JP5550824B2 - Resin sealing method and apparatus - Google Patents

Description

  The present invention relates to a technical field of a resin sealing device that seals a molded product (including a lead frame) on which a semiconductor element is arranged with a resin.

  Conventionally, in a resin sealing apparatus having a plurality of molds, a vacuum pump as a pressure reducing mechanism is installed for each mold, and the pressure reducing timing of the mold is controlled for each mold. Recently, due to energy saving, equipment cost reduction, etc., one vacuum pump is used for a plurality of molds (also referred to as dual-use). When a resin sealing operation is performed with a plurality of molds, After completion of the resin sealing operation (referred to as a pre-press) in the preceding mold in which the resin sealing operation is performed first so that the steps related to decompression do not overlap, the next resin sealing operation is performed Resin sealing operation (referred to as the next press) in the row mold was started.

  However, when the next press is performed after completion of the first press in the molds that also serve as the vacuum pump, the production capacity is reduced.

  Therefore, in Patent Document 1, even if a single vacuum pump is shared by a plurality of molds, the ability of the vacuum function is increased by using a vacuum tank in combination with the vacuum pump, and the air in each mold is increased. Is efficiently and reliably discharged to the outside. That is, it has been suggested that even if a plurality of dies are used, a large delay is not caused in the next press.

Japanese Patent Laid-Open No. 9-290443

  However, in Patent Document 1, the vacuum tank needs a certain volume in order to enable quick execution of evacuation. In other words, since the vacuum tank needs to have a certain size, Patent Document 1 reduces the effect of reducing the cost and reducing the compact aspect of the resin sealing device obtained by using a single vacuum pump. It is thought that. On the other hand, a method of increasing the vacuum capacity of the vacuum pump itself is also conceivable. However, even in this case, there is a problem that there is no substitute for reducing the effect of reducing the size and cost of the resin sealing device by increasing the size of the vacuum pump.

  The present invention has been made to solve such problems, and can use a plurality of molds without diminishing the effects of downsizing and cost reduction caused by the combined use of a vacuum pump. The purpose is to enable efficient resin sealing.

The present invention relates to a resin sealing method comprising a plurality of molds, depressurizing the molds, and performing resin sealing, and a preceding mold in which a resin sealing operation is performed before the plurality of molds. At the end of the decompression , the mounting operation of the molded product to the subsequent mold in the resin sealing operation in the subsequent mold in which the resin sealing operation is performed next to the preceding mold is completed , And the said subject is solved by making it the decompression period of the said preceding metal mold | die and the decompression period of the said following metal mold | die not overlapping.

  In the present invention, when the decompression mechanism is also used, energy saving and cost reduction obtained by using the decompression mechanism instead of increasing the ability of the decompression function, which has an effect of directly improving the decompression capability, are achieved. In order to make the most of the characteristics of compactness and compactness, focus on the method of controlling the pressure reduction timing, and the next press (resin sealing in the subsequent mold) to the previous press (resin sealing operation in the preceding mold) (Operation) delay was reduced. That is, the next press is started before the completion of the pre-press so that the decompression period of the preceding mold and the decompression period of the succeeding mold do not overlap.

  As a result, even if the decompression mechanism is also used, the decompression period for the preceding die and the succeeding die is not prolonged, and the delay of the next press with respect to the previous press can be reduced.

  Here, the method for preventing the pressure reduction period of the preceding mold and the pressure reduction period of the succeeding mold from overlapping does not have any particular limitation. For example, when the decompression of the succeeding mold is started at the end of the decompression of the preceding mold, the overlap between the decompression period of the preceding mold and the decompression period of the succeeding mold can be surely prevented and The delay of the next press relative to the press can be minimized. However, the start time of decompression in the mold is extremely closely related to the time of loading the molded product or the resin tablet for molding into the mold. That is, since they greatly affect the molding conditions of the molded product, it is difficult to independently change and adjust only the mold decompression start timing from those timings.

  For this reason, one of the specific configurations of the present invention includes a molded product supply unit and a plurality of molds, and takes out the molded product from the molded product supply unit according to the plurality of molds. In a resin sealing method in which the mold is decompressed, the mold is decompressed, and the product to be molded is resin-sealed, a preceding mold in which a resin sealing operation is performed ahead of the plurality of molds Time TGE1 from the completion of loading of the molded product to the mold until the end of decompression of the mold, and from the molded product supply unit to the subsequent mold in which the resin sealing operation is performed next to the preceding mold When the time TGS1 is longer than the time TGS2 as a result of the comparison between the step of knowing the time TGS2 from the removal of the molded article to the start of pressure reduction, the step of comparing the time TGE1 and the time TGS2 , At least after completion of loading of the molded product into the preceding mold The start of the removal of the molded product from the subsequent mold is delayed by a time corresponding to the difference between the time TGE1 and the time TGS2, and when the time TGE1 is equal to or less than the time TGS2, And a step of starting to take out the molded product from the succeeding mold when loading of the molded product is completed.

  As a result, in the case where the time TGE1 is longer than the time TGS2, it is possible to start taking out the molded product from the succeeding die before the completion of the time TGE1 in the preceding die. The time when TGS2 overlaps in the process can be offset. That is, in this case, the delay of the next press can be minimized. Here, when the measured values of the time TGE1 and the time TGS2 are reliable, a method of taking the difference as it is is effective. In consideration of the reliability, the difference between the time TGE1 and the time TGS2 may be slightly larger than the actual difference. Even when the time TGE1 is equal to or less than the time TGS2, since the removal of the molding product from the succeeding mold is started when the molding product is completely loaded into the preceding mold, the time TGE1 and the time TGS2 overlap in the process. It is possible to cancel (described later). That is, even if there are a plurality of molds, the delay of the next press can be reduced without changing the molding conditions of the molded product, and efficient resin sealing can be achieved.

  A specific method for knowing the time TGE1 and the time TGS2 is not particularly limited. Actual measurement may be actually performed, or previous measurement values may be extracted as information. In this case, the actual measurement value in the past may be used, or some actual measurement values may be taken into consideration.

  Since the molded product is taken out from the molded product supply unit to the preceding mold and loaded, the molded product is taken out from the molded product supply unit and loaded into the subsequent mold. A mechanism (loading mechanism) for loading a molded product into a plurality of molds can also be used. That is, since there are a plurality of mechanisms that are also used for a plurality of molds, resin sealing can be performed in a more compact manner.

  Further, the above-described resin sealing method can be realized by providing a holding means, a comparing means, and a processing means in a resin sealing apparatus having a pressure reducing mechanism and a loading mechanism that are also used for a plurality of molds. it can. In that case, the resin sealing device can be reduced in cost, and can efficiently perform resin sealing while being compact.

  By applying the present invention, it is possible to realize efficient resin sealing using a plurality of molds without diminishing the effects of downsizing and cost reduction caused by sharing the vacuum pump to be used. .

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic configuration diagram showing an apparatus mechanism unit of a resin sealing device according to an embodiment of the present invention, FIG. 2 is a block diagram showing the relationship between the device mechanism unit and the device control unit of the resin sealing device, and FIG. Fig. 4 is a schematic diagram showing the resin sealing operation in one mold, and Fig. 4 is the first press (resin by the preceding mold) in the first shot (the first resin sealing operation of both the preceding mold and the succeeding mold). Schematic diagram showing the timing of the sealing operation) and the subsequent press (resin sealing operation by the following mold), FIG. 5 is also the second shot (the next resin sealing operation of both the preceding mold and the following mold) ) Is a schematic diagram showing the timing of the pre-press and the post-press when the time TGE1 is smaller than the time TGS2, and FIG. 6 shows the timing of the pre-press and the post-press when the time TGE1 in the second shot is the same as the time TGS2. Schematic diagram illustrating the timing, Fig. 7 is also a schematic view, showing the timing of the previous presses and rear press when the time TGE1 is less than the time TGS2 in the second shot.

  First, a schematic configuration of the resin sealing device according to the present embodiment will be described with reference to FIGS. 1 and 2. The resin sealing operation refers to the process from the preparation of the molded product to the removal of the molded product from the mold, and specifically comprises a series of operations shown in FIG.

  As shown in FIG. 1, the resin sealing device 100 includes a device mechanism unit 102, in which a vacuum pump 104 that is a pressure reducing mechanism, a molding product supply unit 110 that supplies a molding product, and a vacuum pump 104. , Which is a loading mechanism that loads the molds 118 and 120 together with two molds (molds 118 and 120) in which the inside of the mold is decompressed and the molds 118 and 120. 124. That is, the resin sealing device 100 includes a molded product supply unit 110 and molds 118 and 120, and takes out the molded product from the molded product supply unit 110 according to the molds 118 and 120. 120, the mold 118, 120 is decompressed, and the molded product can be resin-sealed.

  Furthermore, the resin sealing device 100 includes a device control unit 140 for controlling the device mechanism unit 102 as shown in FIG. The apparatus control unit 140 includes a holding circuit 142 that is a holding unit, a comparison circuit 144 that is a comparison unit, and a processing circuit 146 that is a processing unit. The holding circuit 142 is configured to reduce the pressure of the mold 118 after completion of the loading of the molded product into the mold 118 which is the preceding mold for which the resin sealing operation is performed first of the two molds 118 and 120. Time TGE1 until the end, and time TGS2 from the removal of the molded product from the molded product supply unit 110 to the mold 120, which is a subsequent mold for which the resin sealing operation is performed next to the mold 118, to the start of pressure reduction And hold (to know). The comparison circuit 144 compares the time TGE1 and the time TGS2. When the time TGE1 is longer than the time TGS2 as a result of the comparison by the comparison circuit 144, the processing circuit 146 delays the start of the removal of the molded product from the mold 120 until the time TGE1 has elapsed in the mold 118. Or after completion of loading of the molded product into the mold 118, the start of taking out the molded product from the mold 120 is delayed at least by a time corresponding to the difference between the time TGE1 and the time TGS2 (difference time TF). To process. In any case, the processing circuit 146 starts the resin sealing operation in the mold 120 before the resin sealing operation in the mold 118 is completed, and the pressure reducing operation DV of the mold 118 is performed. Processing is performed so that the period (decompression period) and the period during which the decompression operation DV of the succeeding mold 120 is performed (decompression period) do not overlap. Then, when the time TGE1 is equal to or less than the time TGS2, the processing circuit 146 performs processing so as to start taking out the molding product from the mold 120 when loading of the molding product into the mold 118 is completed.

  Hereinafter, each component of the resin sealing device 100 will be described in detail.

  As shown in FIG. 1, the device mechanism unit 102 of the resin sealing device 100 mainly includes a vacuum pump 104, a molded product supply unit 110 provided on the base 108, a resin tablet supply unit 116, and a mold. 118 and 120 and a molded product storage section 132.

  There is one vacuum pump 104 as a decompression mechanism, and it is connected to the molds 118 and 120 via the valve mechanisms 106A and 106B. That is, the vacuum pump 104 is also used as the molds 118 and 120. The valve mechanisms 106A and 106B include a decompression valve and a leak valve (not shown), and open and close the decompression valve and the leak valve based on a command from the apparatus control unit 140. When the pressure reducing valve is opened, the vacuum pump 104 can communicate with the inside of the molds 118 and 120 to reduce the pressure inside the molds 118 and 120. When the decompression valve is closed, the vacuum pump 104 and the molds 118 and 120 are shut off, and the decompression of the molds 118 and 120 is interrupted. When the leak valve is opened, the depressurized state of the molds 118 and 120 is destroyed, and when the leak valve is kept closed, the depressurized state of the mold 118 and the mold 120 can be maintained. For example, when the mold 118 is decompressed, the valve mechanisms 106A and 106B are controlled so that the decompression valve of the valve mechanism 106A is opened and the leak valve is closed, and at that time, the decompression valve of the valve mechanism 106B is closed. .

  As shown in FIG. 1, the molded product supply unit 110 includes a plurality of magazines 110 </ b> A, and stores molded products from the direction of the arrow A. Then, the product to be molded is transported onto the turning table 112 by a transport hand (not shown). The swivel table 112 arranges the orientation of the placed molding product, and the molding product is arranged in two preheater portions 114. The preheater unit 114 has a function of raising and holding the arranged molded articles to a specific temperature.

  In the resin tablet supply unit 116, as shown in FIG. 1, a resin tablet used for resin sealing is supplied from a portion indicated by an arrow B. The supplied resin tablet and the product to be molded are conveyed by a loader 124 on an X direction guide 122 laid over the entire X direction on the base 108 (the loader 124 is transferred to two molds 118 and 120. Combined use). The article to be molded and the resin tablet to be conveyed are set in the molds 118 and 120.

  The molds 118 and 120 are composed of an upper mold and a lower mold (not shown). The molds 118 and 120 are connected to one vacuum pump 104 via valve mechanisms 106A and 106B, respectively. In the molds 118 and 120, the lower mold moves relative to the fixed upper mold, and the lower mold is in close contact with the upper mold (the mold clamping is completed in the close contact state), so that the product to be molded is resin-sealed. A closed space (referred to as a cavity) is formed. In addition, the molds 118 and 120 extrude a resin tablet set in a predetermined place of the molds 118 and 120 in a melted state with a plunger, and introduce the molten resin into the cavity through the resin flow path. It has a configuration (known as a structure for transfer molding). The mold 118, 120 is depressurized by the vacuum pump 104, so that moisture in the cavity is removed. At the same time, air can be prevented from entering during resin sealing, and the resin can reach even minute parts of the molded product, so that voids can be suppressed and the molded product can be sealed with high quality. can do. The molds 118 and 120 can each be changed in temperature, but are kept at a constant temperature here.

  As shown in FIG. 1, the unloader 126 is movable in the X direction on the X direction guide 122, takes out a molded product (referred to as a molded product) molded by the dies 118 and 120, and moves it onto the cooling stage 128. . In the cooling stage 128, the molded product is arranged for a predetermined time and cooled. The cooled molded product is moved to the gate break portion 130, and an unnecessary portion (referred to as a cull portion) of the molded product is separated (gate break). Then, the cull portion is taken out from the portion indicated by the arrow C. Further, the molded product from which the cull portion is cut off is moved to the molded product storage unit 132. Then, the molded product is stored in the magazine 132A and then taken out in the direction of the arrow D.

  The holding circuit 142 receives electrical signals related to the operation start time and operation end time of each component of the device mechanism unit 102 from each component of the device mechanism unit 102, and operates the operation time of each component of the device mechanism unit 102. And the operation timing between each component can be held (know). The holding circuit 142 can calculate and output the addition time of the operation time for some of the components of the device mechanism unit 102. For this reason, the holding circuit 142 measures the time TGE1 from the completion of the loading of the molded product to the mold 118 until the end of the pressure reduction of the mold 118, and the mold in which the resin sealing operation is performed next to the mold 118. The time TGS2 from the removal of the molded product from the molded product supply unit 110 to the mold 120 to the start of pressure reduction can be held and output. The holding here assumes that the holding circuit 142 has a measuring function and temporarily holds it in order to actually measure and process the data, and the original data is lost during the processing. May be. However, a storage area may be provided and stored in a specific area in the holding circuit 142, or the measurement function may be prepared externally.

  The comparison circuit 144 receives the output from the holding circuit 142 and compares the output data with the data stored therein, the data from the processing circuit 146, or other output data from the holding circuit 142. The difference data that is the result can be output. That is, the comparison circuit 144 compares the time TGE1 obtained by the holding circuit 142 with the time TGS2, and outputs the difference time TF shown in Expression (1).

    TF = TGE1-TGS2 (1)

  The processing circuit 146 outputs a control signal to each component of the resin sealing device 100 and controls each component to control the entire resin sealing operation. At the same time, it receives signals from each component and processes them. For this reason, as a result of the comparison in the comparison circuit 144, the processing circuit 146 has received the molding from the molded product supply unit 110 for the mold 120 to which the resin sealing operation is performed next to the mold 118 to which the resin sealing operation is performed first. It is possible to adjust the timing for taking out the molded product, that is, the timing for starting the pressure reduction with respect to the mold 120.

  More specifically, as a result of comparison by the comparison circuit 144, when the time TGE1 is longer than the time TGS2 (TGE1> TGS2), the difference between the time TGE1 and the time TGS2 is completed after the completion of loading of the molded product into the mold 118. For the time corresponding to (difference time TF), the start of the removal of the molded product from the mold 120 is delayed, and the process of delaying the start of pressure reduction of the mold 120 is performed. That is, the start time of the next press PR2 (resin sealing operation by the mold 120) is set to the mold 118 in the first press PR1 (resin sealing operation by the mold 118) by the difference time TF obtained by the equation (1). Each component is controlled so as to be delayed from the completion of the loading of the molded product. When the time TGE1 is equal to or less than the time TGS2 (TGE1 ≦ TGS2), each component is controlled so as to start taking out the molded product from the mold 120 when the molding product is completely loaded into the mold 118. When the time TGE1 is longer than the time TGS2 (TGE1> TGS2), the start of the removal of the molded product from the mold 120 may be delayed until the time TGE1 has elapsed in the mold 118.

  In addition, the processing circuit 146 performs the first press (first resin sealing operation of both dies 118 and 120) and the second shot (next resin sealing operation of both dies 118 and 120) and the first press PR1. The operation timing of the next press PR2 can be set separately. Specifically, in the first shot, the mold 120 to be molded next for the resin sealing operation until after the completion of the time TGE1 in the mold 118 for which the resin sealing operation is uniformly performed first. After the second shot after delaying the start of taking out the product, starting the decompression according to the judgment of the process for delaying the timing of the decompression start for the mold 120 to which the resin sealing operation is performed next. Can be adjusted.

  As described above, the essential function of the processing circuit 146 of the present embodiment is to adjust the pressure reduction start timing for the mold 120 that is the succeeding mold. However, the start time of decompression of the mold 120 has a very close relationship with the time of loading the molded product or the resin tablet for molding into the mold 120. Specifically, the resin tablet is melted by heat and hardened by heat. For example, after the molded product is taken out from the molded product supply unit 110, if the molded product is left for a long time in the preheater unit 114, the preheating time is increased. It becomes necessary to adjust resin sealing conditions such as temperature, pressure, and time in the mold 120 due to the increase in length. That is, since they greatly affect the molding conditions of the molded product, it is difficult to independently change / adjust the decompression start timing of the mold. For this reason, in the present embodiment, the processing circuit 146 performs adjustment including the time to take out the molded product corresponding to the pre-process of starting the pressure reduction of the mold 120. In other words, since the adjustment is performed including the time to take out the molded product, the molding condition of the molded product is not changed, the stable quality of the molded product is ensured, and the delay of the next press PR2 is reduced. can do.

  Next, the resin sealing operation when one mold 118 of the resin sealing device 100 is used will be described with reference to FIG. 3 until the unloader 126 takes out the molded product.

  In FIG. 3, the vertical axis shows the operation of the main components, and the horizontal axis shows the resin sealing operation PR.

  First, the turning preheating operation RP is performed. More specifically, the molded product is conveyed from the molded product supply unit 110 to the turntable 112. This conveyance is performed by a conveyance hand (not shown). When one molded product is conveyed to the turntable 112, the turntable 112 rotates. Thereafter, another molded product is conveyed to the turntable 112 by the transfer hand, and a total of two molded products are arranged on the turntable 112. Then, the two molded articles are simultaneously conveyed to the preheater unit 114 by the loader 124. In the preheater unit 114, the product to be molded is heated to a predetermined temperature and kept warm. This turning preheating operation RP is performed by time T1. The resin tablet is supplied from the resin tablet supply unit 116.

  Next, the mounting operation LD is performed. More specifically, the article to be molded and the resin tablet kept warm in the preheater unit 114 are conveyed to the molds 118 and 120 by the loader 124 and mounted at predetermined positions. This mounting operation LD is performed between times T1 and T2.

  Next, the mold operation MS is started. More specifically, the lower mold of the mold 118 starts moving toward the upper mold. In addition, the vertical axis | shaft in FIG. 3 of metal mold | die operation | movement MS shows the movement distance toward the upper mold | type of a lower mold | type. Point D2 at time T2 is a point at which the lower mold starts moving toward the upper mold, and also serves as a mold clamping start position. A point D3 at time T3 indicates an intermediate mold clamping position where the lower mold and the upper mold form a sealed space via a sealing material, and indicates a start position of the pressure reducing operation DV by the vacuum pump 104. . Clamping is completed at point D4 at time T4, and a cavity is formed inside the mold 118. The mold 118 is maintained at a constant temperature.

  When the cavity is depressurized by the vacuum pump 104 that is a depressurizing mechanism, the molten resin flows from the plunger into the cavity constituted by the upper mold and the lower mold through the resin flow path. When sufficient decompression for resin sealing of the molded product is performed and the molten resin sufficiently flows into the cavity, the decompression operation DV ends by closing the decompression valve (time T5), and the cavity of the mold 118 In order to destroy the reduced pressure state, the leak valve is opened by the leak operation LV. Then, the inside of the mold 118 becomes atmospheric pressure. Thereafter, the leak valve is closed (time T6).

  Next, the lower mold keeps its position until time T7 until the lower mold is separated from the upper mold (mold opening), and after time T7, mold opening is started, and the lower mold returns to the initial state at time T8. . In addition, solidification time CT for solidifying resin of a to-be-molded product is from mold clamping start (time T2) to mold opening (time T7).

  After the mold is opened, the molded product is taken out from the mold 118 by the unloader 126 (time T9).

  The above main series of operations is shown in FIG. 3 as a resin sealing operation PR. Note that the decompression operation DV starting at time T3 and ending at time T5 varies depending on the mold used.

  Next, the resin sealing operation when using the two molds 118 and 120 will be described.

  Here, a case where the resin sealing operation (first press PR1) is performed using the mold 118 first, and then the resin sealing operation (next press PR2) is performed using the mold 120 will be described below.

  First, in the first press PR1 at the stage of the first shot (the first resin sealing operation of both the dies 118 and 120), the time TGE1 from the completion of loading the product to the die 118 until the end of the pressure reduction of the die 118 And the value is held by the holding circuit 142 in the device control unit 140.

  At the end of pressure reduction of the mold 118 (time T5), the next press PR2 in the first shot stage is started. That is, at this time, an operation of taking out the molding product from the molding product supply unit 110 to the mold 120 is started. At the same time, the time TGS2 from the removal of the molded product from the molded product supply unit 110 to the start of pressure reduction of the mold 120 is measured, and the value is held by the holding circuit 142 in the apparatus control unit 140. FIG. 4 shows the timing of the first press PR1 and the next press PR2 at this time.

  The holding circuit 142 outputs the held time TGE1 and time TGS2. Then, the output time TGE1 and time TGS2 are compared by the comparison circuit 144.

  Next, in the second shot (the next resin sealing operation for both dies 118 and 120), the timing of the first press PR1 and the next press PR2 is divided into two cases according to the result of the comparison circuit 144.

  When the time TGE1 is longer than the time TGS2 (if the difference time TF shown in the equation (1) is positive), as shown in FIG. 5, at the end of the mounting operation LD in the first press PR1 (molding of the mold 118) After completion of product loading; time T2), after setting the time difference TF, the next press PR2 is started (start of taking out the molded product from the mold 120), and the pressure of the next press PR2 is reduced at time T5. Start. In this embodiment, since the operation timing of each component in the next press PR2 is not changed, there is no change in the quality of the molded product that is resin-sealed by the next press PR2. That is, even if the resin sealing condition of the first press PR1 is changed, the quality influence on the rear press PR2 can be prevented. When the control of each press PR1, PR2 is configured by a software module, it is possible to easily delay the entire next press PR2 collectively by the difference time TF.

  When the time TGE1 is equal to the time TGS2 (if the difference time TF shown in the expression (1) is 0), as shown in FIG. 6, when the product to be molded is completely loaded into the die 118 in the first press PR1 (time T2). ) Next press PR2 is started. That is, at this time, an operation of taking out the molding product from the molding product supply unit 110 to the mold 120 is started. Then, at time T5, the pressure reduction of the next press PR2 is started.

  When the time TGE1 is shorter than the time TGS2 (if the difference time TF shown in the expression (1) is negative), when the loading of the first press PR1 to the die 118 is completed, as in the case where the time TGE1 and the time TGS2 are equal. The operation of the post press PR2 is started at (time T2). Then, the pressure reduction of the next press PR2 is started after time T5.

  In this way, since the mold 118, 120 is provided with a decompression period to perform decompression independently, the quality of the molded product is improved and the yield is improved as compared with the case of resin sealing without decompression. Improvements can be expected. In addition, since the decompression periods do not overlap, even if there is a change in either the mold 118, 120 or the molded product, the first press PR1 and the second press PR2 do not affect each other. There is no possibility that the quality of resin sealing in the molds 118 and 120 will be lowered.

  At the same time, regardless of the comparison result between the time TGE1 and the time TGS2, since the time TGE1 and the time TGS2 have overlapping times, the overlapping times can be offset. For this reason, even if it has two metal mold | die 118,120, the delay of the next press PR2 can be prevented to the minimum, and an efficient resin sealing can be performed now.

  At this time, after the molding product is taken out from the molding product supply unit 110 with respect to the mold 118 as the preceding mold and loaded, the molding product supply unit 110 with respect to the mold 120 as the succeeding mold is completed. Since the molded product is taken out and loaded, even if the loader (loading mechanism) 124 for loading the molded product into the two molds 118 and 120 is also used, there is no delay in the next press PR2. . In addition, all other components other than the valve mechanisms 106A and 106B are also used. That is, since there are a plurality of components that are shared by the two molds 118 and 120, resin sealing can be realized in a more compact manner while minimizing the delay of the next press PR2.

  In the first shot, at the end of the decompression of the mold 118 (time T5), the mold 120 is started to take out the molded product from the molded product supply unit 110, and the time TGE1 is set. The time TGS2 is measured and, after the second shot, the decompression start timing is determined according to the judgment of the process for delaying the decompression start timing for the mold 120 to be subjected to the resin sealing operation next. Since the adjustment is performed, the resin sealing operation for production from the first shot can be performed without measuring the time TGE1 and the time TGS2 in advance. That is, the first shot can be used not only for measuring the time TGE1 and the time TGS2 for the second and subsequent shots but also for resin sealing for improving productivity. In the next and subsequent times, more efficient resin sealing is enabled.

  In other words, by applying the present invention, it is possible to reduce the dead time of supplying the molded product without diminishing the effects of downsizing and cost reduction caused by the combined use of the vacuum pump 104 to be used. Efficient resin sealing using the molds 118 and 120 can be realized, and productivity can be improved.

  Although the present invention has been described with reference to the present embodiment, the present invention is not limited to the present embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the present embodiment, the number of molds is two 118 and 120, but may be three or more.

  In this embodiment, the delay of the next press PR2 with respect to the previous press PR1 is reduced using the relationship between the time TGE1 and the time TGS2, but the present invention is not limited to this. For example, by changing the preheating temperature and controlling the time TGS2, the processing circuit performs processing so as to start the pressure reduction in the succeeding die when the pressure reduction in the preceding die ends. It is possible to reliably prevent the mold depressurization period and the subsequent mold depressurization period from overlapping, and to minimize the delay of the next press with respect to the previous press.

  Further, the time TGE1 and the time TGS2 do not necessarily have to be held by the holding circuit 142. That is, the specific method for knowing the time TGE1 and the time TGS2 is not particularly limited. Actual measurement may be actually performed, or previous measurement values may be extracted as information. In this case, the actual measurement value in the past may be used, or some actual measurement values may be taken into consideration. In that case, the processing circuit which is a processing means for reading the previous actual measurement value functions as the holding means. Here, when obtaining the difference time TF, if the measured values of the time TGE1 and the time TGS2 are reliable, a method of taking the difference as it is is effective. In consideration of the reliability, the difference between the time TGE1 and the time TGS2 may be slightly larger than the actual difference, and may be adopted as the difference time TF.

  Furthermore, the resin sealing is not limited to the resin sealing by transfer molding, but can be applied to other resin sealing using a plurality of molds. Moreover, the loader and the unloader may be combined.

The schematic block diagram showing the apparatus mechanism part of the resin sealing apparatus which concerns on embodiment of this invention The block diagram which similarly shows the relationship between the apparatus mechanism part and apparatus control part of a resin sealing device Similarly, a schematic diagram showing the resin sealing operation in one mold Similarly, a schematic diagram showing the timing of the first press and the rear press in the first shot Similarly, a schematic diagram showing the timing of the pre-press and the post-press when the time TGE1 in the second shot is smaller than the time TGS2. Similarly, a schematic diagram showing the timing of the first press and the second press when the time TGE1 in the second shot is the same as the time TGS2. Similarly, a schematic diagram showing the timing of the pre-press and the post-press when the time TGE1 in the second shot is smaller than the time TGS2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Resin sealing device 102 ... Device mechanism part 104 ... Vacuum pump (decompression mechanism)
106A, 106B ... Valve mechanism 110 ... Molded product supply unit 110A, 132A ... Magazine 112 ... Turning table 114 ... Preheater unit 116 ... Resin tablet supply unit 118, 120 ... Mold (preceding mold, trailing mold)
122 ... X direction guide 124 ... Loader (mounting mechanism)
DESCRIPTION OF SYMBOLS 126 ... Unloader 128 ... Cooling stage 130 ... Gate break part 132 ... Molded product accommodation part 140 ... Apparatus control part 142 ... Holding circuit (holding means)
144: Comparison circuit (comparison means)
146... Processing circuit (processing means)

Claims (6)

In a resin sealing method comprising a plurality of molds, depressurizing the molds, and sealing with resin,
It said at reduced pressure the end of the preceding mold resin sealing operation is performed in the earlier of the plurality of molds, next to the resin sealing operation of the row die after resin sealing operation is performed in the distal Gyokin type Complete the operation of loading the molded product to the subsequent mold ,
In addition, the resin sealing method is characterized in that the decompression period of the preceding mold and the decompression period of the succeeding mold do not overlap. In claim 1,
The resin sealing method, wherein the pressure reduction in the succeeding mold is started at the end of the pressure reduction in the preceding mold. A molded product supply unit and a plurality of molds are provided, and the molded product is taken out from the molded product supply unit according to the plurality of molds and loaded into the mold, and the mold is decompressed. In the resin sealing method for resin sealing the molded article,
A time TGE1 from the completion of loading of the molded product to the preceding mold in which the resin sealing operation is performed first among the plurality of molds until the end of decompression of the mold, and the resin next to the preceding mold A step of knowing a time TGS2 from the removal of the molded product from the molded product supply unit to the subsequent mold in which the sealing operation is performed to the start of pressure reduction,
Comparing said time TGE1 and time TGS2;
As a result of the comparison, when the time TGE1 is longer than the time TGS2, after the completion of the loading of the molded product with respect to the preceding mold, at least the time corresponding to the difference between the time TGE1 and the time TGS2 When the start of taking out the molded product from the mold is delayed and the time TGE1 is equal to or less than the time TGS2, the molding of the succeeding mold is completed when the molding is completely loaded into the preceding mold. And a step of starting to take out the product. In a resin sealing device having a decompression mechanism and a plurality of molds in which the decompression mechanism is also used to decompress the interior of itself,
It said at reduced pressure the end of the preceding mold resin sealing operation is performed in the earlier of the plurality of molds, next to the resin sealing operation of the row die after resin sealing operation is performed in the distal Gyokin type Complete the operation of loading the molded product to the subsequent mold ,
And a processing means for processing so that the pressure reducing period of the preceding mold and the pressure reducing period of the succeeding mold do not overlap. In claim 4,
The resin sealing device, wherein the processing means performs processing so as to start pressure reduction in the succeeding mold when pressure reduction in the preceding mold ends. A decompression mechanism, a plurality of molds that are decompressed inside by using the decompression mechanism, a loading mechanism that is also used by the plurality of molds and loads a molding object into the plurality of molds, In a resin sealing device having a molded product supply unit for supplying a molded product,
A time TGE1 from the completion of loading of the molded product to the preceding mold in which the resin sealing operation is performed first among the plurality of molds until the end of decompression of the mold, and the resin next to the preceding mold A holding means for holding a time TGS2 from the removal of the molded product from the molded product supply unit to the subsequent mold in which the sealing operation is performed to the start of pressure reduction,
A comparison means for comparing the time TGE1 and the time TGS2,
As a result of the comparison, when the time TGE1 is longer than the time TGS2, after the completion of the loading of the molded product with respect to the preceding mold, at least the time corresponding to the difference between the time TGE1 and the time TGS2 When the start of taking out the molded product from the mold is delayed and the time TGE1 is equal to or less than the time TGS2, the molding of the succeeding mold is completed when the molding is completely loaded into the preceding mold. Processing means for processing to start taking out goods;
A resin sealing device comprising:

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