JP2013012019A - Touch panel - Google Patents

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JP2013012019A
JP2013012019A JP2011144032A JP2011144032A JP2013012019A JP 2013012019 A JP2013012019 A JP 2013012019A JP 2011144032 A JP2011144032 A JP 2011144032A JP 2011144032 A JP2011144032 A JP 2011144032A JP 2013012019 A JP2013012019 A JP 2013012019A
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substrate
touch panel
conductive layer
electrode
conductive
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Kenji Nishimura
健司 西村
Toshiharu Fukui
俊晴 福井
Tsutomu Aisaka
勉 相阪
Masanori Yoshida
雅憲 吉田
Keishu Muraoka
桂舟 村岡
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Panasonic Corp
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Panasonic Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a touch panel used for various electronic apparatuses, enabling corrosion prevention and secure operation.SOLUTION: A touch panel has a conductive coating layer 13, 16, 19 formed on at least one of an end portion 3A of an upper electrode 3 and an end portion 6A of a lower electrode 6, so that the end portion 3A or 6A of the upper electrode 3 or the lower electrode 6 is covered with a synthetic resin containing silver, carbon or conductive particles dispersed therein, so as to prevent corrosion thereof even when used in high temperature and high humidity and to enable a secure and stable operation.

Description

本発明は、主に各種電子機器の操作に用いられるタッチパネルに関するものである。   The present invention relates to a touch panel used mainly for operating various electronic devices.

近年、携帯電話や電子カメラ等の各種電子機器の高機能化や多様化が進むなか、液晶表示素子等の表示素子の前面に光透過性のタッチパネルを装着し、このタッチパネルを通して背面の表示素子の表示を見ながら、指等でタッチパネルに触れ操作することによって、機器の様々な機能の切換えを行うものが増えており、使い易く確実な操作を行えるものが求められている。   In recent years, as various types of electronic devices such as mobile phones and electronic cameras have become highly functional and diversified, a light-transmissive touch panel is mounted on the front surface of a display element such as a liquid crystal display element, and the display element on the back side is attached through this touch panel. The number of devices that switch various functions of devices by touching the touch panel with a finger or the like while viewing the display is increasing, and there is a demand for a device that can be used easily and reliably.

このような従来のタッチパネルについて、図5を用いて説明する。   Such a conventional touch panel will be described with reference to FIG.

なお、この図面は構成を判り易くするために、部分的に寸法を拡大して表している。   In addition, in this drawing, in order to make the configuration easy to understand, the dimensions are partially enlarged.

図5は従来のタッチパネルの分解斜視図であり、同図において、1はフィルム状で光透過性の上基板で、上面には酸化インジウム錫等の光透過性で略帯状の、複数の上導電層2が前後方向に配列形成されると共に、この上導電層2の前端または後端に連結され、端部3Aが上基板1の外周右端に延出する銅箔製の複数の上電極3が、上導電層2とは直交方向の左右方向に延出形成されている。   FIG. 5 is an exploded perspective view of a conventional touch panel. In FIG. 5, reference numeral 1 denotes a film-like and light-transmitting upper substrate, and the upper surface has a light-transmitting and substantially band-like shape such as indium tin oxide. Layers 2 are arranged in the front-rear direction, connected to the front end or rear end of the upper conductive layer 2, and a plurality of upper electrodes 3 made of copper foil whose end 3 A extends to the outer right end of the upper substrate 1. The upper conductive layer 2 is formed so as to extend in the left-right direction in the orthogonal direction.

また、4は同じくフィルム状で光透過性の下基板で、上面には酸化インジウム錫等の光透過性で略帯状の複数の下導電層5が、上導電層2とは直交方向の左右方向に配列形成されると共に、この下導電層5右端に連結され端部6Aが下基板4の外周右端に延出する、上電極3と同様の複数の下電極6が、下導電層5と平行方向の左右方向に延出形成されている。   Similarly, 4 is a film-like, light-transmitting lower substrate, and a plurality of light-transmitting, substantially band-like lower conductive layers 5 such as indium tin oxide are formed on the upper surface, and the left-right direction perpendicular to the upper conductive layer 2 A plurality of lower electrodes 6 similar to the upper electrode 3, which are connected to the right end of the lower conductive layer 5 and have an end 6 A extending to the outer peripheral right end of the lower substrate 4, are parallel to the lower conductive layer 5. It is formed extending in the left-right direction.

さらに、7はフィルム状で光透過性のカバー基板で、下基板4上面に上基板1、上基板1上面にカバー基板7が重ねられると共に、これらが各々接着剤(図示せず)等によって貼り合わされて、タッチパネルが構成されている。   Reference numeral 7 denotes a film-like light-transmitting cover substrate. The upper substrate 1 is overlaid on the upper surface of the lower substrate 4, and the cover substrate 7 is overlaid on the upper surface of the upper substrate 1, and these are adhered to each other with an adhesive (not shown). Together, a touch panel is configured.

なお、このようなタッチパネルの上基板1や下基板4は、一般に、上基板1や下基板4上面全面に、酸化インジウム錫と銅箔の薄膜をスパッタ法等によって重ねて形成した後、上導電層2と上電極3、下導電層5と下電極6を形成する箇所をドライフィルム等の絶縁樹脂製の被膜でマスキングし、所定のエッチング液に浸漬して、不要な箇所の酸化インジウム錫と銅を溶融除去して、上面に複数の上導電層2と上電極3、下導電層5と下電極6が形成された上基板1や下基板4が作製される。   Note that the upper substrate 1 and the lower substrate 4 of such a touch panel are generally formed by forming a thin film of indium tin oxide and copper foil on the entire upper surface of the upper substrate 1 or the lower substrate 4 by sputtering or the like, The portions where the layer 2 and the upper electrode 3 and the lower conductive layer 5 and the lower electrode 6 are to be formed are masked with a coating made of an insulating resin such as a dry film, and immersed in a predetermined etching solution. The upper substrate 1 and the lower substrate 4 having the upper conductive layer 2 and the upper electrode 3, and the lower conductive layer 5 and the lower electrode 6 formed on the upper surface are produced by melting and removing copper.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、外周右端に延出した複数の上電極3や下電極6の端部3Aや6Aが、フレキシブル配線板やコネクタ(図示せず)等を介して、機器の電子回路(図示せず)に電気的に接続される。   And the touch panel comprised in this way is arrange | positioned in the front surface of display elements, such as a liquid crystal display element, is mounted | worn with an electronic device, and is the edge part of the several upper electrode 3 and the lower electrode 6 extended to the outer periphery right end 3A and 6A are electrically connected to an electronic circuit (not shown) of the device via a flexible wiring board, a connector (not shown), or the like.

以上の構成において、電子回路から複数の上電極3と下電極6へ順次電圧が印加された状態で、タッチパネル背面の表示素子の表示に応じて、カバー基板7上面を指等で触れて操作すると、この操作した箇所の上導電層2と下導電層5の間の静電容量が変化するため、これによって操作された箇所を電子回路が検出し、機器の様々な機能の切換えが行われる。   In the above configuration, when a voltage is sequentially applied from the electronic circuit to the plurality of upper electrodes 3 and the lower electrodes 6, when the upper surface of the cover substrate 7 is touched with a finger or the like according to the display on the display element on the back of the touch panel, the operation is performed. Since the electrostatic capacity between the upper conductive layer 2 and the lower conductive layer 5 in the operated part changes, the electronic circuit detects the operated part, and various functions of the device are switched.

つまり、例えば複数のメニュー等が背面の表示素子に表示された状態で、所望のメニュー上のカバー基板7上面に指等を触れると、この指に電荷の一部が導電して、操作した箇所のタッチパネルの上導電層2と下導電層5の間の容量が変化し、これを電子回路が検出することによって、所望のメニューの選択等が行われるように構成されているものであった。   That is, for example, when a finger or the like is touched on the upper surface of the cover substrate 7 on a desired menu in a state where a plurality of menus or the like are displayed on the display element on the back, a part of the charge is conducted to the finger, The capacitance between the upper conductive layer 2 and the lower conductive layer 5 of the touch panel is changed, and the electronic circuit detects this, whereby a desired menu is selected.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。   As prior art document information related to the invention of this application, for example, Patent Document 1 is known.

特開2009−93397号公報JP 2009-93397 A

しかしながら、上記従来のタッチパネルにおいては、上基板1や下基板4上面に延出形成された銅箔製の複数の上電極3や下電極6は、一般にスパッタ法等によって、厚さが150nm前後の薄膜状に形成されているため、高温高湿中で長期間使用されると、特に接着剤等に覆われていない上電極3や下電極6の端部3Aや6Aに腐食が生じ、抵抗値の増加や接続が不安定なものになってしまう場合があるという課題があった。   However, in the above conventional touch panel, the upper electrode 3 and the lower electrode 6 made of copper foil extending on the upper surface of the upper substrate 1 and the lower substrate 4 are generally about 150 nm thick by sputtering or the like. Since it is formed into a thin film, when it is used for a long time at high temperature and high humidity, the end portions 3A and 6A of the upper electrode 3 and the lower electrode 6 that are not covered with an adhesive or the like are particularly corroded, and the resistance value There is a problem that the increase in the connection and the connection may become unstable.

本発明は、このような従来の課題を解決するものであり、腐食を防ぎ、確実な操作が可能なタッチパネルを提供することを目的とする。   The present invention solves such a conventional problem, and an object of the present invention is to provide a touch panel that prevents corrosion and enables reliable operation.

上記目的を達成するために本発明は、上電極または下電極の少なくとも一方の端部に、導電被覆層を形成してタッチパネルを構成したものであり、上電極や下電極の端部が銀やカーボン、あるいは導電粒子を分散した合成樹脂で覆われ、高温高湿中で使用された場合でも、これらの腐食を防ぐことができるため、確実で安定した操作が可能なタッチパネルを得ることができるという作用を有するものである。   In order to achieve the above object, the present invention comprises a touch panel by forming a conductive coating layer on at least one end of an upper electrode or a lower electrode, and the end of the upper electrode or the lower electrode is made of silver or Even when it is covered with carbon or synthetic resin with dispersed conductive particles and used in high temperature and high humidity, these corrosions can be prevented, so that a touch panel capable of reliable and stable operation can be obtained. It has an action.

以上のように本発明によれば、腐食を防ぎ、確実な操作が可能なタッチパネルを実現することができるという有利な効果が得られる。   As described above, according to the present invention, an advantageous effect that a touch panel capable of preventing corrosion and performing a reliable operation can be realized.

本発明の一実施の形態によるタッチパネルの断面図Sectional drawing of the touchscreen by one embodiment of this invention 同分解斜視図Exploded perspective view 同部分断面図Partial sectional view of the same 同他の実施の形態による部分断面図Partial sectional view according to another embodiment 従来のタッチパネルの分解斜視図Exploded perspective view of a conventional touch panel

以下、本発明の実施の形態について、図1〜図4を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

なお、これらの図面は構成を判り易くするために、部分的に寸法を拡大して表している。   These drawings are partially enlarged in size for easy understanding of the configuration.

また、背景技術の項で説明した構成と同一構成の部分には同一符号を付して、詳細な説明を簡略化する。   Further, the same reference numerals are given to the same components as those described in the background art section, and the detailed description will be simplified.

(実施の形態)
図1は本発明の一実施の形態によるタッチパネルの断面図、図2は同分解斜視図であり、同図において、1はポリエチレンテレフタレートやポリエーテルサルホン、ポリカーボネート等のフィルム状で光透過性の上基板で、この上面には厚さ10〜100nm前後で、酸化インジウム錫や酸化錫等の光透過性で略帯状の複数の上導電層2が、スパッタ法等によって前後方向に配列形成されている。
(Embodiment)
FIG. 1 is a cross-sectional view of a touch panel according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the touch panel, in which 1 is a film of polyethylene terephthalate, polyethersulfone, polycarbonate, etc. On the upper substrate, a plurality of light-transmitting, substantially band-like upper conductive layers 2 such as indium tin oxide and tin oxide are arranged on the upper surface in the front-rear direction by sputtering or the like. Yes.

そして、3は上導電層2の前端または後端に連結された上電極で、酸化インジウム錫等の上に蒸着等によって厚さ150nm前後の銅箔が重ねられ、端部3Aが上基板1の外周右端に延出する複数の上電極3が、上導電層2とは直交方向の左右方向に延出形成されている。   Reference numeral 3 denotes an upper electrode connected to the front end or the rear end of the upper conductive layer 2, and a copper foil having a thickness of about 150 nm is stacked on the indium tin oxide or the like by vapor deposition or the like. A plurality of upper electrodes 3 extending to the outer peripheral right end are formed to extend in the left-right direction perpendicular to the upper conductive layer 2.

さらに、この複数の上電極3の端部3Aには、図1や図3の部分断面図に示すように、ポリエステルやエポキシ等の樹脂に銀やカーボン等の導電粒子を分散した、厚さ10〜20μm前後の導電被覆層13が、端部3Aの上面及び側面を覆うと共に、下端がこの近傍の上基板1上面に密着して印刷形成されている。   Further, as shown in the partial cross-sectional views of FIGS. 1 and 3, the end portions 3A of the plurality of upper electrodes 3 have a thickness 10 in which conductive particles such as silver or carbon are dispersed in a resin such as polyester or epoxy. A conductive coating layer 13 having a thickness of about 20 μm covers the upper surface and side surfaces of the end portion 3A, and the lower end is printed in close contact with the upper surface of the upper substrate 1 in the vicinity thereof.

また、4は同じくフィルム状で光透過性の下基板で、上面には酸化インジウム錫等の光透過性で略帯状の複数の下導電層5が、上導電層2とは直交方向の左右方向に配列形成されると共に、この下導電層5右端に連結され端部6Aが下基板4の外周右端に延出する、上電極3と同様の複数の下電極6が、下導電層5と平行方向の左右方向に延出形成されている。   Similarly, 4 is a film-like, light-transmitting lower substrate, and a plurality of light-transmitting, substantially band-like lower conductive layers 5 such as indium tin oxide are formed on the upper surface, and the left-right direction perpendicular to the upper conductive layer 2 A plurality of lower electrodes 6 similar to the upper electrode 3, which are connected to the right end of the lower conductive layer 5 and have an end 6 A extending to the outer peripheral right end of the lower substrate 4, are parallel to the lower conductive layer 5. It is formed extending in the left-right direction.

そして、この複数の下電極6の端部6Aにも、導電被覆層13と同様の導電被覆層16が印刷によって、端部6Aの上面及び側面を覆うと共に、下端がこの近傍の下基板4上面に密着して形成されている。   A conductive coating layer 16 similar to the conductive coating layer 13 is also printed on the end portions 6A of the plurality of lower electrodes 6 by printing to cover the upper surface and side surfaces of the end portion 6A, and the lower end is the upper surface of the lower substrate 4 in the vicinity thereof. It is formed in close contact with.

なお、複数の上導電層2と下導電層5は、複数の方形部が帯状に連結されて形成されると共に、これらの間には、略方形の複数の空隙部が設けられ、上基板1と下基板4が積重された状態では、各々の方形部が各々の空隙部に上下で交互に重なるように形成されている。   The plurality of upper conductive layers 2 and the lower conductive layer 5 are formed by connecting a plurality of square portions in a band shape, and a plurality of substantially square gap portions are provided between them, and the upper substrate 1 In the state where the lower substrate 4 and the lower substrate 4 are stacked, the respective rectangular portions are formed so as to alternately overlap the upper and lower spaces.

さらに、7はフィルム状で光透過性のカバー基板で、下基板4上面に上基板1、上基板1上面にカバー基板7が重ねられると共に、これらが各々アクリルやゴム等の接着層18によって貼り合わされて、タッチパネルが構成されている。   Further, reference numeral 7 denotes a film-like and light-transmitting cover substrate. The upper substrate 1 is overlaid on the upper surface of the lower substrate 4, and the cover substrate 7 is overlaid on the upper surface of the upper substrate 1, and these are adhered by an adhesive layer 18 such as acrylic or rubber. Together, a touch panel is configured.

つまり、本実施の形態においては、前後方向に配列形成された複数の上導電層2と、これとは直交方向の左右方向に配列形成された下導電層5が、上基板1やこの下面の接着層18を介して、所定の間隙を空けて対向配置された構成となっている。   That is, in the present embodiment, a plurality of upper conductive layers 2 arranged in the front-rear direction and a lower conductive layer 5 arranged in the left-right direction orthogonal to the upper conductive layer 2 are formed on the upper substrate 1 and the lower surface thereof. It is configured to be opposed to each other with a predetermined gap through the adhesive layer 18.

なお、このようなタッチパネルの上基板1や下基板4を作製するには、先ず、上基板1や下基板4上面全面にスパッタ法等によって、厚さ10〜100nm前後の酸化インジウム錫等の薄膜を形成した後、この上面全面に同じくスパッタ法等によって、厚さ150nm前後の銅箔の薄膜を重ねて形成する。   In order to manufacture the upper substrate 1 and the lower substrate 4 of such a touch panel, first, a thin film such as indium tin oxide having a thickness of about 10 to 100 nm is formed on the entire upper surface of the upper substrate 1 or the lower substrate 4 by sputtering or the like. After that, a thin film of copper foil having a thickness of about 150 nm is formed on the entire upper surface by the same sputtering method or the like.

次に、この銅箔の薄膜上面にフォトレジスト法等によって露光・現像して、上電極3や下電極6を形成する箇所をドライフィルム等の絶縁樹脂製の被膜でマスキングした後、上基板1や下基板4を所定のエッチング液に浸漬し、不要な箇所の銅を溶融除去して、酸化インジウム錫等の薄膜上面に、銅箔の複数の上電極3や下電極6を形成する。   Next, the upper surface of the thin film of the copper foil is exposed and developed by a photoresist method or the like, and a portion where the upper electrode 3 and the lower electrode 6 are formed is masked with a coating made of an insulating resin such as a dry film. Alternatively, the lower substrate 4 is immersed in a predetermined etching solution, and unnecessary portions of copper are melted and removed to form a plurality of upper electrodes 3 and lower electrodes 6 of copper foil on the upper surface of a thin film such as indium tin oxide.

そして、この後、酸化インジウム錫等の薄膜上面の上導電層2や下導電層5を形成する箇所を、同じくマスキングして所定のエッチング液に浸漬し、不要な箇所の酸化インジウム錫等を溶融除去して、上基板1や下基板4上面に略帯状の複数の上導電層2や下導電層5、及び酸化インジウム錫等の上に銅箔が重ねられた複数の上電極3や下電極6が形成される。   After that, the portions where the upper conductive layer 2 and the lower conductive layer 5 on the upper surface of the thin film such as indium tin oxide are formed are similarly masked and immersed in a predetermined etching solution to melt unnecessary portions of indium tin oxide and the like. A plurality of upper electrodes 3 and lower electrodes in which a copper foil is superimposed on a plurality of upper conductive layers 2 and lower conductive layers 5, indium tin oxide, and the like that are removed from the upper substrate 1 and the lower substrate 4. 6 is formed.

さらに、この後、上導電層2や下導電層5の端部3Aや6Aに、スクリーン印刷によって厚さ10〜20μm前後の導電被覆層13や16を形成し、端部3Aや6Aの上面や側面が導電被覆層13や16に覆われると共に、導電被覆層13や16下端がこの近傍の上基板1や下基板4上面に密着形成された、上基板1や下基板4が製作される。   Further, after that, conductive coating layers 13 and 16 having a thickness of about 10 to 20 μm are formed by screen printing on the end portions 3A and 6A of the upper conductive layer 2 and the lower conductive layer 5, and the upper surfaces of the end portions 3A and 6A The upper substrate 1 and the lower substrate 4 are manufactured in which the side surfaces are covered with the conductive coating layers 13 and 16 and the lower ends of the conductive coating layers 13 and 16 are formed in close contact with the upper surfaces of the upper substrate 1 and the lower substrate 4 in the vicinity.

また、この上基板1や下基板4の端部3Aや6Aを除く上面全面に、接着層18を印刷等によって形成すると共に、下基板4上面に上基板1、上基板1上面にカバー基板7を重ね、これらを接着層18によって貼り合わせて、タッチパネルが完成する。   Further, an adhesive layer 18 is formed on the entire upper surface of the upper substrate 1 and the lower substrate 4 except for the end portions 3A and 6A by printing or the like, and the upper substrate 1 is formed on the upper surface of the lower substrate 4, and the cover substrate 7 is disposed on the upper surface of the upper substrate 1. Are stacked together by the adhesive layer 18 to complete the touch panel.

そして、このように構成されたタッチパネルが、液晶表示素子等の表示素子の前面に配置されて電子機器に装着されると共に、外周右端に延出した複数の上電極3や下電極6の端部3Aや6Aが、フレキシブル配線板やコネクタ(図示せず)等を介して、機器の電子回路(図示せず)に電気的に接続される。   And the touch panel comprised in this way is arrange | positioned in the front surface of display elements, such as a liquid crystal display element, is mounted | worn with an electronic device, and is the edge part of the several upper electrode 3 and the lower electrode 6 extended to the outer periphery right end 3A and 6A are electrically connected to an electronic circuit (not shown) of the device via a flexible wiring board, a connector (not shown), or the like.

以上の構成において、電子回路から複数の上電極3と下電極6へ順次電圧が印加された状態で、タッチパネル背面の表示素子の表示に応じて、カバー基板7上面を指等で触れて操作すると、この操作した箇所の上導電層2と下導電層5の間の静電容量が変化するため、これによって操作された箇所を電子回路が検出し、機器の様々な機能の切換えが行われる。   In the above configuration, when a voltage is sequentially applied from the electronic circuit to the plurality of upper electrodes 3 and the lower electrodes 6, when the upper surface of the cover substrate 7 is touched with a finger or the like according to the display on the display element on the back of the touch panel, the operation is performed. Since the electrostatic capacity between the upper conductive layer 2 and the lower conductive layer 5 in the operated part changes, the electronic circuit detects the operated part, and various functions of the device are switched.

つまり、例えば複数のメニュー等が背面の表示素子に表示された状態で、所望のメニュー上のカバー基板7上面に指等を触れると、この指に電荷の一部が導電して、操作した箇所のタッチパネルの上導電層2と下導電層5の間の容量が変化し、これを電子回路が検出することによって、所望のメニューの選択等が行われるように構成されている。   That is, for example, when a finger or the like is touched on the upper surface of the cover substrate 7 on a desired menu in a state where a plurality of menus or the like are displayed on the display element on the back, a part of the charge is conducted to the finger, The capacitance between the upper conductive layer 2 and the lower conductive layer 5 of the touch panel changes, and an electronic circuit detects the capacitance, thereby selecting a desired menu and the like.

そして、上基板1や下基板4上面の上電極3や下電極6は、上記のようにスパッタ法等によって、厚さ10〜100nm前後の酸化インジウム錫等の上に、厚さ150nm前後の銅箔が重ねられて、薄膜状に形成されているが、上電極3や下電極6の接着層18に覆われていない端部3Aや6Aには、これらを覆う厚さ10〜20μm前後の導電被覆層13や16が設けられているため、高温高湿中で長期間使用された場合でも、端部3Aや6Aの腐食を防ぐことができるようになっている。   Then, the upper electrode 3 and the lower electrode 6 on the upper surface of the upper substrate 1 and the lower substrate 4 are made of copper having a thickness of about 150 nm on the indium tin oxide having a thickness of about 10 to 100 nm by sputtering or the like as described above. The foils are overlapped to form a thin film, but the end portions 3A and 6A that are not covered with the adhesive layer 18 of the upper electrode 3 and the lower electrode 6 have a conductive thickness of about 10 to 20 μm covering them. Since the coating layers 13 and 16 are provided, the end portions 3A and 6A can be prevented from corroding even when used for a long time in high temperature and high humidity.

すなわち、上電極3や下電極6の接着層18に覆われていない端部3Aや6Aに、上電極3や下電極6の銅箔の厚さの百倍前後の厚さの導電被覆層13や16を形成し、これによって端部3Aや6Aの上面や側面を覆うと共に、導電被覆層13や16下端を近傍の上基板1や下基板4上面に密着形成することで、高温高湿中で使用された場合でも、湿気や水分による端部3Aや6Aの腐食やこれによる流失を防ぎ、フレキシブル配線板等との安定した接続を保つことが可能なように構成されている。   That is, the conductive coating layer 13 having a thickness of about 100 times the thickness of the copper foil of the upper electrode 3 and the lower electrode 6 is formed on the end portions 3A and 6A that are not covered by the adhesive layer 18 of the upper electrode 3 and the lower electrode 6. 16, thereby covering the upper surfaces and side surfaces of the end portions 3A and 6A, and forming the lower ends of the conductive coating layers 13 and 16 in close contact with the upper surfaces of the upper substrate 1 and the lower substrate 4 in the vicinity. Even when it is used, it is configured to prevent the end portions 3A and 6A from being corroded and lost due to moisture and moisture, and to maintain a stable connection with a flexible wiring board and the like.

なお、以上の説明では、上電極3や下電極6の端部3Aや6Aに、これらを覆うように、樹脂に銀やカーボン等の導電粒子を分散した導電被覆層13や16を印刷形成した構成について説明したが、図4の部分断面図に示すように、端部3Aや6Aが形成された上基板1や下基板4上面全体に、エポキシやアクリル、ポリエステル等の合成樹脂19A内に、ニッケルや樹脂等に金メッキを施した複数の導電粒子19Bが分散された、異方導電性の導電被覆層19を印刷や塗布によって設け、これによって端部3Aや6Aを覆う構成としても、本発明の実施は可能である。   In the above description, the conductive coating layers 13 and 16 in which conductive particles such as silver and carbon are dispersed in the resin are printed and formed on the end portions 3A and 6A of the upper electrode 3 and the lower electrode 6 so as to cover them. Although the configuration has been described, as shown in the partial sectional view of FIG. 4, the entire upper surface of the upper substrate 1 and the lower substrate 4 on which the end portions 3A and 6A are formed, and in the synthetic resin 19A such as epoxy, acrylic, polyester, The present invention can also be applied to a configuration in which a plurality of conductive particles 19B obtained by plating nickel, resin, or the like with a plurality of conductive particles 19B dispersed therein is provided by printing or coating, thereby covering the end portions 3A and 6A. Can be implemented.

また、以上の説明では、上電極3と下電極6の端部3Aと6Aの両方に、導電被覆層13や16、19を設けた構成として説明したが、いずれか一方に設けた構成としてもよい。   In the above description, the conductive coating layers 13, 16, and 19 are provided on both the end portions 3 </ b> A and 6 </ b> A of the upper electrode 3 and the lower electrode 6. Good.

このように本実施の形態によれば、上電極3の端部3Aまたは下電極6の端部6Aの少なくとも一方に、導電被覆層13や16、19を形成することによって、上電極3や下電極6の端部3Aや6Aが銀やカーボン、あるいは導電粒子を分散した合成樹脂で覆われ、高温高湿中で使用された場合でも、これらの腐食を防ぐことができるため、確実で安定した操作が可能なタッチパネルを得ることができるものである。   As described above, according to the present embodiment, by forming the conductive coating layers 13, 16, and 19 on at least one of the end portion 3 A of the upper electrode 3 or the end portion 6 A of the lower electrode 6, Since the end portions 3A and 6A of the electrode 6 are covered with silver, carbon, or a synthetic resin in which conductive particles are dispersed and used in a high temperature and high humidity environment, these corrosions can be prevented, so that it is reliable and stable. The touch panel which can be operated can be obtained.

本発明によるタッチパネルは、腐食を防ぎ、確実な操作が可能なものを得ることができるという有利な効果を有し、主に各種電子機器の操作用として有用である。   The touch panel according to the present invention has an advantageous effect that it can prevent corrosion and can be reliably operated, and is mainly useful for operation of various electronic devices.

1 上基板
2 上導電層
3 上電極
3A、6A 端部
4 下基板
5 下導電層
6 下電極
7 カバー基板
13、16、19 導電被覆層
18 接着層
19A 合成樹脂
19B 導電粒子
DESCRIPTION OF SYMBOLS 1 Upper substrate 2 Upper conductive layer 3 Upper electrode 3A, 6A End 4 Lower substrate 5 Lower conductive layer 6 Lower electrode 7 Cover substrate 13, 16, 19 Conductive coating layer 18 Adhesive layer 19A Synthetic resin 19B Conductive particle

Claims (1)

所定方向に配列された略帯状で複数の上導電層と、この上導電層に連結され端部が外周に延出する複数の銅箔製の上電極と、上記上導電層と所定の間隙を空けて直交方向に配列された略帯状で複数の下導電層と、この下導電層に連結され端部が外周に延出する複数の銅箔製の下電極からなり、上記上電極または下電極の少なくとも一方の端部に、導電被覆層を形成したタッチパネル。 A plurality of upper conductive layers in a substantially strip shape arranged in a predetermined direction, a plurality of upper electrodes made of copper foil connected to the upper conductive layer and having ends extending to the outer periphery, and a predetermined gap from the upper conductive layer The upper electrode or the lower electrode is composed of a plurality of lower conductive layers in a substantially strip shape arranged in an orthogonal direction with a space, and a plurality of lower electrodes made of copper foil connected to the lower conductive layer and having ends extending to the outer periphery. A touch panel having a conductive coating layer formed on at least one end thereof.
JP2011144032A 2011-06-29 2011-06-29 Touch panel Pending JP2013012019A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841859B2 (en) 2013-08-26 2017-12-12 Panasonic Intellectual Property Management Co., Ltd. Sensor structure and detection method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09258882A (en) * 1996-03-25 1997-10-03 Alps Electric Co Ltd Coordinate input device
JP2005115728A (en) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd Touch panel
JP2007156600A (en) * 2005-12-01 2007-06-21 Matsushita Electric Ind Co Ltd Touch panel
JP2009294815A (en) * 2008-06-04 2009-12-17 Mitsubishi Electric Corp Touch panel and display device equipped with the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09258882A (en) * 1996-03-25 1997-10-03 Alps Electric Co Ltd Coordinate input device
JP2005115728A (en) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd Touch panel
JP2007156600A (en) * 2005-12-01 2007-06-21 Matsushita Electric Ind Co Ltd Touch panel
JP2009294815A (en) * 2008-06-04 2009-12-17 Mitsubishi Electric Corp Touch panel and display device equipped with the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9841859B2 (en) 2013-08-26 2017-12-12 Panasonic Intellectual Property Management Co., Ltd. Sensor structure and detection method

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