JP5553290B1 - Method for bonding molded thermoplastic resins to each other and underwater apparatus using the method - Google Patents

Abstract

A so-called O-ring is generally used as a waterproof mechanism between casings of underwater devices, and in order to prevent deterioration of LED light-emitting elements used for lighting due to heat, a heat sink for heat dissipation has heat conduction. Aluminum having excellent properties is generally used. For this reason, problems such as flooding of the casing due to O-ring deterioration, seawater corrosion of aluminum, and contact corrosion of dissimilar metals have arisen.
As a waterproof mechanism between casings, a method of bonding using two or more adhesives having different characteristics is adopted, and a high thermal conductive resin (thermal conductivity is used as an alternative to an aluminum heat sink having excellent thermal conductivity. The above-mentioned problem is solved by employing a heat sink made of a thermoplastic resin including a filler having a filler.
[Selection] Figure 1

Description

  The present invention provides a method for adhering molded thermoplastic resins (including highly thermally conductive resins) to each other using an adhesive as a waterproof mechanism in order to enable use in water, and the adhesion method. A method for adhering between casings (translucent cover, case and / or heat sink) of an underwater lighting apparatus using an adhesive, and underwater provided by the adhering method It relates to lighting equipment.

  As a waterproofing mechanism between the casings (translucent cover, case, and / or heat sink) of the underwater lighting apparatus, a seal packing such as a so-called O-ring in which an elastic material is formed in a ring shape is generally used.

In recent years, light-emitting elements composed of semiconductors such as LEDs have been used as illumination elements for underwater lighting fixtures, but degradation of LED light-emitting element illumination due to heat has become a problem. It is known that an LED element generally deteriorates at a high temperature of 100 ° C. or more and shortens its life. Therefore, it is common for LED lighting fixtures to suppress the temperature rise of the light-emitting element by heat dissipation with a heat sink with excellent thermal conductivity, and the heat sink uses a metal such as aluminum with excellent thermal conductivity. Is common. (For example, Patent Document 1 to Patent Document 3).

JP 2003-178602 A JP 2008-071651 A JP 2012-123947 A

  However, as a waterproof mechanism between the casings (translucent cover, case and / or heat sink) described in Patent Document 1 to Patent Document 3, a material rich in elasticity such as silicon rubber is formed in a ring shape. So-called seal packings such as O-rings are generally used. However, if maintenance and inspection of the waterproof mechanism is insufficient, the O-ring will deteriorate due to deterioration over time, and foreign matter may be caught, causing water to enter the casing. There is a problem that it ends up.

  Furthermore, when a metal such as aluminum having excellent thermal conductivity is used for the heat sink, corrosion of aluminum by seawater occurs, and the life of the heat sink (or casing) is shortened. In addition, when a stainless steel screw or the like is used for an aluminum heat sink (or casing), there is a problem that the life of the heat sink (or casing) is shortened due to contact corrosion of different metals.

  In order to solve the above problems, the present invention does not employ a so-called O-ring as a waterproof mechanism, does not use a metal such as aluminum having excellent thermal conductivity as a heat sink, and bonds between thermoplastic resins. It is an object to provide a method and an underwater apparatus using the method, preferably an underwater lighting apparatus.

  Therefore, the present inventor defines an adhesion method using two or more adhesives having different characteristics as well as defining the adhesion length of the abutting surfaces where the thermoplastic resins (between the casings) adhere as the waterproof mechanism. Moreover, the above-mentioned problem is solved by adopting a heat sink made of a high thermal conductive resin (thermoplastic resin including a filler having thermal conductivity) as a substitute for a heat sink made of metal such as aluminum having excellent thermal conductivity. It came to.

（２）接着する突合せ面の形状を本実加工又は相じゃくり加工とすることに特徴を有する（１）項に記載の水中器具の接着方法、
（３）（１）項又は（２）項に記載の接着方法を用いてなる水中器具、
（４）透光性カバー、ヒートシンクは、それぞれ透明性樹脂、高熱伝導性樹脂で構成され、回路側空間には熱伝導性・絶縁性充填剤を充填することに特徴を有する（３）項に記載の水中器具の一つである水中照明器具、及び
（５）ケースから外部電源用ケーブルを導出する箇所を、特性の異なる二以上の接着剤によって充填することに特徴を有する（３）項又は（４）項に記載の水中器具の一つである水中照明器具、
を提供するものである。That is, the present invention
(1) A method of bonding a case used for an underwater device made of two or more molded thermoplastic resins, wherein the bonding length of the butt surface to be bonded is 2.0 times or more the case plate thickness of the underwater device. Or a hard adhesive whose hardness (Rockwell hardness) is in the range of M80 to 125 and a soft adhesive whose hardness (Shore A hardness) is in the range of 30 to 80. using the adhesive method of underwater device having features to be bonded using different Do that adhesives properties in the range of the bonding length ratio 60-80% of a hard adhesive as defined below,

(2) The method for adhering an underwater device according to the item (1), characterized in that the shape of the butted surfaces to be bonded is the actual processing or the laminating processing,
(3) An underwater device using the bonding method according to (1) or (2) ,
(4) translucent cover, the heat sink, the transparent resin, respectively, is composed of a highly thermally conductive resin, the circuit side space characterized in that to fill the thermally conductive, insulative filler (3) in section water luminaire is one of the water appliance according, and (5) a portion for deriving an external power supply cable from the case, characterized in that the filling by two or more adhesive with different properties (3) term or An underwater lighting device which is one of the underwater devices described in (4) ,
Is to provide.

  According to the method for adhering molded thermoplastic resins of the present invention and an underwater apparatus using the method, there is no inundation due to O-ring deterioration, etc., aluminum corrosion by seawater, no foreign metal contact corrosion An instrument can be provided.

  The method for adhering an underwater device of the present invention can be applied to a housing (also referred to as a waterproof case or a waterproof protector) for enabling imaging devices such as cameras and video cameras to be used underwater, Preferably, it can be applied to an underwater lighting apparatus.

  That is, the underwater lighting fixture provided by the bonding method using an adhesive between the casings of the present invention realizes maintenance-free in which necessary maintenance is omitted when a seal packing such as an O-ring is used. At the same time, it is premised on use in water, and because the cooling efficiency of the light emitting element is high with a heat sink made of high thermal conductivity resin, it prevents overheating of the light emitting element and prevents destruction of the light emitting element and shortening of the lifetime. It takes advantage of the long life of LED light-emitting elements.

(A) is sectional drawing regarding 1st Embodiment of the underwater lighting fixture of this invention. (B) is a right side view. It is a schematic diagram which shows the cross-sectional shape of the surface which adhere | attaches using the adhesive agent of thermoplastic resins (between casings) regarding the 1st and 2nd embodiment of the underwater lighting fixture of this invention. It is a schematic diagram which shows the water pressure and the force concerning a junction which a translucent cover receives at the time of diving or floating. (A) is a schematic diagram of the underwater lighting fixture (FIG. 1) regarding the 1st Embodiment of this invention. (B) is a schematic diagram of the underwater lighting fixture regarding the 2nd Embodiment of this invention.

<Definition>
In this document, the “high thermal conductive resin” is a thermoplastic resin including a filler having thermal conductivity. For example, a resin having a thermal conductivity of about 12 W / mK (representative value) is included. The “transparent resin” is transparent and includes, for example, an acrylic resin, a polycarbonate resin, or the like having a total light transmittance of about 88% (representative value) or more.

A “transparent filler” is a transparent filler containing a silicon resin having a total light transmittance of about 88% (typical), and a “thermally conductive / insulating filler” is a thermally conductive filler. The silicon-containing resin contains a filler having a thermal conductivity of about 2 W / mK (typical value) and a volume resistivity of about 4 × 10 ¹³ Ω · m (typical value). Injected with liquid and solidified above room temperature.

  The “adhesion length of the butt surface to be bonded” refers to the total length of each side of the cross-sectional shape of the butt surface to be bonded using an adhesive. Means the filling length of the adhesive layer between the external power cable and the case.

  Hereinafter, embodiments of an underwater lighting apparatus according to the present invention and an underwater lighting apparatus as a specific example will be described with reference to the accompanying drawings. However, the present invention is not limited to the spirit of the present invention. It is not limited to the embodiment.

  First, a first embodiment of the underwater lighting fixture of the present invention will be described with reference to FIG.

  The underwater lighting fixture 1 has a translucent cover 3, a heat sink 4 and a case 5 as a casing 2, and is formed in a conical shape (the shape of the heat sink side opening is a rounded rectangle, and the shape of the power cable side opening is a circle). The case 5 and the translucent cover 3 whose opening shape is formed in a rounded rectangular shape are integrally coupled via a heat sink (opening shape is rounded rectangular shape) 4.

The shape of the opening is a rounded rectangle, but it may be round or oval, and the positional relationship and size are axisymmetric or line symmetric so that distortion does not occur even when water pressure is applied to the casing. It is desirable to be provided.

  An LED substrate 6 is provided on the heat sink 4, and a plurality of LED light emitting elements 7 are mounted on the LED substrate 6. A light emitting circuit (substrate) 8 for causing the LED light emitting elements to emit light and an external power are provided in the case 5. An external power cable 9 is provided for supplying the external power, and the external power cable 9 is led out through a waterproof connector 10 provided in the case 5.

  FIG. 1 shows an example of a separate type in which a battery and a light part are separately configured. If a so-called wireless power supply system can be used, a battery unit with a battery built in a case 5 and a light are provided. It is also possible to configure an underwater lighting apparatus in which the parts are integrated.

  The translucent cover 3 is made of a transparent resin in order to transmit and radiate a light beam emitted from an LED light-emitting element as a light source, and the heat sink 4 and the LED substrate 6 are conventionally used for heat conduction. As a substitute for a metal such as aluminum having excellent properties, it is made of a highly thermally conductive resin. In addition, the LED board 6 which does not contact seawater can also use metals, such as aluminum which was excellent in heat conductivity as usual.

Further, the case 5 is also made of a thermoplastic resin (for example, polycarbonate resin), and a space between these casings (between the translucent cover 3 and the heat sink 4 and between the heat sink 4 and the case 5) is described below as a waterproof mechanism. In this way, the adhesive length between the casings of underwater lighting fixtures, that is, the adhesive length of the butting surfaces to be bonded is prescribed, and an adhesive method such as bonding using two or more adhesives having different characteristics is adopted. Yes.

Sudden water pressure (pressure) fluctuations are applied to underwater equipment during diving and ascent. This causes fluctuations in the “strain” distribution, and it is considered that a crack occurs in the bonded portion using the adhesive due to the internal stress generated by the strain, and the phenomenon that water intrudes into the underwater device occurs. The present invention provides an adhesion method that can cope with this water pressure fluctuation and that prevents cracks in the adhesion portion.

Here, the maximum sudden water pressure fluctuation is assumed to be 10 m / min. This is the maximum diving / floating speed that does not affect the human body (Leisure Diving Accreditation Promotion Council (a constituent organization of 10 C card issuing organizations) And a method of adhering using an adhesive capable of withstanding the diving / floating speed.

  In addition, although the influence of thermal stress due to different linear expansion coefficient of each material used can be considered, it is a lighting fixture used underwater, and the heat rise by the heat sink suppresses the temperature rise of the light emitting element, the effect is It is considered small.

  Two or more adhesives having different characteristics are an epoxy hard adhesive whose hardness (Rockwell hardness) ranges from 80 to 125 and a urethane system whose hardness (Shore A hardness) ranges from 30 to 80. A soft adhesive is used as a standard, but if necessary, a soft silicone adhesive having a softness and an adhesive hardness (Shore A hardness) in the range of 5 to 25 may be used.

As a soft adhesive having a hardness range of 30 to 80 (Shore A), McNETT, aqua seal, etc. are preferable, and a softer adhesive having a hardness range of 5 to 25 (Shore A). As the agent, Satsuma Research Institute Co., Ltd., RZ and the like are suitable, and as the hard adhesive, the hardness can be adjusted by blending a filler into the epoxy resin.
It is considered that the interaction between the soft adhesive and the hard adhesive absorbs the fluctuation given to the casing caused by the pressure fluctuation due to sudden diving and levitation, and prevents water from entering the bonded portion.

The bond length between the casings (the bond length of the butt surfaces to be bonded) is the total length of the bond length bonded with the hard adhesive and the bond length bonded with the soft adhesive. Is the length of 2.0 mm or more of the case plate thickness of the underwater apparatus or 10 mm or more, whichever is longer, and the bond length ratio (hereinafter referred to as bond length ratio) of the hard adhesive defined below is 60 The range is ˜80%.

  If the bond length ratio of the hard adhesive is lower than 60%, it cannot withstand the water pressure fluctuation applied to the bonded portion of the underwater lighting fixture, and cracks (the load on the soft adhesive portion is not applied to the casing). This is because a crack due to peeling of the soft adhesive part becomes higher, and when it is higher than 80%, the pressure fluctuation absorbing ability due to the interaction between the soft adhesive and the hard adhesive is insufficient and abrupt. This is because a crack occurs in the bonded portion without being able to follow the water pressure fluctuation.

For the purpose of application of such soft adhesive and hard adhesive, it is desirable to use the soft adhesive on the outer side of the casing (the side in contact with seawater). Further, as described above, a softer adhesive can be applied as necessary.

  The bonding length of the butting surfaces to be bonded is 2.0 times or more of the case plate thickness of the underwater device or 10 mm or more, whichever is longer, which is abrupt when the bonding length is not secured. This is because fluctuations applied to the casing caused by pressure fluctuations due to diving and levitation cannot be absorbed, and inundation occurs in the casing.

In addition, the shape of the abutting surface to be bonded is a phase burr processing or actual processing, but it is a shape of the abutting surface necessary for ensuring the above-mentioned bonding length, and such a shape is thermoplastic. When the resin molded products are bonded to each other using an adhesive, it is a shape that can absorb variations in the processing accuracy of the butted surfaces and ensure a uniform thickness of the adhesive. An example of the shape is shown in FIGS. 2 (c) and 2 (d), respectively, and examples of actual machining are shown in FIGS. 2 (e) and 2 (f). The case where the left and right sides of each figure are reversed is also included, and in the case of phase pricking, the case of processing at the center in the thickness direction is also included.

  In order to improve the strength of the adhesive surface, the surface roughness Ra of the surface that is the mutual adhesive surface between the casings (translucent cover, heat sink and / or case) is effective when it is 1 μm or more, When the surface roughness Ra is 150 [mu] m, the surface roughness Ra is preferably in the range of 1 to 120 [mu] m because an effect commensurate with it cannot be obtained although the time and labor required for the surface roughness processing increase.

An LED as a light source is provided in a space (hereinafter referred to as a light-transmitting cover side space 11) with an LED substrate 6 (LED light emitting element as a light source is mounted) provided on the translucent cover 3 and the heat sink 4. In order to transmit and irradiate the light beam emitted from the light emitting element, it is transparent and can be filled with a filler for the purpose of removing air from the light-transmitting cover side space in order to prevent internal condensation.
If the prevention of condensation is insufficient, there is a problem that, for example, the solder portion of the mounting substrate on which the LED light emitting element is mounted by soldering deteriorates and the life is shortened. Moreover, when fogging due to condensation occurs on the translucent cover, it may cause a hindrance to the field of view.

  In the case where the filler is not filled, because of the influence of water pressure, for example, the air becomes one-half when diving 10 m and one-third when diving 20 m. Although the cover is distorted, it can be prevented by filling the filler (in the case where the filler is not filled, it is necessary to increase the strength of the translucent cover to prevent water pressure destruction). In addition, due to the effect of this strain, a pressing force and a peeling force (refer to the schematic diagram of FIG. 3; opposite forces are applied depending on the direction of phase crushing) are also applied to the bonded part when diving or floating. This can also be prevented.

  This filler is composed of a transparent filler (for example, Satsuma Research Institute, Inc., R6). When filling this space with a filler, if the air is not completely removed and air is trapped, It can also cause damage from that part. It is important to perform a defoaming process (evacuation, vibration process, etc.).

  The light-transmitting cover side filler preferably has thermal conductivity in order to dissipate heat generated by the light emitting element as a light source, but a filler having thermal conductivity while having transparency is used. Since it does not exist (transparency is inhibited when a thermally conductive filler is contained), the above filler is selected. In addition, by examining the problem of liquid leakage, the application of silicone oil (liquid), which is used to improve the pressure resistance performance of divers' watches, can be selected. Need to be considered.

In the space between the LED substrate 6 and the case 5 provided in the heat sink 4 (hereinafter referred to as the circuit side space 12), a light emitting circuit for causing the light emitting element to emit light is insulated, and heat generated by the light emitting circuit is dissipated through the heat sink. In order to achieve this, it is filled with a filler having insulating properties and thermal conductivity.
In addition, by filling the filler, the air is removed from the circuit side space to prevent internal condensation, the presence of air (gas) prevents the destruction of water pressure, and the effect on the bonded part The point of preventing (pressing force, peeling force) is the same as the effect of the filler in the translucent cover side space.

The thermally conductive / insulating filler is composed of a silicone filler containing a thermally conductive filler (for example, Satsuma Research Institute, Inc., R4M3). (Drawing, vibration treatment, etc.) is the same as in filling with the light-transmitting cover side filler.

  Moreover, in order to ensure the watertightness between the external power supply cable 9 and the case 5 necessary for the underwater lighting fixture of the present invention, an underwater lighting fixture that does not use a waterproof connector can also be implemented. In other words, the adhesive length of the external power supply cable is 16 mm in design, but two or more adhesives having different characteristics such as a hard adhesive and a soft adhesive are used, and the adhesive length ratio of the hard adhesive is 60 to 90. %, The portion where the cable for the external power supply is led out from the case is filled with an adhesive, so that water can not enter as in the case of integrally molding with resin.

  In this case as well, it is desirable to use the soft adhesive on the side in contact with seawater. Since it is necessary to be used as a cushioning material for mitigating the bending of the external power supply cable and the impact from the outside by grasping and lifting the external power supply cable, the adhesion length ratio of the hard adhesive is set to 60. ~ 90%. Further, as described above, a softer adhesive can be applied as necessary.

  Further, by filling the translucent cover side space and / or the circuit side space with the filler, it is possible to obtain the effect of suppressing the buoyancy of the underwater lighting fixture. Along with the weight reduction by adopting the high heat conductive resin made as a substitute for the metal heat sink (or casing) that has been conventionally used, the unstable factor due to the light weight in water is also eliminated.

  FIG. 4B shows a schematic diagram of a second embodiment in which the underwater lighting fixture 1 of the present invention is configured by a translucent cover 3 and a case 5 as the casing 2, and the case 5 also serves as a heat sink. . As can be understood by comparison with the schematic diagram of the first embodiment shown in FIG. 4A, the case 5 in this case also has a function as a heat sink, and thus is made of a highly thermally conductive resin. .

  In addition, as a matter of course, the bonding location by the adhesive is one location between the translucent cover 3 and the case 5 with respect to the two locations of the first embodiment, but the first implementation except these changes. It is the same as the form.

As described above, the method of adhering between the underwater lighting fixture casings of the present embodiment using an adhesive and the underwater lighting fixture using the method, the corrosion in the case of using a metal such as aluminum as the casing material. Problems, such as deterioration when using a so-called O-ring as a waterproof mechanism, can be solved.

(Test Example 1: Bonding length between casings, bond length ratio of hard adhesive, and relationship between cracks)
Translucent cover made of polycarbonate resin (Teijin Chemicals, Panlite L-1225ZL), high thermal conductive resin (carbon fiber-containing polycarbonate resin, Panlite HV-5600C) as underwater lighting equipment casing A heat sink made of polycarbonate and a case made of polycarbonate resin (Teijin Chemicals Ltd., Panlite G-3110PH) were used.

In addition, silicon resin (Satsuma Research Institute, R4M3), which is a thermally conductive and insulating filler, is used as a circuit side filler, and silicon resin (Satsuma Research Institute, Ltd.), which is a transparent filler, as a transparent cover side filler. In the case of filling with a filler using a company, R6), defoaming treatment by vibration (Sinfonia Technology Co., Ltd., small vibration device, vibrator repacker VP-4D) was performed.

  Next, the bonding length of the butt surfaces to be bonded, a multiple of the plate thickness (the case plate thickness is 5 mm, a multiple thereof), the bonding length of the hard adhesive, and the bonding length ratio (%) of the hard adhesive Using the value described in No. 1, the presence or absence of cracks in the bonded portion was investigated using a water pressure test tester manufactured by Toyoka Sangyo Co., Ltd. at a diving ascent speed of 4, 100, 1000, and 2000 m / min. .

In addition, 80M made by Satsuma Research Institute Co., Ltd. was used as the hard adhesive, and the soft adhesive was used on the outer side of the casing (surface in contact with seawater) as the soft adhesive, McNETT. In addition, the presence or absence of cracks in the bonded portion was visually determined using a magnifying glass 6 times as to whether or not the underwater lighting apparatus used in this test was submerged. The maximum pressure corresponds to a diving depth of 150 m. The diving ascent speed is 1000 and 2000 m / min, and the diving speed is 100 m / min, and the ascent speed is only 1000 and 2000 m / min. The results are shown in Table 1.

  From Table 1 (upper table), when the bonding length of the butt surface to be bonded is 2.0 times or more of the case plate thickness or 10 mm or more, and from Table 1 (lower table), the bonding length of the hard adhesive When the ratio is 60 to 80%, it is understood that cracks are not generated in the bonded portion even with a rapid fluctuation in water pressure (pressure) where the flying speed is 2000 m / min. That is, it is considered that the fluctuation is absorbed by the interaction of the hard adhesive and the soft adhesive against the sudden pressure fluctuation.

(Test Example 2: Relationship between hardness of hard adhesive and occurrence of cracks)
The effect of the hardness of the hard adhesive when the bonding length of the butt surfaces to be bonded in Test Example 1 was 14 mm and the bonding length ratio of the hard adhesive was 70% (corresponding to No. 8 in Table 1) was investigated. The results are shown in Table 2.

  From Table 2, the hardness of the hard adhesive was changed to M60 to 110 with respect to the Shore A hardness 30 of the soft adhesive, and as a result, in the case of M80 to 110, it was found that no crack was generated in the bonded portion. Understood.

(Test Example 3: Relationship between filling of transparent cover side filler and condensation, pressure resistance (water pressure) performance)
Investigate the effect of the presence or absence of filler when the light-transmitting cover side space is filled with air and silicon resin (Satsuma Research Institute, R6) as the light-transmitting cover side filler (transparent filler) did. The underwater lighting fixture used is the same as in Test Example 1 (corresponding to No. 8 in Table 1), and the circuit-side filler uses the same filler as in Test Example 1, and when filling the filler, defoaming treatment by vibration (Symphonia Technology Co., Ltd., small vibration device, vibrator repacker VP-4D).

Next, using a water pressure tester (Toyo Sangyo Co., Ltd.), a load was applied at a speed of 10 m / min to a water pressure of 0.3 MPa, 0.5 MPa, and 1.0 MPa corresponding to a water depth of 30, 50, and 100 m. After that, we investigated whether the underwater lighting fixtures were submerged. The investigation for the presence or absence of condensation is based on visual observation. The survey results are shown in Table 3.

According to Table 3, it is understood that when the translucent cover side space is filled with the translucent cover side filler (transparent filler), there is an effect in preventing hydraulic breakdown (improvement of pressure resistance). This is considered to be the effect of using a transparent silicon resin having a smaller shrinkage rate than the air (pressure). Moreover, when filling with the translucent cover side filler, as a result of visual observation, dew condensation does not occur, and it is considered that the effect of eliminating air is produced.

(Test Example 4: Filling and condensation of circuit side filler, watertightness investigation between power cable and case)
The circuit side space is filled with a silicon-based resin (Satsuma Research Institute, R4M3) containing a heat conductive filler as a circuit side filler, and the waterproof connector 10 is not used and the external power cable is bonded around the waterproof connector. The length was 16 mm, and the adhesive length of the hard adhesive was set to a value shown in Table 4 and filled with a hard adhesive and a soft adhesive. The other conditions were No. 8 in Table 1, but when the circuit side filler was filled, the defoaming treatment (by vibration) was performed as described above, and the soft adhesive was on the side in contact with seawater. Used for.

Next, using a water pressure tester (Toyo Sangyo Co., Ltd.), a load was applied at a speed of 10 m / min up to a water pressure of 0.5 MPa corresponding to a water depth of 50 m, held for 1 hour, and then returned to the same speed. However, this operation was repeated 10 times to investigate the presence or absence of water (watertightness) between the power cable of the underwater lighting fixture and the case. The investigation for the presence or absence of water immersion is performed by cutting the relevant part, and the results of the investigation are shown in Table 4. The light-transmitting cover side space was tested without being filled with a filler.

In addition, the diving depth in recreational diving is about 40 meters for specialty divers, and this 40 meters is the limit. Therefore, a water pressure of 0.5 MPa corresponding to a water depth of about 50 m was set as the water pressure of this test.

From Table 4, when the adhesion length of the external power cable is 16 mm and the adhesion length ratio of the hard adhesive is 60 to 90%, a hard adhesive and a soft adhesive are used instead of the waterproof connector. It is understood that the watertightness between the power cable 9 and the case 5 is ensured by filling. In each case, the relevant part was cut and observed, but in the case of No1, the hard adhesive peeled off due to fluctuations in water pressure, and in the case of No5, there was no water immersion, but the external power cable was The bending of the external power supply cable due to gripping and lifting occurred due to the lack of soft adhesive, and was judged to be problematic.

From the above, it is shown that the waterproof connector can be omitted by applying the bonding method adopted this time. In addition, when investigating whether there was water immersion (cutting the relevant part), we also examined the presence of condensation, but there was no condensation, and even in the circuit side space, air in the circuit side space was excluded and the filler was filled. It is thought that dew condensation is also prevented.

DESCRIPTION OF SYMBOLS 1 Underwater lighting fixture 2 Casing 3 Translucent cover 4 Heat sink 5 Case 6 LED board 7 LED light emitting element 8 Light emitting circuit 9 External power supply cable 10 Waterproof connector 11 Translucent cover side space 12 Circuit side space 13 Arm attachment part 14 Switch

Claims (5)

A method of bonding a case used for an underwater device made of two or more molded thermoplastic resins, wherein the bonding length of the butt surface to be bonded is 2.0 times or more the case plate thickness of the underwater device or 10 mm or more The harder one of which is longer, and the hardness (Rockwell hardness) range is M80-125 and the hardness (Shore A hardness) range is 30-80. , method of adhering water appliance having features to be bonded using different Do that adhesives characteristics that the adhesion length ratio of the hard adhesive as defined below in the range of 60-80%.

The method for adhering an underwater device according to claim 1, wherein the shape of the butted surfaces to be bonded is a real processing or a phase pricking processing. An underwater device using the bonding method according to claim 1 or 2 . The underwater according to claim 3 , wherein the translucent cover and the heat sink are each made of a transparent resin and a high thermal conductive resin, and the circuit side space is filled with a thermal conductive and insulating filler. One of the fixtures is an underwater lighting fixture. The underwater lighting fixture which is one of the underwater fixtures of Claim 3 or Claim 4 which fills the location which guides the cable for external power supplies from a case with two or more adhesives from which a characteristic differs.

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