JP5191967B2 - Electrode foil type film capacitor - Google Patents
Electrode foil type film capacitor Download PDFInfo
- Publication number
- JP5191967B2 JP5191967B2 JP2009192639A JP2009192639A JP5191967B2 JP 5191967 B2 JP5191967 B2 JP 5191967B2 JP 2009192639 A JP2009192639 A JP 2009192639A JP 2009192639 A JP2009192639 A JP 2009192639A JP 5191967 B2 JP5191967 B2 JP 5191967B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- capacitor
- electrode foil
- tin
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 title claims description 58
- 239000011888 foil Substances 0.000 title claims description 50
- 238000000605 extraction Methods 0.000 claims description 22
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 20
- 229910052725 zinc Inorganic materials 0.000 claims description 20
- 239000011701 zinc Substances 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 19
- 229910052718 tin Inorganic materials 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052787 antimony Inorganic materials 0.000 claims description 16
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 238000004804 winding Methods 0.000 claims description 10
- 239000010408 film Substances 0.000 description 37
- 239000011135 tin Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 8
- 239000011104 metalized film Substances 0.000 description 8
- -1 polypropylene Polymers 0.000 description 8
- 229920001155 polypropylene Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
本発明は、産業機器用油浸フィルタ用コンデンサに関するもので、特に大電流フィルタ回路に使用するフィルタ用コンデンサに関するものである。 The present invention relates to an oil filter capacitor for industrial equipment, and more particularly to a filter capacitor used in a large current filter circuit.
フィルムを使用したコンデンサは大別すると、プラスチックフィルムに蒸着電極を形成した金属化フィルムを巻回した金属化フィルムコンデンサと、ポリプロピレンフィルム等の誘電体フィルムとアルミニウム電極箔とを巻回した電極箔型フィルムコンデンサとがある。 Capacitors that use film can be broadly divided into metalized film capacitors in which a metallized film with a deposited electrode formed on a plastic film is wound, and an electrode foil type in which a dielectric film such as a polypropylene film and an aluminum electrode foil are wound. There is a film capacitor.
金属化フィルムコンデンサは、蒸着電極厚さが極薄であり、誘電体破壊時には前記蒸着電極が飛散して瞬時に絶縁回復するため、高電位傾度設計によりコンデンサの小形化が可能である。
これに対して、電極箔型フィルムコンデンサは、金属化フィルムコンデンサのような自己回復性がないため、誘電体破壊時はコンデンサ自体が破壊するので、コンデンサの小形化には限界がある。
ここで、金属化フィルムコンデンサの引出電極は、蒸着電極に接触するメタリコン電極材料で形成されるが、電極箔型フィルムコンデンサの引出電極はアルミニウム電極箔に接合される低融点はんだで形成される。このため、通電電流が小さい時は自己保安型の金属化フィルムコンデンサが、通電電流が大きい時は大電流対応型の電極箔型コンデンサが使用されている。
The metallized film capacitor has a very thin vapor deposition electrode thickness, and when the dielectric breaks down, the vapor deposition electrode scatters and instantaneously recovers insulation, so that the capacitor can be miniaturized by designing a high potential gradient.
On the other hand, since the electrode foil type film capacitor is not self-healing like a metallized film capacitor, the capacitor itself is destroyed at the time of dielectric breakdown, so there is a limit to miniaturization of the capacitor.
Here, the extraction electrode of the metallized film capacitor is formed of a metallicon electrode material that contacts the vapor deposition electrode, whereas the extraction electrode of the electrode foil type film capacitor is formed of a low melting point solder joined to the aluminum electrode foil. For this reason, self-protection type metallized film capacitors are used when the energization current is small, and large-current electrode foil capacitors are used when the energization current is large.
大電流通電用のフィルタ用コンデンサの引出電極に使用するはんだには、誘電体がポリプロピレンフィルムの場合、はんだ接合時における誘電体の熱的劣化を防止するために低融点はんだを用いている。そして、この低融点はんだには、従来、鉛含有品が用いられていた。しかし、鉛は環境的に有害な物質であり、鉛を含まない無鉛合金が各種開発されるようになってきている。 When the dielectric is a polypropylene film, low melting point solder is used as the solder used for the lead electrode of the filter capacitor for energizing large currents in order to prevent thermal degradation of the dielectric during solder joining. Conventionally, lead-containing products have been used for the low melting point solder. However, lead is an environmentally harmful substance, and various lead-free alloys containing no lead have been developed.
上記の無鉛合金として、錫、亜鉛、銅、アンチモンからなる合金が提示されており（例えば、特許文献１）、また、上記合金を２層とした構成も紹介されている（例えば、特許文献２）。
しかしながら、上記合金の組成は、プラスチックフィルムに蒸着電極を形成した金属化フィルムを巻回した金属化フィルムコンデンサを対象とするものであり、誘電体フィルムとアルミニウム電極箔とを巻回した電極箔型フィルムコンデンサに対して、電極箔と引出電極との接合強度を向上させ、通電電流特性を向上させるのに十分なものではなかった。
As the lead-free alloy, an alloy composed of tin, zinc, copper, and antimony has been proposed (for example, Patent Document 1), and a configuration in which the alloy is formed in two layers is also introduced (for example, Patent Document 2). ).
However, the composition of the alloy is intended for a metallized film capacitor obtained by winding a metallized film in which a vapor deposition electrode is formed on a plastic film, and an electrode foil type in which a dielectric film and an aluminum electrode foil are wound. It was not sufficient to improve the bonding strength between the electrode foil and the extraction electrode and the current carrying characteristics with respect to the film capacitor.
本発明は、上述した点に鑑みてなされたものであり、その目的は、誘電体フィルムとアルミニウム電極箔とを巻回した電極箔型フィルムコンデンサに対して、無鉛で電極箔との接合の良好な低融点はんだを用いて、電極箔と引出電極との接合強度を十分向上させ、通電電流特性を十分向上させることにある。 The present invention has been made in view of the above-described points, and the object thereof is lead-free and good bonding with an electrode foil to an electrode foil type film capacitor in which a dielectric film and an aluminum electrode foil are wound. An object of the present invention is to sufficiently improve the bonding strength between the electrode foil and the extraction electrode by using a low-melting-point solder, and to sufficiently improve the conduction current characteristics.
本発明は、上記課題を解決するために発明されたもので、アルミニウム電極箔と誘電体フィルムとを、前記アルミニウム電極箔が前記誘電体フィルムに対して突出するように重ね合わせて巻回したコンデンサ素子の巻回端部に、引出電極を形成した電極箔型フィルムコンデンサにおいて、
前記引出電極は、前記コンデンサ素子の巻回端部上に形成される第１電極層と、該第１電極層上に形成される第２電極層とを有し、
前記第１電極層は、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなり、
前記第２電極層は、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなることを特徴とする。
The present invention was invented in order to solve the above-described problem, and is a capacitor in which an aluminum electrode foil and a dielectric film are overlapped and wound so that the aluminum electrode foil protrudes from the dielectric film. In the electrode foil type film capacitor in which the extraction electrode is formed at the winding end of the element,
The extraction electrode has a first electrode layer formed on the winding end of the capacitor element, and a second electrode layer formed on the first electrode layer,
The first electrode layer is made of an alloy containing 79.0 to 81.0 wt% tin, 17.5 to 19.5 wt% zinc, 0.5 to 1.5 wt% antimony, and 0.3 to 0.7 wt% copper. Become
The second electrode layer is made of an alloy containing 89.5 to 91.5 wt% tin, 7.0 to 9.0 wt% zinc, 0.5 to 1.5 wt% antimony, and 0.3 to 0.7 wt% copper. It is characterized by becoming.
本発明によれば、誘電体フィルムとアルミニウム電極箔とを巻回した電極箔型フィルムコンデンサに対して、無鉛で電極箔との接合の良好な第１および第２電極層からなる引出電極を用いているので、電極箔と引出電極との接合強度を十分向上させ、通電電流特性を十分向上させることができる。 According to the present invention, for the electrode foil type film capacitor in which the dielectric film and the aluminum electrode foil are wound, the lead electrodes composed of the first and second electrode layers that are lead-free and have good bonding with the electrode foil are used. Therefore, it is possible to sufficiently improve the bonding strength between the electrode foil and the extraction electrode and sufficiently improve the conduction current characteristics.
以下、本発明の実施の形態について図面を参照して説明する。
本実施形態の電極箔型フィルムコンデンサが備えるコンデンサ素子は、図１に示すように、一組のアルミニウム電極箔１（厚さ７μｍ）と、片面が粗面化されたポリプロピレンフィルム（誘電体フィルム）２（２枚、厚さ１３μｍ）とを有する。２枚のポリプロピレ
ンフィルム２は粗面化された表面が同じ方向を向くように重ねられ、そのように重ねられたポリプロピレンフィルム２（以下「フィルム積層体」という）を間に挟んで一組のアルミニウム電極箔１が配置される。
一組のアルミニウム電極箔１のうち、一方のアルミニウム電極箔１はその端部がフィルム積層体から突出し、他方のアルミニウム電極箔１はその端部が一方のアルミニウム電極箔１の突出方向とは反対方向に突出している。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
As shown in FIG. 1, the capacitor element provided in the electrode foil type film capacitor of the present embodiment includes a pair of aluminum electrode foils 1 (thickness 7 μm) and a polypropylene film (dielectric film) having one surface roughened. 2 (two sheets, thickness 13 μm). The two
Of the pair of
そして、このように重ね合わされたアルミニウム電極箔１と、ポリプロピレンフィルム２とが巻回され、巻回されたコンデンサ素子４（巻回体）の外周を絶縁紙または絶縁フィルム（図示せず）で外巻きした後、加圧して偏平形状に加工する。
その後、図２に示すようにコンデンサ素子４の巻回端部（電極箔の突出端部）に第１および第２引出電極層６、７を形成するための低融点はんだを溶射して引出電極５を形成する。
引出電極５は、図２に示すように、２層の引出電極層で構成され、コンデンサ素子の巻回端部上に形成される第１電極層６の組成は、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなり、第１電極層６上に形成される第２電極層７は、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなる。
Then, the
Thereafter, as shown in FIG. 2, low melting point solder for forming the first and second extraction electrode layers 6 and 7 is sprayed on the winding end portion (projection end portion of the electrode foil) of the
As shown in FIG. 2, the
前記コンデンサ素子４を複数個作成し、図３に示すように、締付板８とバンド９で締付けて固定し、前記引出電極５同士をリード線１０で接続して、コンデンサユニット１１を構成する。そして、図４に示すように、コンデンサユニット１１を金属ケース１３に収納し、前記リード線１０を外部端子１２に接続して真空乾燥後、絶縁油としてジアリールアルカンを含浸し、４．５μＦの電極箔型フィルムコンデンサを完成させる。
なお、第１電極層が、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、第２電極層が、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％となるように組成を変えているのは、第２電極層の錫に対する亜鉛含有率を第１電極層より減らすことにより、融点を下げて、はんだ付けしやすい構造とするとともに、電極箔と引出電極との接合強度を向上させるためである。
A plurality of the
The first electrode layer was 79.0 to 81.0 wt% tin and 17.5 to 19.5 wt% zinc, and the second electrode layer was 89.5 to 91.5 wt% tin and 7.0 to 9 zinc. The composition is changed to 0.0 wt% by reducing the zinc content of the second electrode layer relative to the tin from that of the first electrode layer, thereby lowering the melting point and making the structure easy to solder. This is to improve the bonding strength between the foil and the extraction electrode.
[実施例] 第１および第２電極層の組成検討
表１に示すように、コンデンサ素子の巻回端部上に形成される第１電極層６の組成を、錫８０．０ｗｔ％、亜鉛１８．５ｗｔ％、アンチモン１．０ｗｔ％、銅０．５ｗｔ％に設定し、第１電極層６上に形成される第２電極層７の組成を、錫９０．５ｗｔ％、亜鉛８．０ｗｔ％、アンチモン１．０ｗｔ％、銅０．５ｗｔ％に設定し、上述した仕様、組立条件にて、電極箔型フィルムコンデンサを作製した。
[Example] Composition examination of the first and second electrode layers As shown in Table 1, the composition of the first electrode layer 6 formed on the winding end of the capacitor element was 80.0 wt% tin, 18% zinc. 0.5 wt%, antimony 1.0 wt%, and copper 0.5 wt%, and the composition of the second electrode layer 7 formed on the first electrode layer 6 is 90.5 wt% tin, 8.0 wt% zinc, An electrode foil-type film capacitor was produced by setting the antimony to 1.0 wt% and copper to 0.5 wt% under the above specifications and assembly conditions.
（比較例１）
図５に比較例に係る電極箔型フィルムコンデンサのコンデンサ素子を示す。
表１に示すように、電極箔の突出端部上に形成される引出電極１５の組成を、錫６０．
０ｗｔ％、亜鉛１５．０ｗｔ％、アンチモン１．５ｗｔ％、鉛２３．５ｗｔ％に設定し、上述した実施例と同じ仕様、組立条件にて、電極箔型フィルムコンデンサを作製した。
(Comparative Example 1)
FIG. 5 shows a capacitor element of an electrode foil type film capacitor according to a comparative example.
As shown in Table 1, the composition of the
An electrode foil-type film capacitor was manufactured under the same specifications and assembly conditions as those of the above-described examples, with the settings being 0 wt%, zinc 15.0 wt%, antimony 1.5 wt%, and lead 23.5 wt%.
（比較例２）
表１に示すように、図５に示される電極箔の突出端部上に形成される引出電極１５の組成を、錫７０．０ｗｔ％、亜鉛３０．０ｗｔ％に設定し、上述した実施例と同じ仕様、組立条件にて、電極箔型フィルムコンデンサを作製した。
(Comparative Example 2)
As shown in Table 1, the composition of the
［引張強度試験］
上記の実施例、比較例１、２について、各５個のコンデンサ試料の引出電極に、直径１ｍｍの錫メッキ銅単線の一方の先端５ｍｍ部分をＬ字形に折り曲げ、試料と同じはんだで直径１０ｍｍの面積ではんだ付けを行い、錫メッキ銅単線の他端は直径２０ｍｍ程度のリング状とし、端部をはんだ付けして引張部分とし、プッシュ・プルゲージで引張強度を測定し、比較した。その結果を表１に示す。表１の引張強度はコンデンサ試料５個の平均値を記載している。
[Tensile strength test]
For each of the above Examples and Comparative Examples 1 and 2, the lead electrode of each of five capacitor samples was bent into a L-shape at one end of a 1 mm diameter tin-plated copper single wire, and the same solder as the sample had a diameter of 10 mm. Soldering was performed in the area, and the other end of the tin-plated copper single wire was formed into a ring shape having a diameter of about 20 mm. The end was soldered to form a tensile portion, and the tensile strength was measured with a push-pull gauge and compared. The results are shown in Table 1. The tensile strength in Table 1 describes the average value of five capacitor samples.
[短絡放電試験]
上記の実施例、比較例１、２について、各５個のコンデンサ試料の外部端子間に直流定格電圧４０００Ｖを印加して２回／分、周波数１００ｋＨｚ、ピーク電流２５ｋＡの短絡放電を１００００回まで行い、ｔａｎδの経時変化を比較した。その結果を表１、図６に示す。
表１のｔａｎδはコンデンサ試料５個の平均値を記載している。
[Short-circuit discharge test]
About said Example and Comparative Examples 1 and 2, DC rated voltage 4000V is applied between the external terminals of each of five capacitor samples, and short-circuit discharge at a frequency of 100 kHz and a peak current of 25 kA is performed up to 10,000 times twice per minute. The time course of tan δ was compared. The results are shown in Table 1 and FIG.
In Table 1, tan δ describes the average value of five capacitor samples.
[第１および第２電極層の組成検討]
表１、図６より明らかなように、実施例で、第１電極層６の組成を、錫８０．０ｗｔ％、亜鉛１８．５ｗｔ％、アンチモン１．０ｗｔ％、銅０．５ｗｔ％とし、かつ、第２電極層６の組成を、錫９０．５ｗｔ％、亜鉛８．０ｗｔ％、アンチモン１．０ｗｔ％、銅０．５ｗｔ％としたことにより、比較例１、２と比較して、電極箔と引出電極との接合強度を十分向上させることができ、また、短絡放電１００００回でもｔａｎδ変化が安定した特性となり、通電電流特性を十分向上させることができた。
ここで、第１電極層６の組成が、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％の範囲を外れた場合、および／または、第２電極層７の組成が、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％の範囲を外れた場合には、電極箔と引出電極との接合強度の向上が不十分であり、また、短絡放電試験において、ｔａｎδ増大を十分に抑えることができず、通電電流特性を満足させることができなかった。
[Composition of the first and second electrode layers]
As is apparent from Table 1 and FIG. 6, in the example, the composition of the first electrode layer 6 was 80.0 wt% tin, 18.5 wt% zinc, 1.0 wt% antimony, 0.5 wt% copper, and The composition of the second electrode layer 6 was 90.5 wt% tin, 8.0 wt% zinc, 1.0 wt% antimony, and 0.5 wt% copper. The junction strength between the lead electrode and the lead electrode can be sufficiently improved, and the tan δ change is stable even after 10,000 short-circuit discharges, and the conduction current characteristic can be sufficiently improved.
Here, the composition of the first electrode layer 6 is 79.0 to 81.0 wt% tin, 17.5 to 19.5 wt% zinc, 0.5 to 1.5 wt% antimony, and 0.3 to 0.7 wt% copper. % And / or the composition of the second electrode layer 7 is 89.5 to 91.5 wt% tin, 7.0 to 9.0 wt% zinc, 0.5 to 1.5 wt% antimony When the copper content is outside the range of 0.3 to 0.7 wt%, the improvement in the bonding strength between the electrode foil and the extraction electrode is insufficient, and the increase in tan δ is sufficiently suppressed in the short-circuit discharge test. It was not possible to satisfy the current-carrying characteristics.
以上の試験結果より、引出電極を構成する第１電極層が、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなり、かつ、第２電極層が、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなる、本発明の電極箔型コンデンサは、電極箔と引出電極との接合強度を十分向上させることができ、また、通電電流特性を十分向上させることができる。しかも、環境対応も十分可能であり、工業的価値大である。 From the above test results, the first electrode layer constituting the extraction electrode was found to have 79.0 to 81.0 wt% tin, 17.5 to 19.5 wt% zinc, 0.5 to 1.5 wt% antimony, 0. The second electrode layer is made of an alloy containing 3 to 0.7 wt%, and the second electrode layer has tin of 99.5 to 91.5 wt%, zinc of 7.0 to 9.0 wt%, antimony of 0.5 to 1.5 wt%, The electrode foil type capacitor of the present invention, which is made of an alloy containing 0.3 to 0.7 wt% of copper, can sufficiently improve the bonding strength between the electrode foil and the extraction electrode, and can sufficiently improve the current carrying characteristics. be able to. In addition, environmental measures are sufficiently possible, and the industrial value is great.
１ アルミニウム電極箔
２ 片側粗面化ポリプロピレンフィルム
３ 電極箔突出部
４ 本発明のコンデンサ素子
５ 引出電極
６ 第１の引出電極
７ 第２の引出電極
８ 締付板
９ バンド
１０ リード線
１１ 本発明のコンデンサユニット
１２ 外部端子
１３ ケース
１４ 絶縁油
１５ 引出電極（従来）
DESCRIPTION OF
Claims (1)
前記引出電極は、前記コンデンサ素子の巻回端部上に形成される第１電極層と、該第１電極層上に形成される第２電極層とを有し、
前記第１電極層は、錫７９．０〜８１．０ｗｔ％、亜鉛１７．５〜１９．５ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなり、
前記第２電極層は、錫８９．５〜９１．５ｗｔ％、亜鉛７．０〜９．０ｗｔ％、アンチモン０．５〜１．５ｗｔ％、銅０．３〜０．７ｗｔ％を含む合金からなることを特徴とする電極箔型フィルムコンデンサ。
An electrode foil type film in which an extraction electrode is formed on a winding end of a capacitor element in which an aluminum electrode foil and a dielectric film are overlapped and wound so that the aluminum electrode foil protrudes from the dielectric film In the capacitor
The extraction electrode has a first electrode layer formed on the winding end of the capacitor element, and a second electrode layer formed on the first electrode layer,
The first electrode layer is made of an alloy containing 79.0 to 81.0 wt% tin, 17.5 to 19.5 wt% zinc, 0.5 to 1.5 wt% antimony, and 0.3 to 0.7 wt% copper. Become
The second electrode layer is made of an alloy containing 89.5 to 91.5 wt% tin, 7.0 to 9.0 wt% zinc, 0.5 to 1.5 wt% antimony, and 0.3 to 0.7 wt% copper. An electrode foil type film capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009192639A JP5191967B2 (en) | 2009-08-22 | 2009-08-22 | Electrode foil type film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009192639A JP5191967B2 (en) | 2009-08-22 | 2009-08-22 | Electrode foil type film capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011044618A JP2011044618A (en) | 2011-03-03 |
| JP5191967B2 true JP5191967B2 (en) | 2013-05-08 |
Family
ID=43831806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009192639A Active JP5191967B2 (en) | 2009-08-22 | 2009-08-22 | Electrode foil type film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5191967B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6441585B2 (en) * | 2014-04-24 | 2018-12-19 | 京セラ株式会社 | Film capacitor |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329218B2 (en) * | 1974-02-28 | 1978-08-19 | ||
| FR2663149B1 (en) * | 1990-06-08 | 1993-09-17 | Europ Composants Electron | SHEET CAPACITOR AND METHOD FOR MANUFACTURING SUCH A CAPACITOR. |
| JPH11204368A (en) * | 1998-01-12 | 1999-07-30 | Hitachi Aic Inc | Metallized film chip capacitor |
| JP2000077256A (en) * | 1998-09-01 | 2000-03-14 | Hitachi Aic Inc | Metallized film capacitor |
| JP2002373824A (en) * | 2001-04-11 | 2002-12-26 | Miura Gokin Kogyosho:Kk | Lead-free alloy for external electrode of metallized plastic film capacitor |
| JP3923840B2 (en) * | 2001-04-11 | 2007-06-06 | 株式会社三浦合金工業所 | Lead-free alloy for external electrodes of metallized plastic film capacitors |
| JP4480297B2 (en) * | 2001-05-15 | 2010-06-16 | 株式会社ニホンゲンマ | Material for film capacitor end face electrode |
| JP4128541B2 (en) * | 2004-03-26 | 2008-07-30 | ソルダーコート株式会社 | Electrode material |
| JP4617485B2 (en) * | 2004-12-13 | 2011-01-26 | ナノジョイン株式会社 | Solder alloy, metalized film capacitor end face electrode material, metalized film capacitor |
| JP2007080908A (en) * | 2005-09-12 | 2007-03-29 | Matsushita Electric Ind Co Ltd | Metallized film capacitor and case mold capacitor using same |
| JP2007207884A (en) * | 2006-01-31 | 2007-08-16 | Nichicon Corp | Metallized polypropylene film capacitor |
-
2009
- 2009-08-22 JP JP2009192639A patent/JP5191967B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011044618A (en) | 2011-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6604610B2 (en) | Multilayer ceramic electronic components | |
| CN1866428B (en) | Stacked capacitor and method of fabricating the same | |
| JP5209336B2 (en) | Electrolytic capacitor assembly with fuse | |
| JP6710085B2 (en) | Solid electrolytic capacitor | |
| JP5879491B2 (en) | Solid electrolytic capacitor | |
| US10115523B2 (en) | Ceramic electronic component and mounting structure of the same | |
| TW200406795A (en) | Solid electrolytic capacitor | |
| JP5191967B2 (en) | Electrode foil type film capacitor | |
| JPWO2007052652A1 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| KR102052769B1 (en) | Composite electronic component and Manufacturing method of the same | |
| JP2007043197A (en) | Stacked capacitor | |
| WO2019176723A1 (en) | Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor | |
| JP2007013043A (en) | Electrode assembly for mounting electric element, electric component employing the same, and solid electrolytic capacitor | |
| US11211204B2 (en) | Solid electrolytic capacitor and method for manufacturing same | |
| US11551872B2 (en) | Multilayer ceramic capacitor | |
| JP4915856B2 (en) | Solid electrolytic capacitor | |
| JP2001126958A (en) | Chip-type solid electrolytic capacitor | |
| JP2008135460A (en) | Chip solid electrolytic capacitor | |
| KR102064017B1 (en) | Solid electrolytic capacitor | |
| JP2012084626A (en) | Manufacturing method of electrolytic capacitor and electrolytic capacitor | |
| JP2005051051A (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| JP2004273511A (en) | Electrolytic capacitor with fuse | |
| JP5324341B2 (en) | Metallized film capacitor and manufacturing method thereof | |
| JP5197400B2 (en) | Manufacturing method of chip-type solid electrolytic capacitor | |
| JP5770444B2 (en) | Solid electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120220 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130123 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130129 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130130 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5191967 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160208 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |