JP5723200B2 - Liquid thermosetting resin curing device - Google Patents

Description

  The present invention relates to a curing device that heats and cures a liquid thermosetting resin for sealing a light emitting element mounted on a lead frame in a heating furnace.

  In the molding process in manufacturing an LED (Light Emitting Diode) which is a light emitting element, the LED chip 21 mounted on the lead frame 20 as shown in FIG. 6A is liquid thermoset as shown in FIG. 6B. The sealing is performed with the resin 22, and the sealing is performed by heating and curing the liquid thermosetting resin 22 for molding the LED chip 21 in the curing furnace 30 shown in FIG. Is called.

  Here, as shown in FIG. 6B, the phosphor 23 is contained in the liquid thermosetting resin 22 for molding the LED chip 21, but the phosphor 23 is not cured when the liquid thermosetting resin 22 is cured. When the deviation occurs, the brightness of the LED as a product varies, and the LED cannot satisfy the product specification.

  By the way, there are two types of curing devices for curing the liquid thermosetting resin for molding the LED chip, one of the batch furnace type shown in FIG. 7 and the one of the continuous furnace type shown in FIG. 8 (see, for example, Patent Document 1). ).

  The batch furnace type curing apparatus 101 shown in FIG. 7 is liquid by heating a plurality of LED chips 21 sealed with a liquid thermosetting resin 22 on a plurality of stages of shelves for a long time (for example, about 4 hours). The thermosetting resin 22 is cured. According to the batch-type curing apparatus 101, the curing posture of the liquid thermosetting resin 22 is kept horizontal and does not change as shown in FIG. 6C. The phosphor 23 contained in the liquid thermosetting resin 22 is not biased.

  However, the work of curing the thermosetting resin using the batch furnace type curing apparatus 101 requires manpower, so that there is a problem that work efficiency is poor and labor saving cannot be achieved.

  On the other hand, the continuous furnace type curing apparatus 201 shown in FIG. 8 attaches the lead frame 20 on which the plurality of LED chips 21 are mounted to the endless chain 204 wound around the upper and lower sprockets 202 and 203, By rotating the chain 204, the liquid thermosetting resin 22 (see FIG. 6) that seals each LED chip 21 is heated and cured. According to this, the LED chip 21 is continuously formed without requiring manual labor. Therefore, it is possible to improve work efficiency and save labor.

JP-A-10-256284

  However, in the continuous furnace type curing device 201 shown in FIG. 8, the curing posture of the liquid thermosetting resin 22 changes depending on the position of the LED chip 21, and therefore the phosphor contained in the liquid thermosetting resin 22. There is a problem that the product specification is not satisfied because the deviation as shown in FIG. 6D occurs in FIG. 23 and the brightness of the LED as a product varies.

  The present invention has been made in view of the above-described problems, and the objective process is to keep the curing posture of the liquid thermosetting resin always horizontal while improving work efficiency, reducing man-hours, or saving labor. An object of the present invention is to provide a curing device for a liquid thermosetting resin that can be used.

In order to achieve the above object, the invention described in claim 1 is a curing device that heats and cures a liquid thermosetting resin sealing a light emitting element mounted on a lead frame in a heating furnace ,
A drum rotatably accommodated in the heating furnace, a plurality of carriers supported swingably on the drum and mounting the lead frame, a heater for heating the heating furnace, and a fan,
The drum has a rotating plate arranged parallel to each other, and a horizontal drum rotating shaft inserted and fixed to the rotating plate,
The carrier has a housing portion for housing the lead frame, a weight provided at a lower portion of the housing portion, and a horizontally extending carrier shaft provided at an upper end portion of the carrier,
The carrier shaft is swingably supported on the rotating plate via a bearing on the rotating plate,
By rotating the drum about the drum rotation shaft, the light emitting device housed in the carrier together with the lead frame is rotated in the heating furnace while maintaining a horizontal state, and the light emitting device is sealed. The thermosetting resin is cured by heating.

  A second aspect of the invention is characterized in that, in the first aspect of the invention, a plurality of the carriers are supported concentrically on the drum.

  The invention described in claim 3 is the invention described in claim 1 or 2, characterized in that the thermosetting resin contains a phosphor.

  According to the present invention, even when the drum rotates in the heating furnace, the carrier whose upper end is supported by the drum so as to be swingable by the shaft acts on the weight provided in the lower portion thereof vertically downward. If the lead frame is accommodated horizontally in the carrier, the light emitting element mounted on the lead frame and the liquid thermosetting resin that seals the light frame are always kept horizontal. Rotate in the state. Therefore, the curing posture of the liquid thermosetting resin does not change, and the posture is always kept in a horizontal state. For example, a phosphor is contained like a liquid thermosetting resin used for sealing an LED chip. In this case, the problem that the phosphors are not biased and the brightness of the LEDs varies and the product specifications cannot be satisfied is solved.

  Moreover, since the curing apparatus according to the present invention employs a continuous furnace system, it is possible to improve work efficiency and save labor.

It is a front view of the hardening apparatus which concerns on this invention. It is a side view of the hardening apparatus which concerns on this invention. It is a perspective view which shows typically the hardening apparatus principal part which concerns on this invention. It is a perspective view of the carrier of the curing device according to the present invention. It is operation | movement explanatory drawing of the hardening apparatus which concerns on this invention. (A)-(d) is a figure which shows the mold process of an LED chip. It is a fragmentary perspective view of the conventional hardening apparatus which employ | adopts a batch furnace system. It is a front view of the conventional hardening apparatus which employ | adopts a continuous furnace system.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a front view of a curing device according to the present invention, FIG. 2 is a side view of the curing device, FIG. 3 is a perspective view schematically showing main parts of the curing device, and FIG. 4 is a perspective view of a carrier of the curing device. FIG. 5 is an operation explanatory view of the curing device.

  The curing device 1 according to the present embodiment is a device used in a molding process in the manufacture of LEDs (light emitting diodes), and continuously applies a liquid thermosetting resin 22 (see FIG. 6) that seals the LED chip 21. As shown in FIGS. 1 and 2, a drum 3 is rotatably accommodated in a rectangular box-shaped sealed heating furnace 2.

  A heater 4 as a heating means and a fan 5 as a blowing means are installed below the heating furnace 2.

  The drum 3 is constituted by two discs 6 arranged in parallel to each other, and a horizontal rotating shaft 7 is inserted and fixed at the center thereof. As shown in FIG. 2, the rotary shaft 7 penetrates the heating furnace 2, and both axial ends projecting out of the heating furnace 2 are rotatably supported by the bearing unit 8. One end of the rotating shaft 7 in the axial direction (the right end in FIG. 2) is connected to an output shaft (motor shaft) 10 a of the electric motor 10 installed horizontally via a coupling 9.

  An electric motor 11 is installed vertically below the heating furnace 2, and an upper end of an output shaft (motor shaft) 11 a extending vertically above the electric motor 11 is connected to a vertical rotating shaft 13 by a coupling 12. The fan 5 is connected to the upper end of the rotating shaft 13. An air guide plate 14 for guiding the hot air heated by the heater 4 and introduced into the heating furnace 2 by the fan 5 to the drum 3 is disposed at the bottom of the heating furnace 2.

Thus, the two discs 6 of the drum 3 are provided with a plurality of cylindrical carriers 15 with their upper ends supported in a swingable manner by the shaft 16. In the present embodiment, a plurality of carriers 15 are provided on inner and outer double concentric circles (8 on the inner concentric circle and 12 on the outer concentric circle), and the shaft 15 extends horizontally from the upper end in the longitudinal direction. As shown in FIG. 2, 16 is supported by two discs 6 via a bearing 17 so as to be swingable. As shown in FIG. 4, a weight 18 is disposed in the lower half of each carrier 15, and the lead frame 20 shown in FIG. 6 is accommodated in each carrier 15 while maintaining a horizontal state. Here, as shown in FIG. 6, a plurality of LED chips 21 are mounted on the lead frame 20, and each LED chip 21 is sealed with a liquid thermosetting resin 22. A phosphor 23 is contained.

  Thus, the thermosetting resin 22 that seals the LED chip 21 is heated and cured by the curing device 1 as follows.

  That is, as shown in FIG. 3, the lead frames 20 are sequentially inserted into the carriers 15 supported by the two disks 6 of the drum 3 and accommodated horizontally. In this state, when the electric motors 10 and 11 are driven and the heater 4 is energized, the rotation of the output shaft 10a of the electric motor 10 is transmitted to the drum 3 through the coupling 9 and the rotation shaft 7, The drum 3 rotates at a low speed in the direction indicated by the arrow (clockwise). Further, the fan 5 is rotationally driven by the electric motor 11, and hot air heated by the heater 4 is sent into the heating furnace 2 by the fan 5. At this time, the hot air is guided to the air guide plate 14 and sent to the drum 3.

  As described above, when the drum 3 rotates at a low speed, a plurality of carriers 15 whose upper ends are supported so as to be swingable by the shaft 16 on the two disks 6 of the drum 3 rotate together with the drum 3. The carrier 15 rotates while maintaining a vertical state by gravity acting vertically on the weight 18 provided in the lower half portion thereof, and operates as if it is a cart in a ferris wheel. For this reason, as shown in FIG. 5, the lead frame 20 accommodated horizontally in each carrier 15 is always rotated while keeping the horizontal state, and the LED chip 21 mounted on the lead frame 20 and this are sealed. The liquid thermosetting resin 22 to be stopped always rotates in a state in which it remains horizontal. Therefore, the curing posture of the liquid thermosetting resin 22 does not change, the posture is always kept horizontal, and the phosphor 23 contained in the liquid thermosetting resin 22 is not biased.

Thus, while each carrier 15 rotates once in the heating furnace 2, the thermosetting resin 22 that seals the LED chip 21 is heated and cured in the heating furnace 2 , and the cured thermosetting resin 22 is cured. As shown in FIG. 3, the LED chip 21 sealed by the step is taken out from the curing device 1 together with the lead frame 20. The thermosetting resin 22 for sealing the LED chip 21 taken out in this way does not generate a bias in the phosphor 23 contained therein, so that the brightness of the LED as a product does not vary, and the LED is The product specifications will be fully satisfied.

  Moreover, since the hardening apparatus 1 which concerns on this Embodiment employ | adopts a continuous furnace system, the effect that work efficiency improvement, man-hour reduction, or labor saving can be achieved is also acquired.

  In the above embodiment, the embodiment in which the present invention is applied to the curing device for curing the liquid thermosetting resin that seals the LED chip as the light emitting element has been described. Of course, the present invention can be similarly applied to a curing device for curing a liquid thermosetting resin for sealing any light emitting element other than the chip.

DESCRIPTION OF SYMBOLS 1 Curing device 2 Heating furnace 3 Drum 4 Heater 5 Fan 6 Disc 7 Rotating shaft 8 Bearing unit 9 Coupling 10, 11 Electric motor 12 Coupling 13 Rotating shaft 14 Air guide plate 15 Carrier 16 Shaft 17 Bearing 18 Weight 20 Lead Frame 21 LED chip (light emitting device)
22 Thermosetting resin 23 Phosphor

Claims (3)

A curing device that heats and cures a liquid thermosetting resin sealing a light emitting element mounted on a lead frame in a heating furnace,
A drum rotatably accommodated in the heating furnace, a plurality of carriers supported swingably on the drum and mounting the lead frame, a heater for heating the heating furnace, and a fan,
The drum has a rotating plate arranged parallel to each other, and a horizontal drum rotating shaft inserted and fixed to the rotating plate,
The carrier has a housing portion for housing the lead frame, a weight provided at a lower portion of the housing portion, and a horizontally extending carrier shaft provided at an upper end portion of the carrier,
The carrier shaft is swingably supported on the rotating plate via a bearing on the rotating plate,
By rotating the drum about the drum rotation shaft, the light emitting device housed in the carrier together with the lead frame is rotated in the heating furnace while maintaining a horizontal state, and the light emitting device is sealed. A curing apparatus for a liquid thermosetting resin, wherein the thermosetting resin is cured by heating.
  The liquid thermosetting resin curing device according to claim 1, wherein a plurality of the carriers are supported concentrically on the drum. The liquid thermosetting resin curing device according to claim 1, wherein the thermosetting resin contains a phosphor.

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