JP5446795B2 - Polyamide resin composition for IC tray and IC tray - Google Patents

Description

  The present invention relates to a novel polyamide resin composition for IC trays. Specifically, it is a polyamide resin in which the dicarboxylic acid component is oxalic acid, and has a wide moldable temperature range, excellent moldability, low water absorption, chemical resistance, hydrolysis resistance, etc. The present invention relates to a polyamide resin composition for IC trays containing a conductivity imparting agent.

  Crystalline polyamides such as nylon 6 and nylon 66 are widely used as clothing, industrial material fibers, or general-purpose engineering plastics because of their excellent properties and ease of melt molding. Problems such as changes in physical properties due to water absorption, acid, high-temperature alcohol, and deterioration in hot water have also been pointed out, and there is an increasing demand for polyamides with superior dimensional stability and chemical resistance.

  On the other hand, a polyamide resin using oxalic acid as a dicarboxylic acid component is called a polyoxamide resin, and is known to have a higher melting point and lower water absorption than other polyamide resins having the same amino group concentration (Patent Document 1). It is expected to be used in fields where conventional polyamide is difficult to use, especially IC trays, where physical properties change due to water absorption.

  So far, polyoxamide resins using various aliphatic linear diamines as diamine components have been proposed. However, for example, a polyoxamide resin using 1,6-hexanediamine as a diamine component has a melting point (about 320 ° C.) higher than the thermal decomposition temperature (1% weight loss temperature in nitrogen; about 310 ° C.) (non-patent document). 1) Melt polymerization and melt molding were difficult and could not withstand practical use.

  For a polyoxamide resin whose diamine component is 1,9-nonanediamine (hereinafter abbreviated as PA92), L. Franco et al. Discloses a production method and its crystal structure when diethyl oxalate is used as the oxalic acid source ( Non-patent document 2). The PA 92 obtained here is a polymer having an intrinsic viscosity of 0.97 dL / g and a melting point of 246 ° C., but only a low molecular weight substance that cannot form a tough molded article is obtained. It is also shown that PA92 having an intrinsic viscosity of 0.99 dL / g and a melting point of 248 ° C. was produced when dibutyl oxalate was used as the dicarboxylic acid ester (Patent Document 2). In this case as well, there is a problem that only a low molecular weight body that cannot be formed into a tough molded body is obtained.

  In addition, in applications of parts using polyamide resin, there is a demand for conductivity for the purpose of preventing charging (for example, Patent Document 3).

The present inventors use oxalic acid as a dicarboxylic acid component, and a polyamide resin using 1,9-nonanediamine and 2-methyl-1,8-octanediamine in a specific ratio as a diamine component has low water absorption, It was disclosed that it is a polyamide resin (PA92C) having a wide melt molding temperature range and excellent properties (Patent Document 4).
However, this polyamide resin uses oxalic acid as the dicarboxylic acid component, and has a specific ratio of three diamines of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine as the diamine component. It is not the polyoxamide resin used in 1.

  The problem to be solved by the present invention is to achieve a sufficiently high molecular weight while having low water absorption, a wide range of moldable temperature estimated from the difference between the melting point and the thermal decomposition temperature, excellent melt moldability, and To provide a polyamide resin composition for IC trays that is excellent in electrical conductivity and that is excellent in heat resistance, chemical resistance, hydrolysis resistance, etc. without impairing the low water absorption seen in aliphatic linear polyoxamide resins. It is in.

  As a result of intensive studies to solve the above problems, the present inventors have used oxalic acid diester as the oxalic acid source as the polyamide resin, and the diamine component is 1,9-nonanediamine, 2-methyl-1,8- It consists of octanediamine and 1,6-hexanediamine, and the molar ratio of C9 diamine (1,9-nonanediamine and 2-methyl-1,8-octanediamine) to 1,6-hexanediamine is 1:99 to 99: 1 is a high molecular weight, has a large difference between the melting point and the thermal decomposition temperature, is excellent in melt moldability, and further, compared with the conventional polyamide without impairing the low water absorption seen in the linear polyoxamide resin. A polyamide resin excellent in chemical resistance, hydrolysis resistance, mechanical properties, etc., and this new polyamide resin (PA92 / 62T It was found that the above-mentioned object can be achieved by blending a conductivity-imparting agent with the present invention, and the present invention was completed.

  The polyamide resin composition for IC tray of the present invention has a low water absorption and can have a high molecular weight by melt polymerization, and the moldable temperature range is as wide as 50 ° C. or more, and further as wide as 60 ° C. or more. It can be used for IC trays because it has excellent melt moldability, electrical conductivity, heat resistance, chemical resistance, and hydrolysis resistance.

FIG. 1 is a view showing an injection molded body for measuring warpage.

(1) Constituent Component of Polyamide Resin In the polyamide used in the present invention, the dicarboxylic acid component is oxalic acid, and the diamine component is a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine (hereinafter referred to as “C9 diamine”). A polyamide resin (PA92 / 62T) having a molar ratio of the C9 diamine mixture to the C6 diamine of 1:99 to 99: 1, and a 1,6-hexanediamine (hereinafter referred to as “C6 diamine”). ).

  As the oxalic acid source used in the production of the polyamide used in the present invention, oxalic acid diesters are used, and these are not particularly limited as long as they have reactivity with amino groups. Dimethyl oxalate, diethyl oxalate, di-n-oxalate (Or i-) propyl, oxalic acid diester of aliphatic monohydric alcohol such as di-n- (or i-, or t-) butyl oxalate, oxalic acid diester of alicyclic alcohol such as dicyclohexyl oxalate, aromatic such as diphenyl oxalate Examples include oxalic acid diester of alcohol.

  Among the above oxalic acid diesters, oxalic acid diesters of aliphatic monohydric alcohols having more than 3 carbon atoms, oxalic acid diesters of alicyclic alcohols, and oxalic acid diesters of aromatic alcohols are preferred, and among them, dibutyl oxalate and diphenyl oxalate are particularly preferred.

  The molar ratio of the 1,9-nonanediamine component to the 2-methyl-1,8-octanediamine component in the C9 diamine mixture used in the polyamide resin of the present invention is generally 1:99 to 99: 1, preferably 5:95 to 95: 5, more preferably 5:95 to 40:60 or 60:40 to 95: 5, especially 5:95 to 30:70 or 70:30 to 90:10. By copolymerizing 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine in the above specific amounts, the moldable temperature range is wide, the melt moldability is excellent, and the water absorption is low. Polyamide having excellent properties, heat resistance, chemical resistance, hydrolysis resistance, transparency and the like can be obtained.

  In the polyamide resin of the present invention, as the diamine component, the C9 diamine mixture (1,9-nonanediamine and 2-methyl-1,8-octanediamine) mixed with 1,6-hexanediamine is used. The molar ratio of C9 diamine mixture to 1,6-hexanediamine is 1:99 to 99: 1. By mixing 1,6-hexanediamine in a molar ratio of 1/99 or more with respect to the C9 diamine mixture, the above excellent effect of the polyamide resin (PA92C) comprising oxalic acid as the dicarboxylic acid component and C9 diamine mixture as the diamine component Can be maintained (particularly without impairing melt moldability and low water absorption), the melting point of the polyamide resin can be increased, and particularly the mechanical properties can be improved. The molar ratio of the C9 diamine mixture to 1,6-hexanediamine is preferably 5.1: 94.9 to 99: 1, more preferably 10:90 to 99: 1, and even more preferably 20:80 to 99: 1. It is. In particular, it is preferably 30:70 to 98: 2, and more preferably 30:70 to 90:10 (further 30:70 to 70:30). In this polyamide resin, the change to the melting point appears clearly by copolymerizing 1,6-hexanediamine in a molar ratio of 1/99 or more with respect to the C9 diamine mixture, and the melting point of the resin rises. If 6-hexanediamine is within a molar ratio of 99/1, an acceptable melt moldability can be obtained. If the molar ratio of 1,6-hexanediamine is within 80/20, the melting point of the polyamide resin will be 300 ° C. or lower, and polymerization and molding (melt moldability) will be easier, and within 70/30. It is more preferable because the melting point becomes 280 ° C. or lower and the melt moldability becomes easier.

(2) Manufacture of polyamide resin Polyamide resin PA92 / 62T used for this invention can be manufactured using the arbitrary methods known as a method of manufacturing polyamide. According to the study by the present inventors, it can be obtained by subjecting diamine and oxalic acid diester to a polycondensation reaction in a batch or continuous manner. Specifically, it is preferable to carry out in the order of (i) pre-polycondensation step and (ii) post-polycondensation step as shown by the following operations.

  (I) Pre-polycondensation step: First, the inside of the reactor is purged with nitrogen, and then diamine (diamine component) and oxalic acid diester (oxalic acid source) are mixed. When mixing, a solvent in which both the diamine and the oxalic acid diester are soluble may be used. The solvent in which both the diamine component and the oxalic acid source are soluble is not particularly limited, but toluene, xylene, trichlorobenzene, phenol, trifluoroethanol, and the like can be used, and particularly, toluene can be preferably used. For example, after heating the toluene solution which melt | dissolved diamine to 50 degreeC, oxalic acid diester is added with respect to this. At this time, the charging ratio of the oxalic acid diester and the diamine is oxalic acid diester / the diamine, 0.8 to 1.5 (molar ratio), preferably 0.91 to 1.1 (molar ratio), more preferably 0. .99 to 1.01 (molar ratio).

  The temperature in the reactor charged in this way is increased under normal pressure while stirring and / or nitrogen bubbling. The reaction temperature is preferably controlled so that the final temperature reaches 80 to 150 ° C., preferably 100 to 140 ° C. The reaction time at the final temperature reached is 3-6 hours.

  (Ii) Post-polycondensation step: In order to further increase the molecular weight, the polymer produced in the pre-polycondensation step is gradually heated in the reactor under normal pressure. In the temperature rising process, the final temperature of the prepolycondensation step, that is, from 80 to 150 ° C, is finally 220 ° C to 300 ° C, preferably 230 ° C to 280 ° C, more preferably 240 ° C to 270 ° C. Let reach the range. It is preferable to carry out the reaction for 1 to 8 hours including the temperature raising time, preferably 2 to 6 hours. Furthermore, in the post-polymerization step, polymerization can be performed under reduced pressure as necessary. The preferable final ultimate pressure in the case of performing the vacuum polymerization is less than 0.1 MPa to 13.3 Pa.

The specific example of the manufacturing method of the polyamide resin used for this invention is demonstrated.
First, the raw oxalic acid diester is charged into the container. The container is not particularly limited as long as it can withstand the temperature and pressure of the polycondensation reaction to be performed later. Thereafter, the container is heated to a temperature at which it is mixed with the raw material diamine, and then the diamine is injected to start the polycondensation reaction. The temperature at which the raw materials are mixed is not particularly limited as long as it is a temperature not lower than the boiling point and lower than the boiling point of the oxalic acid diester and diamine, and the polyoxamide generated by the polycondensation reaction of the oxalic acid diester and diamine is not thermally decomposed. For example, a mixture of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine, and a C9 diamine mixture (1,9-nonanediamine and 2-methyl-1,8-octane) In the case of a polyoxamide resin made from diamine and dibutyl oxalate having a molar ratio of (diamine) to 1,6-hexanediamine of 1:99 to 99: 1, the mixing temperature is preferably 15 ° C to 240 ° C. The molar ratio of C9 diamine (1,9-nonanediamine and 2-methyl-1,8-octanediamine) to 1,6-hexanediamine is about 5:95 to 90:10, liquid at room temperature or 40 ° C. Since it liquefies only by heating to the extent, it is more preferable because it is easy to handle. When the mixing temperature is equal to or higher than the boiling point of the alcohol produced by the condensation reaction, it is desirable to use a container equipped with a device for distilling and condensing the alcohol. In addition, when pressure polymerization is performed in the presence of an alcohol generated by a condensation reaction, a pressure vessel is used. The charging ratio of oxalic acid diester to diamine is oxalic acid diester / the above diamine, 0.8 to 1.2 (molar ratio), preferably 0.91 to 1.09 (molar ratio), more preferably 0.98 to 1. 0.02 (molar ratio).

  Next, the inside of the container is heated to a temperature not lower than the melting point of the polyoxamide resin and not higher than the temperature at which it is not thermally decomposed. For example, C9 diamine (a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine) and 1,6-hexanediamine, and a C9 diamine mixture (1,9-nonanediamine and 2-methyl-1) , 8-octanediamine) and 1,6-hexanediamine have a molar ratio of 50:50, and 1,9-nonanediamine and 2-methyl-1,8-octanediamine have a molar ratio of 50:50. In the case of a polyoxamide resin using diamine and dibutyl oxalate as raw materials, the melting point is 261 ° C., and therefore it is preferable to raise the temperature from 270 ° C. to 300 ° C. (pressure is 2 MPa to 4 MPa). While distilling off the produced alcohol, the polycondensation reaction is continued under an atmospheric pressure of nitrogen or reduced pressure as necessary. When the raw materials are mixed in a pressure vessel and subjected to pressure polymerization in the presence of an alcohol produced by a condensation reaction, the pressure is first released while the produced alcohol is distilled off. Thereafter, the polycondensation reaction is continued under an atmospheric pressure of nitrogen or reduced pressure as necessary. The preferable final pressure in the case of carrying out the vacuum polymerization is 760 to 0.1 Torr. The temperature is preferably 270 to 300 ° C. The alcohol is cooled and liquefied by a water-cooled condenser and recovered.

(3) Properties and Physical Properties of Polyamide Resin There is no particular limitation on the molecular weight of the polyamide resin PA92 / 62T used in the present invention, but a 96% concentrated sulfuric acid is used as a solvent and a solution having a polyamide resin concentration of 1.0 g / dl is used. The relative viscosity ηr measured at 25 ° C. is in the range of 1.8 to 6.0. Preferably it is 2.0-5.5, and 2.5-4.5 is especially preferable. If ηr is lower than 1.8, the molded product becomes brittle and the physical properties deteriorate. On the other hand, if ηr is higher than 6.0, the melt viscosity becomes high, and the molding processability deteriorates.

  The polyamide resin used in the present invention uses oxalic acid as the carboxylic acid component, and copolymerizes 1,9-nonanediamine, 2-methyl-1,8-octanediamine, and 1,6-hexanediamine as the diamine component. It is possible to increase the relative viscosity, that is, to increase the molecular weight, as compared with a polyamide comprising 1,9-nonanediamine. The polyamide resin PA92 / 62T used in the present invention uses oxalic acid as the carboxylic acid component, and 1,9-nonanediamine and 2-methyl-1,8-octanediamine as the diamine component and further 1,6-hexamethylenediamine. By copolymerizing, it is possible to raise the melting point of the resin as compared with polyamides composed of succinic acid, 1,9-nonanediamine and 2-methyl-1,8-octanediamine. The moldable temperature range represented by the difference (Td−Tm) between the 1% weight loss temperature (hereinafter abbreviated as Td) and the melting point (hereinafter abbreviated as Tm), which is a substantial thermal decomposition index, is oxalic acid. And a polyamide composed of 1,9-nonanediamine, preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and further 90 ° C. or higher. The polyamide resin of the present invention has a Td of preferably 280 ° C. or higher, more preferably 300 ° C. or higher, and still more preferably 320 ° C. or higher, and has high heat resistance.

(4) Conductivity-imparting agent The conductivity-imparting agent used in the present invention is not particularly limited as long as it can be added to the polyamide resin to impart conductivity.
The conductivity imparting agent is not particularly limited as long as it can impart conductivity, and examples thereof include carbon black, carbon fiber, and metal fiber, and carbon black and carbon fiber are particularly preferably used.

  The carbon black that can be used in the present invention includes all carbon blacks commonly used for imparting conductivity, and preferred carbon blacks include acetylene black obtained by incomplete combustion of acetylene gas, Examples include, but are not limited to, ketjen black, oil black, naphthalene black, thermal black, lamp black, channel black, roll black, disc black, etc., which are manufactured from crude crude oil by furnace-type incomplete combustion. Absent. Among these, acetylene black and furnace black (Ketjen black) are particularly preferably used.

Carbon black is produced in various carbon powders having different characteristics such as particle diameter, surface area, DBP oil absorption, ash content and the like. Although there is no restriction | limiting in the characteristic of this carbon black, What has a favorable chain structure and a large aggregation density is preferable. A large amount of carbon black is not preferable in terms of impact resistance, and from the viewpoint of obtaining excellent electrical conductivity with a smaller amount, the average particle size is preferably 500 nm or less, more preferably 5 to 100 nm, more preferably from 10 to 70 nm, also the surface area (BET method) is preferably ^{10 m} 2 / g or more, more preferably 300 meters ² / g or more, to be 500 to 1500 ² / g Further, the DBP (dibutyl phthalate) oil absorption is preferably 50 ml / 100 g or more, more preferably 100 ml / 100 g, and further preferably 300 ml / 100 g or more. The ash content is preferably 0.5% by weight or less, and more preferably 0.3% by weight or less. The DBP oil absorption here is a value measured by a method defined in ASTM D-2414. Carbon black preferably has a volatile content of less than 1.0% by weight.

  The mixing ratio of carbon black is preferably 2 to 50 parts by mass with respect to 100 parts by mass of the whole resin. When the blending ratio of the carbon black is less than 2 parts by mass, it is not preferable because sufficient conductivity cannot be obtained. When the blending ratio exceeds 50 parts by weight, the melt viscosity is high, the fluidity is lowered, and the molding processability is significantly impaired. Therefore, it is not preferable. 2-15 mass parts is preferable.

  As the carbon fiber, pitch-based and PAN-based carbon fibers are used without limitation, but PAN-based carbon fibers are more preferable in view of properties such as physical properties and conductivity.

  The carbon fiber length may be a short fiber having a length of 1000 mm in addition to the short fiber depending on the application, but the fiber length before kneading is preferably 0.1 to 12 mm, particularly preferably 1 to 8 mm.

  Moreover, although the fiber diameter of a carbon fiber has a preferable thing of 5-15 micrometers, a fine carbon fiber can also be used.

  The blending ratio of the carbon fibers is preferably 2 to 40 parts by mass with respect to 100 parts by mass of the whole resin. When the blending ratio exceeds 40 parts by mass, the rigidity is high and the impact resistance is inferior, the smoothness of the surface of the molded product is poor, and the slidability may be lowered. The blending ratio of the carbon fiber is preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and further preferably 7 parts by mass or more. If the blending ratio is small, the electrical conductivity is lowered and it is easy to be charged with static electricity.

The conductivity required for the IC tray material of the present invention may vary depending on the application and is not particularly limited. The surface resistance of the polyamide resin is about 10 ¹⁵ Ω. By adding a conductivity-imparting agent, for example, it can be reduced to about 10 ¹² to 10 ¹ Ω or less, but it is determined from the balance of physical properties required for polyamide resin products and the purpose of antistatic depending on the application. do it. In general, conductivity of about 10 ³ to 10 ¹⁰ Ω is considered to be one preferable range.

(5) Other components that can be blended The polyamide resin PA92 / 62T used in the present invention can be mixed with other dicarboxylic acid components within a range not impairing the effects of the present invention. Examples of dicarboxylic acid components other than succinic acid include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, 3, Aliphatic dicarboxylic acids such as 3-diethylsuccinic acid, azelaic acid, sebacic acid and suberic acid, alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid, and terephthalic acid , Isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, dibenzoic acid Acid, 4,4′-oxydibenzoic acid, diphenylmethane-4,4′-dicarboxylic acid, diphenyls Hong-4,4'-dicarboxylic acid, 4,4'-biphenyl and the like alone aromatic dicarboxylic acids such as dicarboxylic acids, or may be added to any mixture thereof during the polycondensation reaction. Furthermore, polyvalent carboxylic acids such as trimellitic acid, trimesic acid, and pyromellitic acid can be used as long as melt molding is possible. In general, the amount of the dicarboxylic acid component other than oxalic acid is preferably 5 mol% or less based on the total dicarboxylic acid component.

  In addition, the polyamide resin PA92 / 62T used in the present invention can be mixed with other diamine components as long as the effects of the present invention are not impaired. Other diamine components other than 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine include ethylenediamine, propylenediamine, 1,4-butanediamine, and 1,8-octanediamine. 1,10-decanediamine, 1,12-dodecanediamine, 3-methyl-1,5-pentanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1 , 6-hexanediamine, aliphatic diamines such as 5-methyl-1,9-nonanediamine, alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine and isophoronediamine, p-phenylenediamine, m-phenylenediamine, p -Xylenediamine, m-xylenediamine, 4,4'-di Mino diphenylmethane, 4,4'-diaminodiphenyl sulfone, 4,4'-and aromatic diamines, such as diaminodiphenyl ether by itself, or may be added to any mixture thereof during the polycondensation reaction. The amount of other diamine components other than 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine is generally preferably 5 mol% or less based on the total diamine components. .

  The polyamide resin of the present invention can be mixed with other polyoxamides, polyamides such as aromatic polyamides, aliphatic polyamides, and alicyclic polyamides as long as the effects of the present invention are not impaired.

  Furthermore, thermoplastic polymers other than polyamide, elastomers, and the like can be similarly blended. However, the polyamide resin PA92 / 62T used in the present invention is preferably contained in an amount of 50% by mass or more of the resin component.

  Moreover, you may mix | blend a reinforcing fiber with the polyamide resin composition for IC trays of this invention. The reinforcing fiber to be blended is not particularly limited, and examples thereof include inorganic fibers such as glass fiber, carbon fiber, metal fiber, and mineral fiber, and organic fibers such as aramid fiber that is tougher than polyamide resin. By blending the reinforcing fibers, the effect of improving the physical properties such as the strength and creep resistance of the composition is remarkable. Glass fiber and carbon fiber are particularly preferable. Use of carbon fiber has an effect of imparting antistatic performance. About carbon fiber, what was demonstrated previously can be used.

  The glass fiber is not particularly limited. The glass fiber diameter is not limited, but is preferably 5 to 15 μm. The fiber length may be a short fiber or a long fiber depending on the use, but is preferably 5 to 1000 μm.

  The mixing ratio of the glass fiber is preferably 2 to 40 parts by mass with respect to 100 parts by mass of the entire resin. It is more preferably 2 to 35 parts by mass, and further preferably 3 to 33 parts by mass. If the blending amount of the glass fiber is small, the improvement in rigidity and creep resistance is lowered, and the bonding with a tube or the like may be deteriorated. On the other hand, when the compounding amount of the glass fiber is increased, the fluidity of the composition is deteriorated, which may cause a short shot or the surface state.

  Furthermore, the polyamide resin composition for IC trays of the present invention is optionally provided with a filler, a stabilizer such as a copper compound, a colorant, an ultraviolet absorber, a light stabilizer, an antioxidant, a flame retardant, and crystallization promotion. An agent, a plasticizer, a lubricant and the like can be added during or after the polycondensation reaction.

(6) Molding process of IC tray As a molding method of the material for IC tray of the present invention, polyamide resin and a conductivity-imparting agent are blended in advance, or a conductivity-imparting agent is introduced in the middle of a molding machine, injection, extrusion , Hollow, press, roll, foaming, vacuum / compressed air, stretching, etc., all known molding methods applicable to IC tray materials are possible, and by these molding methods, film, sheet, molded product, fiber etc. are processed be able to.

(7) Use of IC tray material The molded product using the polyamide resin composition for IC tray of the present invention can be used for use of an IC tray.

[Physical property measurement, molding, evaluation method]
Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.
In addition, the measurement in an Example was performed with the following method.

(1) Relative viscosity (ηr):
ηr was measured at 25 ° C. using an Ostwald viscometer using a 96% polyamide sulfuric acid solution (concentration: 1.0 g / dl).

(2) Melting point (Tm) and crystallization temperature (Tc):
Tm and Tc were measured under a nitrogen atmosphere using a PYRIS Diamond DSC manufactured by PerkinELmer. The temperature was raised from 30 ° C. to 300 ° C. at a rate of 10 ° C./min (referred to as a temperature rise first run), held at 300 ° C. for 3 minutes, and then lowered to −100 ° C. at a rate of 10 ° C./min (temperature fall first). Then, the temperature was raised to 300 ° C. at a rate of 10 ° C./min (called a temperature rising second run). From the obtained DSC chart, the exothermic peak temperature of the temperature decrease first run was Tc, and the endothermic peak temperature of the temperature increase second run was Tm.

(3) 1% weight loss temperature (Td):
Td was measured by thermogravimetric analysis (TGA) using THERMOGRAVIMETRIC ANALYZER TGA-50 manufactured by Shimadzu Corporation. The temperature was raised from room temperature to 500 ° C. at a rate of 10 ° C./min under a nitrogen stream of 20 ml / min, and Td was measured.

(4) Melt viscosity:
The melt viscosity was measured under the conditions of 290 ° C. and shear rate of 0.1 s −1 in nitrogen by attaching a 25 mm cone plate to a melt viscoelasticity measuring device ARES manufactured by TA Instruments Japan.

(5) Film molding:
Film forming was performed using a vacuum press TMB-10 manufactured by Toho Machinery Co., Ltd. After 5 minutes of heating and melting at 290 ° C. in a reduced pressure atmosphere of 500 to 700 Pa (260 ° C. when nylon 6 is used, 290 ° C. when nylon 66 is used, 230 ° C. when nylon 12 is used), 5 MPa Was pressed for 1 minute to form a film. Next, the reduced-pressure atmosphere was returned to normal pressure, and then cooled and crystallized at room temperature of 5 MPa for 1 minute to obtain a film.

(6) Water absorption rate (saturated water absorption rate, equilibrium water absorption rate):
A film (dimensions: 20 mm × 10 mm, thickness 0.25 mm; weight about 0.05 g) obtained by molding the polyamide resin under the conditions of (5) is immersed in ion exchange water at 23 ° C., and the film is taken out every predetermined time. The weight of the film was measured. When the rate of increase in the film weight lasts 3 times within a range of 0.2% or less, it is determined that the absorption of water into the polyamide resin film has reached saturation, and the weight of the film before being immersed in water (Xg) From the weight (Yg) of the film when reaching saturation, the saturated water absorption (%) was calculated by the formula (1).
Saturated water absorption (%) = 100 (Y−X) / X (1)
The water absorption rate (equilibrium water absorption rate) calculated by the formula (1) from the weight (Yg) immediately after forming the film and the weight (Yg) when the film reached equilibrium at a humidity of 65% and a temperature of 23 ° C. ) As the wet water absorption.

(7) Chemical resistance:
After the polyamide hot press film obtained according to the present invention was immersed in the chemicals listed below for 7 days, the weight residual ratio (%) and changes in the appearance of the film were observed. In each of concentrated hydrochloric acid, 64% sulfuric acid, and glacial acetic acid solutions, tests were performed on samples immersed at 23 ° C.

(8) Hydrolysis resistance:
The polyamide hot press film obtained by the present invention was put in an autoclave, and each was 121 in water (pH = 7), 0.5 mol / l sulfuric acid (pH = 1), and 1 mol / l sodium hydroxide aqueous solution (pH = 14). The residual weight ratio (%) and the appearance change after the treatment at 60 ° C. for 60 minutes were examined.

(9) Mechanical properties:
In the following measurements [1] to [4], the following specimens were measured at a resin temperature of 290 ° C. (260 ° C. when nylon 6 was used, 290 ° C. when nylon 66 was used, and nylon 12 used. Was 230 ° C.) and was molded by injection molding at a mold temperature of 80 ° C. The ones evaluated at 23 ° C. without conditioning immediately after molding are shown in the table as dry, and the ones evaluated at 23 ° C. after conditioning at a humidity of 65% and a temperature of 23 ° C. after molding are shown in the table.
[1] Tensile test (tensile yield point strength): Measured in accordance with ASTM D638 using a Type I test piece described in ASTM D638.
[2] Bending test (flexural modulus): Measured at 23 ° C. in accordance with ASTM D790 using a test piece having dimensions of 127 mm × 12.7 mm × 3.2 mm.
[3] Izod impact strength: Measured at 23 ° C. in accordance with ASTM D256 using a test piece having dimensions of 127 mm × 12.7 mm × 3.2 mm.
[4] Deflection temperature under load: Measured at a load of 1.82 MPa in accordance with ASTM D648 using a test piece having a test piece size of 127 mm × 12.7 mm × 3.2 mm.

(10) Surface Resistance of Molded Article A tensile test piece based on ASTM D-638 was measured at an arbitrary 3 locations at 1 cm intervals using a 4261ALCR meter manufactured by Yokogawa Hewlett-Packard Company, and an average value was obtained.

(11) Warpage Warpage was evaluated using a test piece obtained by injection molding the injection molding material of the present invention into a box shape shown in FIG. 1 under the injection molding conditions shown below.
[Injection molding conditions]
・ Injection molding machine: IS-80 manufactured by Toshiba Machine Co., Ltd.
Cylinder set temperature: C1 240 ° C; C2 290 ° C; C3 290 ° C; C4 290 ° C; Nozzle heater 290 ° C
・ Injection pressure: Primary pressure 650kg / cm2
-Mold temperature: Moving mold 40 ° C; Fixed mold 40 ° C
・ Injection time: 11 seconds ・ Cooling time: 20 seconds [Evaluation of warpage]
The dimensions A and B in FIG. 1 were measured and obtained from the following equation with the dimension B as a reference.
Warpage (warping of inward tilt) (%) = (B length−A length) / B length × 100
The allowable range for warpage (%) is 9% or less.

[Resin Production Example 1: Production of PA92 / 62T-1]
Oxalic acid in a pressure vessel with an internal volume of about 150 liters equipped with a stirrer, thermometer, torque meter, pressure gauge, raw material inlet directly connected to the diaphragm pump, nitrogen gas inlet, pressure outlet, pressure regulator and polymer outlet The operation of charging 28.230 kg (139.56 mol) of dibutyl, pressurizing the inside of the pressure vessel to 0.5 MPa with nitrogen gas having a purity of 99.9999%, and then releasing nitrogen gas to normal pressure is performed 5 times. After repeated nitrogen substitution, the system was heated while stirring under a sealing pressure. After the temperature of dibutyl oxalate was raised to 100 ° C. over about 30 minutes, 1.241 kg (7.84 mol) of 1,9-nonanediamine and 19.639 kg (124.04 mol) of 2-methyl-1,8-octanediamine were obtained. And a mixture of 0.893 kg (7.68 mol) of 1,6-hexanediamine (molar ratio of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine is 5.62: 88.88: 5.50) was supplied into the reaction vessel by a diaphragm pump at a flow rate of 1.49 liters / minute for about 17 minutes, and at the same time the temperature was raised. The internal pressure in the pressure vessel immediately after the supply increased to 0.35 MPa by butanol generated by the polycondensation reaction, and the temperature of the polycondensate increased to about 170 ° C. Thereafter, the temperature was raised to 235 ° C. over 1 hour. Meanwhile, the internal pressure was adjusted to 0.75 MPa while extracting the generated butanol from the pressure relief port. Immediately after the temperature of the polycondensate reached 235 ° C., butanol was extracted from the pressure release port over about 20 minutes, and the internal pressure was brought to normal pressure. From the normal pressure, the temperature was raised while flowing nitrogen gas at 1.5 liters / minute, the temperature of the polycondensate was brought to 260 ° C. over about 1 hour, and the reaction was carried out at 260 ° C. for 4.5 hours. . Thereafter, stirring was stopped, the inside of the system was pressurized to 1 MPa with nitrogen and allowed to stand for about 10 minutes, then released to an internal pressure of 0.5 MPa, and the polycondensate was extracted in a string form from the lower outlet of the pressure vessel. The string-like polymer was immediately cooled with water, and the water-cooled string-like resin was pelletized with a pelletizer. The obtained polyamide was a white tough polymer, and ηr = 3.13.

[Resin Production Example 2: Production of PA92 / 62T-2]
28.462 kg (140.71 mol) of dibutyl oxalate was charged, 16.448 kg (103.88 mol) of 1,9-nonanediamine, 2.903 kg (18.34 mol) of 2-methyl-1,8-octanediamine and 1 , 6-hexanediamine 2.150 kg (18.50 mol) (mixture ratio of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine is 73.83: 13.13. 03: 13.14) was reacted in the same manner as in Production Example 1 to obtain polyamide. The obtained polyamide was a white tough polymer with ηr = 2.97.

[Resin Production Example 3: Production of PA92 / 62T-3]
30.238 kg (149.49 mol) of dibutyl oxalate was charged, 4.486 kg (28.33 mol) of 1,9-nonanediamine, 4.486 kg (28.33 mol) of 2-methyl-1,8-octanediamine and 1 , 6-hexanediamine 10.79 kg (92.85 mol) (1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine molar ratio of 18.95: 18. 95: 62.10) was supplied into the reaction vessel with a diaphragm pump at a flow rate of 1.49 liters / minute over about 17 minutes, and at the same time the temperature was raised. The internal pressure in the pressure vessel immediately after the supply increased to 0.35 MPa by butanol generated by the polycondensation reaction, and the temperature of the polycondensate increased to about 170 ° C. Thereafter, the temperature was raised to 270 ° C. over 1.5 hours. Meanwhile, the internal pressure was adjusted to 1.00 MPa while extracting the generated butanol from the pressure relief port. Immediately after the temperature of the polycondensate reached 270 ° C., butanol was extracted from the pressure release port over about 20 minutes, and the internal pressure was brought to normal pressure. From the normal pressure, the temperature was raised while flowing nitrogen gas at 1.5 liters / minute, the temperature of the polycondensate was changed to 285 ° C. over about 1 hour, and the reaction was carried out at 285 ° C. for 1.5 hours. . Thereafter, stirring was stopped, the inside of the system was pressurized to 1 MPa with nitrogen and allowed to stand for about 10 minutes, then released to an internal pressure of 0.5 MPa, and the polycondensate was extracted in a string form from the lower outlet of the pressure vessel. The string-like polymer was immediately cooled with water, and the water-cooled string-like resin was pelletized with a pelletizer. The obtained polyamide was a white tough polymer, and ηr = 2.88.

[Resin Production Example 4: Production of PA92 / 62T-4]
29.864 kg (147.64 mol) of dibutyl oxalate was charged, and 5.598 kg (35.36 mol) of 1,9-nonanediamine, 5.598 kg (35.36 mol) of 2-methyl-1,8-octanediamine and 1 , 6-hexanediamine 8.941 kg (76.92 mol) of a mixture (the molar ratio of 1,9-nonanediamine, 2-methyl-1,8-octanediamine and 1,6-hexanediamine was 23.95: 23. 95: 52.10) was supplied to the reaction vessel by a diaphragm pump at a flow rate of 1.49 liters / minute over about 17 minutes, and at the same time the temperature was raised. The internal pressure in the pressure vessel immediately after the supply increased to 0.35 MPa by butanol generated by the polycondensation reaction, and the temperature of the polycondensate increased to about 170 ° C. Thereafter, the temperature was raised to 250 ° C. over 1 hour. Meanwhile, the internal pressure was adjusted to 1.00 MPa while extracting the generated butanol from the pressure relief port. Immediately after the temperature of the polycondensate reached 250 ° C., butanol was extracted from the pressure release port over about 20 minutes, and the internal pressure was brought to normal pressure. The temperature was raised from normal pressure while flowing nitrogen gas at 1.5 liters / minute, and the temperature of the polycondensate was increased to 270 ° C. over about 1 hour and reacted at 270 ° C. for 2 hours. Thereafter, stirring was stopped, the inside of the system was pressurized to 1 MPa with nitrogen and allowed to stand for about 10 minutes, then released to an internal pressure of 0.5 MPa, and the polycondensate was extracted in a string form from the lower outlet of the pressure vessel. The string-like polymer was immediately cooled with water, and the water-cooled string-like resin was pelletized with a pelletizer. The obtained polyamide was a white tough polymer with ηr = 2.83.

[Resin Production Example 5: Production of PA92 / 62T-5]
29.107 kg (143.89 mol) of dibutyl oxalate was charged, 5.641 kg (35.63 mol) of 1,9-nonanediamine, 10.028 kg (63.34 mol) of 2-methyl-1,8-octanediamine and 1 , 6-hexanediamine 5.223 kg (44.93 mol) (1,9-nonanediamine, 2-methyl-1,8-octanediamine, 1,6-hexanediamine molar ratio 24.76: 44. 02: 31.22) was supplied into the reaction vessel over about 17 minutes at a flow rate of 1.49 liters / minute by means of a diaphragm pump, and the temperature was raised. The internal pressure in the pressure vessel immediately after the supply increased to 0.35 MPa by butanol generated by the polycondensation reaction, and the temperature of the polycondensate increased to about 170 ° C. Thereafter, the temperature was raised to 250 ° C. over 1 hour. Meanwhile, the internal pressure was adjusted to 0.75 MPa while extracting the generated butanol from the pressure relief port. Immediately after the temperature of the polycondensate reached 240 ° C., butanol was extracted from the pressure release port over about 20 minutes, and the internal pressure was brought to normal pressure. The temperature was raised from normal pressure while flowing nitrogen gas at 1.5 liters / minute, and the temperature of the polycondensate was adjusted to 265 ° C. over about 1 hour, and the reaction was carried out at 265 ° C. for 3 hours. Thereafter, stirring was stopped, the inside of the system was pressurized to 1 MPa with nitrogen and allowed to stand for about 10 minutes, then released to an internal pressure of 0.5 MPa, and the polycondensate was extracted in a string form from the lower outlet of the pressure vessel. The string-like polymer was immediately cooled with water, and the water-cooled string-like resin was pelletized with a pelletizer. The obtained polyamide was a white tough polymer with ηr = 3.11.

[Reference Production Example 1: PA92C]
A mixture of 11.11 kg (70.2 mol) of 1,9-nonanediamine and 11.11 kg (70.2 mol) of 2-methyl-1,8-octanediamine was charged with 28.40 kg (140.4 mol) of dibutyl oxalate. Was supplied into the reaction vessel over about 17 minutes at a flow rate of 1.49 liters / minute by means of a diaphragm pump, and at the same time the temperature was raised. The internal pressure in the pressure vessel immediately after the supply increased to 0.35 MPa by butanol generated by the polycondensation reaction, and the temperature of the polycondensate increased to about 170 ° C. Thereafter, the temperature was raised to 235 ° C. over 1 hour. Meanwhile, the internal pressure was adjusted to 0.5 MPa while extracting the generated butanol from the pressure relief port. Immediately after the temperature of the polycondensate reached 235 ° C., butanol was extracted from the pressure release port over about 20 minutes, and the internal pressure was brought to normal pressure. From the normal pressure, the temperature was raised while flowing nitrogen gas at 1.5 liters / minute, the temperature of the polycondensate was brought to 260 ° C. over about 1 hour, and the reaction was carried out at 260 ° C. for 4.5 hours. . Thereafter, stirring was stopped, the inside of the system was pressurized to 1 MPa with nitrogen and allowed to stand for about 10 minutes, then released to an internal pressure of 0.5 MPa, and the polycondensate was extracted in a string form from the lower outlet of the pressure vessel. The string-like polymer was immediately cooled with water, and the water-cooled string-like resin was pelletized with a pelletizer. The obtained polyamide was a white tough polymer, and ηr = 3.35.

[Comparative Production Example 1: Production of PA92]
Using only 22.25 kg (140.4 mol) of 1,9-nonanediamine as a diamine raw material, a reaction was carried out in the same manner as in Production Example 1 to obtain a polyamide. The obtained polymer was a yellowish white polymer, and ηr = 2.78.

  Polyamide PA92 / 62T-1 to PA92 / 62T-5, PA92C, PA92, and nylon 6 (manufactured by Ube Industries, UBE nylon 1015B: PA6) produced in Production Examples 1-5, Reference Production Example 1 and Comparative Production Example 1. For nylon 66 (Ube Industries, UBE nylon 2020B: PA66) and nylon 12 (Ube Industries, UBESTA3020U: PA12), relative viscosity, melting point, crystallization temperature, 1% weight loss temperature, melt viscosity, saturated water absorption, resistance to water Chemical properties, hydrolysis resistance, mechanical properties in dry and wet conditions were measured. The results are shown in Table 1.

[Examples 1 to 18 , Comparative Examples 1 , 2, 6 to 10]
Polyamide PA92 / 62T-1 to PA92 / 62T-5, PA92 produced in Production Examples 1 to 5 and Comparative Production Example 1, and commercially available nylon 6 (UBE Nylon 1015B; U6 manufactured by Ube Industries); Nylon 66 (manufactured by Ube Industries) UBE nylon 2020B (PA66) and nylon 12 (UBESTA3020U; PA12), carbon fiber (Toho Tenax Co., Ltd., Besfite HTA-C6NR (fiber diameter 7 μm), brass fiber (fiber diameter 80 μm), Ketjen Black (Ketjen Black) The mixture of the ratio shown in Table 2 was created using EC600JD made by International) and glass fiber (ECS T-289 made by Nippon Electric Glass (fiber diameter 13 μm)).

Further, these mixtures were melt-kneaded at 290 ° C. (260 ° C. when nylon 6 was used, 290 ° C. with PA 66, 230 ° C. with nylon 12) using a twin-screw kneader with a cylinder diameter of 40 mm, and formed into a strand shape After extrusion and cooling in a water bath, pellets were prepared using a pelletizer.
Various test pieces were prepared from the obtained pellets by injection molding.

  Using the test piece obtained as described above, the surface resistance value of the molded product, mechanical properties, chemical resistance, warpage, smoothness of the molded product, and the like were evaluated. The evaluation results are shown in Table 2. In addition, the smoothness of the molded product was judged by visual observation and evaluated by ○ ×.

  The IC tray material containing the novel polyamide resin of the present invention has conductivity and has low water absorption, heat resistance, chemical resistance, flexibility, hydrolysis resistance, molded product warp, molded product smoothness. It has excellent melt processability and can be used for IC trays.

S. W. Shalaby., J. Polym. Sci., 11, 1 (1973) L. Franco et al., Macromolecules., 31, 3912 (1988)

JP 2006-57033 A Japanese National Patent Publication No. 5-506466 Patent 3036666 WO2008 / 072754

Claims (8)

The dicarboxylic acid component consists of oxalic acid,
The diamine component is from a mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine (hereinafter referred to as “C9 diamine mixture”) and 1,6-hexanediamine (hereinafter referred to as “C6 diamine”). Become
A polyamide resin composition for IC tray, comprising a conductivity imparting agent in a polyamide resin having a molar ratio of C9 diamine mixture to C6 diamine of 1:99 to 99: 1.   2. The polyamide resin has a relative viscosity (ηr) of 1.8 to 6.0 measured at 25 ° C. using a polyamide resin solution having a concentration of 1.0 g / dl using 96% sulfuric acid as a solvent. The polyamide resin composition for IC tray as described.   The polyamide resin is obtained by differential scanning calorimetry measured at a 1% weight loss temperature in a thermogravimetric analysis measured at a heating rate of 10 ° C./min in a nitrogen atmosphere and at a heating rate of 10 ° C./min in a nitrogen atmosphere. The polyamide resin composition for IC tray according to claim 1 or 2, wherein the temperature difference from the measured melting point is 50 ° C or more.   The said polyamide resin consists of a diamine component whose molar ratio of 1,9-nonanediamine and 2-methyl-1,8-octanediamine is 5: 95-95: 5. 2. The polyamide resin composition for IC trays described in 1.   The conductivity imparting agent is carbon black and / or carbon fiber. The polyamide resin composition for IC tray according to any one of claims 1 to 4.   The polyamide resin composition for IC tray according to any one of claims 1 to 5, wherein a blending ratio of the carbon black is 2 to 43 parts by mass with respect to 100 parts by mass of the whole resin.   The polyamide resin composition for IC tray according to any one of claims 1 to 6, wherein a blending ratio of the carbon fibers is 2 to 40 parts by mass with respect to 100 parts by mass of the whole resin. An IC tray using the IC tray material according to any one of claims 1 to 7 .

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