JP5693381B2 - Endoscope, endoscope system, and endoscope management system - Google Patents

Description

  The present invention relates to an endoscope whose tip can be bent, and more particularly to an endoscope capable of recording the bending state of the endoscope, an endoscope system having the endoscope, and an endoscope management system.

  2. Description of the Related Art An endoscope that is inserted into a human body and captures an image inside the body, and an endoscope processor that receives and displays an image from the endoscope are known. Such an endoscope is configured so that the tip can be bent, but the endoscope is worn by the bending. Therefore, in order to grasp the worn state of the endoscope, the user counts the number of connections between the endoscope and the endoscope processor, and predicts that the endoscope is worn when the accumulated number exceeds the reference value. A configuration is known in which the maintenance of the endoscope is promoted (Patent Document 1).

  On the other hand, in order to examine the bending state of the endoscope, a configuration in which a plurality of bending sensors and optical fibers are attached in a bendable range is known (Patent Documents 2 and 3).

Japanese Patent No. 3345180 JP 2001-169998 A JP 2002-34903 A

  However, it is considered that the maintenance time of the endoscope should be determined by how many times or for how long the tip has been bent. However, since the bending frequency of the endoscope varies depending on the observation target, simply adding the number of connections between the endoscope and the endoscope processor may warn the user even if maintenance is not yet required. is there.

  Further, in order to reduce the burden on the subject, the distal end diameter of the endoscope should be thin, and it is not practical to increase the distal end diameter of the endoscope by providing a plurality of bending sensors and optical fibers.

  The present invention has been made in view of these problems, and includes an endoscope capable of grasping the bending of the endoscope while keeping the diameter of the endoscope distal end as thin as possible, and the endoscope. An object is to obtain an endoscope system and an endoscope management system.

  An endoscope according to a first invention of the present application is an endoscope having a bending portion configured to be bendable at a distal end, which is housed in the bending portion and outputs a bending signal when the bending portion is bent. And a control unit that records the bending of the bending portion according to the value of the bending signal.

  The control unit preferably accumulates and records the number of times of bending of the bending portion according to the value of the bending signal.

  Preferably, the bending detection unit outputs a bending signal having a different value depending on the bending angle of the bending unit, and the control unit preferably accumulates and records the number of bendings when the value of the bending signal is a predetermined value or more. .

  The control unit preferably accumulates and records the bending period during which the bending portion is bent according to the value of the bending signal.

  The bend detection unit outputs a bend signal having a different value depending on the bend angle of the bend portion, and the control unit is a period from when the value of the bend signal is equal to or greater than a predetermined value to when it is less than the predetermined value. It is preferable to record the bending period obtained by accumulating.

  An endoscope system according to a second invention of the present application includes the endoscope and an endoscope processor connected to the endoscope, and the endoscope processor receives the number of times of bending or a bending period from the endoscope. And having a warning section that gives a warning when the number of bending times or the bending period exceeds a predetermined value.

  An endoscope management system according to a third invention of the present application includes the endoscope, an endoscope processor connected to the endoscope, and an endoscope management device to which the endoscope processor is connected via a network. The endoscope management apparatus includes a warning unit that receives the number of times of bending or a bending period from the endoscope via the endoscope processor and issues a warning when the number of times of bending or the bending period exceeds a predetermined value. It is characterized by that.

  According to the present invention, an endoscope capable of grasping the bending of an endoscope while keeping the diameter of the endoscope distal end as thin as possible, an endoscope system having the endoscope, and endoscope management Get the system.

1 is a block diagram schematically showing an endoscope. FIG. It is the figure which showed the front-end | tip of an endoscope. It is a partial cross section figure of a segment. It is a perspective view of a segment. It is the figure which showed the strain gauge. It is the flowchart which showed the 1st curve frequency integration process. It is the flowchart which showed the 1st curve frequency and period integration process. It is the flowchart which showed processor warning processing. It is the flowchart which showed the system warning process. It is the figure which showed the bending sensor. It is the flowchart which showed the 2nd curve frequency integration process. It is the flowchart which showed the 2nd curve number and period integration process.

  Hereinafter, an endoscope management system 100 according to the present invention will be described with reference to the accompanying drawings. First, the configuration of the endoscope management system 100 will be described with reference to FIG.

  The endoscope management system 100 mainly includes an endoscope 200, an endoscope processor 300, and an endoscope management server 400 that is an endoscope management apparatus.

  The endoscope 200 includes an insertion unit 210 inserted into an observation target, for example, a human body, an operation unit 251 held by a user, and an operation unit 251 and the endoscope processor 300 via a connection pipe 252. It is mainly composed of a connector 253 to be connected.

  Inside the bending portion 211 provided at the distal end of the insertion portion 210, a strain gauge 212 constituting a bending detection portion is attached. The strain gauge 212 is a sensor whose resistance value changes when bent by an external force. The strain gauge 212 will be described later.

  The operation unit 251 includes a plurality of operation dials 255. When the user operates the operation dial 255, the bending unit 211 is bent.

  Inside the connector 253, a microcomputer 254 constituting a control unit is stored, and a conductive cable 213 extending from the strain gauge 212 is connected to the microcomputer 254. The microcomputer 254 measures the resistance of the strain gauge 212 and calculates the number of bending times and the bending period of the bending portion 211. The number of times the bending portion 211 is bent is referred to as the number of bending times, and the period during which the bending portion 211 is bent is referred to as a bending period. Details of the calculation will be described later.

  The endoscope processor 300 includes a processor monitor 301 and is connected to the microcomputer 254 via the connector 253 and acquires information related to the endoscope 200 from the microcomputer 254. Further, a processor warning process to be described later is executed, and a warning is displayed on the processor monitor 301 when the number of bendings exceeds a predetermined value. This predetermined value is a value determined according to the endoscope 200, is determined by a durability test of the endoscope 200, an experience value, and the like, and is recorded in the endoscope 200. By recording the predetermined value in the endoscope 200, the predetermined value can be set for each endoscope 200. Various types of endoscopes 200 can be attached to the endoscope processor 300.

  The endoscope management server 400 constitutes a filing system that manages images captured by the endoscope 200. A plurality of endoscope processors 300 are connected to the filing system via the network 500. The endoscope management server 400 includes a management monitor 401, is connected to the endoscope processor 300 via the network 500, acquires information related to the endoscope 200 from the endoscope processor 300 via the network 500, and records it. To do. In the present embodiment, the information related to the endoscope 200 is the number of times of bending and the bending period. The endoscope management server 400 executes a system warning process, which will be described later, and displays a warning on the management monitor 401 when the number of bendings exceeds a predetermined value. This predetermined value is a value determined according to the endoscope 200, is determined by a durability test of the endoscope 200, an experience value, and the like, and is recorded in the endoscope 200. By recording the predetermined value in the endoscope 200, the predetermined value can be set for each endoscope 200.

  Next, the bending portion 211 will be described with reference to FIGS.

  Referring to FIG. 2, the bending portion 211 includes a joint member 214 formed by connecting segments 215, which are metal annular members, so as to be able to swing with each other, and a mesh shape attached so as to cover the outer peripheral surface of the joint member 214. It is mainly composed of a tube member 216 and an outer skin 217 made of a resin that is provided in close contact with the outer peripheral surface of the mesh tube member 216.

  The bending of the segment 215 and the joint member 214 will be described with reference to FIGS. The segment 215 includes a wire guide 218 that protrudes from the inner peripheral surface thereof. The wire guide 218 has a hole 219 that penetrates the segment 215 in the axial direction, and the operation wire 220 is inserted into the hole 219. One end of the operation wire 220 is fixed inside the distal end of the endoscope 200, and the other end is fixed to the operation dial 255. When the user rotates the operation dial 255, the operation wire 220 is wound around the operation dial 255 or the operation wire 220 is sent out from the operation dial 255. As a result, the length of the operation wire 220 existing in the insertion portion 210 changes, and the insertion portion 210 is bent. The strain gauge 212 is attached to the inner periphery of the segment 215.

  The strain gauge 212 will be described with reference to FIG. The strain gauge 212 includes a foil portion 221 made of a thin film and two gauge leads 222 extending from the foil portion 221. The foil part 221 includes a foil-like base part 223 and a grid part 224 and a terminal part 225 formed on the base part 223. The terminal part 225 extends from the grid part 224 and connects the grid part 224 to the gauge lead 222. The base part 223 has a long side length of about 3.3 millimeters and a width of about 2.4 millimeters, and the grid part 224 has a long side length of about 1.4 millimeters and a width of about 0.2 millimeters. When the grid part 224 is bent by an external force, the resistance value of the strain gauge 212 changes. That is, by measuring the resistance value of the strain gauge 212, it can be determined whether or not the strain gauge 212 is bent. In this embodiment, one end of the strain gauge 212 is connected to GND, a voltage is applied to the other end, and a partial pressure is input to the A / D terminal of the microcomputer 254. The microcomputer 254 detects whether or not the strain gauge 212 is bent by measuring the partial pressure applied to the A / D terminal. The strain gauge 212 is attached to the joint member 214 so that the grid part 224 straddles the plurality of segments 215 (see FIG. 3). Thereby, the strain gauge 212 can detect the bending of the joint member 214. Moreover, since the strain gauge 212 is a very thin foil shape, it can be attached to the inner peripheral surface without increasing the diameter of the segment 215. That is, the strain gauge 212 is attached without affecting the diameter of the bending portion 211, and the bending portion 211 is not thickened.

  Next, a process in which the microcomputer 254 calculates the number of bendings will be described. The microcomputer 254 records in advance the number of times the bending portion 211 has been bent as the number of bending times. When the endoscope 200 is used, the microcomputer 254 measures the partial pressure from the strain gauge 212 via the A / D terminal. When the partial pressure becomes a predetermined value or more, 1 is added to the recorded number of bending times. By repeating this, the number of times of bending is integrated. This predetermined value is a value determined according to the endoscope 200, is determined by a bending test of the endoscope 200, an experience value, and the like, and is recorded in the endoscope 200. By recording the predetermined value in the endoscope 200, the predetermined value can be set for each endoscope 200.

  Next, a process in which the microcomputer 254 calculates the bending period will be described. The microcomputer 254 records in advance a period during which the bending portion 211 has been bent as a bending period. When the endoscope 200 is used, the microcomputer 254 measures the partial pressure from the strain gauge 212 via the A / D terminal. Then, when the partial pressure becomes equal to or higher than the predetermined value, the time starts to be measured, and when the partial pressure becomes lower than the predetermined value, the time measurement is stopped. The time thus obtained is added to the recorded bending period. By repeating this, the bending period is integrated. This predetermined value is a value determined according to the endoscope 200, is determined by a bending test of the endoscope 200, an experience value, and the like, and is recorded in the endoscope 200. By recording the predetermined value in the endoscope 200, the predetermined value can be changed according to the endoscope 200.

  Next, the first bending number integration process will be described with reference to FIG. The first bending number accumulation process is a process executed by the microcomputer 254 when the use of the endoscope 200 is started, and is used to accumulate the bending number of the bending portion 211.

  In the first step S601, “OFF” is substituted for the flag F. As a result, the flag F is initialized. Next, the processing from steps S602 to S608 is repeatedly executed until the power of the endoscope 200 is turned off.

  In step S603, it is determined whether the strain gauge 212 is on, that is, whether the partial pressure from the strain gauge 212 is equal to or greater than a predetermined value, and whether the flag F is “OFF”. If the strain gauge 212 is on and the flag F is “OFF”, the process executes steps S604 and S605; otherwise, the process does not execute steps S604 and S605, and step S606. Proceed to

  In step S604, “ON” is substituted for the flag F. In the next step S605, the microcomputer 254 adds 1 to the number of bendings stored in advance, and stores the obtained value as a new number of bendings. Then, the process proceeds to step S606.

  In step S606, it is determined whether the strain gauge 212 is off, that is, whether the partial pressure from the strain gauge 212 is less than a predetermined value. If the strain gauge 212 is off, the process executes step S607; otherwise, the process proceeds to step S608 without executing step S607.

  In step S607, “OFF” is substituted for the flag F, and then the process proceeds to step S608. Then, the process returns to step S601 again, and steps S602 to S608 are repeatedly executed until the power of the endoscope 200 is turned off.

  The number of bendings of the bending portion 211 can be obtained by the first bending number integrating process.

  Next, the first curve number / period integration process will be described with reference to FIG. The first number-of-bending times / period integration process is a process executed by the microcomputer 254 when the use of the endoscope 200 is started, and is used for integrating the number of times of bending and the bending period of the bending portion 211.

  In the first step S701, “OFF” is substituted for the flag F. As a result, the flag F is initialized. Next, the processing from step S702 to S710 is repeatedly executed until the power of the endoscope 200 is turned off.

  In step S703, it is determined whether the strain gauge 212 is on, that is, whether the partial pressure from the strain gauge 212 is greater than or equal to a predetermined value, and whether the flag F is “OFF”. If the strain gauge 212 is on and the flag F is “OFF”, the process executes steps S704 to S706. Otherwise, the process does not execute steps S704 to S706, and step S707 is performed. Proceed to

  In step S704, “ON” is substituted for the flag F. In the next step S705, the microcomputer 254 adds 1 to the number of bendings stored in advance, and stores the obtained value as a new number of bendings. Then, the process proceeds to step S706.

  In step S706, time is added to the recorded bending period. Thereafter, the process proceeds to step S707.

  In step S707, it is determined whether the strain gauge 212 is off, that is, whether the partial pressure from the strain gauge 212 is less than a predetermined value. If the strain gauge 212 is off, the process executes step S708; otherwise, the process proceeds to step S710 without executing steps S708 to S709.

  In step S708, “ON” is substituted for the flag F. In the next step S709, the addition of the time started in step S706 is terminated. Thereby, a period from the time when the partial pressure from the strain gauge 212 becomes a predetermined value or more to a time when the partial pressure becomes less than the predetermined value, that is, a period from when the bending portion 211 is bent to a predetermined angle or less, Accumulated over the recorded curve period.

  Thereafter, the processing proceeds to step S710. Then, the process returns to step S702 again, and steps S702 to S710 are repeatedly executed until the power of the endoscope 200 is turned off. By repeating this, the bending period is integrated.

  The number of bending times and the bending period of the bending portion 211 can be obtained by the first bending number / period integration process.

  Next, the processor warning process will be described with reference to FIG. The processor warning process is a process periodically executed by the endoscope processor 300, and is executed to notify the user of the maintenance time of the endoscope 200.

  The processes from step S801 to S806 are repeatedly executed until the power of the endoscope processor 300 is turned off.

  In step S802, it is determined whether or not the endoscope 200 is connected to the endoscope processor 300. If the endoscope 200 is connected, the process executes steps S803 to S805, and if not, the process proceeds to step S806 without executing steps S803 to S805.

  In step S803, the number of curves is received from the endoscope 200. In next step S804, it is determined whether or not the number of times of bending is equal to or greater than a predetermined value. If the number of times of bending is equal to or greater than the predetermined value, the process executes step S805. Otherwise, the process proceeds to step S806.

  In the next step S805, the processor monitor 301 is displayed to warn the user that the endoscope 200 has been bent a predetermined number of times, the usage limit has been reached, and the maintenance time has come.

  Thereafter, the processing proceeds to step S806. Then, the process returns to step S801 again, and steps S802 to S805 are repeatedly executed until the power of the endoscope processor 300 is turned off.

  The processor warning process can warn the user that the use limit has come and the maintenance time has come.

  Next, the system warning process will be described with reference to FIG. The system warning process is a process executed when the endoscope management server 400 is activated, and is executed to notify the user of the maintenance time of the endoscope 200.

  The processes from steps S901 to S905 are executed for all the endoscopes 200 registered in the endoscope management server 400. As described above, the endoscope management server 400 records the number of times of bending and the bending period with respect to the plurality of endoscopes 200.

  In step S902, only one bending count stored in the endoscope management server 400 is read.

  In the next step S903, it is determined whether or not the read number of times of bending is a predetermined value or more. If the number of times of bending is equal to or greater than the predetermined value, the process executes step S904; otherwise, the process proceeds to step S905.

  In step S904, the management monitor 401 is displayed to warn the user that the endoscope 200 has been bent a predetermined number of times, the usage limit has been reached, and the maintenance time has come. Then, the process proceeds to step S905.

  Thereafter, the process returns to step S801 again through step S905, and the processes from step S901 to S905 are executed for all the endoscopes 200 registered in the endoscope management server 400.

  The processor warning process can warn the user that the use limit has come and the maintenance time has come.

  According to the present embodiment, the number of times of bending and the bending period of the endoscope 200 can be obtained without increasing the diameter of the bending portion of the endoscope.

  Next, a second embodiment will be described with reference to FIGS. The same components as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. The second embodiment is different from the first embodiment in that a bending sensor 1001 is used instead of the strain gauge 212. The bending sensor 1001 will be described with reference to FIG.

  The bending sensor 1001 is a sensor having a long thin film shape, and the resistance value changes substantially linearly according to the bending angle of the bending sensor 1001. When the resistance value of the bending sensor 1001 is 40 kΩ, the bending angle is 180 degrees, when the resistance value is 30 kΩ, the bending angle is 120 degrees, when the resistance value is 20 kΩ, the bending angle is 60 degrees and the resistance value is 10 kΩ. The bending angle is 0 degree.

  The bending sensor 1001 has two terminals, one end is connected to GND, and the other end is connected to the A / D terminal 1011 of the microcomputer 254 by applying a voltage of + 5V. As the microcomputer 254, for example, PIC12F675 is used. The microcomputer 254 measures the voltage applied to the A / D terminal 1011 and determines the bending angle of the bending sensor 1001 according to the voltage. Then, the number of times of bending and the bending period are integrated for each bending angle. When the bending angle is greater than 60 degrees and less than 120 degrees, the first bending number A and the first bending period a, and when the bending angle is greater than 120 degrees and less than 180 degrees, the second bending number B and the second bending period a. When the bending period b and the bending angle are 180 degrees or more, the third bending number C and the third bending period c are integrated, respectively. When the bending angle is less than 60 degrees, the life of the endoscope 200 is not affected, so the number of bendings is not integrated.

  Next, the second bending number accumulation process will be described with reference to FIG. The second bending number integration process is a process executed by the microcomputer 254 when the use of the endoscope 200 is started, and is used to integrate the bending number of the bending portion 211 for each bending angle. Actually, the microcomputer 254 measures the partial pressure from the bending sensor 1001, but for the following explanation, the bending angle is determined based on the resistance value.

  In the first step S1101, “0” is assigned to the flag Int_flag. As a result, the flag Int_flag is initialized. Next, the processing from step S1102 to S1114 is repeatedly executed until the power of the endoscope 200 is turned off.

  In step S1103, it is determined whether the resistance value of the bending sensor 1001 is 40 kΩ or more and the flag Int_flag is 2. If the resistance value of the bending sensor 1001 is 40 kΩ or more and the flag Int_flag is 2, the process executes steps S1104 and S1105. Otherwise, the process proceeds to step S1106 without executing steps S1104 and S1105.

  In step S1104, “3” is substituted for the flag Int_flag. In the next step S1105, the microcomputer 254 adds 1 to the previously stored third number of bendings C, and stores the obtained value as a new third number of bendings C. Then, the process proceeds to step S1106.

  In step S1106, it is determined whether the resistance value of the bending sensor 1001 is 30 kΩ or more and less than 40 kΩ and the flag Int_flag is 1. If the resistance value of the bending sensor 1001 is not less than 30 kΩ and less than 40 kΩ and the flag Int_flag is 1, the process executes steps S1107 and S1108; otherwise, the process proceeds to step S1109 without executing steps S1107 and S1108. .

  In step S1107, “2” is substituted for the flag Int_flag. In the next step S1108, the microcomputer 254 adds 1 to the second bending number B stored in advance, and stores the obtained value as a new second bending number B. Then, the process proceeds to step S1109.

  In step S1109, it is determined whether the resistance value of the bending sensor 1001 is 20 kΩ or more and less than 30 kΩ, and the flag Int_flag is 0. If the resistance value of the bending sensor 1001 is 20 kΩ or more and less than 30 kΩ and the flag Int_flag is 0, the process executes steps S1110 and S1111. Otherwise, the process proceeds to step S1112 without executing steps S1110 and S1111. .

  In step S1110, “1” is assigned to the flag Int_flag. In the next step S1111, the microcomputer 254 adds 1 to the previously stored first bending number A, and stores the obtained value as a new first bending number A. Then, the process proceeds to step S1112.

  In step S1112, it is determined whether the resistance value of the bending sensor 1001 is 10 kΩ or more and less than 20 kΩ. If the resistance value of the bending sensor 1001 is not less than 10 kΩ and less than 20 kΩ, the process executes step S1113; otherwise, the process proceeds to step S1114 without executing step S1113.

  In step S1113, “0” is substituted for the flag Int_flag. Then, the process proceeds to step S1114.

  The process returns to step S1102 again through step S1114, and steps S1102 to S1114 are repeatedly executed until the power of the endoscope 200 is turned off.

  By the second bending number integration process, the bending number of the bending portion 211 can be obtained for each bending angle.

  Next, the second curve number / period integration process will be described with reference to FIG. The second number-of-bending times / period integration process is a process executed by the microcomputer 254 when the use of the endoscope 200 is started, in order to integrate the number of times of bending and the bending period of the bending portion 211 for each bending angle. Used for. Actually, the microcomputer 254 measures the partial pressure from the bending sensor 1001, but for the following explanation, the bending angle is determined based on the resistance value.

  In the first step S1201, “0” is assigned to the flag Int_flag. As a result, the flag Int_flag is initialized. Next, the processing from step S1202 to S1114 is repeatedly executed until the power of the endoscope 200 is turned off.

  In step S1203, it is determined whether or not the resistance value of the bending sensor 1001 is 40 kΩ or more. If the resistance value of the bending sensor 1001 is 40 kΩ or more, the process executes steps S1204 to S1207, and if not, the process proceeds to step S1208 without executing steps S1204 to S1207.

  In step S1204, time addition is started in the recorded third bending period c. Thereafter, the process proceeds to step S1205.

  In step S1205, it is determined whether the flag Int_flag is 2. If the flag Int_flag is 2, the process executes steps S1206 and S1207; otherwise, the process proceeds to step S1208 without executing steps S1206 and S1207.

  In step S1206, “3” is substituted for the flag Int_flag. In the next step S1207, the microcomputer 254 adds 1 to the previously stored third number of bendings C, and stores the obtained value as a new third number of bendings C. Then, the process proceeds to step S1208.

  In step S1208, it is determined whether or not the resistance value of the bending sensor 1001 is not less than 30 kΩ and less than 40 kΩ. If the resistance value of the bending sensor 1001 is not less than 30 kΩ and less than 40 kΩ, the process executes steps S1209 to S1213; otherwise, the process proceeds to step S1214 without executing steps S1209 to S1213.

  In step S1209, the addition of time to the third bending period c started in step S1204 is terminated.

  In the next step S1210, time addition is started in the recorded second bending period b. Thereafter, the process proceeds to step S1211.

  In step S1211, it is determined whether the flag Int_flag is 1. If the flag Int_flag is 1, the process executes steps S1212 and S1213; otherwise, the process proceeds to step S1214 without executing steps S1212 and S1213.

  In step S1212, "2" is substituted for the flag Int_flag. In the next step S1213, the microcomputer 254 adds 1 to the second bending number B stored in advance, and stores the obtained value as the new second bending number B. Then, the process proceeds to step S1214.

  In step S1214, it is determined whether the resistance value of the bending sensor 1001 is 20 kΩ or more and less than 30 kΩ. If the resistance value of the bending sensor 1001 is not less than 20 kΩ and less than 30 kΩ, the process executes steps S1215 to S1219. Otherwise, the process proceeds to step S1220 without executing steps S1215 to S1219.

  In step S1215, the addition of time to the second bending period b started in step S1210 ends.

  In the next step S1216, time addition is started in the recorded first bending period a. Thereafter, processing proceeds to step S1217.

  In step S1217, it is determined whether the flag Int_flag is zero. If the flag Int_flag is 0, the process executes steps S1218 and S1219; otherwise, the process proceeds to step S1220 without executing steps S1218 and S1219.

  In step S1218, “1” is substituted for the flag Int_flag. In the next step S1219, the microcomputer 254 adds 1 to the first stored number of times A, and stores the obtained value as the new first number of times A. Then, the process proceeds to step S1220.

  In step S1220, it is determined whether or not the resistance value of the bending sensor 1001 is 10 kΩ or more and less than 20 kΩ. If the resistance value of the bending sensor 1001 is not less than 10 kΩ and less than 20 kΩ, the process executes steps S1221 and S1222, and if not, the process proceeds to step S1223 without executing steps S1221 and S1222.

  In step S1221, the addition of time to the first bending period a started in step S1216 ends.

  In the next step S1222, “0” is substituted for the flag Int_flag. Then, the process proceeds to step S1223.

  Thereafter, the process returns to step S1202 again through step S1223, and repeatedly executes steps S1202 to S1223 until the power of the endoscope 200 is turned off. By repeating this, the number of times of bending and the bending period are integrated.

  By the second bending frequency / period integration process, the bending frequency and the bending period of the bending portion 211 can be obtained for each bending angle.

  According to the present embodiment, the same effects as those of the first embodiment can be obtained, and the number of bending times and the bending period of the bending portion 211 can be obtained for each bending angle. The bending portion 211 of the endoscope 200 differs in pain depending on the bending angle and the bending period. The greater the bending angle and the longer the bending period, the more painful the bending portion 211 becomes. Therefore, if the number of times of bending and the bending period are obtained for each bending angle, the maintenance time can be estimated in more detail and the user can be warned.

  Furthermore, the accuracy of maintenance time prediction can be improved by accumulating the relationship between the degree of pain of the bending portion 211, the bending angle, and the bending period using this embodiment.

  The system warning process may be executed when the user presses a button provided in the endoscope management server 400 or when the number of bending times or the bending period is received from the endoscope 200.

  Further, in the system warning process, the processor monitor 301 may display that the endoscope 200 has been bent a predetermined number of times, that the usage limit has been reached, and that the maintenance time has come.

  Instead of the strain gauge 212, a film polymer sensor or the bending sensor 1001 in the second embodiment may be used. The film-like polymer sensor has a property of generating a voltage when it is bent. By measuring the voltage of the film-like polymer sensor, it can be determined whether or not the film-like polymer sensor is bent.

  The size of the strain gauge 212 is not limited to the above-described size, and the attachment position of the strain gauge 212 may be appropriately changed depending on the type of the endoscope 200.

  The relationship between the resistance value and the bending angle in the bending sensor 1001 is not limited to the aforementioned value.

DESCRIPTION OF SYMBOLS 100 Endoscope management system 200 Endoscope 210 Insertion part 211 Bending part 212 Strain gauge 213 Cable 214 Joint member 215 Segment 216 Reticulated pipe member 217 Skin 218 Wire guide 220 Operation wire 221 Foil part 222 Gauge lead 223 Base part 224 Grid part 225 Terminal unit 251 Operation unit 252 Connection pipe 253 Connector 254 Microcomputer 255 Operation dial 300 Endoscope processor 301 Processor monitor 400 Endoscope management server 401 Management monitor 500 Network

Claims (7)

An endoscope including a bending portion configured to be freely bent at a tip,
A bend detector that is housed in the bend and outputs a bend signal for each bend angle when the bend is bent; and
An endoscope comprising: a control unit that records the bending of the bending portion for each bending angle according to the value of the bending signal. The endoscope according to claim 1, wherein the control unit accumulates and records the number of times of bending of the bending portion for each bending angle according to a value of the bending signal. The bending detection unit outputs a bending signal having a different value depending on the bending angle of the bending unit,
The endoscope according to claim 2, wherein the control unit accumulates and records the number of bendings for each bending angle when a value of the bending signal is equal to or greater than a predetermined value. The endoscope according to claim 1, wherein the control unit accumulates and records a bending period in which the bending portion is bent for each bending angle in accordance with a value of the bending signal. The bending detection unit outputs a bending signal having a different value depending on the bending angle of the bending unit,
The said control part records the bending period obtained by integrating | accumulating the period from when the value of the said bending signal became more than predetermined value to when it became less than predetermined value for every said bending angle. The endoscope described. An endoscope according to claim 2 and an endoscope processor connected to the endoscope,
The endoscope processor includes a warning unit that receives the number of bending times or the bending period for each bending angle from the endoscope and issues a warning when the number of bending times or the bending period exceeds a predetermined value. Endoscope system. An endoscope according to claim 2, an endoscope processor connected to the endoscope, and an endoscope management device to which the endoscope processor is connected via a network,
The endoscope management apparatus receives the number of bending times or the bending period for each bending angle from the endoscope via the endoscope processor, and the number of bending times or the bending period exceeds a predetermined value. An endoscope management system having a warning unit that sometimes warns.

Images