JP5728251B2 - Grinding method for long workpiece - Google Patents

Grinding method for long workpiece Download PDF

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JP5728251B2
JP5728251B2 JP2011045043A JP2011045043A JP5728251B2 JP 5728251 B2 JP5728251 B2 JP 5728251B2 JP 2011045043 A JP2011045043 A JP 2011045043A JP 2011045043 A JP2011045043 A JP 2011045043A JP 5728251 B2 JP5728251 B2 JP 5728251B2
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純一郎 重水
純一郎 重水
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本発明は、樹脂フィルム成形用T−ダイ、溶工用T―ダイ、液体カーテン幕形成T−ダイなどの長さが5〜10mと長い長尺状ワークピースを砥石車、平研削砥石(PCD砥石、カップホイール砥石、ピッチポリィシャーなどの研削(研磨)工具を用い、平坦で反りの小さい長尺状ワークピースに研削加工する方法に係る。   In the present invention, a long work piece having a length of 5 to 10 m such as a T-die for resin film molding, a T-die for melting, or a T-die for forming a liquid curtain curtain is applied to a grinding wheel, a flat grinding wheel (PCD). The present invention relates to a method of grinding a long workpiece with a flat and small warp using a grinding (polishing) tool such as a grindstone, a cup wheel grindstone, or a pitch polisher.

長尺状ワークピースの表面をピッチポリィシャーで一方向研削加工して工具軌跡島模様の無いT−ダイに機械加工することは知られている。   It is known to machine the surface of a long workpiece into a T-die without a tool locus island pattern by unidirectional grinding with a pitch polisher.

例えば、特開2006−7373号公報(特許文献1)は、図2に示すフレーム6上に設けられたワークテーブル4、研磨ヘッド10のスピンドル軸の下端に軸承された研磨工具保持板、該研磨工具保持板表面に貼付されたピッチ研磨工具3、該ピッチ研磨工具を軸承する前記スピンドル軸の回転駆動装置、左右移動駆動装置ならびに昇降装置、および、前記ワークテーブル上に載置されたワーク面とこれに対向する前記ピッチ研磨工具面間に研磨剤を供給する研磨剤供給ノズル、ドレッサ12、数値制御装置8を備えるピッチ研磨装置100を提案する。   For example, Japanese Patent Laying-Open No. 2006-7373 (Patent Document 1) discloses a work table 4 provided on a frame 6 shown in FIG. 2, a polishing tool holding plate supported on the lower end of a spindle shaft of a polishing head 10, and the polishing A pitch polishing tool 3 affixed to the surface of the tool holding plate, a rotation driving device of the spindle shaft that supports the pitch polishing tool, a right and left movement driving device, a lifting device, and a work surface placed on the work table; A pitch polishing apparatus 100 including an abrasive supply nozzle, a dresser 12 and a numerical controller 8 for supplying an abrasive between the pitch polishing tool surfaces facing this is proposed.

このピッチ研磨装置を用い、フレーム6上に設けられたワークテーブル6に固定された金属メッキブロック材(ワーク)表面に、スピンドル軸の下端に軸承された研磨工具保持板に貼付されたピッチ研磨工具3のピッチ面を押圧し、ワーク表面とこれに対向する前記ピッチ研磨工具面間に研磨剤を供給しながらピッチ研磨工具を回転させながら一方向に移動させ、ワークの一方向ピッチ研磨を行い、ワークに残っていた砥石車縞跡を消滅させるとともに、砥石車を利用した精密研削装置を用いて精密研磨されたワークと比較して表面粗さの値が1/4〜1/6倍と小さくなったより優れた研磨鏡面を呈現させることができる。   Using this pitch polishing apparatus, a pitch polishing tool affixed to a surface of a metal plating block (work) fixed to a work table 6 provided on a frame 6 on a polishing tool holding plate supported at the lower end of a spindle shaft 3 is pressed and moved in one direction while rotating the pitch polishing tool while supplying an abrasive between the workpiece surface and the pitch polishing tool surface facing the workpiece surface, and performs one-direction pitch polishing of the workpiece. The grinding wheel streak traces remaining on the workpiece are eliminated, and the surface roughness value is 1/4 to 1/6 times smaller than that of a workpiece that has been precisely polished using a precision grinding device that uses a grinding wheel. An improved polishing mirror surface can be exhibited.

また、上記ピッチ研磨工具に代えて、特開2006−315088号公報(特許文献2)は、円盤状基台の一方の表面に、直径5〜20mm、高さ1〜10mmの円板状ダイヤモンド焼結体ペレットの複数を隣接するペレット間の距離を少なくとも3mm以上離して同心円上に等間隔に複数設けたディスク状研削砥石であって、前記円板状ダイヤモンド焼結体ペレットは、平均粒径1〜6μm、JIS粒度2,500〜8,000番のダイヤモンド粒子を樹脂バインダーで結合し、ペレット状に成型したものを焼結して得たダイヤモンド焼結体ペレットで形成されているPCDペレット研削砥石を用い、これをスピンドル軸にPCDペレット層が下面を向くように取り付け、研削装置のワークテーブル上に載置された超硬合金製ワークの表面に研削剤を供給しつつ、前記スピンドル軸回りに回転するPCDペレット研削砥石のPCDペレットをワーク表面に押圧し、PCDペレットの一方向への送りをかけながらワークを切り込むことにより超硬合金ワーク表面を研削加工する方法を提案する。   Moreover, it replaces with the said pitch grinding | polishing tool, and Unexamined-Japanese-Patent No. 2006-315088 (patent document 2) is a disk-shaped diamond baking of 5-20 mm in diameter and 1-10 mm in height on one surface of a disk shaped base. A disk-shaped grinding wheel provided with a plurality of concatenated pellets spaced apart by at least 3 mm at equal intervals on a concentric circle, wherein the disk-like diamond sintered pellet has an average particle size of 1 PCD pellet grinding wheel formed of diamond sintered pellets obtained by sintering diamond particles having a diameter of -6 μm and JIS particle size of 2,500 to 8,000 bonded with resin binder and molded into pellets This is attached to the spindle shaft so that the PCD pellet layer faces the bottom surface, and the surface of the cemented carbide workpiece placed on the work table of the grinding machine While supplying the abrasive, press the PCD pellet of the PCD pellet grinding wheel rotating around the spindle axis against the workpiece surface, and cut the workpiece while feeding the PCD pellet in one direction to make the cemented carbide alloy workpiece surface We propose a grinding method.

本願特許出願人は、特開2006−102867号公報(特許文献3)にて図3に示すフレーム(機枠)6上に左右方向に往復移動可能に設けられたワークテーブル4を案内するスライド本体とガイド本体よりなる油静圧直動案内装置、前記ワークテーブル4に直交して設けられた前後方向に往復移動可能なサドル7を案内する油静圧直動案内装置、数値制御装置8、前記サドル7上に起立して固定されたコラム9、該コラムに砥石車3を軸承する砥石軸を備える砥石ヘッド10を固定した滑走体を上下方向に昇降させる油静圧直動案内装置、および、砥石車回転駆動機構を備える精密平面研削装置100を提案した。
The applicant of the present patent application discloses a slide main body for guiding a work table 4 provided in Japanese Patent Application Laid-Open No. 2006-102867 (Patent Document 3) on a frame (machine frame) 6 shown in FIG. And a hydrostatic linear motion guide device comprising a guide body, an hydrostatic linear motion guide device for guiding a saddle 7 reciprocally movable in the front-rear direction provided orthogonal to the work table 4, the numerical control device 8, A column 9 fixed upright on a saddle 7; a hydrostatic pressure linear motion guide device that moves up and down a sliding body to which a grinding wheel head 10 having a grinding wheel shaft 10 bearing a grinding wheel shaft 3 is fixed; The precision surface grinding apparatus 100 provided with the grinding wheel rotation drive mechanism was proposed.

上記特許文献3に記載の超精密平面研削装置100を用いて左右長さ4250mm、前後幅800mm寸法のワークを平面研削加工したワークの前後方向の真直度は0.3μm、左右方向の真直度は1.3μmと小さいもので、長尺状ワークピースの精密研削加工に適する超精密平面研削装置と言える。   The straightness in the front-rear direction of a workpiece obtained by surface grinding a workpiece having a lateral length of 4250 mm and a front-rear width of 800 mm using the ultraprecision surface grinding apparatus 100 described in Patent Document 3 is 0.3 μm, and the straightness in the left-right direction is It can be said to be an ultra-precision surface grinding device that is as small as 1.3 μm and is suitable for precision grinding of long workpieces.

上記特許文献1に記載のピッチ研磨装置、特許文献2に記載の平面研磨装置および特許文献3に記載の平面記載装置は、長尺状ワークピースの左右方向の長さが5000mm程度のものなら反りのない鏡面を有する研削(研磨)加工されたワークピースを与えるが、長さが7000〜12000mmと長尺のワークピースでは、ワークに反りが生じ、左右の長手方向の真直度が1.3〜2.5μmと前後方向の真直度0.1〜0.3μmと比較して大きい値を示す原因は、工具直径が250〜360mm径、または砥石車の直径が200〜360mm径、砥石車幅が25〜60mm幅では、工具とワークピースが接する加工点に供給される研削液の量では、研削作用点から遠く離れているワークピース部分の表面がワークテーブルの左右往復反転移動する間に乾燥してしまうことが原因で機械加工中のワークピースの表面温度が一定していないことに起因すると推量した。   The pitch polishing apparatus described in Patent Document 1, the planar polishing apparatus described in Patent Document 2, and the planar description apparatus described in Patent Document 3 are warped if the length of the long workpiece is about 5000 mm. A workpiece that is ground (polished) with a mirror surface without a gap is provided. However, in a long workpiece having a length of 7000 to 12000 mm, the workpiece is warped and the straightness in the left and right longitudinal directions is 1.3 to The reason why 2.5 μm and the straightness in the front-rear direction are larger than 0.1 to 0.3 μm is that the tool diameter is 250 to 360 mm, or the grinding wheel diameter is 200 to 360 mm, and the grinding wheel width is When the width is 25 to 60 mm, the surface of the workpiece part far away from the grinding action point is the left and right reciprocal reaction of the work table when the amount of the grinding fluid supplied to the processing point where the tool and the workpiece come into contact with each other. It was inferred that the surface temperature of the workpiece being machined was not constant due to drying during rolling.

本願特許出願人は、特願2011−030387号明細書(特許文献4)にて図1に示すワークおよびテーブルを冷却する冷却水噴出ノズルを、超精密平面研削盤“UPG”(商品名)(株式会社岡本工作機械製作所のカタログ「超精密平面研削盤“UPG Series”」、2007年4月印刷)に付属させ、
a)機枠上に左右方向に設けられた案内レール上を左右方向に往復移動できるように設けられたワークテーブル、
b)噴出口を多数設けたクーラント液供給管1対を前記ワークテーブルの前後の機枠に取り付けたワーク表面クーラント液供給機構、
c)コラムに上下昇降可能に取り付けた工具軸に軸承された砥石車、
d)前記砥石車の近傍に設けられ、砥石車とワークとが接する加工点に研削液を供給する研削液供給ノズル、
を備える平面研削装置を用い、
前記ワークテーブル上にワークを固定し、ワークテーブルを左右方向に往復反転移動させ
前記一対のワーク表面クーラント液供給機構よりクーラント液を前記ワーク表面に供給してワーク表面全域にクーラント液膜を形成させるとともに、前記研削液供給ノズルより前記研削工具に向けて研削液を供給し、
150〜380m/分の周速度で回転する前記砥石車を下降させて前記左右方向に6〜10m/分の速度で往復反転移動するワークテーブル上に固定されたワーク表面に当接させてワーク表面の研削加工を開始し、
前記ワークと砥石車の相対的な動きにより砥石車でワーク表面を研削加工する、長尺状ワークピースの研削方法を提案した。
The patent applicant of the present application uses an ultra-precise surface grinder “UPG” (trade name) (see Japanese Patent Application No. 2011-030387 (Patent Document 4)) for a cooling water jet nozzle for cooling the workpiece and table shown in FIG. Attached to Okamoto Machine Tool Co., Ltd. catalog “UPG Series”, printed in April 2007)
a) a work table provided so as to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame;
b) Workpiece surface coolant supply mechanism in which a pair of coolant supply pipes provided with a plurality of jet nozzles are attached to the machine frame before and after the worktable;
c) A grinding wheel supported by a tool shaft attached to the column so as to be movable up and down,
d) a grinding fluid supply nozzle that is provided in the vicinity of the grinding wheel and supplies a grinding fluid to a processing point where the grinding wheel and the workpiece come into contact;
Using a surface grinding machine comprising
A work is fixed on the work table, and the work table is reciprocally reversed in the left-right direction. The coolant liquid is supplied from the pair of work surface coolant supply mechanisms to the work surface to form a coolant liquid film over the entire work surface. Along with, supplying the grinding fluid from the grinding fluid supply nozzle toward the grinding tool,
The grinding wheel rotating at a peripheral speed of 150 to 380 m / min is lowered and brought into contact with a workpiece surface fixed on a work table that is reciprocally reversed at a speed of 6 to 10 m / min in the left-right direction. Started grinding,
A long workpiece grinding method was proposed in which the workpiece surface is ground by a grinding wheel by the relative movement of the workpiece and the grinding wheel.

特開2006−7373号公報JP 2006-7373 A 特開2006−315088号公報JP 2006-315088 A 特開2006−102867号公報JP 2006-102867 A 特願2011−030387号明細書Japanese Patent Application No. 2011-030387

岡本工作機械製作所のカタログ「超精密平面研削盤“UPG Series”」、2007年4月頒布Catalog of Okamoto Machine Tool Works "Ultra-precision surface grinder" UPG Series "", April 2007

上記特許文献4記載の平面研削方法は、研削加工中において、常時、ワークテーブル表面全域にクーラント液膜が形成され、ワークテーブルの温度を一定に保つことができるので、反りの小さい、ワークの前後方向の真直度が0.3μm、ワークの左右方向の真直度が0.6μmの研削加工ワークを得ることができた。   In the surface grinding method described in Patent Document 4, a coolant liquid film is always formed on the entire surface of the work table during grinding, and the temperature of the work table can be kept constant. A ground workpiece with a straightness of 0.3 μm in the direction and a straightness of 0.6 μm in the horizontal direction of the workpiece could be obtained.

本願発明者は、真直度の値が0.1μm前後とさらに小さい加工ワークを得るには、最終研削ステージにおいて、砥番が2,000〜3,000番と砥粒径が小さいダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を20〜40m/分程度に小さくすれば可能であると想到した。   The inventor of the present application provides a diamond grinding wheel having a grinding number of 2,000 to 3,000 and a small abrasive grain size in the final grinding stage in order to obtain a workpiece having a straightness value of about 0.1 μm and smaller. It was thought that this could be achieved by reducing the peripheral speed of the diamond grinding wheel to about 20 to 40 m / min.

本発明の請求項1は、
a).機枠上に左右方向に設けられた案内レール上を左右方向に往復移動できるように設けられたワークテーブル、
b).前記ワークテーブルの左右移動幅の長さより長い長さのクーラント液供給管一対に噴出口を多数設けたクーラント液供給管一対を前記ワークテーブルの前後の機枠に取り付けたワーク表面クーラント液供給機構、
c).コラムに上下昇降可能に取り付けた砥石軸に軸承されたダイヤモンド砥石車、
d).前記ダイヤモンド砥石車の近傍に設けられ、ダイヤモンド砥石車とワークとが接する加工点に研削液を供給する研削液供給ノズル、
を備える研削装置を用い、
前記ワークテーブル上の電磁チャック上面にワークを固定し、ワークテーブルを左右方向に往復反転移動させ
前記一対のワーク表面クーラント液供給機構の多数の噴出口よりクーラント液を前記ワークおよび電磁チャック上面および側面に供給して前記電磁チャック上表面全域に亘ってクーラント液膜を形成させるとともに、前記研削液供給ノズルより前記ダイヤモンド砥石車に向けて研削液を供給し、
回転する前記ダイヤモンド砥石車を下降させて前記左右方向に往復反転移動するワークテーブル上に固定されたワーク表面に当接させてワーク表面の研削加工を開始し、前記ワークとダイヤモンド砥石車の相対的な動きによりダイヤモンド砥石車でワーク表面を研削加工する長尺状ワークピースの研削方法において、
長尺状ワークピースの研削ステージを取り代量1.5〜15μmの粗研削ステージと取り代量0.05〜1.0μmの仕上げ研削ステージとに分け、粗研削ステージでは砥番800〜1,500番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を150〜380m/分として平面研削加工を行い、仕上げ研削ステージでは砥番2,000〜3,000番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を20〜40m/分として平面仕上げ研削加工を行うことを特徴とする、長尺状ワークピースの研削方法を提供するものである。
Claim 1 of the present invention provides
a). A work table provided to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame;
b). A workpiece surface coolant liquid supply mechanism in which a pair of coolant liquid supply pipes provided with a number of jets in a pair of coolant liquid supply pipes having a length longer than the length of the lateral movement width of the work table is attached to a machine frame before and after the work table;
c). Diamond grinding wheel supported by a grinding wheel shaft that can be moved up and down on the column,
d). A grinding fluid supply nozzle that is provided in the vicinity of the diamond grinding wheel and supplies a grinding fluid to a processing point where the diamond grinding wheel and the workpiece come into contact with each other.
Using a grinding device comprising
The work is fixed to the upper surface of the electromagnetic chuck on the work table, and the work table is reciprocally reversed in the left-right direction. The coolant is supplied from the plurality of jets of the pair of work surface coolant liquid supply mechanisms to the upper surface and the side of the work and the electromagnetic chuck. A coolant liquid film is formed over the entire surface of the electromagnetic chuck and supplied to the surface, and the grinding liquid is supplied from the grinding liquid supply nozzle toward the diamond grinding wheel,
The rotating diamond grinding wheel is lowered and brought into contact with the workpiece surface fixed on the work table that is reciprocally reversed in the left-right direction to start grinding the workpiece surface. In the method of grinding a long workpiece, the surface of the workpiece is ground with a diamond grinding wheel by a simple movement.
The long workpiece grinding stage is divided into a rough grinding stage with a machining allowance of 1.5 to 15 μm and a finish grinding stage with a machining allowance of 0.05 to 1.0 μm. Surface grinding is performed using a diamond grinding wheel of No. 500 and a peripheral speed of the diamond grinding wheel of 150 to 380 m / min, and diamond grinding wheels of grinding numbers 2,000 to 3,000 are used on the finish grinding stage. The present invention provides a method for grinding a long workpiece characterized in that the surface finish grinding is performed at a peripheral speed of a grinding wheel of 20 to 40 m / min.

研削加工中において、常時、ワークテーブル表面全域にクーラント液膜が形成され、ワークテーブルの温度を一定に保つことができるので、反りの小さい、真直度のバラツキが小さい研削加工ワークを製作することができる。また、仕上げ研削ステージでの砥石車の回転周速度を粗研削ステージの砥石車の周速度150〜380m/分の約1/10〜1/15程度の低速で行うのでRxが0.01μm前後、Ryが0.09〜0.12μmの鏡面を有する加工ワークを得ることができた。   During the grinding process, a coolant liquid film is always formed on the entire worktable surface, and the worktable temperature can be kept constant, so it is possible to produce a grinding work piece with less warpage and less variation in straightness. it can. Further, since the rotational peripheral speed of the grinding wheel at the finish grinding stage is performed at a low speed of about 1/10 to 1/15 of the peripheral speed of the grinding wheel at the rough grinding stage, about Rx is about 0.01 μm, A processed workpiece having a mirror surface with Ry of 0.09 to 0.12 μm could be obtained.

図1はワーク表面全域にクーラント液膜を形成させている状態を示す斜視図である。FIG. 1 is a perspective view showing a state in which a coolant liquid film is formed over the entire work surface. 図2はピッチ研磨装置の正面図である。FIG. 2 is a front view of the pitch polishing apparatus. 図3は超精密平面研削装置の斜視図である。FIG. 3 is a perspective view of an ultra-precision surface grinding apparatus.

本発明を実施する研削装置は、研削装置が噴出口を多数設けたクーラント液供給管1対20a,20bを前記ワークテーブルの前後の機枠に取り付けたワーク表面クーラント液供給機構20を備える点を除いては、前記特許文献1、特許文献2、特許文献3記載および既知のコラム式、サドル式、門型の平面研削装置100が使用できる。   The grinding apparatus for carrying out the present invention is characterized in that the grinding apparatus includes a workpiece surface coolant liquid supply mechanism 20 in which a pair of coolant liquid supply pipes 20a and 20b provided with a plurality of jet nozzles are attached to the machine frame before and after the work table. Except for this, the above-described Patent Document 1, Patent Document 2, and Patent Document 3 and the known column-type, saddle-type, and portal-type surface grinding apparatuses 100 can be used.

砥石車3としては、粗研削ステージでは砥番800〜1,500番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を150〜380m/分として平面研削加工を行う。仕上げ研削ステージでは砥番2,000〜3,000番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を20〜40m/分として平面仕上げ研削加工を行う。   As the grinding wheel 3, a diamond grinding wheel having a grinding number of 800 to 1,500 is used in the rough grinding stage, and surface grinding is performed at a peripheral speed of the diamond grinding wheel of 150 to 380 m / min. In the finish grinding stage, a diamond grinding wheel having a grinding number of 2,000 to 3,000 is used, and the surface grinding is performed with the peripheral speed of the diamond grinding wheel being 20 to 40 m / min.

図1において、ワーク表面クーラント液供給機構20は、孔径2〜5mmの噴出口20dを30cm間隔に多数設けた口径8〜15mmのクーラント液供給管一対20a,20bを前記ワークテーブル4の前後の機枠2に取り付けており、クーラント液供給管20a,20bの長さは、ワークテーブル4の左右移動幅より10〜20cm若干長い長さとなっている。前記クーラント液供給管一対20a,20bの先端は分岐管20cに結合され、この分岐管にクーラント液タンクからポンプでクーラント液が供給され、噴出口20dより噴流20eがワークwおよび電磁チャック13上面および側面に供給される。この噴出口20dのクーラント液供給管上での穿孔位置は、噴出口より10〜250リットル/分の割合で噴流されるクーラント液がワークテーブル4上の電磁チャック13表面に届くように設けられ、供給されたクーラント液がワークテーブル4の左右移動により電磁チャック13上表面全域に亘って液膜を形成するとともに、ワークテーブル4上にも垂下、もしくはワークテーブル4にもクーラント液の噴流20eがかかって電磁チャック13を冷却する。更に、ワークテーブル4をも冷却する。   In FIG. 1, a workpiece surface coolant liquid supply mechanism 20 includes a pair of coolant liquid supply pipes 20a and 20b each having a diameter of 8 to 15 mm provided with a plurality of jet holes 20d having a hole diameter of 2 to 5 mm at intervals of 30 cm. The coolant liquid supply pipes 20 a and 20 b are attached to the frame 2, and the length of the coolant liquid supply pipes 20 a and 20 b is slightly longer by 10 to 20 cm than the lateral movement width of the work table 4. The ends of the pair of coolant liquid supply pipes 20a and 20b are coupled to a branch pipe 20c. Coolant liquid is supplied to the branch pipe from a coolant liquid tank by a pump, and a jet 20e is supplied from an outlet 20d to the upper surface of the workpiece w and the electromagnetic chuck 13. Supplied to the side. The drilling position on the coolant supply pipe of the jet outlet 20d is provided so that the coolant liquid jetted from the jet outlet at a rate of 10 to 250 liters / minute reaches the surface of the electromagnetic chuck 13 on the work table 4. The supplied coolant liquid forms a liquid film over the entire surface of the upper surface of the electromagnetic chuck 13 by moving the work table 4 left and right, and also droops on the work table 4 or a jet 20e of the coolant is applied to the work table 4. Then, the electromagnetic chuck 13 is cooled. Furthermore, the work table 4 is also cooled.

ダイヤモンド砥石車3の近傍には、ダイヤモンド砥石車3とワークwとが接する加工点に研削液を供給する研削液供給ノズル11が設けられ、研削液(クーラント液)が2〜30リットル/分の割合で供給される。
In the vicinity of the diamond grinding wheel 3, there is provided a grinding fluid supply nozzle 11 for supplying a grinding fluid to a processing point where the diamond grinding wheel 3 and the workpiece w are in contact, and the grinding fluid (coolant fluid) is 2 to 30 liters / minute. Supplied in proportion.

クーラント液、研削液はそれぞれ別のクーラント液タンクに貯蔵され、それらの保管温度は、コラム9やワークテーブル4、電磁チャックを冷却するクーラント液と略同一温度に保たてられる。   The coolant liquid and the grinding liquid are stored in separate coolant liquid tanks, and their storage temperatures are kept at substantially the same temperature as the coolant liquid for cooling the column 9, the work table 4, and the electromagnetic chuck.

実施例1
コラム型超精密平面研削盤“UPG12000”(商品名)のワークテーブル4の前後の機枠6に、孔径4mmの噴出口を30cm間隔に多数設けた口径12mm、長さ12050mmのクーラント液供給管一対20a,20bを取り付け、これらクーラント液供給管の一方の端を分岐管に連結し、分岐管の先をクーラント液タンクに臨ませ、ポンプによりクーラント液を分岐管に供給できる構造とした。
Example 1
A pair of coolant liquid supply pipes having a diameter of 12 mm and a length of 12050 mm, in which a plurality of jet holes with a hole diameter of 4 mm are provided at intervals of 30 cm on the machine frame 6 before and after the work table 4 of a column type ultra-precision surface grinder “UPG12000” (trade name). 20a and 20b are attached, one end of these coolant liquid supply pipes is connected to the branch pipe, the tip of the branch pipe faces the coolant liquid tank, and the coolant liquid can be supplied to the branch pipe by the pump.

研削砥石3として、砥石径300mm、砥石幅50mmの砥番1,000の粗研削ダイヤモンド砥石車または砥番2,000の仕上げ研削ダイヤモンド砥石車を用い、前後幅150mm、左右長さ2500mm、高さ40mm寸法のワークwをワークテーブル4上の電磁チャック13を介して固定した。   As the grinding wheel 3, a rough grinding diamond grinding wheel having a grinding wheel diameter of 300 mm and a grinding wheel width of 50 mm and a finishing grinding diamond grinding wheel having a grinding number of 2,000 is used. The front and rear width is 150 mm, the left and right length is 2500 mm, and the height is high. A work w having a size of 40 mm was fixed via an electromagnetic chuck 13 on the work table 4.

前記ワークテーブル4を9m/分の速度で左右方向に往復反転移動させ、前記一対のワーク表面クーラント液供給機構20よりクーラント液を1つの噴出孔より40リットル/分の割合で前記磁気チャック上に固定されるワーク表面上に供給してワーク表面全域にクーラント液膜を形成させるとともに、前記研削液供給ノズル11より前記砥番1,000の砥石車3に向けて10リットル/分量の研削液を供給した。   The work table 4 is reciprocally moved back and forth in the left-right direction at a speed of 9 m / min, and the coolant liquid from the pair of work surface coolant supply mechanisms 20 is transferred onto the magnetic chuck at a rate of 40 liters / min from one ejection hole. A coolant liquid film is formed on the surface of the workpiece to be fixed to form a coolant liquid film over the entire surface of the work, and a grinding liquid of 10 liters / minute is supplied from the grinding liquid supply nozzle 11 toward the grinding wheel 3 with the grinding number 1,000. Supplied.

370m/分の周速度(v)で回転する前記砥石車3を0.5μmの切り込み量で下降させて左右方向に9m/分テーブル速度で往復反転移動、前後送り速度10mm/分で前後移動するワークテーブル4上の磁気チャックに固定された前記ワーク表面に砥石車3を当接させてワーク表面の研削加工を開始した。   The grinding wheel 3 rotating at a peripheral speed (v) of 370 m / min is lowered by a cutting amount of 0.5 μm, reciprocally reversed at a table speed of 9 m / min in the left-right direction, and moved back and forth at a longitudinal feed speed of 10 mm / min. Grinding of the workpiece surface was started by bringing the grinding wheel 3 into contact with the workpiece surface fixed to the magnetic chuck on the workpiece table 4.

前記ワークwと砥石車3の相対的な動き(前後、左右、上下)により砥石車3でワーク表面を粗研削加工し、15.0μm総取り代量削り取り、ワークの前後方向の真直度が0.3μm、ワークの左右方向の真直度が0.6μmの粗研削加工ワークを得た。   The surface of the workpiece is roughly ground by the grinding wheel 3 by the relative movement of the workpiece w and the grinding wheel 3 (front and rear, left and right, up and down), the total amount of 15.0 μm is removed, and the straightness of the workpiece in the longitudinal direction is zero. A rough-grinded workpiece with a thickness of 3 μm and a straightness in the left-right direction of the workpiece of 0.6 μm was obtained.

ついで、砥石車を砥番2,000の仕上げ研削ダイヤモンド砥石車に取り替え、上記粗研削加工ワークの研削加工条件を、砥石車の切り込み量0.1μm、総取り代量0.5μm、仕上げ研削ダイヤモンド砥石車の周速度(v)34m/分、ワークテーブル4の左右方向移動テーブル速度6m/分、ワークテーブル4の前後送り速度0.4mm/分と変更する他は同様にして仕上げ研削加工を行い、Rxが0.098〜0.10μm、Ryが0.12〜0.16μmの鏡面を呈する仕上げ研削加工ワークを得た。   Next, the grinding wheel is replaced with a finish grinding diamond grinding wheel with a grinding number of 2,000, and the grinding conditions of the rough grinding work are as follows: grinding wheel cutting depth 0.1 μm, total machining allowance 0.5 μm, finish grinding diamond Finish grinding is performed in the same manner except that the peripheral speed (v) of the grinding wheel is 34 m / min, the horizontal moving table speed of the work table 4 is 6 m / min, and the longitudinal feed speed of the work table 4 is 0.4 mm / min. , Rx was 0.098 to 0.10 μm, and Ry was 0.12 to 0.16 μm.

実施例2
コラム型超精密平面研削盤“UPG12000”(商品名)のワークテーブル4の前後の機枠6に、孔径4mmの噴出口を30cm間隔に多数設けた口径12mm、長さ12050mmのクーラント液供給管一対20a,20bを取り付け、これらクーラント液供給管の一方の端を分岐管に連結し、分岐管の先をクーラント液タンクに臨ませ、ポンプによりクーラント液を分岐管に供給できる構造とした。
Example 2
A pair of coolant liquid supply pipes having a diameter of 12 mm and a length of 12050 mm, in which a plurality of jet holes with a hole diameter of 4 mm are provided at intervals of 30 cm on the machine frame 6 before and after the work table 4 of a column type ultra-precision surface grinder “UPG12000” (trade name). 20a and 20b are attached, one end of these coolant liquid supply pipes is connected to the branch pipe, the tip of the branch pipe faces the coolant liquid tank, and the coolant liquid can be supplied to the branch pipe by the pump.

研削砥石3として、砥石径300mm、砥石幅50mmの砥番1,000の粗研削ダイヤモンド砥石車、砥番1,500の中仕上げ研削ダイヤモンド砥石車、または、砥番3,000の仕上げ研削ダイヤモンド砥石車を用い、前後幅150mm、左右長さ2500mm、高さ40mm寸法のワークwをワークテーブル4上の電磁チャック13を介して固定した。   As the grinding wheel 3, a rough grinding diamond grinding wheel having a grinding wheel diameter of 300 mm and a grinding wheel width of 50 mm with a grinding number of 1,000, a medium finish grinding diamond grinding wheel with a grinding number of 1,500, or a finishing grinding diamond grinding wheel with a grinding number of 3,000. Using a vehicle, a workpiece w having dimensions of 150 mm in the front and rear width, 2500 mm in the left and right length, and 40 mm in height was fixed via the electromagnetic chuck 13 on the work table 4.

前記ワークテーブル4を9m/分の速度で左右方向に往復反転移動させ、前記一対のワーク表面クーラント液供給機構20よりクーラント液を1つの噴出孔より40リットル/分の割合で前記磁気チャック上に固定されたワーク表面上に供給してワーク表面全域にクーラント液膜を形成させるとともに、前記研削液供給ノズル11より前記砥番1,000の砥石車3に向けて10リットル/分量の研削液を供給した。   The work table 4 is reciprocally moved back and forth in the left-right direction at a speed of 9 m / min, and the coolant liquid from the pair of work surface coolant supply mechanisms 20 is transferred onto the magnetic chuck at a rate of 40 liters / min from one ejection hole. A coolant liquid film is formed on the entire surface of the workpiece by supplying it onto the fixed workpiece surface, and 10 liters / minute of grinding fluid is applied from the grinding fluid supply nozzle 11 toward the grinding wheel 3 of the grinding number 1,000. Supplied.

370m/分の周速度(v)で回転する前記砥石車3を1.0μmの切り込み量で下降させて左右方向に9m/分テーブル速度で往復反転移動、前後送り速度10mm/分で前後移動するワークテーブル4上の磁気チャックに固定された前記ワーク表面に砥石車3を当接させてワーク表面の研削加工を開始した。   The grinding wheel 3 rotating at a peripheral speed (v) of 370 m / min is lowered by a cutting amount of 1.0 μm, reciprocally reversed at a table speed of 9 m / min in the left-right direction, and moved back and forth at a forward / backward feed speed of 10 mm / min. Grinding of the workpiece surface was started by bringing the grinding wheel 3 into contact with the workpiece surface fixed to the magnetic chuck on the workpiece table 4.

前記ワークwと砥石車3の相対的な動き(前後、左右、上下)により砥石車3でワーク表面を粗研削加工し、12.0μm総取り代量削り取り、ワークの前後方向の真直度が0.36μm、ワークの左右方向の真直度が0.68μmの粗研削加工ワークを得た。   The surface of the workpiece is roughly ground by the grinding wheel 3 by the relative movement of the workpiece w and the grinding wheel 3 (front and rear, left and right, up and down), and the total amount of 12.0 μm is removed, and the straightness of the workpiece in the front and rear direction is zero. A rough-grinding work piece having a thickness of .36 μm and a straightness in the left-right direction of the work of 0.68 μm was obtained.

ついで、砥石車を砥番1,500の中仕上げ研削ダイヤモンド砥石車に取り替え、上記粗研削加工ワークの研削加工条件を、砥石車の切り込み量0.2μm、総取り代量2.0μm、中仕上げ研削ダイヤモンド砥石車の周速度(v)80m/分、ワークテーブル4の左右方向移動テーブル速度6m/分、ワークテーブル4の前後送り速度0.4mm/分と変更する外は同様にして中仕上げ研削加工を行い、Rxが0.010〜0.012μm、Ryが0.14〜0.18μmの鏡面を呈する中仕上げ研削加工ワークを得た。   Next, the grinding wheel is replaced with a medium finish grinding diamond grinding wheel with a grinding number of 1,500, and the grinding conditions of the rough grinding workpiece are as follows: grinding wheel cutting depth 0.2 μm, total machining allowance 2.0 μm, medium finishing Grinding diamond grinding wheel circumferential speed (v) 80m / min, left and right moving table speed of work table 4 6m / min, forward / backward feed speed of work table 4 0.4mm / min. Processing was performed to obtain a semi-finished grinding workpiece having a mirror surface with Rx of 0.010 to 0.012 μm and Ry of 0.14 to 0.18 μm.

続いて、砥石車を砥番3,000の仕上げ研削ダイヤモンド砥石車に取り替え、上記中仕上げ研削加工ワークの研削加工条件を、砥石車の切り込み量0.1μm、総取り代量0.5μm、仕上げ研削ダイヤモンド砥石車の周速度(v)34m/分、ワークテーブル4の左右方向移動テーブル速度6m/分、ワークテーブル4の前後送り速度0.4mm/分と変更する外は同様にして仕上げ研削加工を行い、Rxが0.009〜0.010μm、Ryが0.09〜0.12μmの鏡面を呈する仕上げ研削加工ワークを得た。   Subsequently, the grinding wheel is replaced with a finish grinding diamond grinding wheel with a grinding number of 3,000, and the grinding conditions of the above-mentioned intermediate finish grinding work are as follows: grinding wheel cutting depth 0.1 μm, total machining allowance amount 0.5 μm, finishing Grinding diamond grinding wheel peripheral speed (v) 34m / min, horizontal movement table speed of work table 4 6m / min, forward / backward feed speed of work table 4 0.4mm / min. A finish-grinding work piece having a mirror surface with Rx of 0.009 to 0.010 μm and Ry of 0.09 to 0.12 μm was obtained.

本発明の長尺状ワークピースの研削方法は、反りが小さく、鏡面研磨されたT−ダイを製造できる。   The long workpiece grinding method of the present invention can produce a mirror-polished T-die with low warpage.

100 平面研削装置
w ワーク
3 砥石車
4 ワークテーブル
5 作業ステージ
6 機枠
7 サドル
9 コラム
10 研削ヘッド
11 研削液供給ノズル
13 磁気チャック
20a,20b クーラント液供給管
DESCRIPTION OF SYMBOLS 100 Surface grinding apparatus w Work 3 Grinding wheel 4 Work table 5 Work stage 6 Machine frame 7 Saddle 9 Column 10 Grinding head 11 Grinding liquid supply nozzle 13 Magnetic chuck 20a, 20b Coolant liquid supply pipe

Claims (1)

a).機枠上に左右方向に設けられた案内レール上を左右方向に往復移動できるように設けられたワークテーブル、
b).前記ワークテーブルの左右移動幅の長さより長い長さのクーラント液供給管一対に噴出口を多数設けたクーラント液供給管一対を前記ワークテーブルの前後の機枠に取り付けたワーク表面クーラント液供給機構、
c).コラムに上下昇降可能に取り付けた砥石軸に軸承されたダイヤモンド砥石車、
d).前記ダイヤモンド砥石車の近傍に設けられ、ダイヤモンド砥石車とワークとが接する加工点に研削液を供給する研削液供給ノズル、
を備える研削装置を用い、
前記ワークテーブル上の電磁チャック上面にワークを固定し、ワークテーブルを左右方向に往復反転移動させ
前記一対のワーク表面クーラント液供給機構の多数の噴出口よりクーラント液を前記ワークおよび電磁チャック上面および側面に供給して前記電磁チャック上表面全域に亘ってクーラント液膜を形成させるとともに、前記研削液供給ノズルより前記ダイヤモンド砥石車に向けて研削液を供給し、
回転する前記ダイヤモンド砥石車を下降させて前記左右方向に往復反転移動するワークテーブル上に固定されたワーク表面に当接させてワーク表面の研削加工を開始し、前記ワークとダイヤモンド砥石車の相対的な動きによりダイヤモンド砥石車でワーク表面を研削加工する長尺状ワークピースの研削方法において、
長尺状ワークピースの研削ステージを取り代量1.5〜15μmの粗研削ステージと取り代量0.05〜1.0μmの仕上げ研削ステージとに分け、粗研削ステージでは砥番800〜1,500番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を150〜380m/分として平面研削加工を行い、仕上げ研削ステージでは砥番2,000〜3,000番のダイヤモンド砥石車を用い、ダイヤモンド砥石車の周速度を20〜40m/分として平面仕上げ研削加工を行うことを特徴とする、長尺状ワークピースの研削方法。
a). A work table provided to be able to reciprocate in the left-right direction on a guide rail provided in the left-right direction on the machine frame;
b). A workpiece surface coolant liquid supply mechanism in which a pair of coolant liquid supply pipes provided with a number of jets in a pair of coolant liquid supply pipes having a length longer than the length of the lateral movement width of the work table is attached to a machine frame before and after the work table;
c). Diamond grinding wheel supported by a grinding wheel shaft that can be moved up and down on the column,
d). A grinding fluid supply nozzle that is provided in the vicinity of the diamond grinding wheel and supplies a grinding fluid to a processing point where the diamond grinding wheel and the workpiece come into contact with each other.
Using a grinding device comprising
The work is fixed to the upper surface of the electromagnetic chuck on the work table, and the work table is reciprocally reversed in the left-right direction. The coolant is supplied from the plurality of jets of the pair of work surface coolant liquid supply mechanisms to the upper surface and the side of the work and the electromagnetic chuck. A coolant liquid film is formed over the entire surface of the electromagnetic chuck and supplied to the surface, and the grinding liquid is supplied from the grinding liquid supply nozzle toward the diamond grinding wheel,
The rotating diamond grinding wheel is lowered and brought into contact with the workpiece surface fixed on the work table that is reciprocally reversed in the left-right direction to start grinding the workpiece surface. In the method of grinding a long workpiece, the surface of the workpiece is ground with a diamond grinding wheel by a simple movement.
The long workpiece grinding stage is divided into a rough grinding stage with a machining allowance of 1.5 to 15 μm and a finish grinding stage with a machining allowance of 0.05 to 1.0 μm. Surface grinding is performed using a diamond grinding wheel of No. 500 and a peripheral speed of the diamond grinding wheel of 150 to 380 m / min, and diamond grinding wheels of grinding numbers 2,000 to 3,000 are used on the finish grinding stage. A grinding method for a long workpiece, wherein surface grinding is performed at a peripheral speed of a grinding wheel of 20 to 40 m / min.
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