JP5443555B2 - Illumination light source and illumination device - Google Patents

Description

  The present invention relates to an illumination light source and an illumination device having a semiconductor light emitting element, a base, and a circuit unit.

There are various illumination light sources as alternatives to incandescent bulbs.
In recent years, for example, a light bulb-shaped illumination light source (hereinafter referred to as “LED light source”) using a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light emitter is becoming widespread.

  In such an LED light source, an LED and a circuit unit for emitting the LED are stored in an envelope including a globe and a case. More specifically, a plurality of LEDs, a mounting member for mounting the plurality of LEDs, a cylindrical case having a cylindrical shape and one end closed by the mounting member, and the other end of the case are mounted. It has a base, a circuit unit that is stored inside the case and emits a plurality of LEDs, and a glove that is attached to one end of the case (see, for example, Patent Document 1).

  In addition to LEDs, an illumination light source using an arc tube as a light emitter, such as a bulb-type fluorescent lamp, also contains an arc tube and a circuit unit in an envelope composed of a case and a globe. More specifically, the arc tube, a holding member that holds the arc tube, a cylindrical case that is cylindrical and closed at one end by the holding member, and a base that is attached to the other end of the case A circuit unit that is stored inside the case and causes the arc tube to emit light, and a glove that is attached to one end of the case (see, for example, Patent Document 2).

  As a method for attaching the glove, for example, a method of fixing with an adhesive in a state where the opening side end of the glove is inserted into a groove formed between the outer peripheral surface of the mounting member or the holding member and the inner peripheral surface of the case, There is a method in which a claw extending downward from the opening side end portion of the globe is elastically deformed and engaged with the inside of the opening side end portion of the case.

International Publication No. 2010/090012 JP 2009-164073 A

  However, when an adhesive is used in the glove mounting method described in Patent Document 1 or Patent Document 2, the adhesive is filled in the groove between the mounting member and the case or between the holding member and the case. However, if the amount of the adhesive is small or the adhesive is small, the bonding force between the glove and the case is lowered, and if the adhesive is large, the adhesive protrudes from the case and the appearance is deteriorated.

  In addition, when using an engaging structure using elastically deformable claws for the glove mounting method, if the elastic deformation of the claws at the time of engagement is too large, the claws will break, so the mold for providing the claws There are problems such as the need for high precision.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination light source in which a glove can be attached at a low cost and the glove is hardly detached.

A light source for illumination according to the present invention includes a plurality of semiconductor light emitting elements as light sources, a base on which the plurality of semiconductor light emitting elements are mounted on the front surface, and a circuit unit for lighting the plurality of semiconductor light emitting elements. The base has a through hole penetrating from the front surface to the rear surface, and a part of the circuit unit is disposed in the through hole.
The illumination light source described in the present specification is an illumination light source having a light emitter in an envelope in which an opening end of the globe is inserted into a mounting recess located on one end of the case. The end portion is made of a material that can be deformed by heat, and has a deformed portion that is deformed into a shape that engages with the mounting recess due to heat.

  The term “engagement” as used herein means that the glove can move with respect to the case when the opening side end of the glove is engaged with the mounting groove so that the glove cannot move with respect to the case. Including a case where the opening side end portion of the lobe engages with the mounting groove when is in a predetermined position with respect to the case.

  Further, the deforming portion may be at the tip of the opening side end portion, or may be in front of the tip. That is, the shape is not particularly limited as long as it can be engaged in the mounting recess.

  Since the illumination light source described in the present specification has a deformed portion deformed into a shape that engages with the mounting recess due to heat, the glove can be mounted on the case without using an adhesive. The troublesomeness when using a conventional adhesive is eliminated. In addition, after the opening side end portion is inserted into the mounting recess, the opening side end portion is deformed by heat, so that the dimensional accuracy of the opening side end portion only needs to be acceptable for insertion into the mounting recess, The precision of the metal mold | die required in the case of the engagement structure by the conventional nail | claw becomes unnecessary.

  Moreover, the back side area | region of the said mounting recessed part has spread in the direction orthogonal to the insertion direction of the said opening side edge part rather than the entrance side area | region. Here, “spread in the orthogonal direction” means that there is a component in the orthogonal direction when the component in the direction in which the back region expands is decomposed into a component in the direction orthogonal to the component in the insertion direction. Say.

  Further, the bottom surface of the back side region of the mounting recess is an inclined surface that guides the tip of the opening side end portion in the orthogonal direction, and the opening side end portion is deformed along the inclined surface. It is characterized by having. Here, “guide in the orthogonal direction” means that the component in the direction in which the deformed portion (or the portion to be deformed) at the opening side end portion is guided is divided into the component in the direction orthogonal to the component in the insertion direction. Sometimes it means that there are components in orthogonal directions.

  The light emitter is mounted on a base that closes one end of the case, and the mounting recess is formed between an outer peripheral surface of the base and an inner peripheral surface of the case. It is said. Or the said mounting | wearing recessed part is provided in the perimeter along the internal peripheral surface of a case, It is characterized by the above-mentioned.

  Moreover, the illuminating device which concerns on this invention is an illuminating device provided with the illuminating light source and the lighting fixture which mounts | wears with the said illuminating light source, and is turned on, The said illuminating light source is said light source for illumination. It is said.

The partially broken perspective view which shows the light source for illumination which concerns on embodiment 1 is a sectional view taken along line AA shown in FIG. FIG. 2 is an enlarged sectional view showing a portion surrounded by a two-dot chain line The top view which shows the semiconductor light-emitting module which concerns on embodiment Cross-sectional arrow view along the line BB shown in FIG. Illustration of how to wear gloves Cross-sectional enlarged view of a glove wearing part according to Modification 1 Cross-sectional enlarged view of a glove wearing part according to Modification 2 Cross-sectional enlarged view of a glove wearing part according to Modification 3 Cross-sectional enlarged view of a glove mounting portion according to Modification 4 Explanatory drawing of the mounting method of the glove which concerns on the modification 4. Schematic of the lighting device according to the present invention

Hereinafter, an illumination light source according to an embodiment of the present invention will be described with reference to the drawings. In addition, the scale of the member in each drawing differs from an actual thing.
<Embodiment>
1. Schematic Configuration FIG. 1 is a partially broken perspective view showing an illumination light source according to an embodiment. FIG. 2 is a cross-sectional arrow view taken along the line AA shown in FIG. 3 is an enlarged cross-sectional view showing a portion surrounded by a two-dot chain line in FIG. In the drawings of the present application, the alternate long and short dash line drawn in the vertical direction of the drawing shows the lamp axis J of the illumination light source, the upper side of the drawing being the front of the illumination light source, and the lower side of the drawing being the rear of the illumination light source. is there.

As shown in FIGS. 1 to 3, an illumination light source 1 according to an embodiment is an LED lamp that is an alternative to an incandescent bulb, and includes a semiconductor light emitting module 10 as a light source and a semiconductor light emitting module 10. A base 20, a globe 30 covering the semiconductor light emitting module 10, a circuit unit 40 for lighting the semiconductor light emitting module 10, a circuit holder 50 housing the circuit unit 40, a case 60 covering the circuit holder 50, A base 70 electrically connected to the circuit unit 40 and a reflecting member 80 for diffusing light emitted from the semiconductor light emitting module 10 are provided.
2. Configuration of Each Part (1) Semiconductor Light Emitting Module FIG. 4 is a plan view showing the semiconductor light emitting module according to the embodiment. As shown in FIG. 4, the semiconductor light emitting module 10 includes a mounting substrate 11, a plurality of semiconductor light emitting elements 12 as light sources mounted on the mounting substrate 11, and the mounting substrate 11 so as to cover the semiconductor light emitting elements 12. And a sealing body 13 provided on the surface. In the present embodiment, the semiconductor light emitting element 12 is an LED, and the semiconductor light emitting module 10 is an LED module. However, the semiconductor light emitting element 12 may be, for example, an LD (laser diode) or an EL element ( An electric luminescence element).

  The mounting substrate 11 includes a substantially annular element mounting portion 15 having a substantially circular hole 14 at the center, and a tongue piece portion extending from one place on the inner peripheral edge of the element mounting portion 15 toward the center of the hole 14. 16 A connector 17 to which the wiring 41 of the circuit unit 40 is connected is provided on the rear surface of the tongue piece 16. By connecting the wiring 41 to the connector 17, the semiconductor light emitting module 10 and the circuit unit 40 are electrically connected. Connected (see FIG. 2).

  For example, 32 semiconductor light emitting elements 12 are annularly mounted on the front surface of the element mounting portion 15. Specifically, two semiconductor light emitting elements 12 arranged along the radial direction of the element mounting portion 15 are made into one set, and 16 sets are arranged in circles at equal intervals along the circumferential direction of the element mounting portion 15. It is arranged in a ring. In the present application, the term “annular” includes not only a circular ring but also a polygonal ring such as a triangle, a quadrangle, and a pentagon. Therefore, the semiconductor light emitting element 12 may be mounted in an elliptical or polygonal annular shape, for example.

  The semiconductor light emitting elements 12 are individually sealed by a substantially rectangular parallelepiped sealing body 13 for each set. Therefore, the total number of the sealing bodies 13 is 16. The longitudinal direction of each sealing body 13 coincides with the radial direction of the element mounting portion 15, and when viewed from the front side along the lamp axis J (in plan view), the lamp axis J is the center. Are arranged radially.

  The sealing body 13 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength of light is added to the translucent material. A wavelength conversion material for converting is mixed. As the translucent material, for example, a silicone resin can be used, and as the wavelength conversion material, for example, phosphor particles can be used. In the present embodiment, a semiconductor light emitting element 12 that emits blue light and a sealing body 13 formed of a translucent material mixed with phosphor particles that convert the wavelength of blue light into yellow light are employed. In addition, a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength-converted into yellow light by the sealing body 13, and the white light generated by the color mixture of the unconverted blue light and the converted yellow light is the semiconductor. The light is emitted from the light emitting module 10.

The semiconductor light emitting module 10 may be, for example, a combination of an ultraviolet light emitting semiconductor light emitting element and each color phosphor particle that emits light in three primary colors (red, green, and blue). Further, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.
(2) Base Returning to FIG. 2, the base 20 has, for example, a substantially cylindrical shape having a substantially columnar through-hole 21, and the cylinder axis is arranged in a posture that matches the lamp axis J. Therefore, the through-hole 21 penetrates in the front-rear direction, and the front surface 22 and the rear surface 23 of the base 20 shown in FIG. 3 are both substantially annular planes. Then, the semiconductor light emitting module 10 is mounted on the front surface 22 of the base 20, whereby the semiconductor light emitting elements 12 are arranged in a plane with their respective main emission directions facing forward. As described above, since all the semiconductor light emitting elements 12 are planarly arranged on the front surface 22 of the base 20, the semiconductor light emitting elements 12 can be easily mounted on the base 20, and the assembly work of the illumination light source is easy. It is.

  The front surface 22 is not limited to a substantially annular shape, and may have any shape. Further, the entire front surface 22 does not necessarily have to be a plane as long as the semiconductor light emitting element can be arranged in a plane. Furthermore, the rear surface 23 is not limited to a flat surface.

  The semiconductor light emitting module 10 is fixed to the base 20 together with the reflecting member 80 using screws, for example. The semiconductor light emitting module 10 may be fixed to the base 20 by adhesion or engagement.

  The base 20 is made of, for example, a metal material. As the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, or an alloy of two or more of them, or an alloy of Cu and Ag can be considered. . Since such a metal material has good thermal conductivity, heat generated in the semiconductor light emitting module 10 can be efficiently conducted to the case 60.

The illumination light source 1 is lightweight because the through hole 21 is provided in the base 20. Moreover, since a part of the circuit unit 40 is disposed in the through hole 21 and in the globe 30 through the through hole 21, the circuit unit 40 is small.
(3) Globe Returning to FIG. 2, the globe 30 has a shape imitating a bulb of an A-type bulb that is a general bulb shape in the present embodiment, and the opening-side end 31 of the globe 30 is connected to the case 60. It is inserted into the front end portion 62 and attached to the case 60 in a state of covering the front of the semiconductor light emitting module 10 and the reflecting member 80. The envelope of the illumination light source 1 is composed of a globe 30 and a case 60, and a method for attaching the globe 30 to the case 60 will be described later.

In addition, the shape of the globe 30 is not limited to the shape imitating a bulb of an A-type bulb, and may be any shape.
The inner surface 32 of the globe 30 is subjected to a diffusion process for diffusing light emitted from the semiconductor light emitting module 10, for example, a diffusion process using silica, white pigment, or the like. Light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30.
(4) Circuit Unit The circuit unit 40 is for lighting the semiconductor light emitting element, and includes a circuit board 42 and various electronic components 43 and 44 mounted on the circuit board 42. In the drawings, only some electronic components are denoted by reference numerals. The circuit unit 40 is accommodated in the circuit holder 50, and is fixed to the circuit holder 50 by, for example, screwing, adhesion, engagement, or the like.

  The circuit board 42 is arranged in a posture in which its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored in the circuit holder 50 in a more compact manner. Further, the circuit unit 40 is arranged such that the heat-sensitive electronic component 43 is located on the rear side far from the semiconductor light emitting module 10 and the heat-resistant electronic component 44 is located on the front side close to the semiconductor light emitting module 10. . In this way, the heat-sensitive electronic component 43 is not easily destroyed by heat generated in the semiconductor light emitting module 10.

  The circuit unit 40 and the base 70 are electrically connected by electrical wires 45 and 46. The electrical wiring 45 is connected to the shell portion 71 of the base 70 through the through hole 51 provided in the circuit holder 50. The electrical wiring 46 is connected to the eyelet portion 73 of the base 70 through the rear opening 54 of the circuit holder 50.

A part of the circuit unit 40 is disposed in the through hole 21 of the base 20 and in the globe 30. By doing in this way, the space for accommodating the circuit unit 40 in the back side rather than the base 20 can be made small. Therefore, the distance between the base 20 and the base 70 can be reduced, and the diameter of the case 60 can be reduced, which is advantageous in reducing the size of the illumination light source 1.
(5) Circuit Holder The circuit holder 50 has, for example, a substantially cylindrical shape that is open on both sides, and includes a large diameter portion 52 and a small diameter portion 53. Most of the circuit unit 40 is accommodated in the large-diameter portion 52 located on the front side. On the other hand, a base 70 is fitted on the small-diameter portion 53 located on the rear side, and thereby the rear-side opening 54 of the circuit holder 50 is closed. The circuit holder 50 is preferably formed of an insulating material such as resin, for example.

  The large-diameter portion 52 of the circuit holder 50 passes through the through hole 21 of the base 20, and a part of the circuit unit is disposed in the through hole 21 of the base 20 while being accommodated in the circuit holder 50. . As shown in FIG. 3, the circuit holder 50 and the base 20 are not in contact with each other, and a gap is provided between the outer surface 55 of the circuit holder 50 and the inner surface 24 of the through hole 21 of the base 20. . Further, the circuit holder 50 is not in contact with the semiconductor light emitting module 10 and the reflecting member 80, and is located between the mounting substrate 11 of the semiconductor light emitting module 10 and the outer surface 55 of the circuit holder 50 and the front side end of the circuit holder 50. A gap is also provided between the portion 57 and the reflecting member 80. Therefore, the heat generated in the semiconductor light emitting module 10 is difficult to propagate to the circuit holder 50, and the circuit holder 50 is unlikely to reach a high temperature.

  Returning to FIG. 2, the circuit holder 50 is provided with a through hole 56 at a position corresponding to the tongue piece 16 of the semiconductor light emitting module 10. The tip of the tongue piece 16 is inserted into the circuit holder 50 through the through hole 51, and the connector 17 provided on the tongue piece 16 is located in the circuit holder 50.

  In the circuit unit 40, the circuit board 42 is supported by a support groove 58 formed on the inner peripheral surface of the circuit holder 50. A pair of support grooves 58 are formed so that both ends of the circuit board 42 in the short direction (corresponding to the long sides of the rectangle) are inserted.

The support groove 58 includes a pair of protrusions 58 a and 58 b that extend the inner peripheral surface of the circuit holder 50 in parallel with the lamp axis J.
The pair of protrusions 58a and 58b extend in parallel to each other, and the distance between the two is larger than the thickness of the circuit board 42, and the insertion of the circuit board 42 is allowed.

A fixing protrusion 59 for fixing the circuit board 42 is formed at an end of the pair of protrusions 58a and 58b on the base 70 side in at least any one of the protrusions (here, the protrusion 58b). ing.
(6) Case The case 60 has, for example, a cylindrical shape whose both ends are open and whose diameter is reduced from the front to the rear. As shown in FIG. 3, the base 20 and the opening side end 31 of the globe 30 are accommodated in the front end 62 of the case 60, and the case 60 is fixed to the base 20 by caulking, for example. Yes.

  The outer peripheral edge of the rear side end of the base 20 has a tapered shape in accordance with the shape of the inner peripheral surface 64 of the case 60. Since the tapered surface 25 is in surface contact with the inner peripheral surface 64 of the case 60, the heat propagated from the semiconductor light emitting module 10 to the base 20 is more easily conducted to the case 60. The heat generated in the semiconductor light emitting device 12 is conducted to the base 70 mainly through the base 20 and the case 60 and further through the small diameter portion 53 of the circuit holder 50, and from the base 70 to the lighting fixture (not shown) side. Heat is dissipated.

The case 60 is made of, for example, a metal material. As the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of them, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat transmitted to the case 60 can be efficiently transmitted to the base 70 side. The material of the case 60 is not limited to metal, and may be, for example, a resin having high thermal conductivity.
(7) Base Referring back to FIG. 2, the base 70 is a member for receiving electric power from the socket of the lighting fixture when the illumination light source 1 is attached to the lighting fixture and turned on. The type of the base 70 is not particularly limited, but an Edison type E26 base is used in the present embodiment. The base 70 includes a shell portion 71 having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72. An insulating member 74 is interposed between the shell portion 71 and the case 60.
(8) Reflective member The reflective member 80 has, for example, a bottomed cylindrical shape, a substantially cylindrical main body portion 81 that is open on both sides, and a substantially disc-shaped attachment portion 82 that closes the rear side opening of the main body portion 81. With. As a material of the reflecting member 80, for example, a resin such as polycarbonate, a metal such as aluminum, glass, ceramic, and the like are conceivable. In this embodiment, polycarbonate is used. Since resin such as polycarbonate is light, it is suitable for reducing the weight of the light source 1 for illumination.

  FIG. 5 is a cross-sectional view taken along line BB shown in FIG. As shown in FIG. 5, the reflecting member 80 is provided with a hole 83, and the hole 83 is mounted in a state where the outer peripheral edge of the mounting portion 82 is placed on the inner peripheral edge of the mounting substrate 11 of the semiconductor light emitting module 10. The reflection member 80 and the mounting substrate 11 are fastened together with the base 20 by screwing the screw 90 inserted into the screw hole 26 of the base 20. As shown in FIG. 1, the hole 83 is provided at, for example, three locations near the boundary between the main body 81 and the attachment portion 82.

  As shown in FIG. 4, a notch 18 is provided at one location on the inner peripheral edge of the element mounting portion 15 of the mounting substrate 11, and as shown in FIG. Protrusions 84 are provided at the locations. The use of these notches 18 and protrusions 84 allows the reflecting member 80 to be positioned at an appropriate position corresponding to the position of the semiconductor light emitting element 12 by a simple operation of fitting the protrusions 84 into the notches 18. .

  The main body 81 has a substantially cylindrical shape with a larger outer diameter on the front side than on the rear side, and floats from the semiconductor light emitting module 10 in such a posture that the cylinder axis and the front surface 22 of the base 20 are orthogonal to each other. In this state, it is disposed in front of the semiconductor light emitting element 12, and the cylinder axis of the main body 81 coincides with the lamp axis J. The outer peripheral surface 85 of the main body 81 has a substantially annular shape when viewed from the rear side along the lamp axis J, and has a plurality of semiconductor light emitting elements 12 arranged annularly on the mounting substrate 11. Is opposed to the semiconductor light emitting element 12.

  A plurality of openings 86 are provided in the reflecting member 80 at intervals along the circumferential direction of the outer peripheral surface 85 of the main body 81 around the cylindrical axis of the main body 81 over the main body 81 and the mounting portion 82. Is provided. Specifically, along the circumferential direction of the outer peripheral surface 85, the 16 openings 86 as many as the number of the sealing bodies 13 of the semiconductor light emitting module 10 face the sealing body 13 in a one-to-one relationship. The main body portion 81 is provided at equal intervals.

  In the present embodiment, the opening 86 is a through-hole and nothing is fitted therein. However, the opening 86 may have any configuration that allows light to leak forward, for example, an opening. A translucent member may be fitted into all or part of the portion 86, and light may leak forward through the translucent member. Further, the number of openings 86 is not necessarily the same as that of the sealing body 13, and may be larger or smaller than the number of the sealing bodies 13, or may be one or plural. .

  In a plan view, each opening 86 has a substantially square shape, and a portion on the cylinder axis side which is about half of the sealing body 13 is located in the opening 86 and is opposite to the cylinder axis which is the other half. The side portion faces the outer peripheral surface 85 of the main body 81. In other words, about half of the sealing body 13 is exposed from the opening 86, and the remaining half is hidden behind the main body 81. This will be described in relation to the semiconductor light emitting element 12. Of the two semiconductor light emitting elements 12 sealed by one sealing body 13, the semiconductor light emitting element 12 a on the side close to the cylinder axis is in the opening 86. The semiconductor light emitting element 12b that is located and is far from the cylinder axis faces the outer peripheral surface 85 of the main body 81.

  The main light emitting direction of the semiconductor light emitting element 12 b is directed to the outer peripheral surface 85, and the outer peripheral surface 85 is a reflecting surface of the reflecting member 80. In the present embodiment, in order to increase the reflectance of the outer peripheral surface 85, the reflecting member 80 is formed of white polycarbonate. Forming the main body 81 with a white material is suitable for increasing the reflectance of the outer peripheral surface 85. Note that, as another example of a method for increasing the reflectance of the outer peripheral surface 85, it is conceivable to perform a mirror surface treatment on the outer peripheral surface 85 of the main body 81. As a method of performing the mirror surface treatment, for example, methods such as polishing, painting, vapor deposition, and plating can be considered.

  The outer peripheral surface 85 of the main body 81 has a concave curved surface shape that is recessed on the cylinder axis side of the main body 81. More specifically, in the cut surface (hereinafter referred to as “longitudinal section”) when the main body 81 is cut along a virtual plane including the lamp axis J (coincided with the tube axis), the outer peripheral surface 85 has a shape that is the lamp axis. It is a substantially arc shape bulging to the J side. In other words, it is a substantially circular arc shape that is recessed toward the lamp axis J with respect to the straight line connecting the rear side edge and the front side edge of the outer peripheral surface 85 in the cut surface. Specifically, in the case of the present embodiment, the arc shape of the outer peripheral surface 85 in the longitudinal section is a substantially elliptic arc shape.

  The concave curved surface shape recessed on the tube axis side is suitable for reflecting the emitted light of the semiconductor light emitting element 12 obliquely rearward closer to the rear (more parallel to the lamp axis J). It is effective for widening the light distribution angle. It is also advantageous to concentrate the reflected light in a specific direction.

  In the present embodiment, the entire outer peripheral surface 85 of the main body 81 is a reflecting surface, but the entire outer surface 85 is not necessarily a reflecting surface, and only a part of the outer peripheral surface 85 is a reflecting surface. It may be.

  Further, the shape of the outer peripheral surface 85 of the main body 81 of the reflecting member 80 is not limited to a substantially arc shape that swells to the lamp axis J side in the longitudinal section, but a substantially arc that swells to the opposite side of the lamp axis J in the longitudinal section. The shape may be sufficient, and a linear shape may be sufficient in a longitudinal cross section.

Moreover, although the reflecting member 80 of this Embodiment was a bottomed cylindrical shape, a substantially plate shape may be sufficient as a reflecting member.
As shown by the optical path L1 in FIG. 3, most of the main emitted light emitted from the semiconductor light emitting element 12b and incident on the outer peripheral surface 85 of the main body 81 is incident on the outer peripheral surface 85, and the incident light is the outer peripheral surface 85. The reflected light passes through an annular region surrounding the base 20 from the side and is reflected obliquely rearward so as to avoid the front surface 22 of the base 20. On the other hand, as shown by the optical path L2 in FIG. 3, most of the main emitted light from the semiconductor light emitting element 12a passes through the opening 86 and leaks forward. However, not all of the main emitted light emitted from the semiconductor light emitting element 12b is reflected obliquely rearward by the outer peripheral surface 85, and a part of the main emitted light leaks forward through the opening 86. Further, not all of the main emitted light emitted from the semiconductor light emitting element 12 a passes through the opening 86 and leaks forward, and a part of the main emitted light avoids the front surface 22 of the base 20 by the outer peripheral surface 85. Reflected diagonally backward. As described above, the reflecting member 80 exhibits a diffusing function for diffusing the light emitted from the semiconductor light emitting element 12.

Since the illumination light source 1 includes the outer peripheral surface 85 that reflects a part of the main emitted light of the semiconductor light emitting element 12 obliquely rearward, avoiding the front surface 22 of the base 20, the semiconductor light emitting element 12 with a narrow irradiation angle is provided. Even if it uses, the light distribution characteristic of the light source 1 for illumination is favorable. In addition, since the semiconductor light emitting element 12 is arranged in an annular shape and the outer peripheral surface 85 is also arranged in an annular shape, the reflection to the oblique rear side avoiding the front surface 22 of the base 20 is It occurs all around the outside. Therefore, the light distribution characteristic is good over the entire circumference around the lamp axis J.
3. Wearing the glove To install the glove on the case side, the opening side end of the glove is inserted into a mounting groove as a mounting recess on one end of the case, and the opening side end of the glove can be deformed by heat. It is made of a material and has a tip as a deformed portion deformed into a shape that engages with a mounting groove as a mounting recess due to heat.

  As shown in FIGS. 3 and 5, the globe 30 is mounted on the case 60 side by the opening-side end 31 being inserted into the mounting groove 63 and engaging (engaging) in the mounting groove 63. . In the present embodiment, the mounting groove 63 is formed between the base 20 and the case 60.

  The diameter of the base 20 is the largest at a substantially central position in the thickness direction (the front-rear direction) of the base 20, and the front surface 22 side is the front peripheral surface 28 from the maximum diameter position. Also, the rear surface 23 side is a rear peripheral surface 29.

  A mounting groove 63 is formed by the front peripheral surface 28 of the base 20 and the inner peripheral surface 64 of the case 60 (see FIG. 6A), and the rear peripheral surface 29 is formed in the case 60 as described above. A tapered surface (inclined surface) 25 is formed in accordance with the shape of the peripheral surface 64.

  The mounting groove 63 passes through a passage area (corresponding to the “entrance side area” of the illumination light source described in this specification) 63a through which the tip of the opening-side end portion 31 of the globe 30 passes, and the passage area 63a. And a bottom region (corresponding to a “back region” of the illumination light source described in the present specification) 63b. Here, the passage region 63a extends parallel to the lamp axis J (therefore, the passage region 63a forms a longitudinal groove), and the bottom region 63b has a dimension in a direction perpendicular to the lamp axis J in the longitudinal section. Is larger than the passage region 63a. Here, the bottom region 63b spreads in the lateral direction so as to approach the lamp axis J side (for this reason, the bottom region 63b constitutes a lateral groove). It has a letter shape.

  That is, the front peripheral surface 28 of the base 20 has a stepped shape, and is orthogonal to the lamp shaft J and the large-diameter surface 28a having a large outer peripheral diameter, the small-diameter surface 28b smaller than the outer peripheral diameter of the large-diameter surface 28a. A space including the bottom surface 28c and between the large-diameter surface 28a and the inner peripheral surface 64 of the case 60 is a passage region 63a, and a space surrounded by the small-diameter surface 28b, the bottom surface 28c and the inner peripheral surface 64 of the case 60 is formed. It becomes the bottom region 63b. The outer peripheral edge of the bottom surface 28 c is the maximum diameter position of the base 20.

  The opening-side end 31 of the glow 30 is a front portion positioned in front of the tip of the opening-side end 31 of the globe 30 (a portion positioned in the passage region 63a of the mounting groove 63 when mounted on the case side). 31a extends parallel to the lamp axis J, and the tip 31b is bent so as to approach the lamp axis J in the bottom region 63b.

When the globe 30 is mounted on the case 60 side, the tip 31b of the opening-side end 31 of the globe 30 is located in the bottom region 63b of the base 20, and the globe 30 is about to fall off the case 60. Sometimes, the base 20 is located between the large-diameter surface 28a and the small-diameter surface 28b and engages with a surface 28d extending in a direction perpendicular to the lamp axis J to prevent its dropout (substantially). The glove 30 is attached to the case 60 side).
4). Glove Wearing Method FIG. 6 is an explanatory diagram of a glove wearing method.

This will be specifically described below.
First, the case 60 and the globe 30 into which the base 20 is press-fitted are prepared. At this time, the opening-side end 31 of the globe 30 extends parallel to the lamp axis J (the vertical direction in the drawing is directed downward). Note that the globe 30 in this example is made of a thermoplastic resin (for example, polycarbonate or the like).

Before the opening end 31 of the globe 30 is inserted into the mounting groove 63 formed by the base 20 and the case 60, the opening end 31 is heated and softened into a deformable state.
Next, the opening-side end 31 of the globe 30 is aligned on the mounting groove 63 as shown in (a) of the figure, and inserted into the mounting groove 63 as shown in (b).

  Then, with the tip of the opening-side end 31 of the globe 30 reaching the bottom surface 28 c of the base 20 of the mounting groove 63, the globe 30 is further pressed toward the case 60. At this time, since the opening side end portion 31 is softened so as to be deformable by heating, the tip 31b of the opening side end portion 31 has a shape of the bottom region 63b of the mounting groove 63 as shown in FIG. Is deformed so as to approach the ramp axis J.

Eventually, when the globe 30 is pushed into the case 60 to a predetermined position, the attachment of the globe 30 to the case 60 side is completed as shown in FIG.
Note that the inner peripheral surface 64 of the case 60 and the surface corresponding to the portion where the tip exists immediately after the tip of the opening side end 31 of the globe 30 passes through the passage region 63 a of the mounting groove 63 is the base 20. An inclined surface that approaches the ramp axis J as it approaches the rear surface 23 is formed. The inclined surface functions as a guide surface that guides the tip of the opening-side end portion 31 that has passed through the passage region 63 a of the mounting groove 63 so as to approach the lamp axis J.

As described above, the mounting of the globe 30 according to the embodiment to the mounting groove 63 does not use a locking structure with an adhesive or an elastic deformation claw, and the heated globe 30 is inserted into the mounting groove 63. It can be easily installed by pushing it in. Further, in order to heat the opening-side end 31 before or after the insertion of the opening-side end 31 of the globe 30 into the mounting groove 63, it is sufficient that the opening-side end 31 of the globe 30 can be inserted into the mounting groove 63. High machining accuracy and quality control become unnecessary.
<Modification>
1. Mounting groove (1) Shape (structure)
In the embodiment, the mounting groove 63 has an “L” -shaped vertical section, and the bottom region 63b of the mounting groove 63 extends (expands) toward the lamp axis J.

  However, the longitudinal section of the mounting recess is such that the tip of the opening side end of the glove inserted into the mounting recess is deformed during or after insertion and engages with the mounting recess so that the glove cannot be removed from the case side. The shape may be any shape, and may not be the shape of the mounting groove described in the embodiment (which will be described later, the mounting recess may not be a groove shape continuous in the circumferential direction).

Here, an illumination light source having a mounting groove having a different cross-sectional shape from the mounting groove in the embodiment will be described as a first modification.
The illumination light source 100 according to Modification 1 differs from the illumination light source 1 according to the embodiment in that the shape of the opening-side end 120 of the globe 104 and the shape (structure) of the mounting groove 110 are different. The shapes (structures) of the peripheral surface (front peripheral surface 112) of the base 102 and the front end 118 of the case 106 are different.

  That is, the illumination light source 100 according to the modification 1 includes the semiconductor light emitting module 10, the base 102 on which the semiconductor light emitting module 10 is mounted, the globe 104 that covers the semiconductor light emitting module 10, and the semiconductor as in the embodiment. Circuit unit 40 for lighting light emitting module 10, circuit holder 50 housing circuit unit 40, case 106 covering circuit holder 50, base 70 electrically connected to circuit unit 40, and semiconductor light emitting module And a reflecting member 80 for diffusing the light emitted from 10.

Here, the same reference numerals as those of the constituent members of the illumination light source 1 according to the embodiment are the same as the constituent members described in the embodiment, and the constituent elements constituting the constituent members are also the same.
FIG. 7 is an enlarged cross-sectional view of a glove mounting portion according to the first modification.

The mounting groove 110 for mounting the globe 104 is composed of a base 102 and a case 106, and the vertical cross-sectional shape is a shape close to a “<” shape.
The outer peripheral surface of the base 102 is positioned between the front surface and the rear surface of the base 102 on the front peripheral surface 112 positioned on the front side of the largest diameter position where the diameter is the largest, and on the rear surface side of the maximum diameter position. And a rear peripheral surface 114. The mounting groove 110 is formed by the front peripheral surface 112 and the inner peripheral surface 116 a of the case 106.

  The front peripheral surface 112 of the base 102 has a vertical surface 112a extending substantially parallel to the lamp axis J from the front-side edge to a position in the middle of the maximum diameter position, and as approaching the rear surface from the rear end of the vertical surface 112a. It includes an inclined surface 112b that expands in diameter, and a lateral surface 112c that extends outward from the rear end of the inclined surface 112b in a direction orthogonal to the lamp axis J. The lateral surface 112c is also the bottom surface of the mounting groove 110.

  The rear peripheral surface 114 of the base 102 is a tapered surface that has a shape that decreases in diameter as it moves from the maximum diameter portion toward the rear surface, and abuts on the inner peripheral surface 116b of the case 106 as in the embodiment. It is like that.

The case 106 has a cylindrical shape that is open at both ends and is reduced in diameter from the front to the rear except for the front end 118. As shown in FIG. 7, the front end 118 is a portion facing the front peripheral surface 112 of the base 102, and approaches the ramp axis J as it approaches the end edge from the front of the front end 118. Inclined. That is, the front end 118 of the case 106 is narrower (the outer diameter is smaller) than the portion that has moved slightly rearward from the front end 118. As described above, the mounting groove 110 is formed on the base 102. The front peripheral surface 112 and the inner peripheral surface 116a around the front opening including the front end 118 of the case 106 are formed. As shown in FIG. Extend outwards away from axis J.

  The opening-side end portion 120 of the globe 104 extends backward (downward) in parallel with the lamp axis J in a state before being inserted into the mounting groove 110 (see (a) in the figure). In a state of being completely inserted into 110, it is configured to bend outward along the mounting groove 110 and engage with the front side end portion 118 of the case 106.

  The outward bending (deformation) of the opening-side end 120 of the globe 104 is the opening of the globe 104 when the opening-side end 120 of the globe 104 is inserted into the mounting groove 110 as described in the embodiment. The side end portion 120 is heated so as to be deformable.

In addition, the inclined surface 112 b of the front peripheral surface 112 of the base 102 has a function as a guide surface that guides the tip of the opening side end of the globe 104 inserted in the mounting groove 110 away from the lamp axis J. .
(2) Constituent members The mounting grooves 63 and 110 according to the embodiment and the first modification are configured by the front peripheral surfaces 28 and 112 of the bases 20 and 102 and the inner peripheral surfaces 64 and 116 of the cases 60 and 106. However, you may comprise by another member.

  For example, a member having a mounting recess (for example, an annular member) is mounted on the front end of the case (for example, press-fitting mounting), and the opening side end of the glove is inserted into the mounting recess of the member. (This example is referred to as Modification 2), and the above-mentioned member may be fitted on the outer peripheral surface of the base and attached (an annular member is attached to the outer periphery of the base by a tight fit) To do).

  Furthermore, when the thickness of the end portion on the front side of the case is reduced due to the thinning of the case, in order to ensure mechanical characteristics, for example, strength and rigidity, a reinforcing member at the end portion on the front side of the case, For example, a mounting ring may be formed by press-fitting a reinforcing ring and the reinforcing ring and the outer peripheral surface of the base.

  Furthermore, a mounting recess may be formed in the base, or a mounting recess may be provided in the case. As an example of providing the mounting recess in the case, the case can be formed of a metal material, for example, by folding the end of the case.

FIG. 8 is an enlarged cross-sectional view of a glove mounting portion according to Modification 2.
The annular member 152 having the mounting groove 150 according to the second modification which is an example of the mounting recess is mounted on the front side end 156 of the case 154.

The annular member 152 is interposed between the front peripheral surface 160 of the base 158 and the inner peripheral surface 162 of the case 154, and is mounted by press-fitting from the front opening of the case 154, for example.
The configuration of the mounting groove 150 is substantially the same as the mounting groove 63 in the embodiment, and the configuration of the opening side end 166 of the globe 164 is the same as the opening side end 31 of the globe 30 in the embodiment.
2. Modification of Globe Opening Side Ends The globes 30, 104, and 164 according to the first and second exemplary embodiments and the second modification use, for example, a light-transmitting thermoplastic resin to open the opening side end parts 31, 120, When the 166 is inserted into the mounting grooves 63, 110, and 150, the opening side end portions 31, 120, and 166 can be deformed along the mounting grooves 63, 110, and 150 (by contacting the bottom surface and the side surface of the mounting groove). So that it was heated.

  In addition, when the globes 30, 104, and 164 are about to be detached from the cases 60, 106, and 154 side due to this deformation, the opening side end portions 31, 120, and 166 of the globes 30, 104, and 164 are attached to the mounting grooves 63 and 110. , 150 to prevent the dropout.

However, the shape of the opening-side end that can be engaged with the mounting recess (mounting groove) may be formed by other methods, and other methods will be described as modified examples 3 and 4.
(1) Self-contraction FIG. 9 is an enlarged cross-sectional view of a glove wearing part according to Modification 3.

  In Modification 3, as in the embodiment, after the opening side end portion 204 of the globe 202 is heated and then inserted into the mounting groove 206, the opening side end portion 204 of the globe 202 is cooled (when the temperature is naturally lowered). In other words, the opening side end portion 204 utilizes the fact that the opening inevitably becomes small due to thermal contraction during cooling.

  Also in this example, in a state where the opening side end portion 204 of the globe 202 is heated, the opening side end portion 204 extends downward, and the thickness of the opening side end portion 204 of the globe 202 is larger than that of the inlet 208 of the mounting groove 206. It is small and insertion of the opening side end portion 204 of the globe 202 into the mounting groove 206 is allowed.

  The mounting groove 206 corresponds to a longitudinal groove portion (a “passing region” in the embodiment) extending in the front-rear direction, as in the embodiment, in order to prevent the glove 202 from falling off the case 210. And a lateral groove portion extending in a direction orthogonal to the lamp axis J or inclined with respect to the front-rear direction (the “bottom region” in the embodiment). And corresponds to the “back side region” of the illumination light source described in this specification.

  The opening-side end portion 204 of the globe 202 is bent inward in the mounting groove 206 so as to engage with the recess 218 of the base 216 constituting the lateral groove portion 214. .

Also in the third modification, the mounting groove 206 is formed by the front peripheral surface of the base 216 and the front side end portion 222 of the case 210.
(2) Laser Irradiation FIG. 10 is an enlarged cross-sectional view of a glove wearing part according to Modification 4.

  In the fourth modification, the tip 256 of the opening side end 254 of the globe 252 has a larger spherical shape than the front portion 255 on the near side of the tip. That is, the dimension in the direction orthogonal to the insertion direction of the glove 252 into the mounting groove 258 at the tip 256 of the opening-side end 254 is larger than the dimension in the direction orthogonal to the insertion direction of the glove 252 into the mounting groove 258 in the front portion 255. Also has a large spherical shape.

The mounting groove 258 includes a front peripheral surface 264 of the base 262 on which the semiconductor light emitting module 260 is mounted on the front surface, and an inner peripheral surface 269 of the front side end 268 of the case 266.
The mounting groove 258 is a passing region where the tip 256 of the globe 252 passes (inserts) in a direction parallel to the lamp axis (that is, on the entrance side of the mounting groove 258, and the “entrance side region” of the illumination light source described in this specification. And a bottom region where the tip 256 exists beyond the passing region (that is, the back side of the mounting groove 258 and also the “back side region” of the illumination light source described in this specification). have.

  The dimension in the direction orthogonal to the direction in which the globe 252 is inserted into the mounting groove 258 in the passage region is larger than the thickness of the front portion 255 of the globe 252 and smaller than the diameter of the spherical tip 256.

  In the bottom region, the dimension in the direction orthogonal to the insertion direction of the globe 252 in the passage region in the passage region is larger than the dimension of the passage region. And the front-end | tip 256 of the globe 252 is located in this bottom area | region.

FIG. 11 is a diagram illustrating an outline of a glove wearing method according to Modification 4.
First, a case 266 into which a globe 252 and a base 262 are press-fitted is prepared. At this time, the opening-side end 254 of the globe 252 extends parallel to the lamp axis J (upward and downward in the drawing (upward to the base side)) as shown in FIG. ing. Note that the globe 252 in this example can be made of a glass material.

  Next, the opening side end 254 of the globe 252 is inserted into the mounting groove 258 to a predetermined position, and is arranged so that the globe 252 is on the lower side and the case 266 is on the upper side. This state is shown in FIG.

  After the above arrangement, the laser is irradiated from the globe 252 side to the portion including the tip (256) of the opening-side end 254 of the globe 252. The direction of laser irradiation is indicated by the arrow in FIG.

The tip (256) of the globe 252 is melted by the laser irradiation, and a spherical tip 256 is obtained by the surface tension of the molten resin.
Accordingly, the globe 252 can be attached to the case 266 side without using a locking structure using an adhesive or an elastically deformable claw. In addition, since the opening side end 254 is heated after the opening side end 254 of the globe 252 is inserted into the mounting groove 258, it is only necessary that the opening side end 254 of the globe 252 can be inserted into the mounting groove 258. Management becomes unnecessary.

In the embodiment and the first to third modified examples, the glove material is a thermoplastic resin, and in the modified example 34, the glove material is a glass material.
However, depending on the type of case, base, and light emitter, the globe according to the embodiment and the first to third modifications may be configured with a glass material, or the glove according to the fourth modification may be configured with a thermoplastic resin. You may do it.
3. Light Emitter In the embodiment, the light emitter is composed of an LED element that is a kind of semiconductor light emitting element. However, for example, the present invention can also be applied to a fluorescent lamp in which a light emitting substance is sealed in a glass tube.

In this case, the base described in the embodiment serves as a holding member that holds the arc tube.
4). Mounting recess In the embodiment and the modification, the mounting recess is formed in a groove shape continuous in the circumferential direction of the end portion on the one end opening side of the case. For example, an interval (equal interval or different interval) is provided in the circumferential direction. One or a plurality of mounting recesses may be formed.
5. Illumination Device In the embodiments, modifications, and the like, the illumination light source has been described. However, the present invention can also be applied to an illumination device that uses the illumination light source.

FIG. 12 is a schematic view of a lighting device according to the present invention.
The lighting device 300 is used by being mounted on the ceiling 302, for example.
As shown in FIG. 12, the illumination device 300 includes an illumination light source 1 and a lighting fixture 304 that is mounted and lit by the illumination light source 1.

  The lighting fixture 304 includes, for example, a fixture main body 306 attached to the ceiling 302, and a cover 308 that covers the illumination light source 1 attached to the fixture main body 306 and is detachably attached to the fixture main body 306.

The fixture body 306 includes a socket 310 to which the base 70 of the illumination light source 1 is attached (screwed), and power is supplied to the illumination light source 1 through the socket 310.
Note that the lighting fixture here is an example. For example, the lighting fixture may have an opening-type cover without having a closed-type cover, or a posture in which the illumination light source faces sideways ( A lighting fixture that is lit in a posture in which the lamp axis is horizontal may be used.

  Furthermore, although one illumination light source is turned on here, a plurality of, for example, three illumination light sources may be turned on.

  The present invention can be widely used in general lighting.

DESCRIPTION OF SYMBOLS 1 Light source for illumination 12 Semiconductor light emitting element 20 Base 30 Globe 31 Opening side edge part 31b Tip 60 Case 62 Front side edge part (one end)
63 Mounting groove (Mounting recess)
63a Passing area (entrance side area)
63b Bottom region (back side region)

Claims (3)

A plurality of semiconductor light emitting elements as light sources, a base on which the plurality of semiconductor light emitting elements are mounted on the front surface, a circuit unit for lighting the plurality of semiconductor light emitting elements, and a cylindrical shape that holds the circuit unit therein Circuit holder ,
The circuit unit includes a circuit board and an electronic component mounted on the circuit board,
The base has a through-hole penetrating from the front surface to the rear surface,
A part of the circuit holder penetrates the through hole and a part of the circuit board is arranged in a position corresponding to the inside of the through hole in a posture in which the main surface is parallel to the cylinder axis of the circuit holder ,
The light source for illumination, wherein the plurality of semiconductor light emitting elements are arranged on the front surface in a state of surrounding the through hole . The illumination light source according to claim 1 , wherein a gap is provided between an outer surface of the circuit holder and an inner surface of the through hole of the base . An illumination apparatus comprising: an illumination light source; and an illuminator that is lit by mounting the illumination light source, wherein the illumination light source is the illumination light source according to claim 1 or 2. .

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