JP5768677B2 - Method for manufacturing bump bonded structure - Google Patents

Description

  The present invention relates to a method for manufacturing a bump bonding structure in which a first component having a bump is bonded to a second component via the bump.

  In general, as a method for manufacturing this type of bump bonding structure, for example, a method described in Patent Document 1 has been proposed. Conventionally, first, a first component having a bump protruding on one surface side and a second component having an electrode on one surface side are prepared (preparation step).

  Next, the first component and the second component are in contact with the first component and the second component so that the bump and the electrode are in direct contact with each other. Apply load only. Thereby, the bumps are crushed so that the first component sinks into the second component side (first step).

  Subsequently, the application of ultrasonic vibration to the bump is started, and while applying the ultrasonic vibration, the second load in the same application direction as the first load and larger than the first load is applied. Apply to the first part and the second part. Thereby, the bumps are crushed and joined so that the first component sinks further to the second component side than the end point of the first step (second step). In this way, a bump bonding structure is completed.

JP 2010-67999 A

  However, in the above-described conventional manufacturing method, the applied load and the magnitude of ultrasonic vibration in each process are controlled in order to obtain appropriate bonding, but the first component is moved to the second component side. The amount of displacement due to the subduction, that is, the variation of the subduction amount, is unavoidable, and has been an obstacle to the realization of stable bonding.

  The present invention has been made in view of the above problems, and in a method for manufacturing a bump bonding structure in which a first component having a bump is bonded to a second component through the bump, the amount of sinking It is an object of the present invention to achieve stable bonding by suppressing variations in the above.

  In order to achieve the above object, the present inventor has intensively studied. As a result, as shown in FIG. 6 and the like which will be described later, the amount of subsidence is larger in the second step in which ultrasonic vibration is applied than in the first step in which only the load is applied. We considered that the ultrasonic vibration should be controlled in consideration of the sinking amount due to the ultrasonic vibration.

The invention described in claim 1 is made by paying attention to such a point, and includes a first part (10) having a bump (13) protruding on one surface (11) side, and one surface (21). A preparation step of preparing a second component (20) having an electrode (23) on its side;
A state in which one surface (11) of the first component (10) and one surface (21) of the second component (20) are opposed so that the bump (13) and the electrode (23) are in direct contact with each other. Then, by applying only the first load (F1) to the first component (10) and the second component (20), the first component (10) sinks to the second component (20) side. A first step (S1 to S3) for crushing the bump (13) so as to
Subsequently, application of ultrasonic vibration to the bump (13) is started, and while applying the ultrasonic vibration, the first load (F1) is applied in the same application direction as the first load (F1). By applying a second load (F2) larger than the first component (10) and the second component (20) to the second component (20) further than the end of the first step. And a second step (S4 to S6) in which the bump (13) is crushed and joined so that the first component (10) sinks to the side. It is characterized by performing points.

That is, in the first aspect of the invention, when the amount of displacement due to the sinking of the first component (10) toward the second component (20) is defined as the sinking amount, The amount of subsidence (x2) in step 2 is monitored, and when the amount of subsidence (x2) reaches a predetermined value, the application of ultrasonic vibration is stopped and only the second load (F2) is applied. Thereafter, the application of the second load (F2) is continued, the load application is stopped when the second load (F2) reaches a predetermined value, and the joining is finished. .

  According to this, since the ultrasonic vibration is stopped when the sinking amount (x2) reaches a predetermined value in the second step, it is possible to prevent the sinking amount (x2) from being excessive. In other words, since the application of ultrasonic vibration is continued until the subsidence amount (x2) reaches a predetermined value, the subsidence amount (x2) is prevented from being excessively small.

  Therefore, according to the present invention, it is possible to efficiently prevent the problem that the subsidence amount (x2) due to the ultrasonic vibration is excessively small or excessive, and suppress the variation of the subsidence amount (x2) and perform stable bonding. Can be realized.

  Here, in the invention described in claim 2, in the method for manufacturing the bump bonded structure according to claim 1, in the first step, the subsidence amount (x1) in the first step is monitored, and the subsidence is performed. It is characterized in that application of ultrasonic vibration is started when the amount (x1) of entrainment reaches a predetermined value, and the process proceeds to the second step.

  According to this, the subsidence amount (x1) in the first step can also be controlled to an appropriate value, and the subsidence amount (x1, x2) can be efficiently obtained in the total of the first and second steps. Can be controlled.

  According to a third aspect of the present invention, in the method for manufacturing a bump bonded structure according to the first or second aspect, in the second step, the subsidence amount (x2) in the second step is a predetermined value. The time until the time is monitored, and when the time is out of the predetermined range, it is determined that the bonding is defective.

  If the time until the amount of sinking in the second step reaches a predetermined value is too short, the first component (10) sinks all at once due to the displacement of the bump (13), the sliding of the bump (13), or the like. There may be a problem such as this.

  Further, if the time is too long, the bump (13) is crushed due to, for example, foreign matter mixed in the bump (13) or contact failure between the head (100) to which the load is applied and the first component (10). Problems such as difficulty can be considered. However, according to the present invention, it is possible to detect these problems and prevent the work from flowing to the subsequent process.

  According to a fourth aspect of the present invention, in the bump bonded structure manufacturing method according to any one of the first to third aspects, in the first step, the sinking amount (x1) in the first step The time until the value reaches a predetermined value is monitored, and when the time is out of the predetermined range, it is determined that the bonding is defective.

  Even in the first step, if the time until the sinking amount (x1) in the first step reaches a predetermined value is too short or too long, the same problem as in the second step described above occurs. there's a possibility that. According to the present invention, it is possible to detect these problems and prevent the work from flowing to the subsequent process.

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

1 is a schematic cross-sectional view showing a bump bonding structure according to a first embodiment of the present invention. It is process drawing which shows the manufacturing method of the bump junction structure concerning a 1st embodiment. FIG. 3 is a process diagram illustrating a manufacturing method subsequent to FIG. 2. It is a figure which shows the flowchart of the action | operation of the joining apparatus in the manufacturing method which concerns on 1st Embodiment. It is a figure which shows the relationship between the load applied for joining in the manufacturing method which concerns on 1st Embodiment, the power of ultrasonic vibration, and time. It is a figure which shows the relationship between the load applied for joining in the manufacturing method as a comparative example, the power of ultrasonic vibration, the amount of sinking, and time. It is a figure which shows concretely about the effect in the 2nd process of 1st Embodiment. It is a figure which shows the flowchart of an action | operation of the joining apparatus in 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing a schematic cross-sectional configuration of a bump bonding structure according to the first embodiment of the present invention. The bump bonding structure according to the present embodiment includes a first component 10 having a bump 13 protruding toward the one surface 11 side, and a second component 20 having an electrode 23 on the one surface 21 side. .

  The first component 10 and the second component 20 are not particularly limited. For example, the first component 10 is an IC chip or flip chip made of a silicon semiconductor or the like. The first component 10 has the one surface 11 and the other surface 12 as front and back surfaces and has bumps 13 on the one surface 11.

  Specifically, an electrode 14 made of aluminum, gold, or the like is provided on the one surface 11 of the first component 10, and the bump 13 is provided on the electrode 14. Such bumps 13 are made of, for example, gold, silver, copper, or solder, and are formed by plating, ball bonding, or the like.

  The second component 20 is, for example, a circuit board such as a printed circuit board or a ceramic board, or a circuit chip made of a semiconductor. The first surface 21 and the other surface 22 are front and back surfaces, and the electrode 23 is provided on the first surface 21. Is.

  Here, a land 24 made of aluminum, gold, or the like is provided on one surface 21 of the second component 20, and a bump 25 is provided on the land 24. The bumps 25 are formed using the above-described materials and forming methods, like the bumps 13 of the first component 10. In this embodiment, the land 23 and the bump 25 constitute the electrode 23 of the second component 20.

  Here, both the parts 10 and 20 are arranged with the surfaces 11 and 21 facing each other, and the bumps 13 and the electrodes 23 are in direct contact with each other and bonded. In the present embodiment, the bump 13 and the bump 25 of the electrode 23 are joined in a state of being crushed from the initial protruding shape. The first component 10 and the second component 20 are electrically and mechanically joined via the joint between the bump 13 and the electrode 23.

  Next, with reference to FIGS. 2-5, the manufacturing method of the bump junction structure concerning this embodiment is described. FIG. 2 is a process diagram of the manufacturing method, and FIG. 3 is a process diagram of the manufacturing method subsequent to FIG. FIG. 4 is a diagram showing a flowchart of the operation of the joining apparatus in this manufacturing method, and FIG. 5 is a diagram showing the relationship between the load applied for joining and the power of ultrasonic vibration and time in this manufacturing method. It is.

  First, as shown in FIG. 2 (a), a first component 10 having a bump 13 protruding on one side 11 and a second component 20 having an electrode 23 on one side 21 are prepared (preparation). Process). Here, the bumps 13 and 25 are of course in an initial state before being crushed.

  Next, the bonding process shown in FIGS. 2A, 2B, 3A, and 3B is performed. This bonding step is a step of bonding the bump 13 and the electrode 23 using a bonding apparatus. The first step shown in FIGS. 2A, 2B, and 3A is performed after that. The second step shown in FIG. 3B is performed.

  In the first step, the first part 10 and the second part 20 are opposed to each other so that the bump 13 and the electrode 23 are in direct contact with each other. By applying only the first load F1 to the first component 10 and the second component 20, the bumps 13 are crushed so that the first component 10 sinks into the second component 20 side.

  Specifically, in the first step, first, as shown in FIG. 2A, the second component 20 is mounted on a stage 200 as a support base, and the second component 20 is placed on the stage 200. To support. At this time, the other surface 22 of the second component 20 is brought into contact with the stage 200, and the one surface 21 of the second component 20 is directed above the stage 200.

  Then, with the one surface 21 of the second component 20 and the one surface 11 of the first component 10 facing each other, the first component 10 is lowered from above the second component 20, and FIG. As shown, the front ends of the bumps 13 and 25 facing each other are brought into contact with each other.

  Then, from the contact start state of both the bumps 13 and 25 shown in FIG. 2B, that is, the contact start state of the bump 13 and the electrode 23, a load is applied to both the components 10 and 20 using the joining device. Will start. As shown in FIG. 2B, the bonding apparatus includes a head 100 that applies a load and a control unit 110 that controls the head 100 and the like.

  The head 100 is made of metal or the like. The control unit 110 includes a computer, an actuator, and the like. The head 100 moves up and down, the amount of displacement of the head 100 is detected by the vertical movement, the applied load is monitored by the head 100, the ultrasonic vibration of the head 100 is controlled, the load and the super It manages the application time of sound waves, etc., and these enable typical bump bonding.

  First, in the contact start state shown in FIG. 2B, the joining apparatus is started (see FIG. 4). As a result, the head 100 is lowered in response to a command from the control unit 110, and the head 110 contacts the other surface 12 of the first component 10.

  Here, in step S <b> 1 of FIG. 4, it is determined whether or not the head 100 has contacted the first component 10. This determination is made by detecting the initial load F0 when the head 100 contacts the first component 10 by the control unit 110, as in the general case.

  Although the magnitude of the initial load F0 is smaller than the level at which the bump 13 is deformed, whether or not the contact is sufficient is determined based on the initial load F0. When the initial load F0 is too small, the contact is insufficient and it is determined as “NO”, and the head 100 continues to descend. If the initial load F0 is equal to or greater than the target value, the contact is sufficient and “YES” is determined, and the process proceeds to step S2 in FIG.

  Here, in FIG. 2B, the component height at the start of step S2 is shown as the initial height T0. This component height is the distance between the other surface 12 of the first component 10 and the other surface 22 of the second component 20, in other words, the distance between the stage 200 and the head 100 at the start of the contact.

  That is, when the distance between the other surfaces 12 and 22 of the parts 10 and 20 changes, the amount of displacement can be obtained from the movement distance of the head 100. The initial height T0 is a component height in a state in which a sufficient initial load F0 is secured at the start of contact of the bumps 13 and 25.

  In step S <b> 2 of FIG. 4, the head 100 applies a first load F <b> 1 having a size such that the bump 13 is crushed to both the parts 10 and 20. As a result, as shown in FIG. 3A, the bumps 13 and 25 are crushed and the first component 10 sinks to the second component 20 side, and the component height T1 becomes lower than the initial height T0. .

  Here, when the amount of displacement due to the sinking of the first component 10 toward the second component 20 is defined as the sinking amount, the sinking amount x1 in the first step is obtained by (T0−T1). It is done. Further, as shown in FIG. 5, the first load F1 is applied in a typical pattern in which the first load F1 increases linearly with time. The subsidence amount x1 is increased with time, that is, the first load F1. It grows with the increase.

  Then, in step S3 of FIG. 4, it is determined whether or not the first load F1 is a load having a magnitude suitable for performing ultrasonic vibration (that is, an ultrasonic oscillation load). Here, in the case of “YES”, the process proceeds to step S4, and in the case of “NO”, the increase in the first load F1 is continued by step S2 until the ultrasonic oscillation load is reached.

  The period from the start of step S2 until the first load F1 becomes the ultrasonic oscillation load is the first interval. FIG. 5 shows a load increase pattern in the first section. That is, the subtraction amount x1 in the first step corresponds to the subtraction amount in the first section.

  Next, by proceeding to step S4 of FIG. 4, the second step of the main joining step shown in FIG. 3B is started. In the second step, the application of ultrasonic vibration to the bump 13 is started, and the first load F1 is applied in the same direction as the first load F1 while continuing to apply the ultrasonic vibration. A second load F2 larger than F1 is applied to both parts 10 and 20. By doing so, the bumps 13 are crushed and bonded so that the first component 10 sinks further to the second component 20 side than the end point of the first step.

  First, in step S <b> 4, the head 100 is ultrasonically vibrated according to a command from the control unit 110, and the ultrasonic vibration is applied to both the parts 10 and 20. At the same time, the load applied from the head 100 to the components 10 and 20 is further increased from the ultrasonic oscillation load to obtain the second load F2. Thus, in step S4, the second load F2 and ultrasonic vibration are applied to both the parts 10 and 20 to perform bonding.

  As a result, as shown in FIG. 3B, the bumps 13 and 25 are further crushed and the first component 10 sinks to the second component 20 side, and the component height T2 is the end of the first step. It becomes lower than the component height T1 at the time. Here, the sinking amount x2 in the second step is obtained by (T1-T2).

  Here, as shown in FIG. 5, the second load F2 is applied in a typical pattern in which the second load F2 increases temporarily with time, and the subsidence amount x2 in the second step increases with time. Go. In the present embodiment, the subtraction amount x2 in the second step is monitored by the control unit 110.

  Then, in the next step S5 in FIG. 4, the subtraction amount x2 in the second step is monitored, and the control unit 110 determines whether or not the subtraction amount x2 has reached a predetermined value.

  At this time, in the case of “YES”, the process proceeds to the next step S6, and in step S6, the ultrasonic oscillation is stopped and the ultrasonic vibration is stopped by the control unit 110, and only the second load F2 is applied. Continue joining. On the other hand, in the case of “NO”, in step S4, the application of ultrasonic vibration is continued together with the second load F2 until the sinking amount x2 reaches a predetermined value.

  Thus, when the subtraction amount x2 in the second step reaches a predetermined value, the ultrasonic vibration is stopped and only the second load F2 is applied. Thereafter, the second load F2 is applied. The load application is stopped when the second load F2 reaches a predetermined value, and the joining is finished. The time from this step S4 to the end of joining is the second section, and this second section coincides with the execution time of the second step.

  Here, since the time until the sinking amount x2 in the second step reaches the predetermined value, that is, the predetermined value arrival time varies from product to product, the timing of stopping application of ultrasonic vibration also varies from product to product. Come.

  FIG. 5 shows two types of patterns of the load and ultrasonic vibration power in the second section, that is, the second step, as a second section A and a second section B. The second interval A is when the predetermined value arrival time is relatively short, the second interval B is when the predetermined value arrival time is relatively long, and the second half of the power of the second interval B is a broken line. It is shown.

  That is, in the present embodiment, the time required for the second section is increased or decreased for each product. The time required for bonding the bump 13 and the electrode 23 is substantially the total time of the first section and the second section, but is about 2 or 3 seconds, for example, and the time required for the second section is as follows. Even if there is a change, it falls within that range, so there is no significant effect.

  Thus, with the end of the second section, that is, the end of the second step, the bonding between the bump 13 and the electrode 23 is completed, and the bump bonding structure according to the present embodiment as shown in FIG. 1 is completed. Next, effects and the like of the manufacturing method of this embodiment will be described in comparison with a manufacturing method as a comparative example.

  FIG. 6 is a diagram showing the relationship between the load applied for bonding, the power of ultrasonic vibration, the amount of sinking, and the time in the manufacturing method as a comparative example. Here, the comparative example is a manufacturing method invented by the inventor based on a conventional general manufacturing method.

  In FIG. 6, steps S1 to S3 similar to those of the present embodiment are performed in the first step, and the first section has the same pattern as that of FIG. And, in the second step, instead of changing the application time of ultrasonic vibration for each product as in this embodiment, as in the general case, the application time of ultrasonic vibration is constant even if the product changes, When a certain application time is reached, the application of ultrasonic vibration is terminated.

  As shown in FIG. 6, the sinking amount is larger in the second step in which ultrasonic vibration is further applied than in the first step in which only the load is applied. If the application of ultrasonic vibration is eliminated in the second step and only the load is applied, the amount of sinking does not readily reach the target value.

  Even if the target value is reached, the bumps are simply crushed, resulting in incomplete joining as compared with joining by ultrasonic vibration. That is, it can be said that the controlling factor of the subsidence amount x2 in the second process, that is, the controlling factor of the subsidence amount in the entire joint is substantially the application of ultrasonic vibration.

  In fact, in the second step of the present embodiment, even if the application of only the second load F2 is continued after the application of the ultrasonic vibration is stopped, the change in the subsidence amount x2 is compared with the application of the ultrasonic vibration. Significantly smaller. Therefore, in the present embodiment, application control of ultrasonic vibration based on the subsidence amount x2 is performed in the second step to prevent the subsidence amount x2 from being excessive or small.

  FIGS. 7A and 7B are diagrams specifically showing effects in the second step of this embodiment. FIG. 7A shows the case of the comparative example, and FIG. 7B shows the case of the present embodiment. FIGS. 7A and 7B show the relationship between the sinking amount x2 and the time in the second step for five samples a, b, c, d, and e. In the plot in FIG. 7, “◯” represents a non-defective product in which the amount of subsidence due to ultrasonic vibrations was within the set range, and “×” represents a defective product in which the amount of subsidence was outside the range. ing. In FIG. 7B, the result of FIG. 7A is also shown.

  As shown in FIG. 7A, in the comparative example, since the application of the ultrasonic vibration is always constant, the subtraction amount x2 is set after the fixed time has elapsed, that is, after the application of the ultrasonic vibration is stopped. Sometimes it is too large or too small.

  Specifically, of the five samples a to e, three samples b to d fall within the target subsidence amount x2 and become good products, but the sample a has a subsidence amount x2 that is too large, and the sample e sinks. The amount x2 is too small, and each is a defective product.

  Here, when the sinking amount x2 is too large as in the sample a, there may be a problem such that the first component 10 sinks all at once due to, for example, the displacement of the bump 13 or the slip of the bump 13. Further, when the sinking amount x2 is too small like the sample e, for example, the bump 13 is not easily crushed due to foreign matter mixed into the bump 13 or poor contact between the head 100 and the first component 10. There may be a problem.

  On the other hand, in the case of the present embodiment shown in FIG. 7B, the application of ultrasonic vibration is stopped when the subtraction amount x2 in the second step reaches a predetermined value. Excessive amount x2 can be prevented in advance. For example, for samples a and b, the application of ultrasonic vibration is stopped earlier than in FIG. 7 (a), so that a non-defective product can be realized with the amount of sinking x2 due to the application of ultrasonic vibration as the target range. ing.

  In the case of this embodiment, since the application of ultrasonic vibration is continued until the subtraction amount x2 reaches a predetermined value, the subtraction amount x2 is prevented from being excessively small. For example, with respect to samples d and e, by stopping the application of ultrasonic vibration later than FIG. 7A, a non-defective product can be realized with the amount of sinking x2 due to the application of ultrasonic vibration as the target range. Yes.

  As described above, according to the present embodiment, it is possible to efficiently prevent a problem that the subsidence amount x2 due to the ultrasonic vibration is excessively small or excessive, and suppress the variation of the subsidence amount x2 to achieve stable bonding. Can be realized.

(Second Embodiment)
The second embodiment of the present invention is to manufacture a bump bonded structure similar to that shown in FIG. 1 above, except that a part of the manufacturing method is modified. It will be described in the center. FIG. 8 is a diagram showing a flowchart of the operation of the joining apparatus in the second embodiment.

  In the first embodiment, in the first step, the first load F1 is increased, and when the ultrasonic oscillation load is reached, the ultrasonic vibration and the second load F2 are applied and the second load F1 is applied. The process was started.

  On the other hand, in this embodiment, in the first step, the subtraction amount x1 is monitored by the control unit 110, and application of ultrasonic vibration is started when the subtraction amount x1 reaches a predetermined value. It moves to 2 processes. Specifically, as shown in FIG. 8, in the first section, step S21 is interposed between step S2 and step S3, which is different from the first embodiment.

  In this step S21, before the first load F1 becomes the ultrasonic oscillation load, it is determined as “YES” when the sinking amount x1 in the first process becomes a predetermined value, and the process proceeds to step S4. Start the second step.

  On the other hand, in the case of “NO”, the first load F1 continues to increase until the ultrasonic oscillation load is reached in Step 3. However, if the ultrasonic oscillation load is reached before the subtraction amount x1 in the first step reaches the predetermined value, the process proceeds to step S4 and the second step is started. Then, about a 2nd process, it is the same as that of the said 1st Embodiment.

  For example, if the amount of sinking x1 in the first step is excessive, ultrasonic vibration is applied from a state in which the bumps 13 and 25 are more crushed, so there is a concern about damage to both the parts 10 and 20. In addition, if the subtraction amount x1 is excessively small, the contact area between the bump 13 and the electrode 23 may be too small, and it becomes difficult to ensure the bonding property.

  In this respect, according to the present embodiment, the subsidence amount x1 in the first step can also be controlled to an appropriate value, and the subsidence amounts x1 and x2 are set to a total value in the first and second steps. It can be controlled efficiently.

(Other embodiments)
In all the embodiments described above, in the second step, the time until the subtraction amount x2 in the second step reaches a predetermined value is monitored by the control unit 110 between step S4 and step S5. When the time is out of the predetermined range, a step of determining a bonding failure and stopping the bonding (that is, a bonding stop step) may be provided.

  In the case where the time until the sinking amount x2 in the second step reaches a predetermined value is too short, there is a problem that the first component 10 sinks all at once due to the displacement of the bump 13 or the sliding of the bump 13. Conceivable.

  On the other hand, if the time is too long, there may be a problem that the bump 13 is not easily crushed due to, for example, foreign matter mixed into the bump 13 or some contact failure between the head 100 and the first component 10. However, if this joining stop step is provided in the second process, it is possible to detect these problems and prevent the work from flowing to the subsequent process.

  Further, when this joining stop step is provided, in the second process, the second load F2 and the ultrasonic vibration are generated when a predetermined time elapses before the sinking amount x2 in the second process reaches a predetermined value. May be stopped.

  According to this, in the case where the subsidence amount x2 in the second process does not readily reach the predetermined value, the second process is forcibly stopped, thereby avoiding poor bonding or wasting process time. It can be eliminated.

  In all the above embodiments, in the first process, the time until the subtraction amount x1 in the first process reaches a predetermined value is monitored by the control unit 110 between step S2 and step S3. When the time is out of the predetermined range, a step of determining a bonding failure and stopping the bonding (that is, a bonding stop step) may be provided.

  In this case, the predetermined value of the subtraction amount x1 in the first step may be the same as the predetermined value in step 21 for the second embodiment. That is, when combined with the second embodiment, the joining stop step may be provided between step 2 and step 21.

  According to this, also in the first step, when the time until the sinking amount x1 in the first step becomes a predetermined value is too short or too long, the same as the above-described second step. May cause problems. However, even in the first process, if the joining stop step is provided, it is possible to detect these problems and prevent the work from flowing to the subsequent process.

  Further, when the joining stop step is provided in the first process, the application of the first load F1 is stopped when a predetermined time has elapsed before the subtraction amount x1 in the first process reaches a predetermined value. You may make it do.

  According to this, in the case where the subsidence amount x1 in the first process does not readily reach the predetermined value, the first process is forcibly stopped, thereby avoiding poor bonding or wasting process time. It can be eliminated.

  In each of the above embodiments, the electrode 23 of the second component 20 is a so-called bump electrode constituted by a land 24 and a bump 25 provided on the land 24. In the second component 10, the bumps 25 may be omitted, and the electrode 23 may be composed only of the lands 24. In this case, the bumps 13 of the first component 10 are crushed and joined in direct contact with the lands 24.

  In the first embodiment, the subtraction amount x1 is also monitored by the control unit 110 in the first section of the first step, and the predetermined subtraction amount x1 is determined during the first section. When an over or under range occurs in the range, this may be determined as abnormal and the joining may be stopped.

  In each of the above embodiments, the initial load F0, the ultrasonic oscillation load at the start of application of ultrasonic vibration, the second load F2 at the time of stop, and the voltage generated by the ultrasonic vibration have a management range. It may be allowed. In this case, the values set in these management widths are monitored by the control unit 110, and if they deviate from the management width, if it is determined to be abnormal, the management of the process and the quality is facilitated.

  In each of the above embodiments, the first load F1 applied in the first step and the second load F2 applied in the second step increased with time. If the second load F2 is larger than the first load F1, a constant load in which both the first load F1 and the second load F2 or one of them does not change over time. It may be.

  Further, the bonding between the bump 13 and the electrode 23 may be performed while applying heat, and in that case, the head 100 and the stage 200 may generate heat when energized.

  In addition to the combination of the above-described embodiments, the above-described embodiments may be appropriately combined within a possible range.

DESCRIPTION OF SYMBOLS 10 1st component 11 One surface of 1st component 13 Bump of 1st component 20 2nd component 21 One surface of 2nd component 23 Electrode of 2nd component F1 1st load F2 2nd load S1- S3 Steps in the first step S4 to S6 Steps in the second step x1 Sinking amount in the first step x2 Sinking amount in the second step

Claims (4)

A preparation step of preparing a first component (10) having a bump (13) protruding on one side (11) side and a second component (20) having an electrode (23) on one side (21) side; ,
One surface (11) of the first component (10) and one surface (21) of the second component (20) are arranged so that the bump (13) and the electrode (23) are in direct contact with each other. By applying only the first load (F1) to the first component (10) and the second component (20) in the state of being opposed to each other, the second component (20) is moved toward the second component (20). A first step (S1 to S3) for crushing the bump (13) so that one component (10) sinks;
Subsequently, application of ultrasonic vibration to the bump (13) is started, and the first load is applied in the same application direction as the first load (F1) while continuing to apply the ultrasonic vibration. By applying a second load (F2) larger than (F1) to the first component (10) and the second component (20), the first step is further completed than the end point of the first step. A second step (S4 to S6) in which the bump (13) is crushed and joined so that the first component (10) sinks to the second component (20) side. In the manufacturing method,
When the amount of displacement due to the sinking of the first component (10) toward the second component (20) is defined as the sinking amount,
In the second step, the subsidence amount (x2) in the second step is monitored, and when the subsidence amount (x2) reaches a predetermined value, the application of the ultrasonic vibration is stopped, Only the second load (F2) is applied , and thereafter, the second load (F2) is continuously applied, and the load application is stopped when the second load (F2) reaches a predetermined value. And finishing the bonding, a method for manufacturing a bump bonding structure.   In the first step, the subsidence amount (x1) in the first step is monitored, and when the subsidence amount (x1) reaches a predetermined value, application of the ultrasonic vibration is started, The method for manufacturing a bump bonding structure according to claim 1, wherein the process proceeds to the second step.   In the second step, the time until the sinking amount (x2) in the second step reaches a predetermined value is monitored, and if the time is out of the predetermined range, it is determined that the bonding is defective. The method for producing a bump bonding structure according to claim 1 or 2, wherein:   In the first step, the time until the sinking amount (x1) in the first step reaches a predetermined value is monitored, and when the time is out of the predetermined range, it is determined that the bonding is defective. The method for manufacturing a bump bonding structure according to any one of claims 1 to 3, wherein:

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