JP5662234B2 - Phenolic resin, curable composition containing the same, and cured product - Google Patents
Phenolic resin, curable composition containing the same, and cured product Download PDFInfo
- Publication number
- JP5662234B2 JP5662234B2 JP2011092536A JP2011092536A JP5662234B2 JP 5662234 B2 JP5662234 B2 JP 5662234B2 JP 2011092536 A JP2011092536 A JP 2011092536A JP 2011092536 A JP2011092536 A JP 2011092536A JP 5662234 B2 JP5662234 B2 JP 5662234B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- phenol resin
- resin
- examples
- anthracene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000005011 phenolic resin Substances 0.000 title claims description 92
- 239000000203 mixture Substances 0.000 title claims description 24
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title description 8
- 229920001568 phenolic resin Polymers 0.000 title description 8
- 150000001875 compounds Chemical class 0.000 claims description 40
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 22
- 239000003431 cross linking reagent Substances 0.000 claims description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 150000001299 aldehydes Chemical class 0.000 claims description 10
- 150000002576 ketones Chemical class 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims description 8
- 125000005027 hydroxyaryl group Chemical group 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- -1 polycyclic aromatic compound Chemical class 0.000 description 58
- 238000006243 chemical reaction Methods 0.000 description 36
- 239000000463 material Substances 0.000 description 29
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 25
- 239000000047 product Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 18
- 229910052799 carbon Inorganic materials 0.000 description 18
- 239000002994 raw material Substances 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 16
- 229920003986 novolac Polymers 0.000 description 16
- 150000002989 phenols Chemical class 0.000 description 16
- 239000002904 solvent Substances 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 125000001424 substituent group Chemical group 0.000 description 13
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 238000001723 curing Methods 0.000 description 11
- 239000003377 acid catalyst Substances 0.000 description 10
- 125000005577 anthracene group Chemical group 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 230000009477 glass transition Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 229930040373 Paraformaldehyde Natural products 0.000 description 9
- YMNKUHIVVMFOFO-UHFFFAOYSA-N anthracene-9-carbaldehyde Chemical compound C1=CC=C2C(C=O)=C(C=CC=C3)C3=CC2=C1 YMNKUHIVVMFOFO-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920002866 paraformaldehyde Polymers 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 150000001298 alcohols Chemical class 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 150000005846 sugar alcohols Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 150000002170 ethers Chemical class 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N acetic acid anhydride Natural products CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 150000001454 anthracenes Chemical class 0.000 description 4
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000012776 electronic material Substances 0.000 description 4
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 4
- 238000004128 high performance liquid chromatography Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004566 building material Substances 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 150000004292 cyclic ethers Chemical class 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 3
- 239000002783 friction material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002950 monocyclic group Chemical group 0.000 description 3
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 3
- 125000003367 polycyclic group Chemical group 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 2
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 2
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- YEKWCXNXBLQUTF-UHFFFAOYSA-N 4-[[10-(4-hydroxyphenyl)anthracen-9-yl]methyl]phenol Chemical compound C1=CC(O)=CC=C1CC(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C1=CC=C(O)C=C1 YEKWCXNXBLQUTF-UHFFFAOYSA-N 0.000 description 2
- DOMBBFBDIIXIKP-UHFFFAOYSA-N 4-[[4-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-2-(hydroxymethyl)-6-methylphenol Chemical compound OCC1=C(O)C(C)=CC(CC=2C=C(CO)C(O)=C(C)C=2)=C1 DOMBBFBDIIXIKP-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- YQUQWHNMBPIWGK-UHFFFAOYSA-N 4-isopropylphenol Chemical compound CC(C)C1=CC=C(O)C=C1 YQUQWHNMBPIWGK-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 2
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- UVJHQYIOXKWHFD-UHFFFAOYSA-N cyclohexa-1,4-diene Chemical compound C1C=CCC=C1 UVJHQYIOXKWHFD-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 108091008695 photoreceptors Proteins 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000003021 water soluble solvent Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical group CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- 125000006039 1-hexenyl group Chemical group 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- 125000006023 1-pentenyl group Chemical group 0.000 description 1
- 125000006017 1-propenyl group Chemical group 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- NMSGHQZTUYHIID-UHFFFAOYSA-N 2,2-bis(4-hydroxy-2,5-dimethylphenyl)acetaldehyde Chemical compound C1=C(O)C(C)=CC(C(C=O)C=2C(=CC(O)=C(C)C=2)C)=C1C NMSGHQZTUYHIID-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- GYBGKXFOKOSPLS-UHFFFAOYSA-N 2,4,6-Triethyl-1,3,5-trioxane Chemical compound CCC1OC(CC)OC(CC)O1 GYBGKXFOKOSPLS-UHFFFAOYSA-N 0.000 description 1
- NSBGRQGYTRBWNG-UHFFFAOYSA-N 2,4-bis(hydroxymethyl)-6-methylphenol Chemical compound CC1=CC(CO)=CC(CO)=C1O NSBGRQGYTRBWNG-UHFFFAOYSA-N 0.000 description 1
- HDXHUXYJEBFUFX-UHFFFAOYSA-N 2,4-bis(hydroxymethyl)-6-propan-2-ylphenol Chemical compound CC(C)C1=CC(CO)=CC(CO)=C1O HDXHUXYJEBFUFX-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- 125000005810 2,5-xylyl group Chemical group [H]C1=C([H])C(=C(*)C([H])=C1C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BHPFXDABRSZTIL-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-3,4-dimethylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1C BHPFXDABRSZTIL-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- QYYCPWLLBSSFBW-UHFFFAOYSA-N 2-(naphthalen-1-yloxymethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1OCC1CO1 QYYCPWLLBSSFBW-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- 125000004974 2-butenyl group Chemical group C(C=CC)* 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- VDTAKSVDHUHVFR-UHFFFAOYSA-N 2-cyclohexyl-4,6-bis(hydroxymethyl)phenol Chemical compound OCC1=CC(CO)=C(O)C(C2CCCCC2)=C1 VDTAKSVDHUHVFR-UHFFFAOYSA-N 0.000 description 1
- SRGATTGYDONWOU-UHFFFAOYSA-N 2-cyclohexyl-5-methylphenol Chemical compound OC1=CC(C)=CC=C1C1CCCCC1 SRGATTGYDONWOU-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- NTLUIMJJXIINIM-UHFFFAOYSA-N 2-ethyl-4,6-bis(hydroxymethyl)phenol Chemical compound CCC1=CC(CO)=CC(CO)=C1O NTLUIMJJXIINIM-UHFFFAOYSA-N 0.000 description 1
- 125000004198 2-fluorophenyl group Chemical group [H]C1=C([H])C(F)=C(*)C([H])=C1[H] 0.000 description 1
- 125000006040 2-hexenyl group Chemical group 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- QVQDALFNSIKMBH-UHFFFAOYSA-N 2-pentoxyethanol Chemical compound CCCCCOCCO QVQDALFNSIKMBH-UHFFFAOYSA-N 0.000 description 1
- 229940061334 2-phenylphenol Drugs 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- ZVVAXIOKQUNTKG-UHFFFAOYSA-N 2-tert-butylphenol 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1.CC(C)(C)C1=CC=CC=C1O ZVVAXIOKQUNTKG-UHFFFAOYSA-N 0.000 description 1
- 125000003762 3,4-dimethoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C(OC([H])([H])[H])C([H])=C1* 0.000 description 1
- 125000004179 3-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(Cl)=C1[H] 0.000 description 1
- 125000006041 3-hexenyl group Chemical group 0.000 description 1
- XGGAWFDOIDZRPI-UHFFFAOYSA-N 4,6-Dihydroxy Natural products C1=C2OCOC2=CC(C2OC(C3C(OC(O)C32)C=2C=C3OCOC3=CC=2)O)=C1 XGGAWFDOIDZRPI-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- VNWVYPAQLKRTSC-UHFFFAOYSA-N 4-[(4-hydroxy-2,5-dimethylphenyl)methyl]benzaldehyde Chemical compound OC1=CC(=C(C=C1C)CC1=CC=C(C=C1)C=O)C VNWVYPAQLKRTSC-UHFFFAOYSA-N 0.000 description 1
- ZRIRUWWYQXWRNY-UHFFFAOYSA-N 4-[2-[4-hydroxy-3,5-bis(hydroxymethyl)phenyl]propan-2-yl]-2,6-bis(hydroxymethyl)phenol Chemical compound C=1C(CO)=C(O)C(CO)=CC=1C(C)(C)C1=CC(CO)=C(O)C(CO)=C1 ZRIRUWWYQXWRNY-UHFFFAOYSA-N 0.000 description 1
- 125000004800 4-bromophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Br 0.000 description 1
- OWTGALWHQDVEKQ-UHFFFAOYSA-N 4-cyclohexyl-2,6-bis(hydroxymethyl)phenol Chemical compound OCC1=C(O)C(CO)=CC(C2CCCCC2)=C1 OWTGALWHQDVEKQ-UHFFFAOYSA-N 0.000 description 1
- OAHMVZYHIJQTQC-UHFFFAOYSA-N 4-cyclohexylphenol Chemical compound C1=CC(O)=CC=C1C1CCCCC1 OAHMVZYHIJQTQC-UHFFFAOYSA-N 0.000 description 1
- UIBRZPKYAKGQQZ-UHFFFAOYSA-N 4-ethyl-2,6-bis(hydroxymethyl)phenol Chemical compound CCC1=CC(CO)=C(O)C(CO)=C1 UIBRZPKYAKGQQZ-UHFFFAOYSA-N 0.000 description 1
- 125000006042 4-hexenyl group Chemical group 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000004172 4-methoxyphenyl group Chemical group [H]C1=C([H])C(OC([H])([H])[H])=C([H])C([H])=C1* 0.000 description 1
- ZBCATMYQYDCTIZ-UHFFFAOYSA-N 4-methylcatechol Chemical compound CC1=CC=C(O)C(O)=C1 ZBCATMYQYDCTIZ-UHFFFAOYSA-N 0.000 description 1
- SIBBGGADHQDMHI-UHFFFAOYSA-N 4-tert-butyl-2,6-bis(hydroxymethyl)phenol Chemical compound CC(C)(C)C1=CC(CO)=C(O)C(CO)=C1 SIBBGGADHQDMHI-UHFFFAOYSA-N 0.000 description 1
- OWPBOKWFRAIKTD-UHFFFAOYSA-N 5-[(3-formyl-4-hydroxyphenyl)methyl]-2-hydroxybenzaldehyde Chemical compound C1=C(C=O)C(O)=CC=C1CC1=CC=C(O)C(C=O)=C1 OWPBOKWFRAIKTD-UHFFFAOYSA-N 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- OGUKSIJGQFBZPS-UHFFFAOYSA-N 6-[[2-hydroxy-3-(hydroxymethyl)-4,5-dimethylphenyl]methyl]-2-(hydroxymethyl)-3,4-dimethylphenol Chemical compound OCC1=C(C)C(C)=CC(CC=2C(=C(CO)C(C)=C(C)C=2)O)=C1O OGUKSIJGQFBZPS-UHFFFAOYSA-N 0.000 description 1
- NGHRPKPDSIKYFR-UHFFFAOYSA-N 6-cyclohexyl-2,4-bis(hydroxymethyl)-3-methylphenol Chemical compound OC1=C(CO)C(C)=C(CO)C=C1C1CCCCC1 NGHRPKPDSIKYFR-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000005844 Thymol Substances 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IYKFYARMMIESOX-SPJNRGJMSA-N adamantanone Chemical compound C([C@H](C1)C2)[C@H]3C[C@@H]1C(=O)[C@@H]2C3 IYKFYARMMIESOX-SPJNRGJMSA-N 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 125000005075 adamantyloxy group Chemical group C12(CC3CC(CC(C1)C3)C2)O* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000002078 anthracen-1-yl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C([*])=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 1
- ATUINOWSBQKFKB-UHFFFAOYSA-N anthracene phenol Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C12.C1(=CC=CC=C1)O ATUINOWSBQKFKB-UHFFFAOYSA-N 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 125000000319 biphenyl-4-yl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- 125000005382 boronyl group Chemical group 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- FFSAXUULYPJSKH-UHFFFAOYSA-N butyrophenone Chemical compound CCCC(=O)C1=CC=CC=C1 FFSAXUULYPJSKH-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000007806 chemical reaction intermediate Substances 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001352 cyclobutyloxy group Chemical group C1(CCC1)O* 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- 125000003678 cyclohexadienyl group Chemical group C1(=CC=CCC1)* 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002933 cyclohexyloxy group Chemical group C1(CCCCC1)O* 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001887 cyclopentyloxy group Chemical group C1(CCCC1)O* 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 125000000131 cyclopropyloxy group Chemical group C1(CC1)O* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 238000002189 fluorescence spectrum Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229960004337 hydroquinone Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229940030980 inova Drugs 0.000 description 1
- 239000002917 insecticide Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000002510 isobutoxy group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])O* 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000005921 isopentoxy group Chemical group 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 125000000040 m-tolyl group Chemical group [H]C1=C([H])C(*)=C([H])C(=C1[H])C([H])([H])[H] 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000005484 neopentoxy group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- 125000005295 norbornyloxy group Chemical group C12(CCC(CC1)C2)O* 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 125000003261 o-tolyl group Chemical group [H]C1=C([H])C(*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- 239000004209 oxidized polyethylene wax Substances 0.000 description 1
- 235000013873 oxidized polyethylene wax Nutrition 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000013558 reference substance Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000005920 sec-butoxy group Chemical group 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000005922 tert-pentoxy group Chemical group 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- XKGLSKVNOSHTAD-UHFFFAOYSA-N valerophenone Chemical compound CCCCC(=O)C1=CC=CC=C1 XKGLSKVNOSHTAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Description
本発明は、アントラセン骨格を有する新規なフェノール樹脂、このフェノール樹脂を含む硬化性組成物及び硬化物に関する。 The present invention relates to a novel phenol resin having an anthracene skeleton, a curable composition containing the phenol resin, and a cured product.
アントラセンは、ベンゼン環が3個縮環した多環芳香族化合物であり、従来、木材の殺虫剤や保存安定剤、塗料等のほか、エポキシ樹脂やカーボンブラックの製造原料、アントラキノン染料の合成原料等の種々の用途に利用されている。また、アントラセンは、上記構造を有するため、構造的な硬さ、炭素密度の高さ、高融点、高屈折率等の特徴に加え、紫外線照射によってπ電子が作用し蛍光を発する等の有用な特性を有している。かかる特性を付加価値として更なる活用を図るべく、アントラセンの様々な応用展開が試みられている。これまでも種々のアントラセン誘導体が、多岐にわたる技術分野で付加価値の高い材料として開発されている。 Anthracene is a polycyclic aromatic compound in which three benzene rings are condensed. Conventionally, wood insecticides, storage stabilizers, paints, epoxy resin and carbon black production raw materials, anthraquinone dye synthesis raw materials, etc. It is used for various applications. In addition, since anthracene has the above-mentioned structure, in addition to features such as structural hardness, high carbon density, high melting point, and high refractive index, anthracene is useful in that π electrons act upon ultraviolet irradiation to emit fluorescence. It has characteristics. Various application developments of anthracene have been attempted in order to further utilize such characteristics as added value. Various anthracene derivatives have been developed as high value-added materials in various technical fields.
このようなアントラセン誘導体に係る技術としては、例えば、アントラセンの9,10位に(メタ)アクリレート基を導入し重合性モノマーとすることで、光ラジカル重合の増感剤として作用する光硬化ポリマー(特開2007−99637号公報参照)や、紫外線吸収能や難燃性を有するポリマー(特開2008−1637号公報参照)を得る技術が提案されている。また、フォトレジストの分野においても、アントラセン誘導体は、高感度、高解像性、高エッチング耐性、低昇華性などの利点を有する感放射線性樹脂組成物(特開2005−346024号公報参照)や、レジスト樹脂とのインターミキシングを防止する反射防止膜(特開平7−82221号公報参照)等としての活用が検討されている。さらには、電子輸送材料又は発光材料として、アントラセンを有機感光体(OPC)、有機エレクトロルミネッサンス素子、有機太陽電池、有機発光ダイオード等の用途へ応用することも検討されている(特開2009−40765号公報参照)。また、アントラセンが高屈折率を有するという特徴を生かして、光学材料としての利用の他、高屈折率材料、低屈折率材料及び増感色素等を混合し、露光によって干渉縞を記録するホログラム記録材料としての利用も提案されている(特開平6−295151号公報参照)。 As a technique relating to such an anthracene derivative, for example, a photo-curing polymer (acting as a sensitizer for photo radical polymerization by introducing a (meth) acrylate group at the 9th and 10th positions of anthracene to form a polymerizable monomer ( Japanese Laid-Open Patent Publication No. 2007-99637) and a technique for obtaining a polymer having ultraviolet absorbing ability and flame retardancy (see Japanese Laid-Open Patent Publication No. 2008-1637) have been proposed. Also in the field of photoresists, anthracene derivatives are radiation-sensitive resin compositions having advantages such as high sensitivity, high resolution, high etching resistance, and low sublimation (see JP 2005-346024 A), Further, utilization as an antireflection film (see JP-A-7-82221) for preventing intermixing with a resist resin has been studied. Furthermore, application of anthracene to organic photoreceptors (OPCs), organic electroluminescent elements, organic solar cells, organic light emitting diodes, etc. as an electron transporting material or a light emitting material has been studied (Japanese Patent Laid-Open No. 2009-2009). No. 40765). Furthermore, taking advantage of the feature that anthracene has a high refractive index, in addition to its use as an optical material, a hologram recording that mixes high refractive index material, low refractive index material, sensitizing dye, etc. and records interference fringes by exposure Use as a material has also been proposed (see JP-A-6-295151).
一方、ノボラック型フェノール樹脂に着目すると、この樹脂は、一般的に成型品、積層品、シェルモールド、建材、接着材、摩擦材、砥石、電子材料、感熱紙、感圧紙、エポキシ樹脂用硬化剤など、幅広い用途に使用されている。このような中、特に近年のIT分野の急速な発展にも伴い、ノボラック型フェノール樹脂の高耐熱性、高屈折率、蛍光特性の向上等の高機能化、高付加価値化が渇望されている。 On the other hand, focusing on the novolac type phenolic resin, this resin is generally a molded product, laminated product, shell mold, building material, adhesive material, friction material, grindstone, electronic material, thermal paper, pressure sensitive paper, epoxy resin curing agent. It is used for a wide range of applications. Under such circumstances, especially with the rapid development of IT field in recent years, high functionality and high added value such as high heat resistance, high refractive index, and improvement of fluorescence characteristics of novolak type phenol resin are eagerly desired. .
高機能化されたノボラック型フェノール樹脂としては、例えば、フルオレン骨格などの剛直な骨格を導入することで耐熱性を向上させた難燃性樹脂原料(特開2003−226727号公報参照)や、メチロール基を有するビスフェノールフルオレンを用いて効率良くフルオレン骨格を導入した耐熱性や耐エッチング性に優れた感光性樹脂原料(特開2008−273844号公報参照)、ビフェニル骨格、ナフタレン骨格、アントラセン骨格などを導入することで耐熱性や機械的強度を高めた熱硬化性樹脂成型材料(特開2009−286888号公報参照)、高い屈折率を有するビフェニル骨格を導入したクレゾールノボラックを母体として用いた光学特性に優れたエポキシ樹脂(特開2006−2139号公報)などが提案されている。 Examples of highly functional novolak-type phenol resins include flame retardant resin raw materials (see JP 2003-226727 A) that have improved heat resistance by introducing a rigid skeleton such as a fluorene skeleton, and methylol. Introducing a photosensitive resin material with excellent heat resistance and etching resistance (see Japanese Patent Application Laid-Open No. 2008-273844), a biphenyl skeleton, a naphthalene skeleton, an anthracene skeleton, etc. Excellent thermo-resin molding material with improved heat resistance and mechanical strength (see JP 2009-286888), excellent optical characteristics using cresol novolac with a biphenyl skeleton having a high refractive index as the base material An epoxy resin (Japanese Patent Laid-Open No. 2006-2139) has been proposed.
また、蛍光特性を有するフェノール−グリオキザールノボラック樹脂を、高密度多層プリント回路基板などに用いられる積層物の原料又は添加物として用い、その蛍光特性を積層品の品質検査である自動光学検査(AOI)に活用することも提案されている(特表2002−542389号公報参照)。 In addition, phenol-glyoxal novolak resin having fluorescent properties is used as a raw material or additive for laminates used for high-density multilayer printed circuit boards and the like, and automatic optical inspection (AOI) that is a quality inspection of laminated products. It has also been proposed to use this method (see Japanese Patent Publication No. 2002-542389).
上述のように、骨格に剛直な構造を導入することにより耐熱性等を改善したノボラック型フェノール樹脂などが、種々検討されているが、これらのノボラック型フェノール樹脂であっても、IT分野を始めとした多種の用途へ応用するに当たっての高耐熱性、高屈折率、蛍光特性等の各種機能性においては未だ改善の余地がある。 As described above, various types of novolac type phenol resins having improved heat resistance and the like by introducing a rigid structure into the skeleton have been studied. Even in the case of these novolac type phenol resins, the IT field has begun. There is still room for improvement in various functions such as high heat resistance, high refractive index, and fluorescence characteristics when applied to various applications.
本発明は、かかる事情を背景になされたものであり、高炭素密度、高耐熱性、高屈折率及び蛍光特性等の高い機能性を有し、多岐の技術分野での応用展開が可能なフェノール樹脂、これを含む硬化性組成物及び硬化物を提供することを目的とする。 The present invention has been made in view of such circumstances, and has high functionality such as high carbon density, high heat resistance, high refractive index, and fluorescent properties, and can be applied in various technical fields. It aims at providing resin, the curable composition containing this, and hardened | cured material.
上記課題を解決するためになされた発明は、
酸性触媒の存在下、架橋剤を用いてフェノール性水酸基を有する化合物を重合して得られるフェノール樹脂(ノボラック型フェノール樹脂)であって、
上記化合物が下記式(1)で表されることを特徴とする。
A phenol resin (novolak type phenol resin) obtained by polymerizing a compound having a phenolic hydroxyl group using a crosslinking agent in the presence of an acidic catalyst,
The compound is represented by the following formula (1).
当該フェノール樹脂は、アントラセン骨格を有するため、アントラセン特有の諸特性、例えば、高屈折率及び紫外線に対する蛍光性能等を備え、さらに架橋剤を任意選択することで光学的機能を調整することができる。また、当該フェノール樹脂は、ビスフェノールフルオレン等のビスフェノール系骨格を有するフェノール樹脂と比して、同等以上の屈折率、残炭率(高炭素密度)及びガラス転移温度(耐熱性)を有する。従って、当該フェノール樹脂によれば、高機能性を有する各種樹脂原料や、硬化剤等に用いることができる等の高い汎用性を発揮することができる。 Since the phenol resin has an anthracene skeleton, it has various characteristics peculiar to anthracene, such as a high refractive index and fluorescence performance with respect to ultraviolet rays, and the optical function can be adjusted by arbitrarily selecting a crosslinking agent. Further, the phenol resin has a refractive index, a residual carbon ratio (high carbon density), and a glass transition temperature (heat resistance) that are equal to or higher than those of a phenol resin having a bisphenol skeleton such as bisphenol fluorene. Therefore, according to the phenol resin, high versatility such as being able to be used for various resin raw materials having high functionality, curing agents and the like can be exhibited.
当該フェノール樹脂の重量平均分子量が800以上であり、かつ、屈折率が1.63以上であることが好ましい。当該フェノール樹脂が上記分子量及び屈折率を有することで、機能性をより高めることができる。 The phenol resin preferably has a weight average molecular weight of 800 or more and a refractive index of 1.63 or more. When the phenol resin has the molecular weight and the refractive index, the functionality can be further improved.
上記架橋剤がアルデヒド類、ジメチロール化合物類、アルケン類及びケトン類からなる群より選択される少なくとも1種であるとよい。これらの架橋剤を適宜選択することで、得られるフェノール樹脂の光学的機能等の調整を容易に行うことができる。 The cross-linking agent may be at least one selected from the group consisting of aldehydes, dimethylol compounds, alkenes, and ketones. By appropriately selecting these crosslinking agents, the optical function and the like of the obtained phenol resin can be easily adjusted.
上記架橋剤の中でも、アルデヒド類が好ましい。当該フェノール樹脂は、アルデヒド類を用いて重合することで、特に高い屈折率及び耐熱性等を発揮することができ、また効率よく製造することができる。 Among the crosslinking agents, aldehydes are preferable. The phenol resin can exhibit particularly high refractive index, heat resistance, and the like by being polymerized using aldehydes, and can be efficiently produced.
当該フェノール樹脂において、上記X及びYがヒドロキシフェニル基であるとよい。上記X及びYをヒドロキシフェニル基とすることで、当該フェノール樹脂は、特に高い屈折率及び耐熱性等を発揮することができる。 In the phenol resin, X and Y may be a hydroxyphenyl group. By making the said X and Y into a hydroxyphenyl group, the said phenol resin can exhibit especially a high refractive index, heat resistance, etc.
本発明の硬化性組成物は、当該フェノール樹脂を含む組成物である。当該硬化性組成物は、高い汎用性と付加価値とを有する樹脂原料組成物等として用いることができる。 The curable composition of the present invention is a composition containing the phenol resin. The curable composition can be used as a resin raw material composition having high versatility and added value.
本発明の硬化物は、上記硬化性組成物を硬化して得られる硬化物である。当該硬化物は、樹脂成分がアントラセン骨格を有することで、低架橋密度で高耐熱性が得られ、低膨張性、低吸収率、高屈折率、高融点、高残炭率、蛍光性能等の諸性能を備えることができ、多分野へ応用可能な硬化物として使用することができる。 The cured product of the present invention is a cured product obtained by curing the curable composition. The cured product has a low crosslink density and high heat resistance because the resin component has an anthracene skeleton, such as low expansion, low absorption rate, high refractive index, high melting point, high residual carbon rate, fluorescence performance, etc. It can have various performances and can be used as a cured product applicable to many fields.
以上説明したように、本発明のフェノール樹脂は、高い屈折率を有し、かつアントラセン特有の諸特性、例えば、高耐熱性、低膨張性、低吸収率、高炭素密度及び紫外線に対する蛍光性能等を備えることができる。さらに、当該フェノール樹脂は、アントラセン特有の諸特性を備えた上で、フェノール性水酸基を有するため、エポキシ樹脂等の各種樹脂原料、及び硬化剤等に用いることができる等の高い汎用性を発揮することができる。 As described above, the phenolic resin of the present invention has a high refractive index and various characteristics unique to anthracene, such as high heat resistance, low expansion, low absorption rate, high carbon density, and fluorescence performance with respect to ultraviolet rays. Can be provided. Furthermore, since the phenol resin has various characteristics peculiar to anthracene and has a phenolic hydroxyl group, it exhibits high versatility such as being usable for various resin raw materials such as epoxy resins and curing agents. be able to.
従って、本発明のフェノール樹脂、これを含む硬化性組成物及び硬化物は、材料の高機能化や新たな特性の付与に極めて効果的であり、高い汎用性と付加価値を有する樹脂原料、例えば、エポキシ樹脂原料、エポキシ樹脂硬化剤、ポリカーボネート樹脂原料、アクリル樹脂原料、積層材、塗料等のコーティング材料、レンズ、光学シート等の光学材料、ホログラム記録材料等の記録材料、有機感光体、フォトレジスト材料、反射防止膜、半導体封止材等の高機能材料、分子磁気メモリー等の磁性材料、有機太陽電池、有機EL素子等として多岐の技術分野での応用展開をはかることができる。 Therefore, the phenolic resin of the present invention, the curable composition containing the phenolic resin, and the cured product are extremely effective in enhancing the functionality of the material and imparting new characteristics, and have high versatility and added value, for example, Epoxy resin raw materials, epoxy resin curing agents, polycarbonate resin raw materials, acrylic resin raw materials, laminate materials, coating materials such as paints, optical materials such as lenses and optical sheets, recording materials such as hologram recording materials, organic photoreceptors, photoresists It can be applied in various technical fields as materials, anti-reflective films, highly functional materials such as semiconductor encapsulants, magnetic materials such as molecular magnetic memory, organic solar cells, and organic EL elements.
以下、本発明の実施形態を、フェノール樹脂、これを用いる硬化性組成物及び硬化物について順に詳説する。 Hereinafter, embodiments of the present invention will be described in detail with respect to a phenol resin, a curable composition using the phenol resin, and a cured product.
<フェノール樹脂>
本発明のフェノール樹脂は、酸性触媒の存在下、架橋剤を用いてフェノール性水酸基を有する化合物を重合して得られるフェノール樹脂(ノボラック型フェノール樹脂)であって、上記化合物が下記式(1)で表されることを特徴とする。当該フェノール樹脂は、主鎖にアントラセン骨格を有するため、一般的なフェノール類又はビスフェノール類とホルムアルデヒド等の架橋剤とを利用して縮合したノボラック型フェノール樹脂と比べ、単位構造当たりの炭素密度が高く、高耐熱性、高屈折率、紫外線に対する蛍光性能等を備えている。
<Phenolic resin>
The phenolic resin of the present invention is a phenolic resin (novolak type phenolic resin) obtained by polymerizing a compound having a phenolic hydroxyl group using a crosslinking agent in the presence of an acidic catalyst, wherein the compound is represented by the following formula (1): It is represented by. Since the phenol resin has an anthracene skeleton in the main chain, the carbon density per unit structure is higher than that of a novolac-type phenol resin condensed using a general phenol or bisphenol and a crosslinking agent such as formaldehyde. , High heat resistance, high refractive index, fluorescence performance against ultraviolet rays, etc.
(上記式(1)で表される化合物)
上記式(1)中のX及びYで表されるヒドロキシアリール基とは、少なくとも1つのヒドロキシル基を有し、その他の置換基を有してもよい芳香族炭化水素の芳香環から1つの水素を除いた置換基である。上記ヒドロキシアリール基の具体例としては、ヒドロキシフェニル基、ヒドロキシナフチル基、ジヒドロキシフェニル基、ジヒドロキシナフチル基等及びこれらの芳香環上の水素原子が、アルキル基、アルコキシ基、アリール基、アルケニル基、アミノ基、メルカプト基等の置換基へ置換されたものが挙げられる。なお、上記芳香環上の置換基は、複数であってもよいが、芳香環の反応性を維持するためには、芳香環上の水素原子が全ては置換されていないことが好ましい。
(Compound represented by the above formula (1))
The hydroxyaryl group represented by X and Y in the above formula (1) is at least one hydroxyl group and one hydrogen from an aromatic ring of an aromatic hydrocarbon which may have other substituents. It is a substituent excluding. Specific examples of the hydroxyaryl group include a hydroxyphenyl group, a hydroxynaphthyl group, a dihydroxyphenyl group, a dihydroxynaphthyl group and the like, and a hydrogen atom on these aromatic rings is an alkyl group, an alkoxy group, an aryl group, an alkenyl group, an amino group. And those substituted with a substituent such as a group or a mercapto group. In addition, although the substituent on the said aromatic ring may be plural, in order to maintain the reactivity of an aromatic ring, it is preferable that all the hydrogen atoms on an aromatic ring are not substituted.
上記アルキル基としては、直鎖状、分岐鎖状、単環状又は縮合多環状アルキル基等が挙げられる。これらのアルキル基の具体例としてはメチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ドデシル基、オクタデシル基、イソプロピル基、イソブチル基、イソペンチル基、sec−ブチル基、tert−ブチル基、sec−ペンチル基、tert−ペンチル基、tert−オクチル基、ネオペンチル基、シクロプロピル基、シクロブチル基、シクロペンチル基、シクロヘキシル基、アダマンチル基、ノルボルニル基、ボロニル基、4−デシルシクロヘキシル基等が挙げられる。 Examples of the alkyl group include linear, branched, monocyclic or condensed polycyclic alkyl groups. Specific examples of these alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, dodecyl, octadecyl, isopropyl and isobutyl. , Isopentyl group, sec-butyl group, tert-butyl group, sec-pentyl group, tert-pentyl group, tert-octyl group, neopentyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, adamantyl group, norbornyl group , Boronyl group, 4-decylcyclohexyl group and the like.
上記アルコキシ基としては、直鎖状、分岐鎖状、単環状又は縮合多環状アルコキシ基等が挙げられる。これらのアルコキシ基の具体例としてはメトキシ基、エトキシ基、プロポキシ基、ブトキシ基、ペンチルオキシ基、ヘキシルオキシ基、ヘプチルオキシ基、オクチルオキシ基、ノニルオキシ基、デシルオキシ基、ドデシルオキシ基、オクタデシルオキシ基、イソプロポキシ基、イソブトキシ基、イソペンチルオキシ基、sec−ブトキシ基、tert−ブトキシ基、sec−ペンチルオキシ基、tert−ペンチルオキシ基、te
rt−オクチルオキシ基、ネオペンチルオキシ基、シクロプロピルオキシ基、シクロブチルオキシ基、シクロペンチルオキシ基、シクロヘキシルオキシ基、アダマンチルオキシ基、ノルボルニルオキシ基、ボロニルオキシ基、4−デシルシクロヘキシルオキシ基等が挙げられる。
Examples of the alkoxy group include linear, branched, monocyclic or condensed polycyclic alkoxy groups. Specific examples of these alkoxy groups include methoxy, ethoxy, propoxy, butoxy, pentyloxy, hexyloxy, heptyloxy, octyloxy, nonyloxy, decyloxy, dodecyloxy, octadecyloxy , Isopropoxy group, isobutoxy group, isopentyloxy group, sec-butoxy group, tert-butoxy group, sec-pentyloxy group, tert-pentyloxy group, te
rt-octyloxy group, neopentyloxy group, cyclopropyloxy group, cyclobutyloxy group, cyclopentyloxy group, cyclohexyloxy group, adamantyloxy group, norbornyloxy group, boronyloxy group, 4-decylcyclohexyloxy group, etc. Can be mentioned.
上記アリール基としては、置換基を有していてもよい芳香環から1つの水素を除いた基が挙げられ、具体例としてはフェニル基、1−ナフチル基、2−ナフチル基、1−アンスリル基、9−アンスリル基、2−フェナントリル基、3−フェナントリル基、9−フェナントリル基、1−ピレニル基、5−ナフタセニル基、1−インデニル基、2−アズレニル基、1−アセナフチル基、2−フルオレニル基、9−フルオレニル基、3−ペリレニル基、o−トリル基、m−トリル基、p−トリル基、2,3−キシリル基、2,5−キシリル基、メシチル基、p−クメニル基、p−ドデシルフェニル基、o−メトキシフェニル基、m−メトキシフェニル基、p−メトキシフェニル基、2,6−ジメトキシフェニル基、3,4−ジメトキシフェニル基、3,4,5−トリメトキシフェニル基、p−シクロヘキシルフェニル基、4−ビフェニル基、o−フルオロフェニル基、m−クロロフェニル基、p−ブロモフェニル基、p−ヒドロキシフェニル基、m−カルボキシフェニル基、o−メルカプトフェニル基、p−シアノフェニル基、m−ニトロフェニル基、m−アジドフェニル基等を挙げることができる。 Examples of the aryl group include groups in which one hydrogen is removed from an aromatic ring which may have a substituent, and specific examples include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and a 1-anthryl group. , 9-anthryl group, 2-phenanthryl group, 3-phenanthryl group, 9-phenanthryl group, 1-pyrenyl group, 5-naphthacenyl group, 1-indenyl group, 2-azurenyl group, 1-acenaphthyl group, 2-fluorenyl group 9-fluorenyl group, 3-perylenyl group, o-tolyl group, m-tolyl group, p-tolyl group, 2,3-xylyl group, 2,5-xylyl group, mesityl group, p-cumenyl group, p- Dodecylphenyl group, o-methoxyphenyl group, m-methoxyphenyl group, p-methoxyphenyl group, 2,6-dimethoxyphenyl group, 3,4-dimethoxyphenyl group, , 4,5-trimethoxyphenyl group, p-cyclohexylphenyl group, 4-biphenyl group, o-fluorophenyl group, m-chlorophenyl group, p-bromophenyl group, p-hydroxyphenyl group, m-carboxyphenyl group, An o-mercaptophenyl group, a p-cyanophenyl group, an m-nitrophenyl group, an m-azidophenyl group, and the like can be given.
上記アルケニル基としては、直鎖状、分岐鎖状、単環状又は縮合多環状アルケニル基等が挙げられ、これらは構造中に複数の炭素−炭素二重結合を有していてもよく、具体例としては、ビニル基、1−プロペニル基、アリル基、2−ブテニル基、3−ブテル基、イソプロペニル基、イソブテニル基、1−ペンテニル基、2−ペンテニル基、3−ペンテニル基、4−ペンテニル基、1−ヘキセニル基、2−ヘキセニル基、3−ヘキセニル基、4−ヘキセニル基、5−ヘキセニル基、シクロペンテニル基、シクロヘキセニル基、1,3−ブタジエニル基、シクロヘキサジエニル基、シクロペンタジエニル基等が挙げられる。 Examples of the alkenyl group include straight chain, branched chain, monocyclic or condensed polycyclic alkenyl groups, and these may have a plurality of carbon-carbon double bonds in the structure. Specific examples As, vinyl group, 1-propenyl group, allyl group, 2-butenyl group, 3-butene group, isopropenyl group, isobutenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group 1-hexenyl group, 2-hexenyl group, 3-hexenyl group, 4-hexenyl group, 5-hexenyl group, cyclopentenyl group, cyclohexenyl group, 1,3-butadienyl group, cyclohexadienyl group, cyclopentadienyl group Groups and the like.
上記ヒドロキシアリール基として、上述のような置換基を有するヒドロキアリール基を備える化合物を用いたフェノール樹脂はアントラセン構造の有する特徴を維持したまま、さらに機能を付加又は調整することができる。 A phenol resin using a compound having a hydroxyaryl group having a substituent as described above as the hydroxyaryl group can further add or adjust the function while maintaining the characteristics of the anthracene structure.
このヒドロキシアリール基の中でも、高屈折性、高耐熱性、高炭素密度、剛直性等の点及び架橋剤との反応性の観点からヒドロキシフェニル基及びヒドロキシナフチル基が好ましく、ヒドロキシフェニル基がより好ましく、アントラセン骨格側との結合手に対してパラ位にヒドロキシル基を有するヒドロキシフェニル基が最も好ましい。 Among these hydroxyaryl groups, hydroxyphenyl group and hydroxynaphthyl group are preferable, and hydroxyphenyl group is more preferable from the viewpoint of high refractive property, high heat resistance, high carbon density, rigidity, and reactivity with a crosslinking agent. A hydroxyphenyl group having a hydroxyl group at the para position relative to the bond with the anthracene skeleton side is most preferable.
なお、XとYとは、異なっていてもよいが、高光屈折性、製造の容易さ等の点から、同一であることが好ましい。 X and Y may be different from each other, but are preferably the same from the viewpoint of high photorefractive property, ease of production, and the like.
(上記式(1)で表される化合物の製造方法)
上記化合物は、非反応性含酸素有機溶媒及び酸触媒の存在下にて、フェノール類とアントラセン−9−カルボアルデヒドとを反応させる工程を有する方法により製造される。
(Method for producing compound represented by the above formula (1))
The said compound is manufactured by the method which has the process of making phenols and anthracene-9-carbaldehyde react in presence of a non-reactive oxygen-containing organic solvent and an acid catalyst.
上記フェノール類とは芳香環上にヒドロキシ基を有する化合物をいい、フェノール系化合物、ナフトール系化合物等がある。フェノール系化合物とは、フェノール及び芳香環上の水素が他の置換基に置換されたフェノールをいう。この置換基としては、アルキル基やヒドロキシ基等が挙げられる。この置換基の数としては、アントラセン−9−カルボアルデヒドとの反応性から、4以下が好ましく、2以下が更に好ましく、0が特に好ましい。また、アントラセン−9−カルボアルデヒドとの反応性から、ヒドロキシ基のパラ位に置換基が配置されていないことが好ましい。 The above phenols refer to compounds having a hydroxy group on the aromatic ring, such as phenolic compounds and naphtholic compounds. The phenolic compound refers to phenol in which hydrogen on the aromatic ring is substituted with other substituents. Examples of this substituent include an alkyl group and a hydroxy group. The number of substituents is preferably 4 or less, more preferably 2 or less, and particularly preferably 0, from the reactivity with anthracene-9-carbaldehyde. Moreover, it is preferable that the substituent is not arrange | positioned at the para position of a hydroxy group from the reactivity with anthracene-9-carbaldehyde.
フェノール系化合物としては例えば、フェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、2,6−キシレノール、3,4−キシレノール、3,5−キシレノール、2,3,5−トリメチルフェノール、2,3,6−トリメチルフェノール、2−エチルフェノール、4−エチルフェノール、2−イソプロピルフェノール、4−イソプロピルフェノール、2−tert−ブチルフェノール、4−tert−ブチルフェノール、2−シクロヘキシルフェノール、4−シクロヘキシルフェノール、2−フェニルフェノール、4−フェニルフェノール、チモール、2−tert−ブチル−5−メチルフェノール、2−シクロヘキシル−5−メチルフェノール、レゾルシン、2−メチルレゾルシン、カテコール、4−メチルカテコール、ハイドロキノン、ピロガロール等が挙げられる。 Examples of phenolic compounds include phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, and 3,4-xylenol. 3,5-xylenol, 2,3,5-trimethylphenol, 2,3,6-trimethylphenol, 2-ethylphenol, 4-ethylphenol, 2-isopropylphenol, 4-isopropylphenol, 2-tert-butylphenol 4-tert-butylphenol, 2-cyclohexylphenol, 4-cyclohexylphenol, 2-phenylphenol, 4-phenylphenol, thymol, 2-tert-butyl-5-methylphenol, 2-cyclohexyl-5-methylphenol, reso Shin, 2-methyl resorcinol, catechol, 4-methyl catechol, hydroquinone, pyrogallol.
ナフトール系化合物とは、ナフトール及び芳香環上の水素が他の置換基に置換されたナフトールをいう。この置換基としては、アルキル基やヒドロキシ基等が挙げられる。この置換基の数としては、アントラセン−9−カルボアルデヒドとの反応性の点から、6以下が好ましく、2以下が更に好ましく、0が特に好ましい。 A naphthol compound refers to naphthol in which naphthol and hydrogen on an aromatic ring are substituted with other substituents. Examples of this substituent include an alkyl group and a hydroxy group. The number of substituents is preferably 6 or less, more preferably 2 or less, and particularly preferably 0 from the viewpoint of reactivity with anthracene-9-carbaldehyde.
ナフトール系化合物としては、1−ナフトール、2−ナフトール、1,4−ジヒドロキシナフタレン、1,5−ジヒドロキシナフタレン、1,6−ジヒドロキシナフタレン、2,3−ジヒドロキシナフタレン、2,6−ジヒドロキシナフタレン、2,7−ジヒドロキシナフタレン等が挙げられる。 Examples of naphthol compounds include 1-naphthol, 2-naphthol, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2 , 7-dihydroxynaphthalene and the like.
上記フェノール類は、特にこれらに限定されるものではなく、所望する上記化合物の構造に応じて適宜選択される。例えば、上記フェノール類としてフェノールを選択することで、上記式(1)におけるX及びYがヒドロキシフェニル基である化合物を製造することができる。なお、これらは単独又は2種以上を組み合わせて用いてもよい。 The phenols are not particularly limited, and are appropriately selected according to the desired structure of the compound. For example, a compound in which X and Y in the above formula (1) are hydroxyphenyl groups can be produced by selecting phenol as the phenol. In addition, you may use these individually or in combination of 2 or more types.
また、このフェノール類の配合量の下限としては、アントラセン−9−カルボアルデヒド1モルに対し2モルが好ましく、4モルがさらに好ましい。このフェノール類の配合量の上限としては、アントラセン−9−カルボアルデヒド1モルに対し100モルが好ましく、50モルがさらに好ましく、20モルが特に好ましい。フェノール類の配合量が上記下限未満では、原料の高次縮合物が生成する為精製に多大なエネルギーを要し、逆に上記上限を超えると未反応のフェノール類を除去するのに多大なエネルギーを要する為、共に非経済的である。 Moreover, as a minimum of the compounding quantity of this phenol, 2 mol is preferable with respect to 1 mol of anthracene-9-carbaldehyde, and 4 mol is more preferable. The upper limit of the amount of the phenols is preferably 100 mol, more preferably 50 mol, and particularly preferably 20 mol with respect to 1 mol of anthracene-9-carbaldehyde. If the blending amount of phenols is less than the above lower limit, a large amount of energy is required for purification because a higher-order condensate of the raw material is formed. Conversely, if the upper limit is exceeded, enormous energy is required to remove unreacted phenols. Both are uneconomical.
本製造方法においては、反応溶媒として、分子中に1以上の酸素原子を備える非反応性含酸素有機溶媒を用いる。なお「非反応性」とは、この反応系におけるフェノール類、アントラセン−9−カルボアルデヒド及び合成されるアントラセン誘導体とは反応しないことをいう。上記非反応含酸素有機溶媒としては、例えばアルコール類、多価アルコール系エーテル、環状エーテル類、多価アルコール系エステル、ケトン類、エステル類、スルホキシド類、カルボン酸類等を用いることができる。 In this production method, a non-reactive oxygen-containing organic solvent having one or more oxygen atoms in the molecule is used as the reaction solvent. The term “non-reactive” means that it does not react with phenols, anthracene-9-carbaldehyde and synthesized anthracene derivatives in this reaction system. Examples of the non-reactive oxygen-containing organic solvent include alcohols, polyhydric alcohol ethers, cyclic ethers, polyhydric alcohol esters, ketones, esters, sulfoxides, carboxylic acids, and the like.
アルコール類としては、例えば、メタノール、エタノール、プロパノール、ブタノール等の一価アルコール、ブタンジオール、ペンタンジオール、ヘキサンジオール、エチレングリコール、プロピレングリコール、トリメチレングリコール、ジエチレングリコール、ジプロピレングリコール、トリエチレングリコール、トリプロピレングリコール、ポリエチレングリコール等の二価アルコール、グリセリン等の三価アルコールが挙げられる。 Examples of alcohols include monohydric alcohols such as methanol, ethanol, propanol, and butanol, butanediol, pentanediol, hexanediol, ethylene glycol, propylene glycol, trimethylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, Examples thereof include dihydric alcohols such as propylene glycol and polyethylene glycol, and trihydric alcohols such as glycerin.
多価アルコール系エーテルとしては、例えばエチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノブチルエーテル、エチレングリコールモノペンチルエーテル、エチレングリコールジメチルエーテル、エチレングリコールエチルメチルエーテル、エチレングリコールモノフェニルエーテル等のグリコールエーテル類が挙げられる。 Examples of the polyhydric alcohol ether include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monopentyl ether, ethylene glycol dimethyl ether, ethylene glycol ethyl methyl ether, ethylene glycol mono Examples include glycol ethers such as phenyl ether.
環状エーテル類としては、例えば、1,3−ジオキサン、1,4−ジオキサン、テトラヒドロフラン等が挙げられる。多価アルコール系エステルとしては、例えば、エチレングリコールアセテート等のグリコールエステル類が挙げられる。ケトン類としては、例えばアセトン、メチルエチルケトン、メチルエチルケトンなどが挙げられる。エステル類としては、例えば、酢酸エチル、酢酸プロピル、酢酸ブチル等が挙げられる。スルホキシド類としては、例えば、ジメチルスルホキシド、ジエチルスルホキシド等が挙げられる。カルボン酸類としては、例えば、酢酸、無水酢酸等が挙げられる。 Examples of cyclic ethers include 1,3-dioxane, 1,4-dioxane, tetrahydrofuran and the like. Examples of the polyhydric alcohol ester include glycol esters such as ethylene glycol acetate. Examples of ketones include acetone, methyl ethyl ketone, and methyl ethyl ketone. Examples of the esters include ethyl acetate, propyl acetate, butyl acetate and the like. Examples of the sulfoxides include dimethyl sulfoxide and diethyl sulfoxide. Examples of carboxylic acids include acetic acid and acetic anhydride.
これらの中でもアルコール類及び多価アルコール系エーテルが好ましく、メタノール、エチレングリコール及びエチレングリコールモノメチルエーテルが特に好ましい。 Among these, alcohols and polyhydric alcohol ethers are preferable, and methanol, ethylene glycol, and ethylene glycol monomethyl ether are particularly preferable.
非反応性含酸素有機溶媒は、上記の例示に限定されず、また、それぞれを単独又は2種以上を混合して用いても良い。非反応性含酸素有機溶媒の配合量の下限としては、フェノール類100質量部に対して、1質量部が好ましく、5質量部が更に好ましく、10質量部が特に好ましい。また、非反応性含酸素有機溶媒の配合量の上限としては、フェノール類100質量部に対して、1,000質量部が好ましく、500質量部が更に好ましく、10質量部が特に好ましい。非反応性含酸素有機溶媒の配合量が上記下限未満であると、反応副生物の生成が顕著となり、生産性が低下するおそれがある。逆に、非反応性含酸素有機溶媒の配合量が上記上限を超えると、反応速度が低下し、生産性が低下するおそれがある。 The non-reactive oxygen-containing organic solvent is not limited to the above examples, and each may be used alone or in admixture of two or more. The lower limit of the amount of the non-reactive oxygen-containing organic solvent is preferably 1 part by mass, more preferably 5 parts by mass, and particularly preferably 10 parts by mass with respect to 100 parts by mass of the phenols. Moreover, as an upper limit of the compounding quantity of a non-reactive oxygen-containing organic solvent, 1,000 mass parts is preferable with respect to 100 mass parts of phenols, 500 mass parts is further more preferable, and 10 mass parts is especially preferable. When the blending amount of the non-reactive oxygen-containing organic solvent is less than the above lower limit, the production of reaction by-products becomes remarkable, and the productivity may be reduced. On the other hand, when the blending amount of the non-reactive oxygen-containing organic solvent exceeds the above upper limit, the reaction rate is lowered and the productivity may be lowered.
上記化合物の製造に用いられる酸触媒としては、塩酸、硫酸、リン酸、過塩素酸などの無機酸、蓚酸、パラトルエンスルホン酸、メタンスルホン酸、フェノールスルホン酸などの有機酸、強酸性イオン交換樹脂等の樹脂酸などの強酸を挙げることができる。これらの触媒は、単独で用いても良いし、2種以上を組み合わせて用いてもよく、また、メルカプト酢酸等の反応助触媒を併用しても良い。酸触媒の使用量としては、反応が過激で危険とならない範囲でかつ反応促進のため、少なすぎない量を設定すればよいが、一般的には、フェノール類の質量に対して、0.1〜20質量%である。 Acid catalysts used in the production of the above compounds include inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid and perchloric acid, organic acids such as oxalic acid, paratoluenesulfonic acid, methanesulfonic acid and phenolsulfonic acid, and strong acidic ion exchange Examples include strong acids such as resin acids such as resins. These catalysts may be used alone, or may be used in combination of two or more kinds, or a reaction promoter such as mercaptoacetic acid may be used in combination. The amount of the acid catalyst used may be set in an amount that does not cause the reaction to be radical and dangerous and is not too small for the purpose of promoting the reaction. ˜20 mass%.
上記化合物の製造は、上記フェノール類、アントラセン−9−カルボアルデヒド、非反応性含酸素有機溶媒及び酸触媒を反応容器に投入して、所定時間撹拌して行われる。なお、上記反応容器への投入物の投入順序は問わない。 The above compound is produced by adding the above phenols, anthracene-9-carbaldehyde, a non-reactive oxygen-containing organic solvent and an acid catalyst to a reaction vessel and stirring for a predetermined time. In addition, the order of the input of the input material into the reaction vessel is not limited.
この製造方法の反応工程における反応温度は、通常0〜100℃、好ましくは、25〜60℃の範囲で行われる。反応温度が低すぎると、反応時間が長くなる可能性があり、一方、反応温度が高すぎると、高次縮合物及び異性体等の反応副生物の生成が助長され、上記化合物の純度が低下する可能性がある。 The reaction temperature in the reaction step of this production method is usually 0 to 100 ° C., preferably 25 to 60 ° C. If the reaction temperature is too low, the reaction time may be longer. On the other hand, if the reaction temperature is too high, the formation of reaction by-products such as higher-order condensates and isomers is promoted, and the purity of the above compound is reduced. there's a possibility that.
この製造方法の反応工程における反応容器内の圧力は、通常は常圧であるが、加圧又は減圧で行っても良く、具体的には内部圧力(ゲージ圧)が−0.02〜0.2MPaの範囲であることが好ましい。 The pressure in the reaction vessel in the reaction step of this production method is usually normal pressure, but may be increased or reduced pressure. Specifically, the internal pressure (gauge pressure) is -0.02 to 0.00. The range is preferably 2 MPa.
この製造方法の反応工程における反応時間は、用いるフェノール類、非反応性含酸素有機溶媒の種類と量、モル比、反応温度、圧力等に左右され、一概に定めることは出来ないが一般的には、1〜48時間の範囲であることが好ましい。 The reaction time in the reaction process of this production method depends on the phenols used, the type and amount of the non-reactive oxygen-containing organic solvent, the molar ratio, the reaction temperature, the pressure, etc. Is preferably in the range of 1 to 48 hours.
この製造方法の反応終了後、酸触媒の除去を行う。この触媒除去の方法としては、一般的には、メチルエチルケトン、メチルイソブチルケトン等の非水溶性有機溶媒に生成物を溶解し、水洗により除去を行うが、その他中和処理を行った後析出した中和塩を濾別する方法や、イオン交換樹脂等の樹脂酸を直接濾別除去する方法、アニオン製充填剤の詰まったカラムに反応液を通過させる方法等、特に制限はない。 After completion of the reaction of this production method, the acid catalyst is removed. As a method for removing the catalyst, generally, the product is dissolved in a water-insoluble organic solvent such as methyl ethyl ketone and methyl isobutyl ketone, and is removed by washing with water. There are no particular restrictions, such as a method of filtering out a salt, a method of directly removing a resin acid such as an ion exchange resin, or a method of passing a reaction solution through a column packed with an anionic packing material.
この製造方法においては触媒除去後、精製により上記化合物を取り出す。一般的には、目的物に対して貧溶媒として作用し、その他の副生成物や未反応原料には良溶媒として作用する有機溶媒を添加し、析出させた後濾別、乾燥する方法によって目的物である上記化合物を得ることができる。 In this production method, after removing the catalyst, the compound is removed by purification. In general, an organic solvent that acts as a poor solvent for the target product, and acts as a good solvent for other by-products and unreacted raw materials, is precipitated, filtered, and dried. The above compound which is a product can be obtained.
(架橋剤)
当該フェノール樹脂の重合用いられる架橋剤としては、特に限定されず、例えばアルデヒド類、ジメチロール化合物(2つ以上のメチロール基を有する化合物)類、アルケン類、ケトン類等を適宜用いることができる。なお、得られるフェノール樹脂の屈折率、耐熱性、分子量を重視する場合はアルデヒド類及びジメチロール化合物類が好ましく、250nm以下の短波長域の光透過率を重視する場合はアルケン類が好ましく、炭素密度(残炭率)を重視する場合はケトン類が好ましい。
(Crosslinking agent)
The crosslinking agent used for polymerization of the phenol resin is not particularly limited, and for example, aldehydes, dimethylol compounds (compounds having two or more methylol groups), alkenes, ketones and the like can be appropriately used. In addition, aldehydes and dimethylol compounds are preferred when importance is attached to the refractive index, heat resistance, and molecular weight of the obtained phenol resin, and alkenes are preferred when importance is attached to light transmittance in a short wavelength region of 250 nm or less. Ketones are preferred when emphasizing (remaining carbon ratio).
上記アルデヒド類としては、ホルムアルデヒド、ホルマリン、パラホルムアルデヒド、トリオキサン、アセトアルデヒド、パラアルデヒド、プロピオンアルデヒド、パラプロピオンアルデヒド、サリチルアルデヒド、ベンズアルデヒド、ナフタレンアルデヒド、アントラセンアルデヒド、ビス(3−ホルミル−4−ヒドロキシフェニル)メタン、ビス(4−ヒドロキシ−2,5−ジメチルフェニル)ホルミルメタン、α,α−ビス(4−ヒドロキシ−2,5−ジメチルフェニル)−4−ホルミルトルエン、α,α−ビス(4,5−ジヒドロキシ−2−メチルフェニル)−4−ホルミルトルエン等が挙げられる。これらの中でも、高分子量のフェノール樹脂を得ることができるホルムアルデヒド、ホルマリン及びパラホルムアルデヒドが好ましい。 Examples of the aldehydes include formaldehyde, formalin, paraformaldehyde, trioxane, acetaldehyde, paraaldehyde, propionaldehyde, parapropionaldehyde, salicylaldehyde, benzaldehyde, naphthalene aldehyde, anthracene aldehyde, bis (3-formyl-4-hydroxyphenyl) methane. Bis (4-hydroxy-2,5-dimethylphenyl) formylmethane, α, α-bis (4-hydroxy-2,5-dimethylphenyl) -4-formyltoluene, α, α-bis (4,5- And dihydroxy-2-methylphenyl) -4-formyltoluene. Among these, formaldehyde, formalin and paraformaldehyde which can obtain a high molecular weight phenol resin are preferable.
上記ジメチロール化合物類としては、2,6−ジヒドロキシメチル−4−メチルフェノール、2,4−ジヒドロキシメチル−6−メチルフェノール、2,6−ジヒドロキシメチル−3,4−ジメチルフェノール、4,6−ジヒドロキシメチル−2,3−ジメチルフェノール、4−tert−ブチル−2,6−ジヒドロキシメチルフェノール、4−シクロヘキシル−2,6−ジヒドロキシメチルフェノール、2−シクロヘキシル−4,6−ジヒドロキシメチルフェノール、2,6−ジヒドロキシメチル−4−エチルフェノール、4,6−ジヒドロキシメチル−2−エチルフェノール、4,6−ジヒドロキシメチル−2−イソプロピルフェノール、6−シクロヘキシル−2,4−ジヒドロキシメチル−3−メチルフェノール、ビス(2−ヒドロキシ−3−ヒドロキシメチル−5−メチルフェニル)メタン、ビス(4−ヒドロキシ−3−ヒドロキシメチル−5−メチルフェニル)メタン、ビス(4−ヒドロキシ−3−ヒドロキシメチル−2,5−ジメチルフェニル)メタン、ビス(4−ヒドロキシ−5−ヒドロキシメチル−2,3−ジメチルフェニル)メタン、ビス(2−ヒドロキシ−3−ヒドロキシメチル−4,5−ジメチルフェニル)メタン、2,2−ビス(4−ヒドロキシ−3,5−ジヒドロキシメチルフェニル)プロパン等が挙げられる。また、このジメチロール化合物の市販品としては、旭有機材工業株式会社製のTM−BIP−A(ビスフェノールAのテトラメチロール体)等を挙げることができる。 Examples of the dimethylol compounds include 2,6-dihydroxymethyl-4-methylphenol, 2,4-dihydroxymethyl-6-methylphenol, 2,6-dihydroxymethyl-3,4-dimethylphenol, 4,6-dihydroxy. Methyl-2,3-dimethylphenol, 4-tert-butyl-2,6-dihydroxymethylphenol, 4-cyclohexyl-2,6-dihydroxymethylphenol, 2-cyclohexyl-4,6-dihydroxymethylphenol, 2,6 -Dihydroxymethyl-4-ethylphenol, 4,6-dihydroxymethyl-2-ethylphenol, 4,6-dihydroxymethyl-2-isopropylphenol, 6-cyclohexyl-2,4-dihydroxymethyl-3-methylphenol, bis (2-hydroxy -3-hydroxymethyl-5-methylphenyl) methane, bis (4-hydroxy-3-hydroxymethyl-5-methylphenyl) methane, bis (4-hydroxy-3-hydroxymethyl-2,5-dimethylphenyl) methane Bis (4-hydroxy-5-hydroxymethyl-2,3-dimethylphenyl) methane, bis (2-hydroxy-3-hydroxymethyl-4,5-dimethylphenyl) methane, 2,2-bis (4-hydroxy) -3,5-dihydroxymethylphenyl) propane and the like. Moreover, as a commercial item of this dimethylol compound, Asahi Organic Materials Co., Ltd. TM-BIP-A (tetramethylol body of bisphenol A) etc. can be mentioned.
上記アルケン類としては、エチレン、プロピレン、ブテン、ペンテン、シクロプロパン、シクロブテン、シクロペンテン、シクロヘキセン、シクロヘプテン、1,3−シクロヘキサジエン、1,4−シクロヘキサジエン、1,5−シクロオクタジエン、シクロペンタジエン、ジシクロペンタジエン等が挙げられる。これらの中でも2つの二重結合を持つため反応性が高く、フェノール樹脂を効率よく製造することができる1,3−シクロヘキサジエン、1,4−シクロヘキサジエン、1,5−シクロオクタジエン及びシクロペンタジエン、ジシクロペンタジエンが好ましい。 Examples of the alkenes include ethylene, propylene, butene, pentene, cyclopropane, cyclobutene, cyclopentene, cyclohexene, cycloheptene, 1,3-cyclohexadiene, 1,4-cyclohexadiene, 1,5-cyclooctadiene, cyclopentadiene, And dicyclopentadiene. Among them, 1,3-cyclohexadiene, 1,4-cyclohexadiene, 1,5-cyclooctadiene, and cyclopentadiene are highly reactive because they have two double bonds, and can efficiently produce a phenol resin. Dicyclopentadiene is preferred.
上記ケトン類としては、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジエチルケトン、シクロヘキサノン、アダマンタノン、フルオレノン、アセトフェノン、プロピオフェノン、ブチロフェノン、バレロフェノン等が挙げられる。これらの中でもフルオレノンを用いると炭素密度の高いフェノール樹脂を得ることができるため好ましい。 Examples of the ketones include acetone, methyl ethyl ketone, methyl isobutyl ketone, diethyl ketone, cyclohexanone, adamantanone, fluorenone, acetophenone, propiophenone, butyrophenone, valerophenone, and the like. Among these, fluorenone is preferable because a phenol resin having a high carbon density can be obtained.
これらの架橋剤はいずれも例示に限定はされず、また、屈折率や透過率といった光学性能を調整するため、それぞれ、単独で又は2種以上を併用して用いても良い。 Any of these cross-linking agents is not limited to examples, and may be used alone or in combination of two or more in order to adjust optical performance such as refractive index and transmittance.
上記化合物に対する架橋剤の使用割合としては、上記化合物1モルに対して通常、架橋剤を0.05モル以上1.00モル未満の範囲で配合して用いられ、好ましくは0.10モル以上0.90モル未満、より好ましくは0.30モル以上0.80モル未満である。 The use ratio of the crosslinking agent relative to the above compound is usually used by blending the crosslinking agent in the range of 0.05 mol or more and less than 1.00 mol, preferably 0.10 mol or more and 0 mol per 1 mol of the compound. Less than 90 mol, more preferably 0.30 mol or more and less than 0.80 mol.
(酸触媒)
当該フェノール樹脂の重合の際に用いられる上記酸触媒は、特に限定されず、公知のものを用いることができる。上記酸性触媒としては、例えば塩酸、硝酸、硫酸、ギ酸、シュウ酸、酢酸、メタンスルホン酸、パラトルエンスルホン酸、トリフルオロメタンスルホン酸などを挙げることができる。これらの酸触媒は、単独で用いても良いし、2種以上を組み合わせて用いてもよい。酸触媒の使用量としては、反応が過激で危険とならない範囲でかつ反応促進のため、少なすぎない量を設定すればよいが、一般的には、フェノール樹脂の質量に対して、0.1〜50質量%である。
(Acid catalyst)
The acid catalyst used in the polymerization of the phenol resin is not particularly limited, and a known one can be used. Examples of the acidic catalyst include hydrochloric acid, nitric acid, sulfuric acid, formic acid, oxalic acid, acetic acid, methanesulfonic acid, paratoluenesulfonic acid, trifluoromethanesulfonic acid, and the like. These acid catalysts may be used alone or in combination of two or more. The amount of the acid catalyst used may be set in an amount that does not cause the reaction to be extreme and dangerous and is not too small for the purpose of promoting the reaction. -50 mass%.
(反応条件)
当該フェノール樹脂を得る重合の際の反応条件は例えば、以下のとおりである。なお、この反応は、通常、溶媒中で行われる。
(Reaction conditions)
The reaction conditions in the polymerization for obtaining the phenol resin are, for example, as follows. In addition, this reaction is normally performed in a solvent.
反応温度は、反応物の種類や配合比、溶媒の種類や量、酸触媒の種類や量及びその他の反応要件を考慮して決定されるが、一般的には40〜200℃の範囲であり、好ましくは50〜180℃である。更に好ましくは、架橋剤としてアルデヒド類又はジメチロール化合物類を用いた場合は50〜120℃であり、アルケン類又はケトン類を用いた場合は140〜180℃である。 The reaction temperature is determined in consideration of the type and mixing ratio of the reactants, the type and amount of the solvent, the type and amount of the acid catalyst, and other reaction requirements, but is generally in the range of 40 to 200 ° C. The temperature is preferably 50 to 180 ° C. More preferably, the temperature is 50 to 120 ° C. when aldehydes or dimethylol compounds are used as the crosslinking agent, and 140 to 180 ° C. when alkenes or ketones are used.
反応時間は、上記反応温度や反応要件に応じて適宜調整すればよいが一般的には1〜30時間程度である。また、反応環境としては常圧が好適であるが、加圧下または減圧下で反応を行ってもよい。 The reaction time may be appropriately adjusted according to the reaction temperature and reaction requirements, but is generally about 1 to 30 hours. The reaction environment is preferably normal pressure, but the reaction may be performed under pressure or under reduced pressure.
溶媒としては、上記式(1)で表される化合物を溶かす溶媒であればよく、アルコール類、エーテル類、多価アルコール系エーテル、環状エーテル類、ラクトンなどが挙げられる。これらは、上記化合物の製造方法で用いられる溶媒として上述したものを具体的に例示することができる。 The solvent may be any solvent that dissolves the compound represented by the above formula (1), and examples thereof include alcohols, ethers, polyhydric alcohol ethers, cyclic ethers, and lactones. These can specifically illustrate those described above as the solvent used in the method for producing the compound.
上記溶媒としては、後工程で溶媒の除去を水洗で行なうことができる水溶性の溶媒が好ましく、このような水溶性溶媒としては例えば、1,4−ジオキサン、1,4−ラクトンなどが挙げられる。 The solvent is preferably a water-soluble solvent that can be removed by washing with water in a later step. Examples of such a water-soluble solvent include 1,4-dioxane and 1,4-lactone. .
(フェノール樹脂の物性等)
当該フェノール樹脂の重量平均分子量としては特に限定されないが、800以上が好ましく、1,000以上30,000以下がさらに好ましい。重量平均分子量を上記範囲とすることで、低膨張性や、耐熱性等の機能をより効果的に発揮させることができる。
(Physical properties of phenol resin, etc.)
Although it does not specifically limit as a weight average molecular weight of the said phenol resin, 800 or more are preferable and 1,000 or more and 30,000 or less are more preferable. By setting the weight average molecular weight within the above range, functions such as low expansion and heat resistance can be exhibited more effectively.
当該フェノール樹脂は、上記式(1)で表される化合物から得られることで高い屈折率、耐熱性(ガラス転移温度)及び炭素密度を備え、また、蛍光特性を有する。例えば当該フェノール樹脂の屈折率としては、1.63以上1.70以下程度である。また、当該フェノール樹脂のガラス転移温度としては、100℃以上200℃以下程度である。また、当該フェノール樹脂は、高炭素密度を有し、当該フェノール樹脂の残炭率としては20%以上50%以下程度である。 The phenol resin is obtained from the compound represented by the above formula (1), has a high refractive index, heat resistance (glass transition temperature) and carbon density, and has fluorescence characteristics. For example, the refractive index of the phenol resin is about 1.63 or more and 1.70 or less. Moreover, as a glass transition temperature of the said phenol resin, they are about 100 degreeC or more and 200 degrees C or less. Moreover, the phenol resin has a high carbon density, and the residual carbon ratio of the phenol resin is about 20% to 50%.
当該フェノール樹脂は、上記構造を有する化合物から得られるため、直接又は反応中間体として多用途に用いられ、例えば、ノボラック型エポキシ樹脂原料、アクリル樹脂原料、ポリカーボネート樹脂原料等の各種合成樹脂原料等として用いることができる。また、合成樹脂原料以外にも、光学的特性を活かし、例えばフォトレジスト用ノボラック樹脂や、蛍光塗料としても用いることができる。 Since the phenol resin is obtained from a compound having the above structure, it is used for various purposes, directly or as a reaction intermediate, for example, as various synthetic resin raw materials such as novolac type epoxy resin raw materials, acrylic resin raw materials, polycarbonate resin raw materials, etc. Can be used. In addition to the synthetic resin raw material, it can be used as a novolak resin for a photoresist or a fluorescent paint by utilizing optical characteristics.
<硬化性組成物>
当該硬化性組成物は、本発明のフェノール樹脂を含むものである。この硬化性組成物としては、例えば、当該フェノール樹脂を含むノボラック型フェノール樹脂及び硬化剤を含有し、さらにその他の任意成分を含んでいる組成物が挙げられる。この硬化性組成物の調製の方法としては、特に限定されず、例えばノボラック型フェノール樹脂と硬化剤とを溶融混合や粉砕混合をしてもよいし、溶媒の存在下に溶解混合してもよい。また、当該硬化性組成物において、本発明のフェノール樹脂が他の主成分を硬化させる硬化剤として含有されていてもよい。
<Curable composition>
The said curable composition contains the phenol resin of this invention. As this curable composition, the composition containing the novolak-type phenol resin containing the said phenol resin and a hardening | curing agent, and also containing the other arbitrary component is mentioned, for example. The method for preparing the curable composition is not particularly limited. For example, the novolac type phenol resin and the curing agent may be melt-mixed or pulverized, or may be dissolved and mixed in the presence of a solvent. . Moreover, in the said curable composition, the phenol resin of this invention may contain as a hardening | curing agent which hardens another main component.
上記ノボラック型フェノール樹脂としては、本発明のフェノールノボラック樹脂の他、アントラセン構造を含まないフェノールノボラック樹脂、クレゾールノボラック樹脂、キシレノールノボラック樹脂等を挙げることができ、これらの樹脂の構造としては、ランダムノボラック型でもハイオルソノボラック型でも用いることができる。なお、ノボラック型フェノール樹脂が有するフェノール性水酸基の一部がグリシジルエーテル化されていても構わない。 Examples of the novolak-type phenol resin include the phenol novolak resin of the present invention, a phenol novolak resin not containing an anthracene structure, a cresol novolak resin, a xylenol novolak resin, and the like. The structure of these resins includes a random novolak. Both types and high ortho novolak types can be used. In addition, a part of phenolic hydroxyl group which novolak-type phenol resin has may be glycidyl etherified.
上記硬化剤としては、メチロール化合物、ヘキサミン等を挙げることができる。上記メチロール化合物としては、2,6−ジメチロール−p−クレゾール等のモノマーのジメチロール化合物、ビス(4−ヒドロキシ−3−ヒドロキシメチル−5−メチルフェニル)メタン等のダイマーのジメチロール化合物、2,2−ビス(4−ヒドロキシ−3,5−ジヒドロキシメチルフェニル)プロパン等のテトラメチロール化合物等が挙げられる。 Examples of the curing agent include methylol compounds and hexamine. Examples of the methylol compound include monomeric dimethylol compounds such as 2,6-dimethylol-p-cresol, dimer dimethylol compounds such as bis (4-hydroxy-3-hydroxymethyl-5-methylphenyl) methane, and 2,2- And tetramethylol compounds such as bis (4-hydroxy-3,5-dihydroxymethylphenyl) propane.
当該硬化性組成物における他の成分としては、従来フェノール樹脂の硬化物等を製造する際に使用される公知のものが挙げられる。この他の成分としては、溶媒、無機充填剤、顔料、揺変性付与剤、流動性向上剤、他のモノマー等を挙げることができる。 As another component in the said curable composition, the well-known thing used when manufacturing the hardened | cured material etc. of a phenol resin conventionally is mentioned. Examples of other components include a solvent, an inorganic filler, a pigment, a thixotropic agent, a fluidity improver, and other monomers.
上記溶媒としては、組成物構成によって異なるが、例えば、エーテル類、ジエチレングリコールアルキルエーテル類、エチレングリコールアルキルエーテルアセテート類、プロピレングリコールモノアルキルエーテル類、プロピレングリコールモノアルキルエーテルアセテート類、プロピレングリコールモノアルキルエーテルプロピオネート類、芳香族炭化水素類、ケトン類、エステル類等を挙げることができる。 The solvent varies depending on the composition of the composition. For example, ethers, diethylene glycol alkyl ethers, ethylene glycol alkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ether pro Pionates, aromatic hydrocarbons, ketones, esters and the like can be mentioned.
また、上記無機充填剤としては、球状又は破砕状の溶融シリカ、結晶シリカ等のシリカ粉末、アルミナ粉末、ガラス粉末、マイカ、タルク、炭酸カルシウム、アルミナ、水和アルミナ等を挙げることができる。上記顔料としては、有機系又は無機系の体質顔料、鱗片状顔料等を挙げることができる。揺変性付与剤としては、シリコン系、ヒマシ油系、脂肪族アマイドワックス、酸化ポリエチレンワックス、有機ベントナイト系等を挙げることができ、上記流動性向上剤としては、フェニルグリシジルエーテル、ナフチルグリシジルエーテル等を挙げることができる。 Examples of the inorganic filler include silica powder such as spherical or crushed fused silica and crystalline silica, alumina powder, glass powder, mica, talc, calcium carbonate, alumina, hydrated alumina, and the like. Examples of the pigment include organic or inorganic extender pigments and scaly pigments. Examples of the thixotropic agent include silicon-based, castor oil-based, aliphatic amide wax, oxidized polyethylene wax, and organic bentonite-based, and examples of the fluidity improver include phenyl glycidyl ether and naphthyl glycidyl ether. Can be mentioned.
この硬化性組成物は、塗料、接着剤などの用途に用いられる他、以下に詳述する高機能性を有する硬化物を得るための材料等として用いることができる。 In addition to being used for applications such as paints and adhesives, the curable composition can be used as a material for obtaining a cured product having high functionality, which will be described in detail below.
<硬化物>
本発明の硬化物は、上記硬化性組成物を加熱することで硬化して得られるものである。当該硬化物は各種樹脂として使用することができる。当該硬化物は、アントラセン骨格に由来する高屈折率、高炭素密度、蛍光性能といった広範の用途に有用な各特性を付与する他、耐エッチング性のような電子材料用途特有の特性も付与することができ、高汎用性の材料として様々な用途に用いることができる。
<Hardened product>
The cured product of the present invention is obtained by curing the curable composition by heating. The cured product can be used as various resins. In addition to providing properties useful for a wide range of applications such as high refractive index, high carbon density, and fluorescence performance derived from the anthracene skeleton, the cured product also provides properties specific to electronic materials such as etching resistance. It can be used for various purposes as a highly versatile material.
当該硬化物は、例えば、建材、摩擦材、砥石、記録材料、フォトレジスト材料、反射防止膜、半導体封止材等の電子材料、光学材料、有機EL材料、分子磁気メモリー等の磁性材料等に用いることができる。 The cured product is, for example, a building material, a friction material, a grindstone, a recording material, a photoresist material, an antireflection film, an electronic material such as a semiconductor sealing material, an optical material, an organic EL material, a magnetic material such as a molecular magnetic memory, etc. Can be used.
次に、本発明を実施例によりさらに詳細に説明するが、本発明は、本実施例によってなんら限定されるものではない。なお、得られた化合物及び樹脂の測定は、下記測定機器及び測定方法により行った。 EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited at all by this Example. In addition, the measurement of the obtained compound and resin was performed with the following measuring apparatus and measuring method.
<1H−NMR及び13C−NMR>
1H−NMR及び13C−NMRは、バリアン社製UNITY−INOVA 400MHzを用い、TMSを基準物質としてDMSO−d6溶媒で測定した。
<1 H-NMR and 13 C-NMR>
1 H-NMR and 13 C-NMR were measured with DMSO-d 6 solvent using UNITY-INOVA 400 MHz manufactured by Varian and TMS as a reference substance.
<分子量(重量平均分子量)>
重量平均分子量は、東ソー製HLC−8220型GPC、検出器(RI)、TSKGelG4000HXL+G2000HXL(7.8mmφ×300mm)カラムを用い、展開溶媒としてテトラヒドロフランを1.00ml/分で送液して測定し、標準ポリスチレン換算の重量平均分子量(Mw)を求めた。
<Molecular weight (weight average molecular weight)>
The weight average molecular weight was measured using Tosoh HLC-8220 GPC, detector (RI), TSK GelG4000HXL + G2000HXL (7.8 mmφ × 300 mm) column, and tetrahydrofuran as a developing solvent at 1.00 ml / min. The weight average molecular weight (Mw) in terms of polystyrene was determined.
<HPLC純度>
HPLC純度及び反応の終点確認は、島津製作所製HPLCPromineceシリーズ、UV検出器SPD−20A(246nm)、GLサイエンス製ODS−3(4.6mmφ×250mm)カラムを用い、展開溶媒として水/アセトニトリル=40/60で送液し、目的物ピークの面積比によって求めた。
<HPLC purity>
HPLC purity and reaction end point confirmation were performed using HPLC Promince series manufactured by Shimadzu Corporation, UV detector SPD-20A (246 nm), ODS-3 (4.6 mmφ × 250 mm) column manufactured by GL Science, and water / acetonitrile = 40 as a developing solvent. The liquid was fed at / 60, and was determined by the area ratio of the target peak.
<融点及びガラス転移温度(Tg)>
融点は、リガク製DSC8230型示差走査熱量計にて、窒素雰囲気下5℃/分の昇温速度によるピークトップ法にて求めた。また、ガラス転移温度は同様の条件で測定し、中点ガラス転移温度を求めた。
<Melting point and glass transition temperature (Tg)>
The melting point was determined by a peak top method with a temperature rising rate of 5 ° C./min under a nitrogen atmosphere with a DSC8230 differential scanning calorimeter manufactured by Rigaku. Moreover, the glass transition temperature was measured on the same conditions, and the midpoint glass transition temperature was calculated | required.
<屈折率>
屈折率は、京都電子工業製RA−520N型屈折率計を用い、25℃にて1、5及び10質量%の各濃度でプロピレングリコールモノメチルエーテルアセテート(PGMEA)に溶解して測定し、検量線を作成して100質量%時の換算屈折率を求めた。
<Refractive index>
The refractive index is measured by dissolving in propylene glycol monomethyl ether acetate (PGMEA) at concentrations of 1, 5 and 10% by mass at 25 ° C. using a RA-520N refractometer manufactured by Kyoto Electronics Industry. And the converted refractive index at 100% by mass was determined.
<蛍光スペクトル>
蛍光の有無は、試料(1g)をPGMEA(9g)に溶解した液状状態において、アズワン製ハンディーUVランプSLUV−4を用いて、365nmの紫外線を照射し、発光の有無を観察した。
<Fluorescence spectrum>
The presence or absence of fluorescence was observed by irradiating 365 nm ultraviolet rays using a handy UV lamp SLUV-4 manufactured by ASONE in a liquid state in which a sample (1 g) was dissolved in PGMEA (9 g).
<残炭率>
残炭率は、リガク製TG8230型示差熱天秤にて、窒素雰囲気下10℃/分の昇温速度で830℃までの測定を行い、重量減少率を100%から除した数値で求めた。
<Remaining charcoal rate>
The residual charcoal rate was determined by a numerical value obtained by measuring up to 830 ° C. at a heating rate of 10 ° C./min under a nitrogen atmosphere using a TG8230 differential thermal balance manufactured by Rigaku, and dividing the weight reduction rate from 100%.
<GPC純度>
GPC純度は、東ソー製HLC−8220型GPC、RI検出器、TSK−Gel SuperHZ2000+HZ1000+HZ1000(4.6mmφ×150mm)カラムを用い、展開溶媒としてテトラヒドロフランを0.35ml/分で送液し、目的物ピークの面積比によって求めた。
<GPC purity>
The GPC purity was measured using a Tosoh HLC-8220 GPC, RI detector, TSK-Gel SuperHZ2000 + HZ1000 + HZ1000 (4.6 mmφ × 150 mm) column, and tetrahydrofuran was fed at 0.35 ml / min as a developing solvent. Determined by area ratio.
[合成例1]ビスフェノールアントラセンの合成
300mlの環流管付き反応容器にフェノール(112.8g,1.20mol)、アントラセン−9−カルボアルデヒド(49.4g,0.24mol)及びメタノール(11.3g)を入れ、40℃にて溶解した。濃硫酸(5.6g)を投入し、40℃で24時間反応を行った。次いで、反応液をメチルイソブチルケトン(169.2g)に溶解し、蒸留水(56.4g)にて水洗を数回行って触媒を除去した。減圧下にて、メチルイソブチルケトン及びフェノールを留去した後、キシレン(169.2g)及び蒸留水(11.3g)投入して10℃で攪拌した。析出した結晶を濾別後、減圧乾燥を行って、淡黄色の9−(4−ヒドロキシベンジル)−10−(4−ヒドロキシフェニル)アントラセン48.3g(収率53.3%)を得た。
[Synthesis Example 1] Synthesis of bisphenol anthracene Phenol (112.8 g, 1.20 mol), anthracene-9-carbaldehyde (49.4 g, 0.24 mol) and methanol (11.3 g) in a 300 ml reaction vessel with a reflux tube. And dissolved at 40 ° C. Concentrated sulfuric acid (5.6 g) was added, and the reaction was performed at 40 ° C. for 24 hours. Next, the reaction solution was dissolved in methyl isobutyl ketone (169.2 g), and washed with distilled water (56.4 g) several times to remove the catalyst. After distilling off methyl isobutyl ketone and phenol under reduced pressure, xylene (169.2 g) and distilled water (11.3 g) were added and stirred at 10 ° C. The precipitated crystals were separated by filtration and dried under reduced pressure to obtain 48.3 g (yield 53.3%) of pale yellow 9- (4-hydroxybenzyl) -10- (4-hydroxyphenyl) anthracene.
得られた結晶は、GPC純度100%、HPLC純度99.4%、融点238℃、換算屈折率1.701(25℃)であった、また、UVランプ(365nm)照射時の青色の発光を目視にて確認した。1H−NMR(400MHz,DMSO−d6,δ,ppm/4.9,2H,−CH 2−/6.6,6.9,7.1,7.2,8H,Phenyl−H/7.3,7.5,7.7,8.4,8H,Anthryl−H/9.2,9.8,2H,−OH)及び13C−NMR(400MHz,DMSO−d6,δ,ppm/32.1,−CH2−/115.4,115.6,128.8,129.1,131.4,132.3,155.7,157.1,−Phenyl/125.2,125.3,125.8,127.5,129.7,130.2,131.4,132.8,136.6,−Anthryl)にて9−(4−ヒドロキシベンジル)−10−(4−ヒドロキシフェニル)アントラセン(上記式(1)において、X及びYがパラヒドロキシフェニル基である化合物)であることを確認した。図1に1H−NMRチャート、図2に13C−NMRチャートを示す。 The obtained crystal had a GPC purity of 100%, an HPLC purity of 99.4%, a melting point of 238 ° C., a converted refractive index of 1.701 (25 ° C.), and emitted blue light when irradiated with a UV lamp (365 nm). It was confirmed visually. 1 H-NMR (400MHz, DMSO -d6, δ, ppm / 4.9,2H, -C H 2 - / 6.6,6.9,7.1,7.2,8H, Phenyl- H / 7 .3,7.5,7.7,8.4,8H, Anthryl- H /9.2,9.8,2H,-O H) and 13 C-NMR (400MHz, DMSO -d6, δ, ppm /32.1,- C H 2 - / 115.4,115.6,128.8,129.1,131.4,132.3,155.7,157.1, - Phenyl /125.2, 125.3, 125.8, 127.5, 129.7, 130.2, 131.4, 132.8, 136.6, -Anthryl ) 9- (4-hydroxybenzyl) -10- (4 -Hydroxyphenyl) anthracene (in the above formula (1), X Fine Y was identified as a compound) para-hydroxyphenyl groups. FIG. 1 shows a 1 H-NMR chart, and FIG. 2 shows a 13 C-NMR chart.
[実施例1]
フェノール樹脂(ビスフェノールアントラセン/ホルムアルデヒド)の合成
300mLの還流管付き反応容器に合成例1で得られた化合物の結晶(30.0g,0.08mol)、1,4−ラクトン(90.0g)及びパラトルエンスルホン酸(6.0g)を入れた。これを撹拌しながら昇温し、完全に溶解させた後、92%パラホルムアルデヒド(2.08g、0.06mol)を投入し、内温80℃で6時間反応を行った。次いで、PGMEA(128.0g)を加え、撹拌溶解した。純水128gを投入、撹拌後静置し、上層を除去し、廃液pHが4以上になるまで繰り返し行った。170℃まで常圧脱水を行った後、180℃で減圧し、残留した溶媒を除去し、実施例1のフェノール樹脂(25.9g)を得た。
[Example 1]
Synthesis of phenol resin (bisphenolanthracene / formaldehyde) Crystals of the compound obtained in Synthesis Example 1 (30.0 g, 0.08 mol), 1,4-lactone (90.0 g) and para. Toluenesulfonic acid (6.0 g) was added. The mixture was heated with stirring and completely dissolved, and then 92% paraformaldehyde (2.08 g, 0.06 mol) was added thereto and reacted at an internal temperature of 80 ° C. for 6 hours. Next, PGMEA (128.0 g) was added and dissolved by stirring. The pure water 128g was thrown in, it left still after stirring, the upper layer was removed, and it repeated until the waste liquid pH became 4 or more. After performing atmospheric pressure dehydration to 170 ° C., the pressure was reduced at 180 ° C., and the remaining solvent was removed to obtain the phenol resin (25.9 g) of Example 1.
実施例1のフェノール樹脂は、分子量(Mw)5,387、ガラス転移温度175.6℃、残炭率46.50%、換算屈折率1.704(25℃)であった。また、UVランプ(365nm)照射時の青色の発光を目視にて確認した。図3に実施例1のフェノール樹脂のGPCチャートを示す。 The phenol resin of Example 1 had a molecular weight (Mw) of 5,387, a glass transition temperature of 175.6 ° C., a residual carbon ratio of 46.50%, and a converted refractive index of 1.704 (25 ° C.). Moreover, the blue light emission at the time of UV lamp (365 nm) irradiation was confirmed visually. FIG. 3 shows a GPC chart of the phenol resin of Example 1.
[比較例1]
フェノール樹脂(ビスフェノールフルオレン/ホルムアルデヒド)の合成
実施例1において、合成例1で得られた結晶(30.0g,0.08mol)の代わりにビスフェノールフルオレンの市販品であるBPAF[商品名:JFEケミカル株式会社製/9,9−ビス(4−ヒドロキシフェニル)フルオレン](52.6g,0.15mol)、92%パラホルムアルデヒド(2.08g,0.06mol)の代わりに92%パラホルムアルデヒド(2.24g,0.06mol)を用いたこと以外は、実施例1と同様の操作を行い、比較例1のフェノール樹脂(23.2g)を得た。
[Comparative Example 1]
Synthesis of phenol resin (bisphenolfluorene / formaldehyde) In Example 1, BPAF [trade name: JFE Chemical Co., Ltd.] is a commercial product of bisphenolfluorene instead of the crystals (30.0 g, 0.08 mol) obtained in Synthesis Example 1. 92% paraformaldehyde (2.24 g) instead of 9 / 9-bis (4-hydroxyphenyl) fluorene] (52.6 g, 0.15 mol), 92% paraformaldehyde (2.08 g, 0.06 mol) Except that 0.06 mol) was used, the same operation as in Example 1 was performed to obtain a phenol resin (23.2 g) of Comparative Example 1.
比較例1のフェノール樹脂は、分子量(Mw)4,838、ガラス転移温度169.8℃、残炭率44.41%、換算屈折率1.661(25℃)であった。また、UVランプ(365nm)照射時の発光は目視にて確認できなかった。図4に比較例1のフェノール樹脂のGPCチャートを示す。 The phenol resin of Comparative Example 1 had a molecular weight (Mw) of 4,838, a glass transition temperature of 169.8 ° C., a residual carbon ratio of 44.41%, and a converted refractive index of 1.661 (25 ° C.). Moreover, the light emission at the time of UV lamp (365 nm) irradiation was not able to be confirmed visually. FIG. 4 shows a GPC chart of the phenol resin of Comparative Example 1.
[比較例2]
フェノール樹脂(ビスフェノールA/ホルムアルデヒド)の合成
実施例1において、合成例1で得られた結晶(30.0g,0.08mol)の代わりにビスフェノールA(30.0g,0.13mol)、92%パラホルムアルデヒド(2.08g,0.06mol)の代わりに92%パラホルムアルデヒド(3.43g,0.10mol)を用いたこと以外は、実施例1と同様の操作を行い、比較例2のフェノール樹脂(23.7g)を得た。
[Comparative Example 2]
Synthesis of phenol resin (bisphenol A / formaldehyde) In Example 1, instead of the crystals (30.0 g, 0.08 mol) obtained in Synthesis Example 1, bisphenol A (30.0 g, 0.13 mol), 92% para The same procedure as in Example 1 was performed except that 92% paraformaldehyde (3.43 g, 0.10 mol) was used instead of formaldehyde (2.08 g, 0.06 mol). 23.7 g) was obtained.
比較例2のフェノール樹脂は、分子量(Mw)3,486、ガラス転移温度87.6℃、残炭率21.51%、換算屈折率1.611(25℃)であった。また、UVランプ(365nm)照射時の発光は目視にて確認できなかった。図5に比較例2のフェノール樹脂のGPCチャートを示す。 The phenol resin of Comparative Example 2 had a molecular weight (Mw) of 3,486, a glass transition temperature of 87.6 ° C., a residual carbon ratio of 21.51%, and a converted refractive index of 1.611 (25 ° C.). Moreover, the light emission at the time of UV lamp (365 nm) irradiation was not able to be confirmed visually. FIG. 5 shows a GPC chart of the phenol resin of Comparative Example 2.
上述の評価結果として、実施例1のフェノール樹脂(ビスフェノールアントラセン/ホルムアルデヒド)並びに実施例1と同様に架橋剤としてホルムアルデヒドを用いた比較例1及び比較例2のフェノール樹脂の評価結果を表1にあらためて示す。 Table 1 shows the evaluation results of the phenol resin of Example 1 (bisphenolanthracene / formaldehyde) and the phenol resins of Comparative Example 1 and Comparative Example 2 using formaldehyde as a cross-linking agent in the same manner as in Example 1. Show.
実施例1で得られたフェノール樹脂は、2核体のフェノール誘導体であるビスフェノール−A及びビスフェノールフルオレンを用いて製造されたフェノール樹脂(比較例1及び比較例2のフェノール樹脂)と比較すると、屈折率、ガラス転移温度、残炭率、蛍光特性のいずれにおいても優れた特性を有することが示された。 The phenol resin obtained in Example 1 is refracted when compared with a phenol resin (phenol resin of Comparative Example 1 and Comparative Example 2) produced using bisphenol-A and bisphenol fluorene, which are binuclear phenol derivatives. It was shown that it has excellent characteristics in all of the ratio, glass transition temperature, residual carbon ratio, and fluorescence characteristics.
次に、架橋剤としてアルデヒド類以外を用いた場合のフェノール樹脂について示す。 Next, it shows about the phenol resin at the time of using except aldehydes as a crosslinking agent.
[実施例2]
フェノール樹脂(ビスフェノールアントラセン/テトラメチロールビスフェノールA)の合成
実施例1において、92%パラホルムアルデヒド(2.08g,0.06mol)の代わりにビスフェノールAのテトラメチロール体であるTM−BIP−A(商品名:旭有機材工業株式会社製/6.9g,0.02mol)を用いたこと以外は、実施例1と同様の操作を行い、実施例2のフェノール樹脂(15.3g)を得た。
[Example 2]
Synthesis of phenol resin (bisphenolanthracene / tetramethylol bisphenol A) In Example 1, instead of 92% paraformaldehyde (2.08 g, 0.06 mol), TM-BIP-A (trade name) which is a tetramethylol body of bisphenol A : Asahi Organic Materials Co., Ltd./6.9 g, 0.02 mol) was used in the same manner as in Example 1 to obtain the phenol resin of Example 2 (15.3 g).
実施例2のフェノール樹脂は、分子量(Mw)4,705、換算屈折率1.695(25℃)であった。また、UVランプ(365nm)照射時の青色の発光を目視にて確認した。 The phenol resin of Example 2 had a molecular weight (Mw) of 4,705 and a converted refractive index of 1.695 (25 ° C.). Moreover, the blue light emission at the time of UV lamp (365 nm) irradiation was confirmed visually.
[実施例3]
フェノール樹脂(ビスフェノールアントラセン/フルオレノン)の合成
実施例1において、92%パラホルムアルデヒド(2.08g,0.6mol)の代わりに9−フルオレノン(11.5g,0.06mol)を用い、反応温度を80℃から170℃に変更したこと以外は、実施例1と同様の操作を行い、実施例3のフェノール樹脂(28.1g)を得た。
[Example 3]
Synthesis of phenol resin (bisphenolanthracene / fluorenone) In Example 1, 9-fluorenone (11.5 g, 0.06 mol) was used instead of 92% paraformaldehyde (2.08 g, 0.6 mol), and the reaction temperature was 80. The phenol resin (28.1g) of Example 3 was obtained by performing the same operation as in Example 1 except that the temperature was changed from 170C to 170C.
実施例3のフェノール樹脂は、分子量(Mw)1,633、換算屈折率1.6361(25℃)であった。また、UVランプ(365nm)照射時の青色の発光を目視にて確認した。 The phenol resin of Example 3 had a molecular weight (Mw) of 1,633 and a converted refractive index of 1.6361 (25 ° C.). Moreover, the blue light emission at the time of UV lamp (365 nm) irradiation was confirmed visually.
[実施例4]
フェノール樹脂(ビスフェノールアントラセン/ジシクロペンタジエン)の合成
実施例1において、92%パラホルムアルデヒド(2.08g,0.6mol)の代わりにジシクロペンタジエン(10.5g,0.06mol)を用い、反応温度を80℃から170℃に変更したこと以外は、実施例1と同様の操作を行い、実施例4のフェノール樹脂(29.1g)を得た。
[Example 4]
Synthesis of phenol resin (bisphenolanthracene / dicyclopentadiene) In Example 1, dicyclopentadiene (10.5 g, 0.06 mol) was used instead of 92% paraformaldehyde (2.08 g, 0.6 mol), and the reaction temperature was changed. Was changed from 80 ° C. to 170 ° C., and the same operation as in Example 1 was performed to obtain a phenol resin (29.1 g) of Example 4.
実施例4のフェノール樹脂は、分子量(Mw)1,576、換算屈折率1.650(25℃)であった。また、UVランプ(365nm)照射時の青色の発光を目視にて確認した。 The phenol resin of Example 4 had a molecular weight (Mw) of 1,576 and a converted refractive index of 1.650 (25 ° C.). Moreover, the blue light emission at the time of UV lamp (365 nm) irradiation was confirmed visually.
合成例1で得られた化合物(ビスフェノールアントラセン)を原料として得られたフェノール樹脂(実施例1、実施例2、実施例3及び実施例4のフェノール樹脂)は、いずれも蛍光特性を有し、高い屈折率を有することが示された。 The phenol resins (phenol resins of Example 1, Example 2, Example 3 and Example 4) obtained using the compound (bisphenolanthracene) obtained in Synthesis Example 1 as raw materials all have fluorescent properties, It was shown to have a high refractive index.
本発明のフェノール樹脂は、例えば成型品、積層品、シェルモールド、建材、接着材、摩擦材、塗料、砥石、電子材料、感熱紙、感圧紙、エポキシ樹脂用硬化剤、エポキシ樹脂用母体、フォトレジスト材料、反射防止膜、半導体封止材、記録材料などに用いることができる。 The phenol resin of the present invention is, for example, a molded product, a laminated product, a shell mold, a building material, an adhesive material, a friction material, a paint, a grindstone, an electronic material, a thermal paper, a pressure sensitive paper, an epoxy resin curing agent, an epoxy resin matrix, a photo It can be used for resist materials, antireflection films, semiconductor encapsulants, recording materials and the like.
Claims (7)
上記化合物が下記式(1)で表されることを特徴とするフェノール樹脂。
The said compound is represented by following formula (1), The phenol resin characterized by the above-mentioned.
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