JP5634757B2 - Light source module - Google Patents

Light source module Download PDF

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Publication number
JP5634757B2
JP5634757B2 JP2010134643A JP2010134643A JP5634757B2 JP 5634757 B2 JP5634757 B2 JP 5634757B2 JP 2010134643 A JP2010134643 A JP 2010134643A JP 2010134643 A JP2010134643 A JP 2010134643A JP 5634757 B2 JP5634757 B2 JP 5634757B2
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light source
led
support member
pair
substrate support
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JP2012003840A (en
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野口 卓志
卓志 野口
広巳 村松
広巳 村松
昌寛 石田
昌寛 石田
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Mitsubishi Electric Lighting Corp
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Mitsubishi Electric Lighting Corp
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Priority to PCT/JP2011/063253 priority patent/WO2011158729A1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00Lighting devices or systems using a string or strip of light sources
    • F21S4/20Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • F21V15/013Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Description

本発明は、LED基板を備えるLEDモジュールに関するものであり、特に、複数のLEDを備えるライン形のLED基板を備えるLEDラインモジュールに関する。   The present invention relates to an LED module including an LED substrate, and more particularly to an LED line module including a line-shaped LED substrate including a plurality of LEDs.

従来技術として、金属ベース基板に複数のLEDチップを所定の間隔で配置した線状光源装置がある(特許文献1参照)。
また、LED基板を装着するLEDラインモジュールであり、ヒートシンクと反射面とが個々の独立な部品として構成されたLEDラインモジュールがある(特許文献2参照)。
As a conventional technique, there is a linear light source device in which a plurality of LED chips are arranged on a metal base substrate at a predetermined interval (see Patent Document 1).
Further, there is an LED line module on which an LED substrate is mounted, and there is an LED line module in which a heat sink and a reflective surface are configured as individual independent parts (see Patent Document 2).

特開2007−150080号公報Japanese Patent Laid-Open No. 2007-150080 特許第4328379号公報Japanese Patent No. 4328379

従来技術では、LEDバックライトを想定したLEDラインモジュールであり、金属ベースに複数のLEDチップを設置して金属ベース基板としているので、ライン形のLED基板を装着することができないという課題がある。   The prior art is an LED line module that assumes an LED backlight. Since a plurality of LED chips are installed on a metal base to form a metal base substrate, there is a problem that a line-type LED substrate cannot be mounted.

また、ヒートシンクと反射面とが個々の独立な部品として構成されたLEDラインモジュールでは、部品数が増加しコストがかかるという課題がある。   Moreover, in the LED line module in which the heat sink and the reflective surface are configured as individual independent parts, there is a problem that the number of parts increases and costs increase.

本発明は、上記のような課題を解決するためになされたもので、反射面とヒートシンクとが一体形成されているとともにLEDライン基板を着脱可能に取り付けることのできるLEDラインモジュールを提供することを目的とする。   The present invention has been made to solve the above-described problems, and provides an LED line module in which a reflective surface and a heat sink are integrally formed and an LED line substrate can be detachably attached. Objective.

本発明に係る光源モジュールは、
光源を有する光源基板を支持する光源基板支持部材を備える光源モジュールにおいて、
前記光源基板支持部材は、
前記光源の照射方向側が開口する溝部であって前記光源基板の両側の側部を収納する一対のガイド部を有する溝部と、
前記溝部の前記開口の縁部から前記照射方向側に形成された反射部と、
前記照射方向側の反対側に形成され、前記光源基板の発する熱を放熱する放熱部とを備えることを特徴とする。
The light source module according to the present invention is:
In a light source module comprising a light source substrate support member that supports a light source substrate having a light source,
The light source substrate support member is
A groove part having an opening on the irradiation direction side of the light source and having a pair of guide parts for storing side parts on both sides of the light source substrate;
A reflecting portion formed on the irradiation direction side from an edge of the opening of the groove;
It is formed on the opposite side of the irradiation direction side, and includes a heat radiating part that radiates heat generated by the light source substrate.

前記光源基板支持部材は、一体形成されていることを特徴とする。   The light source substrate support member is integrally formed.

前記光源基板支持部材は、両端面を有し、
前記溝部の一対のガイド部は、前記両端面まで延在して前記両端面に一対のガイド開口部を形成し、
前記光源基板の両側の側部は、前記両端面のうちのいずれか一方の端面に形成された前記ガイド開口部から挿入され前記ガイド部をスライドすることにより、前記溝部の一対のガイド部に収納されることを特徴とする。
The light source substrate support member has both end faces,
The pair of guide portions of the groove portion extends to the both end surfaces to form a pair of guide openings on the both end surfaces,
The side portions on both sides of the light source substrate are inserted into the guide opening portions formed on either one of the both end surfaces, and are accommodated in the pair of guide portions of the groove portion by sliding the guide portions. It is characterized by being.

前記放熱部は、前記照射方向側の反対側に伸びた放熱フィンであって前記両端面まで延在して形成された放熱フィンを複数備え、
前記複数の放熱フィンの各放熱フィンは、前記溝部の底面の幅方向の略中心線から略放射方向に伸びていることを特徴とする。
The heat dissipating part includes a plurality of heat dissipating fins that extend to the opposite end surfaces of the heat dissipating fins and extend to the both end surfaces.
Each radiating fin of the plurality of radiating fins extends in a substantially radial direction from a substantially center line in the width direction of the bottom surface of the groove.

前記光源モジュールは、さらに、前記開口を覆う半円筒状の樹脂カバーを備え、
前記光源基板支持部材は、
前記樹脂カバーを取り付けるカバー取付ガイド部であって前記樹脂カバーの両側辺である両側辺部をスライドさせて取り付けるカバー取付ガイド部を備えることを特徴とする。
The light source module further includes a semi-cylindrical resin cover that covers the opening,
The light source substrate support member is
A cover attachment guide portion for attaching the resin cover, the cover attachment guide portion for attaching the resin cover by sliding both side portions which are both sides of the resin cover.

前記光源モジュールは、前記溝部に直交する断面が略円形状であることを特徴とする。   The light source module has a substantially circular cross section perpendicular to the groove.

本発明に係る光源モジュールであって光源を有する光源基板を支持する光源基板支持部材を備える光源モジュールによれば、前記光源基板支持部材が、前記光源の照射方向側が開口する溝部であって前記光源基板の両側の側部を収納する一対のガイド部を有する溝部と、前記溝部の前記開口の縁部から前記照射方向側に形成された反射部と、前記照射方向側の反対側に形成され、前記光源基板の発する熱を放熱する放熱部とを備えているので、光源基板を着脱可能に取り付けることができるという効果を奏する。   According to the light source module including the light source substrate supporting member that supports the light source substrate having the light source according to the present invention, the light source substrate supporting member is a groove portion that is open on an irradiation direction side of the light source, and the light source A groove portion having a pair of guide portions for storing side portions on both sides of the substrate, a reflection portion formed on the irradiation direction side from an edge of the opening of the groove portion, and formed on the opposite side of the irradiation direction side, Since the heat radiation part for radiating the heat generated by the light source substrate is provided, the light source substrate can be detachably attached.

また、前記光源基板支持部材は、一体形成されているので、部品数を減らすことができコストを低減することができるという効果を奏する。   In addition, since the light source substrate support member is integrally formed, the number of components can be reduced and the cost can be reduced.

図1の(a)が実施の形態1に係るLEDラインモジュールの平面図(光源の照射方向側から見た図、A矢視図)であり、図1の(b)が実施の形態1に係るLEDラインモジュールの側面図(B矢視図)であり図1の(b−1)が実施の形態1に係るLEDラインモジュールの端面図であり、図1の(c)が実施の形態1に係るLEDラインモジュールの背面図(C矢視図)である。1A is a plan view of the LED line module according to Embodiment 1 (a view seen from the irradiation direction side of the light source, as viewed from the arrow A), and FIG. FIG. 1B is a side view of the LED line module, and FIG. 1B-1 is an end view of the LED line module according to the first embodiment, and FIG. 1C is the first embodiment. It is a rear view (C arrow line view) of the LED line module which concerns on. 実施の形態1に係るLEDラインモジュールの端面図の詳細を示す図である。It is a figure which shows the detail of the end elevation of the LED line module which concerns on Embodiment 1. FIG. 実施の形態1に係るLEDラインモジュールの備えるLED基板支持部材の平面図である。3 is a plan view of an LED substrate support member provided in the LED line module according to Embodiment 1. FIG. 実施の形態1に係るLED基板支持部材にLED基板が装着されている状態を示す平面図である。FIG. 3 is a plan view showing a state in which the LED substrate is mounted on the LED substrate support member according to Embodiment 1. 実施の形態1のLEDラインモジュールの端面の各箇所の寸法の関係を示す図である。FIG. 3 is a diagram illustrating a dimensional relationship of each part of an end face of the LED line module according to the first embodiment.

実施の形態1.
図1は、図1の(a)が本実施の形態に係るLEDラインモジュール100の平面図(光源の照射方向側から見た図、A矢視図)であり、図1の(b)がLEDラインモジュール100の側面図(B矢視図)であり図1の(b−1)がLEDラインモジュール100の端面図であり、図1の(c)がLEDラインモジュール100の背面図(C矢視図)である。図2は、本実施の形態に係るLEDラインモジュール100の端面図の詳細を示す図である。図3は、本実施の形態に係るLEDラインモジュール100の備えるLED基板支持部材110の平面図である。図4は、本実施の形態に係るLED基板支持部材110にLED基板200が装着されている状態を示す平面図である。図5は、本実施の形態に係るLEDラインモジュール100の端面の各箇所の寸法の関係を示す図である。
Embodiment 1 FIG.
FIG. 1A is a plan view of the LED line module 100 according to the present embodiment (a view seen from the irradiation direction side of the light source, a view from the arrow A), and FIG. FIG. 1B is a side view of the LED line module 100 (B arrow view), FIG. 1B-1 is an end view of the LED line module 100, and FIG. 1C is a rear view of the LED line module 100. (Arrow view). FIG. 2 is a diagram showing details of an end view of the LED line module 100 according to the present embodiment. FIG. 3 is a plan view of the LED substrate support member 110 included in the LED line module 100 according to the present embodiment. FIG. 4 is a plan view showing a state in which the LED substrate 200 is mounted on the LED substrate support member 110 according to the present embodiment. FIG. 5 is a diagram showing the relationship of dimensions of each part of the end face of the LED line module 100 according to the present embodiment.

図1〜図5を用いて、本実施の形態に係るLEDラインモジュール100の構成について説明する。ここで、図2に示す端面図は、照射方向略中心線1138に対して略線対称である。また、本実施の形態に係るLEDラインモジュール100の長手方向に直交する断面は、図2に示す端面図と略同様であるものとする。   The configuration of the LED line module 100 according to the present embodiment will be described with reference to FIGS. Here, the end view shown in FIG. 2 is substantially line symmetric with respect to the irradiation direction substantially center line 1138. Moreover, the cross section orthogonal to the longitudinal direction of the LED line module 100 which concerns on this Embodiment shall be substantially the same as the end elevation shown in FIG.

LEDラインモジュール100は、LED210(光源の一例)を有するLED基板200(光源基板の一例)を支持するLED基板支持部材110(光源基板支持部材の一例)を備える光源モジュールの一例である。本実施の形態では、LED基板200として、複数のLED210を備えるライン形のLED基板を想定している。したがって、LEDラインモジュール100は、ライン形のLED基板200を装着することのできるLEDモジュールである。   The LED line module 100 is an example of a light source module including an LED substrate support member 110 (an example of a light source substrate support member) that supports an LED substrate 200 (an example of a light source substrate) having LEDs 210 (an example of a light source). In the present embodiment, a line-type LED substrate including a plurality of LEDs 210 is assumed as the LED substrate 200. Therefore, the LED line module 100 is an LED module on which a line-shaped LED substrate 200 can be mounted.

LEDラインモジュール100は、図1の(a)〜図1の(c)に示すように、長手方向に長い略円筒形である。図2は、図1の(b−1)に示すLEDラインモジュール100の端面図の詳細を示す図である。   As shown in FIGS. 1A to 1C, the LED line module 100 has a substantially cylindrical shape that is long in the longitudinal direction. FIG. 2 is a diagram showing details of an end view of the LED line module 100 shown in FIG.

LEDラインモジュール100は、図2に示すように、LED基板支持部材110と、LED基板支持部材110に収納されるLED基板200と、LED基板200に設置(装着)されたLED210を覆うようにLED基板支持部材110に取り付けられる樹脂カバー120とを備える。   As shown in FIG. 2, the LED line module 100 includes an LED board support member 110, an LED board 200 housed in the LED board support member 110, and an LED 210 installed (mounted) on the LED board 200. And a resin cover 120 attached to the substrate support member 110.

LED基板支持部材110は、LED210の照射方向P側が開口する基板収納部113(溝部の一例)であって、LED基板200の両側の側部である基板側部201を収納する一対のガイド部1137を有する基板収納部113を備える。   The LED substrate support member 110 is a substrate storage portion 113 (an example of a groove) that opens on the irradiation direction P side of the LED 210, and a pair of guide portions 1137 that store the substrate side portions 201 that are the side portions on both sides of the LED substrate 200. A substrate storage portion 113 having

LED基板支持部材110は、基板収納部113の開口(以下、開口部1131)の縁部1133から照射方向P側に形成された反射部111を備える。また、LED基板支持部材110は、照射方向P側の反対側(LED基板200の背面方向側、以下、背面方向Q側という)に形成され、LED基板200の発する熱を放熱する金属ヒートシンク112(放熱部の一例)を備える。   The LED substrate support member 110 includes a reflecting portion 111 formed on the irradiation direction P side from an edge portion 1133 of an opening (hereinafter referred to as an opening portion 1131) of the substrate housing portion 113. The LED board support member 110 is formed on the opposite side of the irradiation direction P side (the back side of the LED board 200, hereinafter referred to as the back side Q), and the metal heat sink 112 (dissipates heat generated by the LED board 200). An example of a heat radiating part is provided.

LED基板支持部材110は、例えば、アルミニウム等の金属で一体形成されている。LED基板支持部材110は、長手方向(スライド方向(図1,図3参照))に直交する断面が略半円筒形状(かまぼこ形状)である。LED基板支持部材110は、背面方向Q側が半円筒形状の円弧形状部分となっており、金属ヒートシンク112を構成する放熱フィン1121が放射状に形成されている。金属ヒートシンク112については後述する。   The LED substrate support member 110 is integrally formed of a metal such as aluminum, for example. The LED substrate support member 110 has a substantially semi-cylindrical shape (kamaboko shape) in a cross section perpendicular to the longitudinal direction (slide direction (see FIGS. 1 and 3)). The LED substrate support member 110 has a semi-cylindrical arc-shaped portion on the back surface direction Q side, and heat radiation fins 1121 constituting the metal heat sink 112 are formed radially. The metal heat sink 112 will be described later.

また、LED基板支持部材110は、照射方向P側が半円筒形状の平面形状部分(以下、平面部分とも呼ぶ)であり、LED基板200を収納する基板収納部113(溝部)とLED210の発する光を反射する反射部111とが形成されている。図3は、LED基板支持部材110を照射方向Pから見た図である。すなわち、図3はLED基板支持部材110の平面部分を示す図である。図3のLED基板支持部材110の平面部は、長手方向に長く短手方向に短い略長方形である。長手方向に沿った側部を部材側部と呼ぶ。   In addition, the LED substrate support member 110 is a planar portion (hereinafter also referred to as a plane portion) having a semi-cylindrical shape on the irradiation direction P side. A reflecting portion 111 that reflects is formed. FIG. 3 is a view of the LED substrate support member 110 viewed from the irradiation direction P. That is, FIG. 3 is a diagram showing a planar portion of the LED substrate support member 110. The planar portion of the LED substrate support member 110 in FIG. 3 is a substantially rectangular shape that is long in the longitudinal direction and short in the lateral direction. A side portion along the longitudinal direction is referred to as a member side portion.

樹脂カバーについて説明する。樹脂カバー120の素材は、ガラス等に比べて軽量で、かつ、割れにくいアクリル樹脂等である。図2に示すように、樹脂カバー120は、LED基板支持部材110の平面部分を覆うような略半円筒形状である。樹脂カバー120は、樹脂カバー120の開口部分(円弧形状部分に対向する開口部分)がLED基板支持部材110の平面部分により塞がれるようにLED基板支持部材110に取り付けられる。樹脂カバー120の両側の側辺122には、LED基板支持部材110に形成されたカバー取付部114(カバー取付ガイド部の一例)と係合するカバー突起部121が形成されている。カバー突起部121は、樹脂カバーの両側の側辺122の端部を内側に折り曲げるように形成された突起である。カバー突起部121がLED基板支持部材110の部材側部に設けられた溝であるカバー取付部114に嵌合することにより、樹脂カバー120がLED基板支持部材110に取り付けられる。   The resin cover will be described. The material of the resin cover 120 is an acrylic resin or the like that is lighter than glass and is hard to break. As shown in FIG. 2, the resin cover 120 has a substantially semi-cylindrical shape that covers the planar portion of the LED substrate support member 110. The resin cover 120 is attached to the LED board support member 110 such that the opening part of the resin cover 120 (opening part facing the arc-shaped part) is covered with the flat part of the LED board support member 110. Cover protrusions 121 that engage with cover attachment portions 114 (an example of a cover attachment guide portion) formed on the LED substrate support member 110 are formed on the side edges 122 on both sides of the resin cover 120. The cover protrusion 121 is a protrusion formed to bend the ends of the side edges 122 on both sides of the resin cover inward. The resin cover 120 is attached to the LED substrate support member 110 by fitting the cover protrusion 121 to the cover attachment portion 114 which is a groove provided on the member side portion of the LED substrate support member 110.

すなわち、LED基板支持部材110は、樹脂カバー120を取り付けるカバー取付部114(カバー取付ガイド部)であって樹脂カバー120の両側辺(両側の側辺122)に形成されたカバー突起部121をスライドさせて取り付けるカバー取付部114を備える。   That is, the LED substrate support member 110 is a cover attachment portion 114 (cover attachment guide portion) to which the resin cover 120 is attached, and slides the cover protrusions 121 formed on both sides (side sides 122) of the resin cover 120. The cover attaching part 114 to be attached is provided.

LED基板支持部材110に樹脂カバー120が取り付けられると、図2に示すように長手方向に直交する断面(端面)が略円形となり、LEDラインモジュール100は略円筒形状となる。このように、基板収納部113(溝部)に直交する断面が略円形状であるので、従来のライン形蛍光灯に変わるライン形LED照明として利用することができる。   When the resin cover 120 is attached to the LED substrate support member 110, the cross section (end face) orthogonal to the longitudinal direction becomes substantially circular as shown in FIG. 2, and the LED line module 100 becomes substantially cylindrical. Thus, since the cross section orthogonal to the substrate storage part 113 (groove part) is substantially circular, it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp.

また、図2では、樹脂カバー120は略半円形状であり、両側の側辺122はLED基板支持部材110の平面部分の面上に配置される。例えば、樹脂カバー120の形状を、樹脂カバー122の両側の側辺122がLED基板支持部材110の平面部分の面よりも背面方向Q側に配置されるような形状としても良い。つまり、樹脂カバー120の両側の側辺122が、放熱フィン1121a、1121e(図5参照)近傍まで達するような形状である。半円形状では中心角が約180°の円弧形状であるが、この場合は約240°(あるいは、約190°以上約250°以下)の円弧形状となる。これにより、樹脂カバー120の両側の側辺122近傍で金属ヒートシンク112の一部が覆われ、美観が向上し、蛍光灯の代替品としてより利用性が向上する。   In FIG. 2, the resin cover 120 has a substantially semicircular shape, and the side edges 122 on both sides are disposed on the plane portion of the LED substrate support member 110. For example, the shape of the resin cover 120 may be a shape in which the side edges 122 on both sides of the resin cover 122 are arranged closer to the back surface Q side than the surface of the planar portion of the LED substrate support member 110. That is, the side 122 on both sides of the resin cover 120 is shaped to reach the vicinity of the radiation fins 1121a and 1121e (see FIG. 5). The semicircular shape has an arc shape with a central angle of about 180 °, but in this case, it has an arc shape of about 240 ° (or about 190 ° or more and about 250 ° or less). Thereby, a part of the metal heat sink 112 is covered in the vicinity of the side edges 122 on both sides of the resin cover 120, the aesthetic appearance is improved, and the usability is further improved as an alternative to a fluorescent lamp.

次に、基板収納部113について説明する。LED基板支持部材110に形成された基板収納部113は、照射方向P側が開口する溝部であって、LED基板200の両側の側部である基板側部201を収納する一対のガイド部1137を有する溝部である。また、基板収納部113は、LED基板支持部材110の両端面(両側の端面115)まで延在する。言い換えると、基板収納部113は、LED基板支持部材110の両端面まで貫通して形成された貫通孔であり、照射方向P側に長手方向に沿って直線状に開口する開口部1131(図3参照)を有する貫通孔である。   Next, the substrate storage unit 113 will be described. The substrate storage portion 113 formed on the LED substrate support member 110 is a groove portion that opens on the irradiation direction P side, and has a pair of guide portions 1137 for storing the substrate side portions 201 that are the side portions on both sides of the LED substrate 200. It is a groove. Moreover, the board | substrate storage part 113 is extended to the both end surfaces (end surface 115 of both sides) of the LED board support member 110. FIG. In other words, the substrate storage portion 113 is a through-hole formed so as to penetrate to both end faces of the LED substrate support member 110, and is an opening portion 1131 that opens linearly along the longitudinal direction on the irradiation direction P side (FIG. 3). A through hole having a reference).

基板収納部113は、溝部の底面1134と、溝部の両側の側壁である一対の側壁1135と、底面1134に対向する上面部1136であって開口部1131を挟んで両側に形成された一対の上面部1136とを有する。基板収納部113において、底面1134と一方の側壁1135と一方の上面部1136とにより囲まれた部分がガイド部1137である。ガイド部1137は、開口部1131を挟んで両側に存在し、一対のガイド部の一例である。   The substrate storage portion 113 includes a bottom surface 1134 of the groove portion, a pair of side walls 1135 that are side walls on both sides of the groove portion, and a pair of top surfaces formed on both sides of the opening 1131 with the upper surface portion 1136 facing the bottom surface 1134. Part 1136. In the substrate storage portion 113, a portion surrounded by the bottom surface 1134, one side wall 1135, and one upper surface portion 1136 is a guide portion 1137. The guide part 1137 exists on both sides of the opening 1131 and is an example of a pair of guide parts.

LED基板200がLED基板支持部材110の基板収納部113に収納される際には、基板収納部113のガイド部1137にLED基板200の両側の側部(基板側部201)をスライドさせることにより、基板収納部113にLED基板200が収納される。   When the LED substrate 200 is accommodated in the substrate accommodating portion 113 of the LED substrate supporting member 110, the side portions (substrate side portion 201) on both sides of the LED substrate 200 are slid on the guide portions 1137 of the substrate accommodating portion 113. The LED substrate 200 is accommodated in the substrate accommodating portion 113.

基板収納部113は、LED基板支持部材110の両側の端面115(両端面)まで延在しているので、LED基板支持部材110の両側の端面115には基板収納部113により開口された端面開口部1151(ガイド開口部の一例)が形成される(図2参照)。つまり、基板収納部113の一対のガイド部1137は、両側の端面115まで延在して両側の端面115に一対の端面開口部1151を形成する。LED基板200の両側の基板側部201は、両側の端面115のうちのいずれか一方の端面115に形成された端面開口部1151から挿入されガイド部1137をスライドすることにより、基板収納部131の一対のガイド部1137に収納される。   Since the board storage portion 113 extends to the end faces 115 (both end faces) on both sides of the LED board support member 110, end face openings opened by the board storage section 113 on the both end faces 115 of the LED board support member 110. A portion 1151 (an example of a guide opening) is formed (see FIG. 2). That is, the pair of guide portions 1137 of the substrate storage portion 113 extends to both end surfaces 115 to form a pair of end surface openings 1151 on the both end surfaces 115. The board side parts 201 on both sides of the LED board 200 are inserted from the end face opening parts 1151 formed on either one of the end faces 115 of both sides, and slide on the guide part 1137, whereby the board side parts 201 of the board storage part 131 are inserted. It is stored in a pair of guide portions 1137.

図2及び図4に示すように、LED基板200がLED基板支持部材110の基板収納部113に収納されると、LED基板200に装着されたLED210は開口部1131から照射方向P側に露出するように位置する。LED基板200が基板収納部113に収納されると、複数のLED210(図4では6つのLED210)が、開口部1131に長手方向に並んで配置される。また、図2に示すように、LED210は、基板収納部113の開口部1131の両側の縁部1133に挟まれた部位近傍に位置する。あるいは、LED210は、開口部1131の両側の縁部1133に挟まれた部位よりもやや照射方向P側に位置する。つまり、開口部1131の縁部1133が、LED210の発する光を妨げないような位置に、LED210が配置されることが好ましい。そのため、LED基板支持部材110は、LED基板200の高さ、LED210(LEDチップ)の高さ、LED210(LEDチップ)の幅等を考慮して、基板収納部113を設計し、基板収納部113を構成する底面1134、側壁1135、上面部1136、開口部1131、縁部1133等の寸法を(幅・高さ・厚さ・長さ等)決定することが好ましい。   As shown in FIGS. 2 and 4, when the LED substrate 200 is accommodated in the substrate accommodating portion 113 of the LED substrate supporting member 110, the LED 210 attached to the LED substrate 200 is exposed from the opening portion 1131 to the irradiation direction P side. Is located. When the LED substrate 200 is accommodated in the substrate accommodating portion 113, a plurality of LEDs 210 (six LEDs 210 in FIG. 4) are arranged in the opening portion 1131 in the longitudinal direction. As shown in FIG. 2, the LED 210 is located in the vicinity of a portion sandwiched between the edge portions 1133 on both sides of the opening portion 1131 of the substrate storage portion 113. Or LED210 is located in the irradiation direction P side a little rather than the part pinched | interposed into the edge part 1133 of the both sides of the opening part 1131. FIG. That is, it is preferable that the LED 210 is disposed at a position where the edge 1133 of the opening 1131 does not block the light emitted by the LED 210. Therefore, the LED board support member 110 designs the board storage part 113 in consideration of the height of the LED board 200, the height of the LED 210 (LED chip), the width of the LED 210 (LED chip), and the like. It is preferable to determine dimensions (width, height, thickness, length, etc.) of the bottom surface 1134, the side wall 1135, the top surface portion 1136, the opening portion 1131, the edge portion 1133, and the like.

また、図4に示すように、LED基板200は、2つのLED210の間隔(一方のLED210の略中心から他方のLED210の略中心までを結んだ距離)を2Lとした場合、端のLED210hとLED基板支持部材110の端部(端面115)との間隔はLとすることが望ましい。LEDラインモジュール100を複数連結する場合でも、LED210の間隔が均一となるからである。   As shown in FIG. 4, the LED substrate 200 is configured such that the distance between the two LEDs 210 (distance connecting the approximate center of one LED 210 to the approximate center of the other LED 210) is 2L, The distance from the end portion (end surface 115) of the substrate support member 110 is preferably L. This is because even when a plurality of LED line modules 100 are connected, the distance between the LEDs 210 is uniform.

次に、反射部111について説明する。図2に示すように、反射部111は開口部1131の両側の縁部1133から照射方向P側に形成される反射面である。反射部111の面は、縁部1133側(中心側)から外側(樹脂カバー120側)に向かって、徐々に照射方向Pに向かうように傾斜している。すなわち、反射部111は、断面が逆八の字状になっている。これにより、LED210から発せられる光は、反射部111によって反射され、照射方向Pに照射される。このように、反射部111がLED基板支持部材110に一体形成されているので、少ない部品数で光の取り出し効率を向上させることができる。   Next, the reflection unit 111 will be described. As shown in FIG. 2, the reflection portion 111 is a reflection surface formed on the irradiation direction P side from the edge portions 1133 on both sides of the opening portion 1131. The surface of the reflecting portion 111 is inclined so as to gradually go in the irradiation direction P from the edge 1133 side (center side) toward the outside (resin cover 120 side). That is, the reflecting portion 111 has an inverted eight-shaped cross section. Thereby, the light emitted from the LED 210 is reflected by the reflecting portion 111 and irradiated in the irradiation direction P. Thus, since the reflection part 111 is integrally formed with the LED board support member 110, the light extraction efficiency can be improved with a small number of components.

次に、金属ヒートシンク112(放熱部)について説明する。金属ヒートシンク112(放熱部)は、照射方向P側の反対側(背面方向Q側)に伸びた複数の放熱フィン1121を備える。放熱フィン1121は、LED基板支持部材110の両側の端面115まで延在して形成される(図1の(b)、図1の(c)参照)。   Next, the metal heat sink 112 (heat radiation part) will be described. The metal heat sink 112 (heat dissipating part) includes a plurality of heat dissipating fins 1121 extending on the opposite side of the irradiation direction P side (back surface direction Q side). The radiation fins 1121 are formed to extend to the end surfaces 115 on both sides of the LED substrate support member 110 (see FIGS. 1B and 1C).

複数の放熱フィンの各放熱フィン1121は、基板収納部113の底面1134の幅方向の略中心線1132(図2,図3参照)を中心軸として略放射方向に伸びている。   Each radiating fin 1121 of the plurality of radiating fins extends in a substantially radial direction with a substantially central line 1132 (see FIGS. 2 and 3) in the width direction of the bottom surface 1134 of the substrate housing portion 113 as a central axis.

図5は、本実施の形態のLEDラインモジュール100の端面の各箇所の寸法の関係を示す図である。本実施の形態では、図5に示すように、5枚の放熱フィン1121a〜1121eが、略中心線1132を中心軸として、放射状に伸びて形成されている。また、5枚の放熱フィン1121a〜1121eは、長さL5が略等しい。   FIG. 5 is a diagram showing the relationship of the dimensions of each part of the end face of the LED line module 100 of the present embodiment. In the present embodiment, as shown in FIG. 5, five radiating fins 1121 a to 1121 e are formed to extend radially about the center line 1132 as a central axis. Further, the five heat dissipating fins 1121a to 1121e have substantially the same length L5.

LED基板支持部材110の平面部分の面と放熱フィン1121aとの角度はθ1、放熱フィン1121aと放熱フィン1121bとの角度はθ2、放熱フィン1121bと放熱フィン1121cとの角度はθ3、放熱フィン1121cと放熱フィン1121dとの角度はθ4、放熱フィン1121dと放熱フィン1121eとの角度はθ5、放熱フィン1121eとLED基板支持部材110の平面部分の面との角度はθ6である。ここでは、θ1〜θ6の角度を略均一とするのが好ましい。すなわち、θ1(≒θ2≒θ3≒θ4≒θ5≒θ6)≒30°が好ましい。金属ヒートシンク112の放熱効率が均一となり、放熱効率の向上につながるからである。しかし、LEDラインモジュール100の設置箇所等による金属ヒートシンク112近傍の気流の流れ等によってはθ1〜θ6の角度を変化させることにより、より放熱効率を向上させることができる。例えば、θ1≒θ6≒50°とし、θ2≒θ3≒θ4≒θ5≒20°としてもよい。あるいは、θ1≒50°とし、θ2≒θ3≒θ4≒θ5≒θ6≒26°としてもよい。また、放熱フィン1121は、5枚でなくてもよい。例えば、放熱フィン1121は、3枚、あるいは7枚、あるいはその他の枚数でも良い。   The angle between the plane portion of the LED substrate support member 110 and the radiation fin 1121a is θ1, the angle between the radiation fin 1121a and the radiation fin 1121b is θ2, the angle between the radiation fin 1121b and the radiation fin 1121c is θ3, and the radiation fin 1121c. The angle between the heat dissipating fin 1121d is θ4, the angle between the heat dissipating fin 1121d and the heat dissipating fin 1121e is θ5, and the angle between the heat dissipating fin 1121e and the plane portion of the LED substrate support member 110 is θ6. Here, it is preferable to make the angles of θ1 to θ6 substantially uniform. That is, θ1 (≈θ2≈θ3≈θ4≈θ5≈θ6) ≈30 ° is preferable. This is because the heat dissipation efficiency of the metal heat sink 112 becomes uniform, leading to an improvement in the heat dissipation efficiency. However, the heat radiation efficiency can be further improved by changing the angles of θ1 to θ6 depending on the flow of the air current in the vicinity of the metal heat sink 112 due to the installation location of the LED line module 100 or the like. For example, θ1≈θ6≈50 ° may be set, and θ2≈θ3≈θ4≈θ5≈20 ° may be set. Alternatively, θ1≈50 ° and θ2≈θ3≈θ4≈θ5≈θ6≈26 ° may be set. Further, the number of the radiation fins 1121 may not be five. For example, the number of radiating fins 1121 may be three, seven, or other number.

LEDラインモジュール100の断面は、図2に示す端面図と同様となる。ここで、図2に示すように、半円筒形状の樹脂カバー120の半径L1と、LED基板支持部材110の幅の1/2、すなわち、略中心線から部材側部までの距離(最短距離)L2と、略中心線1132から放熱フィン1121の先端までの距離(最短距離)L3とは略等しい。これにより、LEDラインモジュール100の断面は、半径L1(≒L2≒L3)の略円形状となる。   The cross section of the LED line module 100 is the same as the end view shown in FIG. Here, as shown in FIG. 2, the radius L1 of the semi-cylindrical resin cover 120 and 1/2 of the width of the LED substrate support member 110, that is, the distance (shortest distance) from the substantially center line to the side of the member. L2 and the distance (shortest distance) L3 from the substantially center line 1132 to the tip of the radiation fin 1121 are substantially equal. As a result, the cross section of the LED line module 100 has a substantially circular shape with a radius L1 (≈L2≈L3).

図5に示すように、L1:L2:L3の比は、約1:1:1である。例えば、L1:L2:L3の比を約2:3:2とすることで、断面が略楕円形状のLEDラインモジュール100を得ることができる。   As shown in FIG. 5, the ratio of L1: L2: L3 is about 1: 1: 1. For example, by setting the ratio of L1: L2: L3 to about 2: 3: 2, the LED line module 100 having a substantially elliptical cross section can be obtained.

金属ヒートシンク112は、断面が半径L4の略半円形状の逆かまぼこ状である肉厚部1122を備える。放熱フィン1121a〜1121eは、肉厚部1122の表面から放射状に伸びており、長さはL5(=L3−L4)である。放熱フィン1121a〜1121eは、アルミニウム等で形成されているため、変形しやすい。肉厚部1122を備えることにより、金属ヒートシンク112が変形しにくい構造となるとともに、放熱効率を向上にさせることもできる。   The metal heat sink 112 includes a thick portion 1122 having a substantially semicircular inverted kamaboko shape with a radius L4 in cross section. The radiation fins 1121a to 1121e extend radially from the surface of the thick portion 1122, and have a length of L5 (= L3-L4). Since the radiation fins 1121a to 1121e are made of aluminum or the like, they are easily deformed. By providing the thick portion 1122, the metal heat sink 112 has a structure that is not easily deformed, and the heat dissipation efficiency can be improved.

図5に示すように、肉厚部1122の半径L4と放熱フィン1121の長さL5との比は、L4:L5は約5:6である。放熱効率やLEDラインモジュール100の設置場所等を考慮してL4:L5を変化させても良い。例えば、L4:L5は約1:1、あるいは約1:2、あるいは約2:3、あるいはその他の比でもよい。   As shown in FIG. 5, the ratio of the radius L4 of the thick portion 1122 to the length L5 of the radiating fin 1121 is L5: L5 is about 5: 6. L4: L5 may be changed in consideration of heat dissipation efficiency, the installation location of the LED line module 100, and the like. For example, L4: L5 may be about 1: 1, alternatively about 1: 2, alternatively about 2: 3, or other ratios.

また、本実施にの形態では、放熱フィン1121は、LED基板支持部材110の両側の端面115まで延在するものとして説明した。しかし、図1の(c)に示すように、長手方向の所定の位置に、放熱フィン1121を切り欠いた切り欠き部1123を形成しても良い。図1の(c)に示す切り欠き部1123は、点線と点線との間に存在する放熱フィン1121の部分をカットする(切り欠く)ことを示している。これにより、金属ヒートシンク112は、短手方向の空気の流れを通すことができ放熱効率を向上させることができる。切り欠き部1123は、長手方向に略直交して形成されても良いし、長手方向に対して傾斜して形成されても良い。また、複数の切り欠き部1123が、長手方向に均一に並ぶように形成されるのが好ましい。例えば、5カ所の切り欠き部1123、あるいは10カ所の切り欠き部、あるいは20カ所の切り欠き部、あるいはその他の数の切り欠き部1123を形成しても良い。また、切り欠き部1123は、形成しなくても良い。   Moreover, in this Embodiment, the radiation fin 1121 demonstrated as what extends to the end surface 115 of the both sides of the LED board support member 110. As shown in FIG. However, as shown in FIG. 1C, a notch 1123 may be formed by notching the radiating fin 1121 at a predetermined position in the longitudinal direction. A notch 1123 shown in FIG. 1C indicates that a portion of the heat radiation fin 1121 existing between the dotted lines is cut (notched). Thereby, the metal heat sink 112 can let the air flow of a transversal direction pass, and can improve heat dissipation efficiency. The notch 1123 may be formed substantially orthogonal to the longitudinal direction, or may be formed inclined with respect to the longitudinal direction. Further, it is preferable that the plurality of cutout portions 1123 are formed so as to be evenly arranged in the longitudinal direction. For example, five notch portions 1123, 10 notch portions, 20 notch portions, or other number of notch portions 1123 may be formed. Further, the notch 1123 may not be formed.

以上のように、本実施の形態におけるLEDラインモジュール100によれば、LED210を有するLED基板200を支持するLED基板支持部材110を備える光源モジュールにおいて、LED基板支持部材110は、照射方向P側に開口部1131を有し、LED基板200の両側の基板側部201を収納する一対のガイド部1137を有する基板収納部113(溝部)と、開口部1131の縁部1133から照射方向P側に徐々に傾斜するように形成された反射部111と、基板背面方向Q側に形成され、LED基板200の発する熱を放熱する金属ヒートシンク112(放熱部)とを備えるので、略正方形のLED基板あってもライン形のLED基板200であっても収納することができる。   As described above, according to the LED line module 100 in the present embodiment, in the light source module including the LED substrate support member 110 that supports the LED substrate 200 having the LEDs 210, the LED substrate support member 110 is arranged on the irradiation direction P side. A substrate housing portion 113 (groove portion) having an opening 1131 and a pair of guide portions 1137 for housing the substrate side portions 201 on both sides of the LED substrate 200, and gradually from the edge 1133 of the opening 1131 to the irradiation direction P side. And a metal heat sink 112 (heat dissipating part) that dissipates heat generated by the LED substrate 200 and is formed on the substrate back surface direction Q side. Even the line-shaped LED substrate 200 can be accommodated.

また、本実施の形態におけるLEDラインモジュール100によれば、LED基板支持部材110は、一体形成されているので、部品点数を増やすことなく、LEDの光の取り出し効率の高いLEDラインモジュール100を提供することができ、コストの低減を図ることができる。   In addition, according to the LED line module 100 in the present embodiment, the LED substrate support member 110 is integrally formed, so that the LED line module 100 with high LED light extraction efficiency can be provided without increasing the number of components. The cost can be reduced.

また、本実施の形態におけるLEDラインモジュール100によれば、LED基板支持部材110の両端面115に一対の端面開口部1151(ガイド開口部)を形成し、LED基板200の基板側部201は、両端面115のうちのいずれか一方の端面115に形成された端面開口部1151から挿入されガイド部1137をスライドすることにより、基板収納部113の一対のガイド部1137に収納されるので、LED基板を着脱可能に収納することができる。   Further, according to the LED line module 100 in the present embodiment, a pair of end surface openings 1151 (guide openings) are formed on both end surfaces 115 of the LED substrate support member 110, and the substrate side portion 201 of the LED substrate 200 is The LED board is housed in the pair of guide parts 1137 of the board housing part 113 by sliding through the guide part 1137 inserted from the end face opening 1151 formed on one of the end faces 115 of the both end faces 115. Can be stored detachably.

また、本実施の形態におけるLEDラインモジュール100によれば、金属ヒートシンク112は、基板背面方向Q側に伸びた放熱フィン1121であって両側の端面115まで延在して形成された放熱フィン1121を複数備え、複数の放熱フィン1121a〜1121eの各放熱フィン1121は、底面1134の幅方向の略中心線1132から略放射方向に伸びているので、放熱効率を向上させることができる。   In addition, according to the LED line module 100 in the present embodiment, the metal heat sink 112 includes the heat radiation fins 1121 extending to the substrate back surface direction Q side and extending to the end surfaces 115 on both sides. A plurality of heat radiation fins 1121a to 1121e are provided, and each heat radiation fin 1121 extends in a substantially radial direction from a substantially center line 1132 in the width direction of the bottom surface 1134. Therefore, heat radiation efficiency can be improved.

また、本実施の形態におけるLEDラインモジュール100によれば、開口部1131を覆う半円筒状の樹脂カバー120を備え、LED基板支持部材110は、樹脂カバー120を取り付けるカバー取付部114(カバー取付ガイド部)であって樹脂カバー120の両側辺122に形成されたカバー突起部121(側辺部)をスライドさせて取り付けるカバー取付部114(カバー取付ガイド部)を備えるので、部品点数を増やすことなく樹脂カバー120を取り付けることができる。   In addition, according to the LED line module 100 in the present embodiment, the semi-cylindrical resin cover 120 that covers the opening 1131 is provided, and the LED substrate support member 110 has a cover mounting portion 114 (cover mounting guide) for mounting the resin cover 120. The cover mounting portion 114 (cover mounting guide portion) is mounted by sliding the cover protrusions 121 (side side portions) formed on both sides 122 of the resin cover 120 without increasing the number of parts. A resin cover 120 can be attached.

また、本実施の形態におけるLEDラインモジュール100によれば、基板収納部113(溝部)に直交する断面が略円形状であるので、従来のライン形蛍光灯に変わるライン形LED照明として利用することができる。   In addition, according to the LED line module 100 in the present embodiment, the cross section orthogonal to the substrate housing portion 113 (groove portion) is substantially circular, so that it can be used as a line-type LED illumination that replaces a conventional line-type fluorescent lamp. Can do.

100 LEDラインモジュール、110 LED基板支持部材、111 反射部、112 金属ヒートシンク、113 基板収納部、114 カバー取付部、115 端面、120 樹脂カバー、121 カバー突起部、122 側辺、200 LED基板、201 基板側部、210 LED、210h 端のLED、1121,1121a,1121b,1121c,1121d,1121e 放熱フィン、1122 肉厚部、1123 切り欠き部、1131 開口部、1132 略中心線、1133 縁部、1134 底面、1135 側壁、1136 上面部、1137 ガイド部、1138 照射方向略中心線、1151 端面開口部。   DESCRIPTION OF SYMBOLS 100 LED line module, 110 LED board support member, 111 Reflection part, 112 Metal heat sink, 113 Board storage part, 114 Cover attachment part, 115 End surface, 120 Resin cover, 121 Cover projection part, 122 Side, 200 LED board, 201 Substrate side, 210 LED, 210h end LED, 1121, 1121a, 1121b, 1121c, 1121d, 1121e Radiation fin, 1122 Thick part, 1123 Notch part, 1131 opening part, 1132 substantially center line, 1133 edge part, 1134 Bottom surface, 1135 side wall, 1136 upper surface portion, 1137 guide portion, 1138 Irradiation direction substantially center line, 1151 end surface opening portion.

Claims (7)

光源を有する光源基板を支持する光源基板支持部材を備える光源モジュールにおいて、
前記光源基板支持部材は、
前記光源の照射方向側に開口を形成する溝部であって、前記光源基板と当接する底面部と、前記光源基板の両側の側部と対向する一対の側壁と、前記一対の側壁のそれぞれから前記光源基板の前記光源が実装された実装面と対向するように前記光源近傍まで延びた一対の上面部と、前記底面部と前記一対の側壁と前記一対の上面部とにより形成され、前記光源基板の両側の側部を収納する一対のガイド部を有する溝部と、
前記溝部の前記開口の縁部から前記照射方向側に形成された反射部と、
前記底面部の前記照射方向側の反対側に前記底面部から連続して形成され、前記光源基板の発する熱を放熱する放熱部とを備え、
前記放熱部は、
前記底面部の前記照射方向側の反対側から前記照射方向側の反対側に隆起した肉厚部と、
前記肉厚部の表面から前記照射方向側の反対側に伸びた複数の放熱フィンと
を備えることを特徴とする光源モジュール。
In a light source module comprising a light source substrate support member that supports a light source substrate having a light source,
The light source substrate support member is
There in the groove to form an opening in the radiation direction of the light source, a front Symbol source substrate abutting the bottom portion, and a pair of side walls facing the opposite side of the light source substrate, from each of the pair of side walls The light source board is formed by a pair of upper surface portions extending to the vicinity of the light source so as to face a mounting surface on which the light source is mounted, the bottom surface portion, the pair of side walls, and the pair of upper surface portions. a groove and a pair of guide portions for accommodating the opposite side of the substrate,
A reflecting portion formed on the irradiation direction side from an edge of the opening of the groove;
A heat dissipating part that is continuously formed from the bottom part on the opposite side of the irradiation direction side of the bottom part and dissipates heat generated by the light source substrate;
The heat dissipation part is
A thickened portion raised from the opposite side of the irradiation direction side to the opposite side of the irradiation direction side of the bottom surface part,
A light source module comprising: a plurality of heat radiation fins extending from the surface of the thick portion to the opposite side of the irradiation direction side.
前記複数の放熱フィンは、
各放熱フィン前記光源基板支持部材の一方の端面から他方の端面に向かう長手方向にかけて形成された板状であり、長手方向を横切るように切り欠いた切り欠きが形成されたことを特徴とする請求項1に記載の光源モジュール。
The plurality of radiating fins are:
Each radiating fin has a plate shape formed in a longitudinal direction from one end surface to the other end surface of the light source substrate support member, and is formed with a notch cut out so as to cross the longitudinal direction. The light source module according to claim 1.
前記複数の放熱フィンの各放熱フィンは、
前記底面部において前記光源基板と当接する面の幅方向の略中心同士を結ぶ中心線であって前記底面部の長手方向に沿う中心線に対して略放射方向に伸びていることを特徴とする請求項1または2に記載の光源モジュール。
Each radiating fin of the plurality of radiating fins is:
A center line connecting substantially the centers in the width direction of the surface contacting the light source substrate in the bottom surface portion, and extending in a substantially radial direction with respect to the center line along the longitudinal direction of the bottom surface portion. The light source module according to claim 1.
前記肉厚部の表面から前記複数の放熱フィンの各放熱フィンの先端までの長さは、前記中心線から前記先端までの長さの2分の1から3分の2の範囲内であることを特徴とする請求項3に記載の光源モジュール。   The length from the surface of the thick part to the tips of the heat radiating fins of the plurality of radiating fins is in the range of one-half to two-thirds of the length from the center line to the tip. The light source module according to claim 3. 前記光源基板支持部材は、一体形成されていることを特徴とする請求項1〜4のいずれかに記載の光源モジュール。   The light source module according to claim 1, wherein the light source substrate support member is integrally formed. 前記一対のガイド部は、前記光源基板支持部材の一方の端面から他方の端面にかけて形成され、前記一方の端面と前記他方の端面とに一対のガイド開口部を形成し、
前記光源基板の両側の側部は、前記一対のガイド開口部のうちのいずれかの前記ガイド開口部から挿入され前記一対のガイド部をスライドすることにより、前記一対のガイド部に収納されることを特徴とする請求項1〜5のいずれかに記載の光源モジュール。
The pair of guide portions are formed from one end face to the other end face of the light source substrate support member, and form a pair of guide openings on the one end face and the other end face,
The side portions on both sides of the light source substrate are inserted into the guide opening portion of any one of the pair of guide opening portions, and are housed in the pair of guide portions by sliding the pair of guide portions. The light source module according to any one of claims 1 to 5.
前記光源モジュールは、さらに、前記開口を覆う半円筒状の樹脂カバーを備え、
前記光源基板支持部材は、
前記樹脂カバーを取り付けるカバー取付ガイド部であって前記樹脂カバーの両側辺である両側辺部をスライドさせて取り付けるカバー取付ガイド部を備えることを特徴とする請求項1〜6のいずれかに記載の光源モジュール。
The light source module further includes a semi-cylindrical resin cover that covers the opening,
The light source substrate support member is
The cover attachment guide part which attaches the said resin cover, Comprising: The cover attachment guide part attached by sliding the both sides which are the both sides of the said resin cover is provided. Light source module.
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