JP4495188B2 - Die lip cleaning device and die lip cleaning method - Google Patents

Description

  The present invention cuts the resin discharged from the die lip (resin discharge part) and wipes away the fine resin debris and the resin film remaining after the cutting, so that the die lip cleaning device and the cleaning to keep the die lip clean at all times It is about the method.

  While the distance between the resin discharge part of the die (hereinafter referred to as T die) and the mold surface is adjusted to be equal to the coating thickness, the molten thermoplastic resin is discharged from the T die while being discharged. Thus, a process is known in which a molten resin is applied to the fine irregularities on the mold surface, and then the applied resin is press-formed to produce a film-like product having the fine irregularities transferred to the surface ( For example, see Patent Document 1).

  In such a process, not only the resin discharged from the T-die lip during the molding operation is cut, but the T-die lip during molding is always cleaned by washing minute resin scraps and resin films that cannot be removed by cutting alone. Technology to keep it in good condition is required.

  The molding process disclosed in Patent Document 1 is a process in which the thickness of the resin to be applied is defined by the distance between the T die lip and the mold surface, and the resin to which the lip tip is applied (applied) for each molding cycle. Contact with. When the resin adheres to the lip tip and is dirty, the resin discharged from the lip curls and adheres to the outer surface of the lip tip, further promoting the stain.

  If the resin is left in the state where the resin remains at the tip of the lip, the resin is thermally deteriorated and discolored. On the other hand, there may be a case where the resin is solidified due to heat deprived by heat radiation from the atmosphere. When the heat-degraded resin is mixed in the product, it becomes a fatal defect particularly in the optical product. If the solidified resin remains, when the T-die is brought close to the mold for coating, the solidified resin comes into contact with the mold surface, destroying fine irregularities on the mold surface, or scratching the mirror surface. This causes problems such as wearing. Furthermore, when the resin remains on the T die lip and the smoothness of the lip surface (the surface with which the resin comes into contact) is impaired, streak-like scratches (T die line) are attached in the direction of resin application and the appearance of the final product is impaired. . That is, if the tip of the lip is dirty, the shape of the applied resin is greatly disturbed. In addition, fatal problems such as inability to apply resin to the mold surface occur. Therefore, in the technique described in Patent Document 1, it is important to keep the lip tip always clean.

  On the other hand, although the applied processes are different, several techniques related to the method of cleaning the T die lip are known (see, for example, Patent Documents 2 to 4).

  In Patent Document 2, the resin cutting position is either downstream of the T-die extrusion port (the sheet remains when cut) or directly below the extrusion port (cut by pressing the cutter blade against the extrusion port), and the cutter is a sheet. And a method and apparatus for cutting a sheet intermediate formed product that can be reciprocated in the sheet width direction and that is extruded from the T die extrusion port opening surface or downstream thereof from the T die.

  In Patent Document 3, the lip portion of the T die body is brought into contact with a blade that can advance and retreat in the longitudinal direction (width direction) of the T die, and the coating liquid held on (attached to) the lip portion is scraped off by moving the blade. If the next coating process is not started after a predetermined time has elapsed, a predetermined amount of coating liquid is supplied from the slit to hold the coating liquid on the lip, and then the T die body is lowered to bring the T die body to the blade. A method and apparatus for removing a coating liquid at a lip portion of a T-die coater that removes the coating liquid supplied to and held by the lip portion by bringing the lip portion into contact with each other and then moving a blade is disclosed.

Patent Document 4 discloses a lip lower surface cleaning device for a T-die apparatus, in which an eye dust removing body is formed on a lower surface of a grouper rod rod, and the eye rim is removed by sliding on the lower surface of the lip.
Japanese Patent No. 3857703 Japanese Patent Laid-Open No. 11-198159 Japanese Patent Laid-Open No. 11-147062 JP 2000-25089 A

  However, in any of the above-mentioned patent documents, although there is a disclosure about each of the method and apparatus for cutting the resin or the method and apparatus for cleaning the tip of the lip, the cleaning that completely removes the remaining resin after the cutting is performed. There is no disclosure of the method including the above.

  That is, the technique of Patent Document 2 only cuts the sheet (resin) at the T-die extrusion port, and a small amount of resin waste and resin film remain at the extrusion port even after cutting. There is no disclosure of a method for further removing the remaining resin, and the remaining resin is thermally deteriorated and discolored. When this is mixed into a product, it becomes a fatal defect particularly in an optical member.

  The technique of Patent Document 3 is also the same. Even if a cutter is pressed against the lip portion and cut, a small amount of resin debris and resin film remain, so thermal deterioration of the remaining resin is inevitable. Become.

  In the technique of Patent Document 4, there is a possibility that the rod rod with a grouper becomes dirty during use, and dirt is mixed into the resin.

  In Patent Document 3, the blade is brought into contact with the lip portion of the T-die main body. However, depending on the material of the lip portion and the surface treatment, the blade is damaged when touched, and the discharged resin is caused by the scratch. A streak-like pattern (T die line) is generated. Patent Document 3 discloses a hard rubber plate, a plastic plate, or the like as a material of the blade. However, if the blade edge is sharpened in order to cut the resin well, the above-described material lacks strength. . Increasing the strength increases the possibility of scratching as described above. For this reason, it is not optimal to bring the blade into contact. In some cases, it is preferable to provide a slight gap between the blade (corresponding to the cutter of the present application) and the lip. However, since it becomes difficult to cut the resin if it is separated too much, it is necessary to adjust the gap according to conditions such as the hardness of the resin material to be used.

  As described above, in the above-described Patent Documents 2 to 4, not only the resin discharged from the T-die is cut, but also a means and an apparatus having a cleaning mechanism that completely removes remaining resin waste and resin film. There is no disclosure.

  That is, in the technique disclosed in the above-described patent document, the T-die lip is soiled with the attached resin unless the portion that contacts the T-die lip is kept clean for cutting and cleaning. The cleaning of the lip requires cleaning not only the flat surface portion of the resin discharge portion as shown in Patent Document 4, but also the left and right taper portions and side walls (vertical surfaces) (not shown). Even if 3 and 3 are included, only the cutting of the resin on the flat surface of the discharge portion is assumed, and there is no suggestion that cleaning is performed including the tapered portion.

  The present invention has been made in order to solve the above-described problems. In addition to cutting the resin discharged from the T-die lip, the present invention removes resin residue and resin film that remain minutely in the lip portion. An object of the present invention is to provide a T-die lip cleaning device and a T-die lip cleaning method capable of always keeping the tip of the die lip clean.

  In order to solve the above-described problems, the T-die lip cleaning device of the present invention includes a cutting mechanism for cutting the resin discharged from the T-die lip, and after the cutting by the cutting mechanism, remains on the T-die lip following the cutting. And a wiping mechanism for wiping and removing the resin waste or the resin film.

  Further, in the T-die lip cleaning device of the present invention, the cutting mechanism cuts the resin discharged from the T-die lip by driving the cutter and the cutter so as to approach the T-die lip when cutting the resin, And a cutter up-and-down moving mechanism that moves downward so as to leave the T-die lip after cutting.

  In the T die lip cleaning device of the present invention, the cutter vertical movement mechanism has a pressing force adjusting mechanism for pressing the cutter against the T die lip with a predetermined force.

  Further, in the T-die lip cleaning device of the present invention, the vertical movement mechanism of the cutter has a positioning mechanism capable of adjusting a gap between the cutter that has been lifted and the T-die lip to a predetermined distance. To do.

  Further, in the T-die lip cleaning device of the present invention, the wiping mechanism includes a scraper provided with a notch having substantially the same shape as a cross-sectional shape of the T-die lip, a scraper up-and-down moving mechanism for moving the scraper up and down, and And a sheet feeding mechanism for moving a new sheet onto the scraper by feeding a predetermined amount of a wiping sheet sandwiched between the notch of the scraper and the T die lip when the scraper is raised. To do.

  In the T-die lip cleaning device of the present invention, the scraper up-and-down moving mechanism includes a pressing force adjusting mechanism that presses the scraper against the T-die lip with a predetermined force.

  In the T-die lip cleaning device of the present invention, the notch of the scraper has a shape in which the sheet is brought into contact with the tip surface of the T-die lip, the tapered portion of the notch, and the side wall portion.

  Further, the T-die lip cleaning device of the present invention is characterized in that it has a device driving mechanism for moving the cutting mechanism and the wiping mechanism back and forth in the width direction of the T-die having the T-die lip.

  In the T-die lip cleaning device according to the present invention, the device drive mechanism is capable of positioning the cutting mechanism and the cleaning device at positions specified in advance and adjusting a moving speed to the position. To do.

  In the T-die lip cleaning device of the present invention, the cutting mechanism and the wiping mechanism are arranged on the same axis, and the distance between the cutting mechanism and the wiping mechanism is wider than the width of the T-die lip. Then, after the resin is cut by the cutter, it is arranged so that the lip can be wiped and washed.

  In the T die lip cleaning method of the present invention, the resin discharged from the T die lip is cut by the cutting mechanism, and then the resin waste or the resin film remaining on the lip portion of the T die lip is wiped by the wiping mechanism. It was made to remove.

  According to the present invention, not only the resin discharged from the die lip is cut, but also the resin chips and the resin film that remain minutely in the lip portion are removed, so that the die lip tip can always be kept clean.

  Embodiments of the present invention will be described below.

  In the present embodiment, after the resin discharged from the T die lip is cut, the resin waste and the resin film remaining on the lip (lip portion) are further removed. This T-die lip cleaning device includes a cutting mechanism for cutting the resin discharged from the T-die lip, and a wiping mechanism (lip cleaning mechanism) for wiping and removing resin debris and resin film remaining on the lip portion. Have.

  The aforementioned cutting mechanism includes a cutter that cuts the resin discharged from the T die lip, and a mechanism that moves the cutter up and down. The vertical movement mechanism includes a pressing force adjusting mechanism that adjusts the pressing force of the cutter against the tip end portion of the T die lip, or a positioning mechanism that makes it approach, and an appropriate mechanism can be selected and used as appropriate. These mechanisms can be constituted by springs and screw mechanisms.

  In addition, the method and apparatus according to the present embodiment has a mechanism for wiping off small resin debris and resin film adhering to the lip tip. This mechanism consists of a scraper with a notch having the same shape as the cross-sectional shape of the T-die lip, a scraper vertical movement mechanism that moves the scraper up and down, and a wiping sheet that is sandwiched between the lip when the scraper is raised (wiping on the scraper Sheet) and a sheet feeding mechanism that moves a new paper surface onto the scraper by feeding a certain amount of the wiping sheet.

  The scraper vertical movement mechanism includes a pressing force adjusting mechanism that presses the wiping sheet on the scraper against the T die lip with a predetermined force, and the apparatus can be used by adjusting to a force suitable for cleaning. The notch of the scraper is provided with a shape that allows the wiping sheet to contact not only the lip tip surface but also the taper portion and the side wall portion.

  The resin cutting mechanism and the wiping mechanism described above can be moved by a device driving mechanism that moves back and forth in the T-die width direction. By this drive mechanism, the resin cutting mechanism and the cleaning device are positioned at positions specified in advance, and the moving speed up to that position is appropriately adjusted.

  In addition, after the resin discharged from the T die lip is cut by this resin cutting treatment, the debris resin is secured in a dust box installed at the lower part of the apparatus. Since a certain amount of the debris resin is secured, it can be taken out to the outside, so that the debris resin can be processed periodically.

  Furthermore, this apparatus has a cutter cleaning mechanism for removing the resin adhering to the cutter and keeping the cutter in contact with the resin discharged from the lip portion clean. This cutter cleaning mechanism is configured to pass a cutter through a cleaning plate cut out in substantially the same shape as the cross-sectional shape of the cutter and scrape off the resin adhering to the cutter (resin protruding from the cross-section).

  Further, the resin cutting mechanism and the wiping mechanism of this apparatus are arranged coaxially, and the distance between the cutting mechanism and the wiping mechanism is made wider than the width of the T die lip, so that the lip is continued after the resin cutting. The lip tip can be cleaned in a short time.

  FIG. 1 is a diagram showing a typical configuration of a T-die lip cleaning device according to an embodiment of the present invention, FIG. 2 is a diagram showing a state of cutting resin, and FIG. 3 is an arrangement of a cutting mechanism and a wiping mechanism. FIGS. 4 and 4 are views showing examples of notch shapes provided in the scraper, FIGS. 5 to 7 are views showing the operation of the present embodiment, and FIG. 8 is a perspective view showing a cutter cleaning mechanism.

  1 includes a cutting mechanism 2, a wiping mechanism 3, a stage 4 on which these are mounted, and a stage driving mechanism 6 for moving the stage 4 back and forth in the width direction of the T die 5. Is done.

  The cutting mechanism 2 has a cutter 21, a cutter vertical movement mechanism 22, and a turning mechanism 23 for turning the cutter. When the resin is cut by the turning mechanism 23, the cutter 21 is directed in the direction of the lip as shown in FIGS. 1 and 2 (b), but when the apparatus is retracted after cutting, the cutter is moved as shown in FIG. 7 (S9). Turning 90 degrees and passing the cutter 21 through a groove 71a provided in the cutter cleaning block 71 of the cutter cleaning mechanism 7 and processed into a cutter shape, as shown in FIG. Then, the resin adhering to the cutter 21 is scraped off and washed. The cutter 21 is subjected to a surface treatment for suppressing resin adhesion.

  As shown in FIG. 2B, in the cutting by the cutting mechanism 2, the cutter 21 is pressed against the T die lip 5a, but a gap may be provided between the two as described above. However, it is known that if the gap is large, the resin 8 cannot be cut only by pressing the resin 8 as shown in FIG. In order to perform good cutting, it is preferable to set the gap to 1 mm or less.

  As shown in FIGS. 3 and 4, the wiping mechanism 3 includes a scraper 31 provided with a notch 31a having substantially the same cross-sectional shape as the T-die lip 5a, a scraper up-and-down moving mechanism 32 that moves the scraper 31 up and down, and a scraper. A wiping sheet feeding mechanism (34, 35, 36) that moves a new sheet surface onto the scraper 31 by feeding a certain amount of the wiping sheet 33 and the wiping sheet 33 sandwiched between the T die lip 5a when the 31 is raised Consists of

  As shown in FIG. 3, the wiping sheet 33 is installed in a roll shape at a roll-shaped attachment portion 34. The wiping sheet feeding unit 35 is configured such that the wiping sheet 33 is sandwiched between upper and lower rolls, and one side of the roll is rotated by a driving mechanism such as a motor, and the other side is driven. The wiping sheet is wound up in the sheet winding unit 36.

  The wiping sheet feeding unit 35 is configured to allow (1) at least one roll to move up and down so that the feeding of the wiping sheet is not hindered by the resin lump adhering to the wiping sheet 33 (Furthermore, It is preferable that the roll is pressed against the other roll using an elastic force such as a spring), (2) the roll surface is made of a soft elastic body, etc., so that some unevenness can be overcome, or (3) It is preferable to take measures such that the central part of the roll is dented and at least the unevenness caused by the resin adhering to the vicinity of the width center of the wiping sheet 33 does not affect the rotation of the roll.

  In addition, the material of the wiping sheet 33 employed in the present embodiment is excellent in heat resistance using cotton as a raw material, and has few impurities in the wiping sheet, and the thickness of the wiping sheet is about 0.4 mm.

  As shown in FIG. 4, in the wiping mechanism 3, a scraper 31 provided with a notch 31a having substantially the same shape as the tip of the T die lip 5a is placed between the scraper 31 and the tip of the T die lip. Press with a predetermined force while pinched. As a result, not only the tip of the lip but also the taper portion and the side wall portion come into contact. By moving the cleaning device in this state, the resin waste and resin film of the entire lip are wiped off.

  Note that the scraper 31 can be cleaned without damaging the T die lip 5a at the time of contact by using a material having a lower hardness than the T die lip, such as copper alloy, hard rubber, lead, or bamboo.

  The stage drive mechanism 6 includes an electric motor 6a and a ball screw 6b, but may be a combination of an air cylinder and a proximity switch. The moving speed is adjusted by changing the air flow rate, and the stop position may be detected by a proximity switch. Similarly, other means may be used as long as the moving speed and the stop position can be adjusted.

  According to the configuration shown in FIG. 3, the cutting mechanism 2 and the wiping mechanism 3 are installed on the same axis, and the distance between the cutter 21 and the scraper 31 is made wider than the width of the lip. After the resin cutting, the lip cleaning can be continuously performed.

  In addition, after cutting the resin discharged from the T-die lip 5a by the cutting mechanism 2, the debris resin after cutting is secured with a dedicated dust box (not shown) so that a certain amount of debris resin can be stored and taken out to the outside. Also good.

The operation will be described below with reference to FIGS.
(S1) It is started by a start command.
(S2) The stage drive mechanism 6 moves the cleaning device for the T die lip 5a to the resin cutting start position.
(S3) The cutter 21 is raised by the cutter vertical movement mechanism, and the cutter 21 is pressed against the T die lip 5a. Alternatively, the cutter 21 is raised to a position close to the T die lip 5a.
(S4) The stage drive mechanism 6 moves (advances) the cutter to the cutting end position, and cuts the resin discharged from the lip 5a.
(S5) The stage drive mechanism 6 moves the T die lip 5a cleaning device to the T die lip cleaning start position.

(S6) The scraper 31 is moved up by the scraper vertical movement mechanism 32, and the scraper 31 is pressed against the tip of the lip (wiping sheet on the scraper).
(S7) The scraper 31 is moved (advanced) to the cleaning end position by the stage drive mechanism 6, and the resin debris and the resin film adhering to the T die lip 5a are wiped off and removed (cleaning operation in the forward path).
(S8) The scraper 31 is moved down by the scraper vertical movement mechanism 32.

(S9) The stage drive mechanism 6 moves the cleaning device (stage 4) for the T die lip 5a back to the standby position. In this case, the cutter 21 is turned in the direction opposite to the paper surface so that the cutter surface can be cleaned by the cutter cleaning mechanism (FIG. 8) as shown in FIG. 7 (S9). The cleaning is performed by inserting the cutter into the groove 71a processed into the cutter shape of the cutter cleaning mechanism 7 by the backward movement of the cleaning device.
(S10) The wiping sheet feed mechanism 3 feeds the wiping sheet 33 by a predetermined amount, retracts the surface of the wiping sheet 33 to which the resin has adhered from the scraper 31, and moves the new wiping sheet 33 onto the scraper 31.

  In addition, by including the following steps between the above (S7) and (S8), the T die lip 5a can be cleaned not only in the forward path but also in the return path, and can be operated more efficiently.

(S7-1) The scraper 31 is lowered.
(S7-2) The wiping sheet feeding mechanism 3 feeds the wiping sheet 33 by a predetermined amount, retracts the wiping sheet surface to which the resin has adhered from the scraper 31, and moves the new wiping sheet 33 onto the scraper.
(S7-3) The scraper 31 is raised and the scraper 31 is pressed against the lip tip (wiping sheet on the scraper).
(S7-4) The stage drive mechanism 6 moves (retracts) the T die lip 5a cleaning device to the T die lip cleaning start position.

  The operation of the present embodiment described above is performed in the process disclosed in Japanese Patent No. 3857703 (1) before the start of measurement, (2) after the completion of measurement, (3) before the start of application, and (4) after the end of application. Done. However, this is only an example, and it may be performed only at the one time point described above, or a part of steps (1) to (4) may be selected as appropriate. Of course, it may be performed in steps other than those described above, and may be performed when necessary. In addition, after waiting for the metering operation to start the application of the next cycle after the application is completed, the plasticizer is driven to discharge the resin from the T die lip (at regular intervals). If the operation of cutting the T-die lip resin and cleaning the lip portion is repeated by starting the T-die lip cleaning device, the thermal deterioration of the resin in the device can be prevented.

As the effects of the embodiment, the following effects are obtained.

  In the embodiment of the present invention, not only the resin discharged from the T-die lip is cut, but also the resin debris and the resin film that remain in the lip portion are removed, so that the lip tip is always kept clean. Therefore, the resin that adheres to the lip and is thermally deteriorated and burnt yellow or brown does not enter the product. Further, if the resin adheres to the lip tip, the resin cannot be smoothly discharged, and the discharged resin curls and adheres to the outer surface of the lip tip. The adhering resin causes contamination of the product. Resin curling can be prevented by keeping the tip clean. Further, the resin adheres to the lip (usually a mirror-finished smooth surface), and the smoothness of the lip is impaired. When the resin is discharged or applied in this state, the discharged resin is caused by unevenness of the lip flow path. A streaky pattern (fine scratches) is generated. This not only impairs the appearance of the product, but also gives a fatal defect to the required quality such as the optical characteristics of the product.

  Further, the cutter is pressed against or brought close to the tip end portion of the T die lip by the cutter vertical movement mechanism provided in the resin cutting mechanism. In order to cut the resin discharged from the lip well, it has become clear from experiments by the inventors that the cutter needs to be in contact with or close to the lip discharge portion (see FIG. 2). Focusing on cutting, it is preferable to cut with the cutter in contact with the lip, but bringing the sharply-configured cutter into contact with the lip means that the lip is damaged and the cutter tip is damaged. Not necessarily optimal. In this case, a means for lowering the pressing force by the pressing force adjusting mechanism can be considered, but it is preferable to bring the tip of the cutter close to the lip to 1 mm or less. As a result, satisfactory cutting of the resin and avoidance of damage to the lip and damage to the cutter can be satisfied.

  If the resin adhering to the cutter is left unattended, it may reattach to the lip at the next cutting. For this reason, it is preferable that the cutter surface is subjected to a surface treatment such as a Teflon coating that makes it difficult for the molten resin to adhere. Furthermore, in this application, it has the cutter washing | cleaning mechanism for removing the resin adhering to a cutter, and the adhesion of the resin to a cutter is prevented. Usually, when the temperature of the cutter rises, the resin tends to adhere, so it is desirable to provide means for cooling the cutter.

The cleaning mechanism for the lip portion, which is also the greatest feature of the embodiment of the present invention, is that the scraper is placed with a wiping sheet sandwiched between a lip and a scraper provided with a notch having substantially the same shape as the cross-sectional shape of the lip. Press and move back and forth as it is. Thereby, the minute resin waste, the resin film, etc. adhering to the lip portion can be washed.
The vertical movement mechanism of the scraper includes a mechanism for adjusting the pressing force, and the pressing force can be appropriately changed according to the cleaning state. Usually, the stronger the pressing force is, the higher the cleaning effect is. However, when the pressing force is too strong, problems such as the wiping sheet tearing occur.
As a means for keeping the portion of the wiping mechanism in contact with the lip always clean, the wiping sheet was fed by a certain amount after washing, and washing was always started with a new wiping sheet installed on the scraper. Thereby, the resin adhering to the wiping mechanism side does not adhere again to the lip, and the lip is not soiled.

  The scraper notch has a shape that allows the wiper sheet to contact not only the lip tip surface but also the taper and side walls, even if the curled resin adheres to the taper or side walls of the lip. It is designed to be removed by washing.

  The above-described resin cutting mechanism and wiping mechanism can be moved by a device driving mechanism that moves back and forth in the T-die width direction. By this drive mechanism, the resin cutting mechanism and the cleaning device are positioned at positions designated in advance, and the moving speed up to that position is appropriately adjusted. Thereby, the cutting of the resin and the cleaning of the lip portion can be performed at the optimum position and speed. In particular, when the cutter is pressed against the lip, it is necessary to raise the cutter after reaching a place where the cutter comes into contact with the lip. If this position is too close, the raised cutter will poke the lip. If it is too deep, the resin to be cut will be pressed by the cutter and cutting will not be possible. The lip cleaning is similar, and the cutting and cleaning positioning operations play an important role. Moreover, it is preferable that the speed can be adjusted, and cutting may not be successful if the speed is particularly slow.

  After the resin discharged from the T-die lip is cut by the cutting mechanism, the debris resin after cutting can be secured by a dedicated dust box, and a certain amount of debris resin can be stored and taken out to the outside. Thereby, it becomes possible to prevent a decrease in the cleanliness of the entire apparatus due to debris resin periodically generated from the T die lip, and it becomes possible to keep the molded product clean.

  In order to efficiently perform the above-described cutting / cleaning operation in a short time, the resin cutting mechanism and the wiping mechanism of this apparatus are arranged on the same axis. In addition, by making the distance between the cutting mechanism and the wiping mechanism wider than the width of the T-die lip, the lip can be continuously cleaned after the resin cutting.

It is a figure which shows the typical structure of the T-die lip cleaning apparatus concerning embodiment of this invention. It is a figure which shows a mode that resin is cut | disconnected. It is a figure which shows arrangement | positioning with a cutting mechanism and a wiping mechanism. It is a figure which shows the example of the notch shape provided in the scraper. It is a figure which shows the operation | movement 1 of this Embodiment. It is a figure which shows the operation | movement 2 of this Embodiment. It is a figure which shows the operation | movement 3 of this Embodiment. It is a perspective view which shows a cutter washing | cleaning mechanism.

Explanation of symbols

  1 T die lip cleaning device, 2 cutting mechanism, 3 wiping mechanism, 4 stage, 5 T die, 5a T die lip, 6 stage drive mechanism, 7 cutter cleaning mechanism, 21 cutter, 22 cutter vertical movement mechanism, 23 turning mechanism, 31 Scraper, 31a Notch, 32 Scraper vertical movement mechanism, 33 Wipe sheet, 34 Roll attachment part, 35 Wipe sheet feeding part, 36 Sheet winding part, 71 Cleaning plate, 71a Groove.

Claims (12)

A cutting mechanism for cutting the resin discharged from the die lip;
Wherein the following the cut by the cutting mechanism resin chips or resin film remaining in the die lip possess a wiping mechanism for removing I wipe,
The wiping mechanism is
A scraper provided with a notch having substantially the same shape as the cross-sectional shape of the die lip;
A scraper up-and-down moving mechanism for moving up and down the scraper;
And characterized in that perforated the sheet feed mechanism for moving the sheet on the scraper by sending wipe certain amount sheet for removing sandwiched between the notch and the lip of the scraper during rise of the scraper cleaning apparatus of the die lip to be. The cutting mechanism is
A cutter,
A cutter up-and-down moving mechanism that drives the cutter so as to approach the die lip when cutting the resin, cuts the resin discharged from the die lip, and drives the cutter downward to separate from the die lip after cutting. The die lip cleaning device according to claim 1.   3. The die lip cleaning device according to claim 2, wherein the cleaning device is located away from the die except when the die lip is cleaned.   3. The die lip cleaning device according to claim 2, wherein the vertical movement mechanism of the cutter provides a gap of a predetermined distance between the cutter that is driven up and the die lip.   The die lip cleaning apparatus according to claim 4, wherein a gap between the cutter and the die lip is 1.0 mm or less. The scraper vertical movement mechanism, cleaning apparatus of the die lip according to any one of claims 1 to 5, characterized in that it has a pressing force adjusting mechanism for pressing with a predetermined force said scraper to said die lips. 7. The die lip cleaning device according to claim 6 , wherein the notch of the scraper has a shape in which the sheet is brought into contact with a tip end surface of the die lip, a tapered portion of the notch, and a side wall portion. Die lip cleaning device according to any one of claims 1 to 7 material of the sheet, characterized in that the cotton is obtained as a raw material. The die lip cleaning device according to any one of claims 1 to 8 , further comprising a device drive mechanism for moving the cutting mechanism and the wiping mechanism back and forth in the width direction of the die having the die lip. 10. The die lip cleaning device according to claim 9 , wherein the device drive mechanism is capable of positioning the cutting mechanism and the wiping mechanism at positions specified in advance and adjusting a moving speed to the position. . The cutting mechanism and the wiping mechanism are arranged on the same axis, and the distance between the cutting mechanism and the wiping mechanism is made wider than the width of the die lip, so that the lip is continuously cut after the resin is cut by the cutter. cleaning device die lip according to any one of claims 1 to 1 0, characterized in that the arranged to allow the wiping cleaning. After the resin discharged from the die lip is cut by the cutting mechanism, the scraper provided with a notch that is substantially the same shape as the cross-sectional shape of the die lip is raised by the wiping mechanism, and when the scraper is raised, the scraper said resin scrap or resin film remaining in the die lip is removed by taking wipe in sheet sandwiched between the notches and the die lip, Before moving the sheet on the scraper said sheet by sending a certain amount Die lip cleaning method.

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