JP5494424B2 - Component supply device and component mounting device - Google Patents

Description

  The present invention relates to a component supply apparatus in which a plurality of tape feeders are detachably mounted, and a component mounting apparatus that transports and mounts electronic components taken out of the component supply apparatus by a mounting head onto a substrate.

  In a component mounting apparatus that takes out an electronic component by a mounting head and mounts it on a substrate, as a component supply device that supplies the electronic component to a take-out position by the mounting head, a cart on which a plurality of tape feeders are mounted in advance is connected to the apparatus main body. A method is widely used (see, for example, Patent Document 1). In the parts supply by the tape feeder, the empty tape after the electronic parts are taken out from the carrier tape is discharged. In order to collect this empty tape, the parts supply apparatus including the prior art shown in this patent document example is provided with a tape discharge box for collecting the empty tape cut short after being discharged from the tape feeder as tape waste. The When the tape discharge box becomes full, the tape discharge box is taken out and the tape waste is discarded as industrial waste.

JP 2009-71030 A

  However, the prior art including the above-mentioned patent documents has a problem that it is difficult to efficiently collect the tape waste due to the shape and arrangement of the tape discharge box. This problem will be described with reference to FIG. FIG. 6 is an explanatory diagram of tape scrap recovery in a conventional component supply apparatus. The tape scrap A after being cut by the tape cutter is guided downward by the tape discharge duct B and dropped and collected in the tape discharge box C as shown in FIG. 6 (a). Since it does not have fluidity, the behavior of depositing in the tape discharge box C directly below the tape discharge duct B is shown. For this reason, even if the size of the tape discharge box C is set large, it is difficult to effectively use the volume of the tape discharge box C for collecting the tape waste A. Further, as shown in FIG. 6B, when the tape discharge box C for discarding the collected tape waste A is pulled out, the piles of the tape waste A accumulated immediately below the tape discharge duct B collapse and the tape is discharged. Problems that collapse outside the box C are likely to occur. For this reason, as shown in FIG.6 (c), the operation | work which cleans and removes the tape waste A which spilled on the work floor surface from the tape discharge box C may be needed.

  Therefore, an object of the present invention is to provide a component supply device and a component mounting device that can efficiently collect tape scraps by effectively utilizing the volume of a tape discharge box.

A component supply apparatus according to the present invention is a component supply apparatus used in a component mounting apparatus for transferring and mounting an electronic component taken out from a component supply apparatus by a mounting head onto a substrate, and pitch-feeds a carrier tape that stores and holds the electronic component. Accordingly, the tape feeder that supplies the electronic component to the take-out position by the mounting head and the empty tape that is disposed below the tape feeder and is ejected from the tape feeder after the electronic component is taken out at the take-out position are shortened. A tape cutting section that cuts to the scale, a tape discharge duct that discharges the tape scraps from which the empty tape has been cut down, and a work operating side by an operator on the lower side of the tape discharge duct. Tape scraps that are placed in a slanted posture lower than the head side and discharged from this tape discharge duct And a tape discharge box for housing, said tape debris sequentially deposited from the work operating side moves on the bottom surface of the tape discharge box in the inclined direction.

The component mounting apparatus of the present invention is a component mounting apparatus that transports and mounts an electronic component taken out from a component supply device by a mounting head onto a substrate, and includes a substrate transport mechanism that transports and positions the substrate, and the electronic component as described above. A component supply device in which a plurality of tape feeders to be supplied to a take-out position by the mounting head are detachably mounted, and a head movement that moves the mounting head between the component supply device and the substrate held by the substrate transport mechanism The component supply device is disposed below the tape feeder, and a tape feeder that feeds the electronic component to a take-out position by the mounting head by pitch-feeding a carrier tape that stores and holds the electronic component. The empty tape ejected from the tape feeder after the electronic component is taken out at the take-out position. A tape cut portion that cuts the tape into a short dimension, a tape discharge duct that discharges the tape scraps from which the empty tape has been cut down, and a work operation side by an operator below the tape discharge duct. A tape discharge box that stores tape waste discharged from the tape discharge duct is disposed in an inclined posture lower than the apparatus main body side, and the tape waste moves in an inclined direction on the bottom surface of the tape discharge box. Then, the layers are sequentially deposited from the operation side .

According to the present invention, the tape discharge box that is disposed below the tape discharge duct that discharges the tape waste from which the empty tape has been cut and stores the tape waste discharged from the tape discharge duct is operated by the operator. Since the side is inclined lower than the device main body side of the component mounting device, the tape waste moves in the inclined direction on the bottom surface of the tape discharge box and is sequentially deposited from the operation side . It is possible to efficiently collect tape scraps by effectively using the.

The top view of the component mounting apparatus of one embodiment of this invention Sectional drawing of the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the components supply apparatus of one embodiment of this invention The front view of the components supply apparatus of one embodiment of this invention Explanatory drawing of tape scrap collection | recovery in the components supply apparatus of one embodiment of this invention Explanatory drawing of tape scrap recovery in a conventional parts supply device

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. In FIG. 1, a substrate transport mechanism 2 is disposed in the X direction (substrate transport direction) on the upper surface of a base 1a. The substrate transport mechanism 2 transports a substrate 3 to be mounted and is described below. Position at the mounting work position by the mounting mechanism. Component supply devices 4 are disposed on both sides of the substrate transport mechanism 2.

  As shown in FIG. 2, the component supply device 4 is configured such that a carriage 6 on which a plurality of tape feeders 5 are mounted in parallel is detachably set with respect to the mounting body. The tape feeder 5 has a function of supplying an electronic component to be mounted to a take-out position by a mounting head of a component mounting mechanism. In other words, a supply reel 14 is set on the carriage 6 and wound around a carrier tape 15 holding an electronic component to be mounted. The carrier tape 15 drawn out from the supply reel 14 is drawn into the tape feeder 5 and the tape feeder. 5, the carrier tape 15 is pitch-fed to supply the electronic components held on the carrier tape 15.

  A Y-axis moving table 7 driven by a linear motor is arranged in the Y direction at one end of the base 1a in the X direction. The Y-axis moving table 7 has two X-axis moving tables 8 in the Y direction. It is connected movably. A mounting head 9 is mounted on each X-axis moving table 8 so as to be movable in the X direction by a linear drive mechanism. The mounting head 9 is a multiple head including a plurality of unit transfer heads 10, and suction nozzles 10 a (see FIG. 2) are exchangeably attached to the lower ends of the unit transfer heads 10.

  By driving the Y-axis moving table 7 and the X-axis moving table 8, the mounting head 9 moves horizontally between the component supply device 4 and the substrate 3 held by the substrate transport mechanism 2, and is sucked by the suction nozzle 10a. The electronic component is sucked and held and taken out and mounted on the substrate 3. Therefore, the Y-axis moving table 7 and the X-axis moving table 8 constitute a head moving mechanism that horizontally moves the mounting head 9 between the component supply device 4 and the substrate 3. Each mounting head 9 is provided with a substrate recognition camera 11 that is located on the lower surface side of the X-axis moving table 8 and moves integrally with the mounting head 9. The substrate recognition camera 11 moves integrally with the mounting head 9 above the substrate 3, and the substrate recognition camera 11 images the substrate 3 so that the position of the substrate 3 is recognized.

  A component recognition camera 12 and a nozzle storage unit 13 are disposed between each component supply device 4 and the substrate transport mechanism 2. When the mounting head 9 holding the electronic components moves above the component recognition camera 12, the component recognition camera 12 images these electronic components, and recognizes the imaging result to hold the mounting head 9. Identification and position recognition of the electronic component in the state are performed. A plurality of suction nozzles 10a are stored in the nozzle storage portion 13 according to the type of electronic component to be mounted. When the mounting head 9 accesses the nozzle storage unit 13 and performs the nozzle replacement operation, the suction nozzle 10a can be replaced in each unit transfer head 10 of the mounting head 9 according to the type of electronic component.

  Next, the detailed configuration and function of the component supply device 4 will be described with reference to FIGS. 3 and 4, the carriage 6 includes a carriage base 20 having a structure in which two horizontal frame members 20a arranged in parallel in the Y direction are connected by a horizontal connecting member 20b, and is erected on the horizontal connecting member 20b. A feeder base 23 to which a plurality of tape feeders 5 are detachably attached is coupled to the upper portion of the support member 22. The carriage 6 is movable on the work floor by a plurality of casters 21 attached to the lower surface of the frame member 20a, whereby the carriage 6 to which the plurality of tape feeders 5 are attached is attached to and detached from the apparatus main body. A move is made.

  The carriage 6 is provided with a plurality of reel holders 24, and the reels 24 are detachably mounted with supply reels 14 each having a carrier tape 15 holding electronic components. The carriage 6 is provided with a reel holding portion 24A for mounting a large supply reel 14A in which a carrier tape 15A for holding electronic components of different sizes and types is wound. The reel holders 24 and 24A are selectively used in accordance with the target electronic component.

  The carrier tapes 15 and 15A drawn out from the supply reel 14 or the supply reel 14A are drawn into the tape feeder 5 and pitch-fed through the tape feeder 5, and at the take-out position 5a set at the tip of the apparatus main body side, The held electronic component is taken out by the suction nozzle 10 a of the unit transfer head 10. Then, the empty tape 15 a after the electronic components are taken out is guided from the front end of the tape feeder 5 to the tape cut portion 26 disposed below by the tape guide 25 disposed on the front surface of the feeder base 23.

  The tape cut unit 26 has a function of cutting the empty tape discharged from the tape feeder 5 after the electronic component is taken out at the take-out position 5a into short dimensions. In other words, the tape cut portion 26 includes a cutting mechanism 26a having a movable blade 26b and a fixed blade 26c, and configured to reciprocate the movable blade 26b in the horizontal direction (arrow a) with respect to the fixed blade 26c, and holds the reel. The empty blank tape 15a guided into the tape cut portion 26 by the portion 24 is cut into small pieces of tape waste 15 * by the tape cut portion 26 and falls downward (arrow b).

  A tape discharge duct 27, which is a duct-like member provided with a discharge opening 27 a on the lower surface side, is connected to the lower surface of the tape cut portion 26. The tape discharge duct 27 has a function of discharging the tape waste 15 * from which the empty tape 15a has been cut down. In the tape discharge duct 27, the discharge guide surface 27b on the apparatus main body side is provided so as to be inclined toward the work operation side by the operator, and the tape scrap 15 * dropped in the tape cut portion 26 is lowered along the discharge guide surface 27b. (Arrow c) and falls from the discharge opening 27a (arrow d).

  A bottom plate 28 is stretched between the frame members 20a on both sides of the carriage base 20 so as to close the bottom surface of the frame member 20a. A box-shaped tape discharge box having an open top surface is provided on the top surface of the bottom plate 28. 29 is placed. The tape discharge box 29 has a function of storing the tape waste 15 * discharged from the tape discharge duct 27. Here, the tape discharge box 29 has an upwardly spread shape in which an inclined surface 29b provided at the front end portion 29a on the apparatus main body side and an inclined surface 29d provided on the rear end portion 29c on the operation side are inclined outward. It has become. Further, in the present embodiment, in a state where the tape discharge box 29 is arranged on the bottom plate 28, the front end portion 29 a on the apparatus main body side protrudes a predetermined distance toward the apparatus main body side from the horizontal position of the lower end portion of the tape discharge duct 27. The position of the tape discharge box 29 is set so that the arrangement is protruded by the dimension D.

  The bottom plate 28 is provided so as to be inclined toward the work operation side, that is, the height H1 on the work operation side is lower than the height H2 on the apparatus main body side, and the tape discharged on the bottom plate 28 is discharged. The box 29 is arranged in an inclined posture whose work operation side is lower than the apparatus main body side. At the end of the bottom plate 28 on the operation side, a locking projection 28a is provided so as to protrude upward. When the tape discharge box 29 is placed on the bottom plate 28, the locking projection 28a is The tape discharge box 29 placed on the inclined bottom plate 28 is locked. This prevents the tape discharge box 29 from sliding on the bottom plate 28 in the inclined direction. That is, the locking projection 28a is a non-sliding member that prevents the inclined tape discharge box 29 from sliding to the work operation side by locking the tape discharge box 29. Then, the tape scrap 15 * dropped from the discharge opening 27a of the tape discharge duct 27 (arrow d) and further collected by the tape discharge box 29 moves on the bottom surface 29e in the inclined direction (arrow e), and the rear end. The layers are sequentially deposited from the part 29c side.

  Next, referring to FIG. 5, the behavior of the tape scrap 15 * dropped into the tape discharge box 29 from the tape discharge duct 27 and the tape discharge box 29 filled with the tape scrap 15 * are removed from the cart 6 and collected. The work will be described. FIG. 5A shows a state in which the tape scrap 15 * dropped from the tape discharge duct 27 is accumulated in the tape discharge box 29. FIG. That is, the tape scrap 15 * that falls through the discharge opening 27a (arrow f) first drops on the bottom surface 29e immediately below the tape discharge duct 27, and then moves in the direction of inclination of the bottom surface 29e (arrow g) to accumulate. To do. At this time, the tape scraps 15 * are deposited in order from the lower part on the bottom surface 29e. Therefore, due to the problem in the prior art, that is, the tape scraps 15 * are deposited only directly under the discharge duct. The problem that effective use cannot be prevented is solved, and it is possible to collect and collect a larger amount of tape waste 15 * by effectively using the internal volume in the tape discharge box 29.

  When the accumulated height of the tape scrap 15 * immediately below the tape discharge duct 27 exceeds the depth of the tape discharge box 29, it is determined that the tape scrap 15 * has been recovered to the limit of the capacity of the tape discharge box 29. Thus, an operation of pulling out the full tape discharge box 29 from the carriage 6 is performed. That is, as shown in FIG. 5B, the rear end portion 29c of the tape discharge box 29 is first lifted (arrow h) to release the locked state by the locking convex portion 28a, and then the rear end portion 29c is operated. Pull out to the working side (arrow i). In this movement, the piles of the tape scraps 15 * that have been deposited in a convex shape immediately below the tape discharge duct 27 may collapse due to the movement of the tape discharge box 29 (arrow j).

  At this time, since the front end portion 29a of the tape discharge box 29 protrudes from the lower end portion of the tape discharge duct 27 toward the apparatus main body at the initial position, the deposition position of the convex accumulation portion is shown in FIG. It is inside the protrusion dimension D shown in FIG. Therefore, even when the accumulation portion collapses, the tape scrap 15 * does not spill outside the tip portion 29a and fall. Therefore, there is no problem that has occurred in the prior art, that is, the problem that the pile of tape debris deposited directly under the tape discharge duct collapses and falls outside the tape discharge box does not occur. There is no need to clean and remove tape scraps spilled on.

  The component supply device and the component mounting device according to the present invention have an effect that tape scrap recovery can be efficiently performed by effectively utilizing the volume of the tape discharge box, and the electronic component is supplied from the tape feeder that pitches the carrier tape. This is useful in the field of taking out and mounting on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate conveyance mechanism 3 Board | substrate 4 Component supply apparatus 5 Tape feeder 6 Cart 7 Y-axis movement table 8 X-axis movement table 9 Mounting head 14, 14A Supply reel 15, 15A Carrier tape 15a Empty tape 15 * Tape waste 20 Carriage base 23 Feeder base 24 Reel holding part 25 Tape guide 26 Tape cut part 27 Tape discharge duct 28 Bottom plate 28a Locking convex part 29 Tape discharge box 29a Tip part

Claims (6)

A component supply apparatus used in a component mounting apparatus for transferring and mounting an electronic component taken out from a component supply apparatus by a mounting head onto a substrate,
A tape feeder that feeds the electronic component to a take-out position by the mounting head by pitch-feeding a carrier tape containing and holding the electronic component; and
A tape cutting part that is arranged below the tape feeder and cuts the empty tape discharged from the tape feeder after the electronic component is taken out at the take-out position into short dimensions;
A tape discharge duct for discharging downward the waste tape from which the empty tape has been cut;
Below the tape discharge duct, a work operation side by an operator is arranged with an inclined posture lower than an apparatus main body side of the component mounting apparatus, and a tape discharge box for storing tape waste discharged from the tape discharge duct. Prepared ,
The component supply apparatus according to claim 1, wherein the tape scraps are accumulated in order from the operation side by moving in an inclined direction on a bottom surface of the tape discharge box .   2. The component supply device according to claim 1, wherein the tape discharge box is arranged such that a tip end portion projects from the lower end portion of the discharge duct toward the apparatus main body. Component supply according to claim 1 or 2, characterized in that the tape discharge box of the inclined position by locking the tape discharge boxes with a sliding prevention member for preventing the sliding on the work operating side apparatus. A component mounting apparatus for transferring and mounting an electronic component taken out from a component supply apparatus by a mounting head on a substrate,
A substrate transport mechanism for transporting and positioning the substrate;
A component supply device in which a plurality of tape feeders for supplying the electronic component to the take-out position by the mounting head are detachably mounted;
A head moving mechanism for moving the mounting head between the component supply device and the substrate held by the substrate transport mechanism;
The component supply device includes:
A tape feeder that feeds the electronic component to a take-out position by the mounting head by pitch-feeding a carrier tape containing and holding the electronic component; and
A tape cutting part that is arranged below the tape feeder and cuts the empty tape discharged from the tape feeder after the electronic component is taken out at the take-out position into short dimensions;
A tape discharge duct for discharging downward the waste tape from which the empty tape has been cut;
Below the tape discharge duct, a work operation side by an operator is arranged with an inclined posture lower than an apparatus main body side of the component mounting apparatus, and a tape discharge box for storing tape waste discharged from the tape discharge duct. Prepared ,
2. The component mounting apparatus according to claim 1, wherein the tape scraps are sequentially deposited from the operation side by moving in an inclined direction on the bottom surface of the tape discharge box .   5. The component mounting apparatus according to claim 4, wherein the tape discharge box is arranged such that an end portion on one side protrudes toward the apparatus main body side with respect to a lower end portion of the discharge duct.   6. The component mounting according to claim 4, further comprising a slip prevention member that prevents the tape discharge box in the inclined posture from sliding to the work operation side by locking the tape discharge box. apparatus.

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