JP5720177B2 - Manufacturing method of cover tape - Google Patents

Description

  The present invention relates to a method for manufacturing a cover tape (hereinafter, also simply referred to as “manufacturing method”), and more particularly, to a method for manufacturing an adhesive cover tape used for embossed carrier tape for storing and transporting electronic components and semiconductor components. .

  In recent years, electronic parts and semiconductor parts have been reduced in size. Therefore, as a container for storing and transporting these electronic components and the like, an embossed carrier tape in which a storage portion for storing electronic components and the like is continuously formed is generally used.

  In the embossed carrier tape, contents such as electronic parts are enclosed in the storage unit by covering the opening of the storage unit with the cover tape, and stored by peeling the cover tape from the embossed carrier tape during mounting. Taken out from the department. At this time, in order to automatically take out the contents from the storage portion and perform the mounting process, it is important that the cover tape can be easily peeled from the embossed carrier tape. If the peeling force when peeling the cover tape is too low, the cover tape may come off during transportation other than during mounting, and the contents may fall off. May fall off. Therefore, the cover tape is required to have an appropriate peel strength with the carrier tape and to have a stable peelability.

  Conventionally, a cover tape having a configuration in which a heat seal layer 102 is provided on a substrate 101 as shown in FIG. This heat-seal type cover tape is heat-sealed on the embossed carrier tape 3 through the heat-seal layer 102 so as to cover the storage part 2 in which the contents 1 are stored. Moreover, the adhesive type cover tape which provided the adhesion layer 202 on the base material 201 as shown to the same figure (b) is also known. In this adhesive-type cover tape, a protective layer 203 that covers a portion corresponding to the storage portion is provided so that the contents 1 such as electronic components do not adhere to the adhesive layer.

  Such an adhesive cover tape is disclosed in, for example, Patent Documents 1 and 2. Moreover, about the manufacturing method, for example, Patent Document 3 includes a step of cutting a non-adhesive layer of a laminated film having at least a base layer, an adhesive layer, and a non-adhesive layer, and an adhesive having a step of microslit the laminated film. A manufacturing method for mold cover tapes is disclosed. By preparing a wide original fabric and performing cutting and micro slitting simultaneously, it is possible to collect an arbitrary number of turns from a wide original fabric. It is stated that

Japanese Utility Model Publication No. 61-175174 (the scope of claims for utility model registration) Japanese Utility Model Publication No. 61-202362 (the scope of claims for utility model registration) Japanese Patent No. 3544441 (Claims)

  However, the conventional heat seal type cover tape requires heating when it is bonded to the embossed carrier tape, so it takes time to bond, and the heat seal layer is altered by heating and the peel strength varies. There was a difficulty that sometimes. On the other hand, the pressure-sensitive adhesive cover tape can be joined to the embossed carrier tape only by pressurization, so that it is simple in the process and does not have a problem of variation in peel strength.

  However, in the miniaturized embossed carrier tape, the bonding width with the adhesive cover tape is very narrow, for example, about 0.5 to 2.5 mm. In order to satisfy the adhesive strength between the embossed carrier tape necessary for the function of the cover tape and preferably about 0.1 to 1.3 N at this joining width, the adhesive strength of the adhesive layer is 8 to 13 N / About 25 mm (JIS vs. SUS) is considered necessary. This strength can be said to be higher than, for example, a re-peelable slightly or weakly adhesive tape.

  Here, as in the manufacturing method disclosed in Patent Document 3, using a wide raw material in which a base material, an adhesive layer and a non-adhesive layer are laminated, the non-adhesive layer is half-cut and peeled off. When performing, if the adhesion layer and the non-adhesion layer are bonded in advance, the adhesive force between the adhesion layer and the non-adhesion layer tends to gradually increase immediately after the bonding. Therefore, when such a manufacturing method is used, it takes a long time to peel off the non-adhesive layer in the step of peeling the cut narrow non-adhesive layer to expose the adhesive layer, or the non-adhesive layer is It will be difficult to manufacture, such as breaking. Patent Document 3 describes that the non-adhesive layer may be subjected to a release treatment or other surface treatment for the purpose of peeling the non-adhesive layer from the adhesive layer. In order to remove and remove only both ends of the non-adhesive layer after bonding the adhesive layer and the non-adhesive layer, if a release treatment is performed, the non-adhesive layer is required to have such a narrow width. It will be applied only to the part. Since such processing steps require accuracy, it cannot be said to be a simple method.

  Therefore, the method described in Patent Document 3 is not sufficient, and it is required to establish a technique capable of manufacturing a cover tape having an appropriate peel strength easily and without causing a manufacturing problem. It was.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a cover tape that can solve the above-mentioned problems and can easily manufacture a cover tape having an appropriate peel strength without causing a manufacturing problem. There is.

  As a result of intensive studies, the inventors of the present invention performed a half-cut of the non-adhesive layer and a slit of the laminate at the same time immediately after forming the laminate by laminating the base material, the adhesive layer, and the non-adhesive layer, As a result of performing the above process in one line in one step, it has been found that it is possible to produce a cover tape having an appropriate peel strength without causing a production problem as in the prior art. The present invention has been completed.

That is, the present invention is a method for producing a cover tape comprising at least a substrate, an adhesive layer and a non-adhesive layer in sequence,
A bonding step of bonding the adhesive layer and the non-adhesive layer laminated on the substrate to form a laminate, and the non-adhesive layer leaving the substrate and the adhesive layer in the laminate A half-cut process for cutting the laminate and a slit process for slitting the laminate, and the half-cut process and the slit process are performed immediately and simultaneously with the bonding process, The combination process, the half-cut process, and the slit process are performed in-line in one process.

  In this invention, it is preferable to include the exposure process which peels off the said non-adhesion layer half-cut from the said adhesion layer after the said half cut process, and exposes this adhesion layer. In addition, after the exposing step, the laminate can be wound in a tape shape with the adhesive layer as a winding inner side. Furthermore, in the present invention, the adhesive layer and the release film are sequentially laminated on the base material to prepare an intermediate laminate, and after peeling the release film from the intermediate laminate, the adhesive layer and It is preferable to perform bonding with the non-adhesive layer.

  According to the present invention, the above configuration realizes a method for manufacturing a cover tape that can easily and easily manufacture a cover tape having an appropriate peel strength without causing a manufacturing problem. Became possible.

(A)-(c) is typical sectional drawing which concerns on an example of the manufacturing method of the cover tape of this invention. It is a schematic explanatory drawing which shows an example of the manufacturing equipment which can implement the manufacturing method of the cover tape of this invention. (A)-(e) is typical sectional drawing which shows each manufacturing process corresponding to the manufacturing equipment of FIG. It is typical sectional drawing which shows the state which applied the cover tape which concerns on this invention to the embossed carrier tape. (A), (b) is typical sectional drawing which shows the state which applied the conventional cover tape to the embossed carrier tape.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The present invention relates to an improvement in a method for producing a cover tape, which is sequentially provided with at least a substrate, an adhesive layer, and a non-adhesive layer. 1A to 1C are schematic cross-sectional views according to an example of a method for producing a cover tape of the present invention.

  In this invention, first, (a) the adhesion layer 12 laminated | stacked on the base material 11 and the non-adhesion layer 13 are bonded, the laminated body 20 is formed (bonding process), and immediately after ( b) The non-adhesive layer 13 is cut while leaving the base material 11 and the adhesive layer 12 in the laminate 20 (half-cut process), and at the same time, the laminate 20 is slit (slit process). Thus, by performing a half cut process and a slit process immediately after a bonding process, after that (c) half-cut non-adhesion layer 13A was peeled from adhesion layer 12, and adhesion layer 12 During the exposure (exposure process), the half-cut non-adhesive layer 13A can be easily peeled from the adhesive layer 12, the exposure process can be performed efficiently, and the conventional non-adhesive There is no longer any risk of problems during layer peeling.

  Moreover, in this invention, the said bonding process, a half cut process, and a slit process are performed in one process in-line. The above process is performed inline in one process, and the half cut process and the slit process are performed at the same time, so that the cover tape 10 can be easily manufactured in one process.

  In the cover tape formed by the manufacturing method of the present invention, the width of the non-adhesive layer 13 is set to be narrower than the width of the adhesive layer 12, and the adhesive layer 12 has exposed portions 12a at both ends in the tape width direction. According to the present invention, the exposed width of the exposed portion 12a is 0.5 to 3 mm, and the exposed width of the exposed portion 12a is such that the tolerance of the width x is 0.01 to 0.1 mm. It is possible to easily and accurately form a cover tape having the same, and to secure an appropriate peel strength. Here, the tolerance of the exposed portion width means the absolute value | A−B | mm of the difference between these values when the set value of the exposed portion width is Amm and the actual exposed portion width value is Bmm. .

  In this invention, a half cut process and a slit process can be easily implemented simultaneously by arrange | positioning the cutting blade used for each process in the same position with respect to the running direction of the laminated body 20. FIG. Specifically, for example, as shown in the figure, a combination blade obtained by combining a pair of cutting blades 31 for half-cutting and a cutting blade 32 for slitting can be used.

  More specifically, the production method of the present invention can be implemented in a production facility as shown in FIG. In addition, (a)-(e) in a figure respond | corresponds to (a)-(e) of FIG. In this case, first, the adhesive layer 12 and the release film 14 are sequentially laminated on the base material 11 to produce the intermediate laminate 30 (FIG. 3A). Further, the non-adhesive layer 13 is subjected to an antistatic treatment as desired to form a second intermediate laminate 40 on which an antistatic coat 15 is formed (FIG. 3B).

  Next, the intermediate laminate 30 is unwound from the roll 41, and the release film 14 is peeled off by the roll 42 (FIG. 3C). Thereafter, the adhesive layer 12 of the intermediate laminate 30 and the non-adhesive layer 13 of the second intermediate laminate 40 fed from the roll 43 are bonded together to form the laminate 200. Here, after forming the adhesion layer 12 on the base material 11, the laminated body 200 may be formed by bonding the non-adhesion layer 13 in-line. Next, a half-cut process and a slit process are performed by the assembled blades 31 and 32 (FIG. 3D), the non-adhesive layer 13A half-cut by the roll 44 is peeled off, and the adhesive layer 12 is exposed. The cover tape 100 can be obtained (FIG. 3E). The obtained laminate 200 composed of a plurality of strips of the cover tape 100 can be wound up in a tape shape by the roll 45 with the adhesive layer 12 as the inner side.

  FIG. 4 is a schematic cross-sectional view showing a state in which the cover tape 100 is applied to the embossed carrier tape 3. As shown in the figure, the cover tape 100 of the present invention has a storage portion 2 for storing contents 1 adhered to the surface of an embossed carrier tape 3 formed intermittently in the longitudinal direction to seal the storage portion 2. The embossed carrier tape 3 is joined at the exposed portion 12a of the adhesive layer 12 from which the non-adhesive layer 13 has been peeled off. On the other hand, the portion corresponding to the storage portion 2 faces the non-adhesive layer 13 or the antistatic coating 15 on the surface thereof, so there is no possibility that the contents 1 come into contact with the adhesive layer 12.

  In the present invention, it is only necessary to satisfy the conditions relating to the above-described manufacturing process, whereby the desired effect of the present invention can be obtained, and the shape, material, physical properties, etc. of the cover tape to which the present invention is applied. Is not particularly limited. Specifically, for example, it can be configured as follows.

  In the present invention, a film made of a thermoplastic resin can be suitably used as the base material 11. Specific examples of the thermoplastic resin include polyolefin resins such as polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene copolymers such as ethylene-ethyl acrylate and ethylene-1-butene, Polystyrene resins such as 6-nylon and 12-nylon, polycarbonate resins, polystyrene, styrene-butadiene random copolymers, styrene-butadiene block copolymers, styrene-ethylene-butadiene-styrene copolymer resins, and other styrene copolymers. Examples thereof include polystyrene resins such as polymers. These thermoplastic resins may be used singly or may be mixed as appropriate. It is also preferable to use a biaxially stretched film of a thermoplastic resin, and specific examples include a biaxially stretched film of polyethylene terephthalate (PET), polypropylene, nylon, and polycarbonate resin. Commercial products can be used as these thermoplastic resins and their films. The substrate 11 may be a single layer or a laminate of two or more layers. In the case of two or more layers, the base material 11 may be a laminate of a thermoplastic resin layer formed on a biaxially stretched film. . Moreover, a well-known additive, a filler, etc. can be mix | blended with the base material 11 suitably.

The thickness of the base material 11 is preferably in the range of 12 to 80 μm from the viewpoint of mechanical properties as a cover tape and handling properties. In the present invention, it is also preferable to subject the base material 11 to an antistatic treatment. Thereby, while protecting an electronic component etc. from static electricity, the effect which prevents adhesion of dust to a cover tape is acquired. The antistatic treatment is preferably performed, for example, so that the surface resistivity of the base material 11 is about 1 × 10 ⁴ to 1 × 10 ¹³ Ω / □. In addition, in order to increase the holding power when forming the adhesive layer 12 on the base material 11, the surface of the base material 11 may be subjected to a surface treatment such as a primer treatment.

  The pressure-sensitive adhesive layer 12 can be formed using an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive or the like having adhesiveness at room temperature, such as various fillers and curing agents. An additive may be included. The method for forming the adhesive layer 12 is not particularly limited, and for example, the adhesive may be applied to the base material 11 by a known method such as comma coating, reverse coating, air knife coating, die head coating, Mayer bar coating, direct gravure, offset gravure. It can form by apply | coating on.

  The thickness of the adhesive layer 12 is preferably in the range of 10 to 30 μm. If the thickness of the adhesive layer 12 is too thin, the base material 11 may be damaged when the non-adhesive layer 13 is half-cut, and sufficient adhesive strength to the embossed carrier tape is difficult to obtain. Moreover, even if the adhesive layer 12 is partly cut when the non-adhesive layer 13 is half-cut by keeping the thickness of the adhesive layer 12 in the above range, the function as a cover tape is not impaired. On the other hand, if the thickness of the pressure-sensitive adhesive layer 12 is too thick, the cost performance deteriorates. Moreover, the adhesive strength of the adhesive layer 12 is preferably in the range of 0.1 to 1.3 N, thereby ensuring an appropriate range of peel strength.

  The non-adhesive layer 13 is not particularly limited as long as it does not adhere to the contents 1 stored in the storage unit 2 of the embossed carrier tape 3 and can be peeled off from the adhesive layer 12. Specifically, for example, a biaxially stretched film of a thermoplastic resin such as polyethylene terephthalate, polyethylene naphthalate (PEN), or polypropylene can be suitably used.

The width of the non-adhesive layer 13 is not particularly limited as long as it is narrower than the adhesive layer 12 and wider than the contents 1. The thickness of the non-adhesive layer 13 is preferably in the range of 4 to 40 μm. If the non-adhesive layer 13 is too thick, the non-adhesive layer / adhesive layer surface once adhered may be peeled off due to the rigidity of the non-adhesive layer 13, and if it is too thin, workability is reduced. Further, as described above, the non-adhesive layer 13 is preferably subjected to an antistatic treatment, which can protect the electronic components and the like from static electricity and prevent dust from adhering to the cover tape. . For example, the antistatic treatment is preferably performed so that the surface resistivity of the non-adhesive layer 13 is about 1 × 10 ⁴ to 1 × 10 ¹³ Ω / □.

  In addition, there is no restriction | limiting in particular about the embossed carrier tape to which the cover tape which concerns on this invention is applied, For example, what mixed conductive materials, such as carbon black other than the embossed carrier tape using a styrene type and a polycarbonate-type resin, It can also be applied to a material coated with a conductive paint.

Hereinafter, the present invention will be described in more detail with reference to examples.
<Example 1>
The cover tape was manufactured in-line using the manufacturing equipment shown in FIG. First, an acrylic pressure-sensitive adhesive material was applied at 20 g / m ² on a biaxially stretched polyethylene terephthalate (PET) film having a thickness of 25 μm as the substrate 11 using a comma coater, dried, and then the pressure-sensitive adhesive layer 12. Formed. Thereafter, a release PET film 14 was bonded onto the adhesive layer 12 to prepare an intermediate laminate 30 composed of a base material / adhesive layer / release film (FIG. 3A).

  Next, as the non-adhesive layer 13, a biaxially stretched PET film having a thickness of 16 μm, which was subjected to an antistatic treatment to form an antistatic coat 15, was produced as a second intermediate laminate 40 (FIG. 3B). .

  In the production facility shown in the figure, the intermediate laminate 30 is fed out from the roll 41, and the release film 14 is peeled off by the roll 42 (FIG. 3C), and is fed out from the adhesive layer 12 of the intermediate laminate 30 and the roll 43. Then, the non-adhesive layer 13 of the second intermediate laminate 40 was bonded to form a laminate 200. Next, the non-adhesive layer 13 is half-cut by the assembled blades 31 and 32, and the laminated body 200 is slit simultaneously (FIG. 3D), and the non-adhesive layer 13A half-cut by the roll 44 is continuously peeled off. Then, the pressure-sensitive adhesive layer 12 was exposed (FIG. 3E), and the laminate 200 was wound up in a tape shape by the roll 45. The adhesive type cover tape 100 was produced as described above. Here, the width of the cover tape 100 was 100 mm, the width of the non-adhesive layer 13 was 99 mm, and the set width of the exposed portion of the adhesive layer 12 was 0.5 mm. The same applies to the following examples and comparative examples.

<Example 2>
The cover tape was manufactured in-line using a manufacturing facility (not shown). First, an acrylic adhesive material was applied at 20 g / m ² on a biaxially stretched PET film having a thickness of 25 μm as the substrate 11 using a comma coater, and dried to form an adhesive layer 12. Thereafter, a biaxially stretched PET film having a thickness of 16 μm on which an antistatic coating 15 was formed as a non-adhesive layer 13 was laminated on the adhesive layer 12 to form a laminate 200. Next, the non-adhesive layer 13 is half-cut by the assembled blades 31 and 32, and the laminate 200 is slit simultaneously, and the half-cut non-adhesive layer 13A is continuously removed while peeling to expose the adhesive layer 12. After that, the laminate 200 was wound up in a tape shape. The adhesive type cover tape 100 was produced as described above. The second embodiment is different from the first embodiment in that everything from the formation of the adhesive layer 12 on the substrate 11 to the winding of the laminate 200 is performed in one step.

<Comparative Example 1>
About the laminated body 200 obtained by bonding the intermediate laminated body 30 and the second intermediate laminated body 40 in the same manner as in Example 1, the half-cut and laminated of the non-adhesive layer 13 after 72 hours from the bonding. A cover tape was produced in the same manner as in Example 1 except that the body 200 was slit.

<Comparative Example 2>
For the laminate 200 obtained in the same manner as in Example 2, the cover was obtained in the same manner as in Example 2 except that the non-adhesive layer 13 was half-cut and the laminate 200 was slit after 72 hours had passed from pasting. A tape was prepared.

<Evaluation of cover tape>
(1) Adhesive strength between adhesive layer / non-adhesive layer For Examples 1 and 2, a sample was taken from laminate 200 immediately after bonding, and for Comparative Examples 1 and 2 from laminate 200 after 72 hours, 15 mm The peel strength of the width test piece was measured.
(2) Peelability of non-adhesive layer About the sample similar to the above, sensory evaluation was performed about the peelability at the time of peeling a non-adhesive layer.
These results are shown in the table below.

  As shown in the above table, the peel strength immediately after the bonding of the adhesive layer and the non-adhesive layer in Examples 1 and 2 is significantly lower than the peel strength after 72 hours in Comparative Examples 1 and 2. It has become. For this reason, in Examples 1 and 2 in which the half-cut process and the slit process were performed immediately after bonding of the adhesive layer and the non-adhesive layer, and the non-adhesive layer was peeled to expose the adhesive layer, the non-adhesive layer was peeled off The adhesive type cover tape was able to be produced efficiently.

  On the other hand, in Comparative Examples 1 and 2 in which the half-cut process and the slit process were performed after 72 hours from the pasting of the adhesive layer and the non-adhesive layer, and the adhesive layer was exposed by peeling the non-adhesive layer. As a result, the adhesive strength increased, and it took a long time to peel off the non-adhesive layer. Moreover, since the adhesive strength between the adhesive layer and the non-adhesive layer is high, a phenomenon that the peeled non-adhesive layer is cut irregularly has occurred.

DESCRIPTION OF SYMBOLS 1 Contents 2 Storage part 3 Embossed carrier tape 11 Base material 12 Adhesive layer 13 Non-adhesive layer 13A Half-cut non-adhesive layer 14 Release film 15 Antistatic coating 20,200 Laminate 30 Intermediate laminate 31,31 Assembly blade 40 Second intermediate laminate 41 to 45 Roll 100 Cover tape 101 Base material 102 Heat seal layer 201 Base material 202 Adhesive layer 203 Protective layer

Claims (4)

In a method for producing a cover tape comprising at least a substrate, an adhesive layer and a non-adhesive layer in sequence
A bonding step of bonding the adhesive layer and the non-adhesive layer laminated on the substrate to form a laminate, and the non-adhesive layer leaving the substrate and the adhesive layer in the laminate And a half-cut process for cutting the laminate, and a slit process for slitting the laminate,
The half-cut process and the slit process are performed immediately after the bonding process and simultaneously, and the half-cut process and the slit process allow the width of the non-adhesive layer to be larger than the width of the adhesive layer. Narrow, the adhesive layer has exposed portions at both ends in the tape width direction, the exposed portion width is 0.5 to 3 mm, and the exposed portion width tolerance is 0.01 to 0.1 mm Forming part
Furthermore, the manufacturing method of the cover tape characterized by performing this bonding process, a half cut process, and a slit process in one process in-line. The manufacturing method of the cover tape of Claim 1 including the exposure process which peels the said non-adhesion layer half-cut from the said adhesion layer, and exposes this adhesion layer after the said half cut process. The manufacturing method of the cover tape of Claim 2 which winds up the said laminated body in the shape of a tape by making the said adhesion layer into a roll inner side after the said exposure process. The adhesive layer and the release film are sequentially laminated on the base material to prepare an intermediate laminate, and after peeling the release film from the intermediate laminate, the adhesive layer and the non-adhesive layer are bonded. The manufacturing method of the cover tape as described in any one of Claims 1-3 which match | combine.

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