JP5762918B2 - Method for manufacturing metalized film capacitor - Google Patents

Description

  The present invention relates to a method for manufacturing a metallized film capacitor having high reliability of metallicon connection.

A polymer film capacitor is generally used as a capacitor material because of its high withstand voltage and excellent temperature characteristics and frequency characteristics. In particular, metalized film capacitors using a metal vapor-deposited layer as an electrode are frequently used because they have self-healing properties (self-healing properties). Furthermore, in order to ensure safety and high voltage resistance, a technique is also widely used in which a metal deposition layer is subdivided with non-evaporation slits to form a plurality of divided electrodes, and pattern deposition is performed by connecting them with fuses. ing. Recently, there has been a demand for further miniaturization and higher withstand voltage. The thickness of the polymer film is reduced, and the metal film thickness near the metallicon for electrode extraction is increased relative to the main electrode side of the metal vapor deposition film. Stepped deposition with a heavy edge structure is also being implemented.
However, the metallized film capacitor element's metallicon end face and the metallicon part formed by metal spraying on the end face are affected by variations in the surface roughness of the metallicon end face, fluctuations in element winding deviation, contamination contamination, metal spraying conditions. Even if it is fragile or insufficient due to the influence of fluctuations, etc., the metallicon connection part is formed by joining in an uneasy state for the time being, and the defect is difficult to detect in the initial capacity test and the initial tan δ test. In the actual load or the current resistance test, there is a defect that a weak bondability or insufficient defective product is detected for the first time, and there is a problem in the reliability of the metallicon connection.
Patent Document 1 discloses a laminated film capacitor that has a simple structure and ensures good contact property and mechanical strength in the metallicon part. A film capacitor in which a double-sided vapor-deposited metallized film and a laminated film alternately laminated are cut and metallized to form an external electrode, and the heat shrinkage rate of the polymer film for double-sided vapor-deposited metallized film in the longitudinal direction 1% or less, 1% or less in the width direction, using a film having a heat shrinkage of 1% or less in the longitudinal direction and 7 to 15% in the width direction of the polymer film for laminated film, It is characterized in that a metallicon treatment is performed on the vapor-deposited metal thin film layer at the end of which the end portion is retracted.

JP-A-8-102427

In the prior art, the judgment of the quality of the joint between the metallicon end face of the wound film capacitor element and the metallicon part formed by metal spraying on the end face is not understood in the initial capacity test and the initial tan δ test, except for completely defective products. It is difficult, and defects are often found due to a decrease in capacity in actual use or withstand current test, causing problems in terms of quality control and reliability.
This is because the metallicon end face of the wound film capacitor element is joined to the metallicon part formed by metal spraying on the end face, fluctuation of the surface roughness of the metallicon end face, fluctuation of element winding deviation, contamination of the metallicon end face Even if it is inadequate due to the influence of fluctuations in metal spraying conditions etc., it will be bonded to each other in an uneasy state for the time being to form a metallicon conductive part, and defects are detected in the initial capacity test and the initial tan δ test. This is because, when actual load is applied in actual use or withstand current test, the conductive connection portion is destroyed for the first time due to insufficient bondability.
In the present invention, a predetermined amount of a fatty acid amide compound having an appropriate average particle diameter is melted by heat and wound between the metallicon end face of the film capacitor element and the metallicon portion formed by metal spraying on the end face, in particular, the metallicon end face. By interposing it at the metal junction interface between the metal and the metallicon part, it is possible to easily determine the quality of joining between the metallicon end face of the wound film capacitor element and the metallicon part formed by metal spraying on the end face only by the initial tan δ test. We focused on what we can do.
An object of the present invention is to provide a method for manufacturing a metallized film capacitor having high reliability with respect to metallicon connection based on these findings.

As a result of intensive studies, the present inventors have thermally melted a predetermined amount of a fatty acid amide compound having an appropriate average particle diameter, and wound the metallicon end face of the film capacitor element and the metallicon part formed by metal spraying on the end face. In particular, by interposing at the metal joint interface between the metallicon end face and the metallicon part, the metallicon end face of the wound film capacitor element is joined to the metallicon part formed by metal spraying on the end face only in the initial tan δ test. It was found that the quality of the product can be easily judged.
A predetermined amount of fatty acid amide compound having an appropriate average particle size is melted and wound between the metallicon end face of the film capacitor element and the metallicon part formed by metal spraying on the end face, in particular, the metallicon end face and the metallicon part. By interposing at the metal joint interface, the metallicon part that is firmly joined with the metallicon end face of the wound film capacitor element after the normal metallicon spraying is clearly distinguished from the metallicon part that is weakly joined. Even if the bonding is inadequate, there is no metallicon part forming the conductive part in an uneasy state for the time being.
Since the fragile metallicon part is clearly determined as a defective product in the initial tan δ test and is removed, the reliability as a metallized film capacitor is remarkably improved.

That is, the method for producing a metallized film capacitor according to the present invention is a method for producing a metallized film capacitor in which a metallicon portion is formed on a capacitor element in which a polymer film having a metal vapor deposited thin film layer is stacked and wound on at least one surface. An oleic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide having an average particle size of 5 to 100 μm at the metal sprayed portions of the metallicon end face portions at both ends in the width direction of the wound film capacitor element. At least one fatty acid amide compound selected from the group consisting of 10 to 30 mg / cm ^{2 is} deposited, and then the metallicon part is formed by spraying metal with a spray gun.

From the group consisting of oleic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide having an average particle size of 5 to 100 μm on the metal sprayed portions of the metallicon end face portions at both ends in the width direction of the wound film capacitor element. When 10 to 30 mg / cm ^{2 of} at least one selected fatty acid amide compound is adhered, the fatty acid amide compound has a melting point of 50 to 100 ° C., so that it becomes a melt by subsequent metallicon metal spraying. It plays a role in clearly separating the metallicon part interposed between the end face of the metallicon and the metallicon part, which is firmly joined, and the metallicon part which is weakly bonded and defective.
That is, even if the melt of the fatty acid amide compound is present, the metallicon part that is strongly bonded is a good product, and those that do not bond due to the intervention are clearly defective products, and the jointability is insufficient as in the conventional case. However, for the time being, there is no metallicon part forming the conductive part in an uneasy state.
Fatty acid amide compounds are used in various applications such as lubricants, plasticizers, mold release agents, antifoaming agents, etc., in order to increase the processing degree of plastic products, and have metal-deposited thin film layers that are wound to form capacitor elements. It is also included in the packaging paper mainly composed of polyethylene or the like used when shipping and packing the polymer film itself, and is often deposited on the surface of the packaging paper as a lubricant with time.
The fatty acid amide compound is preferably at least one or more selected from the group consisting of leinic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide that are usually used as a lubricant. As a method of uniformly adhering to the metal sprayed part of the end face of the metallicon at both ends in the width direction of the wound film capacitor element, spraying just before metal spraying using a spray gun used for subsequent metal spraying It is preferable to attach them.
If the average particle size of the fatty acid amide compound is less than 5 μm, the effect is insufficient, and if the average particle size of the fatty acid amide compound exceeds 100 μm, it becomes a contaminant and causes inconvenience.
If the adhesion amount of the fatty acid amide compound is less than 10 mg / cm ² , the effect is insufficient, and if the adhesion amount of the fatty acid amide compound exceeds 30 mg / cm ² , it becomes a contamination and causes a disadvantage.
The metallicon part is made of zinc, lead, copper, tin, etc. as a material over the metallicon end face part and its peripheral part by a thermal spray gun using a direct current arc system, and the thickness is 0.5 to 3 mm. Is preferred.
In this case, in order to improve the homogeneity of the intervening effect of the melt of the fatty acid amide compound, it is preferable that the winding deviation generated when the film is overlapped is less than 0.5 mm. When the winding deviation exceeds 0.5 mm, the unevenness of the end face of the metallicon becomes large and the intervening effect is diminished, and it becomes difficult for the metallicon spray to be uniform.

Furthermore, the metallized film capacitor of the present invention is manufactured by the above manufacturing method.
The metallized film capacitor of the present invention has high reliability without a sudden decrease in capacitance due to poor bonding between the metallicon end face of the film capacitor element and the metallicon part.

The present invention provides a method for manufacturing a metallized film capacitor having high reliability for metallicon connection.

It is a fragmentary sectional view which shows one Embodiment of the metallized film capacitor | condenser which was manufactured by the manufacturing method of this invention.

With reference to FIG. 1, the manufacturing method of the metallized film capacitor 5 of this invention is demonstrated below.
The method for producing a metallized film capacitor according to the present invention includes a metallized film capacitor 5 formed by forming a metallicon part 4 on a capacitor element 3 in which a polymer film 2 having a metal-deposited thin film layer 1 is overlapped and wound on at least one surface. An oleic acid amide, erucic acid amide, stearic acid amide having an average particle size of 5 to 100 μm on the metal sprayed portions 6 of the metallicon end face portions at both ends in the width direction of the wound film capacitor element 3 in the manufacturing method After depositing 10 to 30 mg / cm ^{2 of} at least one fatty acid amide compound selected from the group consisting of behenic acid amide, the metal is sprayed with a thermal spray gun, and the melt 7 of the fatty acid amide compound, the metallicon part 4 is formed.

The polymer film 2 having the metal vapor-deposited thin film layer 1 of the present invention has the metal vapor-deposited film layer 1 on at least one surface of the polymer film, and the type of the polymer film 2 is not particularly limited. From the viewpoint of self-healing properties (self-recovery), a biaxially stretched polymer film is preferred, and a biaxially stretched polypropylene film is more preferred from the viewpoint of voltage endurance, and the film thickness is not particularly limited. Due to the miniaturization of the film capacitor, it is preferably less than 15 μm.
The material of the metal vapor deposition film layer 1 is not particularly limited as long as it has conductivity, such as Al, Zn, Cu, Ag, Au, Sn, Ni, or alloys thereof, but Al, Zn, Cu, Sn, etc. are films. It is preferable from the viewpoint of the electrical characteristics and productivity of the capacitor, and the method for forming the metal vapor deposition film layer 1 is not particularly limited. For example, the metal vapor deposition film layer 1 can be formed using a method such as vapor deposition, sputtering, ion plating, or plating. In order to manufacture efficiently, it is preferable to form using a vacuum evaporation method. Although the thickness of the metal vapor deposition film layer 1 is not specifically limited, As film | membrane resistance value, Preferably it is 1-50 ohms / cm < ² >.
In addition, the metal vapor deposition thin film layer 1 is subjected to pattern vapor deposition for ensuring safety and high voltage resistance, and further, stepped vapor deposition having a heavy edge structure in which the metal vapor deposition film thickness in the vicinity of the electrode lead metallicon side is increased. It is preferable to apply.
Next, the average particle diameter is 50 to 300 μm at the metal sprayed portions 6 of the metallicon end face portions at both ends in the width direction of the capacitor element 3 in which the polymer film 2 having the metal vapor deposited thin film layer 1 is overlapped and wound. At least one fatty acid amide compound selected from the group consisting of oleic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide is attached at 10 to 30 mg / cm ² .
Fatty acid amide compounds are used in various applications such as lubricants, plasticizers, mold release agents, antifoaming agents, etc. to increase the processing degree of plastic products. A polymer film having a layer is also included in a packaging paper mainly composed of polyethylene or the like used for shipping and packaging, and is often deposited on the surface of the packaging paper as a lubricant over time. . The inventors have confirmed that when the capacitor element 3 before the metallicon part is formed is packed with these packing materials, an appropriate fatty acid amide compound is easily attached to the metallicon end face 6 of the capacitor element.
As the fatty acid amide compound, at least one or more selected from the group consisting of leinic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide that are usually used as a lubricant from the viewpoint of easy availability and production cost It is preferable to be.
The method of uniformly adhering to the metal sprayed portions 6 of the metallicon end face portions at both ends in the width direction of the film capacitor element wound with these fatty acid amide compounds is not particularly limited, but is used for metal spraying in the subsequent steps. It is preferable to use a spray gun (not shown) that adheres to the region 6 by spraying compressed air immediately before metal spraying is performed.
If the average particle size of the fatty acid amide compound is less than 5 μm, the effect is insufficient, and if the average particle size of the fatty acid amide compound 7 exceeds 100 μm, it becomes a contaminant and causes inconvenience.
If the adhesion amount of the fatty acid amide compound is less than 10 mg / cm ² , the effect is insufficient, and if the adhesion amount of the fatty acid amide compound exceeds 30 mg / cm ² , it becomes a contamination and causes a disadvantage.
In this case, in order to further enhance the intervening effect of the melt 7 of the fatty acid amide compound, and in this case, to increase the homogeneity of the intervening effect of the fatty acid amide compound, the winding deviation that occurs when the film is overwrapped is 0. It is preferably less than 5 mm. When the winding deviation exceeds 0.5 mm, the unevenness of the end face of the metallicon becomes large and the intervening effect is diminished, and it becomes difficult for the metallicon spray to be uniform.

In this manner, after the fatty acid amide compound having a predetermined average particle size and amount is uniformly attached to the metal sprayed portions 6 of the end faces of the metallicon at both ends in the width direction of the wound film capacitor element 3, the spray gun The metallized part 4 containing the melt 7 of the fatty acid amide compound is formed by spraying the metal.
Metallicon part 4 is formed with a spray gun (not shown) using a direct current arc system using compressed air, using zinc, lead, copper, tin or the like as a material, and the thickness is preferably 1 to 3 mm. .
Since the melting point of the fatty acid amide compound is 50 to 100 ° C. by this metal spraying, the fatty acid amide compound becomes a melt 7 of the fatty acid amide compound, intervenes at the joining interface between the metallicon end face and the metallicon part, and the joining is made strong. It plays a role in clearly separating the metallicon part 4 from the poorly bonded metallicon part 4.
That is, even if the melt 7 of the fatty acid amide compound is present, the metallicon part 4 to be firmly joined is a good product, and the one not joined by the intervention is clearly a defective product, and the joining property as in the conventional case is low. Even if it is insufficient, there is no metallicon part 4 forming the conductive part in an uneasy state for the time being.

The metallized film capacitor 5 of the present invention manufactured by the above-described manufacturing method is highly reliable without a sudden decrease in capacity due to poor bonding between the metallicon end face 6 and the metallicon part 4 of the film capacitor element. Have sex.

A biaxially stretched polypropylene film with a width of 300 mm and a thickness of 3.0 μm is used as the dielectric substrate film, and corona treatment is performed in the air for the purpose of increasing the adhesion strength of the metal to the surface on which the metal is deposited. Then, over the entire width of the biaxially stretched polypropylene film excluding the tape margin part, Al is used as a film resistance, vapor-deposited at a thickness of 100 Ω / cm ² and wound up on a roll to produce a metal vapor-deposited film, and then a cutting machine Was cut to a width of 50 mm in the longitudinal direction, and a metal vapor deposition film for a winding element was produced on a roll. Next, this metal vapor deposition film for elements was stacked and wound to produce a capacitor element. Next, fatty acid amide compound particles having the average particle diameter and amount shown in Table 1 were sprayed onto the metallicon end face portion of this element with a thermal spray gun, and uniformly deposited, and then Cu was sprayed with the thermal spray gun to obtain a thickness. A metallicon part of 1.5 mm was formed, and 50 cylindrical wound film capacitors each having a capacitance of 60 μF, a rated voltage of 500 V, and a film width of 40 mm were produced.

These cylindrical wound film capacitors are subjected to initial capacity test and initial tan δ test to select initial good products, and then use the power regeneration type charge / discharge test system of Takasago Manufacturing Co., Ltd. for the initial good products. Then, a non-defective product was selected by conducting a current resistance test (charging at 400 V and charging and discharging 1000 times with a peak current of 500 to 600 A).
These results are shown in Table 2.

From these results, it can be seen that the metallized film capacitor produced by the production method of the present invention has high reliability with respect to the metallicon connection.

  As mentioned above, although the manufacturing method of embodiment of this invention was demonstrated, this invention is not limited to this description, A various change can be added in the range which does not deviate from the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Metal vapor deposition thin film layer 2 Polymer film 3 Capacitor element 4 Metallicon part 5 Metallized film capacitor 6 Metal sprayed part of metallicon end face part 7 Fatty acid amide compound melt

Claims (2)

A metallized film capacitor manufacturing method comprising a metallized part formed on a capacitor element wound with a polymer film having a metal vapor deposited thin film layer on at least one surface, wherein both ends of the wound film capacitor element in the width direction At least one fatty acid amide compound selected from the group consisting of oleic acid amide, erucic acid amide, stearic acid amide, and behenic acid amide having an average particle diameter of 5 to 100 μm at the metal sprayed portion of the metallicon end face of After depositing 10 to 30 mg / cm ² , the metallicon part is formed by spraying metal with a thermal spray gun. A metallized film capacitor manufactured by the manufacturing method according to claim 1.

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