JP5462010B2 - Optical module - Google Patents

Description

  The present invention relates to an optical module used for optical transmission.

  In recent years, a package used for an optical module having a transmission speed of about 10 Gbps has a structure in which a ceramic substrate is partially used and an electric signal is transmitted to the surface of or inside the ceramic substrate. Alumina and aluminum nitride are known as typical materials for the ceramic substrate. Both of them can form a transmission line with high accuracy inside and on the surface, and it is also possible to provide a small diameter via of about 100 to 200 microns Φ. A material having a dielectric loss of 0.01 or less and a low loss in terms of high frequency can be obtained relatively easily.

  An example of such an optical module is disclosed in Patent Document 1 and Patent Document 2.

  In Patent Document 1, transmission lines such as a high-frequency signal, a power source, and a ground are patterned on the main surface of the surface layer or the inner layer of the multilayer ceramic substrate. The ceramic substrates are stacked, and a pattern on one main plane and a pattern on another main plane are connected and connected by vias. Outside the package, lead pins are attached on this pattern.

  In Patent Document 2, a conductor pattern inside a package is connected to an external conductor pattern mainly by via conductors.

  In order to transmit a high-frequency signal without loss, the characteristic impedance of the transmission line needs to be kept constant, and is generally designed to be around 50 ohms. Therefore, a ground pattern or a ground via is arranged in the vicinity of the pattern and via that transmit a high-frequency signal.

JP-A-2005-252251 JP 2004-235379 A

However, the optical modules disclosed in Patent Documents 1 and 2 have the following problems.
(1) The ground conductor pattern on the ceramic multilayer substrate is composed of a thin film pattern of several tens of microns or less, and is connected to ground conductors arranged on other main planes by vias having a diameter of several hundred microns. . Therefore, the potential of the ground itself fluctuates and resonates at a specific frequency.
(2) The ceramic laminated substrate can be provided with a conductor pattern on the main plane, but it is difficult to provide a conductor pattern on the side surface. Therefore, high frequency noise is likely to be radiated from the side portion of the ceramic multilayer substrate. In particular, in an optical module used in optical communication, a ceramic multilayer substrate is exposed to the outside of the module as in the optical modules disclosed in Patent Documents 1 and 2. High-frequency noise is likely to be radiated from the side of such a ceramic laminate, and these noises jump out of the optical module and are emitted into the optical transceiver.

  The resonance of the ground pattern shown above is generally said to be caused when the length or outer edge of the pattern becomes 1/2 × N × λ (N: integer, λ: wavelength). It also depends on the pattern shape, signal pad, and via positional relationship. In the conventional optical module, these resonance frequencies are approximately 10 GHz or more. Therefore, in the signal transmission of about 10 Gbps, these resonances have not been a big problem. However, in recent years, an optical module and an optical transceiver corresponding to a transmission speed of about 20 Gbps and further about 40 Gbps have been required, and it is necessary to prevent electromagnetic field radiation from the optical module even in a high frequency range of 10 GHz or more. It came out.

  Such electromagnetic field radiation is disadvantageous for stable high-speed operation of the optical transceiver.

  An object of the present invention is to provide an optical module that can be stably operated at a high speed.

  The present application includes a plurality of means for achieving the above object. One example is the invention described in the claims.

  According to the present invention, it is possible to provide an optical module that can be stably operated at a high speed.

1 is a cross-sectional view illustrating a configuration of an optical module according to Example 1. FIG. It is sectional drawing which shows the cross-section along the A-A 'cutting line of the optical module of FIG. FIG. 6 is a cross-sectional view showing an optical module configuration of Example 2. It is sectional drawing which shows the cross-section along the B-B 'cut surface of the optical module of FIG. FIG. 6 is a cross-sectional view showing an optical module configuration of Example 3. FIG. 6 is a cross-sectional view showing an optical module configuration of Example 3. FIG. 6 is a cross-sectional view showing an optical module configuration of Example 4. It is sectional drawing which shows the cross-section along the C-C 'cut surface of the optical module of FIG. FIG. 6 is a cross-sectional view illustrating an optical module configuration of Example 5. FIG. 10 is a cross-sectional view showing a cross-sectional structure along the D-D ′ cut surface of the optical module of FIG. 9. 10 is a cross-sectional view showing an optical module structure of Example 6. FIG. 10 is a cross-sectional view showing an optical module structure of Example 7. FIG. FIG. 10 is a cross-sectional view showing an optical module structure of Example 8. FIG. 10 is a cross-sectional view illustrating an optical module configuration of Example 9. It is sectional drawing which shows the cross-section along the E-E 'cut surface of the optical module of FIG. It is sectional drawing which shows the optical module structure of Example 10. FIG. It is sectional drawing which shows the cross-section along the F-F 'cut surface of the optical module of FIG. FIG. 12 is a cross-sectional view showing an optical module structure of Example 11. FIG. 12 is a cross-sectional view showing an optical module structure of Example 11. It is sectional drawing which shows the optical module structure of Example 12. FIG. 21 is a cross-sectional view showing a cross-sectional structure along the G-G ′ cut surface of the optical module of FIG. 20. It is sectional drawing which shows the optical module structure of Example 13. It is a perspective view which shows the optical module for the effect verification of this invention by calculation. It is a graph containing the calculation result which verified the effect of the present invention. It is a graph containing the calculation result which verified the effect of the present invention.

  Hereinafter, embodiments will be described in detail with reference to the drawings. Outlines of representative ones of the inventions disclosed in the present application will be briefly described as follows.

  In the optical module disclosed in the present application, a part of a package is formed of a multilayer ceramic substrate, and a conductor pattern for transmitting a signal and a ground conductor are patterned inside or on the surface of the multilayer ceramic substrate. These packages for optical modules have a box shape or a coaxial shape. The conductor pattern includes not only a pattern patterned on the ceramic substrate but also a pattern in the ceramic substrate, a via and a through hole penetrating the ceramic substrate. The ground conductor pattern is a conductor pattern arranged close to the signal conductor pattern so as to maintain the characteristic impedance of the conductor pattern through which the high-frequency signal propagates. The area of the ground conductor pattern is the high-frequency signal. In many cases, it has a width several tens of times as large as the conductor pattern through which the light propagates. The ground conductor does not necessarily need to be electrically connected to a metal or a metal pattern covering the outside of the package or the casing of the optical transceiver.

  Further, in the above optical module, a second substrate having a conductor pattern that is electrically connected to the conductor pattern of the multilayer ceramic substrate and directly or via another conductor is attached. The optical module includes the second substrate and the package.

  Furthermore, the optical module includes a radio wave absorber or a radio wave shield disposed along at least a part of the signal conductor pattern of the multilayer ceramic.

  The optical module employing such a configuration can prevent the ground pattern on the ceramic substrate from resonating and prevent electromagnetic noise from being radiated by the radio wave absorber disposed along the ground conductor pattern of the ceramic substrate. It becomes possible. Further, the electromagnetic wave shield can prevent electromagnetic noise from being emitted from the vicinity of the optical module.

  Furthermore, in the optical module, the radio wave absorber and the radio wave shield are fixed to the members constituting the optical module near the ceramic substrate. Therefore, there is an advantage that the radio wave absorber and the radio wave shield are not easily detached over a long period of use.

  By applying the optical module using the above structure, an optical transceiver that stably operates at high speed can be provided.

  In all the drawings for explaining the following embodiments, those having the same function are not described repeatedly.

[Example 1]
FIG. 1 is a cross-sectional view illustrating a configuration of an optical module according to the first embodiment. For convenience, the coordinate axis is described, and the input / output direction of the optical signal is the Z axis.

  The substrate of the package constituting the optical module is composed of laminated ceramic substrates 0106, and the material is generally alumina, aluminum nitride, LTCC or the like. An optical element 0103 is mounted on the ceramic substrate 0106. Electrical coupling between the optical element 0103 and the conductor pad 0107 is made by a wire 0104. The optical element 0103 is a light emitting or light receiving element, and an optical signal to be received and emitted passes through a lens 0101 fixed to the lid 0102. A metal flange 0105 is provided on the ceramic substrate 0106, and a lid 0102 is fixed thereon. As described above, the optical element 103 is not exposed to outside air such as moisture, and deterioration with time is minimized. In addition, electronic elements such as an IC, a chip capacitor, and a resistor may be mounted on the ceramic substrate 0106.

  The conductor pad 0107 on the upper surface of the ceramic substrate 0106 and the conductor pad 0112 on the back surface are electrically connected by a via 0111, an inner layer pad 0130, and the like.

  The base material of the flexible substrate is constituted by a base film 0124, and polyimide, liquid crystal polymer, and the like are known as typical materials. The thickness of the base film 0124 is generally about several tens to 100 microns. On the base film 0124, a ground conductor pattern 0113 and a signal conductor pattern 0116 are patterned. In addition, patterns such as a power source, a monitor, a control signal, and a power source are also patterned on the base film 0124. A lead pin 0121 for power supply of the optical element passes through a through hole 0123 provided in the flexible substrate, and is fixed to the conductor pad 0123 by solder 0120. Here, the conductor pad is a conductor pattern intended to fix solder or the like in particular, but the conductor pad and the conductor pattern are essentially the same, and the same applies to other embodiments. The signal lead pin 0118 passes through the through hole 0119 and is fixed to the signal conductor pattern 0116 with the solder 0117. The printed circuit board 0127 is a member that constitutes an optical transceiver, on which electronic elements such as an IC, an LSI, a resistor, and a capacitor are mounted. In addition to the transmission line conductor pattern 0129 and the ground conductor pattern 0128, the printed circuit board 0127 is patterned with power supply, control, and other patterns. The conductor pattern 0129 is fixed to the pad 0114 on the flexible substrate by the solder 0126.

  FIG. 2 is a cross-sectional view taken along the XY plane including the line AA ′ of FIG. On the ceramic substrate 0106, a ground conductor pattern 0110, a signal conductor pad 0130, a power source, and a control conductor pad 0131 are patterned.

  Actually, when a high-frequency signal passes through the via 0111 or the signal conductor pad 0130, an electric force line is generated from the via 0111 or the conductor pad 0130 to a nearby conductor. In order to suppress the influence of the electric lines of force and improve the high frequency characteristics, the ground conductor pattern is placed close to the signal wiring. Also in the present embodiment, as shown in FIG. 2, the high-frequency signal conductor pad 0130 and the ground conductor pattern 0110 are close to each other.

  However, since the ground conductor pattern 0110 is also connected to other ground wirings (for example, the conductor pattern 0125) by vias, the potential is not always stable at a high frequency of several GHz or more. These potential fluctuations cause resonance and noise at a specific frequency. The radiated electromagnetic field at this time is concentrated on the outer edge of the ground conductor pattern 0110, depending on the shape, length, etc. of the conductor pattern 0110. Therefore, a part of the outer edge portion of the ground conductor pattern 0110 is made closer to the outer edge portion of the ceramic substrate 0106 than the other conductor pads 0131, and the radio wave absorber 0109 is placed in the same XY plane as the ground conductor pattern 0110. Placed and secured by ceramic substrate 106 with adhesive 0108. That is, as shown in FIG. 2, the radio wave absorber 0109 is arranged along the ground conductor pattern 0110 in the ceramic substrate 0106 in the A-A ′ cross section of FIG. Thereby, the resonance efficiency of the electromagnetic field concentrated on the outer edge of the ground conductor pattern 0110 can be reduced, and the resonance can be significantly suppressed.

  The material of the radio wave absorber 0109 is a solid composed of ferrite and carbon. For example, a material in which ferrite and carbon are dispersed in an organic material such as plastic is also used. The radio wave absorber 0109 may be directly fixed to the ceramic substrate 0106 with an adhesive 0108 as in this embodiment, but the radio wave absorber 0109 fixed to another member in the optical transceiver is attached to the ceramic substrate 0106. You may arrange | position so that it may contact.

  Returning to FIG. 1, a part of the radio wave absorber 0109 protrudes in the −Z-axis direction by a distance L1 from the ground conductor pattern 0125. This is because the electromagnetic field radiation concentrates on the outer edge of the ground conductor pattern 0125, and therefore the electromagnetic field concentrated on the outer edge of the ground conductor pattern 0125 is obtained by extending the radio wave absorber 0109 by the distance L1 in the −Z-axis direction. It becomes possible to reduce the resonance efficiency. That is, a part of the radio wave absorber 0109 is located on the same plane as the main plane of the ground conductor pattern 0125, so that the resonance efficiency can be lowered.

  As described above, according to the present embodiment, an optical module having an advantage that a radiated electromagnetic field due to resonance is reduced in an optical module using ceramic as a part of a package can be provided.

  FIG. 23 shows a simulation model for verifying the effect, and FIGS. 25 and 26 show graphs showing calculation results.

  FIG. 23 will be described. Conductive patterns 2407 are patterned on the front and back surfaces of a circular ceramic substrate 2406 having a diameter of 5.4 mmφ and a thickness of 1 mm. The relative permittivity of the ceramic substrate 2406 was 8.5, and the dielectric loss was negligibly small. The conductor pattern 2407 on the front and back surfaces is a ground conductor (ground) and is insulated from the signal. Two signal pads 2405 are provided, which are assumed to transmit differential signals. The signal on the front surface, the ground conductor pattern, and the pad are connected to the signal on the back surface and the ground conductor pattern by a via 2408. A flange 2401 is attached on the conductor pattern 2407 on the surface. The flange 2401 is made of metal and has a diameter of 6 mmφ and a thickness of 0.3 mm.

  A lead pin (not shown) having a diameter of 0.2 mm and a length of 1 mm is mounted on the signal and ground conductor pad on the back surface of the ceramic substrate 2406, and this lead pin is connected to the conductor pattern 2403 on the printed circuit board 2404. Has been. The printed circuit board 2404 has a relative dielectric constant of 3.2, a thickness of 0.2 mm, and a signal transmission length of 2 mm.

  FIG. 24 shows a signal transmission loss at a frequency of 0 to 30 GHz when the radio wave absorber 2402 is not disposed. A steep transmission loss of 1 dB or more is observed around 20 GHz. This is caused by the fact that energy is radiated to the outside by the resonance of the ground conductor pattern 2407.

  On the other hand, FIG. 25 shows signal transmission loss when the radio wave absorber 2402 is arranged. No large transmission loss is seen up to 0-30 GHz. That is, it can be seen that resonance in the conductor pattern 2407, which causes electromagnetic energy radiation to the outside, is suppressed.

  Thus, according to the present embodiment, an optical module that stably operates at high speed can be configured.

  1, 2, 23, 24, and 25 indicate the following configurations. 0101 is a lens, 0102 is a lid, 0103 is an optical element, 0104 is a wire, 0105 is a flange, 0106 is a ceramic substrate, 0107 is a conductor pad, 0108 is an adhesive, 0109 is a radio wave absorber, 0110 is a conductor pattern, and 0111 is a via. , 0112 is a conductor pad, 0113 is a ground pattern, 0114 is a conductor pad, 0115 is a through hole, 0116 is a conductor pattern, 0117 is solder, 0118 is a lead pin, 0119 is a through hole, 0120 is solder, 0121 is a lead pin, and 0122 is a through hole. Hole, 0123 is a conductor pad, 0124 is a base film, 0125 is a conductor pattern, 0126 is solder, 0127 is a printed circuit board, 0128 is a ground pattern, 0129 is a conductor pattern, 0130 is a conductor pad, 0131 is a conductor pad , 2401 flange 2402 wave absorber 2403 conductor pattern, the printed circuit board 2404, the signal pad 2405, 2406 ceramic substrate, 2407 is the conductor pattern, the 2408 is a via.

[Example 2]
FIG. 3 is a cross-sectional view illustrating a configuration of the optical module according to the second embodiment. 4 is a cross-sectional view of the optical module shown in FIG. 3 cut along an XY plane including a line BB ′. On the back surface of the laminated ceramic substrate 0305, a ground conductor pattern 0306, an optical element 0303 power source conductor pad 0318, ground conductor patterns 0320 and 0322, and a signal conductor pattern 0321 are patterned. Note that lead pins 0312 are fixed on the conductor pads 0318 and 0321. On the other hand, conductor patterns 0308 and 0319 are patterned on the base film 0309 constituting the flexible substrate. The radio wave absorber 0307 is sandwiched between a laminated ceramic substrate 0305 constituting a package and a base film 0309 constituting a flexible substrate. Further, by providing a hole 0323 in the radio wave absorber 0307 and passing the lead pin 0312 through the hole, the radio wave absorber 0307 may be detached from the optical module when the optical module is used for a long time. Has the advantage of not.

  The ground conductor pattern 0306 on the ceramic substrate 0305 and the ground conductor pattern 0308 on the base film 0308 are both likely to fluctuate in potential and easily resonate at a specific frequency. In the present optical module, the radio wave absorber 0307 is in proximity to or in contact with the conductor patterns 0306 and 0308, thereby having an effect of suppressing resonance.

Furthermore, since the resonance electromagnetic field generally has the property of being easily localized at the outer edge of the ground conductor pattern, a part of the radio wave absorber 0307 is arranged to extend from the conductor pattern 0308 by a distance L2 in the Y-axis direction. By arranging the conductor pattern 0305 so as to extend the distance L3 in the Y-axis direction, the effect of suppressing resonance is further increased. That is, the absorber 0307 is positioned in the normal direction (Z-axis direction) from the end of the main plane (XY plane) of the conductor pattern 0308, which has an advantage in suppressing resonance.
In addition, the code | symbol of FIG.3 and FIG.4 has shown the following structure. 0301 is a lens, 0302 is a lid, 0303 is an optical element, 0304 is a flange, 0305 is a ceramic substrate, 0306 is a conductor pattern, 0307 is a radio wave absorber, 0308 is a conductor pattern, 0309 is a base film, 0310 is a conductor pad, and 0311 is Solder, 0312 is a lead pin, 0313 is a through hole, 0314 is a transmission line pattern, 0315 is a ground pattern, 0316 is a through hole, 0317 is a conductor pad, 0318 is a conductor pad, 0319 is a conductor pattern, 0320 is a conductor pattern, and 0321 is a conductor A pad, 0322 is a conductor pattern, and 0323 is a hole.

[Example 3]
5 and 6 are cross-sectional views illustrating the configuration of the optical module according to the third embodiment.
In FIG. 5, the radio wave absorber 0503 is attached to the lid 0501 and the flange 0508 with an adhesive 0502. On the other hand, in FIG. 6, the radio wave absorber 0503 is attached to the base film 0507 with an adhesive 0502. A ceramic substrate 0518 has a conductor pattern 0505 forming a ground, and the main plane of the conductor pattern 0505 is parallel to the XY plane. There is a radio wave absorber 0503 on the same XY plane as the conductor pattern 0505 main plane. Accordingly, there is an advantage that the resonance efficiency of the resonance electromagnetic field localized at the outer edge of the ground conductor pattern 0506 is likely to be lowered.

  Thus, the radio wave absorber 0503 is not necessarily attached to the ceramic substrate 0518, and may be attached to other members in the optical transceiver. However, it is important that the radio wave absorber 0503 is close to the ground conductor pattern 0506 in the ceramic substrate 0518 in the optical transceiver. In particular, the radio wave absorber 0503 is optimally arranged so as to touch the ceramic substrate 0518. . Therefore, considering that the mounting accuracy and processing accuracy of the radio wave absorber are about several hundreds of microns, it is better to be directly mounted on one member of the optical module as shown in this embodiment.

  In addition, the code | symbol of FIG.5 and FIG.6 has shown the following structure. 0501 is a lid, 0502 is an adhesive, 0503 is a radio wave absorber, 0504 is a via, 0505 is a conductor pattern, 0506 is a conductor pad, 0507 is a base film, 0508 is a flange, 0509 is a conductor pattern, 0510 is a via, and 0511 is a conductor. Pattern, 0512 is solder, 0513 is a lead pin, 0514 is a conductor pad, 0515 is a conductor pad, 0516 is a conductor pattern, 0517 is a conductor pattern, and 0518 is a ceramic substrate.

[Example 4]
7 and 8 are cross-sectional views illustrating the configuration of the optical module according to the fourth embodiment. In FIG. 7, FIG. 8 is a view showing a cross section of the optical module in a plane CC ′ parallel to the XY plane. The wide conductor pattern 0706 is generally used as a ground conductor, and the pad 0728 having a small area is used for a signal, a power source and the like. A resonant electromagnetic field is likely to be generated at the outer edge of the grounding conductor pattern 0706. Therefore, the radio wave absorber 0707 is located on the same side in the XY plane as the grounding conductor pattern 0706 and is disposed so as to reduce the resonance efficiency of the resonance electromagnetic field. The radio wave absorber 0707 is formed with a notch so as to form a U shape, and in particular, the opening is smaller than the outer diameter of the ceramic substrate 0708. Therefore, the radio wave absorber 0707 has an advantage that it can be positioned stably without being close to or in contact with the ceramic substrate 0708 and falling off in the XY axis direction.

  Returning to FIG. 7, the flange 0705 protrudes by a distance L5 from the inner diameter of the radio wave absorber 0707. Further, the base film 0712 constituting the flexible substrate has a structure protruding by L6 from the inner diameter of the radio wave absorber 0707. That is, the members (here, the base film 0712 and the flange 0705) constituting the optical module are close to each other on the side of the radio wave absorber 0707 other than the surface close to the multilayer ceramic substrate 0708. Therefore, the radio wave absorber 0707 has a limited degree of freedom in the Z-axis direction, and can be positioned in the side direction of the ceramic substrate 0708. Therefore, the radio wave absorber 0707 has an advantage that it does not fall off in the Z-axis direction.

By the way, when the radio wave absorber 0707 is fixed, it is structured such that it is sandwiched between a member constituting the optical module package (here, flange 0705) and a member not constituting the optical module package (here, the base film 0712). There are significant advantages to this. For example, even if there are variations in the width of the radio wave absorber 0707 in the Z-axis direction, the radio wave absorber 0707 can be fixed with little backlash by changing the fixing position of the base film 0712 and the lead pin 0709 in the Z-axis direction. There is an advantage. Furthermore, the base film 0712 is one material of a flexible substrate with high flexibility. Therefore, when the lead pin 0709 is fixed with the solder 0711, the base film 0712 can be fixed to the radio wave absorber 0707 in a state of being pressed. That is, the radio wave absorber 0707 has a merit that it is fixed with less shaking. In addition, even when the radio wave absorber 0707 expands due to long-time use, the base film 0712 has a function of preventing the solder 0711 and the like from being broken due to the pressure due to the expansion.
This method of fixing the radio wave absorber 0707 can be applied even if the material is a radio wave shield.

  On the other hand, a cover film 0726 is bonded onto the base film 0712. This is to prevent the conductor pattern 0727 from corroding. Cover film 0726 is typically no greater than 100 microns. Therefore, the radio wave absorber 0707 does not directly contact the conductor pattern 0727, but the radio wave absorber 0707 can be sufficiently close to the conductor pattern 0727, and an unnecessary electromagnetic field that fluctuates the potential of the conductor pattern 0727 is generated. It is possible to attenuate the absorption. That is, it is preferable that the radio wave absorber 0707 is disposed so as to be in contact with the cover film 0726.

  In addition, the code | symbol of FIG.7 and FIG.8 has shown the following structure. 0701 is a lens, 0702 is a lid, 0703 is an optical element, 0704 is a wire, 0705 is a flange, 0705 is a conductor pattern, 0707 is a radio wave absorber, 0708 is a ceramic substrate, 0709 is a lead pin, 0710 is a conductor pad, 0711 is solder, 0712 is a base film, 0713 is a lead pin, 0714 is a through hole, 0715 is a conductor pattern, 0716 is a conductor pad, 0717 is a via pad, 0718 is a conductor pad, 0719 is a conductor pattern, 0720 is a through hole, 0721 is a conductor pad, 0722 is a conductor pad Solder, 0723 is a printed circuit board, 0724 is a conductor pattern, 0725 is a cover film, 0726 is a cover film, 0727 is a conductor pattern, and 0728 is a lead pin.

[Example 5]
9 and 10 are cross-sectional views illustrating the configuration of the optical module according to the fifth embodiment. FIG. 10 is a diagram showing a cross section of the optical module in a plane DD ′ parallel to the XY plane in FIG.

  The metal frame 0804 is a hollow frame, and the ceramic substrate 0816 is positioned in the hollow portion. The metal frame 0804 is sandwiched between the flange 0803 and the base film 0806. Therefore, the metal frame 0804 has a limited degree of freedom in the XYZ axis directions and is stably fixed. The flange 0803 is conductively fixed to the conductor pattern on the ceramic substrate 0816. The lead pins 0811 and 0813 are bonded to the conductor pads 0809 and 0812 with the solder 0810, whereby the position of the base film 0806 is fixed. Of course, the fixing method of the metal frame 0804 shown in the present embodiment can also be applied to the case of a radio wave absorber.

  The main plane of the grounded conductor pattern 0821 is in the XY plane, and the metal frame 0804 is located in the same XY plane. Thereby, even if the resonant electromagnetic field on the grounded conductor pattern 0821 is radiated, there is an advantage that it is shielded by the metal frame 0804.

  By the way, the flange 0803 is made of metal and is in contact with the metal frame 0804. Further, a grounded conductor pattern 0805 is in contact with the metal frame 0804 on the base film 0806. As a result, for example, even if the grounded conductor patterns 0821 and 0808 resonate and cause electromagnetic field radiation, the majority of the electromagnetic field radiated from the side of the ceramic substrate 0816 is mostly the metal frame 0804, the flange 0803, and the conductor pattern. It is shielded by 0805 and has an advantage that it is difficult to radiate outside the optical module.

  By the way, the metal frame 0804 may be processed in shape or the like so as to be electrically connected to the grounded conductor pattern 0808 on the ceramic substrate 0816. In this case, the ceramic substrate 0816 is not provided even if the conductor pattern 0805 is not provided. Electromagnetic field shielding from the side can be reduced.

  In addition, the code | symbol of FIG.9 and FIG.10 has shown the following structure. 0801 is a lid, 0802 is a lens, 0803 is a flange, 0804 is a metal frame, 0805 is a conductor pattern, 0805 is a base film, 0807 is a conductor pattern, 0808 is a conductor pattern, 0809 is a conductor pad, 0810 is a solder, 0811 is a lead pin, 0812 is a conductor pad, 0813 is a lead pin, 0814 is a through hole, 0815 is a conductor pad, 0816 is a ceramic substrate, 0817 is a conductor pad, 0818 is a conductor pad, 0819 is a wire, 0820 is an optical element, 0821 is a conductor pad, and 0822 is a conductor pad. It is a through hole.

[Example 6]
FIG. 11 is a cross-sectional view illustrating the configuration of the optical module according to the sixth embodiment. Vias 1109 and conductor pads 1117 for transmitting high-speed signals are disposed in the ceramic substrate 1104. Although not shown, a power supply for the optical device, bias vias, conductor pads, and the like are also arranged. Lead pins 1101 are connected on the conductor pads 1112 for high-speed signals. The lead pins 1101 are conductively fixed to the transmission line conductor pattern 1106 disposed on the printed circuit board 1107 by solder 1105.

  As described above, a part of the radio wave absorber 1102 is located between the flange 1103 and the printed circuit board 1107, and the radio wave absorber 1102 is fixed to the side of the ceramic substrate 1104. As described above, the radio wave absorber 1102 can be stably fixed as long as the radio wave absorber 1102 is fixed by being sandwiched between a part of the members constituting the optical module and the external member. However, in this case, the positional relationship between the member constituting the package and the external member needs to be fixed to each other. For example, in this embodiment, the lead pin 1101 and the conductor pattern 1106 are fixed by the solder 1105. ing.

  When a high-speed signal is transmitted to the via 1109 or the conductor pad 1117, the grounded conductor pattern 1111 may radiate a resonance electromagnetic field. However, the radio wave absorber 1102 is located close to the same XY plane as the main plane of the conductor pattern 1111, which has an effect of suppressing resonance efficiency and suppressing electromagnetic field radiation from the conductor pattern 1111. . The radio wave absorbers are preferably close to the ceramic substrate 1104, and in particular, it is better that the parts are in contact with each other.

In addition, the code | symbol of FIG. 11 has shown the following structure. 1101 is a lead pin, 1102 is a wave absorber, 1103 is a flange, 1104 is a ceramic substrate, 1105 is a solder, 1106 is a conductor pattern, 1107 is a printed circuit board, 1108 is a conductor pattern, 1109 is a via, 1110 is a conductor pad, and 1111 is a conductor. Pad 1112 is a conductor pattern, 1113 is a wire, 1114 is an optical element, 1115 is a lid, 1116 is a lens, and 1117 is a conductor pad.
[Example 7]
FIG. 12 is a cross-sectional view illustrating a configuration of an optical module according to the seventh embodiment. Grounded conductor patterns 1203 and 1204 are arranged in the ceramic substrate 1217. Vias 1218 and conductor pads 1219 in the ceramic substrate 1217 are for power supply and bias, and vias 1221 and conductor pads 1220 are for high-speed signal transmission. When high-speed signals pass through the vias 1221 and the conductor pads 1220, there is often a problem that a resonant electromagnetic field is likely to be generated in the ground conductor patterns 1203 and 1204 disposed on the ceramic substrate 1217. However, the radio wave absorber 1205 is positioned on the XY plane including the main planes of the conductor patterns 1203 and 1204, which has an effect of reducing the resonance efficiency.

  A part of the radio wave absorber 1205 is sandwiched between the flange 1202 and the base film 1206 from the Z-axis direction. As a result, the radio wave absorber 1205 can be fixed on the side of the ceramic substrate 1217.

In addition, the code | symbol of FIG. 12 has shown the following structure. 1201 is a lid, 1202 is a flange, 1203 is a conductor pattern, 1204 is a conductor pattern, 1205 is a radio wave absorber, 1206 is a base film, 1207 is a conductor pad, 1208 is solder, 1209 is a lead pin, 1210 is a conductor pattern, and 1211 is a lead pin. , 1212 is a solder, 1213 is a conductor pattern, 1214 is a through hole, 1215 is a conductor pattern, 1216 is a conductor pattern, 1217 is a ceramic substrate, 1218 is a via, 1219 is a conductor pad, 1220 is a conductor pattern, and 1221 is a via.
[Example 8]
FIG. 13 is a cross-sectional view illustrating an optical module configuration according to the eighth embodiment. A hole 1325 is opened in the radio wave absorber 1304, and a lead pin 1308 is disposed in the hole. Furthermore, the lead pin 1308 passes through a through hole 1326 formed in the base film, and is fixed to the conductor pad 1307 using solder 1309. As described above, the radio wave absorber 1304 can be sandwiched between the base film 1305 and the ceramic substrate 1319 and stably fixed.

  In the present embodiment, the main planes of the conductor patterns 1302 and 1303 are included in a certain XY plane. A part of the radio wave absorber 1304 is located close to the same XY plane including these main planes. In the conductor pattern 1303, the radio wave absorber 1304 is also positioned in the normal direction (Z-axis negative direction) of the main plane. Therefore, even if electromagnetic fields are localized on the outer edges of the conductor patterns 1302 and 1303, these electromagnetic fields are efficiently absorbed by the radio wave absorber 1304. Therefore, the generation of a resonant electromagnetic field from the outer edges of the conductor patterns 1302 and 1303 is suppressed.

  When the radio wave absorber 1304 is in contact with the ceramic substrate 1319, the generation of the resonant electromagnetic field can be most efficiently suppressed.

  Further, conductor patterns 1306 and 1310 are arranged on the base film 1305, and these and the wave absorber 1304 are close to or in contact with each other. Therefore, there is an advantage that noise on the conductor patterns 1306 and 1310 can be efficiently absorbed.

  In addition, the code | symbol of FIG. 13 has shown the following structure. 1301 is a lid, 1302 is a conductor pattern, 1303 is a conductor pattern, 1304 is a radio wave absorber, 1305 is a base film, 1306 is a conductor pattern, 1307 is a conductor pad, 1308 is a lead pin, 1309 is solder, 1310 is a conductor pattern, and 1311 is Conductor pattern, 1312 is a conductor pattern, 1313 is a conductor pattern, 1314 is a through hole, 1315 is a conductor pad, 1316 is a conductor pattern, 1317 is a conductor pad, 1318 is a via, 1319 is a ceramic substrate, 1319 is a flange, 1321 is a wire, 1322 is an optical element, 1323 is a hole, 1324 is a lead pin, 1325 is a hole, 1326 is a through hole, and 1327 is a through hole.

[Example 9]
14 and 15 are sectional views showing an optical module configuration of the ninth embodiment. The optical module shown in FIG. 14 is a box-type package 1502, which is often made of a ceramic multilayer substrate or metal. In FIG. 14, a metal package 1502 is shown. A light-transmitting substrate 1501 is attached to the package 1502, and the optical element 1503 mounted inside the package and an external fiber can be optically coupled. The light transmittance of the translucent substrate 1501 varies depending on the purpose of use, but is generally 20% or more. A lens 1507 attached to the lens holder 1508 plays a role of assisting optical coupling between the optical element 1503 and a fiber disposed outside the optical module. In FIG. 14, the optical element 1503 is mounted on the pedestal 1509. However, depending on the application, the optical element 1503 may be mounted on a ceramic substrate, and in some cases, further mounted on a Peltier element. In the optical module shown in FIG. 14, an IC 1505 is arranged in a package 1502, but may be placed on an external printed circuit board or the like depending on applications. In this embodiment, the IC 1505 is mounted on the relay board 1510. The relay substrate 1510 is made of a ceramic substrate or the like, but has a transmission line pattern patterned on the upper surface (not shown in FIG. 14). The optical element 1503, the IC 1505, the conductor pattern 1506 on the ceramic substrate 1511, and the electrode pad on the relay substrate 1510 are connected by a wire 1504. A conductor pattern 1506 is metallized on the ceramic 1511 to electrically connect the inside and the outside of the package 1502. The conductor pattern 1512 is grounded. In the case of a high-frequency transmission line, the conductor pattern 1506 is designed to have a specific characteristic impedance such as a 50 ohm system. Lead pins 1518 are connected on the conductor pattern 1506, and the lead pins 1518 are conductively fixed to the conductor pattern 1520 on the base film 1521 by solder 1519. The conductor pattern 1517 is a ground conductor, and the transmission line conductor pattern 1520 is a high-frequency transmission line having a characteristic impedance of about 50 ohms. Of course, it is possible to change the characteristic impedance depending on the application, but in this case, the characteristic impedance is designed to be approximately the same as the characteristic impedance of the transmission line connected before and after. The transmission line 1520 is electrically connected to the conductor pad 1516 through the through hole 1522. A part of the conductor pad 1516 and the transmission line 1520 is conductively fixed to the conductor pattern on the printed circuit board in the optical transceiver.

  When a high-frequency signal flows through the conductor pattern 1506, the potential of the grounding conductor pattern 1512 patterned on the ceramic substrate 1511 fluctuates, and when the conductor pattern 1512 satisfies the resonance condition, a resonance electromagnetic wave is generated on the outer edge of the conductor pattern 1512. A field is generated and emitted outside the optical module. Such resonant electromagnetic field radiation often causes malfunction of the optical transceiver. Therefore, in this embodiment, the radio wave absorber 1513 is bonded to the conductor pattern 1512 with the adhesive 1514. In particular, in this embodiment, the radio wave absorber 1513 is disposed so as to extend in the −Z-axis direction from the conductor pattern 1514 by the length of L7. In such a case, there is an advantage that the radio wave absorber 1513 efficiently absorbs the resonance electromagnetic field generated at the outer edge of the conductor pattern 1512.

  FIG. 15 is a cross-sectional view taken along the XY plane including the line E-E ′ in FIG. 14. A grounding conductor pattern 1526 is patterned on the ceramic substrate 1511 adjacent to the high-frequency signal transmission conductor pattern 1520. Conductive pattern 1526 is electrically connected to conductive patterns 1527 and 1512 by vias 1525. The conductor pattern 1524 is for a power source and a bias such as the optical element 1503 and the IC 1505. The radio wave absorber 1513 is bonded and fixed on the conductor pattern 1512 with an adhesive 1514 in order to efficiently absorb the resonance electromagnetic field generated in the conductor pattern 1512. In particular, the radio wave absorber 1513 is disposed longer than the outer end of the conductor pattern 1512 by the length of L8 in the X-axis direction. This has the advantage that the resonant electromagnetic field that tends to occur at the outer edge of the conductor pattern 1512 can be efficiently absorbed.

  The radio wave absorber 1528 is fixed to the side surface of the ceramic substrate 1511 with an adhesive 1514. This has an advantage that a resonant electromagnetic field generated in the internal grounded conductor pattern 1527 can be efficiently absorbed. The radio wave absorber 1528 is longer by the distance L9 and is arranged in the −Y axis direction than the conductor pattern 1512. This has the advantage that the resonant electromagnetic field that is likely to be generated at the outer edge of the conductor pattern 1512 can be efficiently absorbed.

In addition, the code | symbol of FIG.14 and FIG.15 has shown the following structure. 1501 is a translucent substrate, 1502 is a package, 1503 is an optical element, 1504 is a wire, 1505 is an IC, 1506 is a conductor pattern, 1507 is a lens, 1508 is a lens holder, 1509 is a base, 1510 is a relay substrate, 1511 is a ceramic substrate Substrate, 1512 is a conductor pattern, 1513 is a radio wave absorber, 1514 is an adhesive, 1515 is a through hole, 1516 is a conductor pad, 1517 is a conductor pattern, 1518 is a lead pin, 1519 is a solder, 1520 is a conductor pattern, 1521 is a base film , 1522 is a through hole, 1523 is a conductor pad, 1524 is a conductor pattern, 1525 is a via, 1526 is a conductor pattern, and 1527 is a conductor pattern.
[Example 10]
16 and 17 are cross-sectional views illustrating the configuration of the optical module according to the tenth embodiment. The optical module shown in FIG. 16 is configured by a box-type package 1704. An optical element 1706 is mounted in the package 1704. In FIG. 16, an IC or the like is not described in the package 1704, but this is due to the usage method of the optical element 1706. For example, when the optical element 1706 is a light emitting element, an IC that drives the optical element 1706 is often mounted on a printed circuit board in the optical transceiver. The conductor pads on the printed circuit board are often connected to the conductor pads 1722 by solder. Conductive pads (not shown in FIG. 16) on the optical element 1706, conductive pads (not shown in FIG. 16) on the ceramic substrate 1703, and conductive patterns 1709 on the ceramic substrate 1710 are connected and connected by wires 1707. Yes.

  A lead pin 1717 is conductively fixed to the conductor pattern 1709 on the ceramic substrate 1712. Further, the lead pin 1717 penetrates through a through hole 1718 provided in the base film, and is electrically connected and fixed to a part of the conductor pattern 1718 by solder 1716.

  A part of the radio wave absorber 1712 is sandwiched between the base film 1714 and the package 1704 in the Z-axis direction, and the radio wave absorber 1712 is stably fixed in proximity to or in contact with the ceramic substrate 1710. In this way, the radio wave absorber 1712 can be stably fixed if a part of the Z-axis direction is sandwiched between two members of the package 1704, the ceramic substrate 1710, and the base film 1714. Become.

  The conductor pattern 1711 is a ground conductor, and is close to or in contact with the radio wave absorber 1712. Thereby, it is possible to prevent the potential of the ground conductor pattern from fluctuating and generating a resonant electromagnetic field.

  In FIG. 16, a cross-sectional view in the XY plane including the line FF ′ is shown in FIG. On the ceramic substrate 1710, conductor patterns 1724 and 1711 for ground conductors, lead pins 1723, and vias 1727 are disposed in addition to conductor patterns 1709 for signal transmission and lead pins. Further, a conductor pattern 1725 and a lead pin 1726 are arranged to supply a bias for the optical element 1706, a power source for control, and the like.

The radio wave absorber 1712 is provided with holes therein, and a part of the ceramic substrate 1710 is located there. The hole is provided with a recess 1728, which prevents the radio wave absorber from attenuating the high-frequency signal passing through the signal conductor pattern 1709. The radio wave absorber 1712 is disposed so as to be in contact with a part of the conductor pattern 1711 on the ceramic substrate 1710.
This is because when a high-frequency signal flows through the conductor pattern 1709, the potential of the ground conductor pattern 1711 fluctuates, and further, resonance occurs near a specific frequency, and a resonance electromagnetic field is easily emitted. However, since the radio wave absorber 1712 is arranged in contact with and close to the grounded conductor pattern 1711, the radio wave absorber 1712 has an effect of absorbing radio waves and reducing their resonance efficiency.

  By the way, the radio wave absorber 1712 is also in contact with the lead pin 1725. In some cases, the conductor pattern 1726 may also be contacted. This has the effect of absorbing noise on the conductor pattern 1726 and the lead pin 1725 and preventing the bias and the potential of the power source from fluctuating.

  Returning to FIG. 16, the radio wave absorber 1712 is in contact with or close to the package 1704 made of metal and the conductor pattern 1713 on the base film 1714. As a result, it is possible to suppress the noise on the package 1704 and the conductor pattern 1713 and the occurrence of resonance electromagnetic field radiation.

  As described above, in an optical module partially composed of a ceramic substrate, it is possible to sandwich a radio wave absorber between a part of an optical module package, a ceramic substrate, and an external transmission line substrate (flexible substrate). In addition to stably arranging and fixing the radio wave absorber, it also has an advantage of efficiently preventing high frequency noise.

In addition, the code | symbol of FIG.16 and FIG.17 has shown the following structure. 1701 is a translucent substrate, 1702 is a lens, 1703 is a ceramic substrate, 1704 is a package, 1705 is a lens holder, 1706 is an optical element, 1707 is a wire, 1708 is a base, 1709 is a conductor pattern, 1710 is a ceramic substrate, 1711 is 1712 is a conductor pattern, 1714 is a base film, 1715 is a conductor pad, 1716 is solder, 1717 is a lead pin, 1718 is a through hole, 1719 is a conductor pattern, 1720 is a conductor pattern, and 1721 is a through pattern. Holes 1722 are conductor pads, 1723 are lead pins, 1724 are conductor patterns, 1725 are lead pins, 1726 are conductor patterns, 1727 are vias, and 1728 are recesses.
[Example 11]
18 and 19 are cross-sectional views showing the optical module configuration of Example 11. FIG. Both show cross-sectional views of the ceramic substrate protruding from the package of the optical module.

  It demonstrates from FIG. On the ceramic substrate, the conductor pattern 1906 is for high-frequency transmission, and the signal propagation direction is approximately the Z-axis direction. Conductive patterns 1904 and 1911 are for ground conductors. The conductor pattern 1908 is for power supply and monitoring. When a high-frequency signal propagates through the conductor pattern 1906, fluctuations occur in the potential of the grounding conductor pattern 1904 or 1911. At certain frequencies, these fluctuations cause resonance and may be radiated to the outside as a resonant electromagnetic field. When resonance occurs, the resonance electromagnetic field tends to localize on the outer edge of the conductor pattern. Therefore, in FIG. 18, it can be seen that the radio wave absorber 1902 is disposed so as to touch the outer edge of the conductor pattern 1911. Further, the radio wave absorber 1902 is touched from above the lead pin 1903 to reduce resonance caused by the ground conductor. The radio wave absorber 1902 also touches the power supply and monitor lead pin 1907, which has the advantage of preventing noise on the power supply and monitor transmission path. Although not shown in FIG. 18, the radio wave absorber 1902 may have a shape that touches not only the lead pins 1903 and 1907 but also the conductor patterns 1904 and 1908.

  In FIG. 18, the radio wave absorber 1902 is not disposed in the positive Y-axis direction of the multilayer ceramic substrate 1909 from the conductor pattern 1906. This is to prevent the radio wave absorber 1902 from absorbing a high frequency signal as a signal.

  In FIG. 18, a metal frame 1901 is disposed outside the radio wave absorber 1902 so as to surround the ceramic substrate 1909 and the radio wave absorber 1902. This has an effect of preventing a radiation electromagnetic field that cannot be prevented by the radio wave absorber 1902 from jumping out from the vicinity of the optical module. Of course, the metal frame 1901 may be sandwiched and disposed between an optical module package, a ceramic substrate, and an external transmission line substrate (flexible substrate), and the metal frame 1901 can be stably disposed and fixed.

  The description of FIG. 19 will be given. The metal frame 1909 is provided with holes, and the multilayer ceramic substrate 1909 is located in the holes. That is, the ceramic multilayer ceramic substrate 1909 is surrounded by the metal frame 1901. This has the effect of shielding the electromagnetic field radiated from the conductor patterns 1904, 1906, 1908, 1911 on the ceramic substrate. Note that the metal frame 1901 is a ground conductor and has a shape capable of being in contact with the lead pin 1903 and the conductor pattern 1911. As a result, the potential fluctuation of the lead pin 1903 and the conductor pattern 1911 can be minimized. The metal frame 1901 may have a shape that can be brought into contact with not only the lead pin 1903 but also the conductor pattern 1904.

In addition, the code | symbol of FIG.18 and FIG.19 has shown the following structure. 1901 is a metal frame, 1902 is a radio wave absorber, 1903 is a lead pin, 1904 is a conductor pattern, 1905 is a lead pin, 1906 is a conductor pattern, 1907 is a lead pin, 1908 is a conductor pattern, 1909 is a ceramic substrate, 1910 is a via, 1911 is a conductor It is a pattern.
[Example 12]
FIG. 20 is a cross-sectional view illustrating an optical module configuration according to the twelfth embodiment. The package 2121 is a metal material package. In order to hermetically seal the optical element 2119 which is weak against moisture or the like, a portion through which an optical signal passes is a translucent substrate 2122 made of an inorganic material, and a portion through which an electrical signal passes. , A ceramic substrate 2115. The ceramic substrate 2115 is made of multiple layers, and a conductor pattern 2116 is patterned between the layers. A lead pin 2111 is fixed on the conductor pattern 2116 outside the package 2121. Lead pins 2126 are fixed to the conductor pattern 2112 on the back side of the ceramic substrate 2115. Conductive patterns 2110, 2102, 2113, conductive pads 2108, 2107, and the like are patterned on a flexible substrate using the base film 2109 as a base material. In addition, a through hole 2104 and the like are disposed as a transmission path connecting the front and back of the base film 2109 which is an insulator. The lead pin 2105 and the conductor pad 2107 are fixed by solder 2106. Further, the lead pin 2126 and the conductor pattern 2102 are also fixed by the solder 2103. As described above, the relative positions of the base film 2109, the package 2121 and the ceramic substrate 2115 are fixed.

  Now, the radio wave absorber 2114 is provided with a hollow hole, and a part of the ceramic substrate 2115 is located inside the hole. A part of the radio wave absorber is sandwiched between the package 2121 and the base film 2109 in the Z-axis direction. As described above, the radio wave absorber 2114 is fixed in the vicinity of the ceramic substrate 2115.

  FIG. 21 is a cross-sectional view of FIG. 20 taken along the XY plane including the line G-G ′. A conductor pattern 2116 for signal transmission and a conductor pattern 2130 for grounding are patterned on the upper surface of the ceramic substrate 2115, and a conductor pattern 2112 for grounding and a conductor pattern for power supply and control are formed on the back side of the ceramic substrate 2115. 2127 is patterned. On each conductor pattern, lead pins 2105, 2126, 2128, and 2131 are fixed. The radio wave absorber 2114 is in direct contact with the lead pins 2131 and 2126 for grounding and the lead pin 2128 for power supply and control, and maximizes the efficiency of absorbing unnecessary electromagnetic fields generated by potential fluctuations. . Of course, the radio wave absorber 2114 may have a shape in contact with the conductor pattern 2130 for grounding and the conductor pattern 2127 for power supply / control. The radio wave absorber 2114 is provided with a recess, and the radio wave absorber 2114 and the lead pin 2105 are separated from each other. This has the effect of preventing the radio wave absorber from absorbing the signal.

20 and 21 indicate the following configuration. 2101 is a through hole, 2102 is a conductor pattern, 2103 is a solder, 2104 is a through hole, 2105 is a lead pin, 2106 is a solder pad, 2107 is a conductor pad, 2108 is a conductor pad, 2109 is a base film, 2110 is a conductor pattern, and 2111 is a lead pin. 2112 is a conductor pattern, 2113 is a conductor pattern, 2114 is a radio wave absorber, 2115 is a ceramic substrate, 2116 is a conductor pattern, 2117 is a ceramic substrate, 2118 is a base, 2119 is an optical element, 2120 is a lens holder, 2121 is a package, 2122 is a translucent substrate, 2123 is a lens, 2124 is an IC, 2125 is a wire, 2126 is a lead pin, 2127 is a conductor pattern, 2128 is a lead pin, 2129 is a via, 2130 is a conductor pattern, 2131 is a lead Down, 2132 is a recess.
[Example 13]
FIG. 22 is a cross-sectional view of an optical transceiver including the optical module according to the thirteenth embodiment. The optical transceiver is configured such that an optical module including a ceramic substrate 2308 and a base film 2310, a printed circuit board 2317 mounted with an IC package 2320 and a connector 2330, and the like are included in a housing 2332.

  In the present embodiment, an example where the optical module is a coaxial type is shown. The radio wave absorber 2309 is fixed by being sandwiched in the Z-axis direction by a flange 2307 that forms part of the optical module base material and the ba film 2310. This absorbs the electromagnetic field radiated from the side portion of the ceramic substrate 2308, prevents resonance, etc., contributes to stable operation of the optical module, and prevents noise from being emitted into the housing 2332 of the optical transceiver. Is responsible.

  Conductive patterns 2313 and 2314 are patterned on the base film 2310 constituting the flexible substrate, and are fixed to the conductive pattern 2316 on the printed circuit board 2317 by solder 2315. The printed board 2317 is made of a multilayer board, and a conductor pattern 2318 and the like are patterned on the inner layer. The conductive patterns of the respective layers are connected and connected by vias 2319 and 2324, through holes, and the like. The electrical connector 2330 provides an electrical interface between the optical transceiver and the board in the transmission device. Although there are various electrical connector shapes and specifications, in this embodiment, the electrical connector 2330 has a through hole 2331, which is a female connector. When the optical transceiver shown in this embodiment is mounted on a transmission device, it is necessary to mount a male electrical connector on a board in the transmission device. The through hole 2331 is electrically connected to the conductor pad 2328 and is fixed to the conductor pad 2326 by solder 2327.

  In addition, the code | symbol of FIG. 22 has shown the following structure. 2301 is a fiber, 2302 is a sleeve, 2303 is a holder, 2304 is a lens, 2305 is a lid, 2306 is an optical element, 2307 is a flange, 2308 is a ceramic substrate, 2309 is a radio wave absorber, 2310 is a base film, 2311 is solder, 2312 Is a lead pin, 2313 is a conductor pattern, 2314 is a conductor pattern, 2315 is a solder, 2316 is a conductor pattern, 2317 is a printed circuit board, 2318 is a conductor pattern, 2319 is a via, 2320 is an IC package, 2321 is a heat dissipation gel, 2322 is solder, 2323 is a conductor pattern, 2324 is a via, 2325 is a via, 2326 is a conductor pad, 2327 is a solder, 2328 is a conductor pad, 2329 is a via, 2330 is a connector, 2331 is a through hole, and 2332 is a housing.

DESCRIPTION OF SYMBOLS 0101 ... Lens, 0102 ... Cover, 0103 ... Optical element, 0104 ... Wire, 0105 ... Flange, 0106 ... Ceramic substrate, 0107 ... Conductor pad, 0108 ... Adhesive, 0109 ... Radio wave absorber, 0110 ... Conductor pattern, 0111 ... Via , 0112 ... Conductor pad, 0113 ... Ground pattern, 0114 ... Conductor pad, 0115 ... Through hole, 0116 ... Conductor pattern, 0117 ... Solder, 0118 ... Lead pin, 0119 ... Through hole, 0120 ... Solder, 0121 ... Lead pin, 0122 ... Through Hole, 0123 ... Conductor pad, 0124 ... Base film, 0125 ... Conductor pattern, 0126 ... Solder, 0127 ... Printed circuit board, 0128 ... Ground pattern, 0129 ... Conductor pattern, 0130 ... Conductor pad, 0131 ... Conductor pad , 0301 ... lens, 0302 ... lid, 0303 ... optical element, 0304 ... flange, 0305 ... ceramic substrate, 0306 ... conductor pattern, 0307 ... radio wave absorber, 0308 ... conductor pattern, 0309 ... base film, 0310 ... conductor pad, 0311 Solder, 0312 ... Lead pin, 0313 ... Through hole, 0314 ... Transmission path pattern, 0315 ... Ground pattern, 0316 ... Through hole, 0317 ... Conductor pad, 0318 ... Conductor pad, 0319 ... Conductor pattern, 0320 ... Conductor pattern, 0321 ... Conductor pad, 0322 ... Conductor pattern, 0323 ... Hole, 0501 ... Cover, 0502 ... Adhesive, 0503 ... Radio wave absorber, 0504 ... Via, 0505 ... Conductor pattern, 0506 ... Conductor pad, 0507 ... Base film, 0508 ... Lange, 0509 ... Conductor pattern, 0510 ... Via, 0511 ... Conductor pattern, 0512 ... Solder, 0513 ... Lead pin, 0514 ... Conductor pad, 0515 ... Conductor pad, 0516 ... Conductor pattern, 0517 ... Conductor pattern, 0518 ... Ceramic substrate, 0701 ... Lens, 0702 ... Lid, 0703 ... Optical element, 0704 ... Wire, 0705 ... Flange, 0706 ... Conductor pattern, 0707 ... Radio wave absorber, 0708 ... Ceramic substrate, 0709 ... Lead pin, 0710 ... Conductor pad, 0711 ... Solder, 0712 ... Base film, 0713 ... Lead pin, 0714 ... Through hole, 0715 ... Conductor pattern, 0716 ... Conductor pad, 0717 ... Via, 0718 ... Conductor pad, 0719 ... Conductor pattern, 0720 ... Through hole, 0721 ... Conduct Body pads, 0722 ... Solder, 0723 ... Printed circuit board, 0724 ... Conductor pattern, 0725 ... Cover film, 0726 ... Cover film, 0727 ... Conductor pattern, 0728 ... Lead pin, 0801 ... Cover, 0802 ... Lens, 0803 ... Flange, 0804 ... Metal frame, 0805 ... Conductor pattern, 0806 ... Base film, 0807 ... Conductor pad, 0808 ... Conductor pattern, 0809 ... Conductor pad, 0810 ... Solder, 0811 ... Lead pin, 0812 ... Conductor pad, 0813 ... Lead pin, 0814 ... Through hole, 0815 ... Conductor pad, 0816 ... Ceramic substrate, 0817 ... Conductor pad, 0818 ... Conductor pad, 0819 ... Wire, 0820 ... Optical element, 0821 ... Conductor pad, 0822 ... Through hole, 1101 ... Lead pin, 1 DESCRIPTION OF SYMBOLS 02 ... Wave absorber, 1103 ... Flange, 1104 ... Ceramic substrate, 1105 ... Solder, 1106 ... Conductor pattern, 1107 ... Printed circuit board, 1108 ... Conductor pattern, 1109 ... Via, 1110 ... Conductor pad, 1111 ... Conductor pad, 1112 ... Conductor pattern, 1113 ... wire, 1114 ... optical element, 1115 ... lid, 1116 ... lens, 1117 ... conductor pad, 1201 ... lid, 1202 ... flange, 1203 ... conductor pattern, 1204 ... conductor pattern, 1205 ... radio wave absorber, 1206 ... Base film, 1207 ... Conductor pad, 1208 ... Solder, 1209 ... Lead pin, 1210 ... Conductor pattern, 1211 ... Lead pin, 1212 ... Solder, 1213 ... Conductor pattern, 1214 ... Through hole, 1215 ... Conductor pattern, 1216 ... Body pattern, 1217 ... Ceramic substrate, 1218 ... Via, 1219 ... Conductor pad, 1220 ... Conductor pattern, 1221 ... Via, 1301 ... Cover, 1302 ... Conductor pattern, 1303 ... Conductor pattern, 1304 ... Radio wave absorber, 1305 ... Base film DESCRIPTION OF SYMBOLS 1306 ... Conductor pattern, 1307 ... Conductor pad, 1308 ... Lead pin, 1309 ... Solder, 1310 ... Conductor pattern, 1311 ... Conductor pattern, 1312 ... Conductor pattern, 1313 ... Conductor pattern, 1314 ... Through hole, 1315 ... Conductor pad, 1316 ... Conductor pattern, 1317 ... Conductor pad, 1318 ... Via, 1319 ... Ceramic substrate, 1320 ... Flange, 1321 ... Wire, 1322 ... Optical element, 1323 ... Hole, 1324 ... Lead pin, 1325 ... Hole, 1326 ... Through-hole 1327 ... through hole, 1501 ... transparent substrate, 1502 ... package, 1503 ... optical element, 1504 ... wire, 1505 ... IC, 1506 ... conductor pattern, 1507 ... lens, 1508 ... lens holder, 1509 ... pedestal, 1510 ... Relay substrate, 1511 ... Ceramic substrate, 1512 ... Conductor pattern, 1513 ... Radio wave absorber, 1514 ... Adhesive, 1515 ... Through hole, 1516 ... Conductor pad, 1517 ... Conductor pattern, 1518 ... Lead pin, 1519 ... Solder, 1520 ... Conductor pattern, 1521 ... Base film, 1522 ... Through hole, 1523 ... Conductor pad, 1524 ... Conductor pattern, 1525 ... Via, 1526 ... Conductor pattern, 1527 ... Conductor pattern, 1701 ... Translucent substrate, 1702 ... Lens, 1703 ... cerami Substrate, 1704 ... package, 1705 ... lens holder, 1706 ... optical element, 1707 ... wire, 1708 ... pedestal, 1709 ... conductor pattern, 1710 ... ceramic substrate, 1711 ... conductor pattern, 1712 ... radio wave absorber, 1713 ... conductor pattern , 1714 ... base film, 1715 ... conductor pad, 1716 ... solder, 1717 ... lead pin, 1718 ... through hole, 1719 ... conductor pattern, 1720 ... conductor pattern, 1721 ... through hole, 1722 ... conductor pad, 1723 ... lead pin, 1724 ... Conductor pattern, 1725 ... Lead pin, 1726 ... Conductor pattern, 1727 ... Via, 1728 ... Recess, 1901 ... Metal frame, 1902 ... Radio wave absorber, 1903 ... Lead pin, 1904 ... Conductor pattern, 1905 ... Lead pin, 1 06 ... conductor pattern, 1907 ... lead pin, 1908 ... conductor pattern, 1909 ... ceramic substrate, 1910 ... via, 1911 ... conductor pattern, 2101 ... through hole, 2102 ... conductor pattern, 2103 ... solder, 2104 ... through hole, 2105 ... lead pin 2106: Solder, 2107 ... Conductor pad, 2108 ... Conductor pad, 2109 ... Base film, 2110 ... Conductor pattern, 2111 ... Lead pin, 2112 ... Conductor pattern, 2113 ... Conductor pattern, 2114 ... Radio wave absorber, 2115 ... Ceramic substrate, 2116 ... Conductor pattern, 2117 ... Ceramic substrate, 2118 ... Pedestal, 2119 ... Optical element, 2120 ... Lens holder, 2121 ... Package, 2122 ... Translucent substrate, 2123 ... Lens, 2124 ... IC, 2125 ... Wire, 2126 ... Lead pin, 2127 ... Conductor pattern, 2128 ... Lead pin, 2129 ... Via, 2130 ... Conductor pattern, 2131 ... Lead pin, 2132 ... Recess, 2301 ... Fiber, 2302 ... Sleeve, 2303 ... Holder, 2304 ... Lens, 2305 ... Cover, 2306 ... Optical element, 2307 ... Flange, 2308 ... Ceramic substrate, 2309 ... Radio wave absorber, 2310 ... Base film, 2311 ... Solder, 2312 ... Lead pin, 2313 ... Conductor pattern, 2314 ... Conductor pattern, 2315 ... Solder, 2316 ... Conductor pattern, 2317 ... Printed circuit board, 2318 ... Conductor pattern, 2319 ... Via, 2320 ... IC package, 2321 ... Thermal radiation gel, 2322 ... Solder, 2323 ... Conductor pattern, 2324 ... Via, 2325 ... Via, 326 ... Conductor pad, 2327 ... Solder, 2328 ... Conductor pad, 2329 ... Via, 2330 ... Connector, 2331 ... Through hole, 2332 ... Housing, 2401 ... Flange, 2402 ... Radio wave absorber, 2403 ... Conductor pattern, 2404 ... Print Substrate, 2405 ... Signal pad, 2406 ... Ceramic substrate, 2407 ... Conductor pattern, 2408 ... Via

Claims (13)

An optical element for transmission and reception;
A package storing the transmitting / receiving optical element;
A multilayer ceramic substrate comprising a conductor pattern for signal and a conductor pattern for ground, and for electrical connection inside and outside the package;
A second substrate disposed outside the package and electrically connected to the signal conductor pattern of the multilayer ceramic substrate; a radio wave absorber or radio wave shield fixed to a part of a member constituting the package; , equipped with a,
The ceramic substrate includes a first surface facing the package, a second surface opposite to the first surface and facing the second substrate, and the first surface and the second surface. have a third surface is a three-dimensional aspect to be,
The ground conductor pattern is disposed closer to the third surface than the conductor pattern,
The wave absorber or the radio wave shield that is disposed on the third surface side,
An optical module characterized by that.   The optical module according to claim 1, wherein the radio wave absorber and the radio wave shield are in contact with the multilayer ceramic substrate.   The material of the electromagnetic wave absorber is a first solid composed of ferrite and carbon, a second solid obtained by mixing the ferrite and carbon with an organic material, a third solid composed of a metal, or a metal such as an organic material. The optical module according to claim 1, wherein the optical module is any one of a fourth solid mixed with the above.   The optical module according to claim 1, wherein the radio wave absorber or the radio wave shield is fixed via an adhesive. 2. The optical module according to claim 1 , wherein a part of the members constituting the optical module is disposed adjacent to the first surface side of the multilayer ceramic substrate .   The radio wave absorber or the radio wave shield has a C shape in which a part of a circular arc of a cylinder is missing, and a part of the multilayer ceramic substrate is disposed inside the C shape. The optical module according to claim 1. The optical module according to claim 6 , wherein the radio wave absorber or the radio wave shield is disposed other than above the conductor pattern for signals on the surface layer of the multilayer ceramic substrate. The radio wave absorber or the radio wave shield has a cylindrical shape with holes,
The optical module according to claim 1, wherein a part of the multilayer ceramic substrate is disposed in the hole. The hole is provided with a recess,
9. The optical module according to claim 8 , wherein the recess is located above the signal conductor pattern on the surface of the multilayer ceramic substrate in the normal direction.   The radio wave absorber or the radio wave shield is disposed in contact with a ground conductor pattern on a surface layer or a back surface of the multilayer ceramic substrate, or is in contact with a conductor that is conductively fixed to the ground conductor pattern. The optical module according to claim 1, wherein the optical module is arranged. The radio wave absorber or the radio wave shield,
Arranged in contact with a part of the conductor pattern on the second substrate,
The optical module according to claim 1, wherein the optical module is disposed and contacted above an organic cover layer coated above a conductor pattern on the second substrate. Lead pins are provided on the multilayer ceramic substrate,
The second substrate is provided with a through hole or a hole,
2. The optical module according to claim 1, wherein the lead pin is inserted into the through hole or hole, and the lead pin and a part of the conductor pattern on the second substrate are fixed by solder. The optical module according to claim 1, wherein the second substrate is a flexible substrate.

Images