JP5488896B2 - Circuit structure manufacturing method, circuit structure, and electrical junction box - Google Patents

Description

  The present invention relates to a method for manufacturing a circuit structure, a circuit structure, and an electrical junction box.

  2. Description of the Related Art Conventionally, as an electric connection box for a vehicle, a device in which a circuit structure is housed in a case is known. The circuit structure includes a circuit board in which a conductive path is formed on at least one surface of an insulating substrate, and a conductive plate called a bus bar that is superimposed on the circuit board. Here, as a method for fixing the circuit board and the bus bar, for example, there is one described in Patent Document 1 below. In this fixing method, a fixing metal chip insert-molded on an insulating substrate and a bus bar are fixed by laser welding.

JP-A-6-113428

  However, in the above fixing method, it is necessary to insert-mold a fixing metal chip on the insulating substrate, and further, laser welding is also required, so that the fixing operation becomes complicated. In this prior art, the base material to be fixed is an insulating substrate, but the same applies to a circuit board.

  The present invention has been completed based on the above-described circumstances, and an object thereof is to simplify a method for fixing a circuit board and a bus bar.

  The present invention relates to a method of manufacturing a circuit structure in which a circuit board and a bus bar are overlapped, and in a state where the circuit board and the bus bar are set in a mold, a tab protruding from the edge of the bus bar is provided at the end of the circuit board. It is provided at the edge, the tab is pushed into the mold by closing the mold and bent at the edge of the bus bar, and the bus bar with the bent tab as the boundary in the molding space formed in the mold The molten resin is injected into the molding space located on the side opposite to the edge of the resin, and the resin flows into the molding space on the edge side of the bus bar, so that the tab is folded along the edge of the bus bar, It is characterized in that the resin filled in the molding space in this state is cooled and solidified.

  If it does in this way, since a tab is hold | maintained in the state folded along the edge part of a bus-bar, the process (for example, laser welding process etc.) for fixing a circuit board and a bus-bar becomes unnecessary. Therefore, the method for fixing the circuit board and the bus bar can be simplified.

The following configuration is preferable as an embodiment of the present invention.
A hole penetrating the circuit board and the bus bar and communicating with the molding space may be provided in the vicinity of the tab so that the resin injected into the molding space is filled into the hole.

  If it does in this way, the fixed intensity | strength of a circuit board and a bus-bar can be raised by filling resin with a hole.

  The tab may be bent at a substantially right angle by closing the mold, and the tip of the tab may be in contact with the bottom wall of the inner wall constituting the molding space that faces the bus bar.

  If it does in this way, a tab can be pushed in reliably by resin which flows into molding space by the edge side of a bus bar.

  The present invention also provides a circuit structure in which a circuit board and a bus bar are overlapped, and is provided so as to extend from an edge of the circuit board and is folded along the edge of the bus bar. It is good also as a circuit structure body provided with the resin molding part which covers the folding | turning part.

  This circuit configuration body may be provided in the vicinity of the tab, provided with a hole penetrating the circuit board and the bus bar, and the resin molded portion being filled in the hole.

  Further, the edge of the circuit board may include an opening edge of an opening provided in the circuit board and an outer peripheral edge of the circuit board.

  Furthermore, this invention is good also as an electrical junction box provided with the circuit structure manufactured by said manufacturing method or said circuit structure, and the case which accommodated this circuit structure inside.

  According to the present invention, the method for fixing the circuit board and the bus bar can be simplified.

The top view of the electrical junction box in Embodiment 1 AA line sectional view in FIG. BB sectional view in FIG. A perspective view showing a circuit board Perspective view showing the bus bar 4 is a perspective view showing a state in which the circuit board of FIG. 4 is overlaid on the bus bar of FIG. The perspective view which shows the state which performed resin molding from the state of FIG. The perspective view which shows the lower surface side of FIG. The perspective view which shows the state by which the electronic component was mounted in the circuit structure of FIG. The perspective view which shows the state by which the terminal assembly was mounted in the circuit structure of FIG. The perspective view which shows the state which accommodated the circuit structure of FIG. 10 in the inside of a case. Plan view showing the lower mold of the mold for molding the resin molding part The top view which shows the state which set the bus-bar and the circuit board to the lower mold | type of FIG. It is CC sectional view taken on the line in FIG. 13, Comprising: Sectional drawing which shows a setting process Sectional drawing which shows the state (die closing process) which closed the metal mold | die from the state of FIG. Sectional drawing which shows the state (injection process) which injected resin into the molding space from the state of FIG. Sectional drawing which shows the circuit structure body removed from the state of FIG. Sectional drawing which shows the setting process in Embodiment 2. Sectional drawing which shows the state (die closing process) which closed the metal mold | die from the state of FIG. Sectional drawing which shows the state (injection process) which injected resin into the molding space from the state of FIG.

<Embodiment 1>
Embodiment 1 of the present invention will be described with reference to the drawings of FIGS. The electrical junction box 10 in the present embodiment is mounted and used in an automobile or the like. The electrical junction box 10 is provided between a battery (not shown) and electrical components (not shown) such as a headlamp and a wiper. The electrical junction box 10 distributes and supplies power supplied from the battery, and controls such power supply switching.

  As shown in FIG. 2, the electrical junction box 10 includes a circuit structure 30 and a case that accommodates the circuit structure 30 therein. This case is composed of a case main body 50A that forms a substantially square box shape and opens upward, and a cover 50B that forms a substantially square box shape and opens downward. The cover 50B is mounted so as to close the opening of the case main body 50A. The circuit component 30 is placed on the bottom surface of the case main body 50A and fixed by bolting. A terminal assembly 60 is mounted on the upper surface of the circuit structure 30.

  As shown in FIG. 10, the terminal assembly 60 includes a plurality of tab terminals 61 having a flat plate shape and a synthetic resin housing 62 having a substantially L shape along the outer peripheral edge of the circuit component 30. Configured. The tab terminal 61 is formed integrally with the housing 62 so as to penetrate the housing 62 in the vertical direction. Thereby, the plurality of tab terminals 61 are held by the housing 62.

  The portion of the tab terminal 61 that protrudes downward from the housing 62 is inserted into a through hole 38 that is formed through the circuit component 30 so as to be conductive by soldering. On the other hand, a portion of the tab terminal 61 that protrudes upward from the housing 62 is accommodated in a cylindrical connector portion 51 as shown in FIGS. 1 to 3. A plurality of connector portions 51 are provided in a form penetrating the cover 50B in the vertical direction.

  A mating connector (not shown) provided at the terminal of the wire harness connected to the battery or each electrical component can be fitted inside the connector 51. The mating connector accommodates a plurality of mating terminals that can be connected to the tab terminal 61. As a result, when the mating connector is fitted into the connector portion 51, the mating terminal and the tab terminal 61 are connected so as to be conductive, power from the battery is supplied to the electrical connection box 10, and each of the electrical connection boxes 10 Electric power is distributed and supplied to the electrical components.

  As shown in FIG. 2, a lock portion 52 that protrudes outward is provided on the outer surface of the side wall of the case body 50 </ b> A. On the other hand, a lock receiving portion 53 that can be elastically deformed is provided at a position corresponding to the lock portion 52 on the side wall of the cover 50B. Further, a flange portion 54 is provided below the lock portion 52 of the case main body 50A so as to project outward. As a result, when the cover 50B is put on the case main body 50A and the lower end of the side wall of the cover 50B reaches a position where it comes into contact with the flange portion 54, the lock portion 52 and the lock receiving portion 53 are locked in the vertical direction. The cover 50B is held in an integrally assembled state.

  The circuit component 30 includes a circuit board 31 and a bus bar 32 disposed on the lower surface side of the circuit board 31. The circuit board 31 is configured such that conductive paths made of a copper foil pattern are formed on both surfaces of an insulating base made of polyimide, for example. The thickness of the insulating base material is, for example, 50 μm (2 mil). On the other hand, the thickness of the conductive path is, for example, 35 μm (1 oz). Further, a solder resist (not shown) as an insulating material is applied to the surface of the circuit board 31. The thickness of the solder resist is set so thin that the conductive path is not exposed. For this reason, the circuit board 31 has flexibility also in the copper foil part in which the conductive path is formed, and is comprised in the extremely flexible film shape in the part in which the conductive path is not formed.

  As shown in FIG. 4, the circuit board 31 has a substantially rectangular shape. The circuit board 31 has a plurality of substantially rectangular openings 33 formed therethrough. The plurality of openings 33 are provided side by side along the longitudinal direction of the circuit board 31, and a board-side locking window 34 is formed between the two adjacent openings 33. A plurality of the board-side locking windows 34 are provided side by side along the longitudinal direction of the circuit board 31. Of the plurality of substrate-side locking windows 34, the substrate-side locking window 34 located at the center in the arrangement direction is arranged adjacent to both the opening portions 33 arranged on the left and right sides, and is independent of the both opening portions 33. Is formed. On the other hand, the remaining board-side locking windows 34 are arranged adjacent to both openings 33 arranged on the left and right sides, and are formed so as to communicate with either the left or right openings 33.

  A pair of restricting pieces 35 are arranged in a facing state at a pair of facing edges along the longitudinal direction of the circuit board 31 among the opening edges of the board-side locking window 34. Both restricting pieces 35 are provided in a form protruding in a direction intersecting with the longitudinal direction of the circuit board 31 (hereinafter referred to as “width direction”). Since the regulation piece 35 is configured not to include a conductive path, it is in the form of a flexible film as described above. Similarly, on the outer peripheral edge of the circuit board 31, like the regulating piece 35, a plurality of fixed pieces 40 that do not include a conductive path are formed to project outward.

  In the circuit board 31, a pair of board-side locking holes 36 are formed through both sides of the board-side locking window 34 in the width direction. Both board side latching holes 36 are arranged corresponding to each board side latching window 34. The board-side locking hole 36 is disposed adjacent to the board-side locking window 34 in the vicinity of the opening 33. In other words, the openings 33 excluding both ends in the arrangement direction among the plurality of openings 33 are surrounded by the four substrate-side locking holes 36. On the other hand, the openings 33 at both ends in the arrangement direction are surrounded by two substrate-side locking holes 36 and an outer peripheral mold portion 46 described later.

  Two bolt insertion holes 37 through which bolts 39 for fixing the circuit structure 30 to the case body 50A are inserted at two corners corresponding to both ends of the terminal assembly 60 among the four corners of the circuit structure 30. It is formed through. In the circuit board 31, a plurality of through holes 38 through which these are inserted are formed at positions corresponding to the lower ends of the plurality of tab terminals 61.

  As shown in FIG. 5, the bus bar 32 has a substantially rectangular shape that is substantially the same shape as the circuit board 31. Specifically, as shown in FIG. 6, the fixed piece 40 of the circuit board 31 protrudes outward from the outer peripheral edge of the bus bar 32, whereas the outer peripheral edge of the bus bar 32 is between the adjacent fixed pieces 40. It is arranged inside. The bus bar 32 is formed by pressing a metal plate material.

  In addition, a cutout 41 is formed in the inner peripheral edge of the bus bar 32 at a position corresponding to the fixed piece 40 so as to be recessed inward. The cutout depth of the cutout portion 41 is set to be larger than the thickness of the fixed piece 40. Further, in the notch portion 41, a pushing projection 73 provided on the upper die 71 is fitted in a die closing process described later. As a result, the fixed piece 40 is bent downward by the pressing projection 73 as the mold 70 is closed, and is fitted into the notch 41. This point will be described in detail later.

  In a state where the fixed piece 40 is fitted in the notch 41, the fixed piece 40 is disposed on the inner side of the outer peripheral edge of the bus bar 32, and a space for molding the outer peripheral mold part 46 is partitioned into S1 and S2. Is done. For this reason, the fixed piece 40 in which the molten resin is bent in the injection process described later flows from S1 to S2 while being folded back along the notch 41, and the molding of the lower surface side of the bus bar 32 from the side of the fixed piece 40 is performed. The entry into the space S2 can be restricted. Therefore, it is not always necessary to dispose the gate 78 described later immediately above the fixed piece 40, and the injected resin is surely circulated to the outside of the fixed piece 40 from the gate 78 disposed at an arbitrary position in the molding space S1. be able to.

  As a result, the resin flows from the outside to the inside of the fixed piece 40, and accordingly, the fixed piece 40 is folded back along the outer peripheral edge of the bus bar 32, and the fixed piece in the folded state. 40 is insert-molded inside an outer peripheral mold part 46 to be described later. The method for forming the fixed piece 40 is the same as the method for forming the restricting piece 35 and will be described in detail later.

  A bus bar side locking window 42 is formed through the bus bar 32 at a position corresponding to the board side locking window 34. The bus bar side latching window 42 has a substantially rectangular shape that is long in the width direction. Further, a bus bar side locking hole 43 is formed through the bus bar 32 at a position corresponding to the board side locking hole 36. The bus bar side locking hole 43 is a circular hole and is arranged coaxially with the board side locking hole 36. The inner diameter of the bus bar side locking hole 43 is set smaller than the inner diameter of the board side locking hole 36.

  Therefore, as shown in FIG. 15, the board side locking hole 36 is arranged in communication with the bus bar side locking hole 43, and in the injection process, as shown in FIG. Both the stop hole 43 and the board side locking hole 36 are filled. In this state, the resin filled in the board-side locking hole 36 is locked to the hole edge of the bus bar-side locking hole 43, so that the anchor effect is exhibited, and a locking window mold portion described later is pulled out to the bus bar 32. Stopped.

  A single relief hole 44 having a substantially square shape is formed through the bus bar 32 in a region corresponding to a through hole group including a plurality of through holes 38. Thus, as shown in FIG. 2 or FIG. 3, when the circuit component 30 is attached to the bottom wall of the case main body 50A, the lower end of the tab terminal 61 passes through the through hole 38 and the escape hole 44, and the case main body 50A It is plunged into an escape recess 55 provided in the bottom wall. As shown in FIG. 5, an input through hole 45 to which the power supply terminal 63 is connected is formed through the left corner of the bus bar 32.

  As shown in FIG. 6, the circuit configuration body 30 of the present embodiment is set on the mold 70 with the circuit board 31 and the bus bar 32 being overlapped, and as shown in FIGS. The outer peripheral mold portion 46 and the locking window mold portion 47) in FIGS. 7 and 8 are integrally assembled by resin molding. As the synthetic resin material, any thermosetting resin such as an epoxy resin, or any thermoplastic resin such as polyphenylene sulfide, liquid crystal polymer, polyethylene, polypropylene, polybutylene terephthalate, and polyethylene terephthalate can be used. As for the molding method, transfer molding or compression molding can be used for the thermosetting resin. Moreover, injection molding etc. can be used about a thermoplastic resin.

  As shown in FIG. 7, four outer peripheral mold portions 46 shown in the figure are provided on the outer peripheral edge portion of the circuit structure 30 along each side. As shown in FIG. 2 or FIG. 3, the upper surface of the outer peripheral mold part 46 is formed substantially flush with the upper surface of the circuit board 31. On the other hand, the lower surface of the outer peripheral mold part 46 is formed so as to protrude below the lower surface of the bus bar 32 so as to cover the outer peripheral edge of the bus bar 32. Inside the outer peripheral mold portion 46, the fixed piece 40 is insert-molded in a state of being folded along the outer peripheral edge portion of the bus bar 32. This restricts the outer peripheral edge of the circuit board 31 from peeling from the upper surface of the bus bar 32, and the circuit board 31 is fixed to the bus bar 32.

  As shown in FIG. 8, a single locking window mold portion 47 is provided at a position corresponding to the plurality of bus bar side locking windows 42 and the plurality of bus bar side locking holes 43 in the lower surface central portion of the circuit component 30. Is formed. The locking window mold portion 47 includes a central rib extending in the longitudinal direction of the circuit board 31 and branching ribs disposed on both sides of the central rib in the width direction. The central rib connects the bus bar side locking windows 42 adjacent to each other. On the other hand, the branching rib connects the bus bar side locking window 42 and the bus bar side locking hole 43.

  The upper surface of the locking window mold portion 47 is formed substantially flush with the upper surface of the circuit board 31 as shown in FIG. 2 or FIG. On the other hand, the lower surface of the locking window mold portion 47 is formed to protrude downward from the lower surface of the bus bar 32 so as to cover the opening edge of the bus bar side locking window 42. Inside the locking window mold part 47, the restricting piece 35 is insert-molded in a state of being folded back along the opening edge of the bus bar side locking window 42. This restricts the opening edge of the board-side locking window 34 from being peeled off from the upper surface of the bus bar 32, and the circuit board 31 is fixed to the bus bar 32.

  As described above, since the board-side locking window 34 is formed adjacent to the opening 33, not only the opening edge of the board-side locking window 34 but also the opening edge of the opening 33 is a bus bar. Lifting from the upper surface of 32 can also be restricted. In particular, in the place where the board-side locking window 34 and the opening 33 are formed to communicate with each other, the lifting of the opening edge of the opening 33 can be efficiently regulated. In addition to these, since the board-side locking hole 36 is formed in the vicinity of the opening 33, the lifting of the opening edge of the opening 33 can be more efficiently regulated.

  As shown in FIG. 9, a semiconductor relay 48 formed by resin-sealing a semiconductor switching element is mounted in the opening 33 by soldering. A plurality of first terminals 48 </ b> A connected to a conductive path formed at the opening edge of the opening 33 are formed at the lower side of the semiconductor relay 48. A second terminal (not shown) connected to the upper surface of the bus bar 32 exposed at the opening 33 is formed on the lower surface of the semiconductor relay 48. Here, in the present embodiment, since the lifting of the opening edge of the opening 33 is restricted, the second terminal and the upper surface of the bus bar 32 can be reliably soldered.

  Next, the structure of the mold 70 for molding the outer peripheral mold part 46 and the locking window mold part 47 and the molding method of the locking window mold part 47 by the mold 70 will be described with reference to FIGS. . As shown in FIG. 14, the mold 70 includes an upper mold 71 and a lower mold 72. As shown in FIG. 12, the lower mold 72 includes a first molding recess 74 that molds the outer peripheral mold portion 46, a second molding recess 75 that molds the locking window mold portion 47, a pair of positioning pins 76, and the like. Has been. In addition, since the molding method of the outer periphery mold part 46 and the latching window mold part 47 is the same, the latching window mold part 47 is demonstrated below as a representative.

  A pair of positioning holes 49 are formed through the circuit structure 30 at positions corresponding to the positioning pins 76. Therefore, when the predetermined positioning hole 49 is inserted into the predetermined positioning pin 76 and the bus bar 32 and the circuit board 31 are set in the lower die 72 in this order, as shown in FIG. 13, a plurality of bus bar side locking windows 42 and a plurality of bus bars are provided. A second molding recess 75 is disposed corresponding to the side locking hole 43 and the vertical direction. In this state, the circuit board 31 and the bus bar 32 are positioned with respect to each other by the positioning pins 76, and the restricting piece 35 protrudes from the opening edge of the bus bar side locking window 42 (setting step).

  On the other hand, as shown in FIG. 14, the upper die 71 includes a pushing projection 73 fitted into the board side locking window 34, a runner 77 formed inside the pushing projection 73, and an end of the runner 77. A formed gate 78 and the like are provided. When the mold 70 is closed, as shown in FIG. 15, the pushing projection 73 fits into the bus bar side locking window 42 while pushing the regulating piece 35 downward, and the board side locking hole 36 is formed by the upper mold 71. Closed. Thereby, a molding space for molding the locking window mold part 47 is formed between the second molding recess 75 and the upper mold 71. This molding space communicates with the board side locking hole 36 and the bus bar side locking hole 43.

  Here, a gap larger than at least the thickness of the restricting piece 35 is set between the pushing protrusion 73 and the inner wall of the bus bar side locking window 42. For this reason, the restricting piece 35 is bent downward at the opening edge of the bus bar side locking window 42 without being sheared by the upper and lower molds 71, 72. In this state, the gate 78 is arranged in the molding space S1 which is partitioned into the molding spaces S1 and S2 with the regulating piece 35 as a boundary in the molding space, and is located on the opposite side of the opening edge of the bus bar side locking window 42. (Mold closing process).

  Subsequently, when the molten resin is injected from the gate 78 into the molding space S1, the molten resin flows into the molding space S2 on the opening edge side of the bus bar side locking window 42 with the restriction piece 35 as a boundary in the molding space. As a result, the molten resin flows from the molding space S1 toward the molding space S2, and the regulating piece 35 is folded along the lower surface of the bus bar 32 by the flow of the resin. Then, as shown in FIG. 16, the restricting piece 35 is folded back along the opening edge of the bus bar side locking window 42, and the molding spaces S1 and S2, the bus bar side locking hole 43, and the board side side Resin is filled into the stop hole 36 (injection process). When the resin filled in this state is cooled, solidified, and demolded, as shown in FIG. 17, a locking window mold portion 47 in which the restriction piece 35 is insert-molded is obtained.

  As described above, in the present embodiment, the circuit board 31 and the bus bar 32 can be fixed simply by insert-molding the fixing piece 40 and the restriction piece 35 in the outer peripheral mold part 46 and the locking window mold part 47. For this reason, fixing work such as laser welding in addition to insert molding becomes unnecessary, and the fixing method of the circuit board 31 and the bus bar 32 can be simplified. In addition, since the board side latching hole 36 and the bus bar side latching hole 43 are provided in the vicinity of the regulating piece 35, the fixing strength of the circuit board 31 and the bus bar 32 is increased by filling the holes 36 and 43 with resin. be able to.

  In addition, since the lifting of the opening edge of the opening 33 is restricted by the restriction piece 35, the second terminal of the semiconductor relay 48 can be reliably soldered to the upper surface of the bus bar 32. Further, since the board side locking hole 36 and the bus bar side locking hole 43 are provided at a position surrounding the opening 33 and the holes 36 and 43 are filled with resin, the opening edge of the opening 33 is lifted efficiently. Can be regulated. In addition to these, since both board-side latching holes 36 are provided on both sides in the width direction of the board-side latching window 34, the resin is poured in the direction in which the regulating piece 35 is bent, so that both the busbar-side latching holes 43 and both board-sides are provided. The locking hole 36 can be filled with resin.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to the drawings of FIGS. In the second embodiment, the regulation piece 35 is more easily bent than the first embodiment due to the flow of resin. In addition, since it overlaps about the same structure, effect | action, and effect as Embodiment 1, the description is abbreviate | omitted. Further, the same components as those in the first embodiment are denoted by the same reference numerals. In the setting step shown in FIG. 18, the restriction piece 80 of the present embodiment is set longer than the restriction piece 35 of the first embodiment. According to such a configuration, the following operations and effects can be achieved.

  When the mold 70 is closed, the restricting piece 80 is bent downward by the pushing protrusion 73 as shown in FIG. At this time, the front end of the regulating piece 80 comes into contact with the bottom wall 81 facing the bus bar 32 among the inner walls constituting the molding space. In this state, the molding space S3 located on the opposite side of the opening edge of the bus bar side locking window 42 with the regulating piece 80 as a boundary in the molding space, and the molding space S4 on the opening edge side of the bus bar side locking window 42 Is partitioned by the regulating piece 80 (mold closing step).

  Next, when the molten resin is injected from the gate 78, the resin always comes into contact with the regulating piece 80 on the way from the molding space S3 to the molding space S4, and the regulating piece 80 is pushed into the molding space S4 side. . Thereby, as shown in FIG. 20, the restricting piece 80 is folded back along the opening edge of the bus bar side locking window 42 and is insert-molded by the locking window mold portion 47. Therefore, the restriction piece 35 can be reliably pushed in by the resin flowing from the molding space S3 into the molding space S4 (injection process).

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) Although the restriction piece 35 and the fixed piece 40 are illustrated as tabs in the above embodiment, a tab may be provided in addition to the restriction piece 35 and the fixed piece 40 according to the present invention. For example, a tab protruding from the opening edge of the escape hole 44 may be provided on the circuit board 31.

  (2) In the above embodiment, the edge of the notch 41 is illustrated as the edge of the bus bar. However, according to the present invention, the outer peripheral edge of the bus bar 32 may be the edge without providing the notch 41.

  (3) In the first embodiment, the board side locking hole 36 and the bus bar side locking hole 43 are provided in communication with the molding space for molding the locking window mold part 47. You may provide a board | substrate side latching hole and a bus-bar side latching hole in the aspect which does not connect with.

  (4) In the first embodiment, the board side latching hole 36 and the bus bar side latching hole 43 are formed so as to penetrate both sides of the board side latching window 34 in the width direction, and the latching window mold part 47 is formed in these. Although formed in communication, according to the present invention, the substrate side locking hole and the bus bar side locking hole may be provided so as to communicate with the outer peripheral mold part 46.

  (5) In the second embodiment, the restriction piece 80 longer than the restriction piece 35 in the first embodiment is illustrated, but according to the present invention, the depth dimension of the second molding recess 75 in the first embodiment is shortened. Thereby, you may make the front-end | tip of the control piece 35 and the bottom wall of the 2nd shaping | molding recessed part 75 contact.

DESCRIPTION OF SYMBOLS 10 ... Electric junction box 30 ... Circuit structure 31 ... Circuit board 32 ... Bus bar 34 ... Board side latching window (opening)
35 ... Regulation piece (tab)
36 ... Board side locking hole 40 ... Fixing piece (tab)
41 ... Notch (outer periphery)
42 ... Busbar side locking window 43 ... Busbar side locking hole 46 ... Outer peripheral mold part (resin molding part)
47 ... Locking window mold part (resin molding part)
50A ... Case body 50B ... Cover 70 ... Mold 80 ... Regulation piece (tab)
S1 to S4 ... Molding space

Claims (8)

A method of manufacturing a circuit structure formed by superimposing a circuit board and a bus bar,
In a state where the circuit board and the bus bar are set in a mold, a tab protruding from the edge of the bus bar is provided on the edge of the circuit board,
By closing the mold, the tab is pushed into the mold and bent at the edge of the bus bar,
Of the molding space formed in the mold, the molten resin is injected into the molding space located on the opposite side of the edge of the bus bar with the bent tab as a boundary, and this resin is the end of the bus bar. By flowing into the molding space on the edge side, the tab is folded along the edge of the bus bar, and in this state, the resin filled in the molding space is cooled and solidified. A method for manufacturing a circuit structure.   The hole which penetrates the circuit board and the bus bar and communicates with the molding space is provided in the vicinity of the tab, and the resin injected into the molding space is filled in the hole. The manufacturing method of the circuit structure of description.   The tab is bent at a substantially right angle by closing the mold, and the tip end of the tab is in contact with the bottom wall facing the bus bar in the inner wall constituting the molding space. A method for manufacturing a circuit structure according to claim 1 or 2. A circuit structure formed by superimposing a circuit board and a bus bar,
A tab that extends from the edge of the circuit board and is folded along the edge of the bus bar;
The circuit structure provided with the resin molding part which covers the folding | turning part of this tab. Provided in the vicinity of the tab, comprising a hole penetrating the circuit board and the bus bar;
The circuit structure according to claim 4, wherein the resin molded portion is filled in the hole.   The edge of the said circuit board is comprised including the opening edge of the opening provided in the said circuit board, and the outer periphery of the said circuit board, The Claim 4 or Claim 5 characterized by the above-mentioned. Circuit construct. A circuit structure manufactured by the method for manufacturing a circuit structure according to any one of claims 1 to 3,
An electrical junction box including a case in which the circuit structure is accommodated. A circuit structure according to any one of claims 4 to 6,
An electrical junction box including a case in which the circuit structure is accommodated.

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