JP5626106B2 - Electronic device housing structure - Google Patents

Description

  The present invention relates to a housing structure of an electronic device in which a circuit board on which electronic components are mounted is held in a housing space constituted by a case and a cover.

  Conventionally, as a housing structure of an electronic device in which a circuit board on which electronic components are mounted is held in a housing space constituted by a case and a cover, a substrate housing housing disclosed in Patent Document 1 below is known. Yes. The substrate housing case is provided with a guide portion for guiding the movement of the substrate on two opposing inner side surfaces. The holding portion for holding the substrate by holding the substrate on the end surface in the direction in which the substrate is inserted is associated with the substrate. And a support portion for supporting the joint. The holding portion has a pair of holding members including a first holding member and a second holding member, and the holding portions are opposed to each other and have contact portions sandwiched by contacting the substrate. Is provided. The contact portion of the first holding member is a flat surface, and an inclined surface is formed at the end thereof. The contact portion of the second holding member is formed in a protruding shape so as to protrude toward the first holding member.

  When the substrate is inserted from the opening of the case main body to the end surface along the both guide portions with respect to the substrate housing case configured as described above, the substrate contacts the first holding member on the inclined surface. Rises along and is pushed further along that plane. Then, the substrate is inserted while crushing the contact portion of the second holding member, and is sandwiched between the second holding member and the first holding member. Accordingly, the substrate is inserted into the accommodation space while only the protruding holding member is crushed, and the substrate can be disposed at a predetermined position with reference to the plane position of the holding member.

JP 2007-227824 A

  By the way, when the circuit board is accommodated in the case, in order to suppress the backlash of the circuit board in the case, a fixing portion or the like provided on the inner surface of the case presses a part of the circuit board, thereby Is held and accommodated in the case.

  However, since a part of the circuit board is pressed by the fixing portion or the like, it is necessary to make the area where the circuit board is pressed and the peripheral area where distortion is caused by this pressing become a mounting prohibited area where elements cannot be mounted. For this reason, since the area | region (area) which can be mounted in a board | substrate surface reduces, there existed a problem that size reduction of a circuit board and the housing | casing which accommodates this circuit board became difficult. Further, as disclosed in Patent Document 1, even in a configuration in which a circuit board is simply held by a pair of holding members, distortion occurs in the contact area of the board surface that contacts the holding member and its periphery. There's a problem.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a housing structure for an electronic device that can reduce the size of the device by reducing the mounting prohibited area on the substrate surface. There is to do.

To achieve the above object, patents in housing structure of an electronic device according to claim 1 in claims, and the circuit board sandwiching the outer edge portion on which an electronic component on the outer edge of the substrate surface is not implemented is al provided, case opening It includes a case that will be formed to face by a pair of guide portions inner surface for guiding the insertion of the circuit board via a cover for closing the case opening, and composed of the case and the cover the housing space, a housing structure of an electronic device formed by holding the circuit board, wherein the guide portion relative to the clamping edge portion of the circuit board which is inserted is the draft, the circuit board by clamping contact from the front side and the back side of the surface-side support portion for holding the circuit board and consists of the back surface side supporting portion, the front side support portion, the portion of the clamping edge portion side, Outer edge for clamping Is formed so as to be closer to the other surface side support portion, and elastically deformed so that the contact portion further approaches the other surface side support portion with respect to the inserted outer edge portion for clamping. Touching.

  According to a second aspect of the present invention, in the housing structure of the electronic device according to the first aspect, the portion of the back side support portion that contacts the outer edge portion for clamping has the clamping as it approaches the other back side support portion. An inclined surface that is inclined so as to be separated from the outer edge portion is formed.

  According to a third aspect of the present invention, in the housing structure of the electronic device according to the first or second aspect, the surface-side support portion is formed by bending a base portion extending from the inner surface and a tip portion having the contact portion. It is formed so that it may connect.

  According to a fourth aspect of the present invention, in the housing structure of the electronic device according to the third aspect, the surface side support portion is configured such that a connecting portion between the base portion and the tip portion smoothly connects the base portion and the tip portion. It is formed in this.

  According to a fifth aspect of the present invention, in the housing structure of the electronic device according to any one of the first to fourth aspects, the front side support portion is the outer edge portion for clamping with respect to the insertion direction of the circuit board. The portion opposite to the case is formed such that the portion closer to the case opening is away from the outer edge for clamping.

  According to a sixth aspect of the present invention, in the housing structure of the electronic device according to any one of the first to fifth aspects, the back side support portion is the outer edge portion for clamping with respect to the insertion direction of the circuit board. The portion opposite to the case is formed such that the portion closer to the case opening is away from the outer edge for clamping.

  According to a seventh aspect of the present invention, in the electronic device casing structure according to any one of the first to sixth aspects, the surface-side support portion has a length in a direction perpendicular to the substrate surface along the substrate surface. It is characterized by being formed longer than the length in the direction.

  According to an eighth aspect of the present invention, in the electronic device casing structure according to any one of the first to seventh aspects, the surface-side support portion is formed so as to become thinner toward the holding outer edge portion. It is characterized by that.

  A ninth aspect of the present invention is the housing structure of the electronic device according to any one of the first to eighth aspects, wherein the surface-side support portion is formed such that a cross section of the contact portion is formed in an arc shape. And

According to the first aspect of the present invention, the pair of guide portions formed on the opposing inner surfaces of the case are in contact with the clamping outer edge portion of the circuit board inserted and guided from the front side and the back side of the circuit board. and by clamping, the Ru surface side support portion for holding the circuit board and the back surface side supporting portion Tona. The front side support portion is formed so as to be inclined so that the portion on the clamping outer edge portion side approaches the other surface side support portion as it approaches the clamping outer edge portion, and the inserted clamping outer edge portion In contrast, the contact portion is further elastically deformed and brought into contact with the other surface side support portion.

  When transporting a circuit board on a production line or the like, the circuit board is transported by clamping the outer edge part of the circuit board, which is the outer edge part of the circuit board. Cannot be implemented. Therefore, by holding the circuit board by holding the outer edge part for holding electronic components, etc., between the front side support part and the back side support part, the holding part for holding the circuit board presses the board surface. Compared with the case where it does, the mounting prohibition area | region in a board | substrate surface can be reduced.

In particular, since the contact portion of the surface side support portion is further elastically deformed so as to approach the other surface side support portion, the contact portion is brought into contact with the outer edge portion for clamping. In order to restore to the above, a force to move away from the other surface side support portion acts. That is, the urging force acting on the outer edge portion for clamping by the surface side support portion is not only in a direction orthogonal to the substrate surface (hereinafter referred to as an orthogonal direction) but also in a direction along the substrate surface (hereinafter referred to as a surface direction). Will also work. For this reason, the circuit board can be held with less urging force compared to the configuration in which the holding part or the like simply holds the circuit board by contacting from the front side and the back side. Can be suppressed.
Therefore, the mounting prohibited area on the board surface can be reduced, and the apparatus can be downsized by reducing the mounting prohibited area in this way.

  According to the second aspect of the present invention, an inclined surface that is inclined so as to be separated from the holding outer edge portion as the other back surface side supporting portion is approached is formed at a portion that contacts the holding outer edge portion of the back surface side supporting portion. As a result, the end portion of the outer edge portion for clamping comes into contact with the inclined surface of the back surface side support portion, and the drag acts from the back surface side support portion in a direction substantially orthogonal to the inclined surface. To do. That is, the drag force acting on the outer edge portion for clamping by the back surface side support portion acts not only in the orthogonal direction but also in the surface direction. For this reason, since a circuit board can be hold | maintained with less biasing force, generation | occurrence | production of the periphery distortion which a contact site | part contacts can further be suppressed.

  In particular, the direction of the force in the surface direction by the front surface side support portion is a direction away from the other surface side support portion, and the direction of the force in the surface direction by the back surface side support portion is directed to the other back surface side support portion. Since the forces in both surface directions act in opposite directions, the holding force of the outer edge portion for clamping by clamping the front surface side support portion and the rear surface side support portion can be increased.

  In the invention of claim 3, the surface side support portion is formed such that the base portion extending from the inner surface of the case and the tip portion having the contact portion are bent and connected. The stress transmitted through the can easily be dispersed. Thereby, generation | occurrence | production of the stress concentration in a surface side support part can be suppressed.

  In the invention of claim 4, the surface-side support portion is formed so that the connecting portion between the base portion and the tip portion smoothly connects the base portion and the tip portion. Therefore, the connecting portion between the base portion and the tip portion. However, the stress is easily dispersed, and the occurrence of stress concentration in the surface side support portion can be reliably suppressed.

  In the invention of claim 5, the surface side support portion is formed such that a portion facing the outer edge portion for clamping is further away from the outer edge portion for holding toward the case opening side in the insertion direction of the circuit board. Thereby, before the circuit board guided by the guide part is inserted to the prescribed position, the insertion to the prescribed position by being sandwiched between the front-side support part and the back-side support part is suppressed. be able to.

  In the invention of claim 6, the back surface side support portion is formed such that a portion facing the outer edge portion for clamping is further away from the outer edge portion for clamping toward the case opening side in the insertion direction of the circuit board. Thereby, before the circuit board guided by the guide part is inserted to the specified position, the insertion to the specified position is restricted by being sandwiched between the front surface side support part and the back surface side support part. Can do.

  In the invention of claim 7, since the length of the surface-side support portion in the direction orthogonal to the substrate surface (orthogonal direction) is longer than the length in the direction along the substrate surface (surface direction), Compared with the case where the length is shorter than the length in the surface direction, the bending in the orthogonal direction is facilitated. Thereby, the stress transmitted via a contact site | part at the time of a contact with the outer edge part for clamping can be made small.

  In the invention of claim 8, since the surface side support portion is formed so as to become thinner as it approaches the holding outer edge portion, the portion on the holding outer edge portion side including the contact portion is separated from the holding outer edge portion. It becomes easier to bend than a distant part. Thereby, the stress transmitted via a contact site | part at the time of a contact with the outer edge part for clamping can be made small.

  In the invention of claim 9, since the cross section of the contact portion is formed in an arc shape in the surface side support portion, there is no possibility of damaging the portion contacting the circuit board. In particular, since the contact portion does not contact the outer edge portion for clamping with a point or a line, the contact area with the outer edge portion for clamping is ensured, and the circuit board can be stably held.

FIG. 1A is a side view showing a partial cross section of the electronic device according to the first embodiment, and FIG. 1B is a view seen from the connector side. It is sectional drawing to which the connector vicinity of FIG. 1 was expanded. It is sectional drawing by the cut surface equivalent to the 3-3 line | wire of FIG. 1 (A). It is an expanded sectional view for demonstrating the inclination with respect to the insertion direction of a surface side support part and a back surface side support part. It is an expanded sectional view which shows a surface side support part and a back surface side support part. It is an expanded sectional view for demonstrating the force which acts on the outer edge part for clamping. It is an expanded sectional view showing the important section of the case structure of the electronic device concerning the 1st modification of this embodiment. It is sectional drawing which shows the principal part of the housing structure of the electronic device which concerns on the 2nd modification of this embodiment. It is an expanded sectional view which shows a surface side support part and a back surface side support part.

[First Embodiment]
Hereinafter, a housing structure of an electronic device according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a side view showing a partial cross section of the electronic device 10 according to the first embodiment, and FIG. 1B is a view seen from the connector 24 side. FIG. 2 is an enlarged cross-sectional view of the vicinity of the connector 24 of FIG. FIG. 3 is a cross-sectional view taken along a section corresponding to line 3-3 in FIG. FIG. 4 is an enlarged cross-sectional view for explaining the inclination of the front surface side support portion 40 and the back surface side support portion 50 with respect to the insertion direction. FIG. 5 is an enlarged cross-sectional view showing the front surface side support portion 40 and the back surface side support portion 50, and FIG. 5 (A) shows a state before the circuit board 20 is inserted into the case 30, and FIG. ) Shows a state after the circuit board 20 is inserted into the case 30. In FIG. 4, for convenience of explanation, the inclination of the front surface side support portion 40 and the back surface side support portion 50 with respect to the insertion direction is exaggerated.

  An electronic device 10 shown in FIGS. 1A and 1B is an engine ECU that controls an engine mounted on an automobile, for example, and is an external device connected via a connector 24 mounted on a circuit board 20 ( It has a communication function to communicate with (not shown). In the electronic device 10, a housing space S for housing the circuit board 20 is formed by a resin case 30 formed in a substantially rectangular parallelepiped shape and a resin cover 60 that closes the case opening 31 of the case 30. The housing 11 is configured as described above.

  The circuit board 20 is provided with a predetermined wiring pattern on the board surface 22 except for its four side outer edges (hereinafter referred to as a holding outer edge 21), and various electronic components 23 for realizing engine control are mounted on the circuit board 20. Has been. The sandwiching outer edge portion 21 is provided, for example, about 5 mm from the outer end in order to sandwich the circuit board 20 when the circuit board 20 is transferred on a production line or the like, and is an area where electronic components or the like cannot be mounted. Yes.

  As shown in FIGS. 1 and 2, a connector 24 is mounted in the vicinity of the outer edge of the substrate surface 22 as a connection member for connecting to the external device corresponding to the predetermined wiring pattern. The connector 24 is formed by a substantially rectangular parallelepiped connector housing 25, and a male terminal (not shown) for inserting a female terminal of a harness connected to an external device into a connection end surface 25a of the connector housing 25, respectively. A plurality of abbreviations) are formed. Each male terminal is a connector pin 26 and is connected to a corresponding wiring pattern on the substrate surface 22. The connector 24 thus configured has a plurality of protrusions 27 provided on the lower surface of the connector housing 25 in contact with the board surface 22 so that the connection end face 25a of the connector housing 25 protrudes from the outer edge of the board surface 22. It is fastened and fixed to the circuit board 20 using screws 28 or the like.

  The connector housing 25 is formed such that when the circuit board 20 is accommodated in the case 30, the connection end surface 25 a protrudes from the case opening 31 and a predetermined gap is provided with respect to the inner surface (opening end) of the case 30. ing.

  The case 30 is formed so as to be inclined inward so that an opening end portion constituting the case opening 31 is sandwiched and fitted to the cover 60 so that the opening area becomes smaller toward the end portion side. Further, convex portions 32 that engage with a U-shaped engaging portion 63 to be described later when the case opening 31 is closed by the cover 60 are provided on both outer side surfaces of the case 30 in the vicinity of the case opening 31.

  As shown in FIG. 3, among the inner surfaces of the case 30, the inner surfaces 33 and 34 facing each other in the direction along the substrate surface 22 (left and right direction in FIG. 3: surface direction) are inserted through the case openings 31. The circuit board 20 is guided in the insertion direction (left and right direction in FIG. 1A) and the front side (upper side in FIG. 3) and the back side of the circuit board 20 with respect to the clamping outer edge portion 21 of the circuit board 20. The front-side support part 40 and the back-side support part 50 that hold the circuit board 20 are respectively formed by contacting and clamping from (the lower side of FIG. 3).

  As shown in FIG. 4, the front surface side support portion 40 and the back surface side support portion 50 are disposed from the vicinity of the case opening 31 to the bottom surface 35, and are portions facing the clamping outer edge portion 21 with respect to the insertion direction. However, it is formed so as to be inclined away from the holding outer edge portion 21 toward the case opening 31 side. In addition, the bottom surface 35 is formed with two contact portions 35 a that restrict the movement of the circuit board 20 to the back side by contacting the circuit board 20 inserted along the support portions 40 and 50. .

Since the front surface side support portion 40 and the back surface side support portion 50 provided on the inner surface 33 and the front surface side support portion 40 and the back surface side support portion 50 provided on the inner surface 34 are symmetrical, both the support portions 40 of the inner surface 33 are provided. , 50 as a representative example, will be described with reference to FIGS.
As shown in FIG. 5A, the front-side support portion 40 is formed by bending a base portion 41 extending inward from the inner surface 33 and a distal end portion 42 that contacts the clamping outer edge portion 21 at a contact portion 42a. And are formed to be connected. In particular, the connection portion 43 between the base 41 and the tip 42 is formed in an R shape so as to smoothly connect the base 41 and the tip 42 in order to suppress stress concentration. Moreover, the connection part 44 of the base 41 and the inner surface 33 is also formed in an R shape so as to be smoothly connected similarly.

  The front-side support portion 40 is formed such that the length in the direction orthogonal to the substrate surface 22 (orthogonal direction) is longer than the length in the direction along the substrate surface 22 (surface direction). That is, the tip portion 42 that is long in the orthogonal direction is formed to be longer than the base portion 41 that is long in the surface direction.

  In addition, the tip end portion 42 which is a portion on the clamping outer edge portion side becomes closer to the other surface side support portion 40 (the surface side support portion 40 provided on the inner surface 34) as the cross-sectional shape approaches the clamping outer edge portion 21. It is formed to incline so as to approach. The distal end portion 42 is formed so as to become thinner toward the contact portion 42a side (closer to the holding outer edge portion 21), and the cross section of the contact portion 42a is formed in an arc shape.

  Particularly, in the vicinity of the bottom surface 35 (see the region A in FIG. 4), the tip end portion 42 has a contact portion 42a further on the other side of the inserted outer edge portion 21 as shown in FIG. 5B. It forms so that it may contact in the state elastically deformed so that the surface side support part 40 may be approached.

  The portion of the back surface side support portion 50 that contacts the clamping outer edge portion 21 (the portion that faces the front surface side support portion 40) approaches the other back surface side support portion 50 (the back surface side support portion 50 provided on the inner surface 34). An inclined surface 51 is formed so as to be farther away from the outer edge portion 21 for clamping.

  The cover 60 closes the case opening 31 in a state where the connection end face 25a of the connector housing 25 is exposed to the outside by being assembled to the case 30 in which the circuit board 20 is accommodated. This prevents foreign matter from entering the case 30 and condensation from passing through. The cover 60 has a cover main body 61 for closing the case opening 31, and an annular fitting portion 62 and a pair of U-shaped engaging portions 63 for assembling the cover main body 61 to the case 30. Is formed.

  The annular fitting portion 62 is formed so as to protrude in a substantially square ring shape along the outer edge of the cover body 61 so as to be fitted and fitted from the inner surface side to the opening end portion constituting the case opening 31. The annular fitting portion 62 is formed such that the upper fitting portion 62a located on the upper side contacts the upper surface of the inner surface of the case 30 on the upper surface and contacts the upper surface of the connector housing 25 on the lower surface. Further, the pair of U-shaped engaging portions 63 protrudes in a substantially orthogonal direction from both ends in the longitudinal direction with respect to the cover body 61 so as to engage with the convex portions 32 provided on both outer side surfaces of the case 30. Each is formed in a shape.

  The cover main body 61 is formed with a rectangular insertion opening 64 through which the connector housing 25 can be inserted at the center thereof. Further, the lower edge of the insertion opening 64 of the cover main body 61 is interposed between the board surface 22 and the connector housing 25 and is in contact with only the connector housing 25 in an elastically deformed state without contacting the board surface 22. A plurality of support portions 65 are formed (see FIG. 2). These support portions 65 are opposed to the connector housing 25 by the upper fitting portion 62a of the annular fitting portion 62 and contact from the upper and lower directions, thereby holding a pair of circuit boards 20 on which the connector 24 is mounted. Each functions as a holding unit.

  The support portion 65 includes a protrusion 65 a that contacts the connector housing 25 at a position away from the cover body 61, and an elastically deformable beam portion 65 b that connects the protrusion 65 a and the cover body 61. The protrusion 65 a is formed with an inclined front end side in order to facilitate insertion of the connector housing 25 into the insertion opening 64.

  The beam portion 65b is trapezoidal so that the length in the direction along the substrate surface 22 gradually increases from the protrusion 65a toward the cover body 61 in order to avoid stress concentration at the connection portion with the cover body 61. The cross-sectional area in the direction orthogonal to the substrate surface 22 is gradually increased. The beam portion 65b is formed so that the upper surface thereof is connected to the lower edge of the insertion opening 64 substantially in parallel with no step and the thickness thereof is substantially constant.

  By configuring each support portion 65 in this way, when the connector housing 25 is inserted into the insertion opening 64, each projection 65a contacts the lower surface of the connector housing 25 and moves downward, so that the beam portion 65b moves downward. Elastically deforms so as to incline toward As a result, the elastic force of the support portion 65 acts upward on the lower surface of the connector housing 25 via the protrusion 65a. At the time of this insertion, since the upper fitting portion 62a of the annular fitting portion 62 is in contact with the upper surface of the connector housing 25, each support portion 65 can also serve as a biasing means for biasing the connector housing 25 for holding. Function.

  Further, when the cover 60 is assembled to the case 30 in which the circuit board 20 is accommodated, a portion of the circuit board 20 excluding the board surface 22, specifically, a side edge of the circuit board 20 is arranged in the insertion direction. A pressing portion 66 is provided to press against. The pressing portion 66 is formed of a member that is more easily elastically deformed than the cover main body 61, such as a rubber member, for example, in order to impart an appropriate elastic force to the side edge portion. The pressing portion 66 may be formed integrally with the cover body 61.

  Next, the holding state of the circuit board 20 by the front surface side support part 40 and the back surface side support part 50 when the circuit board 20 is inserted into the case 30 will be described with reference to FIG. FIG. 6 is an enlarged cross-sectional view for explaining the force acting on the sandwiching outer edge portion 21.

  First, the circuit board 20 is inserted into the case 30 so as to be guided on the case opening side of the front surface side support portion 40 and the back surface side support portion 50 through the case opening 31. At this time, the front-side support portion 40 and the back-side support portion 50 are formed so that the portion facing the holding outer edge portion 21 is away from the holding outer edge portion 21 toward the case opening 31 side. Functioning as a guide part for guiding the insertion of the circuit board 20 through, and before being inserted to a position where the circuit board 20 contacts the contact part 35a, the insertion is restricted by being sandwiched between the support parts 40 and 50. There is nothing.

  Then, the circuit board 20 is inserted to a predetermined position where the circuit board 20 is in contact with both contact portions 35a of the bottom surface 35, and the sandwiching outer edge portion 21 is moved by the front surface side support portion 40 and the back surface side support portion 50 in the vicinity of the contact portion 35a. It is accommodated in the case 30 while being sandwiched from above and below.

  At this time, as shown in FIG. 5B, the front end portion 42 of the front surface side support portion 40 has a contact portion 42a closer to the other front surface side support portion 40 with respect to the inserted outer edge portion 21 for clamping. In contact with each other in an elastically deformed state. Further, the back surface side support portion 50 is in contact with the end portion of the sandwiching outer edge portion 21 at the inclined surface 51.

  As a result, an urging force (arrow F1 in FIG. 6) that the elastically deformed contact portion 42a is restored to the original shape acts on the surface side of the outer edge portion 21 for clamping. That is, the urging force that acts on the outer edge portion 21 for clamping by the front surface side support portion 40 acts not only in the orthogonal direction but also in the surface direction. Further, a drag force (arrow F <b> 2 in FIG. 6) acts from the back surface side support portion 50 in a direction substantially orthogonal to the inclined surface 51 on the back surface side of the sandwiching outer edge portion 21. That is, the drag force acting on the outer edge portion 21 for clamping by the back surface side support portion 50 acts not only in the orthogonal direction but also in the surface direction. As described above, the force in the surface direction by the front surface side support portion 40 and the force in the surface direction by the back surface side support portion 50 act in opposite directions to each other. The holding power of the outer edge portion 21 can be increased.

Next, attachment of the cover 60 to the case 30 that houses the circuit board 20 will be described.
After the circuit board 20 is accommodated in the case 30 as described above, the cover 60 is brought close to the case 30 so as to face the connection end surface 25a of the connector housing 25 at the insertion opening 64. Then, by pushing the cover 60 into the case side, the protrusions 65a of the support portions 65 are pressed down while coming into contact with the lower surface of the connector housing 25, and the beam portions 65b are elastically deformed so as to be inclined downward. At this time, the annular fitting portion 62 is in contact with the upper surface of the connector housing 25 at the lower surface of the upper fitting portion 62a. Further, when the cover 60 is pushed into the case side, the annular fitting portion 62 comes into contact with the outer surface so that the opening end portion constituting the case opening 31 is extended to the outer surface side.

  Then, the cover 60 is pushed into the case side until the pressing portion 66 contacts the side edge portion of the circuit board 20, whereby the annular fitting portion 62 is pinched and fitted to the open end portion, and both U-shaped engaging portions 63 are inserted. Engages with each of the convex portions 32. Thereby, the assembly of the cover 60 to the case 30 is completed in a state where the connection end surface 25a of the connector housing 25 protrudes outward from the insertion opening 64.

  When the assembly is completed, the cover 60 is mounted on the circuit board on which the connector 24 is mounted by contacting the connector housing 25 from above and below by a pair of holding portions of the support portion 65 and the upper fitting portion 62a. 20 is held without contacting the substrate surface 22. In such an assembled state, even when an external force is transmitted to each support portion 65 via the connector 24, the external force can be relaxed by elastic deformation of each support portion 65.

  As described above, in the case structure of the electronic device 10 according to the present embodiment, the opposing inner surfaces 33 and 34 of the case 30 are guided with respect to the sandwiching outer edge portion 21 of the circuit board 20. The front side support part 40 and the rear side support part 50 that hold the circuit board 20 are formed by contacting and sandwiching from the front side and the rear side of the circuit board 20, respectively. And the surface side support part 40 is inclined and formed so that the site | part on the outer edge part 21 for clamping approaches the other surface side support part 40, so that the outer edge part 21 for clamping is approached. The contact portion 42a is further elastically deformed and brought into contact with the sandwiching outer edge portion 21 so as to approach the other surface side support portion 40.

  Thus, holding for holding the circuit board 20 by holding the circuit board 20 by holding the outer edge part 21 for holding electronic parts or the like between the front-side support part 40 and the back-side support part 50. Compared with the case where the part or the like presses the board surface, the mounting prohibited area on the board surface 22 can be reduced.

In particular, since the contact portion 42a of the front surface side support portion 40 is further elastically deformed so as to approach the other front surface side support portion 40, it comes into contact with the outer edge portion 21 for clamping. The urging force acting on the substrate acts not only in the direction orthogonal to the substrate surface 22 (orthogonal direction) but also in the direction along the substrate surface 22 (surface direction). For this reason, since the holding part etc. can hold the circuit board 20 with a small urging force as compared with the configuration in which the circuit board 20 is held simply by contacting from the front side and the back side, the peripheral portion where the contact part 42a comes into contact can be held. Generation of distortion can be suppressed.
Therefore, the mounting prohibited area on the substrate surface 22 can be reduced, and the size of the apparatus can be reduced by reducing the mounting prohibited area in this way.

  Furthermore, an inclined surface 51 that is inclined so as to move away from the holding outer edge portion 21 as the other back surface side supporting portion 50 is approached is formed at a portion that contacts the holding outer edge portion 21 of the back surface side support portion 50. As a result, the end of the clamping outer edge portion 21 comes into contact with the inclined surface 51 of the back surface side support portion 50, so that the drag acting on the clamping outer edge portion 21 by the back surface side support portion 50 is only in the orthogonal direction. It also acts in the surface direction. For this reason, since the circuit board 20 can be hold | maintained with less biasing force, generation | occurrence | production of the periphery distortion which a contact location contacts can further be suppressed.

  In particular, the direction of the force in the surface direction by the front surface side support portion 40 is a direction away from the other surface side support portion 40, and the direction of the force in the surface direction by the back surface side support portion 50 is the other back surface side support. Since the force in both surface directions acts in the opposite direction to each other, the holding force of the holding outer edge portion 21 by holding the front surface side support portion 40 and the back surface side support portion 50 can be increased. it can. Note that the back-side support portion 50 is not limited to be formed so as to be in contact with the outer edge portion 21 for clamping on the inclined surface 51 according to the circuit board 20 to be held, for example, on the outer edge portion 21 for clamping. It may be formed so as to be in surface contact with a parallel contact surface.

  Further, the front side support portion 40 is formed so that the base portion 41 extending from the inner surfaces 33 and 34 of the case 30 and the tip end portion 42 having the contact portion 42a are bent and connected. The stress transmitted through the contact part 42a is easily dispersed. Thereby, generation | occurrence | production of the stress concentration in the surface side support part 40 can be suppressed.

  The surface side support portion 40 is not limited to be formed such that the base portion 41 and the tip portion 42 are bent and connected, and the base portion 41 and the tip portion 42 are bent via one or a plurality of connecting portions. And may be formed to be connected. Thereby, since the bending location in the surface side support part 40 increases, generation | occurrence | production of the stress concentration in the said surface side support part 40 can be suppressed more.

  Furthermore, since the connection part 43 of the base part 41 and the front-end | tip part 42 is formed so that the connection part 43 of the base 41 and the front-end | tip part 42 may connect the said base 41 and the front-end | tip part 42 smoothly, these surface side support parts 40 are connected. The stress is easily dispersed even in the portion 43, and the occurrence of stress concentration in the surface side support portion 40 can be reliably suppressed. In addition, even when the number of bent portions in the surface-side support portion 40 is increased as described above, the connection portion between the base portion 41 and the tip portion 42 and the connection portion connected thereto and the connection portion between the connection portions are smoothly connected. Thus, the occurrence of stress concentration in the front-side support portion 40 can be suppressed more reliably.

  Further, since the front-side support portion 40 is formed so as to become thinner as it approaches the holding outer edge portion 21, the portion on the holding outer edge portion side including the contact portion 42a is separated from the holding outer edge portion 21. It becomes easier to bend than the part. Thereby, the stress transmitted through the contact part 42a at the time of contact with the outer edge portion 21 for clamping can be reduced.

  Moreover, since the cross section of the contact part 42a is formed in circular arc shape, the surface side support part 40 does not have a possibility of damaging the part which contacts the circuit board 20. FIG. Particularly, since the contact portion 42a does not contact the outer edge 21 for clamping with a point or a line, the contact area with the outer edge 21 for clamping is ensured and the circuit board 20 is stably held. be able to. In addition, the contact part 42a of the surface side support part 40 is not limited to being formed in an arc shape in cross section, and may be formed in, for example, a rectangular cross section depending on the shape of the sandwiching outer edge part 21 in contact. .

  Moreover, since the length in the direction orthogonal to the substrate surface 22 (orthogonal direction) is longer than the length in the direction along the substrate surface 22 (surface direction), the front-side support portion 40 has a length in the orthogonal direction. Compared with the case where is formed shorter than the length in the surface direction, it becomes easier to bend in the orthogonal direction. Thereby, the stress transmitted through the contact part 42a at the time of contact with the outer edge portion 21 for clamping can be reduced.

  Further, as shown in FIG. 4, the front surface side support portion 40 and the back surface side support portion 50 are arranged so that the portion facing the outer edge portion 21 for clamping is closer to the case opening 31 side in the insertion direction of the circuit board 20. It is formed so as to be separated from the outer edge portion 21. As a result, the vicinity of the case opening 31 of both the support portions 40 and 50 functions as a guide portion that guides the insertion of the circuit board 20 through the case opening 31, and the guided circuit board 20 contacts the contact portion 35a. It is possible to prevent the insertion to the above-mentioned position from being sandwiched between the support portions 40 and 50 before being inserted to the contacting position.

  In addition, as shown in FIG. 4, the site | part which opposes the outer edge part 21 for clamping of both the surface side support part 40 and the back surface side support part 50 is formed so that the case opening 31 side may leave | separate from the said outer edge part 21 for clamping. However, the portion of the front-side support portion 40 and the back-side support portion 50 that faces the holding outer edge portion 21 is formed so as to be farther from the holding outer edge portion 21 toward the case opening 31 side. Also good.

  Further, the front surface side support portion 40 and the back surface side support portion 50 are provided only in the vicinity of the contact portion 35 a, and a guide portion for guiding the insertion of the circuit board 20 through the case opening 31 is separately provided on the inner surfaces 33 and 34. Each may be provided.

FIG. 7 is an enlarged cross-sectional view showing the main part of the housing structure of the electronic device 10 according to the first modification of the present embodiment.
As shown in FIG. 7, as a first modification of the present embodiment, when the height of the case 30 (the length in the orthogonal direction) is low, the surface-side support portion 40a has a surface direction (left and right in FIG. 7). (Direction) may be longer than the length in the orthogonal direction (vertical direction in FIG. 7). In this case, the front-side support portion 40a can be formed so as to contact a portion located on the side opposite to the connector of the holding outer edge portion 21 provided on the four-side outer edge portion of the circuit board 20. Thereby, the holding force in the surface direction can be increased and the circuit board 20 can be held with a smaller biasing force. As shown in FIG. 7, the holding force can be further increased by engaging a part of the contact portion 42 a of the tip 42 with the through hole 22 a used when the circuit board 20 is transferred.

FIG. 8 is a cross-sectional view illustrating the main part of the housing structure of the electronic device 10 according to the second modification of the present embodiment.
As shown in FIG. 8, as a second modification of the present embodiment, the front surface side support portion 40 and the back surface side support portion 50 are formed on the upper and lower targets on the inner surface 33 of the case 30 and the inner surface 34 of the case 30. The front surface side support part 40 and the back surface side support part 50 may be formed on a pair of upper and lower objects. Thus, the circuit board 20 can be guided and held even when the circuit board 20 is inserted so that the back surface of the case 30 is closer to either the upper surface 36 or the lower surface 37 of the case 30. The workability of the insertion work to insert can be improved.

In addition, this invention is not limited to said each embodiment and its modification, You may actualize as follows.
(1) The housing structure of the electronic device according to the present invention is not limited to being applied to the housing structure of the engine ECU. For example, a circuit board such as an electronic device that controls equipment mounted in another automobile is used. You may apply to the housing structure of the electronic device hold | maintained in a case.

(2) FIG. 9 is an enlarged cross-sectional view showing the front surface side support portion 70 and the back surface side support portion 50, and FIG. 9A shows a state before the circuit board 20 is inserted into the case 30. 9 (B) shows a state after the circuit board 20 is inserted into the case 30.
As shown in FIG. 9A, in the case 30, a surface side support portion 70 may be employed instead of the surface side support portion 40. The front surface side support portion 70 includes a base portion 71 that extends inward from the inner surface 33, and a distal end portion 72 that is in surface contact with the sandwiching outer edge portion 21 at a contact portion 72 a. As shown in FIGS. 9 (A) and 9 (B), the base 71 has an upper end of the distal end portion 72 so that the distal end portion 72 that is in surface contact with the holding outer edge portion 21 at the contact portion 72a is displaced along the orthogonal direction. It forms so that it may incline and connect with respect to a part. In particular, the connecting portion 73 between the base 71 and the tip 72 is formed in an R shape so as to smoothly connect the base 71 and the tip 72 in order to suppress stress concentration. Moreover, the connection part 74 of the base 71 and the inner surface 33 is also formed in an R shape so as to be smoothly connected similarly.

  When the circuit board 20 is inserted into the case 30 configured as described above, the distal end portion 72 that is in contact with the holding outer edge portion 21 is displaced along the orthogonal direction, so that the contact portion 72a is always held in the holding outer edge portion. 21 is in surface contact. Thereby, the holding force of the circuit board 20 by clamping between the front surface side support part 70 and the back surface side support part 50 can be ensured.

DESCRIPTION OF SYMBOLS 10 ... Electronic device 11 ... Housing 20 ... Circuit board 21 ... Outer edge part 22 ... Board surface 30 ... Case 31 ... Case opening 40, 40a ... Surface side support part 41 ... Base part 42 ... Tip part 42a ... Contact part 50 ... Back side support part 51 ... inclined surface 60 ... cover

Claims (9)

A circuit board sandwiching the outer edge portion is found provided that the electronic component is not mounted on the outer edge of the substrate surface,
A pair of guide portions Ru formed to face at the inner surface casing to guide the insertion of the circuit board through the case opening,
A cover for closing the case opening,
In the housing structure of the electronic device formed by holding the circuit board in a housing space constituted by the case and the cover,
The guide portion, relative to the clamping edge portion of the circuit board which is inserted is the draft, by clamping in contact from the front side and the back side of the circuit board, surface for holding the circuit board side support and made from the rear side support portion,
The surface side support part is
The portion on the clamping outer edge portion side is formed to be inclined so as to approach the other surface side support portion as it approaches the clamping outer edge portion,
A housing structure of an electronic device, wherein the inserted outer edge part is elastically deformed and brought into contact with the inserted outer edge part so as to approach the other surface side support part.   The portion of the back surface side support portion that contacts the outer edge portion for clamping is formed with an inclined surface that is inclined so as to move away from the outer edge portion for clamping as it approaches the other back surface side support portion. Item 12. The electronic device casing structure according to Item 1.   The electronic device according to claim 1, wherein the surface-side support portion is formed such that a base portion extending from the inner surface and a tip portion having the contact portion are bent and connected. Enclosure structure.   The case structure of the electronic device according to claim 3, wherein the surface-side support portion is formed such that a connection portion between the base portion and the tip portion smoothly connects the base portion and the tip portion. .   The surface-side support portion is formed such that a portion facing the outer edge portion for clamping with respect to the insertion direction of the circuit board is separated from the outer edge portion for clamping toward the case opening side. The housing structure of the electronic device as described in any one of 1-4.   The back surface side support portion is formed such that a portion facing the outer edge portion for clamping in the insertion direction of the circuit board is separated from the outer edge portion for clamping toward the case opening side. The housing structure of the electronic device as described in any one of 1-5.   The electron according to any one of claims 1 to 6, wherein the surface-side support portion is formed such that a length in a direction orthogonal to the substrate surface is longer than a length in a direction along the substrate surface. The housing structure of the device.   The case structure of the electronic device according to claim 1, wherein the surface-side support portion is formed so as to be thinner as the outer edge portion for clamping is closer.   The case structure of the electronic device according to claim 1, wherein the surface-side support portion has a cross section of the contact portion formed in an arc shape.

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