JP5515488B2 - LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, AND ELECTRONIC DEVICE - Google Patents

Description

  The present invention relates to a light emitting device using an organic EL (electroluminescence) element, a method for manufacturing the light emitting device, and an electronic apparatus.

  In recent years, as a next-generation display device following a liquid crystal display (LCD), a light-emitting element type display panel in which self-light-emitting elements such as organic electroluminescence elements (hereinafter abbreviated as “organic EL elements”) are two-dimensionally arranged. Research and development of the light-emitting device provided is underway.

  The organic EL element includes an anode electrode, a cathode electrode, and an organic EL layer (light emitting functional layer) formed between the pair of electrodes and having, for example, a light emitting layer, a hole injection layer, and the like. In the organic EL element, light is emitted by energy generated by recombination of holes and electrons in the light emitting layer.

  The light emitting layer, the hole injection layer, and the like of such an organic EL element are formed by applying a solution to a space partitioned by a partition and drying the solvent, as disclosed in Patent Document 1, for example. Is done. The application of the solution is performed by, for example, a nozzle printing method, an ink jet printing method, or the like.

JP 2005-123083 A

  By the way, in an organic EL element, when the film thickness of an organic EL layer is non-uniform | heterogenous, there exists a problem that light emission becomes non-uniform | heterogenous. For this reason, it is required to control the film thickness of the light-emitting functional layer well to obtain a film having good uniformity.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a light-emitting device including a light-emitting functional layer having a uniform film thickness, a method for manufacturing the light-emitting device, and an electronic apparatus.

In order to achieve the above object, a light-emitting device according to the first aspect of the present invention includes:
Comprising a plurality of light emitting elements arranged along a plurality of rows and a plurality of columns;
Each of the light emitting elements has a light emitting functional layer including a light emitting layer that emits light in a predetermined emission color,
A plurality of sets having n (n is an even number ) light emitting elements arranged in a fixed order in the row direction are arranged adjacent to each other in a fixed order in the row direction;
A gap region provided between the light emitting elements arranged adjacent to each other in the row direction;
The light emitting functional layer of each light emitting element is formed across the formation region of the light emitting layer and a part of the gap region on both sides along the row direction ,
Each set includes only a first light emitting element group including n / 2 light emitting elements and a second light emitting element group including n / 2 light emitting elements.
The light emitting elements of the first light emitting element group and the light emitting elements of the second light emitting element group are alternately arranged along the row direction for each of the light emitting elements.
The light emitting functional layer of each light emitting element of the first light emitting element group includes two light emitting elements of the second light emitting element group arranged adjacent to both sides along the row direction of each light emitting element. in the gap region between each, we covered on a part of the light-emitting functional layer of the two light emitting elements of the second light emitting element group,
The light emitting functional layer of each light emitting element of the second light emitting element group includes two light emitting elements of the first light emitting element group arranged adjacent to both sides along the row direction of each light emitting element. A part of the light emitting functional layer of the two light emitting elements of the first light emitting element group is covered in the gap region between each of them.

The n light emitting elements in each set are
A first light-emitting element having a first light-emitting layer of a first emission color;
A second light emitting element having a second light emitting layer of a second light emitting color different from the first light emitting color;
A third light-emitting element having a third light-emitting layer having a third light-emitting color different from the first and second light-emitting colors,
The first light-emitting element, and the fourth light-emitting element having a fourth light-emitting layer of the light emitting color of the same color and the second light-emitting element and the third light-emitting element Neu Zureka one particular light emitting element , May be provided .

Before the fourth light emitting element and the light-emitting element of Kitoku constant is, or can be a one of the second light emitting element group and the first light emitting element group.

The n light emitting element of said each set,
A first light-emitting element having a first light-emitting layer of a first emission color;
A second light emitting element having a second light emitting layer of a second light emitting color different from the first light emitting color;
A third light emitting element having a third light emitting layer of a third light emitting color different from the first and second light emitting colors;
A fourth light emitting element having a fourth light emitting layer having a fourth light emitting color different from the first to third light emitting colors.

In order to achieve the above object, a method for manufacturing a light emitting device according to the second aspect of the present invention includes:
A method of manufacturing a light-emitting device in which a plurality of light-emitting elements that emit light of a predetermined emission color along a plurality of rows and a plurality of columns are arranged,
The light emitting device has a gap region provided between the light emitting elements arranged adjacent to each other in a row direction,
A plurality of sets having n (n is an even number) light emitting elements arranged in a fixed order in the row direction are formed so as to be adjacent to each other in a fixed order in the row direction, , Forming only a first light emitting element group including n / 2 light emitting elements and a second light emitting element group including n / 2 light emitting elements, and each of the light emitting elements of the first light emitting element group A light emitting element forming step of forming each light emitting element of the second light emitting element group alternately arranged along the row direction for each one of the light emitting elements;
The light emitting element forming step includes:
A solution is applied in a column direction to a formation region of a light emitting layer that emits light of a predetermined light emission color of each light emitting element of the first light emitting element group that is alternately arranged along the row direction for each of the light emitting elements. And forming a light emitting functional layer including the light emitting layer every other row,
After the first step, the solution is arranged in the formation region of the light emitting layer of each light emitting element of the second light emitting element group arranged in the row where the solution is not applied in the first step. A second step of applying in the direction to form the light emitting functional layer,
The light emitting functional layer formed in the first step and the second step is formed across the formation region of the light emitting layer and a part of the gap region on both sides along the row direction,
The second light emitting element in which the light emitting functional layer of each light emitting element of the first light emitting element group formed by the first step is arranged adjacent to both sides along the row direction of each light emitting element. Formed in the gap region between each of the two light emitting elements of the group so as to be covered by a part of the light emitting functional layer of the two light emitting elements of the second light emitting element group;
The first light emitting element in which the light emitting functional layer of each light emitting element of the second light emitting element group formed by the second step is arranged adjacent to both sides along the row direction of each light emitting element. The gap region between each of the two light emitting elements of the group is formed so as to cover a part of the light emitting functional layer of the two light emitting elements of the first light emitting element group. And

The light emitting element forming step includes a first light emitting element having a first light emitting layer of a first light emitting color as the n light emitting elements of each set, and a second light emitting color different from the first light emitting color. A second light emitting element having a second light emitting layer having a light emitting color, and a third light emitting element having a third light emitting layer having a third light emitting color different from the first and second light emitting colors. and forming a fourth with the first light emitting element, the second light-emitting element and the third light-emitting element Neu Zureka one fourth emission color of the same color as the particular light-emitting elements of the light emitting layer a light emitting element, may form the shape of.

The light emitting device forming step, before the Kitoku constant of the light emitting device said fourth light-emitting element may be formed as one of the second light emitting element group and the first light emitting element group.

  The light emitting element forming step includes a first light emitting element having a first light emitting layer of a first light emitting color as the set of light emitting elements, and a second light emitting color different from the first light emitting color. A second light-emitting element having two light-emitting layers; a third light-emitting element having a third light-emitting layer having a third light-emitting color different from the first and second light-emitting colors; A fourth light emitting element having a fourth light emitting layer having a fourth light emitting color different from the third light emitting color may be formed.

In order to achieve the above object, an electronic device according to a third aspect of the present invention provides:
The light-emitting device according to the first aspect is provided.

  According to the present invention, a light-emitting device including a light-emitting functional layer having a uniform thickness by forming a light-emitting functional layer in every other row after forming an even pixel group, and a method for manufacturing the light-emitting device In addition, an electronic device can be provided.

It is a top view which shows the structural example of the light-emitting device which concerns on 1st Embodiment. (A) And (b) is a figure which shows the electronic device with which a light-emitting device is used. It is a figure which shows the electronic device with which a light-emitting device is used. It is a figure which shows the electronic device with which a light-emitting device is used. It is a figure which shows the cross-sectional structure of the light-emitting device shown in FIG. It is an equivalent circuit diagram of an example of the drive circuit of a pixel. It is a top view of a pixel. It is the VIII-VIII sectional view taken on the line shown in FIG. It is a figure which shows the manufacturing method of a light-emitting device. It is a figure which shows the manufacturing method of a light-emitting device. It is a figure which shows the manufacturing method of a light-emitting device. It is a figure which shows the manufacturing method of a light-emitting device. It is a figure which shows the manufacturing method of a light-emitting device. It is a figure which shows schematic structure of the nozzle printing apparatus for demonstrating a nozzle printing system. It is a figure which shows schematic structure of the nozzle printing apparatus for demonstrating a nozzle printing system. It is a figure which shows the film thickness of each light emitting layer of 1st Embodiment. It is a figure which shows the film thickness of each light emitting layer of a comparative example. It is a figure which shows the structural example of the light-emitting device which concerns on 2nd Embodiment. It is a figure which shows the cross-sectional structure of the light-emitting device shown in FIG. It is a figure which shows the modification of a light-emitting device.

  A light-emitting device, a method for manufacturing a light-emitting device, and an electronic device according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, an active drive type light emitting device using a bottom emission type organic EL element that emits light generated by an organic EL (electroluminescence) element to the outside through a substrate on which the organic EL element is formed is taken as an example. I will give you a description. Further, the light emitting device of this embodiment is also used as a display device.

(First embodiment)
FIG. 1 is a plan view showing a configuration example of a light emitting device according to the first embodiment. 2 to 4 illustrate electronic devices in which the light-emitting device is used. FIG. 5 is a diagram illustrating a cross-sectional configuration of the light emitting device 10 illustrated in FIG. 1. FIG. 6 is an equivalent circuit diagram of an example of a drive circuit for the pixel 30. 7 is a plan view of the pixel 30G, and FIG. 8 is a cross-sectional view taken along the line VIII-VIII shown in FIG.

  In the light-emitting device 10, four light-emitting elements that emit light in any one of three colors of red (R), blue (B), and green (G) are provided on the substrate 31 as illustrated in FIG. 1. A set of pixels 30 (30G1, 30R, 30B, 30G2) is set, and a plurality of, for example, m pieces are arranged in the row direction (left-right direction in FIG. 1). In the column direction (vertical direction in FIG. 1), a plurality of, for example, n pixels having light emitting elements of the same light emission color are arranged. In other words, 4m pixels are arranged in the row direction, and 4m × n pixels emitting each color of RGB are arranged in a matrix. In the present embodiment, the two pixels, the pixel 30G1 and the pixel 30G2, emit light of the same green emission color. Therefore, in the present embodiment, a desired color is expressed by the red pixel 30R, the blue pixel 30B, the green pixel 30G1, and the pixel 30G2.

  The light-emitting device 10 is not limited to a configuration in which an even number of light-emitting elements are used as a set and fixed as an element constituting an image, and a configuration in which one pixel is shared among a plurality of logical pixels is also possible. It is. For example, one pixel is used to configure six types of logic pixels. Specifically, one pixel is used as one logical pixel at the center of six types of logical pixels, and pixels around the pixel are a part of the five types of logical pixels surrounding the central logical pixel. And performing such processing on each pixel. As a result, one pixel is used a plurality of times to form one image. As described above, by using one light emitting element a plurality of times, the resolution can be increased more than a configuration in which a set of pixels is fixed and emitted as an element constituting an image.

  On the substrate 31, an anode line La arranged in the row direction and connected to the plurality of pixel circuits DS shown in FIG. 6, and a plurality of data lines respectively connected to the plurality of pixel circuits DS arranged in the row direction. Ld and a scanning line Ls for selecting the transistors Tr11 of the plurality of pixel circuits DS arranged in the row direction are formed.

  The light emitting device 10 having such a configuration is used as a display unit (display) of an electronic device such as a digital camera, a personal computer, or a mobile phone. Specifically, the camera 200 includes a lens unit 201, an operation unit 202, a display unit 203, and a viewfinder 204, for example, as shown in FIGS. 2 (a) and 2 (b). The light emitting device 10 is used as the display unit 203. Similarly, as shown in FIG. 3, the personal computer 210 includes a display unit 211 and an operation unit 212, and the light emitting device 10 is used as the display unit 211. Further, the mobile phone 220 includes a display unit 221, an operation unit 222, a reception unit 223, and a transmission unit 224, and the light emitting device 10 is used as the display unit 221.

  Next, FIG. 5 shows a cross-sectional configuration of the light-emitting device 10 shown in FIG. In FIG. 5, for convenience of explanation, the substrate 31, the pixel electrode 42, the partition wall 48, and three color light emitting layers having green (G), red (R), blue (B), and green (G) emission colors, respectively. Only 45G1, 45R, 45B, and 45G2 (hereinafter, the light emitting layers 45R, 45G, and 45B are collectively referred to as the light emitting layer 45) are illustrated, and the other components are not illustrated. The light emitting layers 45G1, 45R, 45B, and 45G2 form the light emitting elements of the pixels 30G1, 30R, 30B, and 30G2, respectively. As will be described in detail later, in the present embodiment, the green pixel is divided into two, a pixel 30G1 and a pixel 30G2. The light emitting areas of the pixels 30G1 and G2 are both narrower than the light emitting areas of the red pixel 30R and the blue pixel 30B. Further, after forming the green light emitting layers 45G1 and 45G2, the red light emitting layer 45R and the blue light emitting layer 45B are formed. For this reason, the portion of the red light emitting layer 45R that is in contact with the green light emitting layer 45G1 and the portion that is in contact with 45G2 cover a part of the portion of the green light emitting layers 45G1 and 45G2 that rides on the partition wall 48, respectively. It is formed by riding on it. The same applies to the blue light-emitting layer 45B, and the portions of the blue light-emitting layer 45B that are in contact with the green light-emitting layers 45G1 and 45G2 are part of the portions that ride on the partition walls 48 of the green light-emitting layers 45G1 and 45G2, respectively. It is formed on it so as to cover it.

  Next, the pixels 30 constituting the light emitting device 10 will be described with reference to FIGS. In the present embodiment, since the pixel 30G1, the pixel 30G2, and the green pixel are divided into two, the light emitting areas of the pixels 30G1 and G2 are both from the light emitting areas of the red pixel 30R and the blue pixel 30B. Except for the small area, the configuration of the pixels 30R, 30B, 30G1, and 30G2 is the same, and therefore, the red pixel 30R will be described below as an example.

  The pixel 30 has a pixel circuit DS. As shown in FIG. 6, the pixel circuit DS includes a selection transistor Tr11, a drive transistor Tr12, a capacitor Cs, and an organic EL element (light emitting element) OEL.

  As shown in FIG. 6, the selection transistor Tr11 has a gate terminal connected to the scanning line Ls, a drain terminal connected to the data line Ld, and a source terminal connected to the contact N11. The drive transistor Tr12 has a gate terminal connected to the contact N11, a drain terminal connected to the anode line La, and a source terminal connected to the contact N12. The capacitor Cs is connected to the gate terminal and the source terminal of the drive transistor Tr12. Note that the capacitor Cs is an auxiliary capacitance additionally provided between the gate and the source of the driving transistor Tr12 or a capacitance component including a parasitic capacitance and an auxiliary capacitance between the gate and the source of the driving transistor Tr12. In the organic EL element OEL, the anode terminal (pixel electrode 42) is connected to the contact N12, and the reference voltage Vss is applied to the cathode terminal (counter electrode 46).

  The scanning line Ls is connected to a scanning driver (not shown) disposed on the peripheral edge of the pixel substrate. A selection voltage signal (scanning signal) for setting a plurality of pixels 30 arranged in the row direction at a predetermined timing to a selected state is applied to the scanning line Ls. The data line Ld is connected to a data driver (not shown) disposed on the peripheral edge of the pixel substrate. A data voltage (gradation signal) corresponding to light emission data is applied to the data line Ld at a timing synchronized with the selection state of the pixel 30. A plurality of drive transistors Tr12 arranged in the row direction are set to a state in which a drive current corresponding to light emission data flows through, for example, the anode terminal (pixel electrode 42) of the organic EL element OEL connected to the drive transistor Tr12. In addition, the anode line La (supply voltage line) is directly or indirectly connected to a predetermined high potential power source. In other words, the anode line La is applied with a predetermined high potential (supply voltage Vdd) sufficiently higher than the reference voltage Vss applied to the counter electrode 46 of the organic EL element OEL. The counter electrode 46 is directly or indirectly connected to, for example, a predetermined low potential power source, and is formed of a single electrode layer for all the pixels 30 arranged in an array on the substrate 31. The predetermined low voltage (reference voltage Vss, for example, ground potential GND) is set to be applied in common.

  The anode line La and the scanning line Ls are formed together with the source electrode and the drain electrode by using a source-drain conductive layer that forms the source electrode and the drain electrode of each of the transistors Tr11 and Tr12. The data line Ld is formed together with the gate electrode using a gate conductive layer that becomes a gate electrode of each of the transistors Tr11 and Tr12. As shown in FIG. 7, a contact hole 61 is formed in the insulating film 32 between the data line Ld and the drain electrode Tr11d, and the data line Ld and the drain electrode Tr11d are conducted through the contact hole 61. . Contact holes 62 and 63 are formed in the insulating film 32 between the scanning line Ls and both ends of the gate electrode Tr11g, respectively. The scanning line Ls and the gate electrode Tr11g are electrically connected via the contact holes 62 and 63. A contact hole 64 is formed in the insulating film 32 between the source electrode Tr11s and the gate electrode Tr12g. The source electrode Tr11s and the gate electrode Tr12g are electrically connected through the contact hole 64. The insulating film 32 is formed of an insulating material, such as a silicon oxide film or a silicon nitride film, and is formed on the substrate 31 so as to cover the data line Ld, the gate electrode Tr11g, and the gate electrode Tr12g.

  Next, as shown in FIG. 8, the organic EL element OEL includes a pixel electrode 42, a light emitting layer 45, and a counter electrode 46. In FIG. 8, for the sake of convenience of explanation, a configuration including only the light emitting layer 45 as a light emitting functional layer that contributes to light emission is taken as an example. However, the present invention is not limited to this, and as shown in FIG. May include a hole injection layer 43 and a light emitting layer 45, and may further include a hole injection layer 43, an interlayer layer 44, and a light emitting layer 45.

  On the substrate 31 of each pixel, a selection transistor Tr11 formed by patterning a gate conductive layer and gate electrodes Tr11g and Tr12g of the drive transistor Tr12 are formed. On the substrate 31 adjacent to each pixel, a data line Ld extending in the column direction is formed by patterning the gate conductive layer.

  The pixel electrode (anode electrode) 42 is made of a conductive material having translucency, for example, ITO (Indium Tin Oxide), ZnO, or the like. Each pixel electrode 42 is insulated from the pixel electrode 42 of another adjacent pixel 30 by an interlayer insulating film 47.

  The interlayer insulating film 47 is formed of an insulating material, for example, a silicon nitride film, is formed between the pixel electrodes 42, and insulates and protects the transistors Tr11 and Tr12, the scanning line Ls, and the anode line La. A substantially rectangular opening 47a is formed in the interlayer insulating film 47, and the light emitting region of the pixel 30 is defined by the opening 47a. Further, a partition wall 48 is formed on the interlayer insulating film 47. The partition wall 48 is formed with a groove-shaped opening 48 a extending in the column direction (vertical direction in FIG. 7) over the plurality of pixels 30. Here, the interlayer insulating film 47 and the partition wall 48 formed thereon form a gap region between the light emitting regions of the pixels 30 arranged adjacent to each other in the row direction.

  The partition wall 48 is formed by curing an insulating material, for example, a photosensitive resin such as polyimide, and is formed on the interlayer insulating film 47. As shown in FIG. 7, the partition wall 48 is formed in a stripe shape so as to open the pixel electrodes 42 of a plurality of pixels along the column direction. The planar shape of the partition wall 48 is not limited to this, and may be a lattice shape having an opening for each pixel electrode 42. Further, as shown in FIG. 5, the upper surface of the partition wall 48 is formed to be higher than the upper surface of the flat portion at the center of the light emitting layers 45R, 45G, 45B.

  Note that the surface of the partition wall 48 and the surface of the interlayer insulating film 47 may be subjected to a liquid repellent treatment. Here, the liquid repellency indicates the property of repelling both aqueous solvents and organic solvents.

  The light emitting layer 45 is formed on the pixel electrode (anode electrode) 42. The light emitting layer 45 has a function of generating light of a predetermined emission color by applying a voltage between the anode electrode 42 and the cathode electrode 46. The light emitting layer 45 is made of a known polymer light emitting material capable of emitting fluorescence or phosphorescence, for example, a light emitting material containing a conjugated double bond polymer such as polyparaphenylene vinylene or polyfluorene. In addition, these luminescent materials are appropriately coated with a solution (dispersion) dissolved (or dispersed) in an aqueous solvent or an organic solvent such as tetralin, tetramethylbenzene, mesitylene, and xylene by a nozzle printing method, an inkjet printing method, or the like. Formed by volatilizing the solvent.

  In the present embodiment, the green light emitting layers 45G1 and 45G2 adjacent to the red pixel 30R are formed, and then the red light emitting layer 45R is formed. Therefore, the portion of the red light emitting layer 45R that is in contact with the green light emitting layers 45G1 and 45G2 covers a part of the portion of the green light emitting layers 45G1 and 45G2 that rides on the partition wall 48, respectively. Formed on board. The blue light-emitting layer 45B is the same as the red light-emitting layer 45R, and the portions in contact with the green light-emitting layers 45G1 and 45G2 are the portions that run on the partition walls 48 of the green light-emitting layers 45G1 and 45G2, respectively. It is formed by riding on it so as to cover a part.

Here, when a hole injection layer is provided as the light emitting functional layer, the hole injection layer 43 is provided between the pixel electrode 42 and the light emitting layer 45 as shown in FIG. The hole injection layer 43 has a function of supplying holes to the light emitting layer 45. The hole injection layer 43 is made of an organic polymer material capable of injecting and transporting holes, for example, polyethylenedioxythiophene (PEDOT) which is a conductive polymer and polystyrene sulfonic acid (PSS) which is a dopant. The
Further, when an interlayer layer is provided as the light emitting functional layer, the interlayer layer 44 is provided between the hole injection layer 43 and the light emitting layer 45 as shown in FIG. The interlayer layer 44 has a function of suppressing the hole injection property of the hole injection layer 43 to facilitate recombination of electrons and holes in the light emitting layer 45, and increases the light emission efficiency of the light emitting layer 45.

  Further, in the case of the bottom emission type, the counter electrode (cathode electrode) 46 is provided on the light emitting layer 45 side, and is an electron injecting lower layer made of a conductive material, for example, a material having a low work function such as Li, Mg, Ca, Ba or the like. And a laminated structure having an upper layer made of a light-reflective conductive metal such as Al. In the present embodiment, the counter electrode 46 is composed of a single electrode layer formed across a plurality of pixels 30, and for example, a reference voltage Vss which is a ground potential is applied. When the organic EL element OEL is a top emission type, the counter electrode 46 is provided on the light emitting layer 45 side and is an extremely thin material having a thickness of about 10 nm, such as Li, Mg, Ca, Ba, etc. A transparent laminated structure having a light transmissive low work function layer made of and a light reflective conductive layer such as ITO having a film thickness of about 100 nm to 200 nm.

  Next, a method for manufacturing the light emitting device according to this embodiment will be described with reference to FIGS. 9A to 9E, FIG. 10A, and FIG. 10B. 10A and 10B are diagrams showing a schematic configuration of a nozzle printing apparatus for explaining the nozzle printing method. As shown in FIGS. 10A and 10B, the nozzle printing apparatus generally includes a nozzle head 50 having a nozzle that continuously discharges a solution 52 made of an organic compound-containing liquid, and the nozzle head 50 is applied to a coating region on the substrate 31. The solution 52 is applied to the application region on the substrate 31 by being moved along the direction. 10A shows a configuration in the case where only one nozzle head 50 is provided, and FIG. 10B shows a configuration in the case where two nozzle heads 50 are provided. 10A and 10B are arranged in a direction in which the vertical direction in FIG. 7 is the horizontal direction in FIG. Here, FIG. 10B shows the case where the nozzle printing apparatus has two nozzle heads 50, but the present invention is not limited to this, and the nozzle printing apparatus may have three or more nozzle heads 50. Since the selection transistor Tr11 is formed in the same process as the driving transistor Tr12, a part of the description of the formation of the selection transistor Tr11 is omitted.

  As shown in FIG. 9A, first, a substrate 31 made of a glass substrate or the like is prepared. Next, on the substrate 31, for example, a gate conduction made of a Mo film, a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film or an AlNdTi alloy film, a MoNb alloy film, or the like by sputtering, vacuum deposition, or the like. A film is formed and patterned into the shape of the gate electrode Tr12g of the drive transistor Tr12 as shown in FIG. 9A. At this time, although not shown, the gate electrode Tr11g of the selection transistor Tr11 and the data line Ld are also formed. Subsequently, as shown in FIG. 9B, an insulating film 32 is formed on the gate electrode Tr12g and the data line Ld by a CVD (Chemical Vapor Deposition) method or the like.

  Next, a semiconductor layer made of amorphous silicon or the like is formed on the insulating film 32 by a CVD method or the like. Next, an insulating film made of, for example, SiN is formed on the semiconductor layer by a CVD method or the like. Subsequently, the insulating film is patterned by photolithography or the like to form the stopper film 115. Further, a film made of amorphous silicon or the like containing n-type impurities is formed on the semiconductor layer and the stopper film 115 by a CVD method or the like, and this film and the semiconductor layer are patterned by photolithography or the like. As shown in FIG. 9B, the semiconductor layer 114 and the ohmic contact layers 116 and 117 are formed.

  Next, a transparent conductive film such as ITO or a light-reflective conductive film and a transparent conductive film such as ITO are coated on the insulating film 32 by sputtering, vacuum deposition, or the like, and this film is patterned by photolithography. A pixel electrode 42 is formed.

  Subsequently, after forming contact holes 61 to 64 as through holes in the insulating film 32, for example, a Mo film, a Cr film, an Al film, a Cr / Al laminated film, an AlTi alloy film, an AlNdTi alloy film, or a MoNb alloy film. A source-drain conductive film made of, for example, is coated by sputtering, vacuum deposition, or the like. This film is patterned by photolithography to form a drain electrode Tr12d and a source electrode Tr12s as shown in FIG. 9B. At the same time, the anode line La is formed. At this time, the source electrode Tr12s of the drive transistor Tr12 is formed so as to overlap with a part of the pixel electrode 42, respectively.

  Subsequently, as shown in FIG. 9C, an interlayer insulating film 47 made of a silicon nitride film is formed by a CVD method or the like so as to cover the driving transistor Tr12 and the like, and then an opening 47a is formed by photolithography. Next, photosensitive polyimide is applied so as to cover the interlayer insulating film 47, patterned by exposure and development through a mask corresponding to the shape of the partition wall 48, and has an opening 48a as shown in FIG. 9C. A partition wall 48 is formed.

  Next, as shown in FIG. 10A, an organic compound-containing liquid containing a light emitting polymer material (R, G, B) as the solution 52 using a nozzle printing apparatus that continuously flows the solution 52 from the nozzles of the nozzle head 50. Is applied on the pixel electrode 42 provided between the partition walls 48 and surrounded by the opening 47a. Application is performed along the formation direction of the partition wall 48 (vertical direction shown in FIG. 7). In the application using the nozzle printing apparatus, as shown in FIG. 10A, the organic compound-containing liquid is discharged from the nozzles of the nozzle head 50 and applied onto the substrate 31. The nozzle head 50 moves along the direction in which the partition walls 48 are formed (the left-right direction in FIG. 10A) while discharging the organic compound-containing liquid between the partition walls 48. In addition, when performing application | coating to each row | line | column continuously, as shown to FIG. 10A, while the nozzle head 50 exists outside the board | substrate 31, the direction orthogonal to the direction (the direction where the partition wall 48 was formed) It is moved by a predetermined distance in the vertical direction in FIG. 10A. By repeating this, the solution 52 is applied to a predetermined row. Alternatively, instead of moving the substrate 31, the nozzle head 50 may be moved by a predetermined distance in a direction orthogonal to the direction in which the partition walls 48 are formed. Note that while the nozzle head 50 is outside the substrate 31, the solution 52 may be discharged, or the discharge may be temporarily stopped. Here, as shown in FIG. 10A, when the nozzle printing apparatus has only one nozzle head 50, application is performed by alternately changing the moving direction of the nozzle head 50 for each column. As shown in FIG. 10B, when the nozzle printing apparatus has two nozzle heads 50, application is performed by alternately changing the moving direction of the nozzle head 50 every two rows.

  In the present embodiment, as shown in FIG. 9D, first, green light emitting layers 45G1 and 45G2 are formed using a nozzle printing apparatus. Next, as shown in FIG. 9E, a red light emitting layer 45R and a blue light emitting layer 45B are formed using a nozzle printing apparatus.

  As described above, when the light emitting layers are formed every other row, when the red light emitting layer 45R is formed, the green light emitting layers 45G1 and 45G2 are previously formed on the barrier ribs 48 adjacent to the red light emitting layer 45R. 48 is formed. Therefore, the red light emitting layer 45R is easily compatible with any of the light emitting layers to the same extent, so that the drying speed is prevented from being different. Therefore, the red light emitting layer 45R has a uniform film thickness on the left and right. The same applies to the blue light emitting layer 45B. Further, since the green light emitting layers 45G1 and 45G2 formed in advance every other row are formed in a state in which no light emitting layer is formed on the partition wall 48, there is no imbalance between the drying speeds on the left and right. Therefore, the green light emitting layers 45G1 and 45G2 can also have a symmetrical film thickness.

  In the case where the hole injection layer 43 is formed as the light emitting functional layer, the organic compound containing liquid containing the hole injection material is used as the solution 52 and the solution 52 is continuously discharged before the light emitting layer 45 is formed. The ink is selectively applied onto the pixel electrode 42 surrounded by the opening 47a by the nozzle printing apparatus shown in FIG. 10A or an inkjet apparatus that intermittently discharges a plurality of independent droplets. Subsequently, the substrate 31 is heated in an air atmosphere to volatilize the solvent of the organic compound-containing liquid, thereby forming the hole injection layer 43. The organic compound-containing liquid may be applied in a heated atmosphere.

  When the interlayer layer 44 is further formed as the light emitting functional layer, an organic compound-containing liquid containing a material to be the interlayer layer 44 is used as the solution 52, and the solution 52 is continuously discharged from the nozzle as shown in FIG. 10A. It coats on the hole injection layer 43 using a nozzle printing apparatus or an inkjet apparatus. The interlayer 44 is formed by performing heat drying in a nitrogen atmosphere or heat drying in a vacuum to remove the residual solvent. The organic compound-containing liquid may be applied in a heated atmosphere.

  Subsequently, two layers of a layer 31 made of a material having a low work function such as Li, Mg, Ca, Ba and a light-reflective conductive layer such as Al are formed on the substrate 31 formed up to the light emitting layer 45 by vacuum deposition or sputtering. A counter electrode 46 having a structure is formed.

Next, a sealing resin made of an ultraviolet curable resin or a thermosetting resin is applied on the substrate 31 outside the light emitting region where the plurality of pixels 30 are formed, and the sealing substrate (not shown) and the substrate 31 are bonded together. Next, the sealing resin is cured by ultraviolet rays or heat, and the substrate 31 and the sealing substrate are bonded.
From the above, the light emitting device 10 is manufactured.

  As described above, in the method for manufacturing the light emitting device according to the present embodiment, one light emitting color pixel is divided into two to form an even number of pixels, and light emitting layers are formed every other column. Thereby, since the drying speed of the light emitting layer formed later can be made relatively uniform, the light emitting layer 45 of each color can be made into a film having good uniformity.

  Here, the configuration in which the light emitting layers of the respective colors are formed by coating the red light emitting layer 45R in all rows, coating the green light emitting layer 45G in all rows, and coating the blue light emitting layer 45B in all rows is compared. As an example, the effect in this embodiment when compared with this will be described.

  FIG. 11 is a diagram showing a cross-sectional structure of the light emitting device and the film thickness distribution of each light emitting layer in the present embodiment, and FIG. 12 is a diagram showing a cross sectional structure of the light emitting device and a film thickness distribution of each light emitting layer in the comparative example. It is.

  In the case of the comparative example, as shown in FIG. 12, the film thickness of the light emitting layer 45G and the light emitting layer 45B to be applied later is difficult to be uniform. This is due to the fact that the organic compound-containing liquid for forming the light emitting layer is more easily adapted on the light emitting layer than on the partition. That is, when the green light emitting layer is applied after the red light emitting layers are applied in all rows, the organic compound-containing liquid for forming the green light emitting layer is easily pulled toward the red light emitting layer side. As a result, in the G light emitting layer, the drying speed of the organic compound-containing liquid differs particularly in the left-right direction shown in FIG. 12, and as shown schematically in FIG. 12, the red-side film thickness increases and the left-right is asymmetric. Film thickness. The same applies to the blue light-emitting layer. The film thickness on the green light-emitting layer side formed earlier is increased, and the left and right film thicknesses are asymmetric.

  On the other hand, the green pixel is divided into two as in the present embodiment, the four pixels are combined into one set, and the green light emitting layers 45G1 and 45G2 are formed first, and then the red light emitting layer 45R and blue When the light emitting layer 45B is formed, the drying rate can be made more uniform. For example, after the green light emitting layers 45G1 and 45G2 are formed in advance, the organic compound-containing liquid of the red light emitting layer 45R is applied. Even if the red organic compound-containing liquid is applied on the green light-emitting layers 45G1 and 45G2, the drying rate is different in the left-right direction shown in FIG. There is no. Accordingly, as shown in FIG. 11, the red light emitting layer 45R has a uniform thickness on the left and right. The same applies to the blue light emitting layer 45B. Further, since the green light emitting layers 45G1 and 45G2 formed in advance every other row are formed in a state in which no light emitting layer is formed on the partition walls, there is no imbalance between the drying speeds on the left and right. Accordingly, the left and right film thicknesses of the green light emitting layers 45G1 and 45G2 can be made symmetrical.

  In the above-described embodiment, the configuration in which the red light emitting layer 45R and the blue light emitting layer 45B are formed after forming the green light emitting layers 45G1 and 45G2 has been described as an example. I can't. In short, since it is only necessary to apply the light emitting layers every other row, for example, the green light emitting layers 45G1 and 45G2 may be formed after the red light emitting layer 45R and the blue light emitting layer 45B are formed.

  In the above-described embodiment, the configuration in which the green pixel is divided into two is described as an example, but the present invention is not limited to this. For example, either a red pixel or a blue pixel may be divided into two.

(Second Embodiment)
The light emitting device 20 according to the second embodiment will be described with reference to the drawings. The light emitting device of the present embodiment is different from the light emitting device 10 according to the first embodiment described above in that a white (W) pixel 30 </ b> W is further added in addition to red (R), green (G), and blue (B). It is in the point to prepare. Detailed description of portions common to the first embodiment will be omitted.

  FIG. 13 is a plan view illustrating a configuration example of the light emitting device 20 according to the second embodiment. FIG. 14 is a diagram showing a cross-sectional configuration of the light emitting device 20 shown in FIG.

  In the light emitting device 20, four pixels 30 </ b> R, 30 </ b> B, and 30 </ b> G that emit light in four colors of red (R), blue (B), green (G), and white (W), respectively, on the substrate 31 as illustrated in FIG. 13. , 30 W as a set, a plurality of, for example, x sets are arranged in the row direction (left-right direction in FIG. 13). In the column direction (vertical direction in FIG. 13), a plurality of, for example, y pixels having light emitting elements of the same light emitting color are arranged. In other words, 4x pixels are arranged in the row direction, and 4x × y pixels emitting each color of RGBW are arranged in a matrix.

  Next, FIG. 14 shows a cross-sectional configuration of the light-emitting device 20 shown in FIG. In FIG. 14, for convenience of explanation, the substrate 31, the pixel electrode 42, and the partition wall 48, four-color light emitting layers having red (R), green (G), blue (B), and white (W) emission colors, respectively. Only 45 (45R, 45G, 45B, 45W) is illustrated, and the other components are not shown. In the present embodiment, four-color pixels 30R, 30G, 30B, and 30W are provided, and the light emitting layers 45R, 45G, 45B, and 45W form the light emitting elements of the pixels 30R, 30G, 30B, and 30W, respectively. is there. In the present embodiment, in particular, the red light emitting layer 45R and the blue light emitting layer 45B are formed, and then the green light emitting layer 45G and the white light emitting layer 45W are formed. Therefore, the portion of the green light emitting layer 45G that is in contact with the red light emitting layer 45R and the blue light emitting layer 45B is a part of the portion that rides on the partition wall 48 of the red light emitting layer 45R and the blue light emitting layer 45B. It is formed by riding on it so as to cover it. The same applies to the white light-emitting layer 45W, and the portion in contact with the blue light-emitting layer 45B and the red light-emitting layer 45R is one of the portions on the partition wall 48 of the blue light-emitting layer 45B and the red light-emitting layer 45R, respectively. It is formed by riding on it so as to cover the part.

  Also in this embodiment, since the light emitting layer is formed every other row, when the green light emitting layer 45G is formed, the red light emitting layer 45R is previously formed on the partition wall 48 adjacent to the green light emitting layer 45G. A blue light emitting layer 45 </ b> B is formed on the partition wall 48. Since the green light-emitting layer 45G is easily adapted to the same degree as any light-emitting layer, it is suppressed that the drying speed is different. Therefore, the green light emitting layer 45G has a uniform thickness on the left and right. The same applies to the white light emitting layer 45W. In addition, the red light emitting layer 45R and the blue light emitting layer 45B, which are formed in every other row in advance, are formed in a state in which no light emitting layer is formed on the partition wall 48, and therefore, the drying rate imbalance between the left and right Does not occur. Therefore, the red light-emitting layer 45R and the blue light-emitting layer 45B can also have a symmetrical film thickness.

  In the present embodiment, the configuration in which the red light emitting layer 45R and the blue light emitting layer 45B are formed first is described as an example, but the green light emitting layer 45G and the white light emitting layer 45W are formed first. Then, the red light emitting layer 45R and the blue light emitting layer 45B may be formed later. In addition, since the effect of this embodiment can be obtained if the light emitting layers are formed every other row, the order of the colors of the light emitting layers and the order of application of the light emitting layers can be appropriately changed.

  Further, the number of light emitting elements may be an even number. For example, the first embodiment and the second embodiment are combined, and one color is divided into two, and then a plurality of colors are provided, for example, the second embodiment. An even number of colors, specifically four colors, may be used.

The present invention is not limited to the above-described embodiments, and various modifications and applications are possible.
In the above-described embodiment, the configuration in which the light emitting functional layer includes only the light emitting layer is given as an example. However, the present invention is not limited thereto, and as illustrated in FIG. Further, it may be provided. The hole injection layer 43 and the interlayer layer 44 can be formed of a common material even when a plurality of light emitting layers are provided. Therefore, when these hole injection layer 43 and interlayer layer 44 are formed, if an organic compound-containing liquid containing these materials is applied every other row, the film thickness can be made relatively uniform. This is preferable. When applied every other row, as shown in FIG. 15, the end of the hole injection layer 43 is formed so as to cover the end of the adjacent hole injection layer 43. Similarly, the interlayer layer 44 is formed so as to cover the end of the adjacent interlayer layer 44.

  When the hole injection layer 43 is formed, for example, a PEDOT / PSS aqueous solution that is a dispersion in which polyethylenedioxythiophene (PEDOT) that is a conductive polymer and polystyrene sulfonic acid (PSS) that is a dopant are dispersed in an aqueous solvent. Is used.

  In the embodiment described above, the pixel circuit DS has a configuration including two transistors as an example. However, the pixel circuit DS may include three or more transistors.

  In the above-described embodiments, the bottom emission type organic EL element has been described. However, the present invention is not limited to this, and the top emission type organic EL element that emits light generated by the organic EL element OEL to the outside through the counter electrode 46 is not limited thereto. It can also be used for EL elements. In this case, the pixel electrode 42 may be formed from a material that does not have translucency, and the counter electrode 46 is formed from a material with a low work function such as Li, Mg, Ca, Ba such as a very thin film having a thickness of about 10 nm. A transparent laminated structure having a light transmissive low work function layer and a light reflective conductive layer such as ITO having a thickness of about 100 nm to 200 nm.

  In each of the above-described embodiments, the configuration in which the light emitting device is used as a display device has been described as an example. However, it can also be used as an exposure device such as a printer head that irradiates light to a photosensitive drum of a printer.

DESCRIPTION OF SYMBOLS 10,20 ... Light-emitting device, 30, 30R, 30G, 30G1, 30G2, 30B, 30W ... Pixel, 31 ... Substrate, 32 ... Insulating film, 42 ... Pixel electrode (anode electrode) , 43 ... hole injection layer, 44 ... interlayer layer, 45, 45R, 45G1, 45G2, 45B, 45W ... light emitting layer, 46 ... counter electrode (cathode electrode), 47 ... Interlayer insulating film 48... Partition wall 50... Nozzle head 52. Solution 114. Semiconductor layer 115 stopper film 116 and 117 ohmic contact layer Tr11d and Tr12d ... Drain electrode, Tr11g, Tr12g ... Gate electrode, Tr11s, Tr12s ... Source electrode, La ... Anode line, Ls ... Scan line, Ld ... Data Inn, Tr11 ··· selection transistor, Tr12 ··· drive transistor

Claims (9)

Comprising a plurality of light emitting elements arranged along a plurality of rows and a plurality of columns;
Each of the light emitting elements has a light emitting functional layer including a light emitting layer that emits light in a predetermined emission color,
A plurality of sets having n (n is an even number) light emitting elements arranged in a fixed order in the row direction are arranged adjacent to each other in a fixed order in the row direction;
A gap region provided between the light emitting elements arranged adjacent to each other in the row direction;
The light emitting functional layer of each light emitting element is formed across the formation region of the light emitting layer and a part of the gap region on both sides along the row direction,
Each set includes only a first light emitting element group including n / 2 light emitting elements and a second light emitting element group including n / 2 light emitting elements.
The light emitting elements of the first light emitting element group and the light emitting elements of the second light emitting element group are alternately arranged along the row direction for each of the light emitting elements.
The light emitting functional layer of each light emitting element of the first light emitting element group includes two light emitting elements of the second light emitting element group arranged adjacent to both sides along the row direction of each light emitting element. In the gap region between each of the two light emitting element groups, the two light emitting element groups are covered by a part of the light emitting functional layer,
The light emitting functional layer of each light emitting element of the second light emitting element group includes two light emitting elements of the first light emitting element group arranged adjacent to both sides along the row direction of each light emitting element. The light emitting device characterized in that a part of the light emitting functional layer of the two light emitting elements of the first light emitting element group is covered in the gap region between each. The n light emitting elements in each set are
A first light-emitting element having a first light-emitting layer of a first emission color;
A second light emitting element having a second light emitting layer of a second light emitting color different from the first light emitting color;
A third light-emitting element having a third light-emitting layer having a third light-emitting color different from the first and second light-emitting colors,
The first light-emitting element, and the fourth light-emitting element having a fourth light-emitting layer of the light emitting color of the same color and the second light-emitting element and the third light-emitting element Neu Zureka one particular light emitting element the light emitting device according to claim 1, characterized in that it comprises a. Before Kitoku the fourth light emitting element and the light emitting element of the constant-emitting device according to claim 2, wherein the forming one of said second light emitting element group and the first light emitting element group. The n light emitting element of said each set,
A first light-emitting element having a first light-emitting layer of a first emission color;
A second light emitting element having a second light emitting layer of a second light emitting color different from the first light emitting color;
A third light emitting element having a third light emitting layer of a third light emitting color different from the first and second light emitting colors;
The light-emitting device according to claim 1, further comprising: a fourth light-emitting element having a fourth light-emitting layer having a fourth light-emitting color different from the first to third light-emitting colors. A method of manufacturing a light-emitting device in which a plurality of light-emitting elements that emit light of a predetermined emission color along a plurality of rows and a plurality of columns are arranged,
The light emitting device has a gap region provided between the light emitting elements arranged adjacent to each other in a row direction,
A plurality of sets having n (n is an even number) light emitting elements arranged in a fixed order in the row direction are formed so as to be adjacent to each other in a fixed order in the row direction, , Forming only a first light emitting element group including n / 2 light emitting elements and a second light emitting element group including n / 2 light emitting elements, and each of the light emitting elements of the first light emitting element group A light emitting element forming step of forming each light emitting element of the second light emitting element group alternately arranged along the row direction for each one of the light emitting elements;
The light emitting element forming step includes:
A solution is applied in a column direction to a formation region of a light emitting layer that emits light of a predetermined light emission color of each light emitting element of the first light emitting element group that is alternately arranged along the row direction for each of the light emitting elements. And forming a light emitting functional layer including the light emitting layer every other row,
After the first step, the solution is arranged in the formation region of the light emitting layer of each light emitting element of the second light emitting element group arranged in the row where the solution is not applied in the first step. A second step of applying in the direction to form the light emitting functional layer,
The light emitting functional layer formed in the first step and the second step is formed across the formation region of the light emitting layer and a part of the gap region on both sides along the row direction,
The second light emitting element in which the light emitting functional layer of each light emitting element of the first light emitting element group formed by the first step is arranged adjacent to both sides along the row direction of each light emitting element. Formed in the gap region between each of the two light emitting elements of the group so as to be covered by a part of the light emitting functional layer of the two light emitting elements of the second light emitting element group;
The first light emitting element in which the light emitting functional layer of each light emitting element of the second light emitting element group formed by the second step is arranged adjacent to both sides along the row direction of each light emitting element. The gap region between each of the two light emitting elements of the group is formed so as to cover a part of the light emitting functional layer of the two light emitting elements of the first light emitting element group. A method for manufacturing a light emitting device. The light emitting element forming step includes a first light emitting element having a first light emitting layer of a first light emitting color as the n light emitting elements of each set, and a second light emitting color different from the first light emitting color. A second light emitting element having a second light emitting layer having a light emitting color, and a third light emitting element having a third light emitting layer having a third light emitting color different from the first and second light emitting colors. and forming a fourth with the first light emitting element, the second light-emitting element and the third light-emitting element Neu Zureka one fourth emission color of the same color as the particular light-emitting elements of the light emitting layer method of manufacturing a light-emitting device according to claim 5 in which the light emitting element, to form formed of, it is characterized. The light emitting device forming step, before the Kitoku constant of the light emitting device said fourth light-emitting element, to claim 6, characterized in that formed as one of the second light emitting element group and the first light emitting element group The manufacturing method of the light-emitting device of description.   The light emitting element forming step includes a first light emitting element having a first light emitting layer of a first light emitting color as the set of light emitting elements, and a second light emitting color different from the first light emitting color. A second light-emitting element having two light-emitting layers; a third light-emitting element having a third light-emitting layer having a third light-emitting color different from the first and second light-emitting colors; The method for manufacturing a light emitting device according to claim 5, further comprising: forming a fourth light emitting element having a fourth light emitting layer having a fourth light emitting color different from the third light emitting color.   An electronic apparatus comprising the light-emitting device according to claim 1.

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