JP5622129B2 - Insulated wire - Google Patents

Description

  The present invention particularly relates to an insulated wire having a high partial discharge withstand voltage.

  In recent years, hybrid vehicles have begun to spread with the background of energy saving, and motors used are driven by inverters to improve fuel efficiency and power performance, and are rapidly becoming smaller, lighter, more heat resistant, and driven at higher voltages. .

  The enameled wire currently used in this motor coil is excellent in heat resistance, mechanical characteristics that can withstand harsh coil forming, or mission-resistant oil in order to meet the requirements of motor performance such as small size, light weight, and high heat resistance. A polyamide-imide enameled wire that has properties and the like is indispensable. However, with respect to the mission oil resistance, the insulation retention is greatly affected by the type and amount of the oil additive, but the hydrolyzability due to water content is directly linked to the mission oil resistance except for the influence of the oil additive.

  Polyamideimide resin insulation coatings used for this polyamideimide enamel wire coating are generally N-methyl-2-pyrrolidone (NMP), N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAC), dimethyl. In a polar solvent such as imidazolidinone (DMI), an amide group and an imide group are obtained by decarboxylation of 4,4′-diphenylmethane diisocyanate (MDI) and trimellitic anhydride (TMA) mainly using two components. Is a heat-resistant polymer resin produced at a ratio of almost half and exhibiting excellent properties such as heat resistance, mechanical properties and hydrolysis resistance.

  For example, an isocyanate method or an acid chloride method is known as a method for producing a polyamide-imide resin insulating paint. From the viewpoint of production productivity, an isocyanate method is generally used. As an example of the polyamideimide, one obtained by a synthesis reaction mainly of two components of 4,4'-diphenylmethane diisocyanate (MDI) and trimellitic anhydride (TMA) as an acid component is best known.

  In addition, there is a method of synthesizing a polyamideimide resin with MDI after reacting BAPP and TMA in an acid excess of 50/100 to 80/100 in order to modify the properties of the polyamideimide resin (Patent Literature). 1).

  On the other hand, for higher voltage drive of motors, combined with inverter surges, the risk of partial discharge is increasing, making it difficult to handle inverter surge insulation. One of the disadvantages of the coating film is that the dielectric constant is high, and the presence of amide groups and imide groups has the greatest influence on the increase in dielectric constant in terms of the resin structure. Polyamideimide resin insulation paint has much better heat resistance, mechanical properties, hydrolysis and oil resistance than other enamel resin insulation paints such as polyester and polyesterimide, but has a high dielectric constant and starts partial discharge. The voltage is low. Polyimide resin insulating paints have high heat resistance, but are inferior in wear resistance and hydrolyzability, resulting in inferior mechanical properties, mission oil resistance, and the like related to coil winding workability.

  In insulated wires, especially enameled wires used in motor coils, motors are often driven by inverters for higher efficiency, causing excessive discharge (inverter surge), causing partial discharge deterioration, There are many cases that lead to dielectric breakdown. In addition, the motor drive voltage tends to increase, and the risk of occurrence of partial discharge is further increased.

  Therefore, if a polyamide-imide resin insulating paint having a low dielectric constant can be obtained, an enameled wire excellent in partial discharge resistance that can cope with high voltage driving can be provided.

  As a technique for improving the service life against this partial discharge, a partial discharge resistant enamel wire produced by coating a conductor with a partial discharge resistant resin paint obtained by dispersing an organosilica sol in a resin solution is disclosed. (For example, refer to Patent Documents 2 and 3).

  In partial discharge resistant resin coatings in which such an organosilica sol is dispersed in a resin solution, the solubility of the organosilica sol and the resin solution greatly contributes to the improvement of the partial discharge resistance, but several types of monomers are copolymerized. It has also been shown that the solubility of an organosilica sol and a resin solution comprising a polyamide-imide resin paint is improved (see Patent Document 4).

  As another method, there is a method in which the electric field between enamel wires (the electric field applied to the air layer existing between the wires) is relaxed to make it difficult for partial discharge to occur, thereby improving the service life.

  There are a method of relaxing the electric field by imparting conductivity or semiconductivity to the surface of the enameled wire, and a method of reducing the electric field by reducing the dielectric constant of the insulating film.

JP 2004-204187 A JP 2006-302835 A Japanese Patent No. 2897186 Japanese Patent No. 3396636

  In the method of making the surface of the enameled wire conductive or semi-conductive, there are many problems such as the occurrence of scratches during coil winding, resulting in a decrease in insulation characteristics, and the need to perform terminal insulation treatment. The practicality is low.

  On the other hand, in the method of reducing the dielectric constant of the film, since lowering the dielectric constant depends on the resin structure, it generally causes adverse effects on heat resistance and mechanical properties. Was difficult.

  In addition, the polyamideimide resin insulating paint synthesized by the method of Patent Document 1 has a drawback that the softening temperature is low when it is used as an enameled wire film.

  If the softening temperature is low, the motor is overloaded and the possibility of a short circuit increases when the motor is instantaneously exposed to high temperatures.

  Accordingly, an object of the present invention is to solve the above-mentioned problems and provide an insulated wire having a high partial discharge starting voltage by reducing the dielectric constant while maintaining heat resistance, mechanical characteristics, oil resistance and the like.

In order to achieve the above object, the invention of claim 1 includes 2,2-bis [4- (4-aminophenoxy) phenyl] propane, bis [4- (4-aminophenoxy) phenyl] ether, fluorenediamine, 4 , 4′-bis (4-aminophenoxy) biphenyl, 1,4-bis (4-aminophenoxy) benzene, or an aromatic having three or more benzene rings consisting of at least one selected from isomers thereof An aromatic diamine component comprising a diamine and an aromatic diamine having two or less benzene rings, an aromatic diisocyanate component, and an acid component having an aromatic tricarboxylic acid anhydride are solution polymerized using a solvent. Polyamideimide resin insulation paint (excluding the polyamideimide resin insulation paint where precipitation occurred) on the conductor or other insulation A film is formed by coating and baking on the film, and the film is an insulated wire characterized by having a relative dielectric constant of 3.5 or less and a softening resistance of 390 ° C. or more.

  According to the present invention, characteristics equivalent to those of a general-purpose polyamide-imide enameled wire composed of MDI and TMA are maintained, and the partial discharge start voltage is improved by lowering the dielectric constant without particularly reducing the softening temperature. A film can be obtained.

It is a figure which shows the electric wire which apply | coated the polyamide imide resin insulation coating material of this invention.

  Embodiments of the present invention will be described below.

  The present invention relates to an aromatic diamine component produced by reacting an aromatic diamine component with an acid component composed of an aromatic tricarboxylic acid anhydride in an excess and imidizing by a dehydration ring-closing reaction between the acid anhydride and an amine. After cooling the aromatic imide prepolymer, the aromatic diisocyanate component is added and an amide bond is formed by decarboxylation of the dicarboxylic acid and the diisocyanate. Polymer of amide group and imide group which has the most influence on increase in dielectric constant of polyamide-imide resin, using aromatic diamine component in combination of aromatic diamine having ring and aromatic diamine having two or less benzene rings Reduced dielectric constant by reducing the abundance ratio in the polyamideimide resin insulation with excellent heat resistance It may be a fee.

  The polyamideimide resin insulating coating used in the present invention performs solution polymerization using a polar solvent such as NMP (N-methyl-2-pyrrolidone) as a main solvent.

  In addition to NMP as a main solvent, polyamide-imide resins such as γ-butyrolactone, DMAC (N, N-dimethylacetamide), DMF (N, N-dimethylformamide), DMI (dimethylimidazolidinone), cyclohexanone, methylcyclohexanone These may be synthesized in combination with a solvent that does not inhibit the synthesis reaction, or may be diluted. In addition, aromatic alkylbenzenes may be used in combination for dilution purposes. However, it is necessary to consider when there is a risk of lowering the solubility of the polyamideimide resin.

  As the aromatic diamine component, aromatic diamines having 3 or more benzene rings and aromatic diamines having 2 or less benzene rings are used in combination.

Examples of aromatic diamines having three or more benzene rings include 2,2-bis [4- (4-
Aminophenoxy) phenyl] propane (BAPP), bis [4- (4-aminophenoxy) phenyl] ether (BAPE), fluorenediamine (FDA), 4,4′-bis (4-aminophenoxy) biphenyl, 1,4 At least one selected from bis (4-aminophenoxy) benzene or isomers thereof can be used.

  Examples of aromatic diamines having two or less benzene rings include 4,4′-diaminodiphenyl ether (DPE), 4,4′-diaminodiphenyl sulfone (DDS), and 4,4′-diaminodiphenylmethane (DAM). 1,2-diaminobenzene, 1,3-diaminobenzene, 1,4-diaminobenzene, or at least one selected from isomers thereof can be used.

  These aromatic diamines may be used in combination with an aromatic diamine containing a halogen element, if necessary. In some cases, alicyclic diamines and silane-based diamines can be used in combination.

  Moreover, it is general and industrially possible to produce diisocyanates using phosgene based on diamines, and all or a part of the above-listed diamines may be used instead of diisocyanates. I can do it. When all of them are replaced with diisocyanates, it is also possible to synthesize by one-stage decarboxylation reaction by mixing at once with MDI used in the second-stage synthesis without using the two-stage synthesis. When a part is changed, it can be mixed with the MDI used in the second stage synthesis.

  As aromatic diisocyanate components, 4,4′-diphenylmethane diisocyanate (MDI), 2,2-bis [4- (4-isocyanatophenoxy) phenyl] propane (BIPP), tolylene diisocyanate (TDI), naphthalene diisocyanate, xylylene Examples include aromatic diisocyanates, isomers, and multimers such as range isocyanate, biphenyl diisocyanate, diphenylsulfone diisocyanate, and diphenyl ether diisocyanate. Further, if necessary, aliphatic diisocyanates such as hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, and xylylene diisocyanate, or alicyclic diisocyanates and isomers obtained by hydrogenating the aromatic diisocyanates exemplified above are also used. You may use together.

  As an acid component, there is TMA (trimet acid anhydride) as a tricarboxylic acid anhydride. In addition, aromatic tricarboxylic acid anhydrides such as benzophenone tricarboxylic acid anhydride can be used, but TMA is most preferable.

  It is also possible to use tetracarboxylic dianhydrides together with TMA. Examples of tetracarboxylic dianhydrides include pyromellitic dianhydride (PMDA), 3,3′4,4′-benzophenonetetracarboxylic dianhydride (BTDA), and 3,3′4,4′-diphenylsulfone. Examples include tetracarboxylic dianhydride (DSDA), 4,4′-oxydiphthalic dianhydride (ODPA), 3,3′4,4′-biphenyltetracarboxylic dianhydride, and the like. Butanetetracarboxylic dianhydride, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, or the aromatic tetracarboxylic acid exemplified above You may use together alicyclic tetracarboxylic dianhydride etc. which hydrogenated the dianhydride.

  When used together with alicyclic structure raw materials, it is expected to have an effect on reducing the dielectric constant and improving the transparency of the resin composition, so it may be used together as necessary, but it may cause a decrease in heat resistance. Consideration of the structure is necessary.

  The blending ratio of the aromatic diamine having three or more benzene rings and the aromatic diamine having two or less benzene rings is (aromatic diamine having three or more benzene rings) / (two or less Aromatic diamines having a benzene ring) = 99/1 to 30/70 (molar ratio) is in an appropriate range, preferably (aromatic diamines having three or more benzene rings) / (two The following aromatic diamines having a benzene ring) = 70/30 to 40/60 (molar ratio) is preferable. When the blending ratio of aromatic diamines having three or more benzene rings is more than 99 (molar ratio), the softening temperature may be lowered although the effect of reducing the dielectric constant is increased. Moreover, when the blending ratio of aromatic diamines having two or less benzene rings is more than 70 (molar ratio), the softening temperature tends to be improved, but the dielectric constant becomes high, and 1 The solubility may decrease during the imidization reaction at the stage, which is not preferable.

  There is no particular limitation on the ratio of the aromatic diamine component and TMA in which an aromatic diamine having three or more benzene rings and an aromatic diamine having two or less benzene rings are used in combination. The mixing ratio of all diamine components using aromatic diamines having three or more benzene rings and aromatic diamines having two or less benzene rings, and other diamines if necessary, and TMA The mixing ratio of all the acid components combined with other tetracarboxylic dianhydrides used as required is most preferably the same amount of amine and anhydride required for the imidization reaction. When this ratio is deviated, an amino group or the like that causes a side reaction remains in the second-stage synthesis, and the characteristics of the polyamide-imide resin insulating paint are ultimately deteriorated.

  In the polyamideimide resin insulation paint using general MDI and TMA, it synthesize | combines by a substantially equal amount with MDI and TMA, However About an isocyanate component, it may be oversynthesized in the range of 1-1.05. The blending ratio of the second stage MDI of the present invention is not particularly limited, but the imide dicarboxylic acid synthesized in the first stage and the total amount of diisocyanates are preferably equal. Note that, as in the first stage, a slight excess of isocyanate may be blended.

  The lower the relative dielectric constant, the better. However, in order to exhibit effectiveness in inverter surge insulation (partial discharge resistance), 3.5 or less is desirable.

  At the time of synthesizing the polyamideimide resin insulating paint, a reaction catalyst such as amines, imidazoles, and imidazolines may be used, but those that do not inhibit the stability of the paint are desirable. A sealing agent such as alcohol may be used when the synthesis reaction is stopped.

  Examples 1-7 and Comparative Examples 2-3 are the synthesis | combination of the polyamideimide resin insulation coating material which used the diamine component (aromatic diamine component), and implemented the two-step synthesis | combination as follows.

  Prepare a flask equipped with a stirrer, a reflux condenser, a nitrogen inlet pipe, and a thermometer, and as the first-stage synthesis reaction, the diamine components and acid components shown in Examples 1 to 7 and Comparative Examples 2 to 3, About 50 to 80% of the solvent, heated to 180 ° C. in about 1 hour with stirring in a nitrogen atmosphere, and allowed to react at this temperature for 4 hours while removing water generated by the dehydration reaction from the system. It was. After cooling to 60 ° C. while maintaining the nitrogen atmosphere, the diisocyanate component and the remaining solvent are added, and the second stage synthesis reaction is heated to 140 ° C. with stirring in a nitrogen atmosphere for about 1 hour. It was made to react at this temperature for 2 hours so as to obtain a polyamideimide resin solution having a viscosity of about 0.5 dl / g.

  Comparative Example 1 was a synthesis of a general polyamideimide resin insulating paint using only a diisocyanate component, and was carried out as follows.

  The raw material and solvent shown in Comparative Example 1 were charged at once into a flask equipped with a stirrer, reflux condenser, nitrogen inlet tube, and thermometer, and heated to 140 ° C. in about 1 hour with stirring in a nitrogen atmosphere. It was made to react at this temperature for 2 hours so as to obtain a polyamideimide resin solution having a viscosity of about 0.5 dl / g.

  The polyamide-imide resin insulating paint was applied onto a 0.8 mm copper conductor and baked to obtain an enameled wire with a film thickness of 45 μm.

  FIG. 1 is a view showing an electric wire coated with a polyamide-imide resin insulating paint according to the present invention.

  An insulating coating 2 is obtained around the conductor 1 by applying and baking a polyamide-imide resin insulating paint on the conductor 1.

  Alternatively, another insulating film may be formed directly on the conductor 1, and the film 2 made of the polyamide-imide resin insulating paint of the present invention may be formed thereon. At this time, the other insulating film is not particularly limited as long as it does not impair partial discharge resistance or general characteristics.

  Table 1 shows the properties of the examples and comparative examples, the characteristics of the enamel wires obtained, and the like.

  The properties of the enameled wire in Table 1, particularly the dimensions, flexibility, wear resistance, heat resistance, and softening temperature were measured by a method based on JIS C 3003.

  Hydrolysis resistance is as follows: an enameled wire twisted with 0.4 mL of water is put into a heat-resistant glass tube with an internal volume of 400 mL, then heated and melted and sealed with a burner or the like in a 140 ° C. constant temperature bath. After processing for 1000 hours, the sample was taken out, the dielectric breakdown voltage was measured, and the residual ratio relative to the untreated dielectric breakdown voltage was calculated.

  For the relative dielectric constant, a metal electrode was deposited on the surface of the enameled wire, the capacitance between the conductor and the metal electrode was measured, and the relative dielectric constant was calculated from the relationship between the electrode length and the film thickness. The capacitance was measured at 1 kHz using an impedance analyzer. The dielectric constant at the time of drying was measured in a constant temperature bath at 100 ° C., and the dielectric constant at the time of moisture absorption was left in a constant temperature and humidity chamber at 25 ° C. to 50% RH for 50 hours.

  The partial discharge start voltage was determined by measuring the discharge start voltage at a detection sensitivity of 10 pC at 50 Hz after leaving it in a constant temperature and humidity chamber of 25 ° C.-50% RH for 50 hours.

Example 1
As the synthesis of the first stage, 184.5 g (0.45 mol) of BAPP, 10.0 g (0.05 mol) of 4,4′-DPE, 192.0 g (1.0 mol) of TMA and a solvent As the synthesis of the second stage, as the aromatic diisocyanate component, the synthesis was carried out while adding 1000 g of NMP and synthesizing while discharging water outside the system at 180 ° C. and cooling to 60 ° C. while maintaining the nitrogen atmosphere. 0.5 g (0.505 mol) of MDI and 500 g of NMP as a solvent were added and synthesized at 140 ° C., and the reduced viscosity was about 0.5 dl / g and the resin content concentration was about 25 wt% polyamideimide resin. An insulating paint was obtained.

(Example 2)
As the synthesis of the first stage, 143.0 g (0.35 mol) of BAPP, 30.0 g (0.15 mol) of 4,4′-DPE, 192.0 g (1.0 mol) of TMA and a solvent As the synthesis of the second stage, as the aromatic diisocyanate component, the synthesis was carried out while adding 1000 g of NMP and synthesizing while discharging water outside the system at 180 ° C. and cooling to 60 ° C. while maintaining the nitrogen atmosphere. 0.5 g (0.505 mol) of MDI and 450 g of NMP as a solvent were added and synthesized at 140 ° C., and the reduced viscosity was about 0.5 dl / g and the resin content concentration was about 25% by weight polyamideimide resin. An insulating paint was obtained.

Example 3
As the synthesis of the first stage, 102.5 g (0.25 mol) of BAPP, 50.0 g (0.25 mol) of 4,4′-DPE, 192.0 g (1.0 mol) of TMA and a solvent As the synthesis of the second stage, as the aromatic diisocyanate component, the synthesis was carried out while adding 1000 g of NMP and synthesizing while discharging water outside the system at 180 ° C. and cooling to 60 ° C. while maintaining the nitrogen atmosphere. 0.5 g (0.505 mol) of MDI and 400 g of NMP as a solvent were added and synthesized at 140 ° C., and the reduced viscosity was about 0.5 dl / g and the resin content concentration was about 25 wt% polyamideimide resin. An insulating paint was obtained.

Example 4
As the synthesis of the first stage, 61.5 g (0.15 mol) of BAPP, 70.0 g (0.35 mol) of 4,4′-DPE, 192.0 g (1.0 mol) of TMA and a solvent As the synthesis of the second stage, as the aromatic diisocyanate component, the synthesis was carried out while adding 1000 g of NMP and synthesizing while discharging water outside the system at 180 ° C. and cooling to 60 ° C. while maintaining the nitrogen atmosphere. 0.5 g (0.505 mol) of MDI and 350 g of NMP as a solvent were added and synthesized at 140 ° C., and the reduced viscosity was about 0.5 dl / g, and the resin component concentration was about 25 wt%. An insulating paint was obtained.

(Example 5)
In the first stage synthesis, 102.5 g (0.25 mol) of BAPP, 30.0 g (0.15 mol) of 4,4′-DPE, and 20.0 g (0. 10 mol) and 192.0 g (1.0 mol) of TMA and 1000 g of NMP as a solvent were added, and synthesis was carried out while discharging water out of the system at 180 ° C., and cooled to 60 ° C. while maintaining a nitrogen atmosphere. After that, in the second stage synthesis, 127.5 g (0.505 mol) of MDI as an aromatic diisocyanate component and 400 g of NMP as a solvent were added and synthesized at 140 ° C., and the reduced viscosity was about 0. A polyamideimide resin insulating paint having a resin content concentration of about 25% by weight was obtained.

(Example 6)
In the first stage synthesis, 30.0 g (0.15 mol) of 4,4′-DPE, 20.0 g (0.10 mol) of 3,4′-DPE and 96.0 g (0. 5 mol) and 450 g of γ-butyrolactone and 550 g of NMP were added as solvents, and synthesis was carried out while discharging water outside the system at 180 ° C. After cooling to 60 ° C. while maintaining the nitrogen atmosphere, the second stage As an eye synthesis, 127.5 g (0.505 mol) of MDI as an aromatic diisocyanate component, 115.5 g (0.25 mol) of BIPP (2,2-bis [4- (4-isocyanatophenoxy) phenyl] Propane) and 96.0 g (0.5 mol) of TMA and 450 g of NMP as a solvent were added and synthesized at 140 ° C., the reduced viscosity was about 0.5 dl / g, and the resin concentration was about 25% by weight. The polyami A doimide resin insulating paint was obtained.

(Example 7)
In the first stage synthesis, 102.5 g (0.25 mol) of BAPP, 50.0 g (0.25 mol) of 4,4′-DPE, and 6.2 g (0. 03 mol), 182.4 g (0.95 mol) of TMA, 10.9 g (0.05 mol) of PMDA, and 1000 g of NMP as a solvent, and synthesizing while discharging water at 180 ° C. After cooling to 60 ° C. while maintaining the nitrogen atmosphere, as the synthesis of the second stage, 95.6 g (0.38 mol) of MDI as an aromatic diisocyanate component, 17.7 g (0.10 mol) of TDI and 400 g of NMP were added as a solvent, and synthesis was performed at 140 ° C. to obtain a polyamide-imide resin insulating paint having a reduced viscosity of about 0.5 dl / g and a resin concentration of about 25% by weight.

(Comparative Example 1)
255.0 g (1.02 mol) of MDI as an aromatic diisocyanate component, 192.0 g (1.0 mol) of TMA as an aromatic tricarboxylic acid anhydride, and 1300 g of NMP as a solvent were added and synthesized at 140 ° C. A polyamideimide resin insulating coating having a reduced viscosity of about 0.5 dl / g and a resin concentration of about 25% by weight was obtained.

(Comparative Example 2)
In the first stage synthesis, 205.0 g (0.50 mol) of BAPP, 192.0 g (1.0 mol) of TMA and 1100 g of NMP as a solvent were added, and water was added to the system at 180 ° C. The composition was synthesized while being cooled and cooled to 60 ° C. while maintaining the nitrogen atmosphere. Then, as the second stage synthesis, 127.5 g (0.505 mol) of MDI as an aromatic diisocyanate component and 450 g of NMP as a solvent were added. The resultant was synthesized at 140 ° C. to obtain a polyamide-imide resin insulating paint having a reduced viscosity of about 0.5 dl / g and a resin concentration of about 25% by weight.

(Comparative Example 3)
As the first stage synthesis, 41.0 g (0.10 mol) of BAPP, 80.0 g (0.40 mol) of 4,4′-DPE, 192.0 g (1.0 mol) of TMA and a solvent As a result, 1000 g of NMP was added and synthesis was carried out while discharging water out of the system at 180 ° C., but precipitation occurred, and the characteristics of the enameled wire thereafter could not be measured.

  From Table 1, it was confirmed that the enameled wire using the polyamideimide resin insulating paints of Examples 1 to 7 has a low dielectric constant and the partial discharge starting voltage is improved by about 70 to 100 V compared to the conventional case. General characteristics were good and comparable.

  On the other hand, Comparative Example 1 shows a polyamide-imide enameled wire that is used for general purposes, but the flexibility, wear resistance, heat resistance, and hydrolysis resistance are all good. The dielectric constant is high and the partial discharge starting voltage is low.

  Further, in Comparative Example 2 in which aromatic diamines having two or less benzene rings are not used in combination, the enameled wire having a softening temperature of about 360 ° C. and having a film made of a generally used polyamideimide resin insulating paint The softening temperature will be lower than.

  Further, in Comparative Example 3 in which the blending ratio of aromatic diamines having two or less benzene rings was increased by more than 70 in terms of molar ratio, the solubility was deteriorated and deposited at the first stage of synthesis. .

  While the embodiments and examples of the present invention have been described above, the embodiments and examples described above do not limit the invention according to the claims. It should be noted that not all combinations of features described in the embodiments and examples are necessarily essential to the means for solving the problems of the invention.

1 Conductor 2 Film

Claims (1)

2,2-bis [4- (4-aminophenoxy) phenyl] propane, bis [4- (4-aminophenoxy) phenyl] ether, fluorenediamine, 4,4′-bis (4-aminophenoxy) biphenyl, 1 , 4-bis (4-aminophenoxy) benzene, or aromatic diamines having three or more benzene rings, and aromatic diamines having two or less benzene rings, selected from the isomers thereof an aromatic diamine component consisting class, an aromatic diisocyanate component and, an acid component having an aromatic tricarboxylic acid anhydride with a solvent solution polymerization was composed polyamide-imide resin insulating coating material (however, polyamideimide precipitation occurs A film is formed by applying and baking ( excluding resin insulation paint) on a conductor or other insulation film. The insulated wire has a relative dielectric constant of 3.5 or less and a softening temperature of 390 ° C. or more.