JP5487903B2 - Resin sealing mold, resin sealing device, and method of manufacturing semiconductor device - Google Patents

Description

  The present invention relates to a resin sealing mold, a resin sealing device, and a method for manufacturing a semiconductor device.

  Semiconductor packages include quad flat packages (QFP) and small outline packages (SOP) that use metal lead frames, ball grid array (BGA) packages that use a wiring board with solder balls connected to the bottom surface, and multiple packages There is a system in package (SIP) for sealing a semiconductor chip.

These packages have a structure in which a semiconductor chip is sealed with a mold resin in order to protect the semiconductor chip from impact, contamination, and the like. The resin is sealed using a mold.
The mold has a pot for storing a molding resin before shaping, and a cavity for arranging a semiconductor chip and the like. Each space of the pot and the cavity is connected via a runner that allows the molten mold resin to pass through.

For the runner, a structure is known in which a throttle is provided in order to flow the resin from the pot to the cavity stably.
A structure is also known in which a shutter is provided at the boundary between the runner and the cavity to separate the resin poured into the cavity from other regions.
As the mold resin, a material in which a resin main agent such as an epoxy resin contains a curing agent, a filler such as fused silica, a catalyst, a colorant, or the like is used.

  Resins containing a large amount of filler are likely to be mixed with conductive foreign matters such as pulverized parts during pulverization. When such a foreign substance is included in the package, an electrical short circuit is likely to occur in the semiconductor chip or the wiring board to be packaged.

  In order to prevent such conductive foreign matter from entering the package, a structure is known in which a foreign matter retaining portion is provided in a resin shaping mold. The foreign substance retention part has a recessed part formed in the boundary part of a runner and a pot in a lower metal mold | die, and the magnet arrange | positioned under the recessed part. This prevents conductive foreign matter from flowing into the cavity.

Japanese Patent No. 3107022 Japanese Patent No. 2838981 JP 2007-273551 A

In the mold, every time the shaping of the mold resin in the cavity is finished, an operation of removing with a dust collecting cleaner is performed.
However, it cannot be completely removed by the dust collector, and a lump of resin may remain in the runner. When the lump exists, the lump moves to the cavity entrance and clogs when the molten resin flows toward the cavity. Therefore, the molten resin cannot be filled into the cavity, or the molten resin is insufficiently filled into the cavity.

  An object of the present invention is to provide a resin sealing mold, a resin sealing device, and a method for manufacturing a semiconductor device for allowing a resin to flow into a cavity satisfactorily.

According to one aspect, a lower mold having a cavity lower portion formed in a concave shape, a pot formed in the lower mold and having a resin placement region, a plunger inserted into the pot, and the lower mold At least one sliding pin inserted in a hole formed in at least one of a runner region and a gate region between the cavity lower part and the pot of the mold so as to be movable up and down, and having a concave foreign material capturing portion on the upper surface; An upper mold having a concave cavity upper part fitted to the cavity lower part is provided.
According to another aspect, a lower mold having a cavity lower portion formed in a concave shape, a pot formed in the lower mold and having a resin placement region, a plunger inserted into the pot, and the lower mold to be vertically movable through a hole formed in at least one runner region and the gate region between the cavity bottom and the pot of the mold, and sliding pins that have a foreign body capturing part of the concave top surface, the a resin sealing mold having an upper mold having a cavity upper concave provoking fit to the lower cavity, the plate supporting the front Kisurido pin from below, and a driving device for vertically moving the plate, the A resin sealing device is provided.
According to still another aspect, a step of inserting a plunger into a pot opened in a lower mold having a cavity lower portion formed in a concave shape, and positioning the plunger under a space for placing resin in the upper portion of the pot And at least one sliding pin is inserted into at least one hole formed in the runner region and the gate region between the lower cavity and the pot of the lower mold, and the position of the sliding pin is A step of adjusting the concave foreign matter capturing portion on the upper surface of the sliding pin to be equal to or lower than the upper surface of the lower mold by adjusting, and a pin penetration formed in the bottom of the lower cavity of the lower mold Inserting the eject pin into the hole, adjusting the upper end of the eject pin, and attaching it to the lead frame above the lower cavity of the lower mold A step of placing the produced semiconductor chip, a step of overlaying the upper die on the lower die and the lead frame, and heating the resin in the pot to raise and the plunger while being softened Injecting the resin into the space between the cavity lower part and the cavity upper part through the runner region and the gate region, sealing the semiconductor chip with the resin, solidifying the resin, The step of separating the mold and the lower mold, and the resin, the lead frame, and the semiconductor chip are lifted by raising the plunger, the sliding pin, and the eject pin above the upper surface of the lower mold. And a step of taking out the resin, the lead frame, and the semiconductor chip from between the lower mold and the upper mold. The method of manufacturing a semiconductor device according to claim Rukoto is provided.

According to the present invention, a slide pin capable of moving up and down is attached to at least one of the runner region and the gate region in the lower mold, and a concave foreign matter catching portion is provided on the upper surface of the slide pin.
When the resin softened in the pot is injected into the cavity through the runner region and gate region by raising the plunger, if the sliding pin is placed lower than the upper surface of the lower mold, the resin will flow first at the top of the lower mold Flows onto the sliding pin below.
For this reason, the foreign matter remaining on the plunger and the sliding pin stays in the foreign matter catching portion of the sliding pin, and further gets caught by the surrounding wall portion, and it becomes difficult to reach the resin inlet of the cavity. As a result, generation of unfilled resin in the cavity can be prevented.

1A is a top view showing a lower mold of the resin sealing device according to the first embodiment of the present invention, and FIG. 1B is a partially enlarged plan view of a region surrounded by a one-dot chain line in FIG. 1A. FIG. 2 is a cross-sectional view of a mold used in the resin sealing device according to the first embodiment of the present invention. 3A and 3B are perspective views showing components used in the mold of the resin sealing device according to the first embodiment of the present invention. FIG. 4 is a top view showing the upper mold of the resin sealing device according to the first embodiment of the present invention. FIG. 5 is a side sectional view showing a structure for controlling the vertical movement of the pins attached to the mold of the resin sealing device according to the embodiment of the present invention. 6A is a plan view of a semiconductor device that is resin-sealed by the resin sealing device according to the first embodiment of the present invention, and FIG. 6B is a side view of the semiconductor device shown in FIG. 6A. FIG. 7: A is sectional drawing (the 1) which shows the resin sealing process by the resin sealing apparatus which concerns on 1st Embodiment of this invention. 7B and 7C are cross-sectional views (Nos. 2 and 3) showing the resin sealing step by the resin sealing device according to the first embodiment of the present invention. 7D and 7E are cross-sectional views (Nos. 4 and 5) showing the resin sealing step by the resin sealing device according to the first embodiment of the present invention. 7F and 7G are cross-sectional views (Nos. 6 and 7) showing the resin sealing step by the resin sealing device according to the first embodiment of the present invention. 7H and FIG. 7I are cross-sectional views (Nos. 8 and 9) showing the resin sealing step by the resin sealing device according to the first embodiment of the present invention. 8A to 8D are plan views showing a mold cleaning process of the resin sealing device according to the first embodiment of the present invention. 9A is a top view showing a lower mold of the resin sealing device according to the second embodiment of the present invention, and FIG. 9B is a partially enlarged plan view of a region surrounded by a one-dot chain line in FIG. 9A. FIG. 10 is a cross-sectional view of a mold used in the resin sealing device according to the second embodiment of the present invention. FIG. 11 is a perspective view showing components used in the mold of the resin sealing device according to the second embodiment of the present invention. FIG. 12 is a top view showing an upper mold of the resin sealing device according to the second embodiment of the present invention. FIG. 13: is a side view which shows the structure which controls the vertical motion of the pin attached to the metal mold | die of the resin sealing apparatus which concerns on 2nd Embodiment of this invention. 14A and 14B are cross-sectional views (Nos. 1 and 2) showing a resin sealing step by the resin sealing device according to the second embodiment of the present invention. 14C and 14D are cross-sectional views (Nos. 3 and 4) showing the resin sealing step by the resin sealing device according to the second embodiment of the present invention. 14E and 14F are cross-sectional views (Nos. 5 and 6) showing the resin sealing step by the resin sealing device according to the second embodiment of the present invention.

The objects and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims. It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not intended to limit the invention.
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In the drawings, similar components are given the same reference numerals.
(First embodiment)
1A and 1B are a top view and a partially enlarged plan view showing a lower mold of the resin sealing device according to the first embodiment of the present invention, and FIG. 2 is a resin seal according to the first embodiment of the present invention. It is sectional drawing seen from the II line | wire shown to FIG. 1A and FIG. 4 of the metal mold | die of a stopper. 3A and 3B are perspective views showing components used in the mold of the resin sealing device according to the first embodiment of the present invention, and FIG. 4 is a resin sealing device according to the first embodiment of the present invention. It is a top view which shows the upper metal mold | die.

The resin sealing device according to the present embodiment includes a lower mold 1 and an upper mold 11 as shown in FIG.
As shown in FIG. 1A, the lower mold 1 has a rectangular plane, and a plurality of pots 2 are formed at substantially equal intervals in the central row. The pot 2 is a hole penetrating the lower mold 1 in the vertical direction, for example, a cylindrical hole, and the upper part thereof is a resin placement area, in which the plunger 3 moves in the vertical direction as shown in FIG. 1B. Inserted as possible.

  Runners 4 are formed on both sides of the pot 2, and a first partition 1a is interposed between them as shown in FIG. The runner 4 has a substantially quadrangular columnar hole 4a penetrating the lower mold 1 in the vertical direction, and a substantially quadrangular columnar runner sliding pin 5 attached so as to be vertically movable in the space in the hole 4a.

  On the upper surface of the runner sliding pin 5, as shown in FIG. 3A, a concave foreign material capturing portion 5b whose periphery is surrounded by a wall portion 5a is formed. The wall portion 5a with respect to the bottom surface of the foreign matter catching portion 5b has a height that prevents movement of a foreign matter 38, which will be described later, remaining therein, for example, a height of about 1 mm. The angle formed by the upper inner surface of the wall portion 5a and the bottom surface of the foreign matter catching portion 5b is preferably an angle at which the foreign matter is difficult to climb, that is, an angle of about 90 degrees or less.

  A gate 6 is connected to the end of the runner 4 opposite to the pot 2, and a second partition 1b is interposed between them as shown in FIG. The gate 6 has a substantially square columnar hole 6a penetrating the lower mold 1 in the vertical direction and a substantially square columnar gate sliding pin 7 attached to be movable in the vertical direction in the space in the hole 6a.

  On the upper surface of the gate sliding pin 7, as shown in FIG. 3B, a concave foreign matter capturing portion 7b whose periphery is surrounded by a wall portion 7a is formed. The wall portion 7a with respect to the bottom surface of the foreign matter catching portion 7b has a height that prevents movement of the foreign matter 38 remaining therein, for example, a height of about 1 mm. The angle formed by the upper inner surface of the wall portion 7a and the bottom surface of the foreign matter catching portion 7b is preferably an angle at which the foreign matter is difficult to climb, that is, an angle of about 90 degrees or less.

  The gate 6 is formed in a bent direction with respect to the runner 4 on the upper surface of the lower mold 1 shown in FIG. 1A. Further, the gates 6 on both sides of the pod 2 are formed at positions that are opposite to each other and substantially parallel to each other.

  The tip of each gate 6 near the side edge of the lower mold 1 has a tapered shape, and the tip is connected to one of the four corners of the cavity lower part 8 a formed near both side edges of the lower mold 1. Has been. The planar shape of the cavity lower portion 8a is, for example, a substantially square shape. Further, the gate 6 is formed in a shape whose tip is directed almost to the center of the cavity lower portion 8a.

  The cavity lower portion 8a is formed in a concave shape in the lower mold 1, and pin through holes 1c are formed under the vicinity of the four corners of the bottom, and the eject pin 9 moves up and down in the pin through hole 1c. Inserted as possible.

  As shown in FIGS. 2 and 4, a cull portion 12 positioned on the pot 2 is formed in a concave shape on the lower surface of the upper die 11 that is overlaid on the lower die 1, and is further formed into a cavity. The cavity upper part 8b overlapped with the lower part 8a is formed in a concave shape.

The cavity lower part 8a and the cavity upper part 8b become the cavity 8 when they are overlapped with each other, and have, for example, a shape that becomes the outer shape of the semiconductor package. The size of each of the cavity lower part 8b and the cavity upper part 8b varies depending on the type of the semiconductor package, but the thickness is, for example, about 1.6 mm.

In addition, an air vent 8c connected to a part of the cavity upper portion 8b is formed in a concave shape at the edge of the upper mold 11.
The lower die 1, the runner sliding pin 5, the gate sliding pin 7, and the upper die 11 are, for example, martensitic stainless steel, more specifically, AISI 420-440 series martensitic stainless steel, or these Formed from steel.
In addition, the structure in which at least one is not formed among the 1st, 2nd partition parts 1a and 1b may be sufficient.

  FIG. 5 is a cross-sectional view taken along line II-II in FIG. 1A. A primary plate base 15 is disposed below the lower mold 1, and a plurality of runner sliding pins 5 and a plurality of gate slides are disposed thereon. A moving pin 7 is supported. Further, the primary plate base 15 is supported by a plurality of support columns 16 attached on the secondary plate base 17 below. The secondary plate base 17 is attached to a drive mechanism that is driven by the rotary shaft of the first servomotor 18 via the vertical motion conversion mechanism 19. The vertical motion conversion mechanism 19 has, for example, a structure in which a mechanism in which a worm gear and a rack gear attached to the rotation shaft of the first servomotor 18 are combined is surrounded by a bellows.

  As a result, the vertical movement of the vertical movement conversion mechanism 19 is uniformly transmitted to the plurality of runner sliding pins 5 and the plurality of gate sliding pins 7 via the primary plate base 15, the column 16 and the secondary plate base 17. can do.

  The plurality of eject pins 9 are supported on an eject pin plate base 20, and the eject pin plate base 20 is driven by a rotary shaft of a second servo motor 21 via a vertical motion conversion mechanism 22. It is connected to the. As the vertical motion conversion mechanism 22, for example, a mechanism in which a worm gear attached to the rotation shaft of the second servomotor 20 and a rack gear is combined is used.

By the way, the plunger 3 inserted into the pot 2 is mounted on another plate connected to a vertical motion conversion mechanism driven by a third servo motor, although not particularly shown. The rotations of the first and second servo motors 18 and 20 and the third servo motor are controlled by the control device 23, respectively.
In FIG. 5, reference numeral 24 indicates a housing of the resin sealing device.

Next, a method for forming a package of a semiconductor device using the above-described resin sealing device will be described.
The semiconductor device in a state before the package formation has a semiconductor chip 33 bonded to the upper surface of the die stage 31 of the lead frame 30 with a silver paste 35 as shown in the top view of FIG. 6A and the side sectional view of FIG. 6B. Yes. The silver paste 35 is cured after bonding, for example, at 150 ° C. for 3 hours.

  The lead frame 30 has inner leads 32 arranged around the die stage 31. The inner lead 32 is electrically connected to the electrode pad 34 on the upper surface of the semiconductor chip 35 through a wire 36. For example, a semiconductor integrated circuit is formed on the semiconductor chip 33.

The semiconductor chip 33 attached to the lead frame 30 is covered with a package by the steps shown in FIGS. 7A to 7I.
First, as shown in FIG. 7A, by adjusting the positions of the runner sliding pin 5 and the gate sliding pin 7, the upper ends of the wall portions 5a, 7a are the upper surface of the lower mold 1, the first and the second For example, it is positioned below the partition portions 1a and 1b by a maximum of about 2 mm.

  The positions of the runner sliding pin 5 and the gate sliding pin 7 are adjusted by controlling the rotation of the first servomotor 18 by the control device 23 shown in FIG. That is, the height of the vertical motion converter 19 is changed by controlling the rotation of the first servo motor 18, thereby adjusting the heights of the first and second plate bases 17 and 16 and the column 16, The positions of the sliding pin 5 and the gate sliding pin 7 are changed.

  In this state, the eject pin 9 is adjusted to a position where the upper end coincides with the bottom surface of the cavity lower portion 8a. The position of the eject pin 9 is adjusted by the rotation control of the second servo motor 21 by the control device 23 shown in FIG. That is, the height of the vertical motion converter 22 is changed by controlling the rotation of the second servomotor 21, thereby changing the height of the eject pin plate base 20 and adjusting the position of the eject pin 9.

Further, the plunger 3 in the pot 2 of the lower mold 1 is lowered, and a tablet-like resin 37 is filled therein. The position of the plunger 3 is adjusted by a third servo motor (not shown), a vertical movement conversion mechanism, and a plate, similarly to the runner sliding pin 5 and the gate sliding pin 7.
As the resin 37, for example, a material containing a curing agent, a filler, a catalyst, a colorant and the like in a resin main component such as an epoxy resin is used.

  Subsequently, the lead frame 30 is placed on the lower mold 1 so that the die stage 31 and the semiconductor chip 33 are positioned at the center of the cavity lower portion 8 a of the lower mold 1, and thereafter, the lower surface of the upper mold 11. And the upper surface of the lower mold 1 are aligned. In this case, the outer portion of the inner lead 32 and the frame (not shown) of the lead frame 30 are sandwiched between the lower mold 1 and the upper mold 11, and between the tip of the gate 6 and the inner lead 32 or the inner lead 32. A resin inflow gap (not shown) is formed around the lead 32.

Next, at least the lower mold 1 is heated by a heater (not shown) to transmit heat to the resin 37 and soften the resin 37.
Subsequently, as shown in FIG. 7B, when the resin 37 is softened and the plunger 3 is raised by controlling the third servo motor (not shown) by the control device 23, the resin 37 moves from the pot 2 to the runner. 4. It is injected into the cavity 8 via the gate 6. As a result, the semiconductor chip 33, the die stage 31, and the inner lead 32 are sealed with the resin 37, and the resin 37 in that portion becomes a package. When the resin 37 is caused to flow into the space in the cavity 8, the space is deaerated through the air vent 8c.

  Next, after returning the temperature of the lower mold 1 and the upper mold 11 to room temperature and solidifying the resin 37, the lower mold 1 and the upper mold 11 are opened as shown in FIG. 7C. Further, the resin 37 obtained by lifting and solidifying the plunger 3, the eject pin 9, the runner sliding pin 5, and the gate sliding pin 7 in accordance with a command from the control device 23 is separated from the lower mold 1.

  Thereafter, the semiconductor chip 33 sealed with the resin 37 and the lead frame 30 are taken out, unnecessary portions of the resin 37 are removed, and unnecessary portions of the lead frame 30 are cut. Thereby, a semiconductor device having the semiconductor chip 33 and the inner lead 32 sealed with the resin 37 is completed.

After the resin 37 is taken out, a foreign substance 38 such as a resin residue may remain on the lower mold 1, the plunger 3, the runner 4, and the gate 6 as shown in FIG. 7D. If the next resin sealing is performed with the foreign matter 38 still attached, the foreign matter 38 is clogged at the tip of the gate 6 when the softened resin 37 flows into the inner 4 and the gate 6, and the inside of the cavity lower portion 8 a and the cavity upper portion 8 b. Thus, an unfilled portion is likely to occur.

  Therefore, with the positions of the plunger 3, the runner sliding pin 5 and the gate sliding pin 7 being held, a dust collecting cleaner 39 is inserted between the lower mold 1 and the upper mold 11 as shown in FIG. 7E. Then, the foreign substance 38 adhering to the opposing surfaces of the lower mold 1 and the upper mold 11 is sucked and removed.

  The dust collecting cleaner 39 has a space 39a formed inside the flat plate-shaped main body, and a plurality of suction holes 39b formed on the upper and lower surfaces thereof. In addition, a suction hose connection port 39c is disposed substantially at the center of the space 39a, and one end of the suction hose 40 shown in FIG. 8A is attached. The other end of the suction hose 40 is connected to a suction pump (not shown) controlled by the control device 23.

For example, as shown in FIGS. 8A to 8C, the foreign matter 38 is removed by the dust collector 39 as shown in FIG. 8D after the dust collector 39 is moved from one end to the other end on the lower mold 1. Then, it is folded back from the other end toward one end.
In addition, each distance of the lower metal mold | die 1 and the upper metal mold | die 11 with respect to the dust collecting cleaner 39 shall be 2 mm-3 mm.

  As a result, the foreign matter 38 is sucked and removed by the dust collecting cleaner 39 through the suction ports 39b on the upper surface of the lower mold 1 and the lower surface of the upper mold 11, but the plunger 3, the runner 4 and the gate 6 are not completely removed. May remain in the area.

After removing the dust collecting cleaner 39 from between the lower mold 1 and the upper mold 11, the plunger 3, the runner sliding pin 5, the gate sliding pin 7 and the gate are controlled by the control device 32 as shown in FIG. 7F. Lower the eject pin 9 to the home position.
Thereby, the space which puts the tablet-shaped resin 37 on the plunger 3 is ensured, and the same position as the upper surface of the first and second partition portions 1a and 1b having the same height as the upper surface of the lower mold 1 or The upper ends of the runner sliding pin 5 and the gate sliding pin 7 are positioned at a lower position, for example, about 2 mm below at the maximum. Further, the upper end of the eject pin 9 is adjusted to be substantially the same height as the bottom surface of the cavity lower portion 8a.

  Subsequently, as shown in FIG. 7G, a tablet-like resin 37 is supplied into the pot 2 on the plunger 3. The position of the plunger 3 is adjusted by a third servo motor (not shown), a vertical motion conversion mechanism, and a plate.

  Further, the lead frame 30 is placed on the lower mold 1, and the die stage 31 and the semiconductor chip 33 are positioned at the center of the cavity lower portion 8a. Thereafter, the lower surface of the upper mold 11 and the upper surface of the lower mold 1 are aligned. In this case, the outer portion of the inner lead 32 and the frame (not shown) of the lead frame 30 are sandwiched between the lower mold 1 and the upper mold 11, and between the runner 4 and the inner lead 32 or the inner lead 32. A resin inflow gap (not shown) is formed around the periphery of the.

Next, at least the lower mold 1 is heated by a heater (not shown) to transmit heat to the resin 37 and soften the resin 37.
Subsequently, as shown in FIG. 7H, in a state where the resin 37 is softened, the plunger 3 is raised by the control of a third servo motor (not shown) by the control device 23, and the resin 37 in the pot 2 is moved to the runner 4, It injects into the space between the cavity lower part 8a and the cavity upper part 8b via the gate 6.
Since the resin 37 at the beginning of the flow flows downward, the foreign matter 38 remaining on the plunger 3, the runner 4, and the gate 6 moves together with the resin 37, and the runner slide pin 5 and the gate slide pin 7 below are moved. It moves in the foreign matter catching parts 4a and 7a.

Further, as shown in FIG. 7I, the resin 37 moves to completely fill the cavity 8. As the resin 37 moves, the foreign matter 38 further moves on the foreign matter catching portions 5b and 7b. However, since the movement is finally hindered by the wall portions 5a and 7a, the foreign matter 38 does not easily reach the cavity 8.
Thereby, the semiconductor chip, the die stage 31 and the inner lead 32 are sealed with the resin 37, and foreign matter is prevented from being mixed therein.

As described above, according to the present embodiment, the runner sliding pin 5 having the concave foreign matter capturing portions 5b and 7b on the upper surface, the gate sliding in the flow path through which the resin flows from the pot 2 filled with the resin 37 to the cavity 8. Since the pin 7 is arranged so as to be movable up and down, the foreign matter 38 remaining in the resin flow path is prevented from reaching the resin injection port of the cavity 8, and the occurrence of unfilled resin in the cavity 8 can be prevented. it can.
In such a structure that does not have the runner sliding pin 5 and the gate sliding pin 7, the foreign matter 38 easily reaches the resin injection port as it is, so that it is easy to cause unfilled resin in the cavity 8.

  Moreover, in this embodiment, the runner sliding pin 5 is attached in the hole 4a of the runner 4 so that a vertical movement is possible, and the gate sliding pin 7 is attached in the hole 6a of the gate 6 so that a vertical movement is possible. Thereby, when cleaning the lower mold 1, the positions of the runner sliding pin 5 and the gate sliding pin 7 are set higher than those in the resin sealing step, so that the foreign matter catching portions 5 b and 7 b are placed on the lower mold 1. It becomes easy to remove the existing foreign matter 38.

By the way, at the time of resin sealing, the runner sliding pin 5 and the gate sliding pin 7 may be arranged with a height difference. If the runner sliding pin 5 is positioned below the gate sliding pin 7 to make a difference in height, the foreign matter 38 tends not to move upward, so that a foreign matter is formed at the boundary between the runner sliding pin 5 and the gate sliding pin 7. 38 becomes more difficult to move.
As a result, the foreign matter 38 is prevented from moving before entering from the resin inlet of the cavity 8, so that insufficient filling of the resin in the cavity 8 hardly occurs.
Note that either the runner sliding pin 5 or the gate sliding pin 7 may be omitted. In this case, one of the holes 4a and 6a is not formed, and a recess for allowing the resin 37 to pass therethrough is formed.

(Second Embodiment)
9A and 9B are a top view and a partially enlarged plan view showing a lower mold of the resin sealing device according to the second embodiment of the present invention, and FIG. 10 is a resin seal according to the second embodiment of the present invention. It is sectional drawing seen from the III-III line | wire shown to FIG. 9A and FIG. 12 of the metal mold | die of a stopper. FIG. 11 is a perspective view showing components used in the mold of the resin sealing device according to the second embodiment of the present invention, and FIG. 12 is a top view of the resin sealing device according to the second embodiment of the present invention. It is a top view which shows a metal mold | die.

  As shown in FIGS. 9A and 9B, a plurality of pots 42 are formed at substantially equal intervals in the central row of the lower mold 41 having a square shape. The pot 42 is a hole that penetrates the lower mold 41 in the vertical direction, for example, a cylindrical hole, and an upper portion thereof is a resin placement region, into which the plunger 43 is inserted so as to be movable in the vertical direction.

Runners and gates 44 are formed on both sides of the pot 42, and between them, FIG.
As shown at 0, a partition 41a is interposed. The runner / gate 44 has a substantially square columnar hole 44a penetrating the lower mold 41 in the vertical direction, and a substantially square columnar runner / gate sliding pin 45 capable of moving up and down in the space in the hole 44a. Yes. Here, the runner / gate 44 is a runner that also serves as a gate, and the runner / gate slide pin 45 is a runner slide pin that also serves as a gate slide pin. In addition, the partition part 41a does not need to be formed.

  On the upper surface of the runner / gate sliding pin 45, as shown in FIG. 11, a concave foreign matter capturing portion 45 b surrounded by a wall portion 45 a is formed. The wall portion 45a with respect to the bottom surface of the foreign matter catching portion 45b has a height at which the movement of the foreign matter 38 remaining therein can be stopped, for example, a height of about 1 mm. Further, the angle formed by the upper inner surface of the wall 45a and the bottom surface of the foreign matter catching portion 45b is preferably an angle at which the foreign matter is difficult to climb, that is, an angle of about 90 degrees or less.

  A concave cavity lower portion 48a is formed near both side edges of the lower mold 41, a pin through hole 41c is formed near the both side ends of the bottom portion, and the eject pin 49 moves up and down in the pin through hole 41c. Inserted as possible.

  As shown in FIGS. 10 and 12, a concave cull portion 52 located on the pot 42 is formed on the lower surface of the upper mold 51 superimposed on the lower mold 41, and the lower surface thereof is further formed. Is formed with a concave cavity upper part 48b which is superimposed on the cavity lower part 48a.

  The cavity lower part 48a and the cavity upper part 48b become a cavity 48 in a state where they are overlapped with each other, and have a shape that becomes an outer shape of a semiconductor package, for example. The sizes of the cavity lower part 48b and the cavity upper part 48b differ depending on the type of the semiconductor package, but the thickness is, for example, about 1.6 mm.

Further, an air vent 48c connected to a part of the cavity upper part 48b is formed in a concave shape at the edge of the upper mold 51.
The lower mold 41, the runner / gate sliding pin 45, and the upper mold 51 are made of, for example, martensitic stainless steel, more specifically, AISI 420-440 series martensitic stainless steel, or these steels. Is done.

  FIG. 13 is a cross-sectional view taken along line IV-IV in FIG. 9A. A primary plate base 15 is disposed below the lower mold 41 in the same manner as in the first embodiment, and a plurality of runners and gates are disposed thereon. A sliding pin 45 is supported. Accordingly, the vertical movement of the vertical movement conversion mechanism 19 can be uniformly transmitted to the plurality of runner / gate sliding pins 45 via the primary plate base 15, the support column 16 and the secondary plate base 17.

  The plurality of eject pins 49 are supported on the eject pin plate base 20. The eject pin plate base 20 is attached to a vertical motion conversion mechanism 22 that moves up and down by the rotation shaft of the second servo motor 21 as in the first embodiment.

Although not shown in particular, the plunger 43 inserted through the pot 42 is mounted on another plate connected to the vertical motion conversion mechanism driven by the third servo motor, as in the first embodiment.
In FIG. 13, the same reference numerals as those in FIG. 5 indicate the same elements.

Next, a method for forming a package of a semiconductor device using the above-described resin sealing device will be described.
The semiconductor device in a state before forming the package has, for example, the structure shown in FIGS. 6A and 6B. Then, the semiconductor chip 33 attached to the lead frame 30 is covered with the package by the steps shown in FIGS. 14A to 14F.
Next, steps required until a state shown in FIG. 14A is reached will be described.
First, by adjusting the position of the runner and gate sliding pin 45, the upper end thereof is disposed at a position below the upper surface of the lower mold 41 and the partition portion 41a by a maximum of about 2 mm.

  The position of the runner / gate sliding pin 45 is adjusted by controlling the rotation of the first servomotor 18 by the control device 23 shown in FIG. That is, the height of the vertical motion converter 19 is changed by controlling the rotation of the first servo motor 18, thereby adjusting the heights of the first and second plate bases 17 and 16 and the column 16, The position of the cum gate sliding pin 45 is changed.

  In this state, the eject pin 49 is adjusted to a position where the upper end coincides with the bottom surface of the cavity lower part 48a. The position of the eject pin 49 is adjusted by controlling the rotation of the second servo motor 21 by the control device 23 as in the first embodiment.

  Further, the plunger 43 in the pot 42 of the lower mold 41 is lowered, and the tablet-shaped resin 37 is filled therein. The position of the plunger 43 is adjusted by a third servo motor (not shown), a vertical motion conversion mechanism, and a plate.

Subsequently, the lead frame 30 is placed on the lower mold 41 so that the die stage 31 and the semiconductor chip 33 of the semiconductor device are located in the center of the cavity lower part 48a of the lower mold 41, and then the upper mold The lower surface of 51 and the upper surface of the lower mold 41 are aligned.
In this case, the outer portion of the inner lead 32 and the frame (not shown) of the lead frame 30 are sandwiched between the lower die 41 and the upper die 51, and between the runner / gate 44 and the inner lead 32 or the inner lead 32. A resin inflow gap (not shown) is formed around the lead 32.

Next, at least the lower mold 41 is heated by a heater (not shown) to transmit heat to the resin 37 and soften the resin 37.
Subsequently, in a state where the resin 37 is softened, the plunger 43 is raised by the control of a third servo motor (not shown) by the control device 23, and the resin 37 in the pot 42 is passed through the runner and gate 45 to the space of the cavity 48. Inject.

  As a result, the semiconductor chip 33, the die stage 31, and the inner lead 32 are sealed with the resin 37, and the resin 37 in that portion becomes a package. When the resin 37 is caused to flow into the space between the cavity lower part 48a and the cavity upper part 48b, the space is deaerated through the air vent 48c.

  Next, after the temperature of the lower mold 41 and the upper mold 51 is returned to room temperature and the resin 37 is solidified, the lower mold 41 and the upper mold 51 are opened as shown in FIG. 14B. Further, the resin 37 solidified by lifting the plunger 43, the eject pin 49 and the runner / gate sliding pin 45 in accordance with a command from the control device 23 is separated from the lower mold 41.

  Thereafter, the solidified resin 37, the semiconductor chip 33 sealed thereby, and the lead frame 30 are taken out, unnecessary portions of the resin 37 are removed, and unnecessary portions of the lead frame 30 are cut. Thereby, the semiconductor device having the semiconductor chip 33 and the inner lead 32 sealed with the resin 37 is completed.

In the lower mold 41 from which the resin 37 is taken out, a foreign substance 38 such as a resin residue shown in FIG. 14C may remain on the plunger 43 and the runner / gate 44 as in the first embodiment. . When the resin inlet of the cavity 48 is clogged with the foreign matter 38, an unfilled portion is generated in the cavity 48.

  Therefore, with the positions of the plunger 43 and the runner / gate sliding pin 45 held, as shown in FIG. 14D, a dust collecting cleaner 39 is inserted between the lower mold 41 and the upper mold 51 to lower the lower mold. The foreign matter 38 adhering to the surfaces of 41 and the upper mold 51 is sucked and removed. The dust collection cleaner 39 has the same structure as that shown in the first embodiment.

In the same manner as shown in the first embodiment, the dust collector cleaner 39 is folded from the other end toward the one end after moving the dust collector cleaner 39 from one end on the lower mold 41 to the other end.
The distance between the lower mold 41 and the upper mold 51 with respect to the dust collecting cleaner 39 is 2 mm to 3 mm, for example.
As a result, the foreign matter 38 is sucked and removed by the dust collecting cleaner 39, but the ranger 3 and the runner / gate 44 may remain without being completely removed.

  After removing the dust collecting cleaner 39 from between the lower mold 41 and the upper mold 51, the plunger 43, the runner / gate sliding pin 45 and the eject pin 49 are controlled by the control device 32 as shown in FIG. 14E. Lower. Thereby, the space which puts tablet-shaped resin 37 on the plunger 43 is ensured. Further, the upper end of the runner / gate sliding pin 45 is positioned at the same position as or lower than the upper surface of the lower mold 41, for example, about 2 mm below at the maximum. Further, the upper end of the eject pin 49 is adjusted to be substantially the same height as the bottom surface of the cavity lower part 48a.

Subsequently, a tablet-like resin 37 is filled in the pot 42 on the plunger 43. The position of the plunger 43 is adjusted by a third servo motor (not shown), a vertical motion conversion mechanism, and a plate.
Further, the lead frame 30 is placed on the lower mold 1 so that the die stage 31 and the semiconductor chip 33 are located at the center of the cavity lower part 48 a, and then the lower surface of the upper mold 51 and the lower mold 41 are placed. Match the top surface.
In this case, the outer portion of the inner lead 32 and the frame (not shown) of the lead frame 30 are sandwiched between the lower die 41 and the upper die 51, and between the runner 4 and the inner lead 32 or the inner lead 32. A resin inflow gap (not shown) is formed around the periphery of the.

Next, at least the lower mold 41 is heated by a heater (not shown) to transmit heat to the resin 37 and soften the resin 37.
Subsequently, when the plunger 3 is raised by the control of a third servo motor (not shown) by the control device 23 in a state where the resin 37 is softened, the resin 37 in the pot 2 passes through the runner / gate 44 and is cavityd. 48 is injected into the space.

  Since the resin 37 at the beginning of the flow flows downward, the foreign matter 38 remaining on the plunger 43 and the runner / gate 44 moves together with the resin 37, and the foreign matter catching portion 45a of the runner / gate sliding pin 45 located below is moved. Moving.

In this case, the foreign matter 38 remaining on the plunger 3 and the runner / gate sliding pin 45 moves together with the resin 37 and moves in the foreign matter catching portions 4 a and 7 a of the runner / gate sliding pin 45.
The foreign matter 38 is finally hindered from moving by the wall 45a, and is difficult to reach the cavity 48.
As a result, as shown in FIG. 14F, the semiconductor chip 33, the die stage 31, and the inner lead 32 are sealed with the resin 37, and foreign matter 38 is prevented from being mixed therein.

  According to the above embodiment, in the runner / gate 44 in the flow path where the resin flows from the pot 2 filled with the resin 37 to the cavity 48, the runner / gate sliding pin 45 having the concave foreign material capturing portion 45b on the upper surface is provided. It is arranged so that it can move up and down. Thereby, since the foreign substance 38 remaining in the resin flow path is prevented from moving to the cavity 48 by the runner / gate sliding pin 45, it is possible to prevent the resin 48 from being unfilled in the cavity 48.

Further, since the runner / gate sliding pin 45 is mounted in the hole 44a of the runner / gate 44 so as to be movable up and down, the runner / gate sliding pin 45 is sealed with resin when the lower mold 41 is cleaned. Positioning above the time makes it easier to remove the foreign matter 38 present on the foreign matter catching portion 45b.
The runner and gate sliding pin 45 is used in a region where the distance from the runner 4 to the gate 6 shown in the first embodiment is linear. Further, in the first embodiment, the runner sliding pin 5 and the gate sliding pin 7 are separate parts. However, the runner sliding pin 5 and the gate sliding pin 7 are integrated as shown in this embodiment in accordance with a long and complicated flow path. Good.

  All examples and conditional expressions given here are intended to help the reader understand the inventions and concepts that have contributed to the promotion of technology, such examples and It should be construed without being limited to the conditions, and the organization of such examples in the specification is not related to showing the superiority or inferiority of the present invention. Although embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions and modifications can be made thereto without departing from the spirit and scope of the present invention.

Next, features of the embodiment of the present invention will be described.
(Appendix 1) Of a lower mold having a cavity lower portion formed in a concave shape, a pot formed in the lower mold and having a resin placement region, a plunger inserted through the pot, and the lower mold At least one sliding pin inserted in a hole formed in at least one of a runner region and a gate region between the cavity lower part and the pot so as to be movable up and down and having a concave foreign material capturing part on the upper surface; and the cavity lower part And an upper mold having a concave cavity upper part to be fitted to the resin mold.
(Additional remark 2) In the said lower mold, the said sliding pin is integrally formed over the said runner area | region and the said gate area | region, The metal mold | die for resin sealing of Additional remark 1 characterized by the above-mentioned.
(Supplementary note 3) Supplementary note 1 or 2, characterized in that it has a pin through hole formed below the bottom of the cavity of the lower mold and an eject pin inserted through the pin through hole so as to be movable up and down. The mold for resin sealing as set forth in Appendix 2.
(Additional remark 4) The said cavity upper part, the said cavity lower part, the said runner area | region, and the said gate area | region are provided in the both sides of the said pot, For resin sealing as described in any one of Additional remark 1 thru | or Additional remark 3 characterized by the above-mentioned Mold.
(Supplementary Note 5) Of a lower mold having a cavity lower portion formed in a concave shape, a pot formed in the lower mold and having a resin placement region, a plunger inserted through the pot, and the lower mold At least one sliding pin inserted in a hole formed in at least one of a runner region and a gate region between the cavity lower part and the pot so as to be movable up and down and having a concave foreign material capturing part on the upper surface; and the cavity lower part A resin sealing mold having an upper mold having a concave cavity upper portion that is fitted to the plate, a plate that supports the plurality of sliding pins from below, and a drive device that moves the plate up and down. A resin sealing device characterized by that.
(Appendix 6) A step of inserting a plunger into a pot opened in a lower mold having a cavity lower portion formed in a concave shape, and positioning the plunger under a space for putting resin in the upper portion of the pot; By inserting at least one sliding pin into at least one hole formed in the runner region and the gate region between the cavity lower part and the pot of the mold, and adjusting the position of the sliding pin A step of setting the concave foreign matter catching portion on the upper surface of the sliding pin to be equal to or lower than the upper surface of the lower mold, and an eject pin in a pin through-hole formed in a bottom of the cavity of the lower mold A step of adjusting the upper end of the eject pin and a semiconductor chip attached to a lead frame on the lower portion of the cavity of the lower mold. Placing the upper die on the lower die and the lead frame; raising the plunger while heating and softening the resin in the pot; Injecting the resin into the space between the cavity lower part and the cavity upper part through the region and the gate region, sealing the semiconductor chip with the resin, solidifying the resin, and the upper mold Separating the lower mold; and lifting the resin, the lead frame, and the semiconductor chip by raising the plunger, the sliding pin, and the eject pin above the upper surface of the lower mold; A step of taking out the resin, the lead frame, and the semiconductor chip from between the lower mold and the upper mold. The method of manufacturing a semiconductor device to be. (Supplementary Note 7) After the resin, the lead frame, and the semiconductor chip are taken out from between the lower mold and the upper mold, the plunger, the sliding pin, and the eject pin are attached to the lower mold. The method of manufacturing a semiconductor device according to appendix 6, further comprising a step of cleaning the opposing regions of the lower mold and the upper mold while maintaining a state of being positioned above the upper surface. .
(Additional remark 8) In the said lower metal mold | die, the said sliding pin is integrally formed by the said runner area | region and the said gate area | region, The manufacturing method of the semiconductor device of Additional remark 5 or Additional remark 6 characterized by the above-mentioned.

1 Lower mold 2 Pot 3 Plunger 4 Runner 5 Runner slide pin 6 Gate 7 Gate slide pin 8 Cavity 8a Cavity lower part 8b Cavity upper part 9 Eject pin 11 Upper mold 41 Lower mold 42 Pot 43 Plunger 44 Runner and gate ( runner)
45 Runner and gate sliding pin (Runner sliding pin)
48 Cavity 48a Cavity lower part 48b Cavity upper part 49 Eject pin 51 Upper mold

Claims (5)

A lower mold having a cavity lower part formed in a concave shape;
A pot formed in the lower mold and having a resin placement region;
A plunger inserted through the pot;
In the lower mold, at least one sliding member inserted through a hole formed in at least one of a runner region and a gate region between the lower part of the cavity and the pot so as to be movable up and down and having a concave foreign material capturing portion on the upper surface. A moving pin,
An upper mold having a concave cavity upper part fitted to the cavity lower part;
A mold for resin sealing, comprising:   2. The resin sealing mold according to claim 1, wherein in the lower mold, the sliding pin is integrally formed across the runner region and the gate region. A lower mold having a cavity lower portion formed in a concave shape; a pot formed in the lower mold and having a resin placement region; a plunger inserted through the pot; and the cavity lower portion of the lower mold; vertically movably inserted into the hole formed in at least one runner region and the gate region between the pot and the sliding pins that have a foreign body capturing part of the concave top surface, concave provoking fit the cavity bottom A mold for resin sealing having an upper mold having an upper part of the cavity;
And a plate supporting the previous Kisurido pin from the bottom,
A driving device for moving the plate up and down;
A resin sealing device comprising: Inserting a plunger into a pot opened in a lower mold having a cavity lower part formed in a concave shape, and positioning the plunger under a space for putting resin in the upper part of the pot;
In the lower mold, at least one sliding pin is inserted into at least one hole formed in the runner region and the gate region between the cavity lower part and the pot, and the position of the sliding pin is adjusted. A step of setting the concave foreign matter capturing portion on the upper surface of the sliding pin to be equal to or lower than the upper surface of the lower mold,
Inserting an eject pin into a pin through-hole formed in the bottom of the lower cavity of the lower mold, and adjusting an upper end of the eject pin;
Placing a semiconductor chip attached to a lead frame on the lower cavity of the lower mold; and
A step of stacking an upper mold on the lower mold and the lead frame;
The resin in the pot is heated and softened, and the plunger is raised to inject the resin into the space between the cavity lower part and the cavity upper part through the runner region and the gate region, and the semiconductor chip Sealing with the resin,
Solidifying the resin;
Separating the upper mold and the lower mold;
Lifting the resin, the lead frame, and the semiconductor chip by raising the plunger, the sliding pin, and the eject pin above the upper surface of the lower mold;
Extracting the resin, the lead frame and the semiconductor chip from between the lower mold and the upper mold;
A method for manufacturing a semiconductor device, comprising: After the resin, the lead frame, and the semiconductor chip are taken out from between the lower mold and the upper mold, the plunger, the sliding pin, and the eject pin are placed more than the upper surface of the lower mold. 5. The method of manufacturing a semiconductor device according to claim 4, further comprising a step of cleaning an opposing region of the lower mold and the upper mold while maintaining a state of being positioned above.

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