JP5539155B2 - Method for manufacturing ink jet recording head - Google Patents

Description

  The present invention relates to a method for manufacturing an ink jet recording head capable of ejecting ink droplets.

  In the ink jet recording head, it is important to control the surface characteristics of the discharge port surface in order to obtain good ink discharge performance. If an ink pool remains in the vicinity of the ejection port, the flying direction of the ink droplet may be deflected, or a load may be applied to the ejected ink droplet, resulting in a decrease in the ejection speed of the ink droplet. As a method of improving these and discharging ink with high accuracy, there is a method of performing water-repellent processing around the discharge port.

  In order to arrange the discharge ports at high density, a method using photolithography is useful for forming the member provided with the discharge ports. Patent Document 1 discloses the use of a condensation product of a hydrolyzable silane compound having a fluorine-containing group and a hydrolyzable silane compound having a cationic polymerizable group as a water-repellent material having photosensitivity. Yes. In Patent Document 1, the water repellent material is used to perform water repellent processing by simultaneously performing patterning exposure and development on a water repellent layer and a layer forming a member provided with a discharge port. .

JP 2010-23525 A

  In general, most water repellent materials contain fluorine elements that have low affinity with organic resins, and depending on the application conditions, the water repellent material may agglomerate, resulting in dents in the member provided with the discharge port. There is. An object of the present invention is to suppress the occurrence of dents in a member provided with discharge ports due to aggregation of water repellent material, and to form a discharge port surface with excellent water repellency, thereby realizing high-density and high-quality printing. An ink jet recording head is provided.

  An inkjet recording head manufacturing method according to the present invention includes a substrate, a member provided with an ejection port for ejecting ink formed on the substrate, and a water repellent layer formed on the member. A method of forming a photocationically polymerizable resin layer containing a photocationically polymerizable resin material on a substrate; pattern exposure of the photocationically polymerizable resin layer; A step of forming a latent image of a fine pattern including an exit, and a water repellent material capable of reacting with the photocationically polymerizable resin material to form a bond on the photocationically polymerizable resin layer on which the latent image has been formed. A step of forming a water-repellent layer, and developing the photo-cationic polymerizable resin layer, thereby removing the non-exposed portion of the photo-cationic polymerizable resin layer and removing the water-repellent layer portion corresponding to the non-exposed portion. And the fine A step of forming a turn and a heat treatment to cure the photocationically polymerizable resin layer to form a member provided with the fine pattern, and promote the reaction between the photocationically polymerizable resin material and the water repellent material And a process.

  According to the present invention, it is possible to suppress the occurrence of dents in a member provided with discharge ports due to aggregation of water repellent material, and to form a discharge port surface with excellent water repellency, and to achieve high density and high quality printing. An ink jet recording head that realizes the above can be provided.

It is sectional drawing which shows the formation method of the conventional water repellent layer. It is sectional drawing which shows the formation method of the water repellent layer which concerns on this invention. It is a perspective view which shows an example of the inkjet recording head manufactured by the method based on this invention. It is sectional drawing which shows an example of the manufacturing method of the inkjet recording head which concerns on this invention. It is a flowchart figure which shows an example of the manufacturing method of the inkjet recording head which concerns on this invention.

  As described above, since most of the water repellent material contains a fluorine element having a low affinity with the organic resin, the water repellent material may be aggregated. In particular, when a compound containing a perfluoroalkyl group or a perfluoropolyether group exhibiting high water repellency is used as the water repellent material, the aggregation is more likely to occur. As shown in FIG. 1, in Patent Document 1, as a water repellent treatment, after forming an uncured photosensitive resin layer 1 (FIG. 1A), a water repellent material 2 is applied on the photosensitive resin layer 1. Then, heat treatment is performed (FIG. 1B). Thereafter, pattern exposure and development are performed to form a fine pattern including ejection openings. At this time, since the photosensitive resin layer 1 is soft, when the water repellent material 2 is applied on the photosensitive resin layer 1, the aggregate 3 of the water repellent material is formed as shown in FIG. 1B. In some cases, a depression of about 0.1 to 1.0 μm may occur.

  On the other hand, in the method according to the present invention, an uncured photosensitive resin layer 1 (photocationic polymerizable resin layer) is formed as shown in FIG. A latent image having a fine pattern is formed (FIG. 2A). Thereafter, a water repellent layer containing a water repellent material is formed (FIG. 2B) and developed to form a fine pattern. Thereby, as shown to FIG. 2 (B), a deformation | transformation of the photosensitive resin layer 1 can be suppressed and a water-repellent layer can be formed.

  An example of an ink jet recording head manufactured by the method according to the present invention is shown in FIG. The ink jet recording head shown in FIG. 3 has an ejection port 13 for ejecting ink on a substrate 5 having a plurality of energy generating elements 15 for ejecting ink, and an ink flow that holds the ink in communication with the ejection port 13. It has a channel 16 and a groove 17 formed to flatten the film thickness of the orifice plate. The substrate 5 is provided with an ink supply port 14 for supplying ink to the ink flow path 16.

  Hereinafter, although an example of embodiment of this invention is demonstrated in detail, this invention is not limited to this. FIG. 4 is a view showing a method of manufacturing an ink jet recording head according to the present invention, and FIGS. 4A to 4H are process sectional views corresponding to the A-A 'section of FIG.

  First, a base 7 for forming a groove 17 for flattening the film thickness of the ink flow path mold 6 and the orifice plate is formed on the substrate 5 provided with the energy generating element 15 that generates energy for ejecting ink ( FIG. 4 (A)). Hereinafter, the ink flow path mold 6 and the base 7 are collectively referred to as a mold resist. Since the mold resist is dissolved and removed in a later step, a positive photosensitive resin is used for the mold resist. Specifically, for example, vinyl ketone photodegradable polymer compounds such as polymethyl isopropenyl ketone and polyvinyl ketone are used. As the substrate 5, it is preferable to use a Si substrate.

  Next, the photocationically polymerizable resin layer 8 is formed on the mold resist (FIG. 4B). The cationic photopolymerizable resin layer 8 can be formed by a general application method such as spin coating, slit coating, or roll coating.

  The cationic photopolymerizable resin layer 8 contains a cationic photopolymerizable resin material. Examples of the photocationically polymerizable resin material include epoxy compounds, vinyl ether compounds, oxetane compounds and the like. However, since high mechanical strength and strong adhesion to the base are required, epoxy resins having these characteristics are preferable. Examples of the epoxy resin include bisphenol A type epoxy resin and novolac type epoxy resin. Examples of commercially available products include SU8 (trade name, manufactured by Nippon Kayaku Co., Ltd.), EHPE3150 (trade name, manufactured by Daicel Chemical Industries, Ltd.), and the like.

  The epoxy compound preferably has an epoxy equivalent of 2000 or less, more preferably 1000 or less. When the epoxy equivalent is 2000 or less, it is possible to prevent the crosslinking density from being lowered during the curing reaction, the glass transition temperature of the cured product from being lowered, or the adhesion from being lowered. The epoxy compound preferably has an epoxy equivalent of 100 or more.

  Moreover, since the resolution may deteriorate if the fluidity of the photocationically polymerizable resin layer 8 is high, the photocationically polymerizable resin material is preferably a solid at room temperature of 5 to 35 ° C.

  Examples of the photocationic polymerization initiator for curing the photocationic polymerizable resin layer 8 included in the photocationic polymerizable resin layer 8 include aromatic iodonium salts and aromatic sulfonium salts. Furthermore, cationic polymerization can be accelerated | stimulated by using a reducing agent together with this photocationic polymerization initiator, and heating. Examples of the reducing agent include copper triflate in consideration of reactivity and solubility in an epoxy resin.

  Next, pattern exposure is performed through the mask 9 so that the position where the discharge port 13 of the cationic photopolymerizable resin layer 8 is formed and the position where the groove 17 is formed are the non-exposed portion 10, including the discharge port. A latent image having a fine pattern is formed (FIG. 4C). And in the process (FIG.4 (D)) which heats the photocationic polymerizable resin layer 8 with the acid which generate | occur | produced at the time of exposure, bridge | crosslinking arises in the exposure part 11. FIG. If the crosslinking rate is too small, the photocationic polymerizable resin layer 8 may be deformed due to the application of the water repellent material on the photocationic polymerizable resin layer 8 in the next step, so that deformation does not occur. It is preferable to cure.

  Moreover, in order to produce | generate a chemical bond between the water-repellent layer 12 and the photocationic polymerizable resin layer 8 which are provided in the next step, it is preferable that the reactive group remains. For example, when an epoxy compound is used as the photocationically polymerizable resin material, it is preferable to suppress the crosslinking rate so that an epoxy group remains. Here, when the crosslinking rate indicating the degree of crosslinking is defined by the following formula (1), the crosslinking rate is preferably 5% or more and 95% or less. The residual amount of epoxy groups can be measured by infrared spectroscopy.

  In order to increase the reactivity of the cationic photopolymerizable resin layer 8, it is also useful that the cationic photopolymerizable resin layer 8 contains a compound containing a hydroxyl group or a compound capable of generating a hydroxyl group. As a compound which can produce | generate a hydroxyl group, the compound etc. which have a hydrolyzable silyl group are mentioned, for example. Specific examples of the compound containing a hydroxyl group include 1,4-HFAB (1,4-bis (hexafluoro-2-hydroxy-2-propyl) benzene), and specific examples of the compound capable of generating a hydroxyl group are commercially available. In the product, A-187 (trade name, manufactured by GE Toshiba Silicones) is mentioned.

  Next, the water repellent layer 12 is formed on the photocationically polymerizable resin layer 8 (FIG. 4E). The water repellent layer 12 can be formed by a film forming method such as a general-purpose spin coating method, slit coating method, roll coating method, dip coating method, or vacuum deposition method. As the water repellent material contained in the water repellent layer 12, it is preferable to use a compound having a fluorine-containing group. Among them, it is more preferable to use a compound having a perfluoroalkyl group or a perfluoropolyether group in order to exhibit high water repellency. As the perfluoroalkyl group, for example, the following formula (2)

(In the formula (2), n is an integer of 3 or more). As the perfluoropolyether group, for example, the following formula (3)

(In formula (3), p, q, r, and s are 0 or an integer of 1 or more, and at least one is an integer of 1 or more).

  Comparing the number of repeating units (n, p, q, r, s) of these water repellent groups, generally, in commercially available water repellent materials, p, q, r, s are often larger than n. . Therefore, the water repellent material having a perfluoropolyether group contains more fluorine atoms in one molecule than the water repellent material having a perfluoroalkyl group, and tends to exhibit high water repellency. The average molecular weight of the perfluoropolyether group is preferably from 500 to 20000, since water repellency is not exhibited if it is too small, and if it is too large, the solubility in a solvent is reduced. It is more preferable that In addition, in the case of the said Formula (3), the average molecular weight of a perfluoro polyether group shows the average molecular weight of the part shown by a repeating unit.

  On the other hand, as the water repellent material contained in the water repellent layer 12, a compound that can react with the photo cationic polymerizable resin material contained in the photo cationic polymerizable resin layer 8 to form a bond is used. When the photocationically polymerizable resin material has at least one functional group selected from the group consisting of a hydroxyl group, an epoxy group, and an oxetane group, a compound having a functional group that can react with the functional unit to form a bond. Can be mentioned. Specific examples include compounds having a hydrolyzable silyl group at the terminal portion. As the water repellent material, for example, the following formula (4)

(In the formula (4), Rf is a perfluoroalkyl group or perfluoropolyether group, R is a hydrolyzable substituent, X is an alkylene group having 1 to 3 carbon atoms, Y is a non-hydrolyzable substituent, and a is A compound represented by the following formula (5):

(In Formula (5), Rf, R, X, Y, and a are synonymous with Formula (4).), The following formula (6)

(In Formula (6), Rf, R, X, Y, and a are synonymous with Formula (4). Moreover, Z is a hydrogen atom or an alkyl group, m shows a positive integer.) Is mentioned.

  Examples of the hydrolyzable substituent for R include a halogen atom, an alkoxy group, an amino group, and a hydrogen atom. Among these, an alkoxy group such as a methoxy group or an ethoxy group that can easily control the reactivity is preferable. Examples of the non-hydrolyzable substituent for Y include alkyl groups such as a methyl group and an ethyl group. Examples of X include a methylene group, an ethylene group, and a propylene group.

  Commercially available products include OPTOOL DSX, OPTOOL AES (above trade name, manufactured by Daikin Industries, Ltd.), Novec EGC-1720 (trade name, manufactured by Sumitomo 3M Limited), FG-5010, FG-5020, FS-2050 ( As mentioned above, trade names, manufactured by Harves Co., Ltd.), OPC-700, OPC-800, XOPC-900 (trade names, manufactured by Noda Screen Co., Ltd.) and the like can be mentioned.

  When the water repellent material has a hydrolyzable silyl group, hydrolysis occurs due to moisture in the air, and a silanol group is generated. Furthermore, reaction with a silanol group and the epoxy group and hydroxyl group which exist in the photocationic polymerizable resin layer 8 surface is accelerated | stimulated by heating. At this time, in order to promote hydrolysis of the water repellent material and further generate silanol groups, it is preferable to form the water repellent layer 12 in an environment containing water. For example, treatment such as exposure under humidification can be performed, but the moisture content in the air is sufficient, and humidification is not essential.

  The concentration of the water repellent material solution when the water repellent material is applied as a solution is appropriately determined depending on the intended use and the material of the photocationically polymerizable resin layer 8. As a density | concentration of the water repellent material in a water repellent material solution, 0.01-1.0 mass% is preferable. More preferably, it is 0.05-0.5 mass%. When the concentration of the water repellent material is within the above range, sufficient water repellency and durability are exhibited, density unevenness is not observed on the surface of the coating film, and uniform water repellency is obtained over the entire coating film surface. Examples of the solvent for diluting the water repellent material include hydrofluorocarbon, perfluorocarbon, hydrofluoroether, hydrofluoropolyether, perfluoropolyether and the like. The thickness of the water repellent layer 12 is preferably about several nm, for example, 1 to 10 nm.

  Next, by developing the photo-cationic polymerizable resin layer 8, the non-exposed portion 10 of the photo-cationic polymerizable resin layer 8 is removed, and the water-repellent layer portion corresponding to the non-exposed portion 10 is removed, A discharge port 13 and a groove 17 which are fine patterns are formed (FIG. 4F). The water repellent layer 12 is formed as thin as several nanometers according to the above-described conditions, and the water repellent layer portion corresponding to the non-exposed portion 10 can be removed together with the non-exposed portion 10 during development. For development of the cationic photopolymerizable resin layer 8, a solvent capable of dissolving the non-exposed portion 10 of the cationic photopolymerizable resin layer 8 can be used.

  Finally, an ink supply port 14 is formed on the back surface of the substrate 5, and the mold resist is removed using a solvent capable of dissolving the mold resist (FIG. 4G). Thereafter, in order to completely cure the uncrosslinked photocationic polymerizable resin material in the photocationic polymerizable resin layer 8, curing is accelerated by heating (FIG. 4 (H)). Thus, the photocationically polymerizable resin layer 8 is a member provided with the discharge port 13 and the groove 17 which are the fine patterns. At this time, the reaction between the photocationically polymerizable resin layer 8 and the water repellent material is further promoted, and the bond between the member and the water repellent layer 12 can be further strengthened.

  Hereinafter, exemplary embodiments of the present invention will be described in detail.

[Example 1]
FIG. 4 is a diagram showing a method for manufacturing an ink jet recording head according to the present invention. FIG. 5 is a flowchart showing the steps based on FIG.

  First, polymethylisopropenyl ketone (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name: ODUR-1010) was applied on the Si substrate 5 provided with the energy generating element 15 to a thickness of 14 μm. Next, the pattern of the ink flow path mold 6 and the base 7 is exposed by an exposure apparatus UX3000 (trade name, manufactured by Ushio Electric Co., Ltd.), developed with methyl isobutyl ketone (MIBK), and the ink flow path mold 6 and the base 7 are removed. Formed (FIG. 4A).

  Next, as shown in FIG. 4B, a solution containing the material shown in Table 1 was applied onto the substrate 5 and the mold resist, and heat-treated at 60 ° C. for 9 minutes. Thereby, the photocationically polymerizable resin layer 8 was formed. The film thickness of the photocationically polymerizable resin layer 8 on the mold resist was 25 μm.

Next, using the MPA-600 (trade name, manufactured by Canon Inc.) with respect to the photo cationic polymerizable resin layer 8, the photomask is formed so that the discharge port 13 and the groove 17 forming portion become the non-exposed portion 10. 9 and was exposed with a radiation energy of 500 mJ / cm ² (FIG. 4C). Further, heat treatment was performed at 90 ° C. for 4 minutes (FIG. 4D).

  Thereafter, a compound represented by the following formula (7) as a water repellent material (actually, a mixture of compounds represented by the following formula (7)) was used as a fluorinated solvent Novec HFE7600 (trade name, Sumitomo 3M Limited). The product diluted to 0.6% by mass was prepared. The solution was applied onto the photocationically polymerizable resin layer 8 by spin coating. Furthermore, the heat treatment at 90 ° C. for 1 minute volatilized the solvent, and at the same time promoted the reaction between the epoxy resin contained in the photocationically polymerizable resin layer 8 and the water repellent material. As a result, a water repellent layer 12 made of a perfluoropolyether group-containing water repellent material was formed. (FIG. 4E).

(In formula (7), t represents an integer of 20 to 30, and n represents an integer of 1 to 3).

  Next, the photocationically polymerizable resin layer 8 was developed with a solution of xylene / MIBK = 6/4 (mass ratio). By this development treatment, not only the non-exposed portion 10 of the photocationically polymerizable resin layer 8 but also the water-repellent layer portion corresponding to the non-exposed portion 10 can be removed at the same time, and the discharge port 13 and the groove 17 are formed ( FIG. 4 (F)).

  Next, a mask for producing the ink supply port 14 is appropriately disposed on the back surface of the substrate 5, the surface of the substrate 1 is protected by a rubber film (not shown), and then the ink is supplied by anisotropic etching of the substrate 5. Mouth 14 was made. Thereafter, the rubber film was removed, and the entire surface of the substrate 5 was irradiated with ultraviolet rays using an exposure apparatus UX3000 to decompose the mold resist, and the mold resist was dissolved and removed using methyl lactate (FIG. 4G).

  In order to completely cure the photocationically polymerizable resin layer 8 and promote the reaction between the epoxy resin and the water repellent material, a heat treatment was performed at 200 ° C. for 1 hour (FIG. 4 (H)). Thereafter, means for electrical connection and ink supply were appropriately arranged to produce an ink jet recording head.

  As an evaluation of the produced ink jet recording head, measurement of the dynamic contact angle θr with respect to pure water and confirmation of the presence or absence of a dent on the surface of the member provided with the discharge port 13 were performed. The dynamic contact angle θr for pure water was measured using an automatic contact angle (product name: CA-W, manufactured by Kyowa Interface Science Co., Ltd.). Moreover, the presence or absence of the dent of the surface of the member in which the discharge outlet 13 was provided was confirmed using the color 3D laser microscope (Product name: VD-9710, Keyence Corporation make). The evaluation results are shown in Table 2.

  It was confirmed that the ink jet recording head produced in this example had a large θr and good water repellency. Further, no dent was confirmed on the surface of the member provided with the discharge port 13. Further, when printing evaluation was performed using the ink jet recording head, printing deviation or the like was not observed, and high printing quality was shown.

[Examples 2 to 4]
The same water repellent material as in Example 1 was used, and the concentration of the water repellent material was diluted to 0.2, 0.1, and 0.025 mass%, and the ink jet recording head was operated in the same manner as in Example 1. Were made and evaluated. The evaluation results are shown in Table 2. The ink jet recording heads produced by any of the methods of Examples 2 to 4 also had a large θr and good water repellency. Further, no dent was confirmed on the surface of the member provided with the discharge port 13. Further, in printing evaluation, printing deviation or the like was not observed, and high printing quality was shown.

[Examples 5 to 7]
As the water repellent material, a compound represented by the following formula (8), (9) or (10) (in practice, a mixture of compounds represented by the following formula (8), (9) or (10), respectively) ) Was used. Further, the water-repellent material was diluted so that its concentration was 0.2% by mass, and an ink jet recording head was prepared in the same manner as in Example 1. The evaluation results are shown in Table 2.

(In formula (8), u represents an integer of 20-30.)

(In formula (10), v represents an integer of 0 to 20, and w represents an integer of 0 to 30).

  It was confirmed that when any compound of the formulas (8) to (10) was used as the water repellent material, θr was large and showed good water repellency. Further, no dent was confirmed on the surface of the member provided with the discharge port 13. Further, in printing evaluation, printing deviation or the like was not observed, and high printing quality was shown.

  As described above, good water repellency is exhibited under any of the conditions of Examples 1 to 7, which is considered to be due to the reaction between the water repellent material and the epoxy resin.

[Comparative Examples 1-6]
Inkjet recording was carried out in the same manner as in Example 1 except that the water repellent layer 12 was formed before exposure to the photocationically polymerizable resin layer 8 and the type of water repellent material and the concentration of the water repellent material were as shown in Table 3. A recording head was produced. The evaluation results are shown in Table 3. In any of Comparative Examples 1 to 6, θr was large and showed good water repellency, but dents were generated on the surface of the member provided with the discharge port 13. Due to this dent, printing deviation occurred in printing evaluation, and the image quality was lowered.

DESCRIPTION OF SYMBOLS 1 Photosensitive resin layer 2 Water repellent material 3 Aggregate of water repellent material 4 Photosensitive resin layer 5 which performed exposure processing Substrate 6 Ink flow path type 7 Base 8 Photocationic polymerizable resin layer 9 Photomask 10 Non-exposed portion 11 Exposed portion 12 Water repellent layer 13 Discharge port 14 Ink supply port 15 Energy generating element 16 Ink channel 17 Groove

Claims (10)

A method for manufacturing an ink jet recording head, comprising: a substrate; a member provided with a discharge port for discharging ink formed on the substrate; and a water repellent layer formed on the member. ,
Forming a cationic photopolymerizable resin layer containing a cationic photopolymerizable resin material on a substrate;
Pattern exposing the cationic photopolymerizable resin layer, forming a fine pattern latent image including a discharge port;
Forming a water repellent layer including a water repellent material capable of reacting with the photo cation polymerizable resin material to form a bond on the photo cation polymerizable resin layer on which the latent image is formed;
Developing the photo-cationic polymerizable resin layer to remove a non-exposed portion of the photo-cationic polymerizable resin layer, and removing a water-repellent layer corresponding to the non-exposed portion to form the fine pattern; ,
A step of curing the cationic photopolymerizable resin layer by heat treatment to form a member provided with the fine pattern and promoting a reaction between the cationic photopolymerizable resin material and the water repellent material. Manufacturing method of the head.   The method of manufacturing an ink jet recording head according to claim 1, wherein in the step of forming the latent image of the fine pattern, the photocationically polymerizable resin layer is subjected to pattern exposure and then heated.   The method for producing an ink jet recording head according to claim 1, wherein the water repellent material is a compound having a perfluoroalkyl group or a perfluoropolyether group.   The method for producing an ink jet recording head according to claim 1, wherein the water repellent material is a compound having a perfluoropolyether group, and the average molecular weight of the perfluoropolyether group is 500 to 20,000.   The cationic photopolymerizable resin material has at least one functional group selected from the group consisting of a hydroxyl group, an epoxy group, and an oxetane group, and the water repellent material reacts with the functional group of the cationic photopolymerizable resin material. The method for producing an ink jet recording head according to claim 1, wherein the compound has a functional group capable of forming a bond. The water repellent material has the following formulas (4), (5) and (6):

(In the formula (4), Rf is a perfluoroalkyl group or perfluoropolyether group, R is a hydrolyzable substituent, X is an alkylene group having 1 to 3 carbon atoms, Y is a non-hydrolyzable substituent, and a is Indicates an integer from 1 to 3.)

(In Formula (5), Rf, R, X, Y, and a are synonymous with said Formula (4).)

(In Formula (6), Rf, R, X, Y, and a are synonymous with said Formula (4). Moreover, Z is a hydrogen atom or an alkyl group, m shows a positive integer.)
The method for producing an ink jet recording head according to claim 1, comprising any one of the compounds represented by formula (1):   The method for producing an ink jet recording head according to claim 1, wherein the photocationically polymerizable resin layer contains at least one photocationic polymerization initiator of an aromatic iodonium salt or an aromatic sulfonium salt.   The method for manufacturing an ink jet recording head according to claim 1, wherein the photocationically polymerizable resin layer contains an epoxy compound, a vinyl ether compound, or an oxetane compound.   The method of manufacturing an ink jet recording head according to any one of claims 1, 5, 7, and 8, wherein the cationic photopolymerizable resin layer contains an epoxy compound, and the epoxy equivalent of the epoxy compound is 2000 or less.   The method of manufacturing an ink jet recording head according to claim 1, wherein the photocationically polymerizable resin material is solid at 5 to 35 ° C. 10.

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