JP5579395B2 - Component recognition device, surface mounter - Google Patents

Description

  The present invention relates to a component recognition device that recognizes the suction posture of an electronic component that is sucked and held by a suction nozzle and moves on a base based on an image, and a surface mounter including the component recognition device.

  2. Description of the Related Art Conventionally, a surface mounting machine is widely known in which an electronic component supplied through a component supply device is sucked by a suction nozzle and mounted on a substrate. Such a surface mounter is equipped with a component recognition device equipped with a camera, and acquires image data of the component by photographing the electronic component with the camera. Then, based on the acquired image data of the component, the posture of the electronic component sucked and held by the suction nozzle is recognized, and processing for correcting the deviation of the posture is performed. Patent Document 1 below proposes a camera using a TDI sensor.

  The TDI sensor synchronizes the movement of the image of the electronic component imaged on each light receiving element and the transfer of the signal charge, so that the signal charge corresponding to the same part of the electronic component 5 is accumulated in each light receiving element. These are sensors that integrate and output the accumulated signal charges (time delay integration method). As a result, the total exposure time for accumulating electric charges in the light receiving element can be increased. Therefore, even when taking an image by moving the electronic component sucked by the suction nozzle, even when shooting at high speed or shooting with a small amount of light The amount of signal charge can be secured, and the accuracy of image data can be increased.

JP 2008-270719 A

  As described above, in the TDI sensor, it is necessary to synchronize the movement of the image of the electronic component formed on each light receiving element and the transfer of the signal charge. If the two are out of sync with each other, there will be a shift in the overlap of the integrated signal charges, and the image will be blurred when output as image data, making it impossible to obtain a highly accurate image. . For this reason, when using a TDI sensor, it is desirable that the relative movement between the TDI sensor and the electronic component be completely constant. However, when the relative movement of the electronic component is performed using a rotary motor or a linear motor, It is difficult to move at a completely constant relative speed due to cogging.

  The present invention has been completed based on the above circumstances, and it is possible to synchronize the movement of the image of the electronic component formed on each light receiving element and the transfer of the signal charge with high accuracy. An object is to provide a component recognition device and a surface mounter including the component recognition device.

  The present invention corresponds to a camera including a condenser lens and an image sensor, a moving device that relatively moves the electronic component sucked and held by a suction nozzle, and the movement amount of the relative movement. And an encoder that outputs a pulse signal. The electronic component is photographed by the camera while the electronic component and the camera are relatively moved by the moving device, and the electronic component is based on the obtained image. A component recognition device for recognizing a suction posture of a two-dimensional light receiving unit configured by arranging a plurality of pixel rows in which light receiving elements are arranged in a row, and signal charges accumulated in the light receiving elements of the pixel rows. A TDI sensor, which is the image sensor, including a two-dimensional transfer unit that sequentially transfers data to the next column in units of columns, an oscillation circuit that outputs a clock signal, and resolution on the TDI sensor side When the resolution ratio on the encoder side is defined as the resolution ratio, the target is based on the resolution ratio and the number of signals of the clock signal output during the output period of the pulse signal output from the encoder. A setting means for setting a count value, a clock counter for executing a count operation for counting the clock signal, and the next transfer to the TDI sensor on condition that the clock counter counts the clock signal to the target count value And a transfer command means for outputting a command.

  The present invention includes a base, a substrate transfer device that carries a substrate to be mounted on the base, a component supply device that is provided on the base and supplies electronic components, and suction holding of the electronic components A suction nozzle that performs a mounting operation to mount the electronic component supplied through the component supply device on the substrate, a head unit provided with the suction nozzle, and the head unit on the base The camera includes a head drive device that moves horizontally and a component recognition device, and the camera that constitutes a part of the component recognition device is installed to be movable relative to the head unit via the movement device. Features. With such a configuration, the suction posture can be more reliably recognized by the component recognition device, and a more precise electronic component mounting operation can be performed.

  The present invention includes a base, a substrate transfer device that carries a substrate to be mounted on the base, a component supply device that is provided on the base and supplies electronic components, and suction holding of the electronic components A suction nozzle that performs a mounting operation to mount the electronic component supplied through the component supply device on the substrate, a head unit provided with the suction nozzle, and the head unit on the base The camera includes a head drive device that moves horizontally and a component recognition device, and the camera that constitutes a part of the component recognition device is fixedly installed on the base, and the movement device is the head drive device. It is characterized by that.

As an embodiment of the present invention, the following configuration is preferable.
The clock counter performs the counting operation in units of output periods of pulse signals output from the encoder during relative movement performed for the imaging, and the setting means includes the resolution ratio and the number of signal charges transferred. And a multiplier for determining the target count value by multiplying the number of signals counted by the clock counter in the output cycle by the count correction value. With.

  The number of signals to be multiplied by the count correction value is the number of signals counted in the output cycle immediately before the pulse signal. With such a configuration, the target count value can be determined based on the number of signals in the immediately preceding output cycle (corresponding to the relative movement speed between the electronic component and the camera). For this reason, even when the relative movement speed between the electronic component and the camera changes, the signal charge can be transferred in response to the speed change.

  According to the present invention, since the output timing of the transfer command to the TDI sensor is adjusted based on the resolution ratio, the electronic component is moved in the relative movement direction regardless of the resolution on the light receiving unit side and the resolution on the encoder side. The signal charge can be transferred when it has moved by a distance equal to the resolution on the side, and the movement of the image of the electronic component formed on each light receiving element and the transfer of the signal charge can be synchronized with high accuracy. As a result, a signal obtained by integrating signal charges corresponding to the same part of the electronic component can be obtained from the TDI sensor, and a clearer image of the electronic component can be obtained. For this reason, even when the TDI sensor and the electronic component cannot be moved relative to each other at a completely constant speed, the suction posture of the electronic component can be reliably recognized.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, a plurality of mounting heads 25 for mounting the electronic component 5 are mounted in a row on the head unit 20 of the surface mounter 100 in this embodiment. Each mounting head 25 protrudes downward from the lower surface of the head unit 20, and a suction nozzle 26 is provided at the tip. Each suction nozzle 26 is configured to be supplied with a negative pressure from a negative pressure means (not shown), and a suction force is generated at the tip of the suction nozzle 26 so that the electronic component 5 can be sucked and held. .

  The component recognition device U of the present embodiment is provided in the head unit 20 and recognizes the suction posture of the electronic component 5 sucked by the suction nozzle 26. In the following description, the component recognition apparatus U will be described first, and then the configuration of the surface mounter 100 will be described. In the following description, it is assumed that the X direction, the Y direction, and the Z direction are determined in the directions shown in FIGS.

(1) Configuration of Component Recognizing Device As shown in FIGS. 2 and 3, the component recognizing device U mainly includes a camera unit 60, a linear motor 51, a linear encoder 55, a control device 30, and an image capturing device 50. Has been. The camera unit 60 is a unit in which the light receiving camera 65, the LED 63, and the reflection mirror 54 are accommodated in a casing 61.

  As shown in FIG. 2, the light receiving camera 65 includes a condenser lens 66 and a TDI (Time Delay Integration) sensor 70 (described later in detail) as an image sensor. The condenser lens 66 forms an image of light incident on the camera on the light receiving portion 71 (see FIG. 4) of the TDI sensor 70.

  The reflection mirror 54 is provided below the suction nozzle 26, and changes the direction of light traveling downward from the electronic component 5 to a substantially horizontal direction, thereby causing the light to enter the light receiving camera 65. A plurality of LEDs 63 are provided on both sides of the reflection mirror 54 to illuminate the electronic component 5 from below.

  A bottom frame 22 having a long shape in the X direction is attached to the lower surface of the head unit 20. Side frames 23 that are long in the X direction are fixed to both sides of the bottom surface of the bottom frame 22. A pair of guide rails 24 that are long in the X direction are fixed to the lower ends of the side frames 23.

  A pair of sliders 57 are fixed to the upper surface of the camera unit 60 via a base plate 56. Each slider 57 is attached to each guide rail 24 so as to be movable in the X direction, and the slider 57 and the guide rail 24 constitute a linear guide 58. With the above configuration, the camera unit 60 can move in the X direction with respect to the head unit 20 via the linear guide 58.

  The linear motor 51 is mainly composed of a permanent magnet 27 and a coil portion 52. A plurality of permanent magnets 27 are arranged on the lower surface of the bottom frame 22 along the X direction. Specifically, the permanent magnet 27 with the bottom surface being N-pole and the top surface being S-pole and the permanent magnet 27 having the bottom surface being S-pole and the top surface being N-pole are alternately arranged in the X direction. ing. The coil unit 52 is provided on the upper surface of the camera unit 60 so as to be close to and opposed to the permanent magnet 27.

  With the above configuration, when a current is applied to the coil unit 52, the coil unit 52 moves in the X direction. Accordingly, the camera unit 60 can be moved along the linear guide 58 while being relatively movable in the X direction with respect to the head unit 20 and thus the electronic component 5. In the present embodiment, the linear motor 51 is an example of a “moving device” described in the claims.

  The linear encoder 55 includes a magnetic scale 28, a magnetic sensor 62, and a signal conversion circuit 40. The magnetic scale 28 is fixed to the outer surface of the right side frame 23 in FIG. The magnetic scale 28 is formed along the X direction. On the magnetic scale 28, N and S poles are alternately formed in the X direction at a constant pitch. An L-shaped sensor support member 59 is fixed to the side surface of the base plate 56, and a magnetic sensor 62 is attached to the sensor support member 59 so as to face the magnetic scale 28.

  The magnetic sensor 62 includes a magnetoresistive element (not shown) whose resistance value increases or decreases depending on the strength of the magnetic field. When a voltage is applied to the magnetic sensor 62, a voltage having a magnitude corresponding to the resistance value of the magnetoresistive element is output from the magnetic sensor 62. With the above configuration, when the magnetic sensor 62 moves along the magnetic scale 28, the magnetic poles around the magnetic sensor 62 alternately change between the N pole and the S pole, so that the strength of the magnetic field changes. For this reason, the resistance value of the magnetoresistive element increases and decreases, and the magnetic sensor 62 outputs a sinusoidal voltage signal having a period corresponding to the pitch of the N pole and the S pole.

  The voltage signal output from the magnetic sensor 62 is converted into a pulse signal Sp corresponding to the period of the voltage signal by the signal conversion circuit 40. Thus, by counting the pulse signal Sp, the position of the magnetic sensor 62 with respect to the magnetic scale 28, and thus the relative movement amount of the camera unit 60 with respect to the electronic component 5 (head unit 20 side) in the X direction can be detected. ing.

  Specifically, when the electronic component 5 moves by the same distance as the encoder-side resolution (hereinafter, encoder resolution WR), the linear encoder 55 outputs the pulse signal Sp once. The encoder resolution WR is determined by, for example, the pitch of the N pole and the S pole formed on the magnetic scale 28. In the present embodiment, the linear encoder 55 is an example of an “encoder” recited in the claims.

  As shown in FIG. 3, the control device 30 includes an MPU 35 and a transfer command circuit 160. The MPU 35 and the transfer command circuit 160 are configured to receive the pulse signal Sp output from the magnetic sensor 62 via the signal conversion circuit 40, respectively.

  The MPU 35 is connected to the linear motor 51 via the linear drive control unit 37, and has a function of giving a drive command to the linear drive control unit 37 and controlling energization of the coil unit 52 of the linear motor 51. Thus, a feedback control system for controlling the position of the linear motor 51 is constructed from the MPU 35, the linear motor 51, and the linear encoder 55.

  The transfer command circuit 160 is connected to the signal conversion circuit 40, the MPU 35, and an image capture device 50 described below. By outputting an imaging command to the image capture device 50 described below, the signal charge The transfer timing is determined. The configuration of the transfer command circuit 160 will be described in detail later.

  The image capturing device 50 is constituted by, for example, a DSP (Digital Signal Processor). The image capturing device 50 is electrically connected to the transfer command circuit 160 and the light receiving camera 65 of the control device 30, and the image capturing timing of the light receiving camera 65 constituting the camera unit 60 and the image data between the light receiving camera 65 and the image capturing device 50. The function of controlling the delivery and the like together with the control device 30 is carried out.

  With the above configuration, the component recognition device U moves the electronic component 5 to the camera unit 60 while moving the camera unit 60 relative to the electronic component 5 under the control of the control device 30 and the image capturing device 50. In this configuration, the suction posture of the electronic component 5 sucked and held by the suction nozzle 26 is recognized.

(2) Configuration of TDI Sensor As shown in FIG. 4, the TDI sensor 70 includes a two-dimensional light receiving unit 71 formed by arranging a plurality of pixel rows in which light receiving elements PD are arranged in a row, a transfer unit 75, and the like. , Is mainly composed.

  The transfer unit 75 sequentially transfers signal charges read from the light receiving unit 71, and includes a vertical register 76 and horizontal registers 78A and 78E.

  The vertical registers 76 are two-dimensionally arranged. Specifically, the register rows 76a to 76e arranged in a line in the horizontal direction (H direction) are arranged in a plurality of stages (five stages in the figure) in the vertical direction. It is. Each register (cell) RT constituting the vertical register 76 corresponds to each light receiving element (cell) PD constituting the light receiving unit 71 in a one-to-one relationship, and the signal charge of each light receiving element PD is assigned to it. The read signal charges can be transferred to the corresponding registers RT and transferred in the vertical direction (vertical transfer operation).

  The horizontal registers 78A and 78E send the signal charges sent to the final stage in the vertical direction in the horizontal direction, and are arranged on both sides of the vertical register 76 in the vertical direction.

  Next, the electrical configuration of the TDI sensor 70 will be described with reference to FIG. 5, reference numeral 81 is a controller, 83 is a timing generator, 85 is a clock driver, 87 is a multiplexer, 91 is an analog front end, and 93 is a data transmitter / control receiver.

  The controller 81 controls and controls the entirety of the light receiving camera 65, and a signal switching function for switching the output signal by giving a switching signal to the multiplexer 87, and switching the gain by giving a gain switching signal to the analog front end 91. It mainly has a gain switching function and an operation timing control function for determining the operation timing of the TDI sensor 70 by giving a control signal to the timing generator 83.

  The timing generator 83 generates various signals based on the control signal output from the controller 81, and supplies the generated signals to the transfer unit 75 via the clock driver 85.

  The generated signal includes a read signal T, three-phase drive signals V1 to V3 for performing a vertical transfer operation for shifting the signal charges of the register columns 76a to 76e by one step in the vertical direction, and the signal charges are shifted in the horizontal direction. There are roughly four types of reset signals R that reset the floating gate 79 that converts the two-phase drive signals H1 and H2 that execute the horizontal transfer operation and the signal charges into voltage signals.

  The output timing of each signal is as shown in FIG. 6 and is output with reference to an imaging trigger input from the image capturing device 50 side. Specifically, the read signal T is given from the clock driver 85 to the transfer unit 75 in accordance with the falling edge of the imaging trigger. As a result, the gate of each register RT is opened, and the signal charge is read from each light receiving element PD constituting the light receiving unit 71 to each corresponding register RT.

  In addition, three-phase drive signals V <b> 1 to V <b> 3 are supplied from the clock driver 85 to the transfer unit 75 in accordance with the falling edge of the imaging trigger. As a result, the read signal charges are shifted by one stage in the vertical direction in units of register columns 76a to 76e in the period (1) in FIG. 6 (vertical transfer operation, “column” described in claims) Example of “transfer to the next column in units”).

  The signal charge can be shifted to either the vertical direction A side or the vertical direction E side by adjusting the phase of the drive signals V1 to V3, and the three-phase drive signals V1 to V3 are excluded. For other control signals, that is, the read signal T, the drive signals H1, H2, and the reset signal R, depending on the transfer direction (A side, E side), the dedicated control signal, that is, the read signal T is Ta or Te, the drive signals H1, H2 are H1a, H2a or H1e, H2e, and the reset signal R is Ra, or Re, provided from the clock driver 85 to the transfer unit 75.

  At this time, the signal charge located in the last register row 76e in the vertical direction is transferred to the horizontal register 78E.

  Then, following the output of the three-phase drive signals V <b> 1 to V <b> 3, the two-phase drive signals H <b> 1 and H <b> 2 are given to the transfer unit 75 from the clock driver 85. As a result, the signal charge transferred onto the horizontal register 78E is shifted in the horizontal direction during period (2) in FIG.

  The floating gate 79 performs a process of converting the input signal charge into a voltage. The signal input to the voltage value at the floating gate 79 is input to the analog front end 91.

  The analog front end 91 is composed of CDS (correlated double sampling), VGA (variable gain amplifier), and ADC (AD converter), and removes noise from the input voltage signal and then amplifies it. The amplified voltage signal is converted into a digital signal and then sent to the data transmitter / control receiver 93.

  As described above, when an imaging trigger is input from the image capturing device 50 to the light receiving camera 65, the signal charges in the TDI sensor 70 in units of the register trains 76a to 76e in the period (1) in FIG. Is shifted one stage to the vertical direction E side, and then the signal charge for one line that has reached the horizontal register 78E by the transfer in the period (2) in FIG. 6 is horizontally transferred to the floating gate 79 and transferred. The converted signal charges are converted into voltage signals and taken out.

  In the TDI sensor 70 of the present embodiment, the signal charge is transferred in parallel with the transfer of the signal charge to the output side by sequentially adding the transferred signal charge to the signal charge of the transfer destination during the signal charge transfer. Charge integration is performed (time delay integration operation).

  Then, when the image of the electronic component 5 formed on the light receiving element PD moves by the same distance as the cell width W in the vertical direction (X direction) of the light receiving element PD, signal charges are transferred, The movement of the image of the component 5 and the transfer of the signal charge can be synchronized, so that the same part of the electronic component 5 moving above the light receiving camera 65 can be imaged continuously and imaged.

  Here, in order to transfer the signal charge when the image of the electronic component 5 formed on the light receiving element PD moves by the same distance as the cell width W in the vertical direction (X direction) of the light receiving element PD, The signal charge may be transferred when the electronic component 5 moves relative to the camera 65 by the same distance as the pixel scale WG.

  As shown in FIG. 7, the pixel scale WG (resolution on the TDI sensor side) is the length in the vertical direction (left-right direction in FIG. 7) at the imaging location SP on the electronic component 5 side corresponding to one light receiving element PD. It is determined by the following equation (1).

WG = W / M ... Formula (1)

W: cell width in the vertical direction V (X direction) of the light receiving element PD M: lateral magnification of the condenser lens 66

  Here, as shown in FIG. 8, if the pixel scale WG is equal to the encoder resolution WR described above, a signal charge transfer command may be output to the TDI sensor 70 in accordance with the output timing of the pulse signal Sp. If this is done, the signal charge can be transferred when the electronic component 5 moves by the same distance as the encoder resolution WR (= pixel scale WG).

  If the pixel scale WG and the encoder resolution WR do not match, when a signal charge transfer instruction is given to the TDI sensor 70 in accordance with the output timing of the pulse signal Sp, only the difference between the pixel scale WG and the encoder resolution WR is obtained. The signal charge is transferred when the amount of movement of the light receiving camera 65 relative to the electronic component 5 is smaller (or larger) than the encoder resolution WR.

  Therefore, in the present embodiment, the transfer instruction is not output simultaneously with the output timing of the pulse signal Sp, but only the target count value Epm (described later) determined by the resolution ratio Sr (described later) from the output time of the pulse signal Sp. By outputting a signal charge transfer command at the time of counting, the signal charge can be transferred when the electronic component 5 moves by the same distance as the encoder resolution WR (= pixel scale WG).

  Since the image of the electronic component 5 is formed on the light receiving element PD side through the condenser lens 66, in order to synchronize the movement of the image of the electronic component 5 and the transfer of the signal charge, the signal charge is converted into the electronic component 5 It is necessary to transfer to the opposite side (vertical direction E side) of the moving direction (vertical direction A side). Further, in FIG. 8, for easy understanding, the size of the electronic component 5 is shown smaller than WR, and the signal charge transfer direction and the electronic component moving direction are shown in the same direction.

(3) Resolution ratio Sr
In the present embodiment, the ratio between the pixel scale WG and the encoder resolution WR (hereinafter, resolution ratio Sr) is calculated in advance using the following equation (2), and is stored in the register B1 of the transfer command circuit 160 described next. Yes.

Sr = WG / WR (2) formula

  In the following description, for example, the encoder resolution WR = 1 μm, the pixel scale WG = 0.8 μm, and the resolution ratio Sr = 0.8 will be described.

(4) Configuration of Transfer Command Circuit The transfer command circuit 160 shown in FIG. 9 includes three registers B1, B3, B7, a correction value determination unit B2, an encoder counter B4, a clock counter B5, an oscillation circuit B6, a multiplier B8, The four comparators B9 to B12 are configured by, for example, an FPGA (Field Programmable Gate Array).

  The transfer command circuit 160 has a function of processing the pulse signal Sp input from the linear encoder 55 and the clock signal CL having a constant frequency output from the oscillation circuit B6, and outputting the imaging command TS.

  The register B1 stores the resolution ratio Sr described above. The correction value determination unit B2 determines the parameter Sra from the following equation (3).

Sra = Srd + Sr (3) Equation Srd: Count correction value Sr: Resolution ratio

  The integer part of the parameter Sra is output and stored in the register B3 as the integer part parameter Sri. Further, the decimal part of the parameter Sra is output and stored in the register B7 as the count correction value Srd.

  The encoder counter B4 has a function of counting the pulse signal Sp output from the linear encoder 55 and outputting the count result to the comparators B10 and B11 as an encoder count value Ec.

  The clock counter B5 performs a counting operation of the clock signal CL output from the oscillation circuit B6, and has a function of outputting the count result to the multiplier B8 as the count value Ep and to the comparator B9 as the count value Pc. Note that the count value Ep indicates the count number counted during one cycle of the pulse signal Sp output from the linear encoder 55, and the count value Pc indicates the count number of the clock counter B5.

  The multiplier B8 multiplies the count value Ep by the count correction value Srd of the register B7, and outputs the calculation result to the comparator B9 as the target count value Epm. In the present embodiment, the multiplier B8 is an example of the “multiplier” described in the claims, and constitutes the “setting means” described in the claims together with the correction value determination unit B2. .

  The comparator B9 compares the target count value Epm with the count number Pc, and outputs a signal P9 to the comparator B12 when the condition of Pc> = Epm is satisfied. The comparator B10 compares the integer part parameter Sri and the encoder count value Ec. When the condition of Ec = Sri is satisfied, the comparator B10 outputs a signal P10 to the comparator B12. The comparator B11 compares the integer part parameter Sri with the encoder count value Ec, and outputs a signal P11 to the comparator B12 when the condition of Ec> Sri is satisfied.

The comparator B12 compares the input signals P10, P11, and P12, and when one of the following conditions (1) and (2) is satisfied, the imaging command TS (transfer command) is captured. It has a function of outputting to the device 50 (an example of a transfer command means).
Condition (1) Both the signal P9 and the signal P10 are “H”.
Condition (2) The signal P11 is “H”.

  The MPU 35 is configured to output the value of the resolution ratio Sr calculated in advance to the register B1. Further, the MPU 35 has a function of outputting the initial value of the integer part parameter Sri to the register B3 and outputting the initial value of the count correction value Srd to the register B7 via the correction value determining unit B2. The MPU 35 has a function of resetting the count numbers of the encoder counter B4 and the clock counter B5.

(5) Operation of Transfer Command Circuit The imaging command output from the transfer command circuit 160 will be described with reference to FIGS. In the register B1, the numerical value “0.8” is stored in advance as the resolution ratio Sr described above, and the initial value of the integer part parameter Sri stored in the register B3 is “1” and stored in the register B7. The initial value of the count correction value Srd is “0”, and the count values of the encoder counter B4 and the clock counter B5 are cleared in the initial state (Ec = 0, Pc = 0). It is assumed that the initial value of the target count value Epm output from the multiplier B8 is set to “0”.

(5-1) First Imaging Command Now, when the MPU 35 gives a drive command to the linear drive control unit 37, the linear motor 51 is driven and the light receiving camera 65 starts moving with respect to the electronic component 5 (FIG. 10). Time t0). The MPU 35 gives a drive command to the linear drive control unit 37, and simultaneously gives a start command to the registers B1, B3, B7, the correction value determining unit B2, the encoder counter B4, and the clock counter B5 that constitute the transfer command circuit 160. .

  The registers B1, B3, B7, the correction value determining unit B2, the encoder counter B4, and the clock counter B5 that have received the start command are started. Thereby, simultaneously with the start of the movement of the light receiving camera 65, the clock counter B5 starts to count the clock signal CL of the oscillation circuit B6. The count value counted by the clock counter B5 is input to the comparator B9 every time one is counted (count value Pc).

  The comparator B9 is satisfied when the target count value Epm set by the multiplier B8 is equal to the count value Pc counted by the clock counter B5, and the level of the output signal P9 becomes H level. . Since the target count value Epm is set to “0” for the first time, the comparator B9 outputs an H level immediately after the light receiving camera 65 starts moving.

  On the other hand, in the comparator B10, processing for comparing the integer part parameter Sri stored in the register B3 with the count value Ec of the encoder counter B4 is performed. Since the initial value of Sri is “1”, the count value of the encoder counter B4 is “0” until the pulse signal Sp is output from the linear encoder, so the output of the comparator B10 is L Become a level. From the above, immediately after the movement of the light receiving camera 65, the comparator B12 is in a state where the above condition (1) is not satisfied.

  When the light receiving camera 65 moves by 1 μm (the same distance as the encoder resolution WR), the first pulse signal Sp1 is output from the linear encoder 55 (time t1). The output pulse signal Sp is input to the MPU 35, encoder counter B4, and clock counter B5, respectively.

  The encoder counter B4 counts the input pulse signal Sp (Ec = 0 + 1 = 1). Then, the comparator B10 has an input of Ec = 1, and the output P10 of the comparator B10 becomes H.

  As a result, the condition (1) for the comparator B12 is satisfied, and the first imaging command TS1 is output from the comparator B12. Thereby, an imaging trigger is output from the image capturing device 50 to the light receiving camera 65. When the imaging trigger is output, signal charges are transferred (vertical transfer operation) as described above.

  The comparator B12 outputs a signal to the correction value determination unit B2 and the encoder counter B4 simultaneously with the output of the first imaging command TS1. As a result, the encoder counter B4 is reset (Ec = 0).

  On the other hand, in the correction value determination unit B2, the calculation of the above-described equation (3) is executed. Here, since Srd is “0”, Sra is “0.8” as a result of the calculation. When the calculation is executed, the integer part parameter Sri = 0 determined from the calculated Srd is stored in the register B3, and the count correction value Srd = 0.8 is stored in the register B7.

  Then, the multiplier B8 multiplies “0.8”, which is the count correction value Srd stored in the register B7, by the count value Ep input through the clock counter B5 to calculate the next target count value Epm. . In the example of FIG. 11, since the count value Ep of the clock counter B5 between S0 and Sp1 (corresponding to the output cycle unit of the pulse signal Sp output from the encoder during relative movement) is 500 counts, the next target count value Epm is 400 (0.8 × 500).

  After calculating the target count Epm, the MPU 35 outputs a counter reset signal to the clock counter B5, and the count value is reset (Ep = Pc = 0).

(5-2) Second Shooting Even after the first shooting is performed, the light receiving camera 65 continues to move with respect to the electronic component 5, and the reset clock counter B5 starts counting again from zero. The count value Pc counted by the clock counter B5 is input to the comparator B9 every time one is counted.

  Immediately after the first shooting, the count value Pc is 400 or less, and the condition of Pc> = Epm is not satisfied. For this reason, the level of the output signal P9 of the comparator B9 becomes L level.

  On the other hand, in the comparator B10, immediately after the end of the first shooting, Sri is “0”, and the count value Ec of the encoder counter B4 is “0”. Therefore, the output of the comparator B10 becomes H level.

  When the count value Pc is counted and becomes equal to the target count value Epm (= 400), the condition of the comparator B9 is satisfied, and the level of the output signal P9 becomes H level.

  From the above, the condition (1) of the comparator B12 described above is satisfied after 400 counts (time t2) after the first imaging command TS1 is output, and the second imaging command TS2 is compared. The signal charge is transferred from the device B12 and transferred.

  Here, only 500 counts obtained by multiplying 500 counts counted while the light receiving camera 65 moves by 1 μm (that is, the relative movement amount of the electronic component 5 with respect to the light receiving camera 65) is 400 counts. At the time of counting, an imaging command is output.

  In this way, an imaging command can be output when the electronic component 5 moves relative to the light receiving camera 65 by 0.8 μm, which is equal to the pixel scale WG. In other words, the signal charge can be transferred when the image of the electronic component 5 formed on the light receiving element PD moves by the same distance as the cell width W of the light receiving element PD, and the movement of the image of the electronic component 5 and the signal charge can be transferred. Can synchronize with the transfer. At this time (time t2), the second pulse signal Sp2 has not been output yet.

(5-3) Processing after the second imaging to the output of the second pulse signal Sp2 Simultaneously with the output of the second imaging command TS2, the comparator B12 is the same as when the first imaging command TS1 is output. Signals are output to the correction value determination unit B2 and the encoder counter B4, respectively. As a result, the encoder counter B4 is reset (Ec = 0).

  On the other hand, in the correction value determination unit B2, the calculation of the above-described equation (3) is executed. Here, since Srd is 0.8, Sra is 1.6 (= 0.8 + 0.8) as a result of the calculation. When the calculation is executed, next, the integer part parameter Sri = 1 determined from the calculated Sra is stored in the register B3, and the count correction value Srd = 0.6 is stored in the register B7.

  Even after the second imaging command TS2 is output, the clock counter B5 continues counting, and the counter value Pc further increases from 400. For this reason, the condition of the comparator B9 is established, and the output signal P9 is maintained at the H level.

  While the output signal P9 is maintained at the H level, in the comparator B10, Sri is “1”, the count value Ec of the encoder counter B4 is “0”, and the output of the comparator B10 is L Become a level.

  From the above, the comparator B12 is in a state in which the above condition (1) is not satisfied between the second imaging and the second pulse signal Sp2 output (between times t2 and t3).

(5-4) Output of Second Pulse Signal Sp2 to Third Imaging Command The light receiving camera 65 continues to move with respect to the electronic component 5, and is 1 μm (encoder resolution WR from the position when the first pulse signal Sp1 is output. The linear encoder 55 outputs the second pulse signal Sp2. Then, the multiplier B8 multiplies the count correction value “0.6” stored in the register B7 by “0.6” and the count value Ep input through the clock counter B5 to calculate the next target count value Epm. .

  In the example of FIG. 10, since the count value Ep of the clock counter B5 between Sp1 and Sp2 is 550 counts, the next target count Epm is 330 (0.6 × 550).

  When the target count Epm is calculated, the MPU 35 outputs a counter reset signal to the clock counter B5, and the count value is reset (Ep = Pc = 0).

  The reset clock counter B5 starts counting again from zero. The count value Pc counted by the clock counter B5 is input to the comparator B9 every time one is counted.

  Immediately after the second pulse signal Sp2 is output, the count value Pc is 330 or less, and the condition of Pc> = Epm is not satisfied. For this reason, the level of the output signal P9 of the comparator B9 becomes L level.

  On the other hand, the input pulse signal Sp is counted in the encoder counter B4 (Ec = 0 + 1 = 1). Then, Ec = 1 is input to the comparator B10. Therefore, when Sri is “1”, the count value Ec of the encoder counter B4 is “1”, so that the output of the comparator B10 is at the H level.

  When the count value Pc is counted and becomes equal to the target count value Epm (= 330), the condition of the comparator B9 is satisfied, and the output signal P9 becomes H level.

  From the above, the condition (1) of the comparator B12 described above is satisfied after 330 counts (time t4) after the second pulse signal Sp2 is output, and the third imaging command TS3 is compared. The signal charge is transferred from the device B12 and transferred.

  Here, when the light receiving camera 65 counts by 330 counts obtained by multiplying the count correction value Srd by 550 counts required for the light receiving camera 65 to move by 1 μm (that is, the relative movement amount of the electronic component 5 with respect to the light receiving camera 65), the imaging is performed. Command TS3 is output.

  The count correction value Srd at this time is set to 0.6, which is reduced by 0.8 to 0.2 (difference between the encoder resolution WR and the pixel scale WG). By doing so, the relative movement amount between the electronic component and the light receiving camera between the times t3 and t4 is 0.6 μm. Further, the relative movement amount between the electronic component and the light receiving camera between time t2 and t3 is 0.2 μm because it is 1 μm-0.8 μm.

  From the above, with respect to the position of the electronic component 5 and the light receiving camera 65 when the second imaging command TS2 is output (time t2), the electronic component 5 is equal to the pixel scale WG with respect to the light receiving camera 65. The imaging command TS3 can be output when the relative movement is performed by 8 μm (0.2 + 0.6). In other words, the signal charge can be transferred when the image of the electronic component 5 formed on the light receiving element PD moves by the same distance as the cell width W of the light receiving element PD, and the movement of the image of the electronic component 5 and the signal charge can be transferred. Can synchronize with the transfer.

(5-5) Fourth and subsequent imaging As with the above, the fourth and subsequent imaging commands TS are also output from the output of the pulse signal Sp on condition that the target count value Epm is counted. For example, in the fourth imaging command TS4, when the count value Ep is 480 between the times t3 and t5, the count correction value Srd = 0.4 (subtracted by 0.2 from the previous count correction value 0.6). Value), the target count Epm = 480 × 0.4 = 192. For this reason, after the pulse signal Sp3 is output (time t5), at the time point 192 counted (time t6), the imaging command TS4 is output and the signal charge is transferred.

  As described above, the light receiving camera 65 is moved with respect to the electronic component 5 to perform imaging and signal charge transfer. When the imaging command is output a number of times corresponding to the number of vertical stages of the light receiving element PD, The processing of the transfer command circuit 160 ends.

  In the above example, the condition (Ec> Sri) of the comparator B11 is not satisfied, and P11 is always at the L level. The condition of the comparator B11 is satisfied, for example, when the moving speed of the light receiving camera 65 suddenly increases and the next pulse signal (for example, Spe in FIG. 10) is output before the target count value Epm is counted. This is the case.

  In this case, when the pulse signal Spe is output, the imaging command TS is output (Ec = 2, Sri = 1, the condition for the comparator B11 is satisfied, and the condition (2) for the comparator B12 is satisfied). As described above, when the moving speed of the light receiving camera 65 suddenly increases, an imaging command is output at a timing earlier than counting the target count value Epm, and the movement of the image of the electronic component 5 and the transfer of the signal charge are performed. The synchronization deviation is reduced.

(6) Summary and Effects In this embodiment, after the pulse signal Sp is output, the imaging command is output at a timing counted by the target count value Epm. In this embodiment, when setting the target count value Epm for the second and subsequent times, the value of Srd is 0.2 (the difference between the encoder resolution WR and the pixel scale WG) every time the number of times of imaging (number of transfers) is increased. The size is reduced in increments (corresponding to “based on the resolution ratio and the number of transfer times of the signal charge” described in the claims).

  For this reason, in this embodiment, the signal charge can be transferred when the electronic component 5 moves by the same distance as the pixel scale WG regardless of the difference between the encoder resolution WR and the pixel scale WG. In other words, the signal charge can be transferred when the image of the electronic component 5 formed on the light receiving element PD moves by the cell width W of the light receiving element PD. Thereby, signal charges corresponding to the same part of the electronic component 5 are accumulated in each light receiving element PD.

  From the above, the TDI sensor 70 outputs a signal (image data) obtained by integrating signal charges corresponding to the same part of the electronic component 5 to the image capturing device 50. As a result, an image in which the outline of the electronic component 5 is clearly captured (without blurring) can be obtained, and the suction posture of the electronic component 5 can be more reliably recognized.

  The encoder resolution WR is a value specific to the linear encoder 55, and the pixel scale WG is a value specific to the light receiving camera 65. For this reason, normally, in order to prevent the difference between the encoder resolution WR and the pixel scale WG (WR = WG), the light receiving camera 65 having the pixel scale WG that matches the encoder resolution WR is selected, or the pixel It was necessary to select one of the linear encoders 55 having an encoder resolution WR that matches the scale WG.

  In this regard, in the present embodiment, it is not necessary to match the encoder resolution WR and the pixel scale WG. For this reason, it is not necessary to use an expensive linear encoder 55 with high resolution in accordance with the pixel scale WG of the light receiving camera 65, which is economical.

  In the present embodiment, in calculating the target count value Epm, the multiplication target of the count correction value Srd is set to the count number of the immediately preceding output cycle. Therefore, the target count value Epm is determined corresponding to the count number of the immediately preceding output cycle, that is, the moving speed of the light receiving camera of the immediately preceding output cycle. For this reason, even if the moving speed of the light receiving camera 65 changes due to, for example, cogging of the linear motor 51, it is possible to output the imaging command TS in response to the speed change.

  Further, in the present embodiment, the imaging command TS is output in response to the speed change of the light receiving camera 65, so that imaging can be performed even when the speed is not constant. For this reason, imaging can be started before the light receiving camera 65 reaches a constant speed. Thereby, the acceleration area for accelerating the light receiving camera 65 can be shortened. Further, when the light receiving camera 65 is stopped after the imaging is completed, if the light receiving camera 65 is decelerated during the imaging, the deceleration section for the stop can be shortened. For this reason, the moving range of the light receiving camera 65 on the head unit 20 can be set small, and as a result, the head unit 20 can be made compact. In addition, since it is not necessary to rapidly accelerate the light receiving camera 65 to a certain speed before the light receiving camera 65 reaches below the electronic component 5, the light linear motor 51 having a relatively small output can be used. Weight reduction can be achieved. From the above, the head unit 20 can be made compact and lightweight, and a configuration suitable for high-speed operation can be achieved.

(7) Configuration of Surface Mounter As shown in FIG. 11, the surface mounter 100 has various devices arranged on a base 110 having a flat upper surface. In the center of the base 110, a transport conveyor 120 for transporting the printed wiring board is disposed. The transport conveyor 120 includes a pair of transport belts 121 that circulate and drive in the X direction. When the substrate PK is set so that both the belts 121 are laid, the substrate PK on the upper surface of the belt is caused by friction with the transport belt 121. Is sent in the driving direction.

  In the present embodiment, the right side shown in FIG. 11 is the entrance, and the substrate PK is carried into the apparatus through the transfer conveyor 120 from the right side. The board | substrate PK carried in is conveyed to the mounting position G (position shown with the dashed-two dotted line in FIG. 11) by the conveyance conveyor 120, and is stopped there.

  In addition, the component supply unit 125 is provided at two places in the upper and lower positions in FIG. 11 of the mounting position G, and a tape feeder 128 as a component supply device is installed in alignment in the X direction. Each tape feeder 128 includes a reel (not shown) around which a component supply tape is wound, an electric delivery device (not shown) that pulls out the component supply tape from the reel, and the like.

  Each tape feeder 128 holds a reel (not shown) around which a component supply tape (not shown) containing small chip electronic components such as an integrated circuit (IC), a transistor, a resistor, and a capacitor is wound. The components are supplied to the component extraction position 6 in the vicinity of the conveyer 120 while the component supply tape is pulled out from the reel by an electric delivery device (not shown). The supplied electronic component 5 is sucked and held by the suction nozzle 26 of the component mounting device 130 and mounted on the substrate PK stopped on the mounting position G.

  The component mounting apparatus 130 is roughly composed of an X-axis servo mechanism, a Y-axis servo mechanism, a Z-axis servo mechanism, and a mounting head 25 that is moved and operated in the X-axis, Y-axis, and Z-axis directions by driving these servo mechanisms. The

  Specifically, as shown in FIGS. 1 and 11, a pair of support legs 141 are installed on the base 110. Both support legs 141 are located on both sides of the mounting position G, and both extend straight in the Y direction (vertical direction in FIG. 11).

  Both support legs 141 are provided with guide rails 142 extending in the Y direction on the upper surface of the support legs 141, and head supports 151 are attached to the left and right guide rails 142 while fitting both ends in the longitudinal direction. .

  In FIG. 11, a Y-axis ball screw shaft 145 extending in the Y direction is attached to the right support leg 141, and a ball nut 148 is screwed to the Y-axis ball screw shaft 145. A Y-axis motor 147 (rotary servomotor) is provided at the shaft end of the Y-axis ball screw shaft 145 with an output shaft (not shown) splined.

  When the Y-axis motor 147 is energized, the ball nut 148 advances and retreats along the Y-axis ball screw shaft 145. As a result, the head support 151 fixed to the ball nut 148, and thus the head unit 20 described below, moves to the guide rail 142. Along the Y direction (Y-axis servo mechanism).

  As shown in FIG. 11, a guide member 153 extending in the X direction is installed on the head support 151, and the head unit 20 is attached to the guide member 153 so as to be movable along the axis of the guide member 153. ing. An X-axis ball screw shaft 10 extending in the X direction is attached to the head support 151, and a ball nut 14 is screwed onto the X-axis ball screw shaft 10 (FIG. 1).

  An X-axis motor 12 (rotary servo motor) in which an output shaft (not shown) is splined to the shaft end of the X-axis ball screw shaft 10 is provided. When driven, the ball nut 14 advances and retreats along the X-axis ball screw shaft 10, and as a result, the head unit 20 fixed to the ball nut 14 moves in the X direction along the guide member 153 (X-axis servo mechanism). The X-axis motor 12 is provided with an X-axis encoder 15 that outputs a pulse signal corresponding to the rotation amount of the X-axis motor. By counting pulse signals from the X-axis encoder 15, the position of the head unit 20 in the X direction can be detected.

  Accordingly, the head unit 20 can be moved and operated in the horizontal direction (XY direction) on the base 110 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination. The X-axis servo mechanism and the Y-axis servo mechanism are examples of the “head driving device” recited in the claims.

  Each of the suction nozzles 26 described above can rotate around the axis by driving an R-axis motor (not shown), and can move up and down with respect to the frame 21 of the head unit 20 by driving a Z-axis motor. (Z-axis servo mechanism).

  Further, on the side surface in the X direction in the frame 21 (left side in FIG. 11), a substrate recognition camera 73 composed of a CCD area sensor camera or the like equipped with illumination with the imaging surface facing downward is fixed. These board recognition cameras 73 can take pictures of the position reference marks and board ID marks of the board PK, and can also pick up the component extraction positions 6 of the component supply unit 125 and the like.

(8) Operation of Surface Mounter Next, a series of component mounting operations by the surface mounter 100 will be described. First, the conveyance conveyor 120 is driven, the substrate PK to be mounted is conveyed to the mounting position G, and stopped and positioned at that position. Next, the X-axis servo mechanism and the Y-axis servo mechanism described above are operated to horizontally move the mounting head 25 (suction nozzle 26) of the head unit 20 to above the tape feeder 128, and further drive the Z-axis servo mechanism. The suction nozzle 26 is lowered.

  The electronic component 5 supplied by the tape feeder 128 can be sucked and held by the suction nozzle 26 by supplying negative pressure from a negative pressure means (not shown) at the timing when the tip of the suction nozzle 26 reaches the upper surface of the electronic component 5. .

  Then, following the suction operation, the electronic component 5 can be taken out from the tape feeder 128 by driving the Z-axis servo mechanism and raising the suction nozzle 26 this time.

  Thus, when the electronic component 5 is taken out, the X-axis servo mechanism and the Y-axis servo mechanism are then driven again. As a result, the head unit 20 above the tape feeder 128 starts to move toward the mounting position G at the center of the base.

  By driving the linear motor 51 while the head unit 20 is moving, the camera unit 60 starts accelerating from the standby position on the left side of the head unit 20 in FIG. Is crossed at a substantially constant speed in the X direction, and each electronic component 5 is imaged by the light receiving camera 65 in accordance with the passage timing. Then, each image data output from the light receiving camera 65 is sent to the image capturing device 50, where image processing is performed, and a lower surface image of each electronic component 5 is generated. The standby position of the camera unit 60 may be on either the left or right side of the head unit 20 in FIG. 1 or may be provided on both sides of the head unit 20.

  Thereafter, the process of inspecting the suction position deviation of each electronic component 5 proceeds in parallel with the operation of moving the electronic component 5 to the mounting position G. That is, the data of the lower surface image is output to the control device 30, and the presence / absence of the suction position deviation of each electronic component 5 is inspected based on the output lower surface image data. Then, when there is a deviation in the suction position, the control device 30 performs a process of correcting the suction position deviation of the electronic component 5 for each mounting head 25 (such as driving the R-axis motor to rotate the suction nozzle 26).

  When the electronic component 5 reaches a target component mounting position (a position on the substrate PK stopped at the mounting position G), the Z-axis servo mechanism is driven, and the suction nozzle 26 is lowered at that position. Along with this lowering, each electronic component 5 after posture correction is mounted at a component mounting position on the board PK that stops on the mounting position G.

  By repeating the above processing, the mounting operation of the electronic component 5 on the board PK is advanced. When the mounting operation is completed for all the electronic components 5, the transport conveyor 120 is driven again. Thereby, the board PK on which the electronic component 5 has been mounted is sent in the left direction in FIG. 11 and carried out of the apparatus.

  From the above, in the surface mounter 100, it is possible to obtain clearer image data of the lower surface of the electronic component 5 by the component recognition device U, and more reliably inspect the suction position deviation of each electronic component 5. Can do. As a result, a more precise electronic component mounting operation is possible.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted, and only different points will be described.

  In the first embodiment, the configuration in which the camera unit 60 is installed so as to be relatively movable with respect to the head unit 20 via the linear motor 51 is exemplified. On the other hand, in the component recognition apparatus U1 in the surface mounter 200 of the present embodiment, the camera unit 210 is fixedly installed on the base 110, and the X-axis motor 12 for driving the head unit 20 is driven. Thus, the electronic component 5 is moved with respect to the camera unit 210.

  As shown in FIG. 12, a pair of camera units 210 are installed at the center in the X direction on the base 110 and on both sides in the Y direction of the transport conveyor 120. As shown in FIG. 13, the camera unit 210 is a unit in which the light receiving camera 65 and a plurality of LEDs 212 </ b> A and 212 </ b> B are accommodated in a single casing 211.

  Each LED 212A is installed in the upper part of the casing 211 in a state where the outgoing optical axis for emitting the illumination light is inclined obliquely, and illuminates the electronic component 5 from the oblique lower side. Each LED 212B is installed at the upper part of the casing 211 so that the outgoing optical axis for emitting illumination light is in the horizontal direction, and illuminates the electronic component 5 from the side.

  As shown in FIG. 14, the X-axis encoder 15 is electrically connected to the MPU 35 and the transfer command circuit 160 of the control device 30, and the pulse signal Sp from the X-axis encoder 15 is transferred to the MPU 35 and the transfer of the control device 30. Each is input to the command circuit 160.

  Further, the MPU 35 is electrically connected to the X-axis motor 12 via the motor drive control unit 213, and the motor drive command from the MPU 35 is output to the motor drive control unit 213, so that the X-axis motor 12 is It is configured to rotate.

  In the present embodiment, the electronic component 5 sucked and held by the suction nozzle 26 is moved in the X direction by rotating the X-axis motor 12. Then, at the timing when the moving electronic component 5 passes through the imaging area above the camera unit 210, the light receiving camera 65 images the electronic component 5 from below. In the present embodiment, the X-axis motor 12 is an example of a “moving device” recited in the claims.

  At the time of imaging, the transfer command circuit 160 uses the pulse signal Sp input from the X-axis encoder 15 (which can detect the amount of movement of the head unit 20 and thus the amount of movement of the electronic component 5 with respect to the light receiving camera 65) in the embodiment. 1 is performed, and an imaging command TS is output to the image capturing device 50. Each image data output from the light receiving camera 65 is sent to the image capturing device 50, where image processing is performed to generate a lower surface image of the electronic component 5. As a result, the holding posture of the electronic component 5 can be recognized as an image.

  In the present embodiment, since the imaging command TS is output in response to the speed change, the electronic component 5 can be imaged even when the speed of the head unit 20 is not completely constant. For this reason, it becomes possible to image the electronic component 5 before the head unit 20 reaches a predetermined speed, and the acceleration section for accelerating the head unit 20 can be shortened. Moreover, since the head unit 20 can be decelerated before the imaging of the electronic component 5 is completed, the deceleration interval of the head unit after the imaging is completed can be set short. For this reason, after the electronic component 5 is sucked and held, the moving distance of the head unit 20 while the electronic component 5 is imaged and mounted at a predetermined position can be shortened, and the mounting efficiency can be increased.

<Other embodiments>
The present invention is not limited to the above-described embodiments, and for example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the above embodiment, the count value Ep counted in the output cycle immediately before the pulse signal Sp is exemplified as the number of signals to be multiplied by the count correction value Srd. However, the present invention is not limited to this. The number of signals to be multiplied by the count correction value Srd may be, for example, the count value Ep counted during the output period two cycles before the pulse signal Sp. In the example of FIG. 10, in order to calculate the target count value Epm at times t3 to t4, a count value Ep (500) between times t0 and t1 that is two cycles before times t3 to t4 may be used. The count value Ep may be a preset constant.

  (2) In the above embodiment, the process of outputting the imaging command TS when the target count value Epm is counted after the pulse signal Sp is output is exemplified, but the present invention is not limited to this. For example, when the target count value Epm is determined by using the number of signals counted in the output period two cycles before the pulse signal Sp, the time when the target count value Epm is counted after the imaging command TS is output Thus, the imaging command TS may be output. In this case, the count correction value Srd may always be the same value as the resolution ratio regardless of the number of signal charge transfers.

  (3) In the second embodiment, the example in which the camera unit 210 is installed on the base 110 has been described. However, the installation location of the camera unit 210 is not limited to the base 110, and the electronic component 5 can be imaged. If there is, it may be a place other than the base 110.

  (4) In the above embodiment, the encoder-side resolution is exemplified as the encoder resolution WR of the linear encoder 55 and the TDI sensor-side resolution as the pixel scale WG. However, the present invention is not limited to this. For example, the resolution on the encoder side may be a value obtained by multiplying the encoder resolution WR by the lateral magnification M of the condenser lens 66, and the resolution on the TDI sensor side may be the cell width W in the vertical direction V of the light receiving element PD.

(5) The surface mounter may be provided with both the component recognition device U provided in the head unit 20 of the first embodiment and the camera unit 210 provided on the base 110 of the second embodiment. In this case, the light receiving camera of the camera unit 210 provided on the base 110 on the fixed side uses a camera with a large imaging area, and the light receiving camera of the component recognition device U provided on the head unit 20 on the moving side is a camera. It is better to use a small and light camera with a smaller imaging area than the light receiving camera of unit 210. Then, in correspondence with the size of the imaging area of both cameras, the camera unit 210 is mounted with a relatively small number, the large-sized electronic component 5 is imaged, and the component recognition apparatus U has a relatively large number of mounted. What is necessary is just to image the electronic component 5 of small size. In this way, since the camera on the head unit side can be reduced in size, high-speed operation of the head unit 20 can be easily achieved.
Further, the camera unit 210 may have a coplanarity inspection function for measuring the lead floating and bump height of the electronic component 5.

The figure which shows the relationship between the component recognition device and the head unit Diagram showing the component recognition device Block diagram showing the electrical configuration of the component recognition device The figure which showed the composition of the TDI sensor typically Block diagram showing electrical configuration of TDI sensor Timing chart showing the output timing of each signal The figure which shows the relationship between the pixel scale WG and the cell width W of a light receiving element. The figure which shows the relationship between the movement of the electronic component and the transfer of the signal charge Diagram showing the configuration of the transfer command circuit Timing chart showing processing of transfer command circuit Plan view of surface mounter Plan view of surface mounter in embodiment 2. The figure which shows the structure of the camera unit in Embodiment 2. FIG. The block diagram which shows the electric constitution of the components recognition apparatus in Embodiment 2. FIG.

5... Electronic component 10... X-axis ball screw shaft (in this embodiment, an example of “head driving device” described in claims)
12. X-axis motor (in this embodiment, an example of a “head drive device” described in the claims)
14, 148... Ball nut (in this embodiment, an example of a “head drive device” described in the claims)
15 ... X-axis encoder (in this embodiment, an example of "encoder" described in claims)
20... Head unit 26... Suction nozzle 51... Linear motor (in this embodiment, an example of the “moving device” described in the claims)
55... Linear encoder (in the present embodiment, an example of an “encoder” recited in the claims)
65. Light receiving camera (in this embodiment, an example of “camera” described in claims)
66 ... Condensing lens 70 ... TDI sensor 71 ... Light receiving unit 75 ... Transfer unit 100, 200 ... Surface mounter 110 ... Base 120 ... Conveying conveyor (corresponding to "substrate conveying apparatus" of the present invention)
128 ... Tape feeder (corresponding to "component supply device" of the present invention)
145... Y-axis ball screw shaft (in this embodiment, an example of a “head driving device” recited in the claims)
147... Y-axis motor (in this embodiment, an example of the “head drive device” described in the claims)
B2... Correction value determination unit (in the present embodiment, an example of “setting means” described in the claims)
B5 ... Clock counter B6 ... Oscillator circuit B8 ... Multiplier (In this embodiment, an example of "multiplier and setting means" described in claims)
B12... Comparator (in this embodiment, an example of “transfer command means” described in claims)
CL: Clock signal Ep: Count value (in this embodiment, an example of “number of clock signal signals” recited in the claims)
Epm ... Target count value PD ... Light receiving element PK ... Substrate Sp ... Pulse signal Sr ... Resolution ratio Srd ... Count correction value WG ... Pixel scale (in this embodiment, the "TDI sensor side resolution" described in the claims) One case)
WR: Encoder resolution (in this embodiment, an example of “encoder-side resolution” described in claims)
U, U1 ... Component recognition device

Claims (5)

A camera comprising a condenser lens and an image sensor;
A moving device for relatively moving the electronic component sucked and held by the suction nozzle and the camera;
An encoder that outputs a pulse signal corresponding to the amount of movement of the relative movement, and photographing the electronic component with the camera while relatively moving the electronic component and the camera with the moving device, A component recognition device for recognizing the suction posture of the electronic component based on an obtained image,
A two-dimensional light receiving unit formed by arranging a plurality of pixel rows in which light receiving elements are arranged in a row, and a two-dimensional light source that sequentially transfers signal charges accumulated in the light receiving elements of each pixel column to the next column. A TDI sensor which is the image sensor comprising a transfer unit;
An oscillation circuit that outputs a clock signal;
When the ratio of the resolution on the TDI sensor side and the resolution on the encoder side is defined as a resolution ratio,
Number of signals of the clock signal output between the resolution ratio and an output cycle N cycles before the pulse signal output from the encoder (N is a predetermined fixed value and an integer of 1 or more) And setting means for setting a target count value based on
A clock counter for performing a counting operation for counting the clock signal;
A component recognition apparatus comprising: transfer command means for outputting a next transfer command to the TDI sensor on the condition that the clock counter counts the clock signal to the target count value. The component recognition apparatus according to claim 1,
The clock counter performs the counting operation in units of an output cycle of a pulse signal output from the encoder during relative movement for the photographing,
The setting means includes a correction value determining unit that determines a count correction value based on the resolution ratio and the number of signal charges transferred.
A component recognition apparatus, comprising: a multiplication unit that determines the target count value by multiplying the count correction value by the number of signals counted by the clock counter in the output period. The component recognition apparatus according to claim 2,
The number of signals to be multiplied by the count correction value is the number of signals counted in the output cycle immediately before the pulse signal. The base,
A board transfer device for carrying a board to be mounted on the base;
A component supply device that is provided on the base and supplies electronic components;
A suction nozzle having a function of holding the electronic component by suction and performing a mounting operation for mounting the electronic component supplied through the component supply device on the substrate;
A head unit provided with the suction nozzle;
A head driving device for horizontally moving the head unit on the base;
A component recognition device according to any one of claims 1 to 3,
The surface mounter according to claim 1, wherein the camera constituting a part of the component recognition device is installed so as to be relatively movable with respect to the head unit via the moving device. The base,
A board transfer device for carrying a board to be mounted on the base;
A component supply device that is provided on the base and supplies electronic components;
A suction nozzle having a function of holding the electronic component by suction and performing a mounting operation for mounting the electronic component supplied through the component supply device on the substrate;
A head unit provided with the suction nozzle;
A head driving device for horizontally moving the head unit on the base;
A component recognition device according to any one of claims 1 to 3,
The camera constituting a part of the component recognition device is fixedly installed with respect to the base,
The surface mounting machine, wherein the moving device is the head driving device.

Images