JP5730176B2 - Inverter-integrated electric compressor - Google Patents

Description

  The present invention relates to an inverter-integrated electric compressor that is particularly suitable for use in a vehicle air conditioner, which is configured by installing an inverter device inside an inverter box provided on the outer periphery of a housing.

  2. Description of the Related Art In recent years, electric vehicles that run on the power of an electric motor, such as electric vehicles, hybrid vehicles, and fuel cell vehicles, have been rapidly developed and introduced into the market. Many of the air conditioners in such an electric vehicle use an electric compressor that uses an electric motor as a compressor that compresses and sends out the refrigerant.

  Further, in an air conditioner for an automobile that travels with the power of an internal combustion engine, in order to improve the drivability drop caused by the intermittent connection of the electromagnetic clutch, the compressor is driven by the traveling internal combustion engine via the electromagnetic clutch. Some electric compressors are used.

  As such an electric compressor, a hermetic electric compressor in which a compression mechanism and an electric motor are integrally incorporated in a housing is adopted, and furthermore, electric power input from a power source is supplied to the electric motor via an inverter device. In many cases, the compressor can be variably controlled in accordance with the air conditioning load.

  In the electric compressor driven through the inverter device in this way, the control circuit board or the like constituting the inverter device is housed and installed in an inverter box integrally formed on the outer periphery of the housing of the electric compressor to electrically drive the inverter device. There is one in which electric parts such as a smoothing capacitor and a coil that are integrated with a compressor and further suppress electromagnetic noise are accommodated in the inverter box.

  In this case, it is necessary to cool a highly exothermic electrical component such as a switching element (IGBT, Insulated Gate Bipolar Transistor) of the inverter device. Since the inverter box has a completely sealed structure and cooling air or the like cannot be introduced from the outside, for example, as disclosed in Patent Documents 1 and 2, a heat radiating plane portion that constitutes the outer wall of the housing inside the inverter box ( A heat sink) is formed, and a heat generating electric component is brought into contact therewith, and the heat of the electric component is radiated and cooled by the cold heat of the refrigerant flowing inside the housing.

  In the inverter-integrated electric compressor described in Patent Document 1, a flat surface for heat dissipation is formed on the bottom surface of the inverter box, and an exothermic electrical component such as IGBT is installed on the top surface of the flat surface for heat dissipation. A control circuit board is installed in parallel through a space, and pin terminals extending upward from the heat generating electrical components are soldered to the control circuit board.

  Further, in the inverter-integrated electric compressor described in Patent Document 2, a metal substrate is fixed on a heat radiation flat portion formed on the bottom surface of the inverter box, and a heat generating electrical component is mounted on the metal substrate. In addition, a control circuit board is installed in parallel above the heat generating electrical component via a space, and heat of the heat generating electrical component is radiated to the heat radiation flat portion side through the metal substrate.

JP 2008-131792 A JP 2009-207310 A

  In such conventional inverter-integrated electric compressors, a space is provided between the heat generating electrical component installed to dissipate heat on the heat radiation flat surface side and the control circuit board. The height of the inverter device was increased depending on the space, which led to an increase in the size of the inverter-integrated electric compressor. The space is provided between the heat generating electrical component and the control circuit board in order to make it easy to solder the pin terminal extending from the heat generating electrical component toward the control circuit board to the control circuit board, and to repeatedly apply heat to the pin terminal. This is to give the pin terminal a predetermined length so that the pin terminal does not cause metal fatigue due to stress or vibration.

  Incidentally, there is a thermally conductive substrate called a copper inlay substrate that has recently been put into practical use (see, for example, Japanese Patent Application Laid-Open No. 2011-159727). This is a substrate provided with a plate-like substrate body made of an insulator and a heat conduction penetrating member made of a good heat conductor such as copper and filled in the thickness direction of the substrate body. If this thermally conductive substrate is used as a control circuit substrate of an inverter, a heat generating electrical component can be mounted without leaving a space on one surface of the thermally conductive penetrating member of the control circuit substrate. Moreover, the other surface of the heat conduction penetrating member can be brought close to the heat radiation flat portion on the inverter box side to improve the cooling performance of the heat generating electrical component.

  According to this configuration, the control circuit board, which is a heat conductive board, is placed on the heat radiation flat portion without a large space, and further, the heat generating electrical component is placed on the control circuit board with a space. Therefore, there is no useless space between the heat radiation flat part, the control circuit board, and the heat generating electrical parts, and thus the size of the inverter device in the height direction can be remarkably reduced. . However, in order to use this thermally conductive substrate as a control circuit substrate for an inverter-integrated electric compressor, the following problems remain.

  In other words, in an inverter device through which a high voltage and a high current flow, it is necessary to ensure a certain insulation distance between the control circuit board and the heat radiation flat part through an insulating member between them in order to ensure insulation. There is. However, if the insulation distance is too large, the cooling performance of the heat generating electrical components is impaired. Therefore, it is necessary to calculate an insulation distance that can achieve both insulation and cooling.

  On the other hand, in the heat conductive substrate, the heat conduction penetrating member slightly protrudes from both surfaces of the substrate body, and the contact with other parts is improved. However, the heat conductive penetrating member protrudes from the manufacturing method. The amount tends to vary. Thus, when the protrusion amount of the heat conduction penetrating member varies, it becomes difficult to calculate the above-described insulation distance. The problem is to achieve both insulation and cooling without being affected by variations in the protruding amount of the heat conduction penetrating member.

  The present invention has been made in view of such circumstances, and a thermal conductive substrate has been put to practical use as a control circuit substrate constituting an inverter device, and cooling performance and insulation of a heat-generating electrical component mounted on the control circuit substrate have been made. It is an object of the present invention to provide an inverter-integrated electric compressor capable of achieving both high performance and reducing the size and weight of an inverter device, reducing costs, reducing variation in assembly, and reducing the number of assembly steps.

In order to achieve the above object, the present invention provides the following means.
That is, the inverter-integrated electric compressor according to the present invention includes a refrigerant compression mechanism, an inverter box provided on an outer surface of a housing in which the electric motor that drives the compression mechanism is built, and a control circuit board. An inverter device housed and installed in the box; and a heat generating electrical component mounted on the control circuit board and constituting the inverter device; and a heat radiation plane constituting the outer wall of the housing inside the inverter box And an inverter-integrated electric compressor configured to cool the heat generating electrical component by radiating the heat of the heat-generating electrical component to the heat-dissipating flat part, wherein the control circuit board is a thermally conductive board. The heat generating electrical component is installed on one side of the control circuit board so that heat can be transferred, and the other side of the control circuit board is placed on the heat radiation plane. Are opposed to each other via the heat dissipation space to, said flexible, electrically insulating and thermally conductive is heat conductive filler member to the heat radiating space filling, the control circuit board includes a substrate main body made of an insulating material, the substrate A heat conduction penetrating member made of a good heat conductor that is through-filled in the thickness direction of the main body, and the thickness of the heat conduction penetrating member is set larger than the thickness of the substrate main body, and the heat conduction One end surface of the penetrating member is in contact with the heat-generating electrical component so that heat can be transferred, and the other end surface of the heat conducting penetrating member protrudes from the substrate body and contacts the heat conducting filling member, and the insulation distance of the heat dissipation space Is d, the insulation distance d is obtained from the following equation .
V _min / β + d _{1_max} ≦ d ≦ R _max · α · S + d _{1_min}
However, the protrusion amount of heat conduction through member from d ₁ is the control circuit board, S is the heat dissipation area of the heat-dissipating flat portion of the heat conduction through member, R represents the thermal resistance of the heat conducting filler member, V is the inverter device The necessary insulation voltage value of the heat conduction filling member, α is the heat conductivity of the heat conduction filling member, and β is the dielectric breakdown voltage of the heat conduction filling member.

  According to the above configuration, the heat generating electrical component is installed on one side of the control circuit board, which is a heat conductive board, so that heat can be transferred, and the other side of the control circuit board is for heat dissipation via the flexible heat conduction filling member. Opposite the flat part. The flexible heat conduction filling member is in close contact with the other surface of the control circuit board and the flat surface for heat dissipation without any gap, so that the heat of the heat generating electrical components installed on one side of the control circuit board is radiated through the heat conduction filling member. Heat is dissipated well to the flat surface side. For this reason, the heat dissipation of a heat-generating electrical component can be improved. In addition, since the heat conductive filling member has electrical insulation, the insulation between the heat generating electrical component and the heat radiation flat portion can be enhanced. Therefore, it is possible to achieve both insulating properties and cooling properties of the heat generating electrical component.

  Furthermore, by filling the heat radiation space formed between the control circuit board and the heat radiation flat portion with an electrically insulating heat conductive filling member, the insulation distance of the heat radiation space, that is, the control circuit board and the heat radiation flat portion, Can be narrowed. For this reason, the dimension of the height direction of the inverter box in which the control circuit board is accommodated can be reduced, and the inverter device can be reduced in size and weight.

In addition, since a flexible heat conduction filling member is interposed between the heat conduction penetrating member and the heat radiation flat portion, even if there is a variation in the amount of protrusion of the heat conduction penetrating member from the substrate body, this variation is not reduced. Absorbed by the flexibility of the member. For this reason, the heat of the heat generating electrical component can be radiated favorably to the heat radiating flat portion side regardless of variations in the protruding amount of the heat conduction penetrating member. Therefore, a thermally conductive substrate having a configuration in which a thermally conductive penetrating member is provided on the substrate body can be put into practical use as a control circuit substrate of an inverter device.
Further, according to the above configuration, the insulation distance d of the heat radiation space becomes excessive, and the cooling performance of the heat generating electrical component mounted on the control circuit board is lowered, or conversely, the insulation distance d becomes excessively small and the heat generating electrical component is reduced. It is possible to prevent the insulation property of the heat generating element from being lowered, and to achieve both the cooling property and the insulation property of the heat generating electrical component in an optimum state.

The inverter-integrated electric compressor according to the present invention, prior Symbol of state-like, the thermally conductive filler member initially has fluidity, and the elastic body is cured after being filled into the heat dissipating space It is the characteristic which becomes.

  According to the above configuration, since the heat conductive filling member has fluidity at the time of filling, for example, the amount of protrusion of the plurality of heat conductive penetrating members protruding from the back surface of the substrate main body of the heat conductive substrate constituting the control circuit board. Even if there is a variation, the heat conduction filling member is filled in a state where there is no gap between all these heat conduction penetrating members, the substrate body, and the heat radiation flat portion. Then, the said filling state is maintained because a heat conductive filling member hardens | cures. For this reason, the cooling property and insulation property of the heat generating electrical component mounted on the control circuit board can be maintained in a high state.

The inverter-integrated electric compressor according to the present invention, prior SL aspect, the control circuit board, a through hole communicating with the heat dissipation space, characterized in that it is bored.

  According to the above configuration, when the heat conduction filling member is applied to the heat radiation flat portion and then the control circuit board is installed thereon, the air remaining in the heat radiation space is formed in the through hole formed in the control circuit board. Discharged from. For this reason, the heat conduction filling member can be brought into contact with the back surface of the control circuit board without any gap, and thereby the cooling property of the heat generating electrical components mounted on the control circuit board can be kept good. Furthermore, since the assembly operator can visually confirm that an excessive heat conductive filling member comes out from the through hole, it is effective that a gap is generated in the heat radiation space due to insufficient filling amount of the heat conductive filling member. Therefore, reliable cooling can be obtained and variations in assembly can be eliminated.

The inverter-integrated electric compressor according to the present invention, prior SL aspect, the heat radiation space, and wherein the heat generating electrical component to the control circuit board is formed only in the vicinity mounted To do.

  According to the said structure, since the filling amount of a heat conductive filling member can be made into the minimum required amount, it can contribute to the cost reduction of an inverter apparatus.

The inverter-integrated electric compressor according to the present invention, prior SL aspect, the spacer member is interposed between the control circuit board and the heat-dissipating flat portion, the heat generating electrical component to the control circuit board The heat radiation space is formed by omitting the spacer member in a portion where the is mounted.

  According to the above configuration, the heat radiation space is formed by omitting the spacer member only in the part where the heat generating electrical component is mounted on the control circuit board, the amount of the heat conductive filling member is reduced to the necessary minimum amount, and for heat radiation. The surface shape of the flat portion is made flat to facilitate cutting, and the cost of the inverter device and the inverter-integrated electric compressor can be reduced. In addition, if a spacer member is formed in plate shape and a hole is opened only in the position where a heat-generating electrical component is provided, it can be formed easily.

The recess inverter-integrated electric compressor according to the present invention, prior SL aspect, the heat-dissipating flat portion, the portion facing the thermal conductive penetrating member, along the edge shape of the heat conduction through member It is characterized by forming a shape.

  According to the above configuration, the heat generated from the heat conduction penetrating member can be received in a concave shape formed in the flat surface for heat dissipation over a wide area, so that the cooling performance of the heat generating electrical components mounted on the control circuit board is improved. Can be improved. In addition, by increasing the depth of the concave shape, the distance between the heat conduction penetrating member and the heat radiation flat portion is increased to ensure the insulation of the heat generating electrical components, while the insulation distance of the heat radiation space is reduced. By reducing the height dimension of the inverter box, the inverter device can be reduced in size and weight.

Further, the present invention integrated-inverter electric compressor according to the prior SL aspect, the heat conduction through member, characterized by providing the heat-dissipating flat portion and the surface facing the concave-convex shape.

  According to the above configuration, the surface area of the heat conduction penetrating member facing the heat radiation flat portion is increased and can be in contact with the heat conduction filling member over a wide area. In addition, the heat dissipation property, that is, the cooling property of the heat generating electrical component can be improved.

The inverter-integrated electric compressor according to the present invention, prior SL aspect, the thermally conductive filler member may be a flexible sheet.

  According to the above configuration, since the heat conduction filling member can be installed without flowing into the heat radiation space, it is possible to reduce the number of assembling steps of the inverter device and contribute to the reduction in the manufacturing cost of the inverter-integrated electric compressor. can do.

  As described above, according to the inverter-integrated electric compressor according to the present invention, the heat conductive substrate is put into practical use as the control circuit board constituting the inverter device, and the cooling performance of the heat generating electrical components mounted on the control circuit board is improved. Insulating properties can be achieved, and the inverter device can be reduced in size, weight, cost, assembly variation, and assembly man-hours.

BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal cross-sectional view explaining schematic structure of the inverter integrated electric compressor which is 1st Embodiment of this invention. It is the longitudinal cross-sectional view of the inverter apparatus which expanded the II section of FIG. It is a figure which shows 1st Embodiment of this invention by the longitudinal cross-section of the inverter apparatus which follows the III-III line of FIG. It is a perspective view of an inverter apparatus. It is the longitudinal cross-sectional view of the heat conduction penetration member vicinity which expanded the V section of FIG. It is a longitudinal cross-sectional view of the inverter apparatus which shows 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of the inverter apparatus which shows 3rd Embodiment of this invention. It is a longitudinal cross-sectional view of the inverter apparatus which shows 4th Embodiment of this invention. It is a longitudinal cross-sectional view of the heat conduction penetration member vicinity which shows 5th Embodiment of this invention. It is a longitudinal cross-sectional view of the heat conduction penetrating member vicinity which shows 6th Embodiment of this invention. It is a longitudinal cross-sectional view of the inverter apparatus which shows 7th Embodiment of this invention. It is a longitudinal cross-sectional view explaining schematic structure of the inverter integrated electric compressor which shows 8th Embodiment of this invention.

A plurality of embodiments of the present invention will be described below with reference to FIGS.
[First Embodiment]
FIGS. 1-5 has shown 1st Embodiment of this invention, FIG. 1 is a longitudinal cross-sectional view explaining schematic structure of the inverter integrated electric compressor which is 1st Embodiment of this invention. The inverter-integrated electric compressor 1 is a compressor used in a vehicle air conditioner, and the drive rotation speed is controlled by an inverter device.

  The inverter-integrated electric compressor 1 has an aluminum alloy housing 2 that forms an outer shell. The housing 2 includes a compressor side housing 3 and an electric motor side housing 4 with a bearing housing 5 interposed therebetween. The bolt 6 is fastened and fixed.

  A known scroll compression mechanism 8 is incorporated in the compressor-side housing 3. Further, a stator 11 and a rotor 12 constituting the electric motor 10 are incorporated in the electric motor side housing 4. The scroll compression mechanism 8 and the electric motor 10 are connected via a main shaft 14, and the scroll compression mechanism 8 is driven by rotating the electric motor 10. The main shaft 14 is rotatably supported by a main bearing 15 held by the bearing housing 5 and a sub-bearing 16 held by the end portion of the motor-side housing 4.

  A refrigerant suction port (not shown) is provided at the end of the motor-side housing 4, and a suction pipe for a refrigeration cycle is connected to the refrigerant suction port so that low-pressure refrigerant gas is sucked into the motor-side housing 4. It has come to be. The refrigerant gas flows through the motor side housing 4 and cools the motor 10, and then is sucked into the scroll compression mechanism 8, where it is compressed into a high-temperature and high-pressure refrigerant gas, and is provided at the end of the compressor side housing 3. It is constituted so that it may discharge from the discharge port which is not illustrated to the discharge piping of a refrigerating cycle.

  The electric motor 10 is driven via the inverter device 21 and the rotation speed is variably controlled according to the air conditioning load. In the first embodiment, the inverter device 21 includes, for example, a lower substrate 25 that is a control circuit board and an upper portion inside a rectangular inverter box 23 that is integrally formed on the outer periphery of the housing 2, for example, the upper surface of the housing 2. The substrate 26 is housed and installed so as to overlap vertically, and is integrated with the inverter-integrated electric compressor 1.

  The inverter device 21 is electrically connected to the electric motor 10 through a bus bar 27, a glass insulating terminal 28, a motor terminal 29, a lead wire 30, and the like. In the present embodiment, for example, the lower substrate 25 is a power module substrate on which a large number of exothermic electrical components (heating elements) described later are mounted, and the upper substrate 26 is a low voltage such as a CPU (not shown). It is set as the CPU board | substrate with which the element which operate | moves is mounted.

  The inverter box 23 has a structure in which, for example, a peripheral wall 23a is integrally formed on the upper portion of the motor-side housing 4, and the upper opening is liquid-tightly closed by a lid member 23b. The depth of the inverter box 23 is such that the lower substrate 25 and the upper substrate 26 can be accommodated and installed at a predetermined interval in the interior, and electrical components such as a tall smoothing capacitor 37 are installed on the upper surface of the lower substrate 25. It is possible depth.

  As shown in FIG. 2, the bottom of the inverter box 23 constitutes the outer wall of the motor-side housing 4, and a heat radiation flat portion 31 (heat sink) parallel to the lower substrate 25 and the upper substrate 26 is formed here. Is formed. On the other hand, the lower substrate 25 is a heat conductive substrate, and on one surface (here, the upper surface), heat generating electrical components such as a smoothing capacitor 37, a coil 38, and six switching elements (IGBT) 39 are formed on the lower substrate 25. It is mounted so that heat can be transferred. The smoothing capacitor 37 and the coil 38 suppress electromagnetic noise.

  Further, the other surface (the lower surface in this case) of the lower substrate 25 is disposed so as to face the heat radiation flat surface portion 31 via the heat radiation space 34, and is fixed in the inverter box 23 with a plurality of screws 35, for example. (See FIG. 3). Since the upper surface of the fastening boss portion 35a to which the screw 35 is fastened is higher than the heat radiation flat surface portion 31 by the dimension d, there is a space of the dimension d between the lower surface of the lower substrate 25 and the heat radiation flat surface portion 31. . This dimension d is the height of the heat radiation space 34, that is, the insulation distance d described later.

  The heat radiation space 34 is filled with a heat conduction filling member 36 that is flexible and electrically insulating. As a material of the heat conduction filling member 36, for example, a silicon type or an elastomer type can be used. For this reason, the lower surface of the lower substrate 25 can transfer heat to the heat radiation flat portion 31 via the heat conductive filling member 36. The heat conduction filling member 36 is initially fluid and has a property of being cured after being filled into the heat radiation space 34 to become an elastic body.

  On the other hand, the upper substrate 26 is installed in parallel with a predetermined interval on the lower substrate 25 via a spacer member (not shown), for example, and is fixed to the lower substrate 25 with screws or the like. The upper substrate 26 is provided so as to cover the upper portions of the six short switching elements 39 while avoiding the tall smoothing capacitor 37 and the coil 38 mounted on the upper surface of the lower substrate 25.

  The lower substrate 25, which is a heat conductive substrate, is composed of a substrate body 41 made of an insulator such as glass epoxy or phenol resin, and a good heat conductor such as copper filled in the thickness direction of the substrate body 41. The heat conduction penetrating member 42 is configured. The lower substrate 25 is a multilayer substrate in which a plurality of circuit patterns 43 are laminated and embedded in the substrate body 41. As shown in FIG. 3, these circuit patterns 43 are electrically connected by penetration of the heat conduction penetrating member 42. The heat conduction penetrating member 42 may be insulated from the circuit pattern 43.

  The heat conduction penetrating member 42 is positioned on the lower substrate 25 so as to be aligned with the mounting position of the smoothing capacitor 37, the coil 38, and the six switching elements 39, and one end surface (upper surface) of each of the electric components 37, The lower end surfaces of 38 and 39 are in contact with each other so as to be able to transfer heat, and the other end surface (lower surface) is capable of transferring heat to the heat radiation flat portion 31 via a heat conductive filling member 36 having heat conductivity and elasticity. It touches.

  As shown in FIGS. 3 and 5, the thickness of the heat conduction penetrating member 42 is set to be slightly larger than the thickness of the substrate body 41, and the heat conduction penetrating member 42 has a heat radiation planar portion 31 side (heat radiation space 34 side). An end surface (lower end surface) slightly protrudes from the lower surface of the substrate body 41. The height of the heat radiation space 34, that is, the thickness of the heat conduction filling member 36 is the aforementioned insulation distance d.

Below, the setting method of the insulation distance d [mm] is demonstrated.
As shown in FIG. 5, the insulation distance is d, the protruding amount of the heat conduction penetrating member 42 from the lower substrate 25 (substrate body 41) is d ₁ [mm], and the heat radiation penetrating member 42 from the tip of the heat conduction penetrating member 42 D ₂ [mm], the heat radiation area of the heat conduction penetrating member 42 toward the heat radiation flat portion 31 side is S [mm ² ], and the heat conductivity of the heat conduction filling member 36 is α [W / (mm · K)], the thermal resistance of the heat conduction filling member 36 is R [K / W], the dielectric breakdown voltage of the heat conduction filling member 36 is β [kV / mm], and the insulation voltage of the heat conduction filling member 36 is V [kV]. Then, the thermal resistance R of the heat conduction filling member 36 at the insulation distance d between the lower substrate 25 and the heat radiation flat portion 31 is expressed by the following equation.
R = d ₂ / (α · S) (1)
Although the _{d =} d 1 + _{d 2,} since there is a manufacturing variation in _{d 1,} the _{d 2} when the minimum value of _{d 1} was _{d 1_min d 2_max,} the maximum value of _{d 1 d 1_Max} D ₂ is _defined as d _{2 — min} .
When the thermal resistance required for the heat dissipation of the inverter 21 and _{R max,
R = d 2_max / (α ·} S) ≦ R max ··· formula (2)
From Equation (1) and Equation (2),
d ≦ R _max · α · S + d 1 — _min (3)

Next, an insulable distance between the lower substrate 25 and the heat radiation flat portion 31 will be examined. The dielectric breakdown voltage β and the insulation voltage V of the heat conduction filling member 36 are expressed by the following equations.
V = β · d ₂
When the minimum value of the insulation voltage required for the inverter device 21 is V _min ,
V = β · d _{2_min} ≧ V _min (4)
From Equation (1) and Equation (4),
d ≧ V _min / β + d 1 — _max (5)
Therefore, from the equations (3) and (5), by setting the insulation distance d between the lower substrate 25 and the heat radiation flat portion 31 within the range of the following equation (6), heat dissipation and electrical insulation are achieved. Sex can be made compatible.
V _min / β + d _{1_max} ≦ d ≦ R _max · α · S + d _{1_min} (6)

  By calculating the insulation distance d in this way, the insulation distance d becomes excessive, the cooling performance of the heat generating electrical components 37, 38, 39 mounted on the lower substrate 25 decreases, and conversely, the insulation distance d is too small. It is possible to prevent the heat insulation of the heat generating electrical components 37, 38, 39 from being deteriorated with respect to the flat surface 31 for heat dissipation, and the cooling property and the insulation properties of the heat generating electrical components 37, 38, 39 can be optimized. Both can be achieved.

  When assembling the inverter device 21, first, the heat conduction filling member 36 is applied on the heat radiation flat portion 31, and then the lower substrate 25 is fastened to the fastening boss portion 35 a with the screw 35. At this time, the surplus heat conduction filling member 36 bulges into the escape groove 45 formed so as to dig up the periphery of the heat radiation flat portion 31. Thereafter, the heat conduction filling member 36 is cured in the heat radiation space 34. The upper substrate 26 is assembled in the inverter box 23 together with the lower substrate 25 in a state of being attached to the lower substrate 25 in advance, or is assembled from the rear of the lower substrate 25.

  When the inverter-integrated electric compressor 1 configured as described above operates, the low-pressure refrigerant gas after circulating in the refrigeration cycle is sucked into the motor-side housing 4 from a refrigerant suction port (not shown), and the motor-side housing 4 The inside is circulated and sucked into the scroll compression mechanism 8. The refrigerant gas compressed by the scroll compression mechanism 8 to become high temperature and pressure is circulated from a discharge port (not shown) provided at the end of the compressor side housing 3 to a refrigeration cycle through a discharge pipe.

  During this time, the low-temperature low-pressure refrigerant gas that circulates in the motor-side housing 4 passes through the heat radiation flat portion 31 that is also the housing outer wall of the motor-side housing 4 against the operating heat generated from the inverter device 21 in the inverter box 23. Endothermic. Thereby, the lower board | substrate 25 which is a power board can be forcedly cooled.

  In particular, the smoothing capacitor 37, the coil 38, and the switching element 39, which are heat-generating electrical components mounted on the lower substrate 25, have their lower surfaces filled through in the thickness direction of the lower substrate 25, which is a thermally conductive substrate. The heat conduction penetrating member 42, which is a good heat conductor, is in close contact with the upper surface of the heat conduction penetrating member 42, and the lower surface of the heat conduction penetrating member 42 is attached to the heat radiation planar portion 31 via the heat conduction filling member 36 that is flexible and thermally conductive. Since the heat is transmitted to the electric parts 37, 38, 39 through the heat conduction penetrating member 42 and the heat conduction filling member 36, the heat is quickly transmitted to the heat radiating flat surface portion 31 side to be efficiently cooled. The Among them, the six switching elements 39 have a particularly large calorific value, so that the heat is quickly radiated to the heat radiation flat surface portion 31 side through the heat conduction filling member 36, whereby the entire inverter device 21 is efficiently cooled, The internal temperature rise of the inverter box 23 is prevented. Further, since the heat conduction filling member 36 is electrically insulating, the lower substrate 25, which is a power module substrate to which a high voltage and a high current are applied, is reliably insulated from the heat radiation flat portion 31 (housing 2) side. can do.

  In the configuration of the present embodiment, the lower substrate 25 is a heat conductive substrate, and the heat generating electrical components 37, 38, 39 are installed on the upper surface of the lower substrate 25 so as to be able to transfer heat, and the lower surface of the lower substrate 25 is disposed on the flat surface portion for heat dissipation. Since the heat radiation filling space 36 is filled with a heat conductive filling member 36 that is flexible and electrically insulating and thermally conductive, the flexible heat conduction filling member 36 is placed on the lower surface of the lower substrate 25. And the heat-dissipating flat portion 31 are in close contact with each other without any gap. Therefore, the heat of the heat generating electrical components 37, 38, 39 installed on the upper surface of the lower substrate 25 is well radiated to the heat radiation flat portion 31 side through the heat conduction filling member 36, and the heat generating electrical components 37, 38, 39 Coolability can be improved. In addition, since the heat conduction filling member 36 has electrical insulation, the insulation between the heat generating electrical components 37, 38, 39 and the heat radiation flat portion 31 can be enhanced. Therefore, it is possible to achieve both insulation and cooling of the heat generating electrical components 37, 38, and 39.

  Further, by filling the heat radiation space 34 formed between the lower substrate 25 and the heat radiation flat portion 31 with the heat conduction filling member 36 having electrical insulation, the heat conduction filling member 36 is more electrically charged than when the heat conduction filling member 36 is not filled. Since the insulation can be remarkably improved, the insulation distance d of the heat radiation space 34, that is, the interval between the lower substrate 25 and the heat radiation flat portion 31 can be reduced. For this reason, the dimension of the height direction of the inverter box 23 in which the lower board | substrate 25 is accommodated can be made small, and size reduction and weight reduction of the inverter apparatus 21 can be achieved.

  The lower substrate 25 is a thermally conductive substrate including a substrate body 41 made of an insulator and a heat conduction penetrating member 42 made of a good heat conductor that is filled in the thickness direction of the substrate body 41. In addition, one end face of the heat conduction penetrating member 42 is in contact with the heat generating electrical components 37, 38, 39 so that heat can be transferred, and the other end face is in contact with the heat conduction filling member 36.

  For this reason, even if there is a variation in the amount of protrusion of the heat conduction penetrating member 42 from the substrate body 41 by interposing the flexible heat conduction filling member 36 between the heat conduction penetrating member 42 and the heat radiation planar portion 31, This variation is absorbed by the flexibility of the heat conductive filling member 36. Therefore, the heat of the heat generating electrical components 37, 38, 39 can be radiated favorably to the heat radiating flat portion 31 side regardless of variations in the protruding amount of the heat conduction penetrating member 42. Thereby, the heat conductive board | substrate of the structure by which the heat conductive penetration member 42 was provided in the board | substrate body 41 can be utilized as a control circuit board | substrate of the inverter apparatus 21. FIG.

  Furthermore, since the heat conduction filling member 36 is initially fluid and has a property of being cured after being filled into the heat radiation space 34 to become an elastic body, for example, from the back surface of the substrate body 41 constituting the lower substrate 25. Even if there are variations in the protruding amounts of the plurality of protruding heat conduction penetrating members 42, the heat conduction filling member 36 is in contact with all of the heat conduction penetrating members 42, the substrate body 41, and the heat radiation planar portion 31 without any gaps. It is filled in the state. Thereafter, the heat conduction filling member 36 is cured, so that the above filling state is maintained. For this reason, the cooling property and insulation of the heat generating electrical components 37, 38, 39 mounted on the lower substrate 25 can be maintained in a high state.

[Second Embodiment]
FIG. 6 is a longitudinal sectional view of an inverter device 21 showing a second embodiment of the present invention. This embodiment has the same configuration as that of the first embodiment shown in FIG. 3 except that the lower substrate 25 (substrate body 41) has a plurality of through holes 51 communicating with the heat radiation space 34. Therefore, the same reference numerals are given to the respective parts, and the description thereof is omitted. The through hole 51 is formed so as to pass between the heat conduction penetrating members 42 on which the plurality of switching elements 39 are mounted, for example. The through hole 51 may be formed so as to surround each switching element 39 in a plan view.

  When such a through hole 51 is formed in the lower substrate 25, when the lower substrate 25 is assembled, the heat conduction filling member 36 is applied on the heat radiation flat portion 31, and then the lower substrate is disposed on the fastening boss portion 35a. The air remaining in the heat radiation space 34 is discharged from the through hole 51 when the 25 is installed and fastened with the screw 35. Further, the excessive heat conduction filling member 36 is pushed out from the through hole 51 and comes out. For this reason, the heat conduction filling member 36 can contact the back surface side of the lower substrate 25 without a gap without leaving air on the back surface side of the lower substrate 25, and thereby the heat generating electrical component mounted on the lower substrate 25. The cooling properties of 37, 38 and 39 can be kept good.

  Moreover, since the surplus of the heat conduction filling member 36 comes out of the through hole 51 as described above, this can be visually confirmed by an assembling operator, whereby the amount of filling of the heat conduction filling member 36 is insufficient. It is possible to prevent this, obtain reliable cooling, and eliminate assembling variations.

  In addition, although the escape groove | channel 45 for expanding the excess heat conduction filling member 36 is formed in the circumference | surroundings of the thermal radiation plane part 31, this escape groove | channel 45 may be abbreviate | omitted. By omitting the escape groove 45, the shape of the heat radiation flat portion 31 and the heat radiation space 34 can be simplified, the machining of the inverter box 23 (the motor side housing 4) can be facilitated, and the manufacturing cost can be reduced.

[Third Embodiment]
FIG. 7 is a longitudinal sectional view of an inverter device 21 showing a third embodiment of the present invention. In this embodiment, the heat radiation space 34 is formed only at a position corresponding to the vicinity where the switching element 39 which is a heat generating electrical component is mounted on the lower substrate 25. That is, only the portion of the fastening surface 52 to which the lower substrate 25 is fastened by the screw 35 is aligned downward with the switching element 39, and a plurality of heat radiation spaces 34 are formed in the recesses. 31. In addition, as in the second embodiment, a plurality of through holes 51 are formed in the lower substrate 25 (substrate body 41) so as to communicate with the plurality of heat radiation spaces 34, and the heat radiation space 34 is filled with heat conduction. The member 36 is filled.

  When the lower substrate 25 is assembled, first, the heat conduction filling members 36 are filled in the heat radiation spaces 34. At this time, the heat conductive filling member 36 is filled so as to rise slightly from the fastening surface 52. Then, the lower substrate 25 is installed on the fastening surface 52 and fastened with screws 35. At this time, as in the case of the second embodiment, the air remaining in the heat radiation space 34 is discharged from the through hole 51, and the excessive heat conduction filling member 36 is pushed out from the through hole 51. For this reason, it is possible to prevent the air from remaining in each heat radiation space 34 and to keep the cooling performance of the switching element 39 favorable.

  According to said structure, since the volume of the thermal radiation space 34, ie, the filling amount of the heat conduction filling member 36, can be made into the minimum required amount, it can contribute to the cost reduction of the inverter apparatus 21.

[Fourth Embodiment]
FIG. 8 is a longitudinal sectional view of an inverter device 21 showing a fourth embodiment of the present invention. In this embodiment, a plate-like spacer member 54 having a thickness of about several millimeters is interposed between the heat radiation flat portion 31 and the lower substrate 25. The spacer member 54 is omitted at a position that matches the position of the switching element 39 that is a heat generating electrical component mounted on the lower substrate 25. That is, for example, a hole 55 is formed at a position aligned with the spacer member 54, and the heat radiation space 34 is formed inside the hole 55. The shape and volume of the heat dissipation space 34 are the same as in the third embodiment. Further, the plurality of through holes 51 are formed in the lower substrate 25 so as to communicate with the respective heat radiation spaces 34, and the heat conduction filling member 36 is filled in the heat radiation spaces 34 as in the third embodiment. .

The thickness of the spacer member 54 is based on the insulation distance d [mm] described in the first embodiment, and the spacer member 54 is made of a material whose thickness becomes thin due to crushing caused by the fastening force of the screw 35 after assembly. Is used for the spacer member 54, the thickness of the spacer member 54 is set to d + d ₃ [mm] in consideration of the crushing amount d ₃ [mm].

  When the lower substrate 25 is assembled, the spacer member 54 is placed on the heat radiation flat portion 31, and the heat conduction filling member 36 is filled inside the hole 55, that is, in the heat radiation space 34 while temporarily holding the spacer member 54. At this time, the heat conductive filling member 36 is filled so as to rise slightly from the upper surface of the spacer member 54. Then, the lower substrate 25 is placed on the spacer member 54 and fastened with screws 35. At this time, as in the case of the second and third embodiments, the air remaining in the heat radiation space 34 is discharged from the through hole 51, and the excessive heat conduction filling member 36 is pushed out from the through hole 51. For this reason, it is possible to prevent the air from remaining in each heat radiation space 34 and to keep the cooling performance of the switching element 39 favorable.

  According to the above configuration, the heat radiation space 34 is formed by omitting the spacer member 54 only at the portion where the switching element 39 is mounted on the lower substrate 25, and the filling amount of the heat conduction filling member 36 is set to the necessary minimum amount. At the same time, the surface shape of the heat radiation flat portion 31 is made flat to facilitate the cutting process, and the cost of the inverter device 21 and the inverter-integrated electric compressor 1 can be reduced. Since the spacer member 54 is formed in a plate shape and has a hole 55 only at a position where it is aligned with the switching element 39, the spacer member 54 can be easily manufactured. Furthermore, by changing the thickness of the spacer member 54, the distance (insulating distance) between the lower substrate 25 and the heat radiation flat portion 31 can be freely adjusted.

[Fifth Embodiment]
FIG. 9 is a longitudinal sectional view of the vicinity of the heat conduction penetrating member 42 showing the fifth embodiment of the present invention. In this embodiment, the heat radiating flat surface portion 31 is formed with a concave shape 58 along the end shape of the heat conduction penetrating member 42 at a portion facing the heat conduction penetrating member 42 protruding downward from the lower substrate 25. Yes. The recessed portion 58 has a shape that protrudes from the heat radiation flat surface portion 31 and surrounds the periphery of the front end of the heat conduction penetrating member 42. A predetermined insulation distance d is provided so that both the cooling property and the insulation property of the conductive penetrating member 42 can be achieved. The heat conduction filling member 36 is filled between the lower substrate 25 and the heat radiation flat portion 31 and between the heat conduction penetrating member 42 and the recessed portion 58.

  According to the above configuration, the heat generated from the heat conduction penetrating member 42 is received in a wide area by the recessed portion 58 and is radiated to the heat radiating flat portion 31 side. For this reason, it is possible to improve the cooling performance of a heat generating electrical component (not shown) mounted on the lower substrate 25.

  Further, by increasing the height dimension of the peripheral wall portion of the concave shape 58, the heat radiation flat member 31 and the heat dissipating flat member 31 are formed over the entire tip shape of the heat conductive penetrating member 42 while ensuring the insulation of the heat conductive penetrating member 42. , That is, the insulation distance d can be reduced to reduce the height of the inverter device 21 and the inverter box 23, and thus the inverter-integrated electric compressor 1 can be reduced in size and weight.

[Sixth Embodiment]
FIG. 10 is a longitudinal sectional view of the vicinity of the heat conduction penetrating member 42 showing the sixth embodiment of the present invention. In this embodiment, an uneven shape 42 a is provided on the surface of the heat conduction penetrating member 42 facing the heat radiation flat portion 31, that is, the lower end surface. In this way, the surface area of the lower end surface of the heat conduction penetrating member 42 is increased, and the heat conduction filling member 36 can be brought into contact with a large area. Therefore, the heat dissipation of the heat generating electrical component installed on the opposite side of the heat conduction penetrating member 42 is achieved. Performance, that is, cooling performance can be improved.

[Seventh Embodiment]
FIG. 11 is a longitudinal sectional view of an inverter device showing a seventh embodiment of the present invention. In this embodiment, since the heat conduction filling member 60 provided in the heat radiation space 34 has the same configuration as that of the first embodiment shown in FIG. The reference numerals are attached and the description is omitted. The free thickness of the heat conduction filling member 60 is preferably slightly larger than the insulation distance d of the heat radiation space 34. Thus, when the heat conduction filling member 60 is laid on the heat radiation flat portion 31 and the lower substrate 25 is placed thereon and fastened with the screws 35, the heat conduction filling member 60 is brought about by the fastening force of the screws 35. Is pressed between the heat dissipating flat part 31 and the lower substrate 25, and the upper and lower surfaces of the heat conduction filling member 60 are in close contact with both surfaces of the lower substrate 25 and the heat dissipating flat part 31. For this reason, the heat of the heat generating electrical components such as the switching element 39 mounted on the lower substrate 25 is radiated well to the side of the heat radiating flat portion 31 through the heat conduction filling member 60, and the cooling performance of the heat generating electrical components is improved.

  Since the heat conduction filling member 60 has a flexible sheet shape, the heat conduction filling member 60 can be installed without flowing into the heat radiation space 34 like the heat conduction filling member 36 of the first embodiment. For this reason, it is possible to reduce the assembly man-hour of the inverter device, and it is possible to contribute to a reduction in manufacturing cost of the inverter-integrated electric compressor.

[Eighth Embodiment]
FIG. 12 is a longitudinal sectional view of an inverter-integrated electric compressor showing an eighth embodiment of the present invention. In this inverter-integrated electric compressor 61, the configuration other than the periphery of the inverter device 62 is the same as that of the inverter-integrated electric compressor 1 of the first embodiment shown in FIG. Is omitted.

  This inverter-integrated electric compressor 61 is a type in which an inverter box 63 in which an inverter device 62 is accommodated is provided on the rear end face of the housing 2 (motor-side housing 4). The main reason for providing the inverter box 63 on the rear end surface of the housing 2 is that the housing 2 having a substantially columnar shape when the inverter-integrated electric compressor 61 is installed in an engine room of a hybrid vehicle or an electric vehicle. This is because it is easier to mount in a layout if the inverter box 63 has a slim shape that does not protrude from the outer peripheral surface.

  A flat heat radiation flat portion 64 is formed on the rear end surface constituting the outer wall of the motor-side housing 4, and a cover-like inverter box formed of metal or resin so as to cover the heat radiation flat portion 64. 63 is hermetically covered, and the inverter device 62 is accommodated in a space between the heat radiation flat portion 64 and the inverter box 63. Since the basic configuration of the inverter device 62 is the same as that of the inverter device 21 in the first embodiment, the same reference numerals are given to the respective parts to simplify the description.

  The surface directions of the lower substrate 25 and the upper substrate 26 constituting the inverter device 62 are parallel to the surface direction of the heat radiation flat portion 64, and the substrate main body 41 and the heat conduction penetrating as in the inverter device 21 in the first embodiment. A lower substrate 25, which is a heat conductive substrate provided with a member 42, is installed between the heat radiation flat portion 64 via a heat radiation space 34, and a heat conduction filling member 36 is filled in the heat radiation space 34. Has been. The properties and the like of the heat conduction filling member 36 are the same as those of the first embodiment.

  On the lower substrate 25, a smoothing capacitor 37, a switching element 39, and the like, which are heat generating electrical components, are mounted so as to be able to transfer heat to the lower substrate 25. Then, the heat of the electric components 37 and 39 is radiated to the heat radiation flat portion 64 side through the heat conduction penetrating member 42 and the heat conduction filling member 36 of the lower substrate 25 so that the electric components 37 and 39 are cooled. It has become.

  According to the above configuration, when the inverter device 62 is provided on the rear end surface of the inverter-integrated electric compressor 61, the inverter-integrated electric compressor 61 can be reduced in length and weight. .

  The present invention is not limited to the configurations of the first to eighth embodiments described above, and can be appropriately modified or improved without departing from the gist of the present invention. Embodiments with improvements are also included in the scope of rights of the present invention. For example, the configurations of the first to eighth embodiments may be combined.

  In addition to the application to the inverter integrated electric compressor, the substrate cooling structure described in the first to eighth embodiments described above is, for example, a hot water heater, a vehicle traveling inverter, a vehicle / home / store / office, etc. The present invention can also be widely applied to air conditioning inverters, air conditioning fan motor control devices, power supply devices for various electrical devices, and the like.

1,61 Inverter-integrated electric compressor 2 Housing 8 Compression mechanism 10 Electric motor 21 Inverter device 23 Inverter box 25 Lower substrate (control circuit substrate)
31 Flat part for heat radiation 34 Heat radiation space 36, 60 Heat conduction filling member 37 Smoothing capacitor (heat generating electrical component)
38 Coils (Heat-generating electrical parts)
39 Switching elements (heat generating electrical parts)
41 Substrate body 42 Heat conduction penetrating member 42a Concavity and convexity 51 Through hole 54 Spacer member 58 Recessed shape d Insulation distance d ₁ Protrusion amount of heat conduction penetrating member from control circuit board R Thermal resistance of heat conduction filling member S Heat conduction penetrating member Heat dissipation area V to the heat radiation flat surface side V Insulation voltage of heat conduction filler

Claims (8)

An inverter box provided on an outer surface of a housing in which a refrigerant compression mechanism and an electric motor for driving the compression mechanism are incorporated;
An inverter device having a control circuit board and housed in the inverter box;
A heating electric component mounted on the control circuit board and constituting the inverter device,
Inside the inverter box, a heat radiating flat part constituting the outer wall of the housing is formed,
An inverter-integrated electric compressor configured to cool the heat generated by dissipating heat from the heat-generating electrical component to the heat-dissipating flat surface side,
The control circuit board is a thermally conductive board,
The heat generating electrical component is installed on one surface of the control circuit board so that heat can be transferred,
The other surface of the control circuit board is opposed to the heat radiating flat portion through a heat radiation space,
Filling the heat dissipation space with a heat conductive filling member that is flexible, electrically insulating and thermally conductive ,
The control circuit board is
A substrate body made of an insulator;
A heat conduction penetrating member made of a good heat conductor that is through-filled in the thickness direction of the substrate body, and
The thickness of the heat conduction penetrating member is set larger than the thickness of the substrate body,
One end face of the heat conduction penetrating member is in contact with the heat generating electrical component so as to be able to transfer heat,
The other end face of the heat conduction penetrating member protrudes from the substrate body and contacts the heat conduction filling member,
Inverter-integrated electric compressor , wherein d is the insulation distance of the heat radiation space, and the insulation distance d is obtained from the following equation .
V _min / β + d _{1_max} ≦ d ≦ R _max · α · S + d _{1_min}
However, the protrusion amount of heat conduction through member from d ₁ is the control circuit board, S is the heat dissipation area of the heat-dissipating flat portion of the heat conduction through member, R represents the thermal resistance of the heat conducting filler member, V is the inverter device The necessary insulation voltage value of the heat conduction filling member, α is the heat conductivity of the heat conduction filling member, and β is the dielectric breakdown voltage of the heat conduction filling member.   2. The inverter-integrated electric compressor according to claim 1, wherein the heat conductive filling member is initially fluid and has a property of being cured after being filled in the heat radiation space to become an elastic body. .   The inverter-integrated electric compressor according to claim 1, wherein a through hole communicating with the heat radiation space is formed in the control circuit board.   4. The inverter-integrated electric compressor according to claim 1, wherein the heat radiation space is formed only in the vicinity of the control circuit board where the heat generating electrical component is mounted. 5.   A spacer member is interposed between the heat radiation flat portion and the control circuit board. The spacer member is omitted at a portion where the heat generating electrical component is mounted on the control circuit board, whereby the heat radiation space is formed. The inverter-integrated electric compressor according to any one of claims 1 to 4, wherein the inverter-integrated electric compressor is formed.   The recessed part shape which followed the edge part shape of the said heat conduction penetrating member was formed in the site | part which opposes the said heat conduction penetrating member of the said heat radiation flat part, The Claim 1 characterized by the above-mentioned. Inverter-integrated electric compressor.   The inverter-integrated electric compressor according to any one of claims 1 to 6, wherein an uneven shape is provided on a surface of the heat conduction penetrating member facing the heat radiation flat portion.   The inverter-integrated electric compressor according to any one of claims 1, 4, 5, 6, and 7, wherein the heat conduction filling member has a flexible sheet shape.

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