JP5453585B2 - Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus - Google Patents

Description

The present invention relates to a liquid ejecting head that ejects liquid from a nozzle opening, a liquid ejecting head unit, and a liquid ejecting apparatus.

As an ink jet recording head that is a liquid ejecting head, for example, a pressure generation chamber communicating with a nozzle opening and a longitudinal direction one end side of the pressure generation chamber are provided across the short direction of the pressure generation chamber. A flow path forming substrate formed with a communication portion communicating with the chamber, a piezoelectric element formed on one surface side of the flow path forming substrate, and an adhesive agent on the surface of the flow path forming substrate on the piezoelectric element side Some have a reservoir forming substrate (protective substrate) that is joined and has a reservoir portion that forms a part of the reservoir together with the communication portion (for example, see Patent Document 1).

Japanese Patent Laying-Open No. 2005-219243 (FIGS. 3-5, pages 6-8)

However, due to the pressing force when bonding the flow path forming substrate and the protective substrate, the adhesive is thinned, the adhesive strength is reduced due to the insufficient adhesive in the bonding region, and the bonding region is insufficient due to the insufficient adhesive in the bonding region. Thus, there is a problem that the ink enters and the pressure generating means such as the piezoelectric element is destroyed.

In addition, the adhesive that protrudes from the joining area due to the pressing force adheres to the pressure generating means such as the piezoelectric element, and becomes a factor that hinders the deformation of the pressure generating means. There is a problem that problems such as clogging occur.

Such a problem exists not only in the ink jet recording head but also in a liquid ejecting head that ejects liquid other than ink.

SUMMARY OF THE INVENTION In view of such circumstances, the present invention improves a bonding force, and can suppress destruction due to liquid intrusion and prevention of an adhesive from becoming a foreign substance, a liquid ejecting head, a liquid ejecting head unit, and a liquid ejecting apparatus The purpose is to provide.

According to an aspect of the present invention for solving the above-described problem, a silicon oxide film is formed on one surface of a substrate on which a first flow path communicating with a nozzle opening for ejecting liquid is formed, and a piezoelectric element is disposed on the silicon oxide film side. A first substrate formed; and a second substrate having a second flow channel communicating with the first flow channel and having a silicon oxide film formed on one surface thereof; and The substrate and the second substrate each have a bonding region in which the silicon oxide film sides are bonded to each other via an adhesive, and the silicon oxide films are bonded to each other via an adhesive in the bonding region. Joined first
The bonding region is provided on the silicon oxide film side of the first substrate and has the same layer structure as the piezoelectric element and the wiring connected to the piezoelectric element, and at least the piezoelectric element and the wiring are electrically And a second bonding region provided with a laminate that is not connected to each other.
In such an aspect, by providing the laminate, it is possible to ensure the thickness of the adhesive in the second bonding region, improve the bonding strength, and suppress the intrusion of liquid through the bonding region.

Here, it is preferable that the laminated body is covered with the same layer structure as the wiring.
According to this, by covering the side surface of the laminate with the same layer structure as the wiring, the wiring is provided at the interface between the adhesive and the substrate. Can be suppressed.

According to another aspect of the invention, there is provided a liquid ejecting head unit having two or more liquid ejecting heads according to the above aspect.
In this aspect, it is possible to realize a liquid ejecting head unit with improved durability and reliability.

Furthermore, another aspect of the invention is a liquid ejecting apparatus including the liquid ejecting head according to the above aspect.
In this aspect, a liquid ejecting apparatus with improved durability and reliability can be realized.

Here, it is preferable to have two or more liquid jet heads. According to this, it is possible to realize a liquid ejecting apparatus that ejects different liquids.

FIG. 2 is an exploded perspective view of a recording head according to Embodiment 1 of the invention. 2A and 2B are a plan view and a cross-sectional view of the recording head according to Embodiment 1 of the invention. FIG. 3 is an enlarged cross-sectional view of a main part of the recording head according to Embodiment 1 of the invention. FIG. 5 is a cross-sectional view illustrating the method for manufacturing the recording head according to the first embodiment of the invention. FIG. 6 is a cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment of the invention. FIG. 6 is a cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment of the invention. FIG. 6 is a cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment of the invention. 1 is a schematic view of an ink jet recording apparatus according to an embodiment.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
1 is an exploded perspective view illustrating an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a cross-sectional view of FIG. As shown in the figure, the flow path forming substrate 10 as the first substrate of the present embodiment is made of a silicon single crystal substrate, and an elastic film 50 made of silicon dioxide previously formed by thermal oxidation is formed on one surface thereof. Has been. The flow path forming substrate 10 includes
A plurality of pressure generating chambers 12 as first flow paths are arranged in parallel in the width direction. In addition, an ink supply path 14 and a communication path 13 are partitioned by a partition wall in a region outside the longitudinal direction of the pressure generating chamber 12 of the flow path forming substrate 10.

A plurality of such flow path forming substrates 10 are integrally formed on a flow path forming substrate wafer, which is a silicon wafer. As will be described in detail later, a pressure generating chamber 12 and the like are provided on the flow path forming substrate wafer. After the formation, the flow path forming substrate wafer is formed by dividing.

Further, on the opening surface side of the flow path forming substrate 10, a nozzle plate 20 having a nozzle opening 21 communicating with the vicinity of the end portion of each pressure generating chamber 12 on the side opposite to the ink supply path 14 is provided with an adhesive or It is fixed via a heat welding film or the like. The nozzle plate 20 is made of glass ceramics, a silicon single crystal substrate, stainless steel, or the like.

On the other hand, on the side opposite to the opening surface of the flow path forming substrate 10 as described above, the elastic film 5 is provided.
0 is formed on the elastic film 50, for example, an insulator film 55 made of zirconium oxide.
Is formed. Further, the first electrode 60, the piezoelectric layer 70, and the second electrode 80 are laminated on the insulator film 55 by a process described later to constitute the piezoelectric element 300.
In this embodiment, the piezoelectric element 300 is formed on the elastic film 50, which is a silicon oxide film, via the insulator film 55, but the piezoelectric element 300 is formed on the silicon oxide film side. In the case where the piezoelectric element is formed directly on the silicon oxide film, another film (insulator film 55 in this embodiment) is formed on the silicon oxide film, and the piezoelectric element 300 is formed on the other film. It also includes the ones. Here, the piezoelectric element 300 refers to a portion including the first electrode 60, the piezoelectric layer 70, and the second electrode 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In this case, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion 320. In the present embodiment, the first electrode 60 is a common electrode of the piezoelectric element 300, and the second electrode 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for the convenience of the drive circuit and wiring.
In either case, the piezoelectric active part 320 is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and a vibration plate that is displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator. In the above example, the elastic membrane 50,
The insulator film 55 and the first electrode 60 act as a diaphragm, but of course, the present invention is not limited to this. For example, without providing the elastic film 50 and the insulator film 55, only the first electrode 60 is a diaphragm. You may make it act as. Further, the piezoelectric element 300 itself may substantially serve as a diaphragm.

The piezoelectric element 300 is covered with a protective film 200 made of an insulating material having moisture resistance. In the present embodiment, the protective film 200 covers the side surface of the piezoelectric layer 70, the side surface of the second electrode 80, and the peripheral edge of the upper surface, and is continuously provided across the plurality of piezoelectric elements 300.
That is, the main part, which is a substantially central region on the upper surface of the second electrode 80, is not provided with the protective film 200, but is provided with the opening 201 that opens the main part of the upper surface of the second electrode 80.

The opening 201 penetrates the protective film 200 in the thickness direction and opens in a rectangular shape along the longitudinal direction of the piezoelectric element 300. For example, the protective film 20 extends over the entire surface of the flow path forming substrate 10.
After forming 0, it can be formed by selective patterning.

By covering the piezoelectric element 300 with the protective film 200 in this way, it is possible to prevent the piezoelectric element 300 from being destroyed due to moisture in the atmosphere. Here, as a material of such a protective film 200, any material having moisture resistance may be used. For example, silicon oxide (SiOx),
Inorganic insulating materials such as tantalum oxide (TaOx), aluminum oxide (AlOx), or
An organic insulating material such as polyimide (PI) can be used.

Further, by providing the opening 201 in the protective film 200, the protective film 200 is made to have the piezoelectric element 30.
The ink ejection characteristics can be maintained satisfactorily without hindering zero displacement.

The protective film 200 may be provided so as to cover at least the surface of the piezoelectric layer 70 of the piezoelectric element 300. A protective film is provided for each piezoelectric element 300 and is discontinuous across the plurality of piezoelectric elements 300. You may do it.

A lead electrode 90 is provided on the protective film 200. In the present embodiment, the lead electrode 90 is, for example, an adhesion layer 91 made of nickel-chromium provided on the protective film 200.
And a conductive layer 92 made of gold (Au) or the like provided on the adhesion layer 91. One end of the lead electrode 90 is connected to the second electrode 8 through the communication hole 202 provided in the protective film 200.
0, and the other end extends to the side opposite to the ink supply path 14 of the flow path forming substrate 10, and the extended front end is a drive circuit 120 that drives a piezoelectric element 300 to be described later. They are connected via connection wiring 121.

In addition, a piezoelectric element holding portion 31 having a space that does not hinder the movement of the piezoelectric element 300 is provided in a region facing the piezoelectric element 300 on the surface on the piezoelectric element 300 side on the flow path forming substrate 10. A protective substrate 30 as a second substrate is bonded via an adhesive 35. In addition, the piezoelectric element holding part 31 should just have the space of the grade which does not damage the motion of the piezoelectric element 300, and the said space may be sealed or may not be sealed.

The piezoelectric element holding portion 31 of the protective substrate 30 is provided with a size that exposes the end of the lead electrode 90, and the end of the lead electrode 90 exposed from the protective substrate 30 is driven via the wiring 121. The circuit 120 is connected. In addition, examples of the material of the protective substrate 30 include glass, ceramic material, metal, resin, and the like, but it is more preferable that the material is substantially the same as the coefficient of thermal expansion of the flow path forming substrate 10. In this embodiment, the silicon single crystal substrate made of the same material as the flow path forming substrate 10 is used.

A protective substrate protective film 32 made of silicon dioxide formed by thermally oxidizing a silicon single crystal substrate is provided on the surface of the protective substrate 30. The protective substrate protective film 32 can also be used as a mask when the piezoelectric element holding portion 31 is formed on the protective substrate 30 by anisotropic etching.

Such a protective substrate 30 is bonded to the surface of the flow path forming substrate 10 on the piezoelectric element 300 side via an adhesive 35.

Here, as shown in FIG. 3, in the bonding region between the protective substrate 30 and the flow channel forming substrate 10, the flow channel forming substrate is provided in the bonding region S on the side of the communication channel 13 provided with the ink flow channel described later. 10 has the same layer structure as the piezoelectric element 300 and the wiring (the lead electrode 90 in this embodiment) connected to the piezoelectric element 300, but is not electrically connected to the piezoelectric element 300.
The first bonding region S1 provided with 0, the elastic film 50 made of silicon dioxide, and the second bonding region S2 in which the protective film 32 for the protective substrate is directly bonded by the adhesive 35.

That is, the bonding region S1 on the flow path forming substrate 10 is composed of the same layer as the first electrode 60, but from the same layer as the first electrode 60, the discontinuous first electrode stack 61, and the piezoelectric layer 70. The piezoelectric layer 70 is discontinuous with the piezoelectric layer stacking portion 71, and the second electrode 8 is formed of the same layer as the second electrode 80.
0 and a discontinuous second electrode laminated portion 81 are laminated. On the second electrode laminated portion 81, the protective film 200 is made of the same layer as the protective film 200, but is discontinuous with the protective film 200, and the adhesion layer 91 and the conductive layer 92 that constitute the lead electrode 90. The lead electrode laminated portion 93 (adhesive layer laminated portion 94 and conductive layer laminated portion 95) is made of the same layer as that of the lead electrode 90 but is discontinuous with the lead electrode 90.
And are provided.

The first electrode laminated portion 61, the piezoelectric layer laminated portion 71, the second electrode laminated portion 81, the protective film laminated portion 203, and the lead electrode laminated portion 93 constitute a laminated body 400. Specifically, the laminate 400 includes a first electrode laminate 61, a piezoelectric layer laminate 71, and a second electrode laminate 81.
The protective film stacking portion 203 and the lead electrode stacking portion 93 are sequentially stacked. The lead electrode stacking portion 93 extends from the protective film stacking portion 203 to the elastic film 50 so as to cover the side surface of the stacked body 400. ing.

In the second bonding region S2, the insulator film 55 on the flow path forming substrate 10 is removed, and the elastic film 50 is removed.
Are exposed, and the protective film 3 of the protective substrate 30 and the elastic film 50 of the flow path forming substrate 10 are protected.
2 are directly joined via an adhesive. That is, the flow path forming substrate 10 and the protective substrate 3
With 0, the elastic film 50 and the protective film 32 for protective substrates which are two silicon oxide films are directly joined through the adhesive 35.

The bonding region S of the first bonding region S1 and the second bonding region S2 is the second bonding region S2.
Is on the side of the reservoir 105, which is an ink flow path, and the first bonding region S1 is the piezoelectric element holding portion 31.
It is arranged to be on the side.

As described above, by providing the first bonding region S1 in which the stacked body 400 is provided in the bonding region S, the stacked body 400 secures a gap between the flow path forming substrate 10 and the protective substrate 30 in the second bonding region S2. In the second bonding region S2, the thickness of the adhesive 35 can be secured to improve the bonding strength. Further, by providing the stacked body 400, the adhesive 35 is allowed to move to the second bonding region S.
2, the amount of the adhesive 35 flowing out from the joining region S to the outer excess region can be reduced. As a result, it is possible to suppress problems such as a decrease in displacement of the piezoelectric element 300 due to the adhesion of excess adhesive 35 and clogging of the nozzle opening 21 due to the formation of foreign material in the adhesive.

Further, in the second bonding region S2, the bonding strength can be improved by directly bonding the elastic film 50, which is a silicon oxide film, and the protective film 32 for the protective substrate with the adhesive 35.
Incidentally, the adhesion between the silicon oxide films is higher than that when the insulator film 55 made of zirconium oxide is used, and the strength is higher than each layer or wiring layer constituting the other piezoelectric elements 300. .

Further, in the first bonding region S1, the first layer of the same layer as the piezoelectric element 300 is formed as the stacked body 400.
The electrode laminated portion 61, the piezoelectric layer laminated portion 71, and the second electrode laminated portion 81 are laminated, and the lead electrode laminated on the same layer as the lead electrode is formed so as to cover the side surface of the laminated body 400 and reach the flow path forming substrate 10. A portion 93 is provided. For this reason, in the laminate 400, substantially all of the region in contact with the adhesive 35 is the same layer as the lead electrode laminate portion 93, particularly the conductive layer 92 of gold (Au).
It has become. Thus, the adhesive force between the conductive layer laminate portion 95 made of gold (Au) and the adhesive 35 is strong, and the adhesive strength can be ensured. Further, even if the ink enters through the interface with the adhesive 35 of the flow path forming substrate 10 or the protective substrate 30, the conductive layer stacking portion 95 made of gold (Au) has the ink to the piezoelectric element holding portion 31 side. Can be suppressed, and the conductive layer stacking portion 95 can suppress ink from entering between the layers of the stacked body 400 to suppress delamination.

A sealing member 100 that is a separate member is provided on the communication path 13 side of the flow path forming substrate 10 and the protective substrate 30, and between the sealing member 100 and the flow path forming substrate 10 and the protective substrate 30. In addition, a communication part 15 communicating with the communication path 13 and a reservoir part 33 as a second flow path are defined. In the present embodiment, the reservoir portion 33 extends in the thickness direction to the side of the protective substrate 30 and communicates with the communication portion 15 of the flow path forming substrate 10 as described above, so that each pressure generating chamber 12 is connected. A reservoir 105 serving as a common ink chamber is configured. That is, in the present embodiment, since the inner side surface of the reservoir portion 33 is defined by the side surface of the protective substrate 30,
The reservoir portion 33 as the second flow path is formed on the protective substrate 30.

Further, on the upper side of the protective substrate 30 and the sealing member 100, the sealing film 4 is disposed so as to straddle them.
A compliance substrate 40 including 1 and a fixing plate 42 is joined. The sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm). The sealing film 41 seals one surface of the reservoir portion 33. Yes. The fixing plate 42 is formed of a hard material such as a metal such as stainless steel (SUS). Since the region of the fixing plate 42 facing the reservoir 105 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 105 is sealed only with a flexible sealing film 41. Has been.

Note that such an ink jet recording head takes in ink from an external ink supply means (not shown), fills the interior from the reservoir 105 to the nozzle opening 21, and then externally in accordance with a recording signal from a drive circuit (not shown). A voltage is applied between each of the first electrode 60 and the second electrode 80 corresponding to the pressure generating chamber 12 via the wiring, and the elastic film 50, the insulator film 55, the first electrode 60, and the piezoelectric layer 70 are connected. By deflecting and deforming, the pressure in each pressure generating chamber 12 is increased and ink droplets are ejected from the nozzle openings 21.

Hereinafter, a method for manufacturing the ink jet recording head according to the present embodiment will be described. 4 to 7 are diagrams for explaining the manufacturing process of the ink jet recording head, and are sectional views in the longitudinal direction of the pressure generating chamber.

First, as shown in FIG. 4A, a flow path forming substrate wafer 11 which is a silicon wafer.
0 is thermally oxidized in a diffusion furnace at about 1100 ° C., and a silicon dioxide film 52 constituting the elastic film 50 is formed on the surface thereof.

Next, as shown in FIG. 4B, a zirconium (Zr) layer is formed on the elastic film 50 (silicon dioxide film 52), and then thermally oxidized in a diffusion furnace at 500 to 1200 ° C., for example, to form zirconium oxide ( An insulator film 55 made of ZrO ₂ ) is formed. Further, the insulating film 55 in the region to be the second bonding region S2 is removed to expose the elastic film 50.

Next, as shown in FIG. 4C, for example, after the first electrode 60 is formed by laminating platinum and iridium on the insulator film 55, the first electrode 60 is patterned into a predetermined shape. At this time, a part of the first electrode 60 is left, and the first electrode stacked portion 61 constituting the stacked body 400 is simultaneously formed.

Next, as shown in FIG. 4D, for example, a piezoelectric layer 70 made of lead zirconate titanate (PZT) or the like and a second electrode 80 made of iridium (Ir), for example, are connected to the flow path forming substrate. The piezoelectric layer 300 is formed on the entire surface of the wafer 110, and the piezoelectric layer 70 and the second electrode 80 are patterned to form the piezoelectric elements 300 in the regions to be the pressure generation chambers 12. At this time, the piezoelectric layer 70 simultaneously
In addition, by leaving a part of the second electrode 80 on the first electrode laminated portion 61, the piezoelectric layer laminated portion 7.
1 and the second electrode laminated portion 81 are formed.

Next, as shown in FIG. 5A, the protective film 200 is formed over the entire surface of the flow path forming substrate 10, patterned into a predetermined shape, and the opening 201 and the communication hole 202 are formed. In addition, at this time, by leaving a part of the protective film 200 on the second electrode laminated portion 81 at the same time,
A protective film stack 203 is formed.

Next, as shown in FIG. 5B, lead electrodes 90 (adhesion layer 91 and conductive layer 92) are formed over the entire surface of the flow path forming substrate 10 and patterned for each piezoelectric element 300. At this time, a part of the lead electrode 90 is left on the second electrode laminate portion 81 at the same time, thereby forming the lead electrode laminate portion 93 (the adhesion layer laminate portion 94 and the conductive layer laminate portion 95), and the laminate 400.
Form.

Next, as shown in FIG. 5C, a protective substrate wafer 130 made of a silicon wafer and serving as a plurality of protective substrates 30 is placed on the piezoelectric element 300 side of the flow path forming substrate wafer 110 via an adhesive 35. Join. A piezoelectric element holding portion 31 is formed in advance on the protective substrate 30, and a protective film 32 for protective substrate is formed in advance. This flow path forming substrate wafer 11
0 and the protective substrate wafer 130 are bonded to each other in the bonding region S of the first bonding region S1 provided with the stacked body 400, the elastic film 50 that is a silicon oxide film, and the silicon oxide film. A second bonding region S <b> 2 in which the protective film 32 for the protective substrate is directly bonded with the adhesive 35 is formed. Since the laminated body 400 is provided in the first bonding region S1 of the bonding region S between the flow path forming substrate wafer 110 and the protective substrate wafer 130 at the time of bonding the both, in the second bonding region S2, The adhesive 35 having a thickness greater than or equal to the thickness of the stacked body 400 can be formed. Thereby, it is possible to secure the adhesive 35 in the bonding region S and improve the bonding strength, and to suppress the intrusion of ink through the bonding region S.

Note that the flow path forming substrate wafer 11 is formed by bonding the protective substrate wafer 130.
A zero stiffness will be significantly improved.

Next, as shown in FIG. 6A, the flow path forming substrate wafer 110 is thinned to a predetermined thickness. Next, as shown in FIG. 6B, a mask film 51 made of, for example, silicon nitride (SiN) is newly formed on the flow path forming substrate wafer 110 and patterned into a predetermined shape.

Then, the flow path forming substrate wafer 110 is anisotropically etched with an alkaline etching solution through the mask film 51, so that a pressure generating chamber is formed in the flow path forming substrate wafer 110 as shown in FIG. 6C. 12, a communication path 13, an ink supply path 14, and the like are formed.

Next, the flow path forming substrate wafer 110 and the protective substrate wafer 130 are divided into the size of one head chip as shown in FIG. 7A (becomes the flow path forming substrate 10 and the protective substrate 30). At this time, one side of the partition wall defining the communication portion 15 and the reservoir portion 33 does not need to be cut out from the flow path forming substrate wafer 110 and the protective substrate wafer 130. The degree can be increased.

Next, as shown in FIG. 7B, the nozzle plate 20 and the sealing member 100 are bonded and fixed to the flow path forming substrate 10 and the protective substrate 30 corresponding to each head chip, and further, the protective substrate 30 and the sealing substrate 30 are sealed. By joining the compliance substrate 40 so as to straddle the stop member 100 and sealing the upper side of the reservoir portion 33, the communication portion 15 and the reservoir portion 33 described above are sealed, and the ink jet recording head of the present embodiment To do.

As described above, in the present embodiment, the sealing member 100 that seals a part of the communication portion 15 and the reservoir portion 33 is provided as a separate member from the flow path forming substrate 10 and the protective substrate 30 that are formed from the wafer, for each head chip. Then, the number of wafers is increased and the cost can be reduced.

The sealing member 100 may be a member for sealing the communication portion 15 and the reservoir portion 33, but is preferably provided integrally with a case head that fixes the head chip. According to this, in the step of fixing the head chip to the case head, the communication portion 15 and the reservoir portion 33 can be sealed, and the number of steps can be omitted.

(Other embodiments)
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above. For example, in the first embodiment described above, the stacked body 400 is provided in the bonding region S between the piezoelectric element holding unit 31 and the reservoir 105 in the bonding region between the flow path forming substrate 10 and the protective substrate 30. The laminated body 400 only needs to be provided at least on the side of the reservoir 105 that is the ink flow path, and the laminated body 400 may be provided over the entire adhesion region around the piezoelectric element holding portion 31.

In the first embodiment described above, the ink jet recording head I in which the protective substrate 30 and the sealing member 100 are separate members is illustrated. However, the invention is not limited to this, and the protective substrate 30 and the sealing member 100 are not limited thereto. Even if the ink jet recording head is integrated, the same effect can be obtained by applying the present invention.

Further, the ink jet recording head of the first embodiment described above constitutes a part of a recording head unit including an ink flow path communicating with an ink cartridge or the like, and is mounted on the ink jet recording apparatus. FIG. 8 is a schematic view showing an example of the ink jet recording apparatus.

As shown in FIG. 8, ink jet recording head units (liquid ejecting head units) 1A and 1B having an ink jet recording head are provided with cartridges 2A and 2B constituting an ink supply means in a detachable manner. Head unit 1
The carriage 3 on which A and 1B are mounted is provided on a carriage shaft 5 attached to the apparatus main body 4 so as to be axially movable. These ink jet recording head units 1A and 1B
For example, a black ink composition and a color ink composition are ejected, respectively.

The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted is moved along the carriage shaft 5. The On the other hand, the apparatus body 4 has a carriage shaft 5.
A recording sheet S that is a recording medium such as paper fed by a paper feed roller (not shown) is wound around the platen 8 and conveyed.

In the example shown in FIG. 8, each of the ink jet recording head units 1 </ b> A and 1 </ b> B has one ink jet recording head I.
For example, one ink jet recording head unit 1A or 1B may have two or more ink jet recording heads I.

In addition, although an ink jet recording head has been described as an example of the liquid ejecting head,
The present invention is widely intended for all liquid ejecting heads, and can of course be applied to liquid ejecting heads that eject liquids other than ink. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used for manufacturing color filters such as liquid crystal displays, organic EL displays, and FEDs.
Electrode material ejection head used for electrode formation for (field emission display), bio chi
Examples thereof include a bio-organic matter ejecting head used for p production.

I ink jet recording head (liquid ejecting head), II ink jet recording apparatus (liquid ejecting apparatus), S joining region, S1 first joining region, S2 second joining region, 10 flow path forming substrate (first substrate) ), 12 Pressure generating chamber (first flow path), 13
Communication path, 14 Ink supply path, 20 Nozzle plate, 21 Nozzle opening, 30
Protective substrate (second substrate), 32 Protective substrate protective film (silicon oxide film), 33 Reservoir part (second flow path), 35 Adhesive, 50 Elastic film (silicon oxide film), 6
0 first electrode, 70 piezoelectric layer, 80 second electrode, 100 sealing member, 105
Reservoir, 110 wafer for flow path forming substrate, 130 wafer for protective substrate, 2
00 protective film, 300 piezoelectric element, 400 laminate

Claims (4)

A first substrate in which a silicon oxide film is formed on one surface of a substrate on which a first flow path communicating with a nozzle opening for ejecting liquid is formed, and a piezoelectric element is formed on the silicon oxide film side;
A second substrate having a second channel communicating with the first channel and having a silicon oxide film formed on one surface thereof;
The first substrate and the second substrate each have a bonding region in which the silicon oxide film sides are bonded to each other via an adhesive,
The bonding region includes a first bonding region in which the silicon oxide films are bonded to each other via an adhesive, and the silicon oxide film side of the first substrate. The piezoelectric element and the piezoelectric element And a second bonding region provided with a laminated body that is at least electrically connected to the piezoelectric element and the wiring, and the laminated body has a side surface. Is covered with the same layer structure as the wiring .   A liquid ejecting head unit comprising two or more liquid ejecting heads according to claim 1.   A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.   The liquid ejecting apparatus according to claim 4, comprising two or more liquid ejecting heads.

Images