JP5708002B2 - socket - Google Patents

Description

  The present invention relates to a socket for connecting an electrode of a semiconductor element and an electrode of a circuit board, and more particularly to a socket having a terminal for connecting a spherical electrode of a semiconductor element and an electrode of a circuit board.

  2. Description of the Related Art Conventionally, a socket having a terminal that contacts a spherical electrode formed on a semiconductor element is known. Patent Document 1 discloses a socket having a terminal made of a bamboo shoot spring in which a metal plate is wound in a cylindrical shape.

JP 2003-346963 A

  By the way, since the terminals provided in the conventional socket as described above are spread in a plane, there is a possibility that the reduction of the terminal interval may be hindered.

  The present invention has been made in view of the above circumstances, and a main object thereof is to provide a socket capable of reducing the terminal interval.

  In order to solve the above problems, a socket of the present invention is a socket that is disposed on a circuit board and connects an electrode of a semiconductor element and an electrode of the circuit board, and includes a terminal, a plate-like member, a frame, Is provided. The terminal is formed in a plate shape, and includes a base and an elastic piece that extends from the base and contacts a spherical electrode formed on the lower surface of the semiconductor element and elastically deforms in an in-plane direction. The plate-like member is formed in a plate shape and overlaps with the base to hold the terminal. The frame supports the plate member so that the elastic piece contacts the spherical electrode on the upper surface side and the terminal stands on the circuit board, and the semiconductor element is placed on the upper surface. .

  According to the present invention, since the plate-like terminal and the plate-like member are erected on the circuit board, it is possible to at least reduce the terminal interval in the plate thickness direction.

  In one embodiment of the present invention, a plurality of the plate-like members holding the terminals are stacked, and the elastic pieces of the terminals held by the plate-like members are in contact with one spherical electrode. According to this, it is possible to improve the contact reliability of the terminal with respect to the electrode of the semiconductor element. It is also possible to reduce the inductance of the conductive path.

  In this aspect, a plurality of elastic pieces may sandwich one spherical electrode. According to this, it is possible to further improve the contact reliability of the terminal with respect to the electrode of the semiconductor element.

  In this aspect, the elastic piece may be elastically deformed in a direction away from between the base and the spherical electrode. According to this, the position where the spherical electrode can come into contact with the elastic piece can be made long vertically. In addition, when a plurality of elastic pieces sandwich one spherical electrode, the forces acting on the spherical electrodes from the elastic pieces face each other, so that the contact reliability of the terminals can be further improved.

  In the aspect of the invention, the terminal may include a second elastic piece that extends from the base, contacts the electrode formed on the upper surface of the circuit board, and elastically deforms in an in-plane direction. According to this, it is possible to improve the contact reliability of the terminal with respect to the electrode of a circuit board.

  In one embodiment of the present invention, a groove into which the plate member is inserted is formed in the frame. According to this, the attitude of the terminal is easily maintained.

  In one embodiment of the present invention, the frame includes a lid member that covers a part of the plate-like member. According to this, the omission of the plate-like member is suppressed.

It is a perspective view of the socket which concerns on one Embodiment of this invention. It is a disassembled perspective view of the socket which concerns on the same embodiment. It is a front view of the terminal contained in the socket concerning the embodiment. It is a front view of the terminal holding body contained in the socket concerning the embodiment. It is a perspective view showing the collection of the terminal holding body contained in the socket concerning the embodiment. It is a perspective view showing the modification of a terminal holding body. It is a perspective view showing the modification of a terminal holding body. It is sectional drawing of the socket which concerns on the same embodiment. It is a principal part enlarged view of FIG. It is a principal part enlarged view of FIG. It is a perspective view showing the assembly process of the socket which concerns on the same embodiment. It is a figure following FIG. 7A. It is a figure following FIG. 7B. It is a figure following FIG. 7C. It is a perspective view showing the modification of a socket.

  Embodiments of the socket of the present invention will be described with reference to the drawings.

  1A and 1B are a perspective view and an exploded perspective view of the socket 1. FIG. 2 is a front view of the terminal 3. FIG. 3 is a front view of the terminal holder 4. 4A to 4C are perspective views showing a set of terminal holding bodies 4. FIG. 5 is a cross-sectional view of the socket 1. 6A and 6B are enlarged views of main parts of FIG. 7A to 7D are perspective views showing the assembly process of the socket 1.

  As shown in FIGS. 1A and 1B, the socket 1 is disposed on a socket board 102 as a circuit board and is fixed to the socket board 102 by plate-like fixing members 61, 63, 65. A semiconductor element 101 is mounted on the socket 1 as will be described later, and the socket 1 electrically connects the socket board 102 and the semiconductor element 101.

  The socket 1 mainly includes a plurality of terminals 3 and a frame 2 that supports the terminals 3. Hereinafter, each configuration of the socket 1 will be described in detail.

  As shown in FIG. 2, the terminal 3 is formed in a plate shape as a whole by punching or etching a conductive metal plate. The terminal 3 includes a rectangular base portion 32, a first elastic piece 34 extending from the base portion 32 in a band shape, and a second elastic piece 36.

  The first elastic piece 34 has a shape meandering in an approximately S shape in the in-plane direction, and the tip portion 341 is elastically deformed mainly in the left-right direction in the in-plane direction. The in-plane direction is a direction parallel to the plate surface. The tip 341 extends linearly upward so as to form an acute angle with the vertical direction. The angle formed between the extending direction of the distal end portion 341 and the vertical direction is preferably, for example, 30 degrees or less. The first elastic piece 34 extends upward from one side in the left-right direction of the upper side of the base portion 32, and is bent at two portions 34a and 34b bent toward the other side, and a tip portion 341 extending upward. As a whole, it is formed in a substantially S-shape that faces sideways. The first elastic piece 34 is formed to fit within the left and right widths of the base 32. The first elastic piece 34 formed in this way comes into contact with an electrode 101e formed on the lower surface of the semiconductor element 101 as will be described later.

  The second elastic piece 36 extends from one side in the left-right direction of the upper side of the base portion 32 and extends linearly in a diagonally downward direction toward the other side, and is elastically deformed mainly in the vertical direction in the in-plane direction. To do. The second elastic piece 36 formed in this way comes into contact with an electrode 102e formed on the upper surface of the socket board 102 as will be described later. Note that the present invention is not limited to this mode, and instead of the second elastic piece 36, a protrusion or the like protruding downward from the base 32 may be provided, and this protrusion or the like may be brought into contact with the electrode 102e of the socket board 102.

  The plurality of terminals 3 formed in this way are attached to the center of a plate-like member 41 made of an insulating resin film extending in a strip shape, as shown in FIG. Thereby, the terminal holding body 4 is comprised. The plate-like member 41 is overlapped with the base portion 32 of the terminal 3 and bonded to one surface of the base portion 32. A first elastic piece 34 and a second elastic piece 36 are respectively located on both sides of the plate-like member 41 extending in a strip shape in the short direction. The number of terminals 3 attached to the plate-like member 41 is not particularly limited.

  Further, the plurality of terminal holding bodies 4 are stacked as shown in FIG. 4A and supported by the frame 2 in this state. In the terminal holding body 4 that is overlapped in this embodiment, the base portions 32 of the terminals 3 and the plate-like members 41 are alternately arranged in the plate thickness direction, and the base portions 32 sandwich the plate-like members 41. Further, on one side of the adjacent terminal holding bodies 4, one surface of the terminal 3 is bonded to the plate-shaped member 41, and on the other side, the other surface of the terminal 3 is bonded to the plate-shaped member 41. For this reason, the front-end | tip part 341 of the 1st elastic piece 34 is located mutually apart in the extending | stretching direction of the plate-shaped member 41, ie, the left-right direction of the terminal 3. FIG. In addition, the end part etc. of the plate-shaped member 41 may be pasted up not only simply but overlapping.

  Further, the terminal holding body 4 may be in the form shown in FIG. 4B. In this embodiment, a plurality of terminals 3 are stacked on one surface of the plate-like member 41. The bases 32 of these terminals 3 may be bonded to each other by an insulating or conductive adhesive, solder, or the like. Further, these terminals 3 are overlapped so that the tip portions 341 of the first elastic pieces 34 are separated from each other in the extending direction of the plate-like member 41. When such terminal holding bodies 4 are stacked, a plurality of terminals 3 are arranged in the plate thickness direction between adjacent plate-like members 41.

  Further, the terminal holding body 4 may be in the form shown in FIG. 4C. In this aspect, the terminals 3 are bonded to both surfaces of the plate-like member 41, and the base portions 32 of these terminals 3 sandwich the plate-like member 41. Further, these terminals 3 are bonded to the plate-like member 41 so that the tip portions 341 of the first elastic pieces 34 are separated from each other in the extending direction of the plate-like member 41. When such terminal holding bodies 4 are stacked, a plurality of terminals 3 are arranged in the plate thickness direction between adjacent plate-like members 41.

  As shown in FIG. 1B and FIGS. 7A to 7D, the frame 2 is made of an insulating resin material and is configured in a plate shape as a whole. The frame 2 includes a rectangular plate-shaped foundation member 26 and a lid member 21 disposed on the foundation member 26.

  The base member 26 is formed with a plurality of grooves 26a that are open upward, extend in the left-right direction, and are aligned in the front-rear direction. Each groove 26 a is formed in the same size as the plate-like member 41 of the terminal holding body 4. Inside each groove 26a, a plurality of terminal holding bodies 4 are inserted in an upright posture and overlapped as shown in FIGS. 4A to 4C. Each terminal 3 is erected so that the first elastic piece 34 is located on the upper side and the second elastic piece 36 is located on the lower side. In addition, the number of the terminal holding bodies 4 inserted in each groove | channel 26a is not specifically limited.

  When the terminal holding body 4 is inserted into the groove 26 a, the first elastic piece 34 of the terminal 3 is positioned above the upper surface of the base member 26. The second elastic piece 36 of the terminal 3 is inserted into a through hole 26b formed at a position corresponding to the terminal 3 at the bottom of the groove 26a (see FIGS. 6A and 6B).

  Through holes 26 c used for alignment of the lid member 21 are formed at both ends of the base member 26 in the left-right direction. Moreover, the convex part 26d which protruded toward the downward direction is formed in a pair of corner | angular part which opposes the base member 26. As shown in FIG. These convex portions 26 d are inserted into alignment holes 102 a formed on the upper surface of the socket board 102.

  The lid member 21 has a thin portion 214 provided on both sides in the left-right direction, and a thick portion 212 provided in the center portion in the left-right direction, thicker than the thin portion 214 and convex upward. Yes. The thick part 212 functions as a pedestal part on which the semiconductor element 101 is placed. At the center of the thick portion 212, a rectangular recess 21a having a recessed upper surface is formed. In addition, a plurality of through holes 21b arranged in a lattice shape are formed in the central portion of the recess 21a. The first elastic piece 34 of the terminal 3 supported by the base member 26 is inserted into each through hole 21b. The lid member 21 covers a portion of the plate-like member 41 included in the terminal holding body 4 other than the portion where the terminal 3 is disposed, and prevents the terminal holding body 4 from coming off from the groove 26a.

  Moreover, the thin convex part 21d which protruded toward the downward direction is formed in both the thin parts 214 of the cover member 21 (refer FIG. 5). These convex portions 21 d are inserted into through holes 26 c for alignment formed in the base member 26.

  As shown in FIGS. 1A, 1B and 5, the socket 1 is fixed on the socket board 102 by plate-like fixing members 61, 63 and 65.

  The middle fixing member 63 disposed on the upper surface of the socket board 102 is formed with a rectangular through-hole 63 a that can accommodate the socket 1. Inside the through-hole 63a, a plurality of electrodes 102e arranged on the upper surface of the socket board 102 and arranged in a lattice shape and an alignment hole 102a are located.

  The upper fixing member 61 that is stacked on the middle fixing member 63 is formed with a rectangular through-hole 61a that is formed on the upper surface of the socket 1 and into which the upwardly protruding thick portion 212 can be inserted. . The upper fixing member 61 covers the thin portion 214 adjacent to the thick portion 212 and prevents the socket 1 from coming off.

  A through hole 65 a is also formed in the lower fixing member 65 disposed on the lower surface of the socket board 102. These fixing members 61, 63, 65 are fastened by a fastener such as a bolt (not shown).

  As shown in FIGS. 5, 6 </ b> A, and 6 </ b> B, the semiconductor element 101 is placed on the socket 1 disposed on the socket board 102. A plurality of spherical electrodes 101e projecting downward are formed at the center of the lower surface of the semiconductor element 101, and the terminals 3 of the socket 1 are in contact with the spherical electrodes 101e.

  Specifically, the spherical electrode 101 e is moved downward so as to be inserted into the through hole 21 b formed in the lid member 21 of the frame 2. Inside the through hole 21b, the tip portions 341 of the plurality of first elastic pieces 34 are arranged apart in the left-right direction. From.

  As the spherical electrode 101e moves downward, the tip 341 of each first elastic piece 34 is pushed by the spherical electrode 101e and elastically deformed outward in the left-right direction. Thereby, contact pressure is applied to the spherical electrode 101e so as to be sandwiched by the tip portions 341 of the plurality of first elastic pieces 34.

  In the present embodiment, the distal end portion 341 of the first elastic piece 34 extends so as to form an acute angle with the vertical direction, and is in contact with the side portion of the spherical electrode 101e. According to this, as shown in FIG. 6A and FIG. 6B, while securing a sufficient amount of vertical stroke of the spherical electrode 101 e when mounting the semiconductor element 101, the outer side of the tip portion 341 in the lateral direction is secured. It is possible to suppress the amount of deformation. As a result, it is possible to reduce the terminal spacing in the left-right direction.

  Even if the amount of deformation is suppressed in this way, in this embodiment, the terminal 3 is formed by punching or etching, and the first elastic piece 34 is elastically deformed in the in-plane direction. Therefore, the terminal formed by bending is used. Compared to the above, it is possible to increase the contact pressure with respect to the spherical electrode 101e.

  A tapered portion 216 extending upward is formed at the upper edge of the through hole 21b. Thereby, the space where the front-end | tip part 341 of the 1st elastic piece 34 elastically deforms is ensured. In addition, a stepped portion 218 extending downward is formed on the lower edge of the through hole 21b so as to contact the corner of the base 32 of the terminal 3.

  The second elastic piece 36 of the terminal 3 protrudes downward from a through hole 26 b formed in the base member 26 and comes into contact with a plate-like terminal 102 e formed on the upper surface of the socket board 102. When the socket 1 is disposed on the socket board 102, the second elastic piece 36 is elastically deformed upward to generate a contact pressure with respect to the terminal 102e. Even if the socket board 102 is warped, the second elastic piece 36 follows the warp, and the contact between the second elastic piece 36 and the terminal 102e is ensured.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made by those skilled in the art.

  For example, the base member 26 of the frame 2 may be configured as shown in FIG. A plurality of rail portions 261 extending in the left-right direction and arranged in the front-rear direction are arranged on the upper surface of the base member 26. A plurality of grooves 26a are formed between the rail portions 261, and the plurality of terminal holding bodies 4 are inserted in an upright posture inside each of the grooves 26a. When the terminal holding body 4 is inserted into the groove 26 a, the first elastic piece 34 of the terminal 3 is positioned above the upper surface of the rail portion 261. The second elastic piece 36 of the terminal 3 is inserted into a through hole 26b formed at a position corresponding to the terminal 3 at the bottom of the groove 26a. The above-described lid member 21 is placed on the rail portion 261 and covers a portion of the plate-like member 41 included in the terminal holding body 4 other than the portion where the terminal 3 is disposed.

  1 socket, 2 frame, 21 lid member, 212 thick part (example of pedestal part), 214 thin part, 216 taper part, 218 step part, 21a concave part, 21b through hole, 21d convex part, 26 base member, 26a groove , 26b through hole, 26c through hole, 26d convex part, 261 rail part, 3 terminal, 32 base part, 34 first elastic piece, 341 tip part, 36 second elastic piece, 4 terminal holding body, 41 plate-like member 61 fixing member, 61a through hole, 63 fixing member, 63a through hole, 65 fixing member, 65a through hole, 101 semiconductor element, 101e electrode, 102 socket board (example of circuit board), 102a alignment hole, 102e electrode.

Claims (7)

A socket disposed on a circuit board and connecting an electrode of a semiconductor element and an electrode of the circuit board,
A terminal having a base, and an elastic piece extending from the base and contacting a spherical electrode formed on the lower surface of the semiconductor element and elastically deforming in an in-plane direction;
A plate-like member that is formed in a plate shape and is overlapped with the base to hold the terminal;
A frame on which the semiconductor element is mounted on the upper surface, supporting the plate-like member so that the elastic piece contacts the spherical electrode on the upper surface side and the terminal stands on the circuit board;
Equipped with a,
The elastic piece has two curved portions bent in an in-plane direction so as to reciprocate in the vertical direction, and a tip portion extending upward.
The elastic pieces of the plurality of terminals stacked sandwich one spherical electrode, and the spherical electrode contacts the side edge of the tip of the elastic piece.
Socket characterized by that. A plurality of the plate-like members holding the terminals are stacked, and the elastic pieces of the terminals held by the plate-like members are in contact with one spherical electrode;
The socket according to claim 1. A plurality of elastic pieces sandwich one spherical electrode;
The socket according to claim 2. The elastic piece is elastically deformed in a direction away from between the base and the spherical electrode;
The socket according to any one of claims 1 to 3. The terminal includes a second elastic piece that extends from the base and contacts an electrode formed on the upper surface of the circuit board and elastically deforms in an in-plane direction.
The socket according to any one of claims 1 to 4. A groove into which the plate-like member is inserted is formed in the frame.
The socket according to any one of claims 1 to 5. The frame includes a lid member that covers a part of the plate-like member.
The socket according to any one of claims 1 to 6.

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