JP5446210B2 - Inkjet ink - Google Patents

Description

  The present invention relates to an ink jet ink, for example, an amic acid compound for forming an insulating film layer in the production of electronic components, an imide film formed using the compound, a film substrate on which the imide film is formed, and the film substrate. The present invention relates to an electronic component.

  Polyimide, which is a kind of compound having an imide bond (imide-based compound), is excellent in heat resistance and electrical insulation, and thus is a material widely used in the field of electronic communication (for example, Patent Document 1, Patent Document 2, (See Patent Document 3).

  However, when polyimide is used as a desired pattern film, conventionally, it has been common to form a pattern using etching or photosensitive polyimide, but various types such as a photoresist, a developer, an etchant, and a stripper are used. A large amount of chemical solution is required, and further complicated steps are required.

  Therefore, in recent years, methods for forming a desired pattern film by inkjet have been studied. Various ink-jet inks have been proposed (see, for example, Patent Document 4 and Patent Document 5). When a polyimide-based ink-jet ink is prepared, the solvent contained in the ink composition is N-methyl-2. -Because it is limited to amide solvents such as pyrrolidone, the durability of the inkjet head and the accuracy of jetting are reduced.

  In addition, since the polyamic acid is a relatively high polymer, in order to prepare an ink having an optimum viscosity as an inkjet ink, it is necessary to increase the solvent ratio to reduce the polyamic acid content in the ink. As a result, there is a problem that the thickness of the film obtained by one ink jetting is reduced.

JP 2000-039714 A JP 2003-238683 A JP 2004-094118 A JP 2003-213165 A JP 2006-131730 A

  Under the circumstances described above, there has been a demand for an inkjet ink containing an imide-based compound that can use a solvent that does not reduce the durability of the inkjet head. Further, there has been a demand for an inkjet ink that contains an imide-based compound at a high concentration in the ink and can form a relatively thick film (1 μm or more) by one jetting.

  As a result of intensive studies to solve the above problems, the present inventors have obtained a compound (A) obtained by using a monoamine (a1) and a compound (a2) having one acid anhydride group, preferably both compounds. By using an ink for ink jet containing the amic acid compound (A) obtained by the reaction and the solvent (B), an ink for ink jet with improved head damage and concentration in the ink can be obtained. The headline and the present invention were completed. The present invention provides the following ink jet ink and the like.

[1] An inkjet ink comprising a compound (A) obtained by using a monoamine (a1) and a compound (a2) having one acid anhydride group, and a solvent (B).

式（１）中、Ｒ¹とＲ²はそれぞれ独立して炭素数１〜１００の有機基である。 [2] The inkjet ink according to [1], wherein the compound (A) is an amic acid compound (A) represented by the general formula (1).

In formula (1), R ¹ and R ² are each independently an organic group having 1 to 100 carbon atoms.

式（２）中、Ｒ¹、Ｒ²及びＲ³はそれぞれ独立して水素、ハロゲンまたは炭素数１〜１００の有機基であり、Ｙは炭素数１〜２０の有機基であり、式（３）中、Ｘは炭素数１〜１００の有機基である。 [3] The above [1] or [2], wherein the monoamine (a1) is represented by the general formula (2) and the compound (a2) having one acid anhydride group is represented by the general formula (3) The ink for inkjet described in 2.

In the formula (2), R ¹ , R ² and R ³ are each independently hydrogen, halogen or an organic group having 1 to 100 carbon atoms, Y is an organic group having 1 to 20 carbon atoms, and the formula (3 ), X is an organic group having 1 to 100 carbon atoms.

[4] The inkjet ink according to any one of [1] to [3], wherein the compound (A) is contained in an amount of 5 to 80% by weight based on the total weight of the inkjet ink.

[5] Monoamine (a1) is 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 4-aminobutyltrimethoxysilane, 4-aminobutyltriethoxysilane, 4-aminobutylmethyldiethoxysilane, p-aminophenyltrimethoxysilane, p-aminophenyltriethoxysilane, p-aminophenylmethyldimethoxysilane, p-aminophenylmethyldiethoxysilane, one or more selected from the group consisting of m-aminophenyltrimethoxysilane and m-aminophenylmethyldiethoxysilane,
Compound (a2) having one acid anhydride group is phthalic anhydride, 3-methylphthalic anhydride, 4-methylphthalic anhydride, 4-tert-butylphthalic anhydride, 3-fluorophthalic anhydride, 4 -Fluorophthalic anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, succinic anhydride, glutaric anhydride, itaconic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride 4-methylcyclohexane 1,2-dicarboxylic acid anhydride, cis-4-cyclohexene-1,2-dicarboxylic acid anhydride, methylcyclohexene-1,2-dicarboxylic acid anhydride, maleic acid anhydride, citraconic acid anhydride 2,3-dimethylmaleic anhydride, allyl succinic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, Nadic acid anhydride, butyl succinic anhydride, n-octyl succinic anhydride, decyl succinic anhydride, dodecyl succinic anhydride, tetradecyl succinic anhydride, hexadecyl succinic anhydride, octadecyl succinic anhydride, 2 -Buten-1-yl succinic anhydride, 2-hexen-1-yl succinic anhydride, n-octenyl succinic anhydride, n-decenyl succinic anhydride, 2-dodecen-1-yl succinic anhydride , Tetradecenyl succinic anhydride, hexadecenyl succinic anhydride, octadecenyl succinic anhydride, p- (trimethoxysilyl) phenyl succinic anhydride, p- (triethoxysilyl) phenyl succinic anhydride, m- (trimethoxy Silyl) phenylsuccinic anhydride, m- (triethoxysilyl) E alkenyl succinate anhydrase hydride, is one or more selected from trimethoxysilylpropyl succinate anhydrase hydride and the group consisting of triethoxysilylpropyl succinate anhydrase hydride, inkjet ink according to above [3].

[6] The solvent (B) is ethyl lactate, ethanol, ethylene glycol, propylene glycol, glycerin, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether. Any one of [1] to [5] above, which is one or more selected from the group consisting of acetate, propylene glycol monomethyl ether acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, cyclohexanone and γ-butyrolactone The ink for inkjet described.

[7] N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, diethylacetamide, N with respect to the total weight of solvent (B) At least one solvent selected from the group consisting of methylpropionamide, N, N, N ′, N′-tetramethylurea, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-methylcaprolactam and carbamic acid ester The inkjet ink according to any one of [1] to [6], which is 0 to 20% by weight.

[8] N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, diethylacetamide, N with respect to the total weight of solvent (B) -One or more solvents selected from the group consisting of methylpropionamide, N, N, N ', N'-tetramethylurea, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-methylcaprolactam and carbamic acid ester The inkjet ink according to the above [7], wherein the content is 0% by weight.

[9] The monoamine (a1) is 3-aminopropyltriethoxysilane,
Compound (a2) having one acid anhydride group is phthalic anhydride, cis-4-cyclohexene-1,2-dicarboxylic acid anhydride, itaconic acid anhydride, tetradecenyl succinic acid anhydride, cis-1,2- Cyclohexanedicarboxylic anhydride, 4-methylphthalic anhydride, tetrafluorophthalic anhydride, citraconic anhydride, octadecenyl succinic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, and allyl nadic anhydride One or more selected from the group consisting of:
Compound (A) is an amic acid compound (A) obtained by reaction of monoamine (a1) with compound (a2) having one acid anhydride group,
The ink-jet ink according to the above [1], wherein the solvent (B) is diethylene glycol methyl ethyl ether.

[10] Further, the polymer compound, including one or more selected from the group consisting of an alkenyl-substituted nadiimide compound, a silicon compound, an epoxy resin, an acrylic resin, a surfactant, an antistatic agent, a coupling agent, and an epoxy curing agent, The inkjet ink according to any one of the above [1] to [9].

[11] An imide compound film or a patterned imide compound film obtained from the inkjet ink according to any one of [1] to [10].

[12] The inkjet ink according to any one of [1] to [10] is applied by an inkjet application method to form a compound (A) film, and then the compound (A) film is cured. The obtained imide compound film or patterned imide compound film.

[13] A step of coating the inkjet ink according to any one of [1] to [10] above by an inkjet coating method to form a film of the compound (A), and a curing treatment of the film of the compound (A) A method of forming an imide compound film or a patterned imide compound film, comprising the step of:

[14] A film substrate in which the imide compound film or the patterned imide compound film according to [11] or [12] is formed on a substrate.

[15] An electronic component having the film substrate according to [14].

  According to the inkjet ink according to the preferred embodiment of the present invention, for example, damage to the inkjet head can be suppressed. In addition, when the amic acid compound used in the inkjet ink according to the preferred embodiment of the present invention is used, it can be contained in the ink at a high concentration, so that the amic acid having a relatively thick film thickness by one jetting. A compound film and an imide compound film can be formed.

  In addition, when using the ink-jet ink according to a preferred embodiment of the present invention for forming a film of a patterned imide compound, it is only necessary to draw on a necessary portion by ink-jet printing. Compared to this, the amount of material used is overwhelmingly small, and it is not necessary to use a photomask, so that it is possible to mass-produce a variety of products and to reduce the number of processes required for manufacturing. The insulating film formed from the imide compound film or the patterned imide compound film of the present invention has, for example, high heat resistance and electrical insulation, and can improve the reliability and yield of electronic components.

  The present invention relates to a compound (A) obtained by using a monoamine (a1) and a compound (a2) having one acid anhydride group, preferably an amic acid compound (A) obtained by reacting both compounds, An inkjet ink containing a solvent (B), an imide compound film formation method using the ink, and the like are provided. The ink-jet ink of the present invention may be colorless or colored.

1 Compound (A) and Amido Acid Compound (A)
The compound (A) can be obtained using at least the monoamine (a1) and the compound (a2) having one acid anhydride group. For example, a product obtained by reacting them (amide acid compound) (A)), for example, these may be compounds forming a salt, and are obtained using monoamine (a1) and compound (a2) having one acid anhydride group. The compound is not limited to these as long as the compound can be used.

  The amic acid compound (A) contained in the inkjet ink of the present invention comprises a step of reacting at least one selected from the group consisting of a monoamine (a1) and a compound (a2) having one acid anhydride group. Although it can be obtained by using, it is not limited to the amic acid compound obtained by the said manufacturing method.

Examples of the amic acid compound (A) include compounds represented by the general formula (1). R ¹ in the general formula (1) is a reaction residue of the compound (a2) having one acid anhydride group, and R ² is a reaction residue of the monoamine (a1). A reaction residue means groups other than the site | part which comprises the amide bond contained in General formula (1) in the compound (a2) which has one monoamine (a1) or an acid anhydride group.
R ¹ and R ² in the general formula (1) are not particularly limited as long as they are each independently an organic group having 1 to 100 carbon atoms. The “organic group having 1 to 100 carbon atoms” is preferably an organic group having 2 to 70 carbon atoms, and more preferably an organic group having 4 to 50 carbon atoms.

Specific examples of the “organic group” include a hydrocarbon having 1 to 20 carbon atoms which may have a substituent, an alkoxy having 2 to 20 carbon atoms which may have a substituent, and a substituent. Aryloxy having 6 to 20 carbon atoms which may have, amino which may have a substituent, silyl which may have a substituent, alkylthio which may have a substituent (- SY ¹ , wherein Y ¹ represents an optionally substituted alkyl having 1 to 20 carbon atoms, and optionally substituted arylthio (—SY ² , wherein Y ² Represents an optionally substituted aryl having 6 to 18 carbon atoms), an optionally substituted alkylsulfonyl (—SO ₂ Y ³ , wherein Y ³ has a substituent. The alkyl having 1 to 20 carbon atoms which may be substituted.), An arylsulfonyl having a substituent. (-SO ₂ Y ^4,: in the formula, Y ⁴ is. To an aryl having 6 to 18 carbon atoms which may have a substituent group).

  The hydrocarbon of “C 1-20 hydrocarbon” may be saturated or unsaturated acyclic, or may be saturated or unsaturated cyclic. When the hydrocarbon having 1 to 20 carbon atoms is acyclic, it may be linear or branched. “C1-C20 hydrocarbon” includes C1-C20 alkyl, C2-C20 alkenyl, C2-C20 alkynyl, C4-C20 alkyldienyl, C6-C6. -18 aryl, C7-20 alkylaryl, C7-20 arylalkyl, C3-20 cycloalkyl, C3-20 cycloalkenyl and the like are included.

  “Alkyl having 1 to 20 carbons” is preferably alkyl having 2 to 10 carbons, and more preferably alkyl having 2 to 6 carbons. Examples of alkyl include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, t-butyl, pentyl, hexyl, dodecyl and the like.

  The “alkenyl having 2 to 20 carbon atoms” is preferably alkenyl having 2 to 10 carbon atoms, and more preferably alkenyl having 2 to 6 carbon atoms. Examples of alkenyl include vinyl, allyl, 1-propenyl, isopropenyl, 2-methyl-1-propenyl, 2-methylallyl, 2-butenyl and the like.

  “Alkynyl having 2 to 20 carbon atoms” is preferably alkynyl having 2 to 10 carbon atoms, more preferably alkynyl having 2 to 6 carbon atoms. Examples of alkynyl include ethynyl, propynyl, butynyl and the like.

  The “C4-20 alkyldienyl” is preferably C4-10 alkyldienyl, and more preferably C4-6 alkyldienyl. Examples of alkyldienyl include 1,3-butadienyl and the like.

  “C6-C18 aryl” is preferably C6-C10 aryl. Examples of aryl include phenyl, 1-naphthyl, 2-naphthyl, indenyl, biphenylyl, anthryl, phenanthryl and the like.

  The “alkyl aryl having 7 to 20 carbon atoms” is preferably alkyl aryl having 7 to 12 carbon atoms. Examples of alkylaryl include o-tolyl, m-tolyl, p-tolyl, 2,3-xylyl, 2,4-xylyl, 2,5-xylyl, o-cumenyl, m-cumenyl, p-cumenyl, and And mesityl.

  The “arylalkyl having 7 to 20 carbon atoms” is preferably arylalkyl having 7 to 12 carbon atoms. Examples of arylalkyl include benzyl, phenethyl, diphenylmethyl, triphenylmethyl, 1-naphthylmethyl, 2-naphthylmethyl, 2,2-diphenylethyl, 3-phenylpropyl, 4-phenylbutyl, and 5-phenylpentyl. Etc.

  “C3-C20 cycloalkyl” is preferably C3-C10 cycloalkyl. Examples of cycloalkyl include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and the like.

  The “C3-C20 cycloalkenyl” is preferably a C3-C10 cycloalkenyl. Examples of cycloalkenyl include cyclopropenyl, cyclobutenyl, cyclopentenyl, cyclohexenyl and the like.

  “Alkoxy having 2 to 20 carbon atoms” is preferably alkoxy having 2 to 10 carbon atoms, and more preferably alkoxy having 2 to 6 carbon atoms. Examples of alkoxy include ethoxy, propoxy, butoxy, pentyloxy and the like.

  “C6-C20 aryloxy” is preferably C6-C10 aryloxy. Examples of aryloxy include phenyloxy, naphthyloxy, biphenyloxy, and the like.

"Alkylthio (-SY ^1, in the formula, Y ¹ is an alkyl having carbon atoms of 2 to 20 optionally having a substituent.)" And "alkylsulfonyl (-SO ₂ Y ^3, wherein, Y ³ is a substituted In this case, Y ¹ and Y ³ are preferably alkyl having 2 to 10 carbons, and alkyl having 2 to 6 carbons. Is more preferable. Examples of alkyl include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, t-butyl, pentyl, hexyl, dodecyl and the like.

“Arylthio (—SY ² , wherein Y ² represents optionally substituted aryl having 6 to 18 carbon atoms)” and “Arylsulfonyl (—SO ₂ Y ⁴ , wherein Y ⁴ is substituted) In the formula (1), Y ² and Y ⁴ are preferably aryl having 6 to 10 carbon atoms. Examples of aryl include phenyl, 1-naphthyl, 2-naphthyl, indenyl, biphenylyl, anthryl, phenanthryl and the like.

“C1-C20 hydrocarbon”, “C2-C20 alkoxy”, “C6-C20 aryloxy”, “amino”, “silyl”, “alkylthio”, “arylthio”, “alkyl” Substituents may be introduced into “sulfonyl” and “arylsulfonyl”. Examples of this substitution include ester, carboxyl, amide, alkyne, trimethylsilyl, amino, phosphonyl, thio, carbonyl, nitro, sulfo, imino, halogeno, and alkoxy.
In this case, one or more substituents may be introduced at the substitutable position up to the maximum number that can be substituted, and preferably 1 to 4 substituents may be introduced. When the number of substituents is 2 or more, each substituent may be the same or different.

  Examples of “amino optionally having substituent (s)” include amino, dimethylamino, methylamino, methylphenylamino, phenylamino and the like.

  Examples of “optionally substituted silyl” include dimethylsilyl, diethylsilyl, trimethylsilyl, triethylsilyl, trimethoxysilyl, triethoxysilyl, diphenylmethylsilyl, triphenylsilyl, triphenoxysilyl, dimethylmethoxy Examples include silyl, dimethylphenoxysilyl, and methylmethoxyphenyl.

  As described above, the organic group has basically been described with a monovalent specific example, but the specific example of the divalent organic group has a group in which the valence is further increased by one in the monovalent organic group described above. Can be explained. In addition, description of the organic group in chemical formula represented by General formula (1) can be used also as description of the "organic group" in chemical formula represented by another formula number.

  Below, the monoamine (a1) and the compound (a2) which has one acid anhydride group which can be used in order to obtain an amic acid compound (A) are demonstrated.

1.1 Monoamine (a1)
As monoamine (a1), the compound represented by General formula (2) is mentioned. In the general formula (2), R ¹ , R ² and R ³ are each independently hydrogen, halogen or an organic group having 1 to 100 carbon atoms, and Y is an organic group having 1 to 20 carbon atoms. The description in General formula (1) can be used for description of an organic group.

  The monoamine (a1) is not particularly limited as long as it has one amino group. For example, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, Aminopropylmethyldiethoxysilane, 4-aminobutyltrimethoxysilane, 4-aminobutyltriethoxysilane, 4-aminobutylmethyldiethoxysilane, p-aminophenyltrimethoxysilane, p-aminophenyltriethoxysilane, p- Examples include aminophenylmethyldimethoxysilane, p-aminophenylmethyldiethoxysilane, m-aminophenyltrimethoxysilane, and m-aminophenylmethyldiethoxysilane.

  Among these, for example, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, and p-aminophenyltrimethoxysilane are preferable from the viewpoint of excellent durability of the obtained film, and 3-aminopropyltriethoxysilane is preferable. Is particularly preferred.

  These monoamines can be used alone or in combination of two or more.

1.2 Compound (a2) having one acid anhydride group
Examples of the compound (a2) having one acid anhydride group include a compound represented by the general formula (3). In general formula (3), X is a C1-C100 organic group. The description in General formula (1) can be used for description of an organic group.

  The compound (a2) having one acid anhydride group is not particularly limited as long as it has one acid anhydride group. For example, phthalic anhydride, 3-methylphthalic anhydride, 4-methylphthalic anhydride , 4-tert-butylphthalic anhydride, 3-fluorophthalic anhydride, 4-fluorophthalic anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, succinic anhydride, glutar Acid anhydride, itaconic acid anhydride, cis-1,2-cyclohexanedicarboxylic acid anhydride, 4-methylcyclohexane 1,2-dicarboxylic acid anhydride, cis-4-cyclohexene-1,2-dicarboxylic acid anhydride, methyl Cyclohexene-1,2-dicarboxylic anhydride, maleic anhydride, citraconic anhydride, 2,3-dimethylmaleic anhydride, allyl kohaka Acid anhydride, 2-buten-1-yl succinic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, allyl nadic anhydride, butyl succinic anhydride, n-octyl succinic anhydride, dodecyl Succinic anhydride, tetradecenyl succinic anhydride, octadecenyl succinic anhydride, p- (trimethoxysilyl) phenyl succinic anhydride, p- (triethoxysilyl) phenyl succinic anhydride, m- (trimethoxysilyl) Examples thereof include phenyl succinic anhydride, m- (triethoxysilyl) phenyl succinic anhydride, trimethoxysilylpropyl succinic anhydride, and triethoxysilylpropyl succinic anhydride.

1.3 Reaction conditions for synthesizing the amic acid compound (A) The amic acid compound (A) uses at least a step of reacting the monoamine (a1) with the compound (a2) having one acid anhydride group. Can be obtained.

1.3.1 Charge of reaction raw material The charge of compound (a2) having one monoamine (a1) and one acid anhydride group is one acid anhydride group per mole of monoamine (a1). It is preferable to use 0.5 to 2.0 mol of the compound (a2) having, more preferably 0.7 to 1.5 mol, and further preferably 1.0 to 1.2 mol.

1.3.2 Reaction Solvent The reaction solvent used for synthesizing the amic acid compound (A) is not particularly limited as long as the amic acid compound (A) can be synthesized. For example, diethylene glycol dimethyl ether, diethylene glycol diethyl Ether, diethylene glycol methyl ethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, cyclohexanone, γ-butyrolactone, N-methyl- Examples include 2-pyrrolidone or N, N-dimethylacetamide.

  Among these reaction solvents, when propylene glycol monomethyl ether acetate, methyl methoxypropionate, cyclohexanone, diethylene glycol methyl ethyl ether or diethylene glycol dimethyl ether is used, even if the solvent is used as an inkjet solvent after the reaction, damage to the inkjet head This is preferable because the ink can be reduced.

  These reaction solvents can be used alone or as a mixed solvent of two or more. In addition to the reaction solvent, other solvents can be mixed and used.

  The reaction solvent is preferably used in an amount of 100 parts by weight or more based on 100 parts by weight in total of the monoamine (a1) and the compound (a2) having one acid anhydride group, because the reaction proceeds smoothly. The reaction is preferably performed at 0 to 100 ° C. for 0.2 to 20 hours.

1.3.3 Order of addition to reaction system The order of addition of reaction raw materials to the reaction system is not particularly limited. That is, the compound having one acid anhydride group after dissolving the monoamine (a1) in the reaction solvent is added to the reaction solvent simultaneously with the monoamine (a1) and the compound (a2) having one acid anhydride group ( Any method can be used, such as adding a2) or dissolving the compound (a2) having one acid anhydride group in a reaction solvent and then adding the monoamine (a1).

1.4 Content of Compound (A) (Preferably Amic Acid Compound (A)) The content of compound (A) (preferably amic acid compound (A)) is 5 to 5 based on the total weight of the inkjet ink. It is preferably 80% by weight, more preferably 30 to 70% by weight, and even more preferably 30 to 50% by weight. If it is 5% by weight or more, the imide compound film that can be formed by one jetting does not become too thin, and if it is 80% by weight or less, the viscosity of the ink jet ink does not become too high and the jetting characteristics are good.

2 Solvent (B)
The inkjet ink of the present invention can be obtained, for example, by dissolving the compound (A) in the solvent (B). Therefore, the solvent contained in the inkjet ink of the present invention is not particularly limited as long as it is a solvent that can dissolve the compound (A), preferably the amic acid compound (A). In addition, even if the solvent alone does not dissolve the compound (A), preferably the amic acid compound (A), the solvent (B) contained in the ink-jet ink can be dissolved by mixing with another solvent. Can be used. In addition, as the solvent (B) contained in the inkjet ink, as described above, the reaction solvent used in the synthesis of the amic acid compound (A) may be used as it is.

2.1 Specific examples of the solvent Examples of the solvent (B) include N-methyl-2-pyrrolidone, dimethylimidazolidinone, N-methylcaprolactam, N-methylpropionamide, N, N-dimethylacetamide, dimethyl sulfoxide, N, N-dimethylformamide, N, N-diethylformamide, diethylacetamide, γ-butyrolactone, ethyl lactate, 3-methyl-3-methoxybutanol, tetralin, isophorone, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monoethyl Ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, triethylene glycol monoethyl ether, propylene glycol monobutyl ether , Propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, diethyl malonate, ethanol, 2-propanol, dioxane, or ethylene glycol, and the like.

  Among these solvents, for example, from the viewpoint of suppressing damage to the inkjet head, ethyl lactate, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, propylene glycol monomethyl ether acetate, 3-methoxypropion It preferably contains methyl acid or γ-butyrolactone.

  These solvents may be used alone or in combination of two or more.

2.2 Content of the solvent The content of the solvent (B) is preferably 20 to 95% by weight (solid content concentration is 5 to 80% by weight) with respect to the total weight of the ink jet ink. It is more preferable to set it as -70 weight% (solid content concentration is 30-70 weight%), and it is further more preferable to set it as 50-70 weight% (solid content concentration is 30-50 weight%). If it is 20% by weight or more, the viscosity of the ink jet ink does not become too high and the jetting characteristics are good, and if it is 95% by weight or less, the imide compound film that can be formed by one jetting does not become too thin. .

2.3 Relationship between Ink Surface Tension and Solvent The surface tension of the ink greatly affects the applicability of the ink jet ink. Therefore, the surface tension of the ink is preferably 20 to 45 mN / m, more preferably 27 to 42 mN / m. m, more preferably 30 to 40 mN / m. When the surface tension is in the range of 20 to 45 mN / m, the ink meniscus at the ink discharge port becomes stable, and ink discharge is good.

  In order to adjust the surface tension to a range of 20 to 45 mN / m, it is important to select a solvent. One solvent having a surface tension in the range of 20 to 45 mN / m may be used, but a solvent having a large surface tension (for example, γ-butyrolactone: 43 mN / m) and a solvent having a small surface tension (for example, diethylene glycol methyl) It is preferable to use a mixture of ethyl ether: 24 mN / m or ethylene glycol monobutyl ether: 32 mN / m because the surface tension can be finely adjusted by the solvent composition.

2.4 Solvent preferably not contained In addition, the solvent (B) contained in the inkjet ink of the present invention preferably does not contain a solvent that dissolves or corrodes the inkjet head.

  Examples of the solvent that dissolves or corrodes the inkjet head include N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, diethylacetamide, N -Methylpropionamide, N, N, N ', N'-tetramethylurea, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-methylcaprolactam, carbamic acid ester and the like.

  The content of the solvent that dissolves or corrodes the inkjet head is preferably suppressed to 0 to 20% by weight, more preferably 0 to 10% by weight, based on the total weight of the solvent (B) contained in the ink. Preferably, it is more preferable to suppress to 0% by weight.

3 Additives that may be added to the inkjet ink of the present invention The inkjet ink of the present invention is obtained, for example, by mixing a compound (A), preferably an amic acid compound (A), and a solvent (B). However, if necessary, various additives may be further contained. Examples of the various additives include polymer compounds, alkenyl-substituted nadiimide compounds, and silicon compounds.
In addition, depending on the desired properties, epoxy resins, acrylic resins, surfactants, antistatic agents, coupling agents, epoxy curing agents such as trimellitic acid, pH adjusters, rust inhibitors, antiseptics, antifungal agents In addition, additives such as antioxidants, reduction inhibitors, evaporation accelerators, chelating agents, water-soluble polymers, pigments, dyes and the like may be selected and added as necessary.

3.1 Polymer Compound The ink-jet ink of the present invention can further contain various polymer compounds. Specific examples of the polymer compound include, but are not limited to, polyamic acid, soluble polyimide, polyamide, polyamideimide, polyamic acid ester, polyester, acrylic acid polymer, acrylate polymer, polyvinyl alcohol, or polyoxyethylene. It is not something. Preferably, it is a polyimide-based polymer compound such as polyamic acid or soluble polyimide, for example, described in Japanese Patent Application No. 2006-235336, having a structural unit represented by the general formula (I-1), Preferable examples include polyamic acid having one or more molecular end groups selected from the group of molecular end groups represented by (I-2) and general formula (I-3), or an imidized polymer thereof.

式(I-1)中、Ｒ¹、Ｒ²、Ｒ³及びＲ⁴はそれぞれ独立して炭素数１〜１００の有機基である。

In formula (I-1), R ¹ , R ² , R ³ and R ⁴ are each independently an organic group having 1 to 100 carbon atoms.

3.2 Alkenyl Substituted Nadiimide Compound The inkjet ink of the present invention may further contain various alkenyl substituted nadiimide compounds. An alkenyl-substituted nadiimide compound is a compound having at least one alkenyl-substituted nadiimide structure in the molecule. Preferable examples include, but are not limited to, an alkenyl-substituted nadiimide compound represented by the general formula (II-1) described in Japanese Patent Application No. 2006-310370.

一般式(II-1)中、Ｒ¹およびＲ²はそれぞれ独立に、水素、炭素数１〜１２のアルキル、炭素数３〜６のアルケニル、炭素数５〜８のシクロアルキル、炭素数６〜１２のアリールまたはベンジルのいずれかであり、ｎは１〜２の整数であり、
ｎ＝１のとき、Ｒ³は水素、炭素数１〜１２のアルキル、炭素数１〜１２のヒドロキシアルキル、炭素数５〜８のシクロアルキル、炭素数６〜１２のアリール、ベンジル、−｛（Ｃ_qＨ_2q）Ｏ_t（Ｃ_rＨ_2rＯ）_uＣ_sＨ_2sＸ｝（ここで、ｑ、ｒ、ｓはそれぞれ独立に選ばれた２〜６の整数、ｔは０または１の整数及びｕは１〜３０の整数、Ｘは水素または水酸基である）で表されるポリオキシアルキレンアルキル、−（Ｒ）_a−Ｃ₆Ｈ₄−Ｒ⁴（ここで、ａは０または１の整数、Ｒは炭素数１〜４のアルキレン、Ｒ⁴は水素もしくは炭素数１〜４のアルキルを表す）で表される基、−Ｃ₆Ｈ₄−Ｔ−Ｃ₆Ｈ₅（ここで、Ｔは−ＣＨ₂−、−Ｃ（ＣＨ₃）₂−、−ＣＯ−、−Ｓ−もしくはＳＯ₂−である）で表される基、またはこれらの基の芳香環に直結した１〜３個の水素が水酸基で置換された基であり、
ｎ＝２のとき、Ｒ³は−Ｃ_pＨ_2p−（ここで、ｐは２〜２０の整数）で表されるアルキレン、炭素数５〜８のシクロアルキレン、−｛（Ｃ_qＨ_2qＯ）_t（Ｃ_rＨ_2rＯ）_uＣ_sＨ_2s｝−（ここで、ｑ、ｒ、ｓはそれぞれ独立に２〜６の整数、ｔは０または１の整数及びｕは１〜３０の整数である）で表されるポリオキシアルキレン、炭素数６〜１２のアリーレン、−（Ｒ）_a−Ｃ₆Ｈ₄−Ｒ⁵−（ここで、ａは０または１の整数、Ｒ及びＲ⁵は独立に選ばれた炭素数１〜４のアルキレンである）で表される基、−Ｃ₆Ｈ₄−Ｔ−Ｃ₆Ｈ₄−（ここで、Ｔは−ＣＨ₂−、−Ｃ（ＣＨ₃）₂−、−ＣＯ−、−Ｏ−、−ＯＣ₆Ｈ₄Ｃ（ＣＨ₃）₂Ｃ₆Ｈ₄Ｏ−、−Ｓ−、−ＳＯ₂−）で表される基、またはこれらの基の芳香環に直結する１〜３個の水素が水酸基で置換された基である。

In general formula (II-1), R ¹ and R ² are each independently hydrogen, alkyl having 1 to 12 carbons, alkenyl having 3 to 6 carbons, cycloalkyl having 5 to 8 carbons, or 6 to 6 carbons. 12 is either aryl or benzyl, n is an integer from 1 to 2,
When n = 1, R ³ is hydrogen, alkyl having 1 to 12 carbons, hydroxyalkyl having 1 to 12 carbons, cycloalkyl having 5 to 8 carbons, aryl having 6 to 12 carbons, benzyl,-{( _{C q H 2q) O t (} C r H 2r O) u C s H 2s X} ( where, q, r, s is an integer of from 2 to 6 selected independently, t is an integer of 0 or 1 And u is an integer of 1 to 30, X is hydrogen or a hydroxyl group,-(R) _a -C ₆ H ₄ -R ⁴ (where a is an integer of 0 or 1) , R is alkylene having 1 to 4 carbon atoms, R ⁴ is hydrogen or alkyl having 1 to 4 carbon atoms, and —C ₆ H ₄ —TC ₆ H ₅ (where T is Group represented by —CH ₂ —, —C (CH ₃ ) ₂ —, —CO—, —S— or SO ₂ —, or a group of these groups A group in which 1 to 3 hydrogen atoms directly connected to the aromatic ring are substituted with a hydroxyl group;
When n = 2, R ³ is alkylene represented by —C _p H _2p — (where p is an integer of 2 to 20), cycloalkylene having 5 to 8 carbon atoms, — {(C _q H _2q O _{) t (C r H 2r O} ) u C s H 2s} - ( wherein, q, r, s are each independently an integer of 2 to 6, t is an integer of 0 or 1 and u is 1 to 30 integer Is a polyoxyalkylene represented by formula ( ₆ ), arylene having 6 to 12 carbon atoms,-(R) _a -C ₆ H ₄ -R ^5- (where a is an integer of 0 or 1, R and R ⁵ are groups represented by independently is selected alkylene having 1 to 4 carbon _{atoms), -C 6 H 4 -T-} C 6 H 4 - ( where, T is _{-CH 2 -, - C (CH} 3 ) ₂ —, —CO—, —O—, —OC ₆ H ₄ C (CH ₃ ) ₂ C ₆ H ₄ O—, —S—, —SO ₂ —), or a group of these groups 1 to 3 directly connected to the aromatic ring Element is a substituted group with a hydroxyl group.

Among the alkenyl-substituted nadiimide compounds represented by the general formula (II-1),
R ¹ and R ² are each independently hydrogen, alkyl having 1 to 12 carbons, alkenyl having 3 to 6 carbons, cycloalkyl having 5 to 8 carbons, aryl having 6 to 12 carbons, or benzyl. Yes,
n is 2,
R ³ is alkylene represented by —C _p H _2p — (where p is an integer of 2 to 10), — (R) _a —C ₆ H ₄ —R ⁵ — (where a is 0 or An integer of 1, R and R ⁵ are independently selected alkylene having 1 to 4 carbon atoms, or —C ₆ H ₄ —T—C ₆ H ₄ — (where T is —CH ₂ —, —C (CH ₃ ) ₂ —, —CO—, —O—, —OC ₆ H ₄ C (CH ₃ ) ₂ C ₆ H ₄ O—, —S—, —SO ₂ —) An alkenyl-substituted nadiimide compound, which is a represented group, is preferred.

Among the alkenyl-substituted nadiimide compounds represented by the general formula (II-1),
R ¹ and R ² are each independently hydrogen or alkyl having 1 to 6 carbons;
n is 2,
An alkenyl-substituted nadiimide compound in which R ³ is — (CH ₂ ) ₆ —, a group represented by formula (II-2) or a group represented by formula (II-3) is preferred.

3.3 Silicon Compound The inkjet ink of the present invention may further contain a silicon compound. Specific examples of the silicon compound include, but are not limited to, silicon amide acid, which is a silicon compound having an amide acid structure in the molecule.

  Preferably, for example, as described in Japanese Patent Application No. 2007-88359, silicon amic acid represented by the general formula (III) having at least two amic acid structures in the molecule, or represented by the general formula (IV) And silicon amic acid. Among the silicon amide acids represented by the general formula (III), silicon amide acids represented by the general formula (III-1), (III-2) or (III-3) are preferable. Among the silicon amic acids represented by the general formula (IV), the silicon amic acid represented by the general formula (IV-1), (IV-2), (IV-3) or (IV-4) is preferable.

一般式(III)中、Ｘは、炭素数１〜１００の四価の有機基であり、Ｒ¹、Ｒ²及びＲ³は水素、ハロゲンまたは炭素数１〜１００の一価の有機基であり、それらは同一または異なっていてもよく、Ｙは、炭素数１〜２０の有機基である。

In the general formula (III), X is a tetravalent organic group having 1 to 100 carbon atoms, R ¹ , R ² and R ³ are hydrogen, halogen or a monovalent organic group having 1 to 100 carbon atoms. , They may be the same or different, and Y is an organic group having 1 to 20 carbon atoms.

一般式(III-1)、(III-2)又は(III-3)中、Ｒ¹、Ｒ²及びＲ³の内の少なくとも一つは、炭素数１〜２０のアルコキシ基を含み、ａは、１〜２０の整数である。

In general formula (III-1), (III-2) or (III-3), at least one of R ¹ , R ² and R ³ contains an alkoxy group having 1 to 20 carbon atoms, and a is , An integer of 1-20.

一般式(IV)中、Ｒ¹、Ｒ²及びＲ³は水素、ハロゲンまたは炭素数１〜１００の一価の有機基であり、それらは同一または異なっていてもよく、Ｙ’は、炭素数１〜２０の有機基であり、Ｘ’は炭素数１〜１００の有機基である。

In the general formula (IV), R ¹ , R ² and R ³ are hydrogen, halogen, or a monovalent organic group having 1 to 100 carbon atoms, which may be the same or different, and Y ′ is the number of carbon atoms X ′ is an organic group having 1 to 20 carbon atoms, and X ′ is an organic group having 1 to 100 carbon atoms.

一般式(IV-1)、(IV-2)、(IV-3)又は(IV-4)中、Ｒ¹、Ｒ²及びＲ³の内の少なくとも一つは、炭素数１〜２０のアルコキシ基を含み、一般式(IV-3)のＲは炭素数２〜３０の有機基であり、一般式(IV-4)のＲは水素又は炭素数１〜２０のアルキルであり、ａは、１〜２０の整数である。

In general formula (IV-1), (IV-2), (IV-3) or (IV-4), at least one of R ¹ , R ² and R ³ is an alkoxy having 1 to 20 carbon atoms. R in general formula (IV-3) is an organic group having 2 to 30 carbon atoms, R in general formula (IV-4) is hydrogen or alkyl having 1 to 20 carbon atoms, and a is It is an integer of 1-20.

3.4 Epoxy Resin The ink jet ink of the present invention may further contain an epoxy resin. The epoxy resin contained in the inkjet ink is not particularly limited as long as it has oxirane or oxetane, but a compound having two or more oxiranes is preferable.

  Although the density | concentration of the epoxy resin in an inkjet ink is not specifically limited, 0.1-20 weight% is preferable with respect to the ink jet ink total weight, and 1-10 weight% is further more preferable. Within this concentration range, the heat resistance, chemical resistance, and flatness of the coating film formed from the ink jet ink are good.

  Examples of the epoxy resin include a bisphenol A type epoxy resin, a glycidyl ester type epoxy resin, an alicyclic epoxy resin, a polymer of a monomer having an oxirane, or a copolymer of a monomer having an oxirane and another monomer. It is done.

Specific examples of the monomer having oxirane include glycidyl (meth) acrylate, 3,4-epoxycyclohexyl (meth) acrylate, and methyl glycidyl (meth) acrylate.
Specific examples of the monomer having an oxirane and other monomers copolymerized include (meth) acrylic acid, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) ) Acrylate, iso-butyl (meth) acrylate, tert-butyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, styrene , Methylstyrene, chloromethylstyrene, (3-ethyl-3-oxetanyl) methyl (meth) acrylate, N-cyclohexylmaleimide, N-phenylmaleimide and the like.

  Preferred examples of the polymer of the monomer having oxirane and the copolymer of the monomer having oxirane and another monomer include polyglycidyl methacrylate, methyl methacrylate-glycidyl methacrylate copolymer, benzyl methacrylate-glycidyl methacrylate copolymer, n-butyl methacrylate-glycidyl methacrylate copolymer, 2-hydroxyethyl methacrylate-glycidyl methacrylate copolymer, (3-ethyl-3-oxetanyl) methyl methacrylate-glycidyl methacrylate copolymer, styrene-glycidyl methacrylate copolymer, etc. Is mentioned.

Specific examples of the epoxy resin include trade names “jER807”, “jER815”, “jER825”, “jER825”, “jER828”, “jER190P”, “jER191P”, “jER1004”, “jER1256” (above, Japan Epoxy). Resin Co., Ltd.), trade name "AER" (Asahi Kasei Epoxy Co., Ltd.), trade name "Celoxide 2021P", "Celoxide 3000", "EHPE-3150" (Daicel Chemical Industries, Ltd.), trade name “Techmore VG3101L” (Mitsui Chemicals, Inc.), N, N, N ′, N′-tetraglycidyl-m-xylenediamine, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, or N , N, N ′, N′-tetraglycidyl-4,4′-diaminodiphenylmethane and the like.
Among these, the trade name “AER”, the trade name “Celoxide 2021P”, the trade name “Techmore VG3101L”, and the trade name “jER828” are preferable because the flatness of the resulting imide compound film is particularly good.

Only one type of epoxy resin may be used, or two or more types may be mixed and used.
It is preferable that the ink-jet ink contains these epoxy resins because the heat resistance of the coating film formed from the ink-jet ink is improved.

3.5 Acrylic Resin The ink jet ink of the present invention may further contain an acrylic resin. The acrylic resin contained in the inkjet ink is not particularly limited as long as it has an acrylic group or a methacrylic group.

  The concentration of the acrylic resin in the inkjet ink is not particularly limited, but is preferably 0.1 to 20% by weight, more preferably 1 to 10% by weight with respect to the total weight of the inkjet ink. Within this concentration range, the heat resistance, chemical resistance, and flatness of the coating film formed from the ink jet ink are good.

  Examples of the acrylic resin include a monofunctional polymerizable monomer having hydroxyl, a monofunctional polymerizable monomer having no hydroxyl, a bifunctional (meth) acrylate, or a trifunctional or higher polyfunctional (meth) acrylate.

  Specific examples of the monofunctional polymerizable monomer having hydroxyl include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, or 1,4-cyclohexanedimethanol mono (Meth) acrylate etc. are mentioned. Among these, 4-hydroxybutyl acrylate or 1,4-cyclohexanedimethanol monoacrylate is particularly preferable because the formed film is flexible.

Specific examples of the monofunctional polymerizable monomer having no hydroxyl include glycidyl (meth) acrylate, 3,4-epoxycyclohexyl (meth) acrylate, methyl glycidyl (meth) acrylate, and 3-methyl-3- (meth) acryloxy. Methyl oxetane, 3-ethyl-3- (meth) acryloxymethyl oxetane, 3-methyl-3- (meth) acryloxyethyl oxetane, 3-ethyl-3- (meth) acryloxyethyl oxetane, p-vinylphenyl- 3-ethyloxeta-3-ylmethyl ether, 2-phenyl-3- (meth) acryloxymethyloxetane, 2-trifluoromethyl-3- (meth) acryloxymethyloxetane, 4-trifluoromethyl-2- (meth) ) Acryloxymethyl oxetane, (meth) acrylic acid, Chill (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, iso-butyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) Acrylate, styrene, methylstyrene, chloromethylstyrene, (3-ethyl-3-oxetanyl) methyl (meth) acrylate, N-cyclohexylmaleimide, N-phenylmaleimide, vinyltoluene, (meth) acrylamide, tricyclo [5.2. 1.0 ^2,6 ] decanyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, phenyl (meth) acrylate, glycerol mono (meth) acrylate , Polystyrene macromonomer, polymethyl methacrylate macromonomer, N-acryloylmorpholine, 5-tetrahydrofurfuryloxycarbonylpentyl (meth) acrylate, (meth) acrylate of ethylene oxide adduct of lauryl alcohol, (meth) acrylic acid, crotonic acid, α-chloroacrylic acid, cinnamic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, mesaconic acid, ω-carboxypolycaprolactone mono (meth) acrylate, succinic acid mono [2- (meth) acryloyloxyethyl] , Mono [2- (meth) acryloyloxyethyl maleate], or mono [2- (meth) acryloyloxyethyl] cyclohexene-3,4-dicarboxylate.

  Specific examples of the bifunctional (meth) acrylate include bisphenol F ethylene oxide modified diacrylate, bisphenol A ethylene oxide modified diacrylate, isocyanuric acid ethylene oxide modified diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol diacrylate, pentaerythritol. Diacrylate monostearate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate, 1,4-cyclohexanedimethanol diacrylate, 2-n-butyl-2 -Ethyl-1,3-propanediol diacrylate, trimethylolpropane diacrylate, or dipentaerythritol dia Relate and the like.

  Specific examples of trifunctional or higher polyfunctional (meth) acrylates are trimethylolpropane tri (meth) acrylate, ethylene oxide modified trimethylolpropane tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, epichlorohydrin modified Trimethylolpropane tri (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, glycerol tri (meth) acrylate, epichlorohydrin-modified glycerol tri (meth) acrylate, diglycerin tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, Pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, alkyl-modified dipenta Rithritol penta (meth) acrylate, alkyl-modified dipentaerythritol tetra (meth) acrylate, alkyl-modified dipentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, Examples include ethylene oxide-modified tri (meth) acrylate phosphate, tris [(meth) acryloxyethyl] isocyanurate, caprolactone-modified tris [(meth) acryloxyethyl] isocyanurate, or urethane (meth) acrylate.

  These acrylic resins may be used alone or in combination of two or more.

3.6 Surfactant When it is desired to improve the applicability of the ink-jet ink of the present invention, a surfactant suitable for the purpose may be added. Specific examples of the surfactant include trade names “Byk-300”, “Byk-306”, “Byk-335”, “Byk-310”, “Byk-341”, “Byk-344”, “Byk-”. Silicone surfactants such as “370” (by Big Chemie Japan); acrylics such as “Byk-354”, “ByK-358”, “Byk-361” (by Big Chemie Japan) Fluorosurfactants such as system surfactants, trade names “DFX-18”, “Factent 250”, or “Factent 251” (manufactured by Neos Co., Ltd.).
These surfactants may be used alone or in combination of two or more.

  The surfactant is used, for example, to improve the wettability, leveling property, or coating property to the base substrate, and is added in an amount of 0.01 to 1% by weight based on the total weight of the inkjet ink. It is preferable to use it.

3.7 Antistatic Agent The antistatic agent is not particularly limited, and a known antistatic agent can be used. Specific examples include metal oxides such as tin oxide, tin oxide / antimony oxide composite oxide, and tin oxide / indium oxide composite oxide, and quaternary ammonium salts.
These antistatic agents may be used alone or in combination of two or more.

  The antistatic agent is used, for example, to prevent charging, and is preferably used by adding 0.01 to 1% by weight with respect to the total weight of the ink-jet ink.

3.8 Coupling Agent The coupling agent is not particularly limited, and a known coupling agent can be used. The coupling agent to be added is preferably a silane coupling agent, and specific examples include trialkoxysilane compounds or dialkoxysilane compounds. Preferably, for example, γ-vinylpropyltrimethoxysilane, γ-vinylpropyltriethoxysilane, γ-acryloylpropylmethyldimethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-acryloylpropylmethyldiethoxysilane, γ-acryloylpropyl Triethoxysilane, γ-methacryloylpropylmethyldimethoxysilane, γ-methacryloylpropyltrimethoxysilane, γ-methacryloylpropylmethyldiethoxysilane, γ-methacryloylpropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycyl Sidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-aminopropylmethyl Rudimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-aminoethyl-γ-iminopropylmethyldimethoxysilane, N-aminoethyl-γ-aminopropyl Trimethoxysilane, N-aminoethyl-γ-aminopropyltodiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropylmethyl Dimethoxysilane, N-phenyl-γ-aminopropylmethyldiethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, γ-mercaptopro Le triethoxysilane, .gamma. isocyanate propyl methyl diethoxy silane, or .gamma. isocyanate propyl triethoxysilane, and the like.
Among these, γ-vinylpropyltrimethoxysilane, γ-acryloylpropyltrimethoxysilane, γ-methacryloylpropyltrimethoxysilane, or γ-isocyanatopropyltriethoxysilane is more preferable.

These coupling agents may be used alone or in combination of two or more.
The coupling agent is preferably added in an amount of 0.01 to 3% by weight based on the total weight of the inkjet ink.

3.9 Epoxy Curing Agent The epoxy curing agent is not particularly limited, and a known epoxy curing agent can be used. Specific examples include organic acid dihydrazide compounds, imidazole and derivatives thereof, dicyandiamide, aromatic amines, polyvalent carboxylic acids, and polyvalent carboxylic acid anhydrides. More specifically, dicyandiamides such as dicyandiamide, adipic acid dihydrazide, organic acid dihydrazides such as 1,3-bis (hydrazinocarboethyl) -5-isopropylhydantoin, 2,4-diamino-6- [2′- Ethylimidazolyl- (1 ′)]-ethyltriazine, 2-phenylimidazole, 2-phenyl-4-methylimidazole, imidazole derivatives such as 2-phenyl-4-methyl-5-hydroxymethylimidazole, phthalic anhydride, Examples include merit acid and acid anhydrides such as 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride.
Among these, trimellitic acid and 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride having good transparency are preferable.

These epoxy curing agents may be used alone or in combination of two or more.
The epoxy curing agent is preferably used by adding 0.2 to 5% by weight based on the total weight of the inkjet ink.

4 Viscosity of inkjet ink Although the viscosity of inkjet ink is not particularly limited, when jetting is performed at room temperature (25 ° C.), if the viscosity is 1 to 50 mPa · s, the jetting accuracy by the inkjet coating method is high. It is preferable in terms of improvement. Moreover, the viscosity of the ink for inkjet at 25 degreeC becomes like this. More preferably, it is 5-30 mPa * s, More preferably, it is 8-20 mPa * s (25 degreeC).

  When jetting by heating the ink head, the viscosity of the inkjet ink at a heating temperature (preferably 40 to 120 ° C.) is preferably 1 to 50 mPa · s, more preferably 5 to 30 mPa · s, and 8 ˜20 mPa · s is particularly preferred.

5 Film of imide compound The film of the imide compound of the present invention is formed on the entire surface or in a predetermined pattern by applying the inkjet ink of the present invention to the substrate surface by inkjet, for example, and heat-treating it with a hot plate or oven. It can be obtained as a film of a imide compound in the form of a line (for example, a line). The formation of the imide compound film of the present invention is not limited to heat treatment, and may be treatment with UV treatment, ion beam, electron beam, gamma ray or the like.

5.1 Application of inkjet ink by inkjet method There are various types of inkjet application methods depending on the ink ejection method. Examples of the discharge method include a piezoelectric element type, a bubble jet (registered trademark) type, a continuous injection type, and an electrostatic induction type. The ink according to the present invention can be jetted by various methods by appropriately selecting each component contained in the ink, and the ink for inkjet can be applied in a predetermined pattern.

  A preferable ejection method for performing coating using the ink according to the present invention is a piezoelectric element type. The piezoelectric element-type head includes a nozzle forming substrate having a plurality of nozzles, a pressure generating element made of a piezoelectric material and a conductive material disposed opposite to the nozzles, and ink filling the periphery of the pressure generating element. An on-demand ink jet coating head displaces a pressure generating element by an applied voltage and ejects a small droplet of ink from a nozzle.

  The ink jet coating apparatus is not limited to the one in which the coating head and the ink container are separated, and may be one in which they are integrated so as not to be separated. The ink container is integrated with the application head so as to be separable or non-separable and mounted on the carriage, and is provided at a fixed portion of the apparatus so that the ink is supplied to the application head via an ink supply member, for example, a tube. It may be in the form of supplying.

  In addition, when the ink tank is provided with a structure for applying a preferable negative pressure to the coating head, a configuration in which an absorber is disposed in the ink storage portion of the ink tank, or a flexible ink storage bag and the same It is possible to adopt a form having a spring portion that exerts an urging force in the direction of expanding the internal volume. The coating apparatus may take the form of a line printer in which coating elements are aligned over a range corresponding to the entire width of the coating medium, in addition to the serial coating method as described above.

5.2 Formation of Amic Acid Compound Film After applying the inkjet ink of the present invention onto a substrate by inkjet using an inkjet coating method, the solvent is vaporized by heating in a hot plate or oven. A film of an amic acid compound can be formed by removing, that is, drying.

  Although the heating conditions vary depending on the type and blending ratio of each component, a film of an amic acid compound is usually formed at 70 to 120 ° C. for 5 to 15 minutes when using an oven and 1 to 5 minutes when using a hot plate. The

5.3 Formation of Imide Compound Film After forming the amic acid compound film, in order to imidize the amic acid, 180 to 350 ° C., preferably 200 to 300 ° C., and 30 to 90 minutes when using an oven, When a hot plate is used, an imide compound film can be obtained by heat treatment for 5 to 30 minutes. When the amic acid compound film is formed in a pattern, a patterned imide compound film is formed. In this specification, unless otherwise specified, the imide compound film includes a patterned imide compound film.

6 Film substrate The film substrate of the present invention is formed on the entire surface or a predetermined pattern (line shape) of the ink-jet ink of the present invention by an ink-jet coating method on a substrate such as a polyimide film on which wiring is formed by a method such as ink-jet. Etc.), and then the substrate is dried and further heated to form a polyimide film.
The polyimide film that can be used in the present invention is preferably formed on a substrate such as the polyimide film described above, but is not particularly limited thereto, and can be formed on a known substrate.
As a substrate applicable to the present invention, for example, a glass epoxy substrate, a glass composite substrate, a paper phenol substrate, conforming to various standards such as FR-1, FR-3, FR-4, CEM-3, or E668, Examples thereof include printed wiring boards such as paper epoxy boards, green epoxy boards, and BT resin boards.
Other substrates applicable to the present invention include substrates made of metals such as copper, brass, phosphor bronze, beryllium copper, aluminum, gold, silver, nickel, tin, chromium, and stainless steel (the surfaces of those metals). Or aluminum oxide (alumina), aluminum nitride, zirconium oxide (zirconia), zirconium silicate (zircon), magnesium oxide (magnesia), aluminum titanate, barium titanate, titanium Lead oxide (PT), lead zirconate titanate (PZT), lead lanthanum zirconate titanate (PLZT), lithium niobate, lithium tantalate, cadmium sulfide, molybdenum sulfide, beryllium oxide (beryllia), silicon oxide (silica) , Silicon carbide (silicon carbide), silicon nitride (silicon Toride), boron nitride (boron nitride), zinc oxide, mullite, ferrite, steatite, holsterite, spinel, substrate made of ceramics such as spojumen (may be a substrate having the surface of those ceramics), PET (polyethylene terephthalate) resin, PBT (polybutylene terephthalate) resin, PCT (polycyclohexylene dimethylene terephthalate) resin, PPS (polyphenylene sulfide) resin, polycarbonate resin, polyacetal resin, polyphenylene ether resin, polyamide resin, polyarylate resin , Polysulfone resin, polyethersulfone resin, polyetherimide resin, polyamideimide resin, epoxy resin, acrylic resin, Teflon (registered trademark), thermoplastic resin A substrate made of a resin such as a streamer or a liquid crystal polymer (may be a substrate having the surface of the resin); a semiconductor substrate such as silicon, germanium, or gallium arsenide; a glass substrate; or a tin oxide, an oxide A substrate on which an electrode material such as zinc, ITO, or ATO is formed; αGEL (alpha gel), βGEL (beta gel), θGEL (theta gel), γGEL (gamma gel), ΣGEL (sigma gel) or λGEL (lambda gel) ( As mentioned above, gel sheets such as a registered trademark of Taika Co., Ltd. and the like can be mentioned.

7 Electronic components For example, the ink-jet ink of the present invention is applied to a substrate such as a polyimide film on which wiring is formed in advance by an ink-jet coating method, and then the film substrate is dried and further heated to be insulative. A flexible electronic component covered with a film of an imide compound having

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention, this invention is not limited to these Examples.

The names of monoamine (a1), solvent (B), and additives used in Examples and Comparative Examples are abbreviated. This abbreviation is used in the following description.
Monoamine (a1)
S330: 3-aminopropyltriethoxysilane
Solvent (B)
EDM: Diethylene glycol methyl ethyl ether NMP: N-methyl-2-pyrrolidone
Additives or raw materials thereof ODPA: 3,3 ′, 4,4′-diphenyl ether tetracarboxylic dianhydride DDS: 3,3′-diaminodiphenyl sulfone BANI-X: N, N′-m-xylylene-bis (allyl) Bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide) (manufactured by Maruzen Petrochemical Co., Ltd.)
BANI-M: bis {4- (allylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide) phenyl} methane (manufactured by Maruzen Petrochemical Co., Ltd.)

  The viscosity of the solution was measured at 25 ° C. with an E-type viscometer (VISCONIC ELD manufactured by TOKYO KEIKI).

Example 1 Inkjet ink (1)
To the reaction vessel, phthalic anhydride (2.004 g), S330 (2.996 g) and EDM (5.00 g) were added and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 11.4 mPa · s.

  Ink-jet ink (1) is used as ink-jet ink, and the ink-jet coating apparatus DMP-2831 (manufactured by FUJIFILM Dimatix) is used to set a dot pitch of 25 μm with a dot width of 1.5 μm on a 1.5 mm thick glass plate. Was applied at room temperature (25 ° C.). The heater setting of the inkjet head was set to OFF, the piezoelectric voltage was 16 V, and the driving frequency was 5 kHz. Next, the substrate was dried on an 80 ° C. hot plate for 5 minutes, and then heated in an oven at 230 ° C. for 30 minutes to obtain an insulating imide compound film formed in a line shape.

The line width and edge linearity of the obtained imide compound film were observed with an optical microscope, and the film thickness was further measured. The film thickness was determined by using a stylus-type film thickness meter α step 200 (manufactured by KLA-Tencor Japan Co., Ltd.), and taking the average value of the measured values at three locations as the film thickness.
The line width of the obtained imide compound film was 80 μm, and the linearity of the edge was not jagged and was good. The film thickness of the obtained imide compound film line was 1.4 μm.

Example 2 Inkjet ink (2)
To the reaction vessel, cis-4-cyclohexene-1,2-dicarboxylic anhydride (2.038 g), S330 (2.964 g) and EDM (5.003 g) were added and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 9.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 3 Inkjet ink (3)
Itaconic anhydride (1.686 g), S330 (3.321 g) and EDM (5.007 g) were added to the reaction vessel and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 10.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 4 Inkjet ink (4)
Tetradecenyl succinic anhydride (2.859 g), S330 (2.148 g) and EDM (5.002 g) were added to the reaction vessel and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 10.3 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 5 Inkjet ink (5)
To the reaction vessel, cis-1,2-cyclohexanedicarboxylic anhydride (2.083 g), S330 (2.943 g) and EDM (4.999 g) were added and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 10.3 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 6 Ink for inkjet (6)
4-Methylphthalic anhydride (2.120 g), S330 (2.889 g) and EDM (5.000 g) were added to the reaction vessel, and the mixture was stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 12.0 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 7 Inkjet ink (7)
Tetrafluorophthalic anhydride (1.873 g), S330 (1.881 g) and EDM (3.753 g) were added to the reaction vessel, and the mixture was stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 11.1 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

[Example 8] Inkjet ink (8)
Citraconic anhydride (1.687 g), S330 (3.321 g) and EDM (5.001 g) were added to the reaction vessel and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid concentration in the ink was 50% by weight, and the viscosity of the ink was 6.9 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

[Example 9] Ink for inkjet (9)
Octadecenyl succinic anhydride (3.068 g), S330 (1.937 g) and EDM (5.003 g) were added to the reaction vessel and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 11.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 10 Inkjet ink (10)
To the reaction vessel, 5-norbornene-2,3-dicarboxylic acid anhydride (2.129 g), S330 (2.871 g) and EDM (5.000 g) were added and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 11.4 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 11 Inkjet ink (11)
Allyl nadic acid anhydride (1.201 g), S330 (1.302 g) and EDM (2.500 g) were added to the reaction vessel and stirred at room temperature for 3 hours. The reaction solution after the reaction was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 10.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 12 Inkjet ink (12)
S330 (2.1422 g), ODPA (1.5016 g) and EDM (3.6438 g) were added to the reaction vessel and stirred at room temperature for 3 hours. Further, the total amount of the reaction mixture was mixed with inkjet ink (1) (10.7192 g) and EDM (1.9982 g). The obtained mixture was used as an ink. The solid concentration in the ink was 45% by weight, and the viscosity of the ink was 14.7 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 13 Inkjet ink (13)
S330 (1.1851 g), ODPA (0.3960 g) and EDM (1.5832 g) were added to the reaction vessel and stirred at room temperature for 3 hours. Further, the entire amount of the reaction mixture was mixed with inkjet ink (1) (2.8454 g) and EDM (3.9966 g). The obtained mixture was used as an ink. The solid content concentration in the ink was 30% by weight, and the viscosity of the ink was 5.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 14 Inkjet ink (14)
To the reaction vessel, BANI-X (6.0048 g) and EDM (4.0012 g) were added and stirred at room temperature for 3 hours to obtain an intermediate mixture. Further, this intermediate mixture (1.6682 g), inkjet ink (1) (8.0004 g) and EDM (0.3385 g) were mixed. The obtained mixture was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 11.4 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

[Example 15] Ink for inkjet (15)
The intermediate mixture (3.3331 g) of Example 14, ink-jet ink (1) (5.9984 g), and EDM (0.6689 g) were mixed in a reaction vessel. The obtained mixture was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 12.2 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 16 Inkjet ink (16)
To the reaction vessel, BANI-M (5.9985 g) and EDM (3.9990 g) were added and stirred at room temperature for 3 hours to obtain an intermediate mixture. Further, this intermediate mixture (1.6669 g), inkjet ink (1) (7.9980 g) and EDM (0.3346 g) were mixed. The obtained mixture was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 12.6 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

Example 17 Inkjet ink (17)
The intermediate mixture (3.3329 g) of Example 16, ink-jet ink (1) (5.9994 g), and EDM (0.6702 g) were mixed in a reaction vessel. The obtained mixture was used as an ink. The solid content concentration in the ink was 50% by weight, and the viscosity of the ink was 15.0 mPa · s.
Next, using this ink, line coating and production of an imide compound film were performed in the same manner as in Example 1, and then the obtained imide compound film line width, edge linearity, and line film were obtained. The thickness was evaluated. The evaluation results were almost the same as in Example 1 (see Table 1).

[Comparative Example 1] Inkjet ink (C1)
Raw materials were charged into a 500 ml four-necked flask as shown below, stirred for 10 hours at 40 ° C. in a dry nitrogen stream, then heated to 70 ° C. and stirred for 8 hours to reduce the viscosity. An 8 wt% solution of acid was obtained. This solution was directly used as inkjet ink (C1).
ODPA 20.0g
DDS 16.0g
NMP 414.0g

  The viscosity of the inkjet ink (C1) was measured under the same conditions as in Example 1. As a result, the viscosity was 9.1 mPa · s (25 ° C.). In addition, in the inkjet ink (C1), when EDM is used as a solvent, a reaction product is precipitated. Therefore, the weight average molecular weight measured by GPC using NMP was 25,000.

Next, using this ink (C1), after line coating and production of an imide compound film in the same manner as in Example 1, the line width, edge linearity of the obtained imide compound film and The film thickness of the line was evaluated.
As a result, the line width of the film of the imide compound was 610 to 680 μm, which was significantly wider than the width when applied. Moreover, the linearity of the edge was insufficient and there was a jaggedness. Furthermore, the film thickness of the line was 0.4 μm, and a sufficient thickness could not be obtained.

  Examples of the utilization method of the present invention include an insulating film for a flexible wiring board and an electronic component using the same.

Claims (11)

An inkjet ink comprising an amic acid compound (A) obtained using a monoamine (a1) and a compound (a2) having one acid anhydride group, and a solvent (B),
Monoamine (a1) is 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, 4-aminobutyltrimethoxysilane, 4-amino Butyltriethoxysilane, 4-aminobutylmethyldiethoxysilane, p-aminophenyltrimethoxysilane, p-aminophenyltriethoxysilane, p-aminophenylmethyldimethoxysilane, p-aminophenylmethyldiethoxysilane, m-amino One or more selected from the group consisting of phenyltrimethoxysilane and m-aminophenylmethyldiethoxysilane,
Compound (a2) having one acid anhydride group is phthalic anhydride, 3-methylphthalic anhydride, 4-methylphthalic anhydride, 4-tert-butylphthalic anhydride, 3-fluorophthalic anhydride, 4 -Fluorophthalic anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, succinic anhydride, glutaric anhydride, itaconic anhydride, cis-1,2-cyclohexanedicarboxylic anhydride 4-methylcyclohexane 1,2-dicarboxylic acid anhydride, cis-4-cyclohexene-1,2-dicarboxylic acid anhydride, methylcyclohexene-1,2-dicarboxylic acid anhydride, maleic acid anhydride, citraconic acid anhydride 2,3-dimethylmaleic anhydride, allyl succinic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, Nadic acid anhydride, butyl succinic anhydride, n-octyl succinic anhydride, decyl succinic anhydride, dodecyl succinic anhydride, tetradecyl succinic anhydride, hexadecyl succinic anhydride, octadecyl succinic anhydride, 2 -Buten-1-yl succinic anhydride, 2-hexen-1-yl succinic anhydride, n-octenyl succinic anhydride, n-decenyl succinic anhydride, 2-dodecen-1-yl succinic anhydride , Tetradecenyl succinic anhydride, hexadecenyl succinic anhydride, octadecenyl succinic anhydride, p- (trimethoxysilyl) phenyl succinic anhydride, p- (triethoxysilyl) phenyl succinic anhydride, m- (trimethoxy Silyl) phenylsuccinic anhydride, m- (triethoxysilyl) E alkenyl succinate anhydrase hydride, is one or more selected from trimethoxysilylpropyl succinate anhydrase hydride and the group consisting of triethoxysilylpropyl succinate anhydrase hydride, ink jet inks. Solvent (B) is ethyl lactate, ethanol, ethylene glycol, propylene glycol, glycerin, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monoethyl ether acetate, propylene 2. The inkjet ink according to claim 1 , which is at least one selected from the group consisting of glycol monomethyl ether acetate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, cyclohexanone, and γ-butyrolactone. N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, diethylacetamide, N-methylpropion with respect to the total weight of solvent (B) One or more solvents selected from the group consisting of amide, N, N, N ′, N′-tetramethylurea, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-methylcaprolactam and carbamic acid ester are 0-20 The inkjet ink according to claim 1 or 2 , wherein the inkjet ink is in wt%. N-methylformamide, N, N-dimethylformamide, N, N-diethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, diethylacetamide, N-methylpropion with respect to the total weight of solvent (B) The content of one or more solvents selected from the group consisting of amide, N, N, N ′, N′-tetramethylurea, 2-pyrrolidone, N-methyl-2-pyrrolidone, N-methylcaprolactam and carbamic acid ester The inkjet ink according to claim 3 , wherein the inkjet ink is 0% by weight. Monoamine (a1) is 3-aminopropyltriethoxysilane;
Compound (a2) having one acid anhydride group is phthalic anhydride, cis-4-cyclohexene-1,2-dicarboxylic acid anhydride, itaconic acid anhydride, tetradecenyl succinic acid anhydride, cis-1,2- Cyclohexanedicarboxylic anhydride, 4-methylphthalic anhydride, tetrafluorophthalic anhydride, citraconic anhydride, octadecenyl succinic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, and allyl nadic anhydride One or more selected from the group consisting of :
The inkjet ink according to claim 1, wherein the solvent (B) is diethylene glycol methyl ethyl ether. Further, the polymer compound, an alkenyl-substituted nadimide compound, comprising silicon compounds, epoxy resins, acrylic resins, surfactants, antistatic agents, coupling agents, and one or more selected from the group consisting of an epoxy curing agent of claim 1 The ink for inkjets in any one of -5 . An imide compound film or a patterned imide compound film obtained from the ink jet ink according to claim 1 . An imide compound obtained by applying the inkjet ink according to any one of claims 1 to 6 by an inkjet coating method to form a film of the compound (A), and then curing the film of the compound (A). Film or patterned imide compound film. An imide comprising a step of applying the inkjet ink according to claim 1 by an inkjet coating method to form a film of the compound (A), and a step of curing the film of the compound (A). A method for forming a compound film or a patterned imide compound film. A film substrate in which a film of the imide compound according to claim 7 or 8 or a film of a patterned imide compound is formed on a substrate. An electronic component having the film substrate according to claim 10 .