JP5422192B2 - Shield processing structure of shielded wire - Google Patents

Description

  The present invention relates to a shield processing structure for a shielded electric wire.

  With reference to FIGS. 5 and 6, for example, a conventional shield processing structure for a shielded electric wire disclosed in Patent Document 1 will be described.

  Reference numeral 1 is a shielded wire, 2 is a ground wire, 3 is a resin chip, 4 is an ultrasonic welding machine, 5 is an anvil, 6 is an ultrasonic welding horn, and 7 is a shield processing jig having an opening 8 for installing a resin chip. Each tool is shown.

  First, as shown in FIG. 5, a pair of upper and lower resin chips 3 and 3 are set in a recess formed on the lower surface of the ultrasonic welding horn 6 and a recess formed on the upper surface of the anvil 5. Further, the shielded electric wire 1 is inserted into the pair of electric wire insertion grooves 9 and 9 of the shield processing jig 7.

  Next, the ground wire 2 is inserted into the ground wire insertion groove 10 of the shield processing jig 7 and inserted to a position where the tip of the ground wire 2 contacts the reference recess 11. As a result, the ground wire 2 is disposed in a state of being substantially in contact with the upper surface of the shielded electric wire 1 and intersecting the shielded electric wire 1.

  Next, the ground wire 2 is pulled back by a predetermined dimension so that the tip of the ground wire 2 does not protrude from the resin chips 3 and 3, and the anvil 5 is moved upward and the ultrasonic welding horn 6 is moved downward, respectively. The resin chips 3 and 3 are butted together at the joint surfaces 3a and 3a. Then, the upper and lower resin chips 3 and 3 sandwich the overlapping portion of the shielded electric wire 1 and the ground wire 2, the shielded electric wire 1 into the shielded electric wire arc grooves 3b and 3b, and the ground wire 2 into the earthed wire arc grooves 3c and 3c. Fit in each.

  Next, when ultrasonic vibration is applied while applying a compressive force between the ultrasonic welding horn 6 and the anvil 5, the insulation sheath 1d of the shielded electric wire 1 and the insulation sheath 2b of the ground wire 2 are heated by heat generated by vibration energy. After being melted and scattered, the core wire 2a of the ground wire 2 and the braided wire 1c of the shielded electric wire 1 are brought into contact with each other. Further, the contact portions of the joint surfaces 3 a and 3 a of the pair of resin chips 3 and 3, the inner peripheral surfaces of the arc grooves 3 b and 3 b of the pair of resin chips 3 and 3, and the insulating outer skin 1 d of the shielded electric wire 1. The portion and the contact portion between the insulating sheath 2b of the ground wire 2 and the pair of resin chips 3 and 3 are melted by heat generated by vibration energy, and the melted portion is solidified after the ultrasonic vibration is finished. Thereby, the pair of resin chips 3 and 3, the shielded electric wire 1, and the ground wire 2 are fixed to each other (see FIG. 6), and a series of shield processing is completed.

In the figure, reference numeral 1 b indicates the insulating endothelium of the shielded electric wire 1, and reference numeral 1 a indicates the core wire 1 a of the shielded electric wire 1.
JP 2005-28431 A

  By the way, in the above prior art, the shielded electric wire 1 and the ground wire 2 are overlapped, and thereafter sandwiched between the upper and lower resin chips 3 and 3 and then the core wire 2a of the ground wire 2 and the shielded electric wire 1 are applied by ultrasonic vibration. Since the braided wire 1c is brought into contact, the core wire 2a comes into contact with the half circumference of the braided wire 1c as shown in FIG. The braided wire 1c is actually formed by weaving very thin strands, and since the half circumference becomes a contact location as described above, the contact location between the braided wire 1c and the core wire 2a is surprisingly small, For this reason, there is a problem that the tolerance of the welding height H must be strictly controlled. This is because the greater the tolerance of the welding height H, the higher the possibility that the core wire 2a will not contact the braided wire 1c. When the tolerance of the welding height H increases and the number of contact points between the braided wire 1c and the core wire 2a decreases, the connection resistance increases.

  Similar to tightly managing the tolerance of the welding height H, the dimensional tolerance of the upper and lower resin chips 3 and 3 is also strictly managed. This is because the contact portion between the braided wire 1c and the core wire 2a is reduced due to a change in the dimensions of the upper and lower resin chips 3, 3, and the connection resistance may be increased. Therefore, when management becomes strict, there is a concern that the size of NG products will increase, and there will be a concern about the influence of the waste resin chip on the global environment.

  The present invention has been made in view of the above circumstances, and can increase the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire, and can set a wide range of welding height tolerance and resin chip tolerance. It is an object of the present invention to provide a shield processing structure for a shielded electric wire.

According to a first aspect of the present invention, there is provided a shield processing structure for a shielded electric wire according to the present invention, wherein the core wire and the insulating sheath are crossed with respect to the shielded electric wire having a core wire, an insulating inner skin, a braid, and an insulating outer shell. After sandwiching the overlapped portions formed by overlapping the ground wires with the upper and lower resin chips, ultrasonic vibration is performed with the upper and lower resin chips being pressurized from the outside, whereby the insulation sheath of the shielded wire is In addition, in the shield processing structure of the shielded wire, the insulation sheath of the ground wire is melted and removed, and the braid of the shielded wire and the core wire of the ground wire are conducted.
The overlapped portion is
A first superimposed portion formed overlapping the ground wire to the shield wire, by folding and bending at the position where the consisting ground wire terminal and a predetermined length, a folded portion formed in the ground, the A folded portion is intersected with the shielded electric wire, and a second overlapped portion is formed by overlapping the ground wire on the shielded electric wire,
And the core wire of the ground wire of the first overlapping portion, in which each of the core wire of the ground wire of the second superposed portion was formed so as to be in contact with half round braid of the shielded wire Yes,
On each joint surface in the upper and lower resin chips,
A pair of shielded arcuate grooves for the shielded wire,
A pair of ground wire arc grooves into which the ground wire fits;
A pair of ground wire holding protrusions for holding the ground wire is formed at a position inside the pair of ground wire arc grooves,
When the overlapped portion is sandwiched between the upper and lower resin chips, one of the pair of ground wire holding projections holds the bent portion of the folded portion of the ground wire, and the pair of ground wire holding projections The other of them is characterized in that the terminal of the ground wire at the folded portion is held .

  According to the present invention having such characteristics, the number of the ground wires intersecting with the shielded electric wire is increased by forming the folded portion on the ground wire. That is, the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire increases. When the number of contact points increases, the region for stabilizing the connection resistance increases, so that it is possible to widely set the welding height tolerance and the resin chip tolerance.

  According to the present invention having such features, the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire increases. That is, the ground wire does not completely intersect the shielded electric wire before the bent portion is in front of the ground wire holding projection. By the way, if the bent portion exceeds the ground wire holding projection, the bent portion may protrude from the resin chip and cause a short circuit with other parts. It is preferable to arrange in the above.

  According to the present invention having such characteristics, the number of contact points between the braided wire of the shielded electric wire and the core wire of the ground wire is maximized. That is, it is because the terminal side does not completely intersect the shielded electric wire before the ground wire terminal is in front of the ground wire holding projection. By the way, if the ground wire terminal exceeds the ground wire holding projection, it may protrude from the resin chip and cause a short circuit with other parts. It is preferable to arrange the projections.

  In relation to the shield processing structure of the shielded electric wire of the present invention, the characteristics of the earth wire folding jig are as follows: The earth wire folding jig is “the earth wire is roughly omitted from the end of the earth wire at a predetermined length. A first bent portion that becomes a portion for bending into an L shape or a portion for bending from a substantially L shape into a substantially Z shape, and the ground wire bent by the first bent portion is further bent to provide the ground. And a second bent portion that is a portion for forming the folded portion in the line.

  According to the ground wire folding jig having such characteristics, the folded portion can be formed on the ground wire by using the first bent portion and the second bent portion. The formation of the folded portion in a state bent by 180 ° will be described later with reference to the drawings.

  According to the first aspect of the present invention, the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire can be increased by forming the folded portion on the ground wire. For example, when the folded portion is formed on the ground wire by folding once, the contact location can be doubled as compared with the conventional case. If the number of contact points can be increased more than before, the welding height tolerance and the resin chip tolerance can be set widely. Therefore, according to the present invention, there is an effect that a better shield processing structure can be provided.

According to the first aspect of the present invention, by arranging the bent portion of the folded portion in the ground wire holding projection, the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire can be increased. There is an effect that can be done.

According to the first aspect of the present invention, the number of contact points between the braided wire of the shielded wire and the core wire of the ground wire can be increased by arranging the ground wire end on the ground wire holding projection. There is an effect.

  Hereinafter, description will be given with reference to the drawings. FIG. 1 is an exploded perspective view showing an embodiment of a shield processing structure for a shielded electric wire according to the present invention. FIG. 2 is a view showing the main part of the present invention, FIG. 2 (a) is a plan view showing a state in which the folded portion of the ground wire is superimposed on the shielded wire, and FIG. 2 (b) is a braided wire of the shielded wire. It is a top view which shows the state which the contact location with the core wire of an earth wire increased. In addition, the same code | symbol shall be attached | subjected to the fundamentally same structural member and the same part as a prior art example.

  In FIG. 1, a shielded electric wire 1 includes a core wire 1a, a synthetic resin insulating endothelium 1b covering the outer periphery of the core wire 1a, a braided wire 1c covering the outer periphery of the insulating endothelium 1b, and a synthetic resin covering the outer periphery of the braided wire 1c. (The shielded electric wire is also known to have two core wires inside the braided wire and an insulating inner skin covering each of the core wires. (A shielded wire with two core wires may be used).

  On the other hand, the ground wire 2 includes a core wire 2a and a synthetic resin insulating sheath 2b covering the outer periphery of the core wire 2a. The ground wire 2 is formed with a folded portion 21. The folded portion 21 is in the state shown in FIG. 1 before the ultrasonic vibration. On the other hand, the folding | returning part 21 shown in FIG. 2 is the state after completion of a shield process.

  The folded portion 21 is formed by bending and folding at a position having a predetermined length from the terminal 26 of the ground wire 2. As will be described later, the ground wire 2 can form a portion 22 overlapped with the shielded electric wire 1 by the folded portion 21. The folded portion 21 is formed using, for example, a ground wire folding jig 23 or 31 (described later with reference to FIGS. 3 and 4).

  1 and 2, the upper and lower resin chips 3 and 3 are formed so that they can be positioned by mutual joint surfaces 3 a and 3 a. Moreover, it forms so that it can face | match. On each joint surface 3a of the upper and lower resin chips 3, 3, a pair of shielded wire arc grooves 3b, 3b is formed. In addition, a pair of ground wire arc grooves 3c and 3c are also formed on each joint surface 3a. A pair of ground wire holding protrusions 24 and 24 are formed inside the ground wire arc grooves 3c and 3c. The pair of ground wire holding protrusions 24, 24 are formed as portions sandwiching the ground wire 2.

  The ultrasonic welding machine 4 includes an anvil 5 and an ultrasonic welding horn 6 that is disposed immediately above the anvil 5 and generates ultrasonic vibrations. Both the anvil 5 and the ultrasonic welding horn 6 are provided separately to be vertically movable. The lower resin chip 3 is set on the upper surface of the anvil 5. The anvil 5 is formed so that the lower resin chip 3 can be held so that the bonding surface 3a of the lower resin chip 3 faces upward.

  The upper resin chip 3 is set on the lower surface of the ultrasonic welding horn 6. The ultrasonic welding horn 6 is formed so that the upper resin chip 3 can be held so that the bonding surface 3a of the upper resin chip 3 faces downward.

  The shield processing jig 7 is formed with a resin chip installation opening 8 penetrating in the vertical direction, a pair of wire insertion grooves 9, 9, a ground wire insertion groove 10, and a reference recess 11.

  Next, a shield processing method for the shielded electric wire 1 will be described. By implementing the shield processing method, a shield processing structure is formed on the shielded electric wire 1.

  The upper resin chip 3 is set on the lower surface of the ultrasonic welding horn 6 and the lower resin chip 3 is set on the upper surface of the anvil 5. After these sets, the shielded electric wire 1 is inserted into the pair of electric wire insertion grooves 9 and 9 of the shield processing jig 7.

  After insertion of the shielded electric wire 1, the ground wire 2 on which the folded portion 21 is formed in advance is inserted into the ground wire insertion groove 10. The ground wire 2 is arranged in a state in which the folded portion 21 is substantially in contact with the upper surface of the shielded electric wire 1 and intersects the shielded electric wire 1. When the folded portion 21 intersects the shielded electric wire 1, a portion 22 where the folded portion 21 and the shielded electric wire 1 are overlapped is formed. It is also possible to place the bent portion 25 of the folded portion 21 in contact with the reference recess 11 and then pull it back by a predetermined dimension, thereby disposing it in a state intersecting with the shielded electric wire 1 as described above.

  After the ground wire 2 is inserted into the ground wire insertion groove 10, the anvil 5 is moved upward and the ultrasonic welding horn 6 is moved downward, so that the joint surfaces 3a, 3a of the upper and lower resin chips 3, 3 are mutually connected. Match. Then, the upper and lower resin chips 3 and 3 sandwich the overlapped portion 22 between the folded portion 21 and the shielded electric wire 1. At this time, the shielded electric wire 1 is fitted into the arcuate grooves 3b and 3b for the shielded electric wire, and the ground wire 2 is fitted into the arcuate groove 3c for the ground wire. The bent portion 21 has the bent portion 25 disposed on one of the pair of ground wire holding projections 24 and 24 and the terminal 26 disposed on the other. The bent portion 25 and the terminal 26 are configured not to protrude outward from the ground wire holding projections 24 and 24 (there is no protrusion so that a short circuit with other parts does not occur. 24 has the most contact points).

  After sandwiching the overlapped portion 22 between the upper and lower resin chips 3, 3, ultrasonic vibration is applied while applying a compressive force between the anvil 5 and the ultrasonic welding horn 6. The insulation sheath 1d of the shielded wire 1 and the insulation sheath 2b in the folded portion 21 of the ground wire 2 are melted and scattered by heat generated by vibration energy, and the core wire 2a of the ground wire 2 and the braided wire 1c of the shield wire 1 are in contact with each other. (See FIG. 2). Further, the contact portions of the joint surfaces 3 a and 3 a of the pair of resin chips 3 and 3, the inner peripheral surfaces of the arc grooves 3 b and 3 b of the pair of resin chips 3 and 3, and the insulating outer skin 1 d of the shielded electric wire 1. The portion and the contact portion between the insulating sheath 2b of the ground wire 2 and the pair of resin chips 3 and 3 are melted by heat generated by vibration energy, and the melted portion is solidified after the ultrasonic vibration is finished. As a result, the pair of resin chips 3, 3, the shielded electric wire 1, and the ground wire 2 are fixed to each other, and a series of shield processing is completed.

  As described above with reference to FIGS. 1 and 2, according to the present invention, the number of intersecting ground wires 2 with respect to the shielded wire 1 is increased by forming the folded portion 21 on the ground wire 2. Can do. Accordingly, the number of contact points between the braided wire 1c of the shielded electric wire 1 and the core wire 2a of the ground wire 2 can be increased as compared with the conventional one (see FIG. 2). ).

  Since the present invention can increase the number of contact points as compared with the prior art, it does not require strict dimensional tolerance management as in the past, and as a result, welding height tolerance and resin chip tolerance can be set widely.

  Since this invention has the above-mentioned effect, it can be said that it is a better shield processing structure.

  Next, an example of a ground wire folding jig 23 suitable for use in the present invention will be described with reference to FIG. FIG. 3 is a schematic view showing an embodiment of a ground wire folding jig suitable for use in the present invention. FIG. 3A is a schematic diagram of the ground wire folding jig, and FIG. 3C is a cross-sectional view showing a state where the wire is inserted into the first bent portion, FIG. 3C is a cross-sectional view showing a state where the ground wire is bent in a substantially L shape, and FIG. 3D is bent in a substantially L shape. FIG. 3E is a cross-sectional view illustrating a state immediately before the second bent portion is brought into contact with the ground wire, and FIG. 3E is a cross-sectional view illustrating a state in which the ground wire is further bent to form a folded portion on the ground wire.

  In FIG. 3, it is preferable to use a ground wire folding jig 23 in order to form the folded portion 21. As shown in FIG. 3A, the ground wire folding jig 23 has a first bent portion 27 and a second bent portion 28. The first bent portion 27 is formed as a portion for bending the ground wire 2 into a substantially L shape at a position having a predetermined length from the terminal 26 of the ground wire 2. The second bent portion 28 is formed as a portion for further bending the ground wire 2 bent by the first bent portion 27 to form the folded portion 21 in the ground wire 2.

  The procedure for forming the folded portion 21 will be described. First, as shown in FIG. 3B, the ground wire 2 is set so that the terminal 26 side protrudes from the base 29, and then the first portion is placed on the protruding portion of the ground wire 2. The bending part 27 is inserted. Next, as shown in FIG. 3C, the ground wire folding jig 23 is moved in the direction of the arrow P while using the pressing plate 30, and the terminal 26 side of the ground wire 2 is bent into a substantially L shape. Next, the first bent portion 27 is pulled out and the ground wire folding jig 23 is moved in the direction of the arrow Q as shown in FIG. 3 (d), and the bent portion is bent by the second bent portion 28. When this is done (180 ° bending), the formation of the folded portion 21 is completed as shown in FIG.

  Next, another example of a ground wire folding jig suitable for use in the present invention will be described with reference to FIG. FIG. 4 is a schematic view showing another embodiment of a ground wire folding jig suitable for use in the present invention, and FIG. 4 (a) is a cross section showing a state in which the ground wire is inserted into the first bent portion. FIG. 4B is a cross-sectional view showing a state where the ground wire is bent in a substantially L shape, and FIG. 4C is a state where the ground wire bent in a substantially L shape is further bent in a substantially Z shape. FIG. 4D is a cross-sectional view showing a state where the ground wire is further bent by the second bent portion to form a folded portion on the ground wire.

  In FIG. 4A, the ground wire folding jig 31 has a first bent portion 32 and a second bent portion 33. The first bent portion 32 is a portion for bending the ground wire 2 into a substantially L shape at a position having a predetermined length from the terminal 26 of the ground wire 2, and further bending the substantially L shape into a substantially Z shape. Is formed. The second bent portion 33 is formed as a portion for further bending the ground wire 2 bent by the first bent portion 32 to form the folded portion 21 in the ground wire 2.

  The procedure for forming the folded portion 21 will be described. First, as shown in FIG. 4A, the ground wire 2 is set so that the terminal 26 side projects from the base 29, and then the first portion is placed on the projecting portion of the ground wire 2. The bending part 32 is inserted. Next, as shown in FIG. 4B, the ground wire folding jig 31 is moved in the direction of the arrow P while using the pressing plate 30, and the terminal 26 side of the ground wire 2 is bent into a substantially L shape. Next, the ground wire folding jig 31 is moved in the direction of arrow R, and the terminal 26 side of the substantially L-shaped ground wire 2 is bent into a substantially Z-shape. Next, when the ground wire folding jig 31 is moved in the direction of the arrow Q without removing the first bent portion 32 and folded by the second bent portion 33 (bent at 180 °), as shown in FIG. The formation of the folded portion 21 is completed.

  It goes without saying that the present invention can be variously modified without departing from the spirit of the present invention.

It is a disassembled perspective view which shows one Embodiment of the shield processing structure of the shielded electric wire of this invention. It is a figure which shows the principal part of this invention, (a) is a top view which shows the state which piled up the folding | turning part of the ground wire on the shield electric wire, (b) is a contact location of the braided wire of a shield wire, and the core wire of an earth wire It is a top view which shows the state which increased. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows one Embodiment of the earth wire folding jig | tool suitable to be used for this invention, (a) is the schematic of an earth wire folding jig | tool, (b) is a ground wire in a 1st bending part. (B) is a cross-sectional view showing a state where the ground wire is bent into a substantially L shape, and (c) is a cross-sectional view showing the state where the ground wire is bent into a substantially L shape. Sectional drawing which shows the state just before making it contact, (d) is sectional drawing which shows the state which bent the earth wire further and formed the return part in the earth wire. It is the schematic which shows other one Embodiment of the earth wire folding jig | tool suitable to be used for this invention, (a) is sectional drawing which shows the state which inserted the earth wire in the 1st bending part, (b) Is a cross-sectional view showing a state where the ground wire is bent into a substantially L shape, (c) is a cross-sectional view showing a state where the ground wire bent into a substantially L shape is further bent into a substantially Z shape, and (d) is a first view. It is sectional drawing which shows the state which bent the earth wire further by the 2 bending part, and formed the return part in the earth wire. It is explanatory drawing which concerns on the shield processing structure of the shielded electric wire of a prior art example. It is sectional drawing of the ultrasonic welding part of a prior art example.

Explanation of symbols

21 Folded portion 22 Overlapped portion 23, 31 Ground wire folding jig 24 Ground wire holding projection 25 Bent portion 26 Terminal 27, 32 First bent portion 28, 33 Second bent portion

Claims (1)

After the upper and lower resin chips sandwich the overlapped portion formed by overlapping the core wire and the ground wire having the insulating sheath so as to intersect the shielded wire having the core wire, the insulating inner skin, the braid, and the insulating sheath, the upper and lower Ultrasonic vibration is applied in a state where the resin chip is pressurized from the outside, thereby melting and removing the insulating sheath of the shielded wire and the insulating sheath of the ground wire, and the braid of the shielded wire and the core wire of the ground wire, In the shield processing structure of shielded wire,
The overlapped portion is
A first superimposed portion formed overlapping the ground wire to the shield wire, by folding and bending at the position where the consisting ground wire terminal and a predetermined length, a folded portion formed in the ground, the A folded portion is intersected with the shielded electric wire, and a second overlapped portion is formed by overlapping the ground wire on the shielded electric wire,
And the core wire of the ground wire of the first overlapping portion, in which each of the core wire of the ground wire of the second superposed portion was formed so as to be in contact with half round braid of the shielded wire Yes,
On each joint surface in the upper and lower resin chips,
A pair of shielded arcuate grooves for the shielded wire,
A pair of ground wire arc grooves into which the ground wire fits;
A pair of ground wire holding protrusions for holding the ground wire is formed at a position inside the pair of ground wire arc grooves,
When the overlapped portion is sandwiched between the upper and lower resin chips, one of the pair of ground wire holding projections holds the bent portion of the folded portion of the ground wire, and the pair of ground wire holding projections The shield processing structure for a shielded wire, wherein the other end of the ground wire holds the end of the ground wire at the folded portion .

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