JP6198122B2 - Light emitting unit and lighting fixture - Google Patents

Light emitting unit and lighting fixture Download PDF

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JP6198122B2
JP6198122B2 JP2013151013A JP2013151013A JP6198122B2 JP 6198122 B2 JP6198122 B2 JP 6198122B2 JP 2013151013 A JP2013151013 A JP 2013151013A JP 2013151013 A JP2013151013 A JP 2013151013A JP 6198122 B2 JP6198122 B2 JP 6198122B2
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light emitting
circuit board
emitting unit
semiconductor light
unit
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JP2015022938A (en
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高明 片岡
高明 片岡
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Panasonic Intellectual Property Management Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
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Description

本発明は、複数の光源を線状に配置した発光ユニットおよび照明器具に関するものである。   The present invention relates to a light emitting unit and a lighting fixture in which a plurality of light sources are linearly arranged.

従来、ＬＥＤ（発光ダイオード）を光源として用いた光源ユニットおよび光源ユニットを備える照明器具が知られている（例えば、特許文献１参照）。
図１０（Ａ）および図１０（Ｂ）に示すように、特許文献１に記載の光源ユニット１００は、光源ユニット１００を構成する複数の単位光源ユニット１０１を有する。
単位光源ユニット１０１の底部には、略長方形状のＬＥＤ基板１０２が取り付けられている。ＬＥＤ基板１０２には、５つのＬＥＤ１０３が長辺方向に並んで略均一の間隔Ｌ１で配置されている。端部のＬＥＤ１０３は、ＬＥＤ基板１０２の端面から距離Ｌ２だけ内側に配置されている。ここで、Ｌ１≒Ｌ２×２とすることが好ましい。
なお、光源ユニット１００では、同一の構成のＬＥＤ基板１０２が長辺方向に連結されている。 DESCRIPTION OF RELATED ART Conventionally, the lighting fixture provided with the light source unit and LED light source unit which used LED (light emitting diode) as a light source is known (for example, refer patent document 1).
As shown in FIGS. 10A and 10B, the light source unit 100 described in Patent Document 1 includes a plurality of unit light source units 101 constituting the light source unit 100.
A substantially rectangular LED substrate 102 is attached to the bottom of the unit light source unit 101. On the LED substrate 102, five LEDs 103 are arranged in the long side direction at a substantially uniform interval L1. The LED 103 at the end is disposed on the inner side from the end face of the LED substrate 102 by a distance L2. Here, it is preferable that L1≈L2 × 2.
In the light source unit 100, the LED boards 102 having the same configuration are connected in the long side direction.

ＬＥＤ基板１０２は、他のＬＥＤ基板１０２と物理的に連結される連結部位１０４と、連結部位以外の非連結部位１０５と、他のＬＥＤ基板１０２と電気的に接続するためのコネクタ１０６とを有する。コネクタ１０６は非連結部位１０５に設けられており、コネクタ１０６は電線１０７で接続される。   The LED board 102 includes a connection part 104 that is physically connected to another LED board 102, a non-connection part 105 other than the connection part, and a connector 106 that is electrically connected to the other LED board 102. . The connector 106 is provided at the non-connection portion 105, and the connector 106 is connected by an electric wire 107.

単位光源ユニット１０１におけるＬＥＤ基板１０２同士の物理的な連結は連結部位１０４同士を隣り合わせて連結させて配置している。
また、ＬＥＤ基板１０２同士の電気的な接続は、非連結部位１０５のコネクタ１０６で行われるので、連結部位１０４の外形上（形状、意匠）には影響を及ばさず、複数のＬＥＤ基板１０２が、あたかも一体に形成されているかのように構成される。
さらに、長辺方向に所定の数のＬＥＤ基板１０２を連結させても、隣り合う端部のＬＥＤ１０３同士の間隔Ｌ３はＬ１と略等しくなるので、光源ユニット１００は、光源として均一に光を照射することができる。 The physical connection of the LED substrates 102 in the unit light source unit 101 is arranged by connecting the connection parts 104 next to each other.
In addition, since the electrical connection between the LED substrates 102 is performed by the connector 106 of the non-connecting portion 105, the external shape (shape, design) of the connecting portion 104 is not affected, and the plurality of LED substrates 102 are connected. It is configured as if it were integrally formed.
Further, even if a predetermined number of LED substrates 102 are connected in the long side direction, the distance L3 between the LEDs 103 at the adjacent end portions is substantially equal to L1, so that the light source unit 100 emits light uniformly as a light source. be able to.

特開２０１１−２３２２７号公報（第３図）JP 2011-23227 A (FIG. 3)

ところで、前述した従来の発光ユニットにおいては、発光ユニットを連結する際に、光源を実装した回路基板を線状に連結させている。
しかしながら、実際には、回路基板を直接連結する場合ばかりではなく、回路基板を支持（載置）する支持部材同士を線状に連結する場合がある。このような場合には、支持部材の連結部において、隣り合う発光ユニットにおける近接する最外側のＬＥＤ同士の間隔が、それらＬＥＤ同士に存在する支持部材の長さ分、開くことになるため、光源の間隔が不均一になり、照明器具の発光を見たとき、発光むらが生じて、意匠的に好ましくないという問題があった。 By the way, in the conventional light emitting unit described above, when the light emitting units are connected, the circuit boards on which the light sources are mounted are connected linearly.
However, in practice, not only the circuit boards are directly connected, but also the support members that support (place) the circuit boards may be connected in a line. In such a case, the distance between the adjacent outermost LEDs in the adjacent light emitting units at the connecting portion of the support member is opened by the length of the support member existing between the LEDs. When the light emission of the lighting fixture is observed, unevenness of light emission occurs, which is not desirable in design.

本発明は、従来の問題を解決するためになされたもので、光源を実装した回路基板を支持した支持部材を線状に連結した場合でも、光源の間隔を均一に配置して意匠的に向上させることができる発光ユニットおよび照明器具を提供することを目的とする。   The present invention has been made to solve the conventional problems, and even when the support member supporting the circuit board on which the light source is mounted is linearly connected, the distance between the light sources is uniformly arranged to improve the design. It is an object of the present invention to provide a light emitting unit and a lighting fixture that can be made to operate.

本発明の発光ユニットは、帯状の回路基板と、前記回路基板の実装面に設定された配列線に沿って等間隔で設けられた第１発光部および第２発光部と、を備え、前記第１発光部および前記第２発光部は、それぞれ前記実装面に相互に近接して実装された複数の半導体発光素子を有し、前記第１発光部を構成する複数の半導体発光素子と、前記第２発光部を構成する複数の半導体発光素子とは、同一の組合せであるとともに、前記第１発光部における前記各半導体発光素子のうち、前記第２発光部に最も近い前記半導体発光素子と、前記第２発光部における前記各半導体発光素子のうち、前記第１発光部に最も近い前記半導体発光素子と、の間の第１離間寸法に対して、前記第１発光部における前記各半導体発光素子のうち、前記回路基板における前記配列線に沿った基板縁部と、前記基板縁部に最も近い前記半導体発光素子と、の間の第２離間寸法が２分の１以下であり、前記回路基板における前記実装面とは反対側の裏面を支持する本体と、前記本体の周部に設けられ、前記回路基板の平面輪郭より突出する枠状の鍔部とを有するハウジングを更に備え、前記第１発光部における前記各半導体発光素子のうち、前記ハウジングにおける前記配列線に沿ったハウジング縁部と、前記ハウジング縁部に最も近い前記半導体発光素子と、の間の第３離間寸法が前記第１離間寸法に対して２分の１以下であり、更に、前記回路基板を複数有し、前記各回路基板における前記配列線が互いに同一線に沿うように前記ハウジングに支持され、前記各回路基板のうち、一方の回路基板における前記各半導体発光素子のうち、他方の回路基板に最も近い前記半導体発光素子と、前記各回路基板のうち、他方の回路基板における前記各半導体発光素子のうち、一方の回路基板に最も近い前記半導体発光素子と、の間の第４離間寸法が前記第１離間寸法と等しく、前記第１発光部および前記第２発光部は、発光形態が異なる第１半導体発光素子および第２半導体発光素子を備え、前記第１発光部および前記第２発光部は、それぞれ前記第１半導体発光素子および前記第２半導体発光素子が前記配列線に沿って配列されているとともに、前記第１発光部における前記第１半導体発光素子は前記回路基板における長手方向一端側に配置され、前記第２発光部における前記第１半導体発光素子は前記回路基板における長手方向他端側に配置されている。 The light emitting unit of the present invention includes a belt-like circuit board, and a first light emitting part and a second light emitting part provided at equal intervals along an array line set on a mounting surface of the circuit board, Each of the first light emitting unit and the second light emitting unit includes a plurality of semiconductor light emitting elements mounted close to each other on the mounting surface, the plurality of semiconductor light emitting elements constituting the first light emitting unit, The plurality of semiconductor light emitting elements constituting the two light emitting parts are the same combination, and among the semiconductor light emitting elements in the first light emitting part, the semiconductor light emitting element closest to the second light emitting part, Of each of the semiconductor light emitting elements in the second light emitting section, the first light emitting section is closest to the semiconductor light emitting element closest to the first light emitting section. Of which, the circuit board The second separation dimension between the substrate edge along the array line and the semiconductor light emitting element closest to the substrate edge is less than or equal to one half, and the mounting surface of the circuit board is Each of the semiconductors in the first light emitting unit further includes a housing having a main body that supports the back surface on the opposite side, and a frame-shaped flange that is provided on a peripheral portion of the main body and protrudes from a planar outline of the circuit board. Among the light emitting elements, a third separation dimension between a housing edge along the array line in the housing and the semiconductor light emitting element closest to the housing edge is 2 minutes with respect to the first separation dimension. Of the circuit boards, and the array lines of the circuit boards are supported by the housing so as to be along the same line, and one of the circuit boards Previous Among the semiconductor light emitting elements, the semiconductor light emitting element closest to the other circuit board and the semiconductor light emitting element closest to one circuit board among the semiconductor light emitting elements of the other circuit board among the circuit boards. and element, rather fourth equal spacing dimensions and said first spacing dimension between the first light emitting unit and the second light emitting section, the first semiconductor light emitting element and the second semiconductor light emitting element emitting embodiment is different The first light emitting unit and the second light emitting unit are arranged such that the first semiconductor light emitting element and the second semiconductor light emitting element are arranged along the alignment line, respectively, and the first light emitting unit and the second light emitting unit are arranged in the first light emitting unit. One semiconductor light emitting element is disposed on one end side in the longitudinal direction of the circuit board, and the first semiconductor light emitting element in the second light emitting section is disposed on the other end side in the longitudinal direction of the circuit board. .

また、本発明の発光ユニットは、前記ハウジングを複数有し、前記各ハウジングにおける前記各回路基板の前記配列線が互いに同一線に沿うように前記各ハウジングが配列されている。   The light emitting unit of the present invention includes a plurality of the housings, and the housings are arranged so that the arrangement lines of the circuit boards in the housings are along the same line.

さらに、本発明の照明器具は、前述した発光ユニットのうちのいずれかの発光ユニットを備えたものである。   Furthermore, the lighting fixture of this invention is equipped with the light emission unit in any one of the light emission units mentioned above.

本発明では、発光ユニットは、配列線に沿って等間隔で設けられ複数の半導体発光素子を有する第１発光部および第２発光部を有する。第１発光部における各半導体発光素子のうち第２発光部に最も近いものと、第２発光部のうち第１発光部に最も近いものとの間の距離を第１離間寸法とする。また、配列線に沿った基板縁部と、第１発光部における各半導体発光素子のうち基板縁部に最も近いものとの間の距離を第２離間寸法とする。そして、第２離間寸法が第１離間寸法の２分の１以下となるように配置した。
これにより、半導体発光素子を実装した回路基板を連結した場合でも、発光部の間隔を全体的に均一に配置することができ、意匠的に向上させることができるという効果を有する発光ユニットおよび照明器具を提供できる。 In the present invention, the light emitting unit includes a first light emitting unit and a second light emitting unit that are provided at equal intervals along the array line and have a plurality of semiconductor light emitting elements. A distance between each semiconductor light emitting element in the first light emitting unit closest to the second light emitting unit and a second light emitting unit closest to the first light emitting unit is defined as a first separation dimension. In addition, the distance between the substrate edge along the array line and the semiconductor light emitting element in the first light emitting unit that is closest to the substrate edge is defined as a second separation dimension. And it arrange | positioned so that a 2nd separation dimension may become 1/2 or less of a 1st separation dimension.
Thereby, even when the circuit boards on which the semiconductor light emitting elements are mounted are connected, the light emitting unit and the luminaire having an effect that the intervals between the light emitting portions can be arranged uniformly and can be improved in design. Can provide.

本発明に係る第１実施形態の照明器具の断面図Sectional drawing of the lighting fixture of 1st Embodiment which concerns on this invention 本発明に係る第１実施形態の発光ユニットを下方から見た斜視図The perspective view which looked at the light emitting unit of 1st Embodiment which concerns on this invention from the downward direction 本発明に係る第１実施形態の発光ユニットを下方から見た分解斜視図The disassembled perspective view which looked at the light emission unit of 1st Embodiment which concerns on this invention from the downward direction 本発明に係る第１実施形態の発光ユニットの回路基板における発光部の配置を示す平面図The top view which shows arrangement | positioning of the light emission part in the circuit board of the light emission unit of 1st Embodiment which concerns on this invention. １個の回路基板を支持するハウジングを複数個連結した状態を示す平面図The top view which shows the state which connected the housing which supports one circuit board in multiple numbers 本発明に係る第２実施形態の発光ユニットおよび照明器具の回路基板における発光部の配置を示す平面図The top view which shows arrangement | positioning of the light emission part in the circuit board of the light emission unit of 2nd Embodiment which concerns on this invention, and a lighting fixture. 第３実施形態の発光ユニットおよび照明器具における回路基板の平面図The top view of the circuit board in the light emitting unit and lighting fixture of 3rd Embodiment 第４実施形態の発光ユニットおよび照明器具における回路基板の平面図The top view of the circuit board in the light emission unit of 4th Embodiment, and a lighting fixture （Ａ）〜（Ｃ）は発光部におけるＬＥＤユニットの配置の変形例を示す説明図(A)-(C) is explanatory drawing which shows the modification of arrangement | positioning of the LED unit in a light emission part. （Ａ）は従来の光源ユニットにおける単位光源ユニットの一部破断平面図であり、（Ｂ）は３つの単位光源ユニットが連結された光源ユニットを示す一部破断平面図(A) is a partially broken plan view of a unit light source unit in a conventional light source unit, and (B) is a partially broken plan view showing a light source unit in which three unit light source units are connected.

（第１実施形態）
以下、第１実施形態の発光ユニットおよび照明器具について、図面を用いて説明する。
図１に示すように、第１実施形態の照明器具１０Ａは、被取付部である例えば天井面１１に取り付けて、下方を照明するのに用いることができる。
なお、以下の説明においては、照明器具１０Ａの照明方向を「下」とし、照明方向と反対側を「上」として説明する。 (First embodiment)
Hereinafter, the light emitting unit and the lighting apparatus of the first embodiment will be described with reference to the drawings.
As shown in FIG. 1, the luminaire 10 </ b> A of the first embodiment can be used to illuminate the lower part by being attached to, for example, a ceiling surface 11 that is an attached part.
In the following description, it is assumed that the illumination direction of the lighting fixture 10A is “down” and the opposite side to the illumination direction is “up”.

照明器具１０Ａは、天井面１１等の造営材に取り付けられる矩形平板状の器具本体２０と、器具本体２０の下面に長手方向に沿って取り付けられる断面台形状の台座２１を有する。
台座２１の底面２１１には、詳細を後述する第１実施形態の発光ユニット３０Ａが長手方向に沿って取り付けられる。台座２１の内部には、電源装置２２が器具本体２０の下面に取り付けられて収容される。器具本体２０の下面には、発光ユニット３０Ａを覆う透光性を有する本体カバー２３が取り付けられる。本体カバー２３は、器具本体２０の外形に沿った例えば断面台形状の乳白色の樹脂製のカバーである。 10 A of lighting fixtures have the rectangular flat plate-shaped fixture main body 20 attached to construction materials, such as the ceiling surface 11, and the base 21 of the cross-sectional trapezoid shape attached to the lower surface of the fixture main body 20 along a longitudinal direction.
The light emitting unit 30A of the first embodiment, which will be described in detail later, is attached to the bottom surface 211 of the base 21 along the longitudinal direction. Inside the pedestal 21, the power supply device 22 is attached and accommodated on the lower surface of the instrument body 20. A light-transmitting main body cover 23 that covers the light emitting unit 30 </ b> A is attached to the lower surface of the instrument main body 20. The main body cover 23 is a milky white resin cover having a trapezoidal cross section, for example, along the outer shape of the instrument main body 20.

次に、発光ユニット３０Ａについて、詳述する。
図２および図３に示すように、発光ユニット３０Ａは、帯状の回路基板４０を有する。回路基板４０は、ハウジング３２に支持されるとともに、ハウジング３２に固定される透過パネル３３に覆われる。透過パネル３３は、上カバー３４によってハウジング３２に取り付けられる。 Next, the light emitting unit 30A will be described in detail.
As shown in FIGS. 2 and 3, the light emitting unit 30 </ b> A has a strip-shaped circuit board 40. The circuit board 40 is supported by the housing 32 and is covered with a transmission panel 33 fixed to the housing 32. The transmission panel 33 is attached to the housing 32 by the upper cover 34.

ハウジング３２は、回路基板４０が取り付けられる矩形板状のハウジング本体（本体）３２１と、ハウジング本体３２１の周部に設けられ、回路基板４０の平面輪郭より突出する枠状の鍔部３２２とを有する。
鍔部３２２には、発光ユニット３０Ａを組立てるためのねじ３５用の貫通孔３２３が設けられている。ここでは、鍔部３２２の長手方向両端における幅方向両側の４個と、長手方向中央における幅方向両側の２個の合計６個の貫通孔３２３が設けられている。 The housing 32 includes a rectangular plate-shaped housing body (main body) 321 to which the circuit board 40 is attached, and a frame-shaped flange 322 that is provided around the housing body 321 and protrudes from the planar outline of the circuit board 40. .
The flange portion 322 is provided with a through hole 323 for the screw 35 for assembling the light emitting unit 30A. Here, a total of six through-holes 323 are provided, four on both sides in the width direction at both ends in the longitudinal direction of the flange 322 and two on both sides in the width direction in the center in the longitudinal direction.

鍔部３２２の長手方向両端には、長手方向に突出する取付部３２４が設けられており、取付部３２４には、発光ユニット３０Ａを台座２１に取り付ける取付ねじ２４用の貫通孔３２５が設けられている。
また、ハウジング本体３２１の長手方向両端には、回路基板４０を取り付けるためのねじ３１用のねじ孔３２６が設けられている。なお、回路基板４０の長手方向両端部には、ねじ３１用の貫通孔４０Ａが設けられている。 Attachment portions 324 projecting in the longitudinal direction are provided at both ends in the longitudinal direction of the flange portion 322, and through holes 325 for attachment screws 24 for attaching the light emitting unit 30A to the base 21 are provided in the attachment portion 324. Yes.
Further, screw holes 326 for the screws 31 for attaching the circuit board 40 are provided at both ends in the longitudinal direction of the housing main body 321. Note that through holes 40 </ b> A for the screws 31 are provided at both longitudinal ends of the circuit board 40.

透過パネル３３は、回路基板４０を覆う略半円柱形状で乳白色の透過パネル本体３３１を有し、透過パネル本体３３１の外周部に矩形板状の枠部３３２を有する。
上カバー３４は、全体矩形枠状をしており、内側に透過パネル３３の透過パネル本体３３１を挿嵌して下方に露出させる内部開口３４１を有する。
上カバー３４は、回路基板４０および透過パネル３３を収容してハウジング３２に取り付けられる。このため、上カバー３４には、ハウジング３２の貫通孔３２３に対応して、ねじ３５が螺合するねじ孔３４２が設けられている。 The transmission panel 33 has a substantially semi-cylindrical and milky white transmission panel body 331 that covers the circuit board 40, and has a rectangular plate-shaped frame portion 332 on the outer periphery of the transmission panel body 331.
The upper cover 34 has a rectangular frame shape as a whole, and has an internal opening 341 that inserts the transmissive panel body 331 of the transmissive panel 33 and exposes it downward.
The upper cover 34 accommodates the circuit board 40 and the transmission panel 33 and is attached to the housing 32. For this reason, the upper cover 34 is provided with a screw hole 342 corresponding to the through hole 323 of the housing 32 into which the screw 35 is screwed.

図４に示すように、回路基板４０は、細長い矩形板状部材であり、実装面４０１における長手方向両端より中央側には、電源装置２２に接続するためや、隣接する回路基板４０と接続するためのコネクタ４４が各々設けられている。
回路基板４０の実装面４０１には、配列線ＨＬが設定されており、第１発光部４１および第２発光部４２が配列線ＨＬに沿って直線状に等間隔で設けられている。
第１発光部４１および第２発光部４２は、実装面４０１に実装された複数のＬＥＤユニット（半導体発光素子）４３を有する。 As shown in FIG. 4, the circuit board 40 is an elongated rectangular plate-like member, and is connected to the power supply device 22 or connected to the adjacent circuit board 40 at the center side from both longitudinal ends of the mounting surface 401. Each connector 44 is provided.
An array line HL is set on the mounting surface 401 of the circuit board 40, and the first light emitting unit 41 and the second light emitting unit 42 are provided linearly at equal intervals along the array line HL.
The first light emitting unit 41 and the second light emitting unit 42 have a plurality of LED units (semiconductor light emitting elements) 43 mounted on the mounting surface 401.

ここでは、２個のＬＥＤユニット４３を有する第１発光部４１および第２発光部４２を図示したが、回路基板４０に２組の発光部を実装したことを意味するものではない。
例えば、回路基板４０に左側端部付近では、近接して配置した２個の発光部のうちの左側を1つの群として第１発光部４１、右側を1つの群として第２発光部４２と示すことができる。また、図示はしないが、回路基板４０の右側端部付近では、隣接する２個の発光部のうちの右側を第１発光部、左側を第２発光部と示すことができる。また、各発光部は複数のＬＥＤを備えるが、1つでも良い。
すなわち、第１発光部４１および第２発光部４２を配列線ＨＬに沿って等間隔で実装したということは、複数個の発光部を配列線ＨＬに沿って等間隔で実装したことを意味するものである。 Here, the first light emitting unit 41 and the second light emitting unit 42 having two LED units 43 are illustrated, but this does not mean that two sets of light emitting units are mounted on the circuit board 40.
For example, in the vicinity of the left end portion of the circuit board 40, the left side of two light emitting units arranged in close proximity is referred to as a first light emitting unit 41 as a group, and the right side is referred to as a second light emitting unit 42 as a group. be able to. Although not shown, in the vicinity of the right end of the circuit board 40, the right side of the two adjacent light emitting units can be referred to as a first light emitting unit, and the left side can be referred to as a second light emitting unit. In addition, each light emitting unit includes a plurality of LEDs, but one may be used.
That is, the fact that the first light emitting unit 41 and the second light emitting unit 42 are mounted at equal intervals along the array line HL means that a plurality of light emitting units are mounted at equal intervals along the array line HL. Is.

第１発光部４１におけるＬＥＤユニット４３のうち、第２発光部４２に最も近いものをＬＥＤユニット４３１とする。また、第２発光部４２におけるＬＥＤユニット４３のうち、第１発光部４１に最も近いものをＬＥＤユニット４３２とする。
そして、ＬＥＤユニット４３１とＬＥＤユニット４３２の間の距離を第１離間寸法Ｌ１とする。すなわち、複数個の発光部の隣接する発光部との間隔は、全て第１離間寸法Ｌ１である。 Of the LED units 43 in the first light emitting unit 41, the unit closest to the second light emitting unit 42 is referred to as an LED unit 431. Further, among the LED units 43 in the second light emitting unit 42, the LED unit 432 is the one closest to the first light emitting unit 41.
And let the distance between LED unit 431 and LED unit 432 be the 1st separation dimension L1. That is, the intervals between the adjacent light emitting units of the plurality of light emitting units are all the first separation dimension L1.

第１発光部４１におけるＬＥＤユニット４３のうち、配列線ＨＬに沿った回路基板４０の基板縁部４０３に最も近いものをＬＥＤユニット４３３とし、ＬＥＤユニット４３３と基板縁部４０３との間の距離を第２離間寸法Ｌ２とする。
すなわち、第２離間寸法Ｌ２は、回路基板４０の長手方向両端において存在する。
そして、第２離間寸法Ｌ２を、第１離間寸法Ｌ１の２分の１以下となるように設定する。
また、第１発光部４１におけるＬＥＤユニット４３のうち、ＬＥＤユニット４３３と、配列線ＨＬに沿った鍔部３２２の縁部３２７との間の第３離間寸法Ｌ３は、第１離間寸法Ｌ１の２分の１以下となるように設定する。
なお、一般的には、回路基板は、十分な絶縁性を得るためにＬＥＤユニットや回路パターン部と基板周縁との間を３ｍｍ以上確保することが好ましい。このため、第２離間寸法Ｌ２は、例えば３ｍｍ以上が好ましい。 Among the LED units 43 in the first light emitting unit 41, the one closest to the substrate edge 403 of the circuit board 40 along the arrangement line HL is the LED unit 433, and the distance between the LED unit 433 and the substrate edge 403 is The second separation dimension L2.
That is, the second separation dimension L2 exists at both ends in the longitudinal direction of the circuit board 40.
Then, the second separation dimension L2 is set to be equal to or less than one half of the first separation dimension L1.
In addition, among the LED units 43 in the first light emitting unit 41, the third separation dimension L3 between the LED unit 433 and the edge portion 327 of the flange 322 along the array line HL is 2 of the first separation dimension L1. Set to 1 / min or less.
In general, the circuit board preferably has a space of 3 mm or more between the LED unit or the circuit pattern portion and the periphery of the board in order to obtain sufficient insulation. For this reason, the second separation dimension L2 is preferably 3 mm or more, for example.

なお、第１発光部４１および第２発光部４２としては、それぞれ複数のＬＥＤユニットを有するものであり、第１発光部４１あるいは第２発光部４２における各ＬＥＤユニットは発色、色温度、発色強度等が等しい同一種類でもよく、または異なる種類でもよい。   Each of the first light emitting unit 41 and the second light emitting unit 42 includes a plurality of LED units, and each LED unit in the first light emitting unit 41 or the second light emitting unit 42 has color development, color temperature, color development intensity. The same type may be equal, or different types may be used.

次に、発光ユニット３０Ａの組立ておよび照明器具１０Ａの組立てについて説明する。
なお、上述したように、１個のハウジング３２に、１個の回路基板４０を取り付けた場合には、少なくとも２個のハウジング３２を連結した場合に上述した構成の効果が得られる（図４参照）。
従って、以下の発光ユニット３０Ａでは、１個の回路基板４０が取り付けられたハウジング３２を２個連結する場合について説明する。 Next, assembly of the light emitting unit 30A and assembly of the lighting fixture 10A will be described.
As described above, when one circuit board 40 is attached to one housing 32, the effect of the above-described configuration can be obtained when at least two housings 32 are connected (see FIG. 4). ).
Therefore, in the following light emitting unit 30A, a case where two housings 32 each having one circuit board 40 attached are connected will be described.

図３に示すように、まず、ねじ３１を回路基板４０の貫通孔４０Ａに通し、さらにハウジング本体３２１のねじ孔３２６に締付けて、１個の回路基板４０を１個のハウジング３２に取り付ける。
次いで、回路基板４０を透過パネル本体３３１に収容するように、下方から透過パネル３３を被せ、さらに透過パネル３３を覆うように下方から上カバー３４を被せる。そして、ハウジング３２の貫通孔３２３に上側からねじ３５を通し、上カバー３４のねじ孔３４２に締付ける。
このようにして回路基板４０や透過パネル３３が取り付けられたハウジング３２を、配列線ＨＬに沿って２個以上連結して、発光ユニット３０Ａが組立てられる。 As shown in FIG. 3, first, the screw 31 is passed through the through hole 40 </ b> A of the circuit board 40 and further tightened into the screw hole 326 of the housing main body 321, so that one circuit board 40 is attached to one housing 32.
Next, the transmissive panel 33 is covered from below so that the circuit board 40 is accommodated in the transmissive panel main body 331, and the upper cover 34 is covered from below so as to cover the transmissive panel 33. Then, the screw 35 is passed through the through hole 323 of the housing 32 from the upper side, and is tightened to the screw hole 342 of the upper cover 34.
In this way, the light emitting unit 30A is assembled by connecting two or more housings 32 to which the circuit board 40 and the transmissive panel 33 are attached along the array line HL.

次に、前述したようにして組立てられた複数の発光ユニット３０Ａを、台座２１の下面に固定する。
その後、本体カバー２３を器具本体２０に取り付けて、照明器具１０Ａが組み立てられる。 Next, the plurality of light emitting units 30 </ b> A assembled as described above are fixed to the lower surface of the base 21.
Thereafter, the main body cover 23 is attached to the fixture body 20, and the lighting fixture 10A is assembled.

第１実施形態の発光ユニット３０Ａの作用効果について説明する。
図２および図３に示すように、発光ユニット３０Ａは、帯状の回路基板４０を有し、実装面４０１に設定された配列線ＨＬに沿って等間隔で設けられ複数のＬＥＤユニット４３を有する第１発光部４１および第２発光部４２を有する。回路基板４０は、実装面４０１とは反対側の裏面４０２を支持するハウジング本体３２１と、ハウジング本体３２１の周部に設けられ回路基板４０の平面輪郭より突出する枠状の鍔部３２２と、を有するハウジング３２に支持される。鍔部３２２には、回路基板４０、第１発光部４１および第２発光部４２を覆う透過パネル３３が固定される。 The effects of the light emitting unit 30A of the first embodiment will be described.
As shown in FIGS. 2 and 3, the light emitting unit 30 </ b> A has a belt-like circuit board 40, and is provided with a plurality of LED units 43 provided at equal intervals along the array line HL set on the mounting surface 401. The first light emitting unit 41 and the second light emitting unit 42 are provided. The circuit board 40 includes a housing body 321 that supports a back surface 402 opposite to the mounting surface 401, and a frame-shaped flange 322 that is provided around the housing body 321 and protrudes from the planar outline of the circuit board 40. The housing 32 is supported. The transmissive panel 33 that covers the circuit board 40, the first light emitting unit 41, and the second light emitting unit 42 is fixed to the flange 322.

ここで、図４に示すように、第１発光部４１における各ＬＥＤユニット４３のうち第２発光部４２に最も近いＬＥＤユニット４３１と、第２発光部４２における各ＬＥＤユニット４３のうち第１発光部４１に最も近い前記ＬＥＤユニット４３２と、の間の距離を第１離間寸法Ｌ１とする。また、配列線ＨＬに沿った回路基板４０の基板縁部４０３と、第１発光部４１における各ＬＥＤユニット４３のうち基板縁部４０３に最も近いＬＥＤユニット４３３と、の間の距離を第２離間寸法Ｌ２とする。
そして、第２離間寸法Ｌ２が第１離間寸法Ｌ１の２分の１以下となるように配置した。
また、第１発光部４１におけるＬＥＤユニット４３のうち、ＬＥＤユニット４３３と、配列線ＨＬに沿った鍔部３２２の縁部３２７との間の第３離間寸法Ｌ３は、第１離間寸法Ｌ１の２分の１以下となるように配置した。 Here, as shown in FIG. 4, the LED unit 431 closest to the second light emitting unit 42 among the LED units 43 in the first light emitting unit 41 and the first light emitting unit among the LED units 43 in the second light emitting unit 42. A distance between the LED unit 432 closest to the portion 41 is defined as a first separation dimension L1. Further, the distance between the board edge portion 403 of the circuit board 40 along the array line HL and the LED unit 433 closest to the board edge portion 403 among the LED units 43 in the first light emitting unit 41 is set to the second separation. The dimension is L2.
And it arrange | positioned so that the 2nd separation dimension L2 might become 1/2 or less of the 1st separation dimension L1.
In addition, among the LED units 43 in the first light emitting unit 41, the third separation dimension L3 between the LED unit 433 and the edge portion 327 of the flange 322 along the array line HL is 2 of the first separation dimension L1. It arrange | positioned so that it might become 1 / min or less.

なお、本発明における発光ユニットとは、ハウジング、透過パネルを含まない形態も有り得る。
このような回路基板は、複数の回路基板が互いに基板縁部同士を突き合わせるように１つのハウジングに支持された形態において、隣り合う他の回路基板における発光部との間の第３離間寸法Ｌ３と、回路基板上の各発光部間の第１離間寸法Ｌ１とが等しくなる。
本発明における発光ユニットは、ハウジングを含むか否かにより形態が相違するが、結果的に隣り合う各回路基板における発光部との間の第３離間寸法Ｌ３が回路基板上の各発光部間の第１離間寸法Ｌ１と等しくなればよい。 The light emitting unit in the present invention may have a form not including a housing and a transmission panel.
In such a circuit board, a plurality of circuit boards are supported by one housing so as to abut each other on the board edges, and a third separation dimension L3 between the light emitting parts in other adjacent circuit boards. And the 1st separation dimension L1 between each light emission part on a circuit board becomes equal.
The form of the light emitting unit according to the present invention differs depending on whether or not it includes a housing. As a result, the third separation dimension L3 between the light emitting parts in adjacent circuit boards is different between the light emitting parts on the circuit boards. What is necessary is just to become equal to the 1st separation | spacing dimension L1.

これにより、図５に示すように、ＬＥＤユニット４３を実装した１個の回路基板４０を支持するハウジング３２を配列線ＨＬ上に連結した場合に、連結部における各発光部間の第３離間寸法Ｌ３を第１離間寸法Ｌ１に等しくできる。従って、各発光部の間隔を全体的に均一（Ｌ１）に配置することができ、意匠的に向上させることができる。   Thereby, as shown in FIG. 5, when the housing 32 supporting one circuit board 40 on which the LED unit 43 is mounted is connected on the array line HL, the third separation dimension between the light emitting parts in the connecting part. L3 can be equal to the first separation dimension L1. Therefore, the intervals between the light emitting portions can be arranged uniformly (L1) as a whole, and the design can be improved.

また、発光ユニット３０Ａでは、連結する各ハウジング３２における各回路基板４０の配列線ＨＬが互いに同一線に沿うように、各ハウジング３２が配列されている（図５参照）。
このため、ハウジング３２の連結部（図５中領域Ｒ）においても発光部の間隔を均一にすることができ、意匠的に向上させることができる。 In the light emitting unit 30A, the housings 32 are arranged so that the arrangement lines HL of the circuit boards 40 in the respective housings 32 to be coupled are along the same line (see FIG. 5).
For this reason, the space | interval of a light emission part can be made uniform also in the connection part (area | region R in FIG. 5) of the housing 32, and it can improve design.

第１実施形態の照明器具１０Ａの作用効果について説明する。
照明器具１０Ａは、前述した発光ユニット３０Ａを有する。
これにより、回路基板４０を実装したハウジング３２を連結した際に、各発光部の間隔を全体的に均一に配置することができ、意匠的に向上させることができる。 The effect of the lighting fixture 10A of 1st Embodiment is demonstrated.
The lighting fixture 10A includes the light emitting unit 30A described above.
Thereby, when the housing 32 which mounted the circuit board 40 is connected, the space | interval of each light emission part can be arrange | positioned uniformly uniformly, and it can improve design.

（第２実施形態）
次に、第２実施形態の発光ユニット３０Ｂおよび照明器具１０Ｂについて説明する。
なお、前述した第１実施形態の発光ユニット３０Ａおよび照明器具１０Ａと共通する部位には同じ符号を付して、重複する説明を省略することとする。
図６に示すように、第２実施形態の発光ユニット３０Ｂおよび照明器具１０Ｂでは、１個のハウジング３２に２個以上（図６においては例えば２個）の回路基板４０を、配列線ＨＬが互いに同一線に沿うように支持したものである。 (Second Embodiment)
Next, the light emitting unit 30B and the lighting fixture 10B of the second embodiment will be described.
In addition, suppose that the same code | symbol is attached | subjected to the site | part which is common in the light emission unit 30A and lighting fixture 10A of 1st Embodiment mentioned above, and the overlapping description is abbreviate | omitted.
As shown in FIG. 6, in the light emitting unit 30 </ b> B and the lighting apparatus 10 </ b> B of the second embodiment, two or more (for example, two in FIG. 6) circuit boards 40 are arranged in one housing 32. It is supported along the same line.

ここで、各回路基板４０のうち、一方の回路基板４０Ｌ（例えば図６中左の回路基板４０）におけるＬＥＤユニット４３のうち、他方の回路基板４０Ｒ（例えば図６中右の回路基板４０）に最も近いＬＥＤユニット４３をＬＥＤユニット４３４とする。
また、各回路基板４０のうち、他方の回路基板４０ＲにおけるＬＥＤユニット４３のうち、一方の回路基板４０Ｌに最も近いＬＥＤユニット４３をＬＥＤユニット４３５とする。
そして、ＬＥＤユニット４３４とＬＥＤユニット４３５との間の第４離間寸法Ｌ４が、第１離間寸法Ｌ１と等しくなるように設定した。 Here, among the circuit units 40, one of the circuit units 40L (for example, the left circuit board 40 in FIG. 6), the LED unit 43 in the other circuit board 40R (for example, the right circuit board 40 in FIG. 6). The closest LED unit 43 is defined as an LED unit 434.
Further, among the LED boards 43 in the other circuit board 40R among the circuit boards 40, the LED unit 43 closest to the one circuit board 40L is referred to as an LED unit 435.
Then, the fourth separation dimension L4 between the LED unit 434 and the LED unit 435 was set to be equal to the first separation dimension L1.

この場合、回路基板４０Ｒの第２離間寸法Ｌ２および回路基板４０Ｌの第２離間寸法Ｌ２が第１離間寸法Ｌ１の２分の１未満である場合、回路基板４０Ｒ、４０Ｌ間に隙間４０３が設けられるようにハウジング３２に対して回路基板４０Ｒ、４０Ｌを適宜配置することにより、第４離間寸法Ｌ４が第１離間寸法Ｌ１と等しくなるようにすればよい。   In this case, when the second separation dimension L2 of the circuit board 40R and the second separation dimension L2 of the circuit board 40L are less than half of the first separation dimension L1, the gap 403 is provided between the circuit boards 40R and 40L. Thus, the circuit board 40R, 40L is appropriately arranged with respect to the housing 32 so that the fourth separation dimension L4 becomes equal to the first separation dimension L1.

第２実施形態の発光ユニット３０Ｂおよび照明器具１０Ｂの作用効果について説明する。
図６に示すように、複数の回路基板４０Ｌ、４０Ｒは、配列線ＨＬが互いに同一線に沿うように同じハウジング３２に支持されている。
一方の回路基板４０ＬのＬＥＤユニット４３のうち他方の回路基板４０Ｒに最も近いＬＥＤユニット４３４と、他方の回路基板４０ＲのＬＥＤユニット４３のうち、一方の回路基板４０Ｌに最も近いＬＥＤユニット４３５との間の距離を第４離間寸法Ｌ４とする。
そして、第４離間寸法Ｌ４を、第１離間寸法Ｌ１と等しく設定する。
これにより、一つのハウジング３２に複数の回路基板４０を支持した際に、ハウジング３２全体として発光部の間隔を均一にすることができ、意匠的に向上させることができる。 The effects of the light emitting unit 30B and the lighting fixture 10B of the second embodiment will be described.
As shown in FIG. 6, the plurality of circuit boards 40 </ b> L and 40 </ b> R are supported by the same housing 32 so that the array lines HL are along the same line.
Between the LED unit 434 closest to the other circuit board 40R among the LED units 43 of one circuit board 40L and the LED unit 435 closest to the one circuit board 40L among the LED units 43 of the other circuit board 40R. Is a fourth separation dimension L4.
Then, the fourth separation dimension L4 is set equal to the first separation dimension L1.
Thereby, when a plurality of circuit boards 40 are supported by one housing 32, the interval between the light emitting portions can be made uniform as a whole of the housing 32, and the design can be improved.

また、このようなハウジング３２を複数個連結した場合でも、連結部Ｒにおける発光部の間隔を均一にすることができるので、照明器具１０Ｂ全体として発光部の間隔を均一にすることができ、意匠的に向上させることができる。
なお、ハウジング３２におけるＬＥＤユニット４３４およびＬＥＤユニット４３５の配置は、回路基板４０Ｌと回路基板４０Ｒとの間隔で調整することができる。なお、第４離間寸法Ｌ４と第１離間寸法Ｌ１とを等しくなるように配置すれば、回路基板４０Ｌ、４０Ｒの間隔で調整する必要はない。 Further, even when a plurality of such housings 32 are connected, the intervals between the light emitting portions in the connecting portion R can be made uniform, so that the intervals between the light emitting portions can be made uniform throughout the lighting fixture 10B. Can be improved.
In addition, arrangement | positioning of the LED unit 434 and the LED unit 435 in the housing 32 can be adjusted with the space | interval of the circuit board 40L and the circuit board 40R. If the fourth separation dimension L4 and the first separation dimension L1 are arranged to be equal, it is not necessary to adjust the distance between the circuit boards 40L and 40R.

（第３実施形態）
次に、係る第３実施形態の発光ユニット３０Ｃおよび照明器具１０Ｃについて説明する。
なお、前述した第１実施形態の発光ユニット３０Ａおよび照明器具１０Ａまたは第２実施形態の発光ユニット３０Ｂおよび照明器具１０Ｂと共通する部位には同じ符号を付して、重複する説明を省略することとする。 (Third embodiment)
Next, the light emitting unit 30C and the lighting fixture 10C according to the third embodiment will be described.
In addition, the same code | symbol is attached | subjected to the site | part which is common in the light emission unit 30A and the lighting fixture 10A of 1st Embodiment mentioned above, or the light emission unit 30B and the lighting fixture 10B of 2nd Embodiment, and the overlapping description is abbreviate | omitted. To do.

図７には、第３実施形態の発光ユニット３０Ｃおよび照明器具１０Ｃにおける回路基板４０が示されている。
回路基板４０に実装される第１発光部４１および第２発光部４２は、発光形態が異なる第１ＬＥＤユニット（第１半導体発光素子）４３６および第２ＬＥＤユニット（第２半導体発光素子）４３７を有する。
例えば、第１ＬＥＤユニット４３６には低色温度ＬＥＤを用い、第２ＬＥＤユニット４３７には高色温度ＬＥＤを用いることができる。 FIG. 7 shows a circuit board 40 in the light emitting unit 30C and the lighting fixture 10C of the third embodiment.
The first light emitting unit 41 and the second light emitting unit 42 mounted on the circuit board 40 include a first LED unit (first semiconductor light emitting element) 436 and a second LED unit (second semiconductor light emitting element) 437 having different light emission forms.
For example, a low color temperature LED can be used for the first LED unit 436, and a high color temperature LED can be used for the second LED unit 437.

第３実施形態の発光ユニット３０Ｃおよび照明器具１０Ｃの作用効果について説明する。
第１発光部４１および第２発光部４２は、色温度（発光形態）が異なる第１ＬＥＤユニット４３６および第２ＬＥＤユニット４３７を有するので、種々の色温度で配光制御を行うことができる。
なお、発光形態として色温度を例示したが、これに限らず、例えば、光量や色が異なるＬＥＤユニット４３を用いることもできる。 The effects of the light emitting unit 30C and the lighting fixture 10C of the third embodiment will be described.
Since the 1st light emission part 41 and the 2nd light emission part 42 have the 1st LED unit 436 and the 2nd LED unit 437 from which color temperature (light emission form) differs, light distribution control can be performed with various color temperature.
In addition, although color temperature was illustrated as a light emission form, it is not restricted to this, For example, the LED unit 43 from which a light quantity and a color differ can also be used.

（第４実施形態）
次に、第４実施形態の発光ユニット３０Ｄおよび照明器具１０Ｄについて説明する。
なお、前述した第１実施形態の発光ユニット３０Ａおよび照明器具１０Ａないし第３実施形態の発光ユニット３０Ｃおよび照明器具１０Ｃと共通する部位には同じ符号を付して、重複する説明を省略することとする。 (Fourth embodiment)
Next, the light emitting unit 30D and the lighting fixture 10D of the fourth embodiment will be described.
In addition, the same code | symbol is attached | subjected to the site | part which is common in the light emission unit 30A of the 1st Embodiment mentioned above, and the lighting fixture 10A thru | or the light emission unit 30C and the lighting fixture 10C of 3rd Embodiment, and the overlapping description is abbreviate | omitted. To do.

図８には、第４実施形態の発光ユニット３０Ｄおよび照明器具１０Ｄにおける回路基板４０が示されている。
回路基板４０では、第１発光部４１および第２発光部４２に、それぞれ発光形態が異なる第１ＬＥＤユニット（第１半導体発光素子）４３６および第２ＬＥＤユニット（第２半導体発光素子）４３７を有する。
第１ＬＥＤユニット４３６は例えば蛍光色、第２ＬＥＤユニット４３７は例えば電球色であり、互いに配列線ＨＬに沿って配列されている。
ここで、発光形態とは、発光色、発光色温度、発光強度、発光方向、発光の広がり等を指す。 FIG. 8 shows a circuit board 40 in the light emitting unit 30D and the lighting fixture 10D of the fourth embodiment.
In the circuit board 40, the first light emitting unit 41 and the second light emitting unit 42 have a first LED unit (first semiconductor light emitting element) 436 and a second LED unit (second semiconductor light emitting element) 437 having different light emission forms, respectively.
The first LED unit 436 is, for example, fluorescent color, and the second LED unit 437 is, for example, light bulb color, and are arranged along the arrangement line HL.
Here, the emission form refers to emission color, emission color temperature, emission intensity, emission direction, emission spread, and the like.

第１発光部４１における第１ＬＥＤユニット４３６は回路基板４０の基板縁部４０３Ａ側（図８において左側）に配置されている。また、第２発光部４２における第１ＬＥＤユニット４３６は回路基板４０の基板縁部４０３Ｂ側（図８において右側）に配置されている。
すなわち、図８における回路基板４０の最も左側および最も右側に蛍光色の第１ＬＥＤユニット４３６が配置されている。 The first LED unit 436 in the first light emitting unit 41 is disposed on the board edge 403A side (left side in FIG. 8) of the circuit board 40. Further, the first LED unit 436 in the second light emitting unit 42 is disposed on the board edge 403B side (right side in FIG. 8) of the circuit board 40.
That is, fluorescent first LED units 436 are arranged on the leftmost and rightmost sides of the circuit board 40 in FIG.

第４実施形態の発光ユニット３０Ｄおよび照明器具１０Ｄの作用効果について説明する。
第１発光部４１および第２発光部４２は、それぞれ第１ＬＥＤユニット４３６および第２ＬＥＤユニット４３７が配列線ＨＬに沿って配列されている。
そして、第１発光部４１における第１ＬＥＤユニット４３６は回路基板４０の基板縁部４０３Ａ側に配置され、第２発光部４２における第１ＬＥＤユニット４３６は回路基板４０の基板縁部４０３Ｂ側に配置されている。 The effects of the light emitting unit 30D and the lighting fixture 10D of the fourth embodiment will be described.
As for the 1st light emission part 41 and the 2nd light emission part 42, the 1st LED unit 436 and the 2nd LED unit 437 are arranged along arrangement line HL, respectively.
The first LED unit 436 in the first light emitting unit 41 is disposed on the substrate edge 403A side of the circuit board 40, and the first LED unit 436 in the second light emitting unit 42 is disposed on the substrate edge 403B side of the circuit board 40. Yes.

このため、発光形態が異なる第１ＬＥＤユニット４３６および第２ＬＥＤユニット４３７を点灯させた際に、回路基板４０の両端における配光状態が同じになり、全体として均一な配光を図ることができる。
また、第１ＬＥＤユニット４３６または第２ＬＥＤユニット４３７の一方のみを点灯させた場合でも、回路基板４０の基板縁部４０３Ａ、４０３Ｂにおける配光状態が同じになり、全体として均一な配光を図ることができる。 For this reason, when the 1st LED unit 436 and the 2nd LED unit 437 from which a light emission form differs are lighted, the light distribution state in the both ends of the circuit board 40 becomes the same, and uniform light distribution as a whole can be aimed at.
Further, even when only one of the first LED unit 436 or the second LED unit 437 is lit, the light distribution state at the board edge portions 403A and 403B of the circuit board 40 is the same, and uniform light distribution can be achieved as a whole. it can.

本発明の発光ユニットおよび照明器具は、前述した各実施形態に限定されるものでなく、適宜な変形、改良等が可能である。
例えば、前述した各実施形態においては、半導体発光素子としてＬＥＤを用いた場合を例示したが、本発明は、その他のＥＬ（Electro-Luminescence）にも適用可能である。 The light emitting unit and the lighting fixture of the present invention are not limited to the above-described embodiments, and appropriate modifications and improvements can be made.
For example, in each of the above-described embodiments, the case where an LED is used as the semiconductor light emitting element has been illustrated, but the present invention is also applicable to other EL (Electro-Luminescence).

また、前述した各実施形態においては、ＬＥＤユニット４３を回路基板４０の実装面４０１に設定された配列線ＨＬに沿って一列に並べた場合について例示した。配列線ＨＬに沿って配置する際に、発光部として沿っていれば良く、各ＬＥＤユニット４３が全て配列線ＨＬに沿っている必要はない。
従って、図９（Ａ）〜図９（Ｃ）に示すように、配列線ＨＬを挟んで両側に配列線ＨＬと平行に設けることも可能である。 Moreover, in each embodiment mentioned above, the case where the LED unit 43 was arranged in a line along the arrangement line HL set to the mounting surface 401 of the circuit board 40 was illustrated. When arrange | positioning along the arrangement line HL, what is necessary is just to follow as a light emission part, and it is not necessary for each LED unit 43 to be along the arrangement line HL.
Therefore, as shown in FIGS. 9A to 9C, it is also possible to provide parallel to the array line HL on both sides of the array line HL.

また、前述した各実施形態においては、配列線ＨＬが直線である場合を例示したが、円弧や円形、波形等の曲線の場合にも適用可能である。   Moreover, in each embodiment mentioned above, although the case where the array line HL was a straight line was illustrated, it is applicable also to the case of curves, such as a circular arc, a circle, and a waveform.

１０Ａ、１０Ｂ、１０Ｃ、１０Ｄ 照明器具
３０Ａ、３０Ｂ、３０Ｃ、３０Ｄ 発光ユニット
３２ ハウジング
３２１ ハウジング本体（本体）
３２２ 鍔部
３２７ ハウジング縁部
３３ 透過パネル
４０ 回路基板
４０１ 実装面
４０２ 裏面
４０３、４０３Ａ、４０３Ｂ 基板縁部
４１ 第１発光部
４２ 第２発光部
４３ ＬＥＤユニット（半導体発光素子）
４３６ 第１ＬＥＤユニット（第１半導体発光素子）
４３７ 第２ＬＥＤユニット（第２半導体発光素子）
ＨＬ 配列線
Ｌ１ 第１離間寸法
Ｌ２ 第２離間寸法
Ｌ３ 第３離間寸法
Ｌ４ 第４離間寸法 10A, 10B, 10C, 10D Lighting fixtures 30A, 30B, 30C, 30D Light emitting unit 32 Housing 321 Housing body (main body)
322 Hook 327 Housing edge 33 Transmission panel 40 Circuit board 401 Mounting surface 402 Back face 403, 403A, 403B Board edge 41 First light emitting part 42 Second light emitting part 43 LED unit (semiconductor light emitting element)
436 1st LED unit (1st semiconductor light emitting element)
437 Second LED Unit (Second Semiconductor Light Emitting Element)
HL array line L1 1st separation dimension L2 2nd separation dimension L3 3rd separation dimension L4 4th separation dimension

Claims (3)

帯状の回路基板と、
前記回路基板の実装面に設定された配列線に沿って等間隔で設けられた第１発光部および第２発光部と、を備え、
前記第１発光部および前記第２発光部は、それぞれ前記実装面に相互に近接して実装された複数の半導体発光素子を有し、
前記第１発光部を構成する複数の半導体発光素子と、前記第２発光部を構成する複数の半導体発光素子とは、同一の組合せであるとともに、
前記第１発光部における前記各半導体発光素子のうち、前記第２発光部に最も近い前記半導体発光素子と、前記第２発光部における前記各半導体発光素子のうち、前記第１発光部に最も近い前記半導体発光素子と、の間の第１離間寸法に対して、
前記第１発光部における前記各半導体発光素子のうち、前記回路基板における前記配列線に沿った基板縁部と、前記基板縁部に最も近い前記半導体発光素子と、の間の第２離間寸法が２分の１以下であり、
前記回路基板における前記実装面とは反対側の裏面を支持する本体と、前記本体の周部に設けられ、前記回路基板の平面輪郭より突出する枠状の鍔部とを有するハウジングを更に備え、
前記第１発光部における前記各半導体発光素子のうち、前記ハウジングにおける前記配列線に沿ったハウジング縁部と、前記ハウジング縁部に最も近い前記半導体発光素子と、の間の第３離間寸法が前記第１離間寸法に対して２分の１以下であり、
更に、前記回路基板を複数有し、
前記各回路基板における前記配列線が互いに同一線に沿うように前記ハウジングに支持され、
前記各回路基板のうち、一方の回路基板における前記各半導体発光素子のうち、他方の回路基板に最も近い前記半導体発光素子と、
前記各回路基板のうち、他方の回路基板における前記各半導体発光素子のうち、一方の回路基板に最も近い前記半導体発光素子と、の間の第４離間寸法が前記第１離間寸法と等しく、
前記第１発光部および前記第２発光部は、発光形態が異なる第１半導体発光素子および第２半導体発光素子を備え、
前記第１発光部および前記第２発光部は、それぞれ前記第１半導体発光素子および前記第２半導体発光素子が前記配列線に沿って配列されているとともに、前記第１発光部における前記第１半導体発光素子は前記回路基板における長手方向一端側に配置され、前記第２発光部における前記第１半導体発光素子は前記回路基板における長手方向他端側に配置されている発光ユニット。 A belt-like circuit board;
A first light emitting part and a second light emitting part provided at equal intervals along an array line set on the mounting surface of the circuit board,
The first light emitting unit and the second light emitting unit each have a plurality of semiconductor light emitting elements mounted close to each other on the mounting surface,
The plurality of semiconductor light emitting elements constituting the first light emitting part and the plurality of semiconductor light emitting elements constituting the second light emitting part are the same combination,
Of the semiconductor light emitting elements in the first light emitting part, the semiconductor light emitting element closest to the second light emitting part, and among the semiconductor light emitting elements in the second light emitting part, the closest to the first light emitting part. With respect to the first separation dimension between the semiconductor light emitting device,
Of the semiconductor light emitting elements in the first light emitting unit, a second separation dimension between a substrate edge along the array line in the circuit board and the semiconductor light emitting element closest to the substrate edge is provided. Less than half,
A housing having a main body supporting a back surface of the circuit board opposite to the mounting surface; and a frame-shaped flange provided on a peripheral portion of the main body and projecting from a planar outline of the circuit board;
Of the semiconductor light emitting elements in the first light emitting section, a third separation dimension between a housing edge along the array line in the housing and the semiconductor light emitting element closest to the housing edge is Less than or equal to half the first spacing dimension;
Furthermore, it has a plurality of the circuit boards,
The array lines in the circuit boards are supported by the housing so as to be along the same line as each other,
Among each of the circuit boards, among the semiconductor light emitting elements in one circuit board, the semiconductor light emitting element closest to the other circuit board;
Wherein among the circuit board, of the respective semiconductor light emitting elements of the other circuit board, and the closest the semiconductor light emitting element on one of the circuit board, rather fourth spacing dimension equal to the first spacing dimension between the ,
The first light emitting unit and the second light emitting unit include a first semiconductor light emitting device and a second semiconductor light emitting device having different light emission forms,
In the first light emitting unit and the second light emitting unit, the first semiconductor light emitting element and the second semiconductor light emitting element are arranged along the alignment line, respectively, and the first semiconductor in the first light emitting unit is provided. The light emitting element is disposed on one end side in the longitudinal direction of the circuit board, and the first semiconductor light emitting element in the second light emitting unit is disposed on the other end side in the longitudinal direction of the circuit board . 請求項１に記載の発光ユニットにおいて、
前記ハウジングを複数有し、
前記各ハウジングにおける前記各回路基板の前記配列線が互いに同一線に沿うように前記各ハウジングが配列されている発光ユニット。 The light emitting unit according to claim 1,
A plurality of housings;
The light emitting unit in which the housings are arranged so that the arrangement lines of the circuit boards in the housings are along the same line. 請求項１または請求項２に記載の発光ユニットを備える照明器具。 A lighting fixture comprising the light emitting unit according to claim 1 .
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