JP5533031B2 - Laminate type heat exchanger soldering apparatus and method for producing laminated heat exchanger - Google Patents

Description

  The present invention relates to a soldering apparatus for a laminated heat exchanger and a method for manufacturing the laminated heat exchanger.

  Conventionally, a heat exchanger for exchanging heat between water or air and a refrigerant in a heat pump water heater, an air conditioner, or the like is known. In this heat exchanger, various metal parts are joined together by brazing or the like. For example, a metal material such as aluminum, copper, or stainless steel is used as the metal part. Since an oxide film is formed on the surface of the metal part, it is necessary to remove the oxide film when brazing the metal parts together.

  Patent Document 1 proposes a method of manufacturing a heat exchanger using Nokolok (registered trademark) brazing. In this manufacturing method, the oxide film on the surface of the metal part is removed by applying a flux to the surface of the metal part. In Nocolok brazing brazed at high temperature, non-corrosive flux can be used, so there is an advantage that the cleaning of the flux after brazing can be omitted, while in the heating furnace adjustable to an inert gas atmosphere In this case, it is necessary to join the metal parts to each other, so that there is a problem that costs for manufacturing equipment, running costs, and the like increase.

  Patent Document 2 discloses a method for manufacturing a twisted tube heat exchanger in which metal parts are joined together using a thermosetting resin adhesive. This manufacturing method eliminates the need for manufacturing equipment such as brazing, so that the cost can be reduced. On the other hand, since a resin adhesive is used, the thermal conductivity between metal parts is lowered and heat is reduced. There is a problem that the efficiency of the exchange is lowered.

  By the way, if metal parts are joined together by soldering instead of brazing, manufacturing equipment such as brazing becomes unnecessary (brazing is a joining method performed using a brazing material having a melting point of 450 ° C. or higher. Soldering is a joining method performed using a solder material having a low melting point of less than 450 ° C.). On the other hand, since soldering is performed at a lower temperature than brazing, it is necessary to use a corrosive flux having an effect of removing an oxide film even at a low temperature. When this corrosive flux is used, a cleaning process after soldering is required, which complicates the manufacturing process and increases the cost.

  Patent Document 3 proposes a technique for applying an ultrasonic vibration to a metal part to remove an oxide film on the surface of the metal part. That is, Patent Document 3 discloses a method for manufacturing a regenerator capsule in which when an end of a tubular tube is closed, ultrasonic vibration is locally applied to the end of the tube and soldered. . In the manufacturing method of Patent Document 3, since the oxide film on the surface of the metal part can be removed by applying ultrasonic vibration to the metal part, the metal parts can be brazed together without using corrosive flux. Can be joined.

JP 2008-267782 A JP 2006-284209 A JP 2006-3034 A

  However, in the case of manufacturing a stacked heat exchanger, that is, a heat exchanger in which a plurality of metal tubes are stacked and the surfaces of adjacent metal tubes need to be surface-bonded in a wide range, Even if the disclosed local joining technique is applied, the variation in the joining state between the metal tubes becomes large, and sufficient heat exchange efficiency and joining reliability cannot be obtained.

  Therefore, the present invention has been made in view of such points, and the object of the present invention is that cleaning after bonding and heating in an inert gas atmosphere are unnecessary, and heat exchange efficiency and bonding reliability are achieved. It is an object to provide a soldering apparatus capable of producing an excellent laminated heat exchanger and a method for producing the laminated heat exchanger.

The soldering apparatus of the present invention includes a laminated heat exchanger (17) in which a first metal tube (11) and a second metal tube (13) arranged in a laminated manner are joined by a solder layer (15) interposed therebetween. ). This soldering apparatus includes auxiliary heating means (19), main heating means (21a), and vibration means (21b). The auxiliary heating means (19) is for heating at least one of the first metal tube (11), the second metal tube (13), and the solder layer (15). The main heating means (21a) is for joining the first metal tube (11) and the second metal tube (13) by setting the temperature of the solder layer (15) to a melting point or higher. The vibration means (21b) is for applying ultrasonic vibration to the first metal tube (11) and the second metal tube (13). The soldering apparatus includes a pressurizing unit (81) for pressurizing the first metal tube (11) and the second metal tube (13) arranged in a stacked manner via the solder layer (15) in the stacking direction. And a control means (25) for controlling the pressurizing means (81). The control means (25) detects that the solder layer (15) is in a semi-molten state, and then The pressurizing means (81) is controlled so as to start pressurization in the stacking direction with respect to the first metal pipe (11) and the second metal pipe (13).

  In this configuration, since the oxide film of the metal tube is removed by applying ultrasonic vibration, no flux is required and cleaning is not required. Moreover, in this structure, since metal tubes are joined together by soldering, heating in an inert gas atmosphere is unnecessary. Moreover, in this configuration, in addition to the main heating means (21a) for setting the temperature of the solder layer (15) to the melting point or higher, the auxiliary heating means (19) for assisting the heating by the main heating means (21a) is provided. Yes. Therefore, as compared with the case of heating only by the main heating means (21a), temperature variation at the time of joining in the solder layer (15) interposed between the first metal tube (11) and the second metal tube (13). Can be reduced. Thereby, since the dispersion | variation in the joining state of the metal pipes by a solder layer (15) is reduced, the laminated heat exchanger (17) excellent in heat exchange efficiency and joining reliability can be manufactured.

  The heating by the auxiliary heating means (19), the heating by the main heating means (21a), and the application of the ultrasonic vibration are performed by the first metal tube (11), the solder layer (15), and the second. It is preferable to carry out the temporary assembly (23) in which the metal tubes (13) are laminated in this order.

  In this configuration, heating by the auxiliary heating means (19), heating by the main heating means (21a), and application of the ultrasonic vibration are performed on the temporary assembly (23). Therefore, in this structure, these heating and vibration provision can be collectively performed with respect to a temporary assembly (23). Accordingly, for example, the first metal tube (11) and the second metal tube (13) are individually heated by the auxiliary heating means (19), the main heating means (21a), and the ultrasonic vibration. Compared to the cases where the application is performed, the removal of the oxide film of the first metal tube (11) and the second metal tube (13) and the joining of the first metal tube (11) and the second metal tube (13) are more efficient. Can be done well.

The control means (25) controls the auxiliary heating means (19), the main heating means (21a), and the vibration means (21b), and the control means (25) includes the solder layer (15). ) To the temporary assembly (23) heated by the auxiliary heating means (19) so as to be in a semi-molten state, while applying vibration of ultrasonic waves by the vibration means (21b), It is preferable to execute a control to heat the solder layer (15) to the melting point or higher by heating by the heating means (21a).

  In this configuration, the temporary assembly (23) is heated to a temperature at which the solder layer (15) is in a semi-molten state (a temperature between the solidus temperature and the liquidus temperature). Since the ultrasonic vibration is applied to the temporary assembly (23) in a state where the oxide is removed, the oxide removal effect by the ultrasonic vibration can be further enhanced. The reason is estimated as follows. That is, when the solder layer (15) is in a solid phase (when the temperature of the solder layer (15) is equal to or lower than the solidus temperature), there is an air layer between the metal tube and the solder layer (15). Easy to form. When such an air layer exists, for example, the vibration of the ultrasonic wave applied to the first metal tube (11) may be blocked or attenuated in the air layer, so that the second metal tube (13) It becomes difficult to be transmitted. On the other hand, when the solder layer (15) is in a semi-molten state, the air layer is reduced, so that the vibration of the ultrasonic wave is transmitted from the first metal tube (11) through the solder layer (15) to the second metal. Efficiently transmitted to the tube (13). Moreover, when the solder layer (15) is in a semi-molten state, the shape stability of the solder layer (15) itself is maintained as compared with the case where it is in a molten state, so that the metal tube and the solder layer (15) It is difficult for the relative positional relationship to be shifted.

  Moreover, it is preferable that the soldering apparatus of this invention is equipped with the ultrasonic soldering iron (21) with which the said vibration means (21b) and the said heating means (21a) were comprised integrally.

  In this configuration, the application of ultrasonic vibration and the heat bonding between the metal tubes can be performed with one instrument (ultrasonic soldering iron (21)). Thereby, the structure of the apparatus can be simplified.

Further, the soldering apparatus of the present invention is a pressurizing means (81) for pressurizing the first metal tube (11) and the second metal tube (13) arranged in a stacked manner via the solder layer in the stacking direction. ) that further comprise a.

  In this configuration, since the first metal tube (11) and the second metal tube (13) come into close contact with each other by the pressurizing means (81) during soldering, the joining reliability is improved. Further, by applying pressure, air existing between the metal tube and the solder layer is more easily discharged, so that heat and ultrasonic vibrations are more easily transmitted. In addition, since air is discharged as described above and the air layer between the metal tube and the solder layer decreases, the contact area between the metal tube and the solder layer also increases. Thereby, joining reliability improves more.

  In addition, at least one of the first metal tube (11) and the second metal tube (13) connects one inner surface and the other inner surface of the metal tube in the stacking direction to transmit heat in the stacking direction and It is preferable to have a propagation part (121) that promotes the propagation of ultrasonic waves.

  In this configuration, since at least one of the first metal tube (11) and the second metal tube (13) has the propagation part (121), the first metal tube (11) and the second metal tube (11). When the metal tubes (13) are subjected to heat and ultrasonic vibrations to join the metal tubes in the stacking direction, the ultrasonic waves and heat are easily propagated. Thereby, since joining time can be shortened, production efficiency can be improved. Moreover, since the propagation part (121) is provided in the said metal pipe, since the contact area of a fluid and the said metal pipe can be increased, the heat exchange efficiency at the time of use of a heat exchanger is improved. be able to.

The method of the present invention includes a laminated heat exchanger (17) in which a first metal tube (11) and a second metal tube (13) arranged in a laminated manner are joined by a solder layer (15) interposed therebetween. It is a method for manufacturing. The manufacturing method includes an auxiliary heating step of heating at least one of the first metal tube (11), the second metal tube (13), and the solder layer (15), and the first metal tube (11). And applying ultrasonic vibration to the second metal tube (13), and setting the temperature of the solder layer (15) to a melting point or higher to connect the first metal tube (11) and the second metal tube (13). And a joining step for joining. In the auxiliary heating step, after detecting that the solder layer (15) is in a semi-molten state, the pressurizing means (81) laminates the first metal tube (11) and the second metal tube (13). Start pressurizing in the direction.

  In this method, since the oxide film of the metal tube is removed by applying ultrasonic vibration, no flux is required, and cleaning thereof is also unnecessary. Further, since the metal tubes are joined together by soldering, heating in an inert gas atmosphere is unnecessary. In addition, an auxiliary heating step for assisting heating to bring the temperature of the solder layer (15) to the melting point or higher in the joining step is provided. Therefore, as compared with the case where the solder layer (15) is heated only by the joining process, the solder layer (15) interposed between the first metal tube (11) and the second metal tube (13) is joined at the time of joining. Temperature variation can be reduced. Thereby, since the dispersion | variation in the joining state of the metal pipes by a solder layer (15) is reduced, the laminated heat exchanger (17) excellent in heat exchange efficiency and joining reliability can be manufactured.

  Further, before the auxiliary heating step and the joining step, the first metal tube (11), the solder layer (15), and the second metal tube (13) are laminated in this order, and a temporary assembly (23). It is preferable to further include a molding step for molding the material.

  In this method, an auxiliary heating step and a joining step are performed on the temporary assembly (23) formed in the forming step. Therefore, in this method, these heating and vibration can be collectively applied to the temporary assembly (23). Thereby, for example, the first metal tube (11) and the second metal tube (13) are compared with the case where the auxiliary heating, the main heating, and the application of ultrasonic vibration are individually performed. ) And the oxide film of the second metal tube (13) and the joining of the first metal tube (11) and the second metal tube (13) can be performed efficiently.

  In the auxiliary heating step, the temporary assembly (23) is heated so that the solder layer (15) is in a semi-molten state, and the temporary assembly (23) in the heated state is It is preferable to perform a joining process.

  In this method, the temporary assembly (23) is preheated so as to reach a temperature at which the solder layer (15) is in a semi-molten state (a temperature between the solidus temperature and the liquidus temperature). Since the ultrasonic vibration is applied to the temporary assembly (23) in the above state, the oxide removal effect by the ultrasonic vibration can be further enhanced as described above.

  Prior to the forming step, a solder material is sprayed on at least one surface of the first metal tube (11) and the second metal tube (13) to form the solder layer (15) on the surface. A thermal spraying process may be further provided.

  In this method, since heat and impact are applied to the surface of the metal tube during thermal spraying of the solder material, part or all of the oxide film on the surface of the metal tube is removed at that time. Thereby, the oxide film removal effect on the surface of the metal tube can be further enhanced.

In the method of the present invention, in the bonding step, bonding while maintaining the state where the pressure of the first metal pipe said (11) a second metal tube (13) in the stacking direction. In this case, since the first metal tube (11) and the second metal tube (13) come into close contact with each other during soldering, the joining reliability is improved. Further, by applying pressure, air existing between the metal tube and the solder layer is easily discharged, so that heat and ultrasonic vibrations are more easily transmitted. In addition, since air is discharged as described above and the air layer between the metal tube and the solder layer decreases, the contact area between the metal tube and the solder layer also increases. Thereby, joining reliability improves more. In particular, in the auxiliary heating step, the temporary assembly (23) is heated so that the solder layer (15) is in a semi-molten state, and applied to the heated temporary assembly (23). In the case where the joining step is performed while pressing, the air existing between the metal tube and the solder layer is more easily discharged.

  Further, at least one of the first metal tube (11) and the second metal tube (13) connects one inner surface and the other inner surface of the metal tube in the stacking direction, and heat propagation in the stacking direction and In the case of having the propagation part (121) that promotes the propagation of the ultrasonic wave, the ultrasonic wave and the heat are easily propagated in the lamination direction of the metal tube. Thereby, since joining time can be shortened, production efficiency can be improved. Moreover, since the propagation part (121) is provided in the said metal pipe, since the contact area of a fluid and the said metal pipe can be increased, the heat exchange efficiency at the time of use of a heat exchanger is improved. be able to.

  As described above, according to the present invention, the solder that does not require cleaning after bonding and heating in an inert gas atmosphere, and that can manufacture a stacked heat exchanger excellent in heat exchange efficiency and bonding reliability. An attachment device can be provided.

It is the schematic which shows the structure of the soldering apparatus concerning a 1st form. (A) is a perspective view which shows a laminated heat exchanger, (b) is the top view. FIG. 3 is a side view of the stacked heat exchanger of FIG. 2. (A) is the schematic which shows the header for refrigerant | coolants in the laminated heat exchanger of FIG. 2, (b) is the schematic which shows the header for fluids. (A) is the manufacturing method according to the first embodiment, a cross-sectional view showing a forming step of forming a temporary assembly body, (b) are sectional views showing a temporarily assembled body obtained by molding process. Is a schematic diagram showing an auxiliary heating step and the bonding process in the manufacturing method according to the first embodiment. (A) is a schematic diagram showing a thermal spray process in a manufacturing method according to the first embodiment, (b) are sectional views showing the resultant solder layer with fluid metal plate by spraying step. (A) is a schematic diagram of a first modification of the auxiliary heating step and bonding step in a manufacturing method according to the first embodiment, (b) is a schematic diagram of a second modification of the auxiliary heating step and the bonding step It is. Soldering device according to participate Reference Example 1, and is a schematic diagram showing a method of manufacturing a stacked heat exchanger using the same. Soldering device according to participate Reference Example 2, and is a schematic view showing a manufacturing method of the laminated heat exchanger using the same. Soldering device according to participate Reference Example 3, and is a schematic diagram showing a method of manufacturing a stacked heat exchanger using the same. (A)-(c) is the schematic which shows the modification of the reference example 3. FIG. It is the schematic which shows the reference example 1 of the manufacturing method of a laminated heat exchanger. (A) is a schematic side view showing a manufacturing method according to the implementation embodiments of the present invention, (b) are schematic plan view thereof. It is a schematic front view showing a manufacturing method according to the prior you facilities embodiment. It is a schematic side view showing a soldering apparatus according to the prior you facilities embodiment. It is a schematic side view showing a first modification of the soldering apparatus according to the prior you facilities embodiment. It is a schematic side view showing a second modification of the soldering apparatus according to the prior you facilities embodiment. It is a schematic side view showing a third modification of the soldering apparatus according to the prior you facilities embodiment. (A) is a schematic view showing the front the bonding target in a manufacturing method according to you facilities form temporary assembly body, (b) are a plan view of the temporarily assembled body. (A) is a schematic front view which shows the modification 1 of the said temporary assembly, (b) is a schematic front view which shows the modification 2 of the said temporary assembly. (A) is a schematic front view which shows the modification 3 of the said temporary assembly, (b) is a schematic front view which shows the modification 4 of the said temporary assembly. (A) is a schematic front view which shows the modification 5 of the said temporary assembly, (b) is a schematic front view which shows the modification 6 of the said temporary assembly.

Hereinafter, a first embodiment and an embodiment of the present invention will be described in detail with reference to the drawings.

<First Embodiment>
As shown in FIG. 1, a soldering apparatus 35 according to the first embodiment includes an ultrasonic soldering iron 21 as the heating means 21a and the vibrating means 21b, a heater 19 as an auxiliary heating means, as a control means And a control unit 25. This soldering apparatus 35 is for manufacturing the laminated heat exchanger 17 shown in FIGS. 2 (a), 2 (b) and FIG. 3, for example.

  This laminated heat exchanger 17 can be used as a heat exchanger of a heat pump water heater, for example. In this case, the temperature of water is adjusted by heat exchange between the refrigerant circulating in the refrigerant circuit in the hot water heater (not shown) and the water.

  The heater 19 of the soldering device 35 has a placement surface 19a on which an object to be heated (a temporary assembly 23 described later) is placed. The mounting surface 19a has a size that allows the entire lower surface of the temporary assembly 23 to be in surface contact. The heater 19 plays a role of heating the temporary assembly 23 in an auxiliary manner.

  The ultrasonic soldering iron 21 functions as a main heating means 21a that heats the temporary assembly 23 and heats a solder layer 15 described later to a melting point or higher, and an ultrasonic wave (audible sensation generated on the temporary assembly 23). And a function as a vibration means 21b for generating a vibration of a sound wave having a higher frequency (frequency).

The ultrasonic soldering iron 21 includes a vibrator (not shown) that generates ultrasonic vibrations and a heater (not shown) that heats the temporary assembly 23. The ultrasonic vibration generated by the vibrator and the heat generated by the heater are transmitted to the tip 22 of the ultrasonic soldering iron 21, respectively. The tip portion 22 of the ultrasonic soldering iron 21 in the first embodiment has a contact surface that is in surface contact with the surface of the temporary assembly 23, and has a flat shape (the tip of the tip of the minus screwdriver) that is wider than the thickness. Shape).

  The control unit 25 controls the heater 19 and the ultrasonic soldering iron 21. The control unit 25 includes a central processing unit and a memory for storing various data. Specifically, the control unit 25 controls the temperature of the mounting surface 19a of the heater 19, the temperature of the tip 22 of the ultrasonic soldering iron 21, the frequency of ultrasonic vibration, and the like.

  The control unit 25 can perform position control for moving the ultrasonic soldering iron 21 and / or the heater 19 in the vertical direction. When the control unit 25 heats the temporary assembly 23 and applies ultrasonic vibration to the temporary assembly 23, the tip 22 of the ultrasonic soldering iron 21 is in contact with the surface of the temporary assembly 23. To control. On the other hand, the control unit 25 uses an ultrasonic soldering iron so that the temporary assembly 23 can be inserted between the mounting surface 19a and the tip 22 when the temporary assembly 23 is attached to or detached from the soldering device 35. The position of the tip portion 22 of 21 is controlled.

  As shown in FIGS. 2A, 2B, and 3, the stacked heat exchanger 17 includes a heat exchanging portion 31 for exchanging heat between a fluid such as water and a refrigerant, and the heat exchanging portion. And header portions 33 provided at both ends of 31.

  The laminated heat exchanger 17 includes a fluid metal tube (first metal tube) 11 and a refrigerant metal tube (second metal tube) 13 laminated at one position in the thickness direction of the fluid metal tube 11. And a metal pipe for refrigerant (third metal pipe) 14 laminated at a position on the other side in the thickness direction of the metal pipe for fluid 11.

  As shown in FIG. 5A, the fluid metal pipe 11 has a flat shape having a width larger than the thickness. A fluid channel 11 a extending in the longitudinal direction is formed inside the metal pipe 11 for fluid. The fluid metal tube 11 has a long shape as shown in FIGS. 2 (a), 2 (b) and FIG.

  Refrigerant metal tubes 13 and 14 each have a flat shape having a width larger than a thickness. Moreover, the metal pipes 13 and 14 for refrigerant | coolants respectively have an elongate shape, as shown to Fig.2 (a), (b) and FIG. The refrigerant metal tube 13 is a multi-hole tube in which a plurality of refrigerant channels 13a extending in the longitudinal direction are formed. The plurality of refrigerant flow paths 13a are independent from each other and are arranged in a line in the width direction. Similarly, the refrigerant metal tube 14 is a multi-hole tube in which a plurality of refrigerant channels 14a extending in the longitudinal direction are formed. The plurality of refrigerant flow paths 14a are independent from each other and are arranged in a line in the width direction.

  The fluid metal tube 11 has an outer surface 11b on one side in the thickness direction and an outer surface 11c on the other side. The refrigerant metal tube 13 has an outer surface 13 b that faces the outer surface 11 b on one side of the fluid metal tube 11. The outer surface 13b is joined to the outer surface 11b of the fluid metal tube 11 by the solder layer 15a. The refrigerant metal tube 14 has an outer surface 14 b that faces the outer surface 11 c on the other side of the fluid metal tube 11. The outer surface 14b is joined to the outer surface 11c of the fluid metal tube 11 by the solder layer 15b.

  The header portion 33 includes a fluid header portion 33 a joined to both ends of the fluid metal tube 11 and a refrigerant header portion 33 b joined to both ends of the coolant metal tube 13.

  As shown in FIG. 4A, the refrigerant header portion 33b has a structure in which the header body 41, the end of the refrigerant metal tube 13 and the end of the refrigerant metal tube 14 are joined. . The header main body 41 has a rectangular parallelepiped outer shape, and a refrigerant flow path 41a through which a refrigerant can flow is formed. The refrigerant flow path 41a has a circular cross-sectional shape.

  On the side wall of the header body 41, an insertion port 41b into which an end of the refrigerant metal tube 13 is inserted and an insertion port 41c into which the end of the refrigerant metal tube 14 is inserted are provided. The end of the refrigerant metal tube 13 is joined to the header body 41 by an appropriate amount of brazing material 43 disposed between the inner surface of the insertion port 41 b and the outer surface of the refrigerant metal tube 13. Similarly, the end portion of the refrigerant metal tube 14 is joined to the header body 41 by an appropriate amount of brazing material 43 disposed between the inner surface of the insertion port 41 c and the outer surface of the refrigerant metal tube 14. The refrigerant flow path 13a of the refrigerant metal tube 13 and the refrigerant flow path 14a of the refrigerant metal tube 14 communicate with the refrigerant flow path 41a of the header body 41, respectively. The end portions of the refrigerant metal tubes 13 and 14 may be joined to the header body 41 by other joining methods such as fusion welding instead of joining by the brazing material 43.

  The fluid header 33a has a structure in which the header body 45 and the end of the fluid metal tube 11 are joined. The header body 45 has a cylindrical shape in which a fluid channel 45a through which a fluid can flow is formed. The header body 45 is disposed between the refrigerant metal tube 13 and the refrigerant metal tube 14 positioned above and below.

  An insertion port 45 b into which the end of the fluid metal tube 11 is inserted is provided on the side wall of the header body 45. The end portion of the fluid metal tube 11 is joined to the header body 45 by an appropriate amount of brazing material 47 disposed between the inner surface of the insertion port 45 b and the outer surface of the fluid metal tube 11. The fluid flow path 11 a of the fluid metal pipe 11 communicates with the fluid flow path 45 a of the header body 45. Note that the end of the fluid metal tube 11 may be joined to the header body 45 by other joining methods such as soldering, fusion welding, or joining with a resin adhesive instead of joining with the brazing material 47. Good.

  As shown in FIGS. 2A, 2B, and 3, each refrigerant header portion 33b has a pipe 41d through which the refrigerant in the refrigerant flow passage 41a can enter and exit, and each fluid header portion 33a includes: A pipe 45c through which the fluid in the fluid channel 45a can enter and exit is provided.

  As the material for the fluid metal pipe 11 and the refrigerant metal pipes 13 and 14, a metal having thermal conductivity, corrosion resistance, rigidity, workability, and the like is used. Specifically, aluminum, copper, stainless steel, and the like are used. Can be illustrated. As a material for the solder layer 15, a material suitable for the material of the metal tube may be appropriately selected.

  The laminated heat exchanger 17 can be used in the form of a straight line as shown in FIG. 1, but may be used after being bent into a spiral shape (not shown), for example.

  Next, a method for manufacturing the laminated heat exchanger 17 using the above-described soldering apparatus 35 will be described.

  First, the metal pipe 11 for fluid and the metal pipes 13 and 14 for refrigerant | coolants are produced. These metal tubes 11, 13, and 14 are obtained by extruding a metal material using, for example, dies each having an extrusion outlet having a cross-sectional shape of each metal tube as shown in FIG. It is done.

  Next, the refrigerant metal tube 13, the solder layer 15a, the fluid metal tube 11, the solder layer 15b, and the refrigerant metal tube 14 are laminated in this order in the thickness direction to form the temporary assembly 23 (molding process: FIG. 5 (b)). The fluid metal pipe 11 and the refrigerant metal pipes 13 and 14 are stacked and arranged with their respective longitudinal directions (directions of the flow paths) aligned in the same direction.

  As the solder layers 15a and 15b, for example, those previously formed into a sheet shape (foil shape) can be used. Further, for example, a cream-like solder material is used and applied to the outer surfaces 11b and 11c of the fluid metal tube 11 and / or the outer surfaces 13b and 14b of the refrigerant metal tubes 13 and 14, and the solder layers 15a and 15b. May be formed.

  Further, as shown in FIG. 7A, solder layers 15a and 15b may be formed on the outer surfaces 11b and 11c by spraying a solder material onto the outer surfaces 11b and 11c of the fluid metal tube 11 by thermal spraying ( Thermal spraying process: FIG. 7B). In this method, since heat and impact are applied to the surface of the metal tube during thermal spraying of the solder material, a part or all of the oxide film on the surface of the metal tube 11 is removed at that time. Thereby, the oxide film removal effect on the surface of the metal tube 11 can be further enhanced. The thermal spraying of the solder material may be performed not only on the fluid metal tube 11 but also on the coolant metal tubes 13 and 14. Instead of spraying on the fluid metal tube 11, the solder material may be sprayed only on the coolant metal tubes 13 and 14. Also good. Further, before spraying the solder material, a part or all of the oxide film may be removed from the sprayed surface of the metal tube by mechanical polishing, electrolytic polishing, sandblasting, or the like.

  Next, as shown in FIG. 6, the temporary assembly 23 is placed on the placement surface 19 a of the heater 19 of the soldering device 35. At this time, almost the entire lower surface of the refrigerant metal tube 14 in the temporary assembly 23 is in surface contact with the mounting surface 19a.

  Next, the control unit 25 performs control so that the temporary assembly 23 is auxiliary heated by the heater 19 (auxiliary heating step). The control unit 25 controls the heater 19 based on the temperature of the temporary assembly 23 measured by a temperature sensor (not shown). In this step, the temporary assembly 23 is heated so that the solder layer 15 (15a, 15b) is in a semi-molten state. The temperature at which the solder layer 15 becomes a semi-molten state refers to a temperature between the solidus temperature and the liquidus temperature of the solder material constituting the solder layer 15. For example, when the melting point of the solder material is 245 ° C. and 200 ° C. is included between the solidus temperature and the liquidus temperature of the solder material, the heater 19 is set to about 200 ° C., for example. The solder layer 15 can be brought into a semi-molten state by auxiliary heating of the temporary assembly 23 by adjusting the temperature.

  Next, after detecting that the solder layer 15 is in a semi-molten state by the temperature sensor, the control unit 25 applies ultrasonic vibrations to the temporary assembly 23 by the ultrasonic soldering iron 21 and also solder layer 15. The temporary assembly 23 is fully heated so that the temperature becomes higher than the melting point (bonding step). By this main heating, the solder layer 15 is melted and the metal pipe for fluid 11 and the metal pipes for refrigerant 13 and 14 are joined. As a specific example, when the melting point of the solder material is 245 ° C., for example, the tip 22 of the ultrasonic soldering iron 21 is adjusted to a temperature of about 350 ° C. to 400 ° C., for example. Thereby, almost the entire temporary assembly 23 is heated to about 260 ° C.

  In this joining step, the control unit 25 detects the width and length of the temporary assembly 23 while the tip 22 of the ultrasonic soldering iron 21 is in contact with the upper surface of the temporary assembly 23 (the upper surface of the refrigerant metal tube 13). The ultrasonic soldering iron 21 is controlled so that the ultrasonic vibration is uniformly applied to almost the entire temporary assembly 23 and is heated by moving in the direction.

  In addition, although the width | variety of the front-end | tip part 22 of the ultrasonic soldering iron 21 has illustrated the case where it is smaller than the width | variety of the temporary assembly 23 in FIG. 6, for example, as shown in FIG. It may be formed to be approximately the same as the width of 23. In this case, the temporary assembly 23 is simply disposed by aligning the width direction of the distal end portion 22 with the width direction of the temporary assembly 23 and moving the distal end portion 22 of the ultrasonic soldering iron 21 along the longitudinal direction. It is possible to apply ultrasonic vibrations uniformly to almost the whole and heat them. Thereby, joining time can be shortened. Further, as shown in FIG. 8B, the ultrasonic soldering iron 21 may be applied to the side surface of the temporary assembly 23 to apply ultrasonic vibration and perform the main heating.

  Further, the main heating of the temporary assembly 23 may be performed not after the application of vibration but after the application of vibration to the temporary assembly 23 is completed. Moreover, the front-end | tip part 22 of the ultrasonic soldering iron 21 is not limited to flat shape, For example, other shapes, such as column shape and prismatic shape, may be sufficient.

  The control unit 25 determines the conditions at the time of joining, such as the temperature of the mounting surface 19a of the heater 19, the temperature of the tip 22 of the ultrasonic soldering iron 21, the frequency, amplitude, vibration application time, and heating time of the ultrasonic vibration. Be controlled. These conditions are appropriately set according to the material and thickness of each metal tube and the material of the solder layer 15.

As described above, according to the first embodiment, since the oxide films of the metal tubes 11, 13, and 14 are removed by applying ultrasonic vibrations, no flux is required and cleaning is not required. . In the first embodiment, since the metal tubes are joined by soldering, heating in an inert gas atmosphere is unnecessary. Moreover, in the first embodiment, in addition to the main heating means 21a for setting the temperature of the solder layer 15 to the melting point or higher, the auxiliary heating means 19 for assisting the heating by the main heating means 21a is provided. Therefore, as compared with the case of heating only by the main heating means 21a, temperature variation at the time of joining in the solder layer 15 interposed between the metal tubes can be reduced. Thereby, since the dispersion | variation in the joining state of the metal pipes by the solder layer 15 is reduced, the laminated heat exchanger 17 excellent in heat exchange efficiency and joining reliability can be manufactured.

In the first embodiment, the temporary assembly 23 is heated by the auxiliary heating means 19, heated by the main heating means 21 a, and imparted with ultrasonic vibration. Therefore, in the first embodiment, these heating and vibration can be applied to the temporary assembly 23 in a lump. Thereby, for example, the first metal tube 11 and the second metal tube are compared with the case where the heating by the auxiliary heating unit 19, the heating by the main heating unit 21 a, and the application of ultrasonic vibration are individually performed on each metal tube. The oxide film 13 can be removed, and the first metal tube 11 and the second metal tube 13 can be joined efficiently.

In the first embodiment, the temporary assembly 23 is heated so that the solder layer 15 is in a semi-molten state, and ultrasonic vibration is applied to the temporary assembly 23 in this heated state. The oxide removal effect by vibration can be further enhanced.

Further, in the first embodiment, the application of ultrasonic vibration and the heat bonding between metal tubes can be performed with a single instrument (ultrasonic soldering iron 21). Thereby, the structure of the apparatus can be simplified.

<Implementation form>
14 (a) is a schematic side view showing a manufacturing method according to the implementation embodiments of the present invention, FIG. 14 (b) is a schematic plan view thereof. Figure 15 is a schematic front view showing a manufacturing method according to the implementation form of this. In the following description of the implementation form, the same components as the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 14 (a), the as shown in (b) and 15, the manufacturing method according to the implementation mode, in the bonding step, the refrigerant metal pipe 13 in Karikumitai 23, metal fluid metal tube 11 and the refrigerant the tube 14, the point of joining metal pipes 11, 13, 14 while applying a solder layer 15 (15a, 15b) and the thickness direction of the temporarily assembled body 23 by a pressure means 81 pressurized is, a first embodiment Is different.

  Prior to this joining step, the temporary assembly 23 is placed on the placement surface 19a of the heater 19 for auxiliary heating and is auxiliary heated by the heater 19 (auxiliary heating step). In this step, the control unit 25 controls the heater 19 so that the solder layer 15 (15a, 15b) is in a semi-molten state.

  Next, the control unit 25 detects that the solder layer 15 is in a semi-molten state by a temperature sensor (not shown) and then pressurizes the temporary assembly 23 in the thickness direction (downward) by the pressurizing means 81. The pressure means 81 is controlled.

  The portion where the temporary assembly 23 is pressed by the pressing means 81 is not particularly limited. For example, as shown in FIG. 14B, the moving direction (joining direction) D of the ultrasonic soldering iron 21 is shown. There can be two locations, front and rear.

  By pressing the front position and the rear position of the ultrasonic soldering iron 21 with the pressing means 81, the upper surface portion of the temporary assembly 23 with which the tip 22 of the ultrasonic soldering iron 21 contacts and its periphery In this portion, the degree of adhesion between the metal tubes 13, 11, 14 and the solder layers 15a, 15b can be increased.

  Next, the control unit 25 controls the pressurizing means 81 and the ultrasonic soldering iron 21 so that the temporary assembly 23 is pressed by the pressurizing means 81 and the temporary soldering iron 21 is used to temporarily maintain the temporary assembly 23. Ultrasonic vibration is applied to the assembly 23, and the temporary assembly 23 is fully heated so that the temperature of the solder layer 15 becomes equal to or higher than the melting point (joining step). By this main heating, the solder layer 15 (15a, 15b) is melted and the metal pipe for fluid 11 and the metal pipes for refrigerant 13, 13 are joined. The main heating of the temporary assembly 23 may be performed not after the application of vibration but after the application of vibration to the temporary assembly 23 is completed. In this heating step, the temporary assembly 23 may be pressed in the thickness direction by the ultrasonic soldering iron 21 in addition to pressing the temporary assembly 23 by the pressing means 81.

  In this joining step, for example, the ultrasonic soldering iron 21 and the soldering iron 21 are added while the front end 22 of the ultrasonic soldering iron 21 and the front end (lower surface) of the front and rear pressurizing means 81 are in contact with the upper surface of the temporary assembly 23. The pressure means 81 is moved from one end to the other end in the longitudinal direction of the temporary assembly 23 in the joining direction D to continuously join the metal tubes.

  Thus, when joining metal pipes continuously, by pressing the position in front of the ultrasonic soldering iron 21 with the pressurizing means 81, before the ultrasonic soldering iron 21 passes through the pressing position. In addition, the degree of adhesion between the metal pipe for refrigerant 13, the metal pipe for fluid 11, the metal pipe for refrigerant 14, and the solder layers 15a and 15b can be increased in advance. Moreover, before the ultrasonic soldering iron 21 passes through the pressurizing position, the air existing between the metal tubes 13, 11, 14 and the solder layers 15a, 15b can be discharged as much as possible.

  In the joining process, intermittent joining may be performed as follows. For example, as shown in FIGS. 14A and 14B, first, the ultrasonic soldering iron 21 and the pressing means 81 are arranged at the positions of the ultrasonic soldering iron 21 and the pressing means 81 drawn by solid lines. To do. At this position (first joining position), the front and rear pressing means 81 are brought into contact with the upper surface of the temporary assembly 23 and the temporary assembly 23 is pressed by the pressing means 81 while the ultrasonic soldering iron 21 is pressed. The distal end portion 22 is brought into contact with the upper surface of the temporary assembly 23 to apply ultrasonic vibration to the temporary assembly 23 and to heat the temporary assembly 23 for a predetermined time.

  Next, the ultrasonic soldering iron 21 and the pressurizing means 81 are moved from the first joining position of the temporary assembly 23 to the second joining position at a predetermined interval in the joining direction D (see FIGS. 14A and 14B). Move to the position indicated by the two-dot chain line). At this time, the tip 22 of the ultrasonic soldering iron 21 and the tip of the front and rear pressurizing means 81 may be moved while being in contact with the upper surface of the temporary assembly 23. One or both of 81 may be moved in a state of being separated from the upper surface of the temporary assembly 23.

  At the second joining position, the front and rear pressurizing means 81 are brought into contact with the upper surface of the temporary assembly 23 and the temporary assembly 23 is pressed by the pressurizing means 81 while the front end 22 of the ultrasonic soldering iron 21 is pressed. Is brought into contact with the upper surface of the temporary assembly 23 to apply ultrasonic vibration to the temporary assembly 23 and to heat the temporary assembly 23 for a predetermined time. By repeating this operation a plurality of times, the metal tubes are joined from one end to the other end of the temporary assembly 23 in the longitudinal direction.

  In the joining step, as shown in FIGS. 14A and 14B, the ultrasonic soldering iron 21 and the pressurizing means 81 are arranged along the joining direction D in the vicinity of the center in the width direction of the upper surface of the temporary assembly 23. However, it is not limited to this. For example, the ultrasonic soldering iron 21 and the pressing means 81 may be moved linearly along the joining direction D in the vicinity of the end in the width direction of the upper surface of the temporary assembly 23. Further, the ultrasonic soldering iron 21 and the pressurizing means 81 may be moved in the joining direction D while meandering on the upper surface of the temporary assembly 23. Moreover, the front-end | tip part 22 of the ultrasonic soldering iron 21 can be made into various shapes, such as flat shape, cylinder shape, and prismatic shape, for example.

  Further, in the joining step, as shown in FIGS. 14A and 14B, after applying ultrasonic vibration to one surface (upper surface) of the temporary assembly 23 and heating, this temporary assembly is performed. The ultrasonic soldering iron 21 and the pressurizing means 81 may be similarly brought into contact with the other surface of the temporary assembly 23 by turning over 23 and applying ultrasonic vibration and heating. In this method, when there are a plurality of solder layers 15, it is possible to apply ultrasonic vibration and heat evenly to the solder layer 15a on one side and the solder layer 15b on the other side in the thickness direction.

In the present embodiment, in addition to using the pressurizing unit 81, an auxiliary pressurizing unit that pressurizes the temporary assembly 23 in the thickness direction over substantially the entire longitudinal direction thereof from the beginning to the end of the joining process. It is preferable to use together. As described above, when the pressurizing means 81 and the ultrasonic soldering iron 21 are moved along the joining direction D on the upper surface of the temporary assembly 23, in the portion where the rear pressurizing means 81 passes, Since the applied pressure is reduced, the degree of adhesion between the metal tubes 13, 11, 14 and the solder layers 15a, 15b may be reduced. Therefore, in order to suppress this decrease in the degree of adhesion, the auxiliary pressurizing means is preferably used in combination with the pressurizing means.

  For example, the auxiliary pressurizing means includes an unillustrated base on which the temporary assembly 23 is mounted, an unillustrated mounting member that is mounted on the upper surface of the temporary assembly 23, and the base and the above-described mounting member. A pressure jig including an elastic member spanned between them can be used. The temporary assembly 23 pressed in the thickness direction by the pressing jig is placed on the heater 19 together with the pressing jig.

  As the mounting member, for example, a plate-like member extending linearly along the longitudinal direction on the upper surface of the temporary assembly 23, or disposed at predetermined intervals in the longitudinal direction on the upper surface of the temporary assembly 23. A plate-like member extending along the width direction of the assembly 23 can be used. For example, a spring or rubber can be used as the elastic member.

  By pressurizing the temporary assembly 23 in the thickness direction using such auxiliary pressurizing means, in the joining step, the metal tubes 13, 11, 14 and the solder layer 15 a, in almost the entire longitudinal direction of the temporary assembly 23. The degree of adhesion with 15b can be maintained at a high level from the beginning to the end of the joining process.

  Since the thickness of the solder layer 15 is reduced when it is melted, the thickness of the temporary assembly 23 is reduced during and after the joining process as compared to before the joining process. In the auxiliary pressurizing means, the temporary assembly 23 is pressurized using the elastic member, so that the temporary assembly 23 is added following the thickness change of the temporary assembly 23 during and after the joining process. Can continue to press.

(Soldering device)
Next, various forms of the soldering apparatus 35 will be described. Figure 16 is a schematic side view showing a soldering apparatus 35 according to the implementation embodiments. In addition, illustration of the control part 25 is abbreviate | omitted in each drawing after FIG.

  As shown in FIG. 16, the soldering device 35 includes an ultrasonic soldering iron 21 and a pressurizing means 81. The soldering device 35 is supported by a guide rail (not shown) arranged along the longitudinal direction of the temporary assembly 23 so as to be slidable in the joining direction D.

  The pressurizing means 81 includes a pair of pressurizing units 811 disposed before and after the ultrasonic soldering iron 21, and a load adjusting unit 818 that adjusts the pressure applied to the temporary assembly 23 by the pressurizing units 811. have. As the pressurizing unit 811, for example, as shown in FIG. 16, a quadrangular prism-shaped member having a lower surface (tip portion) 811 a that can be in surface contact with the upper surface of the temporary assembly 23 can be used, but is not limited thereto. . The pressurizing unit 811 may have, for example, a polygonal column shape other than a quadrangular column shape, a cylindrical shape, or the like.

  The load adjusting unit 818 includes a hydraulic pump 812, a cylindrical cylinder 816 disposed below the hydraulic pump 812, a disk-shaped plunger 815 that can move in the vertical direction inside the cylinder 816, and a lower end portion. A rod-shaped connecting shaft 813 connected to the upper surface of the plunger 815, an upper end portion is connected to the lower surface of the plunger 815, a lower portion is trifurcated, and the lower end portions are pressurizing portions 811 and 811 and an ultrasonic soldering iron. And a transmission portion 817 connected to 21.

  The connecting shaft 813 can move in the vertical direction by driving the hydraulic pump 812. The transmission unit 817 transmits the vertical movement of the connecting shaft 813 to the pressurizing units 811 and 811 and the ultrasonic soldering iron 21. Therefore, the load adjusting unit 818 also plays a role of moving not only the pressurizing unit 811 but also the ultrasonic soldering iron 21 up and down.

  The space between the cylinder 816 and the lower surface of the plunger 815 is filled with oil. This oil goes back and forth between the space and the hydraulic pump 812 through the pipe 814 as the plunger 815 moves up and down. In the form shown in FIG. 16, the load adjustment unit 818 performs load adjustment using hydraulic pressure, but may perform load adjustment using air pressure, water pressure, etc., and provides elastic force such as a spring. The load adjustment may be performed using, for example, the load adjustment may be performed using a weight formed of a material having a high density such as metal.

  Next, the operation of the soldering apparatus 35 will be described. When the hydraulic pump 812 is driven and the connecting portion 813 moves downward, the plunger 815 and the transmission portion 817 move downward along with this movement. Thereby, a pair of pressurization part 811 and ultrasonic soldering iron 21 move below.

  When the front end portion 811a and the front end portion 22 are in contact with the upper surface of the temporary assembly 23 and the controller 25 detects that a predetermined pressure is applied to the temporary assembly 23 by a pressure sensor (not shown). The load adjusting unit 818 is controlled so as to stop the downward movement of the pair of pressure units 811 and the ultrasonic soldering iron 21. In such a state where the temporary assembly 23 is pressurized, for example, at the first joining position, ultrasonic vibration is applied to the temporary assembly 23 by the ultrasonic soldering iron 21, and the temperature of the solder layer 15 has a melting point. The temporary assembly 23 is heated as described above (joining step).

  In the joining process, when intermittent joining as described above is performed, after the application of ultrasonic vibration and the main heating are completed at the first joining position, the control unit 25 drives the hydraulic pump 91 to connect the connecting unit 813. Is moved upward, and the pair of pressure parts 811 and the ultrasonic soldering iron 21 are moved upward. As a result, the distal end portion 811 a and the distal end portion 22 are separated from the upper surface of the temporary assembly 23.

  Next, the control unit 25 slides the soldering device 35 along the guide rail (not shown) to the second joining position in the joining direction D. At the second joining position, the control unit 25 moves to the temporary assembly 23 in the same manner as described above. The application of the ultrasonic vibration and the heating of the temporary assembly 23 are controlled to be executed for a predetermined time. These series of operations are repeated a plurality of times.

(Variation 1 of soldering device)
Figure 17 is a schematic side view showing a first modification of the soldering apparatus according to the implementation embodiments. The soldering device 35 of this modification 2 is deformed in that it has a load adjustment unit 818 that moves the pair of pressure units 811 up and down and a load adjustment unit 819 that moves the ultrasonic soldering iron 21 up and down. Different from Example 1.

  In the load adjustment unit 818, the transmission unit 817 is bifurcated and the lower ends thereof are connected to the pressurizing units 811 and 811. In the load adjustment unit 819, the lower end portion of the transmission unit 820 is connected to the ultrasonic soldering iron 21.

  The soldering device 35 uses the pressurizing unit 811 to temporarily change the pressure applied to the temporary assembly 23 by the pressurizing unit 811 and the pressurizing force applied to the temporary assembly 23 by the ultrasonic soldering iron 21. This is effective when it is desired to make the timing for pressing the assembly 23 different from the timing for pressing the temporary assembly 23 by the ultrasonic soldering iron 21. By making the pressure applied to the temporary assembly 23 by the ultrasonic soldering iron 21 smaller than the pressure applied to the temporary assembly 23 by the pressurizing unit 811, the load on the ultrasonic soldering iron 21 is reduced. The life of the ultrasonic soldering iron 21 can be extended.

(Variation 2 of soldering device)
Figure 18 is a schematic side view showing a second modification of the soldering apparatus according to the implementation embodiments. The soldering apparatus 35 according to the second modification is different from the first modification in that a load adjusting unit 818 is provided in each pressing unit 811.

  In the front load adjustment unit 818, the lower end portion of the transmission unit 817 is connected to the front pressure unit 811. In the rear load adjustment unit 818, the lower end portion of the transmission unit 817 is connected to the rear pressure unit 811.

  The soldering device 35 is configured to apply the front pressurization when the pressure applied to the temporary assembly 23 by the front pressurizing unit 811 and the pressurization applied to the temporary assembly 23 by the rear pressurizing unit 811 are different. This is effective when, for example, it is desired to make the timing for pressurizing the temporary assembly 23 by the portion 811 different from the timing for pressurizing the temporary assembly 23 by the rear pressurizing unit 811.

(Variation 3 of soldering device)
Figure 19 is a schematic side view showing a third modification of the soldering apparatus according to the implementation embodiments. The soldering apparatus 35 has, for example, a similar load adjusting portion 818 and FIGS. 16 to 18 has a structure in which the pair of rollers over 822 and 822 attached to the pressing portion 811 of the load adjuster 818 ing. A pair of rollers over 822, are fixed to the opposite ends of the shaft 823 extending through the pressure portion 811. Thereby, the movement of the load adjustment unit 818 in the front-rear direction becomes smoother.

  In the soldering device 35, the metal tubes are continuously connected to each other while the front end portion 22 of the ultrasonic soldering iron 21 and the front end portion 811a of the front and rear pressure portions 811 are in contact with the upper surface of the temporary assembly 23 in the joining process. This is particularly effective when joining to the substrate. In FIG. 19, illustration of the load adjusting units 818 and 819 for moving the pressurizing unit 811 and the ultrasonic soldering iron 21 in the vertical direction is omitted, but the same ones as described above can be used.

(Metal pipe for fluid)
20 (a) is a schematic view showing a temporarily assembled body 23 to be the bonding target in a manufacturing method according to the implementation mode, Fig. 20 (b) is a plan view of Karikumitai 23.

  The fluid metal tube 11 of the temporary assembly 23 has a plurality of columnar propagation portions 121 arranged along the longitudinal direction of the fluid flow path 11a. Each propagation part 121 has one end in the axial direction connected to one inner surface in the thickness direction of the fluid flow path 53, and the other end in the axial direction connected to the other inner face in the thickness direction of the fluid flow path 53. Yes.

  In the fluid metal tube 11 shown in FIG. 20A, the plurality of propagation portions 121 are arranged so as to be linearly arranged in the longitudinal direction and the width direction, respectively, but the present invention is not limited to this. For example, the plurality of propagation units 121 may be arranged in a direction inclined in the longitudinal direction, or may be arranged at random. Moreover, the shape of the propagation part 121 is not limited to a cylindrical shape, For example, a prism etc. may be sufficient.

(Variation 1 of metal pipe for fluid)
FIG. 21A is a schematic front view showing a first modification of the temporary assembly 23. The metal pipe 11 for fluid of the temporary assembly 23 has a wave propagation part 121 arranged along the longitudinal direction of the fluid flow path 11a. The propagation part 121 is a plate-like body having a corrugated cross section perpendicular to the longitudinal direction. The propagation part 121 is arranged so that unevenness is continuously provided along the width direction of the fluid flow path 53. The propagation part 121 is in contact with the upper and lower inner surfaces in the thickness direction of the fluid flow path 11a.

  FIG. 21A illustrates a case where the cross section of the propagation unit 121 is formed of a combination of triangles, but is not limited thereto. The propagation part 121 may be a combination of quadrangular cross-sectional shapes, or may be a combination of arc shapes that are smoothly bent. Moreover, it is preferable that the propagation part 121 is formed using the same material as the metal pipe 11 for fluids from a viewpoint of suppressing electrolytic corrosion. The propagation part 121 may be an integral member continuously disposed along the longitudinal direction of the fluid metal tube 11 or may be divided into a plurality of parts and intermittently disposed in the fluid flow path 11a. Good.

(Variation 2 of metal pipe for fluid)
FIG. 21B is a schematic front view showing a second modification of the temporary assembly 23. The fluid metal tube 11 of the temporary assembly 23 includes a metal tube 131 and a metal tube 132 arranged in the width direction of the temporary assembly 23. These metal tubes 131 and 132 are cylindrical flat tubes that are separately formed by a method such as extrusion. In the fluid metal tube 11, the side wall 131 a of the metal tube 131 and the side wall 132 a of the metal tube 132 disposed near the center in the width direction function as a propagation part 121 that promotes propagation of heat and ultrasonic waves. The number of flat tubes arranged in the width direction is not limited to two, and may be three or more.

(Modification 3 of metal pipe for fluid)
FIG. 22A is a schematic front view showing a third modification of the temporary assembly 23. The fluid metal tube 11 of the temporary assembly 23 is obtained by bending a flat metal plate (not shown) and joining predetermined portions.

  Specifically, first, the metal plate is bent at a bending position along the longitudinal direction, and the metal plate is bent into a tubular shape so that one end side in the width direction of the metal plate contacts the surface of the metal plate. Next, the metal plate is bent at another folding position along the longitudinal direction so that the other end side in the width direction of the metal plate is in contact with the surface of the metal plate at a position adjacent to the one end side. Is bent into a tubular shape. Next, the one end side and the other end side are joined to the surface of the metal plate by a method such as welding along the longitudinal direction. As a result, the fluid metal pipe 11 having a B-shaped cross section is formed.

  This metal pipe 11 for fluid has a propagation part 121 (121a, 121b) arranged near the center in the width direction. Since these propagation portions 121a and 121b extend from a position close to the lower surface of the refrigerant metal tube 13 to a position close to the upper surface of the refrigerant metal tube 14, heat and ultrasonic waves propagate in the temporary assembly 23. Has a function to promote.

(Modification 4 of metal pipe for fluid)
FIG. 22B is a schematic front view showing Modification 4 of the temporary assembly 23. The fluid metal tube 11 of the temporary assembly 23 is a multi-hole tube similar to the refrigerant metal tubes 13 and 14. A plurality of partitions in the multi-hole tube function as the propagation part 121.

(Variation 5 of metal pipe for fluid)
FIG. 23A is a schematic front view showing a fifth modification of the temporary assembly 23. The fluid metal tube 11 of the temporary assembly 23 has a plurality of columnar propagation portions 121 arranged along the longitudinal direction of the fluid flow path 11a. The plurality of propagation portions 121 include a plurality of convex portions 121c extending downward from the upper inner surface of the fluid metal tube 11 and a plurality of convex portions 121d extending upward from the lower inner surface of the fluid metal tube 11. And have. Each convex part 121c is provided in the position which opposes the convex part 121d in the thickness direction, and the mutual front-end | tip parts contact | abut or adjoin. The convex portions 121c and 121d are arranged along the longitudinal direction and the width direction, for example, as shown in FIG.

  The plurality of propagation parts 121 may be arranged so as to be aligned in a direction inclined in the longitudinal direction, or may be arranged randomly. Moreover, the shape of the propagation part 121 is not limited to a cylindrical shape, For example, a prism etc. may be sufficient.

(Modification 6 of metal pipe for fluid)
FIG. 23B is a schematic front view showing Modification 6 of the temporary assembly 23. The fluid metal tube 11 of the temporary assembly 23 has a form in which two fluid flow paths 11a and 11a are formed by a method such as extrusion. These fluid flow paths 11 a and 11 a are partitioned by a propagation part 121. The propagation part 121 extends continuously in the longitudinal direction of the fluid metal pipe 11.

Incidentally, FIG. 20 (a), (b), FIG. 21 (a), (b), FIG. 22 (a), the provisional assembly 23 shown in (b) and 23, the soldering apparatus in the first embodiment 35 and the manufacturing method.

As described above, in the implementation form, the first metal tube and the second metal tube by the pressurizing means at the time of soldering becomes more intimate contact, connection reliability is improved. Further, by applying pressure, air existing between the metal tube and the solder layer is more easily discharged, so that heat and ultrasonic vibrations are more easily transmitted. In addition, since air is discharged as described above and the air layer between the metal tube and the solder layer decreases, the contact area between the metal tube and the solder layer also increases. Thereby, joining reliability improves more.

Also, in the implementation form, the fluid metal tube has the propagating portion, by applying the vibrations of heat and ultrasonic waves to the metal tube and the metal tube for coolant fluid said metal tube to each other in the stacking direction When joining, ultrasonic waves and heat are easily propagated. Thereby, since joining time can be shortened, production efficiency can be improved. Further, since the propagation portion is provided in the metal tube, the contact area between the fluid and the metal tube can be increased, so that the heat exchange efficiency when using the heat exchanger can be improved. .

<Other embodiments>
Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the spirit of the present invention. For example, in the above embodiment, the case where the vibration treatment and the heat treatment are performed using an ultrasonic soldering iron has been described as an example, but the present invention is not limited to this. For example, the soldering device 35 may include vibration means and heating means provided separately from each other.

  In the above embodiment, the case where the soldering device 35 includes the control unit 25 that controls the auxiliary heating unit 19, the main heating unit 21a, and the vibration unit 21b has been described as an example. However, the present invention is not limited thereto. . For example, in the soldering device 35, the auxiliary heating means 19, the main heating means 21a, and the vibration means 21b may be manually controlled (operated) by an operator.

  In the above embodiment, the case where heat is exchanged between water and the refrigerant has been described as an example. However, the stacked heat exchanger according to the present invention is configured such that the refrigerant and another fluid (for example, a gas such as air) are exchanged. It may be used for heat exchange or for heat exchange between refrigerants.

  Moreover, in the said embodiment, the metal pipe 13 for refrigerant | coolants, the metal pipe 11 for fluid, and the metal pipe 14 for refrigerant | coolants have the three metal pipes laminated | stacked in this order, the metal pipe 13 for refrigerant | coolants, and the metal pipe for fluids The embodiment has been described by taking as an example a form having two metal tubes 11 laminated in this order, but may be a form in which four or more metal tubes are laminated.

  Moreover, although the said embodiment gave and demonstrated as an example the case where each metal tube is a flat shape whose width is larger than thickness, it is not limited to this. Each metal tube may have, for example, the same size as the thickness and the width, or may have a shape in which the thickness is larger than the width.

  Moreover, in the said embodiment, although the case where the solder layer 15 interposed between the metal pipe 11 for fluids and the metal pipe 13 for refrigerant | coolants was formed by thermal spraying was illustrated, for example, in the header part, the insertion port of a header main body and the metal pipe A joining material such as a solder material or a brazing material interposed between the end portions may be provided by thermal spraying.

  Further, the auxiliary heating may be performed on the temporary assembly, may be performed on any of the metal tubes, or may be performed on the solder layer.

  Further, as the auxiliary heating means of the temporary assembly 23, other heating means such as laser and high frequency heating can be used in addition to the heater 19 described above.

Also, before you facilities embodiment, a portion of pressurizing the temporarily assembled body by pressurizing means, an example in which the two positions forward and backward in the moving direction of the ultrasonic soldering iron (welding direction) Description However, it is not limited to this. For example, the position where the temporary assembly is pressed may be set at two positions on both sides of the ultrasonic soldering iron (direction substantially perpendicular to the moving direction of the ultrasonic soldering iron). Moreover, the site | part which pressurizes a temporary assembly is good also as one place of the front of an ultrasonic soldering iron, good also as one place of back, and good also as several places of the front, back, and both sides.

Also, before you facilities embodiment, the case where the pressurizing means and the ultrasonic soldering iron along the joint direction is moved while fixing the position of the temporarily assembled body has been described as an example, the pressurizing means and The temporary assembly and auxiliary heating means for auxiliary heating the auxiliary assembly may be moved along the joining direction while the ultrasonic soldering iron is fixed.

Before you facilities embodiment, the moving mechanism such as a pressurizing means may be used such as industrial robots.

<Reference Example 1>
FIG. 9 is a schematic diagram illustrating a soldering apparatus 35 according to Reference Example 1 and a method for manufacturing the laminated heat exchanger 17 using the same. In the first embodiment described above, after forming the Karikumitai 23, application of ultrasonic vibration to the temporary assembly 23, and has been subjected to heat, in this Reference Example 1, application of ultrasonic vibration, and it is different from the first embodiment in that applying separately heating for each metal tube. Here, the same reference numerals are given to the same components as the first embodiment, a detailed description thereof is omitted.

  As shown in FIG. 9, in Reference Example 1, a case where two metal tubes (fluid metal tube 11 and refrigerant metal tube 13) are joined will be described as an example.

  The soldering device 35 includes an ultrasonic soldering iron 21 that applies and heats ultrasonic vibrations to the metal pipe 11 for fluid, and an ultrasonic wave that applies and heats ultrasonic vibrations to the metal pipe 13 for refrigerant. A soldering iron 71, a roller 29 as a supply unit capable of supplying a sheet-like solder material, a pressing member 39 capable of pressing one metal tube against the other metal tube, and a control unit 25 for controlling them. I have.

  The ultrasonic soldering irons 21 and 71 have the same configuration and function as the ultrasonic soldering iron 21 of the first embodiment. The roller 29 is obtained by winding a sheet-like solder material around a columnar core material. The pressing member 39 is for abutting the surface of the fluid metal tube 11 to press the fluid metal tube 11 in the direction toward the refrigerant metal tube 13, and for example, the central axis is the fluid metal tube 11. A columnar member (roller) or the like arranged along the width direction can be used.

  The ultrasonic soldering iron 71 and the roller 29 are movable relative to the refrigerant metal tube 13 along the longitudinal direction of the refrigerant metal tube 13. The ultrasonic soldering iron 21 and the pressing member 29 are movable relative to the fluid metal tube 11 along the longitudinal direction of the fluid metal tube 11.

  Next, a method for manufacturing the laminated heat exchanger 17 using the soldering apparatus 35 of Reference Example 1 will be described.

First, a fluid metal tube 11 and the refrigerant metal tube 13 due to for example extrusion in the same manner as in the first embodiment. The fluid metal tube 11 and the refrigerant metal tube 13 extruded from the mold are cut into predetermined dimensions.

  Next, the metal pipe 13 for refrigerant | coolant is arrange | positioned so that the width direction may turn to a substantially horizontal direction. Next, the solder layer 15 is laminated on the upper surface of the metal pipe for refrigerant 13 using a roller 29. At this time, the roller 29 may be moved along the longitudinal direction with respect to the refrigerant metal tube 13, or the refrigerant metal tube 13 may be moved with respect to the roller 29. The solder layer 15 is sequentially laminated from one end of the refrigerant metal tube 13 toward the other end.

  Next, using the ultrasonic soldering iron 71, ultrasonic vibration is applied to the refrigerant metal tube 13 and the solder layer 15, and the refrigerant metal tube 13 and the solder layer 15 are heated. The vibration treatment and the heat treatment by the ultrasonic soldering iron 71 are performed on the portion of the refrigerant metal tube 13 where the solder layer 15 is laminated. The vibration treatment and the heat treatment are sequentially performed from one end of the refrigerant metal tube 13 toward the other end. In addition, the vibration treatment and the heat treatment for the refrigerant metal tube 13 are directly applied to the surface of the joint surface side (solder layer 15 side) with the fluid metal tube 11.

  On the other hand, the ultrasonic soldering iron 21 is used to impart ultrasonic vibrations to the fluid metal tube 11 and to heat the fluid metal tube 11. The vibration treatment and the heat treatment by the ultrasonic soldering iron 21 are sequentially performed from one end of the fluid metal tube 11 toward the other end. Further, the vibration treatment and the heat treatment for the fluid metal tube 11 are directly applied to the surface on the joint surface side with the refrigerant metal tube 13. In this vibration treatment and heat treatment, the metal pipe for refrigerant 13 may be curved or bent near the boundary between the joined portion and the unjoined portion as shown in FIG. 9 as necessary.

  Next, the portion subjected to the vibration treatment and the heat treatment in the metal pipe for fluid 11 and the portion subjected to the vibration treatment and the heat treatment in the metal pipe for refrigerant 13 are interposed with a solder layer 15 therebetween. In this state, the fluid metal tube 11 and the refrigerant metal tube 13 are joined by sequentially stacking from the one end to the other end.

  In the reference example 1, in the heat treatment of the refrigerant metal tube 13 and the heat treatment of the fluid metal tube 11, two heating conditions can be roughly divided. That is, as the first first heating condition, the refrigerant metal tube 13 is auxiliary heated, and the fluid metal tube 11 is fully heated. As the second second heating condition, both the fluid metal pipe 11 and the refrigerant metal pipe 13 are fully heated.

  More specifically, under the first heating condition, the coolant metal tube 13 and the solder layer 15 are auxiliary heated so that the solder layer 15 is in a semi-molten state by the ultrasonic soldering iron 71 (auxiliary heating step). The fluid metal tube 11 is fully heated by the sonic soldering iron 21 so that the temperature of the fluid metal tube 11 is equal to or higher than the melting point of the solder layer 15 and joined to the refrigerant metal tube 13 (joining step). The temperature of the fluid metal tube 11 heated by the main heating is set so that the temperature of the solder layer 15 is equal to or higher than the melting point when the fluid metal tube 11 is joined to the refrigerant metal tube 13.

  On the other hand, under the second heating condition, the refrigerant metal tube 13 and the solder layer 15 are fully heated by the ultrasonic soldering iron 71 so that the temperature of the solder layer 15 becomes higher than the melting point, and the ultrasonic soldering iron 21 is used for fluid. The fluid metal tube 11 is fully heated so that the temperature of the metal tube 11 is equal to or higher than the melting point of the solder layer 15. That is, both the metal tubes 11 and 13 are fully heated to the melting point of the solder layer 15 or higher.

In Reference Example 1, the fluid metal tube 11 and the refrigerant metal tube 13 produced by extruding a metal material are not cut into predetermined dimensions, and the vibration process is continuously performed following the extrusion process. The heat treatment and the bonding may be performed sequentially. Further, under the first heating condition, the fluid metal tube 11 may be auxiliary heated, and the refrigerant metal tube 13 may be heated. Other structures, functions and effects are the same as defined above is omitted first embodiment.

  As described above, according to the reference example 1, since the oxide film of the metal tube is removed by applying ultrasonic vibration, the flux is unnecessary and the cleaning is not required. Further, since the metal tubes are joined together by soldering, heating in an inert gas atmosphere is unnecessary.

  Further, in Reference Example 1, the portion subjected to the vibration treatment and the heat treatment in the fluid metal tube 11 and the portion subjected to the vibration treatment and the heat treatment in the metal tube for refrigerant 13 are interposed between the solder layers. In the state where 15 is interposed, the metal pipe for fluid 11 and the metal pipe for refrigerant 13 are joined by sequentially stacking from the one end to the other end. Therefore, each metal tube can be uniformly heated from the one end to the other end. Thereby, since the temperature dispersion | variation at the time of joining of metal tubes can be reduced, the dispersion | variation in the joining state of the metal tubes by the solder layer 15 is reduced. Moreover, the oxide of each metal tube can be removed evenly from the one end to the other end. Thereby, the laminated heat exchanger 17 excellent in heat exchange efficiency and bonding reliability can be manufactured. Further, in this method, the vibration treatment, the heat treatment, and the joining between the metal tubes can be continuously performed from one end portion of the metal tube toward the other end portion. Therefore, since the process of forming the temporary assembly 23 as described above can be omitted, the productivity is excellent.

  Further, when the first heating condition is used in Reference Example 1, ultrasonic vibration is applied to one of the fluid metal tube 11 and the refrigerant metal tube 13 and the one metal tube is auxiliary-heated. The metal pipe for fluid and the metal pipe for refrigerant 13 are joined by heating the metal pipe so that the temperature of the solder layer 15 is equal to or higher than the melting point. Thus, by auxiliary heating one of the metal tubes, the temperature at the time of joining in the solder layer 15 interposed between the metal tube for fluid 11 and the metal tube for refrigerant 13 is compared with the case where auxiliary heating is not performed. Since the variation can be reduced, the variation in the joining state between the metal tubes by the solder layer 15 is reduced. Thereby, the laminated heat exchanger 17 excellent in heat exchange efficiency and bonding reliability can be manufactured. In addition, since the shape stability of the solder layer 15 itself before joining is superior to the second heating condition in which the solder layer 15 is heated to a molten state, the metal pipe for refrigerant 13 and the metal pipe for fluid 11 are soldered. The layer 15 can be arranged with high accuracy.

  Further, in the case of using the second heating condition in Reference Example 1, it becomes easier to raise the temperature of the solder layer 15 at the time of joining as compared with the case of auxiliary heating in a semi-molten state.

  In Reference Example 1, the solder layer 15 is previously laminated on the surface of the fluid metal tube 11 or the surface of the refrigerant metal tube 13, and the fluid metal tube 11 or the refrigerant metal is formed from the side on which the solder layer 15 is laminated. Since the vibration treatment and the heat treatment are performed on the tube 13, the solder layer 15 can be directly heated. Thereby, since the heating state of the solder layer 15 is made more uniform, the heat exchange efficiency and the bonding reliability can be further increased.

<Reference Example 2>
Figure 10 is a schematic diagram showing a manufacturing method of the soldering device 35 stacked heat exchanger 17, and was used for the ginseng Reference Example 2. In Reference Example 1 described above, the soldering layer 15 was laminated on the surface of the refrigerant metal tube 13, and then the vibration metal tube 13 and the solder layer 15 were subjected to vibration treatment and heat treatment. In Reference Example 2, The difference from Reference Example 1 is that the solder layer 15 is laminated on the surface of the refrigerant metal tube 13 after the metal tube for refrigerant 13 is subjected to vibration treatment and heat treatment. In addition, the same code | symbol is attached | subjected to the same component as the reference example 1 here, and the detailed description is abbreviate | omitted.

  In Reference Example 2, since the vibration treatment can be directly performed on the surface of the refrigerant metal tube 13, the oxide removal effect can be further enhanced as compared with Reference Example 1.

<Reference Example 3>
Figure 11 is a schematic diagram showing such a soldering device, and a method of manufacturing the laminated heat exchanger using this to participate Reference Example 3. In the reference example 1 described above, the ultrasonic soldering iron 21 and the roller 29 are relatively moved along the longitudinal direction of the metal tubes 11 and 13, but in this reference example 3, the ultrasonic soldering iron 21 and the roller 29 are moved. The difference from Reference Example 1 is that the metal tube 11, 13 is relatively moved along the width direction to perform vibration treatment and heat treatment. In addition, the same code | symbol is attached | subjected to the same component as the reference example 1 here, and the detailed description is abbreviate | omitted.

  In this reference example 3, the ultrasonic soldering iron 21 and the roller 29 are relatively moved along the width direction of the metal tubes 11 and 13 to perform vibration treatment and heat treatment, and then the refrigerant metal tube 13 is replaced with the fluid metal. They are stacked on the tube 11 and joined together. Thus, since the ultrasonic soldering iron 21 and the roller 29 are relatively moved along the width direction of the metal tubes 11 and 13, the ultrasonic soldering iron 21 and the roller 29 are moved as compared with the case of relative movement along the longitudinal direction of the metal tubes 11 and 13. The distance can be reduced. Thereby, the apparatus can be reduced in size.

  12A to 12C are schematic views showing a modification of the reference example 3. FIG. This modification is different from Reference Example 3 shown in FIG. 11 in that one ultrasonic soldering iron 21 performs vibration treatment and heat treatment on both the fluid metal tube 11 and the refrigerant metal tube 13. .

  In this modification, since only one ultrasonic soldering iron is required, the apparatus can be further miniaturized.

<Reference Example 4>
FIG. 13 is a schematic view showing a reference example of a soldering apparatus and a manufacturing method of a laminated heat exchanger using the same. In the reference example 2 described above, an ultrasonic soldering iron is used as means for removing the oxide film on the surface of the metal tube and heating the metal tube, but in this reference example, a laser irradiator 61 is used. In addition, the same code | symbol is attached | subjected to the same component as the reference example 2 here, and the detailed description is abbreviate | omitted.

As the laser of the laser irradiator 61, for example, a lamp-pumped YAG laser, a diode-pumped YAG laser, a CO ₂ laser, or the like can be used. The output of the YAG laser can be adjusted, for example, in the range of about 20 W to 1.5 kW, and the output of the CO ₂ laser can be adjusted, for example, to about 250 W. These include the material and thickness of the metal tube and solder material, etc. What is necessary is just to set suitably according to.

  In this reference example, the laser film is applied to the fluid metal tube 11 and the refrigerant metal tube 13 by the laser irradiator 61, whereby the oxide film on the surface of each metal tube is removed. Further, the temperature of the fluid metal pipe 11 and the refrigerant metal pipe 13 is raised to the melting point of the solder layer 15 or higher by laser irradiation. Immediately after such vibration treatment and heat treatment are performed, the treated portions are laminated via the solder layer 15, whereby the fluid metal tube 11 and the refrigerant metal tube 13 are joined.

  With this method, heating in an inert gas atmosphere is unnecessary at the time of bonding. Moreover, it can suppress that heat conductivity falls like the case where a resin adhesive is used.

The laser irradiator 61 shown in this reference example can also be used as an alternative to the ultrasonic soldering iron in the reference example 3, for example. In addition, a laser can be used as a means for removing the oxide film on the metal surface and a heating means at the joint portion between the header body and the metal tube in the header portion shown in FIG. When joining the header body and metal tube in this header section, place a sheet or paste solder material, brazing material, etc. in advance between the insertion port of the header body and the metal tube. Examples include a method of bonding by heat, and a method of bonding by the heat of a laser while supplying a wire-shaped solder material to the bonding portion. The heating means may instead laser irradiation, air heater over, infrared heaters, hot plates, high-frequency heating, also possible to use various heating means such as a flame.

<Reference Example 5>
Other methods for joining metal tubes include the following. The case where the fluid metal pipe 11 and the refrigerant metal pipe 13 are joined will be described as an example.

  First, a non-corrosive flux is applied to the joint surface between the fluid metal tube 11 and the refrigerant metal tube 13. Next, the metal pipe for fluid 11 and the metal pipe for refrigerant 13 are laminated via the solder layer 15 to produce a temporary assembly. This temporary assembly is heated above the melting point of the solder material and above the activation temperature of the non-corrosive flux. Thereby, the metal tube 11 for fluids and the metal tube 13 for refrigerant | coolants can be joined. With this method, corrosion does not easily proceed even if flux remains on the joint surface, and thus cleaning after joining is unnecessary. In addition, heating in an inert gas atmosphere is not required during bonding. Moreover, it can suppress that heat conductivity falls like the case where a resin adhesive is used.

Examples of non-corrosive flux include Cs-based flux (activation temperature of 420 ° C. or higher). As a means for heating the temporary assembly body, for example a laser, air heater over, infrared heaters, hot plates, high frequency heating, it is possible to use various heating means such as a flame.

11 Metal Pipe for Fluid 13 Metal Pipe for Refrigerant 14 Metal Pipe for Refrigerant 15 Solder Layer 17 Laminated Heat Exchanger 19 Heater 21 Ultrasonic Soldering Iron 21a Main Heating Means 21b Vibrating Means 23 Temporary Assembly 25 Control Unit 29 Roller 31 Heat Replacement part 33 Header part 33a Fluid header part 33b Refrigerant header part 35 Soldering device 81 Pressurizing means 811 Pressurizing part 818 Load adjusting part

Claims (11)

Soldering for manufacturing a laminated heat exchanger (17) in which the first metal tube (11) and the second metal tube (13) to be laminated are joined by a solder layer (15) interposed therebetween. A device,
Auxiliary heating means (19) for heating at least one of the first metal tube (11), the second metal tube (13), and the solder layer (15);
A main heating means (21a) for joining the first metal tube (11) and the second metal tube (13) at a temperature equal to or higher than the melting point of the solder layer (15);
Vibration means (21b) for applying ultrasonic vibration to the first metal tube (11) and the second metal tube (13);
A pressurizing means (81) for pressurizing the first metal tube (11) and the second metal tube (13) arranged in a stacked manner via the solder layer (15) in the stacking direction;
Control means (25) for controlling the pressurizing means (81) ,
The control means (25) pressurizes the first metal pipe (11) and the second metal pipe (13) in the stacking direction after detecting that the solder layer (15) is in a semi-molten state. A soldering apparatus for controlling the pressurizing means (81) to start the operation .   The heating by the auxiliary heating means (19), the heating by the main heating means (21a), and the application of the ultrasonic vibration are performed by the first metal pipe (11), the solder layer (15), and the second metal pipe. The soldering apparatus according to claim 1, wherein (13) is performed on the temporary assembly (23) laminated in this order. Wherein said control means (25), said auxiliary heating means (19), the main heating means (21a), and said controlling the vibrating means (21b),
The control means (25) applies the vibration means (23) to the temporary assembly (23) heated by the auxiliary heating means (19) so that the solder layer (15) is in a semi-molten state. The soldering apparatus according to claim 2, wherein the ultrasonic vibration is applied by 21b), and the temperature of the solder layer (15) is controlled to be higher than the melting point by being heated by the main heating means (21a). .   The soldering apparatus according to any one of claims 1 to 3, further comprising an ultrasonic soldering iron (21) in which the vibration means (21b) and the main heating means (21a) are integrally formed. At least one of the first metal tube (11) and the second metal tube (13) connects one inner surface and the other inner surface of the metal tube in the stacking direction to transmit heat in the stacking direction and ultrasonic waves. The soldering apparatus according to any one of claims 1 to 4 , further comprising a propagation part (121) that promotes propagation of the solder. A method for producing a laminated heat exchanger (17) in which a first metal tube (11) and a second metal tube (13) arranged in a laminated manner are joined by a solder layer (15) interposed therebetween. There,
An auxiliary heating step of heating at least one of the first metal tube (11), the second metal tube (13), and the solder layer (15);
Ultrasonic vibration is applied to the first metal tube (11) and the second metal tube (13), and the temperature of the solder layer (15) is set to be equal to or higher than the melting point, and the first metal tube (11) and the A bonding step of bonding the second metal pipe (13) ,
In the auxiliary heating step, after detecting that the solder layer (15) is in a semi-molten state, the pressurizing means (81) laminates the first metal tube (11) and the second metal tube (13). A method of manufacturing a stacked heat exchanger , in which pressurization in the direction is started . Before the auxiliary heating step and the joining step,
It said first metal tube (11) further includes the solder layer (15) and said second metal tube (13) forming step of forming the temporarily assembled body was stacked in this order (23), according to claim 6 The manufacturing method of the lamination | stacking type heat exchanger as described in 2 .. In the auxiliary heating step, the temporary assembly (23) is heated so that the solder layer (15) is in a semi-molten state, and the joining step is performed on the temporary assembly (23) in the heated state. The manufacturing method of the laminated heat exchanger of Claim 7 which performs. Before the molding process,
The method further comprises spraying a solder material onto at least one surface of the first metal tube (11) and the second metal tube (13) to form the solder layer (15) on the surface. Item 9. A method for producing a stacked heat exchanger according to Item 7 or 8 . Wherein in the bonding step, the bonded while maintaining pressure state first metal tube (11) and said second metal tube (13) in the stacking direction, the stacked according to any one of claims 6-9 Manufacturing method of heat exchanger. At least one of the first metal tube (11) and the second metal tube (13) connects one inner surface and the other inner surface of the metal tube in the stacking direction to transmit heat in the stacking direction and ultrasonic waves. propagation method for producing a laminated heat exchanger according to any one of the propagation unit having a (121) which, claims 6-10 that promotes the.

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