JP5664701B2 - Coating, developing device, coating, developing method and storage medium - Google Patents

Description

  The present invention relates to a coating, developing apparatus, coating, developing method, and storage medium that apply a resist to a substrate and perform development.

  In the photoresist process, which is one of the semiconductor manufacturing processes, a resist is applied to the surface of a semiconductor wafer (hereinafter referred to as a wafer), the resist is exposed in a predetermined pattern, and then developed to form a resist pattern. . The coating / developing apparatus for forming the resist pattern is provided with a processing block including a processing module for performing various processes on the wafer.

  As described in Patent Document 1, for example, the processing block includes a unit block for forming a coating film for forming various coating films such as an antireflection film and a resist film and a unit block for developing processing for performing development processing. It is configured by stacking. The wafers are sequentially processed by delivering processing modules provided in each unit block.

  The wafer may be subjected to a hydrophobic treatment in order to improve the adhesion of the coating film subjected to the coating film forming process to the wafer. By the way, the hydrophobic processing module for performing the hydrophobic processing and the unit block for forming the coating film may have to stop the wafer conveyance when a failure occurs or maintenance is performed. However, since the wafers are sequentially transferred to the processing modules as described above, stopping the transfer to the hydrophobic processing module or the unit block for forming the coating film in this way prevents the wafer from being transferred to the entire coating and developing apparatus. There is a problem that the conveyance is stopped and the throughput is lowered.

  Providing multiple modules of the same type may prevent the conveyance from being stopped in this way, but increasing the number of modules may complicate the operation of the conveyance means and may not sufficiently improve the throughput. In addition, it is difficult to create a program for controlling the conveying means. Patent Document 1 discloses a coating and developing apparatus provided with a plurality of modules for hydrophobizing a wafer before loading in a unit block for coating film formation. However, such a problem cannot be solved.

JP2007-115831

  The present invention has been made under such circumstances, and an abnormality occurs in the hydrophobic treatment module or the unit block for forming the coating film, and the operating efficiency of the coating and developing apparatus is reduced when maintenance is performed. An object of the present invention is to provide a technique that can suppress the complexity of the operation of the substrate transfer means.

In the coating and developing apparatus of the present invention, the substrate carried into the carrier block by the carrier is transferred to the processing block, and after the coating film including the resist film is formed in the processing block, the carrier block is defined with respect to the processing block. In the coating and developing apparatus, the substrate after the exposure is conveyed to the exposure apparatus through the interface block located on the opposite side, and returned to the carrier block after being developed through the processing block. ,
a) The processing block includes a liquid processing module that supplies a chemical solution for forming the coating film to the substrate, a heating module that heats the substrate after the chemical solution is applied, and the substrate between the modules. And a unit block transport mechanism that moves on a straight transport path connecting the carrier block and the interface block, and stacks unit blocks for coating on each other so that N (N is an integer of 2 or more) Including laminated laminates,
b) The N-layered coating unit blocks are configured such that the same coating film is formed on each other,
c) The processing block includes a developing unit block provided with a developing module that is stacked on the N-layered coating unit block and supplies a developing solution to the substrate after the exposure to perform development processing.
d ) A lifting / lowering transport block is provided between the carrier block and the processing block, and the lifting / lowering transport block is a first lifting / lowering for delivering a substrate to each of the N-layered application unit blocks. A transport mechanism, a second lifting / lowering transport mechanism for delivering the substrate to the unit block for development, and a delivery module provided in a stacked manner,
Assuming that the arrangement direction of the carrier block, the processing block, and the lifting / lowering transport block is a front-rear direction, the first lifting / lowering transport mechanism, the second lifting / lowering transport mechanism, and a plurality of stacked delivery modules are provided in the left-right direction. The multi-layered delivery modules are provided so as to be sandwiched between the first elevating and conveying mechanism and the second elevating and conveying mechanism.
e ) The first lifting / lowering transport mechanism and the second lifting / lowering mechanism include a lifting base that moves up and down, a rotating base that rotates the lifting base around a vertical axis, a first transport arm, and a second transport. Each with arm,
f ) The first transfer arm and the second transfer arm advance and retract independently from each other with respect to the rotation base,
The first transfer arm supports the back surface of the substrate, and the width of the first transfer arm perpendicular to the advancing and retreating direction is configured to be narrower than the width of the substrate.
The second transfer arm includes a surrounding portion that surrounds a side periphery of the substrate, and a plurality of claw portions that are provided on the inner peripheral edge of the surrounding portion and support the back surface of the substrate,
g ) The delivery module provided in a stacked manner includes a first delivery module comprising a stage having a coolant flow path for cooling the mounted substrate, and a flow path for the coolant. And a second delivery module consisting of a stage not provided ,
The first transfer arm is used for transferring the substrate to the second transfer module ,
The second transfer arm is used for transferring the substrate to the first transfer module .

Specific examples of the coating and developing apparatus are as follows, for example.
(1) The unit block for coating is
A liquid processing module for a lower layer that supplies a chemical solution for forming an antireflection film to a substrate to form an antireflection film on the lower layer side, and a liquid processing that forms a resist film by supplying a resist solution on the antireflection film For pre-stage processing comprising a module, a heating module for heating the substrate, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport the substrate between these modules Unit block of
A liquid processing module for an upper layer that forms a film on the upper layer side by supplying a chemical liquid for film formation on the upper layer side to the substrate on which the resist film is formed and laminated on the unit block for the previous stage processing, and the substrate A unit block for subsequent processing, comprising a heating module for heating, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport a substrate between these modules; Is provided.
(2) The lifting transport block is associated with each of the N-layered application unit blocks, and the hydrophobicity of N groups for subjecting the substrate before forming the coating film to hydrophobic treatment Module,
The first elevating / conveying mechanism is controlled to deliver a substrate from the N group hydrophobizing module to a corresponding application unit block,
When one of the N overlapping application unit blocks is stopped and a group associated with an available application unit block among the N groups is stopped,
The delivery mechanism is controlled to switch the substrate transport destination from the usable group to the usable application unit block that is not associated.
(3) A plurality of notches are provided in the peripheral edge,
The second transfer arm is moved up and down with respect to the cooling stage to deliver the substrate to the cooling stage;
The notch is provided to allow the plurality of claw portions of the second transfer arm to pass when the elevator is moved up and down.
(4) A hydrophobic treatment module for hydrophobizing the substrate before being transported to the coating unit block is provided,
If the side on which the delivery module is provided with respect to the first lifting / lowering transport mechanism is the left side in the left-right direction, the hydrophobic treatment module is provided on the right side of the first lifting / lowering transport mechanism.

In the coating and developing method of the present invention, a substrate carried into a carrier block by a carrier is transferred to a processing block, and after a coating film including a resist film is formed in this processing block, the carrier block is referred to the processing block. In the coating and developing apparatus, the substrate after the exposure is conveyed to the exposure apparatus through the interface block located on the opposite side, and returned to the carrier block after being developed through the processing block. ,
a) The processing block includes a liquid processing module that supplies a chemical solution for forming the coating film to the substrate, a heating module that heats the substrate after the chemical solution is applied, and the substrate between the modules. And a unit block transport mechanism that moves on a straight transport path connecting the carrier block and the interface block, and stacks unit blocks for coating on each other so that N (N is an integer of 2 or more) Including laminated laminates,
b) The N-layered coating unit blocks are configured such that the same coating film is formed on each other,
c) The processing block includes a developing unit block provided with a developing module that is stacked on the N-layered coating unit block and supplies a developing solution to the substrate after the exposure to perform development processing.
d ) A lifting / lowering transport block is provided between the carrier block and the processing block, and the lifting / lowering transport block is a first lifting / lowering for delivering a substrate to each of the N-layered application unit blocks. A transport mechanism, a second lifting / lowering transport mechanism for delivering the substrate to the unit block for development, and a delivery module provided in a stacked manner,
Assuming that the arrangement direction of the carrier block, the processing block, and the lifting / lowering transport block is the front-rear direction, the first lifting / lowering transport mechanism, the second lifting / lowering transport mechanism, and a number of delivery modules are provided in the left-right direction. The delivery module is provided so as to be sandwiched between the first lifting and lowering transport mechanism and the second lifting and lowering transport mechanism,
e ) The first lifting / lowering transport mechanism and the second lifting / lowering mechanism include a lifting base that moves up and down, a rotating base that rotates the lifting base around a vertical axis, a first transport arm, and a second transport. Each with arm,
f ) The first transfer arm and the second transfer arm advance and retract independently from each other with respect to the rotation base,
The first transfer arm supports the back surface of the substrate, and the width of the first transfer arm perpendicular to the advancing and retreating direction is configured to be narrower than the width of the substrate.
The second transfer arm includes a surrounding portion that surrounds a side periphery of the substrate, and a plurality of claw portions that are provided on the inner peripheral edge of the surrounding portion and support the back surface of the substrate,
g ) The delivery module provided in a stacked manner includes a first delivery module comprising a stage having a coolant flow path for cooling the mounted substrate, and a flow path for the coolant. In a coating and developing method using a developing device including a second delivery module composed of a stage not provided ,
Transferring the substrate to the second transfer module using the first transfer arm;
Using the second transfer arm to transfer the substrate to the first transfer module ;
It is characterized by providing .

The storage medium of the present invention is a storage medium storing a computer program used in a coating and developing apparatus,
The computer program is for carrying out the coating and developing methods described above.

  According to the present invention, N groups each including the same number of hydrophobic treatment modules and N overlapping application unit blocks are provided, and the corresponding application unit blocks from the respective groups of hydrophobic treatment modules are provided. Transport the substrate to Since a plurality of substrate transfer paths are provided in this way, even when a group of hydrophobic treatment modules or a unit block for coating becomes unusable, a substrate is transferred using a path including another group or unit block. Can continue. Accordingly, it is possible to suppress a decrease in the operating efficiency of the apparatus. In addition, since the unit block of the transfer destination is set for each group, it is possible to improve the throughput because the operation of the transfer mechanism that transfers the substrate to each unit block can be suppressed. It is also easy to create a program for controlling the operation of the delivery mechanism.

It is a flowchart which shows the outline of the conveyance path | route of the application | coating and developing apparatus of this invention. It is a flowchart which shows the outline of the conveyance path | route of the application | coating and developing apparatus of this invention. It is a flowchart which shows the outline of the conveyance path | route of the application | coating and developing apparatus of this invention. 1 is a plan view of a coating and developing apparatus according to the present invention. It is a perspective view of the coating and developing apparatus. It is a vertical side view of the coating and developing apparatus. It is a vertical side view of the processing block of the coating and developing apparatus. It is a vertical back view of the raising / lowering conveyance block of the said application | coating and developing apparatus. It is a perspective view of the conveyance mechanism provided in the said raising / lowering conveyance block. It is a perspective view of the delivery module provided in the said raising / lowering conveyance block. It is a perspective view of the other delivery module provided in the said raising / lowering conveyance block. It is a perspective view of the other delivery module provided in the said raising / lowering conveyance block. It is a perspective view of the hydrophobic treatment module provided in the said raising / lowering conveyance block. It is a flowchart which shows the outline of the conveyance path | route of the application | coating and developing apparatus of this invention. It is a schematic block diagram of another process block.

(First embodiment)
Before describing the configuration of the coating and developing apparatus 1 according to the present invention in detail, an outline of the configuration of the apparatus 1 and an outline of a transfer path of a wafer W that is a substrate will be described with reference to FIGS. In the figure, S1 is a carrier block on which a carrier C storing a plurality of wafers W is transferred. In the figure, S2 is an elevating and conveying block, and includes a first hydrophobic treatment module group 10A and a second hydrophobic treatment module group 10B. The hydrophobic treatment module group 10A includes four hydrophobic treatment modules ADH1 to ADH4, and the hydrophobic treatment module group 10B includes four hydrophobic treatment modules ADH5 to ADH8. The wafers W are sequentially transferred to the respective hydrophobic processing modules ADH, and the hydrophobic processing is performed on the wafers W in parallel with the hydrophobic processing modules ADH.

  In the drawing, S3 is a processing block, and includes a first unit block B1 and a second unit block B2 for performing an antireflection film forming process and a resist film forming process on the wafer W, respectively. The processing block S3 is provided with a unit block for development processing for developing the wafer W subjected to the exposure processing after the resist film is formed. These unit blocks are stacked on each other.

  FIG. 1 shows the transfer of the wafer W in a normal state where each unit block and each hydrophobic treatment module can be used. The wafers W discharged from the carrier C are distributed to the hydrophobic processing module groups 10A and 10B, and are processed by the hydrophobic processing modules ADH constituting the respective hydrophobic processing module groups. The wafer W processed by the hydrophobizing module ADH of the first hydrophobizing module group 10A is transferred to the first unit block B1 for processing, and the second hydrophobizing module group 10B is hydrophobized. The wafer W processed by the processing module ADH is transferred to the second unit block B2 and processed.

  The wafers W processed in the first unit block B1 and the second unit block B2 are exposed, processed in a unit block for development processing, and returned to the carrier C. As described above, the wafer W is allocated to the path including the first hydrophobic processing module group 10A and the first unit block B1 and the path including the second hydrophobic processing module group 10B and the second unit block B2. The wafers W are processed in parallel with each other through these paths.

FIG. 2 shows the transfer path of the wafer W when the wafer W cannot be processed in the first unit block B1 due to maintenance or a transfer arm failure described later. As described above, when the first unit block B1 becomes unusable, as the case 1, the transport from the first hydrophobic processing module group 10A to the first unit block B1 is stopped, and the first hydrophobic block from the carrier C is stopped. Conveyance to the process module group 10A is also stopped. On the other hand, the carrier C → second hydrophobization processing module group 10B → second unit block B2 → development processing unit block → carrier C (second path) continues to be transferred, and the subsequent wafer W Are transported through this second route and processed. Accordingly, in case 1, the wafer W is transferred as shown by the solid arrow in FIG.

  In addition, for example, the user can select conveyance of case 2 instead of conveyance of case 1. In this case 2, the transfer from the first hydrophobizing module group 10A to the first unit block B1 is stopped as in the case 1, but from the carrier C, the hydrophobizing module group 10A, The wafer W is transferred to 10B. The wafers W processed by the hydrophobic processing module groups 10A and 10B are loaded into the second unit block B2, and thereafter transferred in the same manner as the case 1. Therefore, in the case 2, the wafer W is transferred as shown by solid line arrows and dotted line arrows in FIG.

  On the contrary, when maintenance or processing of a failed wafer W in a transfer arm, which will be described later, becomes impossible in the second unit block B2, the wafer W is transferred along the transfer path of the case 3. In this case 3, the transport from the second hydrophobic treatment module group 10B to the second unit block B2 is stopped, and the transport from the carrier C to the second hydrophobic treatment module group 10B is also stopped. On the other hand, the carrier C → first hydrophobizing module group 10A → first unit block B1 → development processing unit block → carrier C (which is the first path) is continued to be transferred to the subsequent wafer. W is transported along this first path and undergoes processing.

Further, for example, the user can also select conveyance of the case 4 instead of conveyance of the case 3. In this case 4, the transfer from the second hydrophobic treatment module group 10B to the second unit block B2 is stopped as in the case 3, but from the carrier C, the hydrophobic treatment module group 10A, The wafer W is transferred to 10B. The wafers W processed by the hydrophobic processing module groups 10A and 10B are loaded into the first unit block B1, and thereafter transferred in the same manner as the case 3.

  FIG. 3 shows a transfer path of the wafer W when processing cannot be performed in all the hydrophobic processing modules ADH constituting the first hydrophobic processing module group 10A. In this case, the transfer from the carrier C to the first hydrophobizing module group 10A is stopped, and the transfer of the wafer W to the first unit block B1 is also stopped by this stop. On the other hand, the conveyance of the second route is continued.

  On the contrary, when the processing cannot be performed in all the hydrophobic processing modules ADH constituting the second hydrophobic processing module group 10B, the transport from the carrier C to the second hydrophobic processing module group 10B is stopped. By stopping the transfer, the transfer of the wafer W to the second unit block B2 is also stopped. On the other hand, the conveyance of the first route is continued.

  Next, details of the configuration of the coating and developing apparatus 1 will be described. 4 is a plan view of the coating and developing apparatus 1, FIG. 5 is a schematic perspective view thereof, and FIG. 6 is a schematic side view thereof. The coating and developing apparatus 1 is configured by linearly connecting the carrier block S1, the elevating and conveying block S2, the processing block S3, and the interface block S4. An exposure apparatus S5 for performing immersion exposure is further connected to the interface block S4.

  The carrier block S1 will be described. In the figure, 11 is a mounting table for the carrier C, and 12 is an opening / closing part provided on the side wall. In the figure, reference numeral 13 denotes a transfer arm, which transfers the wafer W to and from the lifting / lowering transport block S2 through the opening / closing part 12. In the figure, reference numeral 14 denotes a shelf 14 provided on the mounting table 11, and the carrier C is transferred between the mounting table 11 and the shelf 14 by the carrier transport mechanism 15. The carrier C that is placed on the mounting table 11 and delivers the wafer W waits on the shelf 14 until the wafer W returns. This prevents the carrier C from occupying the mounting table 11 and allows the wafers W of a plurality of carriers C to be successively carried into the coating and developing apparatus 1.

  The lifting / lowering transport block S2 delivers the wafer W between the carrier block S1 and the processing block S3. The lifting and conveying block S2 will be described later, and the configuration of the processing block S3 will be described with reference to the longitudinal side view of FIG. 7. First, the processing block S3 is divided into first unit blocks B1 to B6. Unit blocks B6 are stacked one above the other. Each unit block includes a liquid processing module that performs liquid processing on the wafer W, a heating module that heats the wafer W, a transfer arm A that is a transfer unit for the unit block, a transfer region R1 in which the transfer arm A moves, It has. In each unit block B, the wafer W is transferred independently from each other by the transfer arm A, and the wafer W is processed. In addition, the conveyance arm of each unit block B1-B6 is shown in FIG. 6 as A1-A6.

  Two of these unit blocks B1 to B6 are configured in the same manner, and the first unit block B1 and the second unit block B2 are formed of an antireflection film and a resist film as described above. The forming process is performed. The third unit block B3 and the fourth unit block B4 perform a process for forming a protective film for immersion exposure and a process for cleaning the back surface of the wafer W on the resist film. The fifth unit block B5 and the sixth unit block B6 correspond to the above-described development processing unit blocks.

  In each of the unit blocks B1 to B6, the liquid processing module, the heating module, and the transfer region R1 are arranged in the same layout, and the first unit block B1 shown in FIG. . In the first unit block B1, the transport region R1 is formed in the X direction (the arrangement direction of the blocks S1 to S4) in FIG. The liquid processing unit 20 and the shelf units U1 to U6 are arranged so as to sandwich the transport region R1 from the left and right direction (Y direction in FIG. 1).

  In the liquid processing unit 20, an antireflection film forming module BCT and a resist film forming module COT, which are liquid processing modules, are provided along the transport region R1. The antireflection film forming module BCT includes two cups 21 in which wafers W are transferred, spin chucks 22 that hold the back surfaces of the wafers W in the cups 21 and rotate the wafers W about the vertical axis, The cup 21 is provided with a chemical solution supply nozzle 23 that moves between the two cups 21 and is shared by these cups 21. The chemical liquid supplied to the wafer W from the chemical liquid supply nozzle 23 is applied to the wafer W by spin coating. The resist film forming module COT is configured in the same manner as the antireflection film forming module BCT except that the chemical solution is a resist.

  The transfer arm A1 provided in the transfer region R1 will be described. The transfer arm A1 is configured to be movable back and forth, freely movable up and down, rotatable about the vertical axis, and movable in the length direction of the transfer region R1, and the wafer W between all the modules of the first unit block B1. Can be delivered. In the figure, reference numeral 24 denotes a fork portion that surrounds the outer periphery of the wafer W, and includes a claw portion 25 that supports the back surface of the wafer W.

  The shelf units U <b> 1 to U <b> 6 are arranged along the length direction of the transfer region R <b> 1, and each shelf unit U <b> 1 to U <b> 5 is configured by stacking, for example, two heating modules that perform the heat treatment of the wafer W. The shelf unit U6 is composed of two peripheral edge exposure modules stacked on each other.

  Differences of the other unit block B from the first unit block B1 will be described. The second unit block B2 has the same configuration as the first unit block B1 as described above. The unit blocks B3 to B6 are configured in the same manner as the unit blocks B1 and B2 except that the liquid processing modules constituting the liquid processing unit 20 are different and a heating module is provided instead of the peripheral exposure module. The unit blocks B3 and B4 respectively include a protective film forming module TCT and a back surface cleaning module BST instead of the antireflection film forming module BCT and the resist film forming module COT. The unit blocks B5 and B6 include a developing module DEV instead of the antireflection film forming module BCT and the resist film forming module COT. Further, the shelf unit U6 of the unit blocks B3 to B6 is provided with a heating module instead of the edge exposure module.

  The protective film forming module TCT and the developing module DEV are different from the antireflection film forming module BCT except that the chemical liquid for forming the protective film and the developing solution are supplied to the wafer W instead of the chemical liquid for forming the antireflection film, respectively. It is constituted similarly. The back surface cleaning module BST is configured in the same manner as the antireflection film forming module BCT except that a brush 26 for cleaning the back surface of the wafer W is provided in the cup 21 instead of providing the chemical solution supply nozzle 23. ing.

  Next, the lifting and conveying block S2 will be described with reference to FIG. 8 which is a longitudinal rear view thereof. A shelf unit U7 is provided at the center in the Y direction of the elevating / conveying block S2. The shelf unit U7 moves the wafer W between the carrier block S1 and the processing block S2 and between each unit block in the processing block S2. In order to deliver, a large number of delivery modules on which the wafer W is once mounted are stacked. In the following description, a delivery module having a flow path of cooling water for cooling the wafer W is shown as CPL on the stage on which the wafer W is placed. The flow path is not provided, and the wafer W is moved according to the temperature of the atmosphere. The delivery module that regulates the temperature is shown as TRS. The configuration of each delivery module will be described later.

  Explaining the positional relationship between each delivery module and the unit block B, delivery modules TRS11, CPL11, and CPL12 are provided at the height position of the first unit block B1. Delivery modules TRS12, CPL13, and CPL14 are provided at the height position of the second unit block B2. Delivery modules CPL15 and CPL16, CPL17 and CPL18 are provided at the height positions of the third unit block B3 and the fourth unit block B4, respectively. Delivery modules CPL19 and CPL20, CPL21 and CPL22 are provided at height positions of the fifth unit block B5 and the sixth unit block B6, respectively. In addition, delivery modules TRS13 and TRS14 are provided at a height that can be accessed by the delivery arm 13 of the carrier block S1.

  The shelf unit U7 is provided with buffer modules 31 and 32 and an inspection module 34. The buffer modules 31 and 32 are configured so that a large number of wafers W can be retained. The buffer module 31 has a role of suppressing the stay of the wafer W in the first unit blocks B1 and B2 by paying out the wafer W according to the processing speed of the antireflection film forming module BCT and the resist coating module COT. In addition, the buffer module 32 has a role of adjusting the timing of dispensing the wafer W so that the wafer W can be dispensed to the carrier block S1 in accordance with the timing when the carrier C is returned from the shelf 14 to the mounting table 11. The inspection module 34 performs various inspections on the surface state of the wafer W, such as the presence / absence of particles and the presence / absence of abnormality in the line width of the pattern, on the wafer W after the development processing.

  Further, a first elevating / conveying mechanism 41 and a second elevating / conveying mechanism 42 that deliver wafers W between modules of the shelf unit U7 are provided so as to sandwich the shelf unit U7 from the Y direction. These lifting and lowering transport mechanisms 41 and 42 are configured in the same manner except for the height position where they are provided, and rotate the guide 43, the lifting base 44 that moves up and down along the guide 43, and the lifting base 44 around a vertical axis. The rotary base 45 is provided with a first arm 46 and a second arm 47 that advance and retract independently on the rotary base 45. FIG. 9 is a perspective view of the first arm 46 and the second arm 47, and the first arm 46 is formed in a narrow and flat bifurcated fork shape. The second arm 47 includes a bifurcated fork 48 that surrounds the side periphery of the wafer W, and a claw portion 49 that supports the back surface of the wafer W. The first arm 46 and the second arm 47 have different shapes as described above, corresponding to the difference in the configuration of the delivery module accessed by these arms.

  Here, the configuration of the delivery module CPL11 at the height position of the above-described first unit block B1 will be described with reference to FIG. The delivery module CPL11 includes a plurality of generally circular plates 51 stacked on each other, and a wafer W is placed on each plate 51. In the delivery module CPL11, the transport arm A1 of the first unit block B1 is from the X direction in the figure, and the second arm 47 of the first lift transport mechanism 41 of the lift transport block S2 is from the Y direction in the figure. Access each one.

  A number of notches 52 are provided on the periphery of the plate 51. When the arms A1 and 47 move up and down with respect to the plate 51, the claw portions 25 and 49 of the arms pass through the notches 52. As a result, the wafer W is transferred between the arms A1 and 47 and the plate 51. In this example, each of the delivery modules provided in the delivery modules CPL12 to CPL22, TRS11, TRS12, and the interface block S3 also includes a plate 51 like the delivery module CPL11. Further, the buffer module 31 is configured by laminating a large number of plates 51, and can retain a large number of wafers W.

  The configuration of another delivery module will be described. As shown in FIG. 11, the delivery module TRS 13 includes three support columns 53 extending in the vertical direction and support bars 54 extending horizontally from the support columns 53. A large number of support bars 54 are provided at intervals in the vertical direction, and the front end side thereof is provided with a horizontal plane that supports the peripheral edge of the back surface of the wafer W. As a result, a large number of wafers W can be horizontally supported in the vertical direction. The delivery module TRS13 passes between the columns 53, the delivery arm 13 is accessed from the X direction, and the first arm 46 of the first elevating / conveying mechanism 41 is accessed from the Y direction. The wafer W can be transferred to and from the support bar 54. In this example, a buffer module 32 to be described later is also configured in the same manner as the delivery module TRS13.

  The delivery module TRS14 includes a plate 56 provided with three pins 55 that support the back surface of the wafer W, as shown in FIG. The transfer arm 13 and the first arm 46 of the first elevating / conveying mechanism 41 can transfer the wafer W between the pins 55 by the elevating operation. A plurality of plates 56 are provided and are stacked on each other.

  Returning to the description of the up-and-down conveying block S2 in FIG. A buffer module 32 is provided at a position away from the shelf unit U7 in the Y direction and accessible by the second lifting and lowering transport mechanism 42. The first hydrophobizing module group 10A and the second hydrophobizing module group 10B described above are provided so as to sandwich the first elevating / conveying mechanism 41 together with the shelf unit U7 from the Y direction. The hydrophobizing modules ADH1 to ADH8 constituting the groups 10A and 10B are stacked on each other.

  The hydrophobizing modules ADH1 to ADH8 are configured in the same manner, and ADH1 is representatively described with reference to FIG. 13 which is a longitudinal side view and a plan view thereof. In the figure, reference numeral 61 denotes a processing container, which comprises a container main body 62 and a lid 63 that can be raised and lowered. In the figure, reference numeral 64 denotes a stage on which the wafer W is placed, and is provided on the container main body 62. Although not shown, the stage 64 includes lifting pins for supporting the back surface of the wafer W and delivering the wafer W to and from the first lifting / lowering transport mechanism 41. Further, the stage 64 includes a heater that adjusts the temperature of the wafer W placed thereon.

  In the figure, reference numeral 66 denotes a plurality of purge gas introduction paths provided in the circumferential direction of the container main body 62, and reference numeral 67 denotes a purge gas discharge path provided in a ring shape on the lid 63. In the figure, 68 is a plurality of exhaust ports provided in the circumferential direction inside the purge gas discharge passage 67, and is connected to a vacuum pump 69. In the figure, reference numeral 71 denotes a gas discharge port provided at the center of the lid 63, and a plurality of openings are opened in the circumferential direction so that gas can be discharged toward the periphery of the wafer W. The gas discharge port 71 is connected to a supply source 72 of a hydrophobization gas and a purge gas.

  When the wafer W is hydrophobized, as shown in FIG. 13, the lid 63 is close to the container body 62, exhausted from the exhaust port 68, and purge gas is supplied from the introduction path 66 toward the purge gas discharge path 67. At this time, a part of the purge gas is sucked into the exhaust port 68 and moves inward to form a gas barrier. In this state, the hydrophobization gas is supplied from the gas discharge port 71 and is exhausted from the exhaust port 68 without being blocked by the gas barrier and leaking from the processing container 61. The arrows in FIG. 13 indicate the flow of each gas.

  When the entire surface of the wafer W is exposed to the hydrophobic treatment gas, the film formed on the surface of the wafer W is improved in adhesion to the wafer W. After the hydrophobic treatment, a purge gas is discharged from the gas discharge port 71 instead of the hydrophobic treatment gas, and the hydrophobic treatment gas is removed from the processing vessel 61. In the hydrophobization module ADH, abnormalities occur in the operation of the module, such as abnormalities in various gas flow rates, abnormalities in raising and lowering the lift pins, abnormalities in raising and lowering the lid 63, and abnormal temperatures in the wafer W placed on the stage 64. Then, the hydrophobic processing module ADH transmits a signal to the control unit 100 described later.

  Returning to FIGS. 4 to 6, the interface block S4 will be described. The interface block S4 includes a shelf unit U8 on which a number of delivery modules are stacked. In the shelf unit U8, delivery modules TRS31, TRS32, TRS33, and TRS34 are provided at respective height positions corresponding to the third unit block B3 to the sixth unit block B6. Further, the shelf unit U8 includes a delivery module CPL31 for cooling the wafer W before it is carried into the exposure apparatus S5, a delivery module TRS35 for delivering the wafer W after exposure, and a buffer module for temporarily retaining the wafer W before exposure. 74 and a buffer module 75 for temporarily retaining the wafer W after exposure is provided. Each of the buffer modules 74 and 75 is configured in the same manner as the buffer module 31.

  A plurality of post-exposure cleaning modules PIR are stacked and provided at positions away from the shelf unit U7 in the Y direction. The interface block S4 includes interface arms 81 to 83 that are configured in substantially the same manner as the first lifting / lowering transport mechanism 41 of the lifting / lowering transport block S2. The interface arm 81 carries the wafer W between the modules of the shelf unit U7. The interface arm 82 delivers the wafer W between the modules and between the module and the post-exposure cleaning module PIR. The interface arm 83 is configured to be movable in the Y direction in FIG. 1, and transfers the wafer W between the wafer W loading / unloading portion 84 of the exposure apparatus S5, the transfer module CPL31, and the transfer module TRS35.

  The coating / developing apparatus 1 is provided with a control unit 100 including, for example, a computer. The control unit 100 includes a program, a memory, a data processing unit including a CPU, and the like. The control unit 100 sends control signals to the coating and developing unit 1 from the control unit 100 to transfer the wafer W and to each module. Instructions (each step) are incorporated so as to advance the processing of the wafer W. This program (including programs related to processing parameter input operations and display) is stored in a storage medium such as a computer storage medium such as a flexible disk, a compact disk, a hard disk, an MO (magneto-optical disk), and a memory card and stored in the control unit 100. Installed.

  When the control unit 100 receives a signal indicating that an abnormality has occurred in the operation of the above-described module from each of the hydrophobic processing modules ADH, the control unit 100 includes other hydrophobic processing modules in the hydrophobic processing module group including the module. A control signal is transmitted so as to transfer the wafer W to the ADH. As a result, the hydrophobic processing module ADH that has transmitted the signal becomes unusable, and the wafer W that has been set to be transferred to the hydrophobic processing module ADH becomes another member of the hydrophobic processing module group to which the module belongs. It will be conveyed to the hydrophobization module ADH. When all of the hydrophobic processing modules of one hydrophobic processing module group have become unusable due to such abnormal operation or maintenance, the control unit 100, as described above, The operation of the first lifting / lowering transfer mechanism 41 is controlled so as to transfer the wafer W to another hydrophobic treatment module group.

  In addition, the control unit 100 includes a display unit that displays the inspection result of the inspection module 34 for each wafer W. Furthermore, the control unit 100 performs a process in the first hydrophobic processing module group 10A and the first unit block B1 associated with the hydrophobic processing module group 10A, a second hydrophobic processing module according to a user instruction. The processing in the second unit block B2 associated with the group 10B and the hydrophobic processing module group 10B can be stopped.

(Normal transport)
A normal transfer path of the wafer W in the coating and developing apparatus 1 will be described. As described with reference to FIG. 1, the wafer W passes through the first hydrophobic treatment module group 10A and the first unit block B1, and the second hydrophobic treatment module group 10B and the second unit block. It is distributed to the second route passing through B2. This distribution is performed alternately, for example, in the order paid out from the carrier C. For convenience of explanation, the wafers W set to be transferred by the first path and the second path are denoted by W1 and W2, respectively. Wafers W1 and W2 are sequentially transferred with the same type of modules and subjected to the same processing.

  First, an example of transferring the wafer W1 will be described. The wafer W1 is transferred in the order of the carrier C → the transfer arm 13 → the transfer module TRS13 → the first arm 46 of the first lifting / lowering transport mechanism 41, and the hydrophobic processing modules ADH1 to ADH1 of the first hydrophobic processing module group 10A. Of the ADH 4, the wafer W is loaded into a module into which the wafer W is not loaded and subjected to a hydrophobic treatment.

  After the hydrophobic treatment, the wafer W1 is transferred in the order of the second arm 47 of the first lifting / lowering transfer mechanism 41 → the buffer module 31 → the second arm 47 → the transfer module CPL11. It is carried into the unit block B1. Then, the wafer W1 has an antireflection film forming module BCT → transfer arm A1 → heating module → delivery module CPL12 → transfer arm A1 → resist coating module COT → transfer arm A1 → heating module → periphery exposure module WEE → transfer arm A1 → delivery module. Transported in the order of TRS11. As a result, an antireflection film and a resist film are formed in this order on the surface of the wafer W1 from the lower layer side.

  Thereafter, the wafer W1 is transferred in the order of the second arm 47 → the transfer module CPL15 of the first lifting / lowering transfer mechanism 41, and is transferred into the third unit block B3 by the transfer arm A3. Then, the wafer W1 is transferred in the order of the protective film forming module TCT → transfer arm A3 → heating module → transfer arm A3 → transfer module CPL16 → back surface cleaning module BST → transfer module TRS31, and a protective film is formed on the upper layer of the resist film. After the back surface is further cleaned, it is carried into the interface block S4.

  The wafer W1 is transferred in the order of the first interface arm 81 → buffer module 74 → second interface arm 82 → delivery module CPL31 → third interface arm 83 → exposure apparatus S5 and is subjected to an immersion exposure process.

  The exposed wafer W1 is transferred in the order of the third interface arm 83 → the delivery module TRS35 → the second interface arm 3B → the post-exposure cleaning module PIR → the buffer module 75 → the second interface arm 82 → the delivery module TRS33. . After that, it is carried into the fifth unit block B5 by the transport arm A5, and transported in the order of heating module → delivery module CPL19 → development module DEV → conveying arm A5 → heating module → conveying arm A5 → delivery module CPL20 for development processing Receive.

  Thereafter, the second arm 47 of the second lifting / lowering transport mechanism 42 in the lifting / lowering transport block S2 is transported to the inspection module 34 for inspection, and then the second arm 47 of the second lifting / lowering transport mechanism 42 → The arm replacement modules 33A and 33B are transferred in the order of the first arm 46 of the second lifting / lowering transport mechanism 42 → the buffer module 32 → the first arm 46 → the transfer module TRS14 → the transfer arm 13 → the carrier C.

  Subsequently, the transfer path of the wafer W2 set so as to pass through the second hydrophobic treatment module group 10B and the second unit block B2 will be described. Wafer W2 is transferred to the same type of module as wafer W1 and undergoes the same processing. The wafer W2 discharged from the carrier C is transferred to the first arm 46 of the first lifting / lowering transfer mechanism 41 in the same manner as the wafer W1, and then the hydrophobic treatment module ADH5 of the second hydrophobic treatment module group 10B. ˜ADH8 is loaded into a module in which the wafer W2 is not loaded. After the hydrophobic treatment, the wafer W1 is transferred to the buffer module 31 in the same manner as the wafer W1, and then transferred in the order of the transfer module CPL13 via the second arm 47, and is transferred to the second unit block B2 by the transfer arm A2. Is done.

  The wafer W2 receives the module in the second unit block B2 in the same manner as the wafer W1 carried into the first unit block B1, and an antireflection film and a resist film are formed in order. However, in the transfer of the wafer W2 in the unit block B2, unlike the transfer of the wafer W1, the transfer module CPL14 corresponding to the module is used instead of the transfer module CPL12.

  After the formation of each film, the wafer W2 transferred to the transfer module TRS13 by the transfer arm A2 is transferred in the order of the second arm 47 → the transfer module CPL17 of the first lifting / lowering transfer mechanism 41. Then, the wafer W2 is loaded into the fourth unit block B4 by the transfer arm A4, and the module in the fourth unit block B4 is delivered and protected in the same manner as the wafer W1 loaded into the third unit block B3. The film forming process and the back surface are sequentially subjected to the cleaning process, and are carried into the interface block S4 via the delivery module TRS32. However, in the transfer of the wafer W2 in the unit block B4, unlike the transfer of the wafer W1, the transfer module CPL18 corresponding to the module is used instead of the transfer module CPL16.

  After the wafer W2 is transferred from the transfer module TRS32 to the first interface arm 81, the wafer W2 is transferred, exposed, exposed and cleaned in the same manner as the wafer W1, and then transferred to the transfer module TRS34 by the second interface arm 82. Passed. Thereafter, the wafer W2 is loaded into the sixth unit block B6 by the transfer arm A6, and the module in the sixth unit block B6 is delivered in the same manner as the wafer W1 loaded into the fifth unit block B5. Receive development processing. Thereafter, the wafer W2 is transferred to the transfer module CPL22, transferred to the second lift transfer mechanism 42, and then transferred in the same manner as the wafer W1 and returned to the carrier C. However, in the transfer of the wafer W2 in the unit block B6, unlike the transfer of the wafer W1, the transfer module CPL20 corresponding to the module is used instead of the transfer module CPL19.

(When processing of the first unit block B1 is stopped)
Next, the case 1 conveyance will be described in the case where the processing in the block B1 is stopped due to failure or maintenance of the first unit block B1 as shown in FIG. 2 during normal conveyance. Even when the processing is stopped in this way, the transfer of the wafer W2 is performed in the same manner as in normal times. Then, the wafer W1 transferred to the first hydrophobizing module group 10A at the time of this process stop is transferred to the buffer module 31 after the hydrophobizing process, and then the second unit block as with the wafer W2. It is transported to B2 and processed. Similarly, the wafer W1 on the path from the first hydrophobic treatment module group 10A to the buffer module 31 is also loaded into the second unit block B2 and processed.

  Further, the wafer W1 on the path from the carrier C to the hydrophobic processing module ADH group at the time of the processing stop is transferred to the second hydrophobic processing module group 10B, and after the hydrophobic processing, the transfer module CPL13 is similar to the wafer W2. To be transferred to the second unit block B2 for processing. The wafer W1 discharged from the carrier C after the processing stop time is transferred to the hydrophobic processing module group 10B and processed in the same manner as the wafer W2, and then transferred to the second unit block B2 and processed. Receive.

  The wafer W1 that has been processed in the second unit block B2 is transferred to the third unit block B3 via the transfer module CPL15 by the first lifting / lowering transfer mechanism 41, and thereafter transferred and processed in the same manner as normal. Receive. Therefore, when the transfer path of the wafer W1 of the case 1 when the process in the first unit block B1 cannot be performed is described in a very schematic manner, instead of being transferred to the first hydrophobizing module group 10A, the second Instead of being transported to the hydrophobic treatment module group 10B and transported to the first unit block B1, it is transported to the second unit block B2.

  Further, in the case 2 already described, when the processing of the first unit block B1 is stopped, the wafer W1 on the path from the hydrophobic treatment module group 10A to the buffer module 31 is delivered in the same manner as in the case 1. It is carried into the second unit block B2 via the module CPL13. However, unlike the case 1, even after the processing of the first unit block B1 is stopped, the loading into the hydrophobic processing module group 10A is continued. The wafer W1 processed by the hydrophobic processing module group 10A is transferred into the second unit block B2 via the transfer module CPL13 in the same manner as the wafer W2, and thereafter transferred in the same manner as in the case 1.

(When processing of the second unit block B2 is stopped)
Subsequently, the conveyance of the above case 3 will be described in the case where the processing is stopped due to failure or maintenance of the second unit block B2. In this case, the transfer of the wafer W1 is performed in the same manner as normal. Then, the wafer W2 transferred to the second hydrophobizing module group 10B at the time of this process stop is transferred to the buffer module 31 after the hydrophobizing process, and thereafter transferred to the first unit block B1 like the wafer W1. It is conveyed and processed. Similarly, the wafer W2 on the path from the second hydrophobic treatment module group 10B to the buffer module 31 is also loaded into the first unit block B1 and processed.

  Further, the wafer W2 on the path from the carrier C to the hydrophobic processing module ADH group at the time of the processing stop is transferred to the first hydrophobic processing module group 10A, and after the hydrophobic processing, the second wafer W2 is transferred in the same manner as the wafer W1. It is transported to unit block B1 for processing. Then, the wafer W2 discharged from the carrier C after the processing stop time is transferred to the first hydrophobizing module group 10A and processed in the same manner as the wafer W1, and then transferred to the first unit block B1. To be processed.

  The wafer W2 processed in the first unit block B1 is transferred to the fourth unit block B4 via the transfer module CPL17 by the second lifting / lowering transfer mechanism 42, and thereafter transferred and processed in the same manner as normal. Receive. Accordingly, the transfer path of the wafer W2 when the process in the second unit block B2 cannot be performed will be described in a very schematic manner. Instead of being transferred to the second hydrophobic processing module group 10B, the first hydrophobic process is performed. Instead of being transported to the module group 10A and transported to the second unit block B2, it is transported to the first unit block B1.

  In the case 4 described above, when the processing of the second unit block B2 is stopped, the wafer W on the path from the hydrophobic treatment module group 10B to the buffer module 31 is transferred as in the case 3. It is carried into the first unit block B1 via the CPL11. However, unlike the case 3, even after the processing of the second unit block B2 is stopped, the loading into the hydrophobization processing module group 10B is continued. The wafer W processed in the hydrophobic processing module group 10B is similarly transferred to the first unit block B1 via the transfer module CPL11, and then transferred in the same manner as the case 1.

(When transporting to the first hydrophobic treatment module group 10A is not possible)
Next, a case will be described in which all of the hydrophobization modules ADH1 to ADH4 cannot be transported due to failure or maintenance during normal transport as shown in FIG. In this case, the transfer of the wafer W2 is performed in the same manner as normal. On the other hand, the wafer W1 which is paid out from the carrier C at the time when the transfer becomes impossible in this way and is on the path to the hydrophobic treatment module group is transferred to the hydrophobic treatment module group 10B like the wafer W2, Further, like the wafer W2, it is transferred to the second unit block B2 and undergoes processing. Also, the wafer W1 discharged from the carrier C after the time when the transfer becomes impossible is transferred to the hydrophobic processing module group 10B and processed similarly to the wafer W2, and then transferred to the second unit block B2. Receive processing.

  At the time when the transfer becomes impossible, the wafer W1 already transferred into the first unit block B1 and the delivery module CPL11 which is the transfer port of the first unit block B1 is the same as in the normal transfer. It is processed in the unit block B1 and conveyed to the third unit block B3. At the time when the transfer becomes impossible, the wafer W1 in the path from the hydrophobic processing modules ADH1 to ADH4 to the buffer module 31 in the previous stage of the delivery module CPL11 is the second unit block, like the wafer W2. It is conveyed to B2.

  The wafer W1 that has been processed in the second unit block B2 is transferred to the third unit block B3 via the transfer module CPL15 by the first lifting / lowering transfer mechanism 41, and thereafter transferred and processed in the same manner as normal. Receive.

(When transporting to the second hydrophobic treatment module group 10B is impossible)
Next, a case will be described in which all of the hydrophobization modules ADH5 to ADH8 become unusable due to failure or maintenance during normal transport. In this case, the transfer of the wafer W1 is performed in the same manner as normal. On the other hand, the wafer W2 which is discharged from the carrier C at the time when the transfer becomes impossible in this way and is in the path to the hydrophobic treatment module group is transferred to the hydrophobic treatment module group 10A in the same manner as the wafer W1, Further, like the wafer W1, it is transferred to the first unit block B1 and undergoes processing. Further, the wafer W2 discharged from the carrier C after the time when the transfer becomes impossible is also transferred to the first hydrophobizing module group 10A and the first unit block B1 for processing, similarly to the wafer W1.

  At the time when the transfer becomes impossible, the second unit block B2 and the wafer W2 already transferred into the transfer module CPL13 which is the transfer port of the second unit block B2 are in the second unit block as in the normal transfer. It is processed in the block B2 and conveyed to the fourth unit block B4. At the time when the transfer becomes impossible, the wafer W2 in the path from the hydrophobization modules ADH5 to ADH8 to the buffer module 31 in the previous stage of the delivery module CPL13 is the first unit block, like the wafer W1. It is conveyed to B1 and processed.

  The wafer W2 processed in the first unit block B1 is transferred to the fourth unit block B4 via the delivery module CPL17 by the second lifting / lowering transfer mechanism 41, and thereafter transferred and processed in the same manner as normal. receive. Further, as described above, the user refers to the inspection result of the inspection module 34 and processes the first hydrophobizing module group 10A and the first unit block B1, or the second hydrophobizing module group 10B. The processing of the second unit block B2 can be stopped. That is, the user can arbitrarily switch the conveyance path from the normal conveyance to the conveyance of the case 1 or the case 3 described above. Then, the user can identify the module that could not perform appropriate processing in the stopped hydrophobic treatment module group and the unit block, and take measures such as repair or replacement.

  And while performing such a countermeasure, a process can be continued using the hydrophobic processing module group and unit block B1 or B2 which are not stopped. As described above, a plurality of groups of a plurality of hydrophobic treatment modules are set during normal transfer, and a transfer path is set in advance from each group to a plurality of coating film forming unit blocks. As described above, when a processing abnormality occurs, it is possible to easily identify in which transport route the abnormality has occurred. Then, by stopping the processing in the specified transfer path and continuing the process in the other transfer path, it is possible to suppress a reduction in the productivity of the apparatus and to prevent the wafer W from being wasted. There is an advantage.

  According to the coating / developing apparatus 1, the hydrophobic processing module groups 10A and 10B including the four hydrophobic processing modules ADH and the unit blocks B1 and B2 which are duplicated unit blocks for coating are provided. The wafer W is transferred from each of the hydrophobic treatment module groups 10A and 10B to the corresponding unit blocks B1 and B2, respectively. As described above, since two transfer paths for the wafer W are provided, even if transfer to the hydrophobic processing module group or unit block in any of the transfer paths becomes impossible, the transfer of the wafer W can be performed using another transfer path. Since conveyance can be continued, the fall of the operating efficiency of an apparatus can be suppressed. Further, since the transfer destination unit block B is set for each hydrophobic treatment module group, the operation of the lifting / lowering transfer mechanism 41 for transferring the wafer W can be prevented from becoming complicated, thereby improving the throughput. In addition, it is easy to create a program for controlling the operation of the lifting and lowering transport mechanism 41.

  Further, in the transfer of the above cases 1 and 3, when the transfer of the wafer W cannot be performed in the unit block B1 or B2, the hydrophobic processing module group associated with the unit block which cannot perform the transfer is transferred. Stop the transport. Therefore, when an abnormality is detected in the processing of the wafer W as described above, it becomes easy to identify the module that is the cause. Further, by limiting the number of hydrophobic processing modules used in accordance with the decrease in processing capacity of the processing block S3, it is possible to suppress waste of power used for the apparatus. Further, even if one hydrophobic treatment module constituting the hydrophobic treatment module group becomes unusable, it is transported to other modules constituting the module group, so that a reduction in throughput can be suppressed.

  By the way, associating the hydrophobic processing module group with the unit block is not to make the two inseparable but to set a unit block for transporting a wafer from the hydrophobic processing module group in advance. The unit of the transport destination may be changed from the hydrophobic processing module group. Therefore, specifically, the control unit 100 can control the transfer of the wafer W as follows. As shown in FIG. 14, when both the first hydrophobizing module group 10A and the second unit block B2 become unusable, the transfer destination of the wafer W processed by the hydrophobizing module group 10B is set to the first destination block. The unit block B1 is changed to continue the processing of the apparatus. Similarly, when both the second hydrophobic processing module group 10B and the first unit block B1 become unusable, the transfer destination of the wafer W processed by the hydrophobic processing module group 10A is designated as the second unit block B2. To continue processing of the device.

In this way, when the module group and the unit block associated with each other during normal transfer are lost, for example, the control unit 100 automatically switches the transfer destination of the wafer W from the module group not associated to the unit block B. As a result, it is possible to suppress a decrease in the productivity of the apparatus. There are three hydrophobic treatment module groups 10A, 10B, and 10C, and there is a unit block B7 configured in the same manner as the unit blocks B1 and B2. The hydrophobic treatment module groups 10A, 10B, and 10C have unit blocks B1, A case where B2 and B7 are associated with each other will be described. For example, when the unit blocks B1 and B3 are unusable and the hydrophobic processing module group 10B is unusable, the corresponding module and unit block disappear. In this case, the transfer is performed from the operating hydrophobic treatment module group 10A, 10C to the operating unit block B2.

(Second Embodiment)
Hereinafter, the coating and developing apparatus 9 of the second embodiment will be described focusing on differences from the first embodiment. In the first embodiment, the resist coating module COT and the antireflection film forming module BCT are provided in the same layer, but may be provided in different layers as shown in FIG. In the coating / developing apparatus 9, two antireflection film forming modules BCT are provided in each of the unit blocks C1 and C2, and two resist film forming modules COT are provided in the unit blocks C3 and C4. The unit blocks C1 to C4 are stacked together and configured in the same manner as the first unit block B1 except that the liquid processing modules are different.

The unit blocks B3 to B6 described in the first embodiment are stacked on the unit blocks C1 to C4. Similarly to the first embodiment, a delivery module is provided at a height corresponding to each unit block of the lifting and lowering transport block S2, and a movement and hydrophobization module between each unit block is provided via each delivery module. Movement between the groups 10A and 10B and each unit block is performed.

  During normal transfer, the wafer W1 is transferred in the order of the first hydrophobizing module 10A group → unit block C1 → unit block C3 → unit block B3, and thereafter transferred along the same path as in the first embodiment. During normal transfer, the wafer W2 is transferred in the order of the second hydrophobizing module 10B group → unit block C2 → unit block C4 → unit block B4. Thereafter, the wafer W2 is transferred by the same route as in the first embodiment. .

  When the unit block C1 or the unit block C3 becomes unusable, the wafer W1 is transferred along with the wafer W2 along the path of the second hydrophobizing module 10B → unit block C2 → unit block C4. It is conveyed by the conveyance route. When the unit block C2 or the unit block C4 becomes unusable, the wafer W2 is transferred together with the wafer W1 through the first hydrophobic processing module 10A group → unit block C1 → unit block C3. It is transported along the same transport path.

  Even when all the modules of the first hydrophobizing module group 10A become unusable, the wafer W1 is transferred along with the wafer W2 along the path of the hydrophobizing module 10B group → unit block C2 → unit block C4, and thereafter normally. It is transported by the same transport path as the time. Even when all the modules of the second hydrophobizing module group 10B become unusable, the wafer W2 is transferred along with the wafer W1 along the path of the hydrophobizing module 10A group → unit block C1 → unit block C3. It is transported along the same transport path as in normal times. This second embodiment also has the same effect as the first embodiment.

  In the example of the coating and developing apparatus, the unit block for coating is doubled and there are two groups of hydrophobic treatment modules. The coating / developing apparatus in which the unit block for the coating film is tripled and the hydrophobic treatment module is in three groups also includes the unit block for coating and the unit block for two groups of coating films that are duplexed. Therefore, it is included in the scope of rights of the present invention. That is, the unit block and the group may be two or more. The unit block N-folding (N is an integer) is not limited to the same number of modules for processing the wafer W and the same module layout, and it is sufficient that the same processing can be performed on the wafer W in each unit block. . Further, the number of hydrophobizing modules constituting each group may be one or more. Further, an antireflection film may not be formed on the wafer W, and in each embodiment, a resist film may be formed on the surface of the wafer W that has been subjected to the hydrophobic treatment after the treatment by the hydrophobic treatment module ADH.

W Wafer ADH Hydrophobization processing module BCT Antireflection film forming module COT Resist film forming module DEV Development module S2 Elevating and conveying block S3 Processing block 1 Coating and developing apparatus 100 Control unit A1 to A6 Transfer arm B1 to B6 Unit block TRS Delivery module CPL Delivery module

Claims (9)

After the substrate carried into the carrier block by the carrier is transferred to the processing block and a coating film including a resist film is formed in the processing block, the substrate is passed through an interface block located on the opposite side of the processing block from the carrier block. In the coating and developing apparatus, the substrate after exposure that has been transferred to the exposure apparatus and returned through the interface block is developed in the processing block and transferred to the carrier block.
a) The processing block includes a liquid processing module that supplies a chemical solution for forming the coating film to the substrate, a heating module that heats the substrate after the chemical solution is applied, and the substrate between the modules. And a unit block transport mechanism that moves on a straight transport path connecting the carrier block and the interface block, and stacks unit blocks for coating on each other so that N (N is an integer of 2 or more) Including laminated laminates,
b) The N-layered coating unit blocks are configured such that the same coating film is formed on each other,
c) The processing block includes a developing unit block provided with a developing module that is stacked on the N-layered coating unit block and supplies a developing solution to the substrate after the exposure to perform development processing.
d ) A lifting / lowering transport block is provided between the carrier block and the processing block, and the lifting / lowering transport block is a first lifting / lowering for delivering a substrate to each of the N-layered application unit blocks. A transport mechanism, a second lifting / lowering transport mechanism for delivering the substrate to the unit block for development, and a delivery module provided in a stacked manner,
Assuming that the arrangement direction of the carrier block, the processing block, and the lifting / lowering transport block is a front-rear direction, the first lifting / lowering transport mechanism, the second lifting / lowering transport mechanism, and a plurality of stacked delivery modules are provided in the left-right direction. The multi-layered delivery modules are provided so as to be sandwiched between the first elevating and conveying mechanism and the second elevating and conveying mechanism.
e ) The first lifting / lowering transport mechanism and the second lifting / lowering mechanism include a lifting base that moves up and down, a rotating base that rotates the lifting base around a vertical axis, a first transport arm, and a second transport. Each with arm,
f ) The first transfer arm and the second transfer arm advance and retract independently from each other with respect to the rotation base,
The first transfer arm supports the back surface of the substrate, and the width of the first transfer arm perpendicular to the advancing and retreating direction is configured to be narrower than the width of the substrate.
The second transfer arm includes a bifurcated enclosure that surrounds the side periphery of the substrate, and a plurality of claw portions that are provided on the inner periphery of the enclosure and support the back surface of the substrate.
g ) The delivery module provided in a stacked manner includes a first delivery module comprising a stage having a coolant flow path for cooling the mounted substrate, and a flow path for the coolant. And a second delivery module consisting of a stage not provided ,
The first transfer arm is used for transferring the substrate to the second transfer module ,
The coating and developing apparatus, wherein the second transfer arm is used for transferring the substrate to the first transfer module . The unit block for coating is
A liquid processing module for a lower layer that supplies a chemical solution for forming an antireflection film to a substrate to form an antireflection film on the lower layer side, and a liquid processing that forms a resist film by supplying a resist solution on the antireflection film For pre-stage processing comprising a module, a heating module for heating the substrate, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport the substrate between these modules Unit block of
A liquid processing module for an upper layer that forms a film on the upper layer side by supplying a chemical liquid for film formation on the upper layer side to the substrate on which the resist film is formed and laminated on the unit block for the previous stage processing, and the substrate A unit block for subsequent processing, comprising a heating module for heating, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport a substrate between these modules; The coating and developing apparatus according to claim 1, further comprising: The elevating transport block is associated with each of the N-layered application unit blocks, and includes an N group hydrophobizing module for hydrophobizing the substrate before forming the coating film. Prepared,
The first elevating / conveying mechanism is controlled to deliver a substrate from the N group hydrophobizing module to a corresponding application unit block,
When one of the N overlapping application unit blocks is stopped and a group associated with an available application unit block among the N groups is stopped,
3. The coating and developing apparatus according to claim 1, wherein a delivery mechanism is controlled so as to switch a substrate transport destination to a usable coating unit block that is not associated with a usable group. . A plurality of notches are provided on the peripheral edge of the cooling stage,
The second transfer arm is moved up and down with respect to the cooling stage to deliver the substrate to the cooling stage;
4. The coating and developing apparatus according to claim 1, wherein the notch is provided to allow the plurality of claw portions of the second transport arm to pass when the elevator is moved up and down. A hydrophobic treatment module for hydrophobizing the substrate before being transported to the coating unit block is provided,
When the side on which the delivery module is provided with respect to the first lifting / lowering transport mechanism is the left side in the left-right direction, the hydrophobic treatment module is provided on the right side of the first lifting / lowering transport mechanism. The coating and developing apparatus according to any one of claims 1 to 4. After the substrate carried into the carrier block by the carrier is transferred to the processing block and a coating film including a resist film is formed in the processing block, the substrate is passed through an interface block located on the opposite side of the processing block from the carrier block. In the coating and developing apparatus, the substrate after exposure that has been transferred to the exposure apparatus and returned through the interface block is developed in the processing block and transferred to the carrier block.
a) The processing block includes a liquid processing module that supplies a chemical solution for forming the coating film to the substrate, a heating module that heats the substrate after the chemical solution is applied, and the substrate between the modules. And a unit block transport mechanism that moves on a straight transport path connecting the carrier block and the interface block, and stacks unit blocks for coating on each other so that N (N is an integer of 2 or more) Including laminated laminates,
b) The N-layered coating unit blocks are configured such that the same coating film is formed on each other,
c) The processing block includes a developing unit block provided with a developing module that is stacked on the N-layered coating unit block and supplies a developing solution to the substrate after the exposure to perform development processing.
d ) A lifting / lowering transport block is provided between the carrier block and the processing block, and the lifting / lowering transport block is a first lifting / lowering for delivering a substrate to each of the N-layered application unit blocks. A transport mechanism, a second lifting / lowering transport mechanism for delivering the substrate to the unit block for development, and a delivery module provided in a stacked manner,
Assuming that the arrangement direction of the carrier block, the processing block, and the lifting / lowering transport block is the front-rear direction, the first lifting / lowering transport mechanism, the second lifting / lowering transport mechanism, and a number of delivery modules are provided in the left-right direction. The delivery module is provided so as to be sandwiched between the first lifting and lowering transport mechanism and the second lifting and lowering transport mechanism,
e ) The first lifting / lowering transport mechanism and the second lifting / lowering mechanism include a lifting base that moves up and down, a rotating base that rotates the lifting base around a vertical axis, a first transport arm, and a second transport. Each with arm,
f ) The first transfer arm and the second transfer arm advance and retract independently from each other with respect to the rotation base,
The first transfer arm supports the back surface of the substrate, and the width of the first transfer arm perpendicular to the advancing and retreating direction is configured to be narrower than the width of the substrate.
The second transfer arm includes a bifurcated enclosure that surrounds the side periphery of the substrate, and a plurality of claw portions that are provided on the inner periphery of the enclosure and support the back surface of the substrate.
g ) The delivery module provided in a stacked manner includes a first delivery module comprising a stage having a coolant flow path for cooling the mounted substrate, and a flow path for the coolant. In a coating and developing method using a developing device including a second delivery module composed of a stage not provided ,
Transferring the substrate to the second transfer module using the first transfer arm;
Using the second transfer arm to transfer the substrate to the first transfer module ;
A coating and developing method comprising: The unit block for coating is
A liquid processing module for a lower layer that supplies a chemical solution for forming an antireflection film to a substrate to form an antireflection film on the lower layer side, and a liquid processing that forms a resist film by supplying a resist solution on the antireflection film For pre-stage processing comprising a module, a heating module for heating the substrate, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport the substrate between these modules Unit block of
A liquid processing module for an upper layer that forms a film on the upper layer side by supplying a chemical liquid for film formation on the upper layer side to the substrate on which the resist film is formed and laminated on the unit block for the previous stage processing, and the substrate A unit block for subsequent processing, comprising a heating module for heating, and a transport mechanism for a unit block that moves on a straight transport path connecting the carrier block and the interface block in order to transport a substrate between these modules; The coating and developing method according to claim 6, further comprising: The elevating transport block is associated with each of the N-layered application unit blocks, and includes an N group hydrophobizing module for hydrophobizing the substrate before forming the coating film. Prepared,
A step of delivering a substrate from the N group hydrophobization module to the corresponding application unit block by the first lifting and lowering transport mechanism;
When one of the N overlapping application unit blocks is stopped and a group associated with an available application unit block among the N groups is stopped,
8. The coating and developing method according to claim 6, further comprising a step of switching a substrate transport destination from the usable group to the usable coating unit block that is not associated. A storage medium storing a computer program used in a coating and developing apparatus,
A storage medium characterized in that the computer program is for carrying out the coating and developing method according to any one of claims 6 to 8.

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