JP5497367B2 - Printed wiring board connection structure and electronic device - Google Patents

Description

  The present invention relates to a printed wiring board connection structure and an electronic apparatus including the connection structure.

  For example, a hard disk device that is widely used as a computer storage device includes a magnetic disk on which information is recorded and supported rotatably by a motor, and a head core that reads and writes information from and to the magnetic disk. The The head core is held by a head stack assembly so that the head core can swing on the surface of the magnetic disk.

  The head stack assembly includes a carriage supported by a voice coil motor (VCM) so as to be swingable about a swing axis, and a suspension provided on an arm portion of the carriage, and is provided at a tip portion of the suspension. The head core is held by the magnetic head portion.

  The head core is connected to a wiring formed on a suspension printed wiring board provided along the suspension, and information is read and written through the wiring. The suspension printed wiring board extends through the central portion of the suspension toward the swing axis of the arm portion, and is drawn out to the side portion of the carriage at the intermediate portion of the arm portion. The base end portion of the suspension printed wiring board is connected to the front end portion of the main printed wiring board fixed to the side portion of the carriage.

  The base end of the main printed wiring board is extended to the opposite side of the suspension printed wiring board, and is connected to a printed wiring board for amplification provided in the hard disk device or a connector for outputting a signal to the outside. Has been.

  In recent years, with the spread of the Internet and the like, an increase in the amount of information processing in computers and an increase in information processing speed are required. As a result, the hard disk drive is also required to have a large capacity and a high information transmission speed.

  In order to satisfy the above requirements, it is conceivable to increase the frequency of read and write signals.

JP 2006-202359 A

  When the frequency of the digital signal flowing through the printed wiring board is increased, there are problems such as interference in the signal flowing through the wiring and an increase in transmission loss. For this reason, as described in the above patent document, a ground wiring is provided on the printed wiring board, and a metal thin plate or the like as a conductive layer is provided via an insulating layer to connect the ground wiring and the conductive layer. Often a configuration is employed. By adopting this configuration, it is possible to reduce interference between signal wirings and improve frequency characteristics and the like.

  In the structure described in the above-mentioned patent document, a metal pad is formed on a part of the ground wiring, and a through-hole extending from the part of the metal pad to the metal thin plate through the insulating layer is provided. By providing a conductive portion by plating, the ground wiring and the metal thin plate are electrically connected.

  In the above method, high processing accuracy is required to form the through hole, and a plating process is required. Therefore, there is a problem that not only the number of manufacturing steps increases, but also the manufacturing cost increases. In addition, since the electrical connection between the metal thin plate and the ground wiring is performed using metal plating provided in the through hole, the connection area between the ground wiring and the metal thin plate is limited. For this reason, there also exists a problem that the reliability of the electrical connection between these is low.

  Especially when the wiring density is high or the frequency of the digital signal flowing through the signal wiring is high, the electromagnetic influence between the signal wirings is also large, and the electrical connection between the ground wiring and the conductive layer is not reliable. In addition, noise due to electrostatic induction and electromagnetic induction and crosstalk between wirings are likely to occur. In addition, transmission loss of current flowing through the signal wiring also increases.

  The present invention provides a connection structure for a printed wiring board that can connect the connection electrodes of the printed wiring board at the same time and can electrically and reliably connect the ground wiring and the conductive layer and can enhance the high-frequency characteristics. The task is to do.

The invention described in claim 1 of the present application provides a first print in which a signal wiring and a ground wiring each provided with a connection electrode are provided on the side opposite to the side on which the conductive layer is provided of the insulating layer on which the conductive layers are laminated. a wiring board, a connection structure of a printed wiring board for connecting the second printed circuit board provided with signal lines and the ground wiring on one side of the insulating layer comprising a connection electrode connected respectively to the connection electrodes , above the conductive layer of the first printed circuit board, whereas the connecting portion that is exposed from the insulating layer towards the second printed circuit board is provided, the in the second printed circuit board A ground wiring connection electrode is formed so as to face the ground wiring connection electrode and the connection portion of the first printed wiring board, and the first printed wiring board and the second printed wiring board are formed. With the corresponding connection electrode line plates are connected via the anisotropic conductive adhesive, the connection electrodes of the ground wiring in the second printed circuit board, via the anisotropic conductive adhesive, the The present invention relates to a connection structure of a printed wiring board that is also connected to the connection portion .

By providing the conductive layer, the electromagnetic shielding effect can be exhibited and the influence of static electricity or the like can be reduced. Moreover, in this invention, each ground wiring and the said conductive layer of a 1st printed wiring board and a 2nd printed wiring board can be reliably connected mutually via the said connection part . Therefore, noise due to electrostatic induction or electromagnetic induction and crosstalk between wirings can be reduced to cope with higher frequency digital signals.

  Moreover, in the present invention, the connection between the ground wiring and the conductive layer can be performed simultaneously in the same process as the process of connecting the first printed wiring board and the second signal line. For this reason, compared with the case where a through-hole is formed in a printed wiring board and plated, it becomes possible to reduce a process significantly and to reduce manufacturing cost.

  The type of the printed wiring board is not particularly limited. The present invention can be applied not only to connection between flexible printed wiring boards, but also to a connection structure between a rigid printed wiring board and a flexible printed wiring board, or a connection structure between rigid printed wiring boards.

  The material constituting the conductive layer is not particularly limited as long as it is bonded by an anisotropic conductive adhesive. For example, a thin plate or film made of aluminum, aluminum alloy, copper, stainless steel or the like can be used as the conductive layer. Further, the printed wiring board provided with the conductive layer is not limited to the first printed wiring board, and the conductive layer can be provided on the second printed wiring board.

  The anisotropic conductive adhesive is prepared by orienting and dispersing conductive particles and the like in an insulating resin composition. The anisotropic conductive adhesive is sandwiched between opposed electrodes and heated and pressed to cause the resin in the adhesive to flow and seal the electrode surface. Adhesion is performed in a state in which electrical connection is achieved by biting between the opposing electrodes. Thereby, the electrode which opposes can be electrically connected, ensuring the insulation between adjacent electrodes. The kind of the anisotropic conductive adhesive is not particularly limited, and anisotropic conductive adhesives having various configurations and forms can be employed. For example, a paste-like anisotropic conductive adhesive or a film-like anisotropic conductive adhesive can be employed.

In this invention, the connection part exposed from the said insulating layer is provided in the said conductive layer toward the said 2nd printed wiring board. On the other hand, the connection electrode of the ground wiring in the second printed wiring board is formed to face the connection electrode of the ground wiring and the connection portion in the first printed wiring board. By adopting this configuration, the ground wirings of the first printed wiring board and the second printed wiring board and the conductive layer can be reliably connected to each other via the connecting portion. That is, only by sandwiching the first printed wiring board and the second printed wiring board through an anisotropic conductive adhesive, the corresponding electrodes are connected, and at the same time, the ground wiring of the first printed wiring board and the second printed wiring board are connected . It is possible to connect the ground wiring and the conductive layer of the two printed wiring boards to each other .

  The form of the connecting portion is not particularly limited. Only the portion corresponding to the electrode of the ground wiring provided on the second printed wiring board can be exposed, or the entire connection region can be exposed. In the case where the entire conductive layer in the connection region is exposed, an insulating layer is provided as necessary to insulate the signal wiring. The insulating layer may be provided on at least one of the first printed wiring board and the second printed wiring board.

  Moreover, the form of the connection electrode of the ground wiring in the second printed wiring board is not particularly limited. For example, it is possible to provide a ground wiring connection electrode of the first printed wiring board and an integral connection electrode facing the connection portion, or facing the electrode and the connection portion, respectively, and being short-circuited by wiring or the like. A pair of electrodes can also be provided.

According to the second aspect of the present invention, the conductive layer of the first printed wiring board is exposed from the insulating layer at the end, and the exposed conductive layer covers the end of the second printed wiring board. In this way, they are joined via the anisotropic conductive adhesive. Since the conductive layer is formed of a thin metal plate such as stainless steel, the strength is high. And the adhesive strength with respect to the anisotropic conductive adhesive of a conductive layer is also high. Therefore, by joining so as to cover the end portion of the second printed circuit board, it constitutes a reinforcement structure of a connection portion of the printed circuit board, increasing the reliability of the connection structure of the print wiring board.

  According to a third aspect of the present invention, the connecting portion is provided on an extending piece that extends from an end portion of the first printed wiring board. By providing the extension piece, the connection portion and the corresponding connection electrode of the ground wiring can be reliably connected. The extension piece can be extended only in the exposed conductive layer, or can be extended in a state where the insulating layer is laminated, and the connection portion can be provided by exposing only a portion facing the connection electrode. .

  The connection structure according to the present invention can be applied to connection structures of various forms of printed wiring boards. For example, the present invention can be applied to a connection structure between a printed wiring board for mounting electronic components and a printed wiring board for signal transmission. Moreover, the connection structure of the printed wiring board which concerns on this invention can be provided in the one end part or both ends of the printed wiring board for wiring relays like the invention described in Claim 4.

  For example, as in the invention described in claim 5, the connection structure according to the present invention can be adopted as the connection structure of the printed wiring board for relay in which the signal wiring is doubled in order to improve the high frequency characteristics of the signal wiring.

  As in the sixth aspect of the invention, the wiring structure according to the present invention can be applied to a printed wiring board connection structure in various electronic devices. For example, the connection structure according to the present invention can be employed in measuring devices and medical devices that require high-frequency characteristics.

  In particular, as in the invention described in claim 7, it is suitable for a hard disk device that reads and writes a high-frequency digital signal. By applying it to a hard disk device, it is possible to increase the frequency of digital signals to greatly increase the read / write speed, and to prevent problems such as attenuation of transmission signals and noise and crosstalk due to the influence between wirings.

  By adopting the connection structure of the present invention, it is possible to electrically connect the ground wiring and the conductive layer at the same time as connecting each connection electrode of the printed wiring board to be connected.

It is a top view which shows the internal structure of the hard disk drive to which the connection structure concerning this invention is applied. FIG. 3 is a plan view of a head stack assembly of the hard disk device shown in FIG. 2. It is sectional drawing which follows the III-III line | wire in FIG. 2, and is a figure which shows the schematic cross section of the connection structure of a printed wiring board. It is a whole perspective view which shows the state just before connecting a printed wiring board. It is a figure which shows the cross-sectional structure after a connection, and is sectional drawing which follows the VV line in FIG. It is a top view which shows the connection state of wiring and a connection electrode. It is a figure which shows 2nd Embodiment and is a perspective view corresponding to FIG. It is a figure which shows 3rd Embodiment and is a perspective view corresponding to FIG. It is a figure which shows 4th Embodiment and is a perspective view corresponding to FIG. It is a figure which shows 5th Embodiment and is a perspective view corresponding to FIG. It is a fragmentary sectional view which follows the XI-XI line in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present embodiment is an example in which the printed wiring board connection structure according to the present invention is applied to the printed wiring board connection structure of the hard disk device 1.

  FIG. 1 is a plan view of a hard disk device 1 to which the present invention is applied. The hard disk device 1 includes a plurality of magnetic disks 3 in which information is recorded and rotatably supported by a motor, and a head core (not shown) that reads / writes information from / to the magnetic disks 3 in a case 2. The head core is held by the head stack assembly 4 so that it can swing on the surface of the magnetic disk.

  The head stack assembly 4 includes a carriage 7 supported so as to be swingable around a swing shaft 13 by a voice coil motor 6 provided at a base end portion, and a suspension 9 provided on an arm portion 8 of the carriage 7. And a magnetic head portion 10 is provided at the tip portion of the suspension 9. The magnetic core 10 holds the head core.

  As shown in FIG. 2, the head portion 10 is connected to a wiring formed on a suspension printed wiring board 11 provided along the suspension 9, and information is exchanged via this wiring. The suspension printed wiring board 11 extends from the central portion of the suspension 9 toward the swing shaft 13 of the arm portion 8 and is pulled out to the side of the carriage 7 in the vicinity of the swing shaft 13. The base end portion of the suspension printed wiring board 11 is connected to the main printed wiring board 15 fixed to the side portion of the carriage 7.

Although not shown, the carriage 7 holds a plurality of thin plate-like suspensions each holding a head core on both surfaces of the front end portion with a predetermined gap, and is swung in the gap between the magnetic disks. Information is read from and written to the magnetic disk 3.

  As shown in FIG. 2 and FIG. 3, in the present embodiment, the suspension printed wiring board 11 is connected to the distal-end printed wiring board 21 connected to the head core and the proximal-end side connected to the main wiring board 15. The printed wiring board 23 includes three printed wiring boards: a printed wiring board 23 and a relay printed wiring board 22 provided in an intermediate portion of the printed wiring boards. A flexible printed wiring board is adopted as the three printed wiring boards, and both ends of the relay printed wiring board 22 arranged on the suspension are connected via an anisotropic conductive adhesive.

  As shown in FIG. 4, the front end side printed wiring board 21 includes signal wirings 31 and 32 for exchanging signals with the head core, and a ground wiring 33. Each of the wirings 31, 32, and 33 is provided on the insulating layer 26, and a conductive layer 25 formed of a thin stainless steel plate is provided on the opposite side of the insulating layer from the side on which the wirings are provided. It has been. In the figure, a printed wiring board including three wirings 31, 32, and 33 is shown as the front end side printed wiring board 21 for easy understanding, but actually, at least six wirings are provided.

  On the other hand, in the present embodiment, in order to improve the high-frequency characteristics of the signals flowing through the signal wirings 31 and 32, the signal wirings 31 and 32 of the leading-end printed wiring board 21 are doubled on the relay printed wiring board 22. Branch wirings 41a, 41b, 42a, 42b and a ground wiring 43 are provided. Each of the wirings is formed on the insulating layer 27, and an intermediate part of the wiring is covered with an insulating cover layer 28. In FIG. 4, the insulating layer 27 is drawn with a broken line for easy understanding.

  One signal wiring 31 of the front end side printed wiring board 21 is branched into double signal wirings 41a and 41b in the relay printed wiring board 22, and the other signal wiring 32 is double wiring. The signal lines 42a and 42b are branched. The wires 41a, 41b, 42a, and 42b are arranged so that wires branched from the signal wires 31 and 32 are alternately arranged. As a result, transmission loss can be reduced and noise resistance can be improved. In particular, by adopting the double-track structure, a so-called differential transmission system in which one signal is sent to the pair of signal wirings 31 and 32 of the front end side printed wiring board 21 and two signals of the order phase and the opposite phase are respectively flowed. In such a case, transmission loss can be prevented, and high frequency characteristics such as noise resistance can be greatly improved.

  Connection electrodes 44 a, 44 b, 45 a, 45 b, 46 are provided at the tips of the respective wirings 41 a, 41 b, 42 a, 42 b, 43. In addition, since the connection structure of the said printed wiring board 22 for a relay and the base end side printed wiring board 23 is comprised similarly, description is abbreviate | omitted.

  Connection electrodes 34, 35, 36 corresponding to the connection electrodes 44 a, 44 b, 45 a, 45 b, 46 of the relay printed wiring board 22 are provided at the tips of the respective wirings of the front end side printed wiring board 21. Yes.

  As shown in FIGS. 4 and 6, the connection electrode 35 of one signal wiring 32 is formed in a long shape extending in the width direction of the printed wiring board. The dimension in the width direction is set corresponding to the interval between the connection electrodes 45a and 45b of the relay printed wiring board 22.

  The connection electrode 34 of the other signal wiring 31 is formed in a substantially U shape in plan view. Connection portions 34a and 34b to which the connection electrodes 44a and 44b of the relay printed wiring board 22 are connected are provided at the opposite ends of the U-shaped connection electrodes. The intermediate part 34c of the U-shaped connection electrode is set so as to be retracted from the connection parts 34a, 34b to the relay printed wiring board side. Then, the other branch wiring 42 a is laminated so as to straddle the intermediate portion of the U-shaped connection electrode 34 with the insulating cover layer 28 interposed therebetween. By adopting the above configuration, the wirings 41a and 41b and the wirings 42a and 42b that are branched and connected from the signal wirings 31 and 32, respectively, can be alternately arranged on the relay printed wiring board 22. It becomes possible. Further, by providing the U-shaped connection electrode 34, uneven steps due to the wiring straddling are not disposed in the vicinity of the connection portions 34a and 34b. For this reason, it becomes possible to make a connection by making a clamping pressure act between each connection electrode reliably, and to make an electrical connection of each electrode reliably.

Further, in the present embodiment, the conductive layer 25 is exposed from the insulating layer so as to extend from the end of the insulating layer 26 at the end of the leading end side printed wiring board 21. On the other hand, the connection electrode 46 of the ground wiring 43 in the relay printed wiring board 22 is formed in a long shape extending in the longitudinal direction of the wiring board from a portion corresponding to the ground wiring connection electrode 36 in the front end side printed wiring board 21. ing. The length of the connection electrode 46 of the ground wiring 43 is set to a length reaching the extended portion of the conductive layer 25.

  The front end side printed wiring board 21 and the relay printed wiring board 22 having the above-described configuration are positioned so that the respective electrodes to be connected correspond to each other, and a predetermined shape is provided via a film-like anisotropic conductive adhesive 24. At a temperature and pressure of As a result, the anisotropic conductive adhesive flows to fill the gaps between the printed wiring boards to form an adhesive layer 24a, and the electrodes are electrically connected via the anisotropic conductive adhesive. At the same time, the printed wiring boards that contact each other are joined.

In the present embodiment, the end of the conductive layer 25 extends from the front end edge of the insulating layer 26 and is exposed, and covers the entire end of the printed wiring board 22 for relay. The conductive adhesive 24 is laminated and bonded.

In addition, as shown in FIG. 5, the ground wiring connection electrode 46 in the relay printed wiring board 22 is formed in a long shape reaching the conductive layer 25. For this reason, the connection portion 46a on the distal end side of the connection electrode for ground wiring is connected to the connection electrode 36 for ground wiring on the printed wiring board 21 on the distal end side, and the connection portion 46b on the proximal end side is connected to the conductive layer 25. Connected to the connecting portion 25a. That is, in the present embodiment, the connection structure of the relay printed wiring board 22 is used to connect the corresponding electrodes, and at the same time, the ground wirings 33 and 43 provided on the surface side of each printed wiring board are It can also be connected to the conductive layer 25. In the present embodiment, since the insulating cover layer 28 is provided in portions corresponding to the exposed portions of the conductive layer 25 of the signal wirings 41a, 41b, 42a, and 42b in the printed wiring board 22 for relay, The signal wiring and the conductive layer 25 are not short-circuited.

  Further, since the conductive layer 25 is formed of a stainless steel plate, the strength is high, and the adhesive strength to the anisotropic conductive adhesive 24 is also high. Therefore, the conductive layer 25 is bonded and laminated over the entire area of the front end portion of the relay printed wiring board 22 to form a reinforcing structure for the connection structure between the relay printed wiring board 22 and the front end printed wiring board 21. Is done. Thereby, the reliability of electrical connection can be further improved.

  FIG. 7 shows a second embodiment of the connection structure according to the present invention.

In the second embodiment, only the portion corresponding to the connection portion 46b of the ground wiring connection electrode 46 in the relay printed wiring board 22 is provided with the connection portion 125a by exposing the conductive layer 25 from the insulating layer . By adopting this configuration, not only can the conductive layer 25 and the connection electrode 46 be reliably connected, but also the connection portion 125a can be easily provided.

  FIG. 8 shows a third embodiment of the connection structure according to the present invention.

In the third embodiment, an extension piece is provided at the edge of the printed wiring board 21 on the front end side, the conductive layer 25 is exposed from the insulating layer, and a connection portion 325a is provided. By adopting this configuration, the same effects as those of the first embodiment and the second embodiment can be exhibited.

  FIG. 9 shows a fourth embodiment of the present invention.

  In this embodiment, adjacent branch wirings 441a, 442a and 441b, 442b of the relay printed wiring board 22 are stacked in the thickness direction of the wiring board via insulating layers 428a, 428b. The connection electrodes 44a, 44b, 45a, 45b are set at the same positions as in the first embodiment.

  By adopting the above configuration, adjacent signal wirings can be brought close to each other. As a result, the high-frequency characteristics can be greatly improved, for example, when a differential transmission method is used in which signals having a phase opposite to the phase are passed through these wirings. Further, since the wiring space of the relay printed wiring board 22 can be reduced, the wiring board can be downsized and the number of wirings can be increased.

  10 and 11 show a fifth embodiment of the present invention.

  In this embodiment, insulating layers 26 and 626 are provided on both surfaces of the conductive layer 25, and a signal wiring and a ground wiring are provided on the insulating layer, respectively, and the first relay printed wiring board 22 and the second relay are provided. Two printed wiring boards for relay of the printed wiring board 623 are connected to both sides of the front-end side printed wiring board 21.

  Since the arrangement of each wiring and connection electrode in the connection structure in the upper part of FIG. 10 is the same as that in the first embodiment, description thereof is omitted.

  On the lower side of the front end side printed wiring board 21, wirings 631, 632, 633 and connecting electrodes 634, 635, 636 having the same relative arrangement as the wiring and connection electrodes provided above are arranged in the longitudinal direction of the printed wiring board. It is formed by shifting the position. On the other hand, connection electrodes 644 a, 644 b, 645 a, corresponding to the connection electrodes 634, 635, 636 formed on the lower side of the front-end printed wiring board 21 are provided at the front end of the second relay printed wiring board 623. Wiring including 645b and 646 is provided.

  As shown in FIG. 10, also in the fifth embodiment, film-like anisotropic conductive adhesives 24 and 624 are arranged on both sides of the front end side printed wiring board 21, and the printed wiring boards are clamped. Only the corresponding connection electrode can be electrically connected.

  As shown in FIGS. 10 and 11, the insulating layer 626 is removed under the conductive layer 25 of the tip side printed wiring board 21 to the vicinity of the connection electrode. On the other hand, the ground wiring connection electrode 646 of the second relay printed wiring board 623 is formed in a long shape extending in the longitudinal direction of the printed wiring board. By adopting this configuration, when the ground wiring connection electrode 636 on the lower side of the printed wiring board 21 at the front end side is connected to the connection portion 646a of the connection electrode 646 for ground wiring on the second relay printed wiring board 623. At the same time, the connection portion 646 b of the ground wiring connection electrode can be connected to the connection portion 625 a of the conductive layer 25.

  By adopting the fifth embodiment, it is possible to form each wiring directly on both sides of a thin plate for suspension via an insulating layer and use the thin plate as the conductive layer 25.

  In the above embodiment, in order to facilitate understanding, the first relay printed wiring board 23 and the second relay printed wiring board 623 connected to the front end side printed wiring board 21 are connected to the printed wiring. Although it connects so that it may connect in the position shifted in the longitudinal direction of the board, it can also comprise so that it may connect in the same position of the front and back of the front end side printed wiring board 21. FIG.

  The present invention is not limited to the embodiment described above. In the embodiment, the present invention is applied to the connection structure of the printed wiring board of the hard disk device, but the present invention can be applied to the connection structure of the printed wiring board of various electronic devices that handle high-frequency digital signals and the like.

  The scope of the present invention is not limited to the embodiment described above. The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined not by the above-mentioned meaning but by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

  A manufacturing cost can be reduced, and a printed wiring board corresponding to a high frequency signal can be provided.

21 First printed wiring board 23 Second printed wiring board 24 Anisotropic conductive adhesive 25 Conductive layer (first printed wiring board)
25a connection portion 26 insulating layer (first printed wiring board)
27 Insulating layer (second printed wiring board)
31 Signal wiring (first printed wiring board)
34 Connection electrode (first printed wiring board)
35 Connection electrode (first printed wiring board)
36 Connection electrode (first printed wiring board)
32 Signal wiring (first printed wiring board)
33 Ground wiring (first printed wiring board)
41a Signal wiring (second printed wiring board)
41b Signal wiring (second printed wiring board)
42a Signal wiring (second printed wiring board)
42b Signal wiring (second printed wiring board)
43 Ground wiring (second printed wiring board)

Claims (7)

A first printed wiring board provided with a signal wiring and a ground wiring each provided with a connection electrode on the side opposite to the side on which the conductive layer is provided of the insulating layer on which the conductive layer is laminated, and the above on one side of the insulating layer a connection structure of a printed wiring board for connecting the second printed circuit board provided with signal wiring and ground wiring having connection electrodes to be connected to each connection electrode,
While the conductive layer of the first printed wiring board is provided with a connection portion exposed from the insulating layer toward the second printed wiring board,
The connection electrode of the ground wiring in the second printed wiring board is formed to face the connection electrode of the ground wiring and the connection portion in the first printed wiring board,
The corresponding connection electrodes of the first printed wiring board and the second printed wiring board are connected via an anisotropic conductive adhesive,
The connection structure of the printed wiring board in which the connection electrode of the ground wiring in the second printed wiring board is also connected to the connecting portion via the anisotropic conductive adhesive . The conductive layer of the first printed wiring board is exposed at the end from the insulating layer, and the exposed conductive layer covers the end of the second printed wiring board so as to cover the anisotropic conductive material. The printed wiring board connection structure according to claim 1, wherein the printed wiring board is bonded via an adhesive.   The printed wiring board connection structure according to claim 1, wherein the connection portion is provided on an extending piece that extends from an end of the first printed wiring board.   A connection structure for a printed wiring board, wherein the connection structure according to any one of claims 1 to 3 is provided at one end or both ends of a printed wiring board for wiring relay.   5. The printed wiring board connection structure according to claim 4, wherein the printed wiring board for relaying wiring includes wiring obtained by doubling the other signal wiring. 6.   An electronic apparatus comprising the printed wiring board connection structure according to any one of claims 1 to 5.   The electronic device according to claim 6, wherein the electronic device is a hard disk device.

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