JP5442430B2 - Cutting blade cleaning device, film laminate half-cut device, and cutting blade cleaning method - Google Patents

Description

  The present invention relates to a cutting blade cleaning device, a film laminate half-cut device, and a cutting blade cleaning method.

  2. Description of the Related Art Conventionally, optical display devices are widely used in display units such as liquid crystal televisions, computer displays, portable terminal devices, portable game devices, calculators, and watches. An optical display device is manufactured by bonding a polarizing film to a liquid crystal panel.

  The polarizing film is coated with an adhesive layer necessary for bonding with the liquid crystal panel, and the adhesive layer is protected by being covered with a protective film. That is, a film laminate having a three-layer structure is generally used for manufacturing a liquid crystal display device.

  After the protective film is removed from the film laminate, the polarizing film and the liquid crystal panel are bonded together. However, since the polarizing film is long with respect to the sheet-like liquid crystal panel, before the bonding. It is necessary to cut the polarizing film and the adhesive layer without cutting the protective film. That is, it is necessary to half-cut the film laminate.

  When the film laminate is half-cut, film scraps are generated by cutting the polarizing film. Moreover, since an adhesive layer is also cut | disconnected with a polarizing film, there exists a problem that the adhesive of an adhesive layer adheres to the cutting blade which cut | disconnects a polarizing film. Moreover, the said film waste and an adhesive may be mixed between a polarizing film and a liquid crystal panel. As a result, the yield decreases and the tact time per liquid crystal display panel increases.

  In view of this, a half-cut apparatus that has a simple configuration and is capable of half-cutting a film laminate with high quality has been proposed. Specifically, the half-cut apparatus disclosed in Patent Documents 1 and 2 can be mentioned. According to these half-cut devices, it is possible to reduce the amount of film waste generated from the polarizing film during half-cutting.

JP 2006-334715 A (released on December 14, 2006) JP 2007-260865 A (published on October 11, 2007)

  However, the conventional half-cut device has a problem that the tact time is still increased in the manufacture of the optical display device.

  Specifically, according to the half-cut devices disclosed in Patent Documents 1 and 2, the generation amount of film waste can be reduced, but the generation of film waste cannot be eliminated. Furthermore, since the pressure-sensitive adhesive layer is applied to the polarizing film, the pressure-sensitive adhesive adheres to the cutting blade used for cutting in the half-cut device. Therefore, as the half-cut is repeated, the cutting blade is contaminated by the film waste and the adhesive, so that the quality of the cutting is lowered and the life of the cutting blade is shortened.

  Further, when the cutting blade is contaminated, it is necessary to stop the entire manufacturing system including the half-cut device and clean (clean) or replace the cutting blade by an operator. As a result, the operating rate of the manufacturing system is greatly reduced, and the tact time is prolonged. Furthermore, since film scraps can be mixed into the product due to the film scraps adhering to the cutting blade, another problem that the yield decreases is caused.

  This invention is made | formed in view of the said conventional problem, Comprising: The main objective is providing the cutting blade cleaning apparatus which contributes to shortening of a tact time in the half cut of a film laminated body.

  In order to solve the above problems, the cutting blade cleaning device of the present invention is a cutting blade cleaning device for a cutting blade that cuts a polarizing film and an adhesive layer in a film laminate including at least a polarizing film, an adhesive layer and a protective film. A porous cleaning unit capable of adsorbing an organic solvent, a holding unit that holds the cleaning unit, a part of the cleaning unit and a storage unit that stores an organic solvent, and the porous cleaning unit includes the cutting unit It can be cut with a blade.

  The cleaning part in the above cutting blade cleaning device can adsorb the organic solvent and can be cut by the cutting blade. The cutting blade cleaning device according to the present invention can be used for cleaning a cutting blade in the manufacture of a liquid crystal display device, and the cutting blade comes into contact with the cut surface of the cleaning portion by cutting the cleaning portion with the cutting blade. Film scraps and adhesives attached to the cutting blade can be cleaned. That is, the cutting blade can be cleaned. The above cleaning can be performed during the cutting operation of the cutting blade, and it is not necessary to stop the cutting blade for cleaning. Therefore, according to the cutting blade cleaning apparatus according to the present invention, it is possible to avoid a long tact time due to the cleaning of the cutting blade and to shorten the tact time in the manufacture of the liquid crystal display device.

  Moreover, in the cutting blade cleaning apparatus of this invention, it is preferable to provide the drive part which rotates a cleaning part by rotating the said holding | maintenance part centering | focusing on the central axis of a cleaning part in the perpendicular | vertical surface with respect to the blade edge direction of the said cutting blade. .

  According to the cutting blade cleaning device, the driving unit can rotate the cleaning unit in a direction perpendicular to the cutting edge direction of the cutting blade. By performing the rotation operation, a new surface that is not cut out of the clean portion can be arranged with respect to the cutting blade. Thus, the clean part can be repeatedly used for cutting by changing the surface of the clean part with respect to the cutting blade. That is, it is very preferable because the replacement frequency of the clean part can be suppressed.

  Moreover, in the half-cut apparatus of the film laminated body of this invention, a polarizing film and a polarizing film and a support stand which supports the said film laminated body, and the film laminated body supported by the said support stand along the width direction of a film laminated body. It is preferable that a cutting blade for cutting the adhesive layer and the cutting blade cleaning device are provided, the support base is provided with the cutting blade cleaning device, and the cleaning portion is disposed on a running line of the cutting blade.

  In the half-cut apparatus of the film laminated body of this invention, since the clean part is arrange | positioned on the running line of a cutting blade, while a polarizing film is cut | disconnected with a cutting blade, a clean part can also be cut | disconnected. According to said structure, the cutting | disconnection of a polarizing film and the cleaning of the cutting blade by a cleaning part can be performed in series, and the cleaning in a short time is possible, without stopping a half-cut apparatus.

  In order to solve the above problems, the cutting blade cleaning method of the present invention is a cutting blade cleaning method for a cutting blade that cuts a polarizing film and an adhesive layer in a film laminate including at least a polarizing film, an adhesive layer, and a protective film. Along the width direction of the film laminate, the film laminate is supported, the polarizing film and the adhesive layer of the supported film laminate are cut with a cutting blade, and arranged along the running line of the cutting blade, The cutting blade is cleaned by cutting the porous cleaning portion adsorbing the organic solvent with the cutting blade.

  The said cleaning part can adsorb | suck an organic solvent. The cutting blade cleaning method according to the present invention can be used to clean the cutting blade in the manufacture of a liquid crystal display device, and the cutting blade is cut with the cutting surface of the cleaning portion by cutting the cleaning portion with the cutting blade. Can be contacted. As a result, film scraps and adhesives attached to the cutting blade can be cleaned. That is, the cutting blade can be cleaned. The above cleaning can be performed during the cutting operation of the cutting blade, and it is not necessary to stop the cutting blade for cleaning. Therefore, according to the cutting blade cleaning method according to the present invention, it is possible to avoid an increase in the takt time due to the cleaning of the cutting blade and to shorten the takt time in the manufacture of the liquid crystal display device.

  In the cutting blade cleaning method of the present invention, it is preferable that the cleaning portion is rotated in a direction perpendicular to the cutting edge direction of the cutting blade after the cleaning portion is cut by the cutting blade.

  According to the cutting blade cleaning method, since the cleaning portion is rotated in the direction perpendicular to the cutting edge direction of the cutting blade, a new surface that is not cut out of the cleaning portion can be disposed on the cutting blade. Thus, the clean part can be repeatedly used for cutting by changing the surface of the clean part with respect to the cutting blade. That is, it is very preferable because the replacement frequency of the clean part can be suppressed.

  As described above, the cutting blade cleaning device of the present invention is a cutting blade cleaning device for a cutting blade that cuts a polarizing film and an adhesive layer in a film laminate including at least a polarizing film, an adhesive layer, and a protective film. An adsorbable porous cleaning section, a holding section for holding the cleaning section, and a storage section for storing a part of the cleaning section and an organic solvent, wherein the porous cleaning section is cut by the cutting blade. It is possible.

  Moreover, the cutting blade cleaning method of the present invention includes a film in the cutting blade cleaning method for a cutting blade that cuts the polarizing film and the adhesive layer in the film laminate including at least the polarizing film, the adhesive layer, and the protective film as described above. An organic material that supports the film laminate along the width direction of the laminate, cuts the polarizing film and the adhesive layer of the supported film laminate with a cutting blade, and is disposed along the running line of the cutting blade. This is a method of cleaning the cutting blade by cutting the porous cleaning portion adsorbing the solvent with the cutting blade.

  Therefore, according to both of the above inventions, by cutting the cleaning portion with a cutting blade, the cutting blade can be brought into contact with the cutting surface of the cleaning portion to clean film scraps and adhesives attached to the cutting blade. it can. That is, the cutting blade can be cleaned. The above cleaning can be performed during the cutting operation of the cutting blade, and it is not necessary to stop the cutting blade for cleaning. Therefore, according to the cutting blade cleaning apparatus according to the present invention, it is possible to avoid a long tact time due to the cleaning of the cutting blade and to shorten the tact time in the manufacture of the liquid crystal display device.

It is sectional drawing which shows the manufacturing system of the optical display apparatus which concerns on this Embodiment. It is sectional drawing which showed the cleaning apparatus which concerns on this Embodiment from the side surface direction. It is a perspective view which shows the half-cut apparatus which concerns on this Embodiment.

  An embodiment of the present invention will be described with reference to FIGS. 1 to 3 as follows. First, a manufacturing system of an optical display device in which the cutting blade cleaning device according to the present embodiment is used will be described.

[Optical display manufacturing system]
FIG. 1 is a cross-sectional view showing an optical display device manufacturing system (hereinafter simply referred to as “manufacturing system” as appropriate). The manufacturing system 20 according to the present embodiment roughly comprises a film transport unit shown at the bottom and a liquid crystal panel transport unit shown at the top.

  First, the film conveyance part which conveys the film laminated body 2 (including the polarizing film 2a and the protective film 2b) via a guide roll is demonstrated. The film transport unit includes an unwinding unit 1, a cleaning device 3, a cutting blade 4, a support base 14, a knife edge 5, and a winding unit 1a. Hereinafter, each member will be described.

  The unwinding part 1 is a member which unwinds the film laminated body 2 containing a polarizing film, and can use a well-known unwinding part. In this Embodiment, what is necessary is just to adjust the speed | rate, tension | tensile_strength, etc. which unwind the film laminated body 2 suitably. What is necessary is just to change suitably according to the size of the film laminated body 2 to be used, and the size of the unwinding part 1 is not specifically limited. For example, the film width | variety of the film laminated body 2 is 300 mm or more and 1200 mm or less, and the unwinding part 1 which can hold | maintain the said film laminated body 2 should just be used.

  The film laminate 2 generally has a three-layer structure, and a known polarizing film structure can be employed. The film laminated body 2 is comprised from the polarizing film 2a, the adhesion layer which is not shown in figure, and the protective film 2b. Specifically, a TAC (triacetylcellulose) film or the like is bonded as a protective film on both sides of the polarizer film, and a protective film is laminated on one or both TAC films via an adhesive. It has become. The film laminate 2 has a configuration in which the protective film 2b is laminated on one of the TAC films. Of course, the protective film may be laminated on both TAC films.

  As the polarizer film, a polyvinyl alcohol film dyed with iodine or the like and a film stretched in a uniaxial direction can be used. Also, instead of the polyvinyl alcohol film, a partially formalized polyvinyl alcohol film, an ethylene / vinyl acetate copolymer partially saponified film, a hydrophilic polymer film such as a cellulose film, etc. Polyene-oriented films such as vinyl chloride dehydrochlorinated products can also be used.

  Although the total thickness of the polarizing film 2a and the protective film 2b is not specifically limited, It can be 100 micrometers or more and 500 micrometers or less. In addition, the thickness of the polarizer film in the polarizing film 2a is generally 10 μm or more and 50 μm or less. Furthermore, in addition to the above three layers, other layers may be further included within a practical range of the film laminate 2.

  The adhesive layer is used to bond the polarizing film 2a and the liquid crystal panel 7 after the protective film 2b is removed. The pressure-sensitive adhesive used for the pressure-sensitive adhesive layer is not particularly limited, and an acrylic, epoxy, polyurethane-based pressure-sensitive adhesive can be used, but it needs to be easily peeled off from the protective film 2b. For this reason, the kind of adhesive is selected according to the protective film 2b. In addition, what is necessary is just to change the thickness of an adhesive layer suitably, for example, they can be 0.5 micrometer or more and 75 micrometers or less.

  A known protective film may be used as the protective film 2b. Specifically, a polyester film, a polyethylene terephthalate film, or the like can be used. Although it does not specifically limit as thickness of the said peeling film, The peeling film of 5 micrometers or more and 100 micrometers or less can be used preferably. In addition, the protective film 2b may be generally called a peeling film, a separator, etc., and is synonymous.

  Although the film laminated body 2 is unwound through each guide roll, since the liquid crystal panel 7 is sheet-like, it is necessary to cut | disconnect a long polarizing film and an adhesion layer before bonding. That is, it is necessary to half-cut the film laminate 2. The members for performing the half cut are the cutting blade 4 and the support base 14. Further, the support base 14 is provided with a cleaning device (cutting blade cleaning device) 3 for cleaning the cutting blade 4. These will be described in more detail with reference to FIGS.

  The knife edge 5 is a member for removing the protective film 2 b from the film laminate 2. The knife edge 5 has a triangular shape as its side surface, and the bottom surface (slope) of the knife edge 5 is disposed along the protective film 2b side. The peeling force between the adhesive layer and the protective film 2b is designed to be small. On the other hand, the knife edge 5 is made of a material that hardly generates frictional force with the protective film 2b. For this reason, the protective film 2 b moves along the knife edge 5. As a material constituting the knife edge 5, a metal material, a resin material or the like can be applied, and is not particularly limited. However, use of stainless steel, aluminum, a resin material, or the like is recommended from the viewpoint of corrosion resistance.

  Next, the liquid crystal panel conveyance part provided in the upper part of the manufacturing system 20 is demonstrated. In a liquid crystal panel conveyance part, the liquid crystal panel 7 is conveyed for bonding with the polarizing film 2a.

  As the liquid crystal panel 7, a known liquid crystal panel can be used. For example, a liquid crystal panel in which an alignment film is disposed between a substrate such as a glass substrate and a liquid crystal layer can be used.

  The conveyance roller 8 is a member that conveys the liquid crystal panel 7 and the liquid crystal panel 7 to which the polarizing film 2a is bonded. The transport roller 8 only needs to be able to transport the liquid crystal panel 7, and another configuration such as a robot arm may be used instead of the transport roller 8.

  Between the film transport unit and the liquid crystal panel transport unit, nip rolls 6 and 6a ("." Between member numbers means "and") are arranged. The nip rolls 6 and 6a are members that bond the conveyed polarizing film 2a and the liquid crystal panel 7. The nip rolls 6 and 6a have a configuration in which the relative distance can be changed, and bonding is performed by pressing the adhesive layer surface of the polarizing film 2a and the liquid crystal panel 7. What is necessary is just to adjust suitably the pressure and temperature of the nip roll 6 * 6a at the time of bonding according to the kind of adhesive, the thickness of the polarizing film 2a, etc. FIG.

[Cleaning equipment]
The cleaning device 3 provided in the manufacturing system 20 will be described with reference to FIG. FIG. 2 is a cross-sectional view showing the cleaning device 3 from the side surface direction. The cleaning device 3 includes a cleaning unit 9, a holding unit 10, a storage unit 11, and a driving unit 12.

  The cleaning part 9 is porous and has a structure capable of adsorbing an organic solvent. That is, innumerable pores are formed in the clean part 9. Furthermore, the cleaning part 9 can be cut by the cutting blade 4. The cleaning unit 9 cleans the cutting blade 4 with an organic solvent adsorbed on the cleaning unit 9 by cutting the cleaning unit 9 by the cutting blade 4 to which film scraps, adhesive, and the like are attached.

  Thus, since the cleaning part 9 needs to adsorb | suck an organic solvent, it needs to have a fixed pore. When the porosity of the clean part 9 is small, the adsorption amount of the organic solvent may be small. On the other hand, if the porosity is too large, the hardness of the clean part 9 may be reduced.

  When the hardness decreases, the cutting blade 4 and the cut surface of the cleaning portion 9 are difficult to contact after the cutting blade 4 cuts the cleaning portion 9. As a result, it becomes difficult for the organic solvent to come into contact with the cutting blade 4, which is not preferable.

  Considering the above factors, the porosity of the clean part 9 is preferably 80% or more and 98% or less, and more preferably 90% or more and 96% or less.

The porosity P (%) of the clean part 9 can be expressed by the following formula (1), where V is the total volume of the clean part 9 including the pores, V ₀ is the total volume of the pores. . The porosity P (%) can also be expressed by the following formula (2) using the density (polyethylene or the like) and the apparent density of a pure substance constituting the clean part 9.

P (%) = V ₀ / V × 100 (1)
P (%) = (density of pure substance−apparent density) / density of pure substance × 100 (2)
Further, the cleaning unit 9 needs to be cut by the cutting blade 4. For this reason, when the hardness of the clean part 9 is shown by 25% compression hardness, it is preferable that it is 0.005 MPa or more and 0.500 MPa or less. The apparent density of the cleaning unit 9, 0.01 g / cm ³ or more and 0.300 g / cm ³ or less.

  Examples of the material constituting the cleaning section 9 having the above physical properties include foam materials such as polyethylene, polyurethane, polypropylene, polystyrene, and melamine. The foam material can be produced by a known method such as a foaming method using a chemical crosslinking agent or a foaming method using radiation. Moreover, you may use a commercial item. These foam materials have the advantage that film scraps are less likely to occur after being cut by the cutting blade 4. Although it does not specifically limit as thickness of the cleaning part 9, As an example, they can be 1 mm or more and 50 mm or less.

  The shape of the cleaning part 9 in FIG. 2 is a flat cylindrical structure. A cylindrical structure is preferable because it is a rotationally symmetric structure. That is, even if the cleaning unit 9 is rotated by the cutting blade 4 and then the cleaning unit 9 is rotated, the surface of the cleaning unit 9 with respect to the cutting blade 4 (surface angle, etc.) can be kept constant. However, it is possible to obtain a cleaning action by the cleaning device 3 even in other shapes, for example, a rectangular parallelepiped shape or a cube shape.

  The holding unit 10 is a member that holds the cleaning unit 9, and has a shape that covers the periphery of the cleaning unit 9. As shown in FIG. 2, a cylindrical shape is shown as a specific shape, but the shape of the holding portion 10 is not particularly limited. In addition, an opening may be formed in the holding unit 10 in order to bring the organic solvent into contact with the cleaning unit 9. The upper surface of the holding unit 10 does not completely cover the cleaning unit 9, and the cleaning unit 9 protrudes from the side surface. Due to the upper shape, it is possible for the cutting blade 4 to cut only the clean part 9 and avoid the cutting of the holding part 10. The material which comprises the holding | maintenance part 10 will not be specifically limited if it is not corroded by the organic solvent, For example, stainless steel can be mentioned.

  The accommodating part 11 is a member that accommodates a part of the cleaning part 9 and the organic solvent. According to this configuration, the cleaning unit 9 can adsorb the organic solvent in the storage unit 11. As an organic solvent that can be used in the cleaning device 3, (1) it can be adsorbed to the cleaning unit 9 (pores of the cleaning unit 9), and (2) the adhesive can be cleaned, that is, the adhesive can be dissolved. (3) Any device that does not dissolve the cleaning part 9 may be used. Regarding (3), a solubility test can be performed in advance and can be easily confirmed.

  Considering the above (1) to (3), an organic solvent is appropriately selected depending on the type of the pressure-sensitive adhesive. As specific examples of the organic solvent, known organic solvents such as ethanol, methanol, isopropyl alcohol, ethyl acetate, dimethylformamide, dimethyl sulfoxide, N-methylpyrrolidone, acetone, benzene, toluene, xylene, and hexane can be used. . Moreover, the said organic solvent may be used individually or in mixture of 2 or more types. In addition, as shown in FIG. 2, it is good also as a structure in which the holding | maintenance part 10 is accommodated in the accommodating part 11. As shown in FIG.

  According to the cleaning device 3, the cutting blade 4 is cleaned by the cleaning portion 9 that has adsorbed the organic solvent being cut by the cutting blade 4. That is, the cutting blade 4 can be cleaned during the cutting operation of the cutting blade 4. Generally, the cutting blade is cleaned by an operator after the entire manufacturing system including the half-cut device is stopped. On the other hand, according to the cleaning device 3 according to the present embodiment, it is possible to clean the cutting blade 4 during the cutting operation. Therefore, the entire manufacturing system 20 including the half-cut device 21 shown in FIG. The cutting blade 4 can be cleaned without stopping. That is, the time required for cleaning can be greatly shortened, and the tact time can be shortened in the manufacture of the optical display device.

  The cleaning device 3 includes a drive unit 12 as a preferred form. The drive unit 12 has a rotatable mechanism and is connected to the holding unit 10 via a rotation shaft 12a. As the drive unit 12, a motor or the like can be employed. The drive unit 12 can rotate the holding unit 10 by rotating, and rotates the holding unit 10 about the central axis of the cleaning unit 9 on a plane perpendicular to the cutting edge direction of the cutting blade 4. Thereby, the cleaning part 9 can also be rotated. In FIG. 2, the central axis of the cleaning unit 9 is disposed along the rotation axis 12a.

  After the cleaning unit 9 is cut by the cutting blade 4, a new surface that is not cut out of the cleaning unit 9 can be arranged with respect to the cutting blade 4 by performing the rotation operation. Thus, by changing the surface of the cleaning part 9 with respect to the cutting blade 4, the cleaning part 9 can be repeatedly used for cleaning, and the replacement frequency of the cleaning part 9 can be suppressed, which is very preferable.

[Half-cut device and cutting blade cleaning method]
The half-cut apparatus 21 provided with the cleaning apparatus 3 mentioned above is demonstrated using FIG. FIG. 3 is a perspective view showing the half-cut device 21. The half-cut device 21 is a device that cuts the polarizing film 2 a in the film laminate 2, and includes a support base 14, a cutting blade 4, and a cleaning device 3.

  Hereinafter, the cutting blade cleaning method according to the present embodiment will be described together with the configuration and operation of the half-cut device 21. The method supports the film laminate along the width direction of the film laminate, cuts the polarizing film and the adhesive layer of the supported film laminate with the cutting blade, and arranges the cut laminate along the running line of the cutting blade. In this method, the cutting blade 4 is cleaned by cutting the porous cleaning portion adsorbing the organic solvent with the cutting blade. Although the above method is understood by the operation of the half-cut device 21, the above method can be implemented without using the half-cut device 21.

  The support base 14 is a member that supports the film laminate 2 when the polarizing film 2 a is cut by the cutting blade 4. Further, the cutting blade 4 is disposed on the movable table 13. The cutting blade 4 is not particularly limited as long as it can cut the polarizing film 2a, and a straight flat blade can be used, but a round blade is preferable from the viewpoint of hardly generating film scraps. Moreover, when using a round blade, you may use the rotation type which cut | disconnects by rotating, but it is preferable to use a non-rotation type round blade. If it is a non-rotating type, when a part of cutting blade 4 is worn, the polarizing film 2a can be cut at a portion that is not worn by changing the position of the cutting blade 4. That is, the cutting blade 4 can be used for a long time.

  In the present embodiment, a round blade is used as the cutting blade 4. As an example, the outer diameter of the round blade is 10 mm or more and 150 mm or less, and the thickness of the round blade is 0.3 mm or more and 2.0 mm or less.

  The moving table 13 is configured to move along the width direction of the film laminate 2 and is a member that moves the cutting blade 4. When half-cutting is performed, unwinding of the film laminate 2 is stopped, and the cutting blade 4 is moved in the width direction of the film laminate 2 by the moving table 13. The cutting blade 4 is disposed at a position where the depth of the blade is in contact with the polarizing film 2 a and the adhesive layer in the film laminate 2, and along the running line 15 of the cutting blade 4 along the width direction of the film laminate 2. Only the polarizing film 2a can be cut. Thus, since the cutting blade 4 only needs to be able to move in the width direction of the film laminate 2, a robot arm or the like can be used instead of the moving table 13.

  The cleaning device 3 is disposed along the travel line 15. More specifically, the cleaning device 3 is arranged at a position where the cutting blade 4 can cut the cleaning portion 9 protruding from the holding portion 10. For this reason, the drive part 12 and the rotating shaft 12a are embedded in the support base 14 (corresponding to the right side from the broken line in FIG. (Corresponding to the left portion from the broken line shown in FIG. 2).

  The polarizing film 2 a and the adhesive layer are cut by the cutting blade 4 by the movement of the moving table 13, and then the cleaning part 9 arranged along the running line 15 is cut by the cutting blade 4. Since the organic solvent is adsorbed in the cleaning unit 9, the cutting blade 4 is cleaned by the cleaning unit 9 (specifically, the cut surface of the cleaning unit 9) along with the above cutting. The cutting of the cleaning unit 9 may be performed by reciprocating the cleaning unit 9, or may be performed only in one direction.

  In the half-cut device 21 according to the present embodiment, since the cleaning part is disposed on the running line 15 of the cutting blade 4, the polarizing film 2 a and the adhesive layer are cut by the cutting blade 4 and the cleaning part 9 is also provided. Can be cut. According to said structure, the cutting | disconnection of the polarizing film 2a and the adhesion layer, and the cleaning of the cutting blade 4 by the cleaning part 9 can be performed in series, and it cleans in a short time, without stopping the half-cut apparatus 21. Is possible.

  After the polarizing film 2a and the adhesive layer are cut, the film laminate 2 is sent out at a constant interval, and the unwinding of the film laminate 2 is stopped again. In this case, the polarizing film 2a and the adhesive layer are cut by moving the cutting blade 4 located on the cleaning device 3 side toward the initial position. In the half-cut device 21, the cleaning device 3 is disposed at one end of the support base 14, but may be disposed at both ends of the support base 14. Since the frequency of cleaning the cutting blade 4 is increased by being provided at both ends, the cutting blade 4 can be kept more clean.

  In the cutting blade cleaning method according to the present embodiment, it is preferable to rotate the cleaning unit 9 in a direction perpendicular to the cutting edge direction of the cutting blade after the cleaning unit 9 is cut by the cutting blade 4. Thereby, the new surface which is not cut | disconnected among the cleaning parts 9 can be arrange | positioned with respect to the cutting blade 4. FIG. Thus, by changing the surface of the cleaning part 9 with respect to the cutting blade 4, the cleaning part 9 can be repeatedly used for cleaning, and the replacement frequency of the cleaning part 9 can be suppressed, which is very preferable.

  As described above, the cleaning device and the half-cut device according to the present embodiment have been described. However, the present invention has been completed by focusing on the cutting of the polarizing film by the cutting blade and the cleaning of the cutting blade during a series of operations. It is a thing. That is, it is added that the present invention is based on a new technical idea that has not been conceived by those skilled in the art.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  The cleaning device according to the present invention can be used as a part of a cutting device for cutting a polarizing film, and the present invention can be applied to a manufacturing system or a half-cut device for a liquid crystal display device for bonding a polarizing film and a liquid crystal panel. Can be used.

DESCRIPTION OF SYMBOLS 1 Unwinding part 1a Winding part 2 Film laminated body 2a Polarizing film 2b Protective film 3 Cleaning apparatus (cutting blade cleaning apparatus)
DESCRIPTION OF SYMBOLS 4 Cutting blade 5 Knife edge 6 * 6a Nip roll 7 Liquid crystal panel 8 Conveying roller 9 Cleaning | cleaning part 10 Holding | maintenance part 11 Storage part 12 Drive part 13 Moving stand 14 Supporting stand 15 Running line 21 Half cut device (half cut device of a film laminated body)

Claims (5)

In a cutting blade cleaning device for a cutting blade for cutting a polarizing film and an adhesive layer in a film laminate including at least a polarizing film, an adhesive layer and a protective film,
A porous cleaning section capable of adsorbing organic solvents;
A holding part for holding the clean part;
A part of the clean part and a container for containing the organic solvent,
A cutting blade cleaning apparatus, wherein the porous cleaning section can be cut by the cutting blade.   The cutting blade cleaning according to claim 1, further comprising: a driving unit that rotates the cleaning unit by rotating the holding unit about a central axis of the cleaning unit on a plane perpendicular to the cutting edge direction of the cutting blade. apparatus. Along the width direction of the film laminate, a support for supporting the film laminate,
A cutting blade for cutting the polarizing film and the adhesive layer in the film laminate supported by the support, and
A cutting blade cleaning device according to claim 1 or 2,
The half cut device for a film laminate, wherein the support base includes the cutting blade cleaning device, and the cleaning portion is disposed on a running line of the cutting blade. In the cutting blade cleaning method of the cutting blade for cutting the polarizing film and the adhesive layer out of the film laminate including at least the polarizing film, the adhesive layer and the protective film,
Along the width direction of the film laminate, supporting the film laminate,
Cut the polarizing film and the adhesive layer of the supported film laminate with a cutting blade,
The cutting blade cleaning method characterized by cleaning the said cutting blade by cut | disconnecting the porous cleaning part which adsorb | sucked the organic solvent arrange | positioned along the running line of a cutting blade with a cutting blade.   The cutting blade cleaning method according to claim 4, wherein after the cleaning portion is cut by a cutting blade, the cleaning portion is rotated in a direction perpendicular to a cutting edge direction of the cutting blade.

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