JP5544780B2 - Die bonding film and semiconductor device using the same - Google Patents

Description

  The present invention relates to a die bonding film and a semiconductor device using the same.

  Conventionally, silver paste has been mainly used for joining a semiconductor chip and a support member for mounting a semiconductor chip. However, with the recent miniaturization and high performance of semiconductor chips, the support members used are also required to be small and fine. Furthermore, along with demands for miniaturization and higher density of portable devices, etc., semiconductor devices in which a plurality of semiconductor chips are stacked have been developed and mass-produced. The silver paste is caused by protrusion or inclination of semiconductor chips. Due to the occurrence of defects during wire bonding, difficulty in controlling the film thickness of the adhesive layer, and the occurrence of voids in the adhesive layer, it has become impossible to cope with the above requirements. Therefore, in recent years, a film-like die bonding material (hereinafter referred to as “die bonding film”) has been used (Patent Document 1).

  Also, in recent years, the memory capacity mounted on portable devices has been increasing at an accelerated rate, and therefore the number of stacked chip stages in a semiconductor package in which a plurality of semiconductor chips are stacked tends to increase. More specifically, the volume and weight of a semiconductor package in which semiconductor chips are stacked in multiple stages are not different from conventional ones due to the weight of the mobile device, and only the number of stacked semiconductor chips has increased. As a result, the semiconductor chips become thinner. There is a tendency, and semiconductor chips having a thickness of 100 μm or less have been used.

  In the case of a diameter of 8 inches, the semiconductor wafer is cut out to a thickness of about 700 μm, and then the back surface is ground to obtain a semiconductor wafer having a desired thickness. Conventionally, when a semiconductor wafer is thinly ground (back grind), a tape that protects the wafer circuit surface (hereinafter referred to as “back grind tape”) is pasted and peeled off after grinding, and then a die bonding film or a dicing substrate. However, as the semiconductor wafer becomes thinner, the risk of the wafer breaking during transportation increases. For this reason, a process of laminating a die bonding film and a dicing substrate without peeling the back grind tape and peeling the back grind tape after lamination is common.

  However, since the heat resistance of the back grind tape has an upper limit of about 80 ° C., it is necessary to ensure sufficient adhesion at a lamination temperature of 80 ° C. or lower, particularly when the die bonding film is attached to the back surface of the wafer.

  The die bonding film is used by any of the following methods.

  (1) A die bonding film is cut into an arbitrary size and attached to a substrate with wiring or a semiconductor chip, and the semiconductor chip is thermocompression bonded thereto.

  (2) Affixing the die bonding film to the entire back surface of the semiconductor wafer, and then affixing the dicing substrate to the back surface of the die bonding film, then separating it with a rotary blade, and picking up the semiconductor chip with the die bonding film by the pickup It is obtained by peeling from the material, and is thermocompression bonded to a substrate with wiring or a semiconductor chip.

  Particularly, in recent years, the method (2) has been mainly used for the purpose of simplifying the semiconductor device manufacturing process. However, as the semiconductor wafer becomes thinner, the semiconductor chip with a die bonding film separated into pieces is obtained. It is difficult to pick up without breaking.

  Furthermore, among the semiconductor packages currently used for mobile phones, portable music players, etc., for the purpose of increasing the capacity, a package in which a large number of the same semiconductor chips are stacked is the mainstream. Conventionally, the spacer type in which spacers are inserted between semiconductor chips has been the mainstream, but wire bonding to thin wafers is reduced, so the lower semiconductor chip is bonded with a die bonding film on the back of the semiconductor chip stacked on the upper stage. An embedded wire type that fills the wire has been developed. However, when stacking the upper semiconductor chip, it becomes difficult to ensure the deformation of the wire and the die bonding film filling property under the wire, so that the electrical characteristics of the semiconductor package are deteriorated and a good semiconductor Getting a package has become difficult.

  Moreover, although the die bonding film which mix | blended the high molecular weight linear polymer component is used in order to improve the moisture absorption reflow tolerance of a semiconductor device, there existed a problem that it was inferior to pick-up property.

JP 2001-244303 A

  In view of the above-described problems of the prior art, the present invention can easily pick up a semiconductor chip with a die bonding film from a dicing substrate, and can fill the bonding wire of the lower semiconductor chip only by heating and pressurizing in the die bonding process. Another object of the present invention is to provide a die bonding film in which a semiconductor device manufactured using the die bonding film has good moisture absorption reflow resistance and a semiconductor device using the die bonding film.

  The present invention is (1) a die bonding film for bonding and fixing semiconductor elements, wherein the die bonding film has an adhesive layer containing a star copolymer, and tackiness of uncured film at 40 ° C. Is a die bonding film in which the melt viscosity of an uncured film at 80 ° C. is 10,000 Pa · s or less, and the adhesive strength of the cured film at 265 ° C. is 3.5 MPa or more.

  The present invention also relates to (2) the die bonding film according to (1), wherein the adhesive layer contains a thermosetting component.

  The present invention also relates to (3) the die bonding film according to (1) or (2), wherein the adhesive layer contains an inorganic filler.

  Moreover, this invention relates to the die-bonding film as described in any one of said (1)-(3) whose thickness of the said die-bonding film is 40-100 micrometers.

  The present invention also relates to (5) a semiconductor device having a structure in which semiconductor elements are bonded to each other using the die bonding film according to any one of (1) to (4).

  According to the present invention, a semiconductor chip with a die bonding film can be easily picked up from a dicing substrate, and in the die bonding process, a temperature of 100 to 150 ° C., a pressure of 0.01 to 1 MPa, and a heating time of 0.1 to 3 seconds are applied. A die bonding film in which a bonding wire of a lower semiconductor chip can be completely filled only by a pressure operation and a semiconductor device manufactured using the die bonding film has good moisture absorption reflow resistance and a semiconductor device using the same Can be provided.

  In particular, even when a thin wafer having a thickness of 100 μm or less is used, the above-described effects can be obtained. Therefore, it can greatly contribute to the development of a miniaturized and thin semiconductor device using a thin wafer in recent years.

It is sectional drawing which shows the semiconductor device using a die-bonding film.

  The die bonding film of the present invention is a die bonding film for bonding and fixing semiconductor elements, and the die bonding film has an adhesive layer containing a star copolymer, and is a tack of an uncured film at 40 ° C. It is characterized in that the force is 1,500 mN or less, the melt viscosity of the uncured film at 80 ° C. is 10,000 Pa · s or less, and the adhesive strength of the cured film at 265 ° C. is 3.5 MPa or more.

  First, each component which comprises the die-bonding film of this invention is demonstrated.

(Star copolymer)
The adhesive layer of the die bonding film of the present invention contains a star copolymer. The star-shaped copolymer is a branched copolymer having a star-shaped structure in which three or more polymer chains extend radially from the center (hereinafter sometimes referred to as “star-shaped copolymer”). .

  Such a star-shaped copolymer is characterized in that it has high fluidity and low viscosity as compared with a linear polymer having the same weight average molecular weight, and thereby a bonding wire for a lower semiconductor chip. And the reliability such as moisture absorption reflow resistance can be improved. This is because, when a weight average molecular weight is increased in a linear polymer, the polymer chain becomes longer and entanglement occurs between adjacent polymer chains, but in a star copolymer, the polymer chain extends radially from the center. It is presumed that due to the structure, the polymer chain portion does not become longer and the occurrence of entanglement is less in linear polymers. Therefore, by using a star copolymer having a high molecular weight and a low viscosity as a high molecular weight component of the die bonding film, it is possible to achieve both high fluidity and high reliability as the whole die bonding film.

  The star copolymer used in the present invention is a branched copolymer having a star structure in which three or more polymer chains extend radially from the center. For example, (meth) acrylic resin, polyimide resin, urethane resin , Polyphenylene ether resin, polyether imide resin, phenoxy resin, modified polyphenylene ether resin, acrylic rubber, and the like. Among these, acrylic rubber is preferable because various higher-order structures and functional control are possible. The acrylic rubber is mainly composed of an acrylate ester, for example, a rubber made of a copolymer of butyl acrylate or ethyl acrylate and acrylonitrile. In the present invention, as described above, a star shape is used. It has a structure. The acrylic rubber preferably contains a crosslinkable functional group, and the crosslinkable functional group may be present in the polymer chain or at the end of the polymer chain. Specific examples of the crosslinkable functional group include an epoxy group, an acryloyl group, a methacryloyl group, a hydroxyl group, a carboxyl group, an isocyanate group, an amino group, and an amide group. Among these, an epoxy group is preferable. The amount of the epoxy group-containing monomer in the epoxy group-containing acrylic rubber is preferably 0.5 to 10% by weight, more preferably 1 to 7% by weight, based on the total monomer amount, and 2 to 4% by weight. % Is particularly preferred. When the amount of the epoxy group-containing monomer is within this range, the adhesive force can be secured and gelation can be easily prevented. In the present invention, “(meth) acryl” means both “acryl” and “methacryl”.

  The star copolymer used in the present invention has a glass transition temperature (Tg) of preferably 60 ° C. or less, more preferably 50 ° C. or less, particularly preferably from the viewpoint of fluidity of the resin blend and toughness of the cured product. Is 45 ° C. or lower. When the glass transition temperature exceeds 60 ° C., the melt viscosity before the die bonding film is cured (B stage state) tends to be high, and it tends to be difficult to make it highly fluid during heating. In addition, the said glass transition temperature is the value measured using the viscoelasticity analyzer (Rheometric company make, RSA-2). The measurement conditions are: sample size: length 12 mm, width 5 mm, thickness 150 μm, temperature range: −50 to 300 ° C., temperature rising rate: 5 ° C./min, frequency 1 Hz, tensile mode.

  The weight average molecular weight of the star copolymer used in the present invention is preferably 30,000 to 1,000,000, more preferably 60,000 to 800,000, particularly preferably 10 from the viewpoint of obtaining high reliability as a die bonding film. 10,000 to 600,000. If the weight average molecular weight is less than 30,000, the adhesive strength of the cured die bonding film is lowered, and the reliability of the semiconductor package may be lowered. On the other hand, if the weight average molecular weight exceeds 1,000,000, the fluidity of the die bonding film in the B-stage state tends to be lowered, and it becomes difficult to fill the bonding wire of the lower chip at the time of crimping. There is a possibility that the reliability of the semiconductor package is lowered due to the void. In addition, the said weight average molecular weight is a polystyrene conversion value using the calibration curve by a standard polystyrene by the gel permeation chromatography method (GPC), uses the Hitachi Ltd. make and brand name: L-6000 as a pump, Hitachi Chemical Co., Ltd. product name: Gelpack GL-R440, Gelpack GL-R450 and Gelpack GL-R400M (each 10.7 mm (diameter) x 300 mm) were used in this order as the column, Tetrahydrofuran (hereinafter referred to as “THF”) is used as an eluent, and a sample in which 120 mg of sample is dissolved in 5 ml of THF can be measured at a flow rate of 1.75 mL / min.

When the star copolymers with the same weight average molecular weight are composed of the same monomers, the greater the number of polymer chains, the shorter the polymer chain per one, thus improving the fluidity. Therefore, it is considered that the viscosity becomes low. Therefore, when it is desired to keep the weight average molecular weight as it is and to lower the viscosity, the viscosity can be lowered by increasing the number of polymer chains. In order to increase the number of polymer chains, a polyfunctional initiator having a large number of functional groups may be used for producing a star copolymer. The star copolymer used in the present invention has 3 or more polymer chains, more preferably 3 to 10 polymer chains , and particularly preferably 3 or 4 polymer chains. The weight average molecular weight of each polymer chain of the star copolymer used in the present invention is preferably 10,000 to 300,000, more preferably 30,000 to 200,000, and 50,000 to 150,000. It is particularly preferred. When the weight average molecular weight of the polymer chain is less than 10,000, the adhesive strength and heat resistance of the die-bonding film after curing may be lowered, and the reliability of the semiconductor package may be lowered. In addition, the film formability tends to be difficult. On the other hand, if the weight average molecular weight exceeds 300,000, the pick-up property at the time of die bonding tends to be lowered, and the fluidity of the die-bonding film in the B stage state tends to be lowered. Filling is difficult, and unfilled voids remaining after pressure bonding may be the starting point, which may reduce the reliability of the semiconductor package. The weight average molecular weight of each polymer chain is a value obtained by dividing the weight average molecular weight of the whole molecule by the number of polymer chains.

  Specific examples of the star copolymer and an example of a synthesis method thereof will be described below, but the star copolymer according to the present invention is not limited to the following synthesis method.

  The star copolymer according to the present invention, for example, using a halogen compound as a polyfunctional initiator, an amine compound as a ligand, and a transition metal of Group 7 to 11 elements of the periodic table as a catalyst, It can be synthesized by polymerizing a plurality of monomer species by atom transfer radical polymerization.

  Below, each component used in the said synthesis method is demonstrated first.

[Monomer species]
The monomer species is not particularly limited, and various types can be used. For example, the following monomers can be mentioned. Moreover, the monomer by which at least 1 H of the compound shown by Structural formula (1)-(6) is substituted by F can also be used.

In addition, although the following structural formula shows an acryl-type thing, a methacryl-type thing can also be used. That is, in the structural formulas (1) to (6), those in which CH ₂ ═CH— is replaced with CH ₂ ═C (CH ₃ ) — can be used.

  R in the structural formula (1) represents an aliphatic group having 1 to 20 carbon atoms or an aromatic group having 6 to 20 carbon atoms. Specific examples of the aliphatic group include an alkyl group having 1 to 20 carbon atoms, an alkoxyalkyl group having 1 to 20 carbon atoms, and a hydroxyalkyl group having 1 to 20 carbon atoms. It may be branched. More specifically, methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, tert-butyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group, octyl group, Alkyl groups such as 2-ethylhexyl group, nonyl group, decyl group, dodecyl group, stearyl group; 2-methoxyethyl group, 2-ethoxyethyl group, 2-propoxyethyl group, 2-butoxyethyl group, 3-methoxypropyl group , Alkoxyalkyl groups such as 3-methoxybutyl group and 4-methoxybutyl group; hydroxyalkyl groups such as 2-hydroxyethyl group and 2-hydroxypropyl group; Among these, a linear alkyl group having 1 to 10 carbon atoms is preferable, and a linear alkyl group having 2 to 8 carbon atoms is more preferable. On the other hand, examples of the aromatic group include an aryl group having 6 to 20 carbon atoms and an aralkyl group having 7 to 20 carbon atoms, and among these, an aryl group having 6 to 10 carbon atoms and an aralkyl group having 7 to 11 carbon atoms. Groups are preferred. Specific examples include a phenyl group, a toluyl group, and a benzyl group.

  R ′ in the structural formula (3) represents H, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom. Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms include an alkyl group having 1 to 5 carbon atoms, and include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a tert-butyl group, and a pentyl group. Etc. Moreover, a chlorine atom, a bromine atom, etc. are mentioned as a halogen atom. Among these, H or an aliphatic hydrocarbon group having 1 to 3 carbon atoms or a halogen atom is preferable, and H or an aliphatic hydrocarbon group having 1 to 2 carbon atoms or a halogen atom is more preferable.

R ¹ and R ^{2 in} the structural formula (4) each independently represent H or an aliphatic hydrocarbon group having 1 to 4 carbon atoms. Examples of the aliphatic hydrocarbon group having 1 to 4 carbon atoms include an alkyl group having 1 to 4 carbon atoms, and more specifically, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and the like. These alkyl groups may be substituted with an amino group. Among these, H or an aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferable.

R ^{3 in the} structural formula (5) represents a divalent aliphatic hydrocarbon group having 1 to 4 carbon atoms. Examples of the divalent aliphatic hydrocarbon group having 1 to 4 carbon atoms include an alkylene group having 1 to 4 carbon atoms, and more specifically, a methylene group, an ethylene group, a propylene group, a butylene group, and the like. Can be mentioned. Among these, a C1-C2 bivalent aliphatic hydrocarbon group is preferable. R ⁴ and R ⁵ each independently represent H, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, or an aromatic hydrocarbon group having 6 to 10 carbon atoms. Examples of the aliphatic hydrocarbon group having 1 to 4 carbon atoms include an alkyl group having 1 to 4 carbon atoms, and more specifically, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and the like. Can be mentioned. Examples of the aromatic hydrocarbon group having 6 to 10 carbon atoms include a phenyl group, a toluyl group, and a benzyl group. Among these, an aliphatic hydrocarbon group having 1 to 2 carbon atoms is preferable.

R ^{6 in the} structural formula (6) represents a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms. Examples of the divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms include an alkylene group having 1 to 5 carbon atoms. More specifically, a methylene group, an ethylene group, a propanediyl group, a butanediyl group, Examples thereof include a pentanediyl group. Among these, a divalent aliphatic hydrocarbon group having 2 to 4 carbon atoms is preferable. R ⁷ , R ⁸ and R ⁹ each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms or an alkoxy group having 1 to 5 carbon atoms. Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms include an alkyl group having 1 to 5 carbon atoms, and more specifically, methyl group, ethyl group, propyl group, isopropyl group, butyl group, tert group -A butyl group, a pentyl group, etc. are mentioned. Among these, an aliphatic hydrocarbon group having 1 to 4 carbon atoms is preferable, and an aliphatic hydrocarbon group having 2 to 3 carbon atoms is more preferable. Specific examples of the alkoxy group having 1 to 5 carbon atoms include a methoxy group, an ethoxy group, a propoxy group, and a butoxy group.

  Among those represented by the structural formulas (1) to (6), the monomer species represented by the structural formula (1) or (2) is preferable, and includes (meth) ethyl acrylate, n-butyl (meth) acrylate, ( More preferred is (meth) acrylonitrile.

  The expression “(meth) acrylic acid” indicates acrylic acid and / or methacrylic acid.

Moreover, as a monomer seed | species used in the manufacturing method of this invention, the monomer which has a crosslinkable functional group can also be used suitably. Examples thereof are shown in the following structural formulas (7) to (9), but the present invention is not limited to the following.

In the structural formulas (7) and (8), R ⁹ and R ¹⁰ represent a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms, such as a methylene group, an ethylene group, a propylene group, a butylene group, A pentylene group etc. are mentioned, Among these, a methylene group is preferable.

Structural formulas (7) and (8) are acrylate-based examples, but methacrylate-based ones can also be used. That is, in Structural Formulas (7) and (8), those in which CH ₂ ═CH— is replaced with CH ₂ ═C (CH ₃ ) — can also be used.

  In the structural formulas (7) to (9), the monomer species represented by the structural formula (7) is preferable, and glycidyl (meth) acrylate is more preferable.

  In the present invention, it is preferable to use three or more types of monomers from the viewpoints of controlling the glass transition temperature, introducing a crosslinking component, improving cohesion, and imparting functionality. The monomer types represented by the structural formulas (1) to (9) Among these, it is more preferable to contain at least one of (meth) acrylonitrile represented by Structural Formula (2) and a monomer having a crosslinkable functional group represented by Structural Formulas (7) to (9). Specific examples of combinations include methyl acrylate, ethyl (meth) acrylate, (meth) acrylic acid alkyl esters such as n-butyl (meth) acrylate; (meth) acrylonitrile; glycidyl (meth) acrylate, etc. And (epoxy group-containing (meth) acrylic acid ester). Containing the (meth) acrylic acid alkyl ester tends to increase flexibility, adhesiveness with a support member, a semiconductor element, and the like. Containing (meth) acrylonitrile increases cohesion, Adhesive strength with a semiconductor element or the like tends to increase, and the cured product tends to be highly elastic by containing an epoxy group-containing (meth) acrylic ester.

  The blending amount of these monomers is not particularly limited and can be freely set except for (meth) acrylonitrile and amino group-containing monomers.

  In the present invention, the total amount of acrylonitrile and amino group-containing monomer can be 10 mol% or more, preferably 20 mol% or more, in terms of a mole fraction relative to the total amount of monomer species used. 30 mol% or more is more preferable, 40 mol% or more is more preferable, and the upper limit is approximately 60 mol%.

In addition, as an amino group containing monomer here, the monomer shown by following Structural formula (10) or Structural formula (11), etc. are used suitably. Also, ^{R 11} and ^{R 12} in the monomers of formula (10) each independently represent a -CH ₃ or _-C 2 _{H 5.}

[Multifunctional initiator]
The polyfunctional initiator is a halogen compound, and generally includes a compound containing 3 or more halogen atoms in one molecule, preferably a compound in which the halogen atom is Br or Cl, more preferably a halogen atom. A compound in which the atom is Br, and most preferably a brominated alkyl. In addition, since the functional number of the polyfunctional initiator is the number of polymer chains of the star copolymer, the polyfunctional initiator is selected in consideration of the number of polymer chains of the star copolymer to be synthesized. It is preferable.

  Although the specific example of the polyfunctional initiator used suitably in this invention is shown according to functional number below, this invention is not limited to Structural formula (12)-(16) shown below.

(Trifunctional; R (Br) ₃ )

Specific examples of the structural formula (13) include those in which hydrogen atoms of three hydroxyl groups of a trihydric alcohol such as glycerin or phloroglucinol are substituted with the following substituent (a).

(Tetrafunctional; R (Br) ₄ )

  Specific examples of the structural formula (15) include those in which hydrogen atoms of four hydroxyl groups of a tetrahydric alcohol such as pentaerythritol or calixarene [4] are substituted with the above substituent (a).

(5 functional; R (Br) ₅ )

  Specific examples of the structural formula (16) include those in which hydrogen atoms of five hydroxyl groups of pentavalent alcohols such as glucose, fructose, and glucopyranose are substituted with the above substituent (a).

(6 functionalities; R (Br) ₆ )

  Specific examples of structural formula (17) include those in which the hydrogen atoms of the six hydroxyl groups of a hexahydric alcohol such as calixarene [6] or glucitol are substituted with the above substituent (a).

  In addition, a 7-functional or higher initiator can be obtained by reacting a predetermined acid halide with a compound having 7 or more hydroxyl groups in one molecule. Here, examples of the predetermined acid halide include 2-bromopropionic acid chloride, 2-bromopropionic acid bromide, 2-bromo-2-methylpropionic acid chloride, and 2-bromo-2-methylpropionic acid bromide. However, the examples given here are merely examples, and the present invention is not limited to these examples.

  The usage amount of the polyfunctional initiator is preferably selected in such a range that the molar ratio (total monomer species / multifunctional initiator) to the total amount of all monomer species is 200/1 to 20000/1.

[Ligand]
The ligand is an amine compound, and it is preferable to use an amine compound having two or more N atoms in one molecule. Examples of such amine compounds include those represented by the following structural formula (18).

(R ¹⁷ represents a divalent aliphatic hydrocarbon group having 1 to 3 carbon atoms, and R ¹⁸ and R ¹⁹ represent H or an aliphatic hydrocarbon group having 1 to 3 carbon atoms.)
Examples of the divalent aliphatic hydrocarbon group having 1 to 3 carbon atoms represented by R ¹⁷ include a methylene group, an ethylene group, and a propylene group. Examples of the aliphatic hydrocarbon group having 1 to 3 carbon atoms represented by R ¹⁸ and R ¹⁹ include a methyl group, an ethyl group, and a propyl group.

  As a usage-amount of a ligand, it is preferable that it is 0.5 / 1-2/1 by molar ratio (ligand / metal) with respect to the metal used as a catalyst.

[catalyst]
The catalyst is a transition metal or a transition metal compound of Group 7 to 11 elements of the periodic table, specifically, manganese, technetium, rhenium, iron, ruthenium, osmium, cobalt, rhodium, iridium, nickel, palladium, Examples include transition metals such as platinum, copper, silver, and gold, or compounds thereof. Among these, copper, ruthenium, nickel, iron, or a compound thereof is preferable, copper and a copper compound are more preferable in terms of high catalytic activity, high polymerization rate, and high molecular weight, and copper and copper compounds. It is particularly preferable to use in combination. As the copper compound, for example, a divalent copper compound such as copper (II) bromide is preferably used.

  As a usage-amount of a catalyst, it is preferable that it is 0.5 / 1-10/1 by molar ratio (catalyst / initiator) with respect to an initiator.

[solvent]
Solvents: sulfoxide solvents such as dimethyl sulfoxide (DMSO); hydrocarbon solvents such as benzene and toluene; ether solvents such as diethyl ether, tetrahydrofuran and dioxane; halogenated hydrocarbon solvents such as methylene chloride and chloroform; acetone Ketone solvents such as methyl ethyl ketone; alcohol solvents such as methanol, ethanol, propanol and isopropanol; nitrile solvents such as acetonitrile, propionitrile and benzonitrile; ester solvents such as ethyl acetate and butyl acetate; ethylene carbonate and propylene A carbonate solvent such as carbonate; an amide solvent such as dimethylformamide, dimethylacetamide, and hexamethylphosphoric amide; can be preferably used. These may be used alone or in combination. However, the examples given here are merely examples, and the present invention is not limited to these examples.

[Other ingredients]
Other components used in the method for synthesizing the star copolymer include Lewis acid (for example, aluminum alkoxide) or inorganic salt (for example, sodium carbonate, sodium benzoate, etc.) or reducing agent (for example, to increase the catalytic activity). For example, 2-ethylhexanoic acid tin etc.) can be added.

[Atom transfer radical polymerization]
Atom transfer radical polymerization employed in the method for synthesizing star copolymers is a polymerization method in which a halogen compound or the like is used as an initiator, a transition metal is used as a catalyst, and a monomer such as an acrylic polymer is polymerized. However, a side reaction such as a stop reaction is unlikely to occur and a polymer having a narrow molecular weight distribution (Mw / Mn = 1.1 to 2.2) is obtained, and depending on the charging ratio of the monomer and the initiator, In addition to the characteristics of the “living radical polymerization method” in which the molecular weight can be freely controlled, it has a halogen that is relatively advantageous for functional group conversion reaction at the end, and the degree of freedom in designing initiators and catalysts is great. This is useful as a method for producing a polymer having a specific functional group.

  As this atom transfer radical polymerization method, for example, Macromolecules, 1995, 28, 1721, 7901, Matyjazewski et al., Journal of American Chemical Society (J. Am. Chem. Soc). 1995) 117, 5614, Science 1996, 272, 866, WO 96/30421 pamphlet, WO 97/18247 pamphlet, WO 98/01480 pamphlet. , WO98 / 40415 pamphlet, JP-A-9-208616, JP-A-8-41117, and the like.

  Next, the procedure for synthesizing the star copolymer in the method for synthesizing the star copolymer will be described.

  First, the catalyst is weighed in a container prepared for synthesis, the container is evacuated and under a nitrogen atmosphere, and each monomer species, ligand, and solvent are added. Next, nitrogen is bubbled for deoxygenation. Under a nitrogen atmosphere again, a separately prepared initiator solution is added, deoxygenated with nitrogen, and then the polymerization proceeds. The polymerization temperature is about 10 to 100 ° C., and after completion of the polymerization reaction, the reaction solution is purified to obtain the desired star copolymer. In the above polymerization, it is important to remove oxygen and moisture. Moreover, in order to advance a polymerization reaction smoothly, it is important to raise the purity of a monomer, an initiator, a ligand, a metal, and a solvent.

[Thermosetting component]
In the present invention, the adhesive layer may contain a thermosetting component. As the thermosetting component, there can be used an epoxy resin, and there is no particular limitation as long as it is an epoxy resin that is cured by heat and has an adhesive action. A bifunctional epoxy resin such as an S-type epoxy resin, a novolac epoxy resin such as a phenol novolac epoxy resin, a cresol novolac epoxy resin, or the like can be used. Moreover, what is generally known, such as a polyfunctional epoxy resin, a glycidyl amine type epoxy resin, a heterocyclic ring-containing epoxy resin, or an alicyclic epoxy resin, can be applied.

  The following are mentioned as an example of the commercial item of such an epoxy resin. As the bisphenol A type epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 807, 815, 825, 827, 828, 834, 1001, 1004, 1007, 1009, Dow Chemical Company, trade name: DER -330, 301, 361, manufactured by Tohto Kasei Co., Ltd., trade name: YD8125, etc. As said bisphenol F type epoxy resin, the Toto Kasei Co., Ltd. make, brand name: YDF-8170C, YSLV-80XY, etc. are mentioned. As said phenol novolak-type epoxy resin, Yuka Shell Epoxy Co., Ltd. product name: Epicoat 152, 154, Nippon Kayaku Co., Ltd. product name: EPPN-201, Dow Chemical Co., Ltd. product name: DEN-438 Moreover, as an o-cresol novolak type epoxy resin, Nippon Kayaku Co., Ltd. product name: EOCN-102S, 103S, 104S, 1012, 1025, 1027, Toto Kasei Co., Ltd. product name: YDCN701, 702, 703, 704, 700-10, and the like. As the polyfunctional epoxy resin, Yuka Shell Epoxy Co., Ltd., trade name: Epon 1031S, Ciba Specialty Chemicals, trade name: Araldite 0163, Nagase Kasei Co., Ltd., trade name: Denacol EX-611, 614 614B, 622, 512, 521, 421, 411, 321 and the like. Examples of the amine type epoxy resin include Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 604, Toto Kasei Co., Ltd., trade name: YH-434, Mitsubishi Gas Chemical Co., Ltd., trade names: TETRAD-X, TETRAD. -C, manufactured by Sumitomo Chemical Co., Ltd., trade name: ELM-120 and the like. As said heterocyclic ring-containing epoxy resin, the product name: ERL4234, 4299, 4221, 4206, etc. by UCC, such as Ciba Specialty Chemicals make and brand name: Araldite PT810, etc. are mentioned. These epoxy resins can be used alone or in combination of two or more.

  In particular, the weight average molecular weight of the epoxy resin is preferably 1000 or less, and more preferably 500 or less, in that high flexibility can be imparted to the die bonding film in the B-stage state.

  Moreover, 50-90 mass% of bisphenol A type or bisphenol F type epoxy resins having a weight average molecular weight of 500 or less, which can impart high flexibility to the die bonding film in the B stage state, and high heat resistance are imparted to the cured product. It is also preferable to use together 10 to 50 mass% of polyfunctional epoxy resins having a weight average molecular weight of 800 to 3000.

[Curing agent]
When an epoxy resin is used as the thermosetting component, it is preferable to use an epoxy resin curing agent. As the epoxy resin curing agent, known curing agents that are usually used can be used, for example, amines; polyamides; acid anhydrides; polysulfides; boron trifluoride; bisphenol A, bisphenol F, and bisphenol S. Bisphenols having two or more such phenolic hydroxyl groups in one molecule; phenol novolak resin, xylylene modified phenol resin, bisphenol A novolak resin, cresol novolak resin, phenol aralkyl resin, naphthol aralkyl resin, triphenolmethane resin, terpene modified And phenol resins such as phenol resin and dicyclopentadiene-modified phenol resin.

  On the other hand, in the present invention, when the compatibility in the varnish state before the production of the die bonding film is deteriorated, the softening temperature is 150 ° C. or lower, preferably 140 ° C. or lower, more preferably 130 ° C. or lower. It can be improved by selecting a curing agent. Specific examples include phenol novolak resins, phenol aralkyl resins, cresol novolak resins, naphthol aralkyl resins, triphenolmethane resins, terpene modified phenol resins, dicyclopentadiene modified phenol resins, and among these, phenol novolac resins. Phenol aralkyl resins are preferred.

  Examples of commercially available epoxy resin curing agents that can be suitably used in the present invention include Mitsui Chemical Co., Ltd., trade names: Millex XLC-series, XL series, and DIC Corporation, trade names: Phenolite LF series. Can be mentioned.

  The content of the epoxy resin curing agent is such that the equivalent ratio of the number of hydroxyl groups of all curing agents to the number of epoxy groups of all epoxy resins (number of hydroxyl groups of all curing agents / number of epoxy groups of all epoxy resins) is 0.5 to 2. It is preferable.

[Filler]
In the present invention, the adhesive layer may contain a filler. The purpose of containing the filler is to improve the dicing property of the die bonding film in the B-stage state, to improve the handling property of the die bonding film, to improve the thermal conductivity, to adjust the melt viscosity, and to impart thixotropic properties.

  As the filler, an inorganic filler is preferable. Aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whisker, boron nitride, crystallinity Examples thereof include silica, amorphous silica, and antimony oxide. Among these, alumina, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like are preferable for improving thermal conductivity. For the purpose of adjusting melt viscosity and imparting thixotropic properties, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, crystalline silica, non-crystalline silica Crystalline silica and the like are preferred. In order to improve dicing properties, alumina and silica are preferable. There is no restriction | limiting in particular about the shape of these inorganic fillers.

[Other ingredients]
The adhesive layer of the die bonding film of the present invention contains, as other components, a coupling agent such as a silane coupling agent or a titanium coupling agent, a curing accelerator, a leveling agent, an antioxidant, and an ion trap agent. You may go out.

<Production of die bonding film>
Next, each process for producing the die bonding film of the present invention will be described. The process shown below is an example, and the die bonding film of the present invention is not limited to the following process.

(1) Preparation of varnish A star copolymer, a thermosetting component, a filler and other components are mixed and kneaded in an organic solvent to prepare a varnish. The organic solvent used for the preparation of the varnish is not particularly limited as long as it can uniformly dissolve, knead or disperse the above-described components, and conventionally known ones can be used. Examples of such a solvent include ketone solvents such as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetone, methyl ethyl ketone, and cyclohexanone, toluene, xylene, and the like. Among these, it is preferable to use methyl ethyl ketone, cyclohexanone, or the like in terms of fast drying speed and low price.

  There is no particular limitation on the amount of the organic solvent used in the preparation of the varnish, and the organic solvent is removed from the die bonding film by heat drying or the like. Min) is preferably 0.01 to 3% by mass based on the total mass, more preferably 0.01 to 2% by mass based on the total mass from the viewpoint of heat resistance reliability, More preferably, it is 1.5 mass%.

  The mixing and kneading of each of the above components can be performed by appropriately combining ordinary dispersing machines such as a stirrer, a raking machine, a three-roller, and a ball mill.

(2) Coating to base material The varnish obtained in the above (1) is coated on the base material layer to form a varnish layer. As the base material, it is possible to use a polyethylene terephthalate film, a polyimide film, a polyester film, a polypropylene film, a polyetherimide film, a polyether naphthalate film, a methylpentene film, a film obtained by coating a release agent on them, or the like. it can.

  An automatic applicator can be used for coating, and the coating thickness is determined in consideration of the final thickness of the die bonding film, but is preferably 10 to 250 μm.

(3) Heat-drying The base material layer coated with varnish obtained in (2) above is heat-dried. The conditions for the heat drying are not particularly limited as long as the solvent used is sufficiently volatilized, but it is usually carried out by heating at 60 to 200 ° C. for 0.1 to 90 minutes.

  After heat drying, the substrate layer can be removed to obtain a die bonding film (B-stage film).

  In the present invention, the thickness of the die bonding film is not particularly limited, and is appropriately determined based on the knowledge of those skilled in the art depending on the thickness of the adhesive sheet and the application of the dicing tape-integrated adhesive sheet. It is preferable that If the thickness is less than 40 μm, the film formability and handling tend to be difficult, and if it exceeds 100 μm, the economy is poor and the moldability tends to be difficult. From this viewpoint, the thickness is more preferably 40 to 90 μm, and particularly preferably 40 to 80 μm.

  The die bonding film of the present invention has a constitution having an adhesive layer containing a star copolymer, and usually comprises an adhesive layer containing a star copolymer and a substrate layer in this order. Alternatively, it may be used as a die-bonding film having a two-layer structure, and may have a three-layer structure in which a base material layer is provided on both sides of the adhesive layer as necessary. Alternatively, a laminate of two or more die bonding films of the present invention, or a laminate of a plurality of die bonding films of the present invention and other die bonding films may be used. The die bonding film of the present invention can be used for bonding a semiconductor element and a substrate with wiring in a semiconductor device or bonding semiconductor elements.

  Hereinafter, an example of a manufacturing process of a semiconductor device using the die bonding film of the present invention will be described.

  First, the die bonding film of the present invention and a semiconductor wafer are bonded together. For example, after bonding the adhesive layer of the die bonding film and the semiconductor wafer, the base material layer is peeled off from the die bonding film and bonded to the adhesive layer of the dicing tape, or the adhesive layer and dicing of the die bonding film Examples include a method in which after bonding the adhesive layer of the tape, the base material layer is peeled off from the die bonding film and the semiconductor wafer is bonded.

  Although the semiconductor wafer is not particularly limited, the thickness of the wafer is preferably 100 μm or less, more preferably 75 μm or less, and more preferably 50 μm or less from the viewpoint that a semiconductor device excellent in moisture absorption reflow resistance can be manufactured. It is particularly preferred.

  The dicing tape is not particularly limited, and examples thereof include plastic films such as a polytetrafluoroethylene film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a polymethylpentene film, and a polyimide film. If necessary, the dicing tape may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment.

  After the die bonding film of the present invention and the semiconductor wafer are bonded together by any one of the above methods, it is cut into chips of a desired size with a rotary blade of a cutting device (dicer). In this step, the die bonding film may be completely cut, but a part may remain without being cut. A construction method that completely cuts the die bonding film is referred to as a full cut, and a construction method that does not completely cut the die bonding film and leaves a part thereof is referred to as a half cut.

  In the case of cutting by the half-cut method, the die bonding film remaining without being cut is expanded (hereinafter referred to as “expanding”) at the time of picking up in the pickup die bonder in the next process and / or thrusting needle at the time of picking up. It is also possible to divide the cut-in part by pushing it up with a jig such as.

  As a dicer and a rotary blade (blade) used for cutting the die bonding film, commercially available ones can be used. For example, a full automatic dicing saw 6000 series or a semi-automatic dicing saw 3000 series manufactured by DISCO Corporation can be used as the dicer, and a dicing blade NBC-ZH05 series or NBC-ZH series manufactured by DISCO Corporation can be used as the blade.

  In addition, the present invention is not limited to a dicer that uses a rotary blade such as a fully automatic dicing saw 6000 series manufactured by DISCO Corporation in the process of cutting a laminate of a semiconductor wafer and a die bonding film. The present invention can also be applied to a method of cutting using a laser such as a full automatic laser saw 7000 series manufactured by DISCO, that is, a method of manufacturing a semiconductor device by laser ablation processing or stealth dicing processing.

  The semiconductor chip with a die bonding film separated into pieces by the cutting step can be picked up by using a pickup die bonder that is generally marketed. For example, it can be picked up by using flexible die bonders DB-730 and DB-700 manufactured by Renesas East Japan Semiconductor, and die bonders SPA-300 and SPA-400 manufactured by Shinkawa Co., Ltd.

  By the above, it picks up as a semiconductor chip with a die-bonding film, and a semiconductor device can be obtained by adhere | attaching semiconductor elements or a semiconductor element and a board | substrate with wiring.

  FIG. 2 is a cross-sectional view of one embodiment of the semiconductor device of the present invention. A semiconductor chip 1 ′ is bonded and connected to the surface of the wiring 6 of the substrate 4 with wiring by a die bonding film 8. Another semiconductor chip 1 ″ is bonded on the semiconductor chip 1 ′ by a die bonding film 2, and another semiconductor chip 1 is bonded on the semiconductor chip 1 ″ by a die bonding film 2. . The semiconductor chip 1, the semiconductor chip 1 ′ and the semiconductor chip 1 ″ and the wiring of the substrate 4 with wiring are electrically connected by bonding wires 3. The wiring 6 surface of the substrate 4 with wiring, the semiconductor chip 1, and the semiconductor chip. 1 ′, the semiconductor chip 1 ″ and the bonding wire 3 are sealed with a sealing resin 7. Terminals 5 such as solder balls are provided on the outer surface of the substrate 4 with wiring. The die bonding films 8 and 2 in the semiconductor device are cured by post-curing of the semiconductor chip 1, the semiconductor chip 1 ′, and the semiconductor chip 1 ″ by thermocompression bonding or subsequent heating, or by heating or post-curing during resin sealing. doing.

<Physical properties of die bonding film>
(Tack power)
In the die bonding film of the present invention, the tack force of the uncured film at 40 ° C. is 1,500 mN or less, preferably 1,200 mN or less, more preferably 1,000 mN or less.

  In the die bonding film of the present invention, the tack force of the uncured film at 40 ° C. necessary for picking up without chip cracking in the pick-up process needs to be 1,500 mN or less. When the tack force exceeds 1,500 mN, die bonding films of adjacent chips adhere to each other, and a plurality of chips are picked up simultaneously. The lower limit of the tack force is not particularly limited.

The tacking force of the uncured film at 40 ° C. of the die bonding film was measured using a tacking tester manufactured by Reska Co., Ltd. The conditions were as follows: film thickness: 40 μm, indentation speed: 2 mm / second, pulling speed: 10 mm / second, stop load: 100 gf / cm ² , stop time: 1 second, with the sample measurement surface facing up on a 40 ° C. stage. The tack strength against a 40 ° C. probe (SUS304 having a diameter of 5.1 mm (φ)) was measured and determined. The measurement surface was the surface to be attached to the dicing tape. Here, the film uncured product refers to a B-stage film.
As a method of increasing the tack force of the die bonding film, it is effective to use a star copolymer having a low glass transition temperature, to add a liquid epoxy resin, and to reduce the filler content. As a method for lowering, it is effective to use a star copolymer having a high glass transition temperature, add a solid epoxy resin, and increase the filler content. As the liquid epoxy resin, for example, Toto Kasei Co., Ltd., trade names: YDF-8170C, YDCN701, 702, 703, 704, 700-10, Yuka Shell Epoxy Co., Ltd., trade names: Epicoat 807, 815, 825, 827, 828, 834, 1001, 1004, 1007, 1009, manufactured by Dow Chemical Co., Ltd., trade name: DER-330, 301, 361, manufactured by Yuka Shell Epoxy Co., Ltd., trade name: Epicoat 152, 154, Nippon Kayaku Yakuhin Co., Ltd., trade name: EPPN-201, Dow Chemical Co., Ltd., trade name: DEN-438, and the like. Examples of the solid epoxy resin include those manufactured by Toto Kasei Co., Ltd., trade name: YSLV-80XY, YDF2001, manufactured by DIC Corporation, product name: EPICLON, and the like can be given.

(Melt viscosity)
In the die bonding film of the present invention, the melt viscosity of the uncured film (B stage state) at 80 ° C. is 10,000 Pa · s or less, preferably in the range of 100 to 10,000 Pa · s, more preferably. It is in the range of 250 to 8,000 Pa · s, particularly preferably in the range of 500 to 5,000 Pa · s.

  In the die bonding film of the present invention, the melt viscosity of the uncured film (B stage state) at 80 ° C. is 10,000 Pa · as film fluidity for ensuring the embedding property of the bonding wire of the lower chip in the die bonding process. Must be less than or equal to s. When the melt viscosity exceeds 10,000 Pa · s, the bonding wire of the lower chip cannot be filled only by the crimping process, and voids remain inside the completed semiconductor package, and the voids serve as a starting point for moisture absorption reflow. Sometimes peeling occurs and reliability is impaired. Although the minimum of the said melt viscosity is not specifically limited, A film may foam at the time of heating, such as a die-bonding process or a film hardening process, as it is less than 100 Pa * s.

  The melt viscosity at 80 ° C. of the uncured product of the die bonding film was measured and calculated by the parallel plate plastometer method shown in Journal of Applied Physics (17) P458 (1946). Two uncured films with a thickness of 60 μm are laminated at 40 ° C., and a film with a thickness of about 120 μm is punched to a diameter of 6 mm using a punching die, and a slide glass with a thickness of 150 μm is pasted on both sides to prepare a test sample. Produced. This was pressure-bonded (80 ° C./1 MPa / 3 seconds) using a COB bonder (AC-SC-400B, manufactured by Hitachi Chemical Co., Ltd.). Samples before and after pressing were taken with a scanner, the area was calculated with image analysis software, and the film thickness before and after pressure bonding was calculated.

The melt viscosity (η) of the uncured product of the die bonding film was calculated by using the following mathematical formula.

Z ₀ : thickness of die bonding film adhesive film before applying load Z: thickness of die bonding film adhesive film after applying load V: volume of die bonding film adhesive film F: magnitude of applied load t : Time when the load is applied To lower the melt viscosity of the uncured film of the die bonding film at 80 ° C, it is effective to use a curing agent with a low softening point and to add an epoxy resin as a thermosetting component .

(Adhesive strength)
In the die bonding film of the present invention, the adhesive strength of the cured film at 265 ° C. is 3.5 MPa or more, preferably 4.0 MPa or more, more preferably 4.5 MPa or more.

  In the cured die-bonding film of the present invention, the adhesive strength at 265 ° C. with the lower chip necessary for ensuring good moisture absorption reflow resistance is 3.5 MPa or more. When the adhesive strength is less than 3.5 MPa, it is not practical because peeling occurs at the interface with the lower chip in the reflow process after moisture absorption.

  The adhesion strength of the cured die bonding film here was measured by the following method. First, a die bonding film having a thickness of 40 μm is attached to a semiconductor wafer having a thickness of 400 μm at 60 ° C., and dicing into 3.2 mm square. On the surface of the substrate (trade name “E-697FG” manufactured by Hitachi Chemical Co., Ltd.) coated with a resist (trade name “AUS308” manufactured by Taiyo Ink Manufacturing Co., Ltd.) A sample is obtained by thermocompression bonding under the conditions of 100 ° C., 0.1 MPa, and 1 s. Then, the obtained sample is cured at 175 ° C. for 5 hours after step curing in the order of 100 ° C./1 hour, 110 ° C./1 hour, 120 ° C./1 hour to obtain a measurement sample. The measurement sample is moisture-absorbed for 168 hours under the conditions of 85 ° C. and 60 RH%. A measurement sample is placed on a hot plate set so that the surface of the resist-coated substrate is 265 ° C., and the die shear strength after being left for 30 seconds is measured. The measurement is performed using a Dage 4000 manufactured by Dage Precision Industries, under the conditions of a measurement height: 50 μm and a measurement speed: 50 μm / s.

  In order to increase the adhesive strength of the cured film of the die bonding film at 265 ° C., it is effective to increase the amount of filler and decrease the amount of rubber.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited to a following example.

Synthesis example 1
(Synthesis of ligand)
A Dimroth equipped with a three-way cock and a septum mule were attached to a 50 ml two-necked eggplant flask and placed in an N ₂ atmosphere, and then 25.0 ml (521.4 mmol) of formic acid was weighed. After cooling to 0 ° C., 10.0 ml (123.2 mmol) of formaldehyde was added, and the mixture was stirred at 0 ° C. for 1 hour. To this reaction solution, an aqueous solution in which 1.5 ml (10.0 mmol) of tris (2-aminoethyl) amine was dissolved in 5 ml of distilled water was dropped over about 10 minutes. Then, the reaction liquid was returned to room temperature (25 degreeC), and it was under nitrogen stream.

  Next, this reactor was installed in an oil bath set at 95 ° C. and gently refluxed for 10 hours. Then, after returning to room temperature (25 ° C.) and removing the solvent with an evaporator, the residue was treated with a saturated aqueous NaOH solution.

The organic layer was extracted and then dried over magnesium sulfate, and the solvent was distilled off under reduced pressure to obtain 1.9 g of hexamethyltris (2-aminoethyl) amine as a pale yellow liquid (yield 86%). The structure was confirmed by ¹ H-NMR and ¹³ C-NMR.

Synthesis example 2
(Synthesis of trifunctional initiator)
Phloroglucinol 1.00 g (7.93 mmol) was weighed in a 100 ml two-necked eggplant flask equipped with a three-way cock and septum mule. After making the N ₂ atmosphere, 40.0 ml of dehydrated tetrahydrofuran was added. Further, 3.9 ml (27.8 mmol) of triethylamine was added and cooled to 0 ° C.

  Subsequently, 2.8 ml (27.8 mmol) of 2-bromopropionic acid chloride was slowly added dropwise, and then returned to room temperature (25 ° C.) to proceed the reaction for 2 hours. The reaction was traced using TLC (Thin Layer Chromatography), and when the spot of the raw material disappeared, the reaction was regarded as completed.

After completion of the reaction, the mixture was filtered to remove the hydrochloride in the solution, and the solvent was distilled off with an evaporator. The residue was recrystallized from methanol to obtain 2.4 g (yield 57%) of a white solid product having the following structural formula. The structure was confirmed by ¹ H-NMR and ¹³ C-NMR.

Synthesis example 3
(Synthesis of star-shaped acrylic copolymer)
A three-way cock and a septum mule were attached to a 100 ml two-necked flask, and 9.5 mg (0.15 mmol) of Cu (0) and 3.4 mg (0.015 mmol) of CuBr ₂ were weighed. The inside of the reaction vessel was N ₂ atmosphere, 9.9 g (77.64 mmol) of butyl acrylate, 7.4 g (73.98 mmol) of ethyl acrylate, 0.8 g (5.43 mmol) of glycidyl methacrylate, and acrylonitrile 7.6 g (142.95 mmol), dehydrated DMSO (dimethyl sulfoxide) 29.4 ml, and hexamethyltris (2-aminoethyl) amine synthesized in Synthesis Example 1 were added in the order of 34.6 mg (0.15 mmol). .

Further, 3.0 ml of a solution prepared by dissolving 106.2 mg of the trifunctional initiator synthesized in Synthesis Example 2 in 4.0 ml of dehydrated DMSO was added. After the inside of the reaction system was deoxygenated by N ₂ flow (400 ml / min × 15 min), a reaction vessel was placed in an oil bath at a set temperature of 30 ° C., and the reaction was allowed to proceed for 25 hours.

  After completion of the reaction, 30 ml of methyl ethyl ketone was added, the viscosity in the system was reduced, and the mixture was filtered using a membrane filter (polytetrafluoroethylene, 0.2 μm). The filtrate was reprecipitated with 600 ml of methanol and then dried under reduced pressure at 40 ° C. to obtain 13.6 g (yield 53%) of a pale yellowish white rubber-like product. Since the number average molecular weight (Mn) is linearly related to the polymerization rate, it is suggested that there is almost no side reaction during the reaction, and that the desired star-shaped acrylic copolymer is obtained. confirmed.

  The synthesized star acrylic copolymer had a weight average molecular weight of 200,000. The glass transition temperature Tg was 44 ° C. The weight average molecular weight is a value obtained by gel permeation chromatography (GPC).

  Next, varnish was prepared as follows using the obtained star-shaped acrylic copolymer.

Examples 1-2 and Comparative Examples 1-3
(Preparation of varnish)
Using the acrylic copolymer, epoxy resin, curing agent, filler, curing accelerator, and coupling agent shown below, the composition (parts by mass) shown in Table 1 was obtained, and cyclohexanone was added, followed by stirring and defoaming A varnish having a nonvolatile content of 40% by mass was prepared.

[Acrylic copolymer]
Star acrylic copolymer: Star acrylic copolymer synthesized in Synthesis Example 3 (glass transition temperature 44 ° C., weight average molecular weight 200,000)
HTR-860P-3 (trade name): linear acrylic rubber (manufactured by Nagase ChemteX Corporation, glass transition temperature 25 ° C., weight average molecular weight: 800,000)
[Epoxy resin]
YDF-8170C (trade name): manufactured by Tohto Kasei Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent 156
YDCN-703 (trade name): manufactured by Tohto Kasei Co., Ltd., o-cresol novolac type epoxy resin, epoxy equivalent 209
YSLV-80XY (trade name): manufactured by Tohto Kasei Co., Ltd., bisxylenol type epoxy resin, epoxy equivalent 192
YDCN-700-10 (trade name): manufactured by Toto Kasei Co., Ltd., o-cresol novolac type epoxy resin, epoxy equivalent 210
[Curing agent]
XLC-LL: Millex XLC-LL (trade name), manufactured by Mitsui Chemicals, phenol resin, hydroxyl group equivalent 175
LF-4871: Phenolite LF-4871 (trade name), DIC Corporation, hydroxyl equivalent 118
[Filler]
SC2050-HLG (trade name): manufactured by Admatechs, silica filler dispersion, average particle size 0.5 μm
[Curing accelerator]
2PZ-CN: Curesol 2PZ-CN (trade name), manufactured by Shikoku Chemicals Co., Ltd., 1-cyanoethyl-2-phenylimidazole [coupling agent]
A-189: NUC A-189 (trade name), manufactured by Nippon Unicar Co., Ltd., γ-mercaptopropyltrimethoxysilane A-1160: NUC A-1160 (trade name), manufactured by Nippon Unicar Co., Ltd., γ-ureidopropyltri Ethoxysilane (die bonding film coating)
Using an applicator automatic coating machine (manufactured by Tester Sangyo Co., Ltd.), the varnish prepared above is applied onto a polyethylene terephthalate (PET) substrate (manufactured by Teijin DuPont Films, Inc., trade name: Mylar A53), It was coated with an applicator with adjusted gap.

  The obtained film was heat-dried in an oven at 120 ° C./20 minutes. Thereafter, the PET base material was peeled off to obtain a B-staged die bonding film uncured material having a film thickness of 60 μm.

(Post-curing of die bonding film)
The die-bonding film uncured material obtained as described above is heat-cured in an oven at 120 ° C./30 minutes, 140 ° C./1 hour, 175 ° C./2 hours, did.

(Die bonding film evaluation)
Evaluation shown below was performed about each of the die-bonding films of Examples 1-2 and Comparative Examples 1-3 obtained from the above.

(1) Measurement of tack force The tack force of the uncured film of the die bonding film at 40 ° C. was measured using a tacking tester manufactured by Reska Co., Ltd. The conditions were as follows: film thickness: 40 μm, indentation speed: 2 mm / second, pulling speed: 10 mm / second, stop load: 100 gf / cm ² , stop time: 1 second, with the sample measurement surface facing up on a 40 ° C. stage. The tack strength against a 40 ° C. probe (SUS304 having a diameter of 5.1 mm (φ)) was measured and determined. The measurement surface was the surface to be attached to the dicing tape. The results are shown in Table 1.
(2) Measurement of melt viscosity The melt viscosity at 80 ° C of the uncured product of the die bonding film was measured and calculated by the parallel plate plastometer method shown in Journal of Applied Physics (17) P458 (1946). Two uncured films with a thickness of 60 μm were laminated on a film with a thickness of about 120 μm at 40 ° C., punched to a diameter of 6 mm using a punching die, and a glass slide with a thickness of 150 μm was pasted on both sides. Produced. This was pressure-bonded (80 ° C./1 MPa / 3 seconds) using a COB bonder (AC-SC-400B, manufactured by Hitachi Chemical Co., Ltd.). Samples before and after pressing were taken with a scanner, the area was calculated with image analysis software, and the film thickness before and after pressure bonding was calculated.

The melt viscosity (η) of the uncured product of the die bonding film was calculated by using the following mathematical formula.

Z ₀ : thickness of die bonding film adhesive film before applying load Z: thickness of die bonding film adhesive film after applying load V: volume of die bonding film adhesive film F: magnitude of applied load t : Load application time (3) Measurement of adhesive strength The adhesive strength of the cured die bonding film was measured by the following method. A die bonding film having a thickness of 40 μm was attached to a semiconductor wafer having a thickness of 400 μm at 60 ° C. and diced to 3.2 mm square. On the surface of the substrate (trade name “E-697FG” manufactured by Hitachi Chemical Co., Ltd.) coated with a resist (trade name “AUS308” manufactured by Taiyo Ink Manufacturing Co., Ltd.) A sample was obtained by thermocompression bonding under conditions of 100 ° C., 0.1 MPa, and 1 second.

  Thereafter, the obtained sample was cured at 175 ° C. for 5 hours after step curing in the order of 100 ° C./1 hour, 110 ° C./1 hour, 120 ° C./1 hour to obtain a measurement sample. The measurement sample was moisture-absorbed for 168 hours under the conditions of 85 ° C. and 60 RH%.

A measurement sample was placed on a hot plate set so that the surface of the resist-coated substrate was 265 ° C., and the die shear strength after being left for 30 seconds was measured. The measurement was performed using a Dage 4000 manufactured by Dage Precision Industries, under the conditions of a measurement height: 50 μm and a measurement speed: 50 μm / second. The results are shown in Table 1.
(4) Evaluation of pickup property A die bonding film in a B-stage state is cut out to a diameter of 210 mm, and a die attach film mounter (trade name: T-80MW, manufactured by Denki Kagaku Kogyo Co., Ltd.) on a dicing tape having a thickness of 80 μm. Bonding was performed at room temperature (25 ° C.) using a product of DMMC, trade name DM-300-H. In addition, the open surface at the time of coating (the reverse side of a polyethylene terephthalate film) and the dicing tape were bonded together, and the die bonding film and the dicing tape laminated product were obtained.

  A semiconductor wafer having a thickness of 50 μm was laminated on the die bonding film / dicing tape laminated product on a hot plate to obtain a semiconductor wafer / die bonding film / dicing tape laminated product, and a dicing sample was produced. The hot plate surface temperature during lamination was set to 40 ° C. The said dicing sample was cut | disconnected using the Disco Co., Ltd. make and brand name full-automatic dicing saw DFD-6361.

Cutting is a single-cut method that completes the processing with one blade, using a product name dicing blade NBC-ZH104F-SE 27HDBB for the blade, blade rotation speed of 45,000 min ⁻¹ , cutting speed of 50 mm / sec. Performed under conditions. The blade height at the time of cutting was set to cut a dicing tape by 20 μm (60 μm). The size for cutting the semiconductor wafer was 10 × 10 mm.

  The pick-up property of the semiconductor chip with a die bonding film produced by the above method was evaluated using a trade name flexible die bonder DB-730 manufactured by Renesas East Japan Semiconductor Co., Ltd. The pickup collet used was manufactured by Micromechanics, Inc., trade name RUBBER TIP 13-087E-33 (size: 10 × 10 mm), and the push-up pin was manufactured by Micromechanics, Inc., trade name EJECTOR NEEDLE SEN2-83-05 (diameter: 0.7 mm, tip shape: semicircle with a diameter of 350 μm) was used.

  As for the arrangement of the push-up pins, nine pins were arranged with a pin center interval of 4.2 mm. The pick-up property was evaluated under the conditions of a pin push-up speed at the time of pick-up: 10 mm / second and a push-up height: 500 μm. When 100 consecutive chips were picked up and no chip cracking or pick-up error occurred, “good”, and even when one chip cracked or pick-up mistake occurred, “bad”. The results are shown in Table 1.

(5) Bonding wire filling ability of lower chip A 100 μm thick semiconductor wafer is laminated on a hot plate to the die bonding film / dicing tape laminate obtained in (4) above, and the semiconductor wafer / die bonding film / dicing tape laminate is obtained. To obtain a dicing sample. The hot plate surface temperature during lamination was set to 40 ° C. The said dicing sump was cut | disconnected using the Disco Co., Ltd. make and brand name full-automatic dicing saw DFD-6361.

Cutting is a single-cut method that completes the processing with one blade, using a product name dicing blade NBC-ZH104F-SE 27HDBB as a blade, blade rotation speed 45,000 min ⁻¹ , cutting speed 50 mm / second It went on condition of. The blade height at the time of cutting was set to cut a dicing tape by 20 μm (60 μm). The size for cutting the semiconductor wafer was 7.5 × 7.5 mm.

  The semiconductor chip with the die bonding film produced by the above method was pressure-bonded onto the wire-bonded semiconductor chip using a trade name flexible die bonder DB-730 manufactured by Renesas East Japan Semiconductor Co., Ltd. The bonding wire of the lower chip was a gold wire with a diameter of 25 μm, and the wire pitch was 200 μm. The pressing conditions of the upper chip were a hot plate temperature of 120 ° C., a load of 0.1 MPa, and a time of 1 second.

  A laminated body obtained by crimping a wire-bonded semiconductor chip with a semiconductor chip with a die-bonding film is observed with a digital microscope (manufactured by Keyence Corporation, VH-6300) for the presence of voids under the bonding wire of the lower chip, and the lower chip The bonding wire filling property was evaluated. When 12 packages were observed, the bonding wire filling property was “good” when no void was present under the wire, and the bonding wire filling property was “bad” when there was a void even in one package. The results are shown in Table 1.

(6) Evaluation of hygroscopic reflow resistance The laminate produced by the method (5) above and bonded with a wire-bonded semiconductor chip with a semiconductor chip with a die bonding film is cured at 110 ° C. for 1 hour and 120 ° C. for 1 hour. After performing this, a sealing material manufactured by Hitachi Chemical Co., Ltd., trade name CEL-9750ZHF was molded on the laminate, and cured at 175 ° C. for 5 hours to obtain a semiconductor package.

  After observing the inside of the semiconductor package and the presence or absence of voids with an ultrasonic exploration imaging apparatus (HYE-FOCUS Scanning Acoustic Tomography, manufactured by Hitachi Construction Machinery Co., Ltd.), the film was dried at 125 ° C. for 12 hours.

The dried semiconductor package was subjected to moisture absorption treatment at 85 ° C., 60% RH and 168 hours, then set to a maximum temperature of 265 ° C. and 30 seconds, and subjected to reflow treatment three times. The semiconductor package after the reflow treatment was observed again with an ultrasonic exploration imaging device, and the inside of the semiconductor package and the presence or absence of voids were observed. After the reflow treatment, 12 packages were observed, and the semiconductor package was peeled off and no void was present. The moisture absorption reflow resistance was “good”. Even one package was peeled and the void was present as moisture absorption reflow resistance “bad”. did. The results are shown in Table 1.

  From Table 1, Examples 1 and 2 show that the thin wafer can be picked up without cracking, the bonding wire of the lower chip can be filled in the crimping process, and the semiconductor package manufactured using the die bonding film of the present invention. Has good moisture absorption reflow resistance.

  Comparative Examples 1 and 2 are not preferable because the tack force at 40 ° C. is as high as 3,079 mN and 2,269 mN, respectively, and pickup failure occurs. Further, Comparative Example 3 is not preferable because the melt viscosity is as high as 28000 Pa · s, the bonding wire of the lower chip is inferior in filling property, and peeling occurs due to the unfilled portion as a starting point during reflow treatment after moisture absorption. Further, Comparative Example 1 is not preferable because the adhesive strength is as low as 2.8 MPa, and peeling occurs during the reflow treatment after moisture absorption.

DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip, 2 ... Die bonding film for wire embedding, 3 ... Bonding wire, 4 ... Substrate, 5 ... Terminal, 6 ... Wiring, 7 ... Sealing resin, 8 ... Die bonding film

Claims (4)

A die bonding film for bonding and fixing semiconductor elements, wherein the die bonding film has a star-shaped acrylic copolymer , a thermosetting resin, a curing agent, and an adhesive layer containing an inorganic filler ,
The tack strength of the uncured film at 40 ° C. is 1,500 mN or less, the melt viscosity of the uncured film at 80 ° C. is 10,000 Pa · s or less, and the adhesive strength of the cured film at 265 ° C. is 3.5 MPa or more. Die bonding film. The thickness of the die bonding film, a die-bonding film according to claim 1 which is 40 to 100 [mu] m.   The die bonding film according to claim 1 or 2, wherein the star acrylic copolymer has a weight average molecular weight of 30,000 to 1,000,000. The semiconductor device which has a structure which adhere | attached semiconductor elements using the die-bonding film as described in any one of Claims 1-3 .

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