JP5766864B2 - Resin composition, resin molded product, and method for producing resin molded product - Google Patents

Description

  The present invention relates to a resin composition for laser direct structuring (hereinafter sometimes simply referred to as “resin composition”). Furthermore, it is related with the manufacturing method of the resin molded product formed by shape | molding the said resin composition, and the resin molded product with a plating layer which formed the plating layer on the surface of the said resin molded product.

  In recent years, with the development of mobile phones including smartphones, various methods for manufacturing antennas inside mobile phones have been studied. In particular, there is a need for a method of manufacturing an antenna that can be three-dimensionally designed for a mobile phone. As one of the techniques for forming such a three-dimensional antenna, a laser direct structuring (hereinafter, also referred to as “LDS”) technique has attracted attention. LDS technology, for example, irradiates the surface of a resin molded product containing an LDS additive with a laser, activates only the portion irradiated with the laser, and forms a plating layer by applying metal to the activated portion. Technology. A feature of this technique is that a metal structure such as an antenna can be manufactured directly on the surface of the resin base material without using an adhesive or the like. Such LDS technology is disclosed in, for example, Patent Documents 1 to 4 and the like.

International publication WO2011 / 095632 pamphlet International Publication WO2011 / 076729 Pamphlet International Publication WO2011 / 077630 Pamphlet International Publication WO2012 / 128219 Pamphlet

By the way, a resin molded product formed by forming a resin composition for laser direct structuring tends to have lower mechanical properties than a molded product formed by molding a resin composition not containing an LDS additive. This is because the LDS additive is essential for LDS processing but becomes a fine foreign matter in the final resin molded product.
An object of the present invention is to provide a resin composition that does not decrease mechanical strength even when an LDS additive is blended.

  Under such circumstances, as a result of intensive studies by the present inventors, it was found that this point can be solved by using a small amount of chopped strands having an average fiber length of 1 to 10 mm, and the present invention has been completed. It was. Specifically, the above problem has been solved by the following means <1>, preferably <2> to <16>.

<1> 0.5 to 8 parts by weight of chopped strands having an average fiber length of 1 to 10 mm with respect to 100 parts by weight of a resin component comprising 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene resin A resin composition comprising a laser direct structuring additive.
<2> The resin composition according to <1>, wherein the amount of the laser direct structuring additive is 1 to 30 parts by weight with respect to 100 parts by weight of the resin component.
<3> The resin composition according to <1> or <2>, wherein the chopped strand is surface-treated with an epoxy resin.
<4> The resin composition according to any one of <1> to <3>, wherein the laser direct structuring additive includes antimony and tin as metal components, and has a higher tin content than antimony. object.
<5> The resin composition according to any one of <1> to <3>, wherein the laser direct structuring additive includes antimony and tin as metal components, and 70% by weight or more of the metal components is tin. object.
<6> The laser direct structuring additive includes both antimony and tin as metal components, and the total amount of antimony and tin in the metal components is 90% by weight or more. <1> to <3> The resin composition in any one.
<7> Resin pellets formed by compounding the resin composition according to any one of <1> to <6>.
<8> A resin molded product obtained by molding the resin composition according to any one of <1> to <6> or the resin pellet according to <7.
<9> The resin molded product according to <8>, further having a plating layer on the surface.
<10> The resin molded product according to <8>, wherein the plated layer has performance as an antenna.
<11> The resin molded product according to any one of <8> to <10>, which is a portable electronic device component.
<12> A method for producing resin pellets, comprising compounding the resin composition according to any one of <1> to <6> using a twin screw extruder.
A <13> chopped strand is a manufacturing method of the resin pellet as described in <12> supplied from a main feeder.
<14> A method for producing a resin molded product with a plating layer, comprising applying a metal to the surface of the resin molded product according to <8> and then applying a metal to form a plating layer.
<15> The method for producing a resin molded article with a plating layer according to <14>, wherein the plating layer is a copper plating layer.
<16> A method for manufacturing a portable electronic device component having an antenna, including the method for manufacturing a resin-molded article with a plated layer according to <14> or <15>.

  According to the present invention, it is possible to provide a resin composition having excellent plating properties and excellent mechanical strength.

It is the schematic which shows the process of providing plating on the surface of a resin molded product. In FIG. 1, 1 indicates a resin molded product, 2 indicates a laser, 3 indicates a portion irradiated with the laser, 4 indicates a plating solution, and 5 indicates a plating layer.

  Hereinafter, the contents of the present invention will be described in detail. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.

The resin composition of the present invention is a chopped strand having an average fiber length of 1 to 10 mm with respect to 100 parts by weight of a resin component comprising 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene resin. -8 parts by weight and a laser direct structuring additive. By setting it as such a structure, it can be set as the resin composition which has high mechanical strength.
Hereinafter, details of the resin composition of the present invention will be described.

<Polycarbonate resin>
The polycarbonate resin used in the present invention is not particularly limited, and any of an aromatic polycarbonate, an aliphatic polycarbonate, and an aromatic-aliphatic polycarbonate can be used. Of these, an aromatic polycarbonate is preferable, and a thermoplastic aromatic polycarbonate polymer or copolymer obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid is more preferable.

  As aromatic dihydroxy compounds, 2,2-bis (4-hydroxyphenyl) propane (= bisphenol A), tetramethylbisphenol A, bis (4-hydroxyphenyl) -P-diisopropylbenzene, hydroquinone, resorcinol, 4,4 -Dihydroxydiphenyl etc. are mentioned, Preferably bisphenol A is mentioned. Furthermore, for the purpose of preparing a composition having a high flame retardancy, a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer containing both terminal phenolic OH groups having a siloxane structure or Oligomers and the like can be used.

  Preferred examples of the polycarbonate resin used in the present invention include polycarbonate resins derived from 2,2-bis (4-hydroxyphenyl) propane; 2,2-bis (4-hydroxyphenyl) propane and other aromatic dihydroxy compounds A polycarbonate copolymer derived from

  The molecular weight of the polycarbonate resin is preferably 14,000 to 30,000 in terms of viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25 ° C. using methylene chloride as a solvent, and 15,000 to 28,000. It is more preferable that it is 16,000 to 26,000. It is preferable for the viscosity average molecular weight to be in the above-mentioned range since the mechanical strength becomes better and the moldability becomes better.

  The method for producing the polycarbonate resin is not particularly limited, and the present invention also uses a polycarbonate resin produced by any method such as the phosgene method (interfacial polymerization method) and the melting method (transesterification method). can do. Moreover, in this invention, after passing through the manufacturing process of a general melting method, you may use the polycarbonate resin manufactured through the process of adjusting the amount of OH groups of a terminal group.

  Furthermore, the polycarbonate resin used in the present invention may be not only a polycarbonate resin as a virgin raw material but also a polycarbonate resin regenerated from a used product, a so-called material-recycled polycarbonate resin.

  In addition, about the polycarbonate resin used by this invention, description of paragraph number 0018-0066 of Unexamined-Japanese-Patent No. 2012-072338 can be referred, for example, The content is integrated in this-application specification.

The resin composition of the present invention may contain only one type of polycarbonate resin, or may contain two or more types.
In the resin composition of the present invention, the lower limit of the proportion of the polycarbonate resin in all resin components is 30% by weight or more, preferably 45% by weight or more, more preferably 50% by weight or more, and 52% by weight or more. You can also. The upper limit is preferably 80% by weight or less, and may be 70% by weight or less from the viewpoint of improving the plating property.

<Styrene resin>
The resin composition of the present invention contains a styrene resin in addition to the polycarbonate resin as a resin component. Charpy impact strength can be improved by blending styrene resin.

  Styrenic resin is a styrene polymer composed of styrene monomers, a copolymer of styrene monomers and other copolymerizable vinyl monomers, or styrene in the presence of a rubbery polymer. A polymer obtained by polymerizing a monomer, a copolymer obtained by polymerizing a styrene monomer and a vinyl monomer copolymerizable with the styrene monomer in the presence of a rubbery polymer. Means at least one polymer selected from the group consisting of Among these, it is preferable to use a styrene monomer or a copolymer of a styrene monomer and another copolymerizable vinyl monomer in the presence of a rubbery polymer.

  Specific examples of the styrene monomer include styrene derivatives such as styrene, α-methylstyrene, p-methylstyrene, divinylbenzene, ethylvinylbenzene, dimethylstyrene, pt-butylstyrene, bromostyrene, and dibromostyrene. Among them, styrene is preferable. In addition, these can also be used individually or in mixture of 2 or more types.

  As vinyl monomers copolymerizable with the above styrenic monomers, vinylcyan compounds such as acrylonitrile and methacrylonitrile, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, Acrylic acid alkyl esters such as 2-ethylhexyl acrylate, octyl acrylate and cyclohexyl acrylate, methacrylic acid such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, amyl methacrylate, hexyl methacrylate, 2-ethylhexyl methacrylate, octyl methacrylate and cyclohexyl methacrylate Acrylic such as alkyl ester, phenyl acrylate, benzyl acrylate Aryl esters, aryl methacrylates such as phenyl methacrylate and benzyl methacrylate, epoxy group-containing acrylic or methacrylic esters such as glycidyl acrylate and glycidyl methacrylate, maleimides such as maleimide, N, N-methylmaleimide and N-phenylmaleimide Examples thereof include α, β-unsaturated carboxylic acids such as monomers, acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid and itaconic acid, or anhydrides thereof.

  Further, rubbery polymers copolymerizable with styrene monomers include polybutadiene, polyisoprene, styrene-butadiene random copolymers and block copolymers, acrylonitrile-butadiene random copolymers and block copolymers, acrylonitrile. -Butadiene copolymer, copolymer of alkyl acrylate or alkyl methacrylate and butadiene, polybutadiene-polyisoprene diene copolymer, ethylene-isoprene random copolymer and block copolymer, ethylene-butene random Copolymers of ethylene and α-olefins such as copolymers and block copolymers, ethylene-methacrylate copolymers, ethylene-butyl acrylate copolymers and the like of ethylene and α, β-unsaturated carboxylic acid esters Copolymer, D Examples include ethylene-propylene-nonconjugated diene terpolymers such as len-vinyl acetate copolymer, ethylene-propylene-hexadiene copolymer, acrylic rubber, and composite rubber composed of polyorganosiloxane rubber and polyalkyl acrylate or methacrylate rubber. Can be mentioned.

  Such styrene resins include, for example, styrene resin, high impact polystyrene (HIPS), acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), methyl methacrylate-acrylonitrile-butadiene. -Styrene copolymer (MABS resin), acrylonitrile-styrene-acrylic rubber copolymer (ASA resin), acrylonitrile-ethylenepropylene rubber-styrene copolymer (AES resin), styrene-methyl methacrylate copolymer (MS resin) ), Styrene-maleic anhydride copolymer, and the like.

  Among these, acrylonitrile-styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene-acrylic rubber copolymer (ASA resin), acrylonitrile-ethylenepropylene rubber-styrene A copolymer (AES resin) is preferred, more preferably an acrylonitrile-butadiene-styrene copolymer (ABS resin), an acrylonitrile-styrene-acrylic rubber copolymer (ASA resin), an acrylonitrile-ethylenepropylene rubber-styrene copolymer It is a combination (AES resin), and an acrylonitrile-butadiene-styrene copolymer (ABS resin) is particularly preferable.

  The styrene resin is produced by a method such as emulsion polymerization, solution polymerization, bulk polymerization, suspension polymerization or bulk / suspension polymerization. In the present invention, a so-called styrene polymer or styrene random copolymer is used. In the case of a polymer or block copolymer, those produced by bulk polymerization, suspension polymerization or bulk / suspension polymerization are suitable, and in the case of a styrene-based graft copolymer, bulk polymerization, bulk / suspension polymerization Or what was manufactured by emulsion polymerization is suitable.

  In the present invention, an acrylonitrile-butadiene-styrene copolymer (ABS resin) that is particularly preferably used is a thermoplastic graft copolymer obtained by graft polymerization of acrylonitrile and styrene to a butadiene rubber component, and a copolymer of acrylonitrile and styrene. It is a mixture. The butadiene rubber component is preferably 5 to 40% by weight, more preferably 10 to 35% by weight, and particularly preferably 13 to 25% by weight, in 100% by weight of the ABS resin component. The rubber particle diameter is preferably 0.1 to 5 μm, more preferably 0.2 to 3 μm, further 0.3 to 1.5 μm, and particularly preferably 0.4 to 0.9 μm. The rubber particle size distribution may be either a single distribution or a plurality of distributions of two or more peaks.

The resin composition of the present invention may contain only one type of styrenic resin, or may contain two or more types.
In the resin composition of the present invention, the ratio of the styrene resin in all resin components is 20% by weight or more, and can be 30% by weight or more. As an upper limit, it is 70 weight% or less, It is preferable that it is 55 weight% or less, 50 weight% or less is more preferable, It can also be 48 weight% or less.

Furthermore, the resin composition of the present invention may contain other resin components without departing from the spirit of the present invention. However, the other resin is preferably 5% by weight or less of the total resin components.
As for the resin composition of this invention, it is preferable that 60 weight% or more of the sum total of a composition is a resin component, and it is more preferable that 70 weight% or more is a resin component.

<Chopped strand>
The resin composition of the present invention includes 0.5 to 8 parts by weight of chopped strands having an average fiber length of 1 to 10 mm with respect to 100 parts by weight of the resin component. By including a small amount of chopped strands, a resin composition having excellent mechanical strength can be provided.

1-5 mm is preferable and, as for the average fiber length of the chopped strand used by this invention, 1-4 mm is more preferable. When the average fiber length is 1 mm or more, the mechanical strength of the resin composition can be improved, and when it is 10 mm or less, the moldability of the resin composition can be improved.
Moreover, 1-20 micrometers is preferable, as for the average fiber diameter of a chopped strand, 10-20 micrometers is more preferable, and 10-15 micrometers is further more preferable.
In the present invention, the average fiber length represents the weight average fiber length.

As the chopped strand used in the present invention, a strand (a bundle of hundreds to thousands of continuous fibers) is cut into a predetermined length, and the fibers include glass fibers and alumina fibers. , Potassium titanate whisker, steel fiber, stainless steel fiber and the like, and glass fiber is particularly preferable.
A glass fiber consists of glass compositions, such as A glass, C glass, E glass, and S glass, and since E glass (an alkali free glass) does not have a bad influence on polycarbonate resin especially, it is preferable.

  The chopped strands are commercially available from Asahi Fiber Glass under the trade names of “Glasslon Chopped Strand” and “Glasslon Milled Fiber” and are easily available. Glass fibers having different forms can be used in combination.

  In the present invention, glass fibers having an irregular cross-sectional shape are also preferable. This irregular cross-sectional shape means that the flatness indicated by the long diameter / short diameter ratio (D2 / D1) when the long diameter of the cross section perpendicular to the length direction of the fiber is D2 and the short diameter is D1, is, for example, 1. 5 to 10, particularly 2.5 to 10, more preferably 2.5 to 8, and particularly preferably 2.5 to 5. About such flat glass, description of paragraph number 0065-0072 of Unexamined-Japanese-Patent No. 2011-195820 can be referred, This content is integrated in this-application specification.

The compounding quantity of the chopped strand in the resin composition of this invention is 0.5-8 weight part with respect to 100 weight part of resin components, 1-8 weight part is preferable and 2-7 weight part is more preferable.
The resin composition of the present invention may contain only one type of chopped strands, or may contain two or more types. When two or more types are included, the total amount falls within the above range. By blending chopped strands, mechanical strength can be improved and plating properties tend to be improved.

<Converging agent>
The chopped strand blended in the resin composition of the present invention is preferably coated with a sizing agent and surface-treated. The type of sizing agent is not particularly defined. A sizing agent may be used alone or in combination of two or more.

The chopped strand is preferably surface-treated with at least one sizing agent selected from polyolefin resins, epoxy resins, urethane resins, and silicone resins, and more preferably surface-treated with an epoxy resin. Such a sizing agent has poor adhesion to the resin component of the present invention including a polycarbonate resin. Therefore, in the resin composition containing such chopped strands, a gap is formed between the chopped strands and the resin component, and the plating solution enters the gap, and the plating property can be further improved. Among such sizing agents, urethane resin is preferable from the viewpoint of high mechanical strength.
The blending amount of the sizing agent in the resin composition of the present invention is preferably 0.1 to 5.0% by weight of the chopped strand, and more preferably 1.0 to 5.0% by weight. The resin composition of the present invention may contain only one type of sizing agent, or may contain two or more types. When two or more types are included, the total amount falls within the above range.

<Laser direct structuring additive (LDS additive)>
The resin composition of the present invention contains an LDS additive.
The LDS additive in the present invention is obtained by adding 4 parts by weight of an additive considered to be an LDS additive to 100 parts by weight of polycarbonate resin (manufactured by Mitsubishi Engineering Plastics, Iupilon (registered trademark), S-3000F). Using a YAG laser, printing is performed by laser irradiation under any of the output 2.6 to 13 W range, scan speed 1 to 2 m / s, frequency 10 to 50 μs, and then the test. This refers to a compound that can form a plating when a piece is degreased with sulfuric acid, treated with Kizai THP Alkali Acti and THP Alkali Ax, and then plated with Kizai SEL Kappa. The LDS additive used in the present invention may be a synthetic product or a commercial product. Moreover, as long as the commercially available product satisfies the requirements for the LDS additive in the present invention, it may be a material sold for other uses as well as those marketed as LDS additives.

  The compounding amount of the LDS additive in the composition of the present invention is preferably 1 to 30 parts by weight, more preferably 3 to 15 parts by weight, and 3 to 9 parts by weight with respect to 100 parts by weight of the resin component. More preferably, it is a part. Only one type of LDS additive may be used, or two or more types may be used in combination. When using 2 or more types, it is preferable that the total amount becomes the said range.

  Hereinafter, preferred embodiments of the LDS additive used in the present invention will be described. By using the LDS additive of such an embodiment, the effects of the present invention tend to be more effectively exhibited. However, it goes without saying that the present invention is not limited to these embodiments.

The first embodiment of the LDS additive used in the present invention is an LDS additive containing copper. The LDS additive used in the first embodiment is preferably an oxide containing copper, and more preferably an oxide containing copper and chromium (copper chromium oxide). Examples of such an LDS additive include CuCr ₂ O ₄ and Cu ₃ (PO ₄ ) ₂ Cu (OH) ₂ , and CuCr ₂ O ₄ is particularly preferable. Thus, the effect of the present invention tends to be exhibited more effectively by using an oxide containing copper as an LDS additive. The copper content in the LDS additive used in the first embodiment is preferably 20 to 95% by weight.

The Mohs hardness of the LDS additive used in the first embodiment is preferably 5.5 or more, and more preferably 5.5 to 6.5. By setting it as such a range, the mechanical strength of a resin molded product can be improved more.
The LDS additive used in the first embodiment preferably has an average particle size of 0.01 to 50 μm, and more preferably 0.05 to 30 μm. By setting it as such an average particle diameter, it exists in the tendency for the effect of this invention to be exhibited more effectively.

  A second embodiment of the LDS additive used in the present invention is an LDS additive containing antimony and / or tin. Of the metal components in the LDS additive in the present embodiment, the content of antimony or tin is preferably 1 to 95% by weight, and more preferably 1.5 to 60% by weight, respectively. In the embodiment containing both antimony and tin, the total amount of antimony and tin in the metal component of the LDS additive is preferably 90% by weight or more, and more preferably 90 to 100% by weight.

In the second embodiment of the LDS additive, an LDS additive containing antimony and tin is preferably exemplified. In the present embodiment, an embodiment is preferred in which both antimony and tin are included (more preferably, antimony oxide and tin oxide are included) and the content of tin is higher than that of antimony. Further preferred is an embodiment containing (more preferably, containing antimony oxide and tin oxide) and 70% by weight or more of the metal component being tin.
Examples of the LDS additive used in the present invention include tin doped with antimony, tin oxide doped with antimony, and tin oxide doped with antimony oxide.

<Elastomer>
The resin composition of the present invention contains an elastomer. By containing the elastomer, the impact resistance of the resin composition can be improved. Examples of the elastomer used in the present invention include methyl methacrylate-butadiene-styrene copolymer (MBS resin), styrene-butadiene triblock copolymer called SBS, SEBS, and hydrogenated products thereof, SPS, SEPS, Examples thereof include a styrene-isoprene triblock copolymer and its hydrogenated product, an olefinic thermoplastic elastomer called TPO, a polyester elastomer, a siloxane rubber, and an acrylate rubber. As the elastomer, the elastomer described in paragraphs 0075 to 0088 of JP2012-251061A, the elastomer described in paragraph numbers 0101 to 0107 of JP2012-1777047A, and the like can be used. It is incorporated herein.

  The elastomer used in the present invention is preferably a graft copolymer obtained by graft copolymerizing a rubber component with a monomer component copolymerizable therewith. The production method of the graft copolymer may be any production method such as bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization, and the copolymerization method may be single-stage graft or multi-stage graft.

  The rubber component usually has a glass transition temperature of 0 ° C. or lower, preferably −20 ° C. or lower, more preferably −30 ° C. or lower. Specific examples of the rubber component include polybutadiene rubber, polyisoprene rubber, polybutyl acrylate and poly (2-ethylhexyl acrylate), polyalkyl acrylate rubber such as butyl acrylate / 2-ethyl hexyl acrylate copolymer, and polyorganosiloxane rubber. Silicone rubber, butadiene-acrylic composite rubber, IPN (Interpenetrating Polymer Network) type composite rubber composed of polyorganosiloxane rubber and polyalkylacrylate rubber, styrene-butadiene rubber, ethylene-propylene rubber, ethylene-butene rubber, ethylene-octene rubber, etc. And ethylene-α-olefin rubber, ethylene-acrylic rubber, fluororubber, and the like. These may be used alone or in admixture of two or more. Among these, in terms of mechanical properties and surface appearance, polybutadiene rubber, polyalkyl acrylate rubber, polyorganosiloxane rubber, IPN composite rubber composed of polyorganosiloxane rubber and polyalkyl acrylate rubber, and styrene-butadiene rubber are preferable. .

  Specific examples of monomer components that can be graft copolymerized with the rubber component include aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, (meth) acrylic acid compounds, glycidyl (meth) acrylates, and the like. Epoxy group-containing (meth) acrylic acid ester compounds; maleimide compounds such as maleimide, N-methylmaleimide and N-phenylmaleimide; α, β-unsaturated carboxylic acid compounds such as maleic acid, phthalic acid and itaconic acid and their anhydrides (For example, maleic anhydride, etc.). These monomer components may be used alone or in combination of two or more. Among these, aromatic vinyl compounds, vinyl cyanide compounds, (meth) acrylic acid ester compounds, and (meth) acrylic acid compounds are preferable from the viewpoint of mechanical properties and surface appearance, and (meth) acrylic acid esters are more preferable. A compound. Specific examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, octyl (meth) acrylate, and the like. be able to.

  The graft copolymer obtained by copolymerizing the rubber component is preferably of the core / shell type graft copolymer type from the viewpoint of impact resistance and surface appearance. Among them, at least one rubber component selected from polybutadiene-containing rubber, polybutyl acrylate-containing rubber, polyorganosiloxane rubber, IPN type composite rubber composed of polyorganosiloxane rubber and polyalkyl acrylate rubber is used as a core layer, and around it. A core / shell type graft copolymer comprising a shell layer formed by copolymerizing (meth) acrylic acid ester is particularly preferred. The core / shell type graft copolymer preferably contains 40% by weight or more of rubber component, more preferably 60% by weight or more. Moreover, what contains 10 weight% or more of (meth) acrylic acid is preferable. The core / shell type in the present invention does not necessarily have to be clearly distinguishable between the core layer and the shell layer, and widely includes compounds obtained by graft polymerization of a rubber component around the core portion. The purpose.

  Preferable specific examples of these core / shell type graft copolymers include methyl methacrylate-butadiene-styrene copolymer (MBS), methyl methacrylate-acrylonitrile-butadiene-styrene copolymer (MABS), and methyl methacrylate-butadiene copolymer. Copolymer (MB), methyl methacrylate-acrylic rubber copolymer (MA), methyl methacrylate-acrylic rubber-styrene copolymer (MAS), methyl methacrylate-acrylic-butadiene rubber copolymer, methyl methacrylate-acrylic-butadiene rubber- Styrene copolymer, methyl methacrylate- (acrylic silicone IPN rubber) copolymer, silicone-acrylic composite rubber containing polyorganosiloxane and polyalkyl (meth) acrylate, etc. Polyorganosiloxane and polyalkyl (meth) silicone containing acrylate - acrylic composite rubber and methyl methacrylate - butadiene copolymer (MB) is particularly preferred. Such rubbery polymers may be used alone or in combination of two or more.

  As such an elastomer, for example, “Paraloid (registered trademark, same applies hereinafter) EXL2602,” “Paraloid EXL2603”, “Paraloid EXL2655”, “Paraloid EXL2311”, “Paraloid EXL2313” manufactured by Rohm and Haas Japan, “Paraloid EXL2315”, “Paraloid KM330”, “Paraloid KM336P”, “Paraloid KCZ201”, “Metabrene (registered trademark, the same applies hereinafter) C-223A”, “Metabrene E-901”, “Metabrene S-2001” manufactured by Mitsubishi Rayon ”,“ Metablene SRK-200 ”,“ Metablene S-2030 ”“ Kane Ace (registered trademark, the same shall apply hereinafter) M-511 ”,“ Kane Ace M-600 ”,“ Kane Ace M-400 ”,“ Kane Ace M- ” 58 "," Kane Ace M-711 "," Kane Ace MR-01 ", manufactured by Ube Industries, Ltd. of" UBESTA XPA ", and the like.

  The compounding amount of the elastomer is 1 to 20 parts by weight, preferably 1 to 15 parts by weight, and more preferably 2 to 10 parts by weight with respect to 100 parts by weight of the resin component. The resin composition of the present invention may contain only one type of elastomer or two or more types. When two or more types are included, the total amount falls within the above range.

<White pigment>
The resin composition of the present invention may contain a white pigment. In the present invention, the resin molded product can be colored by adding a white pigment. Examples of white pigments include ZnS, ZnO, and titanium oxide, with zinc sulfide and titanium oxide being preferred.

As titanium oxide, it is preferable to use titanium oxide containing 80% by weight or more of titanium oxide from the viewpoint of whiteness and hiding properties among those commercially available. Examples of the titanium oxide used in the present invention include titanium monoxide (TiO), titanium trioxide (Ti ₂ O ₃ ), titanium dioxide (TiO ₂ ), and any of these may be used. Titanium dioxide is preferred. Further, as the titanium oxide, those having a rutile type crystal structure are preferably used.

  The average primary particle diameter of the white pigment is preferably 1 μm or less, more preferably in the range of 0.001 to 0.5 μm, and still more preferably in the range of 0.002 to 0.1 μm. . By setting the average particle diameter of the white pigment in such a range and the blending amount in the range described later, a resin composition that gives a molded product having high whiteness and high surface reflectance can be obtained.

When an inorganic pigment is used as the white pigment, a surface-treated one may be used. The white pigment used in the present invention is preferably a white pigment surface-treated with at least one siloxane compound. In this case, the adhesion amount of the siloxane compound is preferably 0.1 to 5% by weight of the white pigment. As the siloxane compound, polyorganohydrogensiloxanes and organopolysiloxanes can be preferably used.
As a preferred embodiment of the present invention, a formulation using titanium oxide surface-treated with at least one selected from polyorganohydrogensiloxanes and organopolysiloxanes is exemplified.
A commercially available white pigment can be used. Furthermore, it is also possible to use a material obtained by pulverizing a lump-shaped material or a material having a large average particle size, and classifying the material with a sieve or the like as necessary to obtain the above-mentioned average particle size.

  When the resin composition of this invention contains a white pigment, it is preferable that the compounding quantity of a white pigment is 0.1-10 weight part with respect to 100 weight part of resin components, and it is 1-8 weight part. More preferably, it is 2 to 5 parts by weight. The resin composition of the present invention may contain only one type of white pigment, or may contain two or more types. When two or more types are included, the total amount falls within the above range.

<Talc>
The resin composition of the present invention may contain talc. In this invention, it exists in the tendency for the plating performance of the part irradiated with the laser to improve by mix | blending talc.
The talc used in the present invention is preferably talc that has been surface-treated with at least one compound selected from polyorganohydrogensiloxanes and organopolysiloxanes. In this case, the adhesion amount of the siloxane compound is preferably 0.1 to 5% by weight of talc. As the siloxane compound, the siloxane compounds described in the above white pigment can be preferably used.
When the resin composition of this invention contains a talc, it is preferable that the compounding quantity of a talc is 1-30 weight part with respect to 100 weight part of resin components, 5-28 weight part is more preferable, 7-22 weight part Part is more preferred. When talc is surface-treated, the total amount of the surface-treated is preferably within the above range.

<Phosphorus stabilizer>
The resin composition of the present invention preferably contains a phosphorus stabilizer.
As the phosphorus stabilizer, phosphate ester and phosphite ester are preferable.

As the phosphate ester, a compound represented by the following general formula (3) is preferable.
General formula (3)
O = P (OH) _m (OR) _3-m (3)
(In general formula (3), R is an alkyl group or an aryl group, and may be the same or different. M is an integer of 0-2.)
R is preferably an alkyl group having 1 to 30 carbon atoms or an aryl group having 6 to 30 carbon atoms, and an alkyl group having 2 to 25 carbon atoms, a phenyl group, a nonylphenyl group, an atarylphenyl group, 2, 4 -Di-tert-butylphenyl group, 2,4-di-tert-butylmethylphenyl group, and tolyl group are more preferable.

  Examples of phosphate esters include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyldiphenyl phosphate, tetrakis (2,4-di-). tert-butylphenyl) -4,4-diphenylene phosphonite.

（一般式（４）中、Ｒ'は、アルキル基またはアリール基であり、各々同一でも異なっていてもよい。）
Ｒ'は炭素数１〜２５のアルキル基または、炭素数６〜１２のアリール基であることが好ましい。Ｒ’がアルキル基である場合、炭素数１〜３０のアルキル基が好ましい。Ｒ’がアリール基である場合、炭素数６〜３０のアリール基が好ましい。 As the phosphite, a compound represented by the following general formula (4) is preferable.
General formula (4)

(In general formula (4), R ′ is an alkyl group or an aryl group, and each may be the same or different.)
R ′ is preferably an alkyl group having 1 to 25 carbon atoms or an aryl group having 6 to 12 carbon atoms. When R ′ is an alkyl group, an alkyl group having 1 to 30 carbon atoms is preferable. When R ′ is an aryl group, an aryl group having 6 to 30 carbon atoms is preferable.

  Examples of phosphites include triphenyl phosphite, trisnonylphenyl phosphite, tris (2,4-di-tert-butylphenyl) phosphite, trinonyl phosphite, tridecyl phosphite, and trioctyl phosphite. , Trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tricyclohexyl phosphite, monobutyl diphenyl phosphite, monooctyl diphenyl phosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol phosphite Bis (2.6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octyl phosphite, monostearate Lil acid phosphate, tri-esters of phosphorous acid such as di-stearyl acid phosphate, diester, monoester, and the like.

  When the resin composition of this invention contains a phosphorus stabilizer, the compounding quantity of a phosphorus stabilizer is 0.01-5 weight part with respect to 100 weight part of resin components, and is 0.02-2 weight part. More preferred. The resin composition of the present invention may contain only one type of phosphorus stabilizer, or may contain two or more types. When two or more types are included, the total amount falls within the above range.

<Antioxidant>
The resin composition of the present invention may contain an antioxidant. As the antioxidant, a phenolic antioxidant is preferable, and more specifically, 2,6-di-butyl-4-methylphenol, n-octadecyl-3- (3 ′, 5′-di-t-). Butyl-4'-hydroxyphenyl) propionate, tetrakis [methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] methane, tris (3,5-di-t-butyl-4- Hydroxybenzyl) isocyanurate, 4,4′-butylidenebis- (3-methyl-6-tert-butylphenol), triethylene glycol-bis [3- (3-tert-butyl-hydroxy-5-methylphenyl) propionate], 3,9-bis {2- [3- (3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl R} -2,4,8,10-tetraoxaspiro [5,5] undecane, and octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate. Among them, octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane preferable.
When the resin composition of this invention contains antioxidant, the compounding quantity of antioxidant is 0.01-5 weight part with respect to 100 weight part of resin components, and 0.05-3 weight part is more preferable. . The resin composition of the present invention may contain only one kind of antioxidant or two or more kinds. When two or more types are included, the total amount falls within the above range.

<Release agent>
The resin composition of the present invention may contain a release agent. The release agent is preferably at least one compound selected from aliphatic carboxylic acids, aliphatic carboxylic acid esters, and aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000. Among these, at least one compound selected from aliphatic carboxylic acids and aliphatic carboxylic acid esters is more preferably used.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated aliphatic monocarboxylic acid, dicarboxylic acid, and tricarboxylic acid. In the present specification, the term “aliphatic carboxylic acid” is used to include alicyclic carboxylic acids. Among the aliphatic carboxylic acids, mono- or dicarboxylic acids having 6 to 36 carbon atoms are preferable, and aliphatic saturated monocarboxylic acids having 6 to 36 carbon atoms are more preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, valeric acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, mellic acid, and tetrariacontanoic acid. , Montanic acid, glutaric acid, adipic acid, azelaic acid and the like.

  As the aliphatic carboxylic acid component constituting the aliphatic carboxylic acid ester, the same aliphatic carboxylic acid as that described above can be used. On the other hand, examples of the alcohol component constituting the aliphatic carboxylic acid ester include saturated or unsaturated monohydric alcohols and saturated or unsaturated polyhydric alcohols. These alcohols may have a substituent such as a fluorine atom or an aryl group. Of these alcohols, monovalent or polyvalent saturated alcohols having 30 or less carbon atoms are preferable, and aliphatic saturated monohydric alcohols or polyhydric alcohols having 30 or less carbon atoms are more preferable. Here, the aliphatic alcohol also includes an alicyclic alcohol. Specific examples of these alcohols include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane, dipentaerythritol. Etc. These aliphatic carboxylic acid esters may contain an aliphatic carboxylic acid and / or alcohol as impurities, and may be a mixture of a plurality of compounds. Specific examples of the aliphatic carboxylic acid ester include beeswax (mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, octyldodecyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin Examples thereof include distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, and pentaerythritol tetrastearate.

  When the resin composition of this invention contains a mold release agent, the compounding quantity of a mold release agent is 0.01-5 weight part with respect to 100 weight part of resin components, and 0.05-3 weight part is more preferable. . The resin composition of the present invention may contain only one type of release agent, or may contain two or more types. When two or more types are included, the total amount falls within the above range.

The resin composition of the present invention may contain other components without departing from the spirit of the present invention. Other components include stabilizers other than phosphorus stabilizers, ultraviolet absorbers, flame retardants, inorganic fillers other than chopped strands and talc, fluorescent whitening agents, anti-dripping agents, antistatic agents, antifogging agents, lubricants, Antiblocking agents, fluidity improvers, plasticizers, dispersants, antibacterial agents and the like can be mentioned. Two or more of these may be used in combination.
About these components, description of Unexamined-Japanese-Patent No. 2007-314766, Unexamined-Japanese-Patent No. 2008-127485, Unexamined-Japanese-Patent No. 2009-51989, Unexamined-Japanese-Patent No. 2012-72338, etc. can be referred, These content is this specification. Embedded in the book.
In addition, although the resin composition of this invention may contain fibrous fillers other than chopped strand, the compounding quantity of fibrous fillers other than chopped strand may be 5 weight% or less of the compounding quantity of chopped strand. it can.

  The method for producing the resin composition of the present invention is not particularly defined, and a wide variety of known methods for producing a thermoplastic resin composition can be adopted. Specifically, each component is mixed in advance using various mixers such as a tumbler or Henschel mixer, and then melt kneaded with a Banbury mixer, roll, Brabender, single-screw kneading extruder, twin-screw kneading extruder, kneader, etc. By doing so, a resin composition can be produced. In the present invention, it is particularly preferable to produce resin pellets by compounding the resin composition using a twin screw extruder. Furthermore, in this invention, it is preferable to supply a fibrous filler from a main feeder. By compounding in this way, stable production is possible while leaving the average fiber length of the chopped strands in the resulting resin pellets long.

  The method for producing a resin molded product from the resin composition or pellet of the present invention is not particularly limited, and a molding method generally adopted for thermoplastic resins, that is, a general injection molding method, an ultra-high speed injection molding. Method, injection compression molding method, two-color molding method, hollow molding method such as gas assist, molding method using heat insulating mold, molding method using rapid heating mold, foam molding (including supercritical fluid), insert -Mold molding, IMC (in-mold coating molding) molding method, extrusion molding method, sheet molding method, thermoforming method, rotational molding method, laminate molding method, press molding method and the like can be employed. A molding method using a hot runner method can also be selected.

  Next, the process of providing plating on the surface of a resin molded product obtained by molding the resin composition of the present invention will be described with reference to FIG. FIG. 1 is a schematic view showing a process of forming plating on the surface of a resin molded product 1 by a laser direct structuring technique. In FIG. 1, the resin molded product 1 is a flat substrate. However, the resin molded product 1 is not necessarily a flat substrate, and may be a resin molded product having a partially or entirely curved surface. Further, the resin molded product is not limited to the final product, and includes various parts. As the resin molded product in the present invention, a portable electronic device component is preferable. Portable electronic equipment parts have both high impact resistance, rigidity, and excellent heat resistance, and are characterized by low anisotropy and low warpage. PDAs such as electronic notebooks and portable computers, pagers, and mobile phones. It is extremely effective as an internal structure such as a telephone or a PHS and a housing. Especially, the resin molded product has an average thickness excluding ribs of 1.2 mm or less (the lower limit is not particularly defined, but, for example, 0.4 mm or more ), Which is particularly suitable as a housing.

Returning again to FIG. 1, the resin molded product 1 is irradiated with a laser 2. The laser here is not particularly defined, and can be appropriately selected from known lasers such as a YAG laser, an excimer laser, and electromagnetic radiation, and a YGA laser is preferable. Further, the wavelength of the laser is not particularly defined. A preferable wavelength range is 200 nm to 1200 nm. Especially preferably, it is 800-1200 nm.
When the laser is irradiated, the resin molded product 1 is activated only in the portion 3 irradiated with the laser. In this activated state, the resin molded product 1 is applied to the plating solution 4. The plating solution 4 is not particularly defined, and a wide variety of known plating solutions can be used. A metal component in which copper, nickel, gold, silver, and palladium are mixed is preferable, and copper is more preferable.
The method of applying the resin molded product 1 to the plating solution 4 is not particularly defined, but for example, a method of introducing the resin molded product 1 into a solution containing the plating solution. In the resin molded product after applying the plating solution, the plating layer 5 is formed only in the portion irradiated with the laser.
In the method of the present invention, a circuit interval having a width of 1 mm or less and further 150 μm or less (the lower limit is not particularly defined, but for example, 30 μm or more) can be formed. Such a circuit is preferably used as an antenna of a portable electronic device component. That is, as an example of a preferred embodiment of the resin molded product of the present invention, a resin molded product in which a plating layer provided on the surface of a portable electronic device component has performance as an antenna can be mentioned.

The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.
Comparative Example 1-1 to Comparative Example 1-6, Example 1-1 to Example 1-8, Comparative Example 2-1, and Comparative Example 2-3 to Comparative Example 2-6 are reference examples.

<Resin component>
S-3000F: Mitsubishi engineering plastics, aromatic polycarbonate resin AT-08: Japan A & L, bulk polymerized ABS resin

<Fibrous filler>
T-187: manufactured by Nippon Electric Glass, chopped strand having an average fiber diameter of 13 μm, glass fiber having a circular cross section having an average fiber length of 3 mm, and an epoxy resin as a converging agent.
T-571: Nippon Electric Glass, chopped strand with an average fiber diameter of 13 μm, an average fiber length of 3 mm, and urethane resin as a sizing agent.
JB1-20: Asahi fiberglass, milled fiber, average fiber diameter 10 μm, average fiber length 30-100 μm
MF-S-R: Asahi Fiber Glass, average fiber diameter 10 μm, average fiber length 110 μm milled fiber, surface treatment with phosphorous acid.

<LDS additive>
Black1G: manufactured by Shepherd Japan, copper chromium oxide with spinel structure CP5C: manufactured by Keeling & Walker, antimony-doped tin oxide (95% by weight of tin oxide, 5% by weight of antimony oxide, 0.02% by weight of lead oxide, 0.004% by weight of copper oxide) )

<Elastomer>
M711: Kaneka MBS resin

<White pigment>
CP-K: Resin Color, titanium oxide treated with methylhydrogensiloxane

<Phosphorus stabilizer>
PEP-8: manufactured by ADEKA, (cyclic neopentanetetraylbis (octadecyl phosphite))
AX71: Made by ADEKA, a mixture of approximately equimolar (mono and distearyl acid phosphate) <Antioxidant>
Irganox 1076: manufactured by BASF, octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate <release agent>
VPG861: manufactured by Cognis Oleochemicals Japan, pentaerythritol tetrastearate

<Compound-side feed>
Each component is weighed so as to have the composition shown in the following table, and the components excluding the fibrous filler are blended with a tumbler, introduced from the root of a twin-screw extruder (manufactured by Toshiba Machine, TEM26SS), and melted. Thereafter, a fibrous filler was side-fed to produce a resin pellet. The temperature setting of the extruder was carried out at 280 ° C.

<Compound-Main feed>
Each component was weighed so as to have the composition shown in the following table, blended with a tumbler, charged from the root of a twin-screw extruder (manufactured by Toshiba Machine, TEM26SS), and melted to prepare resin pellets. The temperature setting of the extruder was carried out at 280 ° C. In Examples 1-3 and 2-3, resin pellets were produced using a single screw extruder (manufactured by Tanabe Plastics, VS-40).

<Bending elastic modulus and bending strength>
After drying the resin pellet obtained by the above-mentioned production method at 100 ° C. for 5 hours, using SG75-MII manufactured by Sumitomo Heavy Industries, the cylinder temperature is 280 ° C., the mold temperature is 80 ° C., and the molding cycle is 50 seconds. Under conditions, injection molding was performed to form a 4 mm thick ISO tensile test piece.
Based on ISO178, the bending elastic modulus (unit: MPa) and bending strength (unit: MPa) were measured at a temperature of 23 ° C. using the above ISO tensile test piece (4 mm thickness).

<Maximum tensile strength>
After drying the resin pellet obtained by the above-mentioned production method at 100 ° C. for 5 hours, using SG75-MII manufactured by Sumitomo Heavy Industries, the cylinder temperature is 280 ° C., the mold temperature is 80 ° C., and the molding cycle is 50 seconds. Under conditions, injection molding was performed to form a 4 mm thick ISO tensile test piece.
Based on ISO527-1 & 2, the maximum tensile point strength (unit: MPa) was measured at a temperature of 23 ° C. using the above ISO tensile test piece (4 mm thickness).

<Weld tensile maximum point strength>
After drying the resin pellet obtained by the above-mentioned manufacturing method at 100 ° C. for 5 hours, it is injected under the conditions of a cylinder temperature of 280 ° C., a mold temperature of 80 ° C., and a molding cycle of 50 seconds using NEX80 manufactured by Nissei Plastic Industry. A tensile test piece having a weld in the center of 4 mm was formed.
In accordance with ISO527-1 & 2, the tensile strength (unit: MPa) of the weld tensile maximum point was measured at a temperature of 23 ° C. using the tensile test piece (4 mm thickness) having the above weld.

<Charpy impact strength>
After drying the resin pellet obtained by the above-mentioned production method at 100 ° C. for 5 hours, using SG75-MII manufactured by Sumitomo Heavy Industries, the cylinder temperature is 280 ° C., the mold temperature is 80 ° C., and the molding cycle is 50 seconds. Injection molding was performed under the conditions, and a 3 mm thick ISO dumbbell test piece was formed.
Using the ISO dumbbell test piece (3 mm thickness) obtained above, the notched and notched Charpy impact strength was measured under the condition of 23 ° C. in accordance with ISO179. NB means non-break.

<Plating property (LDS activity) -Plating Index>
After drying the resin pellet obtained by the above-mentioned manufacturing method at 100 ° C. for 5 hours, using Nissei Plastic Industries, J-50, cylinder temperature 280 ° C., mold temperature 80 ° C., molding cycle 30 seconds And 3 mm thick plate was formed by injection molding.
A 1064 nm YAG laser is used for the 3 mm-thick plate obtained above, and the output is either 2.6 to 13 W, the scan speed is 1 to 2 m / s, and the frequency is 10 to 50 μs. Printing was performed by laser irradiation under various conditions combined from the conditions, and then the plate was degreased with sulfuric acid, treated with Kizai THP Alkali Acti and THP Alkali Ax, and then plated with Kizai SEL Kappa . Plates after the plating treatment were visually judged and classified into the following 5 levels.
5: The condition in which the plating is clearly placed in various laser conditions is 40% or more and 100% or less 4: The condition in which the plating is clearly placed in various laser conditions is 30% or more and less than 40% 3: The condition is clear in various laser conditions 20% or more and less than 30% of the conditions in which the plating is placed on the surface 2: In various laser conditions, the condition in which the plating is clearly placed is 10% or more and less than 20% 1: In various laser conditions, the condition in which the plating is clearly placed is 10 %Less than

The results are shown in the table below. In the table, the blending amount is% by weight.
As is clear from the above table, it was found that the resin composition of the present invention was excellent in plating property because the mechanical strength was not lowered even when the LDS additive was included. On the other hand, the composition of the comparative example could not obtain satisfactory mechanical strength. That is, it was found that the resin composition of the present invention has excellent mechanical strength while maintaining plating properties.

Claims (17)

0.5 to 8 parts by weight of chopped strands having an average fiber length of 1 to 10 mm, and laser direct with respect to 100 parts by weight of a resin component consisting of 80 to 30% by weight of polycarbonate resin and 20 to 70% by weight of styrene resin Including structuring additives,
A resin composition in which the laser direct structuring additive contains antimony and tin as metal components, and has a higher tin content than antimony. The resin composition of Claim 1 whose compounding quantity of the said laser direct structuring additive is 1-30 weight part with respect to 100 weight part of said resin components. The resin composition according to claim 1 or 2, wherein the chopped strand is surface-treated with at least one sizing agent selected from a polyolefin resin, an epoxy resin, a urethane resin, and a silicone resin. The resin composition according to claim 3 , wherein the sizing agent contains an epoxy resin . The resin composition according to claim 3 or 4, wherein the sizing agent is 0.1 to 5.0% by weight of chopped strands. The resin composition according to any one of claims 1 to 5 , wherein the laser direct structuring additive contains both antimony and tin as metal components, and 70 wt% or more of the metal components is tin. . The laser direct structuring additive comprises both antimony and tin as the metal component, and any of claims 1-6 total amount of antimony and tin in the metal component is not less than 90 wt% of the metal components 2. The resin composition according to item 1. Resin pellets obtained by compounding the resin composition according to any one of claims 1-7. Claim 1 resin composition according to any one of 7 or claim 8 resin molded article obtained by molding the resin pellets according to. Furthermore, the resin molded product of Claim 9 which has a plating layer on the surface. The resin molded product according to claim 10 , wherein the plated layer retains performance as an antenna. The resin molded product according to any one of claims 9 to 11 , which is a portable electronic device part. The resin composition according to any one of claims 1 to 7 comprising compounding using a twin screw extruder, the production method of the resin pellets. 14. The method for producing resin pellets according to claim 13 , wherein the chopped strand is supplied from a main feeder. A method for producing a resin molded product with a plating layer, comprising applying a metal to the surface of the resin molded product according to claim 9 after laser irradiation to form a plating layer. The plating layer is a copper plating layer, the manufacturing method according to claim 1 5-plated layer with a resin molded article according to. Including the claims 1 5 or 1 6 production method of plating layer with a resin molded article according to manufacturing method for a portable electronic equipment parts having an antenna.

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