JP5618746B2 - Photosensitive composition, pattern forming material, and photosensitive film using the same, pattern forming method, pattern film, low refractive index film, antireflection film, optical device, and solid-state imaging device - Google Patents

Description

  The present invention relates to a photosensitive composition, a pattern forming material, a photosensitive film using the same, a pattern forming method, a pattern film, a low refractive index film, an antireflection film, an optical device, and a solid-state imaging device.

  Low refractive index film is anti-reflection film, reflection film, semi-transmission semi-reflection film, visible light reflection infrared transmission film, infrared reflection visible light transmission film, blue reflection film, green reflection or red reflection film, bright line cut filter, color correction An optical functional film included in the film is formed on the optical member.

  Not only optical members with a flat surface shape, but also optical function members such as brightness enhancement lens films and diffusion films for liquid crystal backlights, Fresnel lenses, lenticular lenses, and microlenses used for video projection television screens are all made of resin. The desired geometrical optical performance is obtained because the material has a fine structure, but an optical functional film including a low refractive index film is also required on the surface of the fine structure.

  When a low refractive index film is used as an antireflection film, the low refractive index film having a single layer structure becomes an antireflection film as it is. As the refractive index of the antireflection film having a single layer structure, when the substrate is a transparent material such as a resin material, a low refractive index in the range of 1.2 to 1.35 is desired.

  The typical material of the low refractive index film includes a fluorine polymer material having a refractive index of 1.35 to 1.4, and fine particles made of a polymer of a fluorine monomer having a refractive index of 1.37 to 1.46. Although there is a layer containing a porous material in which the material is fused (see, for example, Patent Document 1), a material having a refractive index of 1.3 or less has not been obtained.

  In addition to such reflectance characteristics, many problems such as complexity of the manufacturing process are desired to be solved. In Patent Documents 2 and 3, in order to eliminate the complexity of the manufacturing process, as a patterning method that does not use a photoresist, a silica-based material having photosensitivity is used to expose and develop itself to form a pattern. Although a method is described, the resolution in pattern formation is insufficient, and the low refractive index property of the resulting pattern is also insufficient.

Japanese Patent No. 3718031 JP 2010-31222 A JP 2010-32996 A

This invention is made | formed in view of this present condition, and makes it a subject to solve the said various problems in the past and to achieve the following objectives.
That is, the present invention provides a photosensitive composition, a pattern forming material, and a photosensitive film using the same, which can form a pattern having a low refractive index, excellent film strength, and few development defects with high resolution. An object is to provide a pattern forming method, a pattern film, a low refractive index film, an antireflection film, an optical device, and a solid-state imaging device.

式（Ａ−１）中、Ｒ ^１ 〜Ｒ ^３ はそれぞれ独立に水素原子、ハロゲン原子、又は、一価の有機置換幾を表す。ただし、Ｒ ^１ 〜Ｒ ^３ の少なくともいずれか１つは、アルコキシ基、メルカプト基、ハロゲン原子、アミド基、アセトキシ基、アミノ基、及び、イソプロペノキシ基よりなる群から選択される加水分解性基、又は、水酸基を表す。
＜４＞
前記粒子分散剤（Ｂ）と前記バインダー（Ｄ）とが同一である、＜３＞に記載の感光性組成物。
＜５＞
前記バインダー（Ｄ）が、重合性基を有するアルカリ可溶性バインダー樹脂を含有する、＜１＞〜＜３＞のいずれか１項に記載の感光性組成物。
＜６＞
前記バインダー（Ｄ）が、重合性化合物を含有する、＜１＞〜＜３＞のいずれか１項に記載の感光性組成物。
＜７＞
前記中空又は多孔質粒子の屈折率が１．１０〜１．４０である、＜１＞〜＜６＞のいずれか１項に記載の感光性組成物。
＜８＞
マイクロレンズの被覆用途に使用される、＜１＞〜＜７＞のいずれか１項に記載の感光性組成物。
＜９＞
＜１＞〜＜８＞のいずれか１項に記載の感光性組成物であるパターン形成材料。
＜１０＞
＜１＞〜＜８＞のいずれか１項に記載の感光性組成物により形成される感光性膜。
＜１１＞
＜１０＞に記載の感光性膜を形成する工程、前記感光性膜を露光する工程、及び、アルカリ現像液により現像してパターン膜を得る現像工程を含むパターン形成方法。
＜１２＞
＜１１＞に記載のパターン形成方法により得られるパターン膜。
＜１３＞
＜１２＞に記載のパターン膜である低屈折率膜。
＜１４＞
＜１３＞に記載の低屈折率膜である反射防止膜。
＜１５＞
＜１３＞に記載の低屈折率膜、又は、＜１４＞に記載の反射防止膜を有する光学デバイス。
＜１６＞
＜１５＞に記載の光学デバイスを備えた固体撮像素子。
本発明は、上記＜１＞〜＜１６＞に係る発明であるが、以下、それ以外の事項（例えば、下記［１］〜［２０］）についても記載している。 The present invention has the following configuration, whereby the above object of the present invention is achieved.
<1>
(A) hollow or porous particles, (B) an alkali-soluble particle dispersant, (C) a compound that generates active species upon irradiation with actinic rays or radiation, and (D) dissolution in an alkali developer by the action of the active species. A photosensitive composition containing a binder with reduced properties,
The particles (A) and the particle dispersant (B) each have a group capable of chemically bonding to each other,
The particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the group capable of being chemically bonded to the particle (A) of the particle dispersant (B) is a hydrolyzable silyl group or a silanol group. And at least one of
The photosensitive composition in which the said particle | grain dispersing agent (B) has a polymeric group further.
<2>
<1> The photosensitive composition according to <1>, wherein the compound (C) that generates active species upon irradiation with active light or radiation is an oxime compound.
<3>
The photosensitive composition as described in <1> or <2> whose at least one of the said hydrolysable silyl group and silanol group is group represented by the following Formula (A-1).

In formula (A-1), R ^{1 to} R ³ each independently represents a hydrogen atom, a halogen atom, or a monovalent organic substituent. Provided that at least one of R ^{1 to} R ³ is a hydrolyzable group selected from the group consisting of an alkoxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group, and an isopropenoxy group, or Represents a hydroxyl group.
<4>
<3> The photosensitive composition according to <3>, wherein the particle dispersant (B) and the binder (D) are the same.
<5>
The photosensitive composition of any one of <1>-<3> in which the binder (D) contains an alkali-soluble binder resin having a polymerizable group.
<6>
The photosensitive composition of any one of <1>-<3> in which the binder (D) contains a polymerizable compound.
<7>
The photosensitive composition of any one of <1>-<6> whose refractive index of the said hollow or porous particle is 1.10-1.40.
<8>
The photosensitive composition according to any one of <1> to <7>, which is used for coating microlenses.
<9>
The pattern forming material which is the photosensitive composition of any one of <1>-<8>.
<10>
<1>-<8> The photosensitive film | membrane formed with the photosensitive composition of any one of <1>.
<11>
<10> A pattern forming method comprising a step of forming a photosensitive film, a step of exposing the photosensitive film, and a developing step of developing with an alkaline developer to obtain a pattern film.
<12>
<11> The pattern film obtained by the pattern formation method as described in.
<13>
The low refractive index film | membrane which is a pattern film as described in <12>.
<14>
<13> An antireflection film, which is the low refractive index film according to <13>.
<15>
An optical device having the low refractive index film according to <13> or the antireflection film according to <14>.
<16>
<15> The solid-state image sensor provided with the optical device as described in.
Although this invention is invention which concerns on said <1>-<16>, below, other matters (for example, following [1]-[20]) are also described.

[1] (A) Hollow or porous particles, (B) an alkali-soluble particle dispersant, (C) a compound that generates active species upon irradiation with actinic rays or radiation, and (D) alkali development by the action of the active species A photosensitive composition containing a binder whose solubility in a liquid decreases, wherein the particles (A) and the particle dispersant (B) each have a group capable of chemically bonding to each other. Composition.
[2] The particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the group capable of being chemically bonded to the particle (A) of the particle dispersant (B) is a hydrolyzable silyl group. And the photosensitive composition as described in said [1] containing at least one of a silanol group.
[3] The photosensitive composition according to the above [1] or [2], wherein the particle dispersant (B) further has a polymerizable group.
[4] The photosensitive composition according to the above [3], wherein the particle dispersant (B) and the binder (D) are the same.
[5] The photosensitive composition according to any one of [1] to [3], wherein the binder (D) contains an alkali-soluble binder resin having a polymerizable group.
[6] The photosensitive composition according to any one of [1] to [3], wherein the binder (D) contains a polymerizable compound.
[7] The photosensitive composition according to any one of [1] to [6], wherein a refractive index of the hollow or porous particle is 1.10 to 1.40.
[8] The photosensitive composition according to any one of [1] to [7], which is used for coating microlenses.
[9] A pattern forming material which is the photosensitive composition according to any one of [1] to [8].
[10] A photosensitive film formed from the photosensitive composition according to any one of [1] to [8].
[11] A pattern forming method including a step of forming the photosensitive film according to [10], a step of exposing the photosensitive film, and a developing step of developing with an alkaline developer to obtain a pattern film.
[12] A pattern film obtained by the pattern forming method according to [11].
[13] A low refractive index film, which is the pattern film according to [12].
[14] An antireflection film, which is the low refractive index film according to [13].
[15] An optical device having the low refractive index film according to [13] or the antireflection film according to [14].
[16] A solid-state imaging device including the optical device according to [15].

The present invention preferably further has the following configuration.
[17] The photosensitive composition according to any one of [1] to [8], wherein the hollow or porous particles (A) are hollow particles.
[18] The photosensitive composition according to any one of [1] to [8] and [17], wherein the hollow or porous particles (A) are silica particles.
[19] The photosensitivity according to any one of [6] to [8], [17], and [18], wherein the polymerizable compound is a polyfunctional polymerizable compound having two or more polymerizable groups. Sex composition.
[20] The photosensitive composition according to any one of [6] to [8], [17], [18], and [19], wherein the polymerizable compound is a low molecular weight compound having a molecular weight of 2000 or less. object.

  According to the present invention, a photosensitive composition that can form a pattern with a low refractive index, excellent film strength, and few development defects with high resolution, a pattern forming material, and a photosensitive film using the same, A pattern forming method, a pattern film, a low refractive index film, an antireflection film, an optical device, and a solid-state imaging device can be provided.

The present invention will be described in detail below.
In addition, in the description of the group (atomic group) in this specification, the description which does not describe substitution and non-substitution includes the thing which has a substituent with the thing which does not have a substituent. . For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In addition, “active light” or “radiation” in the present specification means, for example, an emission line spectrum of a mercury lamp, far ultraviolet rays represented by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, electron beams, and the like. In the present invention, light means actinic rays or radiation. Unless otherwise specified, “exposure” in this specification is not only exposure with far-ultraviolet rays such as mercury lamps and excimer lasers, X-rays, EUV light, but also drawing with particle beams such as electron beams and ion beams. Are also included in the exposure.

  The photosensitive composition of the present invention comprises (A) hollow or porous particles, (B) an alkali-soluble particle dispersant having a group capable of chemically bonding to the particles (A), (C) active light or radiation. It contains a compound that generates active species upon irradiation, and (D) a binder whose solubility in an alkaline developer is reduced by the action of the active species.

In the photosensitive composition of the present invention, by using the hollow or porous particles (A), the refractive index of the resulting pattern can be sufficiently reduced, and the alkali-soluble particle dispersant (B) and the compound (C). It is considered that the combination of the binder and the binder (D) greatly contributes to obtaining a pattern with high resolution.
Further, by using a combination of the hollow or porous particles (A) and the alkali-soluble particle dispersant (B), the surface of the particles (A) and the alkali-soluble particle dispersant (B) are combined to form a pattern. It is considered that the film strength is improved. In addition, since the alkali-soluble particle dispersant (B) is fixed to the particles (A), it is sufficiently suppressed that the particles (A) are detached from the exposed portion in the development process and the like, thereby developing defects. It is considered that a pattern with a small amount of is obtained.

The photosensitive composition according to the present invention is typically a negative composition (a composition that forms a negative pattern).
Moreover, this invention relates also to the pattern formation material which is the said photosensitive composition.

  Hereinafter, each component of the photosensitive composition of this invention is explained in full detail.

[1] (A) Hollow or porous particle The hollow particle has a structure having a cavity inside and refers to a particle having a cavity surrounded by an outer shell, and the porous particle is a porous substance having a large number of cavities. Refers to particles.
The porosity of such particles is preferably 10-80%, more preferably 20-60%, and most preferably 30-60%. The porosity of the hollow or porous particles is preferably in the above range from the viewpoint of reducing the refractive index and maintaining the durability of the particles.
The hollow or porous particles are more preferably hollow particles from the viewpoint of easily reducing the refractive index. For example, when the hollow particles are made of silica, the hollow silica particles have air with a low refractive index (refractive index = 1.0), and therefore the refractive index is normal silica (refractive index = Compared with 1.46), it is significantly lower.

  A method for producing hollow particles is described in, for example, JP-A-2001-233611. Moreover, the manufacturing method of porous particle | grains is described in each gazette, such as Unexamined-Japanese-Patent No. 2003-327424, 2003-335515, 2003-226516, 2003-238140, etc., for example.

The hollow or porous particles preferably have an average particle size of 1 to 200 nm, more preferably 10 to 100 nm.
The average particle diameter of the hollow or porous particles can be determined from a photograph obtained by observing the dispersed particles with a transmission electron microscope. The projected area of the particles is obtained, and the equivalent circle diameter is obtained therefrom to obtain the average particle size (usually, 300 or more particles are measured in order to obtain the average particle size).

The refractive index of the hollow or porous particles is preferably 1.10 to 1.40, more preferably 1.15 to 1.35, and most preferably 1.15 to 1.30. .
The refractive index here represents the refractive index of the entire particle, and when the particle is a hollow particle, it does not represent the refractive index of only the outer shell forming the hollow particle. When the particles are porous particles, the refractive index of the porous particles can be measured with an Abbe refractometer (manufactured by Atago Co., Ltd.).

Here, the particle (A) and the particle dispersant (B) described later each have a group capable of being chemically bonded to each other.
That is, the hollow or porous particles can be bonded to the surface (more precisely, the outer surface) of “groups that can be chemically bonded to the particles (A)” of the particle dispersant (B) described later. Group (also referred to as “group capable of binding to the particle dispersant (B)”). The group capable of binding to such a particle dispersant (B) in the hollow or porous particle is preferably a chemically active group.
More specifically, the hollow or porous particle preferably has at least one of an alkoxy group and a hydroxyl group as the “group capable of binding to the particle dispersant (B)”, and more preferably has a hydroxyl group. .

  The amount of “at least one of an alkoxy group and a hydroxyl group” with respect to 1 g of the hollow or porous particle is not particularly limited, but is preferably 0.1 mmol / g to 100 mmol / g.

In the hollow or porous particles having the above-described “at least one group of alkoxy group and hydroxyl group”, the hollow or porous particles having a hydroxyl group are disclosed in WO2007 / 060884, JP200514197, JP2005162533 and JP2007-39323A. Can be synthesized.
Moreover, the hollow or porous particle | grains which have "at least one group of an alkoxy group and a hydroxyl group" are also available as a commercial item.

The hollow or porous particles are preferably hollow or porous inorganic particles from the viewpoint of lowering the refractive index. Examples of the inorganic low refractive index particles include magnesium fluoride and silica particles, and silica particles are more preferable from the viewpoint of low refractive index properties, dispersion stability, and cost.
The primary particle diameter of these inorganic particles is preferably 1 to 500 nm, and more preferably 1 to 200 nm.
The inorganic particles may be either crystalline or amorphous, and may be monodispersed particles or aggregated particles as long as a predetermined particle size is satisfied. The shape is most preferably a spherical shape, but may be a bead shape, a shape having a major axis / minor axis ratio of 1 or more, or an indefinite shape.

The specific surface area of the inorganic particles is preferably 10~2000m ² / g, more preferably from 20~1800m ² / g, and most preferably 50~1500m ² / g.

Inorganic particles are used in a dispersion or coating solution to stabilize the dispersion, or to increase the affinity and binding properties with the binder component, such as a physical surface such as plasma discharge treatment or corona discharge treatment. Chemical surface treatment with a treatment, a surfactant, a coupling agent, or the like may be performed. The use of a coupling agent is particularly preferred. As the coupling agent, an alkoxy metal compound (eg, titanium coupling agent, silane coupling agent) is preferably used. Of these, silane coupling treatment is particularly effective.
That is, when the inorganic particles are silica particles and the coupling agent is a silane compound, the organosilyl group (monoorganosilyl, diorganosilyl, triorganosilyl group) becomes silica particles by the reaction of the silane compound and the silanol group. It binds to the surface. Examples of the organic group that the surface-treated silica particles have on the surface include saturated or unsaturated hydrocarbon groups having 1 to 18 carbon atoms and halogenated hydrocarbon groups having 1 to 18 carbon atoms.
The above-mentioned coupling agent may be used as a surface treatment agent for inorganic particles in order to perform surface treatment in advance before the preparation of the coating solution for low refractive index film, or may be further added as an additive during the preparation of the coating solution.
The inorganic particles are preferably dispersed in the medium in advance before the surface treatment in order to reduce the load of the surface treatment.

Commercially available silica particles can be used.
For example, Julia Catalysts Co., Ltd. through rear series (isopropanol (IPA) dispersion, 4-methyl-2-pentanone (MIBK) dispersion, etc.), OSCAL series, Nissan Chemical Co., Ltd. Snowtex series (IPA dispersion, ethylene glycol) Dispersion, methyl ethyl ketone (MEK) dispersion, dimethylacetamide dispersion, MIBK dispersion, propylene glycol monomethyl acetate dispersion, propylene glycol monomethyl ether dispersion, methanol dispersion, ethyl acetate dispersion, butyl acetate dispersion, xylene-n-butanol dispersion, toluene dispersion, etc.) Sirenax manufactured by Nippon Steel Mining Co., Ltd., PL series manufactured by Fuso Chemical Industry Co., Ltd. (IPA dispersion, toluene dispersion, propylene glycol monomethyl ether dispersion, methyl ethyl ketone dispersion, etc.), manufactured by EVONIK Erotic Jill series (propylene glycol acetate dispersion, ethylene glycol dispersion, MIBK dispersion, etc.) can be used silica particles, such as.

  When silica particles are added to the photosensitive composition as a dispersion containing silica particles and a particle dispersant (details of the particle dispersant will be described later), the content of silica particles in the silica dispersion is 10 % By mass to 50% by mass is preferable, 15% by mass to 40% by mass is more preferable, and 15% by mass to 30% by mass is still more preferable.

  The hollow or porous particles may be used alone or in combination of two or more. When using 2 or more types together, you may use a hollow particle and a porous particle together, for example.

  The content of the hollow or porous particles with respect to the total solid content of the photosensitive composition is preferably 5% by mass to 95% by mass, more preferably 10% by mass to 90% by mass, and more preferably 20% by mass to 20% by mass. More preferably, it is 90 mass%.

When forming a film by using the photosensitive composition, coating amount of the hollow or porous particles is ^{preferably 1mg / m 2 ~100mg / m 2} , more preferably ^{5mg / m 2 ~80mg / m 2} , further preferably from ^{10mg / m 2 ~60mg / m 2} . When it is 1 mg / m ² or more, the effect of lowering the refractive index and the effect of improving scratch resistance can be reliably obtained, and when it is 100 mg / m ² or less, fine irregularities are formed on the surface of the film. It is possible to suppress deterioration of the integrated reflectance.

[2] (B) Alkali-soluble particle dispersant The photosensitive composition of the present invention contains an alkali-soluble particle dispersant (B).

As described above, the particles (A) and the particle dispersant (B) each have a group that can be chemically bonded to each other.
That is, the alkali-soluble particle dispersant (B) has a group that can be chemically bonded to the particles (A), thereby improving the film strength of the pattern and reducing development defects as described above. A pattern is considered to be obtained.

  The group that can be chemically bonded to the particle (A) in the particle dispersant (B) can be bonded to the above-mentioned “group that can be bonded to the particle dispersant (B)” of the particle (A). Not only those chemically bonded to the particles (A) by contact with the particles (A), but also chemically bonded to the particles (A) with thermal energy and exposure energy, In the medium or the dispersion liquid, those that are not chemically bonded to the particles (A) but also chemically bonded to the particles (A) by being placed in a dry state are included.

  The group capable of being chemically bonded to the particle (A) in the particle dispersant (B) is more preferably a group that exhibits high reactivity with respect to the particle (A). As a result, the alkali-soluble particle dispersant (B) is more reliably fixed to the particles (A) even in the unexposed areas, and the solubility of the particles (A) in the alkaline developer can be improved. More specifically, since the alkali-soluble particle dispersant (B) is firmly bonded to the surface of the particle (A) by chemical bonding, the particle (A) and the alkali-soluble particle are also contained in an alkali developer. It can be dissolved quickly without easily dissociating from the dispersant (B). Thereby, generation | occurrence | production of the development residue resulting from the melt | dissolution residue of the particle | grains (A) in an unexposed part can be suppressed.

  Although it does not specifically limit as group which can be couple | bonded chemically with particle | grains (A) in particle | grain dispersing agent (B), As mentioned above, it is preferable that particle | grains (A) have at least one of an alkoxy group and a hydroxyl group. Therefore, a group capable of reacting with at least one of an alkoxy group and a hydroxyl group is preferable.

Examples of the group capable of being chemically bonded to the particle (A) in the particle dispersant (B) include, for example, an alkyl halide group, a carboxyl group or a salt thereof, an isocyanate group, and a hydrolyzable silyl group and a silanol group. At least one of them can be preferably mentioned.
When the particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the particle dispersant (B) has an alkyl halide group, an ether bond is formed, and the particle (A) has a hydroxyl group on the surface. In addition, when the particle dispersant (B) has a carboxyl group, an ester bond is formed, and when the particle (A) has a hydroxyl group on the surface and has an isocyanate group of the particle dispersant (B). In the case where a carbamoyl bond is formed, the particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the particle dispersant (B) has at least one of a hydrolyzable silyl group and a silanol group, A bond is formed.

  The particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the particle dispersant (B) is a hydrolyzable silyl group or silanol group as a “group that can be chemically bonded to the particle (A)”. It is particularly preferable to have at least one of the following. Since the condensation reaction between the hydroxyl group on the surface of the particle (A) and “at least one of hydrolyzable silyl group and silanol group” of the particle dispersant (B) is highly reactive and proceeds quickly, the film of the pattern It is considered that a pattern with fewer development defects and fewer development residues can be obtained more reliably while the strength is improved.

  In the present specification, the “hydrolyzable silyl group” is a silyl group having hydrolyzability. Examples of the hydrolyzable group include an alkoxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group, and an isopropenoxy group. The silyl group is hydrolyzed to a silanol group. Silanol groups undergo dehydration condensation to form siloxane bonds.

  “At least one of the hydrolyzable silyl group and the silanol group” is preferably a group represented by the following formula (A-1).

In formula (A-1), R ^{1 to} R ³ each independently represents a hydrogen atom, a halogen atom, or a monovalent organic substituent. Provided that at least one of R ^{1 to} R ³ is a hydrolyzable group selected from the group consisting of an alkoxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group, and an isopropenoxy group, or Represents a hydroxyl group.

In the formula (A-1), examples of the monovalent organic substituent of R ^{1 to} R ³ include an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms) and an aryl group (an aryl group having 6 to 20 carbon atoms). Alkenyl group (preferably alkenyl group having 2 to 10 carbon atoms), alkynyl group (preferably alkynyl group having 2 to 10 carbon atoms), aralkyl group (preferably aralkyl group having 7 to 20 carbon atoms) and the like. Can be mentioned.
The hydrolyzable group bonded to the silicon atom is particularly preferably an alkoxy group or a halogen atom, and more preferably an alkoxy group.
As an alkoxy group, a C1-C30 alkoxy group is preferable. More preferably, it is a C1-C15 alkoxy group, More preferably, it is a C1-C5 alkoxy group, Most preferably, it is a C1-C3 alkoxy group, Most preferably, it is a methoxy group or an ethoxy group.
Examples of the halogen atom include F atom, Cl atom, Br atom, and I atom. From the viewpoint of ease of synthesis and stability, Cl atom and Br atom are preferable, and Cl atom is more preferable. is there.

The hydrolyzable group can be bonded to one silicon atom in the range of 1 to 4, and the total number of hydrolyzable groups in the formula (A-1) is in the range of 2 or 3. preferable. When two or more hydrolyzable groups are bonded to a silicon atom, they may be the same as or different from each other.
In the present invention, the particle dispersant (B) preferably has 2 to 4 alkoxy groups having 1 to 4 carbon atoms and hydroxyl groups on the same silicon atom in total, more preferably 2 or 3. Thereby, film | membrane intensity | strength can be improved more.

Specific examples of preferable alkoxy groups include methoxy group, ethoxy group, propoxy group, isopropoxy group, butoxy group, tert-butoxy group, phenoxy group, and benzyloxy group. A plurality of these alkoxy groups may be used in combination, or a plurality of different alkoxy groups may be used in combination.
Examples of the alkoxysilyl group to which the alkoxy group is bonded include, for example, a trialkoxysilyl group such as a trimethoxysilyl group, a triethoxysilyl group, a triisopropoxysilyl group, a triphenoxysilyl group; a dimethoxymethylsilyl group, a diethoxymethylsilyl group And dialkoxymonoalkylsilyl groups such as methoxydimethylsilyl group and ethoxydimethylsilyl group.

  Further, the particle dispersant (B) preferably has at least one group selected from the following groups (x) and (y) so as to be alkali-soluble.

(X) Alkali-soluble group (y) A group that decomposes by the action of an alkali developer and increases the solubility in the alkali developer (hereinafter also referred to as “polar conversion group”).

Examples of the alkali-soluble group (x) include phenolic hydroxyl group, carboxylic acid group, fluorinated alcohol group, sulfonic acid group, sulfonamide group, sulfonylimide group, (alkylsulfonyl) (alkylcarbonyl) methylene group, (alkylsulfonyl) ( Alkylcarbonyl) imide group, bis (alkylcarbonyl) methylene group, bis (alkylcarbonyl) imide group, bis (alkylsulfonyl) methylene group, bis (alkylsulfonyl) imide group, tris (alkylcarbonyl) methylene group, tris (alkylsulfonyl) ) Methylene group, alkylene oxide group and the like.
Preferred alkali-soluble groups include fluorinated alcohol groups (preferably hexafluoroisopropanol), sulfonimide groups, and bis (carbonyl) methylene groups. By using these groups, the stability over time of the composition under mixing of particles is improved. To do. More preferred are a hexafluoroisopropanol group and a bis (carbonyl) methylene group, and a film having a lower refractive index can be obtained.

Examples of the group (y) (polar conversion group (y)) that decomposes by the action of an alkali developer and increases the solubility in the alkali developer include a lactone group, a carboxylic acid ester group (—COO—), an acid, and the like. Anhydride group (—C (O) OC (O) —), acid imide group (—NHCONH—), carboxylic acid thioester group (—COS—), carbonate group (—OC (O) O—), sulfate ester A group (—OSO ₂ O—), a sulfonic acid ester group (—SO ₂ O—) and the like, and a lactone group is preferable.

The particle dispersant (B) is preferably a resin having a group that can be chemically bonded to the particles (A) and an alkali-soluble group (hereinafter also referred to as “dispersion resin”).
Preferred examples of the dispersion resin include a resin having a group that can be chemically bonded to the particles (A) in the side chain or the terminal and an alkali-soluble group in the side chain or the terminal.

When a group capable of being chemically bonded to the particle (A) is present at the end of the resin, such a resin synthesis method is as follows. When the resin is synthesized (that is, polymerization of a polymerizable monomer), the particle (A A method of adding a compound having a chemically bonded group and a mercapto group to the above group is preferred. By adding such a compound having a mercapto group, the compound acts as a chain transfer agent, and a group chemically bonded to the particles (A) is introduced into the resin.
The compound having a group chemically bonded to the particle (A) and a mercapto group is preferably a compound having a group represented by the above formula (A-1) and a mercapto group. And silane compounds represented by the following general formula (A-1 ′).

HS-L-Si (R ¹ ) (R ² ) (R ³ ) (A-1 ′)

In the formula, L represents a divalent linking group.
R ^{1 to} R ³ are respectively synonymous with R ^{1 to} R ³ in the above formula (A-1), and preferred examples are also the same.

  Examples of the divalent linking group for L include an alkylene group that may have a substituent, a cycloalkylene group that may have a substituent, and a divalent aromatic group that may have a substituent. , -OC (O)-, -C (O) O-, -N (R)-and a linking group formed by combining these (total carbon number is preferably 1-20, and total carbon number 1-15 More preferably, it is more preferably 2 to 10 carbon atoms in total, and more preferably an alkylene group which may have a substituent. Here, R represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms). In each of the above groups, examples of the substituent that can be introduced include a methoxycarbonyl group, an ethoxycarbonyl group, an isopropyloxycarbonyl group, a methyl group, an ethyl group, and a phenyl group.

  Examples of the silane compound represented by the general formula (A-1 ′) include γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, and the like. Can be mentioned.

  The compound having a group chemically bonded to the particles (A) and a mercapto group is preferably 2.0 mol% to 15.0 mol%, more preferably 3.0 mol, based on all repeating units of the resin. % To 12.0 mol%.

  Moreover, an alkali-soluble group can be introduce | transduced into the terminal of resin by using the polymerization initiator and chain transfer agent which have an alkali-soluble group in the case of the synthesis | combination of resin.

  In particular, when the dispersion resin is a resin having both a group that can be chemically bonded to the particle (A) and an alkali-soluble group in the side chain, (I) it is chemically bonded to the particle (A). A resin having a repeating unit having a group and (II) an alkali-soluble repeating unit is preferable.

  The repeating unit (I) having a group chemically bonded to the particles (A) is preferably a repeating unit having at least one of a hydrolyzable silyl group and a silanol group.

  The repeating unit (I) is preferably a repeating unit represented by the following formula (A-2) or formula (A-3).

(In the formula, R ^B represents an ester bond, an amide bond, a urethane bond, a urea bond, or an imino group, L ¹ represents a single bond (when n is 1) or an n + 1 valent linking group, and L ² represents A single bond or a divalent linking group, L ^s1 represents a single bond (when m is 1) or an m + 1 valent linking group, L ³ represents a single bond or a divalent linking group, and n and m are Each independently represents an integer of 1 or more, and R ^{1 to} R ³ each independently represents a hydrogen atom, a halogen atom, or a monovalent organic substituent, provided that at least one of R ^{1 to} R ³ is Represents a hydrolyzable group selected from the group consisting of an alkoxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group, and an isopropenoxy group, or a hydroxyl group, Xa ₁ and Xa ₂ each independently. Hydrogen atom, halogen atom, hydroxide Represents an alkyl group which may have a group or a substituent.)

^R 1 to R ³ in Formula (A-2) and Formula (A-3) is the same meaning as ^R 1 to R ³ in the formula (A-1), and preferred ranges are also the same.
From the viewpoint of film strength, R ^B is preferably an ester bond or a urethane bond, and more preferably an ester bond.
The divalent or n + 1 valent linking group in L ^{1 to} L ³ is a group composed of at least one atom selected from the group consisting of a carbon atom, a hydrogen atom, an oxygen atom, a nitrogen atom and a sulfur atom. It is preferably a group composed of at least one atom selected from the group consisting of carbon atom, hydrogen atom, oxygen atom and sulfur atom. The number of carbon atoms of L ^{1 to} L ³ is preferably 2 to 60, and more preferably 2 to 30. L ³ preferably contains no ester bond, amide bond, urethane bond, urea bond, or imino group.
The m + 1 valent linking group in L ^s1 is a group composed of a sulfur atom and at least one atom selected from the group consisting of a carbon atom, a hydrogen atom, an oxygen atom, a nitrogen atom and a sulfur atom. Are more preferable, and an alkylene group or a divalent group in which two or more of an alkylene group, a sulfide group, and an imino group are combined is more preferable. The number of carbon atoms of L ^s1 is preferably 2 to 60, and more preferably 6 to 30.
The n and m are each independently preferably an integer of 1 to 10, more preferably an integer of 1 to 6, and particularly preferably 1.

Among the repeating units represented by formula (A-2) or formula (A-3), in formula (A-2), n is 1, L ¹ is a single bond, and L ² is an alkylene group ( An alkylene group having 1 to 5 carbon atoms is preferable, and an alkylene group having 2 to 4 carbon atoms is more preferable.

Regarding the monomer corresponding to the repeating unit (I), examples of the monomer having an alkyl halide group include 4-chlorobutyl methacrylate, chloromethylstyrene, 2- (2-bromobutyryloxy) ethyl methacrylate, and the like. be able to.
Examples of the monomer having a carboxylic acid or a salt thereof include, for example, N, N-dimethyl-N-methacryloyloxyethyl-N-carboxymethyl-ammonium betaine, methacrylic acid, crotonic acid, isocrotonic acid, double addition polymerization in the molecule. A compound having a bond and a hydroxyl group (for example, 2-hydroxyethyl methacrylate) and succinic anhydride, a reaction product of a compound having an addition polymerizable double bond and a hydroxyl group in the molecule and phthalic anhydride, intramolecular A reaction product of a compound having an addition polymerizable double bond and a hydroxyl group and tetrahydroxyphthalic anhydride, a reaction product of a compound having an addition polymerizable double bond and a hydroxyl group and trimellitic anhydride, and an addition in the molecule Reaction product of compound having polymerizable double bond and hydroxyl group and pyromellitic anhydride, acrylic acid, acrylic acid dimer, active compound Le acid oligomer, maleic acid, itaconic acid, fumaric acid, and 4-vinyl benzoate.
Examples of the monomer having an isocyanate group include methacrylic acid 2-isocyanate ethyl ester and methacrylic acid 2-isocyanate ethyl ester.
Examples of the monomer having at least one of a hydrolyzable silyl group and a silanol group include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- Glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, p-styryltrimethoxysilane, γ-methacryloxypropyl Trimethoxysilane, γ-methacryloxypropylmethyldiethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-acryloxypropyltrimethoxysilane, etc., and some of the alkoxy groups of these monomers All can be mentioned monomers has been converted to a hydroxyl group.

  Each of the above-mentioned monomers can be appropriately synthesized and obtained, but it is also preferable from the viewpoint of cost to use a commercially available product. For example, a monomer having at least one of a hydrolyzable silyl group and a silanol group is commercially available from Shin-Etsu Chemical Co., Ltd., Toray Dow Corning Co., Ltd., Momentive Performance Materials Co., Ltd., Chisso Co., Ltd., etc. Commercial products such as silane products and silane coupling agents are equivalent to this.

  As the repeating unit (I), only one type may be used, or two or more types may be used in combination.

  The content of the repeating unit (I) is preferably 1 mol% to 90 mol%, more preferably 2 mol% to 80 mol%, and more preferably 2 mol% to 60 mol% with respect to all repeating units in the dispersion resin. % Range is most preferred. By setting the content of the repeating unit (I) within this range, it is possible to more reliably achieve improvement in film strength and reduction in development defects in the obtained pattern.

  Specific examples of the repeating unit (I) are shown below, but the present invention is not limited thereto.

  The alkali-soluble repeating unit (II) is preferably a repeating unit having a group selected from the group of (x) the alkali-soluble group and (y) the polar conversion group.

  The repeating unit having an alkali-soluble group (x) includes a repeating unit in which an alkali-soluble group is directly bonded to the main chain of the resin, such as a repeating unit of acrylic acid or methacrylic acid, or a main group of the resin via a linking group. Examples include a repeating unit in which an alkali-soluble group is bonded to the chain. The repeating unit having an alkali-soluble group (x) may have at least one of a fluorine atom and a silicon atom.

Specific examples of the repeating unit having an alkali-soluble group (x) are shown below, but the present invention is not limited thereto. In the formula, Rx represents a hydrogen atom, CH ₃ , CF ₃ , or CH ₂ OH.

  Among these various alkali-soluble repeating units, from the viewpoint of heat resistance and polymer stability during polymerization, phenolic repeating units (for example, hydroxystyrene repeating units), fluorinated alcohol-based repeating units (for example, hexafluoroisopropanol group-containing repeating units). , Sulfonamide group-containing repeating units, sulfonylimide group-containing repeating units, (alkylsulfonyl) (alkylcarbonyl) imide group-containing repeating units, and β-diketone group-containing repeating units (for example, acetylacetonate group-containing repeating units) are preferred. Of these, β-diketone group-containing repeating units are most preferred from the viewpoint of the temporal stability of the liquid of the photosensitive composition and the film temporal stability.

  For example, the polar conversion group (y) may be introduced into the side chain of the resin by being included in a repeating unit of an acrylic ester or a methacrylic ester.

  The repeating unit having a polarity converting group (y) is preferably a repeating unit represented by the following general formula (IV).

Where
R represents a hydrogen atom, an alkyl group or a halogen atom.
A represents -COO- or -CONH-.
R ₀ represents an alkylene group, a cycloalkylene group, or a combination thereof, and when there are a plurality of R _{0 s} , they may be the same or different.
Z represents an ether bond, an ester bond, an amide bond, a urethane bond, or a urea bond.
L represents a substituent having a lactone structure, and when there are a plurality of L, they may be the same or different.
n represents an integer of 1 to 5.

The alkyl group of R may be linear or branched. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms. As such an alkyl group, a methyl group or an ethyl group is preferable, and a methyl group is more preferable.
The alkyl group of R may have a substituent. Examples of the substituent include halogen atoms such as fluorine atom, chlorine atom and bromine atom; mercapto group; hydroxy group; methoxy group, ethoxy group, isopropoxy group, t-butoxy group and alkoxy group of benzyloxy group; methyl Group, ethyl group, propyl group, isopropyl group, butyl group, sec-butyl group, t-butyl group, alkyl group such as pentyl group and hexyl group; cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group and cycloheptyl group Cycloalkyl group such as cyano group, nitro group, sulfonyl group, silyl group, ester group, acyl group, vinyl group, and aryl group. As this substituent, a halogen atom is more preferable, and a fluorine atom is particularly preferable. Specific examples of the halogen atom for R include a fluorine atom, a chlorine atom and a bromine atom.

The group represented by R ₀ is not particularly limited as long as it is an alkylene group or a cycloalkylene group, but a preferable alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms. Examples thereof include a methylene group, an ethylene group, and a propylene group. Preferable cycloalkylene groups are cycloalkylene groups having 4 to 20 carbon atoms, and examples thereof include a cyclohexylene group, a cyclopentylene group, a norbornylene group, and an adamantylene group. The group represented by R ₀ is more preferably an alkylene group.

Z preferably represents an ether bond, an ester bond, an amide bond or a urethane bond, and more preferably represents an ether bond or an ester bond.
n is preferably 1.
As the group represented by L, any group can be used as long as it has a lactone structure, but it is preferably a 5- to 7-membered ring lactone structure, and the bicyclo structure or spiro structure is added to the 5- to 7-membered ring lactone structure. Those in which other ring structures are condensed in a form to form are preferable. It is more preferable to have a repeating unit having a lactone structure represented by any of the following general formulas (LC1-1) to (LC1-17). The lactone structure may be directly bonded to the main chain. Preferred lactone structures are (LC1-1), (LC1-4), (LC1-5), (LC1-6), (LC1-13), (LC1-14), and (LC1-17). By using this lactone structure, pattern rectangularity and development defects are improved.

The lactone structure portion may or may not have a substituent (Rb ₂ ). Preferred substituents (Rb ₂ ) include an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 4 to 7 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkoxycarbonyl group having 2 to 8 carbon atoms, and a carboxyl group. , Halogen atom, hydroxyl group, cyano group, acid-decomposable group and the like. More preferably, they are a C1-C4 alkyl group, a cyano group, and an acid-decomposable group. n ₂ represents an integer of 0-4. When n ₂ is 2 or more, a plurality of substituents (Rb ₂ ) may be the same or different, and a plurality of substituents (Rb ₂ ) may be bonded to form a ring. .
More particularly preferred lactone repeating units include repeating units represented by the following general formula (IV-2).

In general formula (IV-2), R, A, R ₀ , Z and n have the same meanings as in general formula (IV).
R ₁ represents an alkyl group that may have a substituent, a cycloalkyl group that may have a substituent, an alkoxycarbonyl group that may have a substituent, or a cyano group. In some cases, they may be the same or different, and two R ₁ may be bonded to form a ring.
X represents an alkylene group, an oxygen atom, or a sulfur atom.
m is the number of substituents and represents an integer of 0 to 5. m is preferably 0 or 1.

General formula (IV-2) will be described in more detail.
Preferred examples and ranges of R, R ₀ , Z, and n are the same as those in General Formula (IV).
The alkyl group for R ₁ is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and most preferably a methyl group. Examples of the cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group. The alkoxycarbonyl group is preferably an alkoxycarbonyl group having 2 to 5 carbon atoms, and examples thereof include a methoxycarbonyl group, an ethoxycarbonyl group, an n-butoxycarbonyl group, and a t-butoxycarbonyl group. These groups may have a substituent, and examples of the substituent include an alkoxy group such as a hydroxy group, a methoxy group, and an ethoxy group, and a halogen atom such as a cyano group and a fluorine atom.
R ₁ is more preferably a methyl group or a cyano group, and even more preferably a cyano group.
When m is 1 or more, at least one R ₁ is preferably bonded to the α-position or β-position of the carbonyl group of the lactone, and particularly preferably bonded to the α-position.
Examples of the alkylene group for X include a methylene group and an ethylene group. X is preferably an oxygen atom or a methylene group, and more preferably a methylene group.
Below, the specific example of the repeating unit provided with the partial structure represented by general formula (IV) is shown. In the following specific examples, Rx represents a hydrogen atom, an alkyl group which may have a substituent, or a halogen atom, preferably a hydrogen atom, a methyl group, a hydroxymethyl group which is an alkyl group having a substituent, acetyl Represents an oxymethyl group. R represents a hydrogen atom, an alkyl group which may have a substituent, or a halogen atom, preferably a hydrogen atom, a methyl group, a hydroxymethyl group or an acetoxymethyl group.

  Specific examples of the repeating unit represented by the general formula (IV-2) are further given below. In the following specific examples, R represents a hydrogen atom, an alkyl group which may have a substituent, or a halogen atom, preferably a hydrogen atom, a methyl group, a hydroxymethyl group or an acetoxymethyl group.

  The repeating unit having a lactone group usually has an optical isomer, but any optical isomer may be used.

The content of the alkali-soluble repeating unit (II) in the dispersion resin enables alkali developability, and all the repetitions in the dispersion resin in order to suppress residues due to adhesion of hollow or porous particles to unexposed areas. It is preferably 10 mol% to 99 mol%, more preferably 20 mol% to 99 mol%, and most preferably 20 mol% to 95 mol% with respect to the unit.
For example, like the monomer having a carboxyl group, the repeating unit (I) having a group chemically bonded to the particle (A) and the alkali-soluble repeating unit (II) may be the same. The repeating unit (I) and also the repeating unit (II) is preferably 1 mol% to 100 mol%, preferably 2 mol% to 100 mol% with respect to all repeating units in the dispersion resin. 99 mol% is more preferable, and 2 mol% to 95 mol% is most preferable.
However, it is preferable that the repeating unit (I) and the repeating unit (II) are different.

  The particle dispersant (B) preferably further has a polymerizable group, whereby the particle dispersant (B) is used as a binder whose solubility in an alkali developer is reduced by the action of the active species (D) described later. Can also work. That is, the particle dispersant (B) and the binder (D) described later may be the same.

  More specifically, it is preferable that the particle dispersant (B) further has a radical or cationic polymerizable repeating unit (III) in addition to the repeating unit (I) and the alkali-soluble repeating unit (II). Thereby, high sensitivity curability and alkali developability with few residues can be made compatible.

  The radical or cation polymerizable repeating unit (III) is cross-linked between polymer molecules by the action of an acid or radical and gels, thereby contributing to a decrease in solubility in an alkali developer.

  The radical polymerizable repeating unit is preferably introduced into the resin by reacting the compound having the radical polymerizable group with the resin capable of binding with the compound having the radical polymerizable group. For example, a resin obtained by reacting a carboxyl group-containing resin with a glycidyl group-containing unsaturated compound such as glycidyl (meth) acrylate or allyl glycidyl ether, or an unsaturated alcohol such as allyl alcohol, 2-hydroxy acrylate, or 2-hydroxy methacrylate, Polybasic acid anhydride is allowed to react with a resin obtained by reacting a carboxyl group-containing resin having a hydroxyl group with a free isocyanate group-containing unsaturated compound and an unsaturated acid anhydride, or an addition reaction product between an epoxy resin and an unsaturated carboxylic acid. Resin, a resin obtained by reacting an addition reaction product of a conjugated diene copolymer and an unsaturated dicarboxylic acid anhydride with a hydroxyl group-containing polymerizable monomer, a specific functional group that causes an elimination reaction by base treatment to give an unsaturated group A radically polymerizable repeating unit by synthesizing a resin having It is possible to obtain a resin having.

  Among them, a resin obtained by reacting a carboxyl group-containing resin with a glycidyl group-containing unsaturated compound such as glycidyl (meth) acrylate or allyl glycidyl ether, or a resin obtained by polymerizing a hydroxyl group-containing (meth) acrylic acid ester compound ( ) Resins obtained by reacting (meth) acrylic acid esters having a free isocyanate group such as acrylic acid-2-isocyanatoethyl, resins having structural units represented by the following general formulas (5) to (7), base treatment It is more preferable to obtain a resin having a radically polymerizable repeating unit by synthesizing a resin having a specific functional group that causes an elimination reaction and gives an unsaturated group by a base treatment.

  As the cationically polymerizable repeating unit, a cationically polymerizable group may be included in the side chain. For example, a polymer containing an epoxy group, an oxetane group or the like in the side chain is also useful.

  In order to obtain a resin having a cationic polymerizable group, for example, a monomer having an epoxy group (hereinafter sometimes referred to as “monomer for introducing an epoxy group”) is polymerized as a monomer component. Good. Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o- (or m-, or p-) vinylbenzyl glycidyl ether, and the like. These monomers for introducing an epoxy group may be only one type or two or more types. When the monomer component in obtaining the alkali-soluble binder also includes a monomer for introducing the epoxy group, the content ratio is not particularly limited, but is 5 to 70% by mass in the total monomer component, Preferably it is 10-60 mass%.

  Specifically, the radically or cationically polymerizable repeating unit (III) is preferably represented by any one of the following general formulas (5) to (7).

In the general formulas (5) to (7), A ²¹ , A ²² and A ²³ each independently represents an oxygen atom, a sulfur atom or —N (R ⁴¹ ) —, and R ⁴¹ represents a hydrogen atom or an alkyl group. Represents.
G ²¹ , G ²² and G ²³ each independently represent a divalent linking group.
X ²¹ and Z ²¹ each independently represent an oxygen atom, a sulfur atom or —N (R ⁴² ) —, and R ⁴² represents a hydrogen atom or an alkyl group.
Y ²¹ represents a single bond, an oxygen atom, a sulfur atom, a phenylene group, or —N (R ⁴³ ) —, and R ⁴³ represents a hydrogen atom or an alkyl group.
R ^{21 to} R ⁴⁰ each independently represent a hydrogen atom or a monovalent substituent.

In the general formula (5), R ^{21 to} R ²³ each independently represents a hydrogen atom or a monovalent substituent. Examples of the monovalent substituent represented by R ^{21 to} R ²³ include an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms) which may have a substituent. Examples of the substituent that the alkyl group may have include a hydroxyl group and a halogen atom. Among these, R ²¹ and R ²² are preferably hydrogen atoms, and R ²³ is preferably a hydrogen atom or a methyl group.
R ^{24 to} R ²⁶ each independently represents a hydrogen atom or a monovalent substituent. Examples of R ²⁴ include a hydrogen atom or an alkyl group which may have a substituent (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms). Examples of the preferable substituent include a hydroxyl group and a halogen atom. Among them, R ²⁴ is preferably a hydrogen atom, a methyl group, or an ethyl group. R ²⁵ and R ²⁶ may each independently have a hydrogen atom, a halogen atom, an alkoxycarbonyl group (preferably 2 to 15 carbon atoms), a sulfo group, a nitro group, a cyano group, or a substituent. A good alkyl group (preferably having 1 to 20 carbon atoms), an aryl group which may have a substituent (preferably 6 to 20 carbon atoms), an alkoxy group which may have a substituent (preferably having a carbon number) 1 to 15), an aryloxy group which may have a substituent (preferably 6 to 20 carbon atoms), an alkylsulfonyl group which may have a substituent (preferably 1 to 20 carbon atoms), substituted And arylsulfonyl group (preferably having 6 to 20 carbon atoms) which may have a group. Among them, a hydrogen atom, an alkoxycarbonyl group, an alkyl group which may have a substituent, and a substituent may be mentioned. An aryl group are preferred even though, more preferably alkyl group which may have a hydrogen atom or a substituent, more preferably a hydrogen atom or a methyl group. Here, examples of the substituent that can be introduced include a methoxycarbonyl group, an ethoxycarbonyl group, an isopropyloxycarbonyl group, a methyl group, an ethyl group, and a phenyl group.

A ²¹ represents an oxygen atom, a sulfur atom, or —N (R ⁴¹ ) —, and X ²¹ represents an oxygen atom, a sulfur atom, or —N (R ⁴² ) —. Here, R ⁴¹ and R ⁴² each independently represent a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms). A ²¹ and X ²¹ are preferably oxygen atoms.
G ²¹ represents a divalent linking group. Examples of the divalent linking group represented by G ²¹ include an alkylene group that may have a substituent, a cycloalkylene group that may have a substituent, and a divalent that may have a substituent. Aromatic group, —OC (O) —, —C (O) O—, —N (R ⁴⁴ ) — and a linking group formed by combining these (total carbon number is preferably 1-20, It is more preferable that the number is 1 to 15, and it is more preferable that the number of carbon atoms is 2 to 10. R ⁴⁴ represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms). More preferred as G ^21, alkylene group which may have a substituent having 1 to 20 carbon atoms, the substituents may cycloalkylene group which may have a 3 to 20 carbon atoms, 6 to 20 carbon atoms A divalent aromatic group which may have a substituent, —OC (O) —, —C (O) O—, —N (R ⁴⁴ ) — and a linking group formed by combining these; Among them, a linear or branched alkylene group having 1 to 10 carbon atoms which may have a substituent, a cycloalkylene group which may have a substituent having 3 to 10 carbon atoms, or a 6 to 12 carbon atom. The divalent aromatic group which may have a substituent, —OC (O) —, —C (O) O—, —N (R ⁴⁴ ) — and a linking group formed by combining these have strength, development It is preferable in terms of performance such as property.

Here, the substituent in G ²¹ is preferably a group in which a hydrogen atom is bonded to a hetero atom except a hydroxyl group, for example, a group not containing an amino group, a thiol group, or a carboxyl group, and preferably a hydroxyl group.

In the general formula (6), R ^{27 to} R ²⁹ each independently represent a hydrogen atom or a monovalent substituent. A preferred range of R ²⁷ to R ²⁹ are the same as the preferred ranges of the above ^R 21 ^{to R 23.}
R ^{30 to} R ³² each independently represent a hydrogen atom or a monovalent substituent. Specific examples of R ^{30 to} R ³² include a hydrogen atom, a halogen atom, a dialkylamino group (preferably having 2 to 20 carbon atoms), an alkoxycarbonyl group (preferably having 2 to 15 carbon atoms), a sulfo group, and a nitro group. A group, a cyano group, an optionally substituted alkyl group (preferably having 1 to 20 carbon atoms), an optionally substituted aryl group (preferably having 6 to 20 carbon atoms), and a substituent group. An optionally substituted alkoxy group (preferably having a carbon number of 1 to 15), an optionally substituted aryloxy group (preferably having a carbon number of 6 to 20), and an optionally substituted alkyl Examples include a sulfonyl group (preferably having a carbon number of 1 to 20), an arylsulfonyl group optionally having a substituent (preferably having a carbon number of 6 to 20), etc. Among them, a hydrogen atom, an alkoxycarbonyl group, Alkyl group which may have a substituent, aryl group which may have a substituent is preferable.
Examples of the substituent that may be introduced include the same manner as in the formula (5) mentioned as the substituent which may be introduced into R ²¹ to R ^23.

A < ²² > represents an oxygen atom, a sulfur atom, or -N (R < ⁴¹ >)-each independently. Here, R ⁴¹ represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms).
G ²² represents a divalent linking group. Specific examples and preferred ranges of the divalent linking group represented by G ²² are the same as the specific examples and preferred ranges of the divalent linking group represented by G ²¹ described above.
Y ²¹ represents an oxygen atom, a sulfur atom, —N (R ⁴³ ) — or a phenylene group. Here, R ⁴³ represents a hydrogen atom or an alkyl group (preferably having 1 to 10 carbon atoms, more preferably 1 to 4 carbon atoms) which may have a substituent. The phenylene group represented by Y ²¹ may have a substituent, and examples of the substituent include an alkyl group and a halogen atom.

In the general formula (7), R ^{33 to} R ³⁵ each independently represents a hydrogen atom or a monovalent substituent. The preferred range of R ^{33 to} R ^{35 is the same as} the preferred range of R ^{21 to} R ²³ described above.
R ^{36 to} R ⁴⁰ each independently represent a hydrogen atom or a monovalent substituent. Specific examples and preferred ranges of R ^{36 to} R ⁴⁰ are the same as the specific examples and preferred ranges of R ^{30 to} R ³² .
A ²³ represents an oxygen atom, a sulfur atom, or —N (R ⁴¹ ) —, and Z ²¹ represents an oxygen atom, a sulfur atom, or —N (R ⁴² ) —. The R ⁴¹ and ^{R 42,} are the same as those for ^{R 41} and ^{R 42} in the general formula (5).

G ²³ represents a divalent linking group. Specific examples and preferred ranges of the divalent linking group represented by G ²³ are the same as the specific examples and preferred ranges of the divalent linking group represented by G ²² described above.

  The synthesis of the polymer having the repeating units represented by the general formulas (5) to (7) is performed based on the synthesis method described in paragraph numbers [0027] to [0057] of JP-A No. 2003-262958. Can do. Among these, it is preferable to use the synthesis method 1) in the publication.

  The content of the radically or cationically polymerizable repeating unit (III) in the dispersion resin is 1 mol% to 70 mol% with respect to all the repeating units in the dispersion resin in order to increase the sensitivity and suppress chipping of the cured pattern. Preferably, 5 mol% to 60 mol% is more preferable, and 10 mol% to 60 mol% is most preferable.

  Specific examples of the radically or cationically polymerizable repeating unit (III) are shown below, but the present invention is not limited thereto.

Further, the dispersion resin may contain a repeating unit (IV) having an acid-decomposable group.
The acid-decomposable group preferably has a structure in which an alkali-soluble group is protected with a group capable of decomposing and leaving by the action of an acid.
The alkali-soluble group is not particularly limited as long as it is a group that dissociates and becomes an ion in an alkali developer. Preferred alkali-soluble groups include a carboxyl group, a fluorinated alcohol group (preferably hexafluoroisopropanol), and a sulfonic acid. Groups.
The acid-decomposable group is preferably a cumyl ester group, an enol ester group, an acetal ester group, a tertiary alkyl ester group or the like. More preferably, it is a tertiary alkyl ester group.

  The repeating unit (IV) having an acid-decomposable group is preferably a repeating unit represented by the following general formula (CAI).

In the general formula (CAI),
Xa ₁ represents a hydrogen atom, a methyl group which may have a substituent, or a group represented by —CH ₂ —R ₉ . R ₉ represents a hydroxyl group or a monovalent organic group, and examples thereof include an alkyl group having 5 or less carbon atoms and an acyl group, preferably an alkyl group having 3 or less carbon atoms, and more preferably a methyl group. Xa ₁ preferably represents a hydrogen atom, a methyl group, a trifluoromethyl group or a hydroxymethyl group.
T represents a single bond or a divalent linking group.
Rx _{1 to} Rx ₃ each independently represents an alkyl group (straight or branched) or a cycloalkyl group (monocyclic or polycyclic).
Two of Rx _{1 to} Rx ₃ may combine to form a cycloalkyl group (monocyclic or polycyclic).

Examples of the divalent linking group for T include an alkylene group, —COO—Rt— group, —O—Rt— group, and the like. In the formula, Rt represents an alkylene group or a cycloalkylene group.
T is preferably a single bond or a —COO—Rt— group. Rt is preferably an alkylene group having 1 to 5 carbon atoms, more preferably a —CH ₂ — group, a — (CH ₂ ) ₂ — group, or a — (CH ₂ ) ₃ — group.
Examples of the alkyl group rx ₁ to Rx _3, methyl, ethyl, n- propyl group, an isopropyl group, n- butyl group, an isobutyl group, those having 1 to 4 carbon atoms such as t- butyl group.
Examples of the cycloalkyl group represented by Rx _{1 to} Rx ₃ include monocyclic cycloalkyl groups such as cyclopentyl group and cyclohexyl group, polycyclic cycloalkyl groups such as norbornyl group, tetracyclodecanyl group, tetracyclododecanyl group, and adamantyl group. Groups are preferred.
The cycloalkyl group formed by combining two of Rx _{1 to} Rx ₃ includes a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, a norbornyl group, a tetracyclodecanyl group, and a tetracyclododecanyl group. And a polycyclic cycloalkyl group such as an adamantyl group is preferred, and a monocyclic cycloalkyl group having 5 to 6 carbon atoms is particularly preferred.
It is preferable that Rx ₁ is a methyl group or an ethyl group, and Rx ₂ and Rx ₃ are bonded to form the above-described cycloalkyl group.
Each of the above groups may have a substituent. Examples of the substituent include an alkyl group (1 to 4 carbon atoms), a halogen atom, a hydroxyl group, an alkoxy group (1 to 4 carbon atoms), a carboxyl group, An alkoxycarbonyl group (C2-C6) etc. are mentioned, C8 or less is preferable.
The content of the repeating unit (IV) having an acid-decomposable group in the dispersion resin is preferably 1 to 50 mol%, more preferably 50 to 40 mol%, based on all repeating units in the dispersion resin.

  The dispersion resin may contain any repeating unit other than the above repeating units (I) to (IV) (hereinafter also referred to as other repeating units).

In particular, when the binder (D) is in a form containing a crosslinking agent (described in detail later), the dispersion resin preferably has an alcoholic hydroxyl group, and more preferably has a repeating unit having an alcoholic hydroxyl group.
Here, the alcoholic hydroxyl group is a hydroxyl group bonded to a hydrocarbon group and is not limited as long as it is other than a hydroxyl group bonded directly on an aromatic ring (phenolic hydroxyl group). Those other than the hydroxyl group in the aliphatic alcohol in which the α-position is substituted with an electron-withdrawing group are preferable. In order to improve the reaction efficiency with the crosslinking agent (C), the hydroxyl group is substituted with a primary alcoholic hydroxyl group (a group in which the hydroxyl group has two hydrogen atoms apart from the hydroxyl group) or a hydroxyl group is substituted. It is preferably a secondary alcoholic hydroxyl group in which no other electron-withdrawing group is bonded to the carbon atom.
The number of alcoholic hydroxyl groups is preferably 1 to 3 per repeating unit, more preferably 1 or 2.
Examples of such a repeating unit include a repeating unit represented by the following general formula (2) or general formula (3).

In the general formula (2), at least one of R _X and R represents a structure having an alcoholic hydroxyl group.
In the general formula (3), at least one of two R _X and R represents a structure having an alcoholic hydroxyl group. Two R _X may be the same or different.
Examples of the structure having an alcoholic hydroxyl group include a hydroxyalkyl group (preferably having 2 to 8 carbon atoms, more preferably 2 to 4 carbon atoms), a hydroxycycloalkyl group (preferably having 4 to 14 carbon atoms), and a hydroxyalkyl group. A substituted cycloalkyl group (preferably having a total carbon number of 5 to 20), an alkyl group substituted with a hydroxyalkoxy group (preferably a total of 3 to 15 carbon atoms), a cycloalkyl group substituted with a hydroxyalkoxy group (preferably total number 5-20) such as carbon and the like, preferably residues of primary alcohols as described _{above, - (CH 2) n-} OH (n is an integer of 1 or more, preferably an integer of 2 to 4) The structure represented is more preferred.
R _X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group which may have a substituent (preferably having 1 to 4 carbon atoms) or a cycloalkyl group which has a substituent (having 5 to 12 carbon atoms). Preferred). The alkyl group and cycloalkyl group are preferred substituents that have the R _X, a hydroxyl group and a halogen atom. Examples of the halogen atom of R _X, there can be mentioned a fluorine atom, a chlorine atom, a bromine atom, an iodine atom. R _X is preferably a hydrogen atom, a methyl group, a hydroxymethyl group, a hydroxyl group or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.
R represents a hydrocarbon group which may have a hydroxyl group. The hydrocarbon group for R is preferably a saturated hydrocarbon, an alkyl group (preferably having 1 to 8 carbon atoms, more preferably 2 to 4 carbon atoms) or a monocyclic or polycyclic cyclic hydrocarbon group (preferably having 3 carbon atoms). To 20, for example, an alicyclic group described later). n ′ represents an integer of 0 to 2.

The repeating unit having an alcoholic hydroxyl group is preferably a repeating unit derived from an ester of acrylic acid which may be substituted at the α-position of the main chain (for example, Rx in the formula (2)). More preferably, it is derived from a monomer having a structure corresponding to. Moreover, it is preferable to have an alicyclic group in a unit. The alicyclic group may be a monocyclic or polycyclic structure, but a polycyclic structure is preferred from the viewpoint of etching resistance.
Specifically, as the alicyclic group, the monocyclic structure includes cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, and the polycyclic structure includes norbornyl, isobornyl, tricyclodecanyl, tetracyclododecanyl, Examples include hexacycloheptadecanyl, adamantyl, diamantyl, spirodecanyl, spiroundecanyl and the like. Of these, adamantyl, diamantyl and norbornyl structures are preferred.

Although the repeating unit which has an alcoholic hydroxyl group is illustrated below, this invention is not limited to these. In specific examples, R ^X represents a hydrogen atom or a methyl group.

  When the dispersion resin has a repeating unit having an alcoholic hydroxyl group, the content of the repeating unit is generally 10 to 50 mol%, preferably 10 to 40 mol%, based on all repeating units constituting the dispersion resin. Preferably it is 10-30 mol%.

  Examples of other repeating units include, but are not limited to, repeating structural units corresponding to the following monomers.

Thereby, performance required for the resin used in the composition of the present invention, in particular,
(1) Solubility in coating solvent,
(2) Film formability (glass transition point),
(3) Alkali developability,
(4) Membrane slip (hydrophobic, alkali-soluble group selection),
(5) Adhesion of the exposed part to the substrate,
(6) Fine adjustment such as dry etching resistance can be performed.

  As such a monomer, for example, a compound having one addition polymerizable unsaturated bond selected from acrylic acid esters, methacrylic acid esters, acrylamides, methacrylamides, allyl compounds, vinyl ethers, vinyl esters, etc. And those compounds having a hydrophilic group such as a hydroxyl group.

  The dispersion resin may or may not contain other repeating units, but when it is contained, the content of the other repeating units in the dispersion resin is 5 mol% to 50% with respect to all the repeating units in the dispersion resin. It is preferable that it is mol%, and 10 mol%-40 mol% are more preferable.

  The dispersion resin consists of only three components of the repeating units (I) to (III) (that is, the total content of the repeating units (I) to (III) is 100 mol with respect to all the repeating units in the dispersion resin. %) Is also preferable.

  The unsaturated value of the dispersion resin is preferably 0.1 mmol / g to 7.0 mmol / g, more preferably 0.2 mmol / g to 5.0 mmol / g, and most preferably 0.5 mmol / g. It is in the range of ~ 2.0 mmol / g. By setting it as this range, both curability and developability can be achieved. The unsaturated value means the number of millimolar number of polymerizable unsaturated bonds contained in 1 g of polymer.

  The acid value of the dispersion resin is preferably 10 mgKOH / g to 300 mgKOH / g, more preferably 20 mgKOH / g to 250 mgKOH / g, and most preferably 50 mgKOH / g to 200 mgKOH / g. By setting it as this range, developability becomes favorable and the residue by the hollow or porous particle | grain to an unexposed part can be suppressed.

  The refractive index of the dispersed resin is 1.30 or more and less than 1.50, preferably 1.40 or more and less than 1.50, more preferably 1.45 or more and less than 1.50. From the viewpoint that can be reduced. In order to realize such a refractive index, it is preferable that the polymer does not have an aromatic ring or a cyclic structure.

  The dispersion resin preferably has a mass average molecular weight (polystyrene equivalent value measured by GPC method) of 2,000 to 100,000, more preferably 2,000 to 50,000 in consideration of embedding in the substrate unevenness. And most preferably in the range of 2,000-35,000.

The dispersion resin can be synthesized and purified according to a conventional method (for example, radical polymerization). For details of the synthesis and purification method, refer to, for example, the description in Chapter 2 “Polymer Synthesis” of “5th edition Experimental Chemistry Course 26 Polymer Chemistry” published by Maruzen Co., Ltd. Regarding the purification of the resin, it is preferable to remove impurities such as unreacted monomers, oligomers and metals as much as possible from the viewpoint of reducing defects and improving resolution.
One type of resin may be used alone, or two or more types may be used in combination. In the latter case, the composition according to the present invention may contain two or more kinds of resins containing the repeating units (I) and (II), and 1 containing the repeating units (I) and (II). Both one or more resins and one or more resins not containing the repeating units (I) and (II) may be included.

  The alkali-soluble particle dispersant (B) has been described above, but the particle dispersant (B) may be used alone or in combination of two or more.

The content of the particle dispersant (B) in the photosensitive composition is preferably 1 to 100% by mass, more preferably 5 to 80% by mass, and 10 to 60% by mass with respect to the hollow or porous particles. More preferably it is.
Specifically, when the particle dispersant (B) is a dispersion resin, the amount used is preferably 5 to 100% by mass, and 10 to 80% by mass with respect to the hollow or porous particles. Is more preferable, and it is especially preferable that it is 15-50 mass%.

  In preparing the photosensitive composition of the present invention, the components constituting the photosensitive composition may be mixed together with a solvent, but in advance, hollow or porous particles (A) and a particle dispersant (B ) To produce a reaction resin that is a reaction product of the hollow or porous particles (A) and the particle dispersant (B), and the reaction resin and each of the other constituents of the photosensitive composition. You may mix an ingredient with a solvent.

[3] (B ′) Particle Dispersant The photosensitive composition of the present invention comprises (B ′) a particle dispersant (hereinafter also referred to as other particle dispersant) different from the above (B) particle dispersant. You may contain suitably.

Other particle dispersants include polyamidoamines and salts thereof, polycarboxylic acids and salts thereof, high molecular weight unsaturated acid esters, modified polyurethanes, modified polyesters, modified poly (meth) acrylates, (meth) acrylic copolymers, Examples of the dispersion resin such as naphthalene sulfonic acid formalin condensate and compounds such as polyoxyethylene alkyl phosphate ester, polyoxyethylene alkyl amine, alkanol amine, and the like are preferable. Also referred to as “other dispersion resin”).
Other dispersion resins can be further classified into linear polymers, terminal-modified polymers, graft polymers, and block polymers based on their structures.

  Other dispersed resins are adsorbed on the surface of the particles and act to prevent reaggregation. Therefore, a terminal-modified polymer, a graft polymer and a block polymer having an anchor site to the pigment surface can be mentioned as preferred structures.

The weight average molecular weight of the other dispersing resin (measured in terms of polystyrene by GPC method) is preferably from 1000-2 × 10 ^5, more preferably in a 2000~1 × 10 ^5, 5000~5 × 10 ⁴ is particularly preferred.

  Other dispersion resins are also available as commercial products. Specific examples of such dispersion resins include “Disperbyk-101 (polyamidoamine phosphate), 107 (carboxylic acid ester), 110 (containing an acid group) manufactured by BYK Chemie. Copolymer)), 111, 130 (polyamide), 161, 162, 163, 164, 165, 166, 170 (polymer copolymer) ”,“ BYK-P104, P105 (high molecular weight unsaturated polycarboxylic acid) ”, “EFKA 4047, 4050-4010-4165 (polyurethane)”, EFKA 4330-4340 (block copolymer), 4400-4402 (modified polyacrylate), 5010 (polyesteramide), 5765 (high molecular weight polycarboxylate) manufactured by EFKA , 6220 (fatty acid polyester), 6745 ( Talocyanine derivative), 6750 (azo pigment derivative) "," Ajisper PB821, PB822 "manufactured by Ajinomoto Fan Techno," Floren TG-710 (urethane oligomer) "manufactured by Kyoeisha Chemical Co.," Polyflow No. 50E, No. 300 (acrylic) Copolymer) ”,“ Disparon KS-860, 873SN, 874, # 2150 (aliphatic polycarboxylic acid), # 7004 (polyetherester), DA-703-50, DA-705, manufactured by Enomoto Kasei Co., Ltd. “DA-725”, “Demol RN, N (naphthalene sulfonic acid formalin polycondensate), MS, C, SN-B (aromatic sulfonic acid formalin polycondensate)”, “Homogenol L-18 (polymer) Polycarboxylic acid) "," Emulgen 920, 930, 935, 985 (polyoxyethylene) Nilphenyl ether) ”,“ acetamine 86 (stearylamine acetate) ”,“ Solsperse 5000 (phthalocyanine derivative), 22000 (azo pigment derivative), 13240 (polyesteramine), 3000, 17000, 27000 (end part) Polymer having functional part), 24000, 28000, 32000, 38500 (graft type polymer) "," Nikkor T106 (polyoxyethylene sorbitan monooleate), MYS-IEX (polyoxyethylene monostearate) "manufactured by Nikko Chemical Co., Ltd. ", EFKA-46, EFKA-47, EFKA-47EA, EFKA polymer 100, EFKA polymer 400, EFKA polymer 401, EFKA polymer 450" manufactured by Morishita Sangyo Co., Ltd. Examples thereof include dispersion resins such as “Perth Aid 6, Disperse Aid 8, Disperse Aid 15, Disperse Aid 9100”.

The other dispersion resin may have at least one selected from structural units represented by any of general formulas (21) to (23) described later.
Further, the other dispersion resin may be a resin obtained by using a compound represented by the general formula (E-1) described later as a copolymer.

  As other particle dispersants, nonionic, anionic and cationic sea surface active agents can be used. These surfactants are also available as commercial products, such as phthalocyanine derivatives (commercial products EFKA-745 (manufactured by Efka)), Solsperse 5000 (manufactured by Nippon Lubrizol Corporation); organosiloxane polymer KP341 (Shin-Etsu Chemical Co., Ltd.) Manufactured by Co., Ltd.), (meth) acrylic acid-based (co) polymer polyflow No. 75, no. 90, no. 95 (above, manufactured by Kyoeisha Yushi Chemical Co., Ltd.), W001 (manufactured by Yusho Co., Ltd.), and the like; polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, poly Nonionic surfactants such as oxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester; W004, W005, W017 (above, manufactured by Yusho Co., Ltd.), etc. Anionic surfactants such as Solsperse 3000, 5000, 9000, 12000, 13240, 13940, 17000, 24000, 26000, 28000, etc. (Nippon Lubrizol Corporation) ); Adeka Pluronic L31, F38, L42, L44, L61, L64, F68, L72, P95, F77, P84, F87, P94, L101, P103, F108, L121, P-123 (above, manufactured by ADEKA Corporation) , And Isonet S-20 (manufactured by Sanyo Chemical Co., Ltd.). In addition, amphoteric dispersants such as Hinoact T-8000E manufactured by Kawaken Fine Chemical Co., Ltd. are also included.

Moreover, ELEBASE BA-100, BA-200, BCP-2, BUB-3, BUB-4, CP-800K, EDP-475, HEB-5, Finesurf 270, 7045, 7085, Braunon DSP-12.5, DT-03, L-205, LPE-1007, O-205, S-202, S-204, S-207, S-205T (Aoki Yushi Kogyo), EMULGEN A-500, PP-290, Amate 102, 105 , 302, 320, Aminone PK-02S, Emanon CH-25, Emulgen 104P, 108, 404, 408, A-60, A-90, B-66, LS-106, LS-114, Rheodor 430V, 440V, 460V , TW-S106, TW-S120V, Rheodor Super TW-L120 (Kao), Examples include Neukargen 3000S, Fu S-3PG, FE-7PG, Pionein D-6414 (Takemoto Yushi), DYNOL604, Orphine PD-002W, Surfynol 2502, 440, 465, 485, 61 (Nisshin Chemical Industry). it can.
Also, Phosphanol ML-200, Emar 20T, E-27, Neopelex GS, Perex NBL, SS-H, SS-L, Poise 532A, Ramtel ASK, E-118B, E-150 (Kao Corporation) , EMULSOGEN COL-020, 070, 080 (Clariant), Prisurf A208B, A210B, A210G, A219B, AL, Labelin FC-45 (Daiichi Kogyo Seiyaku), Pionein A-24-EA, A-28-B, A -29-M, A-44-B, A-44TW (Takemoto Yushi), AKYPO RLM100NV, RLM45, RLM45NV, ECT-3, ECT-3NEX, ECT-7, Phosten HLP, HLP-1, HLP-TEA (Japan) Surfactant Industry).
These other particle dispersants may be used alone or in combination of two or more.

The content of the other particle dispersant in the photosensitive composition is preferably 1 to 90% by mass, more preferably 1 to 80% by mass, and 1 to 50% by mass with respect to the hollow or porous particles. More preferably.
Specifically, when the other particle dispersant is a dispersion resin, the amount used is preferably 10 to 90% by mass, and 10 to 80% by mass with respect to the hollow or porous particles. Is more preferable.

[4] (C) Compound that generates active species upon irradiation with actinic rays or radiation The photosensitive composition of the present invention contains (C) a compound that generates active species upon irradiation with actinic rays or radiation.
The photosensitive composition of the present invention imparted with photosensitivity by containing the compound (C) can be suitably used for a photoresist, a color resist, an optical coating material, and the like.
As a compound (C), a photoinitiator can be mentioned suitably. That is, preferred examples of the active species include radicals, cationic species, and anionic species (more preferably, radicals or cationic species).
Hereinafter, the photopolymerization initiator will be described in detail.

The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, those having photosensitivity to visible light from the ultraviolet region are preferred and photoexcited. It may be an activator that produces some action with a sensitizer and generates active radicals, or an initiator that initiates cationic polymerization according to the type of monomer.
The photopolymerization initiator preferably contains at least one component having a molecular extinction coefficient of at least about 50 within a range of about 200 to 800 nm (more preferably 300 to 450 nm).

  Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferred.

(Photo radical polymerization initiator)
Examples of radical photopolymerization initiators include halogenated hydrocarbon derivatives (for example, those having a triazine skeleton, those having an oxadiazole skeleton, etc.), hexaarylbiimidazole compounds, lophine dimers, benzoins, ketals. , 2,3-dialkyldione compounds, organic peroxides, thio compounds, disulfide compounds, azo compounds, borates, inorganic complexes, coumarins, ketone compounds (benzophenones, thioxanthones, thiochromones, anthraquinones) ), Aromatic onium salts, fluoroamine compounds, ketoxime ethers, acetophenones (aminoacetophenone compounds, hydroxyacetophenone compounds), acylphosphine compounds such as acylphosphine oxides, oximes such as oxime derivatives Compounds, and the like.

  Examples of the halogenated hydrocarbon compound having a triazine skeleton include those described in Wakabayashi et al., Bull. Chem. Soc. Japan, 42, 2924 (1969), a compound described in British Patent 1388492, a compound described in JP-A-53-133428, a compound described in German Patent 3337024, F.I. C. J. Schaefer et al. Org. Chem. 29, 1527 (1964), compounds described in JP-A-62-258241, compounds described in JP-A-5-281728, compounds described in JP-A-5-34920, US Pat. No. 4,221,976 And the compounds described in the book.

  Examples of the compound described in US Pat. No. 4,221,976 include compounds having an oxadiazole skeleton (for example, 2-trichloromethyl-5-phenyl-1,3,4-oxadiazole, 2- Trichloromethyl-5- (4-chlorophenyl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (1-naphthyl) -1,3,4-oxadiazole, 2-trichloromethyl-5 -(2-naphthyl) -1,3,4-oxadiazole, 2-tribromomethyl-5-phenyl-1,3,4-oxadiazole, 2-tribromomethyl-5- (2-naphthyl) -1,3,4-oxadiazole; 2-trichloromethyl-5-styryl-1,3,4-oxadiazole, 2-trichloromethyl-5- (4-chlorostyryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (4-methoxystyryl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (1-naphthyl) -1, 3,4-oxadiazole, 2-trichloromethyl-5- (4-n-butoxystyryl) -1,3,4-oxadiazole, 2-tripromomethyl-5-styryl-1,3,4 Oxadiazole, etc.).

  Examples of benzoins include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl dimethyl ketal, benzoin benzene sulfonate, benzoin toluene sulfonate, benzoin methyl ether, benzoin ethyl ether and benzoin isopropyl ether. It is.

  Examples of borates include, for example, Japanese Patent Nos. 2764769 and 2002-116539, and “Rad Tech'98. Proceeding April” by Kunz, Martin et al., Pages 19-22 (1998, Chicago). ) And the like described in the organic borate. Examples thereof include compounds described in paragraph numbers [0022] to [0027] of JP-A-2002-116539. Examples of other organic boron compounds include JP-A-6-348011, JP-A-7-128785, JP-A-7-140589, JP-A-7-306527, and JP-A-7-292014. Specific examples include organoboron transition metal coordination complexes and the like, and specific examples include ion complexes with cationic dyes.

  In addition, as radical polymerization initiators other than the above, polyhalogen compounds (for example, 9-phenylacridine, 1,7-bis (9,9′-acridinyl) heptane, etc.), N-phenylglycine (for example, Carbon tetrabromide, phenyl tribromomethyl sulfone, phenyl trichloromethyl ketone, etc.), coumarins (for example, 3- (2-benzofuroyl) -7-diethylaminocoumarin, 3- (2-benzofuroyl) -7- (1-pyrrolidinyl) ) Coumarin, 3-benzoyl-7-diethylaminocoumarin, 3- (2-methoxybenzoyl) -7-diethylaminocoumarin, 3- (4-dimethylaminobenzoyl) -7-diethylaminocoumarin, 3,3′-carbonylbis (5 , 7-di-n-propoxycoumarin), 3,3′- Rubonylbis (7-diethylaminocoumarin), 3-benzoyl-7-methoxycoumarin, 3- (2-furoyl) -7-diethylaminocoumarin, 3- (4-diethylaminocinnamoyl) -7-diethylaminocoumarin, 7-methoxy-3 -(3-pyridylcarbonyl) coumarin, 3-benzoyl-5,7-dipropoxycoumarin, 7-benzotriazol-2-ylcoumarin, JP-A-5-19475, JP-A-7-271028, JP 2002-363206, JP-A 2002-363207, JP-A 2002-363208, JP-A 2002-363209, etc.), acylphosphine oxides (for example, bis (2,4 , 6-Trimethylbenzoyl) -phenylphos Fin oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphenylphosphine oxide, Lucirin TPO, etc.), metallocenes (for example, bis (η5-2,4-cyclopentadien-1-yl) -Bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, η5-cyclopentadienyl-η6-cumenyl-iron (1 +)-hexafluorophosphate (1-), etc.) And compounds described in JP-A-53-133428, JP-B-57-1819, JP-A-57-6096, and US Pat. No. 3,615,455.

  Examples of the ketone compound include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 4-methoxybenzophenone, 2-chlorobenzophenone, 4-chlorobenzophenone, 4-bromobenzophenone, 2-carboxybenzophenone, 2-ethoxycarbonylbenzolphenone, benzophenonetetracarboxylic acid or tetramethyl ester thereof, 4,4′-bis (dialkylamino) benzophenone (for example, 4,4′-bis (dimethylamino) benzophenone, 4,4′- Bisdicyclohexylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, 4,4′-bis (dihydroxyethylamino) benzophenone, 4-methoxy-4′-dimethylamino Nzophenone, 4,4'-dimethoxybenzophenone, 4-dimethylaminobenzophenone, 4-dimethylaminoacetophenone, benzyl, anthraquinone, 2-t-butylanthraquinone, 2-methylanthraquinone, phenanthraquinone, xanthone, thioxanthone, 2-chloro -Thioxanthone, 2,4-diethylthioxanthone, fluorenone, 2-benzyl-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino -1-propanone, 2-hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, benzoin, benzoin ethers (for example, benzoin methyl ether, benzoin ethyl ether, In propyl ether, benzoin isopropyl ether, benzoin phenyl ether, benzyl dimethyl ketal), acridone, chloro acridone, N- methyl acridone, N- butyl acridone, N- butyl - such as chloro acrylic pyrrolidone.

  The radical polymerization initiator is more preferably a compound selected from the group consisting of aminoacetophenone compounds, hydroxyacetophenone compounds, acylphosphine compounds, and oxime compounds. More specifically, for example, an aminoacetophenone initiator described in JP-A-10-291969, an acylphosphine oxide initiator described in Japanese Patent No. 4225898, an oxime initiator, and an oxime initiator. As the agent, compounds described in JP-A No. 2001-233842 can also be used.

  As the aminoacetophenone initiator, commercially available products IRGACURE-907, IRGACURE-369, and IRGACURE-379 (trade names: all manufactured by BASF Japan Ltd.) can be used. Further, as the acylphosphine-based initiator, commercially available products such as IRGACURE-819 and DAROCUR-TPO (trade names: both manufactured by BASF Japan Ltd.) can be used.

  The hydroxyacetophenone compound is preferably a compound represented by the following formula (V).

In the formula (V), Rv ¹ is a hydrogen atom, an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms), an alkoxy group (preferably an alkoxy group having 1 to 10 carbon atoms), or a divalent organic compound. Represents a group. When Rv ¹ is a divalent organic group, two photoactive hydroxyacetophenone structures (that is, a structure in which the substituent Rv ¹ is excluded from the compound represented by the general formula (V)) are formed via Rv ¹ Represents a dimer formed by linking. Rv ² and Rv ³ each independently represent a hydrogen atom or an alkyl group (preferably an alkyl group having 1 to 10 carbon atoms). Rv ² and Rv ³ may combine to form a ring (preferably a ring having 4 to 8 carbon atoms).
Alkyl and alkoxy groups as the Rv ^1, the alkyl group as Rv ² and Rv ^3, and, ring and Rv ² and Rv ³ is formed by bonding, it may further have a substituent.

Examples of the hydroxyacetophenone compound include 2-hydroxy-2-methyl-1-phenylpropan-1-one (DAROCURE 1173), 2-hydroxy-2-methyl-1-phenylbutan-1-one, and 1- (4 -Methylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-isopropylphenyl) -2-methylpropan-1-one, 1- (4-butylphenyl) -2-hydroxy-2 -Methylpropan-1-one, 2-hydroxy-2-methyl-1- (4-octylphenyl) propan-1-one, 1- (4-dodecylphenyl) -2-methylpropan-1-one, 1- (4-methoxyphenyl) -2-methylpropan-1-one, 1- (4-methylthiophenyl) -2-methylpropan-1-one, 1 -(4-Chlorophenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-bromophenyl) -2-hydroxy-2-methylpropan-1-one, 2-hydroxy-1- (4 -Hydroxyphenyl) -2-methylpropan-1-one, 1- (4-dimethylaminophenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-carboethoxyphenyl) -2-hydroxy 2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone (IRGACURE 184), 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1- ON (IRGACURE 2959).
In addition, as commercially available α-hydroxyacetophenone compounds, Irgacure 184 (IRGACURE 184), Darocur 1173 (DAROCURE 1173), Irgacure 127 (IRGACURE 127), Irgacure 2959 (IRGACURE 2959), Irgacure 1800 (IRGAC URE) from BASF Japan Polymerization initiators available under the trade names Irgacure 1870 (IRGACURE 1870) and DAROCURE 4265 can also be used.

  As the acylphosphine-based initiator, commercially available products IRGACURE-819, IRGACURE-819DW, DAROCUR-TPO (trade names: all manufactured by BASF Japan Ltd.) can be used. A phosphine initiator described in JP-A-2009-134098 can also be applied.

  Examples of oxime compounds such as oxime derivatives that are preferably used as a photopolymerization initiator in the present invention include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutane-2-one, and 3-propionyloxyimino. Butan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3- (4 -Toluenesulfonyloxy) iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one and the like.

Examples of oxime compounds include J.M. C. S. Perkin II (1979) pp. 1653-1660), J.M. C. S. Perkin II (1979) pp. 156-162, Journal of Photopolymer Science and Technology (1995) pp. 202-232, compounds described in JP-A No. 2000-66385, compounds described in JP-A No. 2000-80068, JP-T 2004-534797, JP-A No. 2006-342166, and the like.
IRGACURE-OXE01 (manufactured by BASF Japan), IRGACURE-OXE02 (manufactured by BASF Japan), CGI-124 (manufactured by BASF Japan), and CGI-242 (manufactured by BASF Japan) are also suitably used as commercial products.
Furthermore, the cyclic oxime compounds described in JP2007-231000A and JP2007-322744A can also be suitably used.
Most preferably, the oxime compound which has a specific substituent shown by Unexamined-Japanese-Patent No. 2007-267979 and the oxime compound which has a thioaryl group shown by Unexamined-Japanese-Patent No. 2009-191061 are mentioned.
Specifically, the oxime compound is preferably a compound represented by the following formula (I). The NO bond of the oxime bond may be an (E) oxime compound, a (Z) oxime compound, or a mixture of (E) and (Z) isomers. Good.

(In formula (I), R and B each independently represent a monovalent substituent, A represents a divalent organic group, and Ar represents an aryl group.)
The monovalent substituent represented by R is preferably a monovalent nonmetallic atomic group.
Examples of the monovalent nonmetallic atomic group include an alkyl group, an aryl group, an acyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, a heterocyclic group, an alkylthiocarbonyl group, and an arylthiocarbonyl group. Moreover, these groups may have one or more substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.
Examples of the substituent include a halogen atom, an aryloxy group, an alkoxycarbonyl group or an aryloxycarbonyl group, an acyloxy group, an acyl group, an alkyl group, and an aryl group.

  As the alkyl group which may have a substituent, an alkyl group having 1 to 30 carbon atoms is preferable, and specifically, a methyl group, an ethyl group, a propyl group, a butyl group, a hexyl group, an octyl group, a decyl group. , Dodecyl group, okdadecyl group, isopropyl group, isobutyl group, sec-butyl group, t-butyl group, 1-ethylpentyl group, cyclopentyl group, cyclohexyl group, trifluoromethyl group, 2-ethylhexyl group, phenacyl group, 1- Naphthoylmethyl group, 2-naphthoylmethyl group, 4-methylsulfanylphenacyl group, 4-phenylsulfanylphenacyl group, 4-dimethylaminophenacyl group, 4-cyanophenacyl group, 4-methylphenacyl group, 2- Methylphenacyl group, 3-fluorophenacyl group, 3-trifluoromethylphenacyl group, and , 3 Nitorofenashiru group can be exemplified.

  The aryl group which may have a substituent is preferably an aryl group having 6 to 30 carbon atoms, specifically, a phenyl group, a biphenyl group, a 1-naphthyl group, a 2-naphthyl group, or a 9-anthryl group. 9-phenanthryl group, 1-pyrenyl group, 5-naphthacenyl group, 1-indenyl group, 2-azurenyl group, 9-fluorenyl group, terphenyl group, quarterphenyl group, o-, m- and p-tolyl group, Xylyl group, o-, m- and p-cumenyl group, mesityl group, pentarenyl group, binaphthalenyl group, tarnaphthalenyl group, quarternaphthalenyl group, heptaenyl group, biphenylenyl group, indacenyl group, fluoranthenyl group, acenaphthylenyl group, ASEAN Trirenyl, phenalenyl, fluorenyl, anthryl, bianthracenyl, ter Nthracenyl group, quarteranthracenyl group, anthraquinolyl group, phenanthryl group, triphenylenyl group, pyrenyl group, chrysenyl group, naphthacenyl group, preadenyl group, picenyl group, perylenyl group, pentaphenyl group, pentacenyl group, tetraphenylenyl group, Examples include a hexaphenyl group, a hexacenyl group, a rubicenyl group, a coronenyl group, a trinaphthylenyl group, a heptaphenyl group, a heptacenyl group, a pyranthrenyl group, and an ovalenyl group.

  The acyl group which may have a substituent is preferably an acyl group having 2 to 20 carbon atoms, specifically, an acetyl group, a propanoyl group, a butanoyl group, a trifluoroacetyl group, a pentanoyl group, a benzoyl group, 1-naphthoyl group, 2-naphthoyl group, 4-methylsulfanylbenzoyl group, 4-phenylsulfanylbenzoyl group, 4-dimethylaminobenzoyl group, 4-diethylaminobenzoyl group, 2-chlorobenzoyl group, 2-methylbenzoyl group, 2 -Methoxybenzoyl group, 2-butoxybenzoyl group, 3-chlorobenzoyl group, 3-trifluoromethylbenzoyl group, 3-cyanobenzoyl group, 3-nitrobenzoyl group, 4-fluorobenzoyl group, 4-cyanobenzoyl group, and And 4-methoxybenzoyl group.

  The alkoxycarbonyl group which may have a substituent is preferably an alkoxycarbonyl group having 2 to 20 carbon atoms, specifically, a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, a butoxycarbonyl group, or a hexyloxy group. Examples thereof include a carbonyl group, an octyloxycarbonyl group, a decyloxycarbonyl group, an octadecyloxycarbonyl group, and a trifluoromethyloxycarbonyl group.

  Specific examples of the aryloxycarbonyl group which may have a substituent include phenoxycarbonyl group, 1-naphthyloxycarbonyl group, 2-naphthyloxycarbonyl group, 4-methylsulfanylphenyloxycarbonyl group, 4-phenylsulfanyl. Phenyloxycarbonyl group, 4-dimethylaminophenyloxycarbonyl group, 4-diethylaminophenyloxycarbonyl group, 2-chlorophenyloxycarbonyl group, 2-methylphenyloxycarbonyl group, 2-methoxyphenyloxycarbonyl group, 2-butoxyphenyloxy Carbonyl group, 3-chlorophenyloxycarbonyl group, 3-trifluoromethylphenyloxycarbonyl group, 3-cyanophenyloxycarbonyl group, 3-nitrophenyloxycarbonyl , 4-fluorophenyl oxycarbonyl group, 4-cyanophenyl oxycarbonyl group, and a 4-methoxy phenyloxy carbonyl group can be exemplified.

The heterocyclic group which may have a substituent is preferably an aromatic or aliphatic heterocyclic ring containing a nitrogen atom, an oxygen atom, a sulfur atom or a phosphorus atom.
Specifically, thienyl group, benzo [b] thienyl group, naphtho [2,3-b] thienyl group, thiantenyl group, furyl group, pyranyl group, isobenzofuranyl group, chromenyl group, xanthenyl group, phenoxathiyl Nyl group, 2H-pyrrolyl group, pyrrolyl group, imidazolyl group, pyrazolyl group, pyridyl group, pyrazinyl group, pyrimidinyl group, pyridazinyl group, indolizinyl group, isoindolyl group, 3H-indolyl group, indolyl group, 1H-indazolyl group, purinyl group 4H-quinolidinyl group, isoquinolyl group, quinolyl group, phthalazinyl group, naphthyridinyl group, quinoxanilyl group, quinazolinyl group, cinnolinyl group, pteridinyl group, 4aH-carbazolyl group, carbazolyl group, β-carbolinyl group, phenanthridinyl group, acridinyl Group Midinyl group, phenanthrolinyl group, phenazinyl group, phenalsadinyl group, isothiazolyl group, phenothiazinyl group, isoxazolyl group, furazanyl group, phenoxazinyl group, isochromanyl group, chromanyl group, pyrrolidinyl group, pyrrolinyl group, imidazolidinyl group, imidazolinyl group, pyrazolidinyl group, pyrazolidinyl group Examples include a group, pyrazolinyl group, piperidyl group, piperazinyl group, indolinyl group, isoindolinyl group, quinuclidinyl group, morpholinyl group, and thioxanthryl group.

  Specific examples of the alkylthiocarbonyl group which may have a substituent include a methylthiocarbonyl group, a propylthiocarbonyl group, a butylthiocarbonyl group, a hexylthiocarbonyl group, an octylthiocarbonyl group, a decylthiocarbonyl group, and an octadecylthiocarbonyl group. Examples thereof include a group and a trifluoromethylthiocarbonyl group.

  Specific examples of the arylthiocarbonyl group which may have a substituent include a 1-naphthylthiocarbonyl group, a 2-naphthylthiocarbonyl group, a 4-methylsulfanylphenylthiocarbonyl group, and a 4-phenylsulfanylphenylthiocarbonyl group. 4-dimethylaminophenylthiocarbonyl group, 4-diethylaminophenylthiocarbonyl group, 2-chlorophenylthiocarbonyl group, 2-methylphenylthiocarbonyl group, 2-methoxyphenylthiocarbonyl group, 2-butoxyphenylthiocarbonyl group, 3 -Chlorophenylthiocarbonyl group, 3-trifluoromethylphenylthiocarbonyl group, 3-cyanophenylthiocarbonyl group, 3-nitrophenylthiocarbonyl group, 4-fluorophenylthiocarbonyl group, 4-cyanophenyl Two thiocarbonyl group, and a and a 4-methoxyphenylthiocarbonyl group.

  The monovalent substituent represented by B represents an aryl group, a heterocyclic group, an arylcarbonyl group, or a heterocyclic carbonyl group. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.

Of these, the structures shown below are particularly preferred.
In the following structure, Y, X, and n have the same meanings as Y, X, and n in formula (II), which will be described later, and preferred examples are also the same.

Examples of the divalent organic group represented by A include an alkylene group having 1 to 12 carbon atoms, a cyclohexylene group having 6 to 12 carbon atoms, and an alkynylene group having 2 to 12 carbon atoms. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.
Among them, A is an alkylene substituted with an unsubstituted alkylene group or an alkyl group (for example, a methyl group, an ethyl group, a tert-butyl group, or a dodecyl group) from the viewpoint of increasing sensitivity and suppressing coloration due to heating. Group, alkylene group substituted with alkenyl group (for example, vinyl group, allyl group), aryl group (for example, phenyl group, p-tolyl group, xylyl group, cumenyl group, naphthyl group, anthryl group, phenanthryl group, styryl group) An alkylene group substituted with

The aryl group represented by Ar is preferably an aryl group having 6 to 30 carbon atoms and may have a substituent. Examples of the substituent include the same substituents as those introduced into the substituted aryl group mentioned above as specific examples of the aryl group which may have a substituent.
Among these, a substituted or unsubstituted phenyl group is preferable from the viewpoint of increasing sensitivity and suppressing coloring due to heating.

  In the formula (I), it is preferable in terms of sensitivity that the structure of “SAr” formed by Ar and adjacent S is the following structure. Me represents a methyl group, and Et represents an ethyl group.

  The oxime compound is preferably a compound represented by the following formula (II).

(In formula (II), R and X each independently represent a monovalent substituent, A and Y each independently represent a divalent organic group, Ar represents an aryl group, and n represents 0-5. (It is an integer.)
R, A, and Ar in formula (II) have the same meanings as R, A, and Ar in formula (I), and preferred examples are also the same.

  Examples of the monovalent substituent represented by X include an alkyl group, an aryl group, an alkoxy group, an aryloxy group, an acyloxy group, an acyl group, an alkoxycarbonyl group, an amino group, a heterocyclic group, and a halogen atom. These groups may have one or more substituents. Examples of the substituent include the above-described substituents. Moreover, the substituent mentioned above may be further substituted by another substituent.

Among these, X is preferably an alkyl group from the viewpoints of solvent solubility and improvement in absorption efficiency in the long wavelength region.
Moreover, n in Formula (2) represents the integer of 0-5, and the integer of 0-2 is preferable.

  Examples of the divalent organic group represented by Y include the structures shown below. In the groups shown below, “*” represents a bonding position between Y and an adjacent carbon atom in the formula (II).

  Among these, from the viewpoint of increasing sensitivity, the following structures are preferable.

  Furthermore, the oxime compound is preferably a compound represented by the following formula (III).

(In formula (III), R and X each independently represent a monovalent substituent, A represents a divalent organic group, Ar represents an aryl group, and n is an integer of 0 to 5.)
R, X, A, Ar, and n in the formula (III) are respectively synonymous with R, X, A, Ar, and n in the formula (II), and preferred examples are also the same.

  Specific examples (B-1) to (B-10) of oxime compounds that can be suitably used are shown below, but the present invention is not limited thereto.

  The oxime compound has a maximum absorption wavelength in a wavelength region of 350 nm to 500 nm, preferably has an absorption wavelength in a wavelength region of 360 nm to 480 nm, and particularly preferably has a high absorbance at 365 nm and 405 nm.

The molar extinction coefficient at 365 nm or 405 nm of the oxime compound is preferably 3,000 to 300,000, more preferably 5,000 to 300,000, and more preferably 10,000 to 200,000 from the viewpoint of sensitivity. It is particularly preferred that
For the molar extinction coefficient of the compound, a known method can be used. Specifically, for example, 0.01 g of an ultraviolet-visible spectrophotometer (Varian Inc., Carry-5 spectrphotometer) is used with an ethyl acetate solvent. It is preferable to measure at a concentration of / L.

(Photocationic polymerization initiator)
The cationic photopolymerization initiator may be any compound that generates a substance that initiates cationic photopolymerization by receiving energy rays such as ultraviolet rays, preferably an onium salt, more preferably an aromatic onium salt, and an arylsulfonium. Further preferred are salts and aryliodonium salts.

Specific examples of the onium salt include diphenyliodonium, 4-methoxydiphenyliodonium, bis (4-methylphenyl) iodonium, bis (4-tert-butylphenyl) iodonium, bis (dodecylphenyl) iodonium, triphenylsulfonium, diphenyl- 4-thiophenoxyphenylsulfonium, bis [4- (diphenylsulfonio) -phenyl] sulfide, bis [4- (di (4- (2-hydroxyethyl) phenyl) sulfonio) -phenyl] sulfide, η5-2,4 -(Cyclopentadienyl) [1,2,3,4,5,6-η]-(methylethyl) -benzene] -iron (1+) and the like. Specific examples of anions include tetrafluoroborate (BF ₄ ⁻ ), hexafluorophosphate (PF ₆ ⁻ ), hexafluoroantimonate (SbF ₆ ⁻ ), hexafluoroarsenate (AsF ₆ ⁻ ), hexachloroantimonate (SbCl). ₆ ^-), perchlorate ion (ClO ₄ ^-), trifluoromethanesulfonate ion _(CF 3 SO ₃ ^-), fluorosulfonic acid ion (FSO ₃ ^-), toluenesulfonate ion, trinitrobenzene sulfonate anion, trinitrotoluene Examples include sulfonate anions.

  In particular, specific examples of the aromatic onium salt include aromatic halonium salts described in JP-A-50-151996, JP-A-50-158680, JP-A-50-151997, JP Group VIA aromatic onium salts described in JP-A-52-30899, JP-A-56-55420, JP-A-55-125105, etc., Group VA-aromatics described in JP-A-50-158698, etc. Onium salts, oxosulfoxonium salts described in JP-A-56-8428, JP-A-56-149402, JP-A-57-192429, etc., described in JP-A-49-17040, etc. Aromatic diazonium salts, thiobililium salts, iron / allene complexes, aluminum complexes / photolytic silicon compound systems described in US Pat. No. 4,139,655 Agents, halides that photogenerate a hydrogen halide, o- nitrobenzyl ester compounds, imide sulfonate compound, bissulfonyldiazomethane compounds, mention may be made of an oxime sulfonate compound.

  As the photocationic polymerization initiator that can be used in the present invention, for example, a chemical amplification type photoresist or a compound used for photocationic polymerization can be widely used (edited by Organic Electronics Materials Research Group, “Organization for Imaging”). Materials, "Bunshin Publishing (1993), pages 187-192). These compounds are described in THE CHEMICAL SOCIETY OF JAPAN Voi. 71 no. 11, 1998, as well as the photocationic polymerization initiator described in “Organic Materials for Imaging”, edited by Organic Electronics Materials Study Group, Bunshin Publishing (1993), can be easily synthesized by known methods. .

  Commercially available photocationic polymerization initiators include UVI-6950, UVI-6970, UVI-6974, UVI-6990, UVI-6992 (above, Union Carbide), Adekaoptomer SP-150, SP-151. , SP-170, SP-171, SP-172 (above, manufactured by ADEKA Corporation), Irgacure 261, IRGACURE OXE01, IRGACURE CGI-1397, CGI-1325, CGI-1380, CGI-1311, CGI-263, CGI -268, CGI-1397, CGI-1325, CGI-1380, CGI-1311 (above, manufactured by BASF Japan), CI-2481, CI-2624, CI-2639, CI-2064 (above, Nippon Soda Co., Ltd.) Manufactured), CD-1010, CD-10 11, CD-1012 (above, manufactured by Sartomer), DTS-102, DTS-103, NAT-103, NDS-103, TPS-103, MDS-103, MPI-103, BBI-103 (above, Midori Chemical ( ), PCI-061T, PCI-062T, PCI-020T, PCI-022T (Nippon Kayaku Co., Ltd.), PHOTOINITIATOR 2074 (Rhodia), UR-1104, UR-1105, UR- 1106, UR-1107, UR-1113, UR-1114, UR-1115, UR-1118, UR-1200, UR-1201, UR-1202, UR-1203, UR-1204, UR-1205, UR-1207, UR-1401, UR-1402, UR-1403, UR-M1010, U -M1011, UR-M10112, UR-SAIT01, UR-SAIT02, UR-SAIT03, UR-SAIT04, UR-SAIT05, UR-SAIT06, UR-SAIT07, UR-SAIT08, UR-SAIT09, UR-SAIT10, UR-SAIT11 UR-SAIT12, UR-SAIT13, UR-SAIT14, UR-SAIT15, UR-SAIT16, UR-SAIT22, UR-SAIT30 (above, manufactured by URAY). Among these, UVI-6970, UVI-6974, Adekaoptomer SP-170, SP-171, SP-172, CD-1012 and MPI-103 have higher photocuring sensitivity due to the composition containing them. Can be expressed. Said photocationic polymerization initiator can be used individually by 1 type or in combination of 2 or more types.

  A radical photopolymerization initiator or a cationic photopolymerization initiator may be used alone, or two or more kinds may be freely combined.

  The content of the compound (C) with respect to the total solid content of the photosensitive composition of the present invention is preferably 0.1 to 50% by mass, preferably 0.5 to 20% by mass, and 1 to 5%. More preferably, it is mass%.

[5] (D) Binder whose solubility in alkaline developer is reduced by the action of active species The photosensitive composition of the present invention contains (D) a binder whose solubility in alkaline developer is reduced by the action of active species. To do.
(D) The binder whose solubility in the alkaline developer is reduced by the action of the active species functions as a binder in the film obtained from the photosensitive composition, and in the image area after the exposure process, The solubility is reduced and a function of becoming insoluble or hardly soluble in the alkaline developer is expressed, and in the non-image area, a function that is easily soluble in the alkaline developer is expressed.

The binder (D) is a binder resin (hereinafter also referred to as a developable binder resin) from the viewpoint of not only exhibiting developability with respect to an alkaline developer in an unexposed portion but also dispersing hollow or porous particles in the film. It is preferable.
The developable binder resin is not particularly limited as long as the resin is alkali-soluble and has reduced solubility in an alkaline developer by the action of active species, such as heat resistance, developability, curability, and availability. It is preferably selected from the viewpoint. Here, “alkali-soluble” includes not only being soluble in an alkali developer but also exhibiting swellability in an alkali developer.

That is, in the photosensitive composition of the present invention, the developable binder resin is used not only for improving the film forming property but also for obtaining developability for an alkaline developer.
Such a developable binder resin is preferably a binder resin having an alkali-soluble group.

Examples of the alkali-soluble group include an acid group, an alcoholic hydroxyl group, a pyrrolidone group, and an alkylene oxide group, and an acid group is more preferable.
The acid group is not particularly limited, and examples thereof include a carboxyl group, an active methylene group, a phosphoric acid group, a sulfonic acid group, a phenolic hydroxyl group, and a carboxylic acid anhydride group. A carboxyl group and an active methylene group are preferable, and An acid group is more preferable. These acid groups may be used alone or in combination of two or more. In order to introduce an acid group into the binder resin, for example, a monomer having an acid group and / or a monomer capable of imparting an acid group after polymerization (hereinafter sometimes referred to as “monomer for introducing an acid group”). ) As a monomer component.
In addition, when introducing an acid group using a monomer capable of imparting an acid group after polymerization as a monomer component, for example, a treatment for imparting an acid group as described later is required after the polymerization.
Examples of the monomer having an acid group include a monomer having a carboxyl group such as (meth) acrylic acid and itaconic acid, a monomer having a phenolic hydroxyl group such as N-hydroxyphenylmaleimide, maleic anhydride, and itaconic anhydride. Although the monomer etc. which have a carboxylic anhydride group are mentioned, Especially, (meth) acrylic acid is preferable among these.
Examples of the monomer capable of imparting an acid group after the polymerization include a monomer having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, a monomer having an epoxy group such as glycidyl (meth) acrylate, and 2-isocyanatoethyl (meta ) Monomers having an isocyanate group such as acrylate. These monomers for introducing an acid group may be only one type or two or more types.
In the case of using a monomer capable of imparting an acid group after polymerization, the treatment for imparting the acid group after polymerization includes a treatment of modifying a part of the polar group of the polymer side chain by a polymer reaction.

  The developable binder resin is preferably a linear organic high molecular polymer. As such a “linear organic high molecular polymer”, in order to enable alkali development of a film obtained from the photosensitive composition of the present invention, first, an alkaline developer (typically weak alkaline water) is used. A linear organic high molecular weight polymer is selected which is soluble or swellable.

  Examples of such linear organic high molecular polymers include polymers having a carboxylic acid in the side chain, such as JP-A-59-44615, JP-B-54-34327, JP-B-58-12577, and JP-B-54-. No. 25957, JP-A-59-53836, JP-A-59-71048, methacrylic acid copolymer, acrylic acid copolymer, itaconic acid copolymer, crotonic acid copolymer, etc. Examples thereof include polymers, maleic acid copolymers, partially esterified maleic acid copolymers, and acidic cellulose derivatives having a carboxylic acid in the side chain are also useful. Moreover, as a linear organic high molecular polymer, the polymer as described in paragraph number [0227]-[0234] paragraph of Unexamined-Japanese-Patent No. 2008-292970 is mentioned.

  The linear organic polymer can be obtained by radical polymerization or cationic polymerization of a polymerizable monomer as shown below by a conventionally known method.

Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, 4-carboxylstyrene, and the monomer having an acid anhydride includes maleic anhydride. Is mentioned.
Moreover, as a developable binder resin, an acidic cellulose derivative having a carboxylic acid group in the side chain can also be used. In addition, those obtained by adding a cyclic acid anhydride to a polymer having a hydroxyl group are useful.

  As described above, when the linear organic high molecular weight polymer is a copolymer, the following monomers (1) to (12) are copolymerized with the monomer having a carboxyl group or the monomer having an acid anhydride. ).

  (1) 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate Acrylic acid esters and methacrylic acid esters having an aliphatic hydroxyl group such as

  (2) Methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, isobutyl acrylate, amyl acrylate, hexyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, benzyl acrylate, acrylic acid-2- Alkyl acrylates such as chloroethyl, glycidyl acrylate, 3,4-epoxycyclohexylmethyl acrylate, vinyl acrylate, 2-phenylvinyl acrylate, 1-propenyl acrylate, allyl acrylate, 2-allyloxyethyl acrylate, propargyl acrylate;

  (3) Methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, amyl methacrylate, methacryl Acid hexyl, 2-ethylhexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, 2-chloroethyl methacrylate, glycidyl methacrylate, 3,4-epoxycyclohexyl methyl methacrylate, vinyl methacrylate, 2-phenylvinyl methacrylate, 1-propenyl methacrylate, Alkyl methacrylates such as allyl methacrylate, 2-allyloxyethyl methacrylate, and propargyl methacrylate;

  (4) Acrylamide, methacrylamide, N-methylolacrylamide, N-ethylacrylamide, N-hexylmethacrylamide, N-cyclohexylacrylamide, N-hydroxyethylacrylamide, N-phenylacrylamide, N-nitrophenylacrylamide, N-ethyl- Acrylamide or methacrylamide such as N-phenylacrylamide, vinylacrylamide, vinylmethacrylamide, N, N-diallylacrylamide, N, N-diallylmethacrylamide, allylacrylamide, allylmethacrylamide.

  (5) Vinyl ethers such as ethyl vinyl ether, 2-chloroethyl vinyl ether, hydroxyethyl vinyl ether, propyl vinyl ether, butyl vinyl ether, octyl vinyl ether, and phenyl vinyl ether.

  (6) Vinyl esters such as vinyl acetate, vinyl chloroacetate, vinyl butyrate and vinyl benzoate.

  (7) Styrenes such as styrene, α-methylstyrene, methylstyrene, chloromethylstyrene, and p-acetoxystyrene.

  (8) Vinyl ketones such as methyl vinyl ketone, ethyl vinyl ketone, propyl vinyl ketone, and phenyl vinyl ketone.

  (9) Olefins such as ethylene, propylene, isobutylene, butadiene, and isoprene.

  (10) N-vinylpyrrolidone, acrylonitrile, methacrylonitrile and the like.

  (11) Unsaturated imides such as maleimide, N-acryloylacrylamide, N-acetylmethacrylamide, N-propionylmethacrylamide, N- (p-chlorobenzoyl) methacrylamide.

  (12) Methacrylic acid monomers having a hetero atom bonded to the α-position, for example, compounds described in JP-A No. 2002-309057, JP-A No. 2002-311569 and the like can be mentioned.

Among these, alkali-soluble resins having an amide group in the side chain described in JP-A No. 2001-242612 are preferable because of excellent balance of film strength, sensitivity, and developability.
In addition, Japanese Patent Publication No. 7-2004, Japanese Patent Publication No. 7-120041, Japanese Patent Publication No. 7-120042, Japanese Patent Publication No. 8-12424, Japanese Patent Laid-Open No. 63-287944, Japanese Patent Laid-Open No. 63-287947, Japanese Patent Laid-Open No. Urethane binder polymers containing acid groups described in No. 271741, JP-A-11-352691 and the like, and urethane binder polymers having acid groups and double bonds in side chains as described in JP-A No. 2002-107918 are It is preferable because of its excellent strength.

  In addition, the acetal-modified polyvinyl alcohol-based binder polymer having an acid group described in European Patent No. 993966, European Patent No. 1204000, and Japanese Patent Application Laid-Open No. 2001-318463 has an excellent balance of film strength and developability. It is preferable.

In addition, polyvinyl pyrrolidone, polyethylene oxide, and the like are useful as the water-soluble linear organic polymer.
In order to increase the strength of the cured film, alcohol-soluble nylon, polyether of 2,2-bis- (4-hydroxyphenyl) -propane and epichlorohydrin, and the like are also useful.

  Among the above, (meth) acrylic resins having an allyl group, a vinyl ester group, and a carboxyl group in the side chain, and side chains described in JP-A Nos. 2000-187322 and 2002-62698. Since the double bond functions as a polymerizable group, the alkali-soluble resin having a double bond is preferable as the developing binder resin in the present invention, as will be described later.

  These binder resins may be random polymers, block polymers, graft polymers or the like.

The binder resin as described above can be synthesized by a conventionally known method.
Examples of the solvent used in the synthesis include tetrahydrofuran, ethylene dichloride, cyclohexanone, methyl ethyl ketone, acetone, methanol, ethanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether acetate, 2-methoxyethyl acetate, Diethylene glycol dimethyl ether, 1-methoxy-2-propanol, 1-methoxy-2-propyl acetate, N, N-dimethylformamide, N, N-dimethylacetamide, toluene, ethyl acetate, methyl lactate, ethyl lactate, dimethyl sulfoxide, water, etc. Is mentioned.
These solvents are used alone or in combination of two or more.

The radical polymerization initiator used for synthesizing the binder resin includes benzoyl peroxide, cumene hydroperoxide, t-butyl hydroperoxide, diisopropyl peroxycarbonate, di-t-butyl peroxide, and t-butyl peroxide. Examples thereof include organic peroxides such as oxybenzoate and azo compounds such as 2,2′-azobisisobutyronitrile.
These radical polymerization initiators are preferably used in an amount of 1 to 20 parts by mass with respect to 100 parts by mass of the monomer.

  In addition to the above, the alkali-soluble linear organic high molecular polymer that is a premise of the developable binder resin in the present invention includes a polymer having a hydroxyl group added with an acid anhydride, a polyhydroxystyrene resin, and the like. Polysiloxane resins, poly (2-hydroxyethyl (meth) acrylate), polyvinyl pyrrolidone, polyethylene oxide, polyvinyl alcohol, and the like are also useful. Further, such a linear organic polymer may be a copolymer of hydrophilic monomers. Examples include alkoxyalkyl (meth) acrylate, hydroxyalkyl (meth) acrylate, glycerol (meth) acrylate, (meth) acrylamide, N-methylol acrylamide, secondary or tertiary alkyl acrylamide, dialkylaminoalkyl (meth). Acrylate, morpholine (meth) acrylate, N-vinylpyrrolidone, N-vinylcaprolactam, vinylimidazole, vinyltriazole, methyl (meth) acrylate, ethyl (meth) acrylate, branched or linear propyl (meth) acrylate, branched or straight Examples include butyl (meth) acrylate of a chain, phenoxyhydroxypropyl (meth) acrylate, and the like. Other hydrophilic monomers include tetrahydrofurfuryl group, phosphoric acid group, phosphoric ester group, quaternary ammonium base, ethyleneoxy chain, propyleneoxy chain, sulfonic acid group and groups derived from salts thereof, morpholinoethyl group, etc. Monomers comprising it are also useful.

  Among these various alkali-soluble binder resins, from the viewpoint of heat resistance, polyhydroxystyrene resins, polysiloxane resins, acrylic resins, acrylamide resins, and acrylic / acrylamide copolymer resins are preferable. From the viewpoint, acrylic resins, acrylamide resins, and acrylic / acrylamide copolymer resins are preferable.

  Examples of the acrylic resin include a copolymer made of a monomer selected from benzyl (meth) acrylate, (meth) acrylic acid, hydroxyethyl (meth) acrylate, (meth) acrylamide, and the like, and a commercially available KS resist 106 ( Osaka Organic Chemical Industry Co., Ltd.) and Cyclomer P Series (Daicel Chemical Industries, Ltd.) are preferred.

  In the present invention, the developable binder resin may or may not have a polymerizable group. However, in order to further reduce the solubility of the resin in an alkaline developer by the action of the active species, the polymerizable binder resin may have a polymerizable group. It preferably has a group.

  Although it does not restrict | limit especially as a polymeric group, An unsaturated group (unsaturated double bond etc.), an epoxy group, an oxetane group etc. can be mentioned, It is preferable that it is an unsaturated group.

  In order to introduce a polymerizable group into the binder resin, for example, the above-described alkali-soluble binder resin is polymerized using a monomer capable of adding a polymerizable group after polymerization, and the polymerizable group is added after polymerization. This can be done by applying a process to do this.

  Examples of the alkali-soluble binder resin having a polymerizable group include carboxyl group-containing resins, glycidyl group-containing unsaturated compounds such as glycidyl (meth) acrylate and allyl glycidyl ether, allyl alcohol, 2-hydroxyacrylate, and 2-hydroxy. Resin obtained by reacting unsaturated alcohol such as methacrylate, carboxyl group-containing resin having hydroxyl group, free isocyanate group-containing unsaturated compound, resin obtained by reacting unsaturated acid anhydride, addition of epoxy resin and unsaturated carboxylic acid Resins obtained by reacting polybasic acid anhydrides with reactants, resins obtained by reacting hydroxyl-containing polymerizable monomers with addition reaction products of conjugated diene copolymers and unsaturated dicarboxylic acid anhydrides, and elimination by base treatment Synthesizing a resin having a specific functional group that gives rise to an unsaturated group by causing a reaction; It was generated unsaturated groups by applying resin to the base treatment resins Typical resins.

  Among them, a resin obtained by reacting a carboxyl group-containing resin with a glycidyl group-containing unsaturated compound such as glycidyl (meth) acrylate or allyl glycidyl ether, or a resin obtained by polymerizing a hydroxyl group-containing (meth) acrylic acid ester compound ( ) Resins obtained by reacting (meth) acrylic acid esters having a free isocyanate group such as acrylic acid-2-isocyanatoethyl, resins having structural units represented by the above general formulas (5) to (7), and base treatment By synthesizing a resin having a specific functional group that gives rise to an unsaturated group by elimination reaction, and by subjecting the resin to a base treatment, a resin that has generated an unsaturated group while maintaining an alkali-soluble group is more preferable.

  The alkali-soluble binder resin having a polymerizable group preferably contains at least one selected from structural units represented by any one of the general formulas (5) to (7).

  In order to improve the crosslinking efficiency, the developable binder resin may have a cationic polymerizable group in the side chain as a polymerizable group, for example, a polymer containing an epoxy group, an oxetane group or the like in the side chain. Useful.

  In order to introduce an epoxy group into an alkali-soluble binder resin, for example, a monomer having an epoxy group (hereinafter also referred to as “monomer for introducing an epoxy group”) is polymerized as a monomer component. do it. Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o- (or m-, or p-) vinylbenzyl glycidyl ether, and the like. These monomers for introducing an epoxy group may be only one type or two or more types. When the monomer component in obtaining the alkali-soluble binder resin also includes a monomer for introducing the epoxy group, the content ratio is not particularly limited, but is 5 to 70 mass in the total monomer components. %, Preferably 10 to 60% by mass.

The binder resin having an alkali-soluble group as a preferred form of the developable binder resin in the present invention has been described above. When the alkali-soluble group is an acid group, the acid value of the developable binder resin is 20 to 300 mgKOH / g is preferable, 40 to 200 mgKOH / g is more preferable, and 50 to 160 mgKOH / g is particularly preferable. When the acid value is within this range, the development residue is less likely to remain during pattern formation, and the coating uniformity is further improved.
Further, when the developable binder resin has a polymerizable group, and the polymerizable group is an unsaturated group, from the viewpoint of improving photosensitivity, the unsaturation value of the developable binder resin is 0.5 mmol / g. The above is preferable, more preferably 0.7 mmol / g or more, and most preferably 1.0 mmol / g or more.
Here, the unsaturated value means the number of millimole of unsaturated bond per 1 g of binder resin.
By setting the unsaturated equivalent of the developable binder resin to 0.5 mmol / g or more, that is, by increasing the number of unsaturated double bonds in the resin, photopolymerization and sensitivity are improved. By improving the polymerizability, adhesion to a solid surface such as a support and immobilization of hollow or porous particles contained are also improved. As a result, there are few defects in the hollow or porous particles in the pattern film during development, A pattern having a tapered or rectangular cross-sectional shape tends to be obtained, which is preferable.

  The developable binder resin in the present invention may have a cyano group, and specifically may have a repeating unit containing a cyano group. In this case, the developable binder resin preferably has a repeating unit containing a cyano group represented by the following general formula (III).

In general formula (III):
R _c31 represents a hydrogen atom, an alkyl group, a cyano group, or a —CH ₂ —O—Rac ₂ group. In the formula, Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group.
R _c32 represents a group having an alkyl group, a cycloalkyl group, an alkenyl group, or a cycloalkenyl group. These groups may be substituted with a cyano group.
However, at least one of R _c31 and R _c32 contains a cyano group.
L _c3 represents a single bond or a divalent linking group.

In general formula (III), the alkyl group represented by R _c32 is preferably a linear or branched alkyl group having 3 to 20 carbon atoms.
The cycloalkyl group is preferably a cycloalkyl group having 3 to 20 carbon atoms.
The alkenyl group is preferably an alkenyl group having 3 to 20 carbon atoms.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms.
R _c32 is preferably an unsubstituted alkyl group.
The divalent linking group of L _c3 is preferably an alkylene group (preferably having 1 to 5 carbon atoms), an oxy group, or an ester bond (a group represented by —COO—).

  The repeating unit represented by the general formula (III) is preferably a repeating unit represented by the following general formula (CIII-1).

In general formula (CIII-1), R ₅ represents a hydrocarbon group. R _{c 31} has the same meaning as _{R c 31} of the general formula (III). However, at least one of R _c31 and R ₅ contains a cyano group.

Examples of the hydrocarbon group for R ₅ include a chain or cyclic structure. Specific examples in the case of having a cyclic structure include a monocyclic or polycyclic cycloalkyl group (preferably having 3 to 12 carbon atoms, more preferably 3 to 7 carbon atoms), a monocyclic or polycyclic cycloalkenyl group (carbon number). 3 to 12 are preferable), more preferably 6 to 12 carbon atoms, and an aralkyl group (preferably 7 to 20 carbon atoms, more preferably 7 to 12 carbon atoms).

The cycloalkyl group includes a ring assembly hydrocarbon group and a bridged cyclic hydrocarbon group. The bridged cyclic hydrocarbon ring includes a bicyclic hydrocarbon ring, a tricyclic hydrocarbon ring, and a tetracyclic hydrocarbon ring. Etc. The bridged cyclic hydrocarbon ring also includes, for example, a condensed ring in which a plurality of 5- to 8-membered cycloalkane rings are condensed.
Preferred examples of the bridged cyclic hydrocarbon ring include a norbornyl group, an adamantyl group, a bicyclooctanyl group, a tricyclo [5,2,1,0 ^2,6 ] decanyl group, and the like. More preferable examples of the bridged cyclic hydrocarbon ring include a norbornyl group and an adamantyl group.

  These hydrocarbon groups may have a substituent, and preferred substituents include bromine atom, chlorine atom, alkyl group, hydroxyl group substituted with hydrogen atom, amino group substituted with hydrogen atom, cyano Groups. Preferred alkyl groups include methyl, ethyl, butyl and t-butyl groups. The above alkyl group may further have a substituent, and the substituent that may further have a bromine atom, a chlorine atom, an alkyl group, a hydroxyl group substituted with a hydrogen atom, or a hydrogen atom substituted An amino group formed can be mentioned.

  Examples of the substituent for the hydrogen atom include an alkyl group, a cycloalkyl group, an aralkyl group, a substituted methyl group, a substituted ethyl group, an alkoxycarbonyl group, and an aralkyloxycarbonyl group. Preferred alkyl groups include alkyl groups having 1 to 4 carbon atoms, preferred substituted methyl groups include methoxymethyl, methoxythiomethyl, benzyloxymethyl, t-butoxymethyl, 2-methoxyethoxymethyl groups, and preferred substituted ethyl groups. 1-ethoxyethyl, 1-methyl-1-methoxyethyl, preferred acyl groups include formyl, acetyl, propionyl, butyryl, isobutyryl, valeryl, pivaloyl groups, etc., aliphatic acyl groups having 1 to 6 carbon atoms, alkoxycarbonyl Examples of the group include an alkoxycarbonyl group having 1 to 4 carbon atoms.

Specific examples of the repeating unit containing a cyano group represented by the general formula (III) are shown below, but are not limited thereto (in the specific examples, Ra is a hydrogen atom, an alkyl group, cyano A group or —CH ₂ —O—Rac ₂ group, wherein Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group.

  The content of the repeating unit containing a cyano group is preferably from 10 to 80 mol%, more preferably from 10 to 60 mol%, based on all repeating units of the developing binder resin.

  The developable binder resin may be a resin obtained by using a compound represented by the following general formula (E-1) (hereinafter sometimes referred to as “ether dimer”) as a copolymer. .

In formula (E-1), R ¹ and R ² each independently represent a hydrogen atom or a hydrocarbon group. The hydrocarbon group as R ₁ and R ₂ is preferably a hydrocarbon group having 1 to 15 carbon atoms, and may further have a substituent.

The photosensitive composition of the present invention contains a resin obtained by using the compound represented by the general formula (E-1) as a copolymer, thereby forming a cured coating formed using the composition. The heat resistance and transparency of the film are further improved.
In the general formula (E-1) representing the ether dimer, the hydrocarbon group represented by R ¹ and R ² is not particularly limited, and examples thereof include a methyl group, an ethyl group, an n-propyl group, and isopropyl. A linear or branched alkyl group such as a group, n-butyl group, isobutyl group, t-butyl group, t-amyl group, stearyl group, lauryl group, 2-ethylhexyl group; an aryl group such as a phenyl group; An alicyclic group such as cyclohexyl group, t-butylcyclohexyl group, dicyclopentadienyl group, tricyclodecanyl group, isobornyl group, adamantyl group, 2-methyl-2-adamantyl group, etc .; 1-methoxyethyl group, An alkyl group substituted with alkoxy such as 1-ethoxyethyl group; an alkyl group substituted with aryl group such as benzyl; and the like.
Among these, a group containing a primary or secondary carbon which is difficult to be removed by an acid or heat, such as a methyl group, an ethyl group, a cyclohexyl group, or a benzyl group, is particularly preferable in terms of heat resistance.
Note that R ¹ and R ² may be the same type of substituents or different substituents.

  Specific examples of the ether dimer include dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, (N-propyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (isopropyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (n-butyl) ) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (isobutyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (t-butyl) -2, 2 ′-[oxybis (methylene)] bis-2-propenoate, di (t-amyl) -2,2 ′-[oxybis (methylene)] bis-2-propeno , Di (stearyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (lauryl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (2 -Ethylhexyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (1-methoxyethyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (1- Ethoxyethyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diphenyl-2,2 ′-[oxybis ( Methylene)] bis-2-propenoate, dicyclohexyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (t- Tilcyclohexyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (dicyclopentadienyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (tri Cyclodecanyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, di (isobornyl) -2,2 ′-[oxybis (methylene)] bis-2-propenoate, diadamantyl-2,2 Examples include '-[oxybis (methylene)] bis-2-propenoate and di (2-methyl-2-adamantyl) -2,2'-[oxybis (methylene)] bis-2-propenoate. Among these, dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, dicyclohexyl-2,2′- [Oxybis (methylene)] bis-2-propenoate and dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate are preferred. These ether dimers may be only one kind or two or more kinds.

  The content of the repeating unit corresponding to the compound represented by the general formula (E-1) is preferably 20 to 90 mol%, and preferably 30 to 60 mol% with respect to all the repeating units of the developing binder resin. More preferably.

As described above, the developable binder resin as the binder whose solubility in the alkaline developer is reduced by the action of the active species has been described. The mass average molecular weight (polystyrene equivalent value measured by the GPC method) of the developable binder resin is 1000. preferably from to 2 × 10 ^5, more preferably in a 2000-1 × 10 ^5, and particularly preferably 5000 to 5 × 10 ^4.

  The developing binder resin is preferably 1% by mass to 50% by mass, more preferably 2% by mass to 40% by mass, and more preferably 3% by mass to 30% by mass with respect to the total solid content of the photosensitive composition of the present invention. Particularly preferred.

  The binder (D) and the particle dispersant (B) may be different or the same, but when the binder (D) and the particle dispersant (B) are the same (for example, In the case where the particle dispersant (B) further has a polymerizable group and becomes an alkali-soluble binder resin having the polymerizable group described above), the content of the component is the total of the photosensitive composition of the present invention. 5 mass%-80 mass% are preferable with respect to solid content, 10 mass%-80 mass% are still more preferable, 15 mass%-70 mass% are the most preferable.

  The developing binder resin preferably has a refractive index of 1.55 or less, more preferably 1.50 or less, and most preferably 1.48 or less. Thereby, the refractive index of the pattern obtained can be reduced more reliably.

  Specific examples of the developable binder resin include the following binder resins (C-1) to (C-7), but the present invention is not particularly limited thereto. The numerical value shown in each unit represents each unit molar fraction in the resin molecule.

Moreover, as another form of a binder (D), the form containing a polymeric compound can also be mentioned.
In this case, the binder (D) contains an alkali-soluble binder resin in addition to the polymerizable compound so that the binder (D) exhibits a function of reducing the solubility in an alkali developer by the action of the active species. Alternatively, (ii) the polymerizable compound contained in the binder is preferably a polymerizable compound having an alkali-soluble group.

  Examples of the polymerizable compound include addition polymerizable compounds having at least one ethylenically unsaturated double bond. Specifically, it is selected from compounds having at least one terminal ethylenically unsaturated bond, preferably two or more. Such a compound group is widely known in the industrial field, and these can be used without particular limitation in the present invention. These may be any of chemical forms such as monomers, prepolymers, that is, dimers, trimers and oligomers, or mixtures thereof, and (co) polymers thereof. Is preferably a low molecular compound having a molecular weight of 2000 or less, more preferably a low molecular compound having a molecular weight of 1500 or less, and still more preferably a low molecular compound having a molecular weight of 900 or less. Here, the low molecular weight compound in the present invention refers to a compound having an unsaturated bond (so-called polymerizable monomer) by cleaving the unsaturated bond using an initiator and growing the bond in a chain manner. It is not a so-called polymer or oligomer obtained, but a compound having a constant molecular weight of 2000 or less (more preferably 1500 or less, more preferably 900 or less) (a compound having substantially no molecular weight distribution). The molecular weight is usually 100 or more.

Examples of monomers and their (co) polymers include unsaturated carboxylic acids (eg, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters thereof, amides, and these (Co) polymers, preferably esters of unsaturated carboxylic acids and aliphatic polyhydric alcohol compounds, amides of unsaturated carboxylic acids and aliphatic polyhydric amine compounds, and their (co) It is a polymer. Also, addition reaction products of monofunctional or polyfunctional isocyanates or epoxies with unsaturated carboxylic acid esters or amides having a nucleophilic substituent such as hydroxyl group, amino group, mercapto group, monofunctional or polyfunctional. A dehydration condensation reaction product with a functional carboxylic acid is also preferably used. Further, an addition reaction product of an unsaturated carboxylic acid ester or amide having an electrophilic substituent such as an isocyanate group or an epoxy group with a monofunctional or polyfunctional alcohol, amine or thiol, and further a halogen group A substitution reaction product of an unsaturated carboxylic acid ester or amide having a detachable substituent such as a tosyloxy group and a monofunctional or polyfunctional alcohol, amine or thiol is also suitable. As another example, it is also possible to use a group of compounds substituted with unsaturated phosphonic acid, styrene, vinyl ether or the like instead of the unsaturated carboxylic acid.
As these specific compounds, the compounds described in paragraphs 0095 to 0108 of JP-A-2009-288705 can also be suitably used in the present invention.

  Methacrylic acid esters include tetramethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, ethylene glycol dimethacrylate, 1,3-butanediol dimethacrylate, Hexanediol dimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol dimethacrylate, dipentaerythritol hexamethacrylate, sorbitol trimethacrylate, sorbitol tetramethacrylate, bis [p- (3-methacryloxy- 2-hydroxypro ) Phenyl] dimethyl methane, bis - [p- (methacryloxyethoxy) phenyl] dimethyl methane, and their EO-modified product, PO-modified products thereof.

  Itaconic acid esters include ethylene glycol diitaconate, propylene glycol diitaconate, 1,3-butanediol diitaconate, 1,4-butanediol diitaconate, tetramethylene glycol diitaconate, pentaerythritol diitaconate And sorbitol tetritaconate. Examples of crotonic acid esters include ethylene glycol dicrotonate, tetramethylene glycol dicrotonate, pentaerythritol dicrotonate, and sorbitol tetradicrotonate. Examples of isocrotonic acid esters include ethylene glycol diisocrotonate, pentaerythritol diisocrotonate, and sorbitol tetraisocrotonate. Examples of maleic acid esters include ethylene glycol dimaleate, triethylene glycol dimaleate, pentaerythritol dimaleate, and sorbitol tetramaleate.

  Examples of other esters include aliphatic alcohol esters described in JP-B-51-47334 and JP-A-57-196231, JP-A-59-5240, JP-A-59-5241, and JP-A-2-226149. Those having the aromatic skeleton described above and those having an amino group described in JP-A-1-165613 are also preferably used. Furthermore, the ester monomers described above can also be used as a mixture.

  Specific examples of amide monomers of aliphatic polyvalent amine compounds and unsaturated carboxylic acids include methylene bis-acrylamide, methylene bis-methacrylamide, 1,6-hexamethylene bis-acrylamide, 1,6-hexamethylene bis. -Methacrylamide, diethylenetriamine trisacrylamide, xylylene bisacrylamide, xylylene bismethacrylamide and the like. Examples of other preferable amide monomers include those having a cyclohexylene structure described in JP-B-54-21726.

  In addition, urethane-based addition polymerizable compounds produced by using an addition reaction of isocyanate and hydroxyl group are also suitable, and specific examples thereof include, for example, one molecule described in JP-B-48-41708. A vinyl urethane containing two or more polymerizable vinyl groups in one molecule obtained by adding a vinyl monomer containing a hydroxyl group represented by the following general formula (E) to a polyisocyanate compound having two or more isocyanate groups. Compounds and the like.

^{_{CH 2 = C (R 4)}} COOCH 2 CH (R 5) OH (E)
(However, R ⁴ and R ⁵ each independently represent H or CH _3. )

  Also, urethane acrylates such as those described in JP-A-51-37193, JP-B-2-32293, and JP-B-2-16765, JP-B-58-49860, JP-B-56-17654, Urethane compounds having an ethylene oxide skeleton described in JP-B-62-39417 and JP-B-62-39418 are also suitable. Further, by using addition polymerizable compounds having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-1-105238, It is possible to obtain a curable composition having a very high photosensitive speed.

  Other examples include polyester acrylates, epoxy resins and (meth) acrylic acid as described in JP-A-48-64183, JP-B-49-43191, JP-B-52-30490, and JP-A-52-30490. Mention may be made of polyfunctional acrylates and methacrylates such as reacted epoxy acrylates. Further, specific unsaturated compounds described in JP-B-46-43946, JP-B-1-40337 and JP-B-1-40336, vinylphosphonic acid compounds described in JP-A-2-25493, and the like can also be mentioned. . In some cases, a structure containing a perfluoroalkyl group described in JP-A-61-22048 is preferably used. Furthermore, Journal of Japan Adhesion Association vol. 20, no. 7, pages 300 to 308 (1984), which are introduced as photocurable monomers and oligomers, can also be used.

  In the present invention, from the viewpoint of curing sensitivity, it preferably contains two or more ethylenically unsaturated bonds, and more preferably contains three or more. Especially, it is preferable to contain 2 or more (meth) acrylic acid ester structures, it is more preferable to contain 3 or more, and it is most preferable to contain 4 or more. Furthermore, it is preferable to contain an EO modified body from the viewpoint of curing sensitivity and developability of the unexposed area. Moreover, it is preferable to contain a urethane bond from a viewpoint of hardening sensitivity and exposure part intensity | strength.

  From the above viewpoint, bisphenol A diacrylate, bisphenol A diacrylate EO modified product, trimethylolpropane triacrylate, trimethylolpropane tri (acryloyloxypropyl) ether, trimethylolethane triacrylate, tetraethylene glycol diacrylate, pentaerythritol diacrylate Acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, sorbitol triacrylate, sorbitol tetraacrylate, sorbitol pentaacrylate, sorbitol hexaacrylate, tri (acryloyloxy D (I) Isocyanurate, pentaerythritol tetraacrylate EO modified product, dipentaerythritol hexaacrylate EO modified product, etc. are mentioned as preferable ones. Also, as commercially available products, urethane oligomer UAS-10, UAB-140 (Sanyo Kokusaku Pulp Co., Ltd.) Made), DPHA-40H (made by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600 (made by Kyoeisha).

  Among them, bisphenol A diacrylate EO modified, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tri (acryloyloxyethyl) isocyanurate, pentaerythritol tetraacrylate EO modified, di Examples of commercially available modified products such as pentaerythritol hexaacrylate EO include DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600 ( Kyoeisha) is more preferable.

  In addition, ethylenically unsaturated compounds having an acid group are also suitable. Examples of commercially available products include TO-756, which is a carboxyl group-containing trifunctional acrylate manufactured by Toagosei Co., Ltd., and a carboxyl group-containing pentafunctional acrylate. Some TO-1382 and the like can be mentioned.

  The polymerizable compound is also preferably a compound having at least one addition-polymerizable ethylene group and having an ethylenically unsaturated group having a boiling point of 100 ° C. or higher under normal pressure. Examples include monofunctional acrylates and methacrylates such as polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, and phenoxyethyl (meth) acrylate; polyethylene glycol di (meth) acrylate, trimethylolethanetri (Meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, hexanediol (Meth) acrylate, trimethylolpropane tri (acryloyloxypropyl) ether, tri (acryloyloxyethyl) iso Polyfunctional alcohols such as anurate, glycerin and trimethylolethane, which are added with ethylene oxide or propylene oxide and then (meth) acrylated, Japanese Patent Publication No. 48-41708, Japanese Patent Publication No. 50-6034, Japanese Patent Publication No. 51- Urethane acrylates as described in JP-B-37193, polyester acrylates and epoxy resins described in JP-A-48-64183, JP-B-49-43191 and JP-B-52-30490 Mention may be made of polyfunctional acrylates and methacrylates such as epoxy acrylates, which are reaction products with (meth) acrylic acid, and mixtures thereof.

  In addition to the above, radically polymerizable monomers represented by the following general formulas (MO-1) to (MO-5) can also be suitably used. In the formula, when T is an oxyalkylene group, the terminal on the carbon atom side is bonded to R.

In the said general formula, n is 0-14 and m is 1-8. A plurality of R and T present in one molecule may be the same or different.
However, in each of the radical polymerizable monomers represented by the general formulas (MO-1) to (MO-5), at least one of the plurality of Rs is —OC (═O) CH═CH ₂ , or a group represented by _{-OC (= O) C (CH} 3) = CH 2.

When the polymerizable compound is a polymerizable compound having an alkali-soluble group (that is, in the case of the above form (ii)), when a plurality of n are all 0, at least one of the plurality of Rs is —OC A group represented by (═O) (CH ₂ ) _m COOH, —OC (═O) NH (CH ₂ ) _m COOH, or —OH is represented.
Further, when the polymerizable compound is a polymerizable compound having an alkali-soluble group, when at least one of a plurality of n is 1 or more,
At least one of (A) a plurality of R _{may, -OC (= O) (CH} 2) m COOH, -OC (= O) NH (CH 2) m COOH, or a group represented by -OH Represent and
(B) at least one of the one or more T _{is, -OCH 2 -, - OCH 2} CH 2 -, - OCH 2 CH 2 CH 2 -, _{or, -OCH 2 CH 2 CH 2 CH} 2 - represents a Satisfy one of the conditions.

  Specific examples of the radical polymerizable monomer represented by the above general formulas (MO-1) to (MO-5) include compounds described in paragraph numbers 0248 to 0251 of JP2007-26979A. Can also be suitably used in the present invention.

  About these polymeric compounds, the details of usage methods, such as the structure, single use, combined use, and addition amount, can be arbitrarily set according to the final performance design of the photosensitive composition. For example, from the viewpoint of sensitivity, a structure having a high unsaturated group content per molecule is preferable, and in many cases, a bifunctional or higher functionality is preferable. Also, from the viewpoint of increasing the strength of the film, those having three or more functionalities are preferable, and those having different functional numbers and different polymerizable groups (for example, acrylic ester, methacrylic ester, styrene compound, vinyl ether compound) are used in combination. Thus, a method of adjusting both sensitivity and intensity is also effective. Furthermore, it is preferable from the viewpoint that the developability of the photosensitive composition can be adjusted and an excellent pattern forming ability can be obtained by using a trifunctional or higher functional polymerizable compound having a different ethylene oxide chain length. In addition, the selection and use method of the polymerizable compound is also an important factor for the compatibility and dispersibility with other components (for example, photopolymerization initiator, binder polymer, etc.) that can be contained in the photosensitive composition. For example, the compatibility may be improved by using a low-purity compound or using two or more kinds in combination. In addition, a specific structure may be selected from the viewpoint of improving adhesion to a hard surface such as a support.

Only 1 type may be used for a polymeric compound and it may use 2 or more types together.
In the form in which the binder (D) contains a polymerizable compound, the content of the polymerizable compound is preferably in the range of 4 to 80% by mass with respect to the total solid content of the photosensitive composition of the present invention. More preferably, it is in the range of 7 to 50% by mass. In particular, when the film thickness is 0.8 μm or less, the addition amount is preferably 7 to 40% by mass in the total solid content, and particularly effective in the range of 6 to 30% by mass.

When the binder (D) is in a form containing a polymerizable compound, and particularly when the polymerizable compound does not have an alkali-soluble group, as described in the above form (i), the binder (D) is an active species. The binder (D) preferably further contains a binder resin having an alkali-soluble group described in the above-mentioned developable binder resin in order to exhibit a function of reducing the solubility in an alkali developer by action.
In this case, the sum of the content of the polymerizable compound and the content of the binder resin having an alkali-soluble group is preferably 1% by mass to 50% by mass with respect to the total solid content of the photosensitive composition of the present invention. 2 mass%-40 mass% are still more preferable, and 3 mass%-30 mass% are the most preferable. Here, the binder resin may be an alkali-soluble binder resin having a polymerizable group described in the developable binder resin.

  In the form in which the binder (D) contains a developable binder resin (particularly, an alkali-soluble binder resin having a polymerizable group) and the form in which the binder (D) contains a polymerizable compound having an alkali-soluble group, The photosensitive composition of the present invention may further contain a polymerizable compound having no alkali-soluble group. In this case, the content of the polymerizable compound having no alkali-soluble group is 3 to 40% by mass. It is preferable that it is the range of 5-25 mass%.

Furthermore, as another form of binder (D), the form containing a crosslinking agent can also be mentioned.
The cross-linking agent is a compound having a cross-linkable group capable of cross-linking with other components contained in the photosensitive composition. Examples of the cross-linkable group include a hydroxymethyl group, an alkoxymethyl group, a vinyl ether group, and an epoxy group. Can be mentioned. The crosslinking agent preferably has two or more such crosslinkable groups.
In this embodiment, the other component preferably has an alcoholic hydroxyl group, and the dispersion resin more preferably has an alcoholic hydroxyl group.
The crosslinking agent is preferably a melamine compound, urea compound, alkylene urea compound, or glycoluril compound crosslinking agent.

Examples of preferable crosslinking agents include compounds having an N-hydroxymethyl group, an N-alkoxymethyl group, or an N-acyloxymethyl group.
As a compound having an N-hydroxymethyl group, an N-alkoxymethyl group, or an N-acyloxymethyl group, two or more (more preferably 2 to 8) partial structures represented by the following general formula (CLNM-1) are used. ) Is preferred.

In General Formula (CLNM-1), R ^NM1 represents a hydrogen atom, an alkyl group, a cycloalkyl group, or an oxoalkyl group. In general formula (CLNM-1), the alkyl group of R ^NM1 is preferably a linear or branched alkyl group having 1 to 6 carbon atoms. The cycloalkyl group of R ^NM1 is preferably a cycloalkyl group having 5 to 6 carbon atoms. The oxoalkyl group of R ^NM1 is preferably an oxoalkyl group having 3 to 6 carbon atoms, and examples thereof include a β-oxopropyl group, a β-oxobutyl group, a β-oxopentyl group, and a β-oxohexyl group. it can.

  As a more preferable embodiment of the compound having two or more partial structures represented by the general formula (CLNM-1), a urea-based crosslinking agent represented by the following general formula (CLNM-2), the following general formula (CLNM-3) , A glycoluril crosslinking agent represented by the following general formula (CLNM-4), and a melamine crosslinking agent represented by the following general formula (CLNM-5).

In the general formula (CLNM-2),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM2 each independently represents a hydrogen atom, an alkyl group (preferably having 1 to 6 carbon atoms), or a cycloalkyl group (preferably having 5 to 6 carbon atoms).

  Specific examples of the urea crosslinking agent represented by the general formula (CLNM-2) include, for example, N, N-di (methoxymethyl) urea, N, N-di (ethoxymethyl) urea, N, N-di (Propoxymethyl) urea, N, N-di (isopropoxymethyl) urea, N, N-di (butoxymethyl) urea, N, N-di (t-butoxymethyl) urea, N, N-di (cyclohexyloxy) And methyl) urea, N, N-di (cyclopentyloxymethyl) urea, N, N-di (adamantyloxymethyl) urea, N, N-di (norbornyloxymethyl) urea and the like.

In the general formula (CLNM-3),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM3 each independently represents a hydrogen atom, a hydroxyl group, a linear or branched alkyl group (preferably having 1 to 6 carbon atoms), a cycloalkyl group (preferably having 5 to 6 carbon atoms), an oxoalkyl group (having 3 carbon atoms). To 6), an alkoxy group (preferably having 1 to 6 carbon atoms) or an oxoalkoxy group (preferably having 1 to 6 carbon atoms).
G represents a single bond, an oxygen atom, a sulfur atom, an alkylene group (preferably having 1 to 3 carbon atoms) or a carbonyl group. More specifically, a methylene group, ethylene group, propylene group, 1-methylethylene group, hydroxymethylene group, cyanomethylene group and the like can be mentioned.

  Specific examples of the alkylene urea crosslinking agent represented by the general formula (CLNM-3) include, for example, N, N-di (methoxymethyl) -4,5-di (methoxymethyl) ethylene urea, N, N- Di (ethoxymethyl) -4,5-di (ethoxymethyl) ethyleneurea, N, N-di (propoxymethyl) -4,5-di (propoxymethyl) ethyleneurea, N, N-di (isopropoxymethyl) -4,5-di (isopropoxymethyl) ethylene urea, N, N-di (butoxymethyl) -4,5-di (butoxymethyl) ethylene urea, N, N-di (t-butoxymethyl) -4, 5-di (t-butoxymethyl) ethyleneurea, N, N-di (cyclohexyloxymethyl) -4,5-di (cyclohexyloxymethyl) ethyleneurea, N, N-di (cyclo Nthyloxymethyl) -4,5-di (cyclopentyloxymethyl) ethyleneurea, N, N-di (adamantyloxymethyl) -4,5-di (adamantyloxymethyl) ethyleneurea, N, N-di (nor Bornyloxymethyl) -4,5-di (norbornyloxymethyl) ethyleneurea and the like.

In the general formula (CLNM-4),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM4 each independently represents a hydrogen atom, a hydroxyl group, an alkyl group, a cycloalkyl group or an alkoxy group.

R ^NM4 alkyl group (preferably having 1 to 6 carbon atoms), cycloalkyl group (preferably having 5 to 6 carbon atoms), alkoxy group (preferably having 1 to 6 carbon atoms), more specifically, methyl group, Examples include an ethyl group, a butyl group, a cyclopentyl group, a cyclohexyl group, a methoxy group, an ethoxy group, and a butoxy group.

  Specific examples of the glycoluril-based crosslinking agent represented by the general formula (CLNM-4) include, for example, N, N, N, N-tetra (methoxymethyl) glycoluril, N, N, N, N-tetra ( Ethoxymethyl) glycoluril, N, N, N, N-tetra (propoxymethyl) glycoluril, N, N, N, N-tetra (isopropoxymethyl) glycoluril, N, N, N, N-tetra (butoxy) Methyl) glycoluril, N, N, N, N-tetra (t-butoxymethyl) glycoluril, N, N, N, N-tetra (cyclohexyloxymethyl) glycoluril, N, N, N, N-tetra ( Cyclopentyloxymethyl) glycoluril, N, N, N, N-tetra (adamantyloxymethyl) glycoluril, N, N, N, N- Tiger (norbornyloxymethyl) glycoluril, and the like.

In the general formula (CLNM-5),
, Each R ^NM1 independently, are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
R ^NM5 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an atomic group represented by the following general formula (CLNM-5 ′).
R ^NM6 represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, or an atomic group represented by the following general formula (CLNM-5 ″).

In the general formula (CLNM-5 ′),
R ^NM1 are those in formula (CLNM-1) ^at, the same as ^{R NM1.}
In the general formula (CLNM-5 ″),
R ^NM1 of the general formula are those (CLNM-1) in ^at, the same as ^{R NM1, R NM5} are those formula (CLNM-5) in the same manner as in ^{R NM5.}

Alkyl group R ^NM5 and ^{R NM6} (1 to 6 carbon atoms is preferred), cycloalkyl groups (5 to 6 carbon atoms is preferred), an aryl group (having 6 to 10 carbon atoms is preferred), and more specifically, Examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a t-butyl group, a pentyl group, a cyclopentyl group, a hexyl group, a cyclohexyl group, a phenyl group, and a naphthyl group.

  Examples of the melamine crosslinking agent represented by the general formula (CLNM-5) include N, N, N, N, N, N-hexa (methoxymethyl) melamine, N, N, N, N, N, N Hexa (ethoxymethyl) melamine, N, N, N, N, N, N-hexa (propoxymethyl) melamine, N, N, N, N, N, N-hexa (isopropoxymethyl) melamine, N, N , N, N, N, N-hexa (butoxymethyl) melamine, N, N, N, N, N, N-hexa (t-butoxymethyl) melamine, N, N, N, N, N, N-hexa (Cyclohexyloxymethyl) melamine, N, N, N, N, N, N-hexa (cyclopentyloxymethyl) melamine, N, N, N, N, N, N-hexa (adamantyloxymethyl) melamine, N, N , N, N, N, N-hexa ( Rubornyloxymethyl) melamine, N, N, N, N, N, N-hexa (methoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (ethoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (propoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (isopropoxymethyl) acetoguanamine, N, N, N, N, N, N -Hexa (butoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (t-butoxymethyl) acetoguanamine, N, N, N, N, N, N-hexa (methoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (ethoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (propoxymethyl) benzoguanamine, N, N, N, N, N, N Hexa (isopropoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (butoxymethyl) benzoguanamine, N, N, N, N, N, N-hexa (t-butoxymethyl) benzoguanamine, etc. Can be mentioned.

The groups represented by R ^{NM1 to} R ^NM6 in the general formulas (CLNM-1) to (CLNM-5) may further have a substituent. Examples of the substituent that R ^{NM1 to} R ^NM6 may have include, for example, a halogen atom, a hydroxyl group, a nitro group, a cyano group, a carboxyl group, a cycloalkyl group (preferably having 3 to 20 carbon atoms), and an aryl group (preferably 6 to 14 carbon atoms), alkoxy group (preferably 1 to 20 carbon atoms), cycloalkoxy group (preferably 4 to 20 carbon atoms), acyl group (preferably 2 to 20 carbon atoms), acyloxy group (preferably carbon 2-20) etc. can be mentioned.

The crosslinking agent may be a phenol compound having a benzene ring in the molecule.
The phenolic compound has a molecular weight of 1200 or less, 3 to 5 benzene rings in the molecule, and two or more hydroxymethyl groups or alkoxymethyl groups, and at least any of the hydroxymethyl group and alkoxymethyl group. Phenol derivatives formed by concentrating on these benzene rings or by sorting and binding are preferred. By using such a phenol derivative, the effect of the present invention can be made more remarkable. As the alkoxymethyl group bonded to the benzene ring, those having 6 or less carbon atoms are preferable. Specifically, a methoxymethyl group, an ethoxymethyl group, an n-propoxymethyl group, an i-propoxymethyl group, an n-butoxymethyl group, an i-butoxymethyl group, a sec-butoxymethyl group, and a t-butoxymethyl group are preferable. Furthermore, alkoxy-substituted alkoxy groups such as 2-methoxyethoxy group and 2-methoxy-1-propyl group are also preferable.

The phenol compound is more preferably a phenol compound having two or more benzene rings in the molecule, and is preferably a phenol compound containing no nitrogen atom.
Specifically, it is preferably a phenol compound having 2 to 8 crosslinkable groups per molecule that can crosslink other components (preferably, a dispersion resin), and has 3 to 6 crosslinkable groups. More preferred.

Among these phenol derivatives, particularly preferable ones are listed below. In the formula, L ^{1 to} L ⁸ represent a crosslinkable group and may be the same or different, and the crosslinkable group preferably represents a hydroxymethyl group, a methoxymethyl group or an ethoxymethyl group.

A commercially available phenol compound can be used, and it can also be synthesized by a known method. For example, a phenol derivative having a hydroxymethyl group is obtained by reacting a phenol compound not having a corresponding hydroxymethyl group (a compound in which L ^{1 to} L ⁸ are hydrogen atoms in the above formula) with formaldehyde in the presence of a base catalyst. be able to. At this time, in order to prevent resinification or gelation, the reaction temperature is preferably 60 ° C. or lower. Specifically, it can be synthesized by the methods described in JP-A-6-282067, JP-A-7-64285 and the like.

  A phenol derivative having an alkoxymethyl group can be obtained by reacting a corresponding phenol derivative having a hydroxymethyl group with an alcohol in the presence of an acid catalyst. At this time, in order to prevent resinification and gelation, the reaction temperature is preferably 100 ° C. or lower. Specifically, it can be synthesized by the method described in EP632003A1 and the like. A phenol derivative having a hydroxymethyl group or an alkoxymethyl group synthesized in this manner is preferable from the viewpoint of stability during storage, but a phenol derivative having an alkoxymethyl group is particularly preferable from the viewpoint of stability during storage. Such a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in total and concentrated on any benzene ring or distributed and bonded may be used alone or in combination of two kinds. A combination of the above may also be used.

The crosslinking agent may be an epoxy compound having an epoxy group in the molecule.
As an epoxy compound, the compound represented by the following general formula (EP2) is mentioned.

In formula (EP2),
R ^{EP1 to} R ^EP3 each independently represent a hydrogen atom, a halogen atom, an alkyl group or a cycloalkyl group, and the alkyl group and the cycloalkyl group may have a substituent. R ^EP1 and R ^EP2 , R ^EP2 and R ^EP3 may be bonded to each other to form a ring structure.
Examples of the substituent that the alkyl group and cycloalkyl group may have include a hydroxyl group, a cyano group, an alkoxy group, an alkylcarbonyl group, an alkoxycarbonyl group, an alkylcarbonyloxy group, an alkylthio group, an alkylsulfone group, and an alkylsulfonyl group. Groups, alkylamino groups, alkylamide groups, and the like.
^QEP represents a single bond or an ^nEP- valent organic group. R ^EP1 to R ^EP3 may be combined to form a ring structure with ^{Q EP} not only with each other but.
n ^EP represents an integer of 2 or more, preferably 2 to 10, more preferably 2 to 6. However, ^nEP is 2 when ^QEP is a single bond.

When ^QEP is an ^nEP- valent organic group, a chain or cyclic saturated hydrocarbon structure (preferably having 2 to 20 carbon atoms) or an aromatic ring structure (preferably having 6 to 30 carbon atoms), or these are ethers and esters , Amides, sulfonamides and the like linked structures are preferred.

  Specific examples of the compound having an epoxy structure are illustrated below, but the present invention is not limited thereto.

In this invention, a crosslinking agent may be used independently and may be used in combination of 2 or more type.
When the photosensitive composition contains a crosslinking agent, the content of the crosslinking agent is preferably 3 to 30% by mass, more preferably 4 to 25% by mass, and still more preferably based on the total solid content of the photosensitive composition. Is 5 to 20% by mass.

[6] (E) Organic solvent The photosensitive composition of the present invention generally contains an organic solvent. The organic solvent is basically not particularly limited as long as the solubility of each component and the applicability of the photosensitive composition are satisfied, but in particular, considering the solubility, applicability, and safety of the ultraviolet absorber and binder. It is preferable to be selected.

Examples of organic solvents include esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, isobutyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, and ethyl lactate. , Alkyl oxyacetate (eg, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate (eg, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate)), alkyl 3-oxypropionate Esters (eg, methyl 3-oxypropionate, ethyl 3-oxypropionate, etc. (eg, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, etc.) )), 2- Xylpropionic acid alkyl esters (eg, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc. (eg, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2-methoxy) Propyl propionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate)), methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate (eg 2-methoxy-2- Methyl methyl propionate, ethyl 2-ethoxy-2-methylpropionate, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, etc. And as ethers For example, diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether (PGME: alias 1-methoxy) -2-propanol), propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate (PGMEA: also known as 1-methoxy-2-acetoxypropane), propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, etc. Preferable examples of tones include methyl ethyl ketone, cyclohexanone, 2-heptanone, and 3-heptanone, and examples of aromatic hydrocarbons include toluene and xylene.

  It is also preferable to mix two or more of these organic solvents from the viewpoint of improving the solubility of the ultraviolet absorber (details will be described later) and the alkali-soluble resin, and improving the coated surface. In this case, particularly preferably, the above-mentioned methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, ethyl It is a mixed solution composed of two or more selected from carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate.

  The content of the organic solvent in the photosensitive composition is preferably such that the total solid concentration of the composition is 5 to 80% by mass, more preferably 5 to 60% by mass, from the viewpoint of applicability. 10-50 mass% is especially preferable.

[7] Additives The photosensitive composition of the present invention is a surfactant and adhesion promoter as long as the characteristics (heat resistance, mechanical strength, coatability, adhesion, etc.) of the film obtained using the composition are not impaired. You may add additives, such as an agent, a polymerization inhibitor, a ultraviolet absorber, antioxidant, an aggregation inhibitor, and a sensitizer.

<Surfactant>
Various surfactants may be added to the photosensitive composition of the present invention from the viewpoint of further improving coatability. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used.

In particular, since the photosensitive composition of the present invention contains a fluorine-based surfactant, liquid properties (particularly fluidity) when prepared as a coating liquid are further improved. The liquid-saving property can be further improved.
That is, in the case of forming a film using a coating liquid to which a photosensitive composition containing a fluorosurfactant is applied, by reducing the interfacial tension between the coated surface and the coating liquid, The wettability is improved and the coating property to the coated surface is improved. For this reason, even when a thin film of about several μm is formed with a small amount of liquid, it is effective in that it is possible to more suitably form a film having a uniform thickness with small thickness unevenness.

  The fluorine content in the fluorosurfactant is preferably 3% by mass to 40% by mass, more preferably 5% by mass to 30% by mass, and particularly preferably 7% by mass to 25% by mass. A fluorine-based surfactant having a fluorine content in this range is effective in terms of uniformity of coating film thickness and liquid-saving properties, and has good solubility in the photosensitive composition.

  Examples of the fluorosurfactant include Megafac F171, F172, F173, F176, F176, F177, F141, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, F780, F781 (above DIC Corporation), Florard FC430, FC431, FC171 (above, Sumitomo 3M Limited), Surflon S-382, SC-101, Same SC-103, Same SC-104, Same SC-105, Same SC1068, Same SC-381, Same SC-383, Same S393, Same KH-40 (above, manufactured by Asahi Glass Co., Ltd.), Solsperse 20000 (Japan Rouble) Zole Co., Ltd.).

  Specific examples of nonionic surfactants include glycerol, trimethylolpropane, trimethylolethane, and ethoxylates and propoxylates thereof (for example, glycerol propoxylate, glycerin ethoxylate, etc.), polyoxyethylene lauryl ether, polyoxyethylene Stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester (Pluronic L10, L31, L61, L62 manufactured by BASF, 10R5, 17R2, 25R2, Tetronic 304, 701, 704, 901, 904, 150R1, etc. It is.

  Specific examples of the cationic surfactant include phthalocyanine derivatives (trade name: EFKA-745, manufactured by Morishita Sangyo Co., Ltd.), organosiloxane polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.), (meth) acrylic acid ( Co) polymer polyflow no. 75, no. 90, no. 95 (manufactured by Kyoeisha Yushi Chemical Co., Ltd.), W001 (manufactured by Yusho Co., Ltd.), and the like.

  Specific examples of the anionic surfactant include W004, W005, W017 (manufactured by Yusho Co., Ltd.) and the like.

Examples of the silicone surfactant include “Toray Silicone DC3PA”, “Toray Silicone SH7PA”, “Toray Silicone DC11PA”, “Tore Silicone SH21PA”, “Tore Silicone SH28PA”, “Toray Silicone” manufactured by Toray Dow Corning Co., Ltd. “Silicone SH29PA”, “Toresilicone SH30PA”, “Toresilicone SH8400”, “TSF-4440”, “TSF-4300”, “TSF-4445”, “TSF-4460”, “TSF” manufactured by Momentive Performance Materials, Inc. -4552 "," KP341 "," KF6001 "," KF6002 "manufactured by Shin-Etsu Silicone Co., Ltd.," BYK307 "," BYK323 "," BYK330 "manufactured by Big Chemie.
Only one type of surfactant may be used, or two or more types may be combined.
The photosensitive composition may or may not contain a surfactant, but when it is contained, the content of the surfactant is 0.001 mass relative to the total solid mass of the photosensitive composition of the present invention. % To 1% by mass, more preferably 0.01% to 0.1% by mass.

<Adhesion promoter>
The photosensitive composition of the present invention may contain any adhesion promoter as long as the object of the present invention is not impaired. Examples of the adhesion promoter include 3-glycidyloxypropyltrimethoxysilane, 1-methacryloxypropylmethyldimethoxysilane, 3-aminoglycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethyldimethoxysilane, 3- Examples include aminopropyltrimethoxysilane. In addition, the compounds described in paragraph No. [0048] of JP-A-2008-243945 are used.
The photosensitive composition of the present invention may or may not contain an adhesion promoter. However, when it is contained, the preferred amount of the adhesion promoter is not particularly limited, but it is usually the total solid content in the composition. Is preferably 10% by mass or less, particularly preferably 0.005 to 5% by mass.

<Polymerization inhibitor>
The photosensitive composition of the present invention may be added with a small amount of a polymerization inhibitor in order to prevent unnecessary thermal polymerization of the polymerizable compound during the production or storage of the photosensitive composition. As hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4,4′-thiobis (3-methyl-6-t-butylphenol), 2,2 Examples include '-methylenebis (4-methyl-6-tert-butylphenol), N-nitrosophenylhydroxyamine primary cerium salt, and the like.
It is preferable that content of a polymerization inhibitor is 0.0005 mass%-5 mass% with respect to the total solid of a photosensitive composition.

<Ultraviolet absorber>
The photosensitive composition of the present invention may contain an ultraviolet absorber.
As the ultraviolet absorber, salicylate-based, benzophenone-based, benzotriazole-based, substituted acrylonitrile-based, and triazine-based ultraviolet absorbers can be used.
Examples of salicylate-based UV absorbers include phenyl salicylate, p-octylphenyl salicylate, pt-butylphenyl salicylate, and the like. Examples of benzophenone-based UV absorbers include 2,2′-dihydroxy-4- Methoxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2- And hydroxy-4-octoxybenzophenone. Examples of the benzotriazole ultraviolet absorber include 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3). '-Tert-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-tert-amyl-5'-isobutylphenyl) -5-chlorobenzotriazole, 2- ( 2'-hydroxy-3'-isobutyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-isobutyl-5'-propylphenyl) -5-chlorobenzotriazole, 2 -(2'-hydroxy-3 ', 5'-di-tert-butylphenyl) benzotriazole, 2- (2'-hydroxy-5'-methylphenyl) benzoto Azole, 2- [2'-hydroxy-5 '- (1,1,3,3-tetramethylbutyl) phenyl] benzotriazole and the like.

Examples of the substituted acrylonitrile-based ultraviolet absorber include ethyl 2-cyano-3,3-diphenyl acrylate, 2-ethylhexyl 2-cyano-3,3-diphenyl acrylate, and the like. Furthermore, as an example of the triazine ultraviolet absorber, 2- [4-[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) ) -1,3,5-triazine, 2- [4-[(2-hydroxy-3-tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) Mono (hydroxyphenyl) triazine compounds such as 1,3,5-triazine and 2- (2,4-dihydroxyphenyl) -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine 2,4-bis (2-hydroxy-4-propyloxyphenyl) -6- (2,4-dimethylphenyl) -1,3,5-triazine, 2,4-bis (2-hydroxy-); -Methyl-4-propyloxyphenyl) -6- (4-methylphenyl) -1,3,5-triazine, 2,4-bis (2-hydroxy-3-methyl-4-hexyloxyphenyl) -6 Bis (hydroxyphenyl) triazine compounds such as (2,4-dimethylphenyl) -1,3,5-triazine; 2,4-bis (2-hydroxy-4-butoxyphenyl) -6- (2,4-di Butoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-4-octyloxyphenyl) -1,3,5-triazine, 2,4,6-tris [2-hydroxy And tris (hydroxyphenyl) triazine compounds such as -4- (3-butoxy-2-hydroxypropyloxy) phenyl] -1,3,5-triazine.
In the present invention, the various ultraviolet absorbers may be used alone or in combination of two or more.
The photosensitive composition may or may not contain an ultraviolet absorber, but when it is contained, the content of the ultraviolet absorber is 0.001 mass relative to the total solid mass of the photosensitive composition of the present invention. % To 1% by mass, more preferably 0.01% to 0.1% by mass.

As mentioned above, although each component of the photosensitive composition of this invention was demonstrated, the solution melt | dissolved in the organic solvent as mentioned above may be sufficient, and the photosensitive composition is a solid substance which does not contain an organic solvent. Also good.
The photosensitive composition of the present invention can be used in various applications typified by low refractive index materials, and the content of each component and the type of additive to be added are determined according to the purpose.
The photosensitive composition is preferably used for forming various films, and particularly preferably used for forming a low refractive index film.

  The photosensitive composition of the present invention preferably has a sufficiently low metal content as an impurity. The metal concentration in the composition can be measured with high sensitivity by the ICP-MS method or the like, and the metal content other than the transition metal in that case is preferably 300 ppm or less, more preferably 100 ppm or less.

  The manufacturing method of a photosensitive composition is not specifically limited, When an organic solvent is included, it can obtain by adding each component of a composition to an organic solvent, and stirring.

  The above composition is preferably used for film formation after removing insolubles, gelled components and the like by filter filtration. The pore diameter of the filter used in this case may be set according to the average particle diameter of the hollow or porous particles, but the pore diameter of the filter is preferably 0.05 to 2.0 μm, and the pore diameter is 0.05 to 1.0 μm. Is more preferable, and a pore diameter of 0.05 to 0.5 μm is most preferable. The material of the filter is preferably polytetrafluoroethylene, polyethylene, polypropylene, or nylon, and more preferably polytetrafluoroethylene, polyethylene, or nylon.

[8] Pattern Formation Method The pattern formation method of the present invention includes a step of forming a photosensitive film, a step of exposing the photosensitive film, and a development step of developing with an alkaline developer to obtain a pattern film.
Here, the photosensitive film is formed from the photosensitive composition of the present invention.
The present invention also relates to a pattern film obtained by this pattern forming method.
The method for forming the photosensitive film formed from the photosensitive composition of the present invention is not particularly limited. For example, the photosensitive composition is spin coated, roller coated, dip coated, scanned, sprayed, and bar coated. After applying to the substrate by any method such as a method or an ink jet method, the solvent is removed by heat treatment as necessary to form a coating film (photosensitive film), and a pre-bake treatment is performed. it can.
Examples of substrates include silicon wafer substrates, SiO ₂ wafer substrates, SiN wafer substrates, glass substrates, substrates on which various metal layers are formed, plastic films, microlenses, and on-chip color filters for image sensors. Examples include a coated substrate.

  As a method of applying to the substrate, a spin coating method, a scanning method, and an ink jet method are preferable. Particularly preferred is a spin coating method. A commercially available apparatus can be used for the spin coating method. For example, a clean track series (manufactured by Tokyo Electron), a D-spin series (manufactured by Dainippon Screen), an SS series or a CS series (manufactured by Tokyo Ohka Kogyo Co., Ltd.) can be preferably used.

  The spin coating conditions may be any rotational speed, but from the viewpoint of in-plane uniformity of the film, a rotational speed of about 1300 rpm is preferable for a 300 mm diameter silicon substrate. In addition, the method for discharging the composition solution may be either dynamic discharge for discharging the composition solution onto a rotating substrate or static discharge for discharging the composition solution onto a stationary substrate. From the viewpoint of performance, dynamic ejection is preferable. In addition, from the viewpoint of suppressing the consumption of the composition, it is also possible to use a method in which only the main solvent of the composition is preliminarily discharged onto the substrate to form a liquid film, and then the composition is discharged from there. it can. The spin coating time is not particularly limited, but is preferably within 180 seconds from the viewpoint of throughput. Further, from the viewpoint of transporting the substrate, it is also preferable to perform processing (edge rinse, back rinse) so as not to leave the film at the edge portion of the substrate.

  The photosensitive composition of the present invention can be easily cleaned and removed using a known cleaning liquid even when it adheres to, for example, a nozzle of a coating apparatus discharge section, a piping section of a coating apparatus, or the inside of a coating apparatus. . In this case, in order to perform more efficient cleaning and removal, it is preferable to use the solvent described above as the solvent contained in the photosensitive composition of the present invention as the cleaning liquid.

JP-A-7-128867, JP-A-7-146562, JP-A-8-278737, JP-A-2000-273370, JP-A-2006-85140, JP-A-2006-291191, The cleaning liquids described in JP 2007-2101 A, JP 2007-2102 A, JP 2007-281523 A and the like can also be suitably used as cleaning liquids for cleaning and removing the photosensitive composition of the present invention. .
As the cleaning liquid, it is preferable to use alkylene glycol monoalkyl ether carboxylate or alkylene glycol monoalkyl ether.
These solvents that can be used as the cleaning liquid may be used alone or in combination of two or more.
When mixing 2 or more types of solvent, the mixed solvent formed by mixing the solvent which has a hydroxyl group, and the solvent which does not have a hydroxyl group is preferable. The mass ratio of the solvent having a hydroxyl group and the solvent having no hydroxyl group is from 1/99 to 99/1, preferably from 10/90 to 90/10, more preferably from 20/80 to 80/20. The mixed solvent is a mixed solvent of propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME), and the ratio is particularly preferably 60/40.
In addition, in order to improve the permeability of the cleaning liquid to the photosensitive composition, the surfactant described above as a surfactant that can be contained in the photosensitive composition may be added to the cleaning liquid.

  The pre-bake treatment method is not particularly limited, and generally used hot plate heating, heating method using a furnace, light irradiation heating using a xenon lamp by RTP (Rapid Thermal Processor), etc. are applied. be able to. A heating method using hot plate heating or furnace is preferable. A commercially available apparatus can be preferably used as the hot plate, and a clean track series (manufactured by Tokyo Electron), D-spin series (manufactured by Dainippon Screen), SS series or CS series (manufactured by Tokyo Ohka Kogyo Co., Ltd.) can be preferably used. As the furnace, Cx series (manufactured by Tokyo Electron) and the like can be preferably used. Examples of the prebaking condition include a condition of heating at 60 ° C. to 150 ° C. (preferably 60 ° C. to 120 ° C.) for about 0.5 minutes to 15 minutes using a hot plate or an oven.

The step of exposing the photosensitive film is performed through a mask as necessary.
Examples of actinic rays or radiation that can be applied to this exposure include infrared light, g-rays, h-rays, i-rays, KrF light, ArF light, X-rays, and electron beams. From the viewpoint of exposure amount, sensitivity, and resolution, i-line, KrF light, ArF light, and electron beam are preferable, and from the viewpoint of versatility, i-line and KrF light are most preferable. When using the i-line to the irradiation light is ^preferably irradiated at an exposure dose of ^{100mJ / cm 2 ~10000mJ / cm 2} . When using KrF light, it is preferable to irradiate with an exposure dose of 30 mJ / cm ^{2 to} 300 mJ / cm ² .
In addition, the exposed composition layer can be heated at 70 ° C. to 180 ° C. for about 0.5 minutes to 15 minutes using a hot plate or oven before the next development processing, if necessary.

  Subsequently, the exposed portion of the photosensitive film is developed with a developer to obtain a pattern film (developing step). Thereby, a negative pattern (resist pattern) can be formed.

Examples of the alkaline developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, and aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, Secondary amines such as di-n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, fourth amines such as tetramethylammonium hydroxide and tetraethylammonium hydroxide Alkalinity such as 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] -5-nonene, etc., cyclic amines such as quaternary ammonium salts, pyrrole and pihelidine Aqueous solution can be used .
Furthermore, an appropriate amount of alcohol or surfactant may be added to the alkaline aqueous solution.
The alkali concentration of the alkali developer is usually from 0.1 to 20% by mass.
The pH of the alkali developer is usually from 10.0 to 15.0.
In particular, a 0.3% mass aqueous solution of tetramethylammonium hydroxide is desirable.

As a developing method, for example, a method in which a substrate is immersed in a tank filled with a developer for a certain period of time (dip method), a method in which the developer is raised on the surface of the substrate by surface tension and is left stationary for a certain time (paddle) Method), a method of spraying the developer on the substrate surface (spray method), a method of continuously discharging the developer while scanning the developer discharge nozzle on the substrate rotating at a constant speed (dynamic dispensing method) Etc. can be applied. The development time varies depending on the composition of the photosensitive composition, but is usually about 30 to 120 seconds at 25 ° C.
When the above-mentioned various development methods include a step of discharging the developer from the developing nozzle of the developing device toward the photosensitive film, the discharge pressure of the discharged developer (flow rate per unit area of the discharged developer) preferably 2mL / sec / mm ² or less, more preferably 1.5mL / sec / mm ^2, more preferably not more than 1mL / sec / mm ^2. There is no particular lower limit on the flow rate, but 0.2 mL / sec / mm ² or more is preferable in consideration of throughput.
By setting the discharge pressure of the discharged developer to be in the above range, pattern defects derived from the resist residue after development can be remarkably reduced.
The details of this mechanism are not clear, but perhaps by setting the discharge pressure within the above range, the pressure applied by the developer to the photosensitive film is reduced, and the photosensitive film / pattern film is inadvertently cut or collapsed. This is considered to be suppressed.
The developer discharge pressure (mL / sec / mm ² ) is a value at the developing nozzle outlet in the developing device.

  Examples of the method for adjusting the discharge pressure of the developer include a method of adjusting the discharge pressure with a pump or the like, and a method of changing the pressure by adjusting the pressure by supply from a pressurized tank.

  After the development, it is preferable to include a step of washing with a rinse solution.

  As the rinsing liquid in the rinsing treatment, pure water can be used, and an appropriate amount of a surfactant can be added and used.

In the rinsing step, the developed wafer is cleaned using a rinsing liquid. The cleaning method is not particularly limited. For example, a method of continuing to discharge the rinse liquid onto the substrate rotating at a constant speed (rotary coating method), or immersing the substrate in a tank filled with the rinse liquid for a certain period of time. A method (dip method), a method of spraying a rinsing liquid on the substrate surface (spray method), and the like can be applied. Among them, a cleaning treatment is performed by a spin coating method, and after cleaning, the substrate is rotated at a speed of 2000 rpm to 4000 rpm. It is preferable to rotate and remove the rinse liquid from the substrate. It is also preferable to include a heating step (Post Bake) after the rinsing step. The developing solution and the rinsing solution remaining between the patterns and inside the patterns are removed by baking. The heating step after the rinsing step can be performed by heating the pattern film with a heating device such as a hot plate or oven. In this post-baking, the heating temperature is usually 120 to 250 ° C., preferably 160 to 250 ° C. 230 ° C. The heating time varies depending on the heating means, but is usually about 5 to 30 minutes when heated on a hot plate, and is usually about 30 to 90 minutes when heated in an oven.
Further, in the post-baking, a step baking method in which heating is performed twice or more can be adopted.

After the development process, if necessary, post-heating and / or post-exposure may be performed on the formed pattern film to further accelerate the curing of the pattern film (post-curing process by hardening process).
Thereby, light resistance, climate resistance, and film strength can be improved, and low refractive index properties can also be improved.

  The hardening process means that the pattern film on the substrate is further cured to give the film more solvent resistance and the like. As the method of hardening, it is preferable to perform heat treatment (firing). For example, a polymerization reaction during post-heating of the polymerizable group remaining in the resin can be used. The conditions for the post-heat treatment are preferably 100 to 600 ° C., more preferably 200 to 500 ° C., particularly preferably 200 ° C. to 450 ° C., preferably 1 minute to 3 hours, more preferably 1 minute to 2 hours, Especially preferably, it is the range of 1 minute-1 hour. The post-heating treatment may be performed in several times.

Further, in the present invention, not by heat treatment but by irradiating with high energy rays such as light irradiation and radiation irradiation, the polymer may still cause a polymerization reaction between the remaining polymerizable groups to be hardened. Good. Examples of high energy rays include electron beams, ultraviolet rays, and X-rays, but are not particularly limited to these methods.
The energy when an electron beam is used as the high energy beam is preferably 0.1 to 50 keV, more preferably 0.2 to 30 keV, and particularly preferably 0.5 to 20 keV. The total dose of the electron beam is preferably 0.01 to 5 μC / cm ² , more preferably 0.01 to ² μC / cm ² , and particularly preferably 0.01 to 1 μC / cm ² . The substrate temperature at the time of irradiation with an electron beam is preferably 0 to 500 ° C, more preferably 20 to 450 ° C, and particularly preferably 20 to 400 ° C. The pressure is preferably 0 to 133 kPa, more preferably 0 to 60 kPa, and particularly preferably 0 to 20 kPa.
From the viewpoint of preventing oxidation of the polymer, the atmosphere around the substrate is preferably an inert atmosphere such as Ar, He, or nitrogen. Further, a gas such as oxygen, hydrocarbon, or ammonia may be added for the purpose of reaction with plasma, electromagnetic waves, or chemical species generated by interaction with an electron beam. The electron beam irradiation may be performed a plurality of times. In this case, the electron beam irradiation conditions need not be the same each time, and may be performed under different conditions each time.

Ultraviolet rays may be used as the high energy rays. The irradiation wavelength region when ultraviolet rays are used is preferably 160 to 400 nm, and the output is preferably 0.1 to 2000 mWcm ⁻² immediately above the substrate. The substrate temperature at the time of ultraviolet irradiation is preferably 250 to 450 ° C., more preferably 250 to 400 ° C., and particularly preferably 250 to 350 ° C. From the viewpoint of preventing oxidation of the polymer of the present invention, the atmosphere around the substrate is preferably an inert atmosphere such as Ar, He, or nitrogen. Further, the pressure at that time is preferably 0 to 133 kPa.

  The film may be hardened by performing heat treatment and high energy ray treatment irradiation such as light irradiation and radiation irradiation simultaneously or sequentially.

  As a dry film thickness, a coating film having a thickness of about 0.05 to 1.5 μm can be formed by a single coating and a thickness of about 0.1 to 3 μm can be formed by a second coating.

Although the use of the photosensitive composition of this invention is not specifically limited, As mentioned above, it is preferable to use in order to produce a low refractive index film | membrane.
Therefore, the present invention also relates to a low refractive index film that is a pattern film obtained by the above-described pattern forming method of the present invention.
Furthermore, the present invention also relates to an optical device having the low refractive index film.
The present invention also relates to a solid-state imaging device including such an optical device.
Hereinafter, such a low refractive index film (for example, an antireflection film) will be described in detail. However, the preferable range of the following various physical properties in the low refractive index film is a preferable range particularly in the application of the low refractive index film, but is not limited to the application.

<Low refractive index film>
The pattern film obtained using the composition described above exhibits excellent low refractive index properties. Specifically, the refractive index (wavelength 633 nm, measurement temperature 25 ° C.) of the pattern film is preferably 1.35 or less, more preferably 1.23-1.34, and 1.25-1 .33 is particularly preferred. Within the above range, it is useful as an antireflection film described later.

<Antireflection film>
As a suitable usage mode of the pattern film obtained by using the composition of the present invention described above, an antireflection film can be mentioned. In particular, it is suitable as an antireflection film for optical devices (for example, microlenses for image sensors, plasma display panels, liquid crystal displays, organic electroluminescence, etc.).
The lower the reflectance when used as an antireflection film, the better. Specifically, the specular average reflectance in the wavelength region of 450 to 650 nm is preferably 3% or less, more preferably 2% or less, and most preferably 1% or less. The reflectance is preferably as small as possible, and most preferably 0.
The haze of the antireflection film is preferably 3% or less, more preferably 1% or less, and most preferably 0.5% or less. The reflectance is preferably as small as possible, and most preferably 0.

  When the above-described film is used as a single-layer type antireflection film, if the refractive index of the transparent substrate is nG, the refractive index n of the antireflection film is √nG, that is, 1/2 of the refractive index of the transparent substrate. Preferably it is a power. For example, since the refractive index of optical glass is 1.47 to 1.92 (wavelength 633 nm, measurement temperature 25 ° C.), n of the single-layer antireflection film formed on the optical glass is 1.21 to 1. .38 is preferred. In addition, it is preferable that the film thickness of the antireflection film in that case is 10 nm-10 micrometers.

When the above-described film is used as a multilayer antireflection film, the film is used as a low refractive index layer, and includes, for example, a high refractive index layer, a hard coat layer, and a transparent substrate under the film. be able to. At this time, the high refractive index layer may be formed directly on the substrate without providing the hard coat layer. Further, an intermediate refractive index layer may be further provided between the high refractive index layer and the low refractive index layer, or between the high refractive index layer and the hard coat layer.
Below, each layer in the case of a multilayer type is explained in full detail.

(1) Low refractive index layer A low refractive index layer is comprised from the pattern film | membrane obtained using the composition of this invention as mentioned above. The refractive index and thickness of the low refractive index layer will be described.

(I) Refractive index The refractive index (wavelength 633 nm, measurement temperature 25 ° C.) of the pattern film obtained using the composition of the present invention, that is, the refractive index of the low refractive index film (also referred to as a low refractive index layer) is 1. It is preferable to be 35 or less. The reason for this is that when the low refractive index film has a refractive index of 1.35 or less, the antireflective effect can be reliably exhibited when combined with a high refractive index film (also referred to as a high refractive index layer). Because.
The refractive index of the low refractive index film is more preferably 1.34 or less, and further preferably 1.33 or less. When a plurality of low refractive index films are provided, at least one of them may have a refractive index value within the above-described range.

  Moreover, when providing a low refractive index layer, since the more excellent antireflection effect is acquired, it is preferable to make the refractive index difference between high refractive index layers into 0.05 or more values. Since the difference in refractive index between the low refractive index layer and the high refractive index layer is 0.05 or more, a synergistic effect in these antireflection film layers can be easily obtained, and the antireflection effect can be obtained more reliably. It is easy to be done. Therefore, it is more preferable to set the refractive index difference between the low refractive index layer and the high refractive index layer to a value within the range of 0.1 to 0.8, and within the range of 0.15 to 0.7. More preferably, it is a value.

(Ii) Thickness The thickness of the low refractive index layer is not particularly limited, but is preferably 20 to 300 nm, for example. When the thickness of the low refractive index layer is 20 nm or more, adhesion to the high refractive index film as a base is surely obtained. On the other hand, when the thickness is 300 nm or less, optical interference hardly occurs and the antireflection effect is further improved. It is easy to get reliably. Therefore, the thickness of the low refractive index layer is more preferably 20 to 250 nm, and still more preferably 20 to 200 nm. In order to obtain higher antireflection properties, when a plurality of low refractive index layers are provided to form a multilayer structure, the total thickness may be set to 20 to 300 nm.

(2) High refractive index layer Although it does not restrict | limit especially as a curable composition for forming a high refractive index layer, As a film formation component, an epoxy resin, a phenol resin, a melamine resin, an alkyd system It is preferable to include one kind or a combination of two or more kinds of resin, cyanate resin, acrylic resin, polyester resin, urethane resin, siloxane resin and the like. With these resins, a strong thin film can be formed as the high refractive index layer, and as a result, the scratch resistance of the antireflection film can be remarkably improved.
However, the refractive index of these resins alone is usually 1.45 to 1.62, which may not be sufficient to obtain high antireflection performance. Therefore, it is preferable to make refractive index 1.70-2.20 by mix | blending a high refractive index inorganic particle, for example, metal oxide particle. Moreover, as a hardening form, although the curable composition which can be thermosetting, ultraviolet curing, and electron beam curing can be used, the ultraviolet curable composition with favorable productivity is used more suitably.

  The thickness of the high refractive index layer is not particularly limited, but is preferably 20 to 30,000 nm, for example. When the thickness of the high refractive index layer is 20 nm or more, when combined with the low refractive index layer, the antireflection effect and the adhesion to the substrate can be more reliably obtained, while the thickness is 30,000 nm or less. In addition, optical interference is unlikely to occur, and the antireflection effect is easily obtained more reliably. Therefore, the thickness of the high refractive index layer is more preferably 20 to 1,000 nm, and further preferably 50 to 500 nm. In order to obtain higher antireflection properties, when a plurality of high refractive index layers are provided to form a multilayer structure, the total thickness may be set to 20 to 30,000 nm. In addition, when providing a hard-coat layer between a high refractive index layer and a board | substrate, the thickness of a high refractive index layer can be 20-300 nm.

(3) Hard coat layer The constituent material of the hard coat layer used in the antireflection film of the present invention is not particularly limited. Examples of such a material include one kind of siloxane resin, acrylic resin, melamine resin, epoxy resin, or a combination of two or more kinds.

  Moreover, although it does not restrict | limit especially also about the thickness of a hard-coat layer, it is preferable to set it as 1-50 micrometers, and it is more preferable to set it as 5-10 micrometers. When the thickness of the hard coat layer is 1 μm or more, the adhesion of the antireflection film to the substrate can be more reliably improved. On the other hand, when the thickness is 50 μm or less, it can be easily formed uniformly.

(4) Substrate The type of the substrate used for the low refractive index film of the present invention is not particularly limited. For example, glass, polycarbonate resin, polyester resin, acrylic resin, triacetyl cellulose resin (TAC), etc. And a transparent substrate and a silicon wafer. By using an antireflection film including these substrates, it is excellent in the field of application of a wide range of antireflection films such as a lens part of a camera, a screen display part of a television (CRT), a color filter or a photographing element in a liquid crystal display device. An antireflection effect can be obtained.

  The pattern film obtained using the composition of the present invention can also be used as a surface protective film or retardation film for optical devices (for example, microlenses).

  The composition of the present invention can be preferably used particularly as a coating application for microlenses (herein, the concept of microlenses includes the concept of microlens arrays).

  The pattern film obtained from the pattern forming method of the present invention is formed using the photosensitive composition of the present invention, and has a low refractive index, a small amount of development residue, and a high resolution. Areas where you want to suppress light reflection, such as on-chip color filter imaging optical systems such as OA equipment, liquid crystal televisions, mobile phones, projectors, facsimiles, electronic copying machines, solid-state image sensors, and optical fiber connectors. It is extremely useful as a film provided on the substrate.

  In particular, by forming the pattern film of the present invention on the surface of the microlens using the pattern forming method of the present invention, a high-definition microlens coated with the film having the above characteristics can be easily produced with a high product yield. Can be formed.

  EXAMPLES The present invention will be described in more detail with reference to examples below, but the present invention is not limited by these examples.

Moreover, the weight average molecular weight (Mw) and dispersity (Mw / Mn) of the following resins are values based on GPC measurement. For GPC measurement, Waters 2695 and Shodex GPC column KF-805L (3 columns directly connected) were used, 50 μl of terahydrofuran solution having a column temperature of 40 ° C. and a sample concentration of 0.5 mass% was injected, and tetrahydrofuran was used as an elution solvent. Was flown at a flow rate of 1 ml per minute, and the sample peak was detected by an RI detector (Waters 2414) and a UV detector (Waters 2996). M _w and M _n were calculated using a calibration curve prepared using standard polystyrene.

<Synthesis of Dispersing Resin (P-1)>
Under a nitrogen stream, 8.0 g of PGMEA was placed in a three-necked flask and heated to 80 ° C. Next, 10.74 g of 3-methacryloxypropylmethyldiethoxysilane, 9.26 g of 2-acetoacetoxyethyl methacrylate, and 0.996 g of initiator V-601 (manufactured by Wako Pure Chemical Industries) are dissolved in 72 g of PGMEA in this reaction solution. The solution was added dropwise over 3 hours and further reacted at 80 ° C. for 1 hour. Thereafter, a solution prepared by dissolving 50 mg of initiator V-601 in 1.0 g of PGMEA was added, and further reacted at 80 ° C. for 1 hour. It stood to cool and obtained the 20 mass% PGMEA solution of dispersion resin (P-1).
When the obtained dispersion resin was analyzed by GPC, it was _Mw = 14500 and _Mn = 7700.

<Synthesis of Dispersing Resin (P-5)>
Under a nitrogen stream, 8.0 g of PGMEA was placed in a three-necked flask and heated to 80 ° C. Next, 11.87 g of 3-methacryloxypropylmethyldiethoxysilane, 8.13 g of α-methacryloxy-γ-butyrolactone, 1.100 g of initiator V-601 (manufactured by Wako Pure Chemical Industries) are dissolved in 72 g of PGMEA in this reaction solution. The solution was added dropwise over 3 hours and further reacted at 80 ° C. for 1 hour. Thereafter, a solution prepared by dissolving 50 mg of initiator V-601 in 1.0 g of PGMEA was added, and further reacted at 80 ° C. for 1 hour. It stood to cool and obtained the 20 mass% PGMEA solution of dispersion resin (P-5).
When the obtained dispersion resin was analyzed by GPC, it was _Mw = 15300 and _Mn = 8400.

<Synthesis of Dispersing Resin (P-8)>
Under a nitrogen stream, 8.0 g of PGMEA was placed in a three-necked flask and heated to 80 ° C. Next, 20.00 g of 2-acetoacetoxyethyl methacrylate, γ-mercaptopropyltrimethoxysilane (KBM-803 manufactured by Shin-Etsu Chemical Co., Ltd.) 0.9165 g, initiator V-601 (manufactured by Wako Pure Chemical Industries) A solution prepared by dissolving 5374 g in 72 g of PGMEA was added dropwise over 3 hours, and the mixture was further reacted at 80 ° C. for 1 hour. Thereafter, a solution prepared by dissolving 50 mg of initiator V-601 in 1.0 g of PGMEA was added, and further reacted at 80 ° C. for 1 hour. It stood to cool and obtained the 20 mass% PGMEA solution of dispersion resin (P-8).
When the obtained dispersion resin was analyzed by GPC, it was _Mw = 6510 and _Mn = 4450.

<Synthesis of Dispersing Resin (P-11)>
Under a nitrogen stream, 54.0 g of PGMEA was placed in a three-necked flask and heated to 80 ° C. Next, to this reaction solution, 10.79 g of 2-acetoacetoxyethyl methacrylate, 4.23 g of allyl methacrylate, 0.823 g of γ-mercaptopropyltrimethoxysilane (KBM-803 manufactured by Shin-Etsu Chemical Co., Ltd.), initiator V-601 ( A solution prepared by dissolving 0.4824 g (manufactured by Wako Pure Chemical Industries, Ltd.) in 81.0 g of PGMEA was added dropwise over 3 hours, and further reacted at 80 ° C. for 1 hour. The mixture was allowed to cool to obtain a 10 mass% PGMEA solution of the dispersion resin (P-11). When the obtained dispersion resin was analyzed by GPC, it was _Mw = 5750 and _Mn = 3100.

<Synthesis of Dispersing Resin (P-14)>
Under a nitrogen stream, 8.0 g of PGME was placed in a three-necked flask and heated to 80 ° C. Next, 19.598 g of 2-acetoacetoxyethyl methacrylate, N, N-dimethyl-N-methacryloyloxyethyl-N-carboxymethyl-ammonium betaine (GLBT, Osaka Organic Chemical Co., Ltd.) 0.402 g, 1- A solution prepared by dissolving 0.9447 g of dodecanthiol and 1.0748 g of initiator V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) in 72 g of PGME was added dropwise over 3 hours, and further reacted at 80 ° C. for 1 hour. Thereafter, a solution prepared by dissolving 50 mg of initiator V-601 in 1.0 g of PGME was added, and further reacted at 80 ° C. for 1 hour. It stood to cool and obtained the 20 mass% PGME solution of dispersion resin (P-14). When the obtained dispersion resin was analyzed by GPC, it was _Mw = 5360 and _Mn = 3800.

<Synthesis of comparative dispersion resin (R1)>
Under a nitrogen stream, 7.41 g of PGMEA was placed in a three-necked flask and heated to 80 ° C. Next, a solution prepared by dissolving 18.52 g of 2-acetoacetoxyethyl methacrylate and 0.996 g of initiator V-601 (manufactured by Wako Pure Chemical Industries, Ltd.) in 66.7 g of PGMEA was added dropwise to this reaction solution over 3 hours. The reaction was carried out at 80 ° C. for 1 hour. Thereafter, a solution prepared by dissolving 50 mg of initiator V-601 in 1.0 g of PGMEA was added, and further reacted at 80 ° C. for 1 hour. It stood to cool and obtained the 20 mass% PGMEA solution of dispersion resin (R1).
When the obtained dispersion resin was analyzed by GPC, it was _Mw = 15200 and _Mn = 8200.

  Other dispersion resins (P-1), (P-5), (P-8), (P-11), (P-14) and (R1) are synthesized in the same manner as in the synthesis examples of (R1). P-2) to (P-4), (P-6), (P-7), (P-9), (P-10), (P-12), (P-13), (P- 15), (P-16) and (R2) were synthesized.

Below, the chemical formula of the monomer corresponding to each repeating unit in the dispersion resins (P-1) to (P-16), (R1) and (R2), the monomer charge ratio (molar ratio) in each dispersion resin, addition Table 1 and Table 2 summarize the agents (thiol compounds) and the dispersion resins Mw and Mw / Mn.
In addition, the usage-amount (mol%) of the additive (thiol compound) in Table 1 and Table 2 is the quantity on the basis of the molar total amount of all the monomers in each dispersion resin.

<Synthesis of reaction resin AP-8 which is a reaction product of inorganic particles and dispersion resin>
Dispersion resin (P-8) 20% by mass PGMEA solution 4.0 g, JGC Catalysts & Chemicals hollow silica “Thruria 2320” (20% by mass MIBK dispersion) 16.0 g, PGMEA 20.0 g, acetic acid 200 mg, water 200 mg 3 This was placed in a one-necked flask, reacted at 80 ° C. for 6 hours, and then allowed to cool (reaction condition (1)). 500 mg of the obtained solution was heated and dried under reduced pressure at 130 ° C. for 3 hours on an aluminum cup, and the weight after drying was measured to confirm that the solid content of the solution was 10% by mass. In addition, 1.0 g of the obtained solution was added to 10 g of hexane and 10 g of chlorobenzene, the produced precipitate was centrifuged (14500 rpm / 30 min), and the precipitate was subjected to thermogravimetric analysis (TA Instruments SDT Q600, nitrogen flow rate 100 ml / As a result of heating up to 600 ° C. at 20 min / 20 ° C./min, 18% weight loss was observed.

  Hollow or porous particles similar to the above-mentioned reaction resin AP-8, except that the hollow or porous particles shown in Table 3 below and the dispersion resin were used and the reaction conditions shown in Table 3 were adopted. Resin Resins AP-1 to AP-7, AP-9 to AP-16, rAP-1 and rAP-2, which are reaction products of the resin and the dispersion resin, were synthesized. Here, the sum of the used amount of the 20% by mass dispersion of hollow or porous particles and the used amount of the 20% by mass PGMEA solution of the dispersion resin is 20.0 g.

  The reaction conditions in Table 3 are as follows.

Reaction condition (1): Acetic acid (5% by mass of the total amount of solids of the dispersion resin and inorganic particles) and water (the same amount as acetic acid) were added, and the mixture was heated and stirred at 80 ° C. for 6 hours.
Reaction condition (2): 20% ammonia water (10% by mass of the total amount of solids of the dispersion resin and inorganic particles) was added, and the reaction was stirred with heating at 80 ° C. for 6 hours.
Reaction condition (3): Water (5% by mass of the total amount of solids of the dispersion resin and inorganic particles) was added, and the reaction was stirred with heating at 100 ° C. for 8 hours.
Reaction condition (4): The mixture was stirred at room temperature for 1 hour.

  Abbreviations for the hollow or porous particles are as follows.

A: Hollow silica particles Product name: Thruria 2320 (20% by mass dispersion of hollow silica (refractive index: 1.20)) (manufactured by JGC Catalysts & Chemicals)
B: Organosilica sol Product name: Snowtex PGM-ST (20% by mass dispersion of porous silica (refractive index: 1.29)) (manufactured by Nissan Chemical Co., Ltd.)
C: Organosilica sol Product name: PL-2L-PGME (20% by mass dispersion of porous silica (refractive index: 1.26)) (manufactured by Fuso Chemical Co., Ltd.)

<Preparation of photosensitive composition>
Hereinafter, Examples 1, 3 to 5, 7 to 10, 12, and 14 to 16 shall be read as Reference Examples 1, 3 to 5, 7 to 10, 12, and 14 to 16, respectively. The same applies to Tables 4 and 5 below.
The components shown in Table 4 below were dissolved in the solvent shown in Table 4 below, the total solid content concentration was 6% by mass, and the mixture was filtered through a tetrafluoroethylene filter having a pore size of 0.5 μm. Examples 1 to 16 and Comparative Example 1 2 photosensitive compositions were prepared.
In Table 4, the solid content of each component is expressed as the content (% by mass) with respect to the sum of the solid content of the reaction resin, photopolymerization initiator, polymerizable compound, and binder resin.

  As the polymerization initiator, a commercially available product (both manufactured by BASF Japan) was used. The structure is shown below.

  Regarding the polymerizable compound, M-1 is the compound described above. Other abbreviations are as follows.

TO-1382: Carboxyl group-containing pentafunctional acrylate manufactured by Toagosei Chemical Co., Ltd. M-360: Aronix M-360 manufactured by Toagosei Chemical Co., Ltd. (EO-modified trimethylolpropane triacrylate)
DPHA: dipentaerythritol hexaacrylate TMPT: NK ester TMPT (trimethylolpropane trimethacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd.
A-TMPT: NK ester manufactured by Shin-Nakamura Chemical Co., Ltd. A-TMPT (trimethylolpropane triacrylate)
CEL 2021: Celoxide 2021P (3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate) manufactured by Daicel Chemical Industries, Ltd.
HMMM: Hexamethoxymethylmelamine (also known as N, N, N, N, N, N-hexa (methoxymethyl) melamine)

  Regarding the binder resin, C-1, C-4, and C-7 represent the above-described binders (C-1), (C-4), and (C-7), respectively. C-8 is as follows.

C-8: Ternary copolymer of benzyl methacrylate, methacrylic acid, and 2-hydroxyethyl methacrylate (mass ratio of repeating units: 70/13/17, Mw: 28,000, Mw / Mn: 11 , 000)

  As the surfactant, BYK307 (manufactured by Big Chemie) and MegaFuck F-475 (manufactured by DIC Corporation) were used.

  The abbreviations for the adhesion promoter are as follows.

GPTMS: 3-glycidyloxypropyltrimethoxysilane MPMDMS: 1-methacryloxypropylmethyldimethoxysilane MAPTMS: 3-methacryloxypropyltrimethoxysilane

  Abbreviations for polymerization inhibitors are as follows.

MP: p-methoxyphenol BHT: 2,6-di-t-butyl-4-cresol

  Abbreviations for solvents are as follows.

PGMEA: Propylene glycol monomethyl ether acetate (also known as 1-methoxy-2-acetoxypropane)
BA: Butyl acetate CYHEX: Cyclohexanone PGME: Propylene glycol monomethyl ether (also known as 1-methoxy-2-propanol)

  A pattern film was formed using the above photosensitive composition based on the following method.

<Formation and exposure of photosensitive film>
The photosensitive composition solution prepared as described above was applied onto a 6-inch silicon wafer, the substrate was pre-dried at 100 ° C. for 1.5 minutes on a hot plate, and a photosensitive film having a film thickness of 300 nm. A film was formed. Next, using an i-line stepper exposure apparatus FPA-3000i5 + (manufactured by Canon Inc.), pattern exposure is performed using a mask in which a large number of square pixels of 1.0 μm are provided on a substrate at a wavelength of 365 nm. Went.

<Formation of pattern film (development on photosensitive film)>
About the obtained exposure film, a silicon wafer was placed on a horizontal rotating table of a spin shower developing machine (DW-30 type, manufactured by Chemitronics), and CD-2000 (Fuji Film Electronics Materials Co., Ltd.). The silicon wafer was fixed to the horizontal rotary table by a vacuum chuck method at 60 ° C. for 60 seconds at 23 ° C., and the silicon wafer was rotated at a rotation speed of 50 r. p. m. Then, pure water was supplied from the jet nozzle in a shower form from above the rotation center, rinsed, and then spray dried to obtain a wafer substrate. In the paddle development, a 0.3% mass aqueous solution of tetramethylammonium hydroxide was used as the alkaline developer.

<Curing pattern film>
The obtained pattern film was cured by any of the following methods.
(1) Heating A
It was heated at 220 ° C. for 5 minutes in a hot plate under the atmosphere.
(2) UV irradiation A
Ultraviolet rays of 10,000 [mJ / cm ² ] were irradiated using a high-pressure mercury lamp (Ushio Electric Co., Ltd. UMA-802-HC552FFAL). In addition, the wavelength light of 275 nm or less contained in the irradiation light from a high pressure mercury lamp is 10%.

  The obtained cured film was evaluated by the following method. The results are shown in Table 5.

<Resolution>
The obtained pattern film was observed with a length measurement SEM (Hitachi, Ltd. S-8840). When the resolution of a 1.0 μm square pixel pattern was recognized, it was marked as “◯”, and when the pattern could not be confirmed as “X”. did.

<Refractive index>
A value measured at 25 ° C. at a wavelength of 633 nm in the pattern film portion on a silicon wafer using a spectroscopic ellipsometer (VASE) manufactured by Woollam Co., Ltd. was used.

<Development defects>
The pattern film thus obtained is observed with a scanning electron microscope (Hitachi Ultra High Resolution Field Emission Scanning Electron Microscope S-4800, magnification 20000 times). The case where there is a residue in the edge portion is indicated by Δ, the case where there is a residue in both the space portion and the edge portion is indicated by ×.

<Young's modulus>
The Young's modulus at 25 ° C. of the pattern film was measured using MTS nanoindenter SA2. A larger Young's modulus value means better film strength.

From the results of Table 5, it was found that when the photosensitive compositions of the examples were used, a pattern having excellent film strength and few development defects could be formed with high resolution.
On the other hand, in Comparative Examples 1 and 2 that do not contain the alkali-soluble particle dispersant (B) of the present invention, the above effects of the present invention could not be satisfied at the same time.

Claims (16)

(A) hollow or porous particles, (B) an alkali-soluble particle dispersant, (C) a compound that generates active species upon irradiation with actinic rays or radiation, and (D) dissolution in an alkali developer by the action of the active species. A photosensitive composition containing a binder with reduced properties,
Said particles (A) and the particle dispersant and (B), but each have a chemically bondable groups to one another,
The particle (A) has at least one of an alkoxy group and a hydroxyl group on the surface, and the group capable of being chemically bonded to the particle (A) of the particle dispersant (B) is a hydrolyzable silyl group or a silanol group. And at least one of
The photosensitive composition in which the said particle | grain dispersing agent (B) has a polymeric group further .   The photosensitive composition of Claim 1 whose compound (C) which generate | occur | produces an active seed | species by irradiation of the said actinic light or a radiation is an oxime compound.   The photosensitive composition of Claim 1 or 2 whose at least one of the said hydrolysable silyl group and silanol group is group represented by the following Formula (A-1).

  In formula (A-1), R ¹ ~ R ³ Each independently represents a hydrogen atom, a halogen atom, or a monovalent organic substituent. However, R ¹ ~ R ³ At least one of these represents a hydrolyzable group selected from the group consisting of an alkoxy group, a mercapto group, a halogen atom, an amide group, an acetoxy group, an amino group, and an isopropenoxy group, or a hydroxyl group.   The photosensitive composition according to claim 3, wherein the particle dispersant (B) and the binder (D) are the same.   The photosensitive composition of any one of Claims 1-3 in which the said binder (D) contains alkali-soluble binder resin which has a polymeric group.   The photosensitive composition of any one of Claims 1-3 in which the said binder (D) contains a polymeric compound.   The photosensitive composition of any one of Claims 1-6 whose refractive index of the said hollow or porous particle | grain is 1.10-1.40.   The photosensitive composition of any one of Claims 1-7 used for the coating | coated application of a micro lens.   The pattern formation material which is the photosensitive composition of any one of Claims 1-8.   The photosensitive film | membrane formed with the photosensitive composition of any one of Claims 1-8.   A pattern forming method comprising a step of forming a photosensitive film according to claim 10, a step of exposing the photosensitive film, and a developing step of developing with an alkaline developer to obtain a pattern film.   A pattern film obtained by the pattern forming method according to claim 11.   A low refractive index film, which is the pattern film according to claim 12.   An antireflection film, which is the low refractive index film according to claim 13.   An optical device having the low refractive index film according to claim 13 or the antireflection film according to claim 14.   A solid-state imaging device comprising the optical device according to claim 15.