JP5559923B1 - Split belt and split device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a split belt and a dividing device capable of further improving the yield.
In an endless split belt, a base layer 10A made of a synthetic resin sheet is provided so as to overlap a surface layer 10B made of a woven fabric, and the warp and weft of the woven fabric have a circumferential direction and a width direction of the belt, respectively. It is arranged along. At least the weft of this fabric contains elastic yarn. Since the weft includes an elastic yarn, an appropriate frictional force is generated between the weft and the ceramic substrate surface, and the lateral displacement of the ceramic substrate at the dividing position can be reduced by the deformation of the elastic yarn, so that the ceramic substrate can be divided sharply. So the yield is improved.
[Selection] Figure 3

Description

  The present invention relates to an endless split belt wound around a roller member for splitting a ceramic substrate provided with a split groove, and a splitting device.

  Conventionally, a ceramic substrate having a plurality of dividing grooves is divided along the dividing grooves to produce a chip-shaped ceramic electronic component. When dividing along the split groove, the ceramic substrate is sandwiched and a load is applied and the ceramic substrate is divided by narrow pressure. A pair of endless belts are used as means for sandwiching the ceramic substrate. The ceramic substrate is sandwiched between a pair of endless belts, and the ceramic substrate is transported by running the belt, and the ceramic substrate is divided along the groove by applying pressure with a pair of rollers while being sandwiched between the belts.

  However, when the ceramic substrate is divided into chip parts, the surface of the belt sandwiched by the edges of the chip parts is damaged, and the surface condition deteriorates. The yield drops. Therefore, when the surface condition starts to deteriorate, the belt needs to be replaced, and as a result, the life of the belt is shortened.

  In order to improve such problems, various ceramic chip dividing belts have been devised.

  For example, the chip grinding belt described in Patent Document 1 has a core wire as means for reducing deformation of the belt during grinding, and the grinding surface is made of hydrogenated nitrile rubber containing an unsaturated carboxylic acid metal salt.

  Further, in recent years, the chip size has been reduced, for example, to a size of 0.4 mm × 0.2 mm. In order to divide into chips of such a small size, for example, in the chip pulverization belt described in Patent Document 2, the interval in the belt width direction of the core wire embedded in the rubber layer is set to 0.2 mm or less.

Japanese Patent Laid-Open No. 2004-42020 JP 2012-152694 A

  Although the problems as described above are being improved, it cannot be said that sufficient yield and lifetime are still obtained.

  An object of the present invention is to provide a split belt and a dividing device capable of further improving the yield.

  Another object of the present invention is to provide a split belt and a dividing device capable of further extending the life.

The present invention provides a split belt to divide the ceramic substrate dividing groove is formed, the belt has a fabric woven with yarn containing at least elastic fibers, the ceramic base plate, the elastic textiles of the fabric It is the split belt characterized by having comprised so that may contact | connect.

In the invention, it is preferable that the woven fabric is a woven fabric including a yarn including at least the elastic fiber or a yarn including the elastic fiber , and woven from a plurality of yarns including a thread including the non-elastic fiber. yarns composed of fibers made from the yarn of monofilament or multifilament yarn composed of non-elastic fibers thinner than the yarn made of the elastic fibers, or the yarn made of non-elastic fibers are twisted sweet made of the inelastic fibers thread constructed thinly flattened the thickness direction than the yarn made of non-elastic fibers are configured so as to spread the thread or the elastic fiber comprising the elastic fibers, and, prior Symbol elastic fiber than said non-elastic fibers The belt has a thick fiber diameter, and the belt surface is caused by at least one of a texture, a deformation of the yarn made of the non-elastic fiber, or a cross-sectional shape of the elastic fiber and the non-elastic fiber. Convex portions are formed, it consists of a convex portion the elastic fibers of the concavo-convex portion is a split belt, wherein the convex portion is configured so as to be in contact with the ceramic substrate.

The present invention, the woven fabric, the side of the surface in contact with the ceramic substrate of the fabric, yarn made of yarn or the elastic fiber comprising the elastic fibers woven climb over two or more yarns at least a non-elastic fiber consists of a woven tissue, a surface exposed many yarns yarns or the elastic fiber comprising the elastic fibers are yarn fabric, characterized by being configured so it said surface is in contact with the ceramic substrate The split belt.

  Further, the present invention is an endless belt, wherein the split belt is made of at least a synthetic resin sheet, and further includes a base material layer provided with the surface layer being the fabric, and the surface layer includes the warp and weft of the fabric Are arranged along the circumferential direction and the width direction of the belt, respectively.

The present invention, the weft, and a yarn made of yarn or the elastic fiber comprising the elastic fibers and yarns composed of non-elastic fibers, the elastic fibers or the at least either the modified cross-section shape of the non-elastic fiber And the elastic fiber is a polyurethane fiber.

  According to another aspect of the present invention, there is provided a chip splitting device comprising the above-described split belt, wherein the surface layer of the split belt is brought into contact with a ceramic substrate having split grooves and split into a plurality of ceramic chips.

According to the present invention, the belt is at least comprises a fabric woven from yarn comprising elastic fibers, the ceramic base plate, configured such that the elastic textiles of the fabric is in contact.

  The woven yarn used in the woven fabric includes a yarn made of stretchable elastic fibers and a yarn made of inelastic fibers. The belt surface is formed with uneven portions due to texture, deformation of the yarn made of the non-elastic fibers, or at least one of the cross-sectional shapes of the elastic fibers and the non-elastic fibers, and the convex portions of the uneven portions. Consists of the elastic fibers. The convex portion is configured to be in contact with the ceramic substrate at the time of division.

  By forming the convex portion from the elastic fiber, an appropriate frictional force is generated between the surface of the ceramic substrate and the lateral displacement of the ceramic substrate at the dividing position can be reduced by the deformation of the elastic yarn, and the ceramic substrate is divided sharply. Can improve the yield. Furthermore, by providing elastic fibers that are thicker than the other yarns along the dividing grooves of the ceramic substrate, yarn cutting is suppressed and the yield does not decrease, so the belt replacement time is extended and a longer life can be achieved.

  In addition, moderate unevenness can be provided on the surface in contact with the ceramic substrate, and the load is concentrated on the portion where the convex portion made of elastic yarn contacts the surface of the ceramic substrate, so that the division in the dividing groove can be performed reliably. . Further, by adjusting the size of the diameter of the elastic yarn, the pitch of the weft including the elastic yarn, etc., it is possible to cope with the division of the small size chip. Furthermore, the convex part is made of an elastic thread, and the elastic thread has resilience to prevent chipping on the belt and reduce adhesion to the belt. The tip can be removed.

  According to the invention, the woven fabric is a surface of the woven fabric that is in contact with the ceramic substrate, and at least two yarns including elastic fibers or yarns made of elastic fibers get over at least two non-elastic fiber yarns. It is composed of a woven structure, and a surface of the yarn including the elastic fiber that is the woven yarn of the woven fabric or a yarn made of the elastic fiber is formed so as to be in contact with the ceramic substrate. A moderate frictional force can be easily generated between them, the deviation of the ceramic substrate during belt conveyance and the deviation during division can be suppressed, and the ceramic substrate can be divided sharply.

  Further, according to the present invention, the split belt is an endless belt in which a base layer made of a synthetic resin sheet and a surface layer made of woven fabric are overlapped, and the surface layer includes warps and wefts of the woven fabric. Are arranged along the circumferential direction and the width direction of the belt, respectively, and the tensile strength of the belt is improved by using a resin sheet as a base material.

According to the invention, since the weft includes a thread made of non- elastic fibers and a thread made of the elastic fibers, expansion and contraction of the fabric in the width direction of the belt is restricted, and the divided ceramic chip is a surface layer. Can be prevented from being bitten. In addition, elastic fibers that are thicker than other yarns are provided as wefts along the dividing grooves of the substrate, which makes it possible to prevent the weaving yarn from being cut and to extend its life.

  Furthermore, since the non-elastic fiber or elastic fiber has a shape having an atypical cross-sectional shape, it is possible to form irregularities due to the fiber shape, facilitate the division of small-sized chips, and wear resistance by using polyurethane fiber as the elastic fiber It is possible to further improve the service life.

  Moreover, according to this invention, by providing said split belt, a ceramic substrate can be divided | segmented sharply and the dividing apparatus which can improve a yield is realizable.

It is the schematic which shows the structure of the chip | tip division | segmentation apparatus 100 which is embodiment of this invention. 4 is an enlarged view showing the vicinity of a divided area of the chip dividing apparatus 100. FIG. It is sectional drawing which shows the 1st aspect of a chip | tip division | segmentation belt. It is sectional drawing which shows the 2nd aspect of a chip | tip division | segmentation belt. It is a figure for demonstrating the structure | tissue of the textile fabric 30 used for the surface layer 10B. It is a cross-sectional view showing the lower belt 20 in a state where the ceramic substrate C is being conveyed.

  FIG. 1 is a schematic diagram showing a configuration of a chip dividing apparatus 100 according to an embodiment of the present invention. The chip dividing device 100 divides a ceramic substrate provided with a split groove between two split belts, and pressurizes the ceramic substrate with a roller while conveying the ceramic substrate, thereby dividing the ceramic substrate into individual ceramic chips along the split groove. is there. The configuration of the chip dividing apparatus 100 is the same as that of the existing apparatus, and has a feature in the chip dividing belt, and thus detailed description of the operation of the entire apparatus is omitted.

  The chip splitting device 100 is composed of two upper and lower parts, and an upper chip splitting endless belt (hereinafter referred to as “upper belt”) 10 and a driving roller 11 for rotating the upper belt 10 on the upper side, An idle roller 12 and a tension roller 13 and a pressure roller 14 for pressing the ceramic substrate C are provided. Below the chip splitting device 100, a lower chip splitting endless belt (hereinafter referred to as “lower belt”) 20, a driving roller 21 for rotating the lower belt 20, an idle roller 22, and A tension roller 23 and a split roller 24 provided to face the pressure roller 14 are provided.

  The upper belt 10 is stretched around the driving roller 11, the idle roller 12, and the tension roller 13, and the upper belt 10 runs around by the rotational driving force applied by the driving roller 11. The lower belt 20 is stretched around the drive roller 21, the idle roller 22, and the tension roller 23, and the lower belt 20 runs around by the rotational driving force applied by the drive roller 21.

  The pressure roller 14 and the split roller 24 are provided at positions facing each other, and sandwich the upper and lower belts from the upper side and the lower side in a conveyance region where the upper and lower belts run in parallel in the horizontal direction. In the transport region, the ceramic substrate C is transported with the ceramic substrate C placed on the lower belt 20, and the ceramic substrate C is separated from the upper belt 10 and the lower belt at the split position where the pressure roller 14 and the split roller 24 are provided. The pressure for dividing the groove is applied to the ceramic substrate C by the pressure roller 14.

  FIG. 2 is an enlarged view showing the vicinity of the divided area of the chip dividing apparatus 100. The ceramic substrate C provided with the dividing groove is pressed vertically by the pressure roller 14 while being sandwiched between the upper and lower belts at the dividing position, and the dividing roller 24 supports the pressure to generate a force point F. A downward force is applied, and an upward force is generated at the action point W by the lever principle, but an upward displacement at the action point W is suppressed by the pressure roller 14, and the force is concentrated on the fulcrum O. When the portion of the ceramic substrate C to be conveyed where the split groove is provided reaches the fulcrum O, the ceramic substrate C is split along the split groove. The surface of the lower belt 20 is particularly damaged by the edge of the broken cross-section. Further, the belt has a dent due to the adhesive force or grip force of the belt and the pressure for chip separation, and the ceramic chip divided on the surface of the belt is bitten and cannot be easily separated from the belt. Further, the pulverized powder generated at the time of the division becomes an abrasive and scrapes the belt surface, thereby reducing the life of the belt.

  The chip splitting belt of the present invention makes it difficult to cause such scratches, suppresses adhesion due to biting of the divided ceramic chips, and further pulverizes the pulverized powder at the concave and convex portions and the concave portions of the irregular cross-section fibers. Therefore, it is intended to reduce the influence on the convex portion in contact with the ceramic substrate, to make it difficult to cause division failure, and to extend the life of the belt.

  FIG. 3 is a cross-sectional view showing a first aspect of the chip split belt. Of the upper belt 10 and the lower belt 20, at least the lower belt 20 uses the chip dividing belt of the present invention. Although it is not essential to use the chip dividing belt of the present invention as the upper belt 10, it is more preferable to use the chip dividing belt of the present invention. Further, when the chip dividing belt of the present invention is used for the upper belt, it is more preferable to make the belt thickness thicker than the lower belt.

  In FIG. 3, the chip dividing belt of the present invention will be described as the lower belt 20. The lower belt 20 of the first aspect includes a base material layer 20A, a surface layer 20B, and an adhesive 20C. The base layer 20A is made of a synthetic resin sheet. For example, a synthetic resin such as polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polyvinyl chloride, polyimide, acrylonitrile, polycarbonate, nylon is formed into a sheet. It is obtained by forming.

  The surface layer 20B is a layer made of a woven fabric, and is provided so as to overlap the base material layer 20A. The present invention is characterized in that a woven fabric is used for the surface layer 20B that is in direct contact with the ceramic substrate C, and the woven fabric is based on warp and weft yarns along the circumferential direction and the width direction of the belt, respectively. It is arrange | positioned on the material layer 20A surface, and about the woven thread, the thread | yarn which consists of a stretchable elastic fiber or a stretchable elastic fiber is included.

  The surface layer 20B made of a woven fabric and the base material layer 20A made of a synthetic resin sheet are joined together by an adhesive 20C. The adhesive 20C is not particularly limited as long as it can join the base layer 20A and the surface layer 20B. Moreover, in this embodiment, although it was set as the joining by an adhesive agent, as long as joining strength is fully securable, you may use not only an adhesive agent but an adhesive.

  FIG. 4 is a cross-sectional view showing a second aspect of the chip split belt. 4, the chip dividing belt of the present invention will be described as the lower belt 20 as in the first mode shown in FIG. The lower belt 20 of the second aspect includes a base material layer 20A, a surface layer 20B, an adhesive 20C, a back surface layer 20D, and an adhesive 20E. The lower belt 20 of the second embodiment is obtained by adding a back layer 20D made of a woven fabric to the belt of the first embodiment.

  The fabric of the back layer 20D in the second embodiment may be the same as the fabric of the surface layer 20B, but may not be in contact with the ceramic substrate C, and may be a different fabric. The back surface layer 20D transmits the rotational driving force from the driving roller 21 by the frictional force with the driving roller 21, so that any suitable frictional resistance is generated between the driving roller 21 and the back surface layer 20D. Good. Therefore, as long as frictional resistance is generated, the woven fabric of the back layer 20D may be composed only of inelastic yarns, or may include elastic yarns in warps or wefts. Further, the surface of the back surface layer 20D on the side in contact with the drive roller 21 may be subjected to a coating process for generating an appropriate frictional resistance with the drive roller 21.

  The back layer 20D made of a woven fabric and the base material layer 20A made of a synthetic resin sheet are joined together by an adhesive 20E. The adhesive 20E is not particularly limited as long as it can join the base layer 20A and the back layer 20D in the same manner as the adhesive 20C. Moreover, in this embodiment, although it was set as the joining by an adhesive agent, as long as joining strength is fully securable, you may use not only an adhesive agent but an adhesive.

  As described above, in the first and second embodiments, the surface layer 20B that is in contact with the ceramic substrate C is made of a woven fabric. A frictional force is generated, and the lateral displacement of the ceramic substrate at the dividing position can be reduced by deformation of the elastic yarn, and the ceramic substrate C can be sharply divided by each of the dividing grooves, so that the yield is improved. Since the yield does not decrease, the belt replacement time can be extended and a longer life can be achieved.

  FIG. 5 is a view for explaining the structure of the fabric 30 used for the surface layer 20B. FIG. 5A is a plan view, and FIG. 5B is a rear view. Note that. In FIG. 5, a diagram viewed from the side in contact with the ceramic substrate C is a plan view, and a diagram viewed from the side opposite to the plan view, that is, the base material layer 20 </ b> A side, is a bottom view. Further, the up and down direction toward the paper surface is the belt circumferential direction (conveying direction), and the left and right direction is the belt width direction.

  Among the woven yarns constituting the woven fabric 30, multifilament yarns that are yarns made of inelastic fibers are used for the warp yarns 31 along the belt conveyance direction. For the weft 32 along the width direction of the belt, an elastic yarn and a multifilament yarn which is an inelastic yarn are used in combination. The multifilament yarn is composed of a sweet-twisted yarn, the sweet-twisted yarn is flat, or the fibers constituting the sweet-twisted yarn are spread, and an elastic yarn having a large yarn diameter Is configured to contact the ceramic substrate.

  The multifilament yarns of the warp 31 and the weft 32 are made of synthetic resin, and the type of the synthetic resin may be selected so as to satisfy the characteristics required for the chip dividing belt. As an example, the multifilament yarn of the warp 31 is made of nylon, and the multifilament yarn of the weft 32 is made of polyester.

  By using the multi-filament inelastic yarn 32b that is sweet-twisted with the warp 31 and the weft 32, expansion and contraction of the belt in the conveyance direction and the width direction is regulated. Thereby, since the surface layer 20B does not expand and contract more than necessary, it is possible to prevent the divided ceramic chip from being bitten by the surface layer 20B and at the same time, the elastic yarn can contact the ceramic substrate. The warp 31 and the weft 32 may be monofilaments as long as the diameter is smaller than that of the elastic yarn 32a.

  The elastic yarn 32a constituting the weft 32 together with the non-elastic yarn is made of synthetic resin, has elasticity, and the type of resin is not particularly limited as long as the friction coefficient is 0.5 or more, and is required for the chip dividing belt. It may be selected so as to satisfy the characteristics. As an example of the elastic yarn, a polyurethane elastic yarn is used. The polyurethane resin is excellent in abrasion resistance, and the life of the belt can be further extended by using polyurethane elastic yarn.

  Furthermore, the structure of the fabric 30 is a weft double weave. In the weft double weaving, the warp 31 is single and the weft 32 is double. By changing the type of the weft 32, the yarn exposed on the front and back of the fabric 30 is different for the weft 32. Since the weft 32 of the fabric 30 is a double yarn of an inelastic yarn and an elastic yarn, a lot of elastic yarn is exposed on one surface of the fabric 30 and an inelastic yarn is exposed on the other surface of the fabric 30. Many are exposed. In the surface layer 20B, the surface on the side where a large amount of elastic yarn is exposed is the surface on the side in contact with the ceramic substrate C, and the surface on the side where a large amount of inelastic yarn is exposed is the surface on the side where the base material layer 20A is joined. The elastic yarn 32a is exposed as the weft 32 on the surface shown in the plan view of FIG. 5A, and the non-elastic yarn 32b is exposed as the weft 32 on the surface shown in the bottom view of FIG. ing. Further, the belt of the present invention may be configured in a single layer.

  Further, the woven structure of the woven fabric 30 of the surface layer 20B may be a twill woven fabric, a satin woven fabric, or a special woven tissue other than a plain woven fabric, as long as the elastic fiber is exposed to a desired degree of exposure. Further, it is more preferable to use a satin weave. It is preferable to configure the woven fabric 30 by appropriately selecting the woven structure so that the friction coefficient of the surface of the surface layer 20B on the side in contact with the ceramic substrate C is 0.5 or more.

  The woven fabric of the back layer 20D is more preferably subjected to a coating treatment because the yarn is worn by rubbing with the roller. Further, when a relatively large friction coefficient is required, an elastic thread may be included on the back surface to improve the friction coefficient.

  Next, a description will be given of the case of the lower belt 20 using elastic yarns having a different cross-sectional shape for the chip dividing belt of the present invention. Hereinafter, the lower belt 20 will be described in the second mode, that is, the mode including the back surface layer. However, the lower belt 20 of the first mode not including the back surface layer can also be implemented.

  FIG. 6 is a cross-sectional view showing the lower belt 20 in a state where the ceramic substrate C is being conveyed. The lower belt 20 includes a base material layer 20A, a surface layer 20B, an adhesive 20C, a back surface layer 20D, and an adhesive 20E. These include the base material layer 10A, the surface layer 10B, the adhesive 10C, and the back surface layer. Since it is the same as 10D and adhesive 10E, description is omitted.

  The surface layer 20B on which the ceramic substrate C provided with the split grooves is directly placed is made of a woven fabric 40. The woven fabric 40 is a warp yarn 41 made of an inelastic yarn and a weft yarn 42 made of an inelastic yarn and an elastic yarn. It consists of.

  The weft yarn 42 is a double yarn, and both an elastic yarn and an inelastic yarn are provided with a plurality of yarns arranged in the surface direction. The elastic yarn has a so-called spectacle-shaped irregular cross-sectional shape in the plane direction. Such an elastic yarn having an irregular cross-sectional shape may be formed by setting the shape of the die at the time of spinning to a desired cross-sectional shape, or may be formed by welding a plurality of elastic yarns. It should be noted that the cross-sectional shape may be any irregular shape that forms irregularities in this way, and may be a shape other than the eyeglass-shaped shape. Furthermore, the cross-sectional shape of the inelastic fiber may be an irregular cross-sectional shape.

  On the belt surface, specifically, the surface of the surface layer, uneven portions are formed due to at least one of texture, deformation of inelastic yarn, or difference in cross-sectional shape between elastic yarn and inelastic yarn. Furthermore, since the elastic yarn has the above-described atypical cross-sectional shape, the surface layer 20B has two types of irregularities on the surface, the small pitch irregularities due to the elastic yarn itself and the large pitch irregularities due to the woven structure of the fabric. Formed regularly. As described with reference to FIG. 2, at the dividing position, the ceramic substrate C is split into individual chips by splitting by the lever principle, and the powder of the ceramic material generated at the time of the division is in the concave and convex portions. Since it is possible to prevent the powder from adhering to the convex portion that applies force to the surface of the ceramic substrate C, stable substrate conveyance and the frictional force of the belt surface can be maintained. Furthermore, the warp 41 is a multi-filament yarn that has been twisted and each filament of the multifilament yarn spreads in the width direction of the belt. It becomes possible to enlarge. When the level difference is large, the contact pressure at which the edge portion of the ceramic substrate C contacts the warp 41 of the recess can be further reduced, and yarn breakage of the warp 41 can be prevented.

  The upper belt 10 applies a force to the surface of the ceramic substrate C where the split groove is provided by the pressure roller 14, and at this time, the force concentrates on the convex portion of the surface layer 10B. Further, the lower belt 20 applies a force to the surface of the ceramic substrate C on the side having no split groove by the reaction of the force applied by the pressure roller 14, but at this time, the lower belt 20 is applied to the convex portion of the surface layer 20B. Power concentrates.

  The ceramic substrate C is divided by the dividing groove by the force applied from above and below. Therefore, if the pitch of the convex portions of the surface layers 10B and 20B, that is, the pitch P1 of the weft is smaller than the pitch P2 of the split grooves provided in the ceramic substrate C, the ceramic substrate can be surely used in all the split grooves by the lever principle. Although C can be divided, if P1 is larger than P2, there is a possibility that a groove that does not break due to insufficient force is generated in some of the split grooves. In the belt of the present invention, the non-elastic fibers or the elastic yarns have an irregular cross-sectional shape, and there are even smaller pitch irregularities inside the wefts. A force can be exerted against it. Since the pitch P3 of the convex portion by the non-elastic fiber or the elastic yarn is naturally smaller than the pitch P1 of the weft yarn, a force can be applied more reliably to all the split grooves provided in the ceramic substrate C. Occurrence of division defects can be suppressed.

  Further, in the method of dividing along the dividing groove by the lever principle using the belt of the present invention above and below, particularly in the case of dividing a chip of a small size, the side of the substrate where the dividing groove is not formed is supported. It is preferable to reduce the diameter of the dividing roller 24, and it is preferable to reduce the thickness of the lower belt 20 so that the dividing force easily acts on the substrate. Further, since the divided roller 24 serves as a fulcrum, the upper belt 10 has a region serving as an action point, and therefore, it is more preferable that the upper belt 10 is configured to have higher rigidity than the lower belt 20.

  In the belt of the present invention, the base material layers 10A and 20A can be easily changed. By making the base material layer 10A thicker than the base material layer 20A, the rigidity of the upper belt 10 can be easily increased. Can be high.

  Furthermore, the uneven pitch due to the non-elastic fiber or elastic thread can be made as small as the diameter of the non-elastic fiber or elastic thread, so that even a small-sized chip can be sufficiently divided.

Table 1 shows a comparison result between the belt of the example of the present invention and the belt of the conventional configuration.
Example 1
As the fabric constituting the surface layer, multifilament yarn, which is a non-elastic yarn made of nylon fiber, is used for the warp, and a urethane yarn having an irregular cross-sectional shape and a multi-stripe yarn made of polyester fiber are used for the weft. A double yarn with a filament yarn was used and woven to a predetermined width by a needle loom.

  A PET (polyethylene terephthalate) film (thickness 75 μm) having a width approximately equal to the woven width is provided as a base material layer on the back surface of the woven fabric through an adhesive, and further, from a satin weave not containing elastic yarn through the adhesive. The resulting woven fabric was placed as a back layer to produce an endless belt.

(Example 2)
As the fabric constituting the surface layer, multifilament yarn, which is a non-elastic yarn made of nylon fiber, is used for the warp, and a urethane yarn having an irregular cross-sectional shape and a multi-stripe yarn made of polyester fiber are used for the weft. A double yarn with a filament yarn was used and woven to a predetermined width by a needle loom.

  A coating agent of a synthetic resin material was applied from the back side of the woven fabric so that the warp and the weft of the woven fabric were not easily displaced.

  A PET (polyethylene terephthalate) film (thickness 75 μm) having a width approximately equal to the woven width is provided as a base material layer on the back surface of the woven fabric through an adhesive, and further, from a satin weave not containing elastic yarn through the adhesive. The resulting woven fabric was placed as a back layer to produce an endless belt.

(Example 3)
As the fabric constituting the surface layer, multifilament yarn, which is a non-elastic yarn made of nylon fiber, is used for the warp, and a urethane yarn having an irregular cross-sectional shape and a multi-stripe yarn made of polyester fiber are used for the weft. A double yarn with a filament yarn was used and woven to a predetermined width by a needle loom.

  A coating agent of a synthetic resin material was applied from the back side of the woven fabric so that the warp and the weft of the woven fabric were not easily displaced.

  A PET (polyethylene terephthalate) film (thickness 75 μm) having a width approximately equal to the woven width is provided as a base material layer on the back surface of the woven fabric via an adhesive, and further comprises a plain weave that does not include elastic yarn via an adhesive. An endless belt was manufactured by arranging it as a back layer having a thickness smaller than that of the back layer of Example 2 in a woven fabric.

(Example 4)
As a woven fabric constituting the surface layer, a urethane elastic yarn having a different cross-sectional shape was used for the warp, and a multi-filament yarn made of nylon fiber was used for the weft and woven to a predetermined width by a needle loom.

  A coating agent of a rubber material was applied from the surface of the woven fabric, and a squeegee was used to bond the warp and weft of the woven fabric.

  A PET (polyethylene terephthalate) film (thickness 75 μm) having a width approximately equal to the woven width is provided as a base material layer on the back surface of the woven fabric through an adhesive, and further, from a satin weave not containing elastic yarn through the adhesive. The resulting woven fabric was placed as a back layer to produce an endless belt.

  Comparative example 1 and 2 are belts of molded articles having a conventional configuration. An endless belt of Comparative Example 3 was produced in the same manner as in Example 4 except that no rubber material coating agent was applied.

  Using the manufactured belts of the example and the comparative example, a chip substrate with a split groove having a pressure of 0.15 MPs, a groove pitch of 0.5 mm, and a width of 1 mm with a chip dividing apparatus (see FIG. 1) having the configuration of FIG. Divided.

About the Example and the comparative example, it evaluated about the ease of a crack, a crack shape, and a lifetime.
As for the ease of cracking, those with twin cracks or more (defects in a state where two or more chips are connected) were evaluated as “x”, and those that were divided without any problem were rated as “◯”. As for the cracked shape, the cracked part (shape defect) other than the split groove is marked as x, and the cracked part along the groove is marked as ◯. Regarding the lifespan, × indicates that the crack shape has changed when the ceramic substrate is passed through the same part of the belt less than 50 times, and Δ indicates that the crack shape has changed between 50 times and less than 200 times. The case where the crack shape did not change even after 200 times or more was rated as ◯.

  As shown in Table 1, all of Examples 1 to 4 had no problems in terms of ease of cracking, crack shape, and life. As a result of further confirming that the pressure was lowered, it was confirmed that division was possible even at a lower pressure compared to the conventional belt.

  In Example 1, a polyurethane elastic yarn having an irregular cross-sectional shape and a multifilament yarn of polyester fiber, which is an inelastic yarn that restricts expansion and contraction in the width direction, are used as wefts, and no measures for preventing deviation from warps are taken. Even though there was a shift in the direction of conveyance of the polyurethane elastic yarn, there was no problem with the chip cracking.

  In Example 2, as a result of coating from the back side of the fabric for the purpose of restricting the displacement of the elastic yarn in the conveyance direction of Example 1, the belt surface is suppressed even if the deviation is suppressed and repeated division is performed at the same position of the belt. As a result, there was little change.

  In Example 3, in order to reduce the thickness of the belt for the purpose of improving the pressure transmission, the back layer fabric is composed of a plain weave using sweet-twisted multifilament yarn for warp and weft, and the thickness of the fabric is 0. .. configured to be 1 mm or less. As a result, the image could be divided more sharply than in Example 2.

  In Example 4, a coating material of a rubber material is applied from the surface in contact with the ceramic substrate so that the warp and the weft are more bonded. In Comparative Example 3, the coating agent is not applied as this comparison. In Comparative Example 3, the polyurethane elastic yarn is cut only by repeatedly passing the ceramic substrate about 10 times at the same portion of the belt, and further, the urethane fiber is cut small by repeating the cutting, and the warp urethane fiber It was confirmed that the chip crack shape changed significantly.

  On the other hand, in Example 4, even if the polyurethane elastic yarn was cut, it was retained by the coating agent, the urethane fiber was not missing, and the chip cracking shape was satisfactory.

  Further, Comparative Examples 1 and 2 which are conventional molded products have a low friction coefficient of Comparative Example 1 which is a belt having improved rigidity, and the chip crack shape is not good. Moreover, although the comparative example 2 with a high friction coefficient is a favorable result, the required minimum pressure was a result as high as 0.15MPs.

  From the above examples, it was found that the fabric of the surface layer is more preferably used for the weft than the elastic for the warp when the substrate splitting property and the manufacturing process are taken into consideration.

  With respect to the coating treatment for the woven fabric, it is preferable to have a coating treatment rather than no coating treatment, and more preferred to yarn misalignment due to rubbing or the like and yarn breakage.

  As for the coating agent, a resin material is preferable when coating from the back side of the fabric, and a rubber material is preferable when coating from the front side.

  Further, although not described in the examples, if the thickness of the synthetic resin sheet of the intermediate layer is too thin, the resin sheet is deformed at the time of division.

  As described above, the split belt of the present invention can be improved in function as compared with a rubber belt made of a conventional molded product, and is an unprecedented split belt. Furthermore, since the belt has a non-conventional uneven portion on the surface of the belt and has a friction coefficient, the belt can be diverted to other industrial fields.

DESCRIPTION OF SYMBOLS 10 Endless belt for upper chip division 11 Drive roller 12 Idle roller 13 Tension roller 14 Pressure roller 20 Endless belt for lower chip division 20A Base material layer 20B Surface layer 20C Adhesive 20D Back surface layer 20E Adhesive 21 Drive roller 22 Idle roller 23 Tension roller 24 Dividing roller 30, 40 Weaving 31, 41 Warp yarn 32, 42 Weft yarn 32a Weft yarn of elastic yarn of irregular cross section 32b Weft yarn of inelastic yarn 100 Chip dividing device C Ceramic substrate

Claims (6)

In split belt to divide the ceramic substrate dividing groove is formed, the belt has a fabric woven with yarn containing at least elastic fibers, the ceramic base plate, so that the elastic textiles of the fabric is in contact A split belt characterized by comprising. The woven fabric is a woven fabric including at least a yarn including the elastic fiber or a yarn including the elastic fiber and woven from a plurality of yarns including a yarn including the non-elastic fiber, and the yarn including the non-elastic fiber includes made from the yarn of monofilament or multifilament yarn composed of non-elastic fibers, wherein said fine than the yarn made of elastic fibers, or the yarn thread made of inelastic fibers is made of sweet twist to the inelastic fibers flattened the than yarn consisting configured yarn or the elastic fibers comprising the elastic fibers as the inelastic fibers spread thinly configured in the thickness direction, and, before Symbol elastic fibers, have a thicker fiber diameter than said non-elastic fibers The belt surface is formed with uneven portions due to at least one of a texture, a deformation of the yarn made of the non-elastic fiber, or a cross-sectional shape of the elastic fiber and the non-elastic fiber. Is, split belt of claim 1, wherein the convex portion is made of the elastic fibers, convex portion, characterized in that it is configured so as to be in contact with the ceramic substrate of the uneven portion. The fabric is surface on the side in contact with the ceramic substrate of the fabric, composed of the elastic fibers yarns made of yarns or the elastic fiber comprises a weave was woven climb over two or more yarns at least a non-elastic fibrous tissue is a surface exposed many yarns yarns or the elastic fiber comprising the elastic fibers are yarn fabric, according to claim 1, characterized in that it is configured so said surface is in contact with the ceramic substrate Or the split belt of 2.   The split belt is an endless belt made of at least a synthetic resin sheet and further including a base material layer provided with the surface layer being a woven fabric, and the surface layer includes a warp and a weft of the woven fabric, respectively. The split belt according to any one of claims 1 to 3, wherein the split belt is arranged along a circumferential direction and a width direction. The weft, and a yarn made of yarn or the elastic fiber comprising the elastic fibers and yarns composed of non-elastic fibers, at least one of the elastic fibers or the inelastic fibers have a modified cross-sectional shape, said The split belt according to any one of claims 1 to 4, wherein the elastic fiber is a polyurethane fiber.   A split belt according to any one of claims 1 to 5, wherein the surface layer of the split belt is brought into contact with a ceramic substrate on which split grooves are formed and is divided into a plurality of ceramic chips. Chip splitting device.

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