JP5617570B2 - Touch panel - Google Patents

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JP5617570B2
JP5617570B2 JP2010267983A JP2010267983A JP5617570B2 JP 5617570 B2 JP5617570 B2 JP 5617570B2 JP 2010267983 A JP2010267983 A JP 2010267983A JP 2010267983 A JP2010267983 A JP 2010267983A JP 5617570 B2 JP5617570 B2 JP 5617570B2
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conductive layer
touch panel
layer
adhesive layer
upper conductive
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JP2012118762A (en
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田邉 功二
功二 田邉
松本 賢一
賢一 松本
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Panasonic Corp
Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Description

本発明は、主に各種電子機器の操作に用いられるタッチパネルに関するものである。   The present invention relates to a touch panel used mainly for operating various electronic devices.

近年、携帯電話や電子カメラ等の各種電子機器の高機能化や多様化が進むに伴い、液晶表示素子等の表示素子の前面に光透過性のタッチパネルを装着し、このタッチパネルを通して背面の表示素子の表示を見ながら、指等でタッチパネルに触れ操作することによって、機器の様々な機能の切換えを行うものが増えており、見易く確実な操作の行えるものが求められている。   In recent years, as various electronic devices such as mobile phones and electronic cameras have become highly functional and diversified, a light-transmissive touch panel is mounted on the front surface of a display element such as a liquid crystal display element, and the display element on the back side is attached through this touch panel. There are an increasing number of devices that switch various functions of a device by touching the touch panel with a finger or the like while viewing the display, and there is a demand for a device that can be easily and reliably operated.

このような従来のタッチパネルについて、図6を用いて説明する。   Such a conventional touch panel will be described with reference to FIG.

なお、この図面は構成を判り易くするために、部分的に寸法を拡大して表している。   In addition, in this drawing, in order to make the configuration easy to understand, the dimensions are partially enlarged.

図6は従来のタッチパネルの分解斜視図であり、同図において、1は厚さ50〜125μm前後の、フィルム状で光透過性の上基板で、上面には酸化インジウム錫等の光透過性で略帯状の、複数の上導電層2が左右方向に配列形成されると共に、一端が上導電層2端部に連結され他端が外周前端に延出する銀やカーボン等の複数の上電極3が、上導電層2とは直交方向の前後方向に延出形成されている。   FIG. 6 is an exploded perspective view of a conventional touch panel. In FIG. 6, reference numeral 1 denotes a film-like light transmissive upper substrate having a thickness of about 50 to 125 μm, and the upper surface is light transmissive such as indium tin oxide. A plurality of upper conductive layers 2 made of silver, carbon, or the like, each having a substantially strip-like shape, arranged in the left-right direction, one end connected to the end of the upper conductive layer 2 and the other end extending to the front end of the outer periphery. However, the upper conductive layer 2 is formed to extend in the front-rear direction orthogonal to the upper conductive layer 2.

また、4は同じく厚さ50〜125μm前後のフィルム状で光透過性の下基板で、上面には酸化インジウム錫等の光透過性で略帯状の複数の下導電層5が、上導電層2とは直交方向の前後方向に配列形成されると共に、一端が下導電層5端部に連結され他端が外周前端に延出する銀やカーボン等の複数の下電極6が、下導電層5と平行方向の前後方向に延出形成されている。   Similarly, reference numeral 4 denotes a film-like light-transmitting lower substrate having a thickness of about 50 to 125 μm, and a plurality of light-transmitting, substantially band-like lower conductive layers 5 such as indium tin oxide on the upper surface. A plurality of lower electrodes 6 such as silver and carbon whose one end is connected to the end of the lower conductive layer 5 and the other end extends to the front end of the outer periphery are formed in the lower conductive layer 5. And extending in the front-rear direction of the parallel direction.

さらに、7は厚さ0.3〜2mm前後の、板状またはフィルム状で光透過性のカバー基板で、下基板4上面に上基板1、上基板1上面にカバー基板7が重ねられると共に、これらが各々接着剤(図示せず)等によって貼り合わされて、タッチパネルが構成されている。   Furthermore, 7 is a plate-like or film-like light-transmitting cover substrate having a thickness of around 0.3 to 2 mm. The upper substrate 1 is overlaid on the upper surface of the lower substrate 4, and the cover substrate 7 is overlaid on the upper surface of the upper substrate 1. These are each bonded by an adhesive (not shown) or the like to constitute a touch panel.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、外周前端に延出した複数の上電極3や下電極6がフレキシブル配線板やコネクタ(図示せず)等を介して、機器の電子回路(図示せず)に電気的に接続される。   The touch panel configured as described above is disposed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and a plurality of upper electrodes 3 and lower electrodes 6 extending to the front end of the outer periphery are flexible wirings. It is electrically connected to an electronic circuit (not shown) of the device via a board, a connector (not shown) or the like.

以上の構成において、電子回路から複数の上電極3と下電極6へ順次電圧が印加された状態で、タッチパネル背面の表示素子の表示に応じて、カバー基板7上面を指等で触れて操作すると、この操作した箇所の上導電層2と下導電層5の間の静電容量が変化するため、これによって操作された箇所を電子回路が検出し、機器の様々な機能の切換えが行われる。   In the above configuration, when a voltage is sequentially applied from the electronic circuit to the plurality of upper electrodes 3 and the lower electrodes 6, when the upper surface of the cover substrate 7 is touched with a finger or the like according to the display on the display element on the back surface of the touch panel, Since the electrostatic capacity between the upper conductive layer 2 and the lower conductive layer 5 in the operated part changes, the electronic circuit detects the operated part, and various functions of the device are switched.

つまり、例えば複数のメニュー等が背面の表示素子に表示された状態で、所望のメニュー上のカバー基板7上面に指等を触れると、この指に電荷の一部が導電して、操作した箇所のタッチパネルの上導電層2と下導電層5の間の容量が変化し、これを電子回路が検出することによって、所望のメニューの選択等が行えるように構成されているものであった。   That is, for example, when a finger or the like is touched on the upper surface of the cover substrate 7 on a desired menu in a state where a plurality of menus or the like are displayed on the display element on the back, a part of the charge is conducted to the finger, The capacitance between the upper conductive layer 2 and the lower conductive layer 5 of the touch panel is changed, and the electronic circuit detects the capacitance so that a desired menu can be selected.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。   As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開2009−93397号公報JP 2009-93397 A

しかしながら、上記従来のタッチパネルにおいては、カバー基板7の下面にフィルム状の上基板1と、同じくフィルム状の下基板4が重ねて形成されているため、全体の厚さが厚くなってしまうと共に、光透過率も87%前後となり、背面の表示素子のメニュー等の表示が見づらいものとなってしまうという課題があった。   However, in the conventional touch panel, since the film-like upper substrate 1 and the film-like lower substrate 4 are formed on the lower surface of the cover substrate 7 so as to overlap with each other, the overall thickness becomes thicker. The light transmittance was also about 87%, and there was a problem that the display of the menu of the display element on the back surface was difficult to see.

本発明は、このような従来の課題を解決するものであり、背面の表示素子の表示が見易く、操作の行い易いタッチパネルを提供することを目的とする。   The present invention solves such a conventional problem, and an object of the present invention is to provide a touch panel in which the display on the back display element is easy to see and easy to operate.

上記目的を達成するために本発明は、以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項1に記載の発明は、略帯状で複数の上導電層をカバー基板下面に接着層を介して設けると共に、上導電層と直交方向に配列された略帯状で複数の下導電層を、上導電層下面に接着層を介して形成してタッチパネルを構成したものであり、フィルム状の上基板や下基板を用いず、カバー基板下面に接着層を介して上導電層を、この下面に接着層を介して下導電層を設けることによって、全体の光透過率を大きなものとすることができるため、タッチパネル背面の表示素子の表示が見易く、容易で確実な操作が可能なタッチパネルを得ることができるという作用を有する。   According to the first aspect of the present invention, a plurality of upper conductive layers having a substantially strip shape are provided on the lower surface of the cover substrate via an adhesive layer, and a plurality of lower conductive layers having a substantially strip shape arranged in a direction orthogonal to the upper conductive layer. A layer is formed on the lower surface of the upper conductive layer via an adhesive layer to constitute a touch panel. The upper conductive layer is formed on the lower surface of the cover substrate via the adhesive layer without using a film-like upper substrate or lower substrate. By providing the lower conductive layer on the lower surface through an adhesive layer, the overall light transmittance can be increased, so that the display on the back of the touch panel is easy to see and the touch panel can be easily and reliably operated. It has the effect | action that can be obtained.

請求項2に記載の発明は、請求項1記載の発明において、下面に微細な凹凸部が形成された無反射層を、下導電層の下面に設けたものであり、無反射層によって外部光等の反射を防ぐことができるため、タッチパネルの光透過率をさらに大きくし、より見易く、操作の行い易いものとすることができるという作用を有する。   According to a second aspect of the present invention, in the first aspect of the invention, an antireflective layer having a fine uneven portion formed on the lower surface is provided on the lower surface of the lower conductive layer. Therefore, the light transmittance of the touch panel can be further increased, making it easier to see and operate.

以上のように本発明によれば、背面の表示素子の表示が見易く、容易で確実な操作が可能なタッチパネルを実現することができるという有利な効果が得られる。   As described above, according to the present invention, it is possible to obtain an advantageous effect that it is possible to realize a touch panel that allows easy and reliable operation of the display on the back display element.

本発明の一実施の形態によるタッチパネルの断面図Sectional drawing of the touchscreen by one embodiment of this invention 同分解斜視図Exploded perspective view 同部分断面図Partial sectional view of the same 同部分断面図Partial sectional view of the same 同部分断面図Partial sectional view of the same 従来のタッチパネルの分解斜視図Exploded perspective view of a conventional touch panel

以下、本発明の実施の形態について、図1〜図5を用いて説明する。   Embodiments of the present invention will be described below with reference to FIGS.

なお、これらの図面は構成を判り易くするために、部分的に寸法を拡大して表している。   These drawings are partially enlarged in size for easy understanding of the configuration.

また、背景技術の項で説明した構成と同一構成の部分には同一符号を付して、詳細な説明を簡略化する。   Further, the same reference numerals are given to the same components as those described in the background art section, and the detailed description will be simplified.

(実施の形態)
図1は本発明の一実施の形態によるタッチパネルの断面図、図2は同分解斜視図であり、同図において、7はガラスやポリメチルメタクリレート、ポリカーボネート等の板状またはフィルム状で、厚さ0.3〜2mm前後の光透過性のカバー基板で、この下面には紫外線硬化性のアクリレート系や熱硬化性のエポキシ系等の、厚さ10〜50μm前後の硬化性接着層11が設けられている。
(Embodiment)
FIG. 1 is a cross-sectional view of a touch panel according to an embodiment of the present invention, FIG. 2 is an exploded perspective view thereof, in which 7 is a plate or film shape such as glass, polymethyl methacrylate, polycarbonate, etc. A light-transmitting cover substrate of about 0.3 to 2 mm, and a curable adhesive layer 11 having a thickness of about 10 to 50 μm, such as an ultraviolet curable acrylate type or a thermosetting epoxy type, is provided on the lower surface. ing.

また、カバー基板7下面には硬化性接着層11を介して、酸化インジウム錫や酸化錫等の光透過性で略帯状の、複数の上導電層12が左右方向に配列形成されると共に、一端が上導電層12端部に連結され他端が外周前端に延出する、酸化インジウム錫や酸化錫等の上に蒸着等によって銅等の金属箔が重ねられた複数の上電極13が、上導電層12とは直交方向の前後方向に延出形成されている。   In addition, a plurality of upper conductive layers 12 that are light-transmitting and substantially band-shaped such as indium tin oxide and tin oxide are arranged on the lower surface of the cover substrate 7 with a curable adhesive layer 11 arranged in the left-right direction. Is connected to the end of the upper conductive layer 12 and the other end extends to the front end of the outer periphery, and a plurality of upper electrodes 13 in which a metal foil such as copper is stacked on the indium tin oxide or tin oxide by vapor deposition or the like. The conductive layer 12 is formed to extend in the front-rear direction in the orthogonal direction.

そして、この上導電層12下面には同じく硬化性接着層11Aが積層形成されると共に、硬化性接着層11A下面には、酸化インジウム錫や酸化錫等の光透過性で略帯状の複数の下導電層15が、上導電層12とは直交方向の前後方向に配列形成され、酸化インジウム錫や酸化錫等の上に銅等の金属箔が重ねられた複数の下電極16が、一端が下導電層15端部に連結され他端が外周前端に延出するように、下導電層15と平行方向の前後方向に延出形成されている。   A curable adhesive layer 11A is similarly laminated on the lower surface of the upper conductive layer 12, and a lower surface of the curable adhesive layer 11A has a plurality of light-transmitting substantially band-like lower layers such as indium tin oxide and tin oxide. A plurality of lower electrodes 16 in which a conductive layer 15 is arranged in the front-rear direction orthogonal to the upper conductive layer 12 and a metal foil such as copper is superimposed on indium tin oxide, tin oxide, or the like, has one end on the lower side. The conductive layer 15 is connected to the end of the conductive layer 15 and extends in the front-rear direction parallel to the lower conductive layer 15 so that the other end extends to the front end of the outer periphery.

なお、この複数の上導電層12と下導電層15は、複数の方形部が帯状に連結されて形成されると共に、これらの間には、略方形の複数の空隙部が設けられ、上導電層12と下導電層15が硬化性接着層11Aを介して、所定の間隙を空けて対向した状態では、各々の方形部が各々の空隙部に上下で交互に重なるように形成されている。   The plurality of upper conductive layers 12 and the lower conductive layer 15 are formed by connecting a plurality of square portions in a strip shape, and a plurality of substantially square gap portions are provided between them. In a state where the layer 12 and the lower conductive layer 15 are opposed to each other with a predetermined gap through the curable adhesive layer 11A, the respective rectangular portions are formed so as to alternately overlap the upper and lower spaces.

さらに、17はアクリルやシクロオレフィン、ポリカーボネート等の無反射層で、下面には100〜350nm前後の高さと間隔で微細な凹凸部が形成されると共に、この無反射層17が下導電層15下面に形成されて、タッチパネルが構成されている。   Further, reference numeral 17 denotes an antireflective layer such as acrylic, cycloolefin, and polycarbonate. On the lower surface, fine irregularities are formed at a height and interval of about 100 to 350 nm, and the nonreflective layer 17 is formed on the lower surface of the lower conductive layer 15. The touch panel is formed.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、外周右端に延出した複数の上電極13や下電極16がフレキシブル配線板やコネクタ(図示せず)等を介して、機器の電子回路(図示せず)に電気的に接続される。   The touch panel configured as described above is disposed on the front surface of a display element such as a liquid crystal display element and attached to an electronic device, and a plurality of upper electrodes 13 and lower electrodes 16 extending to the outer peripheral right end are flexible wirings. It is electrically connected to an electronic circuit (not shown) of the device via a board, a connector (not shown) or the like.

以上の構成において、電子回路から複数の上電極13と下電極16へ順次電圧が印加された状態で、タッチパネル背面の表示素子の表示に応じて、カバー基板7上面に指等を近接、あるいはカバー基板7上面に触れて操作すると、この操作した箇所の上導電層12と下導電層15の間の静電容量が変化するため、これによって操作された箇所を電子回路が検出し、機器の様々な機能の切換えが行われる。   In the above-described configuration, with a voltage sequentially applied from the electronic circuit to the plurality of upper electrodes 13 and lower electrodes 16, a finger or the like is brought close to the upper surface of the cover substrate 7 according to the display on the display element on the back of the touch panel, or the cover is covered. When an operation is performed by touching the upper surface of the substrate 7, the capacitance between the upper conductive layer 12 and the lower conductive layer 15 at the operated position changes, so that the operated circuit is detected by the electronic circuit, and various devices are used. Function switching is performed.

つまり、例えば複数のメニュー等が背面の表示素子に表示された状態で、所望のメニュー上のカバー基板7上面に指等を近接、あるいは触れると、この指に電荷の一部が導電して、操作した箇所のタッチパネルの上導電層12と下導電層15の間の容量が変化し、これを電子回路が検出することによって、所望のメニューの選択等が行えるように構成されている。   That is, for example, when a plurality of menus and the like are displayed on the display element on the back, when a finger or the like is brought close to or touches the upper surface of the cover substrate 7 on the desired menu, a part of the electric charge is conducted to the fingers, The capacitance between the upper conductive layer 12 and the lower conductive layer 15 of the touch panel at the operated location is changed, and the electronic circuit detects this, whereby a desired menu can be selected.

なお、このようなタッチパネルを製作するには、図3(a)の部分断面図に示すように、先ず、上面全面に酸化インジウム錫の薄膜12A上に銅箔13Aが積層された、ポリエチレンテレフタレート等のフィルム状の基材20の、銅箔13A上面にフォトレジスト法等によって露光・現像を行い、上電極13のパターンをドライフィルム等の絶縁樹脂製の被膜でマスキングした後、この上電極13をエッチング液に浸漬して、不要な箇所の銅箔13Aを溶融除去する。   In order to manufacture such a touch panel, as shown in the partial cross-sectional view of FIG. 3A, first, a polyethylene foil such as polyethylene terephthalate in which a copper foil 13A is laminated on a thin film 12A of indium tin oxide on the entire upper surface. After exposing and developing the upper surface of the copper foil 13A of the film-like substrate 20 by a photoresist method or the like and masking the pattern of the upper electrode 13 with a coating made of an insulating resin such as a dry film, the upper electrode 13 is It is immersed in an etching solution, and unnecessary portions of the copper foil 13A are melted and removed.

そして、この後、酸化インジウム錫の薄膜12A上面にフォトレジスト法等によって、上導電層12のパターンを覆う被膜を形成した後、上記とは異なるエッチング液に浸漬し、不要な箇所の薄膜12Aを溶融除去して、図3(b)に示すように、基材20上面に略帯状の複数の上導電層12と、一端がこれらの端部に連結され他端が外周前端に延出する、酸化インジウム錫の上に銅箔が重ねられた、複数の上電極13を形成する。   Then, after a film covering the pattern of the upper conductive layer 12 is formed on the upper surface of the indium tin oxide thin film 12A by a photoresist method or the like, it is immersed in an etching solution different from the above, and the thin film 12A at an unnecessary portion is formed. As shown in FIG. 3 (b) by melting and removing, a plurality of upper conductive layers 12 having a substantially band shape on the upper surface of the base material 20, one end is connected to these end portions, and the other end extends to the outer peripheral front end. A plurality of upper electrodes 13 in which a copper foil is stacked on indium tin oxide are formed.

さらに、この後、複数の上導電層12や上電極13を覆うように、基材20上面全面に硬化性接着層11を貼付して、図3(c)に示すような、上面に複数の上導電層12や複数の上電極13、硬化性接着層11が形成された基材20を作製する。   Further, after that, a curable adhesive layer 11 is affixed to the entire upper surface of the base material 20 so as to cover the plurality of upper conductive layers 12 and the upper electrodes 13, and a plurality of surfaces on the upper surface as shown in FIG. The base material 20 on which the upper conductive layer 12, the plurality of upper electrodes 13, and the curable adhesive layer 11 are formed is produced.

また、同様に、図4(a)の部分断面図に示すように、上面全面に酸化インジウム錫の薄膜15A上に銅箔16Aが積層された基材20Aに、エッチング加工を行って、図4(b)に示すように、基材20A上面に複数の下導電層15と下電極16を形成した後、この上面全面に硬化性接着層11Aを貼付して、図4(c)に示すような、上面に複数の下導電層15や下電極16、硬化性接着層11Aが形成された基材20Aを作製する。   Similarly, as shown in the partial cross-sectional view of FIG. 4A, etching is performed on the base material 20A in which the copper foil 16A is laminated on the thin film 15A of indium tin oxide on the entire upper surface, and FIG. As shown in FIG. 4B, after a plurality of lower conductive layers 15 and lower electrodes 16 are formed on the upper surface of the substrate 20A, a curable adhesive layer 11A is pasted on the entire upper surface, as shown in FIG. The base material 20A having a plurality of lower conductive layers 15, lower electrodes 16, and curable adhesive layers 11A formed on the upper surface is prepared.

さらに、この上導電層12や上電極13が形成された基材20を、図5(a)の部分断面図に示すように、カバー基板7下面に硬化性接着層11によって貼り合わせた後、これに紫外線を照射、あるいは加熱加圧して、硬化性接着層11を硬化させる。   Further, after the base material 20 on which the upper conductive layer 12 and the upper electrode 13 are formed is bonded to the lower surface of the cover substrate 7 with the curable adhesive layer 11 as shown in the partial cross-sectional view of FIG. The curable adhesive layer 11 is cured by irradiating it with ultraviolet rays or heating and pressing.

次に、図5(b)に示すように、基材20を剥離して、上導電層12や上電極13を硬化性接着層11下面に転写した後、この下面に図5(c)に示すように、下導電層15や下電極16が形成された基材20Aを、硬化性接着層11Aによって貼り合わせ、同様に紫外線を照射、あるいは加熱加圧して、硬化性接着層11Aを硬化させる。   Next, as shown in FIG. 5B, after the base material 20 is peeled off and the upper conductive layer 12 and the upper electrode 13 are transferred to the lower surface of the curable adhesive layer 11, the lower surface of FIG. As shown, the base material 20A on which the lower conductive layer 15 and the lower electrode 16 are formed is bonded together by the curable adhesive layer 11A, and similarly, the curable adhesive layer 11A is cured by irradiating with ultraviolet rays or heating and pressing. .

そして、図5(d)に示すように、基材20Aを剥離し、下導電層15や下電極16を硬化性接着層11A下面に転写して、カバー基板7下面に硬化性接着層11を介して上導電層12や上電極13が形成され、この上導電層12下面に硬化性接着層11Aを介して下導電層15や下電極16が設けられたタッチパネルが完成する。   Then, as shown in FIG. 5D, the base material 20A is peeled off, the lower conductive layer 15 and the lower electrode 16 are transferred to the lower surface of the curable adhesive layer 11A, and the curable adhesive layer 11 is applied to the lower surface of the cover substrate 7. Thus, the upper conductive layer 12 and the upper electrode 13 are formed, and a touch panel in which the lower conductive layer 15 and the lower electrode 16 are provided on the lower surface of the upper conductive layer 12 via the curable adhesive layer 11A is completed.

また、この下面にシート等を貼付し、下導電層15下面に微細な凹凸部が形成された無反射層17を設けて、図1に示すような、タッチパネルが製作される。   Moreover, a touch panel as shown in FIG. 1 is manufactured by sticking a sheet or the like on the lower surface and providing the non-reflective layer 17 having fine irregularities formed on the lower surface of the lower conductive layer 15.

つまり、本発明においては、略帯状で複数の上導電層12を、カバー基板7下面に硬化性接着層11を介して設けると共に、上導電層12と直交方向に配列された略帯状で複数の下導電層15を、上導電層12下面に硬化性接着層11Aを介して重ねて形成することによって、光透過率の大きなタッチパネルが得られるように構成されている。   In other words, in the present invention, a plurality of upper conductive layers 12 having a substantially band shape are provided on the lower surface of the cover substrate 7 via the curable adhesive layer 11, and a plurality of strips having a substantially band shape arranged in a direction orthogonal to the upper conductive layer 12. By forming the lower conductive layer 15 on the lower surface of the upper conductive layer 12 through the curable adhesive layer 11A, a touch panel having a high light transmittance is obtained.

すなわち、背景技術の項で説明したような、厚さが50〜125μm前後と厚いフィルム状の上基板1や下基板4を用いることなく、厚さが10〜50μm前後と薄い硬化性接着層11や11Aを介して、カバー基板7下面に上導電層12を、この上導電層12下面に下導電層15を各々形成することで、光透過率を91%前後の大きなものとすることができるため、タッチパネル背面の表示素子の表示が見易く、容易で確実な操作が行えるようになっている。   That is, as described in the background art section, a thin curable adhesive layer 11 having a thickness of about 10 to 50 μm is used without using the upper substrate 1 and the lower substrate 4 having a thickness of about 50 to 125 μm. By forming the upper conductive layer 12 on the lower surface of the cover substrate 7 and the lower conductive layer 15 on the lower surface of the upper conductive layer 12 via 11A, the light transmittance can be increased to about 91%. Therefore, the display of the display element on the back of the touch panel is easy to see, and an easy and reliable operation can be performed.

さらに、下面に微細な凹凸部が形成された無反射層17を、下導電層15下面に設けることによって、この無反射層17によって外部光等の反射を防ぐことができるため、光透過率をさらに大きくすることが可能となる。   Further, by providing the non-reflective layer 17 having a fine uneven portion on the lower surface on the lower surface of the lower conductive layer 15, the non-reflective layer 17 can prevent reflection of external light or the like. It can be further increased.

つまり、光の波長の400〜750nm前後よりもはるかに小さな、100〜350nm前後の高さと間隔の微細な凹凸部が下面に形成された無反射層17を、下導電層15下面に設けることで、この無反射層17によって外部光等の反射を防ぎ、光透過率を96%前後の大きなものとすることができるため、タッチパネルをより見易く、操作の行い易いものとすることができる。   That is, by providing the lower surface of the lower conductive layer 15 with the non-reflective layer 17 on the lower surface of which concave and convex portions having a height and interval of about 100 to 350 nm, which are much smaller than the wavelength of light of about 400 to 750 nm, are formed. Since the non-reflective layer 17 prevents reflection of external light and the like, and the light transmittance can be increased to about 96%, the touch panel can be more easily seen and operated.

なお、複数の上電極13や下電極16は、銀やカーボン等を用いて印刷によって基材20や20A上面に形成し、これを硬化性接着層11や11A下面に転写して形成しても本発明の実施は可能であるが、上記のように酸化インジウム錫や酸化錫等の上に銅等の金属箔が重ねられたものとすることで、銅等の金属箔によって上電極13や下電極16のにじみやかすれ等のない、低く安定した抵抗値が保たれると共に、線幅や線間が0.03〜0.05mm前後の、細線化や狭間隔化を図った上電極13や下電極16を形成することも可能となる。   The plurality of upper electrodes 13 and lower electrodes 16 may be formed on the upper surface of the base material 20 or 20A by printing using silver, carbon or the like, and transferred to the lower surface of the curable adhesive layer 11 or 11A. Although it is possible to implement the present invention, the upper electrode 13 and the lower electrode are made of metal foil such as copper by overlapping the metal foil such as copper on the indium tin oxide or tin oxide as described above. The upper electrode 13 is designed to be thinned or narrowed, with a low and stable resistance value without blurring or blurring of the electrode 16 and with a line width and line spacing of around 0.03 to 0.05 mm. The lower electrode 16 can also be formed.

また、以上の説明では、上導電層12や下導電層15を、酸化インジウム錫や酸化錫等で形成した構成について説明したが、ポリチオフェン等の導電性ポリマーや、カーボンや銀等のナノチューブを分散させた光透過性の樹脂によって、略帯状の上導電層12や下導電層15を形成した構成としても、本発明の実施は可能である。   In the above description, the structure in which the upper conductive layer 12 and the lower conductive layer 15 are formed of indium tin oxide, tin oxide, or the like has been described. However, a conductive polymer such as polythiophene or a nanotube such as carbon or silver is dispersed. The present invention can be carried out even when the substantially band-shaped upper conductive layer 12 and lower conductive layer 15 are formed of the light-transmitting resin.

このように本実施の形態によれば、略帯状で複数の上導電層12をカバー基板7下面に硬化性接着層11を介して設けると共に、上導電層12と直交方向に配列された略帯状で複数の下導電層15を、上導電層12下面に硬化性接着層11Aを介して形成することによって、フィルム状の上基板や下基板を用いず、カバー基板7下面に硬化性接着層11や11Aを介して、上導電層12と下導電層15を設けることで、全体の光透過率を大きなものとすることができるため、タッチパネル背面の表示素子の表示が見易く、容易で確実な操作が可能なタッチパネルを得ることができるものである。   As described above, according to the present embodiment, a plurality of upper conductive layers 12 having a substantially strip shape are provided on the lower surface of the cover substrate 7 via the curable adhesive layer 11 and are arranged in a direction orthogonal to the upper conductive layer 12. By forming the plurality of lower conductive layers 15 on the lower surface of the upper conductive layer 12 via the curable adhesive layer 11A, the curable adhesive layer 11 is formed on the lower surface of the cover substrate 7 without using a film-like upper substrate or lower substrate. By providing the upper conductive layer 12 and the lower conductive layer 15 via 11A, the overall light transmittance can be increased, so that the display on the back of the touch panel is easy to see, easy and reliable operation The touch panel which can do is obtained.

また、下面に微細な凹凸部が形成された無反射層17を、下導電層15下面に設けることで、無反射層17によって外部光等の反射を防ぐことができるため、タッチパネルの光透過率をさらに大きくし、より見易く、操作の行い易いものとすることができる。   In addition, since the non-reflective layer 17 having a fine uneven portion formed on the lower surface is provided on the lower surface of the lower conductive layer 15, the non-reflective layer 17 can prevent reflection of external light and the like. Can be further increased to make it easier to see and operate.

本発明によるタッチパネルは、背面の表示素子の表示が見易く、容易で確実な操作が可能なものを得ることができるという有利な効果を有し、主に各種電子機器の操作用として有用である。   The touch panel according to the present invention has an advantageous effect that it is easy to see the display of the display element on the back surface and can be easily and surely operated, and is mainly useful for operation of various electronic devices.

7 カバー基板
11、11A 硬化性接着層
12 上導電層
12A 薄膜
13 上電極
13A 銅箔
15 下導電層
15A 薄膜
16 下電極
16A 銅箔
17 無反射層
20、20A 基材
7 Cover substrate 11, 11A Curing adhesive layer 12 Upper conductive layer 12A Thin film 13 Upper electrode 13A Copper foil 15 Lower conductive layer 15A Thin film 16 Lower electrode 16A Copper foil 17 Non-reflective layer 20, 20A Base material

Claims (2)

所定方向に配列された略帯状で複数の上導電層と、この上導電層と所定の間隙を空けて直交方向に配列された略帯状で複数の下導電層からなり、上記上導電層をカバー基板下面に接着層を介して設けると共に、上記下導電層を上記上導電層下面に接着層を介して形成したタッチパネル。 A plurality of upper conductive layers in a substantially strip shape arranged in a predetermined direction, and a plurality of lower conductive layers in a substantially strip shape arranged in a perpendicular direction with a predetermined gap from the upper conductive layer, covering the upper conductive layer A touch panel in which the lower conductive layer is provided on the lower surface of the substrate via the adhesive layer, and the lower conductive layer is formed on the lower surface of the upper conductive layer via the adhesive layer. 下面に微細な凹凸部が形成された無反射層を、下導電層下面に設けた請求項1記載のタッチパネル。 The touch panel according to claim 1, wherein a non-reflective layer having a fine uneven portion formed on the lower surface is provided on the lower surface of the lower conductive layer.
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