JP5432764B2 - Double-sided adhesive tape for fixing abrasive cloth and pad for fixing abrasive cloth - Google Patents

Description

The present invention provides a double-sided adhesive for fixing an abrasive cloth that is excellent in adhesiveness and chemical resistance to an abrasive cloth, can be peeled off from a polishing surface plate without causing any peeling during polishing and hardly causing any adhesive residue. Regarding tape. The present invention also relates to a polishing pad fixing pad manufactured using the double-sided adhesive tape for fixing the polishing pad.

In the process of polishing a semiconductor wafer or the like to a predetermined thickness, polishing is performed using a polishing cloth fixed to the surface plate of the polishing machine, and in order to fix the polishing cloth to the surface plate of the polishing machine, Usually, double-sided tape is used. The double-sided adhesive tape for fixing the polishing cloth is required to have sufficient adhesive strength so that the polishing cloth does not peel off during polishing, and can be peeled off from the surface plate without any adhesive residue when the used polishing cloth is replaced. .

As such a double-sided adhesive tape for fixing an abrasive cloth, for example, in Patent Document 1, an adhesive layer made of a nitrile rubber adhesive is provided on one side of a plastic film, and a releasable pressure-sensitive adhesive layer is provided on the other side. There is disclosed a double-sided adhesive tape for fixing an abrasive comprising:
Patent Document 2 discloses a thermal reaction in which (A) an acrylic ester copolymer having an ethylenically unsaturated group in a molecule and (B) a thermal radical polymerization initiator are mixed on one surface of a plastic film. A double-sided tape for fixing a heat-reactive abrasive is disclosed in which a mold pressure-sensitive adhesive layer is provided and a releasable pressure-sensitive adhesive layer is provided on the other surface of the plastic film. In Patent Document 2, in the double-sided tape for fixing a heat-reactive abrasive described in the same document, the heat-reactive pressure-sensitive adhesive layer is a mere adhesive at room temperature, and is cross-linked by hot pressing to increase cohesion. Further, it is described that the adhesion force increases in proportion.

However, in recent years, the process of polishing a semiconductor wafer or the like is performed while flowing a strongly acidic or strongly alkaline slurry solution. Therefore, in order to prevent peeling during polishing, in addition to the adhesion to the polishing cloth, the chemical resistance is improved. The conventional double-sided adhesive tape for fixing an abrasive cloth as described in Patent Document 1 or 2 cannot sufficiently cope with this problem. In addition, for example, when a thermal radical polymerization initiator is contained in the pressure-sensitive adhesive layer as described in Patent Document 2, the curing reaction proceeds slightly even at room temperature, and the storage stability is lowered. It becomes.

JP-A-6-73350 Japanese Utility Model Publication No. 7-27746

The present invention provides a double-sided adhesive for fixing an abrasive cloth that is excellent in adhesiveness and chemical resistance to an abrasive cloth, can be peeled off from a polishing surface plate without causing any peeling during polishing and hardly causing any adhesive residue. The purpose is to provide a tape. Another object of the present invention is to provide a polishing pad fixing pad manufactured using the double-sided adhesive tape for fixing the polishing pad.

The present invention is a double-sided adhesive tape for fixing an abrasive cloth having a heat-reactive adhesive layer containing a phenoxy resin on one surface of a substrate and a pressure-sensitive adhesive layer on the other surface of the substrate. The phenoxy resin is a double-sided adhesive tape for fixing a polishing cloth having a weight average molecular weight of 10,000 or more.
The present invention is described in detail below.

To obtain a double-sided adhesive tape for fixing abrasive cloth, which has excellent adhesiveness to chemicals and chemical resistance, and can be peeled off from the polishing surface plate without residue when replacing the used abrasive cloth. For example, an epoxy resin excellent in performance such as adhesiveness, heat resistance and chemical resistance is used for the adhesive layer on the polishing cloth side of the double-sided adhesive tape, while the adhesive layer on the polishing surface plate side is reused. It is conceivable to use a pressure-sensitive adhesive having excellent releasability. However, for attaching the double-sided adhesive tape for fixing the polishing cloth to the polishing cloth, a laminate at low temperature and low pressure or a heat press is usually used. Therefore, an epoxy resin that requires heating at a high temperature for curing is used. It was difficult to use for the adhesive layer on the polishing cloth side.
The present inventors use a phenoxy resin having a predetermined weight average molecular weight having a linear structure, high flexibility, and thermoplasticity in the adhesive layer on the polishing cloth side of the double-sided adhesive tape for fixing the polishing cloth. Thus, it has been found that the double-sided adhesive tape for fixing the polishing cloth can be firmly fixed to the polishing cloth by laminating or hot pressing at low temperature and low pressure while realizing excellent adhesion to the polishing cloth and excellent chemical resistance.

That is, the present inventors have a heat-reactive adhesive layer containing a phenoxy resin having a predetermined weight average molecular weight on one surface of the substrate, and a pressure-sensitive adhesive layer on the other surface of the substrate. The double-sided adhesive tape for fixing the polishing cloth has excellent adhesion to the polishing cloth and chemical resistance, and can be peeled off from the polishing surface plate without causing any adhesive residue during the polishing without causing peeling. As a result, the present invention has been completed.

The double-sided adhesive tape for fixing an abrasive cloth of the present invention has a heat-reactive adhesive layer on one surface of a substrate.
The double-sided adhesive tape for fixing a polishing cloth of the present invention is used so that the heat-reactive adhesive layer is on the polishing cloth side in the step of polishing a semiconductor wafer or the like.

When adhering the double-sided adhesive tape for fixing the polishing cloth of the present invention to the polishing cloth, the heat-reactive adhesive layer is heated and melted, for example, by laminating at low temperature and low pressure or by hot pressing. Then, the heat-reactive adhesive layer is cooled and solidified. As a result, in the double-sided adhesive tape for fixing the polishing pad of the present invention, a part of the heat-reactive adhesive layer enters the recesses on the surface of the polishing pad and becomes in a state along the recesses and is firmly fixed to the polishing pad.

The heat-reactive adhesive layer contains a phenoxy resin.
Since the phenoxy resin has a linear structure and is highly flexible and exhibits thermoplasticity, the thermally reactive adhesive layer on the abrasive cloth side contains the phenoxy resin, so that the abrasive cloth fixing of the present invention can be performed. The double-sided adhesive tape is firmly fixed to the abrasive cloth by laminating or hot pressing at low temperature and low pressure, which is usually used for attaching the double-sided adhesive tape for fixing the abrasive cloth to the abrasive cloth.
Furthermore, since the phenoxy resin is excellent in performance such as adhesiveness, heat resistance and chemical resistance, the double-sided adhesive tape for fixing the polishing cloth of the present invention has excellent adhesion to the polishing cloth by using the phenoxy resin. Even when the step of polishing a semiconductor wafer or the like is performed while flowing a strongly acidic or strongly alkaline slurry liquid, peeling is less likely to occur during polishing.

The lower limit of the weight average molecular weight of the phenoxy resin is 10,000. When the weight average molecular weight of the phenoxy resin is less than 10,000, the heat-reactive adhesive layer obtained has low heat resistance, and is easily peeled off during polishing, or adhesiveness or flexibility is reduced. The preferable lower limit of the weight average molecular weight of the phenoxy resin is 20,000, more preferably 30,000, and still more preferably 60,000.
Moreover, the said upper limit of the weight average molecular weight of the said phenoxy resin is 90,000. When the weight average molecular weight of the phenoxy resin exceeds 90,000, the compatibility between the phenoxy resin and other components may be reduced, or the solubility when the phenoxy resin is dissolved in a solvent may be reduced. The upper limit of the weight average molecular weight of the phenoxy resin is more preferably 80,000.
In addition, in this specification, a weight average molecular weight means the polystyrene conversion value by gel permeation chromatography (GPC).

Although the glass transition temperature of the said phenoxy resin is not specifically limited, A preferable minimum is 50 degreeC and a preferable upper limit is 200 degreeC. When the glass transition temperature is less than 50 ° C., the glass transition temperature of the cured product may be lowered. When the glass transition temperature exceeds 200 ° C., the adhesiveness and adhesive processability of the phenoxy resin may be deteriorated. The minimum with a more preferable glass transition temperature of the said phenoxy resin is 70 degreeC, and a more preferable upper limit is 110 degreeC.

The phenoxy resin is not particularly limited as long as it has a weight average molecular weight in the above range, but preferably has at least one skeleton selected from the group consisting of a bisphenol S skeleton and a biphenyl skeleton.
The bisphenol S skeleton means a 4,4-dihydroxydiphenylsulfone skeleton. Since the bisphenol S skeleton has a highly polar sulfone group (—SO ₂ —) in the structure, the attractive interaction between the resin having the bisphenol S skeleton and the adherend interface is increased, and the adhesive strength is increased. improves. Further, since the biphenyl skeleton is rigid, the resin having the biphenyl skeleton has improved heat-resistant adhesion and excellent flame retardancy.
Moreover, since the said phenoxy resin can improve the solvent resistance of hardened | cured material, it is preferable to have an epoxy group at both ends of a molecular chain.

More specific examples of the phenoxy resin include a bisphenol S-type and biphenyl-type copolymer phenoxy resin, and a phenoxy resin containing a bromine atom in the molecule of the copolymer phenoxy resin. These phenoxy resins may be used alone or in combination of two or more.
Among the phenoxy resins, examples of commercially available products include trade name “YX8100” (manufactured by Japan Epoxy Resin Co., Ltd.).

The heat-reactive adhesive layer may further contain another epoxy resin having two or more epoxy groups, a curing agent, and a curing accelerator. By using these compounds, the double-sided adhesive tape for fixing the polishing cloth of the present invention is further improved in adhesion to the polishing cloth, heat resistance, chemical resistance and the like.
The other epoxy resin having two or more epoxy groups is not particularly limited, for example, a solid epoxy resin such as dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, solid bisphenol type epoxy resin, Liquid epoxy resins such as liquid bisphenol A type epoxy resin and liquid bisphenol F type epoxy resin, crystalline epoxy resins such as bisphenol S type epoxy resin, biphenyl type epoxy resin, crystalline naphthalene type epoxy resin and anthracene type epoxy resin It is done. These may be used independently and 2 or more types may be used together.

When the heat-reactive adhesive layer contains another epoxy resin having two or more epoxy groups, the amount of the other epoxy resin having two or more epoxy groups is not particularly limited, but the phenoxy resin 100 A preferred lower limit relative to parts by weight is 1 part by weight, and a preferred upper limit is 30 parts by weight. When the amount of the other epoxy resin having two or more epoxy groups is less than 1 part by weight, the effect of improving the adhesiveness, heat resistance, chemical resistance, etc. to the polishing cloth may not be sufficiently obtained. . When the blending amount of the other epoxy resin having two or more epoxy groups exceeds 30 parts by weight, the obtained double-sided adhesive tape for fixing a polishing cloth cannot be fixed to the polishing cloth by lamination at low temperature and low pressure or by hot pressing. Sometimes.
As for the compounding quantity of the other epoxy resin which has 2 or more of said epoxy groups, the more preferable upper limit with respect to 100 weight part of said phenoxy resins is 20 weight part.

The said hardening | curing agent and hardening accelerator are not specifically limited, The normal hardening agent and hardening accelerator used for hardening of an epoxy resin are used.
Examples of the curing agent include heat curing acid anhydride curing agents such as trialkyltetrahydrophthalic anhydride, phenol curing agents, amine curing agents, latent curing agents such as dicyandiamide, and cationic catalyst curing agents. Is mentioned. These epoxy resin curing agents may be used alone or in combination of two or more. Of these, acid anhydride curing agents are preferred.

When the heat-reactive adhesive layer contains the curing agent, the blending amount of the curing agent is not particularly limited, but when a curing agent that reacts with the curable functional group in an equal amount is used, the amount of the curable functional group. The preferred lower limit for is 30 equivalents, and the preferred upper limit is 140 equivalents. If the blending amount of the curing agent is less than 30 equivalents, sufficient curing may not be obtained. Even if the compounding quantity of the said hardening | curing agent exceeds 140 equivalent, it does not contribute to sclerosis | hardenability especially.
Moreover, when using the hardening | curing agent which functions as a catalyst, as for the compounding quantity of the said hardening | curing agent, the preferable minimum with respect to 100 weight part of sclerosing | hardenable compounds is 1 weight part, and a preferable upper limit is 20 weight part. If the blending amount of the curing agent is less than 1 part by weight, sufficient curing may not be obtained. Even if the compounding quantity of the said hardening | curing agent exceeds 20 weight part, it does not contribute to sclerosis | hardenability especially.

Examples of the curing accelerator include imidazole-based curing accelerators and tertiary amine-based curing accelerators. These hardening accelerators may be used independently and 2 or more types may be used together. Among these, an imidazole-based curing accelerator is preferable because it is easy to control the reaction system for adjusting the curing speed or the physical properties of the cured product.
The imidazole-based curing accelerator is not particularly limited. For example, 1-cyanoethyl-2-phenylimidazole in which the 1-position of imidazole is protected with a cyanoethyl group, an imidazole-based curing accelerator whose basicity is protected with isocyanuric acid (trade name “ 2MA-OK ", manufactured by Shikoku Kasei Kogyo Co., Ltd.). These imidazole type hardening accelerators may be used independently and 2 or more types may be used together.

The heat-reactive adhesive layer is more flexible than the cross-linking agent such as isocyanate-based cross-linking agent, aziridine-based cross-linking agent, epoxy-based cross-linking agent, inorganic filler such as silica, and the heat-reactive adhesive layer. A rubber for imparting or a thermoplastic resin such as butyral may be contained.

Although the thickness of the said heat-reactive adhesive layer is not specifically limited, A preferable minimum is 20 micrometers. If the thickness of the heat-reactive adhesive layer is less than 20 μm, the resulting double-sided adhesive tape for fixing an abrasive cloth may have poor followability to the unevenness of the abrasive cloth and may be easily peeled off during polishing. A more preferable lower limit of the thickness of the heat-reactive adhesive layer is 50 μm.

The double-sided adhesive tape for fixing an abrasive cloth of the present invention has a pressure-sensitive adhesive layer on the other surface of the substrate.
The double-sided adhesive tape for fixing a polishing cloth of the present invention is used so that the pressure-sensitive adhesive layer is on the polishing surface plate side in the step of polishing a semiconductor wafer or the like.

The double-sided adhesive tape for fixing a polishing cloth of the present invention is firmly fixed to the polishing surface plate by the pressure-sensitive adhesive layer by pressing the pressure-sensitive adhesive layer against the polishing surface plate. In addition, the double-sided adhesive tape for fixing the polishing cloth of the present invention can be peeled off from the polishing platen with little adhesive residue due to the cohesiveness of the pressure-sensitive adhesive layer when the used polishing cloth is replaced. Can do.

The pressure-sensitive pressure-sensitive adhesive layer is not particularly limited as long as the pressure-sensitive pressure-sensitive adhesive layer can exhibit adhesiveness by being pressurized at room temperature. For example, general-purpose pressure-sensitive adhesive tapes such as acrylic resin-based pressure-sensitive adhesives and rubber-based pressure-sensitive adhesives can be used. It is preferable to contain an adhesive. These pressure-sensitive adhesives may be used alone or in combination of two or more.
Examples of the acrylic resin-based pressure-sensitive adhesive include homopolymers or copolymers of (meth) acrylic acid ester monomers. Examples of the acrylic resin-based pressure-sensitive adhesive include copolymers of (meth) acrylic acid ester monomers and other polymerizable monomers copolymerizable with the (meth) acrylic acid ester monomers.
In addition, in this specification, (meth) acrylic acid ester means both acrylic acid ester and methacrylic acid ester.

Although the said (meth) acrylic acid ester monomer is not specifically limited, The (meth) acrylic acid ester monomer which has a C4-C12 alkyl group is preferable.
The (meth) acrylic acid ester monomer having an alkyl group having 4 to 12 carbon atoms is not particularly limited. For example, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, (meth) acrylic acid Examples include isooctyl, n-octyl (meth) acrylate, isononyl (meth) acrylate, and lauryl (meth) acrylate. These may be used independently and 2 or more types may be used together.

The copolymer of the (meth) acrylic acid ester monomer is not particularly limited, but the main component is a (meth) acrylic acid ester monomer having a glass transition temperature (Tg) of −50 ° C. or less of the homopolymer, and (meth) A copolymer obtained by using a (meth) acrylic acid ester monomer of a lower alcohol such as methyl acrylate and ethyl (meth) acrylate is preferred. By using such a copolymer, the resulting pressure-sensitive adhesive layer can exhibit excellent adhesive strength, and further has a good balance between adhesive strength and cohesiveness. The fixing double-sided adhesive tape can be peeled off from the polishing surface plate with almost no adhesive residue.

Other polymerizable monomers copolymerizable with the (meth) acrylic acid ester monomer are not particularly limited. For example, a carboxyl group-containing monomer such as (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid or the anhydride thereof , Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 4-hydroxybutyl acrylate, polyoxyethylene (meth) acrylate, polyoxypropylene (meth) acrylate, caprolactone-modified (meth) acrylate, and the like.

The rubber-based pressure-sensitive adhesive is not particularly limited, and examples thereof include natural rubber, polyisoprene rubber, SBR, polyisobutylene, and butyl rubber. Moreover, as said rubber-type adhesive, block copolymers, such as SIS, SBS, SEBS, are mentioned, for example. These rubber-based pressure-sensitive adhesives may be used alone or in combination of two or more.

The pressure-sensitive pressure-sensitive adhesive layer may contain various additives such as tackifiers, inorganic fillers or organic fillers, antioxidants or anti-aging agents, heat stabilizers, light stabilizers, and ultraviolet absorbers as necessary. It may contain.

The pressure-sensitive adhesive layer is preferably attached with a release material from the viewpoint of transportation. By using the release material, the double-sided adhesive tape for fixing an abrasive cloth of the present invention can be rolled and shipped.
The release material is not particularly limited, and can be obtained, for example, by subjecting at least one surface of paper, plastic film or the like to release treatment with a silicone resin release agent, a long-chain alkyl group pendant graft polymer release agent, or the like. Examples include release paper and release film.

Although the thickness of the said pressure sensitive adhesive layer is not specifically limited, A preferable minimum is 20 micrometers and a preferable upper limit is 100 micrometers. When the thickness of the pressure-sensitive adhesive layer is less than 20 μm, the resulting double-sided adhesive tape for fixing an abrasive cloth may be easily peeled during polishing. When the thickness of the pressure-sensitive adhesive layer exceeds 100 μm, the obtained double-sided adhesive tape for fixing an abrasive cloth may easily cause an adhesive residue on the polishing surface plate when the used abrasive cloth is replaced.

As described above, the double-sided adhesive tape for fixing an abrasive cloth of the present invention has the above-mentioned heat-reactive adhesive layer on one surface of the substrate and the above-mentioned pressure-sensitive adhesive layer on the other surface of the substrate. .
The said base material is not specifically limited, For example, the synthetic resin film etc. which consist of polyolefin resin, such as a polyester-type resin and a polypropylene resin, etc. are mentioned. Examples of the base material include foam sheets made of polyolefin resins such as polyurethane resins and polypropylene resins. Among these, a synthetic resin film made of a polyester resin is preferable because it is flat, has a small thickness fluctuation, and has a certain strength.
In addition, the base material can be easily treated by surface treatment such as corona treatment or plasma treatment, rubber-based or polyurethane resin-based in order to improve adhesion between the heat-reactive adhesive layer and the pressure-sensitive adhesive layer. It is preferable that an adhesion treatment or the like is performed.

The thickness of the substrate is not particularly limited, but when it is a non-foamed material, the preferred lower limit is 12 μm and the preferred upper limit is 300 μm. When the thickness of the base material that is the non-foamed material is less than 12 μm, the obtained double-sided adhesive tape for fixing a polishing cloth breaks the base material when it is peeled off from the polishing surface plate when the used polishing cloth is replaced. And may not be able to peel cleanly. If the thickness of the non-foamed substrate exceeds 300 μm, it becomes difficult to adjust the pressure when the resulting double-sided adhesive tape for fixing abrasive cloth is pressed against the abrasive cloth, and the double-sided adhesive tape for fixing abrasive cloth is polished. Adhesive strength to cloth may be reduced. The minimum with more preferable thickness of the base material which is the said non-foaming body is 20 micrometers, and a more preferable upper limit is 250 micrometers.

When the thickness of the base material is a foam, the preferable lower limit is 50 μm, and the preferable upper limit is 3000 μm. When the thickness of the base material that is the foam is less than 50 μm, the obtained double-sided adhesive tape for fixing a polishing cloth breaks the base material when it is peeled off from the polishing surface plate when the used polishing cloth is replaced. , May not be able to peel cleanly. When the thickness of the base material which is the foam exceeds 3000 μm, the base material is pushed in and deformed by the pressure during polishing, and the polishing accuracy of the polished article may be lowered. The minimum with more preferable thickness of the base material which is the said foam is 100 micrometers, and a more preferable upper limit is 2000 micrometers.

In the double-sided adhesive tape for fixing an abrasive cloth of the present invention, the 180 ° peel-off adhesive strength to a stainless steel plate (SUS) measured in accordance with JIS Z0237 for the pressure-sensitive adhesive layer is not particularly limited, but a preferable lower limit is 3 N / 25 mm. When the 180 ° peeling adhesive strength is less than 3 N / 25 mm, the double-sided adhesive tape for fixing the polishing cloth may be easily peeled off from the polishing surface plate during polishing. The more preferable lower limit of the 180 ° peeling adhesive strength is 5 N / 25 mm.

The manufacturing method of the double-sided adhesive tape for fixing the abrasive cloth of the present invention is not particularly limited, and examples thereof include the following methods.
First, an adhesive solution for a heat-reactive adhesive layer is applied to the surface of the substrate, and the solvent in the adhesive solution is completely removed by drying to form a heat-reactive adhesive layer. On the other hand, a pressure-sensitive adhesive layer pressure-sensitive adhesive solution is applied to a release film or a release-treated surface of a release paper that has been newly prepared, and the solvent in the pressure-sensitive adhesive solution is completely removed by drying. A laminated film having a pressure sensitive adhesive layer formed on the surface of the release paper is prepared.
Next, the laminate film is overlaid so that the pressure-sensitive adhesive layer of the obtained laminate film and the heat-reactive adhesive layer on the substrate are in a state of sandwiching the substrate, to produce a laminate, The obtained laminate is pressed with a rubber roller or the like. Accordingly, the heat-reactive adhesive layer is provided on one surface of the substrate, the pressure-sensitive adhesive layer is provided on the other surface of the substrate, and the release film or release paper is provided on the surface of the pressure-sensitive adhesive layer. A double-sided adhesive tape for fixing a polishing cloth, which is laminated so as to be peelable, is obtained.

The said solvent is not specifically limited, For example, ethyl acetate, tetrahydrofuran, acetone, methyl ethyl ketone, cyclohexane, benzene, toluene etc. are mentioned.

The shape of the double-sided adhesive tape for fixing an abrasive cloth of the present invention is not particularly limited, and examples thereof include a long band wound in a roll shape, a short band shape, a sheet shape such as a rectangle or a circle.

The double-sided adhesive tape for fixing a polishing cloth of the present invention is used for fixing a polishing cloth to a polishing surface plate in a step of polishing a semiconductor wafer, a glass substrate for liquid crystal, etc., and the heat-reactive adhesive layer is on the polishing cloth side. In addition, the pressure-sensitive adhesive layer is used so as to be on the polishing platen side.
The double-sided adhesive tape for fixing an abrasive cloth of the present invention is firmly fixed to an abrasive cloth and a polishing surface plate, and is excellent in chemical resistance. In addition, the double-sided adhesive tape for fixing the polishing cloth of the present invention can be peeled off from the polishing surface plate with almost no adhesive residue when the used polishing cloth is replaced. Therefore, by using the double-sided adhesive tape for fixing the polishing cloth of the present invention, polishing of a semiconductor wafer, a glass substrate for liquid crystal, etc. can be performed in a stable state for a long period of time.

The polishing pad fixing pad formed by laminating and integrating the polishing pad fixing double-sided adhesive tape of the present invention and the polishing pad is also one aspect of the present invention.
Although the said abrasive cloth is not specifically limited, For example, the abrasive cloth which consists of a foam of hard polyurethane, the foam of various rubbers, the foam of olefin resin, such as polyethylene and a polypropylene, etc. are mentioned. In addition, as the abrasive cloth, for example, an abrasive cloth comprising a sliced product of the foam having an average foamed particle diameter of 0.5 mm or more, the foam containing abrasive grains such as cerium and silica, a filler, an abrasive, and the like. An abrasive cloth made of

According to the present invention, for fixing a polishing cloth, which has excellent adhesion to a polishing cloth and chemical resistance, does not peel during polishing, and can be peeled off from a polishing surface plate with almost no adhesive residue. A double-sided adhesive tape can be provided. Moreover, according to this invention, the pad for polishing cloth fixing manufactured using this double-sided adhesive tape for polishing cloth fixation can be provided.

Examples of the present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Example 1
A monomer mixture containing 2.5 parts by weight of acrylic acid, 38.0 parts by weight of butyl acrylate, 4.2 parts by weight of ethyl acrylate and 54.9 parts by weight of 2-hydroxyethyl acrylate, and as a polymerization initiator 0.2 parts by weight of benzoyl peroxide (manufactured by NOF Corporation) is dissolved in 100 parts by weight of ethyl acetate, heated to 95 ° C. and subjected to radical polymerization for 8 hours. Coalescence was obtained. The obtained copolymer was diluted with toluene to prepare a pressure-sensitive adhesive layer pressure-sensitive adhesive solution.

The obtained pressure-sensitive adhesive layer adhesive solution is applied to the surface of a polyethylene terephthalate (PET) base film having a thickness of 23 μm, and the solvent in the adhesive solution is removed by drying at 100 ° C. for 5 minutes. A pressure-sensitive adhesive layer having a thickness of 60 μm was formed. On the formed pressure-sensitive adhesive layer, release paper was superposed so that the release-treated surface was in contact with the pressure-sensitive adhesive layer, and a film (A) having a pressure-sensitive adhesive layer was obtained.

On the other hand, 30 parts by weight of YP-50 (manufactured by Tohto Kasei Co., Ltd., phenoxy resin, weight average molecular weight 60,000 to 80,000) is dissolved in 100 parts by weight of MEK, and 2 parts by weight of isocyanate is added as a curing agent to contain phenoxy resin. An adhesive solution for a heat-reactive adhesive layer was prepared.
The obtained adhesive solution is applied to the release treatment surface of the 50 μm-thick PET release film subjected to the release treatment, and dried at 100 ° C. for 5 minutes to remove the solvent in the adhesive solution. A film (B) having a heat-reactive adhesive layer having a thickness of 35 μm was obtained.

The film (A) and the film (B) are overlapped so that the heat-reactive adhesive layer of the film (B) is in contact with the surface opposite to the side where the pressure-sensitive adhesive layer of the film (A) is formed. A laminate was produced. A 2 kg rubber roller was reciprocated once at a speed of 300 mm / min on this laminate, and then cured at 40 ° C. for 2 days, whereby a heat-reactive adhesive layer containing a phenoxy resin was formed on one side of the PET base film. A double-sided adhesive tape for fixing an abrasive cloth having a pressure sensitive adhesive layer on the other surface of the PET base film was obtained.

(Example 2)
30 parts by weight of YP-55U (manufactured by Toto Kasei Co., Ltd., phenoxy resin, weight average molecular weight 40,000 to 45,000) is dissolved in 100 parts by weight of MEK, and EPICLON 2050 (manufactured by DIC, as an epoxy resin having two or more epoxy groups) 10 parts by weight of bisphenol A type epoxy resin), 0.2 parts by weight of acid anhydride (Licacid MH-700, manufactured by Shin Nippon Rika Co., Ltd.) as a curing agent, and imidazole curing accelerator (2E4MZ, Shikoku Kasei Kogyo Co., Ltd.) as a curing accelerator (Manufactured) A double-sided adhesive tape for fixing an abrasive cloth was obtained in the same manner as in Example 1 except that 0.01 part by weight was added to prepare an adhesive solution for a heat-reactive adhesive layer containing a phenoxy resin. .

(Comparative Example 1)
In the same manner as in Example 1, a film (A) having a pressure-sensitive adhesive layer was obtained.
On the other hand, rosin A1 15 was added to 100 parts by weight of a copolymer obtained by copolymerizing a monomer mixture containing butyl acrylate, 2-ethylhexyl acrylate, vinyl acetate and acrylic acid in a mixing ratio of 76: 15: 5: 4. (Arakawa Chemical Co., Ltd.) 15 parts by weight is added, ethyl acetate is added as a solvent so that the solid concentration is 45% by weight, and 1.0 part by weight of isocyanate L55 (Nippon Polyurethane Co., Ltd.) is added. The adhesive solution thus obtained was used in place of the adhesive solution for a heat-reactive adhesive layer containing YP-50 (manufactured by Toto Kasei Co., Ltd., phenoxy resin, weight average molecular weight 60,000 to 80,000), (B) was obtained.
A double-sided adhesive tape for fixing an abrasive cloth was obtained in the same manner as in Examples 1 and 2 using the obtained film (A) and film (B).

(Evaluation)
The following evaluation was performed about the double-sided adhesive tape for abrasive cloth fixation obtained by the Example and the comparative example.

(1) 180 degree peeling adhesive strength (1-1) 180 degree peeling adhesive strength (thermal reaction type adhesive layer)
A 35 μm-thick PET film was lined on the pressure-sensitive adhesive layer of the obtained double-sided adhesive tape for fixing an abrasive cloth, and then a plane rectangular test piece having a length of 100 mm × width of 25 mm was cut out. The heat-reactive adhesive layer of this test piece was placed on a polishing cloth and attached using a laminator machine at 100 ° C. and 2 kg / cm ² , and allowed to stand for 20 minutes or more in an atmosphere at a temperature of 23 ° C. and a relative humidity of 50%. did. Next, the adhesive strength was measured by peeling 180 ° using a tensile tester.
When the case where 180 degree peeling adhesive strength was strong enough to tear the PET film was evaluated as ○ and the case where interface peeling occurred was evaluated as ×, evaluation of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 1 The result was ◯, the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 2 was ◯, and the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Comparative Example 1 was x.

(1-2) 180 ° peeling adhesion after immersion in chemical solution (thermal reaction type adhesive layer)
A PET film having a thickness of 38 μm was lined on the pressure-sensitive adhesive layer of the obtained double-sided adhesive tape for fixing an abrasive cloth, and then a plane rectangular test piece having a length of 100 mm × width of 25 mm was cut out. The heat-reactive adhesive layer of this test piece was placed on a polishing cloth and attached using a laminator at 100 ° C. and 2 kg / cm ² , and allowed to stand for 30 minutes in an atmosphere at a temperature of 23 ° C. and a relative humidity of 50%. . Next, the test piece was immersed in an aqueous 0.1 mol / L sodium hydroxide solution at 80 ° C. and left for 12 hours. Then, after washing with running water and towel drying, the adhesive strength was measured by peeling 180 ° using a tensile tester.
When the case where 180 degree peeling adhesive strength was strong enough to tear the PET film was evaluated as ○ and the case where interface peeling occurred was evaluated as ×, evaluation of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 1 The result was ◯, the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 2 was ◯, and the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Comparative Example 1 was x.

(2) Presence or absence of peeling during polishing The obtained double-sided adhesive tape for fixing a polishing cloth was attached to the polishing cloth at 100 ° C. and 2 kg / cm ² using a laminator machine. Next, by pressing a rubber roll from the polishing cloth side, the polishing cloth was fixed to the surface plate of the polishing machine via the double-sided adhesive tape for fixing the polishing cloth.
Using a glass plate as a specimen to be polished, polishing was performed for 5 minutes at a polishing pressure of 49.0 kPa and a rotation speed of 100 rpm using a polishing slurry (manufactured by Cabot Microelectronics, “SS25” or “W2000”). Thereafter, the peeled state was visually observed at the interface between the double-sided adhesive tape for fixing the polishing cloth and the polishing cloth. Such polishing and observation were performed 10 times.
In 10 times, no peeling occurred once, in 10 times, no peeling occurred in 10 times, but when floating more than once, Δ in 10 times, once or more When the case where peeling occurred was evaluated as x, the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 1 was ○, and the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 2 was (Circle) and the evaluation result of the double-sided adhesive tape for abrasive cloth fixation obtained by the comparative example 1 was (triangle | delta).

(3) Presence or absence of adhesive residue After the evaluation of “Presence / absence of peeling during polishing” in (2) above, whether the double-sided adhesive tape for fixing the polishing cloth is peeled off from the surface plate and whether the adhesive remains on the surface plate It was confirmed.
The case where no adhesive residue (adhesive residue) was observed was evaluated as ○, and the case where adhesive residue (adhesive residue) was observed was evaluated as x. The double-sided adhesive tape for fixing abrasive cloth obtained in Example 1 was evaluated. The evaluation result of ◯ was ◯, the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Example 2 was ◯, and the evaluation result of the double-sided adhesive tape for fixing abrasive cloth obtained in Comparative Example 1 was ◯.

According to the present invention, for fixing a polishing cloth, which has excellent adhesion to a polishing cloth and chemical resistance, does not peel during polishing, and can be peeled off from a polishing surface plate with almost no adhesive residue. A double-sided adhesive tape can be provided. Moreover, according to this invention, the pad for polishing cloth fixing manufactured using this double-sided adhesive tape for polishing cloth fixation can be provided.

Claims (4)

A double-sided adhesive tape for fixing an abrasive cloth having a heat-reactive adhesive layer containing a phenoxy resin on one side of a substrate and a pressure-sensitive adhesive layer on the other side of the substrate,
The double-sided adhesive tape for fixing a polishing cloth, wherein the phenoxy resin has a weight average molecular weight of 10,000 or more. The double-sided adhesive tape for fixing an abrasive cloth according to claim 1, wherein the heat-reactive adhesive layer further contains another epoxy resin having two or more epoxy groups. 3. The double-sided adhesive tape for fixing an abrasive cloth according to claim 1, wherein the pressure-sensitive adhesive layer contains an acrylic resin-based adhesive, natural rubber, or a styrene block polymer. 4. A polishing pad fixing pad comprising the polishing cloth fixing double-sided adhesive tape according to claim 1, 2 and 3, and a polishing cloth laminated and integrated.