JP5461055B2 - 金含有めっき層の回収方法及び分析方法 - Google Patents
金含有めっき層の回収方法及び分析方法 Download PDFInfo
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- JP5461055B2 JP5461055B2 JP2009107801A JP2009107801A JP5461055B2 JP 5461055 B2 JP5461055 B2 JP 5461055B2 JP 2009107801 A JP2009107801 A JP 2009107801A JP 2009107801 A JP2009107801 A JP 2009107801A JP 5461055 B2 JP5461055 B2 JP 5461055B2
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- Prior art keywords
- plating layer
- gold
- containing plating
- recovering
- parts
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- 238000007747 plating Methods 0.000 title claims description 60
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 56
- 229910052737 gold Inorganic materials 0.000 title claims description 56
- 239000010931 gold Substances 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 37
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 18
- 229910017604 nitric acid Inorganic materials 0.000 claims description 18
- 239000007864 aqueous solution Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 238000011084 recovery Methods 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 description 9
- 229910001369 Brass Inorganic materials 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical group [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 239000000383 hazardous chemical Substances 0.000 description 4
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 4
- 238000004445 quantitative analysis Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Sampling And Sample Adjustment (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Description
(1)銅を含有する基材上に、金含有めっき層が形成された試料から前記金含有めっき層を剥離して回収する方法であって、前記試料を、1〜5部の60〜65%硝酸、1〜5部の30〜35%過酸化水素及び1〜5部の水の混合物である第1水溶液に浸漬して前記基材のみを溶解した後、前記金含有めっき層を回収することを特徴とする金含有めっき層の回収方法。
(2)銅を含有する基材上に、ニッケル含有下地層を介して金含有めっき層が形成された試料から前記金含有めっき層を剥離して回収する方法であって、前記試料を、1〜5部の60〜65%硝酸、1〜5部の30〜35%過酸化水素及び1〜5部の水の混合物である第1水溶液に浸漬して前記基材のみを溶解した後、第2水溶液(商品名「エンストリップ92液」;メルテックス株式会社製)に浸漬して前記ニッケル含有下地層のみを溶解し、その後、前記金含有めっき層を回収することを特徴とする金含有めっき層の回収方法。
(3)上記(1)または(2)に記載の回収方法で回収した金含有めっき層を分析することを特徴とする金含有めっき層の分析方法。
黄銅製基材にニッケル下地めっき層を介して、金めっき層を形成して試料を作製した。尚、試料における金めっき層の重量は約0.7gである。
Claims (3)
- 銅を含有する基材上に、金含有めっき層が形成された試料から前記金含有めっき層を剥離して回収する方法であって、
前記試料を、1〜5部の60〜65%硝酸、1〜5部の30〜35%過酸化水素及び1〜5部の水の混合物である第1水溶液に浸漬して前記基材のみを溶解した後、前記金含有めっき層を回収することを特徴とする金含有めっき層の回収方法。 - 銅を含有する基材上に、ニッケル含有下地層を介して金含有めっき層が形成された試料から前記金含有めっき層を剥離して回収する方法であって、
前記試料を、1〜5部の60〜65%硝酸、1〜5部の30〜35%過酸化水素及び1〜5部の水の混合物である第1水溶液に浸漬して前記基材のみを溶解した後、第2水溶液(商品名「エンストリップ92液」;メルテックス株式会社製)に浸漬して前記ニッケル含有下地層のみを溶解し、その後、前記金含有めっき層を回収することを特徴とする金含有めっき層の回収方法。 - 請求項1または2に記載の回収方法で回収した金含有めっき層を分析することを特徴とする金含有めっき層の分析方法。
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JP2009107801A JP5461055B2 (ja) | 2009-04-27 | 2009-04-27 | 金含有めっき層の回収方法及び分析方法 |
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JP2009107801A JP5461055B2 (ja) | 2009-04-27 | 2009-04-27 | 金含有めっき層の回収方法及び分析方法 |
Publications (2)
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JP2010256214A JP2010256214A (ja) | 2010-11-11 |
JP5461055B2 true JP5461055B2 (ja) | 2014-04-02 |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0813051A (ja) * | 1994-06-30 | 1996-01-16 | Hokkai Can Co Ltd | 金の収集方法 |
JP4000360B2 (ja) * | 2003-07-16 | 2007-10-31 | 荏原ユージライト株式会社 | 銅または銅合金上のニッケルまたはニッケル合金の剥離剤 |
JP2008224423A (ja) * | 2007-03-13 | 2008-09-25 | Fujitsu Ltd | めっき膜の分離方法、およびこの方法によって分離されためっき膜の分析方法 |
JP5305498B2 (ja) * | 2007-09-25 | 2013-10-02 | 矢崎総業株式会社 | ニッケルまたはニッケル合金めっき層の定量分析方法 |
JP5046963B2 (ja) * | 2008-01-10 | 2012-10-10 | 矢崎総業株式会社 | 銀めっき層の有害金属分析方法 |
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