JP5598927B2 - T-die discharge port cleaning device and method for producing sheet-shaped resin molding using the same - Google Patents

Description

  The present invention relates to a cleaning device for a T-die discharge port suitably used in an apparatus or method for manufacturing a sheet-shaped resin molded body using a T-die and a method for manufacturing a sheet-shaped resin molded body using the same.

  A sheet-shaped or film-shaped resin molded body is manufactured by an extruder or an injection molding machine including a T die. In the manufacture of sheet-shaped resin moldings, the discharge of molten resin from the T-die is stopped for each cycle, so there are problems such as resin waste and resin film remaining on the surface of the T-die discharge port, and die lines are generated. There is. Although there are few proposals for solving this problem, for example, Patent Document 1 has been proposed.

  A die lip cleaning device proposed in Patent Document 1 is a wiping mechanism for wiping and removing resin waste or resin film remaining on a die lip, and a scraper provided with a notch having substantially the same cross-sectional shape as the die lip. And a scraper up-and-down moving mechanism that moves the scraper up and down, and a predetermined amount of a wiping sheet that is sandwiched between the notch of the scraper and the die lip when the scraper is lifted, thereby feeding the sheet onto the scraper. And a sheet feeding mechanism for moving the sheet.

  On the other hand, although the object of the invention is different, Patent Document 2 proposes a coating liquid removing apparatus that can exhibit the same function. This coating solution removing device is a coating solution removing device that removes the coating solution remaining on the lip portion, and a blade that comes into contact with the lip portion of the die body when the die body is lowered by the die coater, and the blade It has a holder for holding, a drive mechanism for moving the holder back and forth in the longitudinal direction of the die body, and a suction means for collecting the coating liquid scraped and removed by the blade.

JP 2008-265178 A Japanese Patent Laid-Open No. 11-147062

  However, in the die lip cleaning device proposed in Patent Document 1, it is possible to sufficiently remove the resin waste adhering to the die lip, but a special wiping sheet made of cotton must be used, and There is a problem that it is a consumable item and is difficult to maintain. In addition, the coating liquid removing apparatus described in Patent Document 2 keeps the properties such as the viscosity of the coating liquid surface end constant when the cycle of the die coater is long or when the die coater is stopped and restarted. The lip surface is made to coincide and the amount of coating liquid supplied is constant, and there is a problem that a sufficiently clean lip surface cannot always be obtained.

  In view of such conventional problems, the present invention is a T-die for producing a sheet-like resin molded body, and a resin lump or resin adhered to the discharge port (die lip) surface without using a special dedicated product. It is an object of the present invention to provide a cleaning device for a T-die discharge port that can sufficiently remove a film and the like and can be easily maintained and a method for producing a sheet-like resin molded body using the same.

  A cleaning device for a T-die discharge port according to the present invention includes a cutting means for cutting the resin cast from the T-die discharge port on a moving table that reciprocates horizontally along the T-die discharge port, and the cutting A wiping means for wiping off the resin adhering to the surface of the T-die outlet later is placed, and the cutting means has a cutter for cutting the resin and an elevating means for moving the cutter up and down, and the wiping means Includes a resin wiping body applied to the T-die discharge port, lifting and lowering means for moving the resin wiping body up and down, and a scraper for removing the wiped resin adhering to the resin wiping body.

  In the above invention, the resin wiping body preferably has a hardness of 50 to 100 Rockwell (R scale), a length along the discharge opening of the T die of 50 mm or more, and a thickness in the pressing direction of 10 mm or more. The resin wipe is preferably made of polytetrafluoroethylene (PTFE) resin.

  Further, the resin wiping body is preferably configured so that the pressing force to the surface of the T-die discharge port at the time of wiping the resin is a surface pressure of 0.5 to 12 MPa.

  The scraper may include a sliding body that slides on the wiping surface of the resin wiping body and an actuator that reciprocates the sliding body in the horizontal direction.

  Further, the T-die discharge port cleaning device further collects both the resin that is wiped down by the resin wiper and the resin that is scraped off from the resin wiper by the scraper, and the recovered resin is predetermined. It is preferable to provide a shooter that discharges to the position.

  Further, the T-die discharge port cleaning device is further provided with an air cooling means for blowing air to the resin wiping body after wiping off the resin remaining on the T-die discharge port and scraping off the wiped resin. be able to.

  In the method for continuously producing a sheet-shaped resin molded body according to the present invention, after discharging a predetermined amount of resin from the T-die discharge port, the resin extrusion is stopped and the T-die discharge port is cleaned. Thereafter, a method of continuously producing a sheet-shaped resin molded body that starts the next cycle, firstly, after stopping the extrusion of the resin, the resin cast from the discharge port of the T-die is cut, and then The resin wiping body was applied to the T-die discharge port and slid from one end to the other end to wipe off the resin remaining on the T-die discharge port, and then wiped off to adhere to the resin wiping body. This is done by scraping the resin and starting the next cycle.

  The cleaning device for the T-die discharge port according to the present invention can sufficiently remove the resin lump and resin film adhering to the surface of the discharge port (die lip) without using a special dedicated product, and is easy to maintain and manage. By using this T-die discharge port cleaning device, the resin adhering to the T-die discharge port is wiped off every cycle, so that the molten resin can be applied with the surface of the T-die discharge port always clean. . The cleaning device for the T-die discharge port can be suitably used for manufacturing a sheet-like molded body.

It is a schematic diagram which shows the outline | summary of the cleaning apparatus of the T-die discharge opening which concerns on this invention. It is explanatory drawing of the wiping means part of the cleaning apparatus of the T-die discharge opening shown in FIG. It is explanatory drawing of the cutting means part of the cleaning apparatus of the T-die discharge opening shown in FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing an outline of a cleaning device for a T-die discharge port according to the present invention. As shown in FIG. 1, in the cleaning device for the present T-die discharge port, a wiping means 10 and a cutting means 20 are placed on a moving table 1. The movable table 1 reciprocates in the horizontal direction along the T-die discharge port 53, and the cutting means 20 can cut the resin cast from the T-die discharge port 53. The wiping means 10 can wipe off the resin adhering to the surface of the T-die discharge port 53 after the cutting of the resin by the cutting means 20. The movable table 1 can be reciprocated by a servo mechanism 5 so that its position can be controlled easily and precisely.

  The wiping means 10 includes a resin wiping body 13 applied to the T-die discharge port 53, an elevating means 135 that moves the resin wiping body 13 up and down, and a scraper that removes the wiped resin adhering to the resin wiping body 13. And 15. The resin wiping body 13 has a function of wiping away resin debris, a resin film, and the like remaining on the surface portion of the T die discharge port 53 after the cast resin is cut along the T die discharge port 53. For this reason, it is preferable that the resin wiping body 13 is elastically deformed when applied to the T-die discharge port 53.

  The resin wiping body 13 can wrap up a lump of residual resin that forms irregularities on the surface of the T-die discharge port 53 by the elastic deformation of the resin wiping body 13, and can adhere to the surface of the T-die discharge port 53, wiping function It is good that it can fully exhibit. For this reason, the resin wiping body 13 needs to be large and thick enough to wrap the residual resin and exhibit the wiping function. The resin wiping body 13 preferably has a length along the T-die discharge port 53 of 50 mm or more and a thickness in the pressing direction (a direction perpendicular to the direction along the T-die discharge port 53) of 10 mm or more.

  The resin wipe 13 in the present invention wipes off the remaining resin with the resin wipe 13 every cycle, so that the hardness and strength to remove the resin lump firmly attached to the T-die discharge port 53 as in the case of manufacturing a film It is different from the blade which requires. However, the resin wiping body 13 requires a hardness that allows an appropriate shearing force to act on the residual resin when the residual resin is wiped off. The hardness of the resin wipe 13 is preferably Rockwell (R scale) 50-100.

  Further, the resin wiping body 13 is preferably one that hardly adheres the residual resin. Polytetrafluoroethylene (PTFE) resin is exemplified as a material of the resin wiping body 13 that can be elastically deformed in this manner, has an appropriate hardness, and is difficult for the residual resin to adhere to.

  As described above, the resin wiping body 13 is pressed and slid along the T-die discharge port 53 while being elastically deformed by being applied to the T-die discharge port 53. At this time, it is preferable to apply a pressing force to the resin wiping body 13 so that the surface pressure becomes 0.5 to 12 MPa. A higher surface pressure is applied to a resin having a high adhesive strength and difficult to wipe off. The wiping of the resin adhering to the surface of the T-die discharge port 53 by the resin wiping body 13 is performed as shown in FIG. 2A and 2B show the standby state of the resin wipe 13 and FIG. 2C shows the state of the resin wipe 13 in operation. FIG. 2B is a side view of FIG. As shown in FIG. 2A, the resin wiping body 13 is attached to the wiping means main body 11, and the wiping means main body 11 can be lifted and lowered by lifting means 135 (135A, 135B) at both ends. A required pressing force can be applied to the resin wiping body 13 by the control of the elevating means 135A and 135B. In the case of this example, by using two pneumatic cylinders as the lifting means, a thin and compact wiping means 10 (short in the direction along the T-die discharge port 53) can be configured. .

  The resin 43 wiped from the T die discharge port 53 falls as shown in FIG. 2C and adheres to the resin wiping body 13. After the resin wiping body 13 applied to the T-die discharge port 53 is pressed and slid along the T-die discharge port 53 from one end to the other end, the resin wiping body 13 descends (FIG. 2B), and the movable table 1 To return to the standby position. The resin wiping body 13 can be reciprocated a plurality of times along the T-die discharge port 53 as necessary. Thereby, resin which is hard to wipe off can also be wiped off sufficiently.

  The resin wiping body 13 that has returned to the standby position after the wiping off process is cleaned by removing the resin 43 adhered by the scraper 15. The scraper 15 has a sliding body 161 attached to the scraper body 16 and is movable in the arrow direction S by an actuator 165. Removal of the resin adhering to the resin wiping body 13 is performed by moving the sliding body 161 of the scraper 15 in the arrow direction S to slide the surface of the resin wiping body 13 and scraping off the adhering resin. The resin wiping body 13 from which the adhering resin has been removed and cleaned is provided for reuse in the next cycle.

  The resin adhering to the resin wiping body 13 is easy to be removed because its temperature is lowered and its adhesive strength is lowered. For this reason, the resin wiping body 13 is preferably provided with an air cooling means for blowing air after wiping off the resin 43 remaining on the T-die discharge port 53 and before scraping off the wiped resin. The air cooling means may be provided as necessary depending on the type of resin 43, temperature, working conditions, and the like. Note that the blowing of air to the resin wiping body 13 can be performed for each cycle, and can also be performed as necessary.

  The resin dropped while being wiped from the T-die discharge port 53 by the resin wiping body 13 is collected by the shooter 30 shown in FIG. The resin removed from the resin wipe 13 is also collected by the shooter 30. The shooter 30 is provided between the covers 3 (3A, 3B) and has a shape like dust removal. The shooter 30 is surrounded by a frame 31 and has a front opening, and the bottom plate 35 can be pushed and pulled by an actuator 315. The front end of the frame 31 is in contact with the flat cover 3A, and the collected resin 45 is accommodated in a bowl-shaped space formed by the frame 31, the bottom plate 35, and the covers 3A and 3B. The resin 45 accommodated in the bowl-shaped space falls by pulling out the bottom plate 35, and finally is scraped off by the cover 3B that acts as a partition plate, and is collected by the chute plate 37 at a predetermined location. It has become. The shooter 30 can prevent the wiped resin or the like from scattering.

  As shown in FIG. 1, the cutting means 20 includes a cutter 25 and an elevating means 215 that moves the cutter 25 up and down, and can cut the resin cast from the T-die discharge port 53. The cutting means 20 of this example not only cuts the resin cast from the T die discharge port 53, but also cuts off the resin cast from the T die discharge port 53 and then scrapes and removes the resin adhering to the cutter 25. Having a cutter cleaning means. Thereby, the resin to be cast is cut so that the remaining resin is small and the cut surface is smooth.

  3A and 3B are explanatory views of the cutting means portion. FIG. 3A shows the state of the cutting means 20 in a standby state, and FIG. 3B shows the time when the resin to be cast is cut by the cutting means 20 (during operation). Shows the state. FIG. 3C shows a state when the cutter is cleaned. In the cutting means 20, the guide 22 and the elevating means 215 are integrally coupled to the movable table 1. The cutting means main body 21 in the standby position (FIG. 3A) moves up and down along the guide 22 (FIG. 3B), and also moves left and right along the movable table 1 (FIG. 3C). . The cutting means body 21 is integrally provided with a cutter holder 23, an actuator 275, and a oyster board 27. A cutter 25 is attached to the cutter holder 23 so as to penetrate the oyster plate 27.

  The operation of the cutting means 20 is performed as follows. That is, first, the screw for the extruder or the screw for the injection molding machine (not shown) is stopped, and the supply of the molten resin is stopped. Next, the resin cast from the T-die discharge port 53 is cut. For cutting the resin, the cutting means 20 is moved to one end of the T-die discharge port 53 under the control of the moving table 1, and then the cutting means main body 21 is raised from the standby position to the operating position by the elevating means 215. Then, the movable table 1 is moved along the T die discharge port 53 to cut the resin.

  When the cutting of the resin is completed, the cutting means main body 21 is lowered from the operating position to the standby position by the elevating means 215, and then the actuator 275 is operated in the arrow direction C to move the oyster plate 27 along the cutter 25. The oyster plate 27 is provided with a hole with a slight clearance around the cutter 25, and the resin remaining on the surface of the cutter 25 is scraped off from the cutter 25 by the movement of the oyster plate 27, and the oyster plate 27 is removed. It is transmitted and removed.

1 Moving platform
3, 3A, 3B cover
5 Servo mechanism
10 Wiping means
11 Wiping means body
13 Resin wipe
135, 135A, 135B Lifting means
15 Scraper
16 Scraper body
161 Sliding body
165 Actuator
20 Cutting means
21 Cutting means body
215 Lifting means
275 Actuator
22 Guide
23 Cutter holder
25 cutter
27 oyster board
30 Shuta
31 Shuta frame
315 Actuator
35 Bottom plate
37 Chute board
43 resin
45 Recovered resin
53 T die outlet

Claims (8)

On the moving table that reciprocates horizontally along the T-die discharge port, a cutting means for cutting the resin cast from the T-die discharge port, and the resin adhering to the surface of the T-die discharge port after the cutting is wiped off Wiping means is placed,
The cutting means has a cutter for cutting the resin, and an elevating means for moving the cutter up and down,
The wiping means includes a resin wiping body applied to the T-die discharge port, an elevating means for moving the resin wiping body up and down, and a scraper for removing the wiped resin adhering to the resin wiping body. Has a T-die discharge port cleaning device.   The resin wiping body has a hardness of 50 to 100 Rockwell (R scale), a length along the discharge port of the T die of 50 mm or more, and a thickness in the pressing direction of 10 mm or more. T-die discharge port cleaning device as described.   The cleaning device for a T-die discharge port according to claim 1 or 2, wherein the resin wipe is made of polytetrafluoroethylene (PTFE) resin.   The T-die according to any one of claims 1 to 3, wherein the resin wiping body is configured such that a pressing force to the surface of the T-die discharge port at the time of wiping the resin becomes a surface pressure of 0.5 to 12 MPa. Discharge port cleaning device.   The scraper includes a sliding body that slides on the wiping surface of the resin wiping body, and an actuator that reciprocates the sliding body in the horizontal direction. T-die outlet cleaning device.   To the cleaning device for the T-die discharge port according to any one of claims 1 to 5, further, a resin that is wiped off by a resin wiping body and dripped down, and a resin that is scraped off from the resin wiping body by a scraper A T-die discharge port cleaning device comprising a shooter that collects the collected resin and discharges the collected resin to a predetermined position.   The T-die discharge port cleaning apparatus according to any one of claims 1 to 6, further wiping off the resin remaining on the T-die discharge port and rubbing the wiped resin against the resin wiping body. A T-die discharge port cleaning device provided with air cooling means for blowing air before dropping. After discharging a predetermined amount of resin from the T-die discharge port, the extrusion of the resin is stopped, and after cleaning the T-die discharge port, a sheet-like resin molded body that starts the next cycle is continuously manufactured. A method,
First, after stopping the extrusion of the resin, cut the resin cast from the discharge port of the T die,
Next, the resin wiping body is applied to the T-die discharge port and pressed and slid from one end to the other end to wipe off the resin remaining on the T-die discharge port, and then the wiping that adheres to the resin wiping body. Scrape off the resin
And the manufacturing method of the sheet-like resin molding which starts the next cycle.

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