JP5503963B2 - Curable silicone composition comprising organosilicon compound, process for producing the same, and organosilicon compound as an adhesion-imparting agent - Google Patents
Curable silicone composition comprising organosilicon compound, process for producing the same, and organosilicon compound as an adhesion-imparting agent Download PDFInfo
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- JP5503963B2 JP5503963B2 JP2009298662A JP2009298662A JP5503963B2 JP 5503963 B2 JP5503963 B2 JP 5503963B2 JP 2009298662 A JP2009298662 A JP 2009298662A JP 2009298662 A JP2009298662 A JP 2009298662A JP 5503963 B2 JP5503963 B2 JP 5503963B2
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- 150000003961 organosilicon compounds Chemical class 0.000 title claims description 42
- 229920001296 polysiloxane Polymers 0.000 title claims description 38
- 239000000203 mixture Substances 0.000 title claims description 36
- 238000000034 method Methods 0.000 title description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- -1 aliphatic unsaturated carbon Chemical class 0.000 claims description 18
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims description 15
- 125000001424 substituent group Chemical group 0.000 claims description 15
- 125000001931 aliphatic group Chemical group 0.000 claims description 14
- 229940014800 succinic anhydride Drugs 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920006395 saturated elastomer Polymers 0.000 claims description 6
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical group O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 claims description 6
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 8
- 238000006243 chemical reaction Methods 0.000 description 25
- 150000001875 compounds Chemical class 0.000 description 20
- 150000002430 hydrocarbons Chemical group 0.000 description 19
- 125000003342 alkenyl group Chemical group 0.000 description 14
- 125000002947 alkylene group Chemical group 0.000 description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 239000004734 Polyphenylene sulfide Substances 0.000 description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 description 9
- 125000000217 alkyl group Chemical group 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- WUMMIJWEUDHZCL-UHFFFAOYSA-N 3-prop-2-enyloxolane-2,5-dione Chemical compound C=CCC1CC(=O)OC1=O WUMMIJWEUDHZCL-UHFFFAOYSA-N 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 125000000732 arylene group Chemical group 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 0 CC(*C(CC(O1)=O)C1=O)(*1)[Si]1(*)O Chemical compound CC(*C(CC(O1)=O)C1=O)(*1)[Si]1(*)O 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 238000004949 mass spectrometry Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 2
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000005156 substituted alkylene group Chemical group 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 125000006232 ethoxy propyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005745 ethoxymethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000006233 propoxy propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000005767 propoxymethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])[#8]C([H])([H])* 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
Description
本発明は、新規な有機ケイ素化合物およびその製造方法、ならびにその有機ケイ素化合物を接着性付与剤として含む硬化性シリコーン組成物に関する。 The present invention relates to a novel organosilicon compound, a method for producing the same, and a curable silicone composition containing the organosilicon compound as an adhesion-imparting agent.
特許文献１には、一分子中に少なくとも２個のアルケニル基を有し且つ２５℃での粘度が１０ｍＰａ・ｓ以上の液状又は固体状のオルガノポリシロキサン、一分子中に少なくとも２個のケイ素原子結合水素原子を有し、かつ２５℃での粘度が１,０００ｍＰａ・ｓ以下であるオルガノハイドロジェンポリシロキサン及び／又はオルガノハイドロジェンシラン、ヒドロシリル化反応用触媒、一分子中に、ケイ素原子結合水素原子、オルガノオキシシリル基及びケイ素原子結合アルケニル基からなる群から選ばれる少なくとも１種の基とエポキシ基とを有するケイ素化合物、および液状酸無水物を少なくとも含む硬化性シリコーン組成物が開示されている。また特許文献２には、一分子中に少なくとも２個のアルケニル基を有するジオルガノポリシロキサン、三官能性シロキサン単位及び四官能性シロキサン単位から選ばれる少なくとも一種の分岐形成単位を含有する三次元状のオルガノポリシロキサンレジン、一分子中に少なくとも２個のケイ素原子結合水素原子を有するオルガノハイドロジェンポリシロキサン、ヒドロシリル化反応用触媒、接着性付与剤としての有機ケイ素化合物、および室温で液体の酸無水物を少なくとも含む硬化性シリコーン組成物が開示されている。 Patent Document 1 discloses a liquid or solid organopolysiloxane having at least two alkenyl groups in one molecule and having a viscosity at 25 ° C. of 10 mPa · s or more, and at least two silicon atoms in one molecule. Organohydrogenpolysiloxane and / or organohydrogensilane having a bonded hydrogen atom and a viscosity at 25 ° C. of 1,000 mPa · s or less, a catalyst for hydrosilylation reaction, silicon-bonded hydrogen in one molecule Disclosed is a curable silicone composition comprising at least a silicon compound having at least one group selected from the group consisting of an atom, an organooxysilyl group, and a silicon atom-bonded alkenyl group and an epoxy group, and a liquid acid anhydride. . Patent Document 2 discloses a three-dimensional shape containing at least one branch-forming unit selected from a diorganopolysiloxane having at least two alkenyl groups in one molecule, a trifunctional siloxane unit, and a tetrafunctional siloxane unit. Organopolysiloxane resins, organohydrogenpolysiloxanes having at least two silicon-bonded hydrogen atoms per molecule, hydrosilylation catalysts, organosilicon compounds as adhesion promoters, and liquid anhydrides at room temperature A curable silicone composition containing at least the product is disclosed.
しかし、このような硬化性シリコーン組成物といえども、比較的低温で硬化させた場合には、ＰＰＳなどの難接着性樹脂に対しては十分な接着性を発現できないという問題があった。 However, even when such a curable silicone composition is cured at a relatively low temperature, there is a problem that sufficient adhesiveness cannot be exhibited with respect to a hardly adhesive resin such as PPS.
特許文献３及び特許文献４には、有機ケイ素化合物として、アリルコハク酸無水物等のアルケニル基置換コハク酸無水物とトリアルコキシシランとのヒドロシリル化反応により得られるコハク酸無水物基含有オルガノシラン化合物が記載されている。 In Patent Document 3 and Patent Document 4, succinic anhydride group-containing organosilane compounds obtained by hydrosilylation reaction between alkenyl group-substituted succinic anhydrides such as allyl succinic anhydride and trialkoxysilane are disclosed as organosilicon compounds. Have been described.
しかし、上記の公知のコハク酸無水物基含有オルガノシラン化合物を付加反応硬化型シリコーンゴム組成物用の接着性付与剤として使用した場合でも、特にポリフェニレンスルファイド樹脂(PPS)などの難接着性基材へのシリコーンゴム組成物の接着性は満足できるものではなかった。 However, even when the above-mentioned known succinic anhydride group-containing organosilane compound is used as an adhesion-imparting agent for an addition reaction curable silicone rubber composition, it is particularly difficult to adhere to an adhesive group such as polyphenylene sulfide resin (PPS). The adhesion of the silicone rubber composition to the material was not satisfactory.
本発明の目的は新規な有機ケイ素化合物、その製造方法、及びその有機ケイ素化合物からなる硬化性シリコーン組成物用接着性付与剤を提供することにある。 An object of the present invention is to provide a novel organosilicon compound, a method for producing the same, and an adhesiveness imparting agent for a curable silicone composition comprising the organosilicon compound.
本発明は、 下記一般式（１）
また、本発明は、上記の有機ケイ素化合物からなる、硬化性シリコーン組成物用接着性付与剤に関するものである。
The present invention provides the following general formula (1)
Moreover, this invention relates to the adhesiveness imparting agent for curable silicone compositions which consists of said organosilicon compound.
本発明の有機ケイ素化合物は、当該化合物を硬化性シリコーン組成物に配合した場合、当該硬化性シリコーン組成物を比較的低温で硬化させた場合でも、ＰＰＳなどの難接着性樹脂に対して良好な接着性を示し、接着強度に優れるという特徴がある。 The organosilicon compound of the present invention is good for difficult-to-adhere resins such as PPS even when the compound is blended in a curable silicone composition, even when the curable silicone composition is cured at a relatively low temperature. It is characterized by showing adhesiveness and excellent adhesive strength.
本発明の有機ケイ素化合物は、下記一般式（１）
R1としては、炭素原子数が３〜１２のアルキレン基、側鎖にフェニル基及び／又はシクロアルキル基を有する置換アルキレン基、アルキレン・アリーレン・アルキレン基、アリーレン・アルキレン基（例えば、-C6H4-CH2CH2-基）、及びフェニレン基が例示できる。とりわけ、R1は炭素原子数３〜１２のアルキレン基であることが好ましく、直鎖状の炭素原子数３〜１０のアルキレン基であることが特に好ましい。
The organosilicon compound of the present invention has the following general formula (1)
R 1 includes an alkylene group having 3 to 12 carbon atoms, a substituted alkylene group having a phenyl group and / or a cycloalkyl group in the side chain, an alkylene / arylene / alkylene group, an arylene / alkylene group (for example, —C 6 H 4 —CH 2 CH 2 — group) and phenylene group. In particular, R 1 is preferably an alkylene group having 3 to 12 carbon atoms, and particularly preferably a linear alkylene group having 3 to 10 carbon atoms.
R1の具体例としては、
式（１）中、R2は、炭素原子数が１〜１０の分子鎖末端に脂肪族不飽和結合を有しない一価炭化水素基であり、例えば、メチル基、エチル基、プロピル基、ブチル基、イソブチル基、ターシャリーブチル基、ペンチル基、シクロペンチル基、ヘキシル基、シクロへキシル基、及びデシル基などのアルキル基；３−クロロプロピル基および３，３，３−トリフルオロプロピル基などのハロゲン化アルキル基；並びにフェニル基、トリル基及びキシリル基などのアリール基が例示される。R2はアルキル基、特にメチル基であることが好ましい。 In the formula (1), R 2 is a monovalent hydrocarbon group having no aliphatic unsaturated bond at the end of the molecular chain having 1 to 10 carbon atoms, for example, methyl group, ethyl group, propyl group, butyl Groups, isobutyl groups, tertiary butyl groups, pentyl groups, cyclopentyl groups, hexyl groups, cyclohexyl groups, decyl groups and other alkyl groups; 3-chloropropyl groups and 3,3,3-trifluoropropyl groups, etc. Illustrative are halogenated alkyl groups; and aryl groups such as phenyl, tolyl and xylyl groups. R 2 is preferably an alkyl group, particularly a methyl group.
式（１）中、R3は、炭素原子数が１〜１８の分子鎖末端に脂肪族不飽和結合を有しない一価炭化水素基またはアルコキシアルキル基である。炭化水素基としては例えば、メチル基、エチル基、プロピル基、ブチル基、デシル基、ドデシル基、及びヘキサデシル基などのアルキル基が例示される。アルコキシアルキル基としては例えば、メトキシメチル基、メトキシエチル基、メトキシ、プロピル基、エトキシメチル基、エトキシエチル基、エトキシプロピル基、プロポキシメチル基、プロポキシエチル基、プロポキシプロピル基などの炭素原子数２〜１０のアルコキシアルキル基が例示される。R3はアルキル基、特にエチル基またはメチル基であることが好ましい。 In formula (1), R 3 is a monovalent hydrocarbon group or alkoxyalkyl group having no aliphatic unsaturated bond at the end of the molecular chain having 1 to 18 carbon atoms. Examples of the hydrocarbon group include alkyl groups such as a methyl group, an ethyl group, a propyl group, a butyl group, a decyl group, a dodecyl group, and a hexadecyl group. Examples of alkoxyalkyl groups include methoxymethyl, methoxyethyl, methoxy, propyl, ethoxymethyl, ethoxyethyl, ethoxypropyl, propoxymethyl, propoxyethyl, and propoxypropyl groups. Ten alkoxyalkyl groups are exemplified. R 3 is preferably an alkyl group, particularly an ethyl group or a methyl group.
式（１）中、R4は炭素原子数１〜１２の、置換または非置換の飽和二価炭化水素基又は不飽和炭素−炭素二重結合もしくは三重結合を有する置換または非置換の二価炭化水素基であり、この二価炭化水素基は直鎖状であることが好ましいが分岐していてもよい。ただし、この二価炭化水素基が、分岐鎖の分子鎖末端及び置換基の分子鎖末端に脂肪族不飽和結合を有しないことを条件とする。 In the formula (1), R 4 is a substituted or unsubstituted divalent carbon group having 1 to 12 carbon atoms, a substituted or unsubstituted saturated divalent hydrocarbon group or an unsaturated carbon-carbon double bond or triple bond. It is a hydrogen group, and this divalent hydrocarbon group is preferably linear but may be branched. However, it is a condition that this divalent hydrocarbon group does not have an aliphatic unsaturated bond at the molecular chain terminal of the branched chain and the molecular chain terminal of the substituent.
R4としては、鎖状の−CH2−、
−CH2CH2CH2CH2CH2CH2CH2CH2CH2CH2CH2CH2−、及び−CH(CH3)-CH2−などの炭素原子数が１〜１２のアルキレン基、側鎖にフェニル基やシクロアルキル基を有する炭素原子数が８〜２１の置換アルキレン基、炭素原子数が８〜２１のアルキレン・アリーレン・アルキレン基、炭素原子数が８〜２１のアリーレン・アルキレン基（例えば、-C6H4-CH2CH2-基）、及びフェニレン基が例示できる。中でもR4は炭素原子数１〜１２のアルキレン基であることが好ましく、直鎖状の炭素原子数２〜９のアルキレン基であることがさらに好ましい。
As R 4 , chain -CH 2- ,
An alkylene group having 1 to 12 carbon atoms, such as —CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 CH 2 — and —CH (CH 3 ) —CH 2 —; A substituted alkylene group having 8 to 21 carbon atoms having a phenyl group or a cycloalkyl group in the side chain, an alkylene / arylene / alkylene group having 8 to 21 carbon atoms, or an arylene / alkylene group having 8 to 21 carbon atoms Examples thereof include a group (for example, —C 6 H 4 —CH 2 CH 2 — group) and a phenylene group. Among these, R 4 is preferably an alkylene group having 1 to 12 carbon atoms, and more preferably a linear alkylene group having 2 to 9 carbon atoms.
R4の具体例としては、
式（１）中、R5はそれぞれ独立に、炭素原子数が１〜１０の分子鎖末端に脂肪族不飽和結合を有しない一価炭化水素基であり、例えば、メチル基、エチル基、プロピル基、ブチル基、イソブチル基、ターシャリーブチル基、ペンチル基、シクロペンチル基、ヘキシル基、シクロへキシル基、及びデシル基などのアルキル基；３−クロロプロピル基および３，３，３−トリフルオロプロピル基などのハロゲン化アルキル基；並びにフェニル基、トリル基及びキシリル基などのアリール基が例示される。R5はそれぞれ独立にアルキル基またはフェニル基、特に、メチル基、エチル基、シクロへキシル基及びフェニル基からなる群から選択されることが好ましく、メチル基がもっとも好ましい。-Si(R5)(R5)-の例として下記の構造を挙げることができる。 In formula (1), each R 5 is independently a monovalent hydrocarbon group having no aliphatic unsaturated bond at the end of the molecular chain having 1 to 10 carbon atoms, for example, methyl group, ethyl group, propyl Group, butyl group, isobutyl group, tertiary butyl group, pentyl group, cyclopentyl group, hexyl group, cyclohexyl group, decyl group and other alkyl groups; 3-chloropropyl group and 3,3,3-trifluoropropyl Illustrative are halogenated alkyl groups such as groups; and aryl groups such as phenyl, tolyl and xylyl groups. R 5 is preferably independently selected from the group consisting of an alkyl group or a phenyl group, particularly a methyl group, an ethyl group, a cyclohexyl group and a phenyl group, and a methyl group is most preferable. Examples of -Si (R 5 ) (R 5 )-include the following structures.
式（１）中、ｎは０、１または２であり、０または１であることが特に好ましい。 In the formula (1), n is 0, 1 or 2, and is particularly preferably 0 or 1.
式（１）中、ｍは０〜２０の整数であり、０〜１０の整数であることが好ましく、０〜２の整数であることがより好ましく、１または２であることが特に好ましい。
。
In the formula (1), m is an integer of 0 to 20, preferably an integer of 0 to 10, more preferably an integer of 0 to 2, and particularly preferably 1 or 2.
.
式（１）で表されるこのような新規なコハク酸無水物官能性有機ケイ素化合物の例としては、以下のものが挙げられる。 Examples of such novel succinic anhydride functional organosilicon compounds represented by formula (1) include:
これらのなかでも、蒸留によって高純度なものを製造しやすい点、及び原料の入手が容易である点から、下記の化合物が特に好ましい。 Among these, the following compounds are particularly preferable from the viewpoint of easy production of a high-purity product by distillation and easy availability of raw materials.
上記一般式（１）で表される新規化合物は、下記一般式（２）
上記式（２）中、R6は、炭素原子数１〜１０の置換または非置換の二価炭化水素基であり、炭素原子数が２〜１０の不飽和炭素−炭素二重結合を有する置換または非置換の二価炭化水素基であってもよい。この二価炭化水素基は直鎖状であることが好ましいが分岐していてもよい。ただし、この二価炭化水素基が分岐鎖である場合は分岐鎖の分子鎖末端に脂肪族不飽和結合を有さず、これが置換基を有する場合は置換基の分子鎖末端に脂肪族不飽和結合を有しないことを条件とする。R6は特に直鎖状の炭素原子１〜８のアルキレン基であることが好ましい。式（３）において、R2、R3、R4、R5、ｍ、及びｎは式（１）に対して定義したとおりである。 In the above formula (2), R 6 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 10 carbon atoms and having an unsaturated carbon-carbon double bond having 2 to 10 carbon atoms. Alternatively, it may be an unsubstituted divalent hydrocarbon group. The divalent hydrocarbon group is preferably linear, but may be branched. However, when this divalent hydrocarbon group is branched, it does not have an aliphatic unsaturated bond at the molecular chain end of the branched chain, and when it has a substituent, it is aliphatic unsaturated at the molecular chain end of the substituent. Subject to having no bond. R 6 is particularly preferably a linear alkylene group having 1 to 8 carbon atoms. In the formula (3), R 2 , R 3 , R 4 , R 5 , m, and n are as defined for the formula (1).
なお、一般式（３）で表される有機ケイ素化合物は、分子鎖両末端ジオルガノハイドロジェンシリル基封鎖ジオルガノシロキサンオリゴマーとアルケニル基含有アルコキシシランまたはアルケニル基含有アルコキシアルコキシシランなどのアルケニル基含有オルガノシランとのヒドロシリル化反応により容易に製造することができる。ヒドロシリル化反応を行う際の、分子鎖両末端ジオルガノハイドロジェンシリル基封鎖ジオルガノシロキサンオリゴマーとアルケニル基含有オルガノシランとのモル比は、０．８：１．０〜１．２：１．０の範囲であることが好ましい。 In addition, the organosilicon compound represented by the general formula (3) is composed of a diorganohydrogensilyl group-blocked diorganosiloxane oligomer having both molecular chains and an alkenyl group-containing organosilane such as an alkenyl group-containing alkoxysilane or an alkenyl group-containing alkoxyalkoxysilane. It can be easily produced by a hydrosilylation reaction with silane. In the hydrosilylation reaction, the molar ratio of the diorganohydrogensilyl group-capped diorganosiloxane oligomer and the alkenyl group-containing organosilane at both ends of the molecular chain is 0.8: 1.0 to 1.2: 1.0. It is preferable that it is the range of these.
アルケニル官能性コハク酸無水物（２）と有機ケイ素化合物（３）とを反応させる場合に、アルケニル官能性コハク酸無水物１モルに対して有機ケイ素化合物（３）を１．０〜１０．０モル用いて反応させるのが好ましく、１．０〜１．５モル用いて反応させるのがさらに好ましい。これは、アルケニル官能性コハク酸無水物１モルに対して有機ケイ素化合物（３）を１モル以上用いることによって、アルケニル官能性コハク酸無水物が未反応で多量に残存してしまうことを防止でき、目的物の収率を高くできるためであり、一方、アルケニル官能性コハク酸無水物１モルに対して有機ケイ素化合物（３）の使用量を１０．０モル以下にすることによって、有機ケイ素化合物（３）が多量に残存することによる、製造時のポットイールドの低下を抑えることができ、コスト的に有利だからである。 When the alkenyl functional succinic anhydride (2) is reacted with the organosilicon compound (3), the organosilicon compound (3) is added in an amount of 1.0 to 10.0 with respect to 1 mole of the alkenyl functional succinic anhydride. It is preferable to make it react using mol, and it is more preferable to make it react using 1.0-1.5 mol. This can prevent the alkenyl functional succinic anhydride from remaining unreacted in large amounts by using 1 mol or more of the organosilicon compound (3) with respect to 1 mol of the alkenyl functional succinic anhydride. On the other hand, by using the organosilicon compound (3) in an amount of 10.0 mol or less with respect to 1 mol of the alkenyl-functional succinic anhydride, the organosilicon compound can be obtained. This is because it is possible to suppress a decrease in pot yield at the time of production due to a large amount of (3) remaining, which is advantageous in terms of cost.
アルケニル官能性コハク酸無水物と有機ケイ素化合物（３）の反応装置内への導入方法は任意の方法を用いることができるが、これらの化合物の混合モル比が、上述した範囲から外れないようにすることが好ましい。また、加熱条件下で、アルケニル官能性コハク酸無水物中に有機ケイ素化合物（３）を導入してもよいし、またその逆でもよい。この反応を加熱して行う場合の温度は、後述する好適な反応温度の範囲内であることが好ましい。 Any method can be used for introducing the alkenyl-functional succinic anhydride and the organosilicon compound (3) into the reaction apparatus, but the mixing molar ratio of these compounds does not deviate from the above range. It is preferable to do. Alternatively, the organosilicon compound (3) may be introduced into the alkenyl-functional succinic anhydride under heating conditions, or vice versa. The temperature at which this reaction is carried out by heating is preferably within the range of a suitable reaction temperature described later.
アルケニル官能性コハク酸無水物と有機ケイ素化合物（３）との反応温度は目的とする反応が進行するかぎり特に限定されず、任意の温度でこの反応を行うことができるが、反応は加熱下でおこなってもよい。その場合、反応温度は１００℃〜１８０℃の範囲であることが好ましい。反応温度を１００℃以上にすることによって、反応温度を速くして目的物を製造するために時間を短縮することができるためにコスト的に有利である。一方、反応温度を１８０℃以下にすることによって、生成物が着色する可能性を低減することができる。 The reaction temperature between the alkenyl-functional succinic anhydride and the organosilicon compound (3) is not particularly limited as long as the intended reaction proceeds, and this reaction can be carried out at any temperature. You may do it. In that case, it is preferable that reaction temperature is the range of 100 to 180 degreeC. By setting the reaction temperature to 100 ° C. or more, it is advantageous in terms of cost because the reaction temperature can be increased to shorten the time for producing the target product. On the other hand, by setting the reaction temperature to 180 ° C. or lower, the possibility that the product is colored can be reduced.
本発明の反応は任意の圧力で行うことができ、特に圧力に関する制限はない。しかし、用いる原料の沸点との関係によって、常圧で加熱した場合に目的とする温度に到達しない場合や、常圧における反応では反応の完結までに必要な時間が著しく長い場合は、加圧下で反応を行ってもよい。 この場合の圧力は任意の圧力であることができるが、1kPaから5kPaの範囲であることが望ましい。本発明の反応を1kpa以上で行うことによって、目的生成物の収率の低下が起こりにくい。 The reaction of the present invention can be carried out at any pressure, and there is no particular limitation regarding pressure. However, depending on the relationship with the boiling point of the raw material used, if the target temperature is not reached when heated at normal pressure, or if the time required for completion of the reaction is significantly long in the reaction at normal pressure, A reaction may be performed. The pressure in this case can be any pressure, but is preferably in the range of 1 kPa to 5 kPa. By performing the reaction of the present invention at 1 kpa or more, the yield of the target product is hardly lowered.
上記の反応は、不活性ガス下、例えば、窒素及びアルゴンなどから選択される不活性ガスの雰囲気下で行なうことが好ましい。また原料であるアルケニル官能性コハク酸無水物と有機ケイ素化合物（３）に含まれる水分量もできるかぎり少なくすることが好ましい。 The above reaction is preferably performed under an inert gas, for example, an atmosphere of an inert gas selected from nitrogen and argon. It is also preferable to reduce the amount of water contained in the raw materials alkenyl functional succinic anhydride and organosilicon compound (3) as much as possible.
また、本発明の反応においては、必要に応じて有機溶媒、例えば、トルエン、キシレン、ベンゼン、ヘキサン、エチレンクロライド、クロロホルム、トリクロロエチレン、及びシクロヘキサンなどから選択される、活性水素を含まない有機溶媒を反応溶媒として使用してもよい。しかし、極性が低い溶媒を用いた上記反応を行った場合には反応効率が低下する場合があるので、これらの有機溶媒を使用しないことが一般的には好ましい。 In the reaction of the present invention, if necessary, an organic solvent such as toluene, xylene, benzene, hexane, ethylene chloride, chloroform, trichloroethylene, and cyclohexane is reacted with an organic solvent that does not contain active hydrogen. It may be used as a solvent. However, when the above reaction using a solvent with low polarity is performed, the reaction efficiency may be lowered. Therefore, it is generally preferable not to use these organic solvents.
上記式（２）の化合物と有機ケイ素化合物（３）とのヒドロシリル化反応に用いる触媒は、式（３）中のケイ素原子結合水素原子（すなわち、ケイ素原子に結合した水素原子）が式(２)中のアルケニル基へ付加する反応を促進するための触媒であり、例えば、長周期型周期律表における第VIII属遷移金属系の触媒が挙げられ、好ましくは、白金系触媒である。このような白金系触媒としては、塩化白金酸、塩化白金酸のアルコール溶液、白金のオレフィン錯体、白金のアルケニルシロキサン錯体、及び白金のカルボニル錯体が例示できる。用いる触媒量は目的の反応が進行する限り、特に限定されない。 The catalyst used for the hydrosilylation reaction between the compound of formula (2) and the organosilicon compound (3) has a silicon atom-bonded hydrogen atom in formula (3) (that is, a hydrogen atom bonded to a silicon atom) represented by formula (2). ), A catalyst for promoting the reaction of addition to the alkenyl group, for example, a Group VIII transition metal catalyst in the long-period periodic table, preferably a platinum catalyst. Examples of such platinum-based catalysts include chloroplatinic acid, alcohol solutions of chloroplatinic acid, platinum olefin complexes, platinum alkenylsiloxane complexes, and platinum carbonyl complexes. The amount of catalyst used is not particularly limited as long as the target reaction proceeds.
本発明の式（１）で表される新規な有機ケイ素化合物は、硬化性シリコーン組成物の接着性付与成分として有用である。硬化性シリコーン組成物としては、分子鎖末端に不飽和基を含有するシリコーン化合物とＳｉ−Ｈ基含有シリコーン化合物との間の付加反応によって架橋且つ硬化する当分野で公知の付加硬化反応型シリコーン組成物であってもよく、水酸基やアルコキシ基などの加水分解性基含有シリコーン化合物の縮合反応によって架橋且つ硬化する当分野で公知の縮合反応硬化型のシリコーン組成物であってもよい。本発明の式（１）で表される新規な有機ケイ素化合物は、とりわけ、付加反応硬化型シリコーン組成物用の接着性付与成分として有用である。例えば本発明の新規な有機ケイ素化合物を配合した付加反応硬化性シリコーン組成物は、難接着性のPPS（ポリフェニレンサルファイド）やアルミダイキャストへの低温接着性及び接着強度が優れている。 The novel organosilicon compound represented by the formula (1) of the present invention is useful as an adhesion imparting component of the curable silicone composition. Examples of the curable silicone composition include addition-curable silicone compositions known in the art that are crosslinked and cured by an addition reaction between a silicone compound containing an unsaturated group at the molecular chain terminal and a Si-H group-containing silicone compound. It may also be a condensation reaction curable silicone composition known in the art that is crosslinked and cured by a condensation reaction of a hydrolyzable group-containing silicone compound such as a hydroxyl group or an alkoxy group. The novel organosilicon compound represented by the formula (1) of the present invention is particularly useful as an adhesion imparting component for an addition reaction curable silicone composition. For example, an addition reaction curable silicone composition containing the novel organosilicon compound of the present invention has excellent low-temperature adhesion to PPS (polyphenylene sulfide) and aluminum die-casting and adhesive strength.
以下、本発明を実施例に基づいて、さらに詳細に説明する。実施例中％は質量％を意味し、粘度は２５℃で測定した値であり、Meはメチル基を、Viはビニル基を意味する。 Hereinafter, the present invention will be described in more detail based on examples. In the examples,% means mass%, the viscosity is a value measured at 25 ° C., Me means a methyl group, and Vi means a vinyl group.
［実施例１］
窒素ガス導入管、温度計、ジムロート型コンデンサーおよび滴下漏斗を備えた50 ミリリットルの４つ口フラスコに、アリルコハク酸無水物(和光純薬工業製, 14.01 g, 0.1 モル)、白金の１，３−ジビニル−１，１，３，３−テトラメチルジシロキサン錯体（アリルコハク酸無水物に対して錯体中の白金金属が15 ppmとなる量）を投入し、反応混合物を１００℃に加熱して攪拌した。続いて、1-ハイドロジェン-3-(2’-トリメトキシシリルエチル)-1,1,3,3-テトラメチルジシロキサン (28.26 g, 0.1 モル)を1時間かけて滴下した。その際、発熱するため、フラスコを適宜冷却しながら反応をおこなった。ハイドロジェンシロキサンの滴下終了後、反応混合物を110℃で1時間さらに攪拌し、反応を完結させた。その後、反応溶液を減圧蒸留して、32.40ｇの主留分を得た(収率 76.7 %, 沸点211 - 213℃ / 1 torr)。核磁気共鳴スペクトル分析、及びガスクロマトグラフ質量分析の結果から、このものは、下記に示す化合物であることがわかった。
[Example 1]
Into a 50 ml 4-neck flask equipped with a nitrogen gas inlet tube, thermometer, Dimroth condenser and dropping funnel, allyl succinic anhydride (Wako Pure Chemical Industries, 14.01 g, 0.1 mol), platinum 1,3- Divinyl-1,1,3,3-tetramethyldisiloxane complex (amount of platinum metal in the complex to be 15 ppm with respect to allyl succinic anhydride) was added, and the reaction mixture was heated to 100 ° C. and stirred. . Subsequently, 1-hydrogen-3- (2′-trimethoxysilylethyl) -1,1,3,3-tetramethyldisiloxane (28.26 g, 0.1 mol) was added dropwise over 1 hour. At that time, since the heat was generated, the reaction was carried out while appropriately cooling the flask. After completion of the addition of hydrogen siloxane, the reaction mixture was further stirred at 110 ° C. for 1 hour to complete the reaction. Thereafter, the reaction solution was distilled under reduced pressure to obtain 32.40 g of a main fraction (yield 76.7%, boiling point 211-213 ° C./1 torr). From the results of nuclear magnetic resonance spectrum analysis and gas chromatograph mass spectrometry, it was found that this was a compound shown below.
上記化合物の13C NMRスペクトルの解析結果を以下に示す。 The analysis results of the 13 C NMR spectrum of the above compound are shown below.
［実施例２］
実施例１において、1-ハイドロジェン-3-(2’-トリメトキシシリルエチル)-1,1,3,3-テトラメチルジシロキサンの代わりに1-ハイドロジェン-3-(1’-トリメトキシシリル-1’-メチル-メチル)-1,1,3,3-テトラメチルジシロキサン を用いた以外は、実施例１と同様にアリルコハク酸無水物とハイドロシラン化合物とのヒドロシリル化反応をおこなった。反応溶液を減圧蒸留して、28.1ｇの主留分を得た(収率 66.5%, 沸点201 - 203 ℃ / 1 torr)。
核磁気共鳴スペクトル分析及びガスクロマトグラフ質量分析の結果から、このものは、下記に示す化合物であることがわかった。
[Example 2]
In Example 1, instead of 1-hydrogen-3- (2′-trimethoxysilylethyl) -1,1,3,3-tetramethyldisiloxane, 1-hydrogen-3- (1′-trimethoxy A hydrosilylation reaction between allyl succinic anhydride and a hydrosilane compound was performed in the same manner as in Example 1 except that silyl-1'-methyl-methyl) -1,1,3,3-tetramethyldisiloxane was used. . The reaction solution was distilled under reduced pressure to obtain 28.1 g of a main fraction (yield 66.5%, boiling point 201-203 ° C./1 torr).
From the results of nuclear magnetic resonance spectrum analysis and gas chromatograph mass spectrometry, it was found that this was a compound shown below.
上記化合物の13C NMRスペクトルの解析結果を以下に示す。 The analysis results of the 13 C NMR spectrum of the above compound are shown below.
［応用例１（実施例）］
粘度５０Ｐａ・ｓの分子鎖両末端ジメチルビニルシリル基封鎖ポリジメチルシロキサン５０質量部、平均単位式：（ＭｅＶｉＳｉＯ１／２）４（Ｍｅ２ＳｉＯ１／２）４０（ＳｉＯ４／２）５６で表されるゲルパーミエーションクロマトグラフィーにより測定した標準ポリスチレン換算の重量平均分子量約２０，０００のシリコーンレジン １０質量部、平均粒子径２μｍの石英微粉末（Ｕ.Ｓ. Ｓｉｌｉｃａ Ｃｏｍｐａｎｙ社製のＭＩＮ−Ｕ−ＳＩＬ（登録商標）５）４０質量部、式：（Ｍｅ３ＳｉＯ１／２）（Ｍe２ＳｉＯ２／２）３０（ＭｅＨＳｉＯ１／２）３０（Ｍｅ３ＳｉＯ１／２）で表される粘度４４センチストークスのジメチルハイドロジェン・メチルハイドロジェンシロキサン共重合体 ３質量部、実施例１で調製した化合物 １質量部、グリシドキシプロピルトリメトキシシラン １．２質量部、反応抑制剤として、本硬化性シリコーン組成物中１０００ｐｐｍとなる量の２−フェニル−３−ブチン−２−オール、白金の１，３−ジビニル−１，１，３，３−テトラメチルジシロキサン錯体（本硬化性シリコーン組成物中白金金属として８ppmとなる量）を均一に混合して硬化性シリコーン組成物を調製した。
得られた硬化性シリコーン組成物の接着性をＪＩＳ Ｋ ６８５０に規定の引張せん断接着強さ試験方法に準拠して測定した。
すなわち、１００ｍｍ×２０ｍｍ×１.６ｍｍのＰＰＳ製被着材と１００ｍｍ×２０ｍｍ×１.６ｍｍのアルミ製被着材を用い、これらの被着材の間に硬化性シリコーン組成物からなる接着層を１０ｍｍ×２０ｍｍ×１ｍｍとなるように形成し、これを１２０℃で３０分間加熱して前記組成物を硬化させて試験片を作製した。この試験片の引張せん断接着強さを引っ張り速度５０ｍｍ／分で測定し、測定後のＰＰＳ（ポリフェニレンサルファイド）製被着材の接着界面の状態を観察し、シリコーン硬化物が凝集破壊した割合をＣＦ率（凝集破壊率）として示した。ＣＦ率が０％の場合はＡＦ（界面破壊）と示した。
また、比較として、１００ｍｍ×２０ｍｍ×１.６ｍｍのアルミ製被着材の間に、硬化性シリコーン組成物からなる接着層を１０ｍｍ×２０ｍｍ×１ｍｍとなるように形成し、これを１２０℃で３０分間加熱して前記組成物を硬化させて試験片を作製した。上記と同様にして、引張せん断接着強さを測定し、測定後のアルミ製被着材の接着界面の状態を観察し、シリコーン硬化物が凝集破壊した割合をＣＦ率（凝集破壊率）として示した。
得られた結果を表１に示した。
[Application Example 1 (Example)]
50 parts by mass of dimethylvinylsilyl group-blocked polydimethylsiloxane having a viscosity of 50 Pa · s, average unit formula: (MeViSiO 1/2 ) 4 (Me 2 SiO 1/2 ) 40 (SiO 4/2 ) 56 10 parts by weight of a silicone resin having a weight average molecular weight of about 20,000 in terms of standard polystyrene measured by gel permeation chromatography, and a fine silica powder having an average particle diameter of 2 μm (MIN-U-manufactured by US Silica Company) SIL (registered trademark) 5) 40 parts by mass, viscosity represented by the formula: (Me 3 SiO 1/2 ) (Me 2 SiO 2/2 ) 30 (MeHSiO 1/2 ) 30 (Me 3 SiO 1/2 ) 3 parts by weight of 44 centistokes dimethylhydrogen-methylhydrogensiloxane copolymer, Example 1 1 part by mass of the compound prepared in 1), 1.2 parts by mass of glycidoxypropyltrimethoxysilane, and as a reaction inhibitor, 2-phenyl-3-butyn-2-ol in an amount of 1000 ppm in the curable silicone composition, A curable silicone composition is prepared by uniformly mixing 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum (amount of 8 ppm as platinum metal in the curable silicone composition). did.
The adhesion of the obtained curable silicone composition was measured in accordance with the tensile shear bond strength test method specified in JIS K 6850.
That is, a PPS adherend of 100 mm × 20 mm × 1.6 mm and an aluminum adherend of 100 mm × 20 mm × 1.6 mm are used, and an adhesive layer made of a curable silicone composition is interposed between these adherends. It formed so that it might become 10 mm x 20 mm x 1 mm, this was heated for 30 minutes at 120 degreeC, the said composition was hardened, and the test piece was produced. The tensile shear bond strength of this test piece was measured at a pulling speed of 50 mm / min, and the state of the adhesion interface of the PPS (polyphenylene sulfide) adherend after the measurement was observed. It was expressed as a rate (cohesive failure rate). When the CF ratio was 0%, it was indicated as AF (interface fracture).
As a comparison, an adhesive layer made of a curable silicone composition was formed between 100 mm × 20 mm × 1.6 mm aluminum adherends to be 10 mm × 20 mm × 1 mm, and this was formed at 120 ° C. for 30 The composition was cured by heating for a minute to prepare a test piece. In the same manner as above, the tensile shear bond strength was measured, the state of the adhesion interface of the aluminum adherend after the measurement was observed, and the ratio of the cohesive failure of the cured silicone product was shown as the CF ratio (cohesive failure ratio). It was.
The obtained results are shown in Table 1.
［応用例２（実施例）］
実施例１で調製した化合物 １質量部に替えて実施例２で調製した化合物 １質量部を使用した以外は応用例１と同様にして硬化性シリコーン組成物を調製した。得られた硬化性シリコーン組成物を応用例１と同様にして接着性を評価し、結果を表１に示した。
[Application Example 2 (Example)]
A curable silicone composition was prepared in the same manner as in Application Example 1 except that 1 part by mass of the compound prepared in Example 2 was used instead of 1 part by mass of the compound prepared in Example 1. The adhesive properties of the obtained curable silicone composition were evaluated in the same manner as in Application Example 1, and the results are shown in Table 1.
［応用例３（比較例）］
実施例１で調製した化合物 １質量部に替えて下式で表される化合物 １質量部を使用した以外は応用例１と同様にして硬化性シリコーン組成物を調製した。
[Application Example 3 (Comparative Example)]
A curable silicone composition was prepared in the same manner as in Application Example 1 except that 1 part by mass of the compound represented by the following formula was used instead of 1 part by mass of the compound prepared in Example 1.
得られた硬化性シリコーン組成物を応用例１と同様にして接着性を評価し、結果を表１に示した。 The adhesive properties of the obtained curable silicone composition were evaluated in the same manner as in Application Example 1, and the results are shown in Table 1.
［応用例４（比較例）］
実施例１で調製した化合物 １質量部に替えてアリルコハク酸無水物 １質量部を使用した以外は応用例１と同様にして硬化性シリコーン組成物を調製した。
得られた硬化性シリコーン組成物を応用例１と同様にして接着性を評価し、結果を表１に示した。
[Application Example 4 (Comparative Example)]
A curable silicone composition was prepared in the same manner as in Application Example 1 except that 1 part by mass of allyl succinic anhydride was used instead of 1 part by mass of the compound prepared in Example 1.
The adhesive properties of the obtained curable silicone composition were evaluated in the same manner as in Application Example 1, and the results are shown in Table 1.
［応用例５（比較例）］
実施例１で調製した化合物 １質量部を配合しなかった以外は応用例１と同様にして硬化性シリコーン組成物を調製した。
得られた硬化性シリコーン組成物を応用例１と同様にして接着性を評価し、結果を表１に示した。
[Application Example 5 (Comparative Example)]
A curable silicone composition was prepared in the same manner as in Application Example 1 except that 1 part by mass of the compound prepared in Example 1 was not blended.
The adhesive properties of the obtained curable silicone composition were evaluated in the same manner as in Application Example 1, and the results are shown in Table 1.
本発明の無水コハク酸基含有有機ケイ素化合物は、シランカップリング剤、コーティング剤、無機材料表面処理剤、繊維処理剤、接着性付与剤としての有機樹脂用添加剤、及び／または高分子変性剤として有用である。特に付加硬化型硬化性シリコーン組成物や縮合反応硬化性シリコーン組成物の接着性付与剤として有用である。 The succinic anhydride group-containing organosilicon compound of the present invention comprises a silane coupling agent, a coating agent, an inorganic material surface treatment agent, a fiber treatment agent, an additive for organic resins as an adhesion-imparting agent, and / or a polymer modifier. Useful as. In particular, it is useful as an adhesion-imparting agent for addition-curable curable silicone compositions and condensation reaction curable silicone compositions.
Claims (3)
下記一般式（３）
The following general formula (3)
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| US13/519,066 US8729195B2 (en) | 2009-12-28 | 2010-12-20 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
| KR1020127019022A KR20120099282A (en) | 2009-12-28 | 2010-12-20 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
| CN201080059463.5A CN102686598B (en) | 2009-12-28 | 2010-12-20 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
| PCT/JP2010/073651 WO2011081165A1 (en) | 2009-12-28 | 2010-12-20 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
| EP10805746A EP2519528A1 (en) | 2009-12-28 | 2010-12-20 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
| TW099145084A TWI512013B (en) | 2009-12-28 | 2010-12-21 | Organosilicon compound, method for producing thereof, and curable silicone composition containing the same |
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