JP5631681B2 - Tape peeling device, tape winding unit, and method for removing tape from tape winding unit - Google Patents

Description

  The present invention relates to a tape peeling device used for peeling a protective tape attached to the surface of a semiconductor wafer in a semiconductor manufacturing process, a tape winding portion used in the tape peeling device, and a tape winding portion. The present invention relates to a method for removing a tape.

  In general, in a back grinding process for polishing the back surface of a semiconductor wafer, a protective tape for protecting the pattern is attached to the surface of the semiconductor wafer. The protective tape is peeled from the semiconductor wafer after the back grinding process is completed. In this peeling process, a tape peeling device is used.

  The tape peeling apparatus attaches a peeling tape to a protective tape on the surface of a semiconductor wafer, and peels the protective tape from the wafer together with the peeling tape. The protective tape peeled off from the wafer is collected by being wound around a tape take-up portion together with a peeling tape (for example, see Patent Document 1).

JP 2003-209082 A (refer to paragraphs 0055 to 0066 and FIGS. 6 to 9)

  Here, the tape winding portion is generally a member in which a circular pipe member (winding member) is fitted around a shaft having a quadrangular cross section, and the tape scrap around the circular pipe member as the shaft rotates. Is configured to wind up. When the winding amount of the tape residue reaches a specified amount, the circular pipe member is pulled out from the shaft to create a gap between the wound tape residue and the shaft, and then the tape residue is removed from the shaft.

  However, in such a configuration, as the amount of winding of the tape residue increases, the force (tightening force) with which the tape residue tightens the circular pipe member increases, and it becomes difficult to pull out the circular pipe member from the shaft. For this reason, the wound tape residue may not be removed from the tape winding portion.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to ensure that the tape can be removed even when the tape winding amount in the tape winding portion is large. And

The tape winding portion according to the present invention is used in a tape peeling device, and is attached to an end portion of a shaft and the shaft, and has a length in the axial direction of the shaft, and the axial direction of the shaft A pair of winding pieces opposed to each other in a direction perpendicular to each other, and a pair of winding pieces around which a tape is wound. Each of the pair of winding pieces has a shape in which a substantially central portion protrudes toward the winding pieces facing each other than both ends in the longitudinal direction. Further, the pair of winding pieces are connected to each other at a substantially central portion in the longitudinal direction so as to be swingable with respect to each other.

  Further, the tape peeling apparatus according to the present invention attaches a table for holding a wafer, a tape supply unit for supplying a peeling tape, and a peeling tape supplied from the tape supply unit to a protective tape on the surface of the wafer. And a peeling mechanism for peeling the peeling tape and the protective tape from the wafer, and the tape winding unit for winding the peeling tape and the protective tape peeled from the wafer by the peeling mechanism.

  Further, in the tape removing method from the tape winding unit according to the present invention, in the tape winding unit, the ends of the pair of winding pieces far from the shaft are urged toward each other. By swinging the pair of winding pieces, the tape is protruded in the direction of taking out from the pair of winding pieces.

  According to the present invention, even when the tape winding amount is large in the tape winding portion, the tape can be reliably removed.

It is a side view which shows the basic composition of the tape peeling apparatus in embodiment of this invention. It is a perspective view which shows the basic composition of the tape peeling apparatus in embodiment of this invention. It is a disassembled perspective view (A) and a perspective view (B) which show the principal part structure of the tape winding part of the tape peeling apparatus in embodiment of this invention. It is a perspective view which shows the state at the time of use of the tape winding-up part in embodiment of this invention. It is a figure for demonstrating the basic operation | movement of the tape peeling apparatus in embodiment of this invention. It is a figure for demonstrating the effect | action of the tape winding-up part in embodiment of this invention. It is a schematic diagram explaining the structural example of the tape winding-up part in embodiment of this invention. It is a figure which shows the structure (A) and operation | movement (B) of the tape winding-up part of a comparative example.

  Below, the tape peeling apparatus provided with the tape winding-up part in embodiment of this invention is demonstrated with reference to drawings. FIG. 1 and FIG. 2 are a side view and a perspective view showing a basic configuration of the tape peeling apparatus 1 in the present embodiment. The tape peeling apparatus 1 peels off the protective tape attached to the surface of the semiconductor wafer in the back grinding process of the semiconductor manufacturing process after the back grinding process is completed.

  In FIG. 1, a tape peeling apparatus 1 includes a table 5 that holds a wafer (semiconductor wafer) W, a tape supply unit 3 that supplies a peeling tape 11, and a peeling tape 11 that is supplied from the tape supply unit 3. Affixed to the protective tape 10 on the surface of the wafer W, the peeling mechanism 4 for peeling the protective tape 10 from the wafer W together with the peeling tape 11, and the peeling tape 11 and the protective tape 10 peeled by the peeling mechanism 4 are wound. And a tape take-up unit 2 to be taken.

  The table 5 has a horizontal plate surface and holds the wafer W by, for example, vacuum suction. A protective tape 10 for protecting the pattern is attached to the surface (element formation surface) of the wafer W. The wafer W is held with the back side facing the table 5.

  The tape supply unit 3 holds an unused peeling tape 11 (adhesive tape) in a rolled state. The tape supply unit 3 includes a supply roller 31 that holds the peeling tape 11 on the outer peripheral surface. The supply roller 31 is rotatably attached to the casing 15 (see FIG. 6) of the tape peeling apparatus 1.

  A guide roller 61 for guiding the peeling tape 11 supplied from the tape supply unit 3 to the wafer W held on the table 5 is provided between the tape supply unit 3 and the table 5. Here, the guide roller 61 is disposed at substantially the same height as the upper surface of the wafer W.

  The peeling mechanism 4 has a movable frame 40 that can move along the plate surface of the table 5, and a peeling roller 41 is rotatably attached to the movable frame 40. The peeling mechanism 4 also includes a pressing portion 42 such as a cylinder for pressing the peeling roller 41 against the wafer W on the table 5. The peeling roller 41 adheres the peeling tape 11 to the protective tape 10 by pressing the peeling tape 11 supplied from the tape supply unit 3 against the protective tape 10 on the surface of the wafer W.

  The tape winding unit 2 winds the peeling tape 11 and the protective tape 10 peeled from the wafer W together with the peeling tape 11 as will be described later as a tape residue 12. The tape winding unit 2 includes a winding body 20 that winds up the tape residue 12 and a shaft 25 that has the winding body 20 attached to the tip. The shaft 25 is rotatably supported by the casing 15 (FIG. 6) of the tape peeling device 1 and is rotated in a direction (indicated by an arrow R) for winding the tape residue 12 around the winding body 20 by a motor (not shown). . Details of the tape winding unit 2 will be described later.

  Between the tape winding unit 2 and the table 5, guide rollers 62 and 63 for guiding the tape residue 12 from the peeling mechanism 4 to the tape winding unit 2 are provided. The guide rollers 62 and 63 are arranged in a pair so as to sandwich the tape residue 12.

  FIG. 3 is an exploded perspective view (A) and a perspective view (B) showing the configuration of the tape winding unit 2. As shown in FIG. 3A, the winding body 20 is a combination of a pair of winding pieces 21 and 22. Each of the winding pieces 21 and 22 is a long member having a length in the axial direction (X direction) of the shaft 25 and faces each other in a direction orthogonal to the axial direction. The winding pieces 21 and 22 have the same length and width.

  The winding piece 21 has a shape in which a substantially central portion protrudes toward the winding piece 22 from both end portions in the longitudinal direction (X direction). More specifically, the winding piece 21 has a shape in which a flat plate member is bent in a “K” shape of Hiragana, that is, a combination of two flat plate portions 21 a and 21 b with a substantially central portion in the longitudinal direction sandwiched therebetween. It has a different shape.

  Similarly, the winding piece 22 has a shape in which a substantially central portion protrudes toward the winding piece 21 from both ends in the longitudinal direction (X direction). More specifically, the winding piece 22 has a shape in which a flat plate member is bent in a “K” shape of Hiragana, that is, a combination of two flat plate portions 22a and 22b with a substantially central portion in the longitudinal direction sandwiched therebetween. It has a different shape.

  These take-up pieces 21 and 22 are supported by a support pin 24 so as to be able to swing like a laundry scissors at a substantially central portion in the longitudinal direction. More specifically, a support pin 24 extending in the width direction (direction orthogonal to the X direction) of the winding piece 21 is provided on the convex side of the substantially central portion (bent portion) of the winding piece 21. A pair of shaft support portions 21c to be inserted is disposed. In addition, a pair of left and right shaft support portions 22c through which the support pins 24 are inserted are also disposed on the side of the winding piece 22 that is the convex portion of the substantially central portion (bent portion).

  When the winding pieces 21 and 22 are combined, the pair of shaft support portions 21c of the winding piece 21 and the pair of shaft support portions 22c of the winding piece 22 are aligned in the width direction of the winding pieces 21 and 22. Arranged. A support pin 24 is inserted through the shaft support portions 21c and 22c. Thereby, the winding pieces 21 and 22 are connected to each other by the support pin 24 at a substantially central portion in the longitudinal direction, and can swing with respect to each other.

  The distal end portion 26 of the shaft 25 is inserted between the winding pieces 21 and 22 (more specifically, between the flat plate portions 21b and 22b), and the above-described support pin 24 is inserted into the distal end portion 26. A shaft hole 26c is formed.

  As shown in FIG. 3B, the support pin 24 is inserted into the shaft support portion 21c of the winding piece 21, the shaft support portion 22c of the winding piece 22, and the shaft hole 26c of the distal end portion 26 of the shaft 25. The winding pieces 21 and 22 and the shaft 25 are integrated with each other. In this state, the shaft 25 is rotated in the rotation direction (arrow R) described above by a motor (not shown).

  In a normal use state, that is, in a state in which the tape residue 12 is wound, the flat plate portions 21b and 22b of the winding pieces 21 and 22 are in contact with inclined surfaces 26a and 26b formed on the tip portion 26 of the shaft 25, respectively. Yes. In addition, as described above, the winding pieces 21 and 22 are connected at a substantially central portion in the longitudinal direction like a clothespin, so that, for example, the leading end side (the side far from the shaft 25) of the winding pieces 21 and 22 is used. When an external force is applied so as to close, the rear end sides of the winding pieces 21 and 22 (sides close to the shaft 25) open.

  As shown in FIG. 4, a tape residue 12 made of the peeling tape 11 (or the peeling tape 11 and the protective tape 10 are integrated) is wound around the winding pieces 21 and 22. The leading edge (tape end) of the peeling tape 11 is fixed to the winding pieces 21 and 22 with, for example, another adhesive tape.

Next, the basic operation of the tape peeling apparatus 1 of the present embodiment will be described.
5A to 5D are diagrams showing the basic operation of the tape peeling apparatus 1 according to the present embodiment. As shown in FIG. 5A, the peeling tape 11 is held by the supply roller 31 of the tape supply unit 3, from which the guide roller 61, the peeling roller 41 and the guide rollers 62 and 63 are moved. Via, it is wound around the winding pieces 21 and 22 (winding body 20) of the winding part 2.

  The wafer W whose back surface has been polished in the back grinding process is transferred by a transfer mechanism (not shown) and placed on the table 5. The wafer W is sucked and held on the table 5 with the back side facing the table 5. A protective tape 10 for protecting a pattern or the like is attached to the surface of the wafer W.

  Next, as shown in FIG. 5B, in a state where the peeling roller 41 is pressed against the surface (protective tape 10) of the wafer W on the table 5 by the pressing portion 42 (FIG. 1), the movable frame 40 is moved. Accordingly, the wafer moves in the A direction along the surface of the wafer W. Thus, the peeling tape 11 is attached to the protective tape 10 on the surface of the wafer W.

  Next, as shown in FIG. 5C, the shaft 25 (FIG. 3) of the tape take-up unit 2 rotates, and the take-up of the peeling tape 11 is started. Further, the peeling roller 41 is moved in the reverse direction (B direction) along the surface of the wafer W by the movable frame 40 in a state where the peeling roller 41 is pressed more strongly against the wafer W by the pressing portion 42 (FIG. 1). Thereby, the protective tape 10 is peeled off from the surface of the wafer W together with the peeling tape 11.

  Thereby, as shown in FIG. 5D, the protective tape 10 is completely peeled off from the surface of the wafer W together with the peeling tape 11. The protective tape 10 peeled off from the surface of the wafer W is wound as a tape residue 12 on the winding body 20 (winding pieces 21 and 22) of the tape winding portion 2 together with the peeling tape 11.

  Here, when the winding amount of the tape residue 12 in the tape winding portion 2 reaches a predetermined amount, it is necessary to remove the tape residue 12 from the tape winding portion 2.

  6A to 6C are schematic views for explaining a method of removing the tape residue 12 from the tape winding unit 2. FIG. FIG. 6A shows a state in which the tape residue 12 is wound around the wound pieces 21 and 22 by the rotation of the shaft 25. In this state, the flat plate portions 21 b and 22 b of the winding pieces 21 and 22 are in contact with the inclined surfaces 26 a and 26 b of the tip end portion 26.

  As shown in FIG. 6 (B), when removing the tape residue 12 from the tape take-up portion 2, the user can use the tips of the flat plate portions 21a and 22a of the take-up pieces 21 and 22 (ends farther from the shaft 25). And the winding pieces 21 and 22 are oscillated.

  As a result, the winding pieces 21 and 22 are swung in the direction indicated by the arrow S in FIG. 6B, and the flat plate portions 21b and 22b of the winding pieces 21 and 22 are in contact with the tape residue 12 and the arrow C Energize in the direction indicated by (takeout direction). As a result, the tape residue 12 slides in the take-out direction indicated by the arrow C.

  In a state in which the flat plate portions 21a and 22a of the winding pieces 21 and 22 are swung until they come into contact with each other, the tape residue 12 protrudes to the vicinity of the tips of the flat plate portions 21a and 22a. Therefore, as shown in FIG. 6C, the user can easily take out the tape residue 12 from the winding pieces 21 and 22.

  With this configuration, even when the winding amount of the tape residue 12 increases and the force with which the tape residue 12 tightens the winding pieces 21 and 22 increases, the tape residue 12 can be easily removed from the winding pieces 21 and 22. Can be removed.

  6B, the user may swing the winding pieces 21 and 22 by hand. However, when the tightening force of the winding pieces 21 and 22 by the tape residue 12 is strong. There is a possibility that the winding pieces 21 and 22 cannot be swung only by the user's hand.

  Therefore, as shown in FIG. 7A, a screw fastening portion including a screw 71 passing through the winding pieces 21 and 22 and a nut 72 screwed on the screw 71 is provided, as shown in FIG. In addition, the winding pieces 21 and 22 may be swung by tightening the screw 71 and the nut 72.

The effect of this embodiment will be described with reference to a comparative example.
FIGS. 8A and 8B are an exploded perspective view and a perspective view showing a tape winding portion 8 of a comparative example. As shown in FIG. 8A, the tape winding portion 8 of this comparative example is obtained by fitting a circular pipe member 82 around a shaft 81 having a quadrangular cross section. As shown in FIG. 8B, the tape residue 12 is wound around the circular pipe member 82 by the rotation of the shaft 71.

  In this comparative example, when removing the tape residue 12 from the tape winding portion 8, first, the circular pipe member 82 is pulled out from the shaft 81 to create a gap between the tape residue 12 and the shaft 81, and the tape residue 12 is attached to the shaft. Pull out from 81.

  However, in the tape winding portion 8 of this comparative example, when the winding amount of the tape residue 12 increases and the tightening force of the circular tube member 82 by the tape residue 12 increases, it becomes difficult to pull out the circular tube member 82 from the shaft 81. Become. In such a case, the tape residue 12 cannot be removed from the tape winding unit 8.

  On the other hand, in the tape take-up portion 2 (FIG. 6 and the like) of the present embodiment described above, the take-up pieces 21 and 22 are connected to each other at a substantially central portion so as to be swingable. Even when the tightening force of the winding pieces 21 and 22 by the tape residue 12 is increased, the user closes the leading end side of the winding pieces 21 and 22, so that the tape residue 12 is removed. It can be easily removed by protruding in the direction of taking out from the winding pieces 21 and 22.

  As described above, according to the present embodiment, the pair of winding pieces 21 and 22 are connected to each other at a substantially central portion in the longitudinal direction so as to be swingable with respect to each other. , 22 has a shape in which a substantially central portion protrudes toward the other winding piece (22, 21) from both ends in the longitudinal direction, so that the winding pieces 21, 22 are swung. Then, the wound tape residue 12 is protruded in the take-out direction, and the tape residue 12 can be easily taken out.

  At the time of winding the tape residue 12, the front ends (ends far from the shaft 25) and the rear ends (ends close to the shaft 25) of the pair of winding pieces 21 and 22 Therefore, the tape residue 12 does not fall off from the winding pieces 21 and 22 during winding.

  Moreover, the winding pieces 21 and 22 each have two flat plate portions on both sides sandwiching the substantially central portion in the longitudinal direction, thereby providing an effect of protruding the tape residue 12 with a simple configuration. it can.

  Further, a pair of inclined surfaces 26 a and 26 b that are inclined with respect to the direction of the shaft 25 are provided at the tip portion 26 of the shaft 25, and these inclined surfaces 26 a and 26 b are inserted between the winding pieces 21 and 22. The swinging position of the winding pieces 21 and 22 during winding can be regulated by the inclined surfaces 26a and 26b.

  Further, when removing the tape residue 12, if the screw portions (71, 72) attached to the winding pieces 21, 22 are used, even if the tightening force by the tape residue 12 is particularly large, the winding pieces 21, 22 are used. Can be swung.

  In the above description, each of the winding pieces 21 and 22 has a shape in which a flat plate member is bent into a “<” shape, but is not limited to such a shape. . That is, the winding pieces 21 and 22 only have to have a shape in which a substantially central portion in the longitudinal direction protrudes toward the winding pieces 22 and 21 facing each other.

  In addition, the winding pieces 21 and 22 have been described as being connected to each other at a substantially central portion in the longitudinal direction. However, the “substantially central portion in the longitudinal direction” does not have to be exactly the center in the longitudinal direction. It is sufficient that the both end regions are not in the longitudinal direction.

  In addition, the configuration for connecting the winding pieces 21 and 22 to each other and the configuration for attaching them to the tip portion 26 of the shaft 25 are not limited to the configurations described with reference to FIGS. Absent. For example, instead of using the support pins 24, convex portions may be provided on both end surfaces of the tip portion 26 of the shaft 25.

  DESCRIPTION OF SYMBOLS 1 Tape peeling apparatus, 10 Protective tape, 11 Stripping tape, 12 Tape waste, 2 Tape winding part, 20 Winding body, 21, 22 Winding piece, 24 Support pin, 25 Shaft, 26 Tip part, 3 Tape supply part , 31 supply roller, 4 peeling mechanism, 40 movable frame, 41 peeling roller, 42 pressing part, 5 table, 61, 62, 63 guide roller, W wafer.

Claims (7)

A tape winding unit used in a tape peeling device,
A shaft,
Attached to the end of the shaft, the pair has a length in the axial direction of the shaft, a pair of winding pieces facing each other in a direction perpendicular to the axial direction of the shaft, the tape around wound With a winding piece of
The pair of winding pieces have a shape in which a substantially central portion protrudes toward the opposing winding pieces rather than both longitudinal end portions thereof,
The pair of winding pieces are connected to each other at the substantially central portion and configured to be swingable with respect to each other.   2. The tape take-up portion according to claim 1, wherein each of the pair of take-up pieces has two flat plate portions on both sides of the substantially central portion.   3. The tape take-up portion according to claim 1, wherein each of the pair of take-up pieces is obtained by bending a long member at the substantially central portion. The end portion of the shaft has a pair of inclined surfaces inclined with respect to the axial direction of the shaft ,
The tape winding unit according to any one of claims 1 to 3, wherein the pair of inclined surfaces are inserted between the pair of winding pieces. A table for holding the wafer;
A tape supply section for supplying a peeling tape;
A peeling mechanism that affixes the peeling tape supplied from the tape supply unit to a protective tape on the surface of the wafer, and peels the protective tape from the wafer together with the peeling tape;
5. A tape comprising the tape take-up unit according to claim 1, for winding the peeling tape and the protective tape peeled from the wafer by the peeling mechanism. Peeling device. A method for removing a tape from a tape take-up unit according to any one of claims 1 to 4,
By energizing the ends of the pair of winding pieces on the side far from the shaft in a direction approaching each other, the pair of winding pieces are swung to thereby sway the tape. A tape removal method characterized by causing the tape to protrude in the direction from which it is removed.   The tape removing method according to claim 6, wherein the pair of winding pieces is swung by tightening a screw portion attached to the pair of winding pieces.

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