JP5614207B2 - Imaging device and visual axis alignment method in imaging device - Google Patents

Description

  The present application relates to an imaging apparatus and a visual axis alignment method in the imaging apparatus, and more particularly to a structure of an imaging apparatus having a plurality of imaging sensors including an optical system using infrared rays or visible light, and a visual axis alignment method of the imaging apparatus.

  Conventionally, imaging devices have been used to detect, search, and identify target objects (targets), mounted on patrol aircraft and ships that search for floating objects and drifters floating on the sea, or attached to vehicles traveling on the road. It was. In addition to using visible light, some imaging devices use infrared, ultraviolet, or X-rays to image a target object (see Patent Document 1).

On the other hand, in recent years, there are the following demands for improving the performance (detection and identification performance) of imaging devices.
(A) Higher sensitivity and multi-element imaging sensor (b) Higher magnification optical system used for the imaging sensor and field of view magnification (c) Multi-sensor using imaging sensors with different wavelength bands ) Reduced noise of captured image and high speed of image processing In addition, each imaging sensor employed in the imaging apparatus has an image size of about 20 μm per pixel when an infrared imaging sensor is taken as an example. The elements are arranged side by side at about 480 in the vertical direction and about 640 in the horizontal direction, and are arranged so as to coincide with the imaging point of the optical system.

  In order to improve detection / recognition performance, it is generally important that the images displayed on each monitor from a plurality of imaging sensors have the same visual axis. This is because when the same target object is viewed at the center of the screen, the target objects displayed from the respective imaging sensors must be at the same position. This is hereinafter referred to as visual axis alignment.

Also, during maintenance of the imaging apparatus, the sensor module provided with the imaging sensor may be replaced, but the visual axis alignment is required after the imaging sensor replacement as well. In particular, in an imaging device using an infrared sensor, a cooler may be used to cool the infrared sensor, so that regular maintenance is required from the lifetime of the cooler. Such an image pickup apparatus is appropriately mounted on a casing, and is operated as an image pickup apparatus through operation as described below.
(Ii) Fixed camera device with fixed visual axis (b) Directional camera device with “pan / tilt mechanism” for directing visual axis in an arbitrary direction (ha) “Gimbal” mechanism with visual axis stabilization function On-board gimbal imaging device

  Here, an example of the function and operation method of the gimbal imaging apparatus will be described with reference to FIGS. FIG. 1A shows an example of mounting the gimbal imaging device 1 on an aircraft 2 (for example, patrol aircraft 2). The gimbal image pickup device 1 is attached to the airframe 4 directly below the cockpit 3 of the patrol aircraft 2, and projects the sea surface, the ground surface, and the like by projecting from the airframe 4 when necessary. In addition, when the gimbal imaging device 1 is mounted on a ship, the gimbal imaging device 1 is often installed on the bow or on the roof of a bridge. Furthermore, the gimbal imaging device 1 may be mounted on a vehicle.

  As shown in FIG. 1B, the gimbal imaging apparatus 1 generally has a base portion 6 fixed to a fixed base 5 provided in an aircraft or a ship. To obtain space stability suitable for operation, two axes (yaw = azimuth (left and right) direction, pitch = elevation (up and down direction) direction) or three axes (roll (tilt direction) + yaw + pitch direction) as necessary ). FIG. 1B shows a gimbal imaging apparatus 1 having a rotation axis 7 in the yaw direction y and a rotation axis 8 in the pitch direction p. Further, the gimbal imaging apparatus 1 of this example has two imaging apparatuses built in, and reference numeral 9 indicates an “optical window” that transmits a wavelength band used by the two imaging apparatuses. Reference numerals 9 a and 9 b indicate the visual axes of the two windows 9.

  FIG. 2 shows a general configuration example of the infrared imaging device 10 mounted on the imaging device 1 shown in FIG. The infrared imaging device 10 is provided on the back side of the window 9 and includes an imaging unit 10A and an image processing unit 10B. The imaging unit 10A includes an optical lens system 11 that collects energy in a wavelength band emitted by an object, such as infrared rays, and a sensor module 12 that includes a detection element 13 that detects the collected infrared energy. The sensor module 12 detects the energy projected on the light receiving surface of the sensing element 13 and outputs it as a photocurrent.

  On the other hand, the image processing unit 10B includes an amplification circuit 14, a signal processing circuit 15, a video circuit 16, and a monitor 17. The photocurrent output from the sensor module 12 is amplified by the amplifier circuit 14, subjected to image processing by the signal processing circuit 15 and the video circuit 16, and detected by the detection element 13 on the monitor 17 using a cathode ray tube or a liquid crystal display. An image is shown. Although the general configuration example of the infrared imaging device 10 has been described here, the configuration of the imaging device using visible light is not significantly different from the configuration of the infrared imaging device 10.

  The imaging device 10 is not limited to a visible / infrared imaging device, and is required to have high image quality and high resolution. The device structure is complicated, and maintenance is becoming more difficult. As a result, facilitating maintenance and maintenance including customer maintenance is the key to improving product value and obtaining customer satisfaction. Therefore, an adjustment unit capable of visual axis alignment in the imaging unit 10A of the imaging device 10 is desired.

  Here, the structure and visual axis alignment method of the imaging unit 20 having a plurality of imaging sensors including a conventional infrared or visible optical system will be described with reference to FIGS. In order to simplify the description, here, the imaging unit 20 including the first optical system 30 and the second optical system 40 will be described.

  FIG. 3A shows the configuration of the first sensor module 31 used in the first optical system 30. The first sensor module 31 includes a sensor unit 33 that incorporates an image sensor 32 and a mounting base 34 that attaches the sensor unit 33 to an optical frame described later. The sensor unit 33 incorporates a moving mechanism 35 that can move the imaging sensor 32 in three axial (x, y, z) directions. This is because the design position of the image sensor 32 is a position indicated by a broken line, but due to manufacturing variations, the position of the image sensor 32 after manufacture does not become the design position, for example, shifts by Δdet1 to the position indicated by the solid line. Is necessary. Further, the mounting surface of the mounting base 34 is provided with a recess 36 for alignment with the optical frame.

  FIG. 3B shows the configuration of the second sensor module 41 used in the second optical system 40. Similar to the first sensor module 31, the second sensor module 41 is mounted on the optical frame. The sensor module 41 includes a sensor unit 43 incorporating the image sensor 42 and a mounting base 44 for attaching the sensor unit 43 to an optical frame described later. The sensor unit 43 has a built-in moving mechanism 45 that can move the imaging sensor 42 in three axis (x, y, z) directions. Also in this figure, the design position of the image sensor 42 is indicated by a broken line, and the position of the image sensor 42 after manufacture is indicated by a solid line. The error of the position after manufacture with respect to the design position of the image sensor 42 is Δdet2. The mounting surface of the mounting base 44 is provided with a recess 46 for alignment with the optical frame.

  Here, the overall structure of the imaging unit 20 and the visual axis alignment method will be described with reference to FIG. The imaging unit 20 is configured by mounting a first optical system 30 and a second optical system 40 on an optical frame 21. The first optical system 30 includes a first optical lens unit 37 including a plurality of optical lenses 38 and a first sensor module 31, and the second optical system 40 includes a first optical lens 48 including a plurality of optical lenses 48. There are two optical lens portions 47 and a second sensor module 41. The first optical lens portion 37 and the second optical lens portion 47 are respectively attached to attachment portions 22 and 23 protruding from the optical frame 21. The first sensor module 31 and the second sensor module 41 are positioned and attached to the optical frame 21 by guide pins 24 and 25, respectively.

  In the first optical lens unit 37 and the second optical lens unit 47 as well, the imaging position of the incident light on the design is a position indicated by a broken line. For example, Δopt1 and Δopt2 are shifted to the positions indicated by solid lines. As for the guide pins 24 and 25 projecting from the optical frame 21, the positions of the manufactured guide pins 24 and 25 are shifted by Δmecha1 and Δmecha2 as shown by the solid lines with respect to the design positions indicated by the broken lines. . Design errors (optical frame 21, optical systems 37 and 47, and image sensors 32 and 42) of the respective components that hinder the visual axis matching are in the order of mm.

  That is, there are technical and cost-effective limits on the dimensional accuracy of the components (structural components, imaging sensor, and optical system) employed in each component of the imaging unit 20. Further, among the components for establishing the visual axis consistency, regarding the “optical system and imaging sensor”, there is no means for independently measuring the physical absolute position with the necessary accuracy (on the order of μm). For these reasons, at the time of maintenance of the imaging unit 20, the visual axis alignment is adjusted by the method described below because the visual axis alignment (visual axis alignment required accuracy is about 20 μm) is disturbed. The imaging sensors 32 and 42 employed in the imaging unit 20 require maintenance (replacement, etc.) that occurs due to the life of the cooler at regular intervals by the customer or manufacturer. Realignment of the visual axis was essential.

  In order to align and adjust the visual axis in the conventional apparatus shown in FIGS. 3A to 3C, the optical system error (Δopt1, Δopt2), the optical frame error (Δmecha1, Δmecha2), sensor module The visual axis alignment adjustment is performed for the accumulated error (Δ) of the errors (Δdet1, Δdet2). This adjustment is performed by physically moving the imaging sensors 32 and 42 in the axial (x, y, z) translational direction and the rotational (rot) direction by the moving mechanisms 35 and 45 in the sensor modules 31 and 41. Visual axis alignment (making the optical axis parallel) between one optical system and another optical system has been performed when the imaging unit is manufactured. Accordingly, when the sensor modules 31 and 41 are replaced, it is essential to adjust the visual axis alignment so that the centers of the imaging sensors 32 and 42 are aligned with the optical axes of the optical systems. At this time, it is necessary to adjust the positional accuracy (within about 20 μm) necessary for visual axis alignment with respect to the accumulated component error (about 1 mm).

JP 2007-235760 A

However, the above-described conventional visual axis alignment adjustment method has a problem that it takes a lot of work steps and is extremely difficult due to the following factors.
(A) Increasing the focal length (telephoto) of the optical system in order to further improve the detection performance of the imaging device by increasing the number of elements of the imaging sensor (high vision for visible light and high definition for infrared) and high sensitivity. Because of the progress, the sensitivity during visual axis alignment adjustment has increased.
(B) The imaging system has become multi-sensor (visible light system, mid-infrared system, far-infrared system, etc.), and the number of visual axis alignment adjustment targets has increased.
(C) Since the optical system has a longer focal length, a variable magnification optical system having a high magnification zoom and a plurality of fields of view is employed in the optical system, so that it is necessary to satisfy the visual axis alignment function even when the optical system is zoomed. .
(D) Due to the internal gap of the adjustment mechanism system at the time of adjustment and the rigidity (spring property) of the structure, adjustment is difficult because there is a range with no reproducibility after adjustment and after fixing.

  SUMMARY OF THE INVENTION Accordingly, an object of the present application is to provide an imaging apparatus and a visual axis alignment method for the imaging apparatus that can significantly reduce the alignment adjustment man-hour and reduce the difficulty while ensuring the visual axis alignment of the imaging apparatus.

An imaging apparatus of the present application that achieves the above object is an imaging apparatus having a plurality of imaging units including at least a visible optical system imaging unit and an infrared optical system imaging unit, and an optical frame on which the imaging unit is mounted , Each of the imaging units includes an optical lens system, a sensor module including an imaging sensor, and a base mechanism that mounts the sensor module on an optical frame, and each of the plurality of sensor modules is provided with a positioning member for the base mechanism. each individual image sensor mounted on the plurality of sensor modules, are pre-adjusted position of the three-dimensional direction with respect to the positioning member of the sensor module for mounting each imaging sensor, the each individual plurality of base mechanism, It is possible to adjust the position of the imaging sensor of the mounted sensor module in the three-dimensional direction. Sei mechanism is provided with, in the optical frame, provided with respect to the optical axis of one imaging unit of the plurality of imaging units, the adjustment mechanism of the optical axis to adjust the parallel optical axis of the other imaging units It is characterized by being.

The visual axis alignment method of the imaging apparatus of the present application that achieves the object includes a plurality of imaging units including at least a visible optical system imaging unit and an infrared optical system imaging unit, and an optical frame on which the plurality of imaging units are mounted. Each of the plurality of imaging units is a visual axis alignment method in an imaging device including an optical lens system, a sensor module incorporating an imaging sensor, and a base mechanism on which the sensor module is mounted , and in each of the plurality of sensor modules , A step of accurately adjusting the position of the imaging sensor with respect to the reference point of the mounting position on the base mechanism provided in the sensor module using an adjustment device, and an optical for one of the plurality of imaging units. a lens system and the base system after mounting the optical frame, the position of the image sensor is adjusted to the reference point Sensamo The Yuru mounted to the base mechanism, and adjusting the imaging sensor positioned in the imaging position of the optical lens system in three-dimensional directions adjustment provided in the base system, with respect to each individual other imaging unit of the plurality of image pickup unit After mounting the optical lens system on the optical axis adjustment mechanism provided on the optical frame , the sensor module is attached to the optical lens system via a jig, and the optical axis adjustment mechanism allows each light of the other imaging unit to be mounted. Adjusting the axis to be parallel to the optical axis of the optical lens system already mounted on the optical frame, and removing the jig for each of the other imaging units , and then moving the base mechanism to the optical frame equipped with after, the sensor module after removal, mounted in the base mechanism combined reference point, forming the image sensor position of the optical lens system in three-dimensional directions adjustment provided in the base mechanism It is characterized by comprising a step of adjusting the position.

  According to the present application, since the position accuracy of the image sensor position of the sensor unit is improved, a base mechanism having a mechanism for moving in three axes is added on the optical frame, and the sensor module is mounted thereon, the sensor The visual axis alignment adjustment during module replacement became easy. In other words, the “optical system” and “optical frame”, which are the main components that make up the imaging device, are not compatible at the component level with emphasis on manufacturability and cost. I gave it. As a result, the visual axis alignment can be easily performed by adjusting only the “rotation direction” in the visual axis alignment adjustment when replacing the sensor module, and while improving the performance of the imaging device and maintaining the manufacturing cost as compared with the conventional device, The ease of maintenance has improved.

(A) is a perspective view of a patrol aircraft provided with an imaging device, (b) is a perspective view showing an overview of the imaging device shown in (a). It is a block diagram which shows the general structural example of the conventional infrared imaging device. (A) is a side view showing the configuration of an example of a conventional sensor module attached to an optical frame, (b) is a side view showing the configuration of an example of a conventional sensor module attached to another location of the optical frame, and (c) is It is a side view which shows the structural example of the imaging unit provided with the optical system of 2 systems, and a visual axis alignment method. (A) is a side view which shows the structure of the sensor module of this application, (b) is a block diagram which shows the structure of the adjustment apparatus which adjusts the position of the imaging sensor with respect to the guide pin of the sensor module shown to (a). FIG. 4A is a plan view of the sensor module attached to the adjusting device shown in FIG. 4B, and FIG. 4B is a cross-sectional view showing a detailed structure of an embodiment of the sensor module shown in FIG. FIG. (A) is a perspective view showing a state in which the sensor module of one embodiment of the present application is attached via a measurement jig on the pedestal of the adjusting device shown in FIG. 4 (b). It is a perspective view which shows the state by which the sensor module of another Example of this application was attached on the base of the adjustment apparatus shown in FIG.4 (b) through the jig for measurement. (A) is explanatory drawing explaining the 1st procedure of the visual axis alignment method of the sensor module in the imaging unit of one Example of this application, (b) is a partial cross section which shows the detailed structure of the tilt mechanism of (a) FIG. It is explanatory drawing explaining the 2nd procedure of the visual axis alignment method of the sensor module in the imaging unit of one Example of this application shown to Fig.7 (a). (A) is a side view showing a configuration of a collimator used in the visual axis alignment method of the sensor module in the imaging unit of the embodiment of the present application shown in FIG. 8, and (b) is a target pattern shown in (a). FIG. FIG. 10 is a diagram illustrating the positions of the target pattern displayed on the monitor described in FIG. 2 before and after visual axis alignment when the visual axis is adjusted using the collimator illustrated in FIG. is there. (A) is a perspective view which shows the specific apparatus outline | summary of an imaging device provided with three imaging units of this application, (b) is a front view of the imaging device shown to (a). (A) is an optical path diagram showing the optical path from the window in the infrared imaging unit built in the imaging device shown in FIGS. 11 (a) and 11 (b) to the sensor module, and (b) is the imaging device of the present application. It is an optical path diagram which shows another Example of the optical path from the window in the imaging unit incorporated in to the sensor module.

  Hereinafter, embodiments of an imaging apparatus and a visual axis alignment method of the imaging apparatus according to the present application will be described in detail based on specific examples with reference to the accompanying drawings. First, the configuration of the sensor module 102 used in the imaging apparatus of the present application will be described with reference to FIGS. The sensor module 102 is used for an infrared imaging unit. 4A is a side view of the sensor module 102, and FIG. 4B is a side view of the measuring device 117 that adjusts the position of the image sensor 104 with respect to the guide pin 116 of the sensor module 102 shown in FIG. It is a block diagram which shows a structure. FIGS. 5A and 5B are a plan view and a cross-sectional view of the W portion of FIG. Further, FIG. 6A is a perspective view showing a state in which the sensor module 102 is attached via the measurement jig 115 on the base 118 of the measurement device 117 shown in FIG. 4B.

  As shown in FIG. 4A, the sensor module 102 has an L-shaped mounting base 103 in side view, and one of the outer surfaces of the mounting base 103 serves as a mounting surface, and a guide pin 116 projects. Has been. Further, the imaging sensor 104 is provided on the other surface of the outer surface of the mounting base 103, and the position of the imaging sensor 104 in the three-dimensional direction can be adjusted by an adjusting mechanism 130 provided on the mounting base 103. The image sensor 104 is sealed with an image sensor cover 120. The adjustment mechanism 130 can adjust the position of the image sensor 104 in the x direction, the y direction, the z direction, and the rotation direction R. Reference numeral 113 denotes an adjustment screw provided in the adjustment mechanism 130.

  The sensor module 102 configured as shown in FIG. 4A is attached to a measuring device 117 as shown in FIG. 4B, and the position of the image sensor 104 with respect to the guide pin 116 is adjusted by the adjustment mechanism 130. The measuring device 117 includes a pedestal 118, a column part 121 provided on the outer peripheral part of the pedestal 118, a ceiling part 122 held by the column part 121, an infrared irradiation unit 123 provided on the facing surface of the pedestal 118 of the ceiling part 122, and A measuring jig 115 fixed on the pedestal 118 is provided. The measurement jig 115 is disposed directly below the infrared irradiation unit 123.

  All the sensor modules 102 are attached to the measurement jig 115 so that the imaging sensor 104 faces the infrared irradiation unit 123 in a state before the imaging sensor cover 120 is attached after manufacturing. This state is shown in FIG. 4 (b) and FIG. 6 (a). At this time, the mounting surface 103S of the imaging sensor of the mounting base 103 is parallel to the pedestal 118, and the installation surface 103P of the guide pins 116 of the mounting base 103 is perpendicular to the pedestal 118. The imaging sensor 104 is attached to the mounting surface 103S of the imaging sensor by the sensor holding unit 125, and the sensor holding unit 125 can be moved in the x and y directions on the mounting surface 103S of the imaging sensor by the adjustment screw 113. Further, by inserting a shim 126 that is a height adjusting member between the sensor holding portion 125 and the mounting surface 103S of the imaging sensor, the distance from the mounting surface 103S of the imaging sensor in the z direction of the imaging sensor 104 is adjusted. Can do.

Here, a method for adjusting the sensor module 102 using the measuring device 117 will be described. The sensor module 102 at the time of adjustment is implemented in a sensor module manufacturing process before the imaging sensor cover 120 is attached. When the sensor module 102 is attached to the measurement jig 115, first, the pedestal 118 of the measuring device 117 and the imaging sensor 104 that is a measurement target are parallelized.

Next, z-direction measurement from the guide pin 116 to the imaging sensor 104 is performed, and the sensor holding portion 125 and the mounting base 103 are set so that the distance from the guide pin 116 to the imaging sensor 104 is within a reference value (within about 20 μm). A shim 126 is inserted between the sensor mounting surface 103 and the sensor mounting surface 103. Thereafter, the adjustment screw 113 is loosened and the image sensor 104 is moved in the x and y directions so that the position of the center of the image sensor 104 from the guide pin 116 is within a reference value (within about 20 μm), thereby adjusting the position. Is done. A three-dimensional measuring machine 123 having an optical system 124 capable of non-contact measurement is used for measurement in the x, y, and z directions during position adjustment. The three-dimensional measuring machine 123 has both a contact measuring element and a non-contact function based on visible image determination. Here, a measurement function based on a visible image is used. 123A is a contact type measuring element to use when the measurement of the origin position.

  After the height and center position of the image sensor 104 are adjusted as described above, the points A, B, C, and D (see FIG. 5A) at the four corners of the image sensor 104 are measured, and the image sensor 104 One side is adjusted to be parallel to one side of the mounting base 103. For example, as shown in FIG. 5A, when the long side of the image sensor 104 is inclined by an angle θ with respect to the long side of the mounting base 103, this inclination is set to zero. Then, after all adjustments are completed, the adjustment screw 113 is fixed, the image sensor cover 120 is attached, and the assembly of the sensor module 102 is completed.

  In the above-described embodiment, the height and center position of the image sensor 104 and the parallelism with the mounting base 103 are adjusted only by the adjustment screw 113, but the actual adjustment accuracy is relative to the reference value. Since it is within about 20 μm, fine adjustment is necessary. Therefore, the sensor module 102 is provided with a fine adjustment mechanism 131 as shown in FIG. 5B and FIG. 6B. In the fine adjustment mechanism 131, there is a shim holding slider 127 between the sensor holding portion 125 and the sensor mounting surface 103S of the mounting base, and the shim 126 is inserted between the recess of the shim holding slider 127 and the sensor holding portion 125. Yes.

  The shim holding slider 127 can move in the x and y directions on the sensor mounting surface 103S of the mounting base, and is fixed on the sensor mounting surface 103S of the mounting base by the adjusting screw 113. Further, the adjustment screw 114 fixes the shim 126 on the shim holding slider 127 and, if loosened, allows the sensor holding unit 125 to rotate around the center line CL of the shim holding slider 127. That is, the fine adjustment mechanism 131 has a structure that allows the position to be adjusted independently only in the rotation direction (rot direction) after the first sensor module 102 is installed on the optical frame 105.

  Next, the visual axis adjustment of the imaging apparatus 150 according to the embodiment of the present application using the sensor module 102 adjusted with high accuracy will be described with reference to FIGS. Note that the imaging apparatus 150 includes a first optical system (first imaging unit) 50 and a second optical system (second imaging unit) 100 in the optical frame 105. The first optical system 50 includes the first optical lens unit 101 and the adjusted first sensor module 102 described above. The second optical system 100 includes the second optical lens unit 107, Assume that there is a second sensor module 108 that has also been adjusted.

Further, in order to send a collimated light for visual axis adjustment to the imaging apparatus 150, in front of the imaging device 150 are installed collimator 60 shown in FIG. 9 (a), the imaging apparatus 150 is not shown FIG. It is assumed that an image processing unit as described in 2 is connected. The collimator 60 is provided with a concave mirror 62 at the inner bottom of a cylindrical housing 61 with one opening, and a flat mirror 64 inclined 45 degrees with respect to the central axis 63 of the collimator 60 in the housing 61 beyond the focal point of the concave mirror 62. It is a thing. A window 65 is provided on the side surface of the housing 61 facing the mirror surface of the plane mirror 64, and a heat light source 67 having a target pattern 66 is provided outside the window 65. FIG. 9B shows an example of the target pattern 66 having holes 66H through which light passes.

  As shown in FIG. 9A, light that has entered the housing 61 from the window 65 through the hole 66H of the target pattern 66 from the thermal light source 67 is reflected by the reflecting mirror 64 toward the concave mirror 62, and is reflected by the concave mirror 62. The light is reflected and becomes parallel light and travels toward the imaging device 150. The diameter of the collimated light reflected by the concave mirror 62 (effective aperture of the collimator 60) Φ has a size that includes the imaging device 150.

  For example, when the target pattern 66 emitted from the collimator 60 is incident on the first imaging unit 50 of the imaging apparatus 150 that is not aligned with the visual axis, the mark M by the target pattern 66 is as shown in FIG. Is displayed on the monitor 17 and is at a position shifted from the center point CP of the monitor 17. The visual axis alignment adjustment of the imaging device 150 described later is an adjustment so that the mark M by the target pattern 66 is displayed at the center point CP of the monitor 17.

  Here, an example of the visual axis alignment adjustment of the imaging apparatus 150 will be described. The visual axis alignment adjustment of the image pickup apparatus 150 is performed at the time of initial manufacture. In this embodiment, a case will be described in which the visual axis alignment adjustment is first performed with the first optical system 50 as the visual axis reference, and then the visual axis alignment adjustment of the second optical system 100 is performed. At the time of visual axis alignment adjustment, the collimator 60 that displays the above-mentioned distant far target is used.

(Adjustment of the visual axis of the first optical system 50)
As shown in FIG. 7A, first, the first optical lens unit 101 is fixed to the mounting part 141 of the optical frame 105. The configuration of the first optical lens unit 101 may be the same as the configuration of the conventional first optical lens unit 37 described with reference to FIG. Next, the first base mechanism 110 is installed on the optical frame 105 in accordance with the guide pins 112 protruding from the optical frame 105. The first base mechanism 110 mounts the first sensor module 102 thereon, and is provided with a three-axis translational direction (x1, y1, z1 direction) adjustment mechanism (hereinafter referred to as a three-axis adjustment mechanism) 128. ing.

  After the first base mechanism 110 is installed on the optical frame 105, the first sensor module 102 whose position has been adjusted is positioned and fixed on the first base mechanism 110 with the guide pins 116. At this time, the first optical lens unit 101 faces the collimator described above. In this state, using the target pattern set on the collimator, the target pattern is imaged on the image sensor 104 of the first sensor module 102 through the first optical lens unit 101. Then, the image acquired by the image sensor 104 is displayed on the monitor. At this time, the display of the target pattern displayed on the monitor is focused and displayed on the center of the monitor. That is, the first sensor module 102 is finely moved by the three-axis adjusting mechanism 128 provided in the first base mechanism 110, and the position is adjusted so as to be within the required reference position range (within about 20 μm). Thus, the visual axis adjustment of the first optical system 50 is completed.

(Visual axis adjustment of the second optical system 100)
After the visual axis adjustment of the first optical system 50 is completed, the visual axis adjustment of the second optical system 100 is performed. In the second optical system 100, the second optical lens unit 107 is attached to the optical system tilt mechanism 106 provided in the optical frame 105. As shown in FIG. 7B, the tilt mechanism 106 includes a tilt adjusting screw 142 attached to the optical frame 105, a fixing bolt 143, and a movable piece 144. The second optical lens portion 107 has a flange portion 145 attached to the movable piece 144. The tilt mechanism 106 changes the attachment angle of the movable piece 144 with respect to the optical frame 105 by adjusting the adjustment screw 142 and fixes the attachment angle with the fixing bolt 143.

  The second optical lens unit 107 of the second optical system 100 has the optical axis parallel to that of the first optical lens unit 101 of the first optical system 50 by adjusting the mounting bolt 143 of the tilt mechanism 106. It fixes to the optical frame 105 like this. As described above, the second optical lens unit 107 is fixed to the optical frame 105 via the tilt mechanism 106 because the component accuracy of the optical frame 105, the first optical lens unit 101, and the second optical lens unit 107 is increased. This is because it is made equivalent to the parts accuracy level of the conventional similar products.

  If the component accuracy is the same as before, the actual optical frame 105 has a manufacturing error (Δmecha1, Δmecha2) that deviates from the design position indicated by the broken line to the position indicated by the solid line. For this reason, the mounting surfaces of the first optical system 50 and the second optical system 100 of the optical frame 105 are inclined by θfre due to manufacturing errors. In addition, the imaging position of the incident light on the first and second optical lens units 101 and 107 is shifted by Δopt1 and Δdet2 as shown by the solid line with respect to the design position shown by the broken line. When the first and second optical lens portions 101 and 107 are directly attached to the optical frame 105 due to the deviation of the optical frame 105 from the design position, the optical frame 105 is placed between the optical axes of the first and second optical lens portions 101 and 107. An angle θfre is generated. The tilt mechanism 106 is for eliminating the angle θfre between the optical axes of the first and second optical lens portions 101 and 107 so that both optical axes are parallel to each other.

  In the case where the optical axes of the first and second optical lens portions 101 and 107 are made parallel by the tilt mechanism 106, a bore sight adjusting jig 155 is attached to the second optical lens portion 107, and the second sensor module 108 is attached. Is fixed to the boresight adjusting jig 155. At this time, the second base mechanism is not attached to the optical frame 105. Then, the position of the entire second sensor module 108 is adjusted in the x and y directions so that the target pattern image acquired by the second sensor module 108 is displayed in focus at the center of the monitor screen. At this time, the focus adjustment can be performed by the focus adjustment function of the focus adjustment mechanism of the second optical lens unit 107.

  After the position of the second sensor module 108 is adjusted so that the target pattern image is in focus at the center of the screen of the monitor, the entire second optical lens unit 107 is finely moved by the tilt 106 to adjust the position of the first optical system 50. The optical axis of the second optical system 100 is made parallel to the optical axis. At this time, the tilt mechanism 106 is adjusted so that the target pattern image displayed on the monitor of the first optical system 50 matches the target pattern image displayed on the monitor of the second optical system 100. In the adjustment of the tilt mechanism 106, the entire second optical lens unit 107 is adjusted in the x1 and y1 directions with the adjusting screw 142, and the position is fixed and the fixing bolt 143 is tightened to fix the position. Thus, the boresight adjustment of the second optical system 100 is completed.

  Thereafter, the boresight adjusting jig 155 attached to the second optical lens unit 107 is removed, and the optical frame 105 is aligned with the guide pins 112 projecting from the optical frame 105 as shown in FIG. The second base mechanism 111 is installed on the top. The second base mechanism 111 mounts the second sensor module 108 thereon, and is provided with a three-axis translational direction (x1, y1, z1 direction) adjustment mechanism (hereinafter referred to as a three-axis adjustment mechanism) 129. ing.

  After the second base mechanism 111 is installed on the optical frame 105, the second sensor module 108 whose position has been adjusted is positioned and fixed on the second base mechanism 111 with the guide pins 116. At this time, the second optical lens unit 107 faces the collimator described above. In this state, the target pattern set on the collimator is used to form an image of the target pattern on the image sensor 119 of the second sensor module 108 through the second optical lens unit 107. Then, the image acquired by the image sensor 119 is displayed on the monitor. At this time, the second sensor module 111 is adjusted by the three-axis adjusting mechanism 129 provided in the second base mechanism 111 so that the target pattern displayed on the monitor is focused and displayed at the center of the monitor. Is adjusted so that it is within the required reference position range (within about 20 μm).

  At this time, the rot in the second sensor module 108 in the rot direction so that the inclination of the target pattern displayed on the monitor matches the inclination of the target pattern image acquired by the first sensor module 102 in the rotation direction. Alignment adjustment is performed by an adjustment mechanism (not shown). Thus, the visual axis adjustment of the second optical system 100 is completed, and the visual axis alignment adjustment when the imaging device 150 is newly manufactured is completed.

(Visual alignment adjustment when replacing the sensor module)
The visual axis alignment adjustment of the first and second sensor modules 102 and 108 in the first and second optical systems 50 and 100 described above is performed when the imaging device 150 is manufactured. On the other hand, when the first and second sensor modules 102 and 108 are for infrared rays, the first and second sensor modules 102 and 108 need to be replaced every predetermined period. At the time of replacement, visual axis alignment adjustment is required for the first and second sensor modules 102 and 108. However, as described above, the positions of the imaging sensors 104 and 119 with respect to the guide pins 116 are precisely adjusted in the first and second sensor modules 102 and 108 used in the imaging device 150 of the present application. That is, the position adjustment of the first and second imaging sensors 104 and 119 with respect to the positioning guide pin 116 has been completed.

  For this reason, the first and second sensor modules 102 and 108 whose positions have been adjusted are mounted on the first and second base mechanisms 110 and 111 at the time of replacement, and then the first and second sensor modules 102 and 108 are mounted. Only the rot direction adjustment is carried out by the rot adjustment mechanism provided in FIG. The rot adjustment can be performed using the male and female structure of the ΦD portion of the sensor holding portion 125 shown in FIG. That is, for the sensor module to be replaced, the visual axis adjustment is completed by performing only the axial alignment adjustment by loosening the adjustment screw 114 and rotating the sensor holding portion 125 as the rot adjustment after replacement.

  FIG. 11A shows a device overview of a specific example of the image pickup apparatus 160 having three image pickup units of the present application, and FIG. 11B shows the image pickup apparatus 160 shown in FIG. From the front. The imaging apparatus 160 of this embodiment includes a visible optical imaging unit, a mid-infrared imaging unit, and a far-infrared imaging unit. Reference numeral 161 is a window of a visible optical system imaging unit, reference numeral 162 is a window of a mid-infrared imaging unit, and reference numeral 163 is a window of a far-infrared imaging unit.

  If the imaging sensors used in the imaging apparatus 160 including three imaging units shown in FIGS. 11A and 11B are all rot-adjustable imaging sensors, the position of the imaging sensor with respect to the guide pin at the time of manufacture is Since it has been adjusted, visual axis alignment is possible without rot adjustment at the time of replacement. On the other hand, if there is a visible imaging sensor that cannot be rot-adjusted, the other imaging sensors are rot-adjusted to perform visual axis alignment with reference to the rot position including the manufacturing error of the sensor.

The optical path of the optical system of the imaging unit of the visible optical system is straight. Therefore, the sensor module 164 of the imaging unit of the visible optical system is on the back side of the imaging device 160. Since the sensor module 164 of the imaging unit of the visible optical system hardly needs to be replaced, there is no inconvenience even on the back side of the imaging device 160. On the other hand, the optical path of the optical system of the mid-infrared imaging unit and the far-infrared imaging unit is bent 180 degrees by two reflecting mirrors. An example of the optical system of the far-infrared imaging unit is shown in FIG. The optical system lens 170 of the far-infrared imaging unit has two reflecting mirrors 171 and 172, and the infrared light incident from the window 163 is reflected 90 degrees at the two reflecting mirrors 171 and 172, and is the same as the window 163. The image sensor 167 in the sensor module 166 provided on the side is reached. The configuration of the optical system of the mid-infrared imaging unit may be the same as the configuration of the optical system of the far-infrared imaging unit.

  Using two reflecting mirrors, the optical path of the optical system of the mid-infrared imaging unit and the far-infrared imaging unit is bent 180 degrees. For this reason, in the mid-infrared imaging unit and the far-infrared imaging unit, the sensor module can be arranged on the same side as the indows 162 and 163 of the imaging device 160. In FIG. 11, a portion indicated by reference numeral 171 is a sensor module of a mid-infrared imaging unit, and a portion indicated by reference numeral 172 is a sensor module of a far-infrared imaging unit.

  As described above, when the optical path of the optical system of the mid-infrared imaging unit and the far-infrared imaging unit is bent 180 degrees, the sensor modules 171 and 172 come to the same side as the windows 162 and 163. Since the infrared imaging unit needs to be replaced periodically, the sensor modules 171 and 172 in maintenance can be easily replaced from the front side of the imaging device 160, and the number of sensor module 171 and 172 replacement steps is reduced. can do.

As shown in FIG. 12B, the optical path of the optical lens 180 of the imaging unit is bent by 90 degrees by one reflecting mirror 181, and the sensor module 186 of the imaging unit is placed on the right side surface of the main body of the imaging device, or It is also possible to arrange on the left side. Reference numeral 183 denotes a window, and 187 denotes an image sensor.

As described above, according to the imaging apparatus and the visual axis alignment method of the imaging apparatus of the present application, the following is possible.
(1) When the optical system and the optical frame, which are components of the image pickup apparatus, are configured as separate components, if the visual axis alignment adjustment is performed at the time of initial manufacturing, the visual axis alignment adjustment at the time of subsequent sensor module replacement Is unnecessary except for adjustment of the rotation direction. For this reason, the alignment adjustment man-hours and the difficulty can be greatly reduced while ensuring the alignment of the visual axis during the visual axis alignment of the imaging apparatus.
(2) Therefore, even when the performance of the imaging apparatus is improved and the configuration becomes complicated, the load at the time of visual axis alignment adjustment is significantly improved than before.
(3) Furthermore, a significant reduction (cost reduction effect) of the visual axis alignment adjustment work man-hour at the time of apparatus maintenance in the manufacturer is expected.
(4) Since the same maintenance can be performed by the user, the apparatus operating rate can be improved and a product with high customer satisfaction can be provided.

(5) It is possible to adjust the position of the image sensor to an accuracy that does not affect the visual axis alignment for each manufacture.
(6) Despite the complex and high-performance imaging device by adding the base mechanism of the sensor module, each component component (optical system, optical frame component, etc.) that composes it has a track record with similar devices. It satisfies the visual axis alignment function performance of the imaging apparatus with a certain part accuracy.
(7) It is possible to continue to purchase products that have been outsourced for design and manufacture by a specialist that is advantageous in terms of cost.
(8) It is possible to obtain and configure the material cost necessary for manufacturing the imaging device at a low cost, which contributes to the improvement of the product profit rate.
(9) The technology of the present application can be technically used continuously if the required accuracy is below the adjustable accuracy for further enhancement of the imaging device expected in the future.

  The present invention has been described in detail with particular reference to preferred embodiments thereof. For easy understanding of the present invention, specific embodiments of the present invention will be described below.

(Appendix 1) An imaging apparatus having a plurality of imaging units including at least a visible optical imaging unit and an infrared optical imaging unit, and an optical frame on which the imaging unit is mounted,
Each imaging unit includes an optical lens system, a sensor module including an imaging sensor, and a base mechanism for mounting the sensor module on the optical frame,
The position of the imaging sensor in a three-dimensional direction is adjusted in advance with respect to a positioning member for the base mechanism of the sensor module,
The base mechanism is provided with an adjustment mechanism capable of adjusting the position of the imaging sensor of the sensor module positioned and mounted in a three-dimensional direction,
The optical frame is provided with an optical axis adjustment mechanism that adjusts the optical axis of another imaging unit in parallel to the optical axis of the one imaging unit.
(Supplementary note 2) The imaging device according to supplementary note 1, wherein the sensor module is provided with a rotation mechanism that rotates the imaging sensor with respect to the optical axis by adjustment from the outside.
(Supplementary note 3) The imaging apparatus according to Supplementary note 1 or 2, wherein the one imaging unit is an infrared optical imaging unit, and the other imaging unit is a visible light imaging unit.
(Additional remark 4) The imaging device in any one of Additional remark 1 to 3 characterized by the positioning member with respect to the said base mechanism of the said sensor module being an at least 2 guide pin and a guide hole.
(Supplementary Note 5) The imaging apparatus according to any one of Supplementary Notes 1 to 4, wherein a positioning member of the base mechanism with respect to the optical frame is at least two guide pins and a guide hole.

(Additional remark 6) The far-infrared optical system imaging unit and the injection infrared optical system imaging unit are provided as said infrared optical system imaging unit, The imaging device in any one of Additional remark 1 to 5 characterized by the above-mentioned.
(Supplementary Note 7) The optical lens system of each imaging unit includes two reflecting mirrors, and incident light to each imaging unit is reflected by 90 degrees at each reflecting mirror, and the sensor module is the optical lens. The imaging apparatus according to any one of appendices 1 to 6, wherein the imaging apparatus is mounted on the imaging apparatus in a replaceable manner from the same side as the incident window of the system.
(Supplementary Note 8) The optical lens system of each imaging unit includes one reflecting mirror, and incident light to each imaging unit is reflected by 90 degrees by the reflecting mirror in a direction orthogonal to the optical lens system. The imaging apparatus according to any one of appendices 1 to 6, wherein the imaging apparatus is incident on the sensor module mechanism provided.
(Supplementary Note 9) A sensor having a plurality of imaging units including at least a visible optical system imaging unit and an infrared optical system imaging unit, and an optical frame on which the imaging unit is mounted, the imaging unit including an optical lens system and an imaging sensor A visual axis alignment method in an imaging apparatus including a module and a base mechanism for mounting the sensor module,
Accurately adjusting the position of the imaging sensor with respect to a reference point of the mounting position of the sensor module on the base mechanism using an adjustment device;
With respect to one of the imaging units, the sensor module is mounted on the base mechanism after the optical lens system and the base mechanism are mounted on the optical frame, and the three-dimensional direction adjustment provided in the base mechanism is performed. Adjusting the imaging sensor position to the imaging position of the optical lens system;
With respect to the other imaging unit, the optical axis adjustment mechanism provided between the optical lens system and the optical frame is used to adjust the optical axis of the other optical imaging unit to the position of the imaging sensor. Adjusting to be parallel to the optical axis of the imaging unit;
The sensor module is mounted on the base mechanism after the base mechanism is mounted on the optical frame with respect to the other optical imaging unit, and the position of the imaging sensor is adjusted by three-dimensional direction adjustment provided in the base mechanism. And a step of adjusting the imaging position of the optical lens system.
(Additional remark 10) The imaging device of Additional remark 9 characterized by the adjustment in the said sensor module including the adjustment which rotates the said image sensor with respect to an optical axis by the adjustment from the outside.

(Supplementary note 11) The visual axis alignment method in the imaging apparatus according to Supplementary note 9 or 10, wherein the one imaging unit to be adjusted first is the visible optical system imaging unit.
(Additional remark 12) The process of adjusting the position of the said image sensor correctly with respect to the reference point of the mounting position to the said base mechanism of the said sensor module,
Taking the adjustment device and the imaging sensor in parallel;
Adjusting the distance in the z direction from the guide pin of the imaging sensor to be within a reference value;
Adjusting the distance in the x and y directions from the guide pin to the center of the imaging sensor to be within a reference value, respectively;
The method according to claim 8, further comprising a step of rotating the imaging sensor with respect to the center so that one side of the imaging sensor is parallel to a mounting surface of the sensor module on the base mechanism. A visual axis alignment method in an imaging apparatus.
(Additional remark 13) The visual axis alignment in the imaging device according to Additional remark 12, wherein the reference point is at least two guide pins projecting from the sensor module and a guide hole provided in the base mechanism. Method.
(Additional remark 14) The process of adjusting the optical axis of an infrared optical system imaging unit and another optical system imaging unit with the optical axis adjustment mechanism in parallel with the optical axis of the visible optical system imaging unit,
The sensor module is mounted on the light exit surface of the other optical system imaging unit using a bore sight adjusting jig, the optical axis of which is aligned with the optical axes of the infrared optical system imaging unit and the other optical system imaging unit. A visual axis alignment method in an imaging apparatus according to any one of appendices 9 to 13, wherein the visual axis alignment method includes the step of:
(Supplementary Note 15) In the step of adjusting the distance of the image sensor from the guide pin in the z direction to be within a reference value, a height adjustment shim is inserted into the holding unit of the image sensor. The visual axis alignment method in the imaging device according to appendix 9.

(Supplementary Note 16) A visual axis alignment method in an imaging apparatus after the sensor module is replaced,
The visual axis alignment in the imaging apparatus according to appendix 10, wherein the sensor module newly mounted on the base mechanism is rotated with respect to the optical axis by external adjustment. Method.

DESCRIPTION OF SYMBOLS 50 1st optical system 100 2nd optical system 101 1st optical lens part 102 1st sensor module 103 1st attachment base 104 1st imaging sensor 105 Optical frame 106 tilting mechanism 107 2nd optical lens part 108 Second sensor module 109 Second mounting base 110 First base mechanism 111 Second base mechanism 112, 116 Guide pin 113, 114 Adjustment screw 115 Measuring jig 117 Measuring device 119 Second imaging sensor 120 Sensor Cover 126 Shim 128, 129 Triaxial adjustment mechanism 130 Adjustment mechanism 131 Fine adjustment mechanism 150 Imaging device of the present application 155 Boresight adjustment jig

Claims (6)

An imaging device having a plurality of imaging units including at least a visible optical imaging unit and an infrared optical imaging unit, and an optical frame on which the imaging unit is mounted,
Each of the plurality of imaging units includes an optical lens system, a sensor module including an imaging sensor, and a base mechanism for mounting the sensor module on the optical frame,
Each of the plurality of sensor modules is provided with a positioning member for the base mechanism,
Wherein the plurality of the image pickup sensor mounted on the sensor module each individual is pre-adjusted three-dimensional direction position relative to the positioning member of the sensor module for mounting each imaging sensor,
Each of the plurality of base mechanisms is provided with an adjustment mechanism capable of adjusting the position of the imaging sensor of the sensor module positioned and mounted in a three-dimensional direction,
Wherein the optical frame, characterized in that the optical axis of one imaging unit of the plurality of imaging units, the adjustment mechanism of the optical axis to adjust the parallel optical axis of the other imaging units are provided An imaging device. The optical lens system provided in each of the plurality of imaging units includes two reflecting mirrors, and incident light to the imaging units is reflected by 90 degrees by the two reflecting mirrors, respectively.
The sensor module provided in each of the plurality of imaging units is located on the same side as the entrance window of the optical lens system ,
The sensor module of the plurality of imaging unit mounted on the imaging apparatus, an imaging apparatus according to claim 1, characterized in that the interchangeable from the entrance window side of the optical lens system. A plurality of imaging units including at least a visible optical system imaging unit and an infrared optical system imaging unit; and an optical frame on which the plurality of imaging units are mounted. Each of the plurality of imaging units includes an optical lens system and an imaging sensor. A visual axis alignment method in an imaging device including a sensor module and a base mechanism on which the sensor module is mounted,
In each of the plurality of sensor modules, accurately adjusting the position of the imaging sensor with respect to a reference point of a mounting position on the base mechanism provided in each sensor module, using an adjustment device;
The sensor module in which the position of the imaging sensor is adjusted with respect to the reference point after the optical lens system and the base mechanism are mounted on the optical frame with respect to one of the plurality of imaging units. A step of mounting on the base mechanism and adjusting the position of the imaging sensor to the imaging position of the optical lens system by three-dimensional direction adjustment provided in the base mechanism;
The optical lens system is mounted on an optical axis adjustment mechanism provided on the optical frame for each of the other imaging units of the plurality of imaging units, and then the sensor is inserted into the optical lens system via a jig. Attaching a module, and adjusting the optical axis of each of the other imaging units with the optical axis adjustment mechanism so as to be parallel to the optical axis of the optical lens system already mounted on the optical frame;
For each of the other imaging units, after removing the jig and mounting the base mechanism on the optical frame, the removed sensor module is mounted on the base mechanism with the reference point aligned. And a step of adjusting the position of the image sensor to the image forming position of the optical lens system by adjusting the three-dimensional direction provided in the base mechanism. The step of accurately adjusting the position of the imaging sensor with respect to the reference point of the mounting position on the base mechanism in each of the plurality of sensor modules,
Taking the adjustment device and the imaging sensor in parallel;
Adjusting the distance in the Z direction from a guide pin provided in the imaging sensor to be within a reference value;
Adjusting the distance in the x and y directions from the guide pin to the center of the imaging sensor to be within a reference value, respectively;
4. The method according to claim 3, further comprising a step of rotating the imaging sensor relative to the center so that one side of the imaging sensor is parallel to a mounting surface of the sensor module on the base mechanism. Visual axis alignment method in the image pickup apparatus. When replacing one of the plurality of sensor modules,
Remove the sensor module to be replaced from the base mechanism,
The sensor module in which the position of the imaging sensor is adjusted with respect to a reference point of the mounting position on the base mechanism provided in the sensor module by the adjusting device is attached to the base mechanism from which the sensor module is removed,
4. The visual axis alignment method in an imaging apparatus according to claim 3, further comprising a step of adjusting the position of the imaging sensor to an imaging position of the optical lens system by three-dimensional direction adjustment provided in the base mechanism. . One of the plurality of imaging units is the visible optical system imaging unit , the other imaging unit of the plurality of imaging units is an infrared optical system imaging unit and another optical system imaging unit , and is based on the optical axis adjustment mechanism. the method visual axis aligned in the imaging apparatus according to claim 3 or 4, wherein the jig used in step of adjusting in parallel to the optical axis of the other imaging units are boresight adjustment jig .

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