JP5742942B2 - Thermal dielectric generator - Google Patents

Description

  The present invention relates to a thermal dielectric power generation device, and more particularly to a thermal dielectric power generation device that generates electric power by repeating a process of cooling and charging a capacitor and a process of heating and discharging the capacitor.

  As part of the effective use of energy, the need for waste heat utilization is increasing. As a form of exhaust heat utilization, a method of utilizing as heat and a method of converting to electricity are realistic. When converted to electricity, transportation and storage are relatively easy and convenient.

  When heat is converted into electricity and the temperature of exhaust heat is large and the temperature is high, steam can be generated by heat energy, and the turbine can be driven by the steam to generate electric power. However, when the scale is small or the temperature of exhaust heat is low, it is difficult to efficiently use heat energy, and most of the heat energy is discarded.

  As a method for converting thermal energy into electrical energy, a power generation element using a Seebeck effect by causing a temperature difference inside an object has been developed for a long time. However, under the present circumstances, it is mainly assumed to be used at a relatively large temperature difference (200 ° C. or more), and there are many problems to be solved in terms of the reliability and cost of such power generation elements.

  In addition, research on turbines that can be driven at low temperatures of 200 ° C. or less is also underway, and there is a proposal for a power generation system using ammonia as a medium. However, in principle, power generation efficiency is higher than in the case of the high heat source body (200 ° C. or higher). It is low and has not yet been put into practical use.

  On the other hand, another method for converting thermal energy into electrical energy is thermal dielectric power generation. Thermal dielectric power generation is the conversion of thermal energy into electrical energy using the temperature dependence of the dielectric constant of the dielectric forming the capacitor. Regarding thermal dielectric power generation, “Massunori Akasaki and Masanori Hara,“ Electric Energy Engineering ”, Asakura Shoten, 1986, pp. 110-111 "(Non-Patent Document 1) The concept itself is" J. Di. Proposed by JDChildress, “Application of a Ferroelectric Material in an Energy Conversion Device”, J. Appl Phys Vol.33, No.5, pp.1793-1798, 1962 ”(Non-Patent Document 2) In addition, verification by experiment is also written by “Mitsuharu Fujimoto,“ Experimental Study of Thermal Dielectric Direct Power Generation ”, The Institute of Electrical Engineers of Japan Vol83-12, No903, p.2080-2088, 1963” (Non-Patent Document 3) ).

  Patent documents include Japanese Patent Application Laid-Open No. 61-097308 (Patent Document 1), Japanese Patent Application Laid-Open No. 01-133581 (Patent Document 2), and Japanese Patent Application Laid-Open No. 06-165541 (Patent Document 3). . FIG. 14 shows a basic circuit of the thermal dielectric power generator disclosed in Patent Document 1, and FIG. 15 shows a relationship between charge and voltage in the charging, heating, and discharging processes of the thermal dielectric power generator.

  Thermal dielectric power generation technology utilizes the temperature characteristics of the dielectric that forms the capacitor. In the basic circuit as shown in FIG. 14, as shown in FIG. 15, the capacitor CA is charged at the temperature T1. Thereafter, the switch SW1 and the switch SW2 are turned off, the capacitor CA is opened, and the temperature of the capacitor CA is raised to T2 while the capacitor CA holds the electric charge.

  At this time, the dielectric constant of the capacitor CA at the temperature T1 is selected to be larger than the dielectric constant of the capacitor CA at the temperature T2. As a result, as shown in FIG. 15, the voltage rises (rises from V1 to V2). Assuming that the dielectric constant of the capacitor CA at the temperature T1 is εr1, the dielectric constant of the capacitor CA at the temperature T2 is εr2, the charging voltage at the temperature T1 is V1, and the voltage at the temperature T2 is V2, V2 = V1 × (εr1 / The relationship of εr2) is established.

  Since the amount of charge of the capacitor CA is the same before and after the temperature change and the voltage of the capacitor CA rises, the electrical energy of the capacitor CA is amplified. This is called thermal dielectric power generation. Some papers also pay attention to changes in spontaneous polarization, and the effects of changes in spontaneous polarization are also included in the thermoelectric generation described here.

  In the thermal dielectric power generation using the capacitor CA, for high-efficiency power generation, the dielectric constant itself is high and the charge holding capability is high, the change of the dielectric constant and spontaneous polarization with temperature is large, the time for the temperature change Are necessary, such as being short and charging / discharging efficiency being good.

JP 61-097308 A Japanese Patent Laid-Open No. 01-133581 Japanese Patent Laid-Open No. 06-165541

Authored by Masanori Akasaki and Masanori Hara, "Electric Energy Engineering", Asakura Shoten, 1986, pp. 110-111 Jay. Di. Childress, `` Application of a Ferroelectric Material in an Energy Conversion Device '', J.Appl Phys Vol.33, No.5, pp.1793-1798, 1962 Sanji Fujimoto, “Experimental study of direct thermal power generation”, The Institute of Electrical Engineers of Japan Vol 83-12, No903, p.2080-2088, 1963

  However, the conventional thermal dielectric power generation apparatus has a problem that the temperature change rate of the capacitor is slow and the power generation efficiency is low. As a method of increasing the temperature change rate of the capacitor, it is conceivable to form a large-area thin capacitor by connecting a plurality of chip-type capacitors in parallel, and to increase the contact area to the heating part and the cooling part.

  However, simply connecting a plurality of chip type capacitors in parallel, if one chip type capacitor fails and short-circuits, current flows through the path and the capacitor cannot be charged, and the power generation function may stop. There is. Moreover, in order to resume power generation, it is necessary to remove the shorted chip capacitor. For this reason, manpower is required, and the stop time becomes longer.

  Therefore, a main object of the present invention is to provide a thermal dielectric power generator having a short operation stop time due to a failure, easy operation, and high operation rate.

Thermal dielectric power generator according to the present invention are those comprising a flexible substrate, a first terminal mounted on a flexible substrate, a second terminal, a plurality of chip-type fuse, and a plurality of capacitors. One terminals of the plurality of chip-type fuses are all connected to the first terminal, one terminal of the plurality of capacitors is connected to the other terminal of the plurality of chip-type fuses, and the other terminals of the plurality of capacitors are both the second terminals. Connected to. Each of the plurality of capacitors includes a plurality of chip type capacitors connected in parallel between the other terminal and the second terminal of the corresponding chip type fuse. The thickness of each of the plurality of chip-type fuses is equal to or less than the thickness of each of the plurality of chip-type capacitors. The thermal dielectric power generator is further connected to a cooling / heating unit that alternately performs a first step of cooling the plurality of capacitors and a second step of heating the plurality of capacitors, and the first and second terminals. And a charging / discharging unit that charges the cooled capacitors and discharges the heated capacitors.

  Preferably, the cooling / heating unit is provided to face the one side surface of the flexible substrate, and is provided to face the cooling member having the first temperature and the other side surface of the flexible substrate. A heating member that is set to a second temperature higher than the temperature, and a driving unit that deflects the flexible substrate toward the cooling member to cool the plurality of capacitors and deflects the flexible substrate toward the heating member to heat the plurality of capacitors. Including.

  In the thermal dielectric power generation device according to the present invention, a first terminal, a second terminal, a plurality of fuses, and a plurality of capacitors are provided, and one terminal of each of the plurality of fuses is connected to the first terminal, One terminal of each capacitor is connected to the other terminal of each of the plurality of fuses, and the other terminals of the plurality of capacitors are both connected to the second terminal. Therefore, since a plurality of capacitors connected in parallel is used, each capacitor can be thinned. Therefore, the temperature change speed of each capacitor can be increased, and the efficiency can be increased.

  When one capacitor fails and is short-circuited, a large current flows through the fuse corresponding to the capacitor, the fuse is blown, and the failed capacitor is electrically disconnected from the other capacitors. Therefore, the operation can be continued and the operation stop time can be shortened.

It is a figure which shows the principal part of the thermoelectric power generator used as the foundation of this invention. It is a figure which shows the structure of the electric power generation part shown in FIG. It is a figure which shows the structure of the wiring board shown in FIG. It is the IV-IV sectional view taken on the line of FIG. It is a circuit block diagram which shows the structure of the thermal dielectric power generator shown in FIG. It is sectional drawing which shows the heating process and electrical energy extraction process of the thermoelectric power generator shown in FIGS. It is sectional drawing which shows the cooling process and charging process of the thermal dielectric power generator shown in FIGS. It is a figure which shows the principal part of the thermal dielectric power generator by one embodiment of this invention. It is a circuit block diagram which shows the structure of the thermal dielectric power generator demonstrated in FIG. It is a figure which shows the operation | movement at the time of the failure of the chip type capacitor shown in FIG. FIG. 10 is another diagram showing an operation when the chip capacitor shown in FIG. 9 fails. FIG. 10 is still another diagram showing an operation when the chip capacitor shown in FIG. 9 fails. 13 is a time chart showing an operation at the time of failure of the thermal dielectric power generation device shown in FIGS. It is a circuit block diagram which shows the structure of the conventional thermal dielectric power generator. It is a figure which shows operation | movement of the thermal dielectric power generator shown in FIG.

  Before describing the embodiment of the present invention, first, a thermal dielectric power generation device 1 which is the basis of the present invention will be described (see Japanese Patent Application No. 2010-165940). As shown in FIGS. 1 to 4, this thermal dielectric power generation device 1 includes a power generation unit 100, a heating duct 200 disposed so as to contact a first wall portion 111 a provided in the power generation unit 100, And a cooling duct 300 disposed so as to be in contact with the second wall portion 111b provided in the portion 100.

  For example, water (warm water) at about 95 ° C. is introduced into the heating duct 200 as a high heat source, and water (cold water) at about 15 ° C. is used as the low heat source in the cooling duct 300. Is introduced. In addition, you may introduce | transduce the exhaust gas of 200 degrees C or less, water vapor | steam, high temperature water, high temperature oil (heat transport medium) etc. as a high heat source body. Further, instead of the heating duct 200, a plate heated by a radiant heat source such as a flame may be used. Further, instead of the cooling duct 300, an air cooling plate connected to air cooling fins may be used.

  As shown in FIG. 2, the power generation unit 100 includes a rectangular parallelepiped chamber 110. The first wall 111a of the chamber 110 and the second wall 111b facing the first wall 111a are arranged in parallel with a predetermined gap therebetween, and each of the first wall 111a and the second wall 111b is , Has a rectangular planar shape.

  As described above, the heating duct 200 is disposed in contact with the entire outer surface of the first wall 111a, and the cooling duct 300 is disposed in contact with the entire outer surface of the second wall 111b. Therefore, it is preferable that a material having high thermal conductivity is used for each of the first wall portion 111a and the second wall portion 111b. For example, a material such as a surface-treated steel plate or stainless steel is used as the metallic plate.

  The four side surfaces 112a, 112b, 112c, and 112d surrounding the chamber 110 preferably block heat from entering the chamber 110. Therefore, a material having lower thermal conductivity than the material used for the first wall portion 111a and the second wall portion 111b is used. For example, a high heat resistant resin such as a silicone resin is used.

  The chamber 110 can be deformed flexibly so that the chamber 110 is divided into a first space 120a on the first wall 111a side and a second space 120b on the second wall 111b side. A flexible wiring board 101 is provided. The four sides of the wiring substrate 101 are formed on the inner surfaces of the four side surfaces 112a, 112b, 112c, and 112d that surround the periphery of the chamber 110 so that the sealing between the first space 120a and the second space 120b is maintained. It is fixed.

  As shown in FIG. 3, a plurality of chip capacitors 102 are mounted on the wiring substrate 101 in a plurality of rows and a plurality of columns. The chip type capacitor 102 defined here means a so-called surface mount type capacitor in which a terminal portion is directly joined to a land or the like on a wiring board through solder or the like without using a lead terminal.

  For the wiring substrate 101, a flexible substrate having a film thickness of about 30 μm using polyimide is used. A flexible substrate using polyimide has a very small heat capacity. Therefore, heat from the high heat source is efficiently transferred to the chip capacitor 102 during heating. This time can be estimated from the heat capacity and the heat resistance. When the heat resistance is the same, the time constant for causing the temperature change is doubled when the heat capacity is doubled, and the time for causing the same temperature change is obtained. Doubles. As a result, the power generation efficiency is halved. Similarly, when the thermal resistance is large, the efficiency is lowered. Therefore, it is effective to cause heat transfer under an appropriate stress in an area as large as possible from the heat source.

  Of the four side surfaces 112a, 112b, 112c, and 112d surrounding the chamber 110, the side surface 112a located on the upper side and the side surface 112c located on the lower side in FIG. 2 each have an opening that leads to the first space 120a. The first nozzle 113 that constitutes the second nozzle 114 and the second nozzle 114 that constitutes an opening leading to the second space 120b are provided. The chamber 110 is configured such that the internal space is kept sealed except for the first nozzle 113 and the second nozzle 114.

  Moreover, as shown in FIG. 4, each 1st nozzle 113 is connected to the air supply / exhaust device 201 via piping. Each second nozzle 114 is connected to the air supply / exhaust device 301 via a pipe. The air supply / exhaust devices 201 and 301 are controlled by the control unit 400. The air supply / exhaust device 201 alternately performs an air supply operation for supplying air into the first space 120a via the first nozzle 113 and an exhaust operation for discharging air from the first space 120a via the first nozzle 113. Do. The air supply / exhaust device 301 alternately performs an exhaust operation for discharging air from the second space 120b via the second nozzle 114 and an air supply operation for supplying air to the second space 120b via the second nozzle 114. .

  On the side of the second space 120 b of the wiring substrate 101 accommodated in the chamber 110, a plurality of chip type capacitors 102 are arranged at intervals that do not impair the flexibility of the wiring substrate 101. The size of the chip capacitor 102 is, for example, height 3.2 mm × length 1.6 mm × width 1.6 mm.

  The chip capacitor 102 is preferably a chip capacitor using a multilayer ceramic having a high energy density and a large temperature change in dielectric constant. However, any chip capacitor having similar characteristics may be used. A chip capacitor using a material may be used.

  Further, as shown in FIGS. 3 and 4, a thermal resistance reduction sheet 103 that covers all of the plurality of chip capacitors 102 is provided on the second wall 111 b side of the plurality of chip capacitors 102. This is provided in order to increase the contact area of the plurality of chip capacitors 102 to the second wall portion 111b, and to facilitate heat transfer between the chip capacitor 102 and the second wall portion 111b. This is a sheet.

  Since it is preferable that the thermal resistance reducing sheet 103 has the same characteristics as the flexible substrate described above, for example, a thermal conductive grease is applied to increase the heat transfer coefficient, and the film thickness is about 10 μm. A film using polyimide is used.

  In addition, the distance between the inner surface of the first wall 111a and the surface of the wiring board 101 in the first space 120a is about 0.1 mm to about 0.2 mm. Further, the distance between the inner surface of the second wall 111b and the surface of the thermal resistance reducing sheet 103 in the second space 120b is also about 0.1 mm to about 0.2 mm.

  The thermal resistance reducing sheet 103 is fixed to the chip-type capacitor 102 side, but may be fixed to the second wall portion 111b side. In addition, when the heat transfer between the chip capacitor 102 and the second wall portion 111b is not a problem, it is not necessary to provide the thermal resistance reduction sheet 103.

  As shown in the basic circuit of FIG. 5, the plurality of chip capacitors 102 are connected in parallel, and the charging process (SW1 = OFF / SW2 = ON) and the open state (SW1 = OFF) by switching the switch SW1 and the switch SW2. / SW2 = OFF) and the electrical energy extraction process (SW1 = ON / SW2 = OFF). It should be noted that ON / OFF control of switch SW1 and switch SW2 is performed in control unit 400. In FIG. 5, a load (or power storage device) L is connected to the switch SW1, and a battery BT is connected to the switch SW2.

  Next, a thermal dielectric power generation cycle in the thermal dielectric power generation apparatus 1 having the above configuration will be described with reference to FIGS. In the circuit shown in FIG. 5, the charged chip capacitor 102 is opened (SW1 = OFF, SW2 = OFF), and as shown in FIG. Air in 120a is discharged, and at the same time, air is introduced into the second space 120b from the second nozzle 114 by the air supply / exhaust device 301.

  By introducing air into the second space 120b, the wiring board 101 on which the chip capacitor 102 is mounted is bent toward the first space 120a, and the wiring board 101 comes into contact with the first wall portion 111a. Thereby, the chip capacitor 102 is heated by the heating duct 200.

  In addition, about 95 ° C. water (hot water) is introduced into the heating duct 200 as a high heat source, and about 15 ° C. water (cold water) is used as the low heat source in the cooling duct 300. Has been introduced.

  Next, after heating the chip capacitor 102, the switch SW1 is turned on and the switch SW2 is turned off in the circuit shown in FIG.

  Next, referring to FIG. 7, air is introduced from the first nozzle 113 into the first space 120 a by the air supply / exhaust device 201, and at the same time, the air in the second space 120 b from the second nozzle 114 by the air supply / exhaust device 301. Is discharged. By introducing air into the first space 120a, the wiring board 101 on which the chip capacitor 102 is mounted is bent toward the second space 120b, and the wiring board 101 comes into contact with the second wall 111b. As a result, the chip capacitor 102 is cooled by the cooling duct 300.

  Next, in the circuit shown in FIG. 5, the switch SW1 is turned off and the switch SW2 is turned on to charge the chip capacitor 102. Thereafter, the process proceeds from the heating step to the electric energy extraction step.

  In this way, by performing the thermal dielectric power generation cycle of the charging process → heating process → electrical energy extraction process → cooling process in order, thermal dielectric power generation is continuously performed, and it is possible to generate power efficiently. .

  As described above, according to the thermal dielectric power generation device 1, a plurality of chip capacitors 102 are mounted in a matrix on the wiring board 101, and the chip capacitors 102 are mounted using the flexibility of the wiring board 101. By alternately contacting the first wall 111a with which the heating duct 200 contacts and the second wall 111b with which the cooling duct 300 contacts, the temperature change of the chip capacitor 102 can be accelerated. .

  Thereby, the time required to reach a specific temperature of the chip capacitor 102 is shortened, and the number of heating / cooling cycles per unit time is increased. As a result, the amount of electrical energy extracted per unit time increases, and the amount of power generation can be increased.

  By the way, in this thermal dielectric power generation device 1, since a plurality of chip capacitors 102 are simply connected in parallel, when one chip capacitor 102 fails and short-circuits, a current flows through the path, and another chip capacitor 102 There is a possibility that the battery 102 cannot be charged and the power generation function is stopped. Further, in order to resume power generation, it is necessary to remove the shorted chip capacitor 102. For this reason, manpower is required, and the stop time becomes longer. In this embodiment, this problem can be solved.

  FIG. 8 is a diagram showing a main part of the thermal dielectric power generation device according to one embodiment of the present invention. Referring to FIG. 8, this thermal dielectric power generation device is different from thermal dielectric power generation device 1 of FIGS. 1 to 7 in that wiring board 101 and a plurality of chip type capacitors 102 include wiring board 501, N pieces (however, N is an integer greater than or equal to 2 and is replaced with, for example, 100 chip fuses 510, and N × M (where M is an integer greater than or equal to 2, for example, 10) chip capacitors 511 It is a point. The N × M chip capacitors 511 are grouped by M pieces.

  The wiring board 501 is a rectangular flexible board having a film thickness of about 30 μm using polyimide, like the wiring board 101. The chip-type fuse 510 is a so-called surface mount type fuse that directly joins a terminal portion to a land or the like on a wiring board through solder or the like without using a lead terminal. Similarly to the chip capacitor 102, the chip capacitor 511 is a so-called surface mount capacitor in which a terminal portion is directly joined to a land or the like on a wiring board via solder without using a lead terminal.

  A power supply wiring 502 extending in the Y direction is formed along the left side of the surface of the wiring substrate 501 in the drawing. Inside the power supply wiring 502 (on the right side), M electrodes 502a corresponding to the M chip-type fuses 510 are provided at a predetermined pitch.

  A ground wiring 503 extending in the Y direction is formed along the right side of the wiring board 501 in the drawing. Between the wirings 502 and 503, a plurality of ground wirings 504 extending in the X direction are arranged in the Y direction at a predetermined pitch. The right end of each ground wiring 504 is connected to the ground wiring 503. A wiring 505 extending in the X direction is formed to face each ground wiring 504. The wirings 504 and 505 are arranged in parallel at a predetermined interval. Further, the left end portion of each wiring 505 is disposed to face the corresponding electrode 502a.

  One electrode of each chip-type fuse 510 is bonded to the surface of the corresponding electrode 502 a, and the other electrode is bonded to the surface of the left end portion of the wiring 505. One electrode of each chip-type capacitor 511 is bonded to the surface of the corresponding wiring 505, and the other electrode is bonded to the surface of the corresponding ground wiring 504.

  When the chip type fuse 510 and the chip type capacitor 511 are mounted on the wiring board 501, the height of the upper surface of the chip type fuse 510 viewed from the surface of the wiring board 501 is the chip type capacitor viewed from the surface of the wiring board 501. The height is set to be equal to or less than the height of the upper surface of 511. In other words, the thickness of the chip type fuse 510 is equal to or less than the thickness of the chip type capacitor 511. This is because if the thickness of the chip-type fuse 510 is larger than the thickness of the chip-type capacitor 511, the chip-type fuse 510 prevents the contact between the chip-type capacitor 511 and the second wall portion 111b when the wiring board 501 is bent. This is because the temperature change of the chip capacitor 511 is hindered.

  FIG. 9 is a circuit block diagram showing the configuration of the thermal dielectric power generation apparatus described with reference to FIG. In FIG. 9, a capacitor CG indicates M chip capacitors 511 connected in parallel. One electrode of the N chip-type fuses 510 is connected to the positive electrode of the battery BT via the power supply wiring 502 and the switch SW2. One electrode of each capacitor CG is connected to the other electrode of the corresponding chip-type fuse 510, and the other electrode of the capacitor CG is both connected to the negative electrode of the battery BT via the ground wiring 503.

  In the cooling process, the switches SW1 and SW2 are both turned off, and the wiring board 501 is bent toward the cooling duct 300 to cool each capacitor CG. In the charging process, the switches SW1 and SW2 are turned off and on with the capacitor CG cooled. Thereby, a current flows from the battery BT to each capacitor CG via each chip-type fuse 510, and each capacitor CG is charged.

  In the heating step, the switches SW1 and SW2 are both turned off, and the wiring board 501 is bent toward the heating duct 200 to heat each capacitor CG. Thereby, the electrical energy of the capacitor CG is amplified, and the voltage across the terminals of the capacitor CG increases. In the electrical energy extraction step, the switches SW1 and SW2 are turned on and off, respectively, with the capacitor CG being heated. As a result, a current flows from each capacitor CG to the load L via the chip-type fuse 510, and each capacitor CG is discharged.

  As shown in FIG. 10, when one chip-type capacitor 511 is short-circuited in the charging process, there is a large path from the power supply wiring 502 to the corresponding chip-type fuse 510, short-circuited chip-type capacitor 511, and ground wirings 504 and 503. Current flows.

  Further, as shown in FIG. 11, when one chip capacitor 511 is short-circuited in the electric energy extraction process, the power supply wiring 502, the corresponding chip-type fuse 510, the short-circuited chip from the other charged chip-type capacitor 511. A large current flows through the path of the type capacitor 511. 10 and 11 show the case where the chip capacitors 511 in the second row from the top and in the second column from the left are short-circuited.

  As a result, as shown in FIG. 12, the chip capacitors 511 in the second row from the top are melted, and the capacitor group (capacitor CG) in the second row from the top is electrically disconnected from the power supply wiring 502. For this reason, other capacitor groups are charged / discharged from the next charge / discharge cycle without being affected by the short-circuited chip capacitor 511.

  Therefore, in this embodiment, even when one chip-type capacitor 511 fails and is short-circuited, it is possible to prevent the power generation function from being stopped due to current concentrated on the path. Further, since it is not necessary to remove the short-circuited chip type capacitor 511 in order to resume power generation, no manual operation is required.

  Note that when a short-circuit failure occurs in the chip capacitor 511, one of the capacitor groups stops functioning as described above, resulting in a decrease in power generation. For this reason, a design with a margin according to the application is required, but the present invention facilitates maintenance and can prevent a reduction in operating rate.

  Instead of mounting the chip-type fuse 510 on the wiring board 501, the fuse may be formed by wiring on the wiring board 501.

  FIGS. 13A to 13D are time charts showing the operation of this thermal dielectric power generation apparatus. 13A shows the temperature T (° C.) of the side surface of the chip-type capacitor 511, FIG. 13B shows the on / off operation of the switch SW2, and FIG. 13C shows the on / off operation of the switch SW1. FIG. 6D shows the voltage VL (V) between terminals of the load L. FIG. As is apparent from FIGS. 13A to 13D, charging / discharging is not necessarily performed after the temperature is stabilized, but is performed during the temperature change. As the temperature changes, the voltage across the capacitor changes, and charging and discharging are performed during the change.

  As shown in FIG. 13A, heating and cooling of the wiring board 501 were alternately performed for about 5 seconds each. The temperature TH of the high heat source body was 150 ° C., and the temperature TL of the low heat source body was 15 ° C. When the wiring substrate 501 is brought into contact with the heating duct 200, the temperature T of the chip capacitor 511 rises to about 130 ° C., and when the wiring substrate 501 is brought into contact with the cooling duct 300, the temperature T of the chip capacitor 511 is about 35 ° C. Descended.

  Further, as shown in FIGS. 13B and 13C, the switch SW2 is turned on to charge the chip capacitor 511 during the period when the temperature T of the chip capacitor 511 decreases, and the temperature T of the chip capacitor 511 increases. During the period, the switch SW1 was turned on to discharge the chip capacitor 511.

  As shown in FIGS. 13B to 13D, when the switch SW2 is turned on and the chip capacitor 511 is charged and then heated, the electric energy of the chip capacitor 511 is amplified and the voltage between the terminals is about 100V. To rise. When the switch SW1 is turned on in this state, the electrical energy stored in the chip capacitor 511 is supplied to the load L, and the voltage between the terminals of the chip capacitor 511, that is, the voltage VL (V) between the terminals of the load L decreases rapidly. To do.

  13A to 13D, when the switch SW1 is turned on and the electric energy of the M × N chip capacitors 511 is supplied to the load L (time t0), as shown in FIG. In the figure, a case where one chip capacitor 511 fails and is short-circuited is shown. When one chip-type capacitor 511 is short-circuited, the terminals of the load L are short-circuited by the chip-type capacitor 511, and the terminal voltage VL of the load L becomes 0V.

  Further, as shown in FIGS. 11 and 12, the current concentrates on the short-circuited chip capacitor 511, and the chip fuse 510 corresponding to the chip capacitor 511 is blown. A group of capacitors CG including a short-circuited chip capacitor 511 is electrically disconnected from the power supply wiring 502. Thereby, the chip type capacitors 511 of other groups operate normally from the next charge / discharge cycle, and the power generation is continued.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Thermal dielectric power generation device, 100 Power generation part, 101,501 Wiring board, 102,511 Chip type capacitor, 103 Thermal resistance reduction sheet, 110 Chamber, 111a 1st wall part, 111b 2nd wall part, 112a-112d Side surface, 113 First nozzle, 114 Second nozzle, 120a First space, 120b Second space, 200 Heating duct, 201, 301 Air supply / exhaust device, 300 Cooling duct, 400 Control unit, 501 Wiring board, 502 Power supply wiring, 502a Electrode 503, 504 Ground wiring, 505 wiring, 510 chip type fuse, BT battery, CA capacitor, CG capacitor, L load, SW1, SW2 switch.

Claims (2)

A flexible substrate;
A first terminal mounted on the flexible substrate, a second terminal, a plurality of chip-type fuse, and a plurality of capacitors comprising,
One terminal of each of the plurality of chip-type fuses is connected to the first terminal,
One terminal of each of the plurality of capacitors is connected to the other terminal of each of the plurality of chip-type fuses, and the other terminal of each of the plurality of capacitors is connected to the second terminal.
Each of the plurality of capacitors includes a plurality of chip type capacitors connected in parallel between the other terminal of the corresponding chip type fuse and the second terminal;
The thickness of each of the plurality of chip-type fuses is equal to or less than the thickness of each of the plurality of chip-type capacitors,
A cooling / heating unit that alternately performs a first step of cooling the plurality of capacitors and a second step of heating the plurality of capacitors;
And a charge / discharge unit connected to the first and second terminals for charging the cooled capacitors and discharging the heated capacitors. The cooling / heating unit includes:
A cooling member provided opposite to the one side surface of the flexible substrate and having a first temperature;
A heating member provided opposite to the other side surface of the flexible substrate and having a second temperature higher than the first temperature;
Wherein the flexible substrate is bent to the cooling member side to cool the plurality of capacitors, and a driving unit for the flexible substrate to heat the plurality of capacitors by bending to the heating member side, according to claim 1 Thermal dielectric power generator.

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