JP5411573B2 - Method and apparatus for manufacturing metal clad band by surface activated bonding - Google Patents

Description

  The present invention relates to a method for manufacturing a strip-shaped metal clad material by applying surface activated bonding and an apparatus therefor.

  Surface activated bonding (SAB) irradiates the bonding surface of the material to be bonded with an atomic beam, ion beam, plasma, etc. in a vacuum, and the collision energy causes oxide film, water, contaminants (organic matter, etc.) on the surface This is a bonding method in which atoms in an active state are exposed by removal and bonding is performed immediately in that state. This surface activated bonding is based on the bonding mechanism as described above, and enables bonding without pressurizing or heating the materials to be bonded. Metal that can undergo structural change, phase transformation, etc. due to processing and heating Suitable for joining materials. In addition, this bonding method enables not only the same kind of material but also different kinds of materials to be joined, and further, the form is not limited. Because of these advantages, surface activated bonding is used for bonding materials that may lose characteristics due to heat, for example, materials with an adjusted degree of orientation.

  The surface activated bonding is suitable for the production of a band-like or tape-like clad material since the bonding property in the inter-surface bonding is good. Here, as a specific process in the production of the band-shaped clad material to which the surface activated bonding is applied, for example, there is a method using an apparatus described in Patent Document 1.

Japanese Patent Publication No. 7-55384

  Such a surface activated bonding apparatus is provided with an unwinding reel wound with two types of metal bands to be bonded and a pressure contact roll for bonding the metal bands in a vacuum chamber. In the meantime, a roll is appropriately installed to transfer the metal band, and an atomic beam, an ion beam gun, or the like which is an activation source for activating the metal band surface is installed.

  By the way, in surface activated bonding, since sufficient surface activation of the bonding surface is necessary, in the surface activated bonding apparatus as described above, the surface activation is performed by stopping the transfer of the metal band for a certain period of time, It can be said that the batch-type joining in which joining is performed after the surface activation is completed is optimal. However, in this batch method, it is necessary to perform delicate position adjustment for joining the activated regions while connecting them without gaps, and since it is not excellent in production efficiency, in order to produce a long clad material It is an unsuitable method.

  Further, a continuous method, that is, a method in which the metal strip is continuously transferred at a constant speed and transferred and joined while performing surface activation is also possible. However, in this case, it is necessary to slow down the transfer rate of the metal strip in order to sufficiently activate the surface, which also reduces the production efficiency.

  Therefore, the present invention provides a method for manufacturing a clad material by activation bonding, which is excellent in manufacturing efficiency and capable of manufacturing a long clad material, and an apparatus therefor.

In the conventional activation bonding process, it can be said that the activation of the metal strip as a continuous and high-speed transfer can be achieved by trials such as improvement of the activation source and optimization of activation conditions. The present inventors have also conducted a preliminary test using a fast atom bombardment beam (FAB) as an activation source, and have confirmed that sufficient surface activation can be achieved even at a high transfer rate.
However, according to the present inventors, in this preliminary test, it has been confirmed that even if sufficient surface activation can be achieved, the bonding may be insufficient and the bonding strength is insufficient.

  The inventors of the present invention have studied the cause of the phenomenon that makes bonding difficult even though the surface activation as described above is sufficiently performed. As a result, it came to the view that impurities such as oxide films removed by surface activation remain in the vicinity of the active surface, and this is re-adsorbed to the active surface while accompanying the bonding region as it is at a high transfer rate. The inventors of the present invention have conceived the present invention that it is necessary to recover the surface activity of the metal band at the time of bonding while taking into consideration the influence of such re-adsorption of impurities.

  That is, according to the present invention, the first metal band and the second metal band are transferred at a constant feed rate in the vacuum chamber, the first main activation region for the first metal band, and the second metal band. A collision energy from an activation source is applied to the second main activation region with respect to the metal band of the first metal to activate the surface of the first metal band and the second metal band. In the method of manufacturing a metal clad band by surface activation bonding in which the metal band and the second metal band are overlapped and bonded, at least a part of the region between the first main activation region and the bonding region Collision energy is added to both the first sub-activation region and the second sub-activation region which is at least a part of the region between the second main activation region and the junction region. The step of applying the energy, and integrating energy in the first sub-activation region The ratio between the energy accumulated in the first main activation region and the energy accumulated in the second sub-activation region and the energy accumulated in the second main activation region are both set to 20 to 50%. It is the manufacturing method of the metal clad belt characterized.

  In the present invention, the surface activation treatment is also performed on the region between the activation region where the surface activation is performed and the bonding region for each of the metal bands which are the materials to be bonded. By performing an additional surface activation treatment on such a secondary activation region, the active state can be maintained even when impurities once separated in the main activation region accompany the metal band and are adsorbed again. And subsequent bonding is also good.

  Here, the additional surface activation treatment is under conditions that are milder than the surface activation in the first and second main activation regions of each metal strip. This is because the impurities that can be re-adsorbed as described above are not so much quantitatively, and the surface activity can be recovered by relatively light surface activation. Further, this additional surface activation treatment imparts collision energy to the material surface like the surface activation in the main activation region, and the surface activation more than necessary may damage the material surface. Therefore, in the present invention, as the degree of additional surface activation, the ratio between the integrated energy in the first sub-activation region and the integrated energy in the first main activation region, and the integrated energy in the second sub-activation region and the first The ratio of the accumulated energy in the two main activation regions is 20 to 50% in all cases. In the present invention, the integrated energy in each activated region is defined by the product of the collision energy received by the surface to be activated and the irradiation time, and is adjusted according to the specific mode described below. Can do.

  As a specific example of the surface activated bonding method having an additional surface activation treatment of the present invention, first, as in the prior art, first activation for imparting collision energy to the first main activation region is performed. A source and a second activation source for imparting collision energy to the second main activation region, and an additional (third) activation source. This additional activation source provides collision energy to both the first sub-activation region and the second sub-activation region. And each activation area | region is surface-activated by each activation source.

  In this case, adjustment of the integrated energy in the main activation region and the sub activation region can be performed by changing the output of the activation source and the irradiation time for each region. That is, the integrated energy is adjusted by adjusting one or both of the output and irradiation time for each activation source so that the product of both is within a predetermined range.

  Further, the additional activation source as described above is not always essential. Surface activation by a fast atom bombardment beam can irradiate a linear beam in a wide range, and can irradiate a plurality of regions by adjusting the arrangement of the activation source and the material to be activated and the irradiation angle. Therefore, only two activation sources, a first activation source for applying collision energy to the first main activation region and a second activation source for applying collision energy to the second main activation region, are used. Even if it arranges, the joining method concerning the present invention can be carried out. At this time, the first activation source activates the surface of the first metal band located in the first main activation region and the surface activation of the second metal band located in the second sub-activation region. At the same time, the second activation source causes the second metal band located in the second main activation region to be surface activated and the first metal band located in the first sub-activation region to be surfaced. Activate.

  Bonding of the metal strip after surface activation and additional surface activation in the active region may be performed with pressure or substantially without pressure. The low pressure required for bonding is an advantage in surface activated bonding. In the present invention, it is possible to join in a sufficiently surface activated state by additional surface activation, and it is possible to join at an extremely low load of 0.25 MPa or less.

  The constituent material of the metal strip to which the present invention is applied is not particularly limited. Different materials may be applied to the first and second metal bands, or the same material may be applied. When joining dissimilar materials, the activation conditions for each metal band may differ, but the ratio of accumulated energy in the main activation region and the subactivation region in that case is within the above range. I just need it.

  In addition, as described above, the present invention improves the bondability when the metal strip is transferred continuously and at a high speed. The lower limit of the transfer speed of the metal strip is preferably 5 m / h. This is because if it is less than this, it is not worthy of efficient production aimed by the present invention. In addition, the upper limit of the transfer speed is not particularly limited, and can be adjusted by the scale of the apparatus and the output of the activation source, and the speed can be increased up to 500 m / h.

  And the surface activation joining apparatus which concerns on this invention is the following two types by arrangement | positioning of the activation source for said additional surface activation process. The first surface activated bonding apparatus includes a first unwinding reel and a second unwinding reel on which a first metal band and a second metal band are respectively wound, and the first and second reels One or more first and second guide rolls that transport while supporting the first and second metal strips unwound from the unwinding reel, and the first and second guide rolls that transport the first and second guide rolls. And a pressure roll that rolls down the second metal band in a state where they are overlapped, and the first and second guide rolls have a main activation region in which the first and second metal plates are substantially flat. And a first activation source for applying collision energy to the first and second metal bands in the main activation region, and the main activation region. A third activation source for imparting collision energy to the first and second metal bands between the press rolls A surface activation bonding device comprising a.

  This apparatus includes a third activation source for performing an additional surface activation treatment in addition to an activation source for surface activating the first and second activation regions.

  Also, as described above, an activation source for additional surface activation is not essential. That is, the second surface activated bonding apparatus includes a first unwinding reel and a second unwinding reel on which the first metal band and the second metal band are wound, respectively, It is transported by one or more first and second guide rolls that transport while supporting the first and second metal bands unwound from the two unwinding reels, and the first and second guide rolls. A pressure contact roll that reduces the first and second metal bands in a state where they are overlapped with each other, and the first and second guide rolls have a main activity in which the first and second metal plates are substantially flat. The first and second metal bands in the main activation region, and the first and second metal bands between the main active region and the pressure roll, However, at least one of the position and the irradiation angle so that the collision energy can be applied to the It is a surface activated bonding apparatus comprising a first and a second activation source installed section capable.

  As described above, according to the present invention, in the method for producing a clad material by surface activated bonding, a long clad material having excellent production efficiency can be produced. As the activation source in the present invention, an atomic beam (fast atom bombardment beam), an ion beam, or the like can be applied.

The structure of the surface activation joining apparatus which concerns on 1st Embodiment. The figure explaining the beam splitting by the position adjustment of the activation source (atomic gun) in 2nd Embodiment.

First Embodiment : FIG. 1 shows a configuration of a surface activated bonding apparatus according to the present embodiment. The surface activated bonding apparatus includes unwinding reels 10 and 20 around which first and second metal bands M1 and M2 are wound. The metal strips M1 and M2 unwound from the unwinding reels 10 and 20 are transported at a constant speed by the respective guide rolls 11, 12 and 21, 22 and are overlapped and joined by the pressure contact rolls 30 and 30 ′. . The joined clad material is collected by the take-up reel 40. These unwinding and winding reels, guide rolls, and pressure contact rolls can individually control the number of rotations by a drive motor (not shown).

  In addition, atomic guns 50 and 60 that are first and second activation sources for surface activating the metal bands M1 and M2 are provided. At this time, the metal bands M1 and M2 supported by the guide rolls 11, 12 and 21, 22 are such that the surfaces thereof face the first and second atomic guns 50 and 60 between the respective guide rolls. First and second main activation regions are formed. Further, in the surface activated bonding apparatus according to the present embodiment, an additional surface activation process is performed on both surfaces of the metal bands M1 and M2 through the first and second main activation regions until reaching the bonding roll. An atomic gun 70 is installed as a third activation source. The positions and angles of the atomic guns 50, 60, and 70 can be adjusted, and the irradiation distance and irradiation angle with respect to the metal bands M1 and M2 can be changed.

  Each of the above constituent members is installed inside a vacuum chamber 100 connected to a vacuum pump. And the rotation speed (transfer speed) of the unwinding reels 10 and 20, the guide rolls 11, 12, 21, and 22, the pressure contact rolls 30 and 30 ', and the take-up reel 40, the output of the atomic guns 50, 60, and 70, etc. These joining conditions can be arbitrarily adjusted by a control plate (not shown) outside the vacuum chamber. The settable ranges of various conditions in the surface activated bonding apparatus according to the present embodiment are as follows (preferred ranges are in parentheses).

Transfer speed (S): 8 to 80 m / h (8 to 40 m / h)
Irradiation distance (L): 80 to 240 mm (80 to 160 mm)
Irradiation angle (θ): −8 to + 30 ° (+12 to + 30 °)
Pressure contact force (P): 2000 to 10000N (6000 to 10000N)
Atomic gun output (current value (A)): 100 to 600 mA (500 to 600 mA)
Degree of vacuum: 5 × 10 ⁻⁵ Pa or less * Irradiation angle is 0 when the horizontal direction is 0 ° and tilted in the metal band transfer direction.

Using this surface activated bonding apparatus, various metal bands were bonded to produce a clad material. And the joining strength (peeling strength) was evaluated about the manufactured clad material. The bonding strength was evaluated by a peel test using a tensile tester. Table 1 shows the conditions and evaluation results in each example.

  In this embodiment, the transfer speed is constant, each atomic gun emits a beam continuously, and the integrated energy ratio between the main activation region and the secondary activation region is the output ratio of each atomic gun. It corresponds to. From Table 1, a clad material having high bonding strength can be manufactured by performing surface activation with a third atomic gun as in each of the examples and performing bonding. This effect is the same in any joint of the same kind or different kinds of materials.

Second Embodiment : Here, in the surface activated bonding apparatus according to the first embodiment, the first atomic gun 70 is not used (removed) in performing the activation process of the sub-activation region, but the first activation gun is removed. Surface activation was performed only with the second atomic guns 50 and 60. Therefore, the configuration of the surface activated bonding apparatus here is different from the apparatus of the first embodiment only in that the third atomic gun 70 is not provided, and the rest is the same as that of the first embodiment. This also applies to the settable range of the various conditions.

  In this embodiment, the distance between the first and second atomic guns is changed, and the fast atom bombardment beam from these surfaces activates the metal bands of the first and second main active regions at the same time as each active region. The metal band between the pressure contact rolls can also be surface activated. FIG. 2 is a diagram for explaining the position adjustment and surface activation of the activation source in the second embodiment. As can be seen from FIG. 2, in the surface activated bonding apparatus according to the present embodiment, the first metal band and the second metal band are supported by two guide rolls (11, 12, 21, 22), respectively. The metal band supported by the guide roll is opposed to the activation source to form a main activation region. Then, the metal band that has passed through the main activation region is bent by the guide rollers (12, 22) at the subsequent stage and transferred to the pressure contact rollers 30, 30 'between them. In the present embodiment, the interval between the first and second activation sources 50 and 60 is made smaller than that in the first embodiment (the irradiation angle remains the same), and the center line of the atomic beam (the dotted line in FIG. 2) is The metal band of the guide roll (12, 22) overlaps with the tangent at the bent portion.

  In this way, 50% of the atomic beam from each atomic gun irradiates the main active region and 50% irradiates the sub-activated region. At this time, the atomic beams directed toward the sub-activation region intersect, and in this region, the atomic beam is partially scattered, so that the accumulated energy on the surface of the metal band is lower than that of the main activation region. The splitting of the atomic beam by adjusting the center line of the atomic beam as described above is most preferably 50%: 50% as in this embodiment, but in the main active region: sub-active region. The irradiation amount to the main active region side may be slightly increased to 50%: 50% to 70%: 30%.

  Using the surface activated bonding apparatus according to this embodiment, various metal bands were bonded to manufacture a clad material. And the joining strength (peeling strength) was evaluated about the manufactured clad material. The evaluation of the bonding strength is the same as in the first embodiment. Table 2 shows the conditions and evaluation results in each example.

  From Table 2, it can be seen that even when no additional atomic gun is used, the bonding strength can be improved by activating the secondary active region. Moreover, although the bonding strength is slightly inferior in the dissimilar material (Cu / SUS), the same material (Cu / Cu) has the same bonding strength as in the first embodiment. This embodiment is effective in obtaining a good bonded state without adding an expensive atomic gun when bonding similar materials.

  The surface activated bonding method and apparatus according to the present invention are excellent in manufacturing efficiency and can manufacture a long clad material having excellent bonding strength. The present invention can be expected to be applied to, for example, a clad material that is a composite of a superconducting material.

Claims (5)

In the vacuum chamber, the first metal band and the second metal band are transferred at a constant feed rate,
A collision energy from an activation source is applied to the first main activation region for the first metal band and the second main activation region for the second metal band to apply the first metal band and the second metal activation region. Surface activated the second metal strip,
Thereafter, in a method of manufacturing a metal clad band by surface activation bonding in which the first metal band and the second metal band are overlapped and bonded in a bonding region,
A first sub-activation region which is at least a part of a region between the first main activation region and the junction region; and at least a part of a region between the second main activation region and the junction region. A step of additionally applying collision energy to both of the second sub-activation regions which are the regions of
The ratio between the accumulated energy in the first sub-activation region and the accumulated energy in the first main activation region, and the ratio between the accumulated energy in the second sub-activation region and the accumulated energy in the second main activation region are all. 20-50% (the integrated energy in the first main activation region and the integrated energy in the second main activation region are set to 100%) . A first activation source for applying collision energy to the first main activation region and a second activation source for applying collision energy to the second main activation region;
The third activation source for imparting collision energy to both the first sub-activation region and the second sub-activation region is further arranged to surface-activate each activation region. Manufacturing method of metal clad band. A first activation source for applying collision energy to the first main activation region and a second activation source for applying collision energy to the second main activation region;
Surface activation of the first metal band located in the first main activation region and surface activation of the second metal band located in the second sub-activation region by the first activation source;
The surface activation of the second metal band located in the second main activation region and the surface activation of the first metal band located in the first sub-activation region by the second activation source. A method for producing a metal clad strip according to claim 1. An apparatus applied to the surface activated bonding method according to claim 1 or 2,
A first unwinding reel and a second unwinding reel each wound with a first metal strip and a second metal strip;
One or more first and second guide rolls that transport while supporting the first and second metal bands unwound from the first and second unwinding reels,
A pressure contact roll that rolls down the first and second metal strips transferred by the first and second guide rolls in a state where they are overlapped with each other,
The first and second guide rolls are arranged such that the first and second metal plates form a substantially flat main activation region,
And first and second activation sources for imparting collision energy to the first and second metal bands in the main activation region,
A third activation source that imparts collision energy to both the first and second metal bands between the main activation region and the pressure roll;
A surface activated bonding apparatus comprising: An apparatus applied to the surface activated bonding method according to claim 1 or 3,
A first unwinding reel and a second unwinding reel each wound with a first metal strip and a second metal strip;
One or more first and second guide rolls that transport while supporting the first and second metal bands unwound from the first and second unwinding reels,
A pressure contact roll that rolls down the first and second metal strips transferred by the first and second guide rolls in a state where they are overlapped with each other,
The first and second guide rolls are arranged such that the first and second metal plates form a substantially flat main activation region,
The positions of the first and second metal bands in the main activation region, the first and second metal bands between the main active region and the pressure roll, so that collision energy can be applied to both of them. Alternatively, a surface activated bonding apparatus including first and second activation sources in which at least one of irradiation angles can be adjusted.

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