JP5466400B2 - Mems装置のための機械的分離 - Google Patents
Mems装置のための機械的分離 Download PDFInfo
- Publication number
- JP5466400B2 JP5466400B2 JP2008327692A JP2008327692A JP5466400B2 JP 5466400 B2 JP5466400 B2 JP 5466400B2 JP 2008327692 A JP2008327692 A JP 2008327692A JP 2008327692 A JP2008327692 A JP 2008327692A JP 5466400 B2 JP5466400 B2 JP 5466400B2
- Authority
- JP
- Japan
- Prior art keywords
- isolator
- die
- package
- attached
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Description
12 パッケージ
14 アイソレータ
14’ アイソレータ
14” アイソレータ
15 衝撃止め具
16 周囲分離構造
17 レセプタクル
18 上部カバー
19 段付き凹部
20 パッケージカバー
22 ダイ
24 上部側
25 底部側
26 導電性取付装置
28 底部側
30 ワイヤボンディング棚部
32 角度付けされた棚部
40 過程
42 ブロック
44 ブロック
46 ブロック
Claims (3)
- 微小電気機械システム装置と、
ダイ(22)の第1の側で前記微小電気機械システム装置を支持するように構成されたダイ(22)と、
第1の側が前記ダイ(22)の前記第1の側に取り付けられたアイソレータ(14)と、
前記アイソレータ(14)の前記第1の側に取り付けられたパッケージ(12)と、
前記ダイ(22)を前記アイソレータ(14)に取り付け、前記アイソレータ(14)を前記パッケージ(12)に取り付けるように構成された導電性取付装置(26)とを備え、
前記アイソレータ(14)は、角度付けされた棚部(32)を含み、前記角度付けされた棚部(32)は、前記パッケージ(12)に対するダイ(22)の垂直位置の変更を可能にする、
装置(10)。 - 前記ダイ(22)に取り付けられた上部カバー(18)をさらに備えた、請求項1に記載の装置(10)。
- 微小電気機械システム装置をダイ(22)の第1の側に取り付けるステップと、
アイソレータ(14)の第1の側を前記ダイ(22)の前記第1の側に取り付けるステップと、
前記アイソレータ(14)の前記第1の側をパッケージ(12)に取り付けるステップとを含み、
前記アイソレータ(14)は、角度付けされた棚部(32)を含み、前記角度付けされた棚部(32)は、前記パッケージ(12)に対するダイ(22)の垂直位置の変更を可能にする、
方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/965,623 | 2007-12-27 | ||
US11/965,623 US7830003B2 (en) | 2007-12-27 | 2007-12-27 | Mechanical isolation for MEMS devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009154288A JP2009154288A (ja) | 2009-07-16 |
JP5466400B2 true JP5466400B2 (ja) | 2014-04-09 |
Family
ID=40379781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008327692A Expired - Fee Related JP5466400B2 (ja) | 2007-12-27 | 2008-12-24 | Mems装置のための機械的分離 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7830003B2 (ja) |
EP (1) | EP2075221B1 (ja) |
JP (1) | JP5466400B2 (ja) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103221333B (zh) | 2010-09-18 | 2017-05-31 | 快捷半导体公司 | 多晶片mems封装 |
US9278845B2 (en) | 2010-09-18 | 2016-03-08 | Fairchild Semiconductor Corporation | MEMS multi-axis gyroscope Z-axis electrode structure |
KR20130057485A (ko) | 2010-09-18 | 2013-05-31 | 페어차일드 세미컨덕터 코포레이션 | 미세 전자 기계 시스템에 미치는 응력을 감소시키기 위한 패키징 |
WO2012037539A1 (en) | 2010-09-18 | 2012-03-22 | Fairchild Semiconductor Corporation | Micromachined 3-axis accelerometer with a single proof-mass |
CN103221779B (zh) | 2010-09-18 | 2017-05-31 | 快捷半导体公司 | 微机械整体式六轴惯性传感器 |
WO2012037501A2 (en) | 2010-09-18 | 2012-03-22 | Cenk Acar | Flexure bearing to reduce quadrature for resonating micromachined devices |
EP2619536B1 (en) | 2010-09-20 | 2016-11-02 | Fairchild Semiconductor Corporation | Microelectromechanical pressure sensor including reference capacitor |
US9006846B2 (en) | 2010-09-20 | 2015-04-14 | Fairchild Semiconductor Corporation | Through silicon via with reduced shunt capacitance |
CN101920926B (zh) * | 2010-09-30 | 2012-11-28 | 无锡中微高科电子有限公司 | 一种不匹配封接应力释放结构 |
US9062972B2 (en) | 2012-01-31 | 2015-06-23 | Fairchild Semiconductor Corporation | MEMS multi-axis accelerometer electrode structure |
US8978475B2 (en) | 2012-02-01 | 2015-03-17 | Fairchild Semiconductor Corporation | MEMS proof mass with split z-axis portions |
US9488693B2 (en) | 2012-04-04 | 2016-11-08 | Fairchild Semiconductor Corporation | Self test of MEMS accelerometer with ASICS integrated capacitors |
US20130264755A1 (en) * | 2012-04-05 | 2013-10-10 | Honeywell International Inc. | Methods and systems for limiting sensor motion |
KR102058489B1 (ko) | 2012-04-05 | 2019-12-23 | 페어차일드 세미컨덕터 코포레이션 | 멤스 장치 프론트 엔드 전하 증폭기 |
US9069006B2 (en) | 2012-04-05 | 2015-06-30 | Fairchild Semiconductor Corporation | Self test of MEMS gyroscope with ASICs integrated capacitors |
EP2647955B8 (en) | 2012-04-05 | 2018-12-19 | Fairchild Semiconductor Corporation | MEMS device quadrature phase shift cancellation |
EP2647952B1 (en) | 2012-04-05 | 2017-11-15 | Fairchild Semiconductor Corporation | Mems device automatic-gain control loop for mechanical amplitude drive |
US9625272B2 (en) | 2012-04-12 | 2017-04-18 | Fairchild Semiconductor Corporation | MEMS quadrature cancellation and signal demodulation |
KR101999745B1 (ko) | 2012-04-12 | 2019-10-01 | 페어차일드 세미컨덕터 코포레이션 | 미세 전자 기계 시스템 구동기 |
DE102013014881B4 (de) | 2012-09-12 | 2023-05-04 | Fairchild Semiconductor Corporation | Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien |
US8931765B2 (en) | 2012-09-27 | 2015-01-13 | Honeywell International Inc. | Systems and methods for high frequency isolation |
EP2871456B1 (en) * | 2013-11-06 | 2018-10-10 | Invensense, Inc. | Pressure sensor and method for manufacturing a pressure sensor |
EP2871455B1 (en) | 2013-11-06 | 2020-03-04 | Invensense, Inc. | Pressure sensor |
DE102014210934A1 (de) * | 2014-06-06 | 2015-12-17 | Robert Bosch Gmbh | Vertikal hybrid integriertes MEMS-ASIC-Bauteil mit Stressentkopplungsstruktur |
US10023461B2 (en) | 2014-10-31 | 2018-07-17 | Stmicroelectronics S.R.L. | Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof |
EP3614115A1 (en) | 2015-04-02 | 2020-02-26 | InvenSense, Inc. | Pressure sensor |
CN104950137B (zh) * | 2015-06-23 | 2018-01-19 | 西安电子科技大学 | 具有应力隔离结构的横向敏感加速度传感器芯片 |
US10278281B1 (en) * | 2015-10-30 | 2019-04-30 | Garmin International, Inc. | MEMS stress isolation and stabilization system |
EP3444609A1 (en) | 2017-08-14 | 2019-02-20 | Sensirion AG | Measuring concentrations of a target gas |
US20190169018A1 (en) * | 2017-12-05 | 2019-06-06 | Invensense, Inc. | Stress isolation frame for a sensor |
US11225409B2 (en) | 2018-09-17 | 2022-01-18 | Invensense, Inc. | Sensor with integrated heater |
EP3969868A1 (en) | 2019-05-17 | 2022-03-23 | InvenSense, Inc. | A pressure sensor with improve hermeticity |
US11795052B2 (en) | 2020-09-29 | 2023-10-24 | Te Connectivity Solutions Gmbh | Constraint for a sensor assembly |
GB2624843A (en) | 2022-07-08 | 2024-06-05 | Autorient Tech As | Micromechanical devices and methods of manufacturing thereof |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6714105B2 (en) * | 2002-04-26 | 2004-03-30 | Motorola, Inc. | Micro electro-mechanical system method |
US6946742B2 (en) * | 2002-12-19 | 2005-09-20 | Analog Devices, Inc. | Packaged microchip with isolator having selected modulus of elasticity |
US20040041254A1 (en) * | 2002-09-04 | 2004-03-04 | Lewis Long | Packaged microchip |
US6768196B2 (en) * | 2002-09-04 | 2004-07-27 | Analog Devices, Inc. | Packaged microchip with isolation |
US7166911B2 (en) * | 2002-09-04 | 2007-01-23 | Analog Devices, Inc. | Packaged microchip with premolded-type package |
US20050189622A1 (en) * | 2004-03-01 | 2005-09-01 | Tessera, Inc. | Packaged acoustic and electromagnetic transducer chips |
JP4815756B2 (ja) * | 2004-05-21 | 2011-11-16 | パナソニック株式会社 | アクチュエータ |
JP4573695B2 (ja) * | 2005-04-27 | 2010-11-04 | 三洋電機株式会社 | マイクロマシンスイッチ |
US20070114643A1 (en) * | 2005-11-22 | 2007-05-24 | Honeywell International Inc. | Mems flip-chip packaging |
US7491567B2 (en) * | 2005-11-22 | 2009-02-17 | Honeywell International Inc. | MEMS device packaging methods |
US8129801B2 (en) * | 2006-01-06 | 2012-03-06 | Honeywell International Inc. | Discrete stress isolator attachment structures for MEMS sensor packages |
JP2007242462A (ja) * | 2006-03-09 | 2007-09-20 | Sanyo Electric Co Ltd | メカニカルスイッチ |
US20070246665A1 (en) * | 2006-04-20 | 2007-10-25 | Lafond Peter H | Mechanical isolation for mems devices |
US7280262B1 (en) * | 2006-05-24 | 2007-10-09 | Honeywell International Inc. | Integrated die level isolation for a MEMS device |
US8742557B2 (en) | 2007-06-19 | 2014-06-03 | Honeywell International Inc. | Die mounting stress isolator |
JP4851555B2 (ja) * | 2008-05-13 | 2012-01-11 | 株式会社デンソー | 力学量センサおよびその製造方法 |
-
2007
- 2007-12-27 US US11/965,623 patent/US7830003B2/en active Active
-
2008
- 2008-12-16 EP EP08171877.7A patent/EP2075221B1/en not_active Expired - Fee Related
- 2008-12-24 JP JP2008327692A patent/JP5466400B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7830003B2 (en) | 2010-11-09 |
EP2075221A3 (en) | 2013-05-29 |
EP2075221B1 (en) | 2015-12-16 |
JP2009154288A (ja) | 2009-07-16 |
EP2075221A2 (en) | 2009-07-01 |
US20090166827A1 (en) | 2009-07-02 |
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