JP5562192B2 - Information processing apparatus, abnormal temperature detection method, and program - Google Patents

Description

  The present invention relates to an information processing apparatus, an abnormal temperature detection method, and a program for detecting an abnormal temperature in a predetermined region on a printed circuit board.

  An information processing apparatus such as a PC (Personal Computer) incorporates a printed circuit board on which various electronic components are mounted. These electronic components include electronic components that generate a predetermined amount of heat during operation (hereinafter referred to as high heat generating components). Is included). If this high heat-generating component reaches a high temperature in accordance with the operating status of the information processing device (increasing power consumption), there is a risk of fire, so the temperature of the high heat-generating component is monitored using a sensor and exceeds a predetermined threshold. In this case, a technique for detecting an abnormal temperature is known (for example, Patent Document 1).

  In addition to high heat-generating components, the printed circuit board includes electronic components (hereinafter referred to as “low heat-generating components”) that generate less heat during operation than the high heat-generating components. As in the technique described above, it is possible to monitor the temperature by using a sensor or the like for each of the high heat generating component and the low heat generating component, and monitor the abnormal temperature of the low heat generating component. However, when the low heat generating component is disposed in the vicinity of the high heat generating component, the low heat generating component may reach a high temperature even under normal operation due to the influence of heat generated from the high heat generating component. In such a case, the abnormal temperature detection threshold of the low heat-generating component is set higher than when the low heat-generating component is used alone. Increasing the abnormal temperature detection threshold is not preferable because detection of abnormal temperature is delayed, and the risk of causing troubles such as smoke and fire is increased when parts are deteriorated.

JP 2007-233782 A

  In contrast to the technique for monitoring the temperature of each electronic component as described above, there is a technique in which a printed circuit board is divided into a plurality of areas and an abnormal temperature is detected in each area. In this technique, the abnormal temperature detection threshold is a fixed value in a predetermined region. Further, the abnormal temperature detection threshold value has a higher upper limit in accordance with the high heat generation component because the temperature at which the high heat generation component becomes abnormal is higher than that of the low heat generation component. Here, this technical example will be described with reference to FIG. FIG. 7 shows an example in which the printed circuit board 20 is virtually divided into four areas A, B, C, and D. Each region shown in FIG. 7 is a target of temperature measurement. For example, as shown in a region C, there are cases where both the high heat generating component 21 and the low heat generating component 22 exist in one region, but the abnormal temperature detection threshold in the region C is a fixed value adjusted to the high heat generating component 21. (A value higher than the temperature at which the low heat generating component 22 becomes abnormal). In the region C, when the temperature of the high heat-generating component 21 rises as the power consumption of the printed circuit board 20 increases, the temperature of the low heat-generating component 22 also rises due to the influence. However, since the threshold value for detecting the abnormal temperature is adjusted to the high heat generating component 21, even if the low heat generating component 22 reaches the abnormal temperature, it is determined to be normal. Therefore, also in this technique, if there is a defect or deterioration in a low heat-generating component or a short circuit due to dust contamination, the possibility of smoke generation or ignition due to delayed detection of abnormal temperature increases.

  The present invention has been made in view of the above circumstances, and an information processing apparatus capable of detecting a temperature abnormality in a predetermined region of a printed circuit board, even if components having different abnormal temperatures are mixed, an abnormal temperature An object is to provide a detection method and a program.

  In order to achieve such an object, a first aspect of the present invention is an information processing apparatus having a printed circuit board having a region in which components having different abnormal temperatures are mixed and mounted. A plurality of determination thresholds calculated based on the temperature measured in advance in the area according to the power are prepared, the power consumption measuring means for measuring the power consumption of the printed circuit board, and the area for measuring the temperature of the area The determination threshold value corresponding to the measurement result of the temperature measurement unit, the power consumption measurement unit, and the measurement result of the region temperature measurement unit are compared, and if the measurement result of the region temperature measurement unit is equal to or greater than the determination threshold value, the region is And an abnormal temperature determining means for determining that the temperature is abnormal.

  According to a second aspect of the present invention, there is provided an abnormal temperature detection method performed by an information processing apparatus having a printed circuit board having a region in which components having different abnormal temperatures are mixedly mounted. Accordingly, a plurality of thresholds for determination calculated based on the temperature measured in advance in the area are prepared, a power consumption measuring step for measuring the power consumption of the printed circuit board, and an area temperature measurement for measuring the temperature of the area The threshold value for determination corresponding to the measurement result of the step and the power consumption measurement step is compared with the measurement result of the region temperature measurement step. If the measurement result of the region temperature measurement step is equal to or greater than the determination threshold value, the region is abnormal temperature And an abnormal temperature determination step for determining that it is.

  According to a third aspect of the present invention, there is provided a program for causing a computer having a printed circuit board having an area where components with different temperatures to be abnormally mounted to be mixed to each other, wherein the computer uses the power consumption of the printed circuit board. A plurality of determination thresholds calculated based on the temperature measured in advance in the area are prepared, and the power consumption measurement process for measuring the power consumption of the printed circuit board and the area temperature for measuring the temperature of the area are prepared. Compare the threshold value for determination corresponding to the measurement result of the measurement process and the power consumption measurement process with the measurement result of the area temperature measurement process, and if the measurement result of the area temperature measurement process is greater than or equal to the threshold for determination, the area is abnormal And performing an abnormal temperature determination process for determining that the temperature is reached.

  According to the present invention, it is possible to detect a temperature abnormality in a predetermined region of the printed circuit board even when components having different temperatures are mixed.

It is a block diagram which shows the structural example of PC as one Embodiment of this invention. It is a sectional side view which shows the structural example of the film-like temperature sensor with which PC as one Embodiment of this invention is equipped. It is a top view which shows the example of the several area | region formed with the film-like temperature sensor with which PC as one Embodiment of this invention is equipped. It is a flowchart which shows the operation example of calculation of the threshold value for determination performed by PC concerning one Embodiment of this invention. It is a graph which shows the image of the threshold for judgment computed by PC concerning one embodiment of the present invention. It is a flowchart which shows the operation example of determination of the abnormal temperature performed by PC concerning one Embodiment of this invention. It is a figure which shows the example of the area | region divided | segmented on the printed circuit board.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  The configuration of a PC that is an embodiment of the information processing apparatus of the present invention will be described with reference to FIG. As illustrated in FIG. 1, the PC 1 according to the present embodiment includes a printed circuit board 10, a film temperature sensor 11, a control unit 12, and a storage unit 13.

  As described above, the printed board 10 is a board on which a high heat-generating component and a low heat-generating component are mounted. In the present embodiment, the printed circuit board 10 is virtually divided into a plurality of regions, and the temperature of each region is monitored (measured).

  The film temperature sensor (planar temperature sensor) 11 is a sensor for measuring the temperature of each region in the printed circuit board 10. The film temperature sensor 11 has a film shape and is attached to the bottom surface of the printed circuit board 10, for example. Here, the configuration of the film temperature sensor 11 will be described with reference to FIGS. 2 and 3.

  FIG. 2A is a diagram showing a side cross section of the film temperature sensor 11. As shown in FIG. 2A, the film-like temperature sensor 11 has a silicon thin film 32 at the center and conductive film layers 31 and 32 above and below it. A heat-resistant insulating film 30 is provided on the conductive film layer 31, and a heat-resistant insulating film 34 is provided below the conductive film layer 33.

  FIG. 2B is a diagram illustrating a state in which the film temperature sensor 11 is attached to the bottom surface of the printed board 10. Heat generated by the electronic component 23 on the printed circuit board 10 reaches the silicon thin film 32 via the printed circuit board 10, the heat resistant insulating film 30, and the conductive film layer 31. When the silicon thin film 32 receives the heat, the resistance value changes. Due to this change in resistance value, the temperature of the region where the electronic component 23 exists can be measured. In addition, in the example of FIG.2 (b), it is set as the structure by which the electroconductive film layers 31 and 33 are connected by the control part 12 mentioned later. Thereby, the resistance value changed in the silicon thin film 32 is sent to the control unit 12, and the temperature is specified (measured) in the control unit 12 based on the resistance value.

  FIG. 3 is a top view illustrating a configuration example of the conductive film layers 31 and 33. In FIG. 3, for convenience of explanation, the silicon thin film 33 and the heat-resistant insulating films 30 and 34 are not shown. As shown in FIG. 3, the conductive film layers 31 and 33 are arranged so as to intersect each other vertically. With such an arrangement, a plurality of substantially square regions are formed. Formation of such a matrix region can be realized, for example, using a technique disclosed in JP-T-2002-502128. In FIG. 3, a region a is illustrated as an example of one region. Since the printed board 10 is disposed above the area a, the area a corresponds to a predetermined area on the printed board 10. Here, the area of the printed circuit board 10 corresponding to the area a is “area a ′”. In the present embodiment, it is assumed that a high heat-generating component and a low heat-generating component are mixed in the region a ′. When the resistance value of the silicon thin film 33 corresponding to the region a changes due to the transfer of heat generated from the region a ′, the resistance value is determined by the conductive film layer 31 specifying (forming) the region a, It is transmitted to the control unit 12 via 33. Then, the control unit 12 specifies (measures) the temperature of the region a ′. In addition, since the control part 12 (area | region temperature measurement means 15 mentioned later) can recognize from which area | region (area | region formed with the electroconductive films 31 and 33) the transmitted resistance value is, It can be recognized which region of the printed circuit board 10 the temperature measured based on the resistance value. Therefore, the control unit 12 can specify the temperature of the region a ′ based on the resistance value from the region a.

  The control unit 12 includes a power consumption measuring unit 14, a region temperature measuring unit 15, and an abnormal temperature determining unit 16. The control unit 12 is realized by, for example, a CPU (Central Processing Unit).

  The power consumption measuring unit 14 measures the power consumption of the printed circuit board 10 (power consumption in all areas divided into a plurality of areas). The area temperature measuring means 15 measures the temperature of a predetermined area when the power consumption is predetermined. The abnormal temperature determination unit 16 compares the temperature measured by the region temperature measurement unit 15 with a determination threshold value 17 described later for a predetermined region, and determines whether the temperature is abnormal. Details of these means will be described in an operation example to be described later.

  The storage unit 13 holds a determination threshold value 17 in advance. The storage unit 13 is realized by a non-volatile storage device such as an HDD (Hard Disc Drive).

  The determination threshold 17 is a value (abnormal temperature detection threshold) used for comparison when the abnormal temperature determination means 16 determines whether the temperature is abnormal. The determination threshold value 17 is calculated in advance according to the power consumption for each region, and is prepared in the storage unit 13. In the example of FIG. 1, the determination threshold 17 is configured to be stored in the PC 1, but is configured to be stored (prepared) in an external device so that the PC 1 can acquire the determination threshold 17 from the external device. Also good.

  Here, an example of a method for calculating the determination threshold 17 in the PC 1 will be described with reference to FIGS. 4 and 5.

  When the power consumption of the printed circuit board 10 is measured by the power consumption measuring unit 14, the region temperature measuring unit 15 sets the resistance value for one region (here, the region a ′ described above as an example). The temperature is measured based on the basis (S1). For example, while the same power consumption is measured by the power consumption measuring unit 14 for a certain period of time, the region temperature measuring unit 15 measures the temperature change of the region a 'during the certain time.

  The steps after S2 are performed by a threshold calculation means (not shown) of the control unit 12. The threshold value calculation means specifies the upper limit temperature at the predetermined power consumption and calculates the average temperature at the predetermined power consumption based on the temperature measurement result by the area temperature measurement means 15. For example, if the region temperature measuring unit 15 measures the temperature change in the region a ′ for 10 seconds during which the power consumption 25 W is measured by the power consumption measuring unit 14, the region temperature measuring unit 15 measures for 10 seconds. The largest value among the measured values is specified as the upper limit temperature (maximum value), and the values measured for 10 seconds are averaged to calculate the average temperature (average value). The relationship between the upper limit temperature and the average temperature is, for example, as shown in FIG.

  Next, the threshold value calculation means calculates a calculation value based on the upper limit temperature and the average temperature (S3). The calculation value is a value from which the determination threshold value 17 is calculated. The threshold value calculation means calculates a difference between the upper limit temperature and the average temperature as a calculation value. The calculated value for calculation is d1 as shown in FIG.

  Next, the threshold value calculation means calculates a determination threshold value 17 based on the calculated calculation value d1 (S4). That is, the threshold value calculation unit multiplies the calculation value d1 by the risk factor R, which is a predetermined constant, as the determination threshold value 17 to obtain a product. The risk factor R is a ratio obtained from the results of past failure records and environmental resistance tests. The calculated determination threshold value is d2 as shown in FIG. The temperature above y (upper limit value of d2) shown in FIG. 5 is determined as an abnormal temperature.

  Next, the threshold value calculation means has information (area ID) that can identify the area a ′ for the calculated determination threshold value 17 and a value (power consumption value) indicating the power consumption measured by the power consumption measurement means 14. In the above example, 25 W) is linked and stored in the storage unit 13.

  As described above, the determination threshold value in the region a ′ when the power consumption of the printed circuit board 10 is 25 W is calculated and stored. Then, by performing the above-described S1 to S5 for each different power consumption (within the range of the minimum value to the maximum value), a plurality of determination threshold values in the region a ′ are prepared. It should be noted that not only the region a 'but also other regions may be calculated and stored for different power consumptions in the same manner as described above.

  The calculation and storage of the determination threshold value 17 may be performed in advance in a factory or the like before shipping the product of the PC 1, or may be performed as needed in an environment where the user can freely use the PC 1 after shipping the product. In the latter case, the determination threshold 17 may be updated each time the above calculation is performed.

  Next, an example of an abnormal temperature determination method in the PC 1 will be described with reference to FIG. The operation of FIG. 6 is performed when the user actually uses the PC 1.

  When the power of the PC 1 is turned on by the user, the power consumption measuring unit 14 measures the power consumption of the printed circuit board 10 at a predetermined timing (S11).

  At this time, the region temperature measuring means 15 measures the temperature of one region (here, the region a ′ described above) (S12). It is assumed that high heat-generating parts and low heat-generating parts are mixed in the region a ′.

  Here, the abnormal temperature determination unit 16 searches the storage unit 13 for a determination threshold 17 in which the power consumption measured in S11 and the region where the temperature measurement was performed in S12 are associated. Then, the abnormal temperature determination means 16 compares the temperature measured in S12 with the searched determination threshold 17 (S13).

  As a result of the comparison in S13, if the temperature measured in S12 is not equal to or higher than the determination threshold 17 (S14 / NO), the process returns to S11. On the other hand, as a result of the comparison in S13, when the temperature measured in S12 is equal to or higher than the determination threshold value 17 (S14 / YES), the abnormal temperature determination means 16 determines that the region a ′ is an abnormal temperature (detection). (S15). Thereafter, the abnormal temperature determination unit 16 may perform control to notify the user that the region a 'is abnormal temperature, and may perform control to shut down the PC 1 (turn off the power).

  In the above description, after the power consumption is measured by the power consumption measuring unit 14, the abnormal temperature determination unit 16 reflects the change in the power consumption on the determination threshold (search before the comparison in S 13). You may control to delay. For example, the threshold value is not immediately increased even when the power consumption is increased, or the threshold value is not immediately decreased even when the power consumption is decreased. However, since the time during which power consumption appears as heat generation depends on the part and its cooling means (cooling method), the above control does not apply to all cases, and depends on the part and its cooling means (cooling method). Preferably applied.

  Moreover, in the said embodiment, the following modifications can also be applied. This modification is an operation in the case where a threshold for determination (hereinafter referred to as a threshold) in a predetermined area is changed in accordance with a change in power consumption, and the current temperature in that area exceeds the threshold. Hereinafter, a specific example will be described.

  For example, for the region A, it is assumed that the threshold is 50 ° C. when the power consumption is 20 W, and the threshold is 30 ° C. when the power consumption is 10 W. If the power consumption is changed from 20 W to 10 W as a result of the measurement by the power consumption measuring means 14, the abnormal temperature determination means 16 changes the threshold used for comparison from 50 ° C. to 30 ° C. At this time, if the result of measurement of the current temperature in the region A by the region temperature measuring unit 15 is 32 ° C., according to the above description, the abnormal temperature determining unit 16 determines that the current temperature 32 ° is changed to the threshold 30 ° C. Therefore, the region A is determined as an abnormal temperature. However, in this modified example, even when the current temperature exceeds the threshold value, the abnormal temperature is not determined by referring to the threshold value and the current temperature in another region. In the present modification, a threshold value corresponding to the power consumption needs to be set in advance for other regions other than the region A. Here, as an example, it is assumed that a plurality of threshold values corresponding to power consumption are calculated in advance and stored in the storage unit 13 for other regions by the threshold value calculation unit.

  First, the abnormal temperature determination unit 16 specifies another region in which a threshold value corresponding to a measurement result (changed power consumption) of the power consumption measurement unit 14 is set in advance. As an example, it is assumed here that the region R is specified. Next, the abnormal temperature determination unit 16 calculates the difference between the current temperature (Ta) of the region A measured by the region temperature measurement unit 15 and the changed threshold value of the region A. Let this calculation result be Δt1. Next, the abnormal temperature determination unit 16 searches the threshold value of the region R corresponding to the measurement result of the power consumption measurement unit 14, the current temperature of the region R measured by the region temperature measurement unit 15, and the searched region R The difference from the threshold is calculated. Let this calculation result be Δt2. Next, the abnormal temperature determination means 16 calculates (Δt1−Δt2) / Ta * 100 and calculates the deviation rate. Next, the abnormal temperature determination means 16 determines whether or not the calculated deviation rate is within Q% (predetermined deviation rate for determination). If the calculated deviation rate is within Q% as a result of the determination, the abnormal temperature determination means 16 determines that the current temperature in the region A is not an abnormal temperature even if the current temperature exceeds the changed threshold value. On the other hand, if the calculated deviation rate exceeds Q% as a result of the determination, the abnormal temperature determination means 16 determines that the region A is an abnormal temperature.

  By operating as described above, according to the present modification, the increase in the threshold cannot catch up with the temperature increase in the region accompanying the increase in power consumption, or the threshold is set prior to the temperature decrease due to the decrease in power consumption. In the case of descending, it can be avoided that it is determined that the temperature is abnormal although it is not abnormal.

  As described above, according to the present embodiment, even if there are components with different temperatures (high heat generation components and low heat generation components) in a predetermined area of the printed circuit board, a temperature abnormality in that area is detected. it can.

  As mentioned above, although embodiment of this invention was described, it is not limited to the said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary.

  For example, the operation in the above-described embodiment can be executed by hardware, software, or a combined configuration of both.

  When executing processing by software, a program in which a processing sequence is recorded may be installed and executed in a memory in a computer incorporated in dedicated hardware. Or you may install and run a program in the general purpose computer which can perform various processes.

  For example, the program can be recorded in advance on a hard disk or a ROM (Read Only Memory) as a recording medium. Alternatively, the program is stored on a removable recording medium such as a CD-ROM (Compact Disc Read Only Memory), an MO (Magneto Optical) disc, a DVD (Digital Versatile Disc), a USB (Universal Serial Bus) memory, a magnetic disc, or a semiconductor memory. It is possible to store (record) temporarily or permanently. Such a removable recording medium can be provided as so-called package software.

  The program may be wirelessly transferred from the download site to the computer in addition to being installed on the computer from the removable recording medium as described above. Or you may wire-transfer to a computer via networks, such as LAN (Local Area Network) and the internet. The computer can receive the transferred program and install it on a recording medium such as a built-in hard disk.

  In addition to being executed in time series in accordance with the processing operations described in the above embodiment, the processing capability of the apparatus that executes the processing, or a configuration to execute in parallel or individually as necessary Is also possible.

1 PC
DESCRIPTION OF SYMBOLS 10 Printed circuit board 11 Film-like temperature sensor 12 Control part 13 Memory | storage part 14 Power consumption measuring means 15 Area | region temperature measuring means 16 Abnormal temperature judging means 17 Judgment threshold value 21 High heat generation component 22 Low heat generation component 23 Electronic component 30, 34 Heat-resistant insulation Film 31, 33 Conductive film layer 32 Silicon thin film

Claims (7)

An information processing apparatus having a printed circuit board having a region in which components having different temperatures that are abnormally mixed are mounted,
In accordance with the power consumption of the printed circuit board, a plurality of determination thresholds calculated based on the temperature measured in advance in the region are prepared,
Power consumption measuring means for measuring the power consumption of the printed circuit board;
Area temperature measuring means for measuring the temperature of the area;
The determination threshold value corresponding to the measurement result of the power consumption measurement unit is compared with the measurement result of the region temperature measurement unit. When the measurement result of the region temperature measurement unit is equal to or greater than the determination threshold value, the region is An abnormal temperature determining means for determining that the temperature is abnormal;
An information processing apparatus comprising: Threshold calculating means for calculating the threshold for determination;
The threshold calculation means includes
Based on a plurality of values of the temperature of the region measured at a predetermined power consumption, the highest value is specified and an average value is calculated,
The information processing apparatus according to claim 1, wherein one determination threshold corresponding to the predetermined power consumption is calculated by multiplying a difference between the maximum value and the average value by a predetermined constant. . The abnormal temperature determination means includes
When the measurement result of the power consumption measuring means is changed, the threshold for determination is changed according to the measurement result, and when the measurement result of the area temperature measuring means is greater than or equal to the determination threshold after the change for the area,
Identify another area in which a threshold value for determination corresponding to the measurement result of the changed power consumption measuring means is set,
For the region, calculate the difference between the measurement result of the region temperature measurement means and the determination threshold after the change,
For the other region, calculate the difference between the measurement result of the region temperature measuring means and the threshold for determination,
Based on the calculated two differences and the measurement result of the region temperature measuring means of the region, a divergence rate is calculated,
The information processing apparatus according to claim 1, wherein when the calculated deviation rate is within a predetermined deviation rate, the region is not determined to be an abnormal temperature. The abnormal temperature determination means includes
4. The control device according to claim 1, wherein when it is determined that the region has an abnormal temperature, a notification to that effect is given to the user, and the information processing apparatus is turned off. 5. Information processing device. A film-like temperature sensor is provided on the bottom surface of the printed circuit board,
The region temperature measuring means includes
5. The information processing apparatus according to claim 1, wherein the temperature of the region is measured based on a change in resistance value in the film temperature sensor. 6. An abnormal temperature detection method performed by an information processing apparatus having a printed circuit board having a region in which components having different temperatures are mixed and mounted,
In accordance with the power consumption of the printed circuit board, a plurality of determination thresholds calculated based on the temperature measured in advance in the region are prepared,
A power consumption measuring step for measuring power consumption of the printed circuit board;
An area temperature measuring step for measuring the temperature of the area;
The determination threshold value corresponding to the measurement result of the power consumption measurement step is compared with the measurement result of the region temperature measurement step, and when the measurement result of the region temperature measurement step is equal to or greater than the determination threshold value, the region An abnormal temperature determination step for determining an abnormal temperature;
An abnormal temperature detection method characterized by comprising: A program for causing a computer having a printed circuit board having an area in which components having different temperatures to be mixed are mounted together,
In the computer,
In accordance with the power consumption of the printed circuit board, a plurality of determination thresholds calculated based on the temperature measured in advance in the region are prepared,
Power consumption measurement processing for measuring the power consumption of the printed circuit board;
An area temperature measurement process for measuring the temperature of the area;
The determination threshold value corresponding to the measurement result of the power consumption measurement process is compared with the measurement result of the area temperature measurement process, and the measurement result of the area temperature measurement process is equal to or greater than the determination threshold value, the area is An abnormal temperature determination process for determining that the temperature is abnormal;
A program characterized by having executed.

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