JP5484857B2 - Solder supply device - Google Patents

Description

  The present invention relates to a solder supply apparatus.

  A solder supply device is used for a die bonder or the like, which is a manufacturing facility for semiconductor devices. A die bonder of a facility for manufacturing a semiconductor device using a lead frame supplies a certain amount of solder to an island of the lead frame, and a semiconductor chip is mounted on the supplied solder. In the die bonder, there is a solder supply to the lead frame in which a molten solder obtained by melting solid solder is supplied onto the lead frame (Patent Documents 1 and 2).

  The thing of patent document 1 heats and melts the ingot solder thrown into the solder pot (crucible) with a heater. A nozzle is formed at the lower end of the solder pot, and the upper end opening of the solder pot is closed with a lid. A gas pipe is connected to the lid. Pressurized gas is supplied into the solder pot from the gas pipe, and the space above the molten solder in the pot is set to a positive pressure. With this positive pressure, a small amount of molten solder is discharged from the nozzle onto the lead frame.

  Moreover, the thing of patent document 2 has provided the melting tank separately from the crucible. That is, ingot solder is supplied to the melting tank and is heated and melted by the heater. In this case, since the molten solder melted in the melting tank comes into contact with the outside air when supplying the ingot solder to the melting tank, SnO (stannous oxide) or the like is formed on the molten solder in the melting tank. Oxide may be generated. When such an oxide is generated, high quality solder cannot be supplied. However, since the lower layer molten solder in the melting tank is further supplied to the crucible, supply of the oxide generated in the melting tank to the crucible can be suppressed.

JP-A-4-72639 JP 2008-178892 A

  However, in the method of Patent Document 1, when the melted solder that has been melted by heating the ingot solder in the solder pot decreases to the lower limit value, the solder supply operation is temporarily stopped, and the ingot solder is newly charged and melted. I had to let it. The ingot solder is introduced by opening the lid of the solder pot. At this time, the solder in the pot is oxidized and the quality may be deteriorated, and there is a problem that high-quality molten solder cannot be supplied. In the method of Patent Document 2, there is a possibility that oxide generated in the melting tank may be mixed into the crucible, and thus high quality molten solder may not be stably supplied.

  In Cited Document 1, oxides are generated in the crucible, and in Cited Document 2, oxides are generated in the melting tank. Therefore, replacement of the crucible and the melting tank and the number of maintenance are increased, and it is difficult to operate for a long time. There was a problem.

  In view of the above problems, the present invention provides a solder supply apparatus that can supply solder with less impurities and can be operated for a long time.

The solder supply device of the present invention is a solder supply device in which ingot solder is supplied to a melting tank having an antioxidation atmosphere, the ingot solder is heated and melted in the melting tank, and the molten solder is discharged from the melting tank. And a non-oxidizing gas supply means for supplying a non-oxidizing gas into the melting tank and a vacuum means for evacuating the melting tank, and the non-oxidizing gas is supplied into the melting tank. and supplying the supply port, and an outlet for discharging the non-oxidizing gas in the molten bath to melt bath outside provided by the non-oxidizing gas supply means, Ru was circulated non-oxidizing gas to the outlet from the supply port At the same time, the inside of the melting tank is evacuated by the vacuum means to reduce the residual oxygen in the melting tank and discharge the molten solder while forming a flow path for supplying non-oxidizing gas into the melting tank. To do.

  According to the solder supply device of the present invention, when the molten solder is discharged, the non-oxidizing gas is circulated from the supply port to the outlet. Is supplied to maintain the inside of the melting tank in an oxidation-preventing atmosphere. Moreover, since the non-oxidizing gas flows out from the inside of the melting tank to the outside at the outlet, it is possible to block the entry of air (oxygen) inside from the outside of the melting tank. Thereby, it can suppress that the molten solder in a melting tank oxidizes, and can suppress generation | occurrence | production of an oxide in a melting tank. Further, ingot solder can be constantly supplied to the melting tank through the outlet.

  The melting tank includes a tank body and a guide body that is connected to the tank body and extends in the vertical direction. The opening on the side opposite to the tank body of the guide body serves as the outlet, and the guide body extends from the supply port. A non-oxidizing gas flow path to the opening can be formed. Thereby, the opening part (communication port with a guide body) of a tank main body is no longer exposed to external air, and it can prevent that oxygen enters into a tank main body.

  An opening / closing lid for opening and closing the outlet can be provided, and a vacuum means for evacuating the melting tank can be provided in the melting tank. Thereby, the inside of a melting tank can be made into a sealing state, and a melting tank can be made into a vacuum state.

  The crucible is disposed below the melting tank and discharges molten solder to the mounted portion, and the molten solder in the melting tank can be supplied to the crucible while maintaining the oxidation preventing atmosphere of the melting tank. Accordingly, the molten solder is further supplied to the crucible, and even if oxide is generated in the melting tank, the oxide can remain in the melting tank, and the oxide is hardly supplied to the crucible.

The solder supply method of the present invention is a solder supply method in which ingot solder is supplied to a melting tank that is in an oxidation-preventing atmosphere, the ingot solder is heated and melted in the melting tank, and the molten solder is discharged from the melting tank. While evacuating the inside of the melting tank, supplying the non-oxidizing gas into the melting tank, reducing the residual oxygen in the melting tank, and then circulating the non-oxidizing gas from the supply port to the outlet. The molten solder is discharged in a state where a non-oxidizing gas flow path is formed in the melting tank .

  According to the solder supply method of the present invention, the molten solder in the melting tank can be prevented from being oxidized, and the generation of oxides in the melting tank can be suppressed. Further, ingot solder can be constantly supplied to the melting tank through the outlet.

After making the said melting tank into the sealing state and setting it as the antioxidant atmosphere which removed the residual oxygen in a melting tank, a sealing state can be cancelled | released and a non-oxidizing gas can be distribute | circulated in a melting tank.

  In the solder supply apparatus and the solder supply method of the present invention, generation and growth of oxides in the melting tank can be suppressed, and ingot solder can be constantly supplied to the melting tank through the outlet. Combined with these, replacement of the melting tank and the number of maintenance operations can be reduced, and long-time operation becomes possible. In addition, high-quality solder with few impurities can be supplied.

  If the melting tank is equipped with a tank body and a guide body, oxygen can be prevented from entering the tank body, generation of oxides can be prevented, and higher quality solder can be supplied. Can do.

  When an opening / closing lid for opening and closing the outlet is provided and a vacuum means is provided in the melting tank, the residual oxygen in the melting tank can be quickly replaced with a non-oxidizing gas, and the apparatus can be operated efficiently. .

  If a crucible disposed below the melting tank is provided, high-quality solder can be supplied because it is difficult for oxide to be supplied to the crucible.

It is sectional drawing of the solder supply apparatus of 1st Embodiment of this invention. It is a principal part expanded sectional view of the solder supply apparatus of the said FIG. It is process drawing which shows the method of supplying ingot solder into a melting tank using the solder supply apparatus of the said FIG.

  Embodiments of the present invention will be described below with reference to FIGS.

  This solder supply device heats and melts the ingot solder supplied to the melting tank 1, discharges the molten solder L from the melting tank 1 and supplies the molten solder L to the crucible 42, for example, a lead frame or the like. The molten solder L is supplied to a mounting part (not shown).

  The solder supply apparatus of the present invention includes a melting part 90 having a melting tank 1 for melting solder, a supply part 91 having a crucible 42 for supplying molten solder L to a mounted part (not shown), and a crucible from the melting tank 1. And a supply path structure 92 for supplying the molten solder L to 42.

  The melting tank 1 constituting the melting part 90 includes a tank main body 1a made of a cylindrical body or a bottomed cylindrical body for storing the molten solder L, a lid member 1b for closing the opening of the tank main body 1a, and a tank main body 1a. It comprises a guide body 27 that is provided continuously and extends in the vertical direction. A heater 4 as the heating means 3 is disposed on the outer peripheral side of the tank body 1a.

  As shown in FIG. 1, a solder outlet 32 made of a through hole is formed at a substantially central portion of the bottom surface of the tank body 1a. The solder outlet 32 communicates with a vertical hole 70 of a supply path structure 92 described later.

  The solder outlet 32 is opened and closed via a vertical rod 33 disposed in the melting tank 1. The vertical rod 33 includes a large-diameter rod body 33a, and a tapered portion 33b is provided at the lower end of the rod body 33a. The vertical rod 33 can be changed between the raised state and the lowered state by the reciprocating mechanism 34. As the reciprocating mechanism 34, various reciprocating mechanisms such as a cylinder mechanism and a ball screw mechanism can be used. As the vertical rod 33 rises, the molten solder L in the melting tank can be pushed out of the melting tank 1.

  Three holes 20, 21, and 22 are provided in the lid member 1b. A non-oxidizing gas supply means 23 for supplying a non-oxidizing gas such as nitrogen or an inert gas into the melting tank 1 is provided at the opening end of the hole 20 outside the melting tank. Thereby, the hole 20 becomes the supply port 25 of the non-oxidizing gas. A vacuum means 24 for evacuating the inside of the melting tank 1 is provided at the opening end of the hole 21 outside the melting tank. The hole 22 is in an open state, and ingot solder is supplied to the tank body 1 a through the hole 22.

  As shown in FIG. 2, a guide body 27 extending upward is provided in the hole portion 22. The guide body 27 is formed of a cylindrical body, and the inner space of the guide body 27 and the hole 22 communicate with each other. The inner diameter and the total length of the guide body 27 can be set to various dimensions necessary for preventing oxygen outside the melting tank from entering the melting tank. An end of the guide body 27 on the side opposite to the melting tank serves as an outlet 28 for discharging the non-oxidizing gas from the melting tank 1. The outlet 28 is located above the hole 22 in the vertical direction. The outlet 28 is provided with an opening / closing lid 29 for opening and closing the outlet 28, and a ball valve is used as the opening / closing lid 29 in this embodiment.

  The supply unit 91 includes a crucible 42, and a heater 61 as a heating unit 60 is disposed on the outer peripheral side of the crucible 42. A nozzle 62 is attached to the bottom wall 64 of the crucible 42.

  The crucible 42 is provided with a pipe (not shown) connected via the vertical hole 70, and a pressure control means (not shown) is connected to the pipe. The pressure control means switches and controls the internal pressure of the crucible 42 between a positive pressure for discharging the molten solder L from the nozzle 62 and a negative pressure for stopping the discharge of the molten solder L from the nozzle 62. The pressure control means includes a gas supply system for supplying a pressurized gas (non-oxidizing gas) from a compressor (not shown) into the crucible so as to be positive pressure, and a vacuum pump (not shown) for appropriately vacuuming the inside of the crucible. Equipped with a gas suction system for negative pressure.

  The supply path structure 92 includes a fixed block body 73 having a vertical hole portion 70 communicating with the crucible 42 and having a horizontal hole portion 71 formed therein, and a moving block body 74. The moving block 74 moves the horizontal hole 71 in the horizontal direction by the reciprocating mechanism 75. The reciprocating mechanism 75 includes a horizontal rod 81 whose tip is connected to the moving block 74, and the rod 81 reciprocates in the directions of arrows A and B. As a mechanism for reciprocating the horizontal rod 81, various mechanisms such as a cylinder mechanism and a ball screw mechanism can be used.

  When the rod 81 of the reciprocating mechanism 75 extends in the direction of arrow A, the vertical hole portion 70 of the fixed block body 73 is blocked by the moving block body 74. When the rod 81 of the reciprocating mechanism 75 is contracted in the direction of arrow B, the vertical hole 70 of the fixed block body 73 is opened.

  A concave groove 84 is formed in a horizontal plane below the horizontal hole 71, and a sealing material 82 such as an O-ring is attached to the concave groove 84. Accordingly, as shown in FIG. 1, in the closed state in which the moving block body 74 has advanced, the sealing material 82 is crushed by the moving block body 74 and the concave circumferential groove 84, and the sealing performance of the crucible 42 can be improved. .

  Next, a solder supply method using the solder supply apparatus shown in FIG. 1 will be described with reference to FIG. FIG. 3 shows only the melting part 90 of the solder supply apparatus of the present invention. In the initial state, the supply path structure 92 is in a closed state in which the moving block body 74 has advanced as shown in FIG. The solder outlet 32 is in a closed state.

  As shown in FIG. 3A, the open / close lid 29 is closed and the inside of the melting tank is sealed. In this state, the non-oxidizing gas supply means 23 is operated to supply the non-oxidizing gas into the melting tank 1 from the supply port 25 as indicated by an arrow. Thereafter, as shown in FIG. 3B, the inside of the melting tank 1 is evacuated as shown by an arrow by operating the vacuum means 24. By repeating this several times, the residual oxygen in the melting tank 1 is removed and a non-oxidizing gas is supplied to form an oxidation preventing atmosphere.

  Next, as shown in FIG. 3C, the opening / closing lid 29 is opened, and the outlet 28 is in communication with the outside. At this time as well, the non-oxidizing gas supply means 23 is operating, and the non-oxidizing gas is circulated from the supply port 25 to the outlet 28. Thereby, as shown by the arrow in FIG. 3C, a non-oxidizing gas flow path is formed inside the tank body 1 a, and inside the guide body 27, the tank body 1 a side is connected to the outlet 28. A non-oxidizing gas flow path is formed.

  In this state, ingot solder is supplied from the outlet 28 to the melting tank 1. In this case, since the outlet 28 is positioned above the hole portion 22 in the vertical direction, the ingot solder falls into the tank body by its own weight. Then, the tank body 1 a is heated by the heater 4 to melt the ingot solder to obtain molten solder L. Since the non-oxidizing gas flows out from the inside of the melting tank 1 toward the outside at the outlet 28, air (oxygen) can be blocked from entering from the outside of the melting tank 1 to the inside through the outlet 28. Oxide generation can be suppressed.

  In order to supply the molten solder L to the crucible 42, as shown by an arrow B in FIG. 1, the moving block body 74 of the supply path structure 92 is retracted away from the fixed block body 73, and the vertical hole of the fixed block body 73 is The part 70 is an open body. In this state, the vertical rod 33 is raised and the molten solder L is discharged from the solder outlet 32. At this time, the molten solder L is supplied to the crucible 42 through the small diameter tip portion 33 c of the vertical rod 33.

  In the crucible 42, the molten solder L can be discharged from the nozzle 62 by internal pressure control by the pressure control means, and soldering to a member to be soldered such as a lead frame can be performed.

  In the present invention, when the molten solder L is discharged, the non-oxidizing gas is circulated from the supply port 25 to the outlet 28, so that the non-oxidizing gas is supplied into the melting tank even when the outlet 28 is open. Thus, the inside of the melting tank can be maintained in an oxidation-preventing atmosphere. Moreover, since the non-oxidizing gas flows out from the inside of the melting tank 1 toward the outside at the outlet 28, it is possible to block the entry of air (oxygen) inside from the outside of the melting tank 1. Thereby, it can suppress that the molten solder L in a melting tank oxidizes, can suppress generation | occurrence | production of an oxide in a melting tank, and can supply high quality solder with few impurities. Further, ingot solder can be constantly supplied to the melting tank through the outlet 28. Combined with these, replacement of the melting tank 1 and the number of maintenance operations can be reduced, and operation for a long time becomes possible.

  The melting tank 1 includes a tank body 1 a and a guide body 27 that is connected to the tank body 1 a and extends in the vertical direction. An opening on the side opposite to the tank body of the guide body 27 is used as an outlet 28. A non-oxidizing gas flow path to the opening of the guide body 27 is formed. Thereby, the opening part (communication port with the guide body 27) of the tank main body 1a is not exposed to the outside air, and oxygen can be prevented from entering the tank main body. Thereby, generation | occurrence | production of an oxide can be prevented and higher quality solder can be supplied.

  An opening / closing lid 29 for opening and closing the outlet 28 is provided, and a vacuum means 24 for bringing the melting tank 1 into a vacuum state is provided in the melting tank 1. Thereby, the inside of a melting tank can be made into a sealed state, the melting tank 1 can be made into a vacuum state, the residual oxygen in a melting tank can be rapidly replaced with a non-oxidizing gas, and an apparatus is operated efficiently. be able to.

  A crucible 42 is provided below the melting tank 1 to discharge the molten solder L to the mounted portion, and the molten solder L in the melting tank 1 is supplied to the crucible 42 while maintaining the oxidation-preventing atmosphere of the melting tank 1. To do. As a result, the molten solder L is further supplied to the crucible 42, and even if oxide is generated in the melting tank 1, the oxide can remain in the melting tank 1. Since it is difficult to supply, high quality solder can be supplied.

  In the second embodiment, the supply unit 91 and the supply path structure 92 in the above embodiment are omitted, and only the melting unit 90 is configured. In this case, a nozzle (not shown) is attached to the solder outlet 32, and the molten solder L is supplied from this nozzle to the mounted portion.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the length and inner diameter of the guide body 27 are various dimensions. be able to. In addition, the flow rate of the non-oxidizing gas is preferably a flow rate at which the entrance of oxygen at the outlet 28 can be suppressed, and can be various speeds. The guide body 27 preferably has a structure that extends upward in the vertical direction in order to cause the ingot solder to fall by its own weight, but it may extend upward obliquely. The opening / closing lid 29 may not be a ball valve, and various types such as a plug valve can be adopted. The opening / closing lid 29 may not be provided, and the outlet 28 may be always open.

  In the above embodiment, the ingot solder is supplied into the melting tank after the non-oxidizing gas flow path is formed in the melting tank in advance by setting the inside of the melting tank as an oxidation-preventing atmosphere, but these steps may be reversed. . That is, first, ingot solder is supplied into the melting tank. Thereafter, the open / close lid 29 is closed to seal the inside of the melting tank, and the non-oxidizing gas supply means 23 and the vacuum means 24 are operated to remove residual oxygen from the melting tank 1 and the guide body 27 and prevent oxidation. The atmosphere. Thereafter, with the non-oxidizing gas supply means 23 being operated, the open / close lid 29 is opened, and the non-oxidizing gas is circulated from the supply port 25 to the outlet 28 to form a non-oxidizing gas flow path. May be. The opening / closing lid 29 may be opened and closed manually or automatically.

  The tank body 1a is provided with an oxygen concentration meter capable of measuring the oxygen concentration inside the tank body 1a, and the non-oxidizing gas supply means 23 has a flow rate and supply amount of the non-oxidizing gas according to the value of the oxygen concentration meter. You may provide the control means which controls. That is, when oxygen enters from the outlet 28 or when the oxygen concentration in the tank body 1a is high due to the presence of residual oxygen, the non-oxidizing gas supply means 23 is immediately controlled to supply the non-oxidizing gas. The amount is increased and oxygen in the tank body 1a is discharged. Thereby, the inside of the tank main body a can be made into a non-oxidizing atmosphere correctly in real time.

DESCRIPTION OF SYMBOLS 1 Melting tank 1a Tank main body 23 Non-oxidizing gas supply means 24 Vacuum means 25 Supply port 27 Guide body 28 Exit 29 Opening / closing lid 42 Crucible L Molten solder

Claims (6)

In a solder supply apparatus for supplying ingot solder to a melting tank to be an oxidation-preventing atmosphere, heating and melting the ingot solder in the melting tank, and discharging the molten solder from the melting tank,
A non-oxidizing gas supply means for supplying a non-oxidizing gas into the melting tank and a vacuum means for evacuating the melting tank, and supplying the non-oxidizing gas into the melting tank. Providing an outlet for discharging the non-oxidizing gas in the melting tank to the outside of the melting tank,
Wherein the non-oxidizing gas supply means, Rutotomoni was circulated non-oxidizing gas to the outlet from the supply port by the vacuum means, by performing vacuuming the inside of the melting tank, reduce the residual oxygen in the molten bath A solder supply device for discharging molten solder while forming a flow path for supplying a non-oxidizing gas into the melting tank .   The melting tank includes a tank body and a guide body that is connected to the tank body and extends in the vertical direction. The opening on the side opposite to the tank body of the guide body serves as the outlet, and the guide body extends from the supply port. The solder supply device according to claim 1, wherein a non-oxidizing gas flow path to the opening is formed.   The solder supply device according to claim 1 or 2, wherein an opening / closing lid for opening and closing the outlet is provided, and a vacuum means for evacuating the melting tank is provided in the melting tank.   The crucible is disposed below the melting tank and discharges molten solder to the mounted portion, and the molten solder in the melting tank is supplied to the crucible while maintaining the oxidation preventing atmosphere of the melting tank. The solder supply apparatus of any one of Claims 1-3. In a solder supply method in which ingot solder is supplied to a melting tank to be an oxidation preventing atmosphere, ingot solder is heated and melted in the melting tank, and the molten solder is discharged from the melting tank.
While evacuating the inside of the melting tank, supplying non-oxidizing gas into the melting tank and reducing the residual oxygen in the melting tank ,
A solder supply method , wherein non-oxidizing gas is circulated from a supply port to an outlet, and molten solder is discharged in a state where a non-oxidizing gas channel is formed in a melting tank . The non-oxidizing gas is circulated in the melting tank after releasing the sealing state after setting the melting tank in a sealed state to form an antioxidant atmosphere from which residual oxygen in the melting tank is removed . Solder supply method.

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